M284071M284071
【新型所屬之技術領域】 本新型涉及攝像模組的結 組成像區域的封裝裝置。 具體地說是指攝像模 【先前技術】 攝 話、車 術中， 刷電路 每平方 ，通過 能，還 經 影像感 圍的其 在出廠 品判定 圍的其 模組在 感光晶 攝像模 因 像感光 品質將 橡模組 載系統 攝橡模 板和連 英尺允 一系列 要經過 過如此 光晶片 他區域 前，可 為不合 他區域 經過運 片表面 組生產 此’開 晶片表 具有極 主要應 、醫療 組由半 接器組 許最多 自動化 振動、 多的程 的表面 。若灰 通過一 格產品 ，目前 輸及客 ，使該 企業的 發一種 面成像 大的意 用於數螞相 糸統、安入 導體影像感 t而成，組 有10個直經 設備自動完 調焦、功測 式之後，產 ’也可能落 塵落在半導 系列自動檢 ;若灰塵落 尚沒有較好 戶振動實驗 產品變成不 最大困擾。 能夠最大限 區域的封裝 義。 機 可攝像手機、可視電 監控系統等領域。現有技 光晶片、鏡頭、底座、印 裳過程必須在無塵室，即 為〇·5游的灰塵的空間内 成。要使產品有預期的功 等一系列工序。 生的灰塵可能落在半導體 到半導體影像感光晶片周 體影像感光晶片的表面 測設備檢測出來，將今I 在半導體影像感光晶片周 的方法進行檢測，而攝像 後’這些灰塵有可能落到 良品。這種現象已經成為 度防止灰塵落到半導體$ 結構’對提南攝像模組的 【新型内容】[Technical Field of New Type] The present invention relates to a packaging device for a group imaging area of a camera module. Specifically, it refers to the camera module. [Prior technology] In telephony and driving, each square of the brush circuit passes the energy and also passes through the image sensing range. Its module is determined at the factory. The rubber module-mounted system with a rubber template and a pair of feet allows a series of wafers to pass through other areas of the wafer, so that unsuitable areas can be produced through the wafer transport surface group. The connector set allows for a maximum of automated vibration, multi-pass surfaces. If the ash passes a grid product, it is currently lost to customers, so that the company will send a large-scale image intended for counting the number of phases and the image of the conductor. The group has 10 straight-through equipment to automatically complete the adjustment. After the coke and power measurement, the product may also fall into the semi-conductor series for automatic inspection; if the dust has not fallen, the vibration test product will not be the biggest problem. Encapsulates the maximum area. Cameras can be used in fields such as camera phones, video surveillance systems, etc. The prior art optical wafer, lens, base, and printing process must be completed in a clean room, that is, a dusty space of 0.5 °. A series of processes must be performed to make the product function as expected. The generated dust may fall on the surface of the semiconductor image sensing wafer around the semiconductor image sensing wafer. The detection device detects the current method around the semiconductor image sensing wafer. After imaging, the dust may fall into a good product. This phenomenon has become the degree to prevent dust from falling on the semiconductor $ structure.
第5頁 M284071 四、創作說— -- 本新型提供一種攝像模組成像區域的封裝裝置，龙 =的在於克服現有技術的缺陷，即：攝像模組在組；主 測试、使用過程中由於受到振動、衝擊而產生灰塵，^ 半導體影像感光晶片的成像區域，從而 : 本新型採用如下技術方案：攝像模組成；【：心 裝置，包括印刷電路板、設於印刷電路板上方的半導體^ 像感光晶片以及連接印刷電路板和半導體影像感光晶片= 打金線，半導體影像感光晶片上表面形成一成像區域，還 包括一封裝框架，該封裝框架位於半導體影像感光晶片的 I上方，其邊緣向下延伸形成一環繞於半導體影像感光晶片 周圍的邊框，該邊框底部與印刷電路板接觸，且該邊框設 有嵌入印刷電路板的插腳；該封裝框架開設有與成像區域 相對應的通光孔，該通光孔上覆蓋有一濾光玻璃。 所述渡光玻璃散入封裝框架的上表面，濾光玻璃邊緣 和封裝框架之間通過膠粘方式密封連接。 所述的通光孔的下邊緣向下延伸形成一環繞於半導體 影像感光晶片的成像區域周圍的密封框，該密封框的底部 與半導體影像感光晶片接觸。 所述的密封框下端面與半導體影像感光晶片之間通過 膠粘方式密封連接。 所述的密封框内側壁下部形成一倒角。 所述打金線位於密封框外側壁與所述封裝框架的邊框 内側璧之間的空間内，且該空間内填充有膠體。 戶斤述封裝框架上表面邊緣設有可與鏡頭座進行裝配的Page 5 M284071 Fourth, the creation theory-This new type provides a packaging device for the imaging area of the camera module. Long = is to overcome the shortcomings of the existing technology, namely: the camera module is in the group; Dust is generated by vibration and impact, ^ the imaging area of the semiconductor image sensor wafer, so that: the new technology uses the following technical solutions: the composition of the camera module; [: core device, including a printed circuit board, a semiconductor provided above the printed circuit board ^ Like the photosensitive wafer and the connection between the printed circuit board and the semiconductor image sensitive wafer = gold wire, the upper surface of the semiconductor image photosensitive wafer forms an imaging area, and also includes a packaging frame, which is located above the semiconductor image photosensitive wafer I, and its edge faces A lower frame is formed to surround the periphery of the semiconductor image sensor chip, the bottom of the frame is in contact with the printed circuit board, and the frame is provided with pins embedded in the printed circuit board; the package frame is provided with a light through hole corresponding to the imaging area, The light passing hole is covered with a filter glass. The crossing glass is scattered on the upper surface of the packaging frame, and the edge of the filter glass and the packaging frame are sealed and connected by an adhesive method. The lower edge of the light-passing hole extends downward to form a sealing frame surrounding the imaging area of the semiconductor image sensing wafer, and the bottom of the sealing frame is in contact with the semiconductor image sensing wafer. The lower end surface of the sealing frame and the semiconductor image photosensitive wafer are sealed and connected by an adhesive method. A chamfer is formed at the lower part of the inner wall of the sealing frame. The gold wire is located in a space between the outer side wall of the sealing frame and the inner side of the frame of the packaging frame, and the space is filled with colloid. The upper edge of the packaging frame is provided with a lens mount that can be assembled with the lens holder.
第6頁 M284071 四、創作說明（3) 固定孔。 由上述對本新型結構的描诚 本實用新型具有如下優點· Z知，和現有技術相比， 一，成像區域完全祜宓扭 . 大限度地減少了攝像模組組裝、 ^ 。:、最 灰塵落到成像區域中的可能性，’因：且：：程中產生的 衝擊性能；二，具有防水、耐高優越的^振、抗 ^ ^ 』阿/皿的性能，二，該封奘从 莫組生產的模組化、標準化，具有較高的; 【較佳具體實施方式】 下面參照圖1至圖5詳細說明本新型的—個具體實施例 、攝像模組成像區域的封裝裝置，包括印刷電路板i、 半導體影像感光晶片2及封裝框架3。半導體影像感光晶片 2設於印刷電路板1上方，印刷電路板丨和半導體影像感光 晶片2邊緣位置通過打金線9連接，半導體影像感光晶片2 上表面形成一成像區域21。 該封裝框架3位於半導體影像感光晶片2的上方，其邊 緣向下延伸形成一環繞於半導體影像感光晶片2周圍的邊 框31，該邊框31底部與印刷電路板1接觸，且該邊框3丨設 有嵌入印刷電路板1的插腳3 11，該插腳311與該印刷電路 板1通過鉚接固定連接，該邊框31底部與印刷電路板1之間 通過一黑膠層8固定連接。 該封裝框架3中部開設有與成像區域2 1相對應的通光 孔3 4，該通光孔3 4邊緣上側形成自中部向四周逐漸升高的 M284071 四、創作說明（4) 二級階梯狀，内側的第一級階梯4 0内嵌設有一濾光玻璃4 ，濾光玻璃4覆蓋於該通光孔3 4上；該濾光玻璃4的外側邊 緣與第二級階梯5 〇之間形的凹槽中填充有黑膠’形成一密 封環。 通光孔3 4的下邊緣向下延伸形成一環繞於半導體影像 感光晶片2的成像區域21周圍的密封框33，該密封框33的 底部與半導體影像感光晶片2接觸，其間通過一黑膠層7固 定連接，該密封框3 3内側壁下部形成一倒角3 3 1。 打金線9位於密封框33外側壁與所述封裝框架3的邊框 塌► 3 1内側壁之間的空間9 〇内，且該空間9 0内也填充有黑膠， 為了顯示打金線9，空間90内的黑膠未示出。因此，打金 線9不會因為振動而鬆動或斷裂。 由上可知’該封裝裝置的結構使成像區域2丨完全密封 ’因而具有優越的抗振、抗衝擊、耐高溫、耐濕等性能。 採用本封裝裝置結構的攝像模組可進行標準化、系列 化、集成化生產’圖5為本創作攝像模組成像區域的封裝 裝置於標準化生產過程中切割前的拼板丨〇 1結構示意圖， 切割後可得到本新型的成品丨〇()。 M w 上述僅為本新型的 固且杳· 丨 / * ψ 、 ^ 1固具體貫施例，但本新型的設計 構思並不局限於此，凡利用μμ德 冲丄士 沾物叙 u刊用此構思對本新型進行非實質性 的改動，均應屬於侵犯本新型保護範圍的行為。Page 6 M284071 Fourth, creation instructions (3) Fixing holes. From the above description of the novel structure, the present utility model has the following advantages: · Compared with the prior art, one, the imaging area is completely twisted. The assembly of the camera module is greatly reduced. :, The possibility of the most dust falling in the imaging area, 'because: and :: impact performance in the process; two, has the performance of waterproof, high resistance to vibration, resistance ^ ^ A / dish performance, two, The seal is modularized and standardized from the Mo group. It has a high standard; [Best Mode for Carrying Out the Invention] The following describes in detail a specific embodiment of the novel camera module imaging area with reference to FIGS. 1 to 5. The packaging device includes a printed circuit board i, a semiconductor image sensing wafer 2 and a packaging frame 3. The semiconductor image sensing wafer 2 is disposed above the printed circuit board 1. The edge position of the printed circuit board 丨 and the semiconductor image sensing wafer 2 is connected by a gold wire 9. The upper surface of the semiconductor image sensing wafer 2 forms an imaging area 21. The packaging frame 3 is located above the semiconductor image sensing wafer 2, and an edge of the packaging frame 3 extends downward to form a frame 31 surrounding the semiconductor image sensing wafer 2. The bottom of the frame 31 is in contact with the printed circuit board 1, and the frame 3 is provided with The pins 3 11 of the printed circuit board 1 are embedded, the pins 311 and the printed circuit board 1 are fixedly connected by riveting, and the bottom of the frame 31 and the printed circuit board 1 are fixedly connected by a black rubber layer 8. The middle of the packaging frame 3 is provided with a light through hole 3 4 corresponding to the imaging area 2 1. The upper side of the edge of the light through hole 3 4 forms a gradually rising M284071 from the middle to the periphery. 4. Creation instructions (4) Level two step A filter glass 4 is embedded in the first step 40 on the inner side, and the filter glass 4 covers the light-passing hole 34. The shape between the outer edge of the filter glass 4 and the second step 50 is The groove is filled with black glue to form a sealing ring. The lower edge of the through-hole 34 is extended downward to form a sealing frame 33 surrounding the imaging region 21 of the semiconductor image sensing wafer 2. The bottom of the sealing frame 33 is in contact with the semiconductor image sensing wafer 2 with a black rubber layer in between. 7 fixed connection, a chamfer 3 3 1 is formed at the lower part of the inner wall of the sealing frame 3 3. The gold wire 9 is located in the space 9 between the outer side wall of the sealing frame 33 and the packaging frame 3 ► 3 1 and the inner side wall 90 is filled with black plastic. The vinyl in the space 90 is not shown. Therefore, the gold wire 9 is not loosened or broken due to vibration. From the above, it can be known that 'the structure of the packaging device completely seals the imaging area 2', and thus has superior vibration resistance, impact resistance, high temperature resistance, and humidity resistance. The camera module adopting the packaging device structure can be standardized, serialized, and integrated production. 'Figure 5 is a schematic diagram of the packaging device of the creative camera module imaging area before cutting during the standardized production After that, the new type of finished product 丨 〇 () can be obtained. M w The above is only the specific example of the new type of solid and 杳 · 丨 / * ψ and ^ 1, but the design concept of the new type is not limited to this. Any non-substantial changes to this model should be considered as an infringement on the scope of protection of this model.
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