CN117641729A - Circuit board with light sensing element and manufacturing method thereof - Google Patents
Circuit board with light sensing element and manufacturing method thereof Download PDFInfo
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- CN117641729A CN117641729A CN202210987490.3A CN202210987490A CN117641729A CN 117641729 A CN117641729 A CN 117641729A CN 202210987490 A CN202210987490 A CN 202210987490A CN 117641729 A CN117641729 A CN 117641729A
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- sensing element
- circuit board
- light sensing
- conductive
- circuit
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000010410 layer Substances 0.000 claims description 58
- 239000012790 adhesive layer Substances 0.000 claims description 28
- 239000003292 glue Substances 0.000 claims description 10
- 238000003475 lamination Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000002834 transmittance Methods 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims 1
- 206010070834 Sensitisation Diseases 0.000 abstract 1
- 230000005611 electricity Effects 0.000 abstract 1
- 230000008313 sensitization Effects 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 4
- 239000002356 single layer Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The application discloses a circuit board with light sensing element, including circuit substrate and light sensing element, light sensing element is embedded in the circuit substrate and with circuit substrate electricity is connected, the circuit substrate includes an opening in order to expose light sensing element's sensitization side. The application also discloses a manufacturing method of the circuit board with the light sensing element.
Description
Technical Field
The present disclosure relates to circuit boards, and particularly to a circuit board with a light sensing element and a method for manufacturing the same.
Background
Light sensors are widely used in various electronic devices, such as smart phones and smart watches, and the main function of the light sensors is to sense the change condition of external light and feed the change condition back to a processing chip in the electronic device. And the processing chip automatically adjusts the backlight brightness of the display of the electronic equipment according to the feedback signal, so that the energy consumption of the product is reduced. As the size and shape of application products are increasingly reduced, particularly in support of portable and mobile applications, highly integrated packaging, thinner packaging is becoming more critical. The circuit board is used as a main connecting component in the electronic product and occupies a larger space of the electronic product. The arrangement mode of compactness and thinness between the circuit board and the electronic element is beneficial to the development trend of light, thin, short and small electronic products. Therefore, how to ensure the reliability of the product under the premise of compactness and thinness is a problem to be solved at present.
Disclosure of Invention
In view of the above, the present invention provides a circuit board with a photo sensor and a method for manufacturing the same, which are beneficial to improving the reliability of the product.
As a method of the present application, a method of manufacturing a circuit board having a light sensing element includes the steps of:
providing a first circuit board, which comprises a circuit substrate and a plurality of connecting columns electrically connected with the circuit substrate respectively, wherein the connecting columns are arranged on the same side of the circuit substrate in a protruding manner along the thickness direction of the circuit substrate respectively;
fixing a light sensing element on one side of the circuit substrate provided with the connecting columns through an adhesive layer, so as to obtain an intermediate structure, wherein the thickness of the light sensing element is smaller than the height of each connecting column in the thickness direction;
providing a second circuit board, which comprises an adhesive layer, a conductive paste column and a conductive layer laminated with the adhesive layer, wherein a plurality of connecting holes respectively penetrate through the adhesive layer, each connecting hole is communicated with the conductive layer, and each connecting hole is filled with the conductive paste column;
laminating and pressing the intermediate structure and the second circuit board to obtain a pressed body; when the lamination is not pressed, the light sensing element is positioned between the first circuit board and the second circuit board, and is attached to at least one conductive paste column, and each connecting column corresponds to one conductive paste column; after lamination, the connecting column is electrically connected with the conductive paste column, and the adhesive layer is filled in the intermediate structure, the second circuit board and the second circuit board due to the increase of lamination fluidity; and
an opening is formed in one side, facing away from the first circuit board, of the pressing body corresponding to the light sensing element so as to expose the photosensitive side of the light sensing element.
As an aspect of the present application, in the intermediate structure, the light sensing element is located at least two of the connection posts.
As one scheme of the application, after lamination, the areas, except for the areas attached to the conductive paste columns, of the light sensing elements are covered by the adhesive layer and the adhesive layer.
As an aspect of the present application, further includes: and a light-transmitting adhesive is arranged in the opening.
As an aspect of the present application, the transmittance of the light-transmitting glue is preferably greater than 90%.
As an aspect of the present application, a circuit board with a light sensing element includes a circuit substrate and the light sensing element, where the light sensing element is embedded in the circuit substrate and electrically connected to the circuit substrate, and the circuit substrate includes an opening to expose a photosensitive side of the light sensing element.
As an aspect of the application, the device further comprises a light-transmitting adhesive, wherein the light-transmitting adhesive is arranged in the opening.
As an aspect of the application, the transmittance of the light-transmitting glue is greater than 90%.
As an aspect of the present application, the circuit substrate includes a first conductive line layer and a second conductive line layer stacked and spaced apart in a thickness direction, the first conductive line layer and the second conductive line layer being located at opposite sides of the light sensing element, respectively; the circuit substrate further comprises a plurality of conductive structures which are arranged along the thickness direction and electrically connected with the first conductive circuit layer and the second conductive circuit layer, each conductive structure comprises a first conductive column and a second conductive column which are sequentially connected along the thickness direction, and the second conductive column is formed by conductive paste.
As an aspect of the present application, the light sensing element is located between at least two of the conductive structures.
In the prior art, a circuit substrate is formed first, then a cover is opened to embed the light sensing element in the circuit substrate, and the circuit substrate is also required to be provided with an opening corresponding to the light sensing side of the light sensing element. Compared with the manufacturing method of the circuit board in the prior art, the manufacturing method of the circuit board with the light sensing element only needs to be provided with the opening corresponding to the light sensing side of the light sensing element, so that the light sensing element is protected more favorably, and the reliability of a product is improved. Meanwhile, the manufacturing method of the circuit board with the light sensing element is simple in technological process, the light sensing element is attached to the conductive paste column and is electrically connected, the adhesive layer is matched with the adhesive layer to fix the light sensing element, and therefore the light sensing element is fixedly welded to the second circuit board without a surface mounting technology, and the step of removing soldering flux generated by the method is omitted.
Drawings
Fig. 1 is a schematic cross-sectional view of a first circuit board according to an embodiment of the present application.
Fig. 2 is a schematic cross-sectional view of a second circuit board according to an embodiment of the present application.
Fig. 3 is a schematic cross-sectional view of an intermediate structure according to an embodiment of the present application.
Fig. 4A is a schematic cross-sectional view of the intermediate structure shown in fig. 3 stacked with the second wiring board shown in fig. 2.
Fig. 4B is a schematic cross-sectional view of a laminate according to an embodiment of the present disclosure.
Fig. 5 is a schematic cross-sectional view of an opening formed in the laminate shown in fig. 4B.
Fig. 6 is a schematic cross-sectional view of the light-transmitting glue disposed in the opening shown in fig. 5.
Fig. 7 is a schematic cross-sectional view of a circuit board with a light sensing element according to an embodiment of the present application.
Description of the main reference signs
First Circuit Board 10
Circuit board 11
Connecting column 13
Thickness direction X
Dielectric layer 111
First circuit layer 113
Second circuit layer 115
Second circuit board 20
Adhesive layer 21
Conductive paste column 23, 77
Conductive layer 25
Connection hole 210
Dielectric layer 22
Light sensing element 40
Adhesive layer 30
Intermediate structure 50
Press body 53
Openings 530, 70a
Light-transmitting glue 60
Circuit board 100
Circuit board 70
First conductive line layer 71
Second conductive line layer 73
Conductive structure 75
First conductive post 751
Second conductive column 753
Electric connection pad 41
The invention will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Some embodiments of the present application are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without collision.
Referring to fig. 1 to 6, an embodiment of the present application provides a method for manufacturing a circuit board with a light sensing element, which includes the following steps:
in step S1, referring to fig. 1, a first circuit board 10 is provided, and includes a circuit substrate 11 and a plurality of connection posts 13 electrically connected to the circuit substrate 11. The plurality of connection posts 13 are respectively protruded on the same side of the circuit board 11 in the thickness direction X of the circuit board 11.
The circuit substrate 11 may be a flexible circuit substrate, a rigid circuit substrate, or a soft and hard combined circuit substrate. The circuit substrate 11 may be a single-layer circuit substrate or a multi-layer circuit substrate. The number of the circuit layers in the multilayer circuit substrate is two or more.
The circuit substrate 11 includes a dielectric layer and at least one circuit layer combined with the dielectric layer. In the present embodiment, the circuit board 11 is a double-sided circuit board, and the following description will be made. Specifically, the circuit substrate 11 includes a dielectric layer 111, and a first circuit layer 113 and a second circuit layer 115 stacked in the thickness direction X, and the dielectric layer 111 is bonded between the first circuit layer 113 and the second circuit layer 115. The first circuit layer 113 and the second circuit layer 115 may also be electrically connected.
Each of the connection posts 13 is connected to a side of the first circuit layer 113 facing away from the second circuit layer 115.
In some embodiments, the height of the connection posts 13 in the thickness direction X may be preferably 30 micrometers to 90 micrometers. The height of the connecting posts 13 in the thickness direction X may be set to other values as desired.
The connection posts 13 may be metal posts, such as but not limited to copper posts. The connection posts 13 may be formed by, but not limited to, electroplating.
In step S2, referring to fig. 2, a second circuit board 20 is provided, which includes an adhesive layer 21, a conductive paste column 23 and a conductive layer 25 laminated with the adhesive layer 21, wherein a plurality of connection holes 210 respectively penetrate through the adhesive layer 21, each connection hole 210 is communicated with the conductive layer 25, and each connection hole 210 is filled with the conductive paste column 23.
The second circuit board 20 may be a flexible circuit board, a rigid circuit board or a soft and hard combined circuit board. The second circuit board 20 may be a single-layer circuit board or a multi-layer circuit board. The number of the circuit layers in the multilayer circuit substrate is two or more, and the two or more circuit layers are respectively arranged in the dielectric layers or/and on the surfaces of the dielectric layers.
In this embodiment, the second circuit board 20 is a single-layer circuit board, and includes a laminated adhesive layer 21, a dielectric layer 22, and a conductive layer 25. A plurality of connection holes 210 sequentially penetrate through the adhesive layer 21 and the dielectric layer 22, and each connection hole 210 communicates with the conductive layer 25. The conductive paste pillars 23 fill each of the connection holes 210 to be electrically connected to the conductive layer 25.
In step S3, referring to fig. 3, a photo sensor 40 is fixed on the circuit substrate 11 at the side with the connection post 13 through a glue layer 30, so as to obtain an intermediate structure 50. Wherein, in the thickness direction X, the thickness of the light sensing element 40 is smaller than the height of each of the connection posts 13.
Preferably, the light sensing element 40 is located between at least two of the connecting posts 13, so that the light sensing element 40 is more uniformly stressed during the subsequent pressing.
Specifically, a plurality of electrical connection pads 41 are disposed on a side of the optical sensing element 40 facing away from the circuit substrate 11.
In step S4, referring to fig. 4A and 4B, the intermediate structure 50 and the second circuit board 20 are laminated and pressed together, so as to obtain a pressed body 53. When the lamination is not pressed, the photo-sensing element 40 is located between the first circuit board 10 and the second circuit board 20, and the photo-sensing element 40 is attached to at least one conductive paste column 23, and each connection column 13 corresponds to one conductive paste column 23; after the lamination, the connecting posts 13 are electrically connected to the conductive paste posts 23, and the adhesive layer 30 is filled between the intermediate structure 50 and the second circuit board 20 due to the increased lamination fluidity.
Specifically, the electrical connection pad 41 of the light sensing element 40 is attached to and electrically connected with the conductive paste column 23, and the adhesive layer 30 cooperates with the adhesive layer 21 to fix the light sensing element 40, so that the light sensing element 40 is fixedly soldered to the second circuit board 20 without a surface mount technology, and the step of removing the soldering flux generated thereby is omitted.
In this embodiment, the areas of the photo-sensing element 40, except for the areas attached to the conductive paste posts 23, may be covered by the adhesive layer 30 and the adhesive layer 21, which is favorable for fixing the photo-sensing element 40, and further is favorable for improving the stability of the structure of the pressing body 53.
In step S5, referring to fig. 4B and fig. 5, an opening 530 is formed on a side of the pressing body 53 facing away from the first circuit board 10 corresponding to the photo-sensing element 40 to expose the photo-sensing element 40.
The openings 530 are disposed so as to avoid the conductive paste pillars 23 electrically connected to the photo-sensing element 40.
In some embodiments, the method for manufacturing a circuit board with a light sensing element further includes step S6, referring to fig. 6, a transparent adhesive 60 is disposed in the opening 530, so that the light sensing element 40 is protected without affecting the operation of the light sensing element 40, and the reliability of the whole product is improved.
The transmittance of the transparent adhesive 60 is preferably greater than 90%, so that the light sensing element 40 can accurately sense the intensity of the ambient light.
In the prior art, a circuit substrate is formed first, then a cover is opened to embed the light sensing element in the circuit substrate, and the circuit substrate is also required to be provided with an opening corresponding to the light sensing side of the light sensing element. Compared with the manufacturing method of the circuit board in the prior art, the circuit board with the light sensing element manufactured by the manufacturing method of the present application only needs to be provided with the opening corresponding to the light sensing side of the light sensing element 40, thereby being more beneficial to protecting the light sensing element 40. Meanwhile, the manufacturing method is simple in process flow.
Referring to fig. 7, an embodiment of the present application further provides a circuit board 100 with a light sensing element, where the circuit board 100 includes a circuit substrate 70 and the light sensing element 40, and the light sensing element 40 is embedded in the circuit substrate 70 and electrically connected to the circuit substrate 70. The circuit substrate 70 includes an opening 70a to expose the photosensitive side of the photo-sensing element 40.
In some embodiments, the circuit board 100 may further include a light-transmitting glue 60, and the light-transmitting glue 60 is disposed in the opening 70 a.
The transmittance of the transparent adhesive 60 is preferably greater than 90%, so that the light sensing element 40 can accurately sense the intensity of the ambient light.
The circuit board 70 includes a first conductive trace layer 71 and a second conductive trace layer 73 stacked and spaced apart in the thickness direction X. The first conductive circuit layer 71 and the second conductive circuit layer 73 are respectively located on two opposite sides of the light sensing element 40. The circuit substrate 70 may further include a plurality of conductive structures 75 disposed along the thickness direction X and electrically connecting the first conductive trace layer 71 and the second conductive trace layer 73, and each of the conductive structures 75 may include a first conductive post 751 and a second conductive post 753 sequentially connected along the thickness direction X, the second conductive post 753 being formed of a conductive paste.
In the present embodiment, the first conductive pillars 751 may be, but are not limited to, copper pillars.
Preferably, the light sensing element 40 may be located between at least two of the conductive structures 75.
The photosensitive side of the light sensing element 40 is provided with a plurality of electrical connection pads 41, the circuit substrate 70 is provided with a conductive paste column 77 corresponding to each electrical connection pad 41, and the conductive paste column 77 is electrically connected with the electrical connection pad 41 and the first conductive circuit layer 71.
The circuit board with the light sensing element in the present application only needs to be provided with an opening corresponding to the light sensing element 40, thereby being more beneficial to protecting the light sensing element 40.
The present invention is not limited to the above-mentioned embodiments, but is capable of other and obvious modifications and equivalents of the above-mentioned embodiments, which will be apparent to those skilled in the art from consideration of the present invention without departing from the scope of the present invention.
Claims (10)
1. A manufacturing method of a circuit board with a light sensing element comprises the following steps:
providing a first circuit board, which comprises a circuit substrate and a plurality of connecting columns electrically connected with the circuit substrate respectively, wherein the connecting columns are arranged on the same side of the circuit substrate in a protruding manner along the thickness direction of the circuit substrate respectively;
fixing a light sensing element on one side of the circuit substrate provided with the connecting columns through an adhesive layer, so as to obtain an intermediate structure, wherein the thickness of the light sensing element is smaller than the height of each connecting column in the thickness direction;
providing a second circuit board, which comprises an adhesive layer, a conductive paste column and a conductive layer laminated with the adhesive layer, wherein a plurality of connecting holes respectively penetrate through the adhesive layer, each connecting hole is communicated with the conductive layer, and each connecting hole is filled with the conductive paste column;
laminating and pressing the intermediate structure and the second circuit board to obtain a pressed body; when the lamination is not pressed, the light sensing element is positioned between the first circuit board and the second circuit board, and is attached to at least one conductive paste column, and each connecting column corresponds to one conductive paste column; after lamination, the connecting column is electrically connected with the conductive paste column, and the adhesive layer is filled in the intermediate structure, the second circuit board and the second circuit board due to the increase of lamination fluidity; and
an opening is formed in one side, facing away from the first circuit board, of the pressing body corresponding to the light sensing element so as to expose the photosensitive side of the light sensing element.
2. The method of manufacturing a circuit board with photo-sensing elements according to claim 1, wherein in the intermediate structure, the photo-sensing elements are located in at least two of the connection posts.
3. The method of claim 1, wherein after the pressing, the areas of the photo-sensing element except the areas attached to the conductive paste posts are covered by the adhesive layer and the adhesive layer.
4. The method of manufacturing a circuit board with a light sensing element according to claim 1, further comprising:
and a light-transmitting adhesive is arranged in the opening.
5. The method of manufacturing a circuit board with photo sensor elements according to claim 4, wherein the transmittance of the transparent glue is preferably greater than 90%.
6. The circuit board with the light sensing element comprises a circuit substrate and the light sensing element, and is characterized in that the light sensing element is embedded in the circuit substrate and is electrically connected with the circuit substrate, and the circuit substrate comprises an opening for exposing the photosensitive side of the light sensing element.
7. The circuit board with light sensing element according to claim 6, further comprising a light transmissive glue disposed within the opening.
8. The circuit board with light sensing element of claim 7, wherein the light transmission of the light transmissive glue is greater than 90%.
9. The circuit board with the light sensing element according to claim 6, wherein the circuit substrate includes a first conductive trace layer and a second conductive trace layer laminated and spaced apart in a thickness direction, the first conductive trace layer and the second conductive trace layer being located on opposite sides of the light sensing element, respectively; the circuit substrate further comprises a plurality of conductive structures which are arranged along the thickness direction and electrically connected with the first conductive circuit layer and the second conductive circuit layer, each conductive structure comprises a first conductive column and a second conductive column which are sequentially connected along the thickness direction, and the second conductive column is formed by conductive paste.
10. The circuit board with light sensing element of claim 9, wherein the light sensing element is located between at least two of the conductive structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210987490.3A CN117641729A (en) | 2022-08-17 | 2022-08-17 | Circuit board with light sensing element and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210987490.3A CN117641729A (en) | 2022-08-17 | 2022-08-17 | Circuit board with light sensing element and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117641729A true CN117641729A (en) | 2024-03-01 |
Family
ID=90025735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210987490.3A Pending CN117641729A (en) | 2022-08-17 | 2022-08-17 | Circuit board with light sensing element and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117641729A (en) |
-
2022
- 2022-08-17 CN CN202210987490.3A patent/CN117641729A/en active Pending
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