CN205122586U - Image sensor encapsulates and has camera module of this encapsulation - Google Patents
Image sensor encapsulates and has camera module of this encapsulation Download PDFInfo
- Publication number
- CN205122586U CN205122586U CN201520972810.3U CN201520972810U CN205122586U CN 205122586 U CN205122586 U CN 205122586U CN 201520972810 U CN201520972810 U CN 201520972810U CN 205122586 U CN205122586 U CN 205122586U
- Authority
- CN
- China
- Prior art keywords
- image sensor
- substrate
- sensor package
- camera module
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The utility model discloses an image sensor encapsulates and has camera module of this encapsulation, including chip (1.1) and first base plate (1.2), image sensor encapsulation (1) still includes passive component (1.4), passive component (1.4) install first base plate (1.2) on, the inside circuit electric connection in passive component (1.4) and first base plate (1.2), chip (1.1) also install first base plate (1.2) on, chip (1.1) also circuit electric connection inside with first base plate (1.2). This image sensor encapsulation contains passive component, can realize complete camera module circuit, makes the production of camera module more convenient. This camera module compact structure, the equipment is convenient, can improve production efficiency.
Description
Technical field
The utility model relates to picture pick-up device technical field, particularly relates to a kind of image sensor package and has the camera module of this encapsulation.
Background technology
In recent years, along with the development of multimedia technology, the range of application of camera module is more and more wider, is widely used in mobile phone, computer, the first-class electronic product of miniature video camera.The camera module of prior art generally includes lens assembly, infrared fileter, circuit board and image sensor package.Image sensor package is the core component of camera module.Camera module comprises chip and substrate.At present, image sensor package be packaged with a lot of form, such as more common CSP encapsulation and PLSS encapsulation etc., and these encapsulation modes above-mentioned only encapsulate for chip itself, do not comprise the passive device such as electric capacity, resistance required in camera module circuit.And the peripheral circuit that the passive device such as electric capacity, resistance is chip helps chip to realize the function of image sensing.At present, when image sensor package is assembled into and goes in camera module, passive device is mounted on circuit board.Can be there is following defect in this kind of design: passive device is installed on circuit boards, make camera modular structure not compact, and play passive device on circuit boards there is certain operation easier, which improves the production threshold of camera module production firm, do not utilize the development of science and technology.
Utility model content
The technical problems to be solved in the utility model is, provides a kind of image sensor package, and this image sensor package comprises passive device, can realize complete camera module circuit, camera module is produced convenient.
Technical solution of the present utility model is, provide a kind of image sensor package with following structure, comprise chip and first substrate, image sensor package also comprises passive device; Described passive device is arranged on described first substrate, and the circuit of described passive device and first substrate inside is electrically connected; Described chip is also arranged on described first substrate, and described chip is also electrically connected with the circuit of first substrate inside.
After adopting above structure, image sensor package of the present utility model, compared with prior art, has the following advantages:
Because image sensor package of the present utility model comprises passive device, such image sensor package inherently can realize complete camera module circuit, make the assembling of camera module more simple and convenient, reduce the production threshold of camera module production firm, enhance productivity, be conducive to the development of science and technology.
Improve as one of the present utility model, described first substrate is provided with light hole, and described passive device is arranged on the upside of described first substrate; Described chip is arranged on the downside of described first substrate.After adopting this kind of structure, passive device is separated with chip, not at grade, thus passive device can not be impacted the height of camera module, be also conducive to the testing and analyzing in producing.
Improve as another kind of the present utility model, image sensor package also comprises second substrate; Described second substrate is provided with the chip hole for accommodating described chip; Described second substrate is arranged on the downside of described first substrate and is linked in outside described chip.After adopting this kind of structure, make to affect transducer overall structure reliable, stable, but also make bottom camera module more smooth, be conducive to the installation of camera module.
Also have a kind of improvement as of the present utility model, be fixedly connected with by the first glue between described first substrate and described second substrate.After adopting this kind of structure, fixed form is simple and firm.
Also have a kind of improvement as of the present utility model, the downside of described second substrate is provided with the second glue.After adopting this kind of structure, fixed form is simple and firm.
Another technical problem to be solved in the utility model is, provide a kind of camera module with this encapsulation, this camera modular structure is compact, easy to assembly, can enhance productivity.
Another technical solution of the present utility model is, provides another kind to have the camera module with this encapsulation of following structure, bag lens assembly, infrared fileter, circuit board and claim 1 to 6 image sensor package in any one; Described lens assembly comprises camera lens, motor and support, described camera lens is arranged in described motor, described motor is arranged on the upside of support, described image sensor package is arranged on the downside of described support, and described infrared fileter is arranged in the inner space that formed between support and image sensor package; Described support is provided with the spatial accommodation for accommodating passive device; The passive device of described image sensor package is contained in described spatial accommodation.
After adopting above structure, the camera module with this encapsulation of the present utility model, compared with prior art, has the following advantages:
Because the transducer that affects with the camera module of this encapsulation of the present utility model carries passive device, without the need to installing passive device on circuit boards, reducing and producing threshold, assembling more convenient, quick; Support is provided with spatial accommodation and likes you, and passive device is contained in spatial accommodation, and make camera module overall structure compacter, space shared when being assembled on the mobile terminals such as mobile phone is smaller.
Improve as one of the present utility model, the downside of described support is provided with the holding tank for accommodating described passive device, and described passive device is contained in described holding tank.Structure is simple, implements more convenient.
Improve as another kind of the present utility model, the upper end of described image sensor package is located at by described infrared fileter.After adopting this kind of structure, the height of camera module can be reduced further.
Also have a kind of improvement as of the present utility model, fixed by the 3rd glue between described infrared fileter and the upper end of image sensor package.After adopting this kind of structure, fixed form is simple and firm.
Accompanying drawing explanation
Fig. 1 is the perspective view of image sensor package of the present utility model.
Fig. 2 is the detonation configuration schematic diagram of image sensor package of the present utility model.
Fig. 3 is the perspective view with the camera module of this encapsulation of the present utility model.
Fig. 4 is the detonation configuration schematic diagram with the camera module of this encapsulation of the present utility model.
Fig. 5 is the perspective view with the support of the camera module of this encapsulation of the present utility model.
Shown in figure: 1, image sensor package, 1.1, chip, 1.2, first substrate, 1.2.1, light hole, 1.3, second substrate, 1.3.1, chip hole, 1.4, passive device, the 1.5, first glue, the 1.6, second glue, 2, infrared fileter, 3, circuit board, 4, camera lens, 5, motor, 6, support, 6.1, holding tank, the 7, the 3rd glue.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Refer to shown in Fig. 1 to Fig. 5, image sensor package of the present utility model comprises chip 1.1, first substrate 1.2, second substrate 1.3 and passive device 1.4.Described passive device 1.4 is arranged on described first substrate 1.2, and described passive device 1.4 is electrically connected with the circuit of first substrate 1.2 inside.Described chip 1.1 is also arranged on described first substrate 1.2, and described chip 1.1 is also electrically connected with the circuit of first substrate 1.2 inside.In this specific embodiment, described first substrate 1.2 is provided with light hole 1.2.1, and described passive device 1.4 is arranged on the upside of described first substrate 1.2.Described chip 1.1 is arranged on the downside of described first substrate 1.2.
Described second substrate 1.3 is provided with the chip hole 1.3.1 for accommodating described chip 1.1.Described second substrate 1.3 is arranged on the downside of described first substrate 1.2 and is linked in outside described chip 1.1.The degree of depth of described chip hole 1.3.1 is more than or equal to the thickness of described chip 1.1, and like this, chip 1.1 is contained in chip hole 1.3.1 completely, can reduce the whole height of image sensor package 1.
Be fixedly connected with by the first glue 1.5 between described first substrate 1.2 and described second substrate 1.3.The downside of described second substrate 1.3 is provided with the second glue 1.6, and the effect of the second described glue 1.6 is fixed image sensor package 1 and circuit board 3.
The camera module with this encapsulation of the present utility model, bag lens assembly, infrared fileter 2, circuit board 3 and described image sensor package 1.Described lens assembly comprises camera lens 4, motor 5 and support 6, described camera lens 4 is arranged in described motor 5, described motor 5 is arranged on the upside of support 6, described image sensor package 1 is arranged on the downside of described support 6, and described infrared fileter 2 is arranged in the inner space that formed between support 6 and image sensor package 1.Described circuit board 3 is arranged on the downside of described image sensor package 1.Described support 6 is provided with the spatial accommodation for accommodating passive device 1.4.The passive device 1.4 of described image sensor package 1 is contained in described spatial accommodation.
The downside of described support 6 is provided with the holding tank 6.1 for accommodating described passive device 1.4, and described passive device 1.4 is contained in described holding tank 6.1.The upper end of described image sensor package 1 is located at by described infrared fileter 2, and in this specific embodiment, the upper end of described first substrate 1.2 is located at by described infrared fileter 2.Fixed by the 3rd glue 7 between described infrared fileter 2 and the upper end of image sensor package 1, fixed by the 3rd glue 7 between namely described infrared fileter 2 and the upper end of first substrate 1.2.
Claims (9)
1. an image sensor package, comprises chip (1.1) and first substrate (1.2), it is characterized in that: image sensor package (1) also comprises passive device (1.4); Described passive device (1.4) is arranged on described first substrate (1.2), and described passive device (1.4) is electrically connected with the circuit of first substrate (1.2) inside; Described chip (1.1) is also arranged on described first substrate (1.2), and described chip (1.1) is also electrically connected with the circuit of first substrate (1.2) inside.
2. image sensor package according to claim 1, it is characterized in that: described first substrate (1.2) is provided with light hole (1.2.1), described passive device (1.4) is arranged on the upside of described first substrate (1.2); Described chip (1.1) is arranged on the downside of described first substrate (1.2).
3. image sensor package according to claim 2, is characterized in that: image sensor package (1) also comprises second substrate (1.3); Described second substrate (1.3) is provided with the chip hole (1.3.1) for accommodating described chip (1.1); Described second substrate (1.3) is arranged on the downside of described first substrate (1.2) and is linked in described chip (1.1) outward.
4. image sensor package according to claim 3, is characterized in that: described first substrate (1.2) is fixedly connected with by the first glue (1.5) with between described second substrate (1.3).
5. the image sensor package according to claim 3 or 4, is characterized in that: the downside of described second substrate (1.3) is provided with the second glue (1.6).
6. there is a camera module for this encapsulation, any one image sensor package (1) in bag lens assembly, infrared fileter (2), circuit board (3) and claim 1 to 5; Described lens assembly comprises camera lens (4), motor (5) and support (6), described camera lens (4) is arranged in described motor (5), described motor (5) is arranged on the upside of support (6), described image sensor package (1) is arranged on the downside of described support (6), and described infrared fileter (2) is arranged in the inner space that formed between support (6) and image sensor package (1); It is characterized in that: described support (6) is provided with the spatial accommodation for accommodating passive device (1.4); The passive device (1.4) of described image sensor package (1) is contained in described spatial accommodation.
7. the camera module with this encapsulation according to claim 6, it is characterized in that: the downside of described support (6) is provided with the holding tank (6.1) for accommodating described passive device (1.4), and described passive device (1.4) is contained in described holding tank (6.1).
8. the camera module with this encapsulation according to claim 6 or 7, is characterized in that: the upper end of described image sensor package (1) is located at by described infrared fileter (2).
9. the camera module with this encapsulation according to claim 8, is characterized in that: fixed by the 3rd glue (7) between described infrared fileter (2) and the upper end of image sensor package (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520972810.3U CN205122586U (en) | 2015-11-28 | 2015-11-28 | Image sensor encapsulates and has camera module of this encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520972810.3U CN205122586U (en) | 2015-11-28 | 2015-11-28 | Image sensor encapsulates and has camera module of this encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205122586U true CN205122586U (en) | 2016-03-30 |
Family
ID=55578167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520972810.3U Expired - Fee Related CN205122586U (en) | 2015-11-28 | 2015-11-28 | Image sensor encapsulates and has camera module of this encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205122586U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108962927A (en) * | 2018-06-28 | 2018-12-07 | 江西芯创光电有限公司 | The production method of camera case chip |
| CN109461746A (en) * | 2018-09-30 | 2019-03-12 | 华为技术有限公司 | A kind of CCD camera assembly, assemble method and terminal |
-
2015
- 2015-11-28 CN CN201520972810.3U patent/CN205122586U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108962927A (en) * | 2018-06-28 | 2018-12-07 | 江西芯创光电有限公司 | The production method of camera case chip |
| CN109461746A (en) * | 2018-09-30 | 2019-03-12 | 华为技术有限公司 | A kind of CCD camera assembly, assemble method and terminal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA2675179C (en) | Folded package camera module and method of manufacture | |
| CN202120913U (en) | Thin-type image capturing module | |
| CN206878952U (en) | A kind of camera module and mobile terminal | |
| CN203910777U (en) | Surface-mounted assembly packaging structure and relevant assembly | |
| CN204633900U (en) | A kind of dual camera module | |
| CN205122586U (en) | Image sensor encapsulates and has camera module of this encapsulation | |
| CN205123872U (en) | Automatic camera module of focusing | |
| CN204465695U (en) | Camera module | |
| CN204465696U (en) | Camera module | |
| CN202306098U (en) | Micro camera shooting module | |
| CN203845811U (en) | Multifunctional sensor | |
| CN205081864U (en) | Camera module | |
| CN113035826A (en) | Packaging module, manufacturing method of packaging module and electronic equipment | |
| CN201114373Y (en) | Sticker type camera module | |
| US8169043B2 (en) | Optical seneor package structure and manufactueing method thereof | |
| CN205211751U (en) | Proximity sense and electronic equipment | |
| CN205142365U (en) | Automatic focus camera for module image sensor encapsulate | |
| CN109462807B (en) | Electric connection structure and electronic equipment of sensor | |
| CN202059570U (en) | Silicon microphone | |
| CN202748512U (en) | Camera lens module | |
| CN206686272U (en) | A kind of camera base, CCD camera assembly and mobile terminal | |
| CN201438461U (en) | Novel CMOS image sensor module | |
| CN208079217U (en) | A kind of gun shaped rain-proof video camera | |
| CN113206938B (en) | Split double-camera module, photosensitive assembly, manufacturing method and electronic equipment | |
| CN106104919A (en) | Three-dimensional antenna arrangement |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160330 Termination date: 20211128 |