CN209328888U - Photosensory assembly, camera module and mobile terminal - Google Patents
Photosensory assembly, camera module and mobile terminal Download PDFInfo
- Publication number
- CN209328888U CN209328888U CN201822237748.XU CN201822237748U CN209328888U CN 209328888 U CN209328888 U CN 209328888U CN 201822237748 U CN201822237748 U CN 201822237748U CN 209328888 U CN209328888 U CN 209328888U
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- electrical connection
- connection section
- sensitive chip
- circuit board
- photosensory assembly
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
- H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
- H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
- H01L2224/48481—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a ball bond, i.e. ball on pre-ball
- H01L2224/48483—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a ball bond, i.e. ball on pre-ball outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
- H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
- H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
- H01L2224/48484—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) being a plurality of pre-balls disposed side-to-side
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to a kind of photosensory assembly, camera module and mobile terminals.The photosensory assembly includes: circuit board, is equipped with the first electrical connection section；Sensitive chip, on circuit boards, sensitive chip is equipped with the second electrical connection section corresponding with the first electrical connection section far from the surface of circuit board for setting；Conductive structure, including main part and clinch, main part includes several conductive particles, and several conductive particles are sequentially overlapped, the conductive particle of main part one end is electrically connected with the first electrical connection section, and clinch is electrically connected the conductive particle of the second electrical connection section and the main part other end.In above-mentioned photosensory assembly, the main part being sequentially overlapped using conductive particle at least substitutes the gold thread of parts of traditional, so as to reduce the probability for occurring short circuit because of gold thread bending deformation, also the bad electric connection risk such as short circuit can be effectively reduced, so that above-mentioned photosensory assembly yield with higher.
Description
Technical field
The utility model relates to technical field of electronic equipment, more particularly to a kind of photosensory assembly, camera module and movement
Terminal.
Background technique
As shown in Figure 1, camera module 10 generally includes photosensory assembly 100 and lens assembly 200, photosensory assembly 100 includes
Circuit board 110, sensitive chip 120, bracket 130 and optical filter 140, sensitive chip 120 are set on circuit board 110, bracket
130 be the hollow structure of both ends open, and bracket 130 is set on circuit board 110, and sensitive chip 120 is contained in bracket 130, filter
Mating plate 140 is set on the stepped part of bracket 130, and lens assembly 200 is set on the one end of bracket 130 far from circuit board 110.
As shown in Figures 1 and 2, circuit board 110 is equipped with the first electrical connection section 112, and sensitive chip 120 is equipped with the second electricity
Interconnecting piece 122 connect the second electrical connection section 122 by gold thread 150 with the first electrical connection section 112 by beating gold thread technique,
To realize that sensitive chip 120 is electrically connected with circuit board 110.But gold thread 150 has certain length, is easily bent deformation, and causes
Gold thread 150 is contacted with the side of sensitive chip 120 leads to short circuit, influences the yield of camera module.
Utility model content
Based on this, it is necessary to for the problem that leading to short circuit because of gold thread bending deformation, influence the yield of camera module, mention
For a kind of photosensory assembly, camera module and mobile terminal.
A kind of photosensory assembly, comprising:
Circuit board is equipped with the first electrical connection section；
Sensitive chip is arranged on the circuit board, and the sensitive chip is equipped with and institute far from the surface of the circuit board
State corresponding second electrical connection section of the first electrical connection section；And
Conductive structure, including main part and clinch, the main part include several conductive particles, and several described conductive
Grain is sequentially overlapped, and the conductive particle of described main part one end is electrically connected with first electrical connection section, the clinch electricity
Connect the conductive particle of second electrical connection section and the main part other end.
In above-mentioned photosensory assembly, the main part being sequentially overlapped using conductive particle at least substitutes the gold thread of parts of traditional,
So as to reduce the probability for occurring short circuit because of gold thread bending deformation, the bad electric connection wind such as short circuit can also be effectively reduced
Danger, so that above-mentioned photosensory assembly yield with higher.
The conductive structure includes multiple conductive particles, multiple conductive particles in one of the embodiments,
Be sequentially overlapped, the conductive particle at the conductive structure both ends respectively with first electrical connection section and second conductive part
Electrical connection, wherein the clinch includes at least one described conductive particle.In above-mentioned photosensory assembly, using conductive particle
The conductive structure being sequentially overlapped substitutes traditional gold thread completely, can avoid the occurrence of and asking for short circuit occurs because of gold thread bending deformation
Topic, so that above-mentioned photosensory assembly has higher yield.
The number of the conductive particle is 3-5 in one of the embodiments, the number of the conductive particle of the main part
Mesh is more than or equal to 2.Wherein, the number of the conductive particle of main part is more than or equal to 2, conductive structure can be made close to first
One end of electrical connection section have it is longer be unlikely to deform part (part that conductive particle is constituted is to be unlikely to deform part), can be with
Short-circuit probability is further decreased, to further increase the yield of photosensory assembly.And the number of conductive particle is too many, will increase folded
Add conductive particle to form the difficulty of conductive structure, the number that conductive particle is arranged is 3-5, is more convenient for forming conductive structure.
The one end of the main part far from first conductive connection part and the photosensitive core in one of the embodiments,
Piece is flushed far from the surface of the circuit board.Namely be unlikely to deform part height it is roughly the same with the height of sensitive chip, can
The case where leading to short circuit, influencing the yield of camera module is contacted with the side of sensitive chip to prevent to occur conductive structure substantially to go out
It is existing, further increase the yield of photosensory assembly.
Several described conductive particles of the main part are along the circuit board to the sense in one of the embodiments,
The direction of optical chip is sequentially overlapped, so that the main part is vertically arranged with the circuit board.In this way, in production main part
When, the conducting liquid for being used to form conductive particle does not need on (direction of plane where circuit board) in the horizontal direction all around
It is mobile, it is highly convenient for production main part.
Several described conductive particles of the main part are gradually inclined to the sensitive chip in one of the embodiments,
It moves, so that the main part is obliquely installed with the circuit board.Side inclination as where main part towards sensitive chip,
So that the spacing between main part one end and the second electrical connection section far from circuit board reduces, so as to use length lesser
Clinch connects main part and the second electrical connection section, is more convenient for making clinch.
The clinch includes the conductive particle and conductor wire, the institute of the clinch in one of the embodiments,
Conductive particle is stated to be electrically connected with second electrical connection section, the both ends of the conductor wire respectively with the conduction of the main part
The electrical connection of the conductive particle of particle and the clinch.Clinch including conductive particle and conductor wire, relative to only wrapping
The clinch for including conductive particle is more convenient for making.
The clinch is conductor wire in one of the embodiments,.In this way, being more convenient for making clinch.
The sensitive chip is provided with insulation adjacent to the side of first electrical connection section in one of the embodiments,
Layer, the insulating layer is for being isolated the main part and the sensitive chip.Short circuit etc. can be effectively reduced in the insulating layer of setting
Bad electric connection risk, and insulating layer can be used as the breasting platform of conductive drop, and it is conductive can to further decrease superposition
Particle is to form the difficulty of conductive structure.
In one of the embodiments, on the circuit board to the direction of the sensitive chip, the insulating layer is located at
The spacing between two sides between the main part and the sensitive chip is gradually reduced.In this way, when several conductive drops
It is gradually deviated to sensitive chip, when forming the main part being obliquely installed with circuit board, the insulating layer with inclined side can be just
It is born against in conductive drop, and the insulating layer with inclined side can also reduce the material quantity of the material of insulating layer, saves material
Cost.
It is described photosensitive in one of the embodiments, on the sensitive chip to the direction of first electrical connection section
Spacing between chip and the adjacent side of first electrical connection section and first electrical connection section is less than 100 microns.Between being somebody's turn to do
Away from bigger, cause the conductive structure eventually formed larger towards the inclined gradient of sensitive chip, will increase superposition conductive particle
Difficulty, which is set less than 100 microns, superposition conductive particle can be reduced to form the difficulty of conductive structure, but also
Conducive to the acquisition lesser camera module of size in the horizontal direction.
In one of the embodiments, on the sensitive chip to the direction of first electrical connection section, described second
The spacing of electrical connection section and the sensitive chip between the side of first electrical connection section is less than 20 microns.In this way, should
Spacing is bigger, causes the conductive structure eventually formed larger towards the inclined gradient of sensitive chip, will increase superposition conductive
The difficulty of grain, is arranged the spacing less than 20 microns, can reduce superposition conductive particle to form the difficulty of conductive structure, but also
Conducive to the acquisition lesser camera module of size in the horizontal direction.
The wherein one end of second electrical connection section and the sensitive chip are neighbouring described in one of the embodiments,
The side of first electrical connection section flushes.In this way, the difficulty for being superimposed conductive particle to form conductive structure can be further decreased, into
The size of one step reduction camera module.
In one of the embodiments, on the circuit board to the direction of the sensitive chip, the sensitive chip
With a thickness of 50-100 microns.The thickness is bigger, and the number for the conductive particle for needing to be superimposed is more, will increase superposition conductive particle with
The difficulty of conductive structure is formed, setting should can reduce superposition conductive particle with a thickness of 50-100 microns to form conductive structure
Difficulty, but also be conducive in the vertical direction obtain the lesser camera module of size.
It is provided with adhesive layer between the sensitive chip and the circuit board in one of the embodiments, in the electricity
On road plate to the direction of the sensitive chip, the adhesive layer with a thickness of 5-10 microns.The thickness is bigger, and need to be superimposed leads
The number of electric particle is more, will increase superposition conductive particle to form the difficulty of conductive structure, and setting is somebody's turn to do with a thickness of 5-10 microns,
Superposition conductive particle can be reduced to form the difficulty of conductive structure, but also it is lesser to be conducive to acquisition size in the vertical direction
Camera module.
In one of the embodiments, on the circuit board to the direction of the sensitive chip, the conductive particle
With a thickness of 10-30 microns.Under the premise of other conditions are constant, the thickness is too small, will lead to the conductive particle mistake of conductive structure
More, the number for the conductive particle for needing to be superimposed is more, will increase superposition conductive particle to form the difficulty of conductive structure, the thickness
It is too big, will lead to be formed the conductive drop of conductive particle size it is too big, being not easy to manage the shape of conductive drop, (conductive drop can
Can be deformed because of flowing), it will increase superposition conductive particle to form the difficulty of conductive structure.Be arranged conductive particle with a thickness of
10-30 microns, superposition conductive particle can be reduced to form the difficulty of conductive structure.
The number of first electrical connection section is multiple, the number of second electrical connection section in one of the embodiments,
Mesh is identical as the number of first electrical connection section, and correspond, second electrical connection section on the circuit board just
Projection and the first electrical connection section face, so that orthographic projection of second electrical connection section on the circuit board is located at institute
On the extended line for stating the first electrical connection section.The orthographic projection of second electrical connection section on circuit boards and the first electrical connection section face, phase
Second electrical connection section and the first electrical connection section are shifted to install, the offset of conductive structure can be reduced, it is conductive to reduce superposition
The difficulty of particle.
A kind of camera module, which is characterized in that including above-mentioned photosensory assembly.
Above-mentioned camera module has the characteristics that size is small, is more conducively applied on lightening mobile terminal.
A kind of mobile terminal, including above-mentioned camera module.
Above-mentioned mobile terminal may be implemented lightening.
A kind of production method of photosensory assembly, includes the following steps:
There is provided the circuit board and sensitive chip being fixed together, wherein circuit board is equipped with the first electrical connection section, sensitive chip
Surface far from circuit board is equipped with the second electrical connection section corresponding with the first electrical connection section；And
Successively be added dropwise on the first electrical connection section of circuit board drip conductive drops, until conductive drop and sensitive chip
Second electrical connection section connection, wherein drip after conductive drop solidifies forms multiple conductive particles being sequentially overlapped, and the two of both ends more
A conductive particle is electrically connected with the first electrical connection section and the second electrical connection section respectively.
It is i.e. real while forming multiple conductive particle (namely conductive structures) in the production method of above-mentioned photosensory assembly
The assembling for having showed conductive structure Yu circuit board and sensitive chip is omitted the step of beating gold thread, simplifies processing step.And
In above-mentioned photosensory assembly, the conductive structure being sequentially overlapped using conductive particle substitutes traditional gold thread completely, can avoid the occurrence of
Occurs the problem of short circuit because of gold thread bending deformation, so that above-mentioned photosensory assembly has higher yield.
In one of the embodiments, in the step of conductive drop is added dropwise, dripped using the capillary plumb joint of bonding equipment
Add conductive drop.Since bonding equipment is conventional electric connecting device, to not need additionally to make when making photosensory assembly
Production equipment can reduce production cost.
A kind of production method of photosensory assembly, includes the following steps:
There is provided the circuit board and sensitive chip being fixed together, wherein circuit board is equipped with the first electrical connection section, sensitive chip
Surface far from circuit board is equipped with the second electrical connection section corresponding with the first electrical connection section；
The conductive drop of several drops is successively added dropwise on the first electrical connection section of circuit board, after the conductive drop solidification of several drops,
Obtain include several conductive particles being sequentially overlapped main part；And
Conductor wire is welded between main part and the second electrical connection section, so that the first electrical connection section and the second electrical connection section
Electrical connection.
In the production method of above-mentioned photosensory assembly, it is electrically connected the conductive structure of the first electrical connection section and the second electrical connection section
Include simultaneously conductor wire and conductive particle, the manufacture difficulty of conductive structure can be reduced.And in above-mentioned photosensory assembly, use
The main part that conductive particle is sequentially overlapped at least substitutes the gold thread of parts of traditional, occurs so as to reduce because of gold thread bending deformation
The probability of short circuit, can also be effectively reduced the bad electric connection risk such as short circuit, so that above-mentioned photosensory assembly is with higher
Yield.
A kind of production method of photosensory assembly, includes the following steps:
There is provided the circuit board and sensitive chip being fixed together, wherein circuit board is equipped with the first electrical connection section, sensitive chip
Surface far from circuit board is equipped with the second electrical connection section corresponding with the first electrical connection section；
The conductive drop of several drops is successively added dropwise on the first electrical connection section of circuit board and the second electrical connection section respectively, drop is led
Conductive particle is formed after electro-hydraulic drop solidification, the main part connecting with the first electrical connection section is obtained and is connect with the second electrical connection section
Auxiliary section, main part and auxiliary section include the conductive particle that several are sequentially overlapped, and the free end of main part and cooperation
The free end interval in portion, wherein the number of the conductive particle of main part is more than or equal to 2, and the number of the conductive particle of auxiliary section is big
In equal to 1；And
Conductor wire is welded between auxiliary section and main part, so that the first electrical connection section is electrically connected with the second electrical connection section
It connects.
In the production method of above-mentioned photosensory assembly, it is electrically connected the conductive structure of the first electrical connection section and the second electrical connection section
Include simultaneously conductor wire and conductive particle, the manufacture difficulty of conductive structure can be reduced.Moreover, the second electrical connection section is first and by leading
The auxiliary section electrical connection that electric particle is formed, the welding for conductor wire of being more convenient for.And in above-mentioned photosensory assembly, using conductive particle
The main part being sequentially overlapped at least substitutes the gold thread of parts of traditional, occurs the general of short circuit because of gold thread bending deformation so as to reduce
The bad electric connection risk such as short circuit can be also effectively reduced in rate, so that above-mentioned photosensory assembly yield with higher.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section of camera module in the prior art；
Fig. 2 is the schematic top plan view that circuit board in the prior art and sensitive chip link together；
Fig. 3 is the diagrammatic cross-section for the photosensory assembly that an embodiment of the present invention provides；
Fig. 4 is the schematic top plan view that the circuit board that an embodiment of the present invention provides and sensitive chip link together；
Fig. 5 connects the conduction that an embodiment of the present invention provides between circuit board and sensitive chip shown in Fig. 2
The diagrammatic cross-section of structure；
Fig. 6 is the diagrammatic cross-section for the photosensory assembly that another embodiment of the utility model provides；
Fig. 7 is the diagrammatic cross-section for the photosensory assembly that another embodiment of the utility model provides；
Fig. 8 is the diagrammatic cross-section for the photosensory assembly that another embodiment of the utility model provides；
Fig. 9 is the flow chart of the production method for the photosensory assembly that an embodiment of the present invention provides；
Figure 10 is the flow chart of the production method for the photosensory assembly that another embodiment of the utility model provides；
Figure 11 is the flow chart of the production method for the photosensory assembly that another embodiment of the utility model provides.
Specific embodiment
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, with reference to the accompanying drawing to this
The specific embodiment of utility model is described in detail.Many details are explained in the following description in order to abundant
Understand the utility model.But the utility model can be implemented with being much different from other way described herein, this field
Technical staff can do similar improvement without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific implementation opened.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specifically embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes
Any and all combinations of one or more related listed items.
As shown in figure 3, the photosensory assembly 300 that an embodiment of the present invention provides, 300 energy of photosensory assembly and lens group
Part is cooperatively formed applied to the camera module on mobile terminal.Wherein, mobile terminal can be for smart phone, tablet computer etc. just
Take formula mobile terminal.
Wherein, photosensory assembly 300 includes circuit board 310, sensitive chip 320 and conductive structure 330.Circuit board 310 is set
There is the first electrical connection section 312, sensitive chip 320 is arranged on circuit board 310, and is equipped with corresponding with the first electrical connection section 312
Second electrical connection section 322.The both ends of conductive structure 330 are electrically connected with the first electrical connection section 312 and the second electrical connection section 322 respectively
It connects.
In some embodiments, conductive structure 330 includes multiple conductive particles 332, and multiple conductive particles 332 are being formed
During be sequentially overlapped, and two conductive particles 332 at both ends during formation respectively with the first electrical connection section 312 with
The electrical connection of second electrical connection section 322.Namely conductive structure 330 and the first electricity are realized while forming conductive structure 330
Interconnecting piece 312 and the electrical connection of the second electrical connection section 322, are omitted the step of beating gold thread, and use and be superimposed by conductive particle 332
The conductive structure 330 of formation substitutes traditional gold thread 150, can avoid the occurrence of because gold thread 150 bending deformation due to occur short circuit
Problem, so that the yield with higher of above-mentioned photosensory assembly 300.
As shown in Fig. 2, first electrical connection section 112 is with sensitive chip 120 in first party in traditional photosensory assembly 100
It is usually 150 microns to the spacing L1 on 302, the second electrical connection section 122 is with sensitive chip 120 adjacent to the first electrical connection section 112
The spacing L2 on 302 is 32-75 microns in a first direction for side.Spacing L1 and L2 is larger, is conducive to beat gold thread, but be superimposed
Conductive particle 332 to form conductive structure 330 during (as shown in Figure 5), spacing L1 and L2 is bigger, needs to control conductive
Grain 332 is increasingly towards the movement of the second electrical connection section 122, and the conductive particle 332 of end could be made close to the second electrical connection section
122, cause the conductive structure 330 eventually formed that there is on 302 biggish offset (namely conductive structure 330 in a first direction
It is larger towards the inclined gradient of sensitive chip 120), increase the difficulty of superposition conductive particle 332.
As shown in figure 4, in some embodiments, the space D 1 of setting the first electrical connection section 312 and sensitive chip 320 is less than
100 microns.In some embodiments, the second electrical connection section of setting 322 is with sensitive chip 320 adjacent to the first electrical connection section 312
The space D 2 of side is less than 20 microns.Space D 1 is superimposed conductive particle 332 with smaller can reduce of space D 2 to form conductive knot
The difficulty of structure 330, but also size is lesser to be taken the photograph conducive to obtaining in (first direction 302 and second direction 304) in the horizontal direction
As mould group.
As shown in figure 3, in some embodiments, sensitive chip 320 is provided with absolutely adjacent to the side of the first electrical connection section 312
Edge layer 324, the first electrical connection section 312 are contacted with insulating layer 324.Namely first electrical connection section 312 extend to sensitive chip 320
Edge, the space D 1 of the first electrical connection section 312 and sensitive chip 320 is zero, in this way, it is conductive to further decrease superposition
Particle 332 is to form the difficulty of conductive structure 330.And the insulating layer 324 being arranged, the bad electrical property such as short circuit can be effectively reduced and connect
It gives a dinner for a visitor from afar danger.And insulating layer 324 can be used as the breasting platform of conductive drop (after conductive drop solidification, forming conductive particle),
Superposition conductive particle can be further decreased to form the difficulty of conductive structure.In some embodiments, insulating layer 324 is from photosensitive
The side of chip 320 extends to sensitive chip 320 close to the surface of circuit board 100.It is waited not in this way, short circuit can be further decreased
Good electric connection risk.In some embodiments, fringe region of the sensitive chip 320 close to the surface of circuit board 100 is provided with
Insulating layer 324, and central area is not provided with insulating layer 324, consequently facilitating adhesive layer 340, Jin Erke is arranged in central area
To avoid adhesive layer 340 is superimposed with insulating layer 324 and thickness in the vertical direction is caused to increase.
In some embodiments, the second electrical connection section 322 is with sensitive chip 320 adjacent to the side of the first electrical connection section 312
It flushes namely the second electrical connection section 322 extends to the edge of sensitive chip 320, the second electrical connection section 322 and sensitive chip 320
The space D 2 of the side of neighbouring first electrical connection section 312 is zero, in this way, superposition conductive particle 332 can be further decreased with shape
At the difficulty of conductive structure 330.Wherein, when sensitive chip 320 is provided with insulating layer adjacent to the side of the first electrical connection section 312
When 324, the second electrical connection section 322 is flushed with insulating layer 324.
As shown in figure 4, in some embodiments, the number of the first electrical connection section 312 is multiple, the second electrical connection section 322
Number it is identical as the number of the first electrical connection section 312, and correspond, the second electrical connection section 322 on circuit board 310 just
Projection with 312 face of the first electrical connection section (namely the center line of orthographic projection of second electrical connection section 322 on circuit board 310 with
The center line of first electrical connection section 312 is located on the same line) so that the second electrical connection section 322 is on circuit board 310
Orthographic projection is located on the extended line of the first electrical connection section 312.Orthographic projection of second electrical connection section 322 on circuit board 310 and the
One electrical connection section, 312 face shifts to install relative to the second electrical connection section 322 and the first electrical connection section 312, can reduce and lead
Offset of the electric structure 330 in second direction 304 reduces the difficulty of superposition conductive particle 332.
As shown in figure 5, adhesive layer is arranged between circuit board 110 and sensitive chip 120 in traditional photosensory assembly 100
160, the thickness L3 of adhesive layer 160 is 15-30 microns, and the thickness L4 of sensitive chip 120 is 150 microns.Thickness L3 and L4 is got over
Greatly, the number for the conductive particle 332 for needing to be superimposed is more, will increase superposition conductive particle 332 to form the difficulty of conductive structure 330
Degree.
As shown in figure 3, in some embodiments, adhesive layer 340 is provided between sensitive chip 320 and circuit board 310, glue
The thickness H1 for tying layer 340 is 5-10 microns.In some embodiments, the thickness H2 of sensitive chip 320 is 50-100 microns.It is thick
Number that degree H1 and thickness H2 be smaller can to reduce the conductive particle 332 being superimposed (for example, conductive particle shown in Fig. 3 332
Number is 4, and the number of conductive particle 332 shown in fig. 5 is 6), so as to reduce superposition conductive particle 332 to be formed
The difficulty of conductive structure 330, and be conducive to obtain the lesser camera module of size on vertical direction (third direction 306).
In some embodiments, the number of conductive particle 332 is 3-5.The number of conductive particle 332 is too many, will increase
Superposition conductive particle 332 is to form the difficulty of conductive structure 330, and when the number of conductive particle 332 is 1, if to meet
The requirement of electrical connection then needs conductive particle 332 to have biggish size in the vertical direction, also will increase superposition conductive particle
332 to form the difficulty of conductive structure 330.In conclusion the number of setting conductive particle 332 is 3-5, superposition can be reduced
Conductive particle 332 is to form the difficulty of conductive structure 330.
In some embodiments, the size H3 on 332 vertical direction of conductive particle is 10-30 microns.Superposition can be reduced
Conductive particle 332 is to form the difficulty of conductive structure 330.Preferably, in some embodiments, 332 vertical direction of conductive particle
On size H3 be 25 microns.
In some embodiments, as shown in Figure 3 and Figure 6, conductive structure 330 includes connected main part 334 and clinch
336, main part 334 and clinch 336 include several conductive particles 332, conduction of the main part 334 far from clinch 336
Particle 332 is electrically connected with the first electrical connection section 312, and conductive particle 332 of the clinch 336 far from main part 334 is electrically connected with second
Socket part 322 is electrically connected.
In some embodiments, as shown in Figure 3 and Figure 6, several conductive particles 332 of main part 334 are along third direction
306 are sequentially overlapped, so that main part 334 is vertically arranged with circuit board 310.In this way, being highly convenient for forming main part 334.
In some embodiments, as shown in fig. 7, several conductive particles 332 of main part 334 are gradually to sensitive chip
320 offsets, so that main part 334 is obliquely installed with circuit board 310.In this way, being highly convenient for forming clinch 336.
In some embodiments, the one end of main part 334 far from the first electrical connection section 312 and sensitive chip 320 are far from electricity
The height that the surface of road plate 310 is substantially flush namely main part 334 is on third direction 306 and the height of sensitive chip 320 are big
Cause it is identical, namely be unlikely to deform part (part that conductive particle 332 is constituted is to be unlikely to deform part) height and photosensitive core
The height of piece 320 is roughly the same, can prevent to occur substantially conductive structure 330 contacted with the side of sensitive chip 320 cause it is short
Road, the case where influencing the yield of camera module appearance, and be highly convenient for forming clinch 336.
In some embodiments, the number of the conductive particle 332 of main part 334 is more than or equal to 2, and clinch 336 is led
The number of electric particle 332 is more than or equal to 1.Wherein, the number of the conductive particle 332 of main part 334 is more than or equal to 2, can be with
So that conductive structure 330 is unlikely to deform part (332 structure of conductive particle with longer close to one end of the first electrical connection section 312
At part be to be unlikely to deform part), short-circuit probability can be further decreased, to further increase photosensory assembly 300
Yield.
In some embodiments, as shown in figure 8, conductive structure 330 includes connected main part 334 and clinch 336, master
Body portion 334 includes several conductive particles 332,312 electricity of conductive particle 332 and the first conductive connection part of 334 one end of main part
Connection, clinch 336 include conductive particle 332 and conductor wire 338, the conductive particle 332 and the second electrical connection section of clinch 336
322 electrical connections, conductor wire 338 are electrically connected the conductive particle 332 of main part 334 and the conductive particle 332 of clinch 336.In Fig. 8
Shown in photosensory assembly 300, the main part 334 being sequentially overlapped using conductive particle 332 at least substitutes the gold thread of parts of traditional
150, so as to reduce because gold thread 150 bending deformation due to occur short circuit probability, the bad electrical property such as short circuit can also be effectively reduced
Risk is connected, so that the yield with higher of above-mentioned photosensory assembly 300.
In some embodiments, clinch 336 can be conductor wire 338.
In some embodiments, as shown in figs 6-8, on circuit board 310 to the direction of sensitive chip 320, insulating layer 324
The spacing between two sides between main part 334 and sensitive chip 320 is gradually reduced.Insulating layer 324 can be straight
Angle triangle, or right-angled trapezium.
As shown in figure 9, the production method for the photosensory assembly that an embodiment of the present invention provides, includes the following steps:
Step S410 provides the circuit board and sensitive chip being fixed together, wherein circuit board is equipped with the first electrical connection
Portion, sensitive chip are equipped with the second electrical connection section corresponding with the first electrical connection section far from the surface of circuit board.In some embodiments
In, sensitive chip is adhered on circuit board, to form adhesive layer between sensitive chip and circuit board.
Step S420, be successively added dropwise on the first electrical connection section of circuit board drip conductive drops, until conductive drop with
Second electrical connection section of sensitive chip connects, wherein and drip after conductive drop solidifies forms multiple conductive particles being sequentially overlapped more,
And two conductive particles at both ends are electrically connected with the first electrical connection section and the second electrical connection section respectively.
In some embodiments, in the step s 420, conductive drop is added dropwise using the capillary plumb joint of bonding equipment.Due to
Bonding equipment is conventional electric connecting device, to not need additionally to make production equipment, can reduce when making photosensory assembly
Production cost.
In some embodiments, after conductive drop is dripped in every dropwise addition one, interval is after 30-60 seconds, so that previous drop conduction liquid
After drop is formed by curing conductive particle, then the conductive drop of next drop is added dropwise.
In some embodiments, conductive drop is that melting is formed under the high temperature conditions for solid gold thread, copper wire etc..Some
In embodiment, in order to avoid the conductive drop hot melt of high temperature wears the first electrical connection section and the second electrical connection section, first can be increased
The thickness of electrical connection section and the second electrical connection section, the higher conductive material of fusing point also can be used formed the first electrical connection section with
Second electrical connection section.And in order to avoid the portion of the first electrical connection section of conductive drips of high temperature and the second electrical connection section periphery
Part can carry out rapid cooling to conductive drop, can also suitably increase the first electrical connection section and the second electrical connection section in level
Size on direction.
As shown in Figure 10, the production method for the photosensory assembly that an embodiment of the present invention provides, includes the following steps:
Step S510 provides the circuit board and sensitive chip being fixed together, wherein circuit board is equipped with the first electrical connection
Portion, sensitive chip are equipped with the second electrical connection section corresponding with the first electrical connection section far from the surface of circuit board.
The conductive drop of several drops, several drop conduction liquids are successively added dropwise in step S520 on the first electrical connection section of circuit board
Drop solidification after, obtain include several conductive particles being sequentially overlapped main part.
Step S530 welds conductor wire between main part and the second electrical connection section, so that the first electrical connection section and
The electrical connection of two electrical connection sections.Wherein, conductor wire is above-mentioned clinch.
As shown in figure 11, the production method for the photosensory assembly that an embodiment of the present invention provides, includes the following steps:
Step S610 provides the circuit board and sensitive chip being fixed together, wherein circuit board is equipped with the first electrical connection
Portion, sensitive chip are equipped with the second electrical connection section corresponding with the first electrical connection section far from the surface of circuit board.
It is conductive that several drops are successively added dropwise in step S620 on the first electrical connection section of circuit board and the second electrical connection section respectively
Drop forms conductive particle after dripping conductive drop solidification, obtain main part connect with the first electrical connection section and with it is second electric
The auxiliary section of interconnecting piece connection, main part and auxiliary section include the conductive particle that several are sequentially overlapped, and main part from
By holding the free end interval with auxiliary section, wherein the number of the conductive particle of main part is more than or equal to 2, the conduction of auxiliary section
The number of grain is more than or equal to 1.
Step S630 welds conductor wire between auxiliary section and main part, so that the first electrical connection section is electrically connected with second
Socket part electrical connection.Wherein, the entirety that conductor wire and auxiliary section are constituted is above-mentioned clinch.
In some embodiments, conductor wire is gold thread.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (17)
1. a kind of photosensory assembly characterized by comprising
Circuit board is equipped with the first electrical connection section；
Sensitive chip is arranged on the circuit board, and the sensitive chip is equipped with and described the far from the surface of the circuit board
Corresponding second electrical connection section of one electrical connection section；And
Conductive structure, including main part and clinch, the main part include several conductive particles, several conductive particles according to
Secondary superposition, the conductive particle of described main part one end are electrically connected with first electrical connection section, the clinch electrical connection
The conductive particle of second electrical connection section and the main part other end.
2. photosensory assembly according to claim 1, which is characterized in that the conductive structure includes multiple described conductive
Grain, multiple conductive particles are sequentially overlapped, and the conductive particle at the conductive structure both ends is electrically connected with described first respectively
Socket part is electrically connected with second electrical connection section, wherein the clinch includes at least one described conductive particle.
3. photosensory assembly according to claim 2, which is characterized in that the number of the conductive particle is 3-5, the master
The number of the conductive particle in body portion is more than or equal to 2.
4. photosensory assembly according to claim 2, which is characterized in that the main part is far from first electrical connection section
One end is flushed with the sensitive chip far from the surface of the circuit board.
5. photosensory assembly according to claim 4, which is characterized in that several described conductive particle edges of the main part
The direction of the circuit board to the sensitive chip is sequentially overlapped, so that the main part is vertically arranged with the circuit board；
Alternatively, several described conductive particles of the main part are gradually deviated to the sensitive chip, so that the main body
Portion is obliquely installed with the circuit board.
6. photosensory assembly according to claim 1, which is characterized in that the clinch includes conductor wire and the conduction
Grain, the conductive particle of the clinch is electrically connected with second electrical connection section, the both ends of the conductor wire respectively with institute
State the conductive particle electrical connection of the conductive particle and the clinch of main part；
Alternatively, the clinch is conductor wire.
7. photosensory assembly according to claim 1 to 6, which is characterized in that the sensitive chip is adjacent to described
The side of one electrical connection section is provided with insulating layer, and the insulating layer is for being isolated the main part and the sensitive chip.
8. photosensory assembly according to claim 7, which is characterized in that in the circuit board to the direction of the sensitive chip
On, spacing of the insulating layer between two sides between the main part and the sensitive chip is gradually reduced.
9. photosensory assembly according to claim 1, which is characterized in that in the sensitive chip to first electrical connection section
Direction on, the spacing between the sensitive chip and the adjacent side of first electrical connection section and first electrical connection section
Less than 100 microns.
10. photosensory assembly according to claim 1, which is characterized in that in the sensitive chip to first electrical connection
On the direction in portion, the spacing of second electrical connection section and the sensitive chip between the side of first electrical connection section
Less than 20 microns.
11. photosensory assembly according to claim 10, which is characterized in that the wherein one end of second electrical connection section with
The sensitive chip is flushed adjacent to the side of first electrical connection section.
12. photosensory assembly according to claim 1, which is characterized in that in the circuit board to the side of the sensitive chip
Upwards, the sensitive chip with a thickness of 50-100 microns.
13. photosensory assembly according to claim 1, which is characterized in that set between the sensitive chip and the circuit board
Be equipped with adhesive layer, on the circuit board to the direction of the sensitive chip, the adhesive layer with a thickness of 5-10 microns.
14. photosensory assembly according to claim 1, which is characterized in that in the circuit board to the side of the sensitive chip
Upwards, the conductive particle with a thickness of 10-30 microns.
15. photosensory assembly according to claim 1, which is characterized in that the number of first electrical connection section is multiple, institute
The number for stating the second electrical connection section is identical as the number of first electrical connection section, and corresponds, second electrical connection section
Orthographic projection and the first electrical connection section face on the circuit board, so that second electrical connection section is in the circuit
Orthographic projection on plate is located on the extended line of first electrical connection section.
16. a kind of camera module, which is characterized in that including the photosensory assembly as described in any one of claim 1-15.
17. a kind of mobile terminal, which is characterized in that including camera module as claimed in claim 16.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822237748.XU CN209328888U (en) | 2018-12-28 | 2018-12-28 | Photosensory assembly, camera module and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822237748.XU CN209328888U (en) | 2018-12-28 | 2018-12-28 | Photosensory assembly, camera module and mobile terminal |
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| Publication Number | Publication Date |
|---|---|
| CN209328888U true CN209328888U (en) | 2019-08-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201822237748.XU Active CN209328888U (en) | 2018-12-28 | 2018-12-28 | Photosensory assembly, camera module and mobile terminal |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020134407A1 (en) * | 2018-12-28 | 2020-07-02 | 南昌欧菲光电技术有限公司 | Light sensing assembly and fabrication method therefor, camera module and mobile terminal |
| CN113037952A (en) * | 2019-12-25 | 2021-06-25 | 南昌欧菲光电技术有限公司 | Photosensitive assembly manufacturing method, photosensitive assembly, camera module and mobile terminal |
| WO2021128031A1 (en) * | 2019-12-25 | 2021-07-01 | 南昌欧菲光电技术有限公司 | Fabrication method for photosensitive assembly, and photosensitive assembly, camera module and mobile terminal |
| CN113394208A (en) * | 2021-05-25 | 2021-09-14 | 武汉光迅科技股份有限公司 | Photoelectric detector |
-
2018
- 2018-12-28 CN CN201822237748.XU patent/CN209328888U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020134407A1 (en) * | 2018-12-28 | 2020-07-02 | 南昌欧菲光电技术有限公司 | Light sensing assembly and fabrication method therefor, camera module and mobile terminal |
| CN113037952A (en) * | 2019-12-25 | 2021-06-25 | 南昌欧菲光电技术有限公司 | Photosensitive assembly manufacturing method, photosensitive assembly, camera module and mobile terminal |
| WO2021128031A1 (en) * | 2019-12-25 | 2021-07-01 | 南昌欧菲光电技术有限公司 | Fabrication method for photosensitive assembly, and photosensitive assembly, camera module and mobile terminal |
| CN113394208A (en) * | 2021-05-25 | 2021-09-14 | 武汉光迅科技股份有限公司 | Photoelectric detector |
| CN113394208B (en) * | 2021-05-25 | 2023-05-05 | 武汉光迅科技股份有限公司 | Photoelectric detector |
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