CN106483611A - Light-receiving assembly and optical transceiver module - Google Patents
Light-receiving assembly and optical transceiver module Download PDFInfo
- Publication number
- CN106483611A CN106483611A CN201510943215.1A CN201510943215A CN106483611A CN 106483611 A CN106483611 A CN 106483611A CN 201510943215 A CN201510943215 A CN 201510943215A CN 106483611 A CN106483611 A CN 106483611A
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- light
- optical
- receiving assembly
- chip
- receiving
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
- G02B6/4261—Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention provides a kind of light-receiving assembly and optical transceiver module.Optical transceiver module includes substrate, light-receiving assembly and multiple closed type light emission component.Light-receiving assembly includes shell body and light-receiving chip, and light-receiving chip is disposed in shell body, and light-receiving chip includes chip substrates, optical receiver and location hole.The relative the first base material surface of chip substrates tool and the second substrate surface, optical receiver is disposed on the first base material surface of chip substrates, and location hole is formed on the second substrate surface of chip substrates, and is pointed to optical receiver.
Description
【Technical field】
The present invention relates to a kind of optical transceiver module and Connectorized fiber optic cabling module, more particularly to
A kind of compact optical module being related to high-density installation.
【Background technology】
Demand currently for computing device persistently rises, and reaches even for computing device
To superior performance demand also in lifting.However, traditional electrical I/O (input/defeated
Go out) signal transmission and invariably expected can and the demand that performance is increased, especially for
The expectation of following high-performance calculation is gone forward side by side in step.Now, I/O signal is by circuit board
Electrically transmit to and fro from processor and be outwards delivered to peripheral device.Electrical signals are required
Through solder joints, cable and other electrical conductors.Therefore, electrical I/O signal rate
Can be limited by the electric characteristics institute of electric connector.
Traditional telecommunication transmission systems are gradually replaced by fibre-optic transmission system (FOTS).Fiber-optic transfer
System limits due to not having bandwidth, has high-speed transfer, transmission range length, material
The advantages of be not subject to Electromagnetic Interference, therefore, how current electronic industry is towards the side of fiber-optic transfer
To being researched and developed.
Although use to have for the connection transmission of optical profile type in computing device continuing to increase,
But need special processing currently used for the component used by optical signal transfer, therefore increase system
Cost and complexity that controlling is made.For example, in recent years it is desirable to the optical mode such as optical transceiver
The further miniaturization of block.However, because substrate area reduces, so the height of part
Density is installed becomes difficult.
【Content of the invention】
Present invention is primarily targeted at providing a kind of optical transceiver module, described optics is received
Send out module to include：
Substrate has relative first surface and second surface；And
Light-receiving assembly, is connected to described substrate；And
Multiple closed type light emission components, are arranged on described substrate, described in each of which
Closed type light emission component includes optical transmitting set, and described optical transmitting set is fully to be sealed in
In one or more closed type housings.
Another object of the present invention is to providing a kind of Connectorized fiber optic cabling module, described fiber optic cable
Wire module includes：
Connectorized fiber optic cabling；And
Optical transceiver module, including:
Substrate has relative first surface and second surface；And
Light-receiving assembly, is connected to described substrate；And
Multiple closed type light emission components, are arranged on described substrate, each of which
Described closed type light emission component includes optical transmitting set, and described optical transmitting set is complete
Be sealed in one or more closed type housings.
In one embodiment of this invention, the plurality of closed type light emission component is arrangement
On the first surface of described substrate or the side of described substrate.
In one embodiment of this invention, described optical transceiver module also includes keeper,
For positioning and fixing the plurality of closed type light emission component is in the first of described substrate
On the side of surface or described substrate.
In one embodiment of this invention, described keeper includes multiple recesses and draw-in groove,
Multiple recesses are for the corresponding accommodating and multiple closed type light emission components of positioning, card
Groove is for engaging and fixing this multiple closed type light emission component in substrate.
In one embodiment of this invention, the plurality of closed type light emission component is parallel
It is arranged in side by side on the first surface of described substrate.
In one embodiment of this invention, each the plurality of closed type light emission component is also
Including tubular elements, at least a portion of each described tubular elements protrudes from the one of described substrate
End, described light-receiving assembly is affixed to the side (lower section) of described tubular elements.
In one embodiment of this invention, the outer surface of tubular elements is provided with least one outer shroud
Portion, for being placed in the draw-in groove of keeper.
In one embodiment of this invention, described light-receiving assembly be by flexible base plate Lai
It is connected to the circuit on the second surface of described substrate.
In one embodiment of this invention, the plurality of closed type light emission component be for
Connect four optical-fibre channels (Channel), to meet QSFP28, QSFP+ or Micro
The requirement of QSFP+.
In one embodiment of this invention, the size of described substrate is to meet QSFP28,
The requirement of QSFP+ or Micro QSFP+.
In one embodiment of this invention, in one embodiment, the width of substrate is about
11～18mm, in another embodiment, the width of substrate can be only about 11.5～17mm.
In one embodiment, the length of substrate is about 58～73mm, in another embodiment,
The length of substrate can be only about 63～73mm.
In one embodiment, the width of shell body is about 13～20mm, in another enforcement
In example, the width of shell body can be only about 13.5～19mm.In one embodiment, shell
The length of body is about 60～75mm, and in another embodiment, the length of shell body can be only
It is about 65～75mm.
In one embodiment of this invention, each the plurality of closed type light emission component
Seal degree meets industrial use TO (Transmitter Optical Sub-Assembly)
Or the airtight requirement of Butterfly type package.
In one embodiment of this invention, each the plurality of closed type light emission component
Seal degree is between 1x10-12(atm*cc/sec) with 5x 10-7(atm*cc/sec)
Between.
In one embodiment of this invention, each the plurality of closed type light emission component
Seal degree is between 1x 10-9(atm*cc/sec) with 5x 10-8(atm*cc/sec)
Between.
In one embodiment of this invention, described light-receiving assembly connects for the light of non-tight type
Receive assembly.
In one embodiment of this invention, described light-receiving assembly is one or more sealings
The light-receiving assembly of type.
In one embodiment of this invention, described light-receiving assembly is affixed to the of substrate
On two surfaces.
In one embodiment of this invention, described light-receiving assembly directly can be sealed by chip
Dress (chip on board) mode is being fixed.
In one embodiment of this invention, described closed type light emission component is also included at least
One fiber orientation spring, described fiber orientation spring is disposed on the plurality of closed type light
One end of emitting module, to guarantee between the plurality of closed type light emission component and optical fiber
Connection.
In one embodiment of this invention, closed type light emission component also includes at least one
Fiber orientation spring and spring mountings.Fiber orientation spring is to be arranged in correspondence with tubular
One end of part, and be fixed in spring mountings.
In one embodiment of this invention, spring mountings can be for living near one end of optical fiber
Dynamic formula, by the elastic force of fiber orientation spring, optical fiber can be allowed to be close proximity to tubular elements,
Accordingly ensure that the connection between optical fiber and closed type light emission component and positioning.
In one embodiment of this invention, each the plurality of closed type light emission component is also
Including tubular elements, described fiber orientation spring is disposed on one end of described tubular elements, light
Fibre is to be connected to described tubular elements through described fiber orientation spring.
In one embodiment of this invention, fiber orientation spring is to be arranged in correspondence with tubular
One end of part, and be fixed in spring mountings.
In one embodiment of this invention, the light-receiving assembly of non-tight type can pass through chip
Directly packaged type is being fixed on the ledge of tubular elements and the lower section of spring mountings.
In one embodiment of this invention, the plurality of closed type light emission component is multiple
Optical transmitting set is to be sealed in described single closed type housing.
In one embodiment of this invention, described single closed type housing is a L-shaped housing
And there is recess, optical fiber is to be connected to described light-receiving assembly through described recess.
In one embodiment of this invention, the plurality of closed type light emission component is in L
Shape arranges, and optical fiber is to arrange connecting through the L-shaped of the plurality of closed type light emission component
It is connected to described light-receiving assembly.
In one embodiment of this invention, closed type light emission component is disposed on substrate
One end, light-receiving assembly may be disposed on the first surface of substrate.
In one embodiment of this invention, described substrate has a recess, and L-shaped.
At least part of the plurality of closed type light emission component is in described recess, and electricity
Property is connected to the circuit on the second surface of described substrate.
In one embodiment of this invention, multiple closed type light emission components of part are to set
Put in the recess of substrate, other multiple closed type light emission components are the of setting substrate
On one surface, light-receiving assembly is on the first surface of setting substrate, and is located at recess
Side.
In one embodiment of this invention, light-receiving assembly may include shell body and light-receiving
Chip, light-receiving chip is disposed in shell body, and light-receiving chip may include chip base
Material, optical receiver and location hole.The relative the first base material surface and second of chip substrates tool
Substrate surface, optical receiver is disposed on the first base material surface of chip substrates, location hole
It is formed on the second substrate surface of chip substrates, and be pointed to optical receiver.When outer
When the positioning in the hole on the second substrate surface is inserted in one end of portion's optical fiber, one end of optical fiber can
The optical receiver that is directly pointed on the first base material surface is so that the light that sent of fiber cores
Signal directly can reach optical receiver via chip substrates.
In one embodiment of this invention, in order to reduce not expected light reflection, optical fiber
Angle between one end grain and fiber cores is smaller than 90 degree, that is, is sent out by this tangent plane
Angle between the light going out and tangent plane is smaller than 90 degree, anti-to reduce not expected light
Penetrate.
In one embodiment of this invention, optics adhesion material is to be filled in location hole and light
Space between fibre, the refractive index of optics adhesion material can matching chip base material and optical fiber
Refractive index, to reduce not expected light reflection or to reflect.
In one embodiment of this invention, the refractive index of optics adhesion material can matching chip
Between base material and the refractive index of optical fiber.The refractive index of such as optics adhesion material can be
1.2～3.5.In another embodiment, the refractive index of optics adhesion material can be 1.5～3.3.
In one embodiment of this invention, optical fiber can be provided with positioned at one end of positioning in the hole
Mirror assembly, that is, at least part of lens subassembly can be located at positioning in the hole, for improving
The optical effect of light.
In one embodiment of this invention, positioning in the hole has a convex face corresponding to optical fiber
One end, in this, convex surface can have functions that concavees lens, for light is concentrated on light
Receptor.
In one embodiment of this invention, light-receiving chip may include chip substrates, many
Individual optical receiver and multiple location hole.Multiple optical receivers are in the first base material surface,
And form optical receiver array.Multiple location holes are formed on the second substrate surface, and
Correspond respectively to optical receiver.
Compared to the problem of existing optical transceiver module, the optical transceiver module of the present invention
Configurable and encapsulate multiple closed type light emission components and light-receiving assembly is small-sized in one
In optical transceiver module, realize the miniaturization of optical transceiver module.
It is that the above of the present invention can be become apparent, cited below particularly be preferable to carry out
Example, and coordinate institute's accompanying drawings, it is described in detail below：
【Brief description】
Fig. 1 is the side of an embodiment of the system using optical cable module of the present invention
Block figure；
Fig. 2 to Fig. 5, it is the schematic diagram of an embodiment of optical transceiver module of the present invention；
Fig. 6 is the schematic diagram of an embodiment of light emission component of the present invention and keeper；
Fig. 7 is the schematic diagram of an embodiment of keeper of the present invention；
Fig. 8 A to Fig. 8 B is the schematic diagram of an embodiment of optical transceiver module of the present invention；
Fig. 9 is the schematic diagram of an embodiment of optical transceiver module of the present invention；
Figure 10 to 12 is the schematic diagram of an embodiment of light-receiving chip of the present invention；
Figure 13 is the schematic diagram of an embodiment of light-receiving chip of the present invention；
Figure 14 is the schematic diagram of an embodiment of light-receiving chip of the present invention；
Figure 15 is the schematic diagram of an embodiment of light-receiving chip of the present invention；
Figure 16 is the schematic diagram of an embodiment of light-receiving chip of the present invention；And
Figure 17 is the schematic diagram of an embodiment of light-receiving chip of the present invention.
【Specific embodiment】
The explanation of following embodiment is with reference to additional schema, can in order to illustrate the present invention
In order to the specific embodiment implemented.The direction term that the present invention is previously mentioned, for example " on ",
D score, "front", "rear", "left", "right", " interior ", " outward ", " side " etc., only
It is the direction with reference to annexed drawings.Therefore, the direction term of use is to illustrate and manage
The solution present invention, and be not used to limit the present invention.
Accompanying drawing and explanation are considered inherently illustrative rather than restricted.
In in figure, the similar unit of structure is to be represented with identical label.In addition, in order to understand and
It is easy to describe, the size of each assembly shown in accompanying drawing and thickness arbitrarily illustrate,
But the invention is not restricted to this.
In the accompanying drawings, for clarity, layer, film, panel, region etc. are exaggerated
Thickness.In the accompanying drawings, in order to understand and be easy to describe, some layers and region are exaggerated
Thickness.It will be appreciated that ought the assembly of such as layer, film, region or substrate be referred to as
" " another assembly " on " when, described assembly can be directly in described another assembly
On, or can also there is intermediate module.
In addition, in the description, unless explicitly described as contrary, otherwise word " bag
Include " will be understood as meaning including described assembly, but it is not excluded for any other assembly.
Additionally, in the description, " above " mean above target element or
Lower section, and be not intended to must be positioned at based on the top of gravity direction.
Refer to Fig. 1, Fig. 1 is can be wherein using the one of an optical cable module 100
The block chart of one embodiment of system.The optical cable module 100 of the present embodiment may include light
Learn transceiver module 110 and Connectorized fiber optic cabling 130, for transmission signal (video signal video or
Data data) to electronic installation 101.Electronic installation 101 can be many computings or aobvious
Any one of showing device, it includes but is not limited to data center, desktop or knee joint
Laptop computer, notebook computer, ultrathin pen electricity, tablet PC, little pen be electric,
Or other arithmetic unit.In addition to arithmetic unit, it is understood that, many other
The electronic installation of type can comprise one or more description optical transceiver module in this article
110 and/or coupling port 102, and describe embodiment in this article and can equally apply
On these electronic installations.The example of these other electronic installations may include handheld apparatus,
Intelligent mobile phone, media apparatus, personal digital assistant (PDA), be out of the line dynamic individual calculus
Machine, mobile phone, multimedia device, memory device, photographing unit, recorder, I/O
Device, server, Set Top Box, printer, scanner unit, monitor, TV are mechanical, electrical
Sub- billboard, scialyscope, amusement control unit, portable music player, numeral are taken the photograph
Shadow machine, Internet device, game station, game host or any can include this optics
Transceiver module 110 and/or other electronic installations of coupling port 102.Implement other
In example, this electronic installation 101 can be the electronics dress of any other processing data or image
Put.
Connectorized fiber optic cabling 130 is connected to optical transceiver module 110, for transmitting optics letter
Number.Connectorized fiber optic cabling 130 may include at least one or more fiber cores, for allowing optics to believe
Number optical fiber in-core transmission.
As shown in figure 1, electronic installation 101 may include processor 103, it can represent appoints
What type process electrically and/or optics I/O signal process assembly.It will be appreciated that
This processor 103 can be a single treatment device, or multiple separate device.Herein
Reason device 103 may include or can be a microprocessor, can program logic device or array,
Microcontroller, signal processor or some combinations.
As shown in figure 1, the coupling port 102 of electronic installation 101 is for use as a boundary
Face, to connect to the optical transceiver module 110 of optical transceiver module 100.Optical transmitting and receiving
Module 110 can allow another peripheral device 105 and electronic installation 101 to be connected with each other.This
The optical transceiver module 110 of embodiment can support the communication via an optical interface.Each
Plant in embodiment, optical transceiver module 110 also can be supported logical through an electrical interface
Letter.
As shown in figure 1, this peripheral device 105 can be a peripheral I/O device.Each
Plant in embodiment, peripheral device 105 can be any one of multiple arithmetic units,
It includes but is not limited to desktop or laptop computer, notebook computer, ultrathin type
Pen electricity, tablet PC, little pen electricity or other arithmetic unit.Except arithmetic unit it
Outward, it is understood that, peripheral device 105 may include handheld apparatus, intelligent handss
Machine, media apparatus, personal digital assistant (PDA), be out of the line dynamic personal computer, movement
Phone, multimedia device, memory device, photographing unit, recorder, I/O device, clothes
Business device, Set Top Box, printer, scanner unit, monitor, television set, electronic bill-board,
Scialyscope, amusement control unit, portable music player, digital camera, online
Device, game station, game host or other electronic installations.
In one embodiment, electronic installation 101 may also comprise the optical path of inside.This
Optical path can represent one or more assemblies, and it may include in processor 103 and port
Transmit the process of an optical signalling between 102 and/or terminate assembly.Transmit a signal system
May include generation and change to optical or receive and change to electrical.In an embodiment
In, device also includes electrical path.Electrical path represents at processor 103 and port 102
Between transmit one or more assemblies of a signal of telecommunication.
As shown in figure 1, optical transceiver module 110 can be used for correspondence connects electronic installation
101 coupling port 102.In the present embodiment, by a connector plug and another one
Connect and can be used to provide a mechanical type to connect.A connector plug and another one are joined
Connect and communication connection is often also provided.This coupling port 102 may include a case 104, and it can
This mechanical type bindiny mechanism is provided.This coupling port 102 also may include one or more light educational circles
Surface member.Path 106 can represent one or more components, and it may include for transmitting light news
Number (or light signal and electric signal) process between processor 103 and coupling port 102 and
/ or terminate component.Transmitting signals may include and produce and be converted into light signal or receive simultaneously
It is converted into electric signal.
As shown in figure 1, the optical transceiver module 110 of the present invention is referred to alternatively as optics connecting
Device or optic splice.In general, this optical conenctor can be used for providing and a coupling
Adapter and the entity linkage interface that connects of an optical module phase boundary.This optical transceiver module
110 can be a photo engine, for producing light signal and/or receiving and locate Ricoh's signal.
Optical transceiver module 110 can be provided from electricity-to-optical signal or from the light-to-signal of telecommunication
Conversion.
In one embodiment, optical transceiver module 110 can be used in accordance with or according to one or many
Plant this grade light signal of communication protocol processes.Optical transceiver module 110 is used for transmitting one
For the embodiment of light signal and an electric signal, optical interface and electrical interface can be according to phases
Same agreement, but this is not strictly necessary.Though optical transceiver module 110 be according to
According to the agreement at electrical I/O interface, or to process news according to a different agreement or standard
Number, optical transceiver module 110 all can for the agreement of one expected (intended) quilt
Construction or sequencing are in a specific module, and different transceiver modules or photo engine can
It is constructed for different agreements.
Refer to Fig. 2 to Fig. 5, it is an embodiment of optical transceiver module of the present invention
Schematic diagram.This optical transceiver module 110 includes substrate 111, processor 112, multiple
Closed type (hermetic) light emission component 113, light-receiving assembly 114, adapter 115
And shell body 116.Substrate 111 has relative first surface 111a and second surface
111b, substrate 111 is, for example, printed circuit board (PCB) (PCB) or ceramic substrate, and may include
Such as pin or connected ball, are used for interfacing with to an external device (ED).Processor 112 is to connect
In substrate 111, processor 112 can be any kind of processor crystal grain or optical IC,
Rather than it is limited to arbitrary specific processor type.Closed type light emission component 113 and light
Receiving unit 114 is coupled to the processor 112 on substrate 111, is respectively used to launch
And reception optical signal.Closed type light emission component 113 and light-receiving assembly 114 may include
The radiating circuit of transmission electronic signal and receiving circuit, in particular, are to process to correspond to
The sequential of the electronic signal of optical signal or the item of other agreement aspect.
In the present embodiment, optical transceiver module 110 can for example be applied to four optical-fibre channels
The technology of parallel transmission (Parallel Single Mode 4 lane, PSM4), it is
Via multiple closed type light emission components 113 respectively by four lasing light emitter different wave lengths
Light imports in optical fiber, in being carried out by optical fiber, the transmission of distance.Light-receiving assembly
114 can receive optical signal, and the optical signal processing can be directed to different lead to respectively
Road.So not limited to this, optical transceiver module 110 in addition to the technology of application PSM4, also
Can be applicable to wavelength divided multitask (WDM), two phase offset modulation (Binary
Phase Shift Keying, BPSK), four phase offset modulation (Quadrature
Phase Shift Keying, QPSK), thick formula wavelength division multitask conversion
(Conventional/Coarse Wavelength Division Multiplexing,
CWDM) high density partial wave multitask (Dense Wavelength Division
Multiplexing, DWDM), optical access multitask (Optical Add/Drop
Multiplexer, OADM), adjustable optical access multitask (Reconfigurable
Optical Add/Drop Multiplexer, ROADM) or this correlation optical communication of class
Technology.
As shown in Figures 2 to 5, adapter 115 can provide reset to mechanism to cross
Optical fiber (not shown) is changing optical transceiver module 110 and some outside object (examples
As another device) between light.For example, adapter 115 can by reflecting surface Lai
There is provided optical signal reset to.The angle of adapter 115, stock size and shape system take
Certainly in the wavelength of light, and it is used for manufacturing the material of bonder and the requirement of whole system.
In one embodiment, adapter 115 may be designed to provide the vertical light from substrate 111
Reset with the horizon light reaching substrate 111 to.
Additionally, the size of adapter, shape and configuration are relevant with this standard, it includes using
The tolerance connecting in corresponding adapter.Therefore, adapter is used for integrating optics I/O group
The layout (layout) of part can be different because of various standard.Art technology person can
It is understood by, optical interface needs aiming line (line-of-sight) to connect, in order to have
There are one and the light signal transmitter (both are all referred to alternatively as lens) that connects of receptor circle.Cause
This, the configuration of adapter will make lens will not be blocked by corresponding electrical contact assembly
Live.For example, optical interface lens may be disposed at this grade contact unit side or on
Side or lower section, end is depending on free space in this adapter.
In the present embodiment, adapter 115 can be MPO (Multi-Fibre Push On)
Specification, optical fiber can be with the man-to-man docking of multichannel mode.In an embodiment
In, available CWDM/WDM system, and the step via light splitting, solution light splitting, to reach
Specification demands to LR4.
As shown in Fig. 2 shell body 116 is for protection and assembling substrates 111, processes
Device 112, multiple closed type light emission component 113, light-receiving assembly 114 and adapter
115.In other embodiments, optical transceiver module 110 may also include planar light-ripple core
Piece (PLC) and modulator.Planar light-ripple chip can be the transmission of light and its be converted into electronics
Signal provides the integrated assembly of a plane, and vice versa.It is understood that planar light
The function of-ripple chip (PLC) can also be integrated in adapter 115.
Refer to Fig. 5 to Fig. 7, Fig. 6 is the one of light emission component of the present invention and keeper
The schematic diagram of embodiment, Fig. 7 is the schematic diagram of an embodiment of keeper of the present invention.?
In the present embodiment, multiple closed type light emission components 113 can spread configuration in the of substrate
On one surface 111a, for example multiple (as 4) closed type light emission component 113 can be put down
Row is arranged on the first surface 111a of substrate 111 side by side.In one embodiment,
Optical transceiver module 110 may also include keeper 117, for positioning and to fix this multiple
On closed type light emission component 113 111a on the first surface of substrate 111, to tie up
Hold the performance losses engaging between optical-fibre channel and light transmitting-receiving subassembly and reliability.Specifically
Ground, keeper 117 may be disposed on the first surface 111a of substrate 111, and positions
Part 117 may include multiple recess 117a and draw-in groove 117b, and multiple recess 117a are to use
In the corresponding accommodating and multiple closed type light emission components 113 of positioning, draw-in groove 117b
It is for engaging and fixing this multiple closed type light emission component 113 in the of substrate 111
On 111a on one surface.
As shown in fig. 6, each closed type light emission component 113 includes optical transmitting set 113a,
And optical transmitting set 113a is fully to be sealed in one or more closed type housing 113b
Interior, that is, the optical transmitting set 113a in closed type light emission component 113 can't contact
External environment condition to outside closed type light emission component 113 or air, to avoid light to launch
Device 113a component aging it is ensured that the assembly property of optical transmitting set 113a, significantly prolong
The service life of long assembly.Wherein, the seal degree of closed type light emission component 113 is
Meet industrial use TO (Transmitter Optical Sub-Assembly) type envelope
The airtight requirement of dress.For example, the sealing journey of each multiple closed type light emission component 113
Degree can be 1x 10-12～5*10-7 (atm*cc/sec).In one embodiment, more
Specifically, the seal degree of each multiple closed type light emission component 113 can be 1x
10-9～5x 10-8 (atm*cc/sec).
In various embodiments, the optical transmitting set 113a of closed type light emission component 113
The wavelength of the optical signal being sent can be located near infrared light to the scope of infrared light, about
830 nanometers of (nm)～1660 nanometer.Optical transmitting set 113a can be for believing for being suitable to generation light
Number any one type laser chip (such as edge-emitting laser device, FP/DFB/EML
Laser, or Vertical Cavity Surface light emitting-type laser, VCSEL).
As shown in FIG. 6 and 7, in the present embodiment, closed type light emission component 113
Also include closed type housing 113b and tubular elements 113c.Optical transmitting set 113a can be direct
It is sealed in closed type housing 113b, and there is no the gap exposed, to guarantee closed type
The sealing of light emission component 113.In the present embodiment, closed type housing 113b example
As for cylinder type shell.Tubular elements 113c is disposed on the side of closed type housing 113b,
And can be placed in the recess 117a of keeper 117.Sent by optical transmitting set 113a
Optical signal can conduct to optical fiber via tubular elements 113c.The appearance of tubular elements 113c
Face is provided with least one outer portion 113d, for being placed in the draw-in groove 117b of keeper 117
Interior.The inside of tubular elements 113c can be provided with coupling optical lens (not shown), such as convex lenss
Or sphere lenses, for by the optical signal emitted by optical transmitting set 113a via tubular elements
113c coupling light is to external fiber.
In one embodiment, as shown in Figures 5 and 6, closed type light emission component 113
Also include at least one fiber orientation spring 113e and spring mountings 113f.Optical fiber is fixed
Position spring 113e is to be arranged in correspondence with one end of tubular elements 113c, and is fixed on spring
In fixture 113f, outside optical fiber can for example pass through fiber orientation spring 113e to connect
It is connected to tubular elements 113c.Therefore, fiber orientation spring 113e can ensure that optical fiber firmly
It is connected to the tubular elements 113c of closed type light emission component 113, to maintain optical-fibre channel
And light transmitting-receiving subassembly engage performance losses and reliability.Specifically, spring mountings
113f can be movable near one end of optical fiber, by fiber orientation spring 113e's
Elastic force, can allow optical fiber to be close proximity to tubular elements 113c, accordingly ensure that optical fiber and closed type
Connection between light emission component 113 and positioning.
In the present embodiment, at least a portion of tubular elements 113c can project or exceed
One end of substrate 111, and light-receiving assembly 114 is securable to the prominent of tubular elements 113c
Go out the side (lower section) of part, and at least a portion of keeper 117 can project or exceed
In one end of substrate 111, more securely to fix the ledge of tubular elements 113c.
Specifically, the light-receiving assembly 114 of non-tight type can pass through chip direct package (chip
On board) mode to be being fixed on ledge and the spring mountings of tubular elements 113c
The lower section of 113f.So, closed type light emission component 113 can be arranged in substrate 111
First surface 111a, and light-receiving assembly 114 is securable under tubular elements 113c
Side, without on the first surface 111a being arranged at substrate 111, thus can reduce base
The width of plate 111.Furthermore, because light-receiving assembly 114 is securable to tubular elements 113c
Lower section, without on the second surface 111b being arranged at substrate 111, thus can subtract
The integral thickness of few optical transceiver module 110.In this embodiment, light-receiving assembly
The 114 second surface 111b that can be connected to substrate 111 by a flexible base plate 118
On circuit, to be electrically connected to processor 112.
So not limited to this, in one embodiment, light-receiving assembly 114 be alternatively one or
The light-receiving assembly of multiple closed types.In another embodiment, light-receiving assembly 114
Substrate 111 can be fixed on by chip direct package (chip on board) mode
On second surface 111b.
In the present embodiment, the size of each multiple closed type light emission component 113 and base
The size of plate 111 can be for meeting QSFP28, the requirement of QSFP+ or Micro QSFP+
Design.For example, in one embodiment, the width of substrate 111 is about 11～18mm,
In another embodiment, the width of substrate 111 can be only about 11.5～17mm.Real one
Apply in example, the length of substrate 111 is about 58～73mm, in another embodiment, base
The length of plate 111 can be only about 63～73mm, to meet the requirement of QSFP+ or QSFP28.
Therefore, by the configuration of closed type light emission component 113 and light-receiving assembly 114,
Can by the light-receiving assembly 114 of multiple closed type light emission components 113 and non-tight type
Configure and be packaged in a small-sized optical transceiver module 110, realize optical transceiver module
Miniaturization.
For example, in one embodiment, the width of shell body 116 is about 13～20mm,
In another embodiment, the width of shell body 116 can be only about 13.5～19mm.One
In embodiment, the length of shell body 116 is about 60～75mm, in another embodiment,
The length of shell body 116 can be only about 65～75mm.Therefore, positively realize optics to receive
Send out the miniaturization of module.
Refer to Fig. 8 A to Fig. 8 B, it is an embodiment of optical transceiver module of the present invention
Schematic diagram.In one embodiment, multiple light of multiple closed type light emission components 213
Emitter optical transmitting set 113a also salable in single closed type housing 213b.?
In this embodiment, this single closed type housing 213b for a L-shaped housing and can have recessed
Portion 213g, optical fiber may pass through the recess 213g of closed type housing 213b to be connected to light
Receiving unit 214.Specifically, in this embodiment, closed type light emission component 213
It is disposed on one end of substrate 111, light-receiving assembly 214 may be disposed at substrate 111
On first surface 111a.So, can be by multiple closed type light emission components 213 and non-
The light-receiving assembly 214 of closed type can configure and is packaged in a small-sized optical transmitting and receiving mould
In block 110, realize the miniaturization of optical transceiver module.
In other embodiments, multiple closed type light emission components also can L-shaped arrange,
Optical fiber is to arrange being connected to light-receiving through the L-shaped of multiple closed type light emission components
Assembly 214.
Refer to Fig. 9, it is the schematic diagram of an embodiment of optical transceiver module of the present invention.
In one embodiment, substrate 311 can have a recess 311c, and L-shaped.At least
Partial multiple closed type light emission components 313 are in the recess 311c of substrate 311
Interior, and it is electrically connected at the circuit on the second surface 111b of substrate 311.Specifically,
In this embodiment, multiple (such as 2) closed type light emission component 313 of part is
In the recess 311c of setting substrate 311, other multiple (such as 2) closed type light
Emitting module 313 is light-receiving assembly on the first surface 111a of setting substrate 311
314 is on the first surface 111a of setting substrate 311, and is located at the one of recess 311c
Side.So, can be by the light-receiving of multiple closed type light emission components 313 and non-tight type
Assembly 314 can configure and is packaged in a small-sized optical transceiver module 110, realizes light
Learn the miniaturization of transceiver module.
Refer to Figure 10 to 12, it is showing of an embodiment of light-receiving chip of the present invention
It is intended to.In one embodiment, light-receiving assembly 114 may include shell body (not shown)
And light-receiving chip 114b, light-receiving chip 114b is disposed in shell body, and light connects
Receive chip 114b and may include chip substrates 114c, optical receiver 114d and location hole
114e.The relative the first base material surface 114f of chip substrates 114c tool and the second base material table
Face 114g, optical receiver 114d are disposed on the first base material table of chip substrates 114c
On the 114f of face, and the first base material surface 114f can form circuit 114h, to be connected to
Optical receiver 114d.Location hole 114e is formed at the second base of chip substrates 114c
On the 114g of material surface, and location hole 114e is to be pointed to optical receiver 114d to be formed.
The maximum gauge W of location hole 114e can be more than or equal to one end of external fiber 131
Diameter, the one end for external fiber 131 can be inserted directly in location hole 114e.When
When one end of external fiber is inserted in the location hole 114e on the second substrate surface 114g,
The fiber cores 132 of optical fiber 131 can be pointed to the light-receiving on the 114f of the first base material surface
Device 114d is so that the optical signal that fiber cores are sent can be directly via chip substrates 114c
To reach optical receiver 114d.
Refer to Figure 13, it is the schematic diagram of an embodiment of light-receiving chip of the present invention.
In one embodiment, in order to reduce not expected light reflection, an end grain of optical fiber 131
Angle, θ between 233 and fiber cores 132 is smaller than 90 degree, that is, by this tangent plane 233
Angle, θ between the light being sent and tangent plane 233 is smaller than 90 degree, to reduce not
Expected light reflection.
Refer to Figure 14, it is the schematic diagram of an embodiment of light-receiving chip of the present invention.
In one embodiment, one end that optical fiber 131 is located in location hole 114e can be provided with lens
Assembly 134, that is, at least part of lens subassembly 134 can be located in location hole 114e,
For improving the optical effect light.
Refer to Figure 15, it is the schematic diagram of an embodiment of light-receiving chip of the present invention.
In one embodiment, location hole can be filled in using an optics adhesion material 114i
Space between 114e and optical fiber 131, the refractive index of optics adhesion material 114i can
Distribution chip base material 114c and the refractive index of optical fiber 131, to reduce not expected light reflection
Or refraction.That is, the refractive index of optics adhesion material 114i can matching chip base material 114c
And between the refractive index of optical fiber 131.The refractive index of such as optics adhesion material 114i can
For 1.2～3.5.In one embodiment, the refractive index of optics adhesion material 114i can be
1.5～3.3.
Refer to Figure 16, it is the schematic diagram of an embodiment of light-receiving chip of the present invention.
In one embodiment, there is in location hole 114e convex surface 114j in and correspond to optical fiber
131 one end, in this, convex surface 114j can have functions that concavees lens, for by light
Line concentrates on optical receiver 114d.
Refer to Figure 17, it is the schematic diagram of an embodiment of light-receiving chip of the present invention.
In one embodiment, light-receiving chip 214b may include chip substrates 214c, multiple
Optical receiver 214d and multiple location hole 214e.Multiple optical receiver 214d are in
On the 114f of the first base material surface, and form optical receiver array.Multiple location hole 214e
It is formed on the second substrate surface 114g, and correspond respectively to optical receiver 214d.
The optical transceiver module of the present invention can configure and encapsulates multiple closed type light transmitting groups
Part and light-receiving assembly, in a small-sized optical transceiver module, realize optical transceiver module
Miniaturization.
" in certain embodiments " and the term such as " in various embodiments " is by repeatedly
Use.This term frequently not refers to identical embodiment；But it can also refer to identical
Embodiment.The word such as "comprising", " having " and " inclusion " is synonym, unless its
Context meaning shows other meanings.
Although the example of various methods, equipment and system has been described in herein,
The scope that this disclosure covers is not limited thereto.On the contrary, this disclosure covers
All methods reasonably falling in the range of claim defines, equipment, system and system
The thing made, the scope of claim should be former according to the claim explanation being established
Reason to be understood.For example although the example of the system being disclosed above other components it
The outer software also including execute from hardware or or firmware, it should be appreciated that this
It is exemplary example etc. system, and should be read as being restricted example.Specifically
It, any or all revealed hardware, software and/or firmware component can be special
Be embodied as hardware, be ad hoc embodied as software, be ad hoc embodied as firmware,
Or some combinations of hardware, software and/or firmware.
In sum although the present invention is disclosed above with preferred embodiment, but above-mentioned excellent
Select embodiment and be not used to limit the present invention, those of ordinary skill in the art, do not taking off
In the spirit and scope of the present invention, all can make various change and retouching, the therefore present invention
Protection domain be defined by the scope that claim defines.
Claims (10)
1. a kind of light-receiving assembly it is characterised in that：Described light-receiving assembly includes：
Shell body；And
Light-receiving chip, is arranged in described shell body, described light-receiving chip includes core
Plate substrate, at least one optical receiver and at least one location hole, described chip substrates have phase
To the first base material surface and the second substrate surface, described optical receiver is disposed on described
On the first base material surface of chip substrates, described location hole is formed at described chip substrates
The second substrate surface on, and be pointed to described optical receiver, when one end insertion of optical fiber
During described positioning in the hole on described second substrate surface, one end of described optical fiber is pointed to
Described optical receiver on described the first base material surface.
2. light-receiving assembly according to claim 1 it is characterised in that：Described
Angle between light that the tangent plane of described one end of optical fiber is sent and described tangent plane is little
In 90 degree.
3. light-receiving assembly according to claim 1 it is characterised in that：Optics
Adhesion material is the space being filled between described location hole and described optical fiber.
4. light-receiving assembly according to claim 3 it is characterised in that：Described
The refractive index of optics adhesion material be Jie's what 1.2 3.5 it.
5. light-receiving assembly according to claim 4 it is characterised in that：Described
The refractive index of optics adhesion material be Jie's what 1.5 3.3 it.
6. light-receiving assembly according to claim 1 it is characterised in that：Described
One end of optical fiber is provided with lens subassembly.
7. light-receiving assembly according to claim 1 it is characterised in that：Described
Positioning in the hole has one end that a convex face corresponds to optical fiber, and in this, can to have one recessed for convex surface
Effect of lens, for concentrating on optical receiver by light.
8. light-receiving assembly according to claim 1 it is characterised in that：Described
Light-receiving chip includes chip substrates, multiple described optical receiver and multiple described positioning
Hole, the plurality of optical receiver is on described the first base material surface, the plurality of fixed
Position hole is formed on described second substrate surface, and corresponds respectively to the plurality of light and connect
Receive device.
9. light-receiving assembly according to claim 1 it is characterised in that：Described
Light-receiving assembly is the light-receiving assembly of non-tight type.
10. a kind of optical transceiver module it is characterised in that：Described optical transceiver module bag
Include：
Substrate；
Multiple closed type light emission components, are arranged on described substrate；And
Light-receiving assembly, is connected to described substrate, and described light-receiving assembly includes：
Shell body；And
Light-receiving chip, is arranged in described shell body, described light-receiving chip bag
Include chip substrates, at least one optical receiver and at least one location hole, described chip base
Material has relative the first base material surface and the second substrate surface, described optical receiver
It is disposed on the first base material surface of described chip substrates, described location hole is shape
On second substrate surface of chip substrates described in Cheng Yu, and it is pointed to described light-receiving
Device, inserts the described positioning in the hole on described second substrate surface when one end of optical fiber
When, the described light that one end of described optical fiber is pointed on described the first base material surface connects
Receive device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510943215.1A CN106483611A (en) | 2015-08-28 | 2015-08-28 | Light-receiving assembly and optical transceiver module |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510537575.1A CN106483610B (en) | 2015-08-28 | 2015-08-28 | Optical transceiver module and Connectorized fiber optic cabling module |
| CN201510943215.1A CN106483611A (en) | 2015-08-28 | 2015-08-28 | Light-receiving assembly and optical transceiver module |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510537575.1A Division CN106483610B (en) | 2015-08-28 | 2015-08-28 | Optical transceiver module and Connectorized fiber optic cabling module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106483611A true CN106483611A (en) | 2017-03-08 |
Family
ID=58097876
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510943215.1A Pending CN106483611A (en) | 2015-08-28 | 2015-08-28 | Light-receiving assembly and optical transceiver module |
| CN201510537575.1A Expired - Fee Related CN106483610B (en) | 2015-08-28 | 2015-08-28 | Optical transceiver module and Connectorized fiber optic cabling module |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201510537575.1A Expired - Fee Related CN106483610B (en) | 2015-08-28 | 2015-08-28 | Optical transceiver module and Connectorized fiber optic cabling module |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US9720191B2 (en) |
| CN (2) | CN106483611A (en) |
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| US9876576B2 (en) * | 2016-03-17 | 2018-01-23 | Applied Optoelectronics, Inc. | Layered coaxial transmitter optical subassemblies with support bridge therebetween |
| US9923635B2 (en) * | 2016-06-08 | 2018-03-20 | Applied Optoelectronics, Inc. | Optical transmitter or transceiver including reversed planar lightwave circuit (PLC) splitter for optical multiplexing |
| US9866329B2 (en) * | 2016-06-08 | 2018-01-09 | Applied Orthoelectronics, Inc. | Optical transmitter or transceiver including transmitter optical subassembly (TOSA) modules directly aligned to optical multiplexer inputs |
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| US10989870B2 (en) * | 2018-08-29 | 2021-04-27 | Applied Optoelectronics, Inc. | Transmitter optical subassembly with hermetically-sealed light engine and external arrayed waveguide grating |
| CN109239862A (en) * | 2018-09-11 | 2019-01-18 | 深圳市易飞扬通信技术有限公司 | Single channel Tx modular construction and packaging method in PSM4 optical sender |
| TWI718418B (en) * | 2018-10-03 | 2021-02-11 | 大陸商東莞立訊技術有限公司 | Fiber transceiver |
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| JP2020144313A (en) * | 2019-03-08 | 2020-09-10 | 矢崎総業株式会社 | Optical transmitting/receiving module |
| CN112748502A (en) * | 2019-10-31 | 2021-05-04 | 佑胜光电股份有限公司 | Optical transceiver module and optical fiber cable module |
| CN111722327A (en) * | 2019-03-18 | 2020-09-29 | 佑胜光电股份有限公司 | Optical transceiver module and optical fiber cable module |
| CN111722324A (en) * | 2019-03-18 | 2020-09-29 | 佑胜光电股份有限公司 | Optical transceiver module and optical fiber cable module |
| CN113296198A (en) * | 2020-02-21 | 2021-08-24 | 佑胜光电股份有限公司 | Optical transmission assembly, optical transceiver module and optical fiber cable module |
| WO2020187034A1 (en) * | 2019-03-18 | 2020-09-24 | 佑胜光电股份有限公司 | Optical transceiver module and optical fiber cable module |
| CN109738997A (en) * | 2019-03-20 | 2019-05-10 | 苏州易锐光电科技有限公司 | Optical module |
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| CN112835150A (en) * | 2019-11-22 | 2021-05-25 | 佑胜光电股份有限公司 | Optical transmission assembly, optical transceiver module and optical fiber cable module |
| CN112859255A (en) * | 2019-11-28 | 2021-05-28 | 讯芯电子科技（中山）有限公司 | Optical communication module and manufacturing method thereof |
| WO2021171599A1 (en) * | 2020-02-28 | 2021-09-02 | 日本電信電話株式会社 | High-speed optical transmission/reception device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN106483610B (en) | 2018-06-29 |
| US20170254972A1 (en) | 2017-09-07 |
| US20170059796A1 (en) | 2017-03-02 |
| CN106483610A (en) | 2017-03-08 |
| US9720191B2 (en) | 2017-08-01 |
| US10139578B2 (en) | 2018-11-27 |
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