CN210839778U

CN210839778U - Sensitization chip, sensitization subassembly, module and intelligent terminal make a video recording

Info

Publication number: CN210839778U
Application number: CN201922403238.XU
Authority: CN
Inventors: 帅文华
Original assignee: Nanchang OFilm Optoelectronics Technology Co Ltd
Current assignee: Jiangxi Jinghao Optical Co Ltd
Priority date: 2019-12-27
Filing date: 2019-12-27
Publication date: 2020-06-23
Anticipated expiration: 2029-12-27

Abstract

The utility model relates to a photosensitive chip, a photosensitive assembly, a camera module and an intelligent terminal, wherein the photosensitive chip comprises a substrate and a photosensitive unit; the substrate is provided with a first surface and a second surface which are arranged oppositely, and the first surface is provided with a groove; the photosensitive unit is arranged in the groove and electrically connected with the substrate, the end face of the photosensitive unit, which is far away from the second surface, is a photosensitive surface, and the photosensitive surface is arranged between the first surface and the second surface. The utility model discloses can reduce the height of sensitization chip photosurface, reach the purpose of the whole thickness of attenuate module of making a video recording. In addition, because the photosensitive chip is only provided with the groove in the local area of the substrate and the thickness of the substrate is not reduced integrally, the structural strength of the edge of the substrate is maintained at a higher level, so that the substrate is not easy to bend and warp.

Description

Sensitization chip, sensitization subassembly, module and intelligent terminal make a video recording

Technical Field

The utility model relates to a camera technical field especially relates to a sensitization chip, photosensitive assembly, module and intelligent terminal make a video recording.

Background

Because the thickness of the sensitization chip in the module of making a video recording maintains at thick level, and make a video recording the whole thickness of module great, be unfavorable for the development of making a video recording the module frivolousization. In the correlation technique, can adopt the mode of whole attenuate sensitization chip thickness, realize the purpose that the module of making a video recording is more frivolous, but the intensity of the sensitization chip after the thickness attenuate weakens for the sensitization chip after the thickness attenuate takes place bending and warpage phenomenon easily.

SUMMERY OF THE UTILITY MODEL

Based on this, it is necessary to provide a sensitization chip, sensitization subassembly, module and intelligent terminal to the problem that the intensity of the sensitization chip that brings is not enough in order to realize making a video recording the more frivolous of module, adopts the thickness of whole attenuate sensitization chip.

A photosensitive chip, comprising:

the substrate is provided with a first surface and a second surface which are arranged oppositely, and the first surface is provided with a groove;

a circuit layer, at least part of the structure of which is formed on the substrate

The photosensitive unit is arranged in the groove and electrically connected with the circuit layer, the end face of the photosensitive unit, which deviates from the second surface, is a photosensitive surface, and the photosensitive surface is arranged between the first surface and the second surface.

Above-mentioned sensitization chip can be applied to the module of making a video recording, and under the certain prerequisite of the focus of the module of making a video recording, the distance between the camera lens of camera lens subassembly and the sensitization face of sensitization chip among the module of making a video recording keeps unchangeable, and when the high reduction of the sensitization face of sensitization chip, the camera lens reduces along with the high reduction of sensitization face to can attenuate the whole thickness of the module of making a video recording, make the module of making a video recording frivolous more. The utility model discloses a set up the recess of holding sensitization unit at the base plate to make the sensitization face between first surface and second surface, thereby can reduce the height of sensitization chip sensitization face, reach the purpose of the whole thickness of attenuate module of making a video recording. In addition, because the photosensitive chip is only provided with the groove in the local area of the substrate and the thickness of the substrate is not reduced integrally, the structural strength of the edge of the substrate is maintained at a higher level, so that the substrate is not easy to bend and warp.

In one embodiment, the photosensitive unit includes a light-transmitting layer, a filter layer, and a photosensitive layer, which are connected in this order, in a direction from the first surface to the second surface; the circuit layer comprises a first part and a second part which are electrically connected, the first part is integrated in the substrate and is positioned at the periphery of the photosensitive unit, the second part is arranged between the filter layer and the photosensitive layer, and the photosensitive layer is electrically connected with the second part. Therefore, the circuit layer part structure (namely the first part) can be transferred to the periphery of the photosensitive unit, and the circuit layer is prevented from being completely arranged in the groove, so that the thickness of the circuit layer has influence on the height of the photosensitive surface of the photosensitive chip.

In one embodiment, the photosensitive unit includes a light-transmitting layer, a filter layer, and a photosensitive layer, which are connected in this order, in a direction from the first surface to the second surface; the circuit layer comprises a first part and a second part which are electrically connected, the first part is integrated in the substrate and is positioned at the periphery of the photosensitive unit, the second part is arranged at one side of the photosensitive layer, which is far away from the filter layer, and the photosensitive layer is electrically connected with the second part. Therefore, the circuit layer part structure (namely the first part) can be transferred to the periphery of the photosensitive unit, and the circuit layer is prevented from being completely arranged in the groove, so that the thickness of the circuit layer has influence on the height of the photosensitive surface of the photosensitive chip.

In one embodiment, the distance between the photosensitive surface and the second surface is 0.05mm-0.15 mm. Therefore, on the premise of ensuring the bending strength of the photosensitive chip, the thickness of the photosensitive surface is reduced, and the overall thickness of the camera module obtained by assembling is maintained at a lower level.

A photosensitive assembly comprising:

a circuit board;

in the photosensitive chip, the second surface is attached to the circuit board, and the circuit layer is electrically connected with the circuit board.

Above-mentioned photosensitive assembly can be applied to the module of making a video recording, the utility model discloses a set up the recess of holding sensitization unit at the base plate to make the sensitization face between first surface and second surface, thereby can reduce the height of sensitization chip sensitization face, reach the purpose of the whole thickness of attenuate module of making a video recording. In addition, because the photosensitive chip is only provided with the groove in the local area of the substrate and the thickness of the substrate is not reduced integrally, the structural strength of the edge of the substrate is maintained at a higher level, so that the substrate is not easy to bend and warp.

In one embodiment, the photosensitive assembly further comprises a conductive wire, and the conductive wire is electrically connected with the circuit layer and the circuit board. Therefore, the bonding of the conductive wire is facilitated, and the photosensitive unit is not interfered.

In one embodiment, the circuit board is provided with a sinking groove along a direction in which the first surface and the second surface are arranged oppositely, and at least part of the structure of the photosensitive chip is accommodated in the sinking groove. So, can further reduce the height of sensitization face of sensitization chip to make the whole thickness of the module of making a video recording further reduce.

A camera module, comprising:

the photosensitive assembly;

the packaging body is of a hollow structure with openings at two ends and is arranged on the circuit board in a surrounding manner;

the lens assembly is borne at one end, far away from the circuit board, of the packaging body and is opposite to the photosensitive surface.

In the camera module, the groove for accommodating the photosensitive unit is formed in the substrate, and the photosensitive surface is arranged between the first surface and the second surface, so that the height of the photosensitive surface of the photosensitive chip can be reduced, and the purpose of reducing the overall thickness of the camera module is achieved. In addition, because the photosensitive chip is only provided with the groove in the local area of the substrate and the thickness of the substrate is not reduced integrally, the structural strength of the edge of the substrate is maintained at a higher level, so that the substrate is not easy to bend and warp.

In one embodiment, a carrying table is disposed on an inner side wall of the package, and the camera module further includes an optical filter, wherein the optical filter is connected to the carrying table in an overlapping manner. Therefore, the module imaging quality can be improved.

An intelligent terminal, comprising:

a terminal body; and

the camera module is arranged on the terminal body.

Above-mentioned intelligent terminal is because the module of making a video recording is more frivolous to can reserve the inside more installation space of intelligent terminal, and make intelligent terminal more frivolous, promote user and use experience.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of the camera module in fig. 1 according to an embodiment;

FIG. 3 is a schematic structural diagram of the sensor chip in FIG. 2;

FIG. 4 is a schematic structural diagram of a portion A of FIG. 3 in accordance with one embodiment;

FIG. 5 is a schematic structural diagram of a portion A of another embodiment of FIG. 3;

fig. 6 is a schematic structural diagram of the camera module according to another embodiment of fig. 1.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention can be embodied in many different forms other than those specifically described herein, and it will be apparent to those skilled in the art that similar modifications can be made without departing from the spirit and scope of the invention, and it is therefore not to be limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1, the present application will describe a smart terminal 10 by taking a smart phone as an example. Those skilled in the art will readily understand that the smart terminal 10 of the present application may be any device having communication, storage and shooting functions, such as an electronic device, e.g., a smart phone, a tablet computer, a notebook computer, a mobile phone, a video phone, a digital still camera, an electronic book reader, a Portable Multimedia Player (PMP), a mobile medical device, etc., and the representation of the smart terminal 10 is not limited thereto. Of course, wearable devices such as smartwatches are also applicable to the smart terminal 10 according to the embodiments of the present application.

The intelligent terminal 10 includes a terminal body 10a and a camera module 10b provided in the terminal body 10 a. In an embodiment, the terminal body 10a includes a middle frame 11, a rear cover 12 and a display 13, the rear cover 12 and the display 13 are respectively connected to two opposite sides of the middle frame 11 and enclose to form an accommodating space, and devices such as a main board, a memory, a power supply and the like of the intelligent terminal 10 are disposed in the accommodating space. The camera module 10b is used as a front camera and exposed at a side of the display screen 13 where the displayable area is located. In other embodiments, the camera module 10b may also be exposed to the side of the rear cover 12 as a rear camera. The mounting position of the camera module 10b is not limited at all.

Referring to fig. 2, the camera module 10b includes a photosensitive assembly 100, a package 200, and a lens assembly 300.

The photosensitive assembly 100 includes a circuit board 110 and a photosensitive chip 120. The Circuit Board 110 is used to carry the photosensitive chip 120, and the Circuit Board 110 may be a PCB (Printed Circuit Board), a rigid-flex Board, or a reinforced FPC (Flexible Printed Circuit). Wherein, the rigid-flex board is including range upon range of PCB and the FPC that sets up, and the flexible circuit board after the reinforcement is including range upon range of FPC and the reinforcement piece that sets up, and the reinforcement piece can be for having the steel sheet of good heat dispersion.

The photo sensor chip 120 is a device that converts an optical signal into an electrical signal. The photosensitive chip 120 may be a CCD (Charge-coupled Device) photosensitive chip or a CMOS (Complementary Metal-Oxide-Semiconductor) photosensitive chip.

The photosensitive chip 120 is disposed on the circuit board 110 and electrically connected to the circuit board 110. In one embodiment, referring to fig. 3, the photo sensor chip 120 includes a substrate 121, a photo sensor unit 122, and a circuit layer 123. The substrate 121 has a first surface 121a and a second surface 121b opposite to each other, and the first surface 121a is provided with a groove 1211. At least a part of the circuit layer 123 is formed on the substrate 121, and the circuit layer 123 may be a metal layer. The photosensitive unit 122 is disposed in the recess 1211 and electrically connected to the circuit layer 123 of the substrate 121. An end surface of the photosensitive unit 122 facing away from the second surface 121b is a photosensitive surface 122a, and the photosensitive surface 122a is interposed between the first surface 121a and the second surface 121 b. In one embodiment, the distance H between the photosensitive surface 122a and the second surface 121b is 0.05mm to 0.15 mm. It should be noted that the area of the substrate 121 with the groove 1211 may be understood as a photosensitive area, and the area of the substrate 121 without the groove 1211 may be understood as a logic area, i.e., a non-photosensitive area.

Referring to fig. 2, the second surface 121b is attached to the circuit board 110, for example, the second surface 121b may be adhered to the circuit board 110 by an adhesive 20. In an embodiment, the photosensitive element 120 includes conductive wires 123, and the first surface 121a may be provided with pads 1212 electrically connected to the circuit layer 123, so that the conductive wires 123 electrically connect the pads 1212 and the circuit board 110, and the circuit layer 123 of the substrate 121 is electrically connected to the circuit board 110. Conductive line 123 may be, but is not limited to, a gold line, a copper line, a silver line, and the like. The conductive wires 123 can be encapsulated by an encapsulation adhesive to avoid disorder of the flat cables.

Referring to fig. 2, the package 200 is a hollow structure with two open ends, and the package 200 is formed on the circuit board 110 and surrounds the photo sensor chip 120. The package body 200 may be formed on the circuit board 110 by injection molding. The package body 200 is formed by molding the circuit board 110 through an insert molding process using, for example, an injection molding machine. The formed package body 200 is firmly connected to the circuit board 110, and the bonding force between the package body 200 and the circuit board 110 is much larger than that between the package body 200 and the circuit board 110 which are bonded by a conventional bracket through a glue layer.

The material for forming the package body 200 by using the injection molding process may be ninon, LCP (Liquid crystal polymer), PP (Polypropylene), or the like. It will be understood by those skilled in the art that the foregoing alternative forms of manufacture, as well as alternative materials, are provided by way of illustration only and are not intended to limit the present invention.

Referring to fig. 2, the lens assembly 300 is disposed in the photosensitive path of the photosensitive chip 120. The lens assembly 300 is carried at an end of the package body 200 away from the circuit board 110 and opposite to the light-sensing surface 122 a. In an embodiment, the lens assembly 300 includes a lens holder 310 and a lens 320 disposed in the lens holder 310, and the lens holder 310 is carried on a side of the package body 200 away from the circuit board 110. The lens 320 includes a lens barrel 321 and a lens 322, the lens 322 is disposed in the lens barrel 321, and the lens barrel 321 is connected to the inner wall of the lens holder 310. In one embodiment, when the focal length of the lens 320 is adjustable, the mirror base 310 can be a VCM voice coil motor.

In an embodiment, the inner sidewall of the package 200 is provided with a carrier 210, the camera module 10b further includes a filter 400, and the filter 400 is mounted on the carrier 210 to improve the imaging quality of the camera module 10 b. It is understood that in other embodiments, filter 400 may be omitted when imaging quality requirements are not high.

In the camera module 10b, on the premise that the focal length of the camera module 10b is fixed, the distance between the lens 320 of the lens assembly 300 and the photosensitive surface 122a of the photosensitive chip 120 in the camera module 10b is kept unchanged. Now, the heights of the components such as the photo sensor chip 120 and the lens 320 are defined as the distances from the circuit board 110, and the thickness T of the camera module 10b is the maximum distance between two back sides of the camera module shown in fig. 2 in the Z-axis direction, and when the height of the photo sensing surface 122a of the photo sensor chip 120 is reduced (i.e., when the distance between the photo sensing surface 122a and the circuit board 110 is reduced), the lens 320 is reduced along with the reduction of the height of the photo sensing surface 122a (i.e., the distance between the lens 320 and the circuit board 110 is reduced), so that the overall thickness of the camera module 10b can be reduced, and the camera module 10b is lighter and thinner. The utility model discloses a set up the recess 1211 of holding sensitization unit 122 at base plate 121 to make sensitization face 122a between first surface 121a and second surface 121b, thereby can reduce sensitization chip 120 sensitization face 122 a's height, reach the purpose of the whole thickness of attenuate camera module 10 b. In addition, since the groove 1211 is formed only in a partial region of the substrate 121, the thickness of the substrate 121 is not reduced as a whole, and thus the structural strength of the edge of the substrate 121 is maintained at a high level, so that the substrate is not easily bent or warped.

In one embodiment, as shown in fig. 3 and 4, the photosensitive unit 122 includes a light-transmitting layer 1221, a filter layer 1222, and a photosensitive layer 1223, which are sequentially connected in a direction from the first surface 121a to the second surface 121 b. It should be noted that the transparent layer 1221 may include a plurality of lenses arranged in an array, and the transparent layer 1221 is used to focus light. The filter layer 1222 may include red, green, and blue filters to filter out optical signals outside a predetermined wavelength band. The photosensitive layer 1223 is used to acquire optical signals and convert the optical signals into electrical signals to generate image information. The photosensitive layer 1223 may be a photodiode, and the photosensitive layer 1223 is electrically connected to the circuit layer 123.

In one embodiment, referring to fig. 3 and 4, the sensor chip 120 employs Front Side Illumination (FSI), in which the circuit layer 123 includes a first portion 1231 and a second portion 1232 electrically connected to each other, the first portion 1231 is integrated in the substrate 121 and located at the periphery of the sensor unit 122, the second portion 1232 is disposed between the filter layer 1222 and the photosensitive layer 1223, and the photosensitive layer 1223 is electrically connected to the second portion 1232. Since the circuit layer 123 is partially (i.e., the first portion 1231) transferred to the periphery of the light-sensing unit 122, the circuit layer 123 is prevented from being completely disposed in the groove 1211, so that the distance between the light-sensing surface 122a of the light-sensing chip 120 and the bottom of the groove 1211 under the influence of the thickness of the circuit layer 123 is prevented from increasing, i.e., the light-sensing surface 122a is prevented from being raised.

In other embodiments, referring to fig. 3 and 5, the photo sensor chip 120 employs a backside illumination (BSI), in which the first portion 1231 is integrated in the substrate 121 and located at the periphery of the photo unit 122, the second portion 1232 is disposed at a side of the photo-sensing layer 1223 away from the filter layer 1222, and the photo-sensing layer 1223 is electrically connected to the second portion 1232. Due to the fact that the circuit layer 123 is partially (i.e., the first portion 1231) transferred to the periphery of the light sensing unit 122, the circuit layer 123 is prevented from being completely disposed in the groove 1211, and the distance between the light sensing surface 122a of the light sensing chip 120 and the bottom of the groove 1211 is prevented from being increased under the influence of the thickness of the circuit layer 123.

In an embodiment, referring to fig. 5, the circuit board 110 has a sinking groove 111 along a direction in which the first surface 121a and the second surface 121b are opposite to each other, the direction in which the first surface 121a and the second surface 121b are opposite to each other may be parallel to the thickness direction of the circuit board 110, and at least a portion of the photosensitive chip 120 is accommodated in the sinking groove 111. Thus, the height of the photosensitive surface 122a can be further reduced by accommodating the photosensitive chip 120 in the sinking groove 111, and the height of the lens 320 is reduced by the reduction of the height of the photosensitive surface 122a, so that the overall thickness of the camera module 10b can be further reduced, and the camera module 10b tends to be thinner and more compact.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A photosensitive chip, comprising:

a circuit layer, wherein at least part of the structure of the circuit layer is formed on the substrate; and

2. The photosensitive chip according to claim 1, wherein the photosensitive unit includes a light-transmitting layer, a filter layer, and a photosensitive layer, which are connected in this order, in a direction from the first surface to the second surface; the circuit layer comprises a first part and a second part which are electrically connected, the first part is integrated in the substrate and is positioned at the periphery of the photosensitive unit, the second part is arranged between the filter layer and the photosensitive layer, and the photosensitive layer is electrically connected with the second part.

3. The photosensitive chip according to claim 1, wherein the photosensitive unit includes a light-transmitting layer, a filter layer, and a photosensitive layer, which are connected in this order, in a direction from the first surface to the second surface; the circuit layer comprises a first part and a second part which are electrically connected, the first part is integrated in the substrate and is positioned at the periphery of the photosensitive unit, the second part is arranged at one side of the photosensitive layer, which is far away from the filter layer, and the photosensitive layer is electrically connected with the second part.

4. The photosensitive chip according to any one of claims 1 to 3, wherein a distance between the photosensitive surface and the second surface has a value of 0.05mm to 0.15 mm.

5. A photosensitive assembly, comprising:

a circuit board;

the photosensitive chip of any one of claims 1 to 4, wherein the second surface is attached to the circuit board, and the circuit layer is electrically connected to the circuit board.

6. The photosensitive assembly of claim 5, further comprising a conductive wire electrically connecting the circuit layer of the substrate and the circuit board.

7. The photosensitive assembly of claim 5, wherein the circuit board is provided with a sinking groove along a direction in which the first surface and the second surface are opposite to each other, and at least a part of the photosensitive chip is accommodated in the sinking groove.

8. The utility model provides a module of making a video recording which characterized in that includes:

the photosensitive assembly according to any one of claims 5 to 7;

9. The camera module of claim 8, wherein a stage is disposed on an inner sidewall of the package, and the camera module further comprises a filter attached to the stage.

10. An intelligent terminal, comprising:

a terminal body; and

the camera module according to claim 8 or 9, wherein the camera module is disposed on the terminal body.