KR101824557B1 - Manufacturing method for LED package type FPCB using Copper plate, and LED package produced thereby - Google Patents

Manufacturing method for LED package type FPCB using Copper plate, and LED package produced thereby Download PDF

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Publication number
KR101824557B1
KR101824557B1 KR1020160060291A KR20160060291A KR101824557B1 KR 101824557 B1 KR101824557 B1 KR 101824557B1 KR 1020160060291 A KR1020160060291 A KR 1020160060291A KR 20160060291 A KR20160060291 A KR 20160060291A KR 101824557 B1 KR101824557 B1 KR 101824557B1
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South Korea
Prior art keywords
copper foil
led package
layer
copper
circuit board
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KR1020160060291A
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Korean (ko)
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KR20170017708A (en
Inventor
송영희
함진영
김봉겸
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주식회사 써키트 플렉스
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]

Abstract

The present invention relates to a method of manufacturing a flexible circuit board for an LED package using a copper foil, and an LED package manufactured thereby.
The present invention provides a method of manufacturing a semiconductor device, comprising: preparing a copper foil having a single-sided copper foil layer and attaching a carrier film to a lower entire surface of the copper foil; Forming a copper foil pattern to be a base of the connection terminal portion by selectively removing the copper foil layer adhered to the carrier film; Applying an insulating resin such as PI ink to the upper part of the carrier film including the copper foil pattern and flattening it by squeezing to form an insulating layer; Polishing the insulating layer to expose an upper surface of the copper foil pattern; Electroplating an exposed result of the copper foil pattern to form a copper plating layer on the copper foil pattern; Forming a silver plating layer on the copper plating layer by removing the carrier film from the copper plating layer and connecting the copper foil pattern to the copper plating pattern using the insulating layer as a frame, The present invention also provides a method of manufacturing a flexible circuit board for a LED package using the copper foil, which is fabricated by manufacturing a flexible flexible printed circuit board, and an LED package having a frame structure made of the PI resin so as to be a frame.
Since the flexible circuit board for the LED package utilizes the PI insulation layer as a frame, it is a more stable and easy process than the conventional one, and thus the manufacturing cost can be reduced, and the package manufacturing process including the LED chip mounting is easy. In addition, the manufacturing process of the LED package is very easy in preparation for the previous process of using metal or ceramic as a substrate.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing a flexible circuit board for an LED package using a copper foil, and an LED package manufactured thereby,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing a flexible circuit board for an LED package using a copper foil, and an LED package manufactured thereby, and more particularly, It is a technology related to a substrate for LED package that can replace a ceramic substrate used as a substrate for high power LED while solving the manufacturing cost rise due to the difficulty of processing. A method for manufacturing a flexible circuit board for an LED package using a copper foil which is suitable for manufacturing a small-sized LED having a small size and is a new platform for a flexible circuit board, and a manufacturing method thereof Gt; LED package. ≪ / RTI >

In general, a light emitting diode (LED) has advantages such as low consumption power consumed for the same illuminance and low driving voltage, easy handling and long life, and can be made small and light, And is also widely used as a light source of a backlight unit (BLU) of a liquid crystal display (LCD) in an electronic device such as a portable information communication device such as a smart phone and a TV or a notebook computer.

Meanwhile, in recent years, a technology for mounting an LED chip itself on a printed circuit board (PCB) has been developed. On the other hand, as the utilization of a flexible and thin flexible circuit board (FPCB) Technology for fabricating LED packages using a flexible circuit board is being studied.

The conventional LED package generally uses a method of mounting an LED chip on a metal or ceramic substrate.

As shown in FIG. 1, the LED chip is diced into a lead frame through a die attach process to attach the divided LED chip, and the electrode of the LED chip is bonded through a wire bonding process. Connect to lead terminal and mold or dispense. At this time, the substrate associated with the lead frame is a metal or ceramic plate used as a substrate. After the LED package is trimmed, the lead frame is trimmed, and the LED package is fabricated as a single LED device or a plurality of LED devices through a sorting process. Then, the lead frame is classified by a sorting process using a spectroscopic tester and attached to a carrier tape And is waiting for shipment.

As an example of the prior art for manufacturing an LED package using the above-described metal or ceramic as a substrate in a complicated LED package process as described above,

Japanese Patent Application Laid-Open No. 10-2014-0013612 discloses a method of manufacturing a light-emitting device, in which a hardened and semi-hardened Epoxy insulating resin is coated on a surface of a metal plate without using FR4 as an insulating layer formed on the surface of the plate, A method of manufacturing a chip-on-metal type printed circuit board in which a copper foil layer (RESIN COATED COPPER FOIL) is formed and thermally bonded to the metal plate in a high-temperature and high-pressure chamber,

In addition, in the IPC classification, Korean Patent Laid-Open Publication No. 10-2014-0013611 discloses a method of using a cured and semi-hardened Epoxy insulating resin stepwise as an epoxy insulating layer and a step of using a high temperature and high pressure There is disclosed a method for manufacturing a package-on-metal type heat-dissipating printed circuit board in which a circuit pattern layer can be precisely and firmly attached to a metal plate by three-dimensional thermocompression bonding.

In connection with the use of an LED element together with a flexible circuit board, in the prior art of Korean Patent Registration No. 10-1423458; A flexible circuit board comprising a wiring circuit layer on which an electronic element is mounted, between a first insulating film layer and a second insulating film layer, characterized in that the second insulating film layer has an opening And the wiring circuit layer includes a detent groove for restricting displacement of the electronic device while accommodating a part of the electronic device at a position corresponding to the opening portion, there is,

Such a conventional technique relates to a technique for preventing the position of an LED element from being displaced by a stop groove upon reflow of a surface mount of an LED package element on a flexible circuit board regardless of the LED package manufacturing technique of the present invention , The disclosed drawings and the detailed description thereof show a structure in which a wiring circuit layer beneath the first insulating film layer is used as a reflector, and the LED device has a structure in which the substrate of the LED package is made of a metal or a ceramic substrate Content.

On the other hand, in addition to the above-mentioned mounting method on the metal or ceramic substrate, there has recently been developed a technique of mounting and packaging the LED chip itself on a printed circuit board (PCB), and a flexible and thin flexible circuit board (FPCB) As the utilization rate increases, a technology for mounting an LED chip on a flexible circuit board is being developed in various aspects.

For example, the prior art of Korean Patent Application No. 10-2010-0085137; An upper support member in the form of a plate which covers a part of the flexible circuit board and has an opening at a central portion thereof to expose the mounting region; And a lower support member formed on the other surface of the flexible circuit board so as to correspond to the upper support member, wherein the support member is filled with the phosphor to facilitate the manufacture of the LED package, the phosphor filled by the reinforcement plate and the support member, An LED package having high reliability because stress is not applied to the LED package,

Prior Art of Korean Patent Application No. 10-2011-0065518; A flexible circuit board on which a plurality of mounting areas of the LED chip are formed; a cover layer formed on the flexible circuit board; and a top support plate formed on the cover layer and supporting a periphery of the mounting area, A flexible LED package in which the cover layer and the upper support plate have openings corresponding to the mounting areas, and a reflective film is formed on the inner surfaces of the openings.

The conventional technology using the above-described flexible circuit board is an LED packaging method in which a plurality of LEDs are mounted on a single flexible circuit board as a basic structure other than the intrinsic object pursued by the conventional invention, But it does not match at all. More specifically, due to the complicated and many layered structures of the flexible circuit board used in the manufacture of the LED package, the number of manufacturing processes is increased, resulting in a problem of productivity and a yield reduction. In addition, the LED package using the above- It has a structural problem in that it can not easily provide heat dissipation measures for fabrication of various LED packages having different power capacities when viewed from the viewpoint of the complicated layer structure and the manufacturing process thereof.

In order to meet the demand for miniaturization of the LED chip for middle power in the LED package related technology to date, it is difficult to process the miniaturization of the lead frame, which is the basis of the LED chip manufacturing technology, A new platform optimal for miniaturization, that is, a package technology related to a flexible circuit board is required,

In addition, there is a demand for a solution of an LED package manufacturing technology that uses a flexible circuit board having excellent process stability and high-mass-production capability to replace a ceramic substrate used as a substrate of a high power LED with a low cost.

Korean Patent Laid-Open Publication No. 10-2014-0013612,

Korean Patent Laid-open Publication No. 10-2014-0013611,

Korean Patent Registration No. 10-1423458,

Korean Patent Application No. 10-2010-0085137,

Korean Patent Application No. 10-2011-0065518

SUMMARY OF THE INVENTION The present invention, which is devised to meet the needs and resolutions of the above-described conventional problems,

By using the flexible raw material as a substrate at a low cost compared to a conventional metal or ceramic substrate, we have secured a new package structure and process technology that can be used as a simple layer structure to mass-produce LED packages And to achieve the improvement of yield by securing process stability.

It is another object of the present invention to provide a flexible heat dissipation countermeasure against the heat generation of the LEDs including the middle power LED and the high power LED.

According to an aspect of the present invention,

a) preparing a double-sided copper-clad laminate in which a copper foil layer is laminated on upper and lower sides with an insulating layer interposed therebetween;

b) forming one or more via holes by laser drilling to selectively remove only the lower copper foil layer and the insulating layer from the lower surface of the double-sided copper-clad laminate to expose the inner surface of the upper copper foil layer;

c) forming a pre-treatment copper coating on the sidewall of the via hole by a chemical or physical method, followed by electrolytic copper plating to fill the via hole and forming upper and lower copper plating layers on the upper and lower copper foil layers, respectively;

d) patterning the upper and lower copper plating layers by photolithography to expose the upper and the lower copper plating layers by patterning the via hole to form an upper connection terminal portion to be electrically connected to the LED chip and a lower connection terminal portion to be used as a substrate lower electrode terminal; The present invention also provides a method of manufacturing a flexible circuit board for an LED package using the double-sided copper-clad laminate.

Meanwhile, in the above-described structure of the present invention, before the step b), the lower surface of the copper-clad laminate is protected with a masking film, and then a copper plating layer is formed only on the upper surface of the copper-clad laminate by electrolytic plating, And then performing the step b) and the subsequent steps of drilling the lower copper foil and the insulating layer from the lower copper foil surface of the copper clad laminate.

Preferably, electrolytic plating is controlled so as to form a dimple on the exposed surface of the via hole, and a silver plating layer is formed on the top of the upper connection terminal portion.

In addition, the via holes are formed by perforating the upper and lower portions of the connection terminal portion by a plurality of holes spaced at a predetermined distance from each other.

According to the present invention, there is provided an LED package, which is manufactured by the above-described method and is formed by arranging LED elements in an insulating layer with an insulating layer as a frame until the upper and lower connection terminal portions are mounted and the LED chip is mounted, And the upper and lower electrode connection portions connected by the filled via holes are included in one LED device as a pair of two adjacent and electrically isolated flexible circuits. Thereby providing an LED package using the substrate.

At this time, it is preferable that the LED chip 60 connected to the upper part of the upper connection terminal part 44 is a flip chip, but a wire bonding chip is also possible.

Meanwhile, the present invention provides a method for manufacturing a semiconductor device, comprising: preparing a copper foil having a single-sided copper foil layer and attaching a carrier film to a lower entire surface of the copper foil; Forming a copper foil pattern to be a base of the connection terminal portion by selectively removing the copper foil layer adhered to the carrier film; Applying an insulating resin such as PI ink to the upper part of the carrier film including the copper foil pattern and flattening it by squeezing to form an insulating layer; Polishing the insulating layer to expose an upper surface of the copper foil pattern; Electroplating an exposed result of the copper foil pattern to form a copper plating layer on the copper foil pattern; Forming a silver plating layer on the copper plating layer by removing the carrier film from the copper plating layer and connecting the copper foil pattern to the copper plating pattern using the insulating layer as a frame, The present invention also provides a method of manufacturing a flexible circuit board for a LED package using the copper foil, which is fabricated by manufacturing a flexible flexible printed circuit board, and an LED package having a frame structure made of the PI resin so as to be a frame.

According to the present invention, a flexible circuit board suitable for mounting an LED chip is manufactured by connecting the upper and lower connection terminal portions having a plurality of via holes formed by limited punching and peeling using a copper clad laminate or a copper foil, The manufacturing process and the layer structure are simplified as compared with the flexible circuit board for LED chip mounting, so that it is possible to secure process stability and productivity at low cost.

In addition, when the LED package is manufactured using such a flexible circuit board, the mold process of the lead frame for the LED package is not required in the related art. Thus, a technique for realizing miniaturization of the LED with low cost can be secured. And a high power LED, and it is possible to manufacture a lightweight LED package having an excellent heat radiation effect.

Also, the LED package manufactured in the above-described manner has the effect of facilitating the process of sowing a unit number in preparation for the previous use of metal or ceramic as a substrate.

The specific operation and effect of the present invention can be understood as a correlation between the configuration of the embodiment described later and the operation and effect thereof.

1 is a schematic view for explaining a conventional LED package process sequence,
FIGS. 2 to 4 illustrate a step process for fabricating a flexible circuit board according to various embodiments of the present invention, a layer structure for each step, and a structure and a process method of an LED package manufactured using the completed flexible circuit board A process flow chart shown as a layer section for explanation,
5 is a flow chart showing a step process of a manufacturing method according to another embodiment of the present invention and a structure of an LED package as a layer section;
6A and 6B are views showing an embodiment in which a via hole is formed in a unit connection terminal portion and a lower connection terminal portion in a flexible circuit board for an LED package according to the present invention;

While the invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

It is also to be understood that one component may have other components in between, as well as a direct connection or connection between the components in the context of a "connection" or "connection" to another component, Quot; directly connected "or" directly connected "to another component, it should be understood that no other component is present in between.

It should be understood, however, that the appended drawings in this application are, for the sake of convenience, illustrated in enlarged or reduced size and proportions,

Hereinafter, the present invention will be described in detail with reference to the drawings. In this instance, the same or corresponding components are denoted by the same reference numerals regardless of the reference numerals, and redundant explanations thereof will be omitted.

≪ Embodiment 1 >

Referring to Figure 2,

As shown in (a) of FIG. 2, a) step of preparing the double-sided copper-clad laminate 20 in which the copper foil layers 24 and 25 are laminated on the upper and lower sides of the insulating layer 22 is performed And then selectively removing only the lower copper foil layer 25 and the insulating layer 22 from the lower surface of the double-sided copper-clad laminate 20 by laser drilling, as shown in FIG. 2 (B) And the inner surface of the upper copper foil layer 24 is exposed to form one or more via holes 30.

As shown in FIG. 2 (c), a thin copper film is formed on the side wall of the via hole 30 by a chemical or physical method, and then electrolytic copper plating is performed to fill the via hole 30, And the upper and lower copper plating layers 34 and 35 are formed on the lower copper foil layers 24 and 25, respectively. The chemical method for forming the thin copper coating is chemical plating, and the physical method is sputtering.

Subsequently, as shown in FIG. 2 (D), the upper and lower copper plating layers 34 and 35 are exposed to light and patterned by the photolithography method using the via hole 30 as a center, And the lower connection terminal portion 45 to be used as the lower electrode terminal of the substrate are formed.

The upper and lower connection terminal portions 44 and 45 are two for one LED element and are for positive and negative electrodes.

At this time, electroplating is controlled so that the dimples 36 are formed on the exposed surface of the via hole 30.

The dimple 36 may be useful in preventing displacement of the LED element in a separate process for surface-mounting the completed LED device manufactured using the present invention on a circuit board where necessary. This is because, as described above, a patent for forming a stopping groove of a circuit board for preventing displacement at the time of surface mounting of the LED element described in the prior art has been patented and proved the inventive feature of the present invention due to remarkable action effects I will.

A silver plating layer 52 is formed on the outer surfaces of the upper connection terminal portion 44 or the upper and lower connection terminal portions 44 and 45 of the upper and lower connection terminal portions 44 and 45 as shown in FIG. Forming step e). As described above, the step of applying the flux layer 54 to the upper portion of the lower connection terminal portion 45 formed in Step e) for the subsequent process such as surface mounting may be provided.

The flexible circuit board completed in the step e) is produced as an LED package including a plurality of LED elements arrayed by a subsequent process such as attaching an LED chip. That is, as shown in FIG. 2 (b), the LED chip 60 is aligned on the upper connection terminal portion in a predetermined position to attach and electrically connect pads 62a and 62b serving as LED electrode terminals, The outer shape is formed by the permeable resin 72. The pads 62a and 62b may be electrically connected to the upper connection terminal portion 44 by bumps 56 using gold (Au).

Thereafter, production is completed as one unit LED element or several units of LED element packages from the arrayed state within the size range of the first FCCL through a sawing process for cutting the sawing line S shown in FIG. 2 (bar) After that, it will be attached to carrier tapes according to the grades inspected after classification inspection, and it will be produced and shipped.

2 (e), the insulating layer 22 remaining after the step of forming the connection terminal portions 44 and 45 is completed, It is necessary to align and align the via holes 30 with each other in the entire process from the time of drilling the through holes.

In the LED package of the present invention, the LED package is formed in an array state in which the insulating layer 22 is a lead frame and a plurality of LED packages are connected to each other. In the LED package, the upper and lower portions of the insulating layer are filled with the via- The lower electrode connection portions 44 and 45 are formed as two adjacent and electrically separated groups, which are provided for the construction of one LED package.

As described above, the LED chip is attached and electrically connected to the upper portion of the upper connection terminal portion provided in the two pairs of the flexible circuit board for the LED package of the present invention, And then, the LED packages are arrayed to form a single LED package.

In the present invention manufactured by the above-described process, a flip chip may be used as the LED chip 60, or a chip for wire bonding may be used.

In the case of a flip chip, the flip chip pads (62a, 62b) are positioned on the two top connection terminal portions (44). When a chip for wire bonding is used in place of the flip chip, the chip is positioned and attached to either one of the upper and lower sides of the upper connection terminal portion, and is completed by wire bonding to the other upper connection terminal portion. In this case, the upper connection terminal portions 44 and 45 may be formed with a larger pattern area on the side where the LED chip 60 is mounted, and the size of the pattern area may also be set to the size of the terminals 62a and 62b of the LED chip 60 The number of the via holes 30 is not limited to two as shown in FIG. 2, and in order to increase the heat transfer capacity for heat radiation, ) And (b) two or more via holes as shown in the drawing.

In the meantime, the function and effect of the via hole, which is one of the main features of the present invention, will be described concretely. The copper filling portion 32 of the copper filled in the via hole serves as an electrical connection, Is used as a portion that acts to perform the operation. Therefore, the shorter the length of the copper-made filling post 32 having a high thermal conductivity and the larger the total cross-sectional area occupied by the filling posts 32, the better the heat dissipation effect. Based on this, the present invention, which is fabricated as a flexible circuit board using FCCL, has a thin thin LED package substrate, which shortens the heat transfer distance. Therefore, there will be no problem of heat dissipation measures on the side of the length of the filling post 32. Further, if the number of the via holes 30 is increased, heat dissipation problem of the LED element will be further solved.

6A and 6B, the present invention is configured by forming a plurality of via holes 30 in the pattern region of the unit lower connection terminal portion 45 described above. 6A, the number of the via holes 30 is increased to increase the cross-sectional area of the filled filling posts 32 and to increase the cross-sectional area of the circular via holes (FIG. 6A) in the unit connection terminal portion pattern in order to further increase the heat dissipation effect. In order to make the bottom surface and cross-sectional shape of the via hole 30 to be square as shown in FIG. 6B in order to form more via holes than in the step (b) of FIG. 2, laser drilling Processing. The rectangular via hole 30 is advantageous in increasing the cross-sectional area occupied by the plurality of via holes 30 per unit area of the circuit pattern of the lower connection terminal portion 45 as compared with the circular via hole. Conversely, if the number of the circular via holes 30 is increased to increase the unit area, it is disadvantageous in hole processing at the approach distance between the adjacent via holes 30. This is disadvantageous in the case of interference between neighboring via holes at the time of forming the via holes 30. [ Resulting in product failure such as occurrence or burrs in the edge of the via hole. Conversely, when a square via hole is formed, the heat radiation efficiency is lower than that in the case of a circular via hole in the same condition.

6A and 6B illustrate the shapes of a plurality of via holes 30 having a suitable distance between the lower connection terminal portions 45 of the flexible circuit board for LED package. About 100 .mu.m is suitable. Therefore, it can be seen that the number of the via holes must be different according to the circuit pattern area size of the connection terminal portion. In addition, it is preferable that the separated distance between the two connection terminal portions is set to about 100 mu m in order to maximize the heat dissipation effect and prevent electric short-circuiting.

If the present invention is a relatively unimportant part of the present invention in the series of processes described above and this part is a well-known processing method well known to a person skilled in the art, It will be understood that the scope of the present invention is not limited to the extent to which it is mutually interchangeable or simple and the scope of the present invention is supported by many precedents.

≪ Embodiment 2 >

For example, as shown in FIG. 3, the lower surface of the copper-clad laminate 20 is protected with a masking film 70, and copper plating is first performed by electrolytic plating only on the upper surface of the copper- The lower copper foil and the insulating layer are drilled from the surface of the copper foil 25 to form a via hole which is not penetrated to the copper plated portion, Thus, even when the copper foil is thin and the drilling depth is slightly inaccurate at the time of drilling, it is possible to prevent the product from leading to defective products. The masking film 70 is used as a protective layer so that the lower surface of the masking film 70 is not plated at the time of electroplating, and the masking film 70 is not used for general purpose exposure. The masking film may be replaced with a carrier film that is easy to adhere and remove.

In the second embodiment described above, the same reference numerals as in the first embodiment correspond to the same components.

≪ Third Embodiment >

In addition, the upper and lower connection terminal portions serving as electrodes of the LED package may be patterned in a copper foil state, and then electrolytic plating may be performed.

More specifically, the step of c) and the step d) of the first embodiment may be carried out to pattern the center of the via hole by photolithography as a step c) And a step of forming a lower copper foil pattern is performed. As a step d), a copper or a copper foil is formed on the side wall of the via hole 30 by a chemical or physical method, and electrolytic copper plating is performed to fill the via hole 30 The upper and lower copper plating layers 34 and 35 are formed on the patterned upper and lower copper foil patterns, respectively, and a silver plating layer is formed on the upper and lower copper plating layers 34 and 35, thereby forming an upper connection terminal portion 44 to be electrically connected to the LED chip, A step of forming a lower connection terminal portion 45 to be used as a lower electrode terminal can be performed to manufacture a flexible circuit board for an LED package.

The method of the third embodiment may be disadvantageous in terms of workability, stability, and the like due to the conditions of the process equipment and the process environment up to now compared to the first embodiment described above, but may be improved due to improvements in jigs and equipment . In the drawings of the third embodiment, the same constituent elements are given the same reference numerals as the drawings of the first and second embodiments.

<Fourth Embodiment>

In addition to the first to third embodiments using the double-sided FCCL, the present invention is also applicable to a manufacturing method of a flexible circuit board for an LED package manufactured using a copper foil used for a flexible circuit board as shown in Fig. 5, And may be implemented as a structure of a manufactured LED.

More specifically, preparing a copper foil having a single-sided copper foil layer 124 and attaching a carrier film 170 to the entire lower surface thereof; Selectively removing the copper foil layer (124) attached to the carrier film (170) to form a copper foil pattern to be a base of the connection terminal portion; Coating an insulating resin made of PI ink on the entire upper surface of the carrier film including the copper foil pattern, planarizing the film with a squeeze 182, and then curing to form an insulating layer 122; Polishing the insulating layer 122 to expose an upper surface of the copper foil pattern; Electroplating the exposed substrate of the copper foil pattern to form a copper plated layer (134) on the copper foil pattern; Removing the carrier film 170 on the lower part of the copper plating layer 134 to connect the copper foil pattern with the insulating layer 122 as a frame and forming a silver plating layer 152 on the copper plating layer And the upper and lower connection terminal portions 144 and 145 are formed. As shown in FIG. 5 (e), the LED chip is mounted on the flexible circuit board manufactured as described above, and the LED device is obtained by staking the sawing line S after application of the resin.

The LED package manufactured by the flexible printed circuit board for LED package using the copper foil manufactured according to the fourth embodiment has a structure in which the connection terminal portions are supported by using the insulation layer cured by the PI ink as a frame.

The LED package according to the present invention is configured in the same manner as the above-described various embodiments, and the LED package of the present invention can be manufactured by using the LED package of the present invention as a conventional flexible printed circuit board which is much cheaper than a ceramic substrate, It is very difficult to make the cross-sectional area of itself or the via holes different by the process of manufacturing the upper and lower connection terminal portions made of copper (Cu) material having a high thermal conductivity as a thin structure compared to a technology using a conventional flexible circuit board, It is possible to easily provide heat dissipation measures from the middle output to the large output LED.

20: copper-clad laminate 22: insulating layer
24: upper copper foil layer 25: lower copper foil layer
30: via hole 32: pre-treatment copper film
34: upper copper plating layer 35: lower copper plating layer
36: dimple 44: upper connection terminal portion
45: lower connection terminal portion 52: silver plated layer
56: Bump 60: LED chip
70: masking film

Claims (2)

  1. Preparing a copper foil having a single copper foil layer (124) and attaching a carrier film (170) to a lower entire surface of the copper foil; Selectively removing the copper foil layer (124) attached to the carrier film (170) to form a copper foil pattern to be a base of the connection terminal portion; Coating an insulating resin made of PI ink on the entire upper surface of the carrier film including the copper foil pattern, planarizing the film with a squeeze 182, and then curing to form an insulating layer 122; Polishing the insulating layer 122 to expose an upper surface of the copper foil pattern; Electroplating the exposed substrate of the copper foil pattern to form a copper plated layer (134) on the copper foil pattern; Removing the carrier film 170 on the lower part of the copper plating layer 134 to connect the copper foil pattern with the insulating layer 122 as a frame and forming a silver plating layer 152 on the copper plating layer To thereby form the upper and lower connection terminal portions (144, 145).
  2. The LED package according to any one of the preceding claims, wherein the connection terminal portions, which are electrodes of the LED device, are supported with the insulation layer (122) cured by the PI ink as a frame. package.
KR1020160060291A 2016-05-17 2016-05-17 Manufacturing method for LED package type FPCB using Copper plate, and LED package produced thereby KR101824557B1 (en)

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Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2012124358A (en) 2010-12-09 2012-06-28 Citizen Electronics Co Ltd Semiconductor light emitting device and manufacturing method of the same

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KR101423458B1 (en) 2008-03-26 2014-07-28 서울반도체 주식회사 Flexible circuit board and led lighting apparatus comprising the same
WO2010040350A1 (en) 2008-10-10 2010-04-15 Widex A/S A retaining module for the earpiece of a hearing aid
KR20140013612A (en) 2012-07-25 2014-02-05 서호이노베이션(주) Chip on metal type heat radiating printed circuit board and manufacturing the same
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JP2012124358A (en) 2010-12-09 2012-06-28 Citizen Electronics Co Ltd Semiconductor light emitting device and manufacturing method of the same

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