CN103400848B - For the encapsulating structure of multiplying charge coupled apparatus - Google Patents
For the encapsulating structure of multiplying charge coupled apparatus Download PDFInfo
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- CN103400848B CN103400848B CN201310352285.0A CN201310352285A CN103400848B CN 103400848 B CN103400848 B CN 103400848B CN 201310352285 A CN201310352285 A CN 201310352285A CN 103400848 B CN103400848 B CN 103400848B
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Abstract
For an encapsulating structure for multiplying charge coupled apparatus, it is characterized in that: it is made up of refrigerator installation cavity, vacuum pump interface, semiconductor cooler, PCB, chip, ring support and cover plate; Aforementioned all parts is split-type structural; Described semiconductor cooler is arranged in refrigerator installation cavity, and refrigerator installation cavity upper surface and PCB lower surface are tightly connected; PCB upper surface and ring support lower surface are tightly connected; Ring support upper surface is connected with cover plate for sealing; Chip is arranged at the upper surface of semiconductor cooler; Vacuum pump interface is arranged on semiconductor cooler; Optical window is provided with in the middle part of cover plate.Advantageous Effects of the present invention is: the various piece in device is split-type structural, is convenient to change, keep in repair and regulate, and meanwhile, can repeat to vacuumize process to encapsulating structure, improve the make efficiency of fresh sample, reduce sample loss.
Description
Technical field
The present invention relates to a kind of semiconductor device packaging technique, particularly relate to a kind of encapsulating structure for multiplying charge coupled apparatus.
Background technology
The precondition that electron multiplying charge coupled apparatus (EMCCD) realizes the detection of high-quality low-light level imaging is that devices function dark current is very little; In prior art, for reducing EMCCD work dark current the most effectively, the most general method is cooling method, therefore, is necessary that the encapsulating structure of reasonable in design, science is to meet the requirement of EMCCD low-temperature working.
Usually the refrigeration modes of low temperature environment is provided to have nature cooling, compulsory type Air flow and the semiconductor cooler type of cooling.For the problem in EMCCD cooling technology, from refrigeration, frock size, operability and the angle with detector applicability, the semiconductor cooler type of cooling is selected to have quite significantly advantage, the ProEM Brochure product that Princeton Instruments (PI) company as the U.S. produces, all have employed the semiconductor cooler type of cooling to ensure that EMCCD works in low temperature environment in the EMCCD Camera product of Hamamatsu (shore pine) company's production of Japan; But all there is a common problem in existing product, namely the encapsulating structure of EMCCD all adopts fixing vacuum form to encapsulate, the internal components of EMCCD is not replaceable, once a certain component failure in EMCCD, whole imageing sensor image-forming assembly is just caused to scrap, especially in experiment development, often need to test the performance of different components, it is huge that this fixing vacuum form encapsulation causes sample to expend.
Summary of the invention
For the problem in background technology, the present invention proposes a kind of encapsulating structure for multiplying charge coupled apparatus, its innovation is: it is made up of refrigerator installation cavity, vacuum pump interface, semiconductor cooler, PCB, chip, ring support and cover plate; Aforementioned all parts is split-type structural;
Described semiconductor cooler is arranged in refrigerator installation cavity, and refrigerator installation cavity upper surface and PCB lower surface are tightly connected; PCB upper surface and ring support lower surface are tightly connected; Ring support upper surface is connected with cover plate for sealing; Chip is arranged at the upper surface of semiconductor cooler; Vacuum pump interface is arranged on the sidewall of refrigerator installation cavity; Optical window is provided with in the middle part of cover plate.
The principle of aforementioned schemes is: each device is split-type structural, after packaged, by vacuum pump interface, process is vacuumized to device inside, the packaging effect identical with encapsulating structure of the prior art can be played, make EMCCD work in low temperature environment by semiconductor cooler; When after a certain parts damages in device, by dismounting, cover plate is taken off, then corresponding device keeped in repair, change, regulate; The present invention is particularly suited for encapsulating the sample in experiment development, significantly can improve the make efficiency of fresh sample, avoids a certain device failure or needs replacing to cause entirety reforming sample.
Preferably, soldering is adopted between described refrigerator installation cavity and PCB; Soldering is adopted between described PCB and ring support.
In Practical Project, chip is the core of product, being also the emphasis of test, for the ease of carrying out dismounting and change to chip, the invention allows for following improvement project: connect by acetal is gluing between described chip and semiconductor cooler.Adopt acetal glue to carry out pasting chip and there is following benefit: acetal glue dissolves in organic solvent, lost efficacy in test process once chip or needed to change other chips and tested, after first cover plate being pulled down, the attachment position of chip is soaked in organic solvent, can chip be taken off after acetal peptization solution, then after chip attachment portion is cleaned up, new chip can be mounted, finally again cover plate is loaded onto, namely can be used for test after again vacuumizing, greatly improve the make efficiency of fresh sample.
In order to the axial length of reduction device, the invention allows for following preferred version: described vacuum pump interface is arranged on the sidewall of refrigerator installation cavity, the axis of vacuum pump interface and the radial direction of refrigerator installation cavity parallel to each other.
Preferably, the material of described refrigerator installation cavity adopts copper product.
Preferably, be bolted between described ring support and cover plate, the contact-making surface of ring support and cover plate is provided with sealing ring.
From the angle taking into account manufacturability and thermal diffusivity, preferably, the bottom thickness of described refrigerator installation cavity is 2mm.
Advantageous Effects of the present invention is: the various piece in device is split-type structural, is convenient to change, keep in repair and regulate, and meanwhile, can repeat to vacuumize process to encapsulating structure, improve the make efficiency of fresh sample, reduce sample loss.
Accompanying drawing explanation
Fig. 1, structural profile schematic diagram of the present invention;
Fig. 2, structure vertical view of the present invention;
The parts that in figure, each mark is corresponding are respectively: refrigerator installation cavity 1, vacuum pump interface 2, semiconductor cooler 3, PCB 4, chip 5, ring support 6, cover plate 7.
Embodiment
For an encapsulating structure for multiplying charge coupled apparatus, it is made up of refrigerator installation cavity 1, vacuum pump interface 2, semiconductor cooler 3, PCB 4, chip 5, ring support 6 and cover plate 7; Aforementioned all parts is split-type structural; Described semiconductor cooler 3 is arranged in refrigerator installation cavity 1, and refrigerator installation cavity 1 upper surface and PCB 4 lower surface are tightly connected; PCB 4 upper surface and ring support 6 lower surface are tightly connected; Ring support 6 upper surface and cover plate 7 are tightly connected; Chip 5 is arranged at the upper surface of semiconductor cooler 3; Vacuum pump interface 2 is arranged on the sidewall of refrigerator installation cavity 1; Optical window is provided with in the middle part of cover plate 7.
Further, soldering is adopted between described refrigerator installation cavity 1 and PCB 4; Soldering is adopted between described PCB 4 and ring support 6.
Further, connect by acetal is gluing between described chip 5 and semiconductor cooler 3.
Further, described vacuum pump interface 2 is arranged on the sidewall of refrigerator installation cavity 1, the axis of vacuum pump interface 2 and the radial direction of refrigerator installation cavity 1 parallel to each other.
Further, the material of described refrigerator installation cavity 1 adopts copper product.
Further, be bolted between described ring support 6 and cover plate 7, the contact-making surface of ring support 6 and cover plate 7 is provided with sealing ring.
Further, the bottom thickness of described refrigerator installation cavity 1 is 2mm.If bottom thickness is too thin, not only not easily process, and easily occur warpage, thermal diffusivity can be caused on the contrary to decline, if bottom thickness is too thick, although solve manufacturability issues, be unfavorable for heat radiation; Inventor after experiment repeatedly, when the bottom thickness finding refrigerator installation cavity 1 is 2mm, its technology difficulty rather moderate, and thermal diffusivity is ideal.
Claims (7)
1. for an encapsulating structure for multiplying charge coupled apparatus, it is characterized in that: it is made up of refrigerator installation cavity (1), vacuum pump interface (2), semiconductor cooler (3), PCB (4), chip (5), ring support (6) and cover plate (7); Aforementioned all parts is split-type structural;
Described semiconductor cooler (3) is arranged in refrigerator installation cavity (1), and refrigerator installation cavity (1) upper surface and PCB (4) lower surface are tightly connected; PCB (4) upper surface and ring support (6) lower surface are tightly connected; Ring support (6) upper surface and cover plate (7) are tightly connected; Chip (5) is arranged at the upper surface of semiconductor cooler (3); Vacuum pump interface (2) is arranged on the sidewall of refrigerator installation cavity (1); Cover plate (7) middle part is provided with optical window.
2. the encapsulating structure for multiplying charge coupled apparatus according to claim 1, is characterized in that: adopt soldering between described refrigerator installation cavity (1) and PCB (4); Soldering is adopted between described PCB (4) and ring support (6).
3. the encapsulating structure for multiplying charge coupled apparatus according to claim 1, is characterized in that: connect by acetal is gluing between described chip (5) and semiconductor cooler (3).
4. the encapsulating structure for multiplying charge coupled apparatus according to claim 1, is characterized in that: the axis of described vacuum pump interface (2) and the radial direction of refrigerator installation cavity (1) parallel to each other.
5. the encapsulating structure for multiplying charge coupled apparatus according to claim 1, is characterized in that: the material of described refrigerator installation cavity (1) adopts copper product.
6. the encapsulating structure for multiplying charge coupled apparatus according to claim 1, is characterized in that: be bolted between described ring support (6) and cover plate (7), and the contact-making surface of ring support (6) and cover plate (7) is provided with sealing ring.
7. the encapsulating structure for multiplying charge coupled apparatus according to claim 1, is characterized in that: the bottom thickness of described refrigerator installation cavity (1) is 2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310352285.0A CN103400848B (en) | 2013-08-14 | 2013-08-14 | For the encapsulating structure of multiplying charge coupled apparatus |
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| CN201310352285.0A CN103400848B (en) | 2013-08-14 | 2013-08-14 | For the encapsulating structure of multiplying charge coupled apparatus |
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| Publication Number | Publication Date |
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| CN103400848A CN103400848A (en) | 2013-11-20 |
| CN103400848B true CN103400848B (en) | 2015-08-12 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106642877A (en) * | 2015-10-30 | 2017-05-10 | 广东百事泰电子商务股份有限公司 | Simple fresh-care space box |
| CN106449548A (en) * | 2016-10-28 | 2017-02-22 | 中国电子科技集团公司第四十四研究所 | Mini type packaging structure for electronic multiplying charge-coupled device |
| CN109451210B (en) * | 2018-11-01 | 2020-09-11 | 南京理工大学 | Refrigeration type electron multiplication CCD camera system |
| CN111142197B (en) * | 2018-11-05 | 2022-12-27 | 华为机器有限公司 | Optical device, optical module and optical communication equipment |
| CN110752198B (en) * | 2019-10-28 | 2022-02-22 | 中国电子科技集团公司第四十四研究所 | Back-illuminated avalanche gain type EMCCD refrigeration packaging structure and method |
| CN116858498B (en) * | 2023-06-09 | 2024-05-10 | 武汉光启源科技有限公司 | Coupling test method and device |
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| CN1494139A (en) * | 2002-09-10 | 2004-05-05 | ��ʿͨ��ʽ���� | Camera assembly for small electronic apparatus |
| CN1674264A (en) * | 2004-02-11 | 2005-09-28 | 三星电子株式会社 | Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof |
| CN1692274A (en) * | 2002-10-10 | 2005-11-02 | 浜松光子学株式会社 | Photo-detection device and manufacturing method thereof |
| KR20070025442A (en) * | 2005-09-02 | 2007-03-08 | 테라셈 주식회사 | Image sensor semiconductor package and it's manufacture method |
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- 2013-08-14 CN CN201310352285.0A patent/CN103400848B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1494139A (en) * | 2002-09-10 | 2004-05-05 | ��ʿͨ��ʽ���� | Camera assembly for small electronic apparatus |
| CN1692274A (en) * | 2002-10-10 | 2005-11-02 | 浜松光子学株式会社 | Photo-detection device and manufacturing method thereof |
| CN1674264A (en) * | 2004-02-11 | 2005-09-28 | 三星电子株式会社 | Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof |
| KR20070025442A (en) * | 2005-09-02 | 2007-03-08 | 테라셈 주식회사 | Image sensor semiconductor package and it's manufacture method |
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