CN116759434A - Packaging structure and manufacturing method thereof - Google Patents

Packaging structure and manufacturing method thereof Download PDF

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Publication number
CN116759434A
CN116759434A CN202310953146.7A CN202310953146A CN116759434A CN 116759434 A CN116759434 A CN 116759434A CN 202310953146 A CN202310953146 A CN 202310953146A CN 116759434 A CN116759434 A CN 116759434A
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CN
China
Prior art keywords
light
functional surface
layer
receiving area
transmitting
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Pending
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CN202310953146.7A
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Chinese (zh)
Inventor
张晓东
谢国梁
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Suzhou Sicui Chegui Semiconductor Industry Technology Research Institute Co ltd
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Suzhou Sicui Chegui Semiconductor Industry Technology Research Institute Co ltd
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Application filed by Suzhou Sicui Chegui Semiconductor Industry Technology Research Institute Co ltd filed Critical Suzhou Sicui Chegui Semiconductor Industry Technology Research Institute Co ltd
Priority to CN202310953146.7A priority Critical patent/CN116759434A/en
Publication of CN116759434A publication Critical patent/CN116759434A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/1469—Assemblies, i.e. hybrid integration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H01L31/02164—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors for shielding light, e.g. light blocking layers, cold shields for infrared detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

The invention discloses a packaging structure and a manufacturing method thereof, comprising the following steps: the chip is provided with a light receiving area and a non-light receiving area surrounding the light receiving area on the chip functional surface, wherein the light receiving area protrudes out of the non-light receiving area and is composed of micro lens structures distributed at intervals; the light-transmitting substrate is arranged on the side of the functional surface through a glue layer, a projection area of the light-transmitting substrate on the functional surface covers a projection area of the light-receiving area on the functional surface, and the glue layer is connected with the non-light-receiving area and a peripheral area of the light-transmitting substrate facing one side surface of the functional surface; the first shading layer is arranged on one side surface of the light-transmitting substrate facing the functional surface, is arranged facing the functional surface and extends to the interval area between the micro lens structures, and is provided with a plurality of first light-transmitting channels which expose the micro lens structures. The arrangement of the shading layer can absorb redundant scattered light, so that the incoming external light can vertically enter the light receiving area.

Description

Packaging structure and manufacturing method thereof
Technical Field
The invention relates to the technical field of semiconductors, in particular to a packaging structure and a manufacturing method thereof.
Background
An image sensing chip is an electronic device capable of sensing external light and converting it into an electrical signal, and is generally manufactured using a semiconductor manufacturing process. After the image sensing chip is manufactured, a series of packaging processes are performed on the image sensing chip, so that a packaged packaging structure is formed, and the image sensing chip is applied to electronic equipment such as digital cameras, digital video cameras and the like.
The packaging structure of the image sensing chip in the prior art mainly comprises the image sensing chip and a transparent cover plate, wherein the transparent cover plate is arranged above the light receiving area of the chip, so that light can irradiate the light receiving area of the chip through a transparent substrate, and the transparent substrate is used for protecting the image sensing chip.
However, in a specific use process, due to the reflection phenomenon of other materials in the packaging structure on light, the abnormal phenomenon of light convergence occurs in the local part of the light receiving area of the image sensing chip, and the problem of light interference between different light receiving areas on the chip is also easy to occur.
Disclosure of Invention
The invention aims to provide a packaging structure and a manufacturing method thereof, which are used for improving the shading effect and avoiding the interference of scattered light.
In order to achieve the above object, the present invention provides a package structure, including:
the chip is provided with a functional surface and a non-functional surface opposite to the functional surface, wherein the functional surface is provided with a light receiving area and a non-light receiving area surrounding the light receiving area, the light receiving area protrudes out of the non-light receiving area, and the chip is composed of microlens structures distributed at intervals;
the light-transmitting substrate is arranged on the side of the functional surface through a glue layer, a projection area of the light-transmitting substrate on the functional surface covers a projection area of the light-receiving area on the functional surface, and the glue layer is connected with the non-light-receiving area and a peripheral area of the light-transmitting substrate facing one side surface of the functional surface;
the first shading layer is arranged on one side surface of the light-transmitting substrate, which faces the functional surface, is arranged facing the functional surface and extends to the interval area between the micro lens structures, and is provided with a plurality of first light-transmitting channels, and the micro lens structures are exposed out of the first light-transmitting channels.
As a further improvement of an embodiment of the present invention, a plurality of the first light-transmitting channels are distributed in an array, and the first light-transmitting channels have a cylindrical structure.
As a further improvement of an embodiment of the present invention, the first light shielding layer is made of a light-proof colloid material or a light-proof metal material.
As a further improvement of an embodiment of the present invention, the thickness of the adhesive layer is the same as the thickness of the first light shielding layer.
As a further improvement of an embodiment of the present invention, the light-shielding device further includes a second light-shielding layer, the second light-shielding layer is disposed on a side surface of the light-transmitting substrate away from the functional surface, the second light-shielding layer is disposed with a plurality of second light-transmitting channels, and the first light-transmitting channels and the second light-transmitting channels are disposed correspondingly.
As a further development of an embodiment of the invention, the projection area of the first light-transmitting channel on the functional surface completely coincides with the projection area of the second light-transmitting channel on the functional surface.
As a further improvement of an embodiment of the present invention, the second light shielding layer is made of a light-proof colloid material or a light-proof metal material.
As a further improvement of an embodiment of the present invention, the non-light receiving area is provided with a plurality of pads electrically connected with the light receiving area;
the non-functional surface is provided with a groove and a rewiring layer, the groove exposes the welding pad, and the rewiring layer extends into the groove and is electrically connected with the welding pad;
and a conductive connecting piece electrically connected with the rewiring layer is arranged on one side surface of the rewiring layer, which is far away from the chip.
In order to achieve the above object, the present invention provides a method for manufacturing the above package structure, including:
providing a chip, wherein the chip is provided with a functional surface and a non-functional surface opposite to the functional surface, the functional surface is provided with a light receiving area and a non-light receiving area surrounding the light receiving area, the light receiving area protrudes out of the non-light receiving area, and the chip is composed of microlens structures distributed at intervals;
providing a light-transmitting substrate, manufacturing a first shading layer in a partial area of one side of the light-transmitting substrate, and enabling the first shading layer to form a plurality of first light-transmitting channels corresponding to the micro-lens structure;
forming a glue layer in the non-light receiving area or the peripheral area of the side surface of the light-transmitting substrate, on which the first shading layer is formed;
the light-transmitting substrate is fixed above the functional surface through the adhesive layer, so that the first shading layer extends to a spacing area between the micro lens structures, the micro lens structures are exposed by the first light-transmitting channels, and a projection area of the light-transmitting substrate on the functional surface covers a projection area of the light-receiving area on the functional surface.
As a further improvement of an embodiment of the present invention, the packaging method further includes:
a second shading layer is manufactured and formed on the other side face of the light-transmitting substrate, a plurality of second light-transmitting channels are formed in the second shading layer, and the second light-transmitting channels are arranged corresponding to the first light-transmitting channels;
when the light-transmitting substrate is fixed above the functional surface through the adhesive layer, the projection area of the first light-transmitting channel on the functional surface is completely overlapped with the projection area of the second light-transmitting channel on the functional surface.
As a further improvement of an embodiment of the present invention, the providing a chip specifically includes:
providing a chip, wherein a light receiving area of the chip consists of a continuously distributed micro lens structure;
and etching the microlens structure of a partial region in the light receiving region to form a spacing region corresponding to the first light shielding layer.
As a further improvement of an embodiment of the present invention, the forming a glue layer on the non-light receiving area or the peripheral area of the light-transmitting substrate where the first light shielding layer is formed specifically includes:
forming a first shading layer, and forming a glue layer with the same thickness as the first shading layer in the peripheral area of one side surface of the light-transmitting substrate;
or forming a glue layer with the same thickness as the first shading layer in the non-light receiving area.
The invention has the beneficial effects that: the light shielding layer is arranged on one side surface of the light transmitting substrate, which faces the light receiving area of the chip, and extends to the interval area of the micro-lens structure on the functional surface of the chip, and the light shielding layer is provided with a plurality of light transmitting channels, the micro-lens structure is exposed out of the light transmitting channels, so that external light enters from the light transmitting substrate, enters through the light transmitting channels and is received by the micro-lens structure, the arrangement of the light shielding layer can absorb redundant scattered light, so that the entering external light can vertically enter the light receiving area, and interference between the scattered light and the corresponding light receiving areas of different light transmitting channels is avoided.
Drawings
Fig. 1 is a schematic structural diagram of a package structure according to an embodiment of the invention.
Fig. 2 is a flow chart of a method for manufacturing a package structure according to an embodiment of the invention.
Fig. 3 to fig. 7 are process step diagrams corresponding to a method for manufacturing a package structure according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below in conjunction with the detailed description of the present invention and the corresponding drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present invention and are not to be construed as limiting the present invention.
For purposes of illustration, terms such as "upper," "lower," "rear," "front," and the like, are used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. The term spatially relative position may include different orientations of the device in use or operation than that illustrated in the figures. For example, if the device in the figures is turned over, elements described as "below" or "over" other elements or features would then be oriented "below" or "over" the other elements or features. Thus, the exemplary term "below" can encompass both a spatial orientation of below and above.
The invention provides a packaging structure, comprising:
the chip is provided with a functional surface and a non-functional surface opposite to the functional surface, the functional surface is provided with a light receiving area and a non-light receiving area surrounding the light receiving area, the light receiving area protrudes out of the non-light receiving area, and the chip is composed of microlens structures distributed at intervals.
The light-transmitting substrate is arranged on the side of the functional surface through a glue layer, the projection area of the light-transmitting substrate on the functional surface covers the projection area of the light-receiving area on the functional surface, and the glue layer is connected with the non-light-receiving area and the peripheral area of the light-transmitting substrate facing one side surface of the functional surface.
The first shading layer is arranged on one side surface of the light-transmitting substrate facing the functional surface, is arranged facing the functional surface and extends to the interval area between the micro lens structures, and is provided with a plurality of first light-transmitting channels which expose the micro lens structures.
As shown in fig. 1, the present embodiment provides a package structure including a chip 1, a light-transmitting substrate 2, and a first light-shielding layer 3.
The chip 1 has a functional surface and a non-functional surface opposite to the functional surface, and the functional surface is provided with a light receiving region and a non-light receiving region surrounding the light receiving region, and the light receiving region is provided so as to protrude from the non-light receiving region.
Specifically, the light receiving area on the functional surface of the chip 1 is composed of microlens structures 11 distributed at intervals, the microlens structures 11 are used for receiving light incident from the outside, and the non-light receiving area on the functional surface of the chip 1 is provided with a plurality of bonding pads 12 electrically connected with the light receiving area.
Specifically, a light receiving unit may be formed by two or more microlens structures 11 distributed in succession, each of which is disposed at a certain interval.
Of course, it is also possible that one microlens structure 11 is a light receiving unit, and each microlens structure 11 is disposed at a certain interval.
The shapes and sizes of the spacing regions (spacing regions between adjacent light receiving units) of the microlens structures 11 on the functional surface of the chip 1 are not limited, and can be adjusted according to the actual performance of the product and the manufacturing process.
In one embodiment of the present invention, the chip 1 is an image sensor chip.
In another embodiment of the present invention, the chip 1 is a MEMS chip, which may be a pressure sensing chip, a capacitive sensing chip, or other sensor chip.
The transparent substrate 2 is a glass substrate, and is disposed above the functional surface of the chip 1 through a glue layer 4.
Specifically, the surface size of the transparent substrate 2 parallel to the chip 1 is greater than the surface size of the light receiving area of the chip 1, when the transparent substrate 2 is disposed above the functional surface of the chip 1, the transparent substrate 2 can completely cover the light receiving area on the functional surface of the chip 1, that is, when the transparent substrate 2 is disposed above the functional surface of the chip 1, the projection area of the transparent substrate 2 on the functional surface of the chip 1 can completely cover the projection area of the light receiving area on the functional surface of the chip 1.
The adhesive layer 4 is disposed in a non-light receiving area on the functional surface of the chip 1, and connects the non-light receiving area and a peripheral area on a side surface of the light-transmitting substrate 2 facing the functional surface of the chip 1. Meanwhile, the glue layer 4 plays a supporting role on the light-transmitting substrate 2, so that the light-transmitting substrate 2 is prevented from being pressed to the functional surface of the chip 1, and the light receiving area is damaged.
Specifically, the adhesive layer 4 covers the pads 12 on the non-light receiving area.
In one embodiment of the present invention, the glue layer 4 is disposed around the light receiving area on the functional surface of the chip 1 to form a glue layer retaining wall structure, i.e. a sealing structure is formed by enclosing the functional surface of the chip 1, a side surface of the transparent substrate 2 facing the chip 1, and an inner side surface of the glue layer 4.
In this embodiment, the specific shape of the retaining wall structure formed by surrounding the adhesive layer 4 is not limited in this invention, and the cross-section structure of the retaining wall structure formed by surrounding the adhesive layer 4 on the functional surface parallel to the chip 1 may be circular, square or other shapes, and may be selected according to specific product requirements and actual process capability.
In other embodiments of the present invention, the glue layer 4 may be glue layer posts spaced around the light receiving area of the chip 1, so as to provide sufficient support for the light-transmitting substrate 2.
The glue layer 4 is made of epoxy resin, preferably an opaque glue material, so that the packaging structure is further prevented from entering light from the side edge of the glue layer 4, and stray light is reduced.
The first light shielding layer 3 is disposed on a side of the light-transmitting substrate 2 facing the functional surface of the chip 1, and is disposed facing the light receiving area on the functional surface of the chip 1, and the first light shielding layer 3 extends to the interval area between the micro lens structures 11, that is, the lower surface of the first light shielding layer 3 extends to the interval area between the light receiving units, and the lower surface of the first light shielding layer 3 is connected to the functional surface of the chip 1 in the interval area.
Specifically, the first light shielding layer 3 is provided with a plurality of first light transmission channels 31, and each first light transmission channel 31 exposes the microlens structure 11 of each light receiving unit.
The plurality of first light-transmitting channels 31 are distributed in an array, each first light-transmitting channel 31 corresponds to the micro lens structure 11 of each light-receiving unit, namely, the first light-transmitting channel 31 is used as a light transmission channel of the micro lens structure 11 of the corresponding light-receiving unit, external light is incident into the packaging structure from the light-transmitting substrate 2, and the arrangement of the first shading layer 3 can absorb redundant stray light, so that the external light can vertically enter the micro lens structure 11 of the corresponding channel through the first light-transmitting channel 31, and the light imaging effect is improved. In addition, the first light-transmitting channel 31 forms different light incidence channels corresponding to the micro lens structures 11 in different light receiving units, and the arrangement of the first light shielding layer 3 can also prevent the micro lens structures 11 of different light receiving units from receiving stray light between different light incidence channels, so that light interference between different light incidence channels is reduced, and performance of the packaged product is enhanced.
In the embodiment of the present invention, the first light-transmitting channel 31 has a cylindrical structure.
Of course, the aperture size of each first light-transmitting channel 31 is related to the size of the corresponding light-receiving unit (microlens structure), the portion of the first light-shielding layer 3 extending to the spacing region of the microlens structure 11 is related to the size of the spacing region of the microlens structure 11, and the invention is not limited thereto, and the extending portion of the first light-shielding layer 3 does not damage the microlens structure 11 in each light-receiving unit.
In other embodiments of the present invention, the first light-transmitting channel 31 may be configured as a rectangular parallelepiped or other structures.
That is, in the direction perpendicular to the functional surface of the chip 1, the thickness of the first light shielding layer 3 is equal to the perpendicular distance between the side of the light transmitting substrate 2 facing the chip 1 (i.e., the lower surface of the light transmitting substrate 2) and the functional surface of the chip 1 (i.e., the upper surface of the chip 1).
The first light shielding layer 3 is made of a light-tight colloid material, such as black photoresist, or a light-tight metal material, such as metal Al, cu, cr, etc.
In the direction perpendicular to the functional surface of the chip 1, the thickness of the adhesive layer 4 is the same as that of the first light shielding layer 3, that is, in the actual manufacturing process, the adhesive layer 4 and the first light shielding layer 3 can be made of the same manufacturing material, such as a black photoresist colloid material, and the manufacturing of the adhesive layer 4 and the first light shielding layer 3 is synchronously performed on the lower surface of the light-transmitting substrate 2.
Specifically, the adhesive layer 4 connects the non-light receiving area of the functional surface of the chip 1 and the peripheral area of the side surface of the light-transmitting substrate 2 facing the functional surface of the chip 1, and the adhesive layer 4 covers the bonding pad 12 on the functional surface of the chip 1. That is, the upper surface of the adhesive layer 4 is connected to the peripheral area of the lower surface of the light-transmitting substrate 2, and the lower surface of the adhesive layer 4 is connected to the non-light-receiving area of the functional surface of the chip 1.
The adhesive layer 4 may be made of the same material as the first light shielding layer 3, or may be made of another epoxy resin material.
Further, the package structure of the present embodiment further includes a second light shielding layer 5, where the second light shielding layer 5 is disposed on a side of the light-transmitting substrate 2 away from the functional surface of the chip 1 (i.e. the upper surface of the light-transmitting substrate 2), and the second light shielding layer 5 is provided with a plurality of second light-transmitting channels 51, and the second light-transmitting channels 51 are disposed corresponding to the first light-transmitting channels 31. The design of two-sided shading layer is carried out to packaging structure, before external light gets into packaging structure through printing opacity base plate 2, and second shading layer 5 can absorb partial disordered light earlier, further improves the light imaging effect.
Similarly, the plurality of second light-transmitting channels 51 are distributed in an array, and each second light-transmitting channel 51 has a cylindrical structure.
Specifically, the projection area of the first light-transmitting channel 31 on the functional surface of the chip 1 and the projection area of the second light-transmitting channel 51 on the functional surface of the chip 1 are completely overlapped.
The second light shielding layer 5 is made of a light-tight colloid material, such as black photoresist, or a light-tight metal material, such as metal Al, cu, cr, etc.
The thickness of the second light shielding layer 5 is not limited in the present invention, and can be designed according to actual product requirements.
Specifically, the non-functional surface of the chip 1 is provided with a groove and a rewiring layer, the groove exposes the bonding pad 12 on the functional surface of the chip 1, and the rewiring layer extends into the groove and is electrically connected with the bonding pad 12.
The rewiring layer is provided with a conductive connection member electrically connected with the rewiring layer on a side surface far away from the chip 1, and the conductive connection member is used for electrically connecting the chip 1 to an external circuit board or other chips.
In one embodiment, the conductive connection member is a metal solder ball, such as a copper ball, a tin ball, or a ball made of other conductive materials.
In other embodiments, the conductive connecting piece is a metal copper pillar, such as a copper pillar, so that the conductive connecting piece can also play a certain supporting role on the chip 1 while the electrical connection function can be realized, and the stability of the packaging structure is further enhanced.
As shown in fig. 2, the present invention further provides a method for manufacturing the package structure according to any one of the foregoing embodiments, including:
the chip is provided with a functional surface and a non-functional surface opposite to the functional surface, wherein the functional surface is provided with a light receiving area and a non-light receiving area surrounding the light receiving area, the light receiving area protrudes out of the non-light receiving area, and the chip is composed of microlens structures distributed at intervals.
Providing a light-transmitting substrate, manufacturing a first shading layer in a partial area of one side of the light-transmitting substrate, and enabling the first shading layer to form a plurality of first light-transmitting channels corresponding to the micro-lens structure.
A glue layer is formed on the peripheral area of one side surface of the first shading layer formed on the non-light receiving area or the light transmitting substrate.
The transparent substrate is fixed above the functional surface through the adhesive layer, the first shading layer extends to the interval area between the micro lens structures, the micro lens structures are exposed by the first transparent channel, and the projection area of the transparent substrate on the functional surface covers the projection area of the light receiving area on the functional surface.
As shown in fig. 3, a chip 1 is provided, the chip 1 having a functional surface and a non-functional surface opposite to the functional surface, the functional surface being provided with a light receiving region and a non-light receiving region surrounding the light receiving region, the light receiving region protruding from the non-light receiving region being provided, which is composed of a continuously distributed microlens structure 11.
As shown in fig. 4, the microlens structures 11 of the partial regions in the light receiving region are etched to form the spacing regions a corresponding to the first light shielding layer, and the microlens structures 11 of the continuous distribution, which are not etched, constitute a light receiving unit B, i.e., each of the light receiving units B is disposed with a certain spacing region a therebetween.
Of course, the subsequent manufacturing process further includes manufacturing grooves and rewiring layers on the non-functional surface of the chip 1, and the formed rewiring layers are electrically connected to the pads 12 on the functional surface of the chip 1.
As shown in fig. 5, a photolithography process is used to manufacture the first light shielding layer 3 in a side portion area of the transparent substrate 2, so that the manufactured first light shielding layer 3 has a plurality of first light transmission channels 31 corresponding to the micro lens structures, each first light transmission channel 31 is formed into a cylindrical structure with the same size, and when the transparent substrate 2 is fixed above the chip 1, the formed first light shielding layer 3 can be exactly located in the interval area a on the functional surface of the chip 1.
That is, the protruding dimension of the first light shielding layer 3 and the aperture size of the first light transmitting channel 31 are controlled according to the region sizes of the spacing region a and the light receiving unit B formed on the functional surface of the chip 1.
In the embodiment of the present invention, the first light shielding layer 3 is formed, and the adhesive layer 4 having the same thickness as the first light shielding layer 3 is formed on the peripheral area of one side surface of the light transmitting substrate 2. That is, the first light shielding layer 3 and the adhesive layer 4 are simultaneously formed on one side of the transparent substrate 2 by photolithography.
Of course, in other embodiments, the first light shielding layer 3 and the adhesive layer 4 may be manufactured separately.
In another embodiment of the present invention, the first light shielding layer 3 and the adhesive layer 4 are separately manufactured, and the adhesive layer 4 with the same thickness as the first light shielding layer 3 is formed in the non-light receiving area of the functional surface of the chip 1, so that the adhesive layer 4 covers the bonding pad on the functional surface of the chip 1.
Further, the packaging method in this embodiment further includes:
as shown in fig. 6, a second light shielding layer 5 is formed on the other side of the transparent substrate 2, and a plurality of second light transmission channels 51 are formed on the second light shielding layer 5, and the second light transmission channels 51 are disposed corresponding to the first light transmission channels 31.
Similarly, the second light shielding layer 5 corresponding to the first light shielding layer 3 is fabricated on the other side of the light-transmitting substrate 2 by using a photolithography process, so that the second light shielding layer 5 is formed with second light-transmitting channels 51 distributed in an array, each second light-transmitting channel 51 is formed into a cylindrical structure with the same size, each second light-transmitting channel 51 corresponds to each first light-transmitting channel 31 uniformly in a direction perpendicular to the surface of the light-transmitting substrate 2, and the aperture of the second light-transmitting channel 51 is the same as that of the first light-transmitting channel 31. That is, when the light-transmitting substrate 2 is fixed above the chip functional surface by the adhesive layer, the projection area of the first light-transmitting channel 31 on the chip functional surface completely coincides with the projection area of the second light-transmitting channel 51 on the chip functional surface.
The first light shielding layer 3 and the second light shielding layer 5 are made of light-tight colloid or light-tight metal material.
Of course, the present invention is not limited to the order of steps for forming the first light shielding layer 3 and the second light shielding layer 5, and can be adjusted according to actual process conditions.
As shown in fig. 7, the transparent substrate 2 is connected to the functional surface of the chip 1 through the adhesive layer 4, so that the transparent substrate 2 is fixed above the functional surface of the chip 1, and the first light shielding layer 3 extends into the interval region between the micro lens structures 11 on the functional surface of the chip.
Further, the process steps of plastic packaging and solder ball manufacturing are performed on the basis of the structure formed in fig. 7, and finally the packaging structure shown in fig. 1 is manufactured.
In summary, the light shielding layers are disposed on the upper and lower surfaces of the transparent substrate, the light shielding layers disposed on the lower surface of the transparent substrate extend to the spacing regions of the micro lens structures on the functional surface of the chip, and the light shielding layers are provided with a plurality of transparent channels, external light enters from the transparent substrate and enters the light receiving regions through the transparent channels, and the light shielding layers can absorb excessive scattered light, so that the entering external light can vertically enter the light receiving regions, and interference of the scattered light to the light receiving regions corresponding to different transparent channels is avoided.
It should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is for clarity only, and that the skilled artisan should recognize that the embodiments may be combined as appropriate to form other embodiments that will be understood by those skilled in the art.
The above list of detailed descriptions is only specific to practical embodiments of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent embodiments or modifications that do not depart from the spirit of the present invention should be included in the scope of the present invention.

Claims (12)

1. A package structure, comprising:
the chip is provided with a functional surface and a non-functional surface opposite to the functional surface, wherein the functional surface is provided with a light receiving area and a non-light receiving area surrounding the light receiving area, the light receiving area protrudes out of the non-light receiving area, and the chip is composed of microlens structures distributed at intervals;
the light-transmitting substrate is arranged on the side of the functional surface through a glue layer, a projection area of the light-transmitting substrate on the functional surface covers a projection area of the light-receiving area on the functional surface, and the glue layer is connected with the non-light-receiving area and a peripheral area of the light-transmitting substrate facing one side surface of the functional surface;
the first shading layer is arranged on one side surface of the light-transmitting substrate, which faces the functional surface, is arranged facing the functional surface and extends to the interval area between the micro lens structures, and is provided with a plurality of first light-transmitting channels, and the micro lens structures are exposed out of the first light-transmitting channels.
2. The package structure of claim 1, wherein a plurality of the first light-transmitting channels are distributed in an array, and the first light-transmitting channels are in a cylindrical structure.
3. The package structure of claim 1, wherein the first light shielding layer is made of an opaque colloid material or an opaque metal material.
4. The package structure of claim 1, wherein a thickness of the glue layer is the same as a thickness of the first light shielding layer.
5. The package structure according to claim 1, further comprising a second light shielding layer, wherein the second light shielding layer is disposed on a side surface of the light-transmitting substrate away from the functional surface, and the second light shielding layer is formed by a plurality of second light-transmitting channels, and the first light-transmitting channels and the second light-transmitting channels are disposed correspondingly.
6. The package structure of claim 5, wherein a projection area of the first light-transmitting channel on the functional surface is completely coincident with a projection area of the second light-transmitting channel on the functional surface.
7. The package structure of claim 5, wherein the second light shielding layer is made of an opaque colloid material or an opaque metal material.
8. The package structure of claim 1, wherein the non-light receiving region is provided with a plurality of pads electrically connected to the light receiving region;
the non-functional surface is provided with a groove and a rewiring layer, the groove exposes the welding pad, and the rewiring layer extends into the groove and is electrically connected with the welding pad;
and a conductive connecting piece electrically connected with the rewiring layer is arranged on one side surface of the rewiring layer, which is far away from the chip.
9. A method of manufacturing the package structure according to any one of claims 1 to 8, comprising:
providing a chip, wherein the chip is provided with a functional surface and a non-functional surface opposite to the functional surface, the functional surface is provided with a light receiving area and a non-light receiving area surrounding the light receiving area, the light receiving area protrudes out of the non-light receiving area, and the chip is composed of microlens structures distributed at intervals;
providing a light-transmitting substrate, manufacturing a first shading layer in a partial area of one side of the light-transmitting substrate, and enabling the first shading layer to form a plurality of first light-transmitting channels corresponding to the micro-lens structure;
forming a glue layer in the non-light receiving area or the peripheral area of the side surface of the light-transmitting substrate, on which the first shading layer is formed;
the light-transmitting substrate is fixed above the functional surface through the adhesive layer, so that the first shading layer extends to a spacing area between the micro lens structures, the micro lens structures are exposed by the first light-transmitting channels, and a projection area of the light-transmitting substrate on the functional surface covers a projection area of the light-receiving area on the functional surface.
10. The method of manufacturing a package structure of claim 9, wherein the method of packaging further comprises:
a second shading layer is manufactured and formed on the other side face of the light-transmitting substrate, a plurality of second light-transmitting channels are formed in the second shading layer, and the second light-transmitting channels are arranged corresponding to the first light-transmitting channels;
when the light-transmitting substrate is fixed above the functional surface through the adhesive layer, the projection area of the first light-transmitting channel on the functional surface is completely overlapped with the projection area of the second light-transmitting channel on the functional surface.
11. The method for manufacturing a package structure according to claim 9, wherein the providing a chip specifically includes:
providing a chip, wherein a light receiving area of the chip consists of a continuously distributed micro lens structure;
and etching the microlens structure of a partial region in the light receiving region to form a spacing region corresponding to the first light shielding layer.
12. The method of claim 9, wherein forming a glue layer on the non-light receiving area or the peripheral area of the light-transmitting substrate where the first light shielding layer is formed, comprises:
forming a first shading layer, and forming a glue layer with the same thickness as the first shading layer in the peripheral area of one side surface of the light-transmitting substrate;
or forming a glue layer with the same thickness as the first shading layer in the non-light receiving area.
CN202310953146.7A 2023-07-31 2023-07-31 Packaging structure and manufacturing method thereof Pending CN116759434A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310953146.7A CN116759434A (en) 2023-07-31 2023-07-31 Packaging structure and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310953146.7A CN116759434A (en) 2023-07-31 2023-07-31 Packaging structure and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN116759434A true CN116759434A (en) 2023-09-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310953146.7A Pending CN116759434A (en) 2023-07-31 2023-07-31 Packaging structure and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN116759434A (en)

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