CN216958003U - dToF chip packaging structure and laser ranging system - Google Patents

dToF chip packaging structure and laser ranging system Download PDF

Info

Publication number
CN216958003U
CN216958003U CN202220530742.5U CN202220530742U CN216958003U CN 216958003 U CN216958003 U CN 216958003U CN 202220530742 U CN202220530742 U CN 202220530742U CN 216958003 U CN216958003 U CN 216958003U
Authority
CN
China
Prior art keywords
chip
photosensitive
dtof
package structure
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202220530742.5U
Other languages
Chinese (zh)
Inventor
汤为
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Lingfang Technology Co ltd
Original Assignee
Shanghai Lingfang Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Lingfang Technology Co ltd filed Critical Shanghai Lingfang Technology Co ltd
Priority to CN202220530742.5U priority Critical patent/CN216958003U/en
Application granted granted Critical
Publication of CN216958003U publication Critical patent/CN216958003U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

Landscapes

  • Solid State Image Pick-Up Elements (AREA)

Abstract

The application discloses a dToF chip packaging structure and a laser ranging system, which comprise a photosensitive chip; a light transmitting sheet; the connecting bodies are arranged on the upper surface of the non-photosensitive area of the photosensitive chip and distributed along the distribution direction of the bonding pads, the number of the connecting bodies is at least two, and the height of each connecting body is greater than that of each bonding pad; the supporting bodies are arranged on the lower surface of the light-transmitting sheet, the number of the supporting bodies is the same as that of the connecting bodies, the positions of the supporting bodies correspond to those of the connecting bodies, and the supporting bodies and the connecting bodies are connected up and down to enable the light-transmitting sheet to be arranged above the photosensitive chip. The light-transmitting sheet is supported by the support body connected with the connector, and the connector is distributed in the non-photosensitive area along the distribution direction of the bonding pad, namely the support body is not directly positioned in the non-photosensitive area, so that the distance between the photosensitive area and the bonding pad can be reduced, the overall size of the photosensitive chip is reduced, and the cost is reduced; because the support body does not need to be directly bonded with the photosensitive chip, activation treatment is not needed, and damage to the photosensitive chip can be avoided.

Description

dToF chip packaging structure and laser ranging system
Technical Field
The application relates to the field of dToF sensors, in particular to a dToF chip packaging structure and a laser ranging system.
Background
The sensor based on the direct time of flight (dToF) technology has the characteristics of accurate distance measurement and depth resolution, and is widely applied to equipment such as smart phones, AR (Augmented Reality) equipment and floor sweeping robots.
A span photosensitive area is arranged in a photosensitive chip of the dToF chip packaging structure, and a light-transmitting sheet is required to be arranged above the photosensitive chip so that light can irradiate the photosensitive area. The light-transmitting sheet is supported by a support wall with the bottom connected with the surface of the photosensitive chip, the bottom of the support wall is located in an area between the photosensitive area and the bonding pad, and in order to ensure the firmness between the support wall and the light-transmitting sheet as well as between the support wall and the photosensitive chip, the width of the support wall needs to be set to be wider, so that the distance between the photosensitive area and the bonding pad needs to be at least 350 micrometers, the size of the photosensitive chip cannot be reduced, and the manufacturing cost is high. In addition, before the photosensitive chip is bonded, the supporting wall needs to be activated so that the supporting wall made of photoresist is well bonded with the photosensitive chip, and the light-transmitting sheet is further attached to the photosensitive chip.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
SUMMERY OF THE UTILITY MODEL
The application aims to provide a dToF chip packaging structure and a laser ranging system, so that the manufacturing cost of the dToF chip packaging structure is reduced, and the quality is improved.
In order to solve the above technical problem, the present application provides a dToF chip package structure, including:
a photosensitive chip;
a light transmitting sheet;
the connecting bodies are arranged on the upper surface of the non-photosensitive area of the photosensitive chip and distributed along the distribution direction of the bonding pads, the number of the connecting bodies is at least two, and the height of each connecting body is greater than that of each bonding pad;
locate the supporter of the lower surface of printing opacity piece, the quantity of supporter is the same with the quantity of connector, and the position corresponds, the supporter with the connector is connected from top to bottom, so that the printing opacity piece set up in sensitization chip top.
Optionally, the pad is connected to the substrate through a lead, a packaging body of the dToF chip packaging structure is a cover body with a through hole at the top, wherein the bottom of the cover body is located on the upper surface of the substrate, the top of the cover body is located on the upper surface of the light-transmitting sheet, the lead cover is arranged inside, and a photosensitive area of the photosensitive chip is located in the projection range of the photosensitive chip through the through hole.
Optionally, the pad is connected to the substrate through a lead, a package body of the dToF chip package structure is a resin package body, the resin package body is located on the upper surface of the substrate and surrounds the photosensitive chip, the light-transmitting sheet and the outer side of the support body, and the lead is fixed through the resin package body.
Optionally, the connecting bodies are distributed in two opposite directions of the photosensitive area.
Optionally, the photosensitive area of the photosensitive chip is completely located in the projection range of the light-transmitting sheet on the photosensitive chip.
Optionally, the support is in a shape of a column or a sphere made of copper, tin solder or resin.
Optionally, the light-transmitting sheet is a glass sheet or an optical filter.
Optionally, the package form of the dtofs chip package structure is any one of LGA, QFN, and DFN.
Optionally, the connector is a metal connector identical to the pad.
The application also provides a laser ranging system, the laser ranging system includes any one of the above dToF chip packaging structure.
The application provides a dToF chip package structure, includes: a photosensitive chip; a light transmitting sheet; the connecting bodies are arranged on the upper surface of the non-photosensitive area of the photosensitive chip and distributed along the distribution direction of the bonding pads, the number of the connecting bodies is at least two, and the height of each connecting body is greater than that of each bonding pad; locate the supporter of the lower surface of printing opacity piece, the quantity of supporter is the same with the quantity of connector, and the position corresponds, the supporter with the connector is connected from top to bottom, so that the printing opacity piece set up in sensitization chip top.
Therefore, in the dTaF chip packaging structure, the light-transmitting sheet is supported by the support body, the support body is connected with the connector, the connector is distributed in the non-photosensitive area of the photosensitive chip along the distribution direction of the bonding pad, namely the support body is not directly positioned in the non-photosensitive area, so that the distance between the photosensitive area and the bonding pad can be reduced, the overall size of the photosensitive chip is reduced, the cost is reduced, in addition, the support body does not need to be directly bonded with the photosensitive chip, the activation treatment is not needed to be carried out on the photosensitive chip, the preparation process is simplified, meanwhile, the damage to the photosensitive chip caused by the activation can be avoided, and the quality of the dTaF chip packaging structure is improved; the height of the connector is greater than that of the bonding pad, so that bonding pad routing is not affected.
In addition, this application still provides a laser rangefinder system.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a top view of a prior art dtod chip package structure;
FIG. 2 is a cross-sectional view of a dToF chip package structure in the prior art;
fig. 3 is a top view of a dToF chip package structure according to an embodiment of the present disclosure;
fig. 4 is a schematic cross-sectional view of a dToF chip package structure provided in an embodiment of the present application before packaging;
fig. 5 is a schematic diagram of a dToF chip package structure according to an embodiment of the present disclosure;
fig. 6 is a schematic view of another dToF chip package structure provided in the embodiment of the present application.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
As described in the background section, referring to fig. 1 and fig. 2, in the dtofs chip package structure, the light-transmitting sheet 1 is supported by the supporting wall 9, the bottom of the supporting wall 9 is located in the region between the photosensitive region 22 and the bonding pad 4, that is, the non-photosensitive region 21, and the width of the supporting wall 9 needs to be set to be relatively wide, so that the size of the photosensitive chip 2 cannot be small, and the manufacturing cost is high; the supporting wall 9 needs to activate the photosensitive chip 2 before the photosensitive chip 2 is bonded, and when the photosensitive chip 2 is activated, the resin layer or the microlens on the photosensitive chip 2 is damaged by high temperature. The material of the support wall 9 is photoresist, and the photoresist is not resistant to high temperature and can be melted when reflow soldering is performed, so that the reliability is poor.
In view of the above, the present application provides a dToF chip package structure, please refer to fig. 3 and fig. 4, which includes:
a photosensitive chip 2;
a light transmitting sheet 1;
the connecting bodies 3 are arranged on the upper surface of the non-photosensitive area 21 of the photosensitive chip 2 and distributed along the distribution direction of the bonding pads 4, the number of the connecting bodies 3 is at least two, and the height of each connecting body 3 is greater than that of each bonding pad 4;
locate the supporter 5 of the lower surface of printing opacity piece 1, the quantity of supporter 5 is the same with the quantity of connector 3, and the position corresponds, supporter 5 with connector 3 connects from top to bottom, so that printing opacity piece 1 set up in sensitization chip 2 top.
The dtofs chip package structure further includes a substrate 6, a pad 4, a lead 7, and a package body, wherein the pad 4 is connected to the substrate 6 through the lead 7. The substrate 6 may be a PCB (Printed circuit board), if: the height of the pads 4 is about 10 μm and the height of the connectors 3 may be between 50 μm and 200 μm.
The photosensitive chip 2 comprises a photosensitive area 22 and a non-photosensitive area 21, and the size of the photosensitive area 22 can be equal to that of the photosensitive area 22 in the prior art; the bonding pad 4 is disposed on the upper surface of the non-photosensitive region 21 of the photosensitive chip 2, the size of the bonding pad 4 can be equal to the size of the bonding pad 4 in the prior art, and at this time, the distance between the bonding pad 4 and the photosensitive region 22 can be reduced to 10 μm, so that the area of the photosensitive chip 2 is reduced.
Light shines photosensitive area 22 of photosensitive chip 2 through printing opacity piece 1, in order to make photosensitive area 22 whole region all sensitization, also realize the maximize utilization photosensitive area 22, photosensitive area 22 of photosensitive chip 2 is located completely printing opacity piece 1 is in photosensitive chip 2's projection range.
The type of the light-transmitting sheet 1 is not particularly limited in the present application, and may be set by itself. For example, the light-transmitting sheet 1 is a glass sheet or a filter.
The supporting bodies 5 are used for supporting the light-transmitting sheet 1, the number of the supporting bodies 5 is equal to that of the connecting bodies 3, and the positions of the supporting bodies 5 correspond to that of the connecting bodies 3, in order to enhance the supporting effect of the supporting bodies 5 on the light-transmitting sheet 1, the connecting bodies 3 are distributed in two opposite directions of the light-sensing area 22, that is, the supporting bodies 5 support in two opposite directions of the light-transmitting sheet 1. The opposite directions of the photosensitive area 22, for example, above and below, or left and right, or upper left and lower right, or lower left and upper right, etc.
Preferably, the number of the connectors 3 is four, and the connectors are respectively arranged at four top corners of the photosensitive chip 2, so that the supporting effect on the light-transmitting sheet 1 can be ensured, the excessive area occupying the non-photosensitive area 21 is avoided, and the setting requirement of the bonding pad 4 is ensured.
Optionally, in an embodiment of the present application, the connector 3 is a metal connector 3 identical to the pad 4, so that the connector 3 and the pad 4 are simultaneously manufactured in a manufacturing process, and a manufacturing process is simplified. However, the present application is not limited to this, and in other embodiments of the present application, the connector 3 may be a metal connector 3 different from the pad 4.
It should be noted that the shape of the support body 5 is not limited in the present application. For example, the support 5 may have a columnar shape or a spherical shape. Further, the material of the support 5 is not limited in the present application, and the material of the support 5 may be, for example, copper, tin solder, resin, or the like. When the supporting body 5 is a copper column, the supporting body 5 can be accurate in height, but the supporting wall 9 in the prior art cannot ensure accurate height; the support body 5 is directly connected with the connecting body 3, and the position of the placing does not need to be accurately controlled. In addition, when reflow soldering is carried out, the copper columns are not easy to melt, and reliability is guaranteed.
The Package form of the dtoff chip Package structure includes, but is not limited to, any one of LGA (Land Grid Array), QFN (Quad Flat No-lead Package), and DFN (Dual Flat No-lead Package).
The package body with different dtofs chip package structure is described below.
As an implementation manner, referring to fig. 5, a package body 8 of the dToF chip package structure is a cover body having a through hole at a top thereof, wherein a bottom of the cover body is located on an upper surface of a substrate 6, the top of the cover body is located on an upper surface of the light-transmissive sheet 1, the lead 7 is covered inside the cover body, and a photosensitive area 22 of the photosensitive chip 2 is located in a projection range of the through hole on the photosensitive chip 2.
As another possible implementation manner, referring to fig. 6, a package 8 of the dtofs chip package structure is a resin package, the resin package is located on the upper surface of the substrate 6 and surrounds the photosensitive chip 2, the light-transmitting sheet 1 and the support 5, and the leads 7 are fixed by the resin package.
In the dTaF chip packaging structure, the light-transmitting sheet 1 is supported by the support body 5, the support body 5 is connected with the connector 3, the connector 3 is distributed in the non-photosensitive area 21 of the photosensitive chip 2 along the distribution direction of the bonding pad 4, namely, the support body 5 is not directly positioned in the non-photosensitive area 21, so that the distance between the photosensitive area 22 and the bonding pad 4 can be reduced, the overall size of the photosensitive chip 2 is reduced, the cost is reduced, in addition, the support body 5 is not required to be directly bonded with the photosensitive chip 2, the photosensitive chip 2 is not required to be activated, the preparation process is simplified, meanwhile, the damage to the photosensitive chip 2 caused by activation can be avoided, and the quality of the dTaF chip packaging structure is improved; the height of the connector 3 is larger than that of the bonding pad 4, so that the bonding pad 4 is not affected by routing. In addition, in the dToF chip packaging structure, the light sensing surface is arranged above, and the pins are arranged below; the pins, the bonding pads and the light receiving or emitting part are separated at the upper end and the lower end of the packaging body, and the packaging structure is suitable for packaging CIS (complementary metal oxide semiconductor) or other photosensitive and light-emitting products.
The manufacturing method of the dtofs chip package structure in the present application is described below.
Step 1, manufacturing a support body on the surface of a glass sheet, wherein the support body can be a copper column, a solder ball or a resin support body;
step 2, manufacturing a bonding pad and four metal connectors which are the same as the bonding pad in a non-photosensitive area of the photosensitive chip;
step 3, mounting the photosensitive chip on the surface of the substrate;
step 4, buckling the glass sheet with the support body on the photosensitive chip, aligning the support body with the metal connector, and welding;
step 5, connecting a bonding pad on the upper surface of the photosensitive chip to a substrate on the lower part of the photosensitive chip through a routing;
and 6, protecting the photosensitive chip and the routing area (for preventing EMC (Epoxy Molding Compound) from entering the photosensitive area, dispensing and blocking can be performed firstly), and performing plastic package.
The application also provides a laser ranging system, the laser ranging system includes any one of the above-mentioned implementations dToF chip packaging structure.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The dtod chip package structure and the laser ranging system provided in the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.

Claims (10)

1. A dToF chip packaging structure is characterized by comprising:
a photosensitive chip;
a light transmitting sheet;
the connecting bodies are arranged on the upper surface of the non-photosensitive area of the photosensitive chip and distributed along the distribution direction of the bonding pads, the number of the connecting bodies is at least two, and the height of each connecting body is greater than that of each bonding pad;
locate the supporter of the lower surface of printing opacity piece, the quantity of supporter is the same with the quantity of connector, and the position corresponds, the supporter with the connector is connected from top to bottom, so that the printing opacity piece set up in sensitization chip top.
2. The dToF chip package structure of claim 1, wherein the bonding pads are connected to a substrate through leads, and a package of the dToF chip package structure is a cover body having a through hole at the top, wherein the bottom of the cover body is located on the upper surface of the substrate, the top of the cover body is located on the upper surface of the light-transmitting sheet, the leads are covered inside, and a photosensitive area of the photosensitive chip is located within a projection range of the through hole on the photosensitive chip.
3. The dtot f chip package structure of claim 1, wherein the bonding pads are connected to a substrate through leads, and the package of the dtot f chip package structure is a resin package which is located on the upper surface of the substrate and surrounds the photosensitive chip, the light-transmitting sheet, and the outer side of the support, and the leads are fixed through the resin package.
4. The dtofchip package structure of claim 1, wherein the connectors are distributed in two opposite directions of the photosensitive area.
5. The dToF chip package structure of claim 1, wherein the photosensitive area of the photosensitive chip is located entirely within the projection range of the light-transmissive sheet on the photosensitive chip.
6. The dToF chip package structure of claim 1, wherein the support is in the shape of a column or a sphere made of copper, tin solder or resin.
7. The dToF chip package structure of claim 1, wherein the light transmissive sheet is a glass sheet or an optical filter.
8. The dToF chip package structure of claim 1, wherein the package form of the dToF chip package structure is any one of LGA, QFN, and DFN.
9. The dToF chip package structure of any one of claims 1 to 8, wherein the connectors are the same metal connectors as the pads.
10. A laser ranging system comprising the dtofs chip package structure of any one of claims 1 to 9.
CN202220530742.5U 2022-03-10 2022-03-10 dToF chip packaging structure and laser ranging system Active CN216958003U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220530742.5U CN216958003U (en) 2022-03-10 2022-03-10 dToF chip packaging structure and laser ranging system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220530742.5U CN216958003U (en) 2022-03-10 2022-03-10 dToF chip packaging structure and laser ranging system

Publications (1)

Publication Number Publication Date
CN216958003U true CN216958003U (en) 2022-07-12

Family

ID=82295826

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220530742.5U Active CN216958003U (en) 2022-03-10 2022-03-10 dToF chip packaging structure and laser ranging system

Country Status (1)

Country Link
CN (1) CN216958003U (en)

Similar Documents

Publication Publication Date Title
US7443038B2 (en) Flip-chip image sensor packages
EP0561964B1 (en) Optoelectronic device component package and method of making the same
US20070210246A1 (en) Stacked image sensor optical module and fabrication method
US11133348B2 (en) Sensor package structure and sensing module thereof
JP2005197717A (en) Structure of image sensor package and its forming method, and structure of optical element package and its forming method
CN110943049B (en) Optical sensor
CN216958003U (en) dToF chip packaging structure and laser ranging system
CN115732438B (en) Image sensing chip packaging structure and manufacturing method thereof
US10964615B2 (en) Chip-scale sensor package structure
JP2006114737A (en) Optical semiconductor equipment and manufacturing method thereof
CN115881652B (en) Chip packaging structure and manufacturing method thereof
KR20050120142A (en) Camera module and method of fabricating the same using epoxy
JP3100560U (en) Flip chip package structure of image sensor and its image sensor module
JP3585952B2 (en) Optical coupling device
KR100364979B1 (en) Semiconductor device its manufacturing method
JP3100618U (en) Image sensor chip scale package (CSP: ChipScalePackage) structure
KR100325450B1 (en) Ball Grid Array Package
KR100216845B1 (en) Structure of csp ( chip scale package ) and manufacture method
KR100206977B1 (en) Vertical type ball grid array
CN116207055A (en) System-in-package structure and manufacturing method thereof
KR100763773B1 (en) Chip scale package and method of manufacturing the same
TW202013648A (en) Optical sensor
KR19990012706A (en) Semiconductor package and manufacturing method
KR20010058572A (en) semiconductor package and its mounting method
KR20050100072A (en) Packaging structure of image sensing device and wafer level packaging method thereof

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant