CN205645790U - Image sensor encapsulation and escape gas tank structure thereof - Google Patents

Abstract

The utility model provides an image sensor encapsulation and escape gas tank structure thereof, this image sensor encapsulation is equipped with on this base and escapes the gas tank structure including circuit substrate, CMOS sensor, the base installed in proper order. The gas tank structure of escaping of this image sensor encapsulation including communicateing external heavy groove, communicates the inside T type groove of sensor, should be linked together with T type groove in heavy groove. Via heavy groove leaked -in air, inside the reentrant sensor in T type groove, the dust piece that carries in the air etc. Deposit through the reposition of redundant personnel in T type groove, can directly not get into the sensor inside, effective isolation dust, piece, this structure can improve the packaging and testing yield greatly to package stacking is simple for this structure.

Description

Image sensor package and escape tank structure

[technical field]

This utility model relates to communication field, especially relates to a kind of image sensor package and escapes air drain Structure.

[background technology]

Past CMOS is substantially employing wafer-level package (CSP, chip scale package；), investment is big, and cost is high.Along with panel computer, the application of wisdom mobile phone, pixel microminiaturization And the technological break-through of advanced process, drive CMOS to carry out on a large scale marching high pixel (pixel More than 5000000) application market, and wafer-level package (CSP:Chip Scale Package) is in high pixel CMOS encapsulation has defect and the bottleneck of technology, chip on board (COB:Chip On Board) encapsulation must be trend, the most helpless in 5,000,000 pixel above CSP encapsulation, it is necessary to use plate Upper chip package (COB:Chip On Board).Along with the development of science and technology, mobile phone and panel computer more come The least more thin, more and more higher to cleanliness factor, current most high pixel CMOS COB Escape hole set by the base of chip on board encapsulating structure or escape air drain, as depicted in figs. 1 and 2, existing The escaping of technology, inside air drain 110 or escape hole 120 structure through-chip, could not effectively prevent outer bound pair image The pollution of sensor, the dust in the external world, microgranule, chip etc. can enter by escaping air drain 110 or escape hole 120 Enter chip internal, so will result in that chip is bad, stain is bad, cause overall package yield low.

Therefore it provides a kind of can effectively intercept outside contamination, the encapsulation high image sensor package of yield and It is the most necessary that it escapes tank structure.

[summary of the invention]

The purpose of this utility model be to provide a kind of can effectively intercept outside contamination, shadow that encapsulation yield is high Tank structure is escaped as what sensor encapsulated.

The purpose of this utility model be to provide a kind of can effectively intercept outside contamination, shadow that encapsulation yield is high As sensor encapsulates.

For realizing this utility model purpose, it is provided that techniques below scheme:

What this utility model provided a kind of image sensor package escape tank structure, and it includes that connection is extraneous Deep gouge, the T-slot of connection sensor internal, this deep gouge is connected with T-slot.The sky flowed into via deep gouge Gas, enters back into sensor internal by T-slot, and dust chip entrained in air etc. is through T-slot Shunting precipitation, will not be directly entered sensor internal, be effectively isolated dust, chip goes to CMOS image Above sensor, this structure can be greatly improved packaging and testing yield, and this construction packages stacking is simple.

Preferably, this T-slot includes main airway and the shunting air flue being connected.The sky flowed into via deep gouge Gas, by the main airway of T-slot, changes airflow direction the most again and enters shunting air flue, the most just enter Sensor internal, dust chip entrained in air etc. precipitates through the shunting of T-slot, obtains effectively Intercept, sensor internal will not be entered.

Preferably, arranging concave structure below the main airway of this T-slot, the shunting air flue that this is connected divides Cloth is in these concave structure both sides.The air-flow entered via deep gouge, T-slot main airway, changes at concave structure Changing the flow of QI-blood flow path direction enters back into shunting air flue, and the dust chip etc. entrained by gas is sunk at concave structure Form sediment, be greatly improved the cleanliness factor of air-flow, effectively stop these dust chips to enter sensor internal.

Preferably, this T-slot escaping tank structure include two described main airways, two be arranged on main gas Concave structure below road, and three described shunting air flues, these three shunting air flues are distributed in these two The both sides of concave structure and centre.This embodiment effectively utilizes space, between two concave structures Shunting air flue shares, and makes simple and compact for structure.

This utility model also provides for a kind of image sensor package, it circuit substrate including installing successively, Cmos sensor, base, this base is provided with escapes tank structure as above.This image sensor Encapsulation can effectively intercept outside contamination, encapsulation yield height.

Preferably, this circuit substrate is provided with driving motor chip and electric capacity.

Preferably, this image sensor package also includes light-filtering glass, and this light-filtering glass is arranged on On base, part is covered and is escaped tank structure, and this deep gouge escaping tank structure is in communication with the outside.

The assembling process of this image sensor package is: is mounted on by cmos sensor and has installed electricity Hold, drive on the circuit substrate of motor chip, fast setting；Subsequently gold thread is welded, and be carried out； Then mounting seat on circuit substrate, is carried out；Finally light-filtering glass is mounted on base, Carry out hot setting.

Light-filtering glass is mounted on base, and during hot setting, T-slot and deep gouge can effectively aerofluxuss；High After temperature solidification, type groove and deep gouge can hinder extraneous dust, dirty are directly entered cmos sensor surface, Avoid causing test stain bad.

Contrast prior art, this utility model has the advantage that

This utility model image sensor package can effectively intercept outside contamination, encapsulation yield height；This practicality Novel tank structure of escaping, by deep gouge and T-slot structure, is effectively isolated dust, chip, via deep gouge stream The air entered, enters back into sensor internal by T-slot, and dust chip entrained in air etc. is through T The shunting precipitation of type groove, will not be directly entered sensor internal, be effectively isolated dust, chip goes to CMOS Above image sensor, this structure can be greatly improved packaging and testing yield, and this construction packages stacking Simply.

[accompanying drawing explanation]

Fig. 1 be prior art sensor encapsulating structure escape air drain schematic diagram；

Fig. 2 is the escape hole schematic diagram of prior art sensor encapsulating structure；

Fig. 3 is the explosive view of this utility model image sensor package；

Fig. 4 is the close-up schematic view of a part in Fig. 3；

Fig. 5 is perspective view of the present utility model；

Fig. 6 is the structure front schematic view escaping air drain of the present utility model；

Fig. 7 is the close-up schematic view of b part in Fig. 6；

Fig. 8 is the A-A direction sectional view of Fig. 6；

Fig. 9 is the close-up schematic view of c part in Fig. 8；

Figure 10 is encapsulation step one structural representation of the present utility model；

Figure 11 is encapsulation step two structural representation of the present utility model；

Figure 12 is encapsulation step three structural representation of the present utility model.

[detailed description of the invention]

Referring to Fig. 3～9, this utility model image sensor package includes the circuit substrate installed successively 210, cmos sensor 220, base 230, light-filtering glass 240, is provided with on circuit substrate 210 and drives Dynamic motor chip 250, electric capacity 260, this cmos sensor 220 is also mounted on circuit substrate 210.

This base 230 is provided with escapes tank structure 300, this light-filtering glass 240 and the window phase on base 230 Matching installation.

This deep gouge 310 being provided with connection in escaping tank structure 300 extraneous is T-shaped with connect sensor internal Groove 320, this deep gouge 310 is connected with T-slot 320.This T-slot 320 includes main airway 321 and is connected Shunting air flue 322.This light-filtering glass 240 is arranged on base 230, partly covers this and escapes air drain knot Structure 300, this deep gouge 310 escaping tank structure is in communication with the outside simultaneously.

In the present embodiment, this T-slot 320 is provided with two described main airways 321 and three described shuntings Air flue 322, these two described main airways 321 be respectively arranged below concave structure 323, this is connected Shunting air flue 322 be distributed in this concave structure 323 both sides and centre.

As shown in figs. 4 and 7, via deep gouge 310 leaked-in air stream d, e, by the master of T-slot 320 Air flue 321, circulates at concave structure 323, is then tapped off and changes airflow direction, enters back into shunting air flue 322, it is divided into three gangs of air-flows f, g, h, the most just enters sensor internal, the dust entrained by gas is broken Bits etc. are precipitated at concave structure 323, are greatly improved the cleanliness factor of air-flow, and the shunting through T-slot is sunk Forming sediment, effectively intercepted, effectively stop these dust chips to enter sensor internal, this structure can be big The big packaging and testing yield that improves, and this construction packages stacking is simple.

Seeing also Figure 10～12, the assembling process of this utility model image sensor package is:

1, by electric capacity 260, drive motor chip 250 to be arranged on circuit substrate 210, CMOS is sensed Device 220 is mounted on and has installed electric capacity 260, drives on the circuit substrate 210 of motor chip 250, quickly Solidification；

2, weld carrying out gold thread between cmos sensor 220 with circuit substrate 210 subsequently, and be carried out；

3, then mounting seat 230 on substrate, are carried out；

4, finally light-filtering glass 240 is mounted on base 230, carries out hot setting, complete encapsulation Process.

Light-filtering glass 240 is mounted on base 230, during hot setting, T-slot 320 and deep gouge 310 Can effectively aerofluxus；After hot setting, T-slot and deep gouge can hinder extraneous dust, dirty are directly entered Cmos sensor surface, it is to avoid cause test stain bad.

The foregoing is only preferred embodiment of the present utility model, protection domain of the present utility model not office Be limited to this, any based on the equivalent transformation in technical solutions of the utility model belong to this utility model protection Within the scope of.

Claims (7)

1. an image sensor package escape tank structure, it is characterised in that it include connection the external world Deep gouge, connection sensor internal T-slot, this deep gouge is connected with T-slot.

2. image sensor package as claimed in claim 1 escape tank structure, it is characterised in that should T-slot includes main airway and the shunting air flue being connected.

3. image sensor package as claimed in claim 2 escape tank structure, it is characterised in that should Arranging concave structure below the main airway of T-slot, the shunting air flue that this is connected is distributed in this concave structure Both sides.

4. image sensor package as claimed in claim 2 escape tank structure, it is characterised in that should The T-slot escaping tank structure includes two described main airways, two spill knots being arranged on below main airway Structure, and three described shunting air flues, these three shunting air flues are distributed in the both sides of these two concave structures And it is middle.

5. an image sensor package, it circuit substrate including installing successively, cmos sensor, Base, it is characterised in that this base is provided with escapes tank structure as described in any one of Claims 1 to 4.

6. image sensor package as claimed in claim 5, it is characterised in that set on this circuit substrate There are driving motor chip and electric capacity.

7. image sensor package as claimed in claim 6, it is characterised in that this image sensor seals Dress also includes light-filtering glass, and this light-filtering glass is arranged on base, and part is covered and escaped tank structure, This deep gouge escaping tank structure is in communication with the outside.