CN1929144A - Image sensor and its packaging method - Google Patents
Image sensor and its packaging method Download PDFInfo
- Publication number
- CN1929144A CN1929144A CNA2005101024305A CN200510102430A CN1929144A CN 1929144 A CN1929144 A CN 1929144A CN A2005101024305 A CNA2005101024305 A CN A2005101024305A CN 200510102430 A CN200510102430 A CN 200510102430A CN 1929144 A CN1929144 A CN 1929144A
- Authority
- CN
- China
- Prior art keywords
- image sensor
- pin
- metallic support
- thermoplastics
- optical sensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000004806 packaging method and process Methods 0.000 title claims 6
- 229920001169 thermoplastic Polymers 0.000 claims description 25
- 239000004416 thermosoftening plastic Substances 0.000 claims description 25
- 230000003287 optical effect Effects 0.000 claims description 21
- 241000218202 Coptis Species 0.000 claims description 5
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 5
- 230000000295 complement effect Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims 1
- 239000004033 plastic Substances 0.000 abstract description 14
- 229920003023 plastic Polymers 0.000 abstract description 14
- 239000002184 metal Substances 0.000 abstract description 9
- 229910052751 metal Inorganic materials 0.000 abstract description 9
- 238000005538 encapsulation Methods 0.000 description 10
- 238000010276 construction Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 229910010293 ceramic material Inorganic materials 0.000 description 6
- 238000012856 packing Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
This invention relates to one method to process image sensor, which comprises the following steps: setting metal rack structure with certain number and shape leg on one metal board and covering shape rack with heat plastic shell wit sensor window; then setting light sensor chip into plastic shell connected to the lead leg; finally, covering sensor window by transparent board heat plastics shell to form the image sensor.
Description
Technical field
The encapsulation technology of the relevant a kind of image sensor of the present invention, the thermoplastics embedding that outstanding a kind of utilization of purport comprises or do not comprise the adhesive agent composition is penetrated and is being comprised or do not comprising image sensor package and the relevant method for packing of adhesive agent on the support of metal surface.
Background technology
Image sensor (Image Sensor) is widely used in digital camera as digital camera, PC Camera, Video Camera, mobile phone or PDA, saves photography from damage, automobile uses camera, biotechnology detects application, industrial detection system application etc., is considerable key part and component for image capture products; The image sensor (Image Sensor) that generally uses mainly is divided into CCD (Charge Coupled Device at present, photosensitive coupling component) and two kinds of CMOS (Complementary Metal-Oxide Semiconductor, complementary matal-oxide semiconductor).
Known image sensor encapsulation technology is to be provided with metal pin earlier below a flat substrate, and above substrate, be provided with the conductor that is electrically connected with pin in addition, multiple mode with sintering on substrate one of construction by housing that ceramic material was constituted, this housing is to be formed with a window at the top, so that optical sensing chip is placed in the middle of the housing, and use the routing mode that the weld pad on the optical sensing chip is electrically connected with the electric conductor of substrate, at last the light-passing board of a glass material is covered the window place of housing; So encapsulation technology at ceramic material composition, sintering temperature control and forming method, all has more condition restriction because use ceramic material, and all condition restriction may cause the principal element of fraction defective especially.
In addition, as TaiWan, China announce the Plastic Package framework that is used for the optical sensing chip encapsulation for No. 420865 and method patent of invention then be disclose a kind of on substrate moulding one plastic construction, optical sensing chip is placed among the plastic construction, and a light-passing board is covered on the plastic construction, make this chip be sealed in image sensor encapsulation technology in substrate and the plastic construction, it mainly is to encapsulate optical sensing chip with plastic construction and plastic base, solve that ceramic material can't reclaim, the ceramic material yield is lower, and ceramic material only can the monomer manufacturing etc. problem.
But, the below of its plastic base need be provided with metal spherical pin, and a plurality of metal conductors are set above plastic base, and spherical pin is at spherical dot matrix (EGA, BALL GRID ARRAY) pattern in the encapsulation technology, constitute with conductor and be electrically connected, so its integral body is processed into not only comparatively complicated loaded down with trivial details, forming exposure is to belong to thermoset plastics in order to the epoxidation plastic hybrid (Epoxy Mold Compound) that constitutes plastic construction, has the restriction of forming temperature equally.
Summary of the invention
The thermoplastics embedding that the encapsulation technology of a kind of image sensor of the present invention, its purpose are to provide a kind of utilization to comprise or do not comprise the adhesive agent composition is penetrated and is being comprised or do not comprising image sensor package and the relevant method for packing of adhesive agent on the support of metal surface.
In view of this, the present invention promptly is that pre-subpunch is provided with and possesses both determined number, pattern pin on a metal sheet, and look purposes and needing to determine whether adhesive agent to be attached to the metal surface, make the metallic support structure that becomes in order to the carrying optical sensing chip, be coated with thermoplastics housing at this metallic support place with ejection formation again with photosensitive window, this thermoplastics housing is and the pin tabling of metallic support that the raw material of this thermoplastics housing can comprise the adhesive agent composition; Again with the optical sensing chip fixation in the thermoplastics enclosure interior and be electrically connected on pin, cover with the photosensitive window of light-passing board at last the thermoplastics housing, constitute a kind of stay in grade and reduce the image sensor of manufacturing cost.
Description of drawings
Fig. 1 is an image sensor structure cutaway view of the present invention;
Fig. 2 is the encapsulation flow chart for image sensor among the present invention;
Fig. 3 is the completed state figure for metallic support among the present invention;
Fig. 4 is the completed state figure for thermoplastics housing among the present invention.
[figure number explanation]
10 image sensors, 123 recesses
11 metallic supports, 13 optical sensing chips
111 pins, 131 gold threads
12 thermoplastics housings, 14 light-passing boards
121 photosensitive windows, 20 printed circuit board (PCB)s
122 open-works
Embodiment
For the clear structure of the present invention of your auditor is formed, and the overall operation mode, cooperate graphic being described as follows now:
Image sensor of the present invention and method for packing thereof, its overall image sensor package structure are to be provided with a thermoplastics housing 12 on the metallic support 11 of an en plaque as shown in Figure 1; Wherein, metallic support 11 is one-body molded both pins 111 of determined number, form that have, the top of thermoplastics housing 12 is formed with a photosensitive window 121, fixations have optical sensing chip 13 (CMOS for example in the middle of thermoplastics housing 12, complementary matal-oxide semiconductor), and utilize gold thread 131 to constitute being electrically connected of optical sensing chips 13 and pin 111, and be coated with the light-passing board 14 of a glass material at photosensitive window 121, constitute a kind of image sensor 10 structures that can directly utilize pin 111 to be electrically connected with printed circuit board (PCB) 20.
Please cooperate simultaneously with reference to Fig. 2 to shown in Figure 4, the method for packing of whole image sensor 10 is earlier as shown in Figure 3, utilize punch process on a metallic plate, to form both pins 111 of determined number, form, make the metallic support 11 that becomes in order to carrying optical sensing chip (figure slightly), when implementing, can form a plurality of metallic supports 11 on the same metallic plate in advance to increase production capacity; Then as shown in Figure 4, utilize ejection formation processing that thermoplastics directly is coated on the metallic support 11 that forms pin 111 in advance, make and constitute thermoplastics housing 12 structures that the top is formed with photosensitive window 121 and is embedded mutually with pin 111, the nexine bottom surface of this thermoplastics housing 12 is provided with the open-work 122 that exposes for pin 11, and is provided with one in order to the recess 123 with the optical sensing chip location in the center of nexine bottom surface.
According to this, can be with the inside of optical sensing chip fixation in the thermoplastics housing, with reference to shown in Figure 1, and utilize the routing mode gold thread 131 to be connected between the pin 111 of optical sensing chip 13 and metallic support 11, with and optical sensing chip 13 is electrically connected on pin 111, last at photosensitive window 121 places that light-passing board 14 covered thermoplastics housing 12 tops, promptly finish the encapsulation procedure of image sensor 10, and be able on metallic plate, cut a plurality of image sensors of finishing encapsulation.
What deserves to be mentioned is, can be made in order to the metallic plate of making metallic support by copper or copper alloy, and after finishing the punch process of metallic support, further the metallic plate that forms metallic support is imposed and electroplate processing, make and be coated with NiPdAu (Ni-Pd-Au) alloy-layer on the metallic support, to increase the oxidation resistance and the conductivity of metallic support.
As mentioned above, the invention provides a preferable feasible image sensor structure and relevant method for packing thereof, so offer the application of novel patent in accordance with the law; Yet, above implementation and graphic shown in, be this creation preferred embodiment, be not to limit to this creation with this, be with, approximate, identical with the structure of this creation, device, feature etc. such as, all should belong to this creation found purpose and claim in.
Claims (11)
1, a kind of image sensor is characterized in that, includes:
A metallic support is provided with both pins of determined number, form;
A thermoplastics housing is coated on metallic support and is embedded with pin, and its top is provided with a photosensitive window;
An optical sensing chip, fixation be in the thermoplastics enclosure interior, and be electrically connected on pin;
A light-passing board covers the photosensitive window place of thermoplastics housing.
2, image sensor as claimed in claim 1 is characterized in that: the nexine bottom surface of this thermoplastics housing is provided with the open-work that exposes for pin.
3, image sensor as claimed in claim 1 or 2 is characterized in that: the nexine bottom center place of this thermoplastics housing is provided with in order to the recess with the optical sensing chip location.
4, image sensor as claimed in claim 1 is characterized in that: this optical sensing chip is to utilize gold thread to constitute to be electrically connected with pin.
5, image sensor as claimed in claim 1 is characterized in that: this light-passing board is a glass material.
6, image sensor as claimed in claim 1 is characterized in that: this optical sensing chip is complementary matal-oxide semiconductor.
7, a kind of video sensor packaging method is characterized in that, includes the following step:
Metallic support with pin is provided;
On metallic support, coat the thermoplastics housing that a top has photosensitive window;
The optical sensing chip fixation is electrically connected at the thermoplastics housing and with pin;
Light-passing board is covered the photosensitive window place.
8, a kind of video sensor packaging method as claimed in claim 7 is characterized in that: this metallic support is to utilize both pins of determined number, form of punch process moulding in advance.
9, a kind of video sensor packaging method as claimed in claim 7 is characterized in that: this thermoplastics housing is to utilize ejection formation to be coated on metallic support, and is embedded mutually with pin.
10, a kind of video sensor packaging method as claimed in claim 7 is characterized in that: this is to utilize the routing mode that gold thread is connected between the pin of optical sensing chip and metallic support.
11, a kind of video sensor packaging method as claimed in claim 7, it is characterized in that: this metallic support further imposes electroplating processes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005101024305A CN1929144A (en) | 2005-09-09 | 2005-09-09 | Image sensor and its packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005101024305A CN1929144A (en) | 2005-09-09 | 2005-09-09 | Image sensor and its packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1929144A true CN1929144A (en) | 2007-03-14 |
Family
ID=37859022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005101024305A Pending CN1929144A (en) | 2005-09-09 | 2005-09-09 | Image sensor and its packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1929144A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102564400A (en) * | 2010-12-17 | 2012-07-11 | 堡盟英诺泰克股份公司 | Shell-free sensor structure |
| CN106885589A (en) * | 2015-12-16 | 2017-06-23 | 原相科技股份有限公司 | Light with many sensing direction versatilities detects module |
| CN110089100A (en) * | 2016-12-30 | 2019-08-02 | 宁波舜宇光电信息有限公司 | Camera module and its molded case circuit board group part and manufacturing method and the electronic equipment with camera module |
| CN111312856A (en) * | 2020-02-24 | 2020-06-19 | 宁波飞芯电子科技有限公司 | Photosensitive chip packaging method and structure |
-
2005
- 2005-09-09 CN CNA2005101024305A patent/CN1929144A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102564400A (en) * | 2010-12-17 | 2012-07-11 | 堡盟英诺泰克股份公司 | Shell-free sensor structure |
| CN106885589A (en) * | 2015-12-16 | 2017-06-23 | 原相科技股份有限公司 | Light with many sensing direction versatilities detects module |
| CN106885589B (en) * | 2015-12-16 | 2020-03-06 | 原相科技股份有限公司 | Light detection module with multiple sensing direction universality |
| CN110089100A (en) * | 2016-12-30 | 2019-08-02 | 宁波舜宇光电信息有限公司 | Camera module and its molded case circuit board group part and manufacturing method and the electronic equipment with camera module |
| CN111312856A (en) * | 2020-02-24 | 2020-06-19 | 宁波飞芯电子科技有限公司 | Photosensitive chip packaging method and structure |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |