CN113037952A - Photosensitive assembly manufacturing method, photosensitive assembly, camera module and mobile terminal - Google Patents
Photosensitive assembly manufacturing method, photosensitive assembly, camera module and mobile terminal Download PDFInfo
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- CN113037952A CN113037952A CN201911352922.8A CN201911352922A CN113037952A CN 113037952 A CN113037952 A CN 113037952A CN 201911352922 A CN201911352922 A CN 201911352922A CN 113037952 A CN113037952 A CN 113037952A
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- circuit board
- photosensitive chip
- insulating layer
- photosensitive
- conductive structure
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 34
- 239000002245 particle Substances 0.000 claims description 48
- 239000003292 glue Substances 0.000 abstract description 33
- 239000010410 layer Substances 0.000 description 83
- 239000007788 liquid Substances 0.000 description 14
- 206010070834 Sensitisation Diseases 0.000 description 12
- 230000008313 sensitization Effects 0.000 description 12
- 238000003466 welding Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
Abstract
The application relates to a photosensitive assembly manufacturing method, a photosensitive assembly, a camera module and a mobile terminal, wherein the method comprises the following steps: providing a circuit board; the circuit board is provided with a first electric connection part; fixedly arranging the photosensitive chip on the circuit board; the surface of the photosensitive chip far away from the circuit board is provided with a second electric connection part corresponding to the first electric connection part; placing a circuit board fixed with a photosensitive chip to increase the opening area of the photosensitive chip and the circuit board in the direction of injecting the insulating layer; forming an insulating layer between the side surface of the photosensitive chip and the circuit board; the insulating layer is used for forming a conductive structure electrically connecting the first electrical connection portion and the second electrical connection portion. After the photosensitive chip is fixedly arranged on the circuit board, the circuit board fixed with the photosensitive chip is placed, so that the opening area of the photosensitive chip and the opening area of the circuit board in the direction of injecting the insulating layer are increased, the glue is conveniently injected into the insulating layer through the glue dispensing needle nozzle, the risk of poor electrical connection can be effectively reduced in the subsequent process, and the yield of the camera module is improved.
Description
Technical Field
The application relates to the technical field of photographic equipment, in particular to a photosensitive assembly manufacturing method, a photosensitive assembly, a camera module and a mobile terminal.
Background
The camera module generally comprises a photosensitive assembly and a lens assembly, wherein the photosensitive assembly comprises a circuit board, a photosensitive chip, an optical filter and the like, when the camera module is packaged, the photosensitive chip is required to be arranged on the circuit board, the circuit board is electrically connected with a pin of the photosensitive chip by utilizing a conductive material, and then the photosensitive assembly and the lens assembly are packaged together.
The traditional method for manufacturing the photosensitive assembly is to arrange the photosensitive chip on the circuit board, fill an insulating material between the photosensitive chip and a welding point on the circuit board by using a needle, and then form a conductive structure on the insulating material so as to electrically connect the circuit board and a pin of the photosensitive chip. Because the distance between the welding point on sensitization chip and the circuit board generally can all be less, the syringe needle of being inconvenient for fills insulating material, leads to conductive material can't be connected with sensitization chip, circuit board electricity easily in follow-up process, influences the yield of the module of making a video recording.
Disclosure of Invention
Therefore, it is necessary to provide a photosensitive assembly manufacturing method, a photosensitive assembly, a camera module and a mobile terminal, which can improve the yield of the camera module, in order to solve the problem that the yield of the camera module is affected by the conventional photosensitive assembly manufacturing method.
A manufacturing method of a photosensitive assembly comprises the following steps:
providing a circuit board; the circuit board is provided with a first electric connection part;
fixedly arranging a photosensitive chip on the circuit board; the surface of the photosensitive chip, which is far away from the circuit board, is provided with a second electric connection part corresponding to the first electric connection part;
placing a circuit board fixed with the photosensitive chip to increase the opening area of the photosensitive chip and the circuit board in the direction of injecting the insulating layer;
forming an insulating layer between the side surface of the photosensitive chip and the circuit board; wherein the insulating layer is used to form a conductive structure that electrically connects the first and second electrical connections.
According to the manufacturing method of the photosensitive assembly, after the photosensitive chip is fixedly arranged on the circuit board, the circuit board fixed with the photosensitive chip is placed, so that the opening area of the photosensitive chip and the circuit board in the direction of injecting the insulating layer is increased, the glue is conveniently injected into the glue dispensing needle nozzle to form the insulating layer, the requirement on operation precision is lowered, the risk of poor electrical connection can be effectively reduced in the subsequent process, and the yield of the camera module is improved.
In one embodiment, after the fixing the photosensitive chip to the circuit board, before the circuit board fixed with the photosensitive chip is placed and the opening area of the photosensitive chip and the circuit board in the direction of injecting the insulating layer is increased, the method further includes:
forming a first engagement portion on the circuit board; wherein the first engagement portion is electrically connected to the first electrical connection portion.
The first connection part is formed on the circuit board, so that the conductive structure and the first electric connection part can be conveniently and well electrically connected when the conductive structure is manufactured on the insulating layer, and the assembling reliability of the photosensitive assembly is improved.
In one embodiment, after an insulating layer is formed between the side surface of the photosensitive chip and the circuit board, the method further includes:
forming a conductive structure on the insulating layer; wherein the conductive structure is electrically connected to the first connection portion.
The conductive structure is manufactured on the horizontal surface of the insulating layer and is electrically connected with the first connecting part, so that the electrical connection between the conductive structure and the first electrical connecting part of the circuit board is completed, the conductive structure is conveniently manufactured, and the electrical connection effect between the conductive structure and the first electrical connecting part can be ensured.
In one embodiment, after the insulating layer forms a conductive structure, the method further includes:
rotating the circuit board fixed with the photosensitive chip to a direction vertical to the direction of an implanted connection part, and forming a second connection part on the photosensitive chip; wherein the second engagement portion electrically connects the conductive structure and the second electrical connection portion.
After the conductive structure is manufactured, the circuit board fixed with the photosensitive chip is rotated to the direction vertical to the direction of the implanted connection part, so that a second connection part is manufactured on the horizontal surface of the photosensitive chip, the second electric connection part of the photosensitive chip is electrically connected with the conductive structure, the assembly difficulty is reduced, and the electric connection effect of the conductive structure and the second electric connection part can be guaranteed.
In one embodiment, the first and second connection portions are formed by implanting conductive particles. The first connection part, the conductive structure and the second connection part are manufactured in a mode of implanting conductive particles, and the operation is simple, convenient and reliable.
In one embodiment, the conductive particles on the side of the conductive structure far away from the first connecting part exceed the edge of the surface of the photosensitive chip far away from the circuit board, which is close to the insulating layer. The conductive particles far away from one side of the first connection part in the conductive structure exceed the edge, close to the insulating layer, of the surface, far away from the circuit board, of the photosensitive chip, so that the damage of the photosensitive chip caused by the fact that the edge of the photosensitive chip is touched by an instrument when the conductive particles are implanted to manufacture the second connection part is prevented, and the assembling reliability of the photosensitive assembly is improved.
In one embodiment, the insulating layer is formed by dispensing, and the insulating layer covers a portion of the second electrical connection portion. The insulating layer is manufactured by adopting a dispensing mode, and the operation is simple, convenient and reliable. Cover part second electric connection portion with the insulating layer, be more favorable to implanting the second connection portion and realize second electric connection portion and conductive structure's electric connection, improve the preparation reliability.
A photosensitive assembly comprises a circuit board, a photosensitive chip and an insulating layer, wherein a first electric connection part is arranged on the circuit board, and a second electric connection part corresponding to the first electric connection part is arranged on the surface, far away from the circuit board, of the photosensitive chip; the insulating layer is arranged between the side surface of the photosensitive chip and the circuit board; the insulating layer is manufactured by the method.
Above-mentioned photosensitive assembly, after setting up photosensitive chip fixed in the circuit board, place and be fixed with photosensitive chip's circuit board makes photosensitive chip and circuit board increase in the opening area who pours into insulating layer side into, makes things convenient for some glue needle mouths to pour into the colloid into in order to form the insulating layer, has reduced the operation precision requirement, can effectively reduce bad electric connection's risk in subsequent processes, has improved the yield of the module of making a video recording.
In one embodiment, the photosensitive assembly further includes a first connection portion, a conductive structure and a second connection portion, the first connection portion is disposed on the circuit board and electrically connected to the first electrical connection portion, the second connection portion is disposed on the photosensitive chip and electrically connected to the second electrical connection portion, and the conductive structure is disposed on the insulating layer and electrically connects the first connection portion and the second connection portion.
Through setting up first connection portion, second connection portion, the electrically conductive structure of being convenient for forms good electric connection with first electric connection portion, second electric connection portion, has improved photosensitive assembly's equipment reliability.
A camera module comprises a lens assembly and the photosensitive assembly.
Above-mentioned module of making a video recording, when making the insulating layer, after fixedly setting up the sensitization chip in the circuit board, place the circuit board that is fixed with the sensitization chip, make sensitization chip and circuit board increase in the open area who pours into the insulating layer side into, make things convenient for the point to glue the needle mouth and pour into the colloid in order to form the insulating layer, reduced the operation precision requirement, can effectively reduce bad electric connection's risk in subsequent processes, improved the yield of the module of making a video recording.
A mobile terminal comprises the camera module.
When the insulating layer is manufactured, the photosensitive chip is fixedly arranged on the circuit board, the circuit board fixed with the photosensitive chip is placed, the opening area of the photosensitive chip and the opening area of the circuit board in the direction of injecting the insulating layer are increased, glue is conveniently injected into the glue nozzle through the glue dispensing nozzle to form the insulating layer, the requirement on operation precision is lowered, the risk of poor electrical connection can be effectively lowered in subsequent processes, and the yield of the camera module is improved.
Drawings
FIG. 1 is a flow chart of a method for fabricating a photosensitive element according to an embodiment;
FIG. 2 is a flow chart of a method for fabricating a photosensitive element according to another embodiment;
FIGS. 3-6 are schematic diagrams illustrating a process for fabricating a photosensitive element according to an embodiment;
FIG. 7 is a schematic diagram illustrating a fabrication of an insulating layer according to an embodiment;
FIG. 8 is a schematic diagram illustrating a fabrication of a conductive structure according to an embodiment;
FIG. 9 is a schematic diagram of a photosensitive assembly according to an embodiment;
fig. 10 is a schematic structural diagram of a camera module according to an embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In one embodiment, a method for manufacturing a photosensitive assembly is provided, as shown in fig. 1, including:
step S110: a circuit board is provided. Wherein, be provided with first electric connection portion on the circuit board.
The circuit board is prefabricated, and a first electric connection part arranged on the circuit board is used for being electrically connected with other devices. The Circuit Board may specifically be a PCB (Printed Circuit Board) Board or an RPCB (Printed Circuit Board) Board. Specifically, the manufactured circuit board can be horizontally placed on a platform of the dispensing machine table for subsequent assembly operation.
Step S120: the photosensitive chip is fixedly arranged on the circuit board. And a second electric connection part corresponding to the first electric connection part is arranged on the surface of the photosensitive chip far away from the circuit board.
The photosensitive chip is also manufactured in advance, and the second electric connection part on the photosensitive chip is used for being electrically connected with the first electric connection part on the circuit board, so that the electric connection between the photosensitive chip and the circuit board is realized. The number of the second electrical connection parts on the photosensitive chip is not unique, and the same number of first electrical connection parts can be correspondingly arranged on the circuit board according to the number of the second electrical connection parts. And the second electric connection parts on the photosensitive chip are in one-to-one correspondence with the first electric connection parts on the circuit board, and then the photosensitive chip is fixed on the circuit board, so that the subsequent assembly operation is facilitated. The fixing of the photosensitive chip to the circuit board is not unique, and specifically, the photosensitive chip can be bonded to the circuit board, so that an adhesive layer is formed between the photosensitive chip and the circuit board. The photosensitive chip is fixed on the circuit board in a bonding mode, so that the operation is simple, convenient and reliable, and the fixing effect is good.
Step S140: and placing the circuit board fixed with the photosensitive chip to increase the opening area of the photosensitive chip and the circuit board in the direction of injecting the insulating layer.
Specifically, after the photosensitive chip is fixed on the circuit board, the opening area of the photosensitive chip and the circuit board in the direction of injecting the insulating layer is increased by rotating the circuit board, so that the glue is injected into the subsequent glue dispensing needle nozzle to form the insulating layer. In one embodiment, taking the glue dispensing nozzle injecting glue along the vertical downward direction to form the insulating layer as an example, the horizontally placed circuit board can be rotated, so that the first point connecting portion on the circuit board and the edge of the photosensitive chip close to the second electrical connection portion are located on the same horizontal plane, the opening area between the photosensitive chip and the circuit board is maximized, and the glue dispensing nozzle can conveniently inject the glue. It will be appreciated that if more than one side of the photo chip is provided with the second electrical connection, that side edge which is to be electrically connected is rotated to be in the same horizontal plane as the corresponding first electrical connection. If the second electric connection parts at least on two sides of the photosensitive chip are required to be electrically connected, the side edges and the corresponding first electric connection parts can be rotated to be arranged on the same horizontal plane in batches, and the electric connection operation is sequentially carried out.
It can be understood that the manner of rotating the circuit board is not exclusive, and the circuit board may be fixed by using an adjustable fixture, and the circuit board may be rotated by the adjustable fixture so that the first electrical connection portion and the edge of the photosensitive chip are on the same horizontal plane. In addition, a dispenser platform with a rotation function may be adopted, and the platform of the dispenser platform may be rotated to make the first electrical connection portion and the edge of the photo sensor chip on the same horizontal plane.
Step S150: an insulating layer is formed between the side surface of the photosensitive chip and the circuit board.
The insulating layer is used for forming a conductive structure which electrically connects the first electric connection part and the second electric connection part. The specific material of the insulating layer is not exclusive, and the insulating layer may be an insulating glue layer. Correspondingly, in one embodiment, the insulating layer is formed by dispensing, and the insulating layer covers a part of the second electrical connection portion. The insulating layer is manufactured by adopting a dispensing mode, and the operation is simple, convenient and reliable. Cover part second electric connection portion with the insulating layer, be more favorable to implanting the second connection portion and realize second electric connection portion and conductive structure's electric connection, improve the preparation reliability.
After the circuit board is rotated and fixed, insulating glue can be injected to the side face, close to the first electric connection portion, of the photosensitive chip through the glue dispensing needle head of the glue dispensing machine table, so that an insulating glue layer is formed on the side face of the photosensitive chip after the insulating glue is solidified, and the surface of the insulating glue layer is used for arranging a conductive structure to connect the first electric connection portion and the second electric connection portion. The surface of the insulating adhesive layer can be positioned on the same horizontal plane with the edges of the first electric connection part and the photosensitive chip, and the surface of the insulating adhesive layer can also be slightly higher than the horizontal plane where the edges of the first electric connection part and the photosensitive chip are positioned, so long as the subsequent operation of forming the conductive structure is not influenced.
According to the manufacturing method of the photosensitive assembly, after the photosensitive chip is fixedly arranged on the circuit board, the circuit board fixed with the photosensitive chip is placed, so that the opening area of the photosensitive chip and the circuit board in the direction of injecting the insulating layer is increased, the glue is conveniently injected into the glue dispensing needle nozzle to form the insulating layer, the requirement on operation precision is lowered, the risk of poor electrical connection can be effectively reduced in the subsequent process, and the yield of the camera module is improved.
In one embodiment, as shown in fig. 2, after step S120 and before step S140, the method further comprises step S130.
Step S130: a first engaging portion is formed on the circuit board. The first connecting part is electrically connected with the first electric connecting part.
Specifically, when the circuit board is horizontally placed on the platform of the dispensing machine table, the capillary welding head is utilized to form a first connection part electrically connected with the first electric connection part on the circuit board from a vertical downward direction. The first connection part is formed on the circuit board, so that the conductive structure and the first electric connection part can be conveniently and well electrically connected when the conductive structure is manufactured on the insulating layer, and the assembling reliability of the photosensitive assembly is improved. The specific shape and material of the first connecting part are not exclusive, and only the first connecting part needs to be conductive.
Further, in one embodiment, after step S150, the method further comprises step S160.
Step S160: forming a conductive structure on the insulating layer; the conductive structure is electrically connected with the first connecting part.
The conductive structure is manufactured on the horizontal surface of the insulating layer and is electrically connected with the first connecting part, so that the electrical connection between the conductive structure and the first electrical connecting part of the circuit board is completed, the conductive structure is conveniently manufactured, and the electrical connection effect between the conductive structure and the first electrical connecting part can be ensured. The specific shape and material of the conductive structure are not exclusive, and only the conductive structure needs to be conductive.
Further, in one embodiment, with continued reference to fig. 2, after step S160, the method may further include step S170.
Step S170: and rotating the circuit board fixed with the photosensitive chip to a direction vertical to the direction of implanting the first connecting part, and forming a second connecting part on the photosensitive chip. The second connecting part is electrically connected with the conductive structure and the second electric connecting part.
Specifically, after the conductive structure is fabricated, the circuit board is rotated again to be restored to the horizontal position, and then the second engaging portion is formed on the photosensitive chip from the vertically downward direction by the capillary bonding head. After the conductive structure is manufactured, the circuit board fixed with the photosensitive chip is rotated to the direction vertical to the direction of the implanted first connecting part, so that a second connecting part is manufactured on the horizontal surface of the photosensitive chip, the second electric connecting part of the photosensitive chip is electrically connected with the conductive structure, the assembling difficulty is reduced, and the electric connection effect of the conductive structure and the second electric connecting part can be ensured. The specific shape and material of the second connecting portion are not exclusive, and only the second connecting portion needs to be conductive.
In one embodiment, the first and second engagement portions are formed by implanting conductive particles. The first connection part, the conductive structure and the second connection part are manufactured in a mode of implanting conductive particles, and the operation is simple, convenient and reliable. The conductive particles may be gold particles or copper particles, and in this embodiment, the conductive particles are formed as gold particles, which can improve the conductivity. For example, a first connection portion, a conductive structure and a second connection portion are respectively obtained by dropping liquid gold and solidifying to form a gold ball.
Specifically, a capillary welding head of the wire welding equipment can be adopted to drop conductive liquid drops at corresponding positions, and the conductive liquid drops are solidified to form conductive particles so as to respectively obtain a first connection part, a conductive structure and a second connection part. The first connection part and the second connection part can be obtained by dripping one to two drops of conductive liquid drops, and the conductive structure can be obtained by dripping more than two drops of conductive liquid drops. For example, after the photosensitive chip is fixedly arranged on the circuit board, a capillary bonding head of a wire bonding device is used for dripping conductive liquid drops on the horizontally arranged circuit board to form a first joint part contacted with the first electric connection part. After the circuit board is rotated and the insulating layer is manufactured, a plurality of conductive liquid drops are sequentially dripped on the horizontal surface of the insulating layer to form a conductive structure which is fully distributed on the surface of the insulating layer and is in contact with the first connecting part.
The conductive structure is manufactured after the circuit board is rotated, and the problem that a plurality of conductive particles cannot be superposed when the conductive particles are implanted into the inclined plane of the insulating layer when the circuit board is horizontally placed is also solved. In addition, conductive liquid drops are dripped on the horizontal surface of the insulating layer to form a conductive structure, and the problem that when conductive particles are implanted into the inclined surface of the insulating layer, the ceramic nozzle of the capillary welding head is polluted due to the fact that the ceramic nozzle touches the inclined surface of the insulating layer can be avoided.
In one embodiment, the conductive particles on the side of the conductive structure away from the first connecting portion extend beyond the edge of the surface of the photosensitive chip away from the circuit board, which is close to the insulating layer. Specifically, when the conductive liquid drops are dripped on the horizontal surface of the insulating layer, the first conductive liquid drops are dripped from the side close to the first joint part and are contacted with the first joint part, then the conductive liquid drops are dripped in the direction far away from the first joint part to form sequentially superposed conductive particles, and the last conductive particle exceeds the edge of the photosensitive chip, so that the phenomenon that the photosensitive chip is damaged due to the fact that a ceramic nozzle of a capillary welding head is contacted with the photosensitive chip when the second joint part is manufactured subsequently is avoided.
In this embodiment, surpass the edge that the surface that the circuit board was kept away from to the sensitization chip with the electrically conductive particle who keeps away from first joint portion one side in the electrically conductive structure and be close to the insulating layer, prevent that the instrument from touching the edge of sensitization chip and causing the sensitization chip to damage when implanting electrically conductive particle preparation second joint portion, improved the equipment reliability of sensitization subassembly.
In order to better understand the method for fabricating the photosensitive assembly, the following detailed description is made with reference to specific embodiments.
Fig. 3 to 6 are schematic diagrams illustrating a principle of a manufacturing process of the photosensitive element, as shown in fig. 3, the circuit board 110 is horizontally disposed and the photosensitive chip 120 is fixed, wherein the photosensitive chip 120 is provided with a second electrical connection portion 122. After the conductive liquid drops are dropped on the first electrical connection portion 112 of the circuit board 110 by using the nozzle of the capillary soldering head to form a first connection portion, as shown in fig. 4, the side edge glue is dispensed by using the dispensing needle after the angle of the circuit board 110 is reversed to form the insulating layer 130. As shown in fig. 5, a conductive structure electrically connected to the first connection portion is formed by dropping a conductive droplet on the surface of the insulating layer 130. Finally, as shown in fig. 6, the circuit board 110 is restored to the horizontal angle, and conductive particles are implanted by dropping conductive liquid drops on the second electrical connection portion 122 of the photosensitive chip 120, so as to form a second engagement portion electrically connected to the second electrical connection portion 122 and the conductive structure.
In the above process, when the circuit board 110 is turned over, as shown in fig. 7, the positions of the edges (i) of the photosensitive chips 120 and the first electrical connection portions 112 are aligned to be horizontal. The glue dispensing plane is positioned in the horizontal direction, so that the problem that a glue dispensing needle head cannot be placed due to the small position of a glue dispensing position is solved. The conductive particles are implanted in the horizontal direction to form a conductive structure, and the problems that a plurality of conductive particles cannot be superposed and the inclined plane of the insulating layer 130 causes pollution to the porcelain nozzle when the circuit board 110 is horizontally placed and the conductive particles are implanted are solved. In addition, as shown in fig. 8, when the conductive structure is formed by dropping the conductive liquid drops, the conductive particles (which may be called corner gold balls) on the side away from the first electrical connection portion 112 exceed the point C where the edge of the photosensitive chip 120 is located, so as to prevent the damage to the photosensitive chip 120 caused by the collision of the ceramic nozzle with the edge of the photosensitive chip 120 when the next conductive particle is implanted to make the second engagement portion.
In one embodiment, a photosensitive assembly is provided, as shown in fig. 9, including a circuit board 110, a photosensitive chip 120 and an insulating layer 130, wherein a first electrical connection portion 112 is disposed on the circuit board 110, and a second electrical connection portion 122 corresponding to the first electrical connection portion 112 is disposed on a surface of the photosensitive chip 120 away from the circuit board 110; the insulating layer 130 is disposed between the side surface of the photosensitive chip 120 and the circuit board 110; the insulating layer 130 is formed by the above-described method.
Further, in an embodiment, the photosensitive assembly further includes a first connection portion, a conductive structure 140 and a second connection portion, the first connection portion is disposed on the circuit board 110 and electrically connected to the first electrical connection portion 112, the second connection portion is disposed on the photosensitive chip 120 and electrically connected to the second electrical connection portion 122, the conductive structure 140 is disposed on the insulating layer 130 and electrically connects the first connection portion and the second connection portion. In the direction from the circuit board 110 to the photosensitive chip 120, the distance between two sides of the insulating layer 130 between the conductive structure 140 and the photosensitive chip 120 gradually decreases, and the shape of the insulating layer 130 is a right triangle. Through setting up first connection portion, second connection portion, the electrically conductive structure 140 of being convenient for forms good electric connection with first electric connection portion 112, second electric connection portion 122, has improved photosensitive assembly's equipment reliability.
The surface of the insulating layer 130 may be at the same level as the edges of the first electrical connection portion 112 and the photosensitive chip 120, and the surface of the insulating layer 130 may also be slightly higher than the level of the edges of the first electrical connection portion 112 and the photosensitive chip 120. In this embodiment, the surface of the insulating layer 130 is not lower than the horizontal planes of the first electrical connection portion 112 and the edge of the photosensitive chip 120, so that when the conductive structure 140 is formed by implanting conductive particles into the surface of the insulating layer 130, the electrical connection stability between the conductive structure 140 and the photosensitive chip 120 is not affected due to the fact that the height of the insulating layer 130 is lower than that of the photosensitive chip 120, and the yield of the camera module is improved.
When the photosensitive assembly is used for manufacturing the insulating layer 130, the photosensitive chip 120 is fixedly arranged behind the circuit board 110, the circuit board 110 fixed with the photosensitive chip 120 is placed, the opening area of the photosensitive chip 120 and the opening area of the circuit board 110 in the direction of injecting the insulating layer are increased, glue is conveniently injected into the insulating layer 130 through the glue dispensing needle nozzle, the requirement on operation precision is lowered, the risk of poor electrical connection can be effectively lowered in the subsequent processes, and the yield of the camera module is improved. The photosensitive assembly has the characteristic of small size, and is beneficial to being applied to a light and thin mobile terminal.
Specifically, the first and second engagement portions, the conductive structure 140, and the second engagement portion are all formed by implanting conductive particles. The first connection part, the conductive structure 140 and the second connection part are manufactured by implanting conductive particles, and the operation is simple, convenient and reliable. The number of the conductive particles of the conductive structure 140 is two or more, and the number of the conductive particles of the first and second connection portions is 1 to 2. Specifically, the number of all the conductive particles is 3 to 6, and taking 6 as an example, the number of the conductive particles of the first and second connection portions is 1, and the number of the conductive particles of the conductive structure 140 is 4. If the number of the conductive particles is too small, the conductive particles are required to have a larger size in the direction from the circuit board 110 to the photo chip 120 in order to meet the electrical connection requirement, which increases the difficulty of forming the first, conductive structures 140 and second connecting portions by stacking the conductive particles. Accordingly, designing the number of the conductive particles to be 3 to 6 can reduce the difficulty of stacking the conductive particles to form the first and second connection portions 140 and 140. Further, the thickness of the conductive particles in the direction from the circuit board 110 to the photo chip 120 is 10-30 μm, which also reduces the difficulty of stacking the conductive particles.
In one embodiment, the distance D1 between the side of the photosensitive chip 120 adjacent to the first electrical connection 112 and the first electrical connection is less than 100 microns in the direction from the photosensitive chip 120 to the first electrical connection 112. In one embodiment, the distance D2 between the second electrical connection 122 and the side of the photosensitive chip adjacent the first electrical connection 112 in the direction of the photosensitive chip 120 to the first electrical connection 112 is less than 20 microns. The smaller spacing D1 and spacing D2 can reduce the difficulty of stacking conductive particles to form the conductive structure 140, and is also beneficial to obtaining a camera module with a smaller size along the plane of the circuit board 110.
In one embodiment, an adhesive layer is disposed between the photo sensor chip 120 and the circuit board 110, and the size H1 of the adhesive layer is 5-10 μm in the direction from the circuit board 110 to the photo sensor chip 120. In one embodiment, the dimension H2 of the photo chip 120 is 50-100 microns in the direction from the circuit board 110 to the photo chip 120. The smaller size of the dimension H1 and the dimension H2 reduces the number of stacked conductive particles, thereby reducing the difficulty of forming the conductive structure 140, the first connecting portion and the second connecting portion by stacking the conductive particles, and facilitating the acquisition of a camera module with a smaller size in the direction from the circuit board 110 to the photo chip 120.
In one embodiment, the number of the first electrical connection portions 112 is multiple, the number of the second electrical connection portions 122 is the same as the number of the first electrical connection portions 112, and the second electrical connection portions 122 correspond to the first electrical connection portions 112 one by one, and an orthogonal projection of the second electrical connection portions 122 on the circuit board 110 is directly opposite to the first electrical connection portions 112, so that an orthogonal projection of the second electrical connection portions 122 on the circuit board is located on an extension line of the first electrical connection portions 112. The orthographic projection of the second electrical connection portion 122 on the circuit board 110 is opposite to the first electrical connection portion 112, and the offset of the conductive structure 140 in the direction from the first electrical connection portion 112 to the second electrical connection portion 122 can be reduced and the difficulty of overlapping conductive particles can be reduced relative to the staggered arrangement of the second electrical connection portion 122 and the first electrical connection portion 112.
In one embodiment, a camera module is further provided, as shown in fig. 10, including a lens assembly 210 and the photosensitive assembly. In addition, the camera module may further include a bracket 220 and a filter 230. The light sensing chip 120 is disposed on the circuit board 110, the bracket 220 is a hollow structure with two open ends, the bracket 220 is disposed on the circuit board 110, the light sensing chip 120 is accommodated in the bracket 220, the filter 230 is disposed on a step portion of the bracket 220, and the lens assembly 210 is disposed at one end of the bracket 220 away from the circuit board 110.
Above-mentioned module of making a video recording, when making the insulating layer, after fixedly setting up sensitization chip 120 in circuit board 110, place the circuit board 110 that is fixed with sensitization chip 120, make sensitization chip 120 and circuit board 110 increase in the opening area who pours into the insulating layer direction into, make things convenient for some glue needle mouths to pour into the colloid in order to form insulating layer 130 into, reduced the operation precision requirement, can effectively reduce the risk of bad electric connection in subsequent processes, improved the yield of the module of making a video recording.
In one embodiment, a mobile terminal is further provided, which includes the camera module. The mobile terminal can be a mobile phone with a camera module, a camera, a notebook, a wearable device and the like.
When the insulating layer is manufactured, the photosensitive chip 120 is fixedly arranged behind the circuit board 110, the circuit board 110 fixed with the photosensitive chip 120 is placed, the opening area of the photosensitive chip 120 and the opening area of the circuit board 110 in the direction of injecting the insulating layer are increased, glue is conveniently injected into the insulating layer 130 by the glue dispensing needle nozzle, the requirement on operation precision is lowered, the risk of poor electrical connection can be effectively reduced in subsequent processes, the yield of the camera module is improved, and the light and thin property can be achieved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (11)
1. A method for manufacturing a photosensitive assembly is characterized by comprising the following steps:
providing a circuit board; the circuit board is provided with a first electric connection part;
fixedly arranging a photosensitive chip on the circuit board; the surface of the photosensitive chip, which is far away from the circuit board, is provided with a second electric connection part corresponding to the first electric connection part;
placing a circuit board fixed with the photosensitive chip to increase the opening area of the photosensitive chip and the circuit board in the direction of injecting the insulating layer;
forming an insulating layer between the side surface of the photosensitive chip and the circuit board; wherein the insulating layer is used to form a conductive structure that electrically connects the first and second electrical connections.
2. The method according to claim 1, wherein after the fixing and disposing the photosensitive chip on the circuit board, before placing the circuit board fixed with the photosensitive chip and increasing an opening area of the photosensitive chip and the circuit board in a direction of injecting the insulating layer, further comprising:
forming a first engagement portion on the circuit board; wherein the first engagement portion is electrically connected to the first electrical connection portion.
3. The method of claim 2, further comprising, after forming an insulating layer between the side of the photo-sensing chip and the circuit board:
forming a conductive structure on the insulating layer; wherein the conductive structure is electrically connected to the first connection portion.
4. The method of claim 3, further comprising, after the insulating layer forms a conductive structure:
rotating the circuit board fixed with the photosensitive chip to a direction perpendicular to the direction of implanting the first connecting part, and forming a second connecting part on the photosensitive chip; wherein the second engagement portion electrically connects the conductive structure and the second electrical connection portion.
5. The method of claim 4, wherein the first engagement portion, the conductive structure, and the second engagement portion are each formed by implanting conductive particles.
6. The method of claim 5, wherein the conductive particles on the side of the conductive structure away from the first engagement portion extend beyond the edge of the surface of the photosensitive chip away from the circuit board near the insulating layer.
7. The method of any of claims 1-6, wherein the insulating layer is formed by dispensing and covers a portion of the second electrical connection.
8. A photosensitive assembly is characterized by comprising a circuit board, a photosensitive chip and an insulating layer, wherein a first electric connection part is arranged on the circuit board, and a second electric connection part corresponding to the first electric connection part is arranged on the surface, far away from the circuit board, of the photosensitive chip; the insulating layer is arranged between the side surface of the photosensitive chip and the circuit board; the insulating layer is produced by the method of any one of claims 1 to 7.
9. A photosensitive assembly according to claim 8, further comprising a first engagement portion disposed on the circuit board and electrically connected to the first electrical connection portion, a conductive structure disposed on the photosensitive chip and electrically connected to the second electrical connection portion, and a second engagement portion disposed on the insulating layer and electrically connected to the first engagement portion and the second engagement portion.
10. A camera module comprising a lens assembly and a photosensitive assembly according to claim 8 or 9.
11. A mobile terminal characterized by comprising the camera module according to claim 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911352922.8A CN113037952A (en) | 2019-12-25 | 2019-12-25 | Photosensitive assembly manufacturing method, photosensitive assembly, camera module and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911352922.8A CN113037952A (en) | 2019-12-25 | 2019-12-25 | Photosensitive assembly manufacturing method, photosensitive assembly, camera module and mobile terminal |
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| CN113037952A true CN113037952A (en) | 2021-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911352922.8A Withdrawn CN113037952A (en) | 2019-12-25 | 2019-12-25 | Photosensitive assembly manufacturing method, photosensitive assembly, camera module and mobile terminal |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114466126A (en) * | 2022-02-25 | 2022-05-10 | 维沃移动通信有限公司 | Camera shooting assembly, preparation method of camera shooting assembly and electronic equipment |
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| TW201131666A (en) * | 2010-03-03 | 2011-09-16 | Powertech Technology Inc | Method for forming an underfilling material |
| CN207170143U (en) * | 2017-07-12 | 2018-04-03 | 深圳市鹏元晟实业有限公司 | A kind of automatically dropping glue assembles equipment |
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| CN114466126A (en) * | 2022-02-25 | 2022-05-10 | 维沃移动通信有限公司 | Camera shooting assembly, preparation method of camera shooting assembly and electronic equipment |
| CN114466126B (en) * | 2022-02-25 | 2023-09-26 | 维沃移动通信有限公司 | Image pickup assembly, preparation method of image pickup assembly and electronic equipment |
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Application publication date: 20210625 |