CN106449548A - Mini type packaging structure for electronic multiplying charge-coupled device - Google Patents
Mini type packaging structure for electronic multiplying charge-coupled device Download PDFInfo
- Publication number
- CN106449548A CN106449548A CN201610965202.9A CN201610965202A CN106449548A CN 106449548 A CN106449548 A CN 106449548A CN 201610965202 A CN201610965202 A CN 201610965202A CN 106449548 A CN106449548 A CN 106449548A
- Authority
- CN
- China
- Prior art keywords
- multiplying charge
- electron multiplying
- semiconductor cooler
- ceramic cartridge
- pga
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Abstract
The invention discloses a mini type packaging structure for an electronic multiplying charge-coupled device; the mini type packaging structure consists of an electronic multiplying charge-coupled device chip, a semiconductor cooler, a PGA ceramic tube shell, a light window slice and a hot sinking plate. The mini type packaging structure for the electronic multiplying charge-coupled device is small in structural dimension; the semiconductor cooler is directly in heat exchange with the chip; the working efficiency is high; the semiconductor cooler with low power consumption and small volume can be applied.
Description
Technical field
The present invention relates to a kind of electron multiplying charge coupled apparatus, more particularly, to a kind of electron multiplying charge coupled apparatus use
Microencapsulated structure.
Background technology
Electron multiplying charge coupled apparatus（EMCCD）The precondition realizing the detection of high-quality low-light level imaging is to reduce device
Work dark current, reduces charge detection amplifier noise, improves multiplication gain, a kind of effective method is to electron multiplying charge
Coupled apparatus is cooled down, and reduces its operating temperature, and therefore, cooling encapsulating structure only reasonable in design, science could meet
The job requirement of electron multiplying charge coupled apparatus, and under the precondition ensureing its high reliability, also should reduce as far as possible
Encapsulation volume and device weight.
In prior art, it is usually used in providing the mode of low-temperature working environment to have natural cooling, compulsory type air cooling and half
Conductor refrigerator cools down；For the application demand of electron multiplying charge coupled apparatus, from refrigeration, frock size, operable
From the point of view of row and applicability, quite obvious advantage is had using the semiconductor cooler type of cooling, but in prior art
In, the semiconductor cooler mating with electron multiplying charge coupled apparatus is generally arranged at outside shell, electron multiplying charge coupling
Need between clutch part and semiconductor cooler to carry out heat exchange by shell, this refrigeration structure can reduce semiconductor cooler
Operating efficiency, therefore can only be from all larger semiconductor cooler of power consumption and volume, further, since semiconductor cooler exposes
Outside shell, for avoiding in low temperature environment the frosting of ceramic cartridge surface and making in order to semiconductor cooler is played with protection
With in addition it is also necessary to redesigning one layer of closing housing outside semiconductor cooler and ceramic cartridge and fill inert gas, this being not only
Further increase size and the weight of device, and process complexity also accordingly improves, be unfavorable for the miniaturization of device, light
Quantify, additionally, causing the larger another reason of electron multiplying charge coupled apparatus encapsulation volume to be half selecting in prior art
The series of conductor refrigerator is more, leads to the volume of semiconductor cooler itself also relatively large.
Content of the invention
For the problem pointed out in background technology, the present invention proposes a kind of miniature envelope of electron multiplying charge coupled apparatus
Assembling structure, its innovation is：Described electron multiplying charge coupled apparatus microencapsulated structure is by electron multiplying charge coupler
Chip, semiconductor cooler, PGA ceramic cartridge, light window and heat sink plate composition；Described heat sink plate is arranged on PGA ceramic cartridge
Lower surface on；It is provided with mounting groove on the upper surface of PGA ceramic cartridge；Semiconductor cooler lower surface is filled out by epoxy resin
Material is bonding with installing trench bottom, and the position of semiconductor cooler is relative with the position of heat sink plate；Charge-coupled device chip is arranged at
The middle part of semiconductor cooler upper surface, epoxy filler and semiconductor cooler are passed through in the lower surface of charge-coupled device chip
Upper surface bonding；The opening portion of PGA ceramic cartridge upper end is closed by light window, light window lower surface and PGA ceramic cartridge upper end
The contact site in face passes through fluid sealant bonding.
The principle of the present invention is：Electron multiplying charge coupler chip and semiconductor cooler are encapsulated in same PGA pottery
After in porcelain tube shell, the heat on semiconductor cooler is delivered in heat sink plate by PGA ceramic cartridge bottom and outwards quickly leads
Go out, the cold end of semiconductor cooler is directly and electron multiplying charge coupler chip carries out heat exchange, the work of semiconductor cooler
Make that efficiency is higher, can effectively reduce the power consumption requirements to semiconductor cooler, so that we can select small volume, work(
Consume relatively low semiconductor cooler, further, since semiconductor cooler is directly encapsulated in PGA ceramic cartridge it is not necessary to independent again
Containment vessel is set for semiconductor cooler, can effectively reduce package dimension, and be also beneficial to improve the entirety of encapsulating structure
Rigidity is it is ensured that structural stability.
Preferably, the array scale of described electron multiplying charge coupler chip is 512 × 512；Electron multiplying charge coupling
The appearance and size of clutch chip is 19mm × 12mm × 0.5mm.
Preferably, described semiconductor cooler is 2 grades of refrigerators, and the appearance and size of semiconductor cooler is 22mm × 15mm
×5mm.
Preferably, the appearance and size of described PGA ceramic cartridge is 45mm × 35mm × 12mm, the stitch of PGA ceramic cartridge
For 32 pins.
Preferably, it is filled with nitrogen in the inner chamber of described PGA ceramic cartridge.
Preferably, described epoxy filler adopts DW-3 epoxy type adhesive.
Preferably, described fluid sealant adopts DG-4 epoxy type adhesive.
Preferably, described heat sink plate adopts red copper to make.
Preferably, described heat sink plate and PGA ceramic cartridge form overall structure by sintering process.
The method have the benefit that：Provide a kind of electron multiplying charge coupled apparatus microencapsulated structure,
This encapsulating structure size is less, and semiconductor cooler is directly and chip carries out heat exchange, and operating efficiency is higher, can adopt power consumption
Relatively low, small volume semiconductor cooler.
Brief description
Fig. 1, the structure section schematic diagram of the present invention；
Fig. 2, the perspective view of the present invention；
The corresponding title of each mark of in figure is respectively：Electron multiplying charge coupler chip 1, semiconductor cooler 2, PGA
Ceramic cartridge 3, light window 4, heat sink plate 5.
Specific embodiment
A kind of electron multiplying charge coupled apparatus microencapsulated structure, its structure is：Described electron multiplying charge coupling
Device microencapsulated structure is by electron multiplying charge coupler chip 1, semiconductor cooler 2, PGA ceramic cartridge 3, light window
4 and heat sink plate 5 form；Described heat sink plate 5 is arranged on the lower surface of PGA ceramic cartridge 3；On the upper surface of PGA ceramic cartridge 3
It is provided with mounting groove；Semiconductor cooler 2 lower surface is bonding with installing trench bottom by epoxy filler, semiconductor cooler
2 position is relative with the position of heat sink plate；Charge-coupled device chip 1 is arranged at the middle part of semiconductor cooler 2 upper surface, electric charge
It is bonding with semiconductor cooler 2 upper surface that epoxy filler is passed through in the lower surface of coupler chip 1；Light window 4 is ceramic by PGA
The opening portion closing of shell 3 upper end, the contact site of light window 4 lower surface and PGA ceramic cartridge 3 upper surface is gluing by sealing
Connect.
Further, the array scale of described electron multiplying charge coupler chip 1 is 512 × 512；Electron multiplying charge
The appearance and size of coupler chip 1 is 19mm × 12mm × 0.5mm.
Further, described semiconductor cooler 2 is 2 grades of refrigerators, the appearance and size of semiconductor cooler 2 be 22mm ×
15mm×5mm.
Further, the appearance and size of described PGA ceramic cartridge 3 is 45mm × 35mm × 12mm, PGA ceramic cartridge 3
Stitch is 32 pins.
Further, it is filled with nitrogen in the inner chamber of described PGA ceramic cartridge 3.During concrete making, in high pure nitrogen atmosphere
Inside be packaged operation, packaged after, naturally just full of nitrogen in PGA ceramic cartridge 3；Compared to Vacuum Package, in nitrogen
The technology difficulty and the cost that are packaged operation in atmosphere are all relatively low, but, the loss of refrigeration capacity of refrigerator cold end during nitrogen encapsulation
Larger, shell bottom plate heat dissipation problem is more prominent；In view of technology difficulty, production cost and application demand, art technology
Personnel can be according to actual conditions, reasonable selection.
Further, described epoxy filler adopts DW-3 epoxy type adhesive.
Further, described fluid sealant adopts DG-4 epoxy type adhesive.
Further, described heat sink plate 5 adopts red copper to make.
Further, described heat sink plate 5 and PGA ceramic cartridge 3 form overall structure by sintering process.
In the present invention, electron multiplying charge coupler chip 1 and semiconductor cooler 2 are all encapsulated in PGA ceramic cartridge 3
Interior, heat sink plate 5 is metal, and heat sink plate 5 and PGA ceramic cartridge 3 form firm overall structure by sintering process, whole knot
The rigidity of structure is higher, stronger to adaptive capacity to environment.
Claims (9)
1. a kind of electron multiplying charge coupled apparatus with microencapsulated structure it is characterised in that：Described electron multiplying charge coupling
Device microencapsulated structure is by electron multiplying charge coupler chip（1）, semiconductor cooler（2）, PGA ceramic cartridge（3）、
Light window（4）And heat sink plate（5）Composition；Described heat sink plate（5）It is arranged on PGA ceramic cartridge（3）Lower surface on；PGA pottery
Shell（3）Upper surface on be provided with mounting groove；Semiconductor cooler（2）Epoxy filler and mounting groove bottom are passed through in lower surface
Portion's bonding, semiconductor cooler（2）Position relative with the position of heat sink plate；Charge-coupled device chip（1）It is arranged at semiconductor
Refrigerator（2）The middle part of upper surface, charge-coupled device chip（1）Lower surface pass through epoxy filler and semiconductor cooler
（2）Upper surface bonding；Light window（4）By PGA ceramic cartridge（3）The opening portion closing of upper end, light window（4）Lower surface and PGA
Ceramic cartridge（3）The contact site of upper surface passes through fluid sealant bonding.
2. electron multiplying charge coupled apparatus according to claim 1 with microencapsulated structure it is characterised in that：Described electricity
Sub- multiplying charge coupler chip（1）Array scale be 512 × 512；Electron multiplying charge coupler chip（1）Profile chi
Very little for 19mm × 12mm × 0.5mm.
3. electron multiplying charge coupled apparatus according to claim 2 with microencapsulated structure it is characterised in that：Described half
Conductor refrigerator（2）For 2 grades of refrigerators, semiconductor cooler（2）Appearance and size be 22mm × 15mm × 5mm.
4. electron multiplying charge coupled apparatus according to claim 3 with microencapsulated structure it is characterised in that：Described
PGA ceramic cartridge（3）Appearance and size be 45mm × 35mm × 12mm, PGA ceramic cartridge（3）Stitch be 32 pins.
5. electron multiplying charge coupled apparatus according to claim 1 with microencapsulated structure it is characterised in that：Described
PGA ceramic cartridge（3）Inner chamber in be filled with nitrogen.
6. electron multiplying charge coupled apparatus according to claim 1 with microencapsulated structure it is characterised in that：Described ring
Oxygen resin extender adopts DW-3 epoxy type adhesive.
7. electron multiplying charge coupled apparatus according to claim 1 with microencapsulated structure it is characterised in that：Described close
Sealing adopts DG-4 epoxy type adhesive.
8. electron multiplying charge coupled apparatus according to claim 1 with microencapsulated structure it is characterised in that：Described heat
Heavy plate（5）Made using red copper.
9. electron multiplying charge coupled apparatus according to claim 1 with microencapsulated structure it is characterised in that：Described heat
Heavy plate（5）With PGA ceramic cartridge（3）Overall structure is formed by sintering process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610965202.9A CN106449548A (en) | 2016-10-28 | 2016-10-28 | Mini type packaging structure for electronic multiplying charge-coupled device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610965202.9A CN106449548A (en) | 2016-10-28 | 2016-10-28 | Mini type packaging structure for electronic multiplying charge-coupled device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106449548A true CN106449548A (en) | 2017-02-22 |
Family
ID=58180377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610965202.9A Pending CN106449548A (en) | 2016-10-28 | 2016-10-28 | Mini type packaging structure for electronic multiplying charge-coupled device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106449548A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107221542A (en) * | 2017-05-27 | 2017-09-29 | 中国电子科技集团公司第十三研究所 | Linear charge-coupled array encapsulation ceramic package and preparation method thereof |
| CN108180672A (en) * | 2017-12-13 | 2018-06-19 | 中国科学院光电技术研究所 | A kind of Vacuum Package Dewar of EMCCD detectors |
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| US20040233648A1 (en) * | 2003-05-19 | 2004-11-25 | Tdk Corporation | Electronic component module |
| CN102856411A (en) * | 2012-09-24 | 2013-01-02 | 天津英利新能源有限公司 | Photovoltaic module and packaging process thereof |
| CN103400848A (en) * | 2013-08-14 | 2013-11-20 | 中国电子科技集团公司第四十四研究所 | Encapsulating structure for multiply charge-coupled device |
| CN103474561A (en) * | 2013-09-10 | 2013-12-25 | 京东方科技集团股份有限公司 | OLED device encapsulation structure |
| CN204555412U (en) * | 2015-04-14 | 2015-08-12 | 中国电子科技集团公司第四十四研究所 | Semiconductor cooler for heat dissipation structure |
| CN204614790U (en) * | 2015-05-08 | 2015-09-02 | 重庆鹰谷光电有限公司 | A kind of microminiaturized ceramic cartridge photodetector encapsulating structure |
| CN105371951A (en) * | 2015-07-16 | 2016-03-02 | 中国科学院上海技术物理研究所 | Short-wave-infrared multichannel integrated optical spectrum assembly |
| CN205104494U (en) * | 2015-11-16 | 2016-03-23 | 中国电子科技集团公司第四十四研究所 | SMD gas tightness optical window type detector of miniature pottery |
| CN105702882A (en) * | 2016-01-29 | 2016-06-22 | 深圳市华星光电技术有限公司 | A packaging assembly and a packaging method thereof |
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2016
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Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20040233648A1 (en) * | 2003-05-19 | 2004-11-25 | Tdk Corporation | Electronic component module |
| CN102856411A (en) * | 2012-09-24 | 2013-01-02 | 天津英利新能源有限公司 | Photovoltaic module and packaging process thereof |
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| CN103474561A (en) * | 2013-09-10 | 2013-12-25 | 京东方科技集团股份有限公司 | OLED device encapsulation structure |
| CN204555412U (en) * | 2015-04-14 | 2015-08-12 | 中国电子科技集团公司第四十四研究所 | Semiconductor cooler for heat dissipation structure |
| CN204614790U (en) * | 2015-05-08 | 2015-09-02 | 重庆鹰谷光电有限公司 | A kind of microminiaturized ceramic cartridge photodetector encapsulating structure |
| CN105371951A (en) * | 2015-07-16 | 2016-03-02 | 中国科学院上海技术物理研究所 | Short-wave-infrared multichannel integrated optical spectrum assembly |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107221542A (en) * | 2017-05-27 | 2017-09-29 | 中国电子科技集团公司第十三研究所 | Linear charge-coupled array encapsulation ceramic package and preparation method thereof |
| CN107221542B (en) * | 2017-05-27 | 2021-03-23 | 中国电子科技集团公司第十三研究所 | Ceramic shell for packaging linear array charge coupled device and manufacturing method thereof |
| CN108180672A (en) * | 2017-12-13 | 2018-06-19 | 中国科学院光电技术研究所 | A kind of Vacuum Package Dewar of EMCCD detectors |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170222 |