CN207517688U - Camera module encapsulation base plate and camera module - Google Patents
Camera module encapsulation base plate and camera module Download PDFInfo
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- CN207517688U CN207517688U CN201721631626.8U CN201721631626U CN207517688U CN 207517688 U CN207517688 U CN 207517688U CN 201721631626 U CN201721631626 U CN 201721631626U CN 207517688 U CN207517688 U CN 207517688U
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- camera module
- base frame
- insulating base
- base plate
- recessing groove
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Abstract
The utility model is related to a kind of camera module encapsulation base plates, including carrying optical filter, insulating base frame equipped with loophole, the insulating base frame has installation to the docking section of circuit board, recessing groove is further opened on wherein described docking section, the insulating base frame is internally provided with to be connected to the conducting wire of external circuit, and the conducting wire has the electric connection part being exposed in the recessing groove.The docking section of insulating base frame is equipped with recessing groove, and insulating base frame is installed to circuit board, and electronic component can be contained in recessing groove and is electrically connected, and can be electrically connected to circuit board by conducting wire with electric connection part.Therefore, it is more flexible when insulating base frame designs, it is not necessary to the excessive arrangement for considering how electronic component on adaptive circuit plate.In addition, insulating base frame sets deeper avoiding space on a large scale due to not needing to, the height of insulating base frame can be lower and still ensures that structural strength.Also propose a kind of camera module with above-mentioned pedestal.
Description
Technical field
The utility model is related to camera module field, more particularly to a kind of camera module encapsulation base plate.Further relate to one
Kind camera module.
Background technology
Existing module industry internal cause is by electronic component height limitation, CCM (Compact Camera Module, miniature video camera
Module) module height can not continue to reduce；But the thinning trending of existing new cell-phone product, urgent need are captured the reduction of CCM modules height and are asked
Topic solves the plastic base height 0.75 of mobile phone products camera module protrusion back plate problem, at present optical camera module
Millimeter~1 millimeter.As depicted in figs. 1 and 2, plastic base 91 has the space of 0.4 height to place on circuit board 92
The space of electronic component 921, now because the height of electronic component can not reduce, the height that 0.4 millimeter of product, which can not design, to be subtracted
It is small.
Utility model content
Based on this, it is necessary to the problem of the electronic component being limited to for CCM modules on circuit board, provide a kind of camera shooting
Head mould group encapsulation base plate.
A kind of camera module encapsulation base plate, it is described including to carry optical filter, insulating base frame equipped with loophole
Insulating base frame has installation to the docking section of circuit board, wherein recessing groove is further opened on the docking section, the insulating base frame
Be internally provided with to be connected to the conducting wire of external circuit, the conducting wire have be exposed to it is electrical in the recessing groove
Connecting portion.
The storage space being connected with the loophole is also formed on the docking section in one of the embodiments,
The recessing groove is further recessed by the bottom wall of the storage space.
The storage space being connected with the loophole, institute are also formed on the docking section in one of the embodiments,
Recessing groove is stated to be isolated from each other with the storage space.
The depth of the recessing groove is more than the depth of the storage space in one of the embodiments,.
The electric connection part is located at the bottom wall of the recessing groove in one of the embodiments,.
The conducting wire is formed as one by burying forming mode with insulating base frame in one of the embodiments,
Part.
The outer surface of the insulating base frame is attached with the conductive layer connected with conducting wire in one of the embodiments,
Or the conducting wire has conductive junction point on the outer surface.
The inwardly projecting support formed to carry optical filter of the inner wall of the loophole in one of the embodiments,
Portion.
In one of the embodiments, electronic component is electrically connected on the electric connection part.
A kind of camera module, which is characterized in that including the circuit board for being equipped with sensitive chip and aforementioned camera module
Optical filter is installed, the sensitive chip is located at the camera module encapsulation base plate, electricity on encapsulation base plate, wherein insulating base frame
In the enclosure space that road plate and optical filter are collectively formed, electronic component, and the electricity are electrically connected on the electric connection part
Sub- component is electrically connected to the control circuit on the circuit board by the conducting wire.
The docking section of insulating base frame is equipped with recessing groove, and insulating base frame is installed to circuit board, and electronic component can hold
It is contained in recessing groove and is electrically connected, and can circuit board be electrically connected to by conducting wire with electric connection part.Therefore, insulating base frame
It is more flexible during design, it is not necessary to the excessive arrangement for considering how electronic component on adaptive circuit plate.In addition, insulating base frame due to
It does not need to set deeper avoiding space on a large scale, the height of insulating base frame can be lower and still ensures that structural strength.
Description of the drawings
Fig. 1 is that the camera module encapsulation base plate of traditional technology installs the diagrammatic cross-section to circuit board；
Fig. 2 is the diagrammatic cross-section of the camera module of traditional technology；
Fig. 3 is the schematic top plan view of the camera module encapsulation base plate of the utility model one embodiment；
Fig. 4 is that the camera module encapsulation base plate of the utility model one embodiment installs the signal of the section to circuit board
Figure；
Fig. 5 is the diagrammatic cross-section of the camera module of the utility model one embodiment；
Fig. 6 is the schematic diagram of the camera module encapsulation base plate of another embodiment of the utility model.
Specific embodiment
Above-mentioned purpose, feature and advantage to enable the utility model are more obvious understandable, below in conjunction with the accompanying drawings to this
The specific embodiment of utility model is described in detail.Elaborate many details in order to abundant in the following description
Understand the utility model.But the utility model can be much to implement different from other manner described here, this field
Technical staff can do similar improvement in the case of without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific embodiment opened.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to the technology of the utility model
The normally understood meaning of technical staff in domain is identical.It is only in the term used in the description of the utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein " and/or " include
The arbitrary and all combination of one or more relevant Listed Items.
Below in conjunction with the accompanying drawings, illustrate the utility model as module packaging pedestal and the better embodiment of camera module.
It please refers to Fig.2 to Fig. 5, one embodiment of the utility model, provides a kind of camera module encapsulation base plate 10.
Camera module encapsulation base plate 10 includes carrying optical filter 20, insulating base frame equipped with loophole 120
110.Insulating base frame 110 has installation to the docking section 130 of circuit board 30, is wherein further opened with recessing groove on docking section 130
131.The conducting wire 132 for being internally provided with to be connected to external circuit of insulating base frame 110.Conducting wire 132 has exposure
Electric connection part 133 in recessing groove 131
Insulating base frame 110 is used for carrying optical filter 20 and for carrying lens group and voice coil motor.Insulating base frame 110 is excellent
Choosing is using plastic parts.When insulating base frame 110 is installed to circuit board 30, docking section 130 bears against the surface of circuit board 30.Such as Fig. 2
Shown in Fig. 3, in an embodiment, the inwardly projecting support portion 121 formed to carry optical filter 20 of inner wall of loophole 120.
In other examples, support portion 121 can in addition fix support component on insulating base frame 110 to obtain.
The docking section 130 of insulating base frame 110 is equipped with recessing groove 131.Electronic component 40 can be contained in recessing groove 131
It is interior and be electrically connected with electric connection part 133.When the insulating base frame 110 for being equipped with optical filter 20 is installed to circuit board 30, electronics
Component 40 is formed as one with insulating base frame 110, and can be electrically connected to circuit board 30 by conducting wire 132.Therefore,
Insulating base frame 110 is more flexible when designing, it is not necessary to the excessive arrangement for considering how electronic component on adaptive circuit plate.In addition,
Insulating base frame 110 sets deeper avoiding space on a large scale due to not needing to, and the height of insulating base frame 110 can be lower and remains to
Ensure structural strength.
In one embodiment, docking section 130 is formed with the storage space 134 being connected with loophole 120, wherein recessing groove
131 are further recessed by the bottom wall of storage space 134.
Storage space 134 is avoiding the sensitive chip 50 on circuit board 30.Recessing groove 131 is then accommodating electronics member device
Part 40.The local location of the bottom wall of storage space 134 is recessed to form recessing groove 131 to avoid electronic component 40, does not need to be whole
The depth of a storage space 134 is satisfied by can avoiding electronic component 40, the height of such insulating base frame 110 can it is lower but
Still ensure structural strength simultaneously.
For example, in traditional technology, the insulating base frame height of camera module is 0.7 millimeter~1 millimeter, and on insulating base frame
Depth to avoid the space of electronic component and sensitive chip on circuit board is required to set at least to 0.4 millimeter.And
According in the present embodiment scheme, the depth for avoiding the storage space 134 of sensitive chip 50 can be only 0.2 millimeter, and
Only the recessing groove 131 that depth is 0.2 millimeter is opened up in the bottom wall of storage space 134 to avoid electronic component 40.More traditional skill
Art opens up the storage space 134 of 0.4 mm depth on a large scale, can be in the height for reducing insulating base frame 110 to 0.3 milli~0.8
Structural strength is still ensured that during millimeter.
In other examples, the storage space 134 being connected with loophole 120 is also formed on docking section 130, wherein
Recessing groove 131 is isolated from each other with storage space 134.I.e. in the present embodiment, and recessing groove 131 is that receipts are opened up on docking section 130
Receiving the position other than space 134 opens up to be formed.The size of storage space 134 can be only adapted with loophole 120 at this time.
Further, in the present embodiment, the depth of recessing groove 131 is more than the depth of storage space 134.Such as storage space
134 depth is set as 0.2 millimeter, and the depth of recessing groove 131 is then 0.4 millimeter.Electronic component 40 is contained in recessing groove
In 131 and it is welded on electric connection part 133.
Storage space 134 is the sensitive chip 50 avoided on circuit board 30.However, as shown in fig. 6, insulating base frame
In addition 110 can not set storage space 134, but accommodate sensitive chip 50 using loophole 120.I.e. insulator foot is installed
During to circuit board, sensitive chip 50 can be contained in the lower part of loophole 120.In addition, loophole 121 can not be photosensitive to accommodate
Chip 50, but pit is set on circuit board 30.Sensitive chip 50 is placed in pit, top and the flush of circuit board 30
Or the surface less than circuit board 30.
In one embodiment, electric connection part 133 is located at the bottom wall of recessing groove 131.Electronic component 40 is connected to electrically
During connecting portion 133, the short transverse of electronic component 40 is consistent with the short transverse of insulator foot 110.
In one embodiment, conducting wire 132 is formed as one part by burying forming mode and insulating base frame 110.This
When, insulating base frame 110 is preferably plastic parts.
In one embodiment, the outer surface of insulating base frame 110 be attached with the conductive layer that is connected with conducting wire 132 or
Conducting wire 132 has conductive junction point on the outer surface.Conductive layer or conductive junction point can be used to be connected to circuit board 30.Wherein,
The path of conductive layer could be provided as when insulating base frame 110 is positioned over circuit board 30, and conductive layer just can be with circuit board 30
On contact contact with each other or closely.It, then can be by connections such as flexible cables when conducting wire 132 sets conductive junction point
Part is connected to circuit board 30.In Fig. 3, the left side of conducting wire 132 is exposed to be formed conduction in the outer surface of insulating base frame 110 and connects
Point.To sum up, conducting wire 132 is only required to connect with external circuit, with the electric terminal of external circuit
Location and shape are not required.
In one embodiment, it is electrically connected with electronic component on the electric connection part 133 of camera module encapsulation base plate 10
40.Camera module encapsulation base plate 10 is fitted together with the circuit board 30 to match in use, user directly selects.Electronics
Component 40 is preferably electrically connected to electric connection part 133 by welding.
Join Fig. 2, one embodiment of the utility model additionally provides a kind of camera module, including being equipped with sensitive chip 50
Circuit board 30 and previous embodiment camera module encapsulation base plate 10, wherein camera module encapsulation base plate 10 is electrical
Electronic component 40 has been electrically connected on connecting portion 133.
Optical filter 20 is installed, insulating base frame 110 is mounted on the insulating base frame 110 of camera module encapsulation base plate 10
On circuit board 30.Sensitive chip 50 is located at the envelope that camera module encapsulation base plate 10, circuit board 30 and optical filter 20 are collectively formed
It closes in space, while electronic component 40 is electrically connected to the control circuit on circuit board 30 by conducting wire 132, makes control electric
The functional component on road is complete.
In addition, camera module can further include voice coil motor and lens assembly.Voice coil motor and lens assembly
On insulating base frame 110.
In one embodiment, the height of above-mentioned camera module is 0.3 millimeter~0.8 millimeter.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Embodiment described above only expresses the several embodiments of the utility model, and description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent range.It should be pointed out that the common skill for this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of camera module encapsulation base plate, including carrying optical filter, insulating base frame equipped with loophole, feature
It is, the insulating base frame has installation to the docking section of circuit board, wherein recessing groove is further opened on the docking section, it is described
Insulating base frame is internally provided with to be connected to the conducting wire of external circuit, and the conducting wire, which has, is exposed to the recessing groove
Interior electric connection part.
2. camera module encapsulation base plate according to claim 1, which is characterized in that be also formed on the docking section with
The storage space that the loophole is connected, the recessing groove are further recessed by the bottom wall of the storage space.
3. camera module encapsulation base plate according to claim 1, which is characterized in that on the docking section also formed and institute
The storage space that loophole is connected is stated, the recessing groove is isolated from each other with the storage space.
4. camera module encapsulation base plate according to claim 3, which is characterized in that the depth of the recessing groove is more than institute
State the depth of storage space.
5. camera module encapsulation base plate according to claim 1, which is characterized in that the electric connection part is located at described
The bottom wall of recessing groove.
6. camera module encapsulation base plate according to claim 1, which is characterized in that the conducting wire by embedment into
Type mode is formed as one part with insulating base frame.
7. camera module encapsulation base plate according to claim 1, which is characterized in that the outer surface of the insulating base frame is attached
The conductive layer connected with conducting wire or the conducting wire has conductive junction point on the outer surface.
8. camera module encapsulation base plate according to claim 1, which is characterized in that the inner wall of the loophole is to convex
Go out to form the support portion for carrying optical filter.
9. camera module encapsulation base plate according to claim 1, which is characterized in that be electrically connected on the electric connection part
There is electronic component.
10. a kind of camera module, which is characterized in that including being equipped with the circuit board of sensitive chip and as claim 1 to 8 is any
Camera module encapsulation base plate described in, is wherein equipped with optical filter on insulating base frame, the sensitive chip is located at described take the photograph
In the enclosure space being collectively formed as head mould group encapsulation base plate, circuit board and optical filter, it is electrically connected on the electric connection part
Electronic component, and the electronic component is electrically connected to the control circuit on the circuit board by the conducting wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721631626.8U CN207517688U (en) | 2017-11-29 | 2017-11-29 | Camera module encapsulation base plate and camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721631626.8U CN207517688U (en) | 2017-11-29 | 2017-11-29 | Camera module encapsulation base plate and camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207517688U true CN207517688U (en) | 2018-06-19 |
Family
ID=62541957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721631626.8U Active CN207517688U (en) | 2017-11-29 | 2017-11-29 | Camera module encapsulation base plate and camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207517688U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107799544A (en) * | 2017-11-29 | 2018-03-13 | 苏州昀冢电子科技有限公司 | Camera module encapsulation base plate and camera module |
| WO2021196493A1 (en) * | 2020-04-01 | 2021-10-07 | 南昌欧菲光电技术有限公司 | Light filtering assembly, camera module and electronic device |
-
2017
- 2017-11-29 CN CN201721631626.8U patent/CN207517688U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107799544A (en) * | 2017-11-29 | 2018-03-13 | 苏州昀冢电子科技有限公司 | Camera module encapsulation base plate and camera module |
| WO2021196493A1 (en) * | 2020-04-01 | 2021-10-07 | 南昌欧菲光电技术有限公司 | Light filtering assembly, camera module and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 215300 Songjiagang Road 269, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Yunzhong Electronic Technology Co., Ltd Address before: 215300, 144, Kang Zhuang Road, Zhou Town, Suzhou, Jiangsu, Kunshan Patentee before: SUZHOU YUNZHONG ELECTRONIC TECHNOLOGY CO., LTD. |
|
| CP03 | Change of name, title or address |