WO2021128031A1

WO2021128031A1 - Fabrication method for photosensitive assembly, and photosensitive assembly, camera module and mobile terminal

Info

Publication number: WO2021128031A1
Application number: PCT/CN2019/128113
Authority: WO
Inventors: 罗科; 朴成炯; 帅文华
Original assignee: 南昌欧菲光电技术有限公司
Priority date: 2019-12-25
Filing date: 2019-12-25
Publication date: 2021-07-01

Abstract

The present application relates to a fabrication method for a photosensitive assembly, a photosensitive assembly, a camera module and mobile terminal. The method comprises: providing a circuit board, wherein the circuit board is provided with a first electrical connection part; fixedly disposing a photosensitive chip on the circuit board, wherein the surface of the photosensitive chip away from the circuit board is provided with a second electrical connection part corresponding to the first electrical connection part; placing the circuit board on which the photosensitive chip is fixed, so as to increase the opening area between the photosensitive chip and the circuit board in the direction of an injection insulating layer; forming an insulating layer between a side surface of the photosensitive chip and the circuit board, the insulating layer being used to form a conductive structure that electrically connects the first electrical connection part and the second electrical connection part.

Description

Method for manufacturing photosensitive component, photosensitive component, camera module and mobile terminal

Technical field

This application relates to the technical field of photographing equipment, and in particular to a method for manufacturing a photosensitive component, a photosensitive component, a camera module, and a mobile terminal.

Background technique

The camera module usually includes a photosensitive component and a lens component. The photosensitive component includes a circuit board, a photosensitive chip, and a filter. When the camera module is packaged, the photosensitive chip needs to be placed on the circuit board and the circuit is made of conductive materials. The board is electrically connected to the pins of the photosensitive chip, and then the photosensitive component and the lens component are packaged together.

The traditional method of manufacturing photosensitive components is to install the photosensitive chip on the circuit board, use needles to fill the insulating material between the photosensitive chip and the solder joints on the circuit board, and then form a conductive structure on the insulating material to make the circuit board and the photosensitive chip The pins are electrically connected. Since the distance between the photosensitive chip and the solder joints on the circuit board is generally relatively small, it is not convenient to fill the needle with insulating material. In the subsequent process, the conductive material cannot be electrically connected to the photosensitive chip and circuit board, which affects the quality of the camera module. rate.

Summary of the invention

According to various embodiments of the present application, a method for manufacturing a photosensitive component, a photosensitive component, a camera module, and a mobile terminal are provided.

A method for manufacturing a photosensitive component, including:

Provide a circuit board; wherein a first electrical connection part is provided on the circuit board;

Fixing the photosensitive chip on the circuit board; wherein a second electrical connection portion corresponding to the first electrical connection portion is provided on the surface of the photosensitive chip away from the circuit board;

Placing the circuit board on which the photosensitive chip is fixed to increase the opening area of the photosensitive chip and the circuit board in the direction of injecting the insulating layer;

An insulating layer is formed between the side surface of the photosensitive chip and the circuit board; wherein the insulating layer is used to form a conductive structure that electrically connects the first electrical connection portion and the second electrical connection portion.

A photosensitive component includes a circuit board, a photosensitive chip, and an insulating layer. The circuit board is provided with a first electrical connection portion, and the photosensitive chip is provided with a surface away from the circuit board corresponding to the first electrical connection portion The second electrical connection portion; the insulating layer is provided between the side surface of the photosensitive chip and the circuit board; the insulating layer is produced by the above-mentioned method.

A camera module includes a lens assembly and the above-mentioned photosensitive assembly.

A mobile terminal includes the above-mentioned camera module.

The details of one or more embodiments of the present application are set forth in the following drawings and description. Other features, purposes and advantages of this application will become apparent from the description, drawings and claims.

Description of the drawings

In order to more clearly describe the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.

FIG. 1 is a flowchart of a method for manufacturing a photosensitive component in an embodiment;

Figure 2 is a flowchart of a method for manufacturing a photosensitive component in another embodiment;

3 to 6 are schematic diagrams of the manufacturing process of the photosensitive element in an embodiment;

FIG. 7 is a schematic diagram of the manufacturing principle of the insulating layer in an embodiment;

FIG. 8 is a schematic diagram of the manufacturing principle of the conductive structure in an embodiment;

Figure 9 is a schematic view of the structure of a photosensitive component in an embodiment;

FIG. 10 is a schematic diagram of the structure of a camera module in an embodiment.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of this application.

In one embodiment, a method for manufacturing a photosensitive component is provided, as shown in FIG. 1, including:

Step S110: Provide a circuit board. Wherein, the circuit board is provided with a first electrical connection part.

The circuit board is prefabricated, and the first electrical connection portion provided on the circuit board is used for electrical connection with other devices. The circuit board may specifically be a PCB (Printed Circuit Board, printed circuit board) board or an RCB (Rigid Printed Circuit Board, rigid printed circuit board) board. Specifically, the manufactured circuit board can be placed horizontally on the platform of the dispensing machine for subsequent assembly operations.

Step S120: fixing the photosensitive chip on the circuit board. Wherein, the surface of the photosensitive chip away from the circuit board is provided with a second electrical connection portion corresponding to the first electrical connection portion.

The photosensitive chip is also manufactured in advance, and the second electrical connection portion on the photosensitive chip is used to electrically connect the first electrical connection portion on the circuit board, so as to realize the electrical connection between the photosensitive chip and the circuit board. The number of the second electrical connection parts on the photosensitive chip is not unique, and the same number of the first electrical connection parts can be provided on the circuit board according to the number of the second electrical connection parts. The second electrical connection portions on the photosensitive chip are in one-to-one correspondence with the first electrical connection portions on the circuit board, and then the photosensitive chip is fixed on the circuit board to facilitate subsequent assembly operations. There is no unique way to fix the photosensitive chip on the circuit board. Specifically, the photosensitive chip can be bonded to the circuit board to form an adhesive layer between the photosensitive chip and the circuit board. The photosensitive chip is fixed on the circuit board by bonding, which is easy and reliable to operate and has a good fixing effect.

Step S140: Place the circuit board on which the photosensitive chip is fixed to increase the opening area of the photosensitive chip and the circuit board in the direction of injecting the insulating layer.

Specifically, after the photosensitive chip is fixed on the circuit board, the opening area of the photosensitive chip and the circuit board in the direction of injecting the insulating layer is increased by rotating the circuit board, so that the subsequent dispensing needle can inject the glue to form the insulating layer. In one embodiment, taking the glue nozzle in a vertical downward direction to inject the glue to form an insulating layer as an example, the horizontally placed circuit board can be rotated so that the first point connection part on the circuit board is on the photosensitive chip The edge close to the second electrical connection part is on the same horizontal surface, which maximizes the opening area between the photosensitive chip and the circuit board, and facilitates the injection of the glue into the glue nozzle. It can be understood that if the second electrical connection part is provided on more than one side of the photosensitive chip, the edge of the side where the electrical connection operation needs to be performed and the corresponding first electrical connection part are rotated into the same horizontal plane. If there are at least two second electrical connection portions on the photosensitive chip that need to be electrically connected, each side edge and the corresponding first electrical connection portion can be rotated in batches to be arranged in the same horizontal plane, and electrical connection operations can be performed in sequence.

It can be understood that the way of rotating the circuit board is not unique. The circuit board can be fixed by an adjustable jig, and the circuit board can be rotated by the adjustable jig so that the edge of the first electrical connection part and the photosensitive chip are on the same level. In addition, it is also possible to use a dispensing machine platform with a rotating function, and rotate the platform of the dispensing machine platform so that the first electrical connection part and the edge of the photosensitive chip are on the same level.

Step S150: forming an insulating layer between the side surface of the photosensitive chip and the circuit board.

Wherein, the insulating layer is used to form a conductive structure that electrically connects the first electrical connection portion and the second electrical connection portion. The specific material of the insulating layer is not unique, and the specific material may be an insulating glue layer. Correspondingly, in one embodiment, the insulating layer is formed by dispensing, and the insulating layer covers a part of the second electrical connection portion. The insulating layer is made by dispensing glue, and the operation is also simple and reliable. Covering a part of the second electrical connection portion with the insulating layer is more conducive to implanting the second connection portion to realize the electrical connection between the second electrical connection portion and the conductive structure, thereby improving the manufacturing reliability.

After the circuit board is rotated and fixed, insulating glue can be injected into the side of the photosensitive chip close to the first electrical connection part through the glue needle of the glue dispenser, so that an insulating glue layer is formed on the side of the photosensitive chip after the insulating glue is solidified. The surface of the glue layer is used to provide a conductive structure to connect the first electrical connection portion and the second electrical connection portion. The surface of the insulating glue layer can be on the same level as the first electrical connection part and the edge of the photosensitive chip, and the surface of the insulating glue layer can also be slightly higher than the level of the first electrical connection part and the edge of the photosensitive chip, as long as it does not affect the subsequent The operation of forming a conductive structure is sufficient.

In the above method for manufacturing the photosensitive component, after the photosensitive chip is fixedly arranged on the circuit board, the circuit board on which the photosensitive chip is fixed is placed, so that the opening area of the photosensitive chip and the circuit board in the direction of injecting the insulating layer is increased to facilitate the injection of the dispensing needle The colloid is used to form an insulating layer, which reduces the requirements for operation accuracy, effectively reduces the risk of poor electrical connections in the subsequent process, and improves the yield of the camera module.

In one embodiment, as shown in FIG. 2, after step S120 and before step S140, the method further includes step S130.

Step S130: forming a first connecting portion on the circuit board. Wherein, the first connecting portion is electrically connected to the first electrical connecting portion.

Specifically, when the circuit board is placed horizontally on the platform of the glue dispenser, the capillary soldering head is used to form a first connection portion electrically connected to the first electrical connection portion on the circuit board from a vertical downward direction. By forming the first connecting portion on the circuit board, it is convenient to form a good electrical connection between the conductive structure and the first electrical connection portion when the conductive structure is subsequently fabricated on the insulating layer, thereby improving the assembly reliability of the photosensitive component. Among them, the specific shape and material of the first connecting portion are not unique, and only need to be conductive.

Further, in an embodiment, after step S150, the method further includes step S160.

Step S160: forming a conductive structure on the insulating layer; wherein the conductive structure is electrically connected to the first connecting portion.

A conductive structure is fabricated on the horizontal surface of the insulating layer and electrically connected to the first connecting portion to complete the electrical connection between the conductive structure and the first electrical connection portion of the circuit board, which facilitates the fabrication of the conductive structure and ensures that the conductive structure and the first electrical connection portion The electrical connection effect. Among them, the specific shape and material of the conductive structure are not unique, and only need to be conductive.

In addition, in one embodiment, referring to FIG. 2 continuously, after step S160, the method may further include step S170.

Step S170: Rotate the circuit board on which the photosensitive chip is fixed to a direction perpendicular to the direction in which the first joint is implanted, and form a second joint on the photosensitive chip. Wherein, the second connecting portion is electrically connected to the conductive structure and the second electrical connecting portion.

Specifically, after the conductive structure is fabricated, the circuit board is rotated again to return to the horizontal placement, and then the capillary solder joint is used to form a second joint on the photosensitive chip from a vertical downward direction. After the conductive structure is made, the circuit board with the photosensitive chip is rotated to a direction perpendicular to the direction of implanting the first joint, so that the second joint is made on the horizontal surface of the photosensitive chip, and the second joint of the photosensitive chip is realized. The electrical connection between the electrical connection portion and the conductive structure also reduces the difficulty of assembly, and can ensure the electrical connection effect between the conductive structure and the second electrical connection portion. Among them, the specific shape and material of the second connecting portion are not unique, and only need to be conductive.

In one embodiment, the first connecting portion, the conductive structure and the second connecting portion are all formed by implanting conductive particles. The first connecting part, the conductive structure and the second connecting part are made by implanting conductive particles, and the operation is simple and reliable. The conductive particles may be gold particles or copper particles. In this embodiment, the conductive particles are formed as gold particles, which can improve the conductivity. For example, by dropping liquid gold to form a gold ball after solidification, the first connecting portion, the conductive structure and the second connecting portion are obtained respectively.

Specifically, the capillary welding head of the wire bonding device can be used to drop conductive droplets on corresponding positions, and the conductive droplets solidify to form conductive particles to obtain the first connecting portion, the conductive structure, and the second connecting portion, respectively. Wherein, the first connecting portion and the second connecting portion may be obtained by dripping one to two conductive liquid droplets, and the conductive structure may be obtained by dripping more than two conductive liquid droplets. For example, after the photosensitive chip is fixedly arranged on the circuit board, the capillary soldering head of the wire bonding device is used to drip conductive liquid droplets on the horizontally placed circuit board to form the first connecting portion contacting the first electrical connection portion. After the circuit board is rotated and the insulating layer is fabricated, a plurality of conductive liquid droplets are sequentially dropped on the horizontal surface of the insulating layer to form a conductive structure covering the surface of the insulating layer and contacting the first connecting portion.

Making the conductive structure after rotating the circuit board also overcomes the problem that multiple conductive particles cannot be superimposed when the conductive particles are implanted on the slope of the insulating layer when the circuit board is placed horizontally. In addition, dripping conductive droplets on the horizontal surface of the insulating layer to form a conductive structure can also avoid the problem of contamination by the ceramic nozzle of the capillary soldering joint touching the inclined surface of the insulating layer when conductive particles are implanted on the inclined surface of the insulating layer.

In one embodiment, the conductive particles on the side of the conductive structure away from the first connecting portion extend beyond the surface of the photosensitive chip away from the circuit board and are close to the edge of the insulating layer. Specifically, when dripping conductive liquid droplets on the horizontal surface of the insulating layer, the first conductive liquid droplet may be dripped from the side close to the first connecting portion and contacting the first connecting portion, and then moving away from the first connecting portion. Conductive droplets are dripped in the direction of the joint to form sequentially superimposed conductive particles, and the last conductive particle extends beyond the edge of the photosensitive chip to prevent the ceramic nozzle of the capillary soldering joint from touching the photosensitive chip during the subsequent production of the second joint. Damage the photosensitive chip.

In this embodiment, the conductive particles on the side of the conductive structure away from the first connecting portion are extended beyond the surface of the photosensitive chip away from the circuit board and close to the edge of the insulating layer to prevent the instrument from touching the photosensitive chip when the conductive particles are implanted to make the second connecting portion. The edge of the chip causes damage to the photosensitive chip, which improves the assembly reliability of the photosensitive component.

In order to facilitate a better understanding of the above-mentioned photosensitive component manufacturing method, detailed description will be given below in conjunction with specific implementation.

FIGS. 3 to 6 are schematic diagrams of the manufacturing process of the photosensitive component. As shown in FIG. 3, the circuit board 110 is placed horizontally and the photosensitive chip 120 is fixed, wherein the photosensitive chip 120 is provided with a second electrical connection portion 122. After the ceramic nozzle of the capillary soldering head is used to drip conductive liquid droplets at the first electrical connection portion 112 of the circuit board 110 to form the first connection portion, as shown in FIG. 4, the angle of the circuit board 110 is reversed and the glue needle is used to point the side The edge glue forms the insulating layer 130. As shown in FIG. 5, conductive liquid droplets are dripped on the surface of the insulating layer 130 to form a conductive structure electrically connected to the first connecting portion. Finally, as shown in FIG. 6, the circuit board 110 is restored to a horizontal angle, and conductive droplets are added to the second electrical connection portion 122 on the photosensitive chip 120 to implant conductive particles to form a second electrical connection portion 122 and conductive particles. The second connecting part of the structure is electrically connected.

In the above-mentioned manufacturing process, when the angle of the circuit board 110 is reversed, as shown in FIG. 7, the position ① of the edge of the photosensitive chip 120 and the position ② of the first electrical connection portion 112 are adjusted to a horizontal plane. Keep the dispensing plane in the horizontal direction, which overcomes the problem that the dispensing needle cannot be placed due to the small position of the dispensing site. Implanting conductive particles in the horizontal direction to form a conductive structure also overcomes the problem that a plurality of conductive particles cannot be superimposed, and the oblique plane of the insulating layer 130 causes pollution of the porcelain nozzle when the circuit board 110 is placed horizontally to implant conductive particles. In addition, as shown in FIG. 8, when conductive liquid droplets are dropped to form a conductive structure, the conductive particles on the side far from the first electrical connection portion 112 (which can be referred to as corner gold balls) extend beyond point C where the edge of the photosensitive chip 120 is located. It prevents the ceramic nozzle from colliding with the edge of the photosensitive chip 120 when the next conductive particle is implanted to make the second connecting portion, which may cause damage to the photosensitive chip 120.

In one embodiment, a photosensitive component is provided, as shown in FIG. 9, comprising a circuit board 110, a photosensitive chip 120, and an insulating layer 130. The circuit board 110 is provided with a first electrical connection portion 112, and the photosensitive chip 120 is away from the circuit. The surface of the board 110 is provided with a second electrical connection portion 122 corresponding to the first electrical connection portion 112; the insulating layer 130 is provided between the side surface of the photosensitive chip 120 and the circuit board 110; the insulating layer 130 is manufactured by the above method.

Further, in one embodiment, the photosensitive component further includes a first connecting portion, a conductive structure 140, and a second connecting portion. The first connecting portion is disposed on the circuit board 110 and electrically connected to the first electrical connecting portion 112, and the second connecting portion is The portion is disposed on the photosensitive chip 120 and electrically connected to the second electrical connection portion 122, and the conductive structure 140 is disposed on the insulating layer 130 and electrically connects the first connection portion and the second connection portion. In the direction from the circuit board 110 to the photosensitive chip 120, the distance between the two sides of the insulating layer 130 between the conductive structure 140 and the photosensitive chip 120 gradually decreases, and the shape of the insulating layer 130 is a right triangle. By providing the first connecting portion and the second connecting portion, it is convenient for the conductive structure 140 to form a good electrical connection with the first electrical connection portion 112 and the second electrical connection portion 122, thereby improving the assembly reliability of the photosensitive component.

The surface of the insulating layer 130 may be on the same level as the edges of the first electrical connection portion 112 and the photosensitive chip 120, and the surface of the insulating layer 130 may also be slightly higher than the level of the edges of the first electrical connection portion 112 and the photosensitive chip 120. In this embodiment, the surface of the insulating layer 130 is not lower than the level where the first electrical connection portion 112 and the edge of the photosensitive chip 120 are located, so as to avoid implanting conductive particles on the surface of the insulating layer 130 to form the conductive structure 140. The height is lower than the photosensitive chip 120, which affects the electrical connection stability of the conductive structure 140 and the photosensitive chip 120, and improves the yield of the camera module.

In the above photosensitive component, when the insulating layer 130 is made, after the photosensitive chip 120 is fixedly arranged on the circuit board 110, the circuit board 110 on which the photosensitive chip 120 is fixed is placed so that the photosensitive chip 120 and the circuit board 110 are in the direction of injecting the insulating layer. The increased opening area facilitates the injection of the glue into the dispensing needle to form the insulating layer 130, which reduces the requirement for operation accuracy, effectively reduces the risk of poor electrical connection in the subsequent process, and improves the yield of the camera module. The above-mentioned photosensitive component has the characteristics of small size, which is beneficial to be applied to light and thin mobile terminals.

Specifically, the first connecting portion, the conductive structure 140 and the second connecting portion are all formed by implanting conductive particles. The first connecting portion, the conductive structure 140 and the second connecting portion are made by implanting conductive particles, which is simple and reliable in operation. Wherein, the number of conductive particles in the conductive structure 140 is more than two, and the number of conductive particles in the first connecting portion and the second connecting portion is 1 to 2. Specifically, the number of all conductive particles is 3-6. Taking 6 as an example, the number of conductive particles in the first connecting portion and the second connecting portion is one, and the number of conductive particles in the conductive structure 140 is four. If the number of conductive particles is too small, in order to meet the electrical connection requirements, the conductive particles need to have a larger size in the direction from the circuit board 110 to the photosensitive chip 120, which will increase the superimposed conductive particles to form the first connecting portion, the conductive structure 140 and the second Second, the difficulty of the interface. Therefore, designing the number of conductive particles to 3-6 can reduce the difficulty of superimposing conductive particles to form the first connecting portion, the conductive structure 140 and the second connecting portion. Further, in the direction from the circuit board 110 to the photosensitive chip 120, the thickness of the conductive particles is 10-30 microns, which can also reduce the difficulty of superimposing the conductive particles.

In one embodiment, in the direction from the photosensitive chip 120 to the first electrical connection portion 112, the distance D1 between the side surface of the photosensitive chip 120 adjacent to the first electrical connection portion 112 and the first electrical connection portion is less than 100 micrometers. In one embodiment, in the direction from the photosensitive chip 120 to the first electrical connection portion 112, the distance D2 between the second electrical connection portion 122 and the side surface of the photosensitive chip adjacent to the first electrical connection portion 112 is less than 20 microns. The smaller the distance D1 and the distance D2 can reduce the difficulty of superimposing conductive particles to form the conductive structure 140, and it is also beneficial to obtain a smaller-sized camera module along the plane where the circuit board 110 is located.

In one embodiment, an adhesive layer is provided between the photosensitive chip 120 and the circuit board 110, and in the direction from the circuit board 110 to the photosensitive chip 120, the size H1 of the adhesive layer is 5-10 microns. In one embodiment, in the direction from the circuit board 110 to the photosensitive chip 120, the size H2 of the photosensitive chip 120 is 50-100 microns. The smaller size H1 and size H2 can reduce the number of superimposed conductive particles, thereby reducing the difficulty of superimposing conductive particles to form the conductive structure 140, the first connecting portion and the second connecting portion, and is also beneficial to the circuit board 110 to the photosensitive chip 120. Obtain a smaller size camera module in the direction of.

In one embodiment, the number of the first electrical connection portion 112 is multiple, the number of the second electrical connection portion 122 is the same as the number of the first electrical connection portion 112 and corresponds to each other, and the second electrical connection portion 122 is on the circuit board. The orthographic projection of 110 is directly opposite to the first electrical connection portion 112, so that the orthographic projection of the second electrical connection portion 122 on the circuit board is located on the extension line of the first electrical connection portion 112. The orthographic projection of the second electrical connection portion 122 on the circuit board 110 is directly opposite to the first electrical connection portion 112, and is staggered relative to the second electrical connection portion 122 and the first electrical connection portion 112, which can reduce the conductive structure 140 on the first electrical connection portion 112. The offset in the direction from the electrical connection portion 112 to the second electrical connection portion 122 reduces the difficulty of superimposing conductive particles.

In one embodiment, a camera module is also provided, as shown in FIG. 10, which includes a lens assembly 210 and the above-mentioned photosensitive assembly. In addition, the camera module may further include a bracket 220 and a filter 230. The photosensitive chip 120 is arranged on the circuit board 110, the bracket 220 is a hollow structure with openings at both ends, the bracket 220 is arranged on the circuit board 110, and the photosensitive chip 120 is accommodated in the bracket 220, and the filter 230 is arranged on the stepped portion of the bracket 220 The lens assembly 210 is disposed at an end of the bracket 220 away from the circuit board 110.

In the above-mentioned camera module, when the insulating layer is made, after the photosensitive chip 120 is fixedly arranged on the circuit board 110, the circuit board 110 on which the photosensitive chip 120 is fixed is placed so that the photosensitive chip 120 and the circuit board 110 are in the direction of injecting the insulating layer. The increased opening area facilitates the injection of the glue into the dispensing needle to form the insulating layer 130, which reduces the requirement for operation accuracy, effectively reduces the risk of poor electrical connection in the subsequent process, and improves the yield of the camera module.

In one embodiment, a mobile terminal is also provided, including the above-mentioned camera module. The mobile terminal may specifically be a mobile phone with a camera module, a camera, a notebook, a wearable device, etc.

In the above mobile terminal, when the insulating layer is made, after the photosensitive chip 120 is fixedly arranged on the circuit board 110, the circuit board 110 on which the photosensitive chip 120 is fixed is placed, so that the photosensitive chip 120 and the circuit board 110 have openings in the direction of injecting the insulating layer. The area increases, it is convenient for the dispensing nozzle to inject the glue to form the insulating layer 130, which reduces the operation accuracy requirements, and can effectively reduce the risk of poor electrical connections in the subsequent processes, improves the yield of the camera module, and can also achieve Thin and light.

The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the various technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, All should be considered as the scope of this specification.

The above-mentioned embodiments only express several implementation manners of the present application, and their description is relatively specific and detailed, but they should not be interpreted as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of this application, several modifications and improvements can be made, and these all fall within the protection scope of this application. Therefore, the scope of protection of the patent of this application shall be subject to the appended claims.

Claims

A method for manufacturing a photosensitive component, which is characterized in that it comprises:

Provide a circuit board; wherein a first electrical connection part is provided on the circuit board;

Fixing the photosensitive chip on the circuit board; wherein a second electrical connection portion corresponding to the first electrical connection portion is provided on the surface of the photosensitive chip away from the circuit board;

Placing the circuit board on which the photosensitive chip is fixed to increase the opening area of the photosensitive chip and the circuit board in the direction of injecting the insulating layer;

An insulating layer is formed between the side surface of the photosensitive chip and the circuit board; wherein the insulating layer is used to form a conductive structure that electrically connects the first electrical connection portion and the second electrical connection portion.
The method according to claim 1, wherein after the photosensitive chip is fixedly arranged on the circuit board, the circuit board on which the photosensitive chip is fixed is placed, so that the photosensitive chip and the circuit board Before the opening area in the direction of the injection insulating layer is increased, it also includes:

A first connecting portion is formed on the circuit board; wherein the first connecting portion is electrically connected to the first electrical connecting portion.
The method according to claim 2, wherein after forming an insulating layer between the side surface of the photosensitive chip and the circuit board, the method further comprises:

A conductive structure is formed on the insulating layer; wherein the conductive structure is electrically connected to the first connecting portion.
The method according to claim 3, characterized in that, after the conductive structure is formed on the insulating layer, the method further comprises:

The circuit board on which the photosensitive chip is fixed is rotated to a direction perpendicular to the direction in which the first connecting portion is implanted, and a second connecting portion is formed on the photosensitive chip; wherein the second connecting portion is electrically connected to the The conductive structure and the second electrical connection portion.
The method according to claim 4, wherein the first connecting portion, the conductive structure, and the second connecting portion are all formed by implanting conductive particles.
The method according to claim 5, wherein the conductive particles on the side of the conductive structure away from the first connecting portion extend beyond the surface of the photosensitive chip away from the circuit board and are close to the edge of the insulating layer .
The method of claim 1, wherein the insulating layer is formed by dispensing, and the insulating layer covers a portion of the second electrical connection portion.
A photosensitive component, characterized in that it comprises a circuit board, a photosensitive chip and an insulating layer, the circuit board is provided with a first electrical connection part, and the photosensitive chip is disposed on a surface away from the circuit board with the first electrical connection. The second electrical connection portion corresponding to the electrical connection portion; the insulating layer is disposed between the side surface of the photosensitive chip and the circuit board; the insulating layer is made by the method of any one of claims 1-7 get.
The photosensitive component according to claim 8, further comprising a first connecting portion, a conductive structure, and a second connecting portion, the first connecting portion is disposed on the circuit board and is connected to the first electrical connection portion Electrically connected, the second connecting portion is arranged on the photosensitive chip and electrically connected to the second electrical connecting portion, and the conductive structure is arranged on the insulating layer and electrically connecting the first connecting portion and the The second interface.
9. The photosensitive component of claim 9, wherein the first connecting portion, the conductive structure, and the second connecting portion are all formed by implanting conductive particles.
10. The photosensitive component of claim 10, wherein the number of conductive particles in the conductive structure is more than two, and the number of conductive particles in the first connecting portion and the second connecting portion is 1 to 2.
The photosensitive component according to claim 9, wherein the number of the first electrical connection portion is multiple, and the number of the second electrical connection portion is the same as the number of the first electrical connection portion. Correspondingly, the orthographic projection of the second electrical connection portion on the circuit board is directly opposite to the first electrical connection portion, so that the orthographic projection of the second electrical connection portion on the circuit board is located on the first electrical connection portion. An extension cord of an electrical connection part.
8. The photosensitive component of claim 8, wherein an adhesive layer is provided between the photosensitive chip and the circuit board, and in the direction from the circuit board to the photosensitive chip, the adhesive layer The thickness is 5-10 microns.
A camera module, characterized by comprising a lens assembly and a photosensitive assembly; the photosensitive assembly includes a circuit board, a photosensitive chip and an insulating layer, the circuit board is provided with a first electrical connection part, the photosensitive chip is far away from the The surface of the circuit board is provided with a second electrical connection portion corresponding to the first electrical connection portion; the insulation layer is provided between the side surface of the photosensitive chip and the circuit board; the insulation layer passes the claims It is produced by the method described in any one of 1-7.
The camera module according to claim 14, wherein the photosensitive component further comprises a first connecting portion, a conductive structure, and a second connecting portion, the first connecting portion is disposed on the circuit board and is connected to the circuit board. The first electrical connection portion is electrically connected, the second connection portion is provided on the photosensitive chip and is electrically connected to the second electrical connection portion, and the conductive structure is provided on the insulating layer and is electrically connected to the first The connecting portion and the second connecting portion.
15. The camera module according to claim 15, wherein the first connecting portion, the conductive structure and the second connecting portion are all formed by implanting conductive particles.
The camera module according to claim 16, wherein the number of conductive particles in the conductive structure is more than two, and the number of conductive particles in the first connecting portion and the second connecting portion is 1 to 2 .
The camera module according to claim 15, wherein the number of the first electrical connection portion is multiple, and the number of the second electrical connection portion is the same as the number of the first electrical connection portion. One correspondence, the orthographic projection of the second electrical connection portion on the circuit board is directly opposite to the first electrical connection portion, so that the orthographic projection of the second electrical connection portion on the circuit board is located on the The extension line of the first electrical connection part.
The camera module of claim 14, wherein an adhesive layer is provided between the photosensitive chip and the circuit board, and in the direction from the circuit board to the photosensitive chip, the adhesive The thickness of the layer is 5-10 microns.
A mobile terminal, characterized by comprising the camera module according to any one of claims 14-19.