CN212113724U

CN212113724U - High-pixel image sensor packaging structure

Info

Publication number: CN212113724U
Application number: CN202020735356.0U
Authority: CN
Inventors: 白书磊; 顾华; 周芹
Original assignee: Kingwei Optical Suzhou Co ltd
Current assignee: Kingwei Optical Suzhou Co ltd
Priority date: 2020-05-07
Filing date: 2020-05-07
Publication date: 2020-12-08
Anticipated expiration: 2030-05-07

Abstract

The utility model discloses a high pixel image sensor packaging structure, include: the wire bonding golden finger is arranged on the substrate; the CMOS sensor is arranged in the middle of the substrate; and the capacitor and the motor driver wafer are arranged at the edge position of the substrate, and the motor driver wafer is connected with the bonding wire golden finger through a gold wire. The CMOS sensor is arranged on the substrate by using the driver wafer without BAG packaging in a glue fixing and gold wire welding mode, the design can effectively reduce the overall dimension of the high-pixel image sensor packaging structure, so that the designed motor driver wafer does not undergo SMT processing, and the CMOS sensor cannot be polluted even if the driver wafer is not isolated from the CMOS sensor by a baffle wall, thereby improving the product yield.

Description

High-pixel image sensor packaging structure

Technical Field

The utility model relates to an image sensor structure, especially a high pixel image sensor packaging structure.

Background

With the wide application of tablet computers and smart phones, the pixel requirements of consumers On cameras are higher and higher from 800 ten thousand pixels to 5000 ten thousand pixels at present, the Chip On Board (COB) packaging technology is used by more and more camera manufacturers due to the defects and bottlenecks of the Chip Scale Package (CSP) in the high-pixel CMOS image sensor packaging technology, the pixel points of the Chip are smaller and smaller with the improvement of the pixels, the requirement On the cleanliness of the COB packaging technology is higher and higher, the tiny falling dust falls On the Chip, the falling dust is infinitely amplified when the picture is generated due to the fact that the pixel points are smaller, and the picture has a black point which can be seen by naked eyes, so that the shot picture is defective and is difficult to accept by consumers. In order to solve the problems, technicians make many efforts, for example, the passive component capacitor and the motor driver are isolated from the chip by a bracket during design, so that the flux or tin explosion is prevented from directly polluting the surface of the chip due to thermal shock when the chip is subjected to high temperature; hundred-grade dust-free environmental standards are adopted in production, and strict control and the like are carried out on dirt during test shipment. With the increase of pixels, CMOS (Complementary Metal Oxide Semiconductor) chips become larger and smaller, and the package size is required to be smaller and smaller, so that it is difficult to separate the motor driver from the chips by using a bracket wall-blocking method when designing a high-pixel CMOS sensor because the motor driver has a large volume relative to the capacitor, and thus, when the product is subjected to thermal shock, the residual soldering flux of the soldering tin volatilizes or the soldering tin of the motor driver is exploded to the image area of the CMOS chip, so that the chip is polluted and is bad.

Therefore, in view of the above technical problems, there is a need for an improved high pixel image sensor package structure.

SUMMERY OF THE UTILITY MODEL

In view of this, an object of the present invention is to provide a high pixel image sensor package structure capable of effectively preventing the contamination to the image sensor and improving the package quality and yield.

In order to achieve the above object, an embodiment of the present invention provides the following technical solutions:

a high pixel image sensor package structure, comprising:

the wire bonding golden finger is arranged on the substrate;

the CMOS sensor is arranged in the middle of the substrate;

and the capacitor and the motor driver wafer are arranged at the edge position of the substrate, and the motor driver wafer is connected with the bonding wire golden finger through a gold wire.

As a further improvement of the present invention, the motor-driven wafer is attached to the substrate through glue.

As a further improvement of the present invention, the capacitor is connected to the substrate through solder.

As a further improvement of the utility model, the CMOS sensor pass through the glue paste adorn in the base plate, and with the nation's line golden finger passes through the gold thread and links to each other.

As a further improvement, the high-pixel image sensor package structure further comprises a support, the support covers on the substrate, and an accommodating vacancy is arranged at a position corresponding to the capacitor, the motor driver wafer and the CMOS sensor.

As a further improvement, the support corresponds the position of CMOS sensor is equipped with logical unthreaded hole, high pixel image sensor packaging structure still includes the light filter, the light filter attach in on the support, and with logical unthreaded hole position corresponds.

The utility model has the advantages that: compared with the traditional scheme that a driver wafer which is packaged into a BAG form is fixed on a substrate through glue and a CMOS sensor is welded on the substrate through solder paste in an SMT (Surface mount Technology) process, the design can effectively reduce the overall dimension of a high-pixel image sensor packaging structure, so that the designed motor driver wafer is not subjected to the SMT process, and the CMOS sensor cannot be polluted even if the wafer is not isolated from the CMOS sensor through a baffle wall, and the product yield is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is an exploded view of a high pixel image sensor package structure according to an embodiment of the present invention;

fig. 2 is a schematic diagram of an SMT mounting of a high pixel image sensor package according to an embodiment of the present invention.

Detailed Description

In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

Referring to fig. 1 and 2, a specific embodiment of the present invention discloses a high pixel image sensor package structure, including: the device comprises an optical filter 1, a support 2, a CMOS sensor 3, a capacitor 4, a substrate 5, a motor driver wafer 6, a wire bonding golden finger 7 and a golden wire 8.

Wherein, be equipped with nation line golden finger 7 on the base plate 5, the CMOS sensor is installed in the middle part position of base plate 5, and electric capacity 4 and motor driver wafer are installed in the border position of base plate 5, and the motor driver wafer links to each other through gold thread 8 with nation line golden finger 7. In this embodiment, the motor-driven wafer 6 is attached to the substrate 5 by glue.

The motor driver wafer 3 is arranged on the substrate 5 in a glue fixing and gold wire 8 welding mode, and the design can effectively reduce the overall dimension of the high-pixel image sensor packaging structure.

In the present embodiment, the capacitor 4 is connected to the substrate 5 by solder.

Preferably, the CMOS sensor is attached to the substrate 5 by glue, and is connected to the wire bonding gold finger 7 by a gold wire 8.

The high-pixel image sensor packaging structure further comprises a support 2, wherein the support 2 covers the substrate 5, and accommodating vacant positions are arranged at positions corresponding to the capacitor 4, the motor driver wafer and the CMOS sensor 3. The position of the support 2 corresponding to the CMOS sensor 3 is provided with a light through hole, the high-pixel image sensor packaging structure further comprises an optical filter 1, and the optical filter 1 is attached to the support 2 and corresponds to the light through hole.

The packaging of the high pixel image sensor of this embodiment generally includes the following steps: firstly, welding the capacitor 4 on the substrate 5, attaching the CMOS sensor 3 and the motor driver wafer 6 on the substrate 5, connecting the CMOS sensor 3 and the wire bonding golden finger 7 through a gold wire 8, connecting the motor driver wafer 6 and the wire bonding golden finger 7 through a gold wire 8, thereby respectively connecting the CMOS sensor 3 and the motor driver wafer 6 with the substrate, installing the support 2 on the surface of the substrate 5, and attaching the optical filter 1 on the support 2.

In the installation process, the CMOS sensor 3 is installed behind the capacitor 4 and the motor driver wafer 6, and the support 2 is installed immediately after the CMOS sensor 3 is pasted, so that soldering tin and welding beads of the capacitor 4 and the motor driver wafer 6 cannot enter the space where the CMOS sensor 3 is located, the cleaning of the CMOS sensor 3 is protected, and the packaging quality is improved.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A high pixel image sensor package structure, comprising:

the wire bonding golden finger is arranged on the substrate;

the CMOS sensor is arranged in the middle of the substrate;

2. The high pixel image sensor package of claim 1, wherein the motor drive wafer is attached to the substrate by glue.

3. The high pixel image sensor package of claim 1, wherein the capacitor is connected to the substrate by solder.

4. The high-pixel image sensor package structure of claim 1, wherein the CMOS sensor is attached to the substrate by glue and connected to the wire bond finger by a gold wire.

5. The high-pixel image sensor package according to claim 1, further comprising a support covering the substrate and having receiving voids at locations corresponding to the capacitors, the motor driver wafer, and the CMOS sensor.

6. The package structure of claim 5, wherein the support has a light hole at a position corresponding to the CMOS sensor, and the package structure further comprises a filter attached to the support and corresponding to the light hole.