CN202837772U - Dustproof CMOS camera module - Google Patents
Dustproof CMOS camera module Download PDFInfo
- Publication number
- CN202837772U CN202837772U CN201220300643.4U CN201220300643U CN202837772U CN 202837772 U CN202837772 U CN 202837772U CN 201220300643 U CN201220300643 U CN 201220300643U CN 202837772 U CN202837772 U CN 202837772U
- Authority
- CN
- China
- Prior art keywords
- camera module
- sensitive chip
- dustproof
- imaging
- sealant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Images
Landscapes
- Studio Devices (AREA)
- Lens Barrels (AREA)
Abstract
The utility model discloses a dustproof CMOS camera module, which comprises a lens, a light sensing chip and a planar printed circuit substrate, wherein the lower surface of the light sensing chip is arranged on the planar printed circuit substrate. The dustproof CMOS camera module further comprises a sealing layer and a light transmittance protection layer, wherein the sealing layer is arranged on the upper surface of the light sensing chip and partly covers the outer peripheral part of the upper surface, a hollow part of the sealing layer is correspondingly arranged over a light sensing region of the light sensing chip, and the light transmittance protection layer is arranged on the upper surface of the sealing layer and completely covers the sealing layer. The dustproof CMOS camera module has the advantages that an imaging protection region of which the perpendicular height is not less than 0.65 millimeters is formed between the position over the light sensing region of the light sensing chip and the upper surface of the light transmittance protection layer, micro dust can be prevented from entering the imaging protection region, and micro dust particles dropping on the upper surface of the light transmittance protection layer can be prevented from imaging, thus achieving the purpose of dust prevention.
Description
Technical field
The novel camera head technology that relates to of this use is specifically related to a kind of dustproof camera module.
Background technology
Along with the fast development of science and technology, camera is widely used in a plurality of fields, as notebook computer, mobile phone, medically endoscope, the product that industry is used on making of usefulness detect in real time, security monitoring etc.
Photographing module/module (CMOS Camera Module) is called for short CCM, is the core devices for various New Generation of Portable picture pick-up devices, compares with traditional camera system to have miniaturization, low-power consumption, low cost, the advantage of high image quality.
Traditional high pixel CSP technique photographing module is become by sensitive chip, lens assembly+optical filter, motor, motor base and plane substrate structure.The electric signal that sensitive chip produces is outwards exported by the tie point on chip bottom and the substrate, and optical filter is bonded on the lens assembly.Motor base is bonded on the substrate, and motor is bonded in the top of base.The camera module of above-mentioned this structure drops on the sensitive chip face at dust, distance from imaging surface is less, just energy imaging of actual dirty size (15um), existing this structure is widely used, yet the development along with high end pixel module, the client is more and more higher to the dirty requirement of image, and traditional high pixel CSP technique camera module optical filter as previously discussed is bonded on the lens assembly.Therefore dust drops on the chip glass surface, causes dust shorter from the distance of chip imaging surface, and actual dirty very little (15um) just can imaging, is easy to cause the impact on shooting effect.
The utility model content
The purpose of this utility model is for the problems referred to above, and a kind of dustproof camera module is provided, and by sealant and protective seam are set at sensitive chip, increase image-forming range, thereby reaches dustproof purpose.
The technical method that the utility model adopts for achieving the above object is:
A kind of dustproof camera module, it comprises camera lens, sensitive chip, plane electric circuit substrate, the lower surface of described sensitive chip is arranged on the plane electric circuit substrate, it also comprises a sealant and a light transmission protective layer, wherein said sealant hollow also possesses thickness, it is arranged on described sensitive chip upper surface and with the outer periphery partial coverage of this upper surface, its hollow space correspondence be arranged on the sensitive chip photosensitive region directly over; Described light transmission protective layer is the transparent material member that possesses thickness; it is arranged on the upper surface of described sealant; and the sealing layer covered fully; arrive directly over the described sensitive chip photosensitive region between the upper surface of light transmission protective layer; form the imaging protection zone that a vertical height is not less than 0.65mm; micronic dust can not be entered in the described imaging protection zone, and make the dust particale of the upper surface that drops on described light transmission protective layer can not imaging.
It also comprises a motor, a motor base; Described motor base is arranged on the described plane electric circuit substrate; Described motor inner hollow, it is arranged on the described motor base; Described camera lens is arranged in the hollow part of described motor; Described sensitive chip is arranged on that described motor base is inner, its photosensitive region is towards the hollow part of described motor.
The vertical height of imaging protection zone, i.e. vertical height after described sealant and the light transmission protective layer stack is 0.65 ~ 1mm.
Described sealant is a two-sided colloid layer, and its thickness is 0.20 ~ 0.30mm; On the described two-sided colloid layer, also be provided with an exhaust passage, be used for discharging the gas in the described imaging protection zone.
The groove of described exhaust passage for opening in two-sided colloid one side when the camera module sealant encapsulates, is to carry out under hot and humid, can discharge by this exhaust passage and be enclosed in the moisture in the space between sensitive chip and the protective seam.
Described protective seam is the clear glass infrared fileter, and its thickness is 0.45 ~ 0.70mm.
Infrared fileter in traditional camera module group lens is moved down, stick on the two-sided colloid, as protective seam; This protective seam not only plays dustproof effect, also plays the effect of optical filtering, when making imaging effect reach the best, has reduced again cost.
The beneficial effects of the utility model are: by sealant and protective seam are set at sensitive chip, increase image-forming range, and when making the dust that drops on protective seam greater than 30 μ m, could imaging, effectively solved the poor problem of dust-proof effect of existing camera module.
Description of drawings
Fig. 1 is the utility model one-piece construction schematic diagram;
Fig. 2 is the cut-open view of Fig. 1.
Fig. 3 is the blast structural representation of Fig. 1.
Among the figure: 1. camera lens 2. motors 3. motor bases 4. infrared fileters 5. two-sided colloid 6. sensitive chips 7. plane electric circuit substrates 8. connectors 9. exhaust passages
Embodiment
Embodiment: referring to Fig. 1 to Fig. 3, the present embodiment provides a kind of dustproof camera module, it comprises camera lens 1, sensitive chip 6, plane electric circuit substrate 7, the lower surface of described sensitive chip 6 is arranged on the plane electric circuit substrate 7, it also comprises a sealant and a light transmission protective layer, wherein said sealant hollow also possesses thickness, it is arranged on described sensitive chip 6 upper surfaces and with the outer periphery partial coverage of this upper surface, its hollow space correspondence be arranged on sensitive chip 6 photosensitive regions directly over; Described light transmission protective layer is the transparent material member that possesses thickness; it is arranged on the upper surface of described sealant; and the sealing layer covered fully; arrive directly over described sensitive chip 6 photosensitive regions between the upper surface of light transmission protective layer; form the imaging protection zone that a vertical height is not less than 0.65mm; micronic dust can not be entered in the described imaging protection zone, and make the dust particale of the upper surface that drops on described light transmission protective layer can not imaging.
It also comprises a motor 2, a motor base 3; Described motor base 3 is arranged on the described plane electric circuit substrate 7; Described motor 2 inner hollow, it is arranged on the described motor base 3; Described camera lens 1 is arranged in the hollow part of described motor 2; Described sensitive chip 6 is arranged on described motor base 3 inside, and its photosensitive region is towards the hollow part of described motor 2.
The vertical height of imaging protection zone, i.e. vertical height after described sealant and the light transmission protective layer stack is 0.65 ~ 1mm.
Described sealant is 5 layers in a two-sided colloid, and its thickness is 0.20 ~ 0.30mm; On 5 layers in the described two-sided colloid, also be provided with an exhaust passage 9, be used for discharging the gas in the described imaging protection zone.
The groove of described exhaust passage 9 for opening in two-sided colloid one side when the camera module sealant encapsulates, is to carry out under hot and humid, can discharge by this exhaust passage 9 and be enclosed in the moisture in the space between sensitive chip 6 and the protective seam.
Described protective seam is clear glass infrared fileter 4, and its thickness is 0.45 ~ 0.70mm.
By the improvement of the above embodiments to camera module; at sensitive chip 6 sealant and protective seam are set; increase the image-forming range of on the protective seam object of dropping; when making the dust that drops on protective seam greater than 30 μ m, could imaging, and the photosensitive area of sensitive chip 6 carried out sealed package; so that inner and extraneous impurity; can not drop in the photosensitive area of sensitive chip, effectively solve the poor problem of dust-proof effect of existing camera module, reduce the dirty fraction defective of image.
But the above only is better possible embodiments of the present utility model, is not to limit to claim of the present utility model, therefore the equivalent structure that all utilization the utility model instructionss and accompanying drawing content are done changes, all is included in the protection domain of the present utility model.
Claims (5)
1. dustproof camera module, it comprises camera lens, sensitive chip, plane electric circuit substrate, the lower surface of described sensitive chip is arranged on the plane electric circuit substrate, it is characterized in that, it also comprises a sealant and a light transmission protective layer, wherein said sealant hollow also possesses thickness, and it is arranged on described sensitive chip upper surface and with the outer periphery partial coverage of this upper surface, its hollow space correspondence be arranged on the sensitive chip photosensitive region directly over; Described light transmission protective layer is the transparent material member that possesses thickness; it is arranged on the upper surface of described sealant; and the sealing layer covered fully; arrive directly over the described sensitive chip photosensitive region between the upper surface of light transmission protective layer; form the imaging protection zone that a vertical height is not less than 0.65mm; micronic dust can not be entered in the described imaging protection zone, and make the dust particale of the upper surface that drops on described light transmission protective layer can not imaging.
2. dustproof camera module according to claim 1 is characterized in that, it also comprises a motor, a motor base; Described motor base is arranged on the described plane electric circuit substrate; Described motor inner hollow, it is arranged on the described motor base; Described camera lens is arranged in the hollow part of described motor; Described sensitive chip is arranged on that described motor base is inner, its photosensitive region is towards the hollow part of described motor.
3. dustproof camera module according to claim 1 is characterized in that, the vertical height of imaging protection zone, i.e. and vertical height after described sealant and the light transmission protective layer stack is 0.65～1mm.
4. dustproof camera module according to claim 1 is characterized in that, described sealant is a two-sided colloid layer, and its thickness is 0.20～0.30mm; On the described two-sided colloid layer, also be provided with an exhaust passage, be used for discharging the gas in the described imaging protection zone.
5. dustproof camera module according to claim 1 is characterized in that, described protective seam is the clear glass infrared fileter, and its thickness is 0.45～0.70mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220300643.4U CN202837772U (en) | 2012-06-25 | 2012-06-25 | Dustproof CMOS camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220300643.4U CN202837772U (en) | 2012-06-25 | 2012-06-25 | Dustproof CMOS camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202837772U true CN202837772U (en) | 2013-03-27 |
Family
ID=47949438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220300643.4U Withdrawn - After Issue CN202837772U (en) | 2012-06-25 | 2012-06-25 | Dustproof CMOS camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202837772U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102707547A (en) * | 2012-06-25 | 2012-10-03 | 东莞光阵显示器制品有限公司 | Method for manufacturing dustproof photography module and dustproof photography module device |
| CN105120139A (en) * | 2015-09-18 | 2015-12-02 | 信利光电股份有限公司 | Camera shooting module and manufacturing method thereof |
| CN110233955A (en) * | 2014-09-26 | 2019-09-13 | 宁波舜宇光电信息有限公司 | A kind of image mould group and its sensitive chip encapsulating structure and method |
-
2012
- 2012-06-25 CN CN201220300643.4U patent/CN202837772U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102707547A (en) * | 2012-06-25 | 2012-10-03 | 东莞光阵显示器制品有限公司 | Method for manufacturing dustproof photography module and dustproof photography module device |
| CN102707547B (en) * | 2012-06-25 | 2015-02-04 | 东莞光阵显示器制品有限公司 | Method for manufacturing dustproof photography module and dustproof photography module device |
| CN110233955A (en) * | 2014-09-26 | 2019-09-13 | 宁波舜宇光电信息有限公司 | A kind of image mould group and its sensitive chip encapsulating structure and method |
| CN105120139A (en) * | 2015-09-18 | 2015-12-02 | 信利光电股份有限公司 | Camera shooting module and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102707547B (en) | Method for manufacturing dustproof photography module and dustproof photography module device | |
| CN101950751B (en) | Image sensor and encapsulating method thereof | |
| US8351219B2 (en) | Electronic assembly for an image sensing device | |
| CN103066061B (en) | Camera model and include the system of camera model | |
| CN204089956U (en) | There is camera module and the mobile phone of refrigerating function | |
| US20160072088A1 (en) | Image pickup device and electronic apparatus | |
| CN203387598U (en) | Camera module optical sensing assembly and camera module | |
| CN103412389B (en) | Camera lens module and apply the electronic equipment of this camera lens module | |
| CN202120913U (en) | Thin-type image capturing module | |
| US20080291316A1 (en) | Image sensor package structure and camera module having same | |
| CN109244067B (en) | Portable electronic device and image acquisition module and image sensing assembly thereof | |
| CN202837772U (en) | Dustproof CMOS camera module | |
| CN101539709A (en) | Camera protection device | |
| CN211744556U (en) | Camera module and terminal adopting same | |
| CN105097862A (en) | Image sensor package structure and package method thereof | |
| US20230181067A1 (en) | In-cell optical biometrics sensor | |
| CN102377951B (en) | Image sensing module and camera module | |
| CN203350510U (en) | Lens module and electronic device using same | |
| CN100544011C (en) | Image sensing device and manufacture method thereof | |
| US9117719B2 (en) | Solid-state imaging apparatus, manufacturing method for the same, and electronic apparatus | |
| KR20120076286A (en) | Lens module, lens wafer module, and method for manufacturing lens module | |
| US8310584B2 (en) | Image sensing device having thin thickness | |
| CN203632758U (en) | Dustproof pedestal of high-definition shooting module group | |
| CN203260584U (en) | Image sensor packaging structure with air deflating groove | |
| KR101181629B1 (en) | Camera module and methods of manufacturing a camera module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: GUANGDONG GUANGZHEN OPTOELECTRONICS TECHNOLOGY CO. Free format text: FORMER NAME: DONGGUAN GUANGZHEN DISPLAY CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 523000 Guangdong Province, Dongguan City Industrial Zone Qingxi Town Silver Star Patentee after: GUANGDONG LITE ARRAY CO., LTD. Address before: 523000 Guangdong Province, Dongguan City Industrial Zone Qingxi Town Silver Star Patentee before: Dongguan Guangzhen Display Co., Ltd. |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20130327 Effective date of abandoning: 20150204 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20130327 Effective date of abandoning: 20150204 |
|
| RGAV | Abandon patent right to avoid regrant |