CN114710609A - Automatic focusing camera module and automatic focusing camera module assembling method - Google Patents
Automatic focusing camera module and automatic focusing camera module assembling method Download PDFInfo
- Publication number
- CN114710609A CN114710609A CN202210343018.6A CN202210343018A CN114710609A CN 114710609 A CN114710609 A CN 114710609A CN 202210343018 A CN202210343018 A CN 202210343018A CN 114710609 A CN114710609 A CN 114710609A
- Authority
- CN
- China
- Prior art keywords
- lens
- barrel
- base
- camera module
- lower lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/67—Focus control based on electronic image sensor signals
Abstract
The invention relates to the technical field of cameras, and particularly discloses an automatic focusing camera module, which comprises an upper lens group, a T-lens, a lower lens group, a base and a circuit board, wherein the upper lens group is arranged on the upper surface of the base; the T-lenses are arranged between the upper lens group and the lower lens group; conducting circuits are arranged on the top and the side wall of the lower lens group; the side wall of the base corresponding to the lower lens group is also provided with a conductive circuit; the conductive circuit of the lower lens group is electrically connected with the guide circuit of the base, and the conductive circuit of the base is electrically connected with the circuit board. By adopting the technical scheme of the invention, automatic focusing can be realized in a smaller structural size.
Description
Technical Field
The invention relates to the technical field of cameras, in particular to an automatic focusing camera module and an automatic focusing camera module assembling method.
Background
At present, cameras have been generally applied to a plurality of fields such as cell-phone, flat panel, notebook, security protection, on-vehicle, medical treatment, control, and the camera has proposed different demands to various parameters of camera in the application process in different fields, for example: the structure size of a mobile phone camera and the like applied to the consumption field is required to be smaller, and the quality requirement of pictures shot by the camera is continuously improved while the structure size of the camera is reduced; the front camera of the mobile phone is required to realize small head and small size and also realize focusing function.
Therefore, an auto-focusing camera module with a small structural size and an assembling method of the auto-focusing camera module are needed.
Disclosure of Invention
The invention provides an automatic focusing camera module which can realize automatic focusing in a smaller structural size.
In order to solve the technical problem, the present application provides the following technical solutions:
the automatic focusing camera module comprises an upper lens group, a T-lens, a lower lens group, a base and a circuit board;
the T-lenses are arranged between the upper lens group and the lower lens group;
conducting circuits are arranged on the top and the side wall of the lower lens group; the side wall of the base corresponding to the lower lens group is also provided with a conductive circuit;
the conductive circuit of the lower lens group is electrically connected with the guide circuit of the base, and the conductive circuit of the base is electrically connected with the circuit board.
The basic scheme principle and the beneficial effects are as follows:
in the prior art, the T-lens is usually directly placed at the top of the camera module, but the height of the camera is increased, and the X/Y direction size of the camera is increased due to the fact that the T-lens needs to be electrified, the top is placed, a circuit is arranged, the appearance of the camera is affected, and a small-head camera cannot be manufactured. According to the scheme, the T-lens is placed between the upper lens group and the lower lens group, the light path design is completed together with the whole lens, the conducting circuit is directly arranged on the outer wall of the lower lens group and the outer wall of the base, the volume occupation caused by the arrangement of the circuit is reduced, the power supply requirement of the T-lens is met, and the size of the camera is reduced. Under the action of the electrified voltage, the surface curvature of the T-lens can change, so that the lens can realize zooming. The camera module can replace an AF motor function, the T-lens has the advantages of being fast in focusing and low in power consumption, and performance of the camera module is improved.
In conclusion, the automatic focusing can be realized in a smaller structural size.
Further, the upper lens group comprises an upper lens barrel, a first lens and a second lens; the first lens and the second lens are sequentially arranged in the upper lens cone;
the lower lens group comprises a lower lens cone, a third lens, a fourth lens and a fifth lens; the third lens, the fourth lens and the fifth lens are sequentially arranged in the lower lens cone;
and conductive circuits are arranged on the top and the side wall of the lower lens barrel.
Further, the lower lens cone and the base are molded by LDS materials, and the conducting circuit is obtained by laser etching and copper plating.
The LDS process copper plating is a technology for directly transferring a circuit pattern onto the surface of a molded plastic original by using numerical control laser and forming a circuit intercommunication structure by using the three-dimensional surface of a three-dimensional workpiece, and T-lens conduction can be realized on the premise of not increasing the size of a module by using a changed technology.
The automatic focusing camera module assembling method comprises the following steps:
s1, plating copper on the top and the side wall of the lower lens barrel and the side wall of the base corresponding to the lower lens barrel through an LDS process to form a conductive circuit;
s2, attaching the photosensitive chip to the circuit board;
s4, attaching the base to the circuit board, and attaching the T-lens to the lower lens barrel;
s5, respectively connecting the positive electrode and the negative electrode of the T-lens with the conducting circuit of the lower lens barrel;
s6, the upper lens barrel and the lower lens barrel are jointed, and the lower lens barrel and the base are jointed;
and S7, electrically connecting the conductive circuit of the lower lens cone with the conductive circuit of the base, and electrically connecting the conductive circuit of the base with the circuit board.
According to the scheme, the T-lenses are placed between the upper lens group and the lower lens group, the light path design is completed together with the whole lens, the conducting circuit is directly arranged on the outer wall of the lower lens group and the outer wall of the base, the occupied volume caused by the arrangement of the circuit is reduced, the power supply requirement of the T-lenses is met, and the size of the camera is reduced.
Further, in S6, the upper lens barrel and the lower lens barrel, and the lower lens barrel and the base are bonded together by an AOA process; the AOA process specifically comprises the following steps:
s601, lighting the photosensitive chip;
s602, placing the upper lens barrel and the lower lens barrel above the photosensitive chip simultaneously for imaging;
s603, confirming the definition of the test pattern through the photosensitive chip, and determining the relative positions of the upper lens barrel and the lower lens barrel based on the definition;
s604, fixing the upper lens barrel, the lower lens barrel and the base.
The lens is divided into an upper group and a lower group which cannot be completed by adopting a conventional AA (advanced acrylic acid) process, the upper group and the lower group are simultaneously placed above the photosensitive chip to form images after the photosensitive chip is lightened, the definition of a test chart is confirmed through the photosensitive chip to determine the required reduction of the upper group and the lower group, and the positions of the upper group and the lower group are fixed through glue to meet the performance requirement of the camera.
Further, in step S5, the positive electrode and the negative electrode of the T-lens are connected to the conductive traces of the lower barrel, respectively, by a gold wire process.
Further, in step S603, it is further determined whether the offset between the upper barrel and the lower barrel exceeds a preset offset range based on the relative positions of the upper barrel and the lower barrel, and if so, an alarm is issued.
The upper lens barrel and the lower lens barrel with excessive offset can be prevented from being assembled.
Drawings
Fig. 1 is an exploded view of an auto-focus camera module according to an embodiment;
fig. 2 is a partially enlarged view of a portion a in fig. 1.
Detailed Description
The following is further detailed by way of specific embodiments:
the reference numbers in the drawings of the specification include: the optical lens comprises an upper lens group 1, a T-lens2, a lower lens group 3, a base 4, an optical filter 5, a photosensitive chip 6, a circuit board 7, a conducting circuit 8 and a gold wire 9.
Example one
As shown in fig. 1, the auto-focusing camera module of the present embodiment includes: the device comprises an upper lens group 1, a T-lens2, a lower lens group 3, a base 4, a filter 5, a photosensitive chip 6 and a circuit board 7.
The upper lens group 1 comprises an upper lens cone, a first lens, a second lens and a plurality of first space rings; in this embodiment, the number of the first space rings is 1; the first lens, the second lens and the first space ring are arranged in the upper lens cone, and the first space ring is located between the first lens and the second lens and used for separating the first lens and the second lens, controlling the distance between the first lens and the second lens and preventing the first lens and the second lens from rubbing with each other. In this embodiment, the thickness of the first lens edge is 0.2mm, the thickness of the second lens edge is 0.1mm,
the lower lens group 3 includes a lower lens barrel, a third lens, a fourth lens, a fifth lens, and a plurality of second space rings. In this embodiment, the number of the second space rings is 3. The third lens, the fourth lens, the fifth lens and the second space ring are arranged in the lower lens cone. The 3 second space rings are respectively positioned between the lower lens cone and the third lens, between the third lens and the fourth lens and between the fourth lens and the fifth lens. In this embodiment, the thickness of the third lens edge is 0.18 mm.
T-lenses 2 are provided between the upper lens group 1 and the lower lens group 3. T-lens2 includes piezoelectric films, glass films, high molecular weight polymers, and glass scaffolds.
The optical filter 5 is fixed in the base 4, and the photosensitive chip 6 is arranged on the circuit board 7; the upper lens group 1, the T-lens2, the lower lens group 3, the base 4, the photosensitive chip 6 and the circuit board 7 are sequentially combined from top to bottom to form a camera module.
The top and the side wall of the lower lens cone are provided with conducting circuits 8; the side wall of the base 4 corresponding to the lower lens barrel is also provided with a conductive circuit 8. In this embodiment, the lower barrel and the base 4 are molded by LDS material, and the conductive circuit 8 is obtained by laser etching and copper plating. The LDS material is a modified plastic containing an organometallic complex, which is irradiated with laser light to release particles.
The conductive line 8 of the lower barrel is electrically connected to the guide line of the base 4, and the conductive line 8 of the base 4 is electrically connected to the circuit board 7.
As shown in fig. 2, the positive and negative electrodes of T-lens2 are connected to conductive traces 8 of the lower barrel by gold wires 9, respectively. When the circuit board 7 is energized, the light sensing chip 6 is lighted while the T-lens2 is energized.
When the piezoelectric film is used, after voltage is applied to the positive electrode and the negative electrode of the T-lens2, the piezoelectric film forms extrusion force, the high polymer deforms under the extrusion force, the glass film protrudes, and the focal length of the T-lens2 is changed. The T-lens2 focal length change combines the upper lens group 1 and the lower lens group 3 to achieve the whole lens focal length change.
When the camera module shoots scenes with different distances, the T-lens2 can quickly focus for a cycle, and the T-lens2 is deformed and fixed at the clearest photosensitive position of the sightseeing chip, so that the clearest picture can be obtained by quickly focusing.
Based on the automatic focusing camera module, the embodiment further provides an automatic focusing camera module assembling method, which includes the following steps:
s1, plating copper on the top and the side wall of the lower lens barrel and the side wall of the base 4 corresponding to the lower lens barrel through an LDS process to form a conductive circuit 8; the LDS process copper plating refers to a technology of directly transferring a circuit pattern onto the surface of a molded plastic original by using numerical control laser and forming a circuit interconnection structure by using the three-dimensional surface of a three-dimensional workpiece.
S2, attaching the photosensitive chip 6 to the circuit board 7 through a COB packaging process;
s4, attaching the base 4 and the circuit board 7 through LHA equipment, and attaching the T-lens2 and the lower lens barrel; specifically, LHA equipment is equipped with two upper and lower absorption tool and upper and lower 2 CCD, take laminating base 4 and circuit board 7 as an example, go up absorption tool absorption base 4, and through 4 edge profile of CCD discernment base down, absorb tool absorption circuit board 7 down, and through last CCD discernment chip profile, then draw on circuit board 7 and glue, according to 4 edge profile of base and the chip profile of upper and lower two CCD discernments, calculate the center of base 4 and circuit board 7, with base 4 and circuit board group dress laminating together. The fitting of T-lens2 to the lower barrel was performed by calculating the center of T-lens2 and the lower barrel from the edge profile of T-lens2 and the edge profile of the lower barrel.
S5, respectively connecting the positive electrode and the negative electrode of the T-lens2 with the conducting circuit 8 of the lower lens barrel through a gold wire making process;
s6, completing the joint of the upper lens cone, the lower lens cone and the base 4 through an AOA process; compared with the existing lens, in the embodiment, the camera module is divided into the upper lens group 1 and the lower lens group 3, and the conventional AA process cannot be adopted to complete the attachment. The AOA process specifically comprises the following steps:
s601, lighting the photosensitive chip 6;
s602, placing the upper lens barrel and the lower lens barrel above the photosensitive chip 6 at the same time for imaging;
s603, confirming the definition of the test chart through the photosensitive chip 6, and determining the relative positions of the upper lens barrel and the lower lens barrel based on the definition; in this embodiment, the side view is a Chart.
S604, fixing the upper lens barrel, the lower lens barrel and the base 4 in a glue drawing mode;
s7, communicating the T-lens2 with the circuit board 7 through a silver paste supplementing process; specifically, silver paste is filled between the conductive line 8 of the lower barrel and the conductive line 8 of the base 4, and between the conductive line 8 of the base 4 and the circuit board 7.
The conventional application is that T-lens2 is directly placed at the top of the camera module, so that the height of the camera module is increased, and the X/Y direction size of the camera module is increased due to the fact that T-lens2 needs to be electrified and the top is placed to arrange a circuit, so that the appearance of the camera module is influenced, and the size of the camera module cannot be reduced. The scheme places T-lens2 between second lens and the third lens, accomplishes the light path design with whole camera lens together, has beautified camera module outward appearance, has reduced the size of camera module. In the scheme, the T-lens2 is arranged between the upper lens group 1 and the lower lens group 3, and the surface curvature of the T-lens2 can change under the action of the electrified voltage, so that the lens can realize zooming. The camera module can replace an AF motor function, the T-lens2 has the advantages of being fast in focusing and low in power consumption, and the performance of the camera module is improved.
Because the thickness of the T-lens2 body is 0.4mm, the gold thread arc height of the anode and the cathode is 0.08mm, and the thickness of the AA process glue is 0.12mm (including the gold thread arc height), namely the reserved distance between the second lens and the third lens is 0.42mm, and the design distance of the conventional lens is 0.06mm, the light design difficulty is greatly increased. In the scheme, the required distance is reserved by reducing the thickness of the edge of the first lens to 0.2mm, the thickness of the edge of the second lens to 0.3mm to 0.1mm and the thickness of the edge of the third lens to 0.3mm to 0.18 mm.
Example two
The difference between this embodiment and the first embodiment is that, in step S603, it is further determined whether the offset amount of the upper lens barrel and the lower lens barrel exceeds a preset offset range, if so, an alarm is issued, an external power supply is further used to supply power to the T-lens, the curvature of the surface of the T-lens is adjusted, the sharpness of the test chart is confirmed again through the photo sensor chip, the relative positions of the upper lens barrel and the lower lens barrel are determined based on the sharpness, it is continuously determined whether the offset amount of the upper lens barrel and the lower lens barrel exceeds the preset offset range, if not, it is determined that the T-lens is a problem, if so, in step S4, the edge contour of the T-lens of the present camera module and the edge contour of the lower lens barrel, and the edge contour of the T-lens of the previous camera module and the edge contour of the lower lens barrel are respectively compared, and judging whether the difference exists or not, if so, judging the problem is a T-lens problem, and if not, judging the problem is a lens problem.
In this embodiment, when the upper lens barrel, the lower lens barrel and the base are attached to each other, a situation that an offset of the upper lens barrel and the lower lens barrel exceeds a preset offset range may occur, and at this time, a problem may occur in a light path of a lens or a T-lens, which may cause an excessive offset and require a preliminary judgment on a reason. By using an external power supply, the T-lens can be electrified in advance, imaging is carried out after the surface curvature of the T-lens is adjusted, the relative positions of the upper lens cone and the lower lens cone are adjusted, and if the relative positions of the upper lens cone and the lower lens cone do not exceed the preset offset range, the problem of the light path is proved to be solved. The T-lens initial surface curvature is highly likely to have a problem, and therefore, it is judged to be a T-lens problem. If the situation that the deviation range exceeds the preset deviation range still exists, the problem of the optical path is proved to be incapable of being solved by adjusting the curvature of the surface of the T-lens; by comparing the edge profile of the T-lens of the camera module with the edge profile of the lower lens barrel, and the edge profile of the T-lens of the previous camera module with the edge profile of the lower lens barrel, if there is a difference, it may be that the difference of the edge profiles causes the difference between the calculated T-lens and the center of the lower lens barrel, and further causes the problem of the fitting of the T-lens and the lower lens barrel. If the difference does not exist, the centers of the T-lens and the lower lens cone of the camera module are consistent with the center of the last camera module, and the condition that the T-lens and the lower lens cone are attached to each other to cause a problem is eliminated, so that the problem is judged to occur when the lens is installed.
The above are only examples of the present invention, and the present invention is not limited to the field related to the embodiments, the general knowledge of the specific structures and characteristics of the embodiments is not described herein, and those skilled in the art can know all the common technical knowledge in the technical field before the application date or the priority date, can know all the prior art in the field, and have the capability of applying the conventional experimental means before the application date, and those skilled in the art can combine the capabilities of themselves to complete and implement the present invention, and some typical known structures or known methods should not become obstacles for those skilled in the art to implement the present application. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several changes and modifications can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent. The scope of the claims of the present application shall be determined by the contents of the claims, and the description of the embodiments and the like in the specification shall be used to explain the contents of the claims.
Claims (7)
1. The automatic focusing camera module is characterized by comprising an upper lens group, a T-lens, a lower lens group, a base and a circuit board;
the T-lenses are arranged between the upper lens group and the lower lens group;
conducting circuits are arranged on the top and the side wall of the lower lens group; the side wall of the base corresponding to the lower lens group is also provided with a conductive circuit;
the conductive circuit of the lower lens group is electrically connected with the guide circuit of the base, and the conductive circuit of the base is electrically connected with the circuit board.
2. The auto-focus camera module of claim 1, wherein: the upper lens group comprises an upper lens cone, a first lens and a second lens; the first lens and the second lens are sequentially arranged in the upper lens cone;
the lower lens group comprises a lower lens cone, a third lens, a fourth lens and a fifth lens; the third lens, the fourth lens and the fifth lens are sequentially arranged in the lower lens cone;
conductive circuits are arranged on the top and the side wall of the lower lens barrel.
3. The auto-focus camera module of claim 1, wherein: the lower lens cone and the base are molded by LDS materials, and the conducting circuit is obtained by laser etching and copper plating.
4. The assembly method of the automatic focusing camera module is characterized by comprising the following steps:
s1, plating copper on the top and the side wall of the lower lens barrel and the side wall of the base corresponding to the lower lens barrel through an LDS process to form a conductive circuit;
s2, attaching the photosensitive chip to the circuit board;
s4, attaching the base to the circuit board, and attaching the T-lens to the lower lens barrel;
s5, respectively connecting the positive electrode and the negative electrode of the T-lens with the conducting circuit of the lower lens barrel;
s6, the upper lens barrel and the lower lens barrel are attached to each other, and the lower lens barrel and the base are attached to each other;
and S7, electrically connecting the conductive circuit of the lower lens cone with the conductive circuit of the base, and electrically connecting the conductive circuit of the base with the circuit board.
5. The auto-focus camera module assembly method of claim 4, wherein: in the step S6, the upper lens barrel and the lower lens barrel are bonded together, and the lower lens barrel and the base are bonded together by an AOA process; the AOA process specifically comprises the following steps:
s601, lighting the photosensitive chip;
s602, placing the upper lens barrel and the lower lens barrel above the photosensitive chip simultaneously for imaging;
s603, confirming the definition of the test pattern through the photosensitive chip, and determining the relative positions of the upper lens barrel and the lower lens barrel based on the definition;
s604, fixing the upper lens barrel, the lower lens barrel and the base.
6. The auto-focus camera module assembly method of claim 4, wherein: in step S5, the positive electrode and the negative electrode of the T-lens are connected to the conductive traces of the lower barrel, respectively, by a gold wire process.
7. The auto-focus camera module assembling method according to claim 5, wherein: in step S603, it is further determined whether the offset between the upper barrel and the lower barrel exceeds a preset offset range based on the relative positions of the upper barrel and the lower barrel, and if so, an alarm is issued.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210343018.6A CN114710609A (en) | 2022-03-31 | 2022-03-31 | Automatic focusing camera module and automatic focusing camera module assembling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210343018.6A CN114710609A (en) | 2022-03-31 | 2022-03-31 | Automatic focusing camera module and automatic focusing camera module assembling method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114710609A true CN114710609A (en) | 2022-07-05 |
Family
ID=82172442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210343018.6A Pending CN114710609A (en) | 2022-03-31 | 2022-03-31 | Automatic focusing camera module and automatic focusing camera module assembling method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114710609A (en) |
-
2022
- 2022-03-31 CN CN202210343018.6A patent/CN114710609A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11543567B2 (en) | Camera module including liquid lens, optical device including the same, and method of manufacturing camera module including liquid lens | |
| CN110326280B (en) | Array camera module and application thereof | |
| EP3334145B1 (en) | Multi-lens camera module conjoined stand, multi-lens camera module and application thereof | |
| CN109688303B (en) | Photosensitive assembly jointed board, photosensitive assembly, camera shooting module and manufacturing method | |
| KR20170099764A (en) | Camera module with compression-molded circuit board and manufacturing method thereof | |
| TWI657306B (en) | Array camera module and molded photosensitive component thereof, circuit board assembly and manufacturing method, and electronic device | |
| WO2017140118A1 (en) | Array camera module, molded photosensitive component and circuit board component of same, manufacturing method therefor, and electronic device | |
| CN112600999A (en) | Camera module, molded circuit board assembly thereof, preparation method and electronic equipment | |
| TWI728690B (en) | Imaging lens assembly, camera module and electronic device | |
| CN214756582U (en) | Optical lens and camera module | |
| CN114070966B (en) | Camera module and terminal equipment | |
| EP3562138A1 (en) | Array camera module and use thereof | |
| CN115136052B (en) | Split type zoom lens, camera module and corresponding assembly method | |
| CN110291444B (en) | Camera module including liquid lens and optical apparatus | |
| US20230328350A1 (en) | Camera module and molded photosensitive assembly and manufacturing methods thereof, and electronic device | |
| CN114710609A (en) | Automatic focusing camera module and automatic focusing camera module assembling method | |
| CN114647133A (en) | Lens, camera module comprising same and assembling method | |
| CN113542552A (en) | Camera module and equipment | |
| CN112444936B (en) | Under-screen camera shooting assembly, camera shooting module, optical lens and manufacturing method of under-screen camera shooting assembly | |
| CN115412653A (en) | Optical lens and camera module | |
| CN110418985B (en) | Camera module comprising a liquid lens and optical device comprising a camera module | |
| KR20170123795A (en) | Lens and Camera module including the same | |
| CN206629143U (en) | A kind of photographing module and electronic installation | |
| CN111385442A (en) | Lens assembly, photosensitive assembly, camera module and assembling method thereof | |
| CN112311968A (en) | Photosensitive assembly, camera module, manufacturing method of camera module and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |