JPH03151666A - Manufacture of solid image-pickup device - Google Patents
Manufacture of solid image-pickup deviceInfo
- Publication number
- JPH03151666A JPH03151666A JP1291582A JP29158289A JPH03151666A JP H03151666 A JPH03151666 A JP H03151666A JP 1291582 A JP1291582 A JP 1291582A JP 29158289 A JP29158289 A JP 29158289A JP H03151666 A JPH03151666 A JP H03151666A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- cap glass
- assembly
- image sensor
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000007787 solid Substances 0.000 title 1
- 239000011521 glass Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 26
- 238000003384 imaging method Methods 0.000 claims description 11
- 239000000428 dust Substances 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 2
- 238000000926 separation method Methods 0.000 abstract 1
- 230000002950 deficient Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005453 pelletization Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は固体撮像装置の製造方法に関し、特に組立方法
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a solid-state imaging device, and particularly to an assembly method.
従来、固体撮像装置の組立は、第７図（ａ）〜（ｃ）に
示したように検査済みのウエノ・−をチップ２として分
割して分離させたあと、マウンティング工程においてチ
ップ２をパッケージ基体５に接着し、ボンディング工程
においてチップ２の電極とパッケージの端子とをホンデ
ィングワイヤーで接続し、機能確認等の検査をしたあと
、最後にキャップガラス９でパッケージを封止するよう
になっており、パッケージ封止までチップ２のイメージ
部３はむき出しの状態になっている。Conventionally, in the assembly of a solid-state imaging device, as shown in FIGS. 7(a) to 7(c), an inspected wafer is divided into chips 2 and separated, and then the chips 2 are mounted on a package substrate in a mounting process. 5, the electrodes of the chip 2 and the terminals of the package are connected with a bonding wire in the bonding process, and after tests such as function confirmation are performed, the package is finally sealed with a cap glass 9. , the image portion 3 of the chip 2 is exposed due to the package being sealed.
上述した従来の組立方法では、ガラスキャップ９による
パッケージの封止が組立工程の最後になっているため、
ウエノ１−をチップ２として分離してからパッケージの
封止までの組立の各工程において、チップ２のイメージ
部３が常にむき出しになっており、イメージ部３の損傷
やゴミの付着が起こりやすく、これが画素欠陥となり組
み立て歩留りを低下させるといった欠点がある。In the conventional assembly method described above, the package is sealed with the glass cap 9 at the end of the assembly process.
In each process of assembling from separating the wafer 1- as a chip 2 to sealing the package, the image part 3 of the chip 2 is always exposed, and the image part 3 is easily damaged and dust attached. This has the drawback of causing pixel defects and lowering the assembly yield.
本発明の固体撮像装置の製造方法は、ウェノ・−をチッ
プとして分離させる以前に、チップのイメージ部にキャ
ップガラスを貼り付け、その後組立を行うものである。The method for manufacturing a solid-state imaging device of the present invention involves attaching a cap glass to the image area of the chip before separating the chips into chips, and then assembling the chips.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を説明するためのウェハー状
態のチップの上面図、第２図（ａ）〜（ｃ）はその組立
工程を示したものであり、このうち第２図（ａ）は第１
図のＡ−Ａ’線の断面図である。まず、第１図で示した
ように、ウェハー状態のチップ２のイメージセンサー部
３を覆うようにキャップガラスｌを貼り付ける。この際
、キャップガラスｌの接着部分がイメージ部と重ならな
いようにする。また、パッケージ５の端子と接続するた
めのチップの電極はキャップガラス１の外側になるよう
にする。FIG. 1 is a top view of a chip in a wafer state for explaining one embodiment of the present invention, and FIGS. 2(a) to (c) show its assembly process. Of these, FIG. a) is the first
It is a sectional view taken along the line AA' in the figure. First, as shown in FIG. 1, a cap glass l is attached to cover the image sensor section 3 of the chip 2 in the form of a wafer. At this time, make sure that the adhesive part of the cap glass l does not overlap the image part. Further, the electrodes of the chip to be connected to the terminals of the package 5 are arranged on the outside of the cap glass 1.
次に、第２図（ｂ）のようにペレッタイズによってチッ
プとして分離した後、マウンティング工程でチップ２を
パッケージ基体に接着し、ポンディング工程でチップ２
の電極とパッケージ５の端子を接続させる。このように
、チップ２のイメージセンザ一部３は組立工程の最初の
段階でキャップガラスｌによって覆われることになり、
それ以後の組立工程においてイメージセンサー部３は常
にキャップガラス１で保護され、キズによる損傷や、ゴ
ミの付着等を防止することができる。Next, as shown in FIG. 2(b), after separating into chips by pelletizing, the chips 2 are bonded to the package base in a mounting process, and the chips 2 are separated in a bonding process.
The electrode of the package 5 is connected to the terminal of the package 5. In this way, the image sensor part 3 of the chip 2 will be covered by the cap glass l at the initial stage of the assembly process,
In the subsequent assembly process, the image sensor section 3 is always protected by the cap glass 1, thereby preventing damage due to scratches, adhesion of dust, etc.
第３図は本発明の他の実施例を説明するためのウェハー
状態のチップの断面図である。２１は良品チップ、２２
は不良品チップである。本例ではウェハー段階での検査
結果をもとに、キャップガラスｌを不良品チップ２２に
は貼り付けず、良品チップ２１のみに貼り付けるように
したものである。こうすることにより不良品チップの分
だけキャップガラスのメ１（（駄がなくなり、組立コス
トを低減できる。FIG. 3 is a cross-sectional view of a chip in a wafer state for explaining another embodiment of the present invention. 21 is a good chip, 22
is a defective chip. In this example, the cap glass l is not attached to the defective chips 22, but only to the good chips 21, based on the inspection results at the wafer stage. By doing this, the cap glass is not wasted for the defective chips, and the assembly cost can be reduced.
第４図（ａ）〜（ｃ）は本発明の更に他の実施例を説明
するものである。第４図（ａ）に示したように、ウェハ
ー状態のチップ２に貼り付けるキャップガラスｌの表面
にシール状の膜を貼り付けておき、そのキャップガラス
ｌをウェハー状態のチップ２に貼り付ける。チップとし
て分離し、マウンティング工程、ポンディング工程を経
て組み立てた後、このシール状の膜を除去する。こうす
ることによって組立の各工程においてキャップガラス１
０表面にキズが入るのを防ぐことができ、さらに組立歩
留りの向上に結びつく。FIGS. 4(a) to 4(c) illustrate still another embodiment of the present invention. As shown in FIG. 4(a), a seal-like film is pasted on the surface of a cap glass l to be pasted onto the chip 2 in the form of a wafer, and the cap glass l is pasted onto the chip 2 in the form of a wafer. After separating into chips and assembling them through a mounting process and a bonding process, this seal-like membrane is removed. By doing this, in each step of assembly, the cap glass 1
It is possible to prevent scratches on the 0 surface, which further leads to an improvement in assembly yield.
以上の例ではポンディング後、樹脂を第５図のように充
てんさせることにより最終の封止を行うが、第６図のよ
うに予めリードフレ・−ムにチップをマウントし、モー
ルドする方法においても本発明が容易に応用できる。In the above example, after bonding, the final sealing is performed by filling with resin as shown in Figure 5, but it is also possible to mount the chip on a lead frame in advance and mold it as shown in Figure 6. The present invention can be easily applied.
以上説明したように、本発明はウェハー状態のチップの
イメージ部にキャップガラスを貼り付け５−
た後、チップを分離させ組立を行うことにより、ペレッ
タイズ以後の組立工程におけるイメージ部のキズやゴミ
の付着を防止する効果がある。またキャップガラスを良
品チップのみに貼り付けることにより、キャップガラス
の無駄をなくし、組立コストを低減させることができる
。As explained above, the present invention attaches a cap glass to the image area of a chip in a wafer state, and then separates and assembles the chip, thereby eliminating scratches and dust on the image area during the assembly process after pelletizing. It has the effect of preventing adhesion. Furthermore, by attaching the cap glass only to non-defective chips, it is possible to eliminate wastage of the cap glass and reduce assembly costs.
またキャップガラスの表面に予めシール状の膜を貼って
おくことにより、組立の各工程でキャップガラスの表面
にキズが付くのを防ぐことができ、組立工程において発
生するゴミ、キズ等による画像不良の発生を低減でき、
歩留りを向上させる効果がある。In addition, by pasting a seal-like film on the surface of the cap glass in advance, it is possible to prevent scratches on the surface of the cap glass during each assembly process, and image defects due to dust and scratches generated during the assembly process. can reduce the occurrence of
This has the effect of improving yield.
第１図は本発明の一実施例による固体撮像装置の、製造
方法におけるウェハー状態のチップの上面図、第２図（
ａ）〜（ｃ）は本発明の一実施例による固体撮像装置の
製造方法を組立工程順に示した断面図、第３図は本発明
の他の実施例を示したウェハー状態のチップの断面図、
第４図（ａ）〜（ｃ）は６−
本発明の更に他の実施例を組立工程順に示した断面図、
第５図は組立が終了した固体撮像装置の断面図、第６図
はリードフレームにマウントしたチップの断面図、第７
図は従来の固体撮像装置を組立工程順に示した断面図で
ある。
１・・・・・・キャップガラス、２・・・・・・チップ
、３・・・・・イメージセンサー部、４・・・・・・ボ
ンディングワイヤー ５・・・・・・パッケージ基体、
２１・・・・・・良品チップ、２２・・・・・・不良品
チップ、６・・・・・・シール状の膜、７・・・・・・
樹脂、８・・・・・・リードフレーム、９・・・・・キ
ャップガラス。FIG. 1 is a top view of a chip in a wafer state in a manufacturing method of a solid-state imaging device according to an embodiment of the present invention, and FIG.
a) to (c) are cross-sectional views showing the manufacturing method of a solid-state imaging device according to an embodiment of the present invention in the order of assembly steps, and FIG. 3 is a cross-sectional view of a chip in a wafer state showing another embodiment of the present invention. ,
FIGS. 4(a) to 4(c) are 6- sectional views showing still another embodiment of the present invention in the order of assembly steps;
Figure 5 is a cross-sectional view of the assembled solid-state imaging device, Figure 6 is a cross-sectional view of the chip mounted on the lead frame, and Figure 7 is a cross-sectional view of the chip mounted on the lead frame.
The figures are cross-sectional views showing a conventional solid-state imaging device in the order of assembly steps. 1... Cap glass, 2... Chip, 3... Image sensor section, 4... Bonding wire 5... Package base,
21...Good chip, 22...Defective chip, 6...Seal-like film, 7...
Resin, 8... Lead frame, 9... Cap glass.
Claims (3)
ージセンサー部に予めキャップガラスを貼り付けた後に
、該チップを容器取り付けることを特徴とする固体撮像
装置の製造方法。(1) A method for manufacturing a solid-state imaging device, characterized in that, in the assembly process of the solid-state imaging device, a cap glass is previously attached to the image sensor portion of the chip, and then the chip is attached to a container.
で、前記キャップガラスを貼り付けることを特徴とする
特許請求の範囲第１項記載の固体撮像装置の製造方法。(2) The method for manufacturing a solid-state imaging device according to claim 1, wherein the cap glass is attached to the wafer before the chips are individually divided.
付けておくことを特徴とする特許請求の範囲第１項また
は第２項記載の固体撮像装置の製造方法。(3) The method for manufacturing a solid-state imaging device according to claim 1 or 2, characterized in that a seal-like film is pasted on the surface of the cap glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1291582A JPH03151666A (en) | 1989-11-08 | 1989-11-08 | Manufacture of solid image-pickup device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1291582A JPH03151666A (en) | 1989-11-08 | 1989-11-08 | Manufacture of solid image-pickup device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03151666A true JPH03151666A (en) | 1991-06-27 |
Family
ID=17770799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1291582A Pending JPH03151666A (en) | 1989-11-08 | 1989-11-08 | Manufacture of solid image-pickup device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03151666A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020066010A (en) * | 2001-02-08 | 2002-08-14 | (주)해빛정보 | Solid state imaging device with integrated cover glass and fabrication method |
| EP1605521A2 (en) | 2004-06-11 | 2005-12-14 | Sharp Kabushiki Kaisha | Manufacturing method for a base piece made to adhere to an adhesive sheet, for a semiconductor wafer and for a semiconductor device |
| EP1610359A2 (en) | 2004-06-24 | 2005-12-28 | Sharp Kabushiki Kaisha | Bonding apparatus, bonding method, and method for manufacturing semiconductor device |
| EP1633002A2 (en) | 2004-08-31 | 2006-03-08 | Sharp Kabushiki Kaisha | Semiconductor device, semiconductor module, and manufacturing method of semiconductor device |
| CN100423277C (en) * | 2004-06-15 | 2008-10-01 | 夏普株式会社 | Manufacturing method of semiconductor wafer having lid part and manufacturing method of semiconductor device |
| US7456483B2 (en) | 2004-05-10 | 2008-11-25 | Sharp Kabushiki Kaisha | Semiconductor device, manufacturing method of semiconductor device and module for optical device |
| US7615397B2 (en) | 2006-03-08 | 2009-11-10 | Samsung Electronics Co., Ltd. | Micro-element package and manufacturing method thereof |
| US7789575B2 (en) | 2005-07-21 | 2010-09-07 | Panasonic Corporation | Optical device, optical device apparatus, camera module, and optical device manufacturing method |
| JPWO2009016931A1 (en) * | 2007-08-02 | 2010-10-14 | コニカミノルタオプト株式会社 | Imaging device manufacturing method, imaging device, and portable terminal |
| US7911018B2 (en) | 2007-10-30 | 2011-03-22 | Panasonic Corporation | Optical device and method of manufacturing the same |
-
1989
- 1989-11-08 JP JP1291582A patent/JPH03151666A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020066010A (en) * | 2001-02-08 | 2002-08-14 | (주)해빛정보 | Solid state imaging device with integrated cover glass and fabrication method |
| US7456483B2 (en) | 2004-05-10 | 2008-11-25 | Sharp Kabushiki Kaisha | Semiconductor device, manufacturing method of semiconductor device and module for optical device |
| US7438780B2 (en) | 2004-06-11 | 2008-10-21 | Sharp Kabushiki Kaisha | Manufacturing method for base piece made to adhere to adhesive sheet, manufacturing method for semiconductor wafer and manufacturing method for semiconductor device |
| EP1605521A2 (en) | 2004-06-11 | 2005-12-14 | Sharp Kabushiki Kaisha | Manufacturing method for a base piece made to adhere to an adhesive sheet, for a semiconductor wafer and for a semiconductor device |
| EP1605521A3 (en) * | 2004-06-11 | 2007-08-08 | Sharp Kabushiki Kaisha | Manufacturing method for a base piece made to adhere to an adhesive sheet, for a semiconductor wafer and for a semiconductor device |
| CN100423277C (en) * | 2004-06-15 | 2008-10-01 | 夏普株式会社 | Manufacturing method of semiconductor wafer having lid part and manufacturing method of semiconductor device |
| EP1610359A2 (en) | 2004-06-24 | 2005-12-28 | Sharp Kabushiki Kaisha | Bonding apparatus, bonding method, and method for manufacturing semiconductor device |
| EP1633002A2 (en) | 2004-08-31 | 2006-03-08 | Sharp Kabushiki Kaisha | Semiconductor device, semiconductor module, and manufacturing method of semiconductor device |
| CN100399549C (en) * | 2004-08-31 | 2008-07-02 | 夏普株式会社 | Semiconductor device, semiconductor module, and manufacturing method of semiconductor device |
| US7789575B2 (en) | 2005-07-21 | 2010-09-07 | Panasonic Corporation | Optical device, optical device apparatus, camera module, and optical device manufacturing method |
| US7615397B2 (en) | 2006-03-08 | 2009-11-10 | Samsung Electronics Co., Ltd. | Micro-element package and manufacturing method thereof |
| JPWO2009016931A1 (en) * | 2007-08-02 | 2010-10-14 | コニカミノルタオプト株式会社 | Imaging device manufacturing method, imaging device, and portable terminal |
| US7911018B2 (en) | 2007-10-30 | 2011-03-22 | Panasonic Corporation | Optical device and method of manufacturing the same |
| US7977138B1 (en) | 2007-10-30 | 2011-07-12 | Panasonic Corporation | Optical device and method of manufacturing the same |
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