CN2725916Y - Improved structure of lens module - Google Patents
Improved structure of lens module Download PDFInfo
- Publication number
- CN2725916Y CN2725916Y CN 200420092385 CN200420092385U CN2725916Y CN 2725916 Y CN2725916 Y CN 2725916Y CN 200420092385 CN200420092385 CN 200420092385 CN 200420092385 U CN200420092385 U CN 200420092385U CN 2725916 Y CN2725916 Y CN 2725916Y
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- China
- Prior art keywords
- wafer
- substrate
- camera lens
- image sensing
- lens module
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Abstract
The utility model discloses an improved structure of lens module, which is characterized in that an image sensing chip is arranged on the first surface of a base plate, and is connected with a base plate electric property passing through a metallic thread; and also a memorization chip and a control chip are welded on the second surface of a base plate; one side of the second surface of the base plate is equipped with a weldable output unit terminal for externally connecting other electronic components; a lens mount is adhesively fixed on the first surface of the base plate, making the image sensing chip packed in the lens mount; an optical lens, corresponding to the image sensing chip, is arranged in the lens mount; so the utility model omits lens packaging element, and modularizes the chip, which can save surface stuck technology and also reduce entire volume of the lens.
Description
Technical field
The utility model is about a kind of camera lens module structure-improved, is meant a kind of saving lens package assembly especially, to dwindle the camera lens module structure-improved of camera lens overall volume.
Background technology
See also shown in Figure 1ly, for commonly using lens construction, it mainly comprises a circuit substrate 91, control wafer 92, memory wafer 93, image sensing wafer 94 and lens mount 95; Wherein, substrate 91 fronts have electrical areas, and the back side has most the tin balls 97 (solder ball) that connect with electrical areas.This control wafer 92, memory wafer 93 and image sensing wafer 94 all are encapsulated in the packaging body 96, and this packaging body 96 is welded in the electrical areas in circuit substrate 91 fronts with surface mount technology, by screw 99 lens mount 95 is locked in the front of circuit substrate 91 again, makes that lens mount 95 can be with image sensing wafer 94 cover caps; See through the assembling of above-mentioned member, can form the camera lens of commonly using, and be connected with another control circuit board 98 by the tin ball 97 at substrate 91 back sides.
Yet, because of commonly using camera lens control wafer 92, memory wafer 93, video sensing wafer 94 all are encapsulated in the packaging body 96, make all more former wafer of its overall volume big, and all wafers all is located at substrate 91 fronts, cause assembling the camera lens volume of finishing and become big relatively; With packaging body 96 packaged types, will make this commonly use camera lens and on processing procedure, must impose surface mount technology in addition, and cause production process numerous and diverse, necessity of improvement will be arranged in fact.Moreover, the camera lens finished of encapsulation is that each the tin ball 97 with the back side is welded on the circuit board 98, make circuit board 98 be undertaken in the below of whole camera lens, and adopt the mode of general tin ball 97 welding, the camera lens that encapsulation is finished is connected in control circuit board 98, therefore on the circuit board 98 substrate 91 at the camera lens back side all is attached on the circuit board 98, when causing this camera lens to be connected in circuit board 98 relatively, and can take the more plate body area of circuit board 98, make connected circuit board 98 need to use the larger area plate bodys.
This shows that the above-mentioned article of commonly using still have many disappearances, real non-one kindhearted design, and demand urgently being improved.
This case utility model application people commonly uses every shortcoming that camera lens is derived in view of above-mentioned, is urgently to think to be improved innovation, and after concentrating on studies through taking great pains to attain one's goal for many years, successfully this part camera lens module structure-improved is finished in research and development finally.
The utility model content
The purpose of this utility model promptly is to provide a kind of lens package element of saving, and makes the camera lens module structure-improved that the camera lens volume dwindles relatively.
Of the present utility model time a purpose is to be to provide a kind of with the wafer dies blocking, to omit the processing procedure of surface mount technology, the camera lens module structure-improved that makes the production process simplification.
The camera lens module structure-improved of above-mentioned utility model purpose be can reach, a substrate, a memory wafer, a control wafer, an image sensing wafer, a lens mount included; Wherein, image sensing wafer is fixedly arranged on the first surface of substrate, seeing through metal wire and substrate is electrically connected, one optical mirror slip is installed in the lens mount, and it is cemented in the first surface of substrate, make optical mirror slip be covered in the image sensing wafer top, in addition, memory wafer and control wafer are the second surfaces that is welded in substrate, and be provided with one in order to be external to the welded lead-out terminal of other electron component (as circuit board) in a side of substrate second surface, can form this part camera lens module structure-improved.
Camera lens module structure-improved provided by the utility model when comparing mutually with other located by prior art, has more following advantage:
1. the utility model is to replace the circuit board of commonly using camera lens with substrate, makes first and second surface of this substrate all can link for wafer, to dwindle the volume of camera lens integral body.
2. after the utility model does not need to be packaged into a packaging body earlier, again with the first surface that is welded in the substrate electric connection, and be to utilize metal wire directly to be connected with the first surface of substrate, make it can save the use of lens package element, and can save the man-hour of making camera lens, and, can be with the camera lens volume-diminished that completes.
3. the utility model is to plant the wafer dies blocking, to omit the processing procedure section of surface mount technology, makes production process simplify relatively.
4. camera lens module of the present utility model is that the welded lead-out terminal by the substrate second surface is welded on the circuit board, dwindles taking up room on circuit board, and then reduces the circuit board material cost of required usefulness.
Description of drawings
See also the detailed description and the accompanying drawing thereof of following relevant the utility model one preferred embodiment, can further understand technology contents of the present utility model and purpose effect thereof; The accompanying drawing of relevant this embodiment is:
Fig. 1 is a diagrammatic cross-section of commonly using camera lens;
Fig. 2 is that the utility model camera lens module structure improved first is implemented synoptic diagram; And
Fig. 3 is that the utility model camera lens module structure improved second is implemented diagrammatic cross-section.
Fig. 4 is that the utility model camera lens module the structure improved the 3rd is implemented diagrammatic cross-section.
Fig. 5 is structure improved the 3rd embodiment of the utility model camera lens module and control circuit board connection diagram.
Major part conventional letter: 1. substrate, 11. first surfaces, 12. second surfaces, 121. lead-out terminal, 2. wafer set, 21. memory wafers, 22. control wafer, 4. image sensing wafer, 41. metal wires, 5. lens mount, 51. through holes, 6. optical mirror slip, 7. colloid, 70. control circuit boards, 81. wafer set, 811. memory wafer, 812. control wafer, 91. circuit substrates, 92. control wafer, 93. memory wafer, 94. image sensing wafers, 95. lens mounts, 96. packaging body, 97. the tin ball, 98. control circuit boards, 99. screws.
Concrete good embodiment
Seeing also Fig. 2 to shown in Figure 4, is camera lens module structure-improved provided by the utility model, mainly includes:
One substrate 1, this substrate 1 has opposite first 11 and second surface 12, all form a plurality of input terminals (not indicating among the figure) on this first surface 11 and the second surface 12, and at least one lead-out terminal that welds 121 is to be positioned on the side of this second surface 12, and there is no the setting that to weld lead-out terminal 121 on the relative opposite side of second surface 12, wherein the input terminal of this second surface and this can weld lead-out terminal 121 and electrically connect, and see through most conductive holes (not indicating among the figure) by this substrate 1, electrically connect with the input terminal of first surface;
One image sensing wafer 4, this image sensing wafer 4 are to be fixedly arranged on the first surface 11 of substrate 1, and see through the input terminal electric connection of metal wire 41 and first surface 11;
One wafer set 2, it is to be connected on the second surface 12 of substrate 1, and electrically connects with the input terminal of second surface 12; As shown in Figure 2, this wafer set 2 comprises respectively to cover memory wafer 21 and the control wafer 22 that crystal type is connected in the second surface of substrate, with input terminal and conductive hole by second surface 12, electrically connect with the image sensing wafer 4 that is positioned at substrate 1 first surface 11, make this memory wafer 21 and control wafer 22 can receive signal from image sensing wafer 4, image sensing sheet 4 all can electrically connect with the welded lead-out terminal 121 that is positioned at substrate 1 second surface 12 with wafer set 2 simultaneously;
One optical mirror slip 6;
One lens mount 5, the section of this lens mount 5 becomes convex form, and its central part is provided with a through hole 51; Optical mirror slip 6 is installed in the lens mount 5, so that this optical mirror slip 6 is supported, and can be with the end sealing of through hole 51;
Periphery evenly is coated with one deck colloid 7 in the bottom of lens mount 5, make lens mount 5 cemented in the first surface 11 of substrate 1 in the bonding mode, and with image sensing wafer 4 cover caps on substrate 1 first surface 11, make image sensing wafer 4 corresponding, to transmit optical signalling to this image sensing wafer with the through hole 51 of lens mount 5; Hereat, see through the composition of above-mentioned member, can organizator spare camera lens module structure-improved.
Wafer set structure of the present utility model and set-up mode do not exceed with above-mentioned preferred embodiment, other better embodiment is still arranged, second preferred embodiment as shown in Figure 3, its wafer set 81 be by two respectively encapsulation forms the TFBGA packaging body memory wafer 811 and control wafer 812, and see through on the input terminal of second surface 12 that the tin ball bonding is connected to substrate 1, to electrically connect with image sensing wafer 4; Perhaps, the 3rd preferred embodiment as shown in Figure 4, its wafer set 82 is to be packaged in the packaging body with the mode of control function wafer with TFBGA having memory, form one with the integration wafer of memory with control function, also be connected on the second surface 12 of substrate 1 by most tin ball bondings integrating chip back surface, integration wafer 82 is able to and image sensing wafer 4 electric connections, the substrate of above-mentioned second and third preferred embodiments, optical mirror slip are all identical than embodiment with first with lens mount, so in this explanation no longer one by one.
By above-mentioned each preferred embodiment camera lens module of the present utility model as can be known, the wafer set 2 of the utility model camera lens module is the second surface 12 that is connected in substrate 1, and overall volume is dwindled.
In addition, the utility model be arranged on the circuit board mode as shown in Figure 5, be the utility model and control circuit board 70 connection diagrams, this wafer set 2 is the second surfaces 12 that are connected in substrate 1, make the module whole volume-diminished, and the lead-out terminal 121 that can be welded by substrate 1 second surface 12 is welded on the control circuit board 70, the part of module is stretched to be placed outside the circuit board 70, dwindled camera lens module taking up room on circuit board 70, reduce the plate body area of circuit board 70, reduce material cost.Can not take the configuration space of control circuit board 70, be caused making the area of control circuit board 70 to reduce relatively, to reach the purpose of microfilming device volume.
Above-listed detailed description is specifying at a possible embodiments of the present utility model, only this embodiment is not in order to limit claim of the present utility model, allly do not break away from the equivalence that the utility model skill spirit does and implement or change, all should be contained in the claim of this case.
Claims (5)
1. camera lens module structure-improved is characterized in that comprising:
One substrate, this substrate has first and second relative surface, form a plurality of input terminals on it, and at least one lead-out terminal that welds is positioned on the side of this second surface, and there is no the setting that can weld lead-out terminal on the relative opposite side of second surface, wherein the input terminal of this second surface with and this can weld lead-out terminal and electrically connect, and see through at least one conductive hole by this substrate, with the input terminal of first surface, and electrically connect;
One image sensing wafer, it is fixedly arranged on the first surface of substrate, and electrically connects with the input terminal of first surface;
One wafer set, it is fixedly arranged on the second surface of substrate, and is electrically connected with the input terminal of second surface;
One optical mirror slip; And
One lens mount, it is installed for optical mirror slip, and lens mount is bonding on the first surface of this substrate, makes this optical mirror slip be covered in this image sensing wafer top, in order to do transmitting optical signalling to this image sensing wafer.
2. by the described camera lens module structure-improved of claim 1, it is characterized in that this wafer set comprises a memory wafer and a control wafer, this wafer is to cover the second surface that crystal type is connected in substrate.
3. by the described camera lens module structure-improved of claim 1, it is characterized in that this wafer set comprises a memory wafer, and a control wafer, this wafer is the packaging body that encapsulation is finished.
4. by the described camera lens module structure-improved of claim 1, it is characterized in that the section of this lens mount becomes convex form, on it and be provided with a through hole.
5. by the described camera lens module structure-improved of claim 1, it is characterized in that the bottom periphery of this lens mount evenly is coated with one deck colloid, lens mount is cemented in the first surface of substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420092385 CN2725916Y (en) | 2004-09-15 | 2004-09-15 | Improved structure of lens module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420092385 CN2725916Y (en) | 2004-09-15 | 2004-09-15 | Improved structure of lens module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2725916Y true CN2725916Y (en) | 2005-09-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420092385 Expired - Fee Related CN2725916Y (en) | 2004-09-15 | 2004-09-15 | Improved structure of lens module |
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| Country | Link |
|---|---|
| CN (1) | CN2725916Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101675658B (en) * | 2007-09-27 | 2011-07-27 | Lg伊诺特有限公司 | Camera module |
| US8553142B2 (en) | 2008-10-30 | 2013-10-08 | Lite-On Electronics (Guangzhou) Limited | Camera lens module and manufacturing method thereof |
| JP2020502586A (en) * | 2016-12-23 | 2020-01-23 | ▲寧▼波舜宇光▲電▼信息有限公司 | Imaging module, circuit board assembly, manufacturing method, and electronic apparatus having imaging module |
| CN115514864A (en) * | 2021-06-04 | 2022-12-23 | 胜丽国际股份有限公司 | Solderless sensing lens |
| US11652132B2 (en) | 2017-04-01 | 2023-05-16 | Ningbo Sunny Opotech Co., Ltd. | Systems and methods for manufacturing semiconductor modules |
-
2004
- 2004-09-15 CN CN 200420092385 patent/CN2725916Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101675658B (en) * | 2007-09-27 | 2011-07-27 | Lg伊诺特有限公司 | Camera module |
| US8553142B2 (en) | 2008-10-30 | 2013-10-08 | Lite-On Electronics (Guangzhou) Limited | Camera lens module and manufacturing method thereof |
| JP2020502586A (en) * | 2016-12-23 | 2020-01-23 | ▲寧▼波舜宇光▲電▼信息有限公司 | Imaging module, circuit board assembly, manufacturing method, and electronic apparatus having imaging module |
| US11653079B2 (en) | 2016-12-23 | 2023-05-16 | Ningbo Sunny Opotech Co., Ltd. | Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module |
| US11652132B2 (en) | 2017-04-01 | 2023-05-16 | Ningbo Sunny Opotech Co., Ltd. | Systems and methods for manufacturing semiconductor modules |
| CN115514864A (en) * | 2021-06-04 | 2022-12-23 | 胜丽国际股份有限公司 | Solderless sensing lens |
| CN115514864B (en) * | 2021-06-04 | 2024-01-23 | 同欣电子工业股份有限公司 | Non-welding type sensing lens |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |