CN108810348A - Camera module and its photosensory assembly - Google Patents
Camera module and its photosensory assembly Download PDFInfo
- Publication number
- CN108810348A CN108810348A CN201710528982.5A CN201710528982A CN108810348A CN 108810348 A CN108810348 A CN 108810348A CN 201710528982 A CN201710528982 A CN 201710528982A CN 108810348 A CN108810348 A CN 108810348A
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- China
- Prior art keywords
- light hole
- packaging body
- photosensory assembly
- side wall
- photosensitive
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
Abstract
The present invention relates to a kind of camera module and its photosensory assembly, photosensory assembly includes：Substrate；Photosensitive element is set on substrate；Packaging body, including upper surface, packaging body are equipped with light hole, and photosensitive element is located in light hole；Light hole includes the first, second, third light hole, and the side wall of the first light hole is extended vertically from the upward surface of photosensitive element, and the sidewall slope of second, third light hole extends, and the first, second, third light hole forms step surface between any two.Above-mentioned photosensory assembly, since the sidewall slope of second, third light hole of packaging body extends, the light quantity being radiated on photosensitive element increases, and convenient for being used to form the molding mold release of packaging body.
Description
This application claims being submitted on May 6th, 2017, application No. is 201710317509.2, entitled " camera shootings
The priority of the Chinese patent application of module and its photosensory assembly ".
Technical field
The present invention relates to camera module fields, more particularly to a kind of camera module and its photosensory assembly.
Background technology
With the fast development of various smart machines, the smart machine for being integrated with camera module is improving the same of image quality
When, also increasingly as lightening direction is developed.And improve image quality mean the specification of electronic component constantly increase, quantity
It is on the increase, largely influences also constantly increasing for the area of the photosensitive element of image quality, therefore cause camera module
Assembling difficulty constantly increase, overall dimensions also constantly increase, therefore the lightening of camera module receives very big limitation, into
And limit the volume of the smart machine equipped with the camera module.
The camera module packaging technology generally used now is COB (Chip On Board) packaging technology, that is, camera shooting mould
Wiring board, photosensitive element, the holder etc. of group are made into respectively, then successively by passive electronic component, photosensitive element and holder
Encapsulation is in the circuit board.
However use above-mentioned molded method, it usually needs light hole is formed by supporting structure, is on wiring board
Sensitive chip provide passage of light.But currently, due to light be determine equipped with the photosensory assembly camera module at image quality
An important factor for amount, and current holder shape limits the size of thang-kng amount, reduces thang-kng amount and affects camera module
Image quality.
Invention content
Based on this, it is necessary to lead to because of fault of construction that thang-kng amount is smaller, not easy mold release for the light hole of photosensory assembly
The problem of, the camera module and its photosensory assembly of a kind of larger, the easy demoulding of thang-kng amount are provided.
A kind of photosensory assembly, including：
Substrate；
Photosensitive element is set on the substrate and is electrically connected with the substrate, and the photosensitive element includes photosensitive area；And
Packaging body is packaged on the substrate and the photosensitive element, and the packaging body includes far from the photosensitive element
Upper surface, the packaging body is equipped with light hole, and the light hole is through photosensitive area described in the packaging body and face；
Wherein, the light hole includes connection and is in the first light hole, the second light hole and third that ladder is arranged successively
The side wall of light hole, first light hole is extended vertically from the photosensitive element to the upper surface, second light hole
And the cross section of third light hole is inverted trapezoidal structure, the internal diameter of second light hole is less than the interior of the third light hole
Diameter forms First terrace, second thang-kng between the side wall of second light hole and the side wall of the third light hole
The internal diameter in hole is more than the internal diameter of first light hole, the side wall of the side wall of second light hole and first light hole it
Between form second step face.
Above-mentioned photosensory assembly, sidewall slope extension and internal diameter due to the second light hole of packaging body, third light hole exist
Gradually increase on direction far from photosensitive element, therefore be radiated at the increase of the light quantity on photosensitive element, to improve photosensitive group
The thang-kng amount of part.Moreover, the side wall of the second light hole, third light hole is oblique, can be convenient for being used to form packaging body at
Type mold releasability, and avoid that packaging body is caused to damage, finally improve the camera module equipped with the photosensory assembly at image quality
Amount.
On the other hand, First terrace is formed between second light hole, third light hole can further be convenient for molding
The mold releasability of packaging body increases the structural strength of the second light hole.In addition, shape between the second light hole, third light hole
At First terrace be alternatively arranged as loading end to carry optical filter, after the light taken in by camera lens can be filtered by optical filter
It is radiated on photosensitive element, to further simplify the structure of the photosensory assembly, reduces the volume of the photosensory assembly.
In another aspect, second step face is formed between second light hole and first light hole, when on packaging body
When installing other parts by glue, the glue overflowed between part and installation surface can flow on second step face and can keep away
Exempt from glue to be flowed directly on photosensitive element and damage photosensitive element.
The width of the First terrace is 0.02-0.50mm in one of the embodiments,.The setting of above-mentioned width is simultaneous
It has cared for the structural strength of packaging body and has prevented the effect of glue overflow.
The width in the second step face is 0.2-0.9mm in one of the embodiments,.The height in above-mentioned second step face
The design of degree has taken into account influence and various factors such as prevent glue overflow into the luminous flux of the first light hole.
First light hole is rounded in one of the embodiments, a diameter of 2-8mm.
A diameter of 3-7mm of first light hole in one of the embodiments,.
First light hole is square in one of the embodiments, length 3-10mm, width 2.5-9.8mm.
The length of first light hole is 4-7mm, width 3.5-6.5mm in one of the embodiments,.Described
The different shape of one light hole can match different types of photosensitive element, and photosensitive element is coordinated to obtain better photosensitive effect
Fruit.
The width of the upper surface of the packaging body is 0.3-3mm, length 2.7-8.7mm in one of the embodiments,.
The above-mentioned size design of upper surface can not only meet the needs of stable camera lens module, but also take into account the miniaturization of camera module simultaneously
Design.
The height of the packaging body is 0.35-1.7mm in one of the embodiments,.Above-mentioned height design can be simultaneously
Meet encapsulation requirement and Miniaturization Design.
The packaging body includes lateral wall in one of the embodiments, side wall and the envelope of first light hole
It is 0.5-5.5mm to fill the distance between external side wall.
In one of the embodiments, the side wall of first light hole between the packaging body lateral wall at a distance from be
0.93-2.14mm.The design of above-mentioned distance has taken into account structural strength and Miniaturization Design.
Further include the conducting wire for connecting the photosensitive element and the substrate, the photosensitive member in one of the embodiments,
Part includes around the non-photo-sensing area of the photosensitive area, and the packaging body packed part non-photo-sensing area simultaneously coats the conducting wire.In this way,
Encapsulation body portion takes shape in reduce the overall volume of the photosensory assembly on photosensitive element, and can avoid conducting wire and be exposed to packaging body
It is damaged outside.
Photosensitive area edge of the side wall of first light hole from the photosensitive element be most in one of the embodiments,
Small distance is 0.05mm.
Photosensitive area edge of the side wall of first light hole from the photosensitive element be most in one of the embodiments,
Small distance is 0.2mm.The setting of above-mentioned distance makes camera module be obtained between the two preferably in miniaturization and image quality
Balance.
A kind of camera module, including camera lens module and above-mentioned photosensory assembly, the camera lens module are located at the packaging body
Upper surface.
Description of the drawings
Fig. 1 is the sectional view for the photosensory assembly that one embodiment of the invention provides.
Specific implementation mode
To facilitate the understanding of the present invention, below with reference to relevant drawings to invention is more fully described.In attached drawing
Give the preferred embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.Keep the understanding to the disclosure more saturating on the contrary, purpose of providing these embodiments is
It is thorough comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention
The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the Listed Items of pass.
As shown in Figure 1, a kind of photosensory assembly 300 of an embodiment of the present invention, including substrate 320, photosensitive element 340 and
Packaging body 360.
Wherein, photosensitive element 340 is set on substrate 320 and is electrically connected with substrate 320.Packaging body 360 is set to substrate 320
On, including the lower surface 364 of close photosensitive element 340 being oppositely arranged and the upper surface 362 far from photosensitive element 340, encapsulation
Body 360 is equipped with the light hole 368 through upper surface 362 and lower surface 364.Lateral wall of the packaging body 360 far from photosensitive element 340
It tilts and extends from lower surface 364 to upper surface 362, and the outer diameter of packaging body 360 is along from lower surface 364 to 362 direction of upper surface
It is gradually reduced.
Specifically, light hole 368 includes connection and is in the first light hole 3682, the second light hole that ladder is arranged successively
3684 and third light hole 3686, the side wall of the first light hole 3682 extended vertically from photosensitive element 340 to upper surface 362.The
The side wall of two light holes 3684 tilts from 3682 upper end of the first light hole and extends to the third light hole 3686, and second
The internal diameter of light hole 1684 gradually increases in this direction.The side wall of third light hole 3686 is from second light hole 3684
End tilts and extends to the upper surface 362, and the internal diameter of third light hole 3686 gradually increases in this direction.Described second is logical
The cross section of unthreaded hole 3684 and third light hole 3686 is inverted trapezoidal structure.
Above-mentioned photosensory assembly 300, since the second light hole 3684 of packaging body 360 and the side wall of third light hole 3686 incline
The light quantity increasing for tiltedly extending and internal diameter gradually increasing on the direction far from photosensitive element 340, therefore be radiated on photosensitive element 340
Greatly, to improve the thang-kng amount of photosensory assembly 300.Moreover, the lateral wall of packaging body 360 and the second light hole 3684, third
The side wall of light hole 3686 is oblique, can be convenient for being used to form the molding mold release of packaging body 360, and avoids to encapsulation
Body 360 causes to damage, and finally improves the image quality of the camera module equipped with the photosensory assembly 300.
Further, since the side wall of the first light hole 3682 is vertically arranged with respect to photosensitive element 340, therefore can be in molded package
Removable barriers are set on photosensitive element 340 before body 360, the side wall of barriers can be supported in the first light hole 3682
Side wall on the material of packaging body 360 formed with blocking flow on photosensitive element 340, sealed to can avoid photosensitive element 340
It fills and is damaged in the forming process of body 360, and the overall construction intensity of the packaging body 360 also can be improved and be hardly damaged,
It plays a good protective effect, and other parts on the upper surface of packaging body 360 362 can be risen to photosensitive element 340
To firm supporting role.
The angle α of lateral wall and optical axis of the packaging body 360 far from photosensitive element 340 is 0 ° -60 °, further preferably
10 ° -30 °, to avoid damage to packaging body 360 conducive to the molding mold release of packaging body 360.
In the present embodiment, substrate 320 is wiring board, may be, for example, hard circuit board, ceramic substrate (without soft board),
Or Rigid Flex, soft board.When substrate 320 is soft board, can be set in side of the substrate 320 far from photosensitive element 340
Stiffening plate (not shown) is set, to improve the intensity of substrate 320, to improve the overall construction intensity of the photosensory assembly 300.
Including photosurface 342 and back on the non-photo-sensing face that photosurface 342 is arranged, photosurface 342 includes photosensitive element 340
Photosensitive area 3421 and non-photo-sensing area 3422, and photosensitive area 3421 is located at 342 middle part of photosurface, non-photo-sensing area 3422 surrounds photosensitive area
3421 settings.
In one embodiment, the photosensory assembly 300 further includes conducting wire 380, and the conducting wire 380 is electrically connected the photosensitive member
Part 340 and the substrate 320.380 one end of the conducting wire is located at the non-photo-sensing area 3422, and the other end is located at the substrate 320,
360 packed part non-photo-sensing area 3422 of the packaging body simultaneously coats the conducting wire 380.In this way, 360 part of packaging body takes shape in sense
To reduce the overall volume of the photosensory assembly 300 on optical element 340, and it can avoid conducting wire 380 and be exposed to outside packaging body 360 and meet with
To damage.Wherein, conducting wire 380 can be gold thread, copper wire, aluminum steel or silver wire etc..
Further, packaging body 360 is formed in substrate 320 by molded mode.For example, using injection molding machine, lead to
Cross insert molding technique by substrate 320 carry out molding form packaging body 360.Packaging body 360 after molding and 320 secured phase of substrate
Even, compared with conventional stent is bonded by glue-line, the bonding force between packaging body 360 and substrate 320 is much greater.Specifically,
It can be nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer to use Shooting Technique to form the material of packaging body 360
Polymer) or PP (Polypropylene, polypropylene) etc..It can be selected it will be apparent to a skilled person that aforementioned
Manufacture and the material that can be selected are illustrative only the mode that can implement of the present invention, are not the present invention
Limitation.
Above-mentioned photosensory assembly 300 can have more while ensureing smaller size smaller to the optical axis direction of photosensitive element 340
Photosensitive element 340 can be reached along the second light hole 3684, the third light hole 3686 of sidewall slope setting by tilting the light extended
On, to increase the thang-kng amount of the light hole 368, to improve the imaging for the camera module for being equipped with the photosensory assembly 300
Quality.Also, the light being radiated on the side wall of the second light hole 3684, third light hole 3686 can be inclined by the above-mentioned of setting
The reflection of side wall is without reaching photosensitive element 340, to reduce reflection veiling glare to the camera shooting mould equipped with the photosensitive element 340
The influence of the image quality of group.Moreover, the side wall that the inclination of the second light hole 3684, third light hole 3686 extends can be also convenient for
The molding mold release of packaging body 360, to avoid damaging packaging body 360 during demoulding.In addition, packaging body 360 opens up
There is the part of the first light hole 3682 that the overall construction intensity of the photosensory assembly 300 can be improved, for set on the upper table of packaging body 360
Part on face 362 provides preferable support.
The internal diameter of second light hole 3684 is less than the internal diameter of third light hole 3686, thus in the side of the second light hole 3684
First terrace 361 is formed between wall and the side wall of third light hole 3686.In this way, can further be convenient for molded package body 360
Mold releasability, increase the structural strength of the second light hole 3684.In addition, First terrace 361 be alternatively arranged as loading end with
Optical filter is carried, the light taken in by camera lens is radiated at after being filtered by optical filter on photosensitive element 340, to further
The structure for simplifying the photosensory assembly 300 reduces the volume of the photosensory assembly 300.
The width D 1 of above-mentioned First terrace 361 is 0.02-0.50mm, preferably 0.1mm.If width D 1 is excessive, by shadow
It rings the intensity that packaging body 360 corresponds at the second light hole 3682 and will be unable to glue of playing a supporting role and avoid if width D 1 is too small
Water damages the effect of photosensitive element 340, and the setting of above-mentioned width D 1 has taken into account the structural strength of packaging body 360 and prevented glue from overflowing
The effect of stream.
In one embodiment, the height h1 of above-mentioned First terrace 361 is 0.5mm.The height h1 of First terrace 361 refers to
First terrace 361 to substrate 320 distance.If the height h1 of First terrace 361 is excessive, the optical filter of carrying may exceed
Upper surface 362 makes the effect of reducing the volume of the photosensory assembly 300 unobvious, if the height h1 of First terrace 361 is too small,
The optical filter being placed on First terrace 361 generates the increased risk of interference with photosensitive element 340, will influence the branch of optical filter
The sensitization function of support or photosensitive element 340.The design of the height h1 of above-mentioned First terrace 361 has taken into account the small of photosensory assembly
Various factors such as the normal realization of the function of type and correlated parts.
Further, the internal diameter of the second light hole 3684 is more than the internal diameter of the first light hole 3682, the second light hole 3684
Side wall and the side wall of the first light hole 3682 between form second step face 363.In this way, when passing through glue on packaging body 360
When installing other parts, the glue overflowed between part and installation surface can flow on second step face 363 and can avoid glue
Water is flowed directly on photosensitive element 340 and damages photosensitive element 340.The width D 2 in above-mentioned second step face 363 is 0.2-
0.9mm, preferably 0.5mm.If width D 2 is excessive, the intensity at the second light hole 3682 of correspondence of packaging body 360 will be influenced, if wide
It is too small to spend D2, will be unable to play the role of avoiding glue to damage photosensitive element 340, the setting of above-mentioned width D 2 has taken into account packaging body
360 structural strength and the effect for preventing glue overflow.
In one embodiment, the height h2 in above-mentioned second step face 363 is 0.41mm.The height h2 in second step face 363 is
Refer to second step face 363 to the distance of substrate 320.If the height h2 in second step face 363 is excessive, will influence to enter the first thang-kng
The luminous flux in hole 3682, if the height h2 in second step face 363 is too small, it is possible to can not stop that excessive glue makes excessive glue directly fall
And damage photosensitive element 340.The design of the height h2 in above-mentioned second step face 363 has taken into account the light into the first light hole 3682
The influence of flux and various factors such as prevent glue overflow.
In the present embodiment, the angle α of the side wall of the second light hole 3684 and optical axis be 20-40 °, preferably 30 °, and
Section of second light hole 3682 in the plane perpendicular to photosensitive element 340 is at isosceles trapezoid.In this way, conducive to molding die
Make the light for tilting extension to the optical axis direction of photosensitive element 340 that can reach photosensitive member along the second light hole 3684 while demoulding
On part 340, the thang-kng amount of the light hole 368 is increased, and then improves the imaging of the camera module equipped with the photosensory assembly 300
Quality.The angle of inclination that the side wall of third light hole 3686 is relatively orthogonal to the direction of photosensitive element 340 can be with the second light hole
The angle of inclination that 3682 side wall is relatively orthogonal to the direction of photosensitive element 340 is identical.
Further, the first light hole 3682 can be rounded, a diameter of 2-8mm, further preferred a diameter of 3-7mm.
Optionally, the first light hole 3682 can also be square, length 3-10mm, width 2.5-9.8mm, further excellent
The length of choosing is 4-7mm, width 3.5-6.5mm.In one embodiment, the lateral wall of packaging body 360 is from photosensitive element 340
3421 edge minimum range L of photosensitive area is 0.05mm, further preferably 0.2mm.If distance L is too small, encapsulated in encapsulation process
The risk of the photosensitive area 3421 of the foreign materials aways such as resin photosensitive element 340 increases, and the foreign matter on photosensitive area 3421 will influence
Photosensitive area 3421 receives the effect of incident light, and then influences image quality.If distance L is excessive, on the one hand make camera module
Volume increase, be unfavorable for minimizing, on the other hand can also make 3422 stray light of non-photo-sensing area on photosensitive element 340 more and
Influence image quality.The setting of above-mentioned distance L makes camera module be obtained between the two preferably in miniaturization and image quality
Balance.
In one embodiment, the width W of the upper surface 362 of packaging body 360 is 0.3-3mm, preferably 1.65mm, length (Fig. 1
In perpendicular to drawing dimension) be 2.7-8.7mm, preferably 7.6mm.The upper surface 362 can be used for carrying camera lens module, though
The area increase of right upper surface 362 can be such that the contact surface of carrying camera lens module increases, to which the installation for promoting camera lens module is steady
Soundness, but area crosses the overall volume that senior general increases camera module, cannot achieve Miniaturization Design.Above-mentioned upper surface 362
Size design can not only meet the needs of stable camera lens module, but also take into account the Miniaturization Design of camera module simultaneously.
In one embodiment, the height H of packaging body 360 is 0.35-1.7mm, preferably 0.71mm.The packaging body 360
Height H should consider can to other electronic components on photosensitive element 340 or substrate 320 formed encapsulate, consider again not
The volume of camera module can be increased in short transverse.Above-mentioned height H designs can meet encapsulation requirement and Miniaturization Design simultaneously.
In one embodiment, the side wall of the first light hole 3682 distance T between 360 lateral wall of packaging body is 0.5-5.5mm,
Further preferably 0.93-2.14mm.Distance T can be understood as the thickness of packaging body 360.In some embodiments, packaging body
360 lateral wall is obliquely installed, thus thickness everywhere is inconsistent.Distance T sizes influence the structural strength of packaging body 360 and take the photograph
As the volume of module, if distance T is excessive, though structural strength meets the requirements, volume is excessive, cannot meet Miniaturization Design；
If distance T is too small, although disclosure satisfy that Miniaturization Design, structural strength is inadequate.The design of above-mentioned distance T has taken into account structure
Intensity and Miniaturization Design.
A kind of camera module (not shown) of present pre-ferred embodiments, including above-mentioned photosensory assembly 300, further include mirror
Head mould group.
Specifically, when that need to use tight shot, the camera lens module includes camera lens, and the camera lens is located at the upper surface
362；When that need to use zoom lens, the camera lens module includes camera lens and the voice coil motor for being arranged the camera lens, the voice coil
Motor is located at the upper surface 362.Light is incident from camera lens and reaches the photosurface 342 of photosensitive element 340, photosensitive element 340
Convert optical signals into electric signal.
Above-mentioned camera module, the photosensory assembly for including due to it is while with smaller volume with larger thang-kng
Amount, therefore the camera module has preferable image quality and smaller volume, is conducive to the intelligence for being equipped with the camera module
Equipment develops while ensureing image quality to lightening direction.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (15)
1. a kind of photosensory assembly, which is characterized in that including：
Substrate；
Photosensitive element is set on the substrate and is electrically connected with the substrate, and the photosensitive element includes photosensitive area；And
Packaging body is packaged on the substrate and the photosensitive element, and the packaging body includes upper far from the photosensitive element
Surface, the packaging body are equipped with light hole, and the light hole is through photosensitive area described in the packaging body and face；
Wherein, the light hole includes connection and is in the first light hole, the second light hole and third thang-kng that ladder is arranged successively
The side wall in hole, first light hole is extended vertically from the photosensitive element to the upper surface, second light hole and
The cross section of three light holes is inverted trapezoidal structure, and the internal diameter of second light hole is less than the internal diameter of the third light hole, institute
State between the side wall of the second light hole and the side wall of the third light hole formation First terrace, second light hole it is interior
Diameter is more than the internal diameter of first light hole, is formed between the side wall of second light hole and the side wall of first light hole
Second step face.
2. photosensory assembly according to claim 1, which is characterized in that the width of the First terrace is 0.02-
0.50mm。
3. photosensory assembly according to claim 1, which is characterized in that the width in the second step face is 0.2-0.9mm.
4. photosensory assembly according to claim 1, which is characterized in that first light hole is rounded, a diameter of 2-
8mm。
5. photosensory assembly according to claim 4, which is characterized in that a diameter of 3-7mm of first light hole.
6. photosensory assembly according to claim 1, which is characterized in that first light hole is square, length 3-
10mm, width 2.5-9.8mm.
7. photosensory assembly according to claim 6, which is characterized in that the length of first light hole is 4-7mm, width
For 3.5-6.5mm.
8. photosensory assembly according to claim 6, which is characterized in that the width of the upper surface of the packaging body is 0.3-
3mm, length 2.7-8.7mm.
9. photosensory assembly according to claim 1, which is characterized in that the height of the packaging body is 0.35-1.7mm.
10. photosensory assembly according to claim 1, which is characterized in that the packaging body includes lateral wall, and described first is logical
The side wall of unthreaded hole between the packaging body lateral wall at a distance from be 0.5-5.5mm.
11. photosensory assembly according to claim 10, which is characterized in that the side wall of first light hole and the encapsulation
Distance between external side wall is 0.93-2.14mm.
12. according to the photosensory assembly described in claim 1~11 any one, which is characterized in that further include that connection is described photosensitive
The conducting wire of element and the substrate, the photosensitive element include around the non-photo-sensing area of the photosensitive area, the packaging body encapsulation
Part non-photo-sensing area simultaneously coats the conducting wire.
13. photosensory assembly according to claim 12, which is characterized in that the side wall of first light hole is photosensitive from described
The minimum range of the photosensitive area edge of element is 0.05mm.
14. photosensory assembly according to claim 12, which is characterized in that the side wall of first light hole is photosensitive from described
The minimum range of the photosensitive area edge of element is 0.2mm.
15. a kind of camera module, which is characterized in that the sense including camera lens module and as described in claim 1~14 any one
Optical assembly, the camera lens module are located at the upper surface of the packaging body.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710317509 | 2017-05-06 | ||
| CN2017103175092 | 2017-05-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108810348A true CN108810348A (en) | 2018-11-13 |
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ID=61334695
Family Applications (28)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720787619.0U Active CN206922905U (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201720787684.3U Active CN207184627U (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201720787578.5U Active CN206922904U (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710528974.0A Withdrawn CN108810346A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710528955.8A Pending CN108810341A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710528982.5A Withdrawn CN108810348A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201720787643.4U Expired - Fee Related CN206922906U (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710528965.1A Pending CN108810342A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201720787681.XU Active CN207184626U (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710529156.2A Withdrawn CN108810353A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
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| CN206922905U (en) * | 2017-05-06 | 2018-01-23 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
| CN110164984B (en) * | 2018-02-13 | 2024-02-09 | 宁波舜宇光电信息有限公司 | Integrated photosensitive module, photosensitive assembly, camera module and preparation method |
| CN208572292U (en) * | 2018-03-18 | 2019-03-01 | 宁波舜宇光电信息有限公司 | Depth information camera module and its base assembly and electronic equipment |
| CN108769466B (en) * | 2018-05-30 | 2021-01-29 | 信利光电股份有限公司 | Camera module, manufacturing method and electronic equipment |
| TWI768127B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, optical image system and optical image capturing manufacture method |
| TWI768126B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, image system and optical image capturing manufacture method |
| TWI768128B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module and imaging system, manufacture method thereof |
| TWI754099B (en) * | 2018-09-21 | 2022-02-01 | 先進光電科技股份有限公司 | Optical image capturing module |
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| US7221524B2 (en) * | 2004-01-30 | 2007-05-22 | Fujifilm Corporation | Lens unit and compact image pickup module |
| TWM284071U (en) * | 2005-05-11 | 2005-12-21 | Opcom Inc | Package structure of the display area of a camera module |
| TW201106037A (en) * | 2009-08-12 | 2011-02-16 | Univ Nat Central | An optical design for reducing the stray light |
| CN102621698A (en) * | 2012-03-31 | 2012-08-01 | 福建网讯科技有限公司 | Optical projection system for improving stray light near projection picture |
| CN102902137B (en) * | 2012-10-31 | 2015-12-02 | 信利光电股份有限公司 | A kind of camera module and base thereof |
| CN104897064B (en) * | 2015-06-09 | 2018-06-01 | 张白 | A kind of new smooth arm amplifying type high precision length sensor and measuring method |
| CN205157952U (en) * | 2015-11-17 | 2016-04-13 | 南昌欧菲光电技术有限公司 | Camera module |
| CN205792878U (en) * | 2016-04-21 | 2016-12-07 | 宁波舜宇光电信息有限公司 | Camera module based on moulding technology |
| CN205792880U (en) * | 2016-05-11 | 2016-12-07 | 宁波舜宇光电信息有限公司 | The integral base assembly of camera module based on integral packaging technique |
| CN205407982U (en) * | 2016-03-07 | 2016-07-27 | 宁波舜宇光电信息有限公司 | Pick -up module |
| CN205407988U (en) * | 2016-03-07 | 2016-07-27 | 宁波舜宇光电信息有限公司 | Pick -up module |
| CN205610755U (en) * | 2016-03-07 | 2016-09-28 | 宁波舜宇光电信息有限公司 | Pick -up module |
| CN110022424B (en) * | 2016-03-12 | 2021-08-10 | 宁波舜宇光电信息有限公司 | Camera module and photosensitive assembly and manufacturing method thereof |
| CN105681640B (en) * | 2016-03-28 | 2019-12-27 | 宁波舜宇光电信息有限公司 | Camera module and manufacturing method thereof |
| CN206136071U (en) * | 2016-07-03 | 2017-04-26 | 宁波舜宇光电信息有限公司 | Photosensitive assembly and module of making a video recording |
| CN207251753U (en) * | 2016-08-01 | 2018-04-17 | 宁波舜宇光电信息有限公司 | Mold photosensory assembly jigsaw and its manufacturing equipment |
| CN206922905U (en) * | 2017-05-06 | 2018-01-23 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
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| CN206977546U (en) | 2018-02-06 |
| CN108810347A (en) | 2018-11-13 |
| CN108810344A (en) | 2018-11-13 |
| CN207184627U (en) | 2018-04-03 |
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Application publication date: 20181113 |