CN210403733U

CN210403733U - Lens assembly, optical sensor and fan-out type packaging structure thereof

Info

Publication number: CN210403733U
Application number: CN201921418340.0U
Authority: CN
Inventors: 刘路路; 沈志杰; 姜迪; 王腾
Original assignee: Suzhou Duogan Technology Co ltd
Current assignee: Suzhou Duogan Technology Co ltd
Priority date: 2019-08-29
Filing date: 2019-08-29
Publication date: 2020-04-24
Anticipated expiration: 2029-08-29

Abstract

The utility model relates to a camera lens subassembly, an optical sensor and packaging structure thereof, the camera lens subassembly includes: a substrate having opposing first and second surfaces; at least one lens on the first surface of the substrate; and the protective structure is positioned on the first surface of the substrate and arranged around the lens, and the top of the protective structure is higher than that of the lens. The lens assembly can protect the lens from being damaged.

Description

Lens assembly, optical sensor and fan-out type packaging structure thereof

Technical Field

The utility model relates to a chip package field especially relates to a camera lens subassembly, an optical sensor and fan-out type packaging structure thereof.

Background

Nowadays, camera modules are widely applied to a plurality of fields such as cameras, mobile phones, notebooks, monitoring and vehicle-mounted cameras, and the demand for the camera modules is more and more. More mobile terminal devices such as mobile phones are developing to be thinner and thinner, which makes the requirements for the size specification of the camera module more and more stringent, and the fabrication of the chip and the module with the small-sized lens is very important.

The chip with optical imaging characteristics is easily damaged in the chip packaging and module manufacturing process because the lens is exposed on the surface of the glass substrate covering the chip. In order to ensure good optical imaging characteristics of the lens, pollution, scratch and the like to the lens need to be strictly controlled and reduced, which puts high requirements on chip packaging, module manufacturing and the like.

In the prior art, after a chip is packaged and before the chip is mounted on a device, a supporting member for supporting needs to be individually attached to a packaged chip module to protect a lens and prevent the lens from being in direct contact with the device. Because the laminating of supporter need be carried out one by one to single chip module, consequently the efficiency is lower, and in order to facilitate the operation, the supporter is great for the gross thickness of module improves.

How to protect the lens while packaging the chip and reduce the thickness of the module is an urgent problem to be solved at present.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a camera lens subassembly, an optical sensor and fan-out type packaging structure thereof is provided.

In order to solve the above problem, the utility model provides a lens assembly, include: a substrate having opposing first and second surfaces; at least one lens on the first surface of the substrate; and the protective structure is positioned on the first surface of the substrate and arranged around the lens, and the top of the protective structure is higher than that of the lens.

Optionally, the protective structure is in a shape of a fence and is disposed on the periphery of all the lenses, or comprises a plurality of sub-fences, and each sub-fence is disposed on the periphery of one or more of the lenses.

Optionally, the protective structure includes a protective layer having at least one hole exposing the lens.

Optionally, the distance between the protective structure and the lens is greater than 1 μm.

Optionally, the material of the protection structure is photoresist or resin.

The technical scheme of the utility model an optical sensor is still provided, include: the lens assembly of any of the above; the optical sensing chip is attached to the second surface of the substrate; and the interconnection line is connected with the optical sensing chip.

The technical scheme of the utility model a fan-out type packaging structure of optical sensor is still provided, include: a plurality of optical sensors; the top of the protection structure of the optical sensor is adhered to a supporting layer; and a filling layer is arranged between the adjacent optical sensors.

Optionally, the filling layer is subjected to planarization treatment to expose a connection terminal of an interconnection line connecting the optical sensor chip.

Optionally, the method further includes: and the redistribution circuit is positioned on the surface of the filling layer and connected with the connecting end.

The utility model discloses a be formed with protection architecture around lens of lens subassembly, it is right the lens subassembly removes or when carrying out other process steps on the second surface of the base plate of lens subassembly, can be at first right the lens subassembly falls the membrane protection architecture surface card covers the protection film for protection architecture is higher than lens. The lens can not contact with the protective film, so that the lens can be protected, and subsequent steps such as chip packaging and the like are facilitated.

Drawings

Fig. 1A to 1B are schematic structural views of a lens assembly according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a lens assembly according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a lens assembly according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a lens assembly according to an embodiment of the present invention;

fig. 5A to 5C are schematic structural views illustrating a process of forming a lens module according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of an optical sensor according to an embodiment of the present invention;

fig. 7 is a schematic view illustrating a lens assembly being sucked by a suction nozzle according to an embodiment of the present invention;

fig. 8A to 8G are schematic structural diagrams illustrating a forming process of a fan-out package structure of an optical sensor according to an embodiment of the present invention.

Detailed Description

The following describes in detail specific embodiments of a lens assembly, a forming method thereof, an optical sensor, a fan-out package structure thereof, and a packaging method according to the present invention with reference to the accompanying drawings.

Please refer to fig. 1A to 1B, which are schematic structural views of a lens assembly according to an embodiment of the present invention. Wherein FIG. 1A is a schematic cross-sectional view taken along cut line AA' in FIG. 1B.

The lens assembly includes a substrate 100 having opposing first and

second surfaces

110, 120; at least one lens 101 on a first surface 110 of the substrate 100; a protective structure 102 disposed on the first surface 110 of the substrate 100 and surrounding the lens 101, wherein the top of the protective structure 102 is higher than the top of the lens 101.

In this embodiment, the substrate 100 is a transparent substrate, and may be a transparent material such as glass or organic glass. A single lens is formed on the first surface 110 of the substrate 100. The protective structure 102 is located around the lens 101 and is disposed around the lens 101.

The protective structure 102 is spaced apart from the lens 101. In this embodiment, the protective structure 102 is in the shape of a fence, and forms a rectangular space around the lens 101. Referring to fig. 2, in another embodiment, the protection structure 102 may further form a circular space around the lens 101. In other specific embodiments, the edge of the protection structure facing one side of the lens may further enclose a triangle, a square, a trapezoid, or a polygon, and the like, and may be adjusted according to the optical path requirement, so as to improve the optical imaging characteristic of the lens. In order to avoid contact with the lens 101 or too close to the lens 101 to affect the image formation of the lens 101, the lateral distance between the protective structure 102 and the lens 101 needs to be greater than 1 μm; to improve the support effect, the lateral distance between the protective structure 102 and the lens 101 is smaller than 1/2 of the spacing between the lenses.

Two or more lenses 101 may be formed in the space surrounded by the protective structure 102.

The top of the protection structure 102 is higher than the top of the lens 101, so that the protection and support effects can be achieved around the lens 101, and the lens 101 is prevented from being directly touched when the outside contacts with the substrate. The distance between the top of the lens 101 and the top of the protective structure 102 may be 1 μm to 2mm for sufficient support and protection, and may be adjusted by those skilled in the art according to the actual situation.

The material of the protection structure 102 is a polymer material such as photoresist or resin, or may be a metal or other mechanical material, which is easy to form and has little influence on light propagation. The material of the protective structure 102 has a large young's modulus, has a certain hardness, and is not easily deformed, thereby playing a strong supporting role.

Please refer to fig. 3, which is a schematic structural diagram of a lens assembly according to another embodiment of the present invention.

In this embodiment, a plurality of lenses 301 arranged in an array are formed on the surface of the substrate 300, and the protective structures 302 are disposed on the periphery of the area where all the lenses 301 are located.

When the number of lenses is large, the protection structure is provided only at the outermost periphery of all the lenses, and thus it may not be possible to sufficiently protect all the lenses, and it is possible to increase the area of the protection structure appropriately and to add the protection structure between the lenses 301.

Please refer to fig. 4, which is a schematic structural diagram of a lens assembly according to another embodiment of the present invention.

In this embodiment, a plurality of lenses 401 arranged in an array are formed on the surface of the substrate 400 of the lens assembly. The protective structure comprises a protective layer 402 having at least one aperture 4021, the aperture 4021 exposing the lens 401.

In other embodiments, the protective structure may include a plurality of sub-fences, each of which is disposed around one or more of the lenses 401.

When the lens assembly is moved or other process steps are performed on the second surface of the substrate of the lens assembly, the lens assembly may be firstly subjected to film inversion, and a protective film is attached to the surface of the protective structure, so that the protective structure is higher than the lens. The lens can not contact with the protective film, so that the lens can be protected, and subsequent steps such as chip packaging and the like are facilitated.

Referring to fig. 7, a schematic diagram of the lens assembly 710 being sucked by the suction nozzle 730 is shown. A protective film 720 is attached to the surface of the lens assembly to protect the lens 7011, and then the protective film 720 is directly attached by the suction nozzle 730, so that the lens 7011 can be prevented from being damaged.

The present invention also provides a method for forming a lens assembly.

Referring to fig. 5A, a substrate 500 is provided, the substrate 500 includes a first surface 510 and a second surface 520 opposite to each other; at least one lens 501 is formed on a first surface 510 of the substrate 500.

The substrate 500 is a transparent substrate, and may be made of transparent materials such as glass and organic glass. In this embodiment, a single lens is formed on the first surface 510 of the substrate 500; in other embodiments, a plurality of lenses may be formed on the first surface 510 of the substrate 500, for example, a lens array composed of a plurality of lenses is formed, as required.

Subsequently, a protective structure surrounding the lens 501 is formed on the first surface of the substrate 500.

Referring to fig. 5B, a protective material layer 530 is formed to cover the first surface 510 of the substrate 500 and the lens 501.

In this embodiment, the protective material layer 530 is a photoresist layer. The photoresist layer 530 may be formed on the surface of the substrate 500 by a spin coating process. In other embodiments, the protective material layer 530 may also be formed on the surface of the substrate 500 by deposition or other processes. The surface of the protective material layer 530 is higher than the top of the lens 501.

Referring to fig. 5C, the protective material layer 530 is patterned to expose the lens 501.

In this embodiment, the material of the protective material layer 530 is a photoresist, and the protective material layer 530 may be exposed and developed to remove the photoresist covering the lens 501 and a distance around the lens 501, so that the lens 501 is exposed on the surface of the substrate 500, thereby forming a protective structure 531 at the periphery of the lens 501.

In other specific embodiments, the protective material layer 530 may also be made of a metal or a dielectric layer, and the protective material layer 530 may be patterned by an etching process.

In other embodiments, the protection structure 531 may be formed on the surface of the substrate 500 by a screen printing process.

The distance between the protection structure 531 and the lens 501 is greater than 1 μm, and the distance between the top of the protection structure 531 and the top of the lens 501 is 1 μm-2 mm.

The specific shape of the patterning of the protective material layer may be adjusted according to the lens profile formed on the first surface of the substrate, resulting in the lens assembly as shown in fig. 2, 3 and 4.

In some embodiments, corresponding lenses may be formed on corresponding chip regions on a substrate having a size of a whole wafer or panel, and a protective structure around the lenses on each chip region may be formed by patterning once, and then the substrate may be cut to form a plurality of discrete lens assemblies, which may improve the efficiency of forming the lens assemblies.

Particular embodiments of the present invention also provide an optical sensor.

Please refer to fig. 6, which is a schematic structural diagram of an optical sensor according to an embodiment of the present invention.

The optical sensor includes: a lens assembly 610, which includes a substrate 601, a lens 6011 on a first surface of the substrate 601, and a protective structure 6012 disposed around the lens 6011.

The optical sensor further includes an optical sensing chip 630 attached to the second surface of the substrate 601. Specifically, the substrate 601 and the optical sensor chip 630 are fixed by an adhesive layer 620. The light-sensing surface (front surface) of the optical sensor chip 630 faces the lens assembly 610, and the light-sensing area of the optical sensor chip 630 is located below the area where the lens 6011 is located.

The back of the optical sensing chip 630 is formed with an interconnection line 640 connected to the optical sensing chip 630, and an insulating layer 650 covering the interconnection line 640, wherein the insulating layer 650 exposes two connection terminals 660 of the interconnection line 640, and the connection terminals 660 may be pads or solder balls, metal bumps, or the like, for forming an electrical connection with the outside.

The interconnection line 640 is formed through a TSV process, a groove is formed by etching the back surface of the optical sensing chip 630, and then the interconnection line 640 is formed in the groove. In this embodiment, the side walls of the grooves are inclined, and in other embodiments, the side walls of the grooves may also be vertical.

In another embodiment, a redistribution layer is formed on the second surface of the substrate 610, so that the pads on the front surface of the optical sensor chip 630 are connected to the redistribution layer, and the optical sensor chip 630 can be electrically connected to the outside through the redistribution layer.

In other embodiments, the interconnection lines connecting the optical sensor chip 630 can be formed by other suitable methods, and those skilled in the art can select a suitable method according to specific requirements.

The lens assembly of the optical sensor comprises the protection structure arranged around the lens, and the lens can be included when the optical sensor moves or is installed on equipment and the like, so that the optical assembly can have good optical imaging performance, and convenience is brought to manufacturing processes of chip packaging testing and the like.

In addition, when the optical sensor is installed on specific electronic equipment, a bearing part does not need to be additionally installed on the lens side, so that the cost can be reduced, and the efficiency can be improved.

The specific embodiment of the utility model also provides an above-mentioned optical sensor's packaging method. The packaging method of the optical sensor comprises the following steps: forming the lens assembly of the previous embodiments; pasting an optical sensing chip on the second surface of the substrate; and forming an interconnection line for connecting the optical sensing chip.

In one embodiment, the lens assembly may be formed first, and then the optical sensor chip is attached to the second surface of the substrate of the lens assembly, and the interconnection lines are formed. In this embodiment, a protective film can be applied to the lens side of the lens assembly, and since the top of the protective structure is higher than the lens to support the lens, the lens will not contact with the outside. The lens is not damaged when the packaging processes such as the optical sensing chip is pasted and the interconnection circuit is formed. After chip packaging is performed on a wafer-sized or panel-sized substrate, dicing is performed to form individual optical sensors.

In another embodiment, the optical sensor chip may be attached to the second surface of the substrate and the interconnection lines may be formed, and then the lens and the protection structure may be formed on the first surface of the substrate.

The utility model discloses a specific embodiment still provides an optical sensor's fan-out type packaging structure and packaging method thereof.

Referring to fig. 8A, a plurality of optical sensors according to the foregoing embodiments are provided, and the top of the protection structure of the optical sensor is adhered to a supporting layer 810.

Only two optical sensors are shown in fig. 8A, and the optical sensor structure is shown in fig. 6. The protective structure 6012 of the lens assembly 610 of the optical sensor is adhered to the surface of the support layer 810. The support layer 810 may be a protective film or a transparent substrate. The support layer 820 may be wafer-sized or panel-sized to accommodate different sized packages.

Since the protective structure 6012 is higher than the lens 6011, the lens 6011 can be prevented from contacting the support layer 810, so that the lens 6011 is protected during the encapsulation process.

Fig. 8B is a schematic top view of the supporting layer 810 after the optical sensor 801 is attached. The optical sensors 801 are arrayed on the support layer 810.

Referring to fig. 8C, a filling layer 820 is formed between adjacent optical sensors.

The material of the filling layer 820 may be an insulating polymer material, and the gap between the optical sensors may be filled by coating, spin coating, or the like, so as to form the filling layer 820.

The filler layer 820 covers the optical sensor. In the process of forming the filling layer 820, since the protective structure 6012 is disposed around the lens 6011, it can be avoided that the material of the filling layer 820 penetrates around the lens 6011 to contaminate the lens 6011, which affects the imaging effect of the lens 6011.

Referring to fig. 8D, the filling layer 820 is planarized to expose the connection terminals of the interconnection lines connected to the optical sensors.

The planarization process may employ an etching or chemical mechanical polishing process. During the planarization process of the filling layer 820, the protective structure 6012 surrounds the lens 6011 and protects the lens 6011.

Referring to fig. 8E, a redistribution trace 830 connected to the connection terminal 660 and an insulating layer 840 covering the redistribution trace 830 are formed on the surface of the polished filling layer 821, and the insulating layer 840 has an opening therein exposing the connection portion of the redistribution trace 830. A person skilled in the art can form connection points such as solder balls and metal bumps at the openings to connect the redistribution traces 830 as needed to meet the requirements of different package forms.

If the support layer 810 is a protective film, the support layer 810 may be removed after the encapsulation is completed. If the support layer 810 is a transparent substrate, it may be retained after the encapsulation is completed.

After the fan-out type packaging is carried out, the packaging structure can be further divided to form the fan-out type optical sensing module.

Referring to fig. 8F and 8G, a cross-sectional view and a top view of the package structure in fig. 8E are shown after the package structure is divided to form an optical sensing module and the supporting layer 810 is removed. By way of example, two optical sensors 801 are included in the optical sensing module.

Since the lens 6011 is protected by the protection structure 6012, the fan-out package and the module cutting can be realized, and the lens remains intact without damage or contamination during the above process.

The utility model discloses a concrete implementation mode can require according to specific module, sets for the quantity of the optical sensor who contains in the module, passes through fan-out encapsulation method with many optical sensors that have optical lens subassembly, and is integrated on a product, when the light area and the light inlet amount of advancing of increase optical sensing module, has fine support and protection to the lens, has realized the optical identification of bigger area, has strengthened the function of the final output of optical sensing module.

In other specific embodiments, the lens assemblies corresponding to the plurality of optical sensor chips, which are not divided, on the wafer level may be first attached to the surface of the supporting layer 810, and then a plurality of optical sensor chips are attached corresponding to each lens assembly, so as to perform fan-out type packaging. In this embodiment, the lens assembly does not need to be divided in advance, so that the process steps can be saved.

The utility model discloses a specific embodiment still provides an optical sensor's fan-out type packaging structure.

Referring to fig. 8E, the fan-out package structure of the optical sensor includes: a number of optical sensors 801; the top of the protection structure 6012 of the optical sensor is adhered to a supporting layer 810; between adjacent optical sensors there is a filler layer 821.

For the optical sensor, please refer to the description of the foregoing embodiments, which are not repeated herein.

The filling layer 821 exposes a connection end 660 of the interconnection line 640 connected to the optical sensor chip.

The surface of the filling layer 821 may be further formed with a redistribution trace 830 connected to the connection end 660. The redistribution layer 830 further comprises an insulating layer 840 covering the redistribution lines 830, and openings exposing the connection portions of the redistribution lines 830 are formed in the insulating layer 840. Connection points such as solder balls and metal bumps connected with the redistribution lines 830 can be formed at the openings to meet the requirements of different packaging forms.

In other embodiments, the supporting layer 810 (see fig. 8F) may be removed from the fan-out package structure, and the lens 6011 and the protective structure 6012 are exposed most directly, where the lens 6011 is protected by the protective structure 6012 under any circumstances.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.

Claims

1. A lens assembly, comprising:

a substrate having opposing first and second surfaces;

at least one lens on the first surface of the substrate;

and the protective structure is positioned on the first surface of the substrate and arranged around the lens, and the top of the protective structure is higher than that of the lens.

2. The lens assembly of claim 1, wherein the protective structure is rail-shaped and is disposed around all of the lenses, or comprises a plurality of sub-rails, each sub-rail being disposed around one or more of the lenses.

3. The lens assembly of claim 1, wherein the protective structure comprises a protective layer having at least one hole exposing the lens.

4. The lens assembly of claim 1, wherein a distance between the protective structure and the lens is greater than 1 μ ι η.

5. The lens assembly of claim 1, wherein the material of the protective structure is a photoresist or a resin.

6. An optical sensor, comprising:

the lens assembly of any of claims 1-5;

the optical sensing chip is attached to the second surface of the substrate;

and the interconnection line is connected with the optical sensing chip.

7. A fan-out package structure for an optical sensor, comprising:

a plurality of optical sensors as claimed in claim 6;

the top of the protection structure of the optical sensor is adhered to a supporting layer;

and a filling layer is arranged between the adjacent optical sensors.

8. The fan-out package structure of claim 7, wherein the fill layer is planarized to expose connection ends of interconnect lines connecting the optical sensor die.

9. The fan-out package structure of claim 8, further comprising: and the redistribution circuit is positioned on the surface of the filling layer and connected with the connecting end.