CN109286735A - The assembling structure of camera module, the assembly method for reducing camera module size - Google Patents
The assembling structure of camera module, the assembly method for reducing camera module size Download PDFInfo
- Publication number
- CN109286735A CN109286735A CN201710599130.5A CN201710599130A CN109286735A CN 109286735 A CN109286735 A CN 109286735A CN 201710599130 A CN201710599130 A CN 201710599130A CN 109286735 A CN109286735 A CN 109286735A
- Authority
- CN
- China
- Prior art keywords
- camera module
- lens barrel
- barrel frame
- assembly method
- module size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000004020 conductor Substances 0.000 claims description 18
- 239000003292 glue Substances 0.000 claims description 13
- 238000005452 bending Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 4
- 238000003384 imaging method Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
Abstract
The present invention relates to a kind of assembling structures of camera module, the assembly method of reduction camera module size, camera module includes: lens barrel frame, image sensor chip, printed circuit board, at least one side open gap of the lens barrel frame, part lens barrel frame side wall is removed, achievees the purpose that reduce camera module size.
Description
Technical field
The present invention relates to image sensor chip encapsulation technology field more particularly to a kind of assembly knots of camera module
Structure, the assembly method for reducing camera module size.
Background technique
Imaging sensor is the sensor that can be experienced optical image information and convert thereof into usable output signal, image
Sensor chip is easy the pollution by external environment during the work time, so needing to seal image sensor chip
Dress, is in image sensor chip under sealed environment, to avoid influence of the external environment to image sensor chip.
Currently, the encapsulation of image sensor chip is mainly with the following method: image sensor chip is fixed on circuit
On plate, (wire-bonding) technology is welded by lead and is bonded in plain conductor on chip and circuit board respectively, is then made
Chip package is got up with shell, lens assembly is assemblied in shell.In existing assembly technology, shell encapsulate the step of need
It wants circuit board except plain conductor, then reserves some safe distances to lead with metal when shell is pasted on circuit boards
Line generates interference and causes bad, which directly affects the size of entire camera module, for example, 13M typically now,
16M preceding camera mould group size is generally 8.5mm × 8.5mm.The fast development shielded comprehensively due to mobile phone and people are to appearance
It is required that raising, camera module is to miniaturization, and the size of camera module that screen mobile phone has required comprehensively
Lower than 8mm, it is seen that traditional assembly technology can no longer meet market demands.
Summary of the invention
The purpose of the present invention is to provide the assembly of a kind of assembling structure of camera module, reduction camera module size
Method improves existing assembly method, reduces the package dimension of camera module.
It is described in order to solve the above technical problem, the present invention provides a kind of assembly method for reducing camera module size
Camera module includes: lens barrel frame, image sensor chip, printed circuit board, at least one side quit a post and thus leave it vacant of the lens barrel frame
Mouthful, part lens barrel frame side wall is removed, achievees the purpose that reduce camera module size.
Optionally, after lens barrel frame and glued printed circuit board, a glue is carried out again in the gap regions, is increased
The support strength of camera module, meanwhile, reduce extraneous light to the interference effect of camera module.
Optionally, the side wall bottom edge moves inward between plain conductor and image sensor chip photosensitive region, reduces
Excessive glue and the interference for reducing stray light.
Optionally, the close region at least one angle on described notch one side is provided with bending structure, improves mechanical strength.
Optionally, being provided on one side for the notch is easy to structure for dispensing glue.
Optionally, described to be easy to structure for dispensing glue are as follows: to have sloping structure along the inside side surface direction of lateral surface.
Optionally, the plain conductor is nearby provided with observation structure, is easy to observe plain conductor and printed circuit is hardened
Conjunction state.
Another aspect of the present invention also provides a kind of assembling structure of camera module, and the camera module includes: mirror
Cylinder frame, image sensor chip, printed circuit board, the lens barrel frame at least have notch on one side, remove part lens barrel
Frame side wall reduces camera module size.
Compared with the existing technology, the assembly of the assembling structure of camera module of the invention, reduction camera module size
Method has the advantages that
In the present invention, the camera module includes: lens barrel frame, image sensor chip, printed circuit board, the lens barrel frame
At least one side open gap of frame removes part lens barrel frame side wall, makes camera module that side jaggy be arranged in lens barrel frame
Upward width reduces, and achievees the purpose that reduce camera module size；Furthermore the gap regions are also convenient for carrying out glue again,
Increase the support strength of mould group, the side wall of lens barrel frame by it is in the prior art be located at gold thread areas outside move to plain conductor with
Between image sensor chip photosensitive region, reduces excessive glue and reduce the interference of stray light, improve optical property.
Detailed description of the invention
Fig. 1 is the schematic diagram of camera module assembling structure in one embodiment of the invention；
Fig. 2 is the partial schematic diagram of a-quadrant in Fig. 1；
Fig. 3 is the schematic diagram of notch in one embodiment of the invention；
Fig. 4 is the diagrammatic cross-section of notch in one embodiment of the invention.
Specific embodiment
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention.But the present invention can be with
Much it is different from other way described herein to implement, those skilled in the art can be without prejudice to intension of the present invention the case where
Under do similar popularization, therefore the present invention is not limited to the specific embodiments disclosed below.
Secondly, the present invention is described in detail using schematic diagram, when describing the embodiments of the present invention, for purposes of illustration only, institute
Stating schematic diagram is example, should not limit the scope of protection of the invention herein.
To make the above purposes, features and advantages of the invention more obvious and understandable, below in conjunction with 1 ~ Fig. 4 of attached drawing to this
The assembling structure of the camera module of invention, the assembly method for reducing camera module size are described in detail.
Refering to what is shown in Fig. 1, in the assembly method of reduction camera module size of the invention, the camera module packet
It includes: lens barrel frame (Base) 100, image sensor chip (CMOS Sensor) 200, printed circuit board (FPC) 400, the mirror
Cylinder frame 100 is located at the top of described image sensor chip 200, and image sensor chip 200 has hanging plain conductor
210, the plain conductor 210 in the present embodiment is gold thread, and one end of the plain conductor 210 is bonded to described image sensor core
The pad (PAD) of piece 200, the other end is suspended on image sensor chip 200, and is connected to printed circuit board 400, realizes image
Electrical connection between sensor chip 200 and printed circuit board 400.
At least one side open gap 300 of the lens barrel frame 100 removes the side wall 310 of part lens barrel frame 100, makes to take the photograph
As head mould group is in the width reduction on the direction that lens barrel frame 100 is arranged jagged 300, reduction printed circuit board 400 and lens barrel
The size of frame 100 to achieve the purpose that reduce camera module size, and saves cost.Specifically, refering to what is shown in Fig. 2,
Fig. 2 is the partial schematic diagram of a-quadrant in Fig. 1, is the top view of lens barrel frame 100, the bottom of the lens barrel frame 100 forms scarce
Mouth 300, and 310 bottom edge of the side wall moves inward to plain conductor on the outside of plain conductor region by the prior art
Between 210 and the photosensitive region of image sensor chip 200, the side wall 310 is bonded with image sensor chip 200, for figure
As the offer support force of sensor chip 200, described image sensor chip 200 is suspended on the printed circuit board 400, prevents
Only photosensitive region is reduced excessive glue, and reduce the interference of stray light by the effect of outside contamination, improves image sensor chip 200
Optical property.
With reference to shown in Fig. 3 and Fig. 4, the close region at least one angle on described 300 one side of notch is provided with bending structure
320, the bending structure 320 includes that two parts in a certain angle are constituted, and can be improved the mechanical strength of camera module.
Further, after lens barrel frame 100 and 400 gluing of printed circuit board, one is carried out again in 300 region of notch
Secondary glue increases the adhesive strength of image sensor chip 200 and lens barrel frame 100, increases the support strength of camera module,
Meanwhile reducing extraneous light to the interference effect of camera module.Also, being provided on one side for notch 300 is easy to dispensing
Structure, be easy to structure for dispensing glue described in the present embodiment are as follows: along the inside side surface direction of 100 lateral surface of lens barrel frame have slope
330 structure is in an inclination angle between ramp structure 330 and the photosurface of image sensor chip 200, increases the sky of notch 300
Between, it is easy to glue.
Shown in continuing to refer to figure 1, the plain conductor 210 is nearby provided with observation structure 500, and observation structure 500 is located at
Cutoff filter (being not shown on the way) is arranged on the side wall 310 of lens barrel frame 100 in the top of plain conductor 210, infrared
Edge filter covers observation structure 500, by observation structure 500 it can be seen that the plain conductor of image sensor chip 200
210 with printed circuit board 400, to be easy to observe 400 bonding state of plain conductor 210 and printed circuit board.
Refering to what is shown in Fig. 1, another aspect of the present invention also provides a kind of assembling structure of camera module, camera module
It include: lens barrel frame 100, image sensor chip 200, printed circuit board 300, the lens barrel frame 100 at least has on one side
Jagged 300, the side wall of part lens barrel frame 100 is removed, camera module size is reduced.Notch 300 in the present invention makes
The size of printed circuit board 400 and lens barrel frame 100 reduces, and so as to reduce the size of camera module, and reduces the cost.
In conclusion the assembly side of the assembling structure of camera module provided by the invention, reduction camera module size
In method, the camera module includes: lens barrel frame, image sensor chip, printed circuit board, and the lens barrel frame is at least
One side open gap removes part lens barrel frame side wall, achievees the purpose that reduce camera module size.
Although the invention has been described by way of example and in terms of the preferred embodiments, but it is not for limiting the present invention, any this field
Technical staff without departing from the spirit and scope of the present invention, may be by the methods and technical content of the disclosure above to this hair
Bright technical solution makes possible variation and modification, therefore, anything that does not depart from the technical scheme of the invention, and according to the present invention
Technical spirit any simple modifications, equivalents, and modifications to the above embodiments, belong to technical solution of the present invention
Protection scope.
Claims (8)
1. a kind of assembly method for reducing camera module size, the camera module includes: lens barrel frame, imaging sensor
Chip, printed circuit board, which is characterized in that at least one side open gap of the lens barrel frame removes part lens barrel frame side wall,
Achieve the purpose that reduce camera module size.
2. it is according to claim 1 reduce camera module size assembly method, which is characterized in that when lens barrel frame with
After printed circuit board is glued, a glue is carried out again in the gap regions, increases the support strength of camera module, meanwhile,
Reduce extraneous light to the interference effect of camera module.
3. the assembly method according to claim 1 for reducing camera module size, which is characterized in that the side wall bottom edge
It moves inward between plain conductor and image sensor chip photosensitive region, reduce excessive glue and reduces the interference of stray light.
4. the assembly method according to claim 1 for reducing camera module size, which is characterized in that the notch is on one side
The close region at least one angle be provided with bending structure, improve mechanical strength.
5. the assembly method according to claim 1 for reducing camera module size, which is characterized in that the one of the notch
It is easy to structure for dispensing glue while being provided with.
6. the assembly method according to claim 5 for reducing camera module size, which is characterized in that described to be easy to dispensing
Structure are as follows: have sloping structure along the inside side surface direction of lateral surface.
7. the assembly method according to claim 1 for reducing camera module size, which is characterized in that the plain conductor
It nearby is provided with observation structure, is easy to observe plain conductor and printed circuit board bonding state.
8. a kind of assembling structure of camera module, the camera module includes: lens barrel frame, image sensor chip, print
Printed circuit board, which is characterized in that the lens barrel frame at least has notch on one side, removes part lens barrel frame side wall, reduces
Camera module size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710599130.5A CN109286735A (en) | 2017-07-21 | 2017-07-21 | The assembling structure of camera module, the assembly method for reducing camera module size |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710599130.5A CN109286735A (en) | 2017-07-21 | 2017-07-21 | The assembling structure of camera module, the assembly method for reducing camera module size |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109286735A true CN109286735A (en) | 2019-01-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710599130.5A Pending CN109286735A (en) | 2017-07-21 | 2017-07-21 | The assembling structure of camera module, the assembly method for reducing camera module size |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109286735A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111726945A (en) * | 2020-06-19 | 2020-09-29 | 湖南金康光电有限公司 | Packaging method of camera module |
| CN112954157A (en) * | 2021-01-28 | 2021-06-11 | 湖北三赢兴光电科技股份有限公司 | Camera module and terminal |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080131112A1 (en) * | 2006-11-30 | 2008-06-05 | Hitachi Maxell, Ltd. | Camera module and imaging apparatus |
| KR20150048470A (en) * | 2013-10-28 | 2015-05-07 | 삼성전기주식회사 | Fθ lens module for laser processing |
| CN105098399A (en) * | 2015-07-16 | 2015-11-25 | 格科微电子（上海）有限公司 | Electric connection method for camera module |
| CN105101637A (en) * | 2015-07-13 | 2015-11-25 | 格科微电子（上海）有限公司 | Method for rapidly welding camera module |
| CN207835584U (en) * | 2017-07-21 | 2018-09-07 | 格科微电子（上海）有限公司 | The assembling structure of camera module |
-
2017
- 2017-07-21 CN CN201710599130.5A patent/CN109286735A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080131112A1 (en) * | 2006-11-30 | 2008-06-05 | Hitachi Maxell, Ltd. | Camera module and imaging apparatus |
| KR20150048470A (en) * | 2013-10-28 | 2015-05-07 | 삼성전기주식회사 | Fθ lens module for laser processing |
| CN105101637A (en) * | 2015-07-13 | 2015-11-25 | 格科微电子（上海）有限公司 | Method for rapidly welding camera module |
| CN105098399A (en) * | 2015-07-16 | 2015-11-25 | 格科微电子（上海）有限公司 | Electric connection method for camera module |
| CN207835584U (en) * | 2017-07-21 | 2018-09-07 | 格科微电子（上海）有限公司 | The assembling structure of camera module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111726945A (en) * | 2020-06-19 | 2020-09-29 | 湖南金康光电有限公司 | Packaging method of camera module |
| CN111726945B (en) * | 2020-06-19 | 2021-11-02 | 湖南金康光电有限公司 | Packaging method of camera module |
| CN112954157A (en) * | 2021-01-28 | 2021-06-11 | 湖北三赢兴光电科技股份有限公司 | Camera module and terminal |
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