JPH05218375A - Solid-state image sensor - Google Patents

Abstract

PURPOSE:To seal foreign material in a case without adding a process. CONSTITUTION:When a chip 3 is mounted on a ceramic case 1 through mount material 2, the whole inner bottom plane 1a of the ceramic case 1 is covered by the mount material 2. Then, sealing is performed by using a glass cap 6 whereupon sealing resin 5 is adhered so as to permit the inner part to be thicker than a part which abuts on the adhering part 1c of the ceramic package 1. At the time of sealing, the sealing resin 5 is melted and the inner side plane 1b of the ceramic case 1 is covered.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device in which a solid-state image pickup element is sealed in a ceramic package.

[0002]

2. Description of the Related Art A solid-state image pickup device includes a ceramic case,
It is composed of a solid-state imaging device chip mounted in a ceramic case and a glass cap for making light incident on the chip.

FIG. 3 is a sectional view showing a conventional solid-state image pickup device of this type. To assemble this solid-state image pickup device, the chip 3 of the solid-state image pickup device is fixed to the center of the ceramic case 1 by the mount material 2, and the bonding pad on the chip and the internal lead are connected by the bonding wire 7.

After that, the glass cap 6 to which the sealing resin 5 is attached in advance is placed on the bonding portion 1c of the ceramic case 1, and the sealing resin 5 is melted to bond the cap 6 to the ceramic case 1.

[0005] In this case, the chip 3 is provided inside the case.
When using a container in which a space exists between the glass cap 6 and the glass cap 6, a loose substance may be generated from the inner surface of the ceramic case 1, which becomes the foreign substance 8 moving in the space. When the foreign matter 8 adheres to the chip 3 or the inside of the cap 6, it becomes an optical shadow and causes a black defect.

In order to avoid the generation of the foreign matter 8, conventionally, before the sealing with the glass cap 6, resin is filled around the chip of the case 1 on which the chip 3 is mounted, and the foreign matter is embedded in the resin. Method was taken. Also,
As another method, there is a method in which an adhesive material is applied around the chip of the ceramic case 1 on which the chip 3 is mounted and foreign matter is attached to the adhesive material so as not to move.

[0007]

As described above, in the conventional packaging means for the solid-state image pickup device, the resin is filled or the adhesive is applied after the chip is mounted, and then the cap is sealed. Will be added. And, in this added step, careful work such as not touching the bonding wire is required.

Further, in the conventional measures, since the entire inner surface of the package is not covered, there is a possibility that new foreign matter may be generated from the inner wall surface of the package after encapsulation. If it falls into the effective pixel area of the chip, it will cause a black defect.

[0009]

A solid-state image pickup device of the present invention includes a case body, a solid-state image pickup device mounted on an inner bottom surface of the case body via a mount material, and a sealing material on the case body. And a glass cap glued together,
The inner bottom surface of the case body is covered with the mount material, and the inner side surface of the case body is covered with the sealant.

[0010]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a cross-sectional view showing a state [(a), (b)] before sealing and a state [(c)] after sealing according to the first embodiment of the present invention.

To assemble the solid-state imaging device of this embodiment, as shown in FIG. 1A, the mount material 2 is applied to the entire area of the bottom surface 1a of the ceramic case 1 holding the external leads 4. Then, the chip 3 is mounted and baked.
Next, the pads on the chip and the internal leads of the ceramic case are connected by the bonding wires 7.

Next, the sealing resin 5 is sealed by the glass cap 6 to which the sealing resin 5 is previously attached.
As shown in (b) of FIG. 1, the inside of the ceramic case 1 is thicker than the portion in contact with the adhesive portion 1c. Therefore, when the sealing resin 5 melts during the sealing, the inner side surface 1b of the ceramic case 1 is covered.

Therefore, the inside of the ceramic case 1 is shown in FIG.
As shown in (c) of FIG. 6, all are covered with the mount material 2 or the sealing resin 5, and all the dust from the ceramic case can be contained without adding a new step. Further, the foreign matter mixed during the encapsulation can be attached to the sealing resin or the like.

FIG. 2 is a sectional view of a glass cap and a ceramic case used in the second embodiment of the present invention.
As shown in FIG. 2A, the sealing resin 5 is attached to the bonding portion of the glass cap 6 with the ceramic case 1 with a constant thickness. Further, as shown in FIG. 2B,
The sealing resin 5 is attached to the inner portion of the bonding portion 1c of the ceramic case 1 with the cap glass. When these packaging materials are used for mounting and sealing in the same manner as in the previous embodiment, the sealing resin 5 adhering to the ceramic case 1 is melted, and as shown in FIG. 1 (c). To
The inner side surface 1b of the ceramic case is covered.

[0015]

As described above, in the solid-state image pickup device of the present invention, the inner bottom surface of the ceramic case is covered with the mount material and the inner side surface is covered with the sealing material. Without adding a new process that damages the bonding wire, it is possible to prevent the generation of foreign matter from the ceramic case and to attach and fix the mixed foreign matter, reducing defective modes such as black scratches. be able to.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a state before and after sealing according to a first embodiment of the present invention.

FIG. 2 is a sectional view of a glass cap and a ceramic case used in a second embodiment of the present invention.

FIG. 3 is a sectional view of a conventional example.

[Explanation of symbols]

 1 Ceramic Case 1a Inner Bottom of Ceramic Case 1b Inner Side of Ceramic Case 1c Adhesion of Ceramic Case to Glass Cap 2 Mounting Material 3 Chip of Solid-state Image Sensor 4 External Lead 5 Sealing Resin 6 Glass Cap 7 Bonding Wire 8 Foreign Material

Claims (1)

[Claims] 1. A solid body comprising a case body, a solid-state image sensor mounted on the inner bottom surface of the case body via a mount material, and a glass cap bonded to the case body via a sealing material. In the imaging device, the inner bottom surface of the case body is covered with the mount material, and the inner side surface of the case body is covered with the sealant.