CN207097800U - The encapsulating structure of imaging sensor - Google Patents
The encapsulating structure of imaging sensor Download PDFInfo
- Publication number
- CN207097800U CN207097800U CN201720852293.5U CN201720852293U CN207097800U CN 207097800 U CN207097800 U CN 207097800U CN 201720852293 U CN201720852293 U CN 201720852293U CN 207097800 U CN207097800 U CN 207097800U
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- China
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- image sensor
- framework
- sensor chip
- plain conductor
- encapsulating structure
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Abstract
A kind of encapsulating structure of imaging sensor is the utility model is related to, including：Image sensor chip with hanging plain conductor, the first end of the plain conductor are bonded to the pad of described image sensor chip, and the second end is suspended on image sensor chip；Framework positioned at described image sensor chip top；The inner side of the framework has the side wall being arranged between chip photosensitive region and chip bonding pad, prevents the interference of extraneous light；The framework is provided with hollow-out parts corresponding to plain conductor, suitable for observation plain conductor and the state of printed circuit plate weld.
Description
Technical field
It the utility model is related to image sensor chip encapsulation technology field, more particularly to a kind of encapsulation of imaging sensor
Structure.
Background technology
Imaging sensor is the sensor that can be experienced optical image information and convert thereof into usable output signal, image
Sensor chip is easily polluted by external environment in the course of the work, so needing to seal image sensor chip
Dress, makes image sensor chip be under sealed environment, so as to avoid influence of the external environment to image sensor chip.
At present, the encapsulation of image sensor chip is main with the following method：Image sensor chip is fixed on circuit
On plate, welded by lead（wire-bonding）Plain conductor is bonded on chip and circuit board by technology respectively, is then made
Chip package is got up with shell, lens assembly is assemblied in shell.Although this encapsulating structure energy shield portions spurious rays,
But chip can be influenceed by circuit plate flatness and produce warpage（Tilt）.Also, the photosensitive region of chip does not have and circuit board
It is completely isolated, still it may be contaminated；Shell will can not just see the plain conductor of chip perimeter after chip package, it is difficult to it is determined that
The bond styles of plain conductor.So one kind is needed to block spurious rays, prevent photosensitive region from being seen by outside contamination, and can
Examine the encapsulating structure of internal metal wirings.
Utility model content
The purpose of this utility model is to provide a kind of encapsulating structure of imaging sensor solve the encapsulation knot of prior art
Photosensitive region can not be prevented by outside contamination, to be difficult to the technical problem for observing internal metal wirings again, improve image sensing in structure
The optical property of device and the reliability of electrical connection.
In order to solve the above-mentioned technical problem, the utility model provides a kind of encapsulating structure of imaging sensor, including：
Image sensor chip with hanging plain conductor, the first end of the plain conductor are bonded to described image biography
The pad of sensor chip, the second end are suspended on image sensor chip；
Framework positioned at described image sensor chip top；The inner side of the framework, which has, is arranged at imaging sensor core
Side wall between piece photosensitive region and pad, prevent the interference of extraneous light；The framework is provided with corresponding to plain conductor and engraved
Empty portion, suitable for observation plain conductor and the state of printed circuit plate weld.
Optionally, the hollow-out parts correspond to the second petiolarea domain of the plain conductor.
Optionally, the framework has step, and cutoff filter is arranged on step；The cutoff filter
The hollow-out parts are covered, prevent the quality of foreign materials away module packaging.
Optionally, when the cutoff filter uses silk-screen printing technique, silk-screen layer avoids corresponding hollow-out parts, just
In observation plain conductor and the state of printed circuit plate weld.
Optionally, the side wall of the framework is bonded with image sensor chip, and support force is provided for image sensor chip；
Described image sensor chip is suspended on the printed circuit board (PCB).
Optionally, extension is provided with the outside of the framework, is assembled by the extension and printed circuit board (PCB) bonding.
Optionally, the framework has step, and lens assembly is arranged on the step, and the lens assembly is near figure
As a piece of camera lens of sensor chip is as cutoff filter.
Relative to prior art, the image sensor package structure in the utility model has the advantages that：
In image sensor package structure provided by the utility model, the inner side of the framework is photosensitive with chip is arranged at
Side wall between region and pad, prevent the interference of external stray light line；The framework is provided with hollow out corresponding to plain conductor
Portion, suitable for observation plain conductor and the state of printed circuit plate weld.Encapsulating structure of the present utility model can not only prevent photosensitive
The welded condition of internal metal wirings is enough observed in region by outside contamination, and can, improves the optical property of image sensor chip
And the reliability of electrical connection.
Brief description of the drawings
Fig. 1 is the schematic top plan view of image sensor package structure in the embodiment of the utility model one；
Fig. 2 is the elevational schematic view of image sensor package structure in the embodiment of the utility model one；
Fig. 3 is the diagrammatic cross-section of image sensor package structure in the embodiment of the utility model one.
Embodiment
Many details are elaborated in the following description in order to fully understand the utility model.But this practicality is new
Type can be to be much different from other manner described here to implement, and those skilled in the art can be new without prejudice to this practicality
Similar popularization is done in the case of type intension, therefore the utility model is not limited by following public specific implementation.
Secondly, the utility model is described in detail using schematic diagram, when the utility model embodiment is described in detail, for ease of
Illustrate, the schematic diagram is example, and it should not limit the scope of the utility model protection herein.
It is understandable to enable above-mentioned purpose of the present utility model, feature and advantage to become apparent, below in conjunction with 1 ~ Fig. 3 of accompanying drawing
Image sensor package structure of the present utility model is described in detail.
With reference to shown in 1 ~ Fig. 3 of figure, the encapsulating structure of imaging sensor of the present utility model includes imaging sensor framework
（Base）10th, image sensor chip（CMOS Sensor）20th, cutoff filter（IR Cut）30.
Image sensor chip 20 has a hanging plain conductor 21, and the plain conductor 21 in the present embodiment is gold thread, institute
The first end for stating plain conductor 21 is bonded to the pad of described image sensor chip 20（PAD）, the second end is suspended on image biography
Sensor chip 20, the second end are connected to printed circuit board (PCB), realize electric between image sensor chip 20 and printed circuit board (PCB)
Connection.
The framework 10 is located at the top of described image sensor chip 20, and the inner side of the framework 10, which has, is arranged at figure
As sensor chip 20 photosensitive region and pad between side wall 12, for blocking spurious rays, prevent external stray light line
Interference to photosensitive region.The side wall 12 of the framework 10 bonds with image sensor chip 20, is image sensor chip 20
Support force is provided, described image sensor chip 20 is suspended on the printed circuit board (PCB), is avoided so as to control due to printing
Image sensor chip caused by circuit board out-of-flatness tilts, and prevents photosensitive region from being acted on by outside contamination, improves image
The optical property of sensor.
The framework 10 is provided with hollow-out parts 11 corresponding to plain conductor 21, and hollow-out parts 11 are arranged at step 14 and extension
Between 12, the hollow-out parts 11 correspond to the second petiolarea domain of the plain conductor 21, from from the front of framework 10 directly
The second petiolarea domain of plain conductor 21 and printed circuit board (PCB)（PCB）The state of welding, as shown in fig. 1.When imaging sensor core
After the plain conductor 21 on the periphery of piece 20 completes welding, welding effect can be observed directly by hollow-out parts 11, be advantageous in real time
Management and control welding procedure and the bad problem of analysis, raising image sensor chip 20 are electrically connected reliable with printed circuit board (PCB)
Property.
The framework 10 has step 14, lens assembly（Lens）It is arranged on the step 14, the lens assembly is most
A piece of camera lens close to image sensor chip 20 is as cutoff filter 30, so as to which cutoff filter 30 is arranged at
On step 14.The cutoff filter 30 covers the hollow-out parts 11, prevents the quality of foreign materials away module packaging, example
Such as, influence of the foreign matters such as steam, impurity to the region of plain conductor 21 is prevented.In the present embodiment, the cutoff filter 30
During using silk-screen printing technique, silk-screen layer avoids corresponding hollow-out parts 11, so as to expose the hollow-out parts 11, is easy to observation gold
Belong to wire 21 and the state of printed circuit plate weld, beneficial to real-time management and control welding procedure and the bad problem of analysis.
In addition, the outside of the framework 10 is provided with extension 13, bonded by the extension 13 and printed circuit board (PCB)
Assembling, realizes the assembling of framework 10 and printed circuit board (PCB).
In summary, in image sensor package structure provided by the utility model, the inner side of the framework, which has, to be set
Side wall between chip photosensitive region and pad, prevent the interference of extraneous light；The framework is set corresponding to plain conductor
There are hollow-out parts, suitable for observation plain conductor and the state of printed circuit plate weld.
Although the utility model is disclosed as above with preferred embodiment, it is not for limiting the utility model, appointing
What those skilled in the art is not being departed from spirit and scope of the present utility model, may be by the method and skill of the disclosure above
Art content makes possible variation and modification to technical solutions of the utility model, therefore, every without departing from the utility model technology
The content of scheme, any simple modification made according to the technical essence of the utility model to above example, equivalent variations and
Modification, belong to the protection domain of technical solutions of the utility model.
Claims (7)
- A kind of 1. encapsulating structure of imaging sensor, it is characterised in that including：Image sensor chip with hanging plain conductor, the first end of the plain conductor are bonded to described image sensor The pad of chip, the second end are suspended on image sensor chip；Framework positioned at described image sensor chip top；The inner side of the framework, which has, is arranged at image sensor chip sense Side wall between light region and pad, prevent the interference of extraneous light；The framework is provided with hollow-out parts corresponding to plain conductor, Suitable for observation plain conductor and the state of printed circuit plate weld.
- 2. the encapsulating structure of imaging sensor according to claim 1, it is characterised in that the hollow-out parts correspond to described The second petiolarea domain of plain conductor.
- 3. the encapsulating structure of imaging sensor according to claim 1, it is characterised in that the framework has step, red Outer edge filter is arranged on step；The cutoff filter covers the hollow-out parts, prevents foreign materials away module from sealing The quality of dress.
- 4. the encapsulating structure of imaging sensor according to claim 3, it is characterised in that the cutoff filter is adopted During with silk-screen printing technique, silk-screen layer avoids corresponding hollow-out parts, is easy to observe plain conductor and the shape of printed circuit plate weld State.
- 5. the encapsulating structure of imaging sensor according to claim 1, it is characterised in that the side wall and image of the framework Sensor chip is bonded, and support force is provided for image sensor chip；Described image sensor chip is suspended on the printing electricity Road plate.
- 6. the encapsulating structure of imaging sensor according to claim 1, it is characterised in that be provided with the outside of the framework Extension, assembled by the extension and printed circuit board (PCB) bonding.
- 7. the encapsulating structure of imaging sensor according to claim 1, it is characterised in that the framework has step, mirror Head part is arranged on the step, the lens assembly near image sensor chip a piece of camera lens as IR-cut Optical filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720852293.5U CN207097800U (en) | 2017-07-14 | 2017-07-14 | The encapsulating structure of imaging sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720852293.5U CN207097800U (en) | 2017-07-14 | 2017-07-14 | The encapsulating structure of imaging sensor |
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| Publication Number | Publication Date |
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| CN207097800U true CN207097800U (en) | 2018-03-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201720852293.5U Active CN207097800U (en) | 2017-07-14 | 2017-07-14 | The encapsulating structure of imaging sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110661963A (en) * | 2018-06-28 | 2020-01-07 | 格科微电子（上海）有限公司 | Method for realizing optical anti-shake of camera module |
-
2017
- 2017-07-14 CN CN201720852293.5U patent/CN207097800U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110661963A (en) * | 2018-06-28 | 2020-01-07 | 格科微电子（上海）有限公司 | Method for realizing optical anti-shake of camera module |
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