WO2019015692A1 - Camera module, support base thereof, photosensitive device, manufacturing method, and electronic apparatus - Google Patents

Camera module, support base thereof, photosensitive device, manufacturing method, and electronic apparatus Download PDF

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Publication number
WO2019015692A1
WO2019015692A1 PCT/CN2018/096649 CN2018096649W WO2019015692A1 WO 2019015692 A1 WO2019015692 A1 WO 2019015692A1 CN 2018096649 W CN2018096649 W CN 2018096649W WO 2019015692 A1 WO2019015692 A1 WO 2019015692A1
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WO
WIPO (PCT)
Prior art keywords
holder
groove
venting
photosensitive
passage
Prior art date
Application number
PCT/CN2018/096649
Other languages
French (fr)
Chinese (zh)
Inventor
赵波杰
梅哲文
王明珠
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to CN202111073363.4A priority Critical patent/CN113596313B/en
Priority to CN201880045508.XA priority patent/CN110892702B/en
Publication of WO2019015692A1 publication Critical patent/WO2019015692A1/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present invention relates to the field of optical imaging, and in particular to a camera module and its support, a photosensitive device and a manufacturing method thereof, and an electronic device.
  • the camera module will inevitably protrude from the smart electronic device.
  • the number of devices or other smart components such as, but not limited to, gyroscopes, sensors, processors, etc.
  • the camera module protrudes from the smart electronic device, the design of the smart electronic device is affected on the one hand, and the smart electronic device is highlighted in the process of carrying the intelligent electronic device on the other hand.
  • the camera module is easily touched and the camera module is damaged. If the number of smart electronic devices is reduced and the size is reduced, the performance of the camera module is greatly adversely affected, and the smart electronic device is further restricted toward the intelligent direction.
  • the inventors introduced the molding and packaging process applied in the field of semiconductor packaging into the packaging process of the camera module.
  • the passive electronic components are first pasted through the surface.
  • the process is mounted on the circuit board, and then the molding process is integrally integrated into the circuit board to form an integrated base, wherein the integrated base can embed the passive electronic components, because the integrated base There is no need to reserve a safe distance between the seat and the passive electronic components, so that the size of the camera module is reduced, and the integrated base can prevent adjacent passive electronic components from appearing by isolating adjacent passive electronic components.
  • the mutual interference is a problem, so that a larger number of passive electronic components can be mounted on the limited mounting area of the circuit board, which is beneficial to further improve the quality of the camera module.
  • the integrated pedestal integrally formed by the molding process and integrally bonded to the circuit board can further embed the non-photosensitive area of the photosensitive member.
  • the filter element is held between the optical lens and the photosensitive element for filtering stray light in the light entering the interior of the camera module from the optical lens.
  • the filter element is a glass piece, for example, not limited to blue glass.
  • the filter element is relatively fragile, and the filter element having a larger length and width is more fragile, and on the other hand, the cost of the filter element is compared.
  • a filter element that is high and has a large length and width is relatively expensive.
  • the area in which the filter element is effectively utilized is actually small, and only the area located in the middle of the filter element is the filter area. In other words, the area of the filter region of the filter element occupies less overall area of the filter element, which causes waste of the filter element and greatly increases the cost of the camera module.
  • a frame-shaped support for connecting the filter element and the unitary base is employed by the inventors. Specifically, first, the filter element is attached to the inner side of the frame-shaped support, and then the outer side of the frame-shaped support is attached to the integrated base by glue, and at this time, the inner side of the frame-shaped support
  • the portion can extend from the non-photosensitive area of the photosensitive member toward the photosensitive region, and the light-passing hole of the frame-shaped holder corresponds to the photosensitive region of the photosensitive member, and the filter member is held on the photosensitive path of the photosensitive member.
  • the frame-shaped support is mounted on the integrated base by means of glue, and the glue is first applied to the lower mounting surface of the frame-shaped support and/or the upper surface of the integrated base, and then After the lower mounting surface of the frame-shaped support and the upper surface of the integrated base are attached together, the baking process is performed, and at this time, the lower mounting surface of the frame-shaped support can be reliably mounted on the integrated base. The upper surface of the seat. Then, after the lower mounting surface of the frame-shaped holder is attached to the upper surface of the integrated base, a sealed space is formed between the filter element, the frame-shaped support, the integrated base, and the circuit board. At this time, during the baking process, the air pressure inside and outside the sealed space is no longer balanced.
  • the air pressure in the sealed space will be greater than the pressure of the external environment, thus causing
  • the fragile components such as filter elements and photosensitive elements are affected by the air pressure, and the air pressure may cause deformation or cracks in the fragile components such as the filter element and the photosensitive element, and if these undesirable phenomena occur, it is inevitable.
  • An object of the present invention is to provide a camera module and a support thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the camera module has at least one sealed space, in the process of manufacturing the camera module,
  • the air pressure of the sealed space and the pressure of the outside of the photosensitive device of the camera module can be always balanced, in such a manner that each component of the photosensitive device for forming the sealed space can be avoided. Bad phenomenon caused by pressure imbalance.
  • An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein in the process of manufacturing the camera module, the pressure of the sealed space and the photosensitive device
  • the external atmospheric pressure can be always balanced, in such a manner that the pressures of the upper and lower portions of the filter element of the photosensitive device are ensured to be uniform, thereby avoiding the upper and lower portions of the filter element being received.
  • the pressure imbalance causes an undesirable phenomenon in which the filter element is cracked or chipped.
  • An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the photosensitive device has at least one ventilation passage for communicating the sealed space and the exterior of the photosensitive device a method of achieving gas exchange between the sealed space and the exterior of the photosensitive device through the venting passage, balancing the pressure of the air in the sealed space and the pressure of the outside of the photosensitive device during the baking process .
  • An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the ventilation passage is curvedly extended to prevent dust and the like from entering the external environment via the ventilation passage.
  • the sealed space is prevented from being contaminated by the photosensitive region held in the sealed space and the portion of the filter element for forming the sealed space.
  • An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the ventilation passage can be sealed by a sealing medium to prevent dust and the like from being discharged through the ventilation passage.
  • the outside of the photosensitive device enters the sealed space, thereby preventing the photosensitive region held in the sealed space and the portion where the filter element forms the sealed space from being contaminated.
  • An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the ventilation passage is curvedly extended, in such a manner that the ventilation passage is sealed with the sealing medium
  • the venting passage can prevent the sealing medium from flowing into the sealed space, thereby preventing the photosensitive region of the photosensitive member held in the sealed space from being contaminated.
  • An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the ventilation passage is curvedly extended, in such a manner that the ventilation passage is sealed with the sealing medium At this time, the sealing medium does not flow to the inner wall of the sealed space, causing a defect in the inside of the sealed space, and in this way, entry into the sealed space through the filter element can be prevented. Light is affected to ensure the imaging quality of the camera module.
  • An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the holder has at least one venting groove, and the holder is attached to the holder through a mounting medium.
  • the venting groove forms the venting passage between the holder and the molding base when the pedestal of the camera module is molded.
  • An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the molding base has at least one venting groove through which the cradle is The venting groove forms the venting passage between the holder and the molded base when mounted on the molded base.
  • An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the holder has at least one vent hole and at least one venting groove, and the vent hole and the venting groove are mutually Communicating to form the venting passage, and the extending direction of the vent hole does not coincide with the extending direction of the venting groove, such that the venting passage can be bently extended.
  • An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein a depth dimension of the venting groove is larger than a thickness dimension of the mounting medium, so that a baking process is performed
  • a depth dimension of the venting groove is larger than a thickness dimension of the mounting medium, so that a baking process is performed
  • the pressure of the air pressure in the sealed space and the pressure of the outside of the photosensitive device are balanced.
  • An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein a plurality of small-sized vent holes can communicate with the same one of the venting grooves to form the venting passage.
  • the small-sized vent hole can prevent contaminants such as dust from entering the sealed space from the external environment via the vent passage to contaminate the photosensitive region of the photosensitive member held in the sealed space and A problem of the portion of the filter element for forming the sealed space occurs.
  • the invention provides a camera module comprising at least one optical lens and at least one photosensitive device, wherein the photosensitive device comprises:
  • At least one filter unit wherein the filter unit comprises at least one seat and at least one filter element, the holder has at least one light passage, the filter element is mounted on the support, and The light passage of the holder corresponds to the filter element;
  • At least one molded photosensitive unit wherein the molded photosensitive unit further comprises:
  • At least one circuit board wherein the circuit board includes at least one substrate
  • At least one photosensitive member wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
  • At least one molded base wherein the molded base has at least one light window, the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member a periphery of the photosensitive region, and the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein the holder is attached to a top surface of the molded base, and Forming at least one sealed space between the filter unit and the molded photosensitive unit, the photosensitive region of the photosensitive member being held in the sealed space, wherein the optical lens is held at the photosensitive element a photosensitive path, and the filter element is held between the optical lens and the photosensitive element;
  • the photosensitive device has at least one venting passage for communicating the sealed space and the exterior of the photosensitive device, wherein the venting passage is used to make the venting passage during manufacture of the photosensitive device
  • the gas inside the sealed space and the gas outside the photosensitive device are exchanged to balance the air pressure inside the sealed space and the air pressure outside the photosensitive device.
  • the venting passage is formed in the holder; or the venting passage is formed in the molding base; or the venting passage is formed in the holder and the molding base Between the seats; or a portion of the venting channel is formed in the pedestal and another portion is formed between the molded base and the pedestal.
  • the venting channel extends curvedly; or the venting channel extends obliquely; or the shape of the venting channel is selected: "L” shaped, “S” shaped, “V” shaped or " A group of shapes consisting of Y" shapes.
  • the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one vent hole, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage a passage, wherein the vent hole extends from the upper surface toward the lower surface, the vent groove is formed on the lower surface, and the vent groove extends from the inner side toward the outer side direction, wherein The vent hole and the venting groove communicate with each other to form the venting passage of the photosensitive device.
  • the extending direction of the vent hole and the extending direction of the vent groove are perpendicular to each other.
  • one of the vent holes and one of the venting grooves communicate with each other to form the venting passage of the photosensitive device; or a plurality of the venting holes and one of the venting grooves communicate with each other to form The venting passage of the photosensitive device; or one of the venting holes and the plurality of venting grooves communicate with each other to form the venting passage of the photosensitive device.
  • the venting groove is stepped.
  • the parameter of the depth dimension of the venting groove of the pedestal is h1, wherein the parameter h1 of the depth dimension of the venting groove has a value range of: h1 ⁇ 0.1 mm.
  • the parameter of the depth dimension of the venting groove of the pedestal is h1
  • the parameter of the thickness dimension of the pedestal is H
  • the parameter h1 of the depth dimension of the venting groove The ratio of the ratio of the parameter H of the thickness dimension of the support is: 0.5% to 70%.
  • the venting groove of the holder has an open end and a communicating end corresponding to the open end, wherein a portion of the communicating end of the venting groove is defined as a first venting a groove defining a portion of the open end of the venting groove as a second venting groove, such that the first venting groove communicates with the second venting groove and the venting hole, respectively, and the second venting groove is connected
  • the sealed space wherein a depth dimension of the first venting groove is greater than a depth dimension of the second venting groove.
  • the first venting groove of the holder has a depth dimension of 0.1 mm
  • the second venting groove of the holder has a depth dimension of 0.03 mm.
  • the parameter of the width dimension of the first venting groove of the pedestal is W
  • the parameter of the diameter dimension of the low end of the vent is R
  • the pedestal The ratio of the width dimension of the first venting groove to the diameter dimension of the lower end of the vent hole ranges from 2:1 to 1:1.
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein
  • the venting groove is formed on the lower surface, and the venting groove extends from the inner side surface to the outer side surface, wherein the lower surface of the pedestal is attached to the molded base After the top surface is described, the venting groove forms the venting passage of the photosensitive device between the holder and the molded base.
  • the venting groove extends in a curved manner.
  • the shape of the venting groove is selected from the group consisting of: an "L” shape, an "S” shape, a “V” shape, and a "Y” shape.
  • the holder has at least one first groove and at least one second groove, the first groove extending from the inner side of the seat facing the outer side direction,
  • the second groove extends from the outer side of the holder toward the inner side surface, and the first groove and the second groove communicate with each other to form the groove of the holder .
  • the extending direction of the first groove of the holder and the extending direction of the second groove have an included angle.
  • one of the first groove and one of the second grooves communicate with each other to form the groove of the holder; or a plurality of the first groove and one of the The second grooves communicate with each other to form the grooves of the holder; or one of the first grooves and the plurality of the second grooves communicate with each other to form the grooves of the holder.
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the lower surface adjacent to the light window is defined as a non-painting area, and an area of the lower surface remote from the light window is defined as a glue area surrounding the non-painting area, wherein The venting groove is formed on the lower surface, and the venting groove extends from the outer side surface via the glue area to a suitable position of the non-painting area, wherein the lower surface of the pedestal After the glue area is attached to the top surface of the molding base, the vent groove is on the lower surface of the holder and the top surface of the molding base Forming the venting passage of the photosensitive device
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer sides correspond to each other, and the inner side and the outer side extend upward and downward, respectively, to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein A region of the lower surface adjacent to the light window is defined as a non-painting region, and a region of the lower surface remote from the light window is defined as a glue region surrounding the non-painting region, wherein The venting hole extends from the upper surface of the holder to the non-painting area of the lower surface, wherein the glue area of the lower surface of the holder is attached to the mold The top surface of the plastic base, the venting opening of the holder forming the venting passage of the photosensitive device.
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein a venting groove formed on the upper surface of the holder, and the venting groove extending from the inner side toward the outer side surface, wherein the filter element is mounted on the seat a surface, and the filter element exposes a portion of the venting groove, wherein after the lower surface of the pedestal is attached to the top surface of the molded base, the branch The venting groove of the seat forms the venting passage of the photosensitive device between the filter element and the holder.
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the upper surface adjacent to the light window is defined as an inner side of the upper surface, and a region of the upper surface remote from the light window is defined to surround an outer surface of the upper surface of the upper surface, wherein
  • the inner side surface has an inner side surface side and an inner side surface lower side, the inner side surface sides respectively extending upward and downward to be connected to the outer side of the upper surface and the inner side of the upper surface, the lower side of the inner side surface Extending upwardly and downwardly to connect to the inner side of the upper surface and the lower surface, wherein the venting groove is provided inside the upper surface, and the venting groove extends from
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer sides correspond to each other, and the inner side and the outer side extend upward and downward, respectively, to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the upper surface adjacent to the light window is defined as an inner side of the upper surface, and a region of the upper surface remote from the light window is defined to surround an outer surface of the upper surface of the upper surface, wherein
  • the inner side surface has an inner side surface side and an inner side surface lower side, and the inner side surface side respectively extends upward and downward to be connected to the outer side of the upper surface and the inner side of the upper surface, respectively Extending upwardly and downwardly to connect to an inner side of the upper surface and the lower surface, wherein the vent extends from an inner side of the upper surface to the lower surface, wherein the filter element is
  • the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one venting groove, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage a channel, wherein a region of the upper surface adjacent to the light window is defined as an inner side of an upper surface, and a region of the upper surface remote from the light window is defined to surround an area around an inner side of the upper surface
  • An outer side surface wherein the inner side surface has an inner side surface side and an inner side surface lower side, the inner side surface sides respectively extending upward and downward to be coupled to the outer side of the upper surface and the inner side of the upper surface, The lower side of the inner side surface respectively extends upward and downward to be connected to the inner side of the upper surface and the lower surface, wherein the vent
  • the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder, And forming a slit between the outer wall of the filter element and the connecting portion, wherein the pedestal mounting portion of the holder is attached to the top surface of the molding base, and The filter mounting portion is held by the light window of the molding base such that the molding base surrounds the filter mounting portion of the holder, wherein
  • the holder has at least one light passing hole, wherein the light passing hole extends from an upper surface to a lower surface of the filter mounting portion, and the light passing hole communicates with an upper surface of the filter mounting portion The slit to form the venting passage of the photosensitive device.
  • the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder,
  • the pedestal mounting portion of the holder is attached to the top surface of the molding base, and the filter mounting portion is held by the light of the molding base a window such that the molded base surrounds the filter mounting portion of the holder, wherein the base inner surface of the molded base and the connecting portion of the holder Forming a gap therebetween, wherein the holder has at least one light passing hole, wherein the light passing hole extends from an upper surface of the pedestal mounting portion to a lower surface, and the light passing hole is pasted on the pedestal A lower surface of the loading portion communicates with the slit to form the venting passage of the photosensitive device.
  • the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder, And forming a gap between the outer wall of the filter element and the connecting portion, the pedestal mounting portion of the holder being mounted on the top surface of the molding base, and The filter mounting portion is held in the light window of the molding base such that the molding base surrounds the filter mounting portion of the holder, wherein Forming another gap between the inner surface of the base of the molded base and the connecting portion of the holder, wherein the holder has at least one light passing hole, and the light passing hole is from one side of the connecting portion Extending to the other side to respectively communicate the gap formed between the outer wall of the filter element and the connecting portion and formed on the molded base The vent passage of the gap between the outer wall and the inner surface of said filter housing elements, thereby
  • the top surface of the molding base has at least one venting groove extending from the inner surface of the base of the molding base to the outer surface of the pedestal to communicate The light window and the exterior, wherein the venting groove is at the top of the holder and the molded base after the holder is attached to the top surface of the molding base
  • the venting passage of the photosensitive device is formed between the surfaces.
  • the venting groove of the molded base extends in a curved manner.
  • the shape of the venting groove of the molded base is selected from the group consisting of an "L” shape, an "S” shape, a “V” shape, and a "Y” shape.
  • the molding base has at least one first groove and at least one second groove
  • the first groove is from the inner surface of the base of the molding base
  • the outer surface of the substrate extends in a direction
  • the second groove extends from the outer surface of the base of the molding base toward the inner surface of the base
  • the first groove and the second concave The slots communicate with each other to form the grooves of the molded base.
  • one of the first groove and one of the second grooves communicate with each other to form the groove of the molded base; or one of the first groove and a plurality of The second grooves communicate with each other to form the grooves of the molded base; or a plurality of the first grooves and one of the first grooves communicate with each other to form the molded base The groove.
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer side surfaces correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the vent hole being from the upper surface of the holder Extending to the lower surface, wherein the top surface of the molded base has at least one venting groove extending from the inner surface of the base of the molded base toward the outer surface of the base to a suitable a position wherein the venting opening of the holder and the ventilation of the molded base after the lower surface of the holder is attached to the top surface of the molding base
  • the slots communicate with each other to form the venting passage of the photosensitive device.
  • the molding base has a first groove and a second groove, the first groove respectively communicating the second groove and the vent, the first Two grooves communicate with the sealed space, wherein a depth dimension of the first groove is greater than a depth dimension of the second groove.
  • the camera module further comprises at least one sealing element formed and held in the venting channel.
  • the substrate has a substrate front surface, a substrate back surface, and at least one receiving space, wherein the substrate front surface and the substrate back surface correspond to each other, and the receiving space is from the front surface of the substrate toward the The substrate is extended in the back direction, wherein the photosensitive device is housed in the accommodation space.
  • the substrate has a substrate front surface, a substrate back surface, and at least one receiving space, wherein the substrate front surface and the substrate back surface correspond to each other, and the receiving space extends from the front surface of the substrate to the a back surface of the substrate to communicate the front surface of the substrate and the back surface of the substrate, wherein the non-photosensitive area of the photosensitive element is mounted on a back surface of the substrate of the substrate, and the substrate surrounds the photosensitive element
  • the photosensitive region is circumferentially disposed such that the photosensitive region of the photosensitive member corresponds to the receiving space of the substrate.
  • the molding base is integrally bonded to at least a portion of the non-photosensitive area of the photosensitive member; or the molding base is integrally bonded to the substrate.
  • the circuit board comprises at least one electronic component, the electronic component being conductively connected to the substrate, wherein the molded base is embedded in the substrate At least a portion of at least one of the electronic components on the front side of the substrate.
  • the present invention further provides an electronic device with a camera module, comprising: a device body and at least one camera module disposed on the device body, wherein the camera module includes at least one optical a lens and at least one photosensitive device, wherein the photosensitive device comprises:
  • At least one filter unit wherein the filter unit comprises at least one seat and at least one filter element, the holder has at least one light passage, the filter element is mounted on the support, and The light passage of the holder corresponds to the filter element;
  • At least one molded photosensitive unit wherein the molded photosensitive unit further comprises:
  • At least one circuit board wherein the circuit board includes at least one substrate
  • At least one photosensitive member wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
  • At least one molded base wherein the molded base has at least one light window, the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member a periphery of the photosensitive region, and the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein the holder is attached to a top surface of the molded base, and Forming at least one sealed space between the filter unit and the molded photosensitive unit, the photosensitive region of the photosensitive member being held in the sealed space, wherein the optical lens is held at the photosensitive element a photosensitive path, and the filter element is held between the optical lens and the photosensitive element;
  • the photosensitive device has at least one venting passage for communicating the sealed space and the exterior of the photosensitive device, wherein the venting passage is used to make the venting passage during manufacture of the photosensitive device
  • the gas inside the sealed space and the gas outside the photosensitive device are exchanged to balance the air pressure inside the sealed space and the air pressure outside the photosensitive device.
  • the present invention further provides a camera module comprising at least one optical lens and at least one photosensitive device, wherein the photosensitive device comprises:
  • At least one filter unit wherein the filter unit includes at least one seat and at least one filter element, wherein the support has at least one light passage, at least one ventilation passage, and at least one second light passage space, a light passing passage and the venting passage respectively communicate with the second light passing space, the filter element is attached to the pedestal, and the light passing passage of the pedestal corresponds to the filter element ;
  • At least one molded photosensitive unit wherein the molded photosensitive unit further comprises:
  • At least one circuit board wherein the circuit board includes at least one substrate
  • At least one photosensitive member wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
  • At least one molding portion wherein the molding portion includes at least one molding body and has at least one first light passing space, the molding body is integrally bonded to the substrate, and the molding body forms at least a first light-passing space, wherein the holder is attached to the molded body such that the first light-passing space and the second light-passing space communicate with each other at the filter unit and the Forming at least one sealed space between the molded photosensitive units, the venting passage of the holder for communicating the sealed space and the outside of the photosensitive device, wherein the photosensitive region of the photosensitive member is held at The sealed space in which the optical lens is held in a photosensitive path of the photosensitive element, and the filter element is held between the optical lens and the photosensitive element.
  • the holder includes a seat body and at least one extension arm integrally extending from the holder body, and the first portion is formed between the holder body and the extension arm a light-passing passage formed in the holder body, the ventilation passage being formed in the extension arm, wherein the extension arm of the holder is attached to the molding portion
  • the molded body is described.
  • the holder comprises at least a seat body and at least one extension arm integrally extending from the seat body, the formation being formed between the seat body and the extension arm a second light-passing space and at least one second installation space communicating with the second light-passing space, the light-passing passage is formed in the support body, and the ventilation passage is formed in the extension arm, wherein the phase is Forming at least one first installation space between adjacent molding bodies, wherein at least a portion of the extension arms of the holder are held in the holder when the holder is attached to the molding portion The first installation space of the molding portion, at least a portion of the molding body being held in the second installation space of the holder to be between the filter unit and the molded photosensitive unit The sealed space is formed.
  • the molded body has an "I" shape
  • the extension arm has a U-shape
  • the molded body has a U-shape
  • the extension arm has an "I” shape
  • the molded body has an "L” shape
  • the extension arm has an "L” shape
  • the two molded bodies are symmetrical to each other, and the two extension arms are symmetrical to each other; or the molded body and The extension arms are all in the shape of a "mouth”.
  • the ventilation channel extends obliquely.
  • the present invention further provides an electronic device with a camera module, comprising: a device body and at least one camera module, wherein the camera module has at least one optical lens and at least one photosensitive device, wherein
  • the photosensitive device comprises:
  • At least one filter unit wherein the filter unit includes at least one seat and at least one filter element, wherein the support has at least one light passage, at least one ventilation passage, and at least one second light passage space, a light passing passage and the venting passage respectively communicate with the second light passing space, the filter element is attached to the pedestal, and the light passing passage of the pedestal corresponds to the filter element ;
  • At least one molded photosensitive unit wherein the molded photosensitive unit further comprises:
  • At least one circuit board wherein the circuit board includes at least one substrate
  • At least one photosensitive member wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
  • At least one molding portion wherein the molding portion includes at least one molding body and has at least one first light passing space, the molding body is integrally bonded to the substrate, and the molding body forms at least a first light-passing space, wherein the holder is attached to the molded body such that the first light-passing space and the second light-passing space communicate with each other at the filter unit and the Forming at least one sealed space between the molded photosensitive units, the venting passage of the holder for communicating the sealed space and the outside of the photosensitive device, wherein the photosensitive region of the photosensitive member is held at The sealed space in which the optical lens is held in a photosensitive path of the photosensitive element, and the filter element is held between the optical lens and the photosensitive element.
  • the present invention further provides a photosensitive device comprising:
  • At least one filter unit wherein the filter unit comprises at least one seat and at least one filter element, the holder has at least one light passage, the filter element is mounted on the support, and The light passage of the holder corresponds to the filter element;
  • At least one molded photosensitive unit wherein the molded photosensitive unit further comprises:
  • At least one circuit board wherein the circuit board includes at least one substrate
  • At least one photosensitive member wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
  • At least one molded base wherein the molded base has at least one light window, the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member a periphery of the photosensitive region, and the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein the holder is attached to a top surface of the molded base, and Forming at least one sealed space between the filter unit and the molded photosensitive unit, the photosensitive region of the photosensitive member is held in the sealed space, and the filter element is held at the photosensitive member Photosensitive path
  • the photosensitive device has at least one venting passage for communicating the sealed space and the exterior of the photosensitive device, wherein the venting passage is used to make the venting passage during manufacture of the photosensitive device
  • the gas inside the sealed space and the gas outside the photosensitive device are exchanged to balance the air pressure inside the sealed space and the air pressure outside the photosensitive device.
  • the venting passage is formed in the holder; or the venting passage is formed in the molding base; or the venting passage is formed in the holder and the molding base Between the seats; or a portion of the venting channel is formed in the pedestal and another portion is formed between the molded base and the pedestal.
  • the venting channel extends curvedly; or the venting channel extends obliquely; or the shape of the venting channel is selected: "L” shaped, “S” shaped, “V” shaped or " A group of shapes consisting of Y" shapes.
  • the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one vent hole, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage a passage, wherein the vent hole extends from the upper surface toward the lower surface, the vent groove is formed on the lower surface, and the vent groove extends from the inner side toward the outer side direction, wherein The vent hole and the venting groove communicate with each other to form the venting passage of the photosensitive device.
  • the extending direction of the vent hole and the extending direction of the vent groove are perpendicular to each other.
  • one of the vent holes and one of the venting grooves communicate with each other to form the venting passage of the photosensitive device; or a plurality of the venting holes and one of the venting grooves communicate with each other to form The venting passage of the photosensitive device; or one of the venting holes and the plurality of venting grooves communicate with each other to form the venting passage of the photosensitive device.
  • the venting groove is stepped.
  • the parameter of the depth dimension of the venting groove of the pedestal is h1, wherein the parameter h1 of the depth dimension of the venting groove has a value range of: h1 ⁇ 0.1 mm.
  • the parameter of the depth dimension of the venting groove of the pedestal is h1
  • the parameter of the thickness dimension of the pedestal is H
  • the parameter h1 of the depth dimension of the venting groove The ratio of the ratio of the parameter H of the thickness dimension of the support is: 0.5% to 70%.
  • the venting groove of the holder has an open end and a communicating end corresponding to the open end, wherein a portion of the communicating end of the venting groove is defined as a first venting a groove defining a portion of the open end of the venting groove as a second venting groove, such that the first venting groove communicates with the second venting groove and the venting hole, respectively, and the second venting groove is connected
  • the sealed space wherein a depth dimension of the first venting groove is greater than a depth dimension of the second venting groove.
  • the first venting groove of the holder has a depth dimension of 0.1 mm
  • the second venting groove of the holder has a depth dimension of 0.03 mm.
  • the parameter of the width dimension of the first venting groove of the pedestal is W
  • the parameter of the diameter dimension of the low end of the vent is R
  • the pedestal The ratio of the width dimension of the first venting groove to the diameter dimension of the lower end of the vent hole ranges from 2:1 to 1:1.
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein
  • the venting groove is formed on the lower surface, and the venting groove extends from the inner side surface to the outer side surface, wherein the lower surface of the pedestal is attached to the molded base After the top surface is described, the venting groove forms the venting passage of the photosensitive device between the holder and the molded base.
  • the venting groove extends in a curved manner.
  • the shape of the venting groove is selected from the group consisting of: an "L” shape, an "S” shape, a “V” shape, and a "Y” shape.
  • the holder has at least one first groove and at least one second groove, the first groove extending from the inner side of the seat facing the outer side direction,
  • the second groove extends from the outer side surface of the holder like the inner side direction, and the first groove and the second groove communicate with each other to form the concave of the holder groove.
  • the extending direction of the first groove of the holder and the extending direction of the second groove have an included angle.
  • one of the first groove and one of the second grooves communicate with each other to form the groove of the holder; or a plurality of the first groove and one of the The second grooves communicate with each other to form the grooves of the holder; or one of the first grooves and the plurality of the second grooves communicate with each other to form the grooves of the holder.
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the lower surface adjacent to the light window is defined as a non-painting area, and an area of the lower surface remote from the light window is defined as a glue area surrounding the non-painting area, wherein The venting groove is formed on the lower surface, and the venting groove extends from the outer side surface via the glue area to a suitable position of the non-painting area, wherein the lower surface of the pedestal After the glue area is attached to the top surface of the molding base, the vent groove is on the lower surface of the holder and the top surface of the molding base Forming the venting passage of the photosensitive device
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer sides correspond to each other, and the inner side and the outer side extend upward and downward, respectively, to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein A region of the lower surface adjacent to the light window is defined as a non-painting region, and a region of the lower surface remote from the light window is defined as a glue region surrounding the non-painting region, wherein The venting hole extends from the upper surface of the holder to the non-painting area of the lower surface, wherein the glue area of the lower surface of the holder is attached to the mold The top surface of the plastic base, the venting opening of the holder forming the venting passage of the photosensitive device.
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein a venting groove formed on the upper surface of the holder, and the venting groove extending from the inner side toward the outer side surface, wherein the filter element is mounted on the seat a surface, and the filter element exposes a portion of the venting groove, wherein after the lower surface of the pedestal is attached to the top surface of the molded base, the branch The venting groove of the seat forms the venting passage of the photosensitive device between the filter element and the holder.
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the upper surface adjacent to the light window is defined as an inner side of the upper surface, and a region of the upper surface remote from the light window is defined to surround an outer surface of the upper surface of the upper surface, wherein
  • the inner side surface has an inner side surface side and an inner side surface lower side, the inner side surface sides respectively extending upward and downward to be connected to the outer side of the upper surface and the inner side of the upper surface, the lower side of the inner side surface Extending upwardly and downwardly to connect to the inner side of the upper surface and the lower surface, wherein the venting groove is provided inside the upper surface, and the venting groove extends from
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer sides correspond to each other, and the inner side and the outer side extend upward and downward, respectively, to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the upper surface adjacent to the light window is defined as an inner side of the upper surface, and a region of the upper surface remote from the light window is defined to surround an outer surface of the upper surface of the upper surface, wherein
  • the inner side surface has an inner side surface side and an inner side surface lower side, and the inner side surface side respectively extends upward and downward to be connected to the outer side of the upper surface and the inner side of the upper surface, respectively Extending upwardly and downwardly to connect to an inner side of the upper surface and the lower surface, wherein the vent extends from an inner side of the upper surface to the lower surface, wherein the filter element is
  • the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one venting groove, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage a channel, wherein a region of the upper surface adjacent to the light window is defined as an inner side of an upper surface, and a region of the upper surface remote from the light window is defined to surround an area around an inner side of the upper surface
  • An outer side surface wherein the inner side surface has an inner side surface side and an inner side surface lower side, the inner side surface sides respectively extending upward and downward to be coupled to the outer side of the upper surface and the inner side of the upper surface, The lower side of the inner side surface respectively extends upward and downward to be connected to the inner side of the upper surface and the lower surface, wherein the vent
  • the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder, And forming a slit between the outer wall of the filter element and the connecting portion, wherein the pedestal mounting portion of the holder is attached to the top surface of the molding base, and The filter mounting portion is held by the light window of the molding base such that the molding base surrounds the filter mounting portion of the holder, wherein
  • the holder has at least one light passing hole, wherein the light passing hole extends from an upper surface to a lower surface of the filter mounting portion, and the light passing hole communicates with an upper surface of the filter mounting portion The slit to form the venting passage of the photosensitive device.
  • the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder,
  • the pedestal mounting portion of the holder is attached to the top surface of the molding base, and the filter mounting portion is held by the light of the molding base a window such that the molded base surrounds the filter mounting portion of the holder, wherein the base inner surface of the molded base and the connecting portion of the holder Forming a gap therebetween, wherein the holder has at least one light passing hole, wherein the light passing hole extends from an upper surface of the pedestal mounting portion to a lower surface, and the light passing hole is pasted on the pedestal A lower surface of the loading portion communicates with the slit to form the venting passage of the photosensitive device.
  • the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder, And forming a gap between the outer wall of the filter element and the connecting portion, the pedestal mounting portion of the holder being mounted on the top surface of the molding base, and The filter mounting portion is held in the light window of the molding base such that the molding base surrounds the filter mounting portion of the holder, wherein Forming another gap between the inner surface of the base of the molded base and the connecting portion of the holder, wherein the holder has at least one light passing hole, and the light passing hole is from one side of the connecting portion Extending to the other side to respectively communicate the gap formed between the outer wall of the filter element and the connecting portion and formed on the molded base The vent passage of the gap between the outer wall and the inner surface of said filter housing elements, thereby
  • the top surface of the molding base has at least one venting groove extending from the inner surface of the base of the molding base to the outer surface of the pedestal to communicate The light window and the exterior, wherein the venting groove is at the top of the holder and the molded base after the holder is attached to the top surface of the molding base
  • the venting passage of the photosensitive device is formed between the surfaces.
  • the venting groove of the molded base extends in a curved manner.
  • the shape of the venting groove of the molded base is selected from the group consisting of an "L” shape, an "S” shape, a “V” shape, and a "Y” shape.
  • the molding base has at least one first groove and at least one second groove
  • the first groove is from the inner surface of the base of the molding base
  • the outer surface of the substrate extends in a direction
  • the second groove extends from the outer surface of the base of the molding base toward the inner surface of the base
  • the first groove and the second concave The slots communicate with each other to form the grooves of the molded base.
  • one of the first groove and one of the second grooves communicate with each other to form the groove of the molded base; or one of the first groove and a plurality of The second grooves communicate with each other to form the grooves of the molded base; or a plurality of the first grooves and one of the first grooves communicate with each other to form the molded base The groove.
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer side surfaces correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the vent hole being from the upper surface of the holder Extending to the lower surface, wherein the top surface of the molded base has at least one venting groove extending from the inner surface of the base of the molded base toward the outer surface of the base to a suitable a position wherein the venting opening of the holder and the ventilation of the molded base after the lower surface of the holder is attached to the top surface of the molding base
  • the slots communicate with each other to form the venting passage of the photosensitive device.
  • the molding base has a first groove and a second groove, the first groove respectively communicating the second groove and the vent, the first Two grooves communicate with the sealed space, wherein a depth dimension of the first groove is greater than a depth dimension of the second groove.
  • the camera module further comprises at least one sealing element formed and held in the venting channel.
  • the substrate has a substrate front surface, a substrate back surface, and at least one receiving space, wherein the substrate front surface and the substrate back surface correspond to each other, and the receiving space is from the front surface of the substrate toward the The substrate is extended in the back direction, wherein the photosensitive device is housed in the accommodation space.
  • the substrate has a substrate front surface, a substrate back surface, and at least one receiving space, wherein the substrate front surface and the substrate back surface correspond to each other, and the receiving space extends from the front surface of the substrate to the a back surface of the substrate to communicate the front surface of the substrate and the back surface of the substrate, wherein the non-photosensitive area of the photosensitive element is mounted on a back surface of the substrate of the substrate, and the substrate surrounds the photosensitive element
  • the photosensitive region is circumferentially disposed such that the photosensitive region of the photosensitive member corresponds to the receiving space of the substrate.
  • the molding base is integrally bonded to at least a portion of the non-photosensitive area of the photosensitive member; or the molding base is integrally bonded to the substrate.
  • the circuit board comprises at least one electronic component, the electronic component being conductively connected to the substrate, wherein the molded base is embedded in the substrate At least a portion of at least one of the electronic components on the front side of the substrate.
  • the present invention further provides a photosensitive device comprising:
  • At least one filter unit wherein the filter unit includes at least one seat and at least one filter element, wherein the support has at least one light passage, at least one ventilation passage, and at least one second light passage space, a light passing passage and the venting passage respectively communicate with the second light passing space, the filter element is attached to the pedestal, and the light passing passage of the pedestal corresponds to the filter element ;
  • At least one molded photosensitive unit wherein the molded photosensitive unit further comprises:
  • At least one circuit board wherein the circuit board includes at least one substrate
  • At least one photosensitive member wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
  • At least one molding portion wherein the molding portion includes at least one molding body and has at least one first light passing space, the molding body is integrally bonded to the substrate, and the molding body forms at least a first light-passing space, wherein the holder is attached to the molded body such that the first light-passing space and the second light-passing space communicate with each other at the filter unit and the Forming at least one sealed space between the molded photosensitive units, the venting passage of the holder for communicating the sealed space and the outside of the photosensitive device, wherein the photosensitive region of the photosensitive member is held at In the sealed space, the filter element is held in a photosensitive path of the photosensitive element.
  • the holder includes a seat body and at least one extension arm integrally extending from the holder body, and the first portion is formed between the holder body and the extension arm a light-passing passage formed in the holder body, the ventilation passage being formed in the extension arm, wherein the extension arm of the holder is attached to the molding portion
  • the molded body is described.
  • the holder comprises at least a seat body and at least one extension arm integrally extending from the seat body, the formation being formed between the seat body and the extension arm a second light-passing space and at least one second installation space communicating with the second light-passing space, the light-passing passage is formed in the support body, and the ventilation passage is formed in the extension arm, wherein the phase is Forming at least one first installation space between adjacent molding bodies, wherein at least a portion of the extension arms of the holder are held in the holder when the holder is attached to the molding portion The first installation space of the molding portion, at least a portion of the molding body being held in the second installation space of the holder to be between the filter unit and the molded photosensitive unit The sealed space is formed.
  • the molded body has an "I" shape
  • the extension arm has a U-shape
  • the molded body has a U-shape
  • the extension arm has an "I” shape
  • the molded body has an "L” shape
  • the extension arm has an "L” shape
  • the two molded bodies are symmetrical to each other, and the two extension arms are symmetrical to each other; or the molded body and The extension arms are all in the shape of a "mouth”.
  • the present invention further provides a seat, wherein the holder includes an inner portion and an outer portion surrounding the inner portion, wherein the holder further has at least one light passage And at least one venting channel, the inner side portion defining the light passing passage, the venting passage extending from the outer side portion to the inner side portion, and the venting passage communicating the outer side portion and the inner side portion.
  • the venting channel extends in a curved manner.
  • the support has an upper surface, a lower surface, an inner side and an outer side, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side Corresponding to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, wherein the upper surface and the outer side surface form a bareness of the outer side portion
  • the lower surface and the inner side form an exposed surface of the inner portion, wherein the venting passage extends from the upper surface of the holder to the lower surface.
  • the support has an upper surface, a lower surface, an inner side and an outer side, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side Corresponding to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, wherein the upper surface and the outer side surface form a bareness of the outer side portion
  • the lower surface and the inner side form an exposed side of the inner side portion, wherein the venting passage extends from the upper surface of the seat to the inner side of the seat.
  • the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one venting groove, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, wherein the upper surface and the upper surface An outer side surface forms an exposed surface of the outer side portion, the lower surface and the inner side surface forming an exposed surface of the inner side portion, wherein the vent hole extends from the upper surface toward the lower surface direction, the ventilation A groove is formed in the lower surface, and the vent groove extends from the inner side toward the outer side direction, and the vent groove and the vent hole communicate with each other to form the vent passage.
  • the venting groove has an open end and a communicating end, a portion of the venting groove at the communicating end is defined as a first venting groove, and a portion of the venting groove at the open end It is defined as a second venting groove such that the first venting groove communicates with the venting hole and the second venting groove, and the first venting groove has a depth dimension greater than a depth dimension of the second venting groove.
  • the parameter of the depth dimension of the venting groove is h1
  • the parameter of the thickness dimension of the pedestal is H
  • the parameter h1 of the depth dimension of the venting groove and the pedestal The ratio of the parameter H of the thickness dimension is in the range of 0.5% to 70%.
  • the support has an upper surface, a lower surface, an inner side and an outer side, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side Corresponding to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, wherein the upper surface and the outer side surface form a bareness of the outer side portion a surface, wherein the upper surface of the holder is used to mount a filter element, or the lower surface of the holder is used to mount the filter element, and the filter element After being attached to the upper surface or the lower surface of the holder, the light passage of the holder corresponds to the filter element, so that the filter element closes the holder
  • the light passage wherein the lower surface of the holder is used to mount a molded photosensitive unit, and the upper surface of the holder is held by a driver or a mirror in which an optical lens is assembled a cartridge, wherein the molded photosensitive unit comprises:
  • At least one electronic component At least one electronic component
  • At least one photosensitive element wherein the photosensitive element has a photosensitive area and a non-sensitive area surrounding the photosensitive area;
  • At least one circuit board wherein the circuit board includes a substrate and a connecting board connected to the front surface of the substrate or the back surface of the substrate, wherein the connecting board is a flexible connecting board for connecting to a device body to form An electronic device, wherein the photosensitive element is electrically connected to the substrate through a set of connecting lines, or the photosensitive element is electrically connected to the substrate by being attached to the substrate,
  • the electronic component is mounted on or partially embedded in the front surface of the substrate and/or the back surface of the substrate;
  • the molded base has at least one light window
  • the molded base is integrally bonded to the front surface of the substrate of the substrate, or the molded base is integrally bonded to a front side of the substrate of the substrate and a portion of the non-photosensitive area of the photosensitive element, or the molded base integrally bonding the front surface of the substrate and the electronic component, or a molding base integrally bonded to a front surface of the substrate of the substrate and a portion of the non-photosensitive region of the electronic component and the photosensitive member, and the molded base surrounds the photosensitive member
  • the photosensitive region is circumferentially disposed such that the photosensitive region of the photosensitive member corresponds to the light window of the molding base, wherein the lower surface of the holder is attached to the molding a top surface of the susceptor such that the filter element is held in a photosensitive path of the photosensitive element, wherein the driver or the lens barrel is attached to the upper surface of the holder, or The driver or the lens barrel is mounted on
  • the present invention further provides a photosensitive device comprising:
  • At least one filter element At least one filter element
  • At least one photosensitive element wherein the photosensitive element has a photosensitive area and a non-sensitive area surrounding the photosensitive area;
  • At least one seat wherein the support includes an inner portion and an outer portion surrounding the inner portion, wherein the support further has at least one light passage and at least one air passage, the inner portion defining The light passage, the ventilation passage extending from the outer portion to the inner portion, and the ventilation passage communicating with the outer portion and the inner portion, wherein the filter element is attached to the The outer side portion or the inner side portion of the holder, and the light passing passage of the holder corresponds to the filter element;
  • At least one circuit board wherein the circuit board has at least one substrate, wherein the photosensitive element is conductively connected to the substrate;
  • At least one molded base wherein the molded base has at least one light window, wherein the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member
  • the periphery of the photosensitive region is such that the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein at least a portion of the inner portion of the holder is attached to the A top surface of the molded base, or at least a portion of the outer portion of the holder is attached to a top surface of the molded base to be in the filter element, the holder, the Forming at least one sealed space between the substrate and the molded base, wherein the photosensitive element is held in the sealed space, wherein the ventilation passage of the holder is for communicating the sealed space and the photosensitive The outside of the device.
  • the present invention further provides a camera module comprising at least one optical lens and at least one photosensitive device, wherein the photosensitive device further comprises:
  • At least one filter element At least one filter element
  • At least one photosensitive element wherein the photosensitive element has a photosensitive area and a non-sensitive area surrounding the photosensitive area;
  • At least one seat wherein the support includes an inner portion and an outer portion surrounding the inner portion, wherein the support further has at least one light passage and at least one air passage, the inner portion defining The light passage, the ventilation passage extending from the outer portion to the inner portion, and the ventilation passage communicating with the outer portion and the inner portion, wherein the filter element is attached to the The outer side portion or the inner side portion of the holder, and the light passing passage of the holder corresponds to the filter element;
  • At least one circuit board wherein the circuit board has at least one substrate, wherein the photosensitive element is conductively connected to the substrate;
  • At least one molded base wherein the molded base has at least one light window, wherein the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member
  • the periphery of the photosensitive region is such that the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein at least a portion of the inner portion of the holder is attached to the A top surface of the molded base, or at least a portion of the outer portion of the holder is attached to a top surface of the molded base to be in the filter element, the holder, the Forming at least one sealed space between the substrate and the molded base, wherein the photosensitive element is held in the sealed space, wherein the ventilation passage of the holder is for communicating the sealed space and the photosensitive An exterior of the apparatus, wherein the optical lens is held in a photosensitive path of the photosensitive member of the photosensitive device, and the filter element is held between the optical lens and the photosensitive element.
  • the present invention further provides a stand, wherein the stand has an upper surface, a lower surface, an inner side, an outer side, at least one venting groove, and at least one light passage, wherein The upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface
  • the inner side surface is for defining the light passing passage, wherein a region of the lower surface close to the light window is defined as a non-painting area, and an area of the lower surface away from the light window is defined a rubberized area surrounding the non-painting area, and the non-painting area extends inwardly to connect the inner side, the glue area extending outward to connect the outer side, wherein
  • the venting groove is disposed on the lower surface, and the venting groove extends from the outer side surface toward the inner side surface to an appropriate position of the non-painting area via the glue area.
  • the present invention further provides a stand, wherein the stand has an upper surface, a lower surface, an inner side, an outer side, at least one venting groove, and at least one light passage, wherein The upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface
  • the inner side surface is for defining the light passing passage, wherein a region of the lower surface close to the light window is defined as a non-painting area, and an area of the lower surface away from the light window is defined a rubberized area surrounding the non-painting area, and the non-painting area extends inwardly to connect the inner side, the glue area extending outward to connect the outer side, wherein
  • the venting groove is disposed on the lower surface, and the venting groove extends from the outer side surface to the inner side surface via the glue area and the non-painting area in sequence.
  • the present invention further provides a stand, wherein the stand has an upper surface, a lower surface, an inner side, an outer side, at least one venting groove, and at least one light passage, wherein The upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface
  • the inner side surface is for defining the light passage passage, wherein the ventilation groove is provided on the outer side surface, and the ventilation groove extends from the upper surface to the lower surface.
  • the venting groove is on the outer side of the holder and At least one venting channel is formed between the inner surfaces of the pedestals of the molded pedestal.
  • the present invention further provides a stand, wherein the stand has an upper surface, a lower surface, an inner side, an outer side, at least one venting groove, and at least one light passage, wherein The upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface
  • the inner side surface is for defining the light passage passage, wherein the ventilation groove is disposed on the upper surface, and the ventilation groove extends from the inner side toward the outer side direction to an appropriate position.
  • the present invention further provides a stand, wherein the stand has an upper surface, a lower surface, an inner side, an outer side, at least one venting groove, and at least one light passage, wherein The upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface
  • the inner side is for defining the light passage, wherein the ventilation groove is disposed on the upper surface, and the ventilation groove extends from the inner side to the outer side.
  • the present invention further provides a stand, wherein the stand has an upper surface, a lower surface, an inner side, an outer side, at least one venting groove, and at least one light passage, wherein The upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface
  • the inner side surface is for defining the light passage, wherein a portion of the upper surface adjacent to the light window is defined as an inner side of an upper surface, and a portion of the upper surface remote from the light window is defined as Surrounding an outer surface of the upper surface of the upper surface, wherein a portion of the inner side near the upper surface is defined as an inner side surface, and a portion of the inner side near the lower surface is defined An inner side lower side, wherein the inner side surface extends upwardly and downwardly to be coupled to the outer side of the upper surface and the inner side of the upper surface, the lower side of the
  • the invention further provides a stand wherein the venting groove extends in a curved manner.
  • the vent groove is on the lower surface of the holder and the At least one venting passage is formed between the top surfaces of the molded base.
  • the venting groove is between the filter element and the upper surface of the holder At least one venting channel is formed.
  • the present invention further provides a photosensitive device comprising:
  • At least one sealing element At least one sealing element
  • At least one filter unit wherein the filter unit comprises at least one seat and at least one filter element, the holder has at least one light passage, the filter element is mounted on the support, and The light passage of the holder corresponds to the filter element;
  • At least one molded photosensitive unit wherein the molded photosensitive unit further comprises:
  • At least one circuit board wherein the circuit board includes at least one substrate
  • At least one photosensitive member wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
  • At least one molded base wherein the molded base has at least one light window, the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member a periphery of the photosensitive region, and the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein the holder is attached to a top surface of the molded base, and Forming at least one sealed space between the filter unit and the molded photosensitive unit, the photosensitive region of the photosensitive element being held in the sealed space;
  • the photosensitive device has at least one venting passage for communicating the sealed space and the exterior of the photosensitive device, wherein the venting passage is used to make the venting passage during manufacture of the photosensitive device Gas exchange between the gas inside the sealed space and the outside of the photosensitive device to balance the air pressure inside the sealed space and the air pressure outside the photosensitive device, wherein the sealing member is held in the ventilation passage .
  • the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one vent hole, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage a passage, wherein the vent hole extends from the upper surface toward the lower surface, the vent groove is formed on the lower surface, and the vent groove extends from the inner side toward the outer side direction, wherein The vent hole and the venting groove communicate with each other to form the venting passage of the photosensitive device, wherein the sealing member is held at the vent hole.
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein
  • the venting groove is formed on the lower surface, and the venting groove extends from the inner side surface to the outer side surface, wherein the lower surface of the pedestal is attached to the molded base After the top surface is described, the venting groove forms the venting passage of the photosensitive device between the holder and the molded base, wherein the sealing member is held in the venting groove.
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the lower surface adjacent to the light window is defined as a non-painting area, and an area of the lower surface remote from the light window is defined as a glue area surrounding the non-painting area, wherein The venting groove is formed on the lower surface, and the venting groove extends from the outer side surface via the glue area to a suitable position of the non-painting area, wherein the lower surface of the pedestal After the glue area is attached to the top surface of the molding base, the vent groove is on the lower surface of the holder and the top surface of the molding base Forming the venting passage of the photosensitive device Where the sealing element is retained
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer sides correspond to each other, and the inner side and the outer side extend upward and downward, respectively, to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein A region of the lower surface adjacent to the light window is defined as a non-painting region, and a region of the lower surface remote from the light window is defined as a glue region surrounding the non-painting region, wherein The venting hole extends from the upper surface of the holder to the non-painting area of the lower surface, wherein the glue area of the lower surface of the holder is attached to the mold The top surface of the plastic base, the venting opening of the holder forming the venting passage of the photosensitive device, wherein the sealing member is retained in the venting opening.
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein a venting groove formed on the upper surface of the holder, and the venting groove extending from the inner side toward the outer side surface, wherein the filter element is mounted on the seat a surface, and the filter element exposes a portion of the venting groove, wherein after the lower surface of the pedestal is attached to the top surface of the molded base, the branch The venting groove of the seat forms the venting passage of the photosensitive device between the filter element and the holder, wherein the sealing member is held in the venting groove.
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the upper surface adjacent to the light window is defined as an inner side of the upper surface, and a region of the upper surface remote from the light window is defined to surround an outer surface of the upper surface of the upper surface, wherein
  • the inner side surface has an inner side surface side and an inner side surface lower side, the inner side surface sides respectively extending upward and downward to be connected to the outer side of the upper surface and the inner side of the upper surface, the lower side of the inner side surface Extending upwardly and downwardly to connect to the inner side of the upper surface and the lower surface, wherein the venting groove is provided inside the upper surface, and the venting groove extends from
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer sides correspond to each other, and the inner side and the outer side extend upward and downward, respectively, to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the upper surface adjacent to the light window is defined as an inner side of the upper surface, and a region of the upper surface remote from the light window is defined to surround an outer surface of the upper surface of the upper surface, wherein
  • the inner side surface has an inner side surface side and an inner side surface lower side, and the inner side surface side respectively extends upward and downward to be connected to the outer side of the upper surface and the inner side of the upper surface, respectively Extending upwardly and downwardly to connect to an inner side of the upper surface and the lower surface, wherein the vent extends from an inner side of the upper surface to the lower surface, wherein the filter element is
  • the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one venting groove, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage a channel, wherein a region of the upper surface adjacent to the light window is defined as an inner side of an upper surface, and a region of the upper surface remote from the light window is defined to surround an area around an inner side of the upper surface
  • An outer side surface wherein the inner side surface has an inner side surface side and an inner side surface lower side, the inner side surface sides respectively extending upward and downward to be coupled to the outer side of the upper surface and the inner side of the upper surface, The lower side of the inner side surface respectively extends upward and downward to be connected to the inner side of the upper surface and the lower surface, wherein the vent
  • the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder, And forming a slit between the outer wall of the filter element and the connecting portion, wherein the pedestal mounting portion of the holder is attached to the top surface of the molding base, and The filter mounting portion is held by the light window of the molding base such that the molding base surrounds the filter mounting portion of the holder, wherein
  • the holder has at least one light passing hole, wherein the light passing hole extends from an upper surface to a lower surface of the filter mounting portion, and the light passing hole communicates with an upper surface of the filter mounting portion
  • the slit to form the venting passage of the photosensitive device, wherein the sealing member is held in the slit.
  • the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder,
  • the pedestal mounting portion of the holder is attached to the top surface of the molding base, and the filter mounting portion is held by the light of the molding base a window such that the molded base surrounds the filter mounting portion of the holder, wherein the base inner surface of the molded base and the connecting portion of the holder Forming a gap therebetween, wherein the holder has at least one light passing hole, wherein the light passing hole extends from an upper surface of the pedestal mounting portion to a lower surface, and the light passing hole is pasted on the pedestal A lower surface of the loading portion communicates with the slit to form the venting passage of the photosensitive device, wherein the sealing member is retained in the light passing hole.
  • the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder, And forming a gap between the outer wall of the filter element and the connecting portion, the pedestal mounting portion of the holder being mounted on the top surface of the molding base, and The filter mounting portion is held in the light window of the molding base such that the molding base surrounds the filter mounting portion of the holder, wherein Forming another gap between the inner surface of the base of the molded base and the connecting portion of the holder, wherein the holder has at least one light passing hole, and the light passing hole is from one side of the connecting portion Extending to the other side to respectively communicate the gap formed between the outer wall of the filter element and the connecting portion and formed on the molded base The gap between the inner surface of the seat and the outer wall of the filter element, thereby forming
  • the top surface of the molding base has at least one venting groove extending from the inner surface of the base of the molding base to the outer surface of the pedestal to communicate The light window and the exterior, wherein the venting groove is at the top of the holder and the molded base after the holder is attached to the top surface of the molding base
  • the venting passage of the photosensitive device is formed between the surfaces, wherein the sealing member is held in the venting groove of the molding base.
  • the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer side surfaces correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the vent hole being from the upper surface of the holder Extending to the lower surface, wherein the top surface of the molded base has at least one venting groove extending from the inner surface of the base of the molded base toward the outer surface of the base to a suitable a position wherein the venting opening of the holder and the ventilation of the molded base after the lower surface of the holder is attached to the top surface of the molding base
  • the slots communicate with each other to form the venting passage of the photosensitive device, wherein the sealing member is retained in the venting opening of the holder.
  • the molding base is integrally bonded to at least a portion of the non-photosensitive area of the photosensitive member; or the molding base is integrally bonded to the substrate.
  • the present invention further provides a camera module, including:
  • At least one optical lens At least one optical lens
  • At least one photosensitive device wherein the photosensitive device further comprises:
  • At least one sealing element At least one sealing element
  • At least one filter unit wherein the filter unit comprises at least one seat and at least one filter element, the holder has at least one light passage, the filter element is mounted on the support, and The light passage of the holder corresponds to the filter element;
  • At least one molded photosensitive unit wherein the molded photosensitive unit further comprises:
  • At least one circuit board wherein the circuit board includes at least one substrate
  • At least one photosensitive member wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
  • At least one molded base wherein the molded base has at least one light window, the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member a periphery of the photosensitive region, and the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein the holder is attached to a top surface of the molded base, and Forming at least one sealed space between the filter unit and the molded photosensitive unit, the photosensitive region of the photosensitive element being held in the sealed space;
  • the photosensitive device has at least one venting passage for communicating the sealed space and the exterior of the photosensitive device, wherein the venting passage is used to make the venting passage during manufacture of the photosensitive device Gas exchange between the gas inside the sealed space and the outside of the photosensitive device to balance the air pressure inside the sealed space and the air pressure outside the photosensitive device, wherein the sealing member is held in the ventilation passage
  • the optical lens is held in a photosensitive path of the photosensitive element, and the filter element is held between the optical lens and the photosensitive element.
  • the present invention further provides a seat, wherein the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one glue overflow groove, at least one exhaust groove, and at least one passage.
  • a gas hole wherein the upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be connected to the upper surface
  • the inner side surface is for defining the light passage, wherein the overflow tank and the exhaust groove are respectively disposed on the lower surface, and the exhaust groove communicates with the light passage a passage and the overflow tank, wherein the vent hole extends from the upper surface toward the lower surface, and the vent hole communicates with the overflow tank.
  • the area of the lower surface adjacent to the light window is defined as a non-painting area
  • the area of the lower surface remote from the light window is defined as surrounding the non-painting a glue area around the glue area, and the non-paint area extends inwardly to connect the inner side, the glue area extends outward to connect the outer side, wherein the exhaust slot is from the The inner side extends in the direction of the glue area, and the overflow tank communicates with the exhaust groove and the vent hole in the non-paint area.
  • the area of the lower surface adjacent to the light window is defined as a non-painting area
  • the area of the lower surface remote from the light window is defined as surrounding the non-painting a glue area around the glue area, and the non-paint area extends inwardly to connect the inner side, the glue area extends outward to connect the outer side, wherein the exhaust slot is from the The inner side extends in the direction of the glue area, the overflow tank communicates with the exhaust groove in the non-paint area, and the light passing hole is communicated in the glue area.
  • the overflow tank has a depth dimension greater than a depth dimension of the exhaust slot.
  • the overflow tank has a depth dimension of 0.1 mm and the exhaust groove has a depth dimension of 0.03 mm.
  • the parameter of the width dimension of the overflow tank is W
  • the parameter of the diameter dimension of the low end of the vent is R
  • the width dimension of the overflow tank is The ratio of the diameter of the low end of the vent is in the range of 2:1 to 1:1.
  • the inner side of the seat extends obliquely.
  • the present invention further provides a photosensitive device comprising:
  • At least one filter element At least one filter element
  • At least one photosensitive element wherein the photosensitive element has a photosensitive area and a non-sensitive area surrounding the photosensitive area;
  • At least one seat wherein the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one glue overflow groove, at least one venting groove, and at least one vent hole, wherein the upper surface and the lower portion
  • the surfaces correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface being Defining the light passage, wherein the overflow tank and the exhaust groove are respectively disposed on the lower surface, and the exhaust groove communicates with the light passage and the overflow tank, wherein a vent hole extending from the upper surface toward the lower surface, and the vent hole communicates with the overflow tank, wherein the filter element is attached to the upper surface or the lower surface of the holder a surface, and the light passage of the holder corresponds to the filter element;
  • At least one circuit board wherein the circuit board has at least one substrate, wherein the photosensitive element is conductively connected to the substrate;
  • At least one molded base wherein the molded base has at least one light window, wherein the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member The periphery of the photosensitive region such that the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein at least a portion of the lower surface of the holder is attached to the Molding a top surface of the pedestal to form at least one sealed space between the filter element, the mount, the substrate, and the molded base, wherein the photosensitive element is held in the seal a space, wherein the venting groove, the overflow tank, and the vent hole of the holder form at least one venting passage for communicating the sealed space and an exterior of the photosensitive device.
  • the molding base is integrally bonded to at least a portion of the non-photosensitive area of the photosensitive member; or the molding base is integrally bonded to the substrate.
  • the present invention further provides a camera module comprising at least one optical lens and at least one photosensitive device, wherein the photosensitive device further comprises:
  • At least one filter element At least one filter element
  • At least one photosensitive element wherein the photosensitive element has a photosensitive area and a non-sensitive area surrounding the photosensitive area;
  • At least one seat wherein the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one glue overflow groove, at least one venting groove, and at least one vent hole, wherein the upper surface and the lower portion
  • the surfaces correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface being Defining the light passage, wherein the overflow tank and the exhaust groove are respectively disposed on the lower surface, and the exhaust groove communicates with the light passage and the overflow tank, wherein a vent hole extending from the upper surface toward the lower surface, and the vent hole communicates with the overflow tank, wherein the filter element is attached to the upper surface or the lower surface of the holder a surface, and the light passage of the holder corresponds to the filter element;
  • At least one circuit board wherein the circuit board has at least one substrate, wherein the photosensitive element is conductively connected to the substrate;
  • At least one molded base wherein the molded base has at least one light window, wherein the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member The periphery of the photosensitive region such that the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein at least a portion of the lower surface of the holder is attached to the Molding a top surface of the pedestal to form at least one sealed space between the filter element, the mount, the substrate, and the molded base, wherein the photosensitive element is held in the seal a space, wherein the venting groove, the overflow tank, and the vent hole of the holder form at least one venting passage for communicating the sealed space and an exterior of the photosensitive device, wherein the optical lens A photosensitive path of the photosensitive member is held, and the filter element is held between the optical lens and the photosensitive element.
  • the present invention further provides a photosensitive device comprising:
  • At least one filter unit wherein the filter unit includes at least one filter element and at least one seat, wherein the support has an upper surface, a lower surface, an inner side, an outer side, at least one light passage, and At least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be connected to the An upper surface and the lower surface, the inner side defining the light passage, the vent extending from the upper surface to the lower surface, wherein the filter element is mounted to the holder And the light passage of the holder corresponds to the filter element; and
  • At least one molded photosensitive unit wherein the molded photosensitive unit further comprises:
  • At least one circuit board wherein the circuit board includes at least one substrate
  • At least one photosensitive member wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
  • At least one molded base wherein the molded base has at least one light window, at least one venting groove, at least one pedestal inner surface, a pedestal outer surface, and a top surface, wherein the pedestal inner surface is Defining the light window, the top surface extending inwardly and outwardly to connect to the inner surface of the base and the outer surface of the base, the ventilation groove is disposed on the top surface, and the ventilation The groove extends from the inner surface of the base toward the outer surface of the base to a proper position, wherein the molded base is integrally coupled to the substrate, and the molded base surrounds the photosensitive element The periphery of the photosensitive region and the photosensitive region of the photosensitive member correspond to the light window of the molded base, wherein at least a portion of the lower surface of the holder is attached to the Forming the top surface of the susceptor and forming at least one sealed space between the filter unit and the molded photosensitive unit, the photosensitive region of the photosensitive member being held in the sealed space, wherein
  • the molding base has at least one first groove and at least one second groove, the first groove respectively communicating with the second groove and the seat a venting hole, the second groove communicating with the sealing space, wherein a depth dimension of the first groove is greater than a depth dimension of the second groove.
  • the molding base is integrally bonded to at least a portion of the non-photosensitive area of the photosensitive member; or the molding base is integrally bonded to the substrate.
  • the molded photosensitive unit comprises at least one electronic component, wherein the electronic component is electrically connected to the substrate.
  • the molded base encloses at least a portion of at least one of the electronic components protruding from the front side of the substrate of the substrate.
  • the circuit board includes at least one connection board having a module connection end and a device connection end corresponding to the module connection end, wherein the connection board The module connection end is electrically connected to the front surface of the substrate or the back surface of the substrate, or the module connection end of the connection board is integrally extended and electrically connected to the substrate.
  • the substrate has at least one mounting area and at least one connecting line
  • the photosensitive element is mounted on the mounting area of the substrate, and both ends of the connecting line
  • a substrate connector connected to the substrate and a chip connector of the photosensitive member are electrically connected to electrically connect the photosensitive member and the substrate, respectively.
  • the substrate has at least one receiving space and at least one connecting line extending from a front surface of the substrate toward a rear surface of the substrate, and the photosensitive member is held in the receiving space
  • the two ends of the connecting wire are respectively electrically connected to the substrate connecting member of the substrate and the chip connecting member of the photosensitive member to electrically connect the photosensitive member and the substrate.
  • the photosensitive device further includes a sealing member, wherein the sealing member is formed in the vent hole of the holder, and the sealing member is held in the holder Vent holes.
  • the present invention further provides a camera module comprising at least one optical lens, at least one photosensitive device, wherein the photosensitive device further comprises:
  • At least one filter unit wherein the filter unit includes at least one filter element and at least one seat, wherein the support has an upper surface, a lower surface, an inner side, an outer side, at least one light passage, and At least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be connected to the An upper surface and the lower surface, the inner side defining the light passage, the vent extending from the upper surface to the lower surface, wherein the filter element is mounted to the holder And the light passage of the holder corresponds to the filter element; and
  • At least one molded photosensitive unit wherein the molded photosensitive unit further comprises:
  • At least one circuit board wherein the circuit board includes at least one substrate
  • At least one photosensitive member wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
  • At least one molded base wherein the molded base has at least one light window, at least one venting groove, at least one pedestal inner surface, a pedestal outer surface, and a top surface, wherein the pedestal inner surface is Defining the light window, the top surface extending inwardly and outwardly to connect to the inner surface of the base and the outer surface of the base, the ventilation groove is disposed on the top surface, and the ventilation The groove extends from the inner surface of the base toward the outer surface of the base to a proper position, wherein the molded base is integrally coupled to the substrate, and the molded base surrounds the photosensitive element The periphery of the photosensitive region and the photosensitive region of the photosensitive member correspond to the light window of the molded base, wherein at least a portion of the lower surface of the holder is attached to the Forming the top surface of the susceptor and forming at least one sealed space between the filter unit and the molded photosensitive unit, the photosensitive region of the photosensitive member being held in the sealed space, wherein
  • FIG. 1 is a schematic diagram of an application state of a camera module according to a preferred embodiment of the present invention.
  • FIG. 2 is a perspective view of the camera module according to the above preferred embodiment of the present invention.
  • FIG 3 is an exploded perspective view of the camera module in accordance with the above preferred embodiment of the present invention.
  • FIG. 4A is a schematic diagram showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along an intermediate position.
  • 4B is a schematic view showing the internal structure of a modified embodiment of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • Fig. 5 is an enlarged schematic view showing a partial position of Fig. 4A.
  • FIG. 6A is a perspective view showing a perspective view of a pedestal of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 6B is a perspective view of another perspective view of the holder of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 7 is a cross-sectional view showing one of manufacturing steps of a manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 8A and FIG. 8B are schematic cross-sectional views showing the second manufacturing step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 9 is a cross-sectional view showing the third manufacturing step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 10 is a cross-sectional view showing the fourth manufacturing step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 11 is a cross-sectional view showing the fifth manufacturing step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 12 is a cross-sectional view showing the sixth manufacturing step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 13A and FIG. 13B are schematic cross-sectional views showing the seventh manufacturing step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 14 is a cross-sectional view showing the eighth manufacturing step of the manufacturing process of the image pickup module according to the above preferred embodiment of the present invention.
  • Figure 15 is a cross-sectional view showing the manufacturing steps of the above-described manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 16 is a cross-sectional view showing the manufacturing steps of the above-described manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • 17A to 17C are schematic cross-sectional views showing the eleventh manufacturing step of the above-described manufacturing flow of the image pickup module according to the above preferred embodiment of the present invention.
  • Figure 18 is a cross-sectional view showing the manufacturing steps of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 19 is a cross-sectional view showing the manufacturing steps of the above-described manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 20A is a schematic diagram showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • FIG. 20B is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • FIG. 21 is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • Figure 22 is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • FIG. 23 is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • FIG. 24 is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • FIG. 25 is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • FIG. 26 is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • FIG. 27A is a schematic diagram showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • FIG. 27B is a schematic diagram showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • 28A and 28B are schematic views showing a modified embodiment of a pedestal of the camera module according to the above preferred embodiment of the present invention.
  • 29A and 29B are schematic views showing another modified embodiment of the holder of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 30 is a perspective view showing another modified embodiment of the camera module according to the above preferred embodiment of the present invention.
  • Figure 31 is an exploded perspective view of the camera module in accordance with the above preferred embodiment of the present invention.
  • FIG. 32 is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • Figure 33 is an enlarged schematic view of a partial position of Figure 32.
  • FIG. 34A is a perspective view showing a viewing angle of the holder of the camera module according to the above preferred embodiment of the present invention.
  • Figure 34B is a perspective view showing another perspective of the holder of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 34C is a top plan view of the holder of the camera module according to the above preferred embodiment of the present invention.
  • Figure 35 is a schematic illustration of a modified embodiment of the holder of the camera module in accordance with the above-described preferred embodiment of the present invention.
  • Figure 36 is a schematic illustration of a modified embodiment of the molded circuit board assembly of the camera module in accordance with the above-described preferred embodiment of the present invention.
  • FIG. 37 is a partially enlarged schematic view showing the internal structure of a modified embodiment of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • FIG. 38A is a schematic diagram showing the internal structure of a modified embodiment of the holder of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • Figure 38B is a schematic view showing the internal structure of a modified embodiment of the photosensitive device of the camera module according to the above preferred embodiment of the present invention, taken along the intermediate position.
  • 38C is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • Figure 38D is an enlarged schematic view of a partial position of Figure 38C.
  • FIG. 39A is a perspective view showing a modified embodiment of the holder of the camera module according to the above preferred embodiment of the present invention.
  • 39B is a schematic view showing the internal structure of the above-described modified embodiment of the holder of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • 39C is a schematic view showing the internal structure of a modified embodiment of the photosensitive device of the camera module according to the above preferred embodiment of the present invention, which is cut along an intermediate position.
  • 39D is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • Figure 39E is an enlarged schematic view of a partial position of Figure 39D.
  • FIG. 40A is a perspective view showing a modified embodiment of the holder of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 40B is a schematic view showing the internal structure of a modified embodiment of the photosensitive device of the camera module according to the above preferred embodiment of the present invention, which is cut along an intermediate position;
  • 40C is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • Fig. 40D is an enlarged schematic view of a partial position of Fig. 39C.
  • Figure 41 is a schematic view showing the internal structure of a modified embodiment of the photosensitive device of the camera module according to the above preferred embodiment of the present invention, taken along the intermediate position.
  • Figure 42A is a perspective view showing a perspective view of a modified embodiment of the holder of the camera module according to the above preferred embodiment of the present invention.
  • 42B is a perspective view showing another perspective of the above-described modified embodiment of the holder of the camera module according to the above preferred embodiment of the present invention.
  • 42C is a schematic view showing the internal structure of the holder of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
  • 42D is a schematic diagram showing the internal structure of a filter unit of the camera module according to the above preferred embodiment of the present invention, which is cut along an intermediate position.
  • 42E is a schematic view showing the internal structure of a modified embodiment of the photosensitive device of the camera module according to the above preferred embodiment of the present invention, which is cut along an intermediate position.
  • Figure 42F is a schematic view showing the internal structure of a modified embodiment of the camera module according to the above preferred embodiment of the present invention, taken along the intermediate position.
  • Figure 42G is an enlarged schematic view of a partial position of Figure 42F.
  • 43A and 43B are schematic diagrams showing the internal structure of a modified embodiment of the photosensitive device of the camera module according to the above preferred embodiment of the present invention, taken along the intermediate position.
  • Fig. 44 is a view showing the internal structure of a modified embodiment of the photosensitive device of the image pickup module according to the above preferred embodiment of the present invention, taken along the intermediate position.
  • Figure 45 is a perspective view showing a modified embodiment of the camera module according to the above preferred embodiment of the present invention.
  • Figure 46 is an exploded perspective view of the camera module in accordance with the above preferred embodiment of the present invention.
  • Figure 47 is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention taken along the intermediate position.
  • Figure 48 is an enlarged schematic view showing a partial position of Figure 47.
  • FIG. 49A is a perspective view showing a viewing angle of the holder of the camera module according to the above preferred embodiment of the present invention.
  • Figure 49B is a perspective view showing another perspective of the holder of the camera module according to the above preferred embodiment of the present invention.
  • Figure 49C is a cross-sectional view of the holder of the camera module in accordance with the above preferred embodiment of the present invention.
  • Figure 50 is an exploded perspective view showing a modified embodiment of the camera module according to the above preferred embodiment of the present invention.
  • Figure 51 is an exploded perspective view showing another modified embodiment of the camera module according to the above preferred embodiment of the present invention.
  • Figure 52 is an exploded perspective view showing another modified embodiment of the camera module according to the above preferred embodiment of the present invention.
  • Figure 53 is an exploded perspective view showing another modified embodiment of the camera module according to the above preferred embodiment of the present invention.
  • Figure 54 is an exploded perspective view showing another modified embodiment of the camera module according to the above preferred embodiment of the present invention.
  • the term “a” is understood to mean “at least one” or “one or more”, that is, in one embodiment, the number of one element may be one, and in other embodiments, the element The number can be multiple, and the term “a” cannot be construed as limiting the quantity.
  • an electronic device according to a preferred embodiment of the present invention is illustrated, wherein the electronic device includes at least one camera module 100 and a device body 200, wherein the camera module The group 100 is disposed on the device body 200 to assist the device body 200 in acquiring images (eg, video or images).
  • images eg, video or images.
  • the camera module 100 is disposed on the back side of the device body 200 (facing away from the device body 200 ) (facing away from the device body 200 ), or at least one The camera module 100 is disposed on the back side of the device body 200 and at least one of the camera modules 100 is disposed on the front side of the device body 200, that is, on the back side and the front side of the device body 200. At least one of the camera modules 100 is provided. Nonetheless, it will be understood by those skilled in the art that in other examples of the electronic device, it is also possible to have one or more of the camera modules 100 disposed on the side of the device body 200.
  • the type of the camera module 100 is not limited in the electronic device of the present invention, although in the example shown in FIG. 1 , the camera module 100 is implemented as a single-lens camera module.
  • the camera module 100 can also be implemented as an array camera module, such as but not limited to a dual lens camera module.
  • the device body 200 of the electronic device shown in FIG. 1 is a smart phone, in other examples, the device body 200 may be implemented as, but not limited to, a tablet computer, an e-book. Any of the electronic products that can be configured with the camera module 100, such as MP3/4/5, personal digital assistant, camera, television, washing machine, refrigerator, and the like.
  • the camera module 100 includes at least one optical The lens 10 and the at least one molded photosensitive unit 20, wherein the molded photosensitive unit 20 further comprises at least one circuit board 21, at least one photosensitive element 22, and at least one molded base 23, wherein the photosensitive element 22 is turned on Connected to the circuit board 21, the molding base 23 is integrally coupled to the circuit board 21, wherein the optical lens 10 is held in a photosensitive path of the photosensitive member 22.
  • the molding base 23 forms at least one light window 231 while being integrally coupled to the circuit board 21, wherein the light window 231 forms a light path between the optical lens 10 and the photosensitive element 22.
  • the camera module 100 further includes at least one filter unit 30, wherein the filter unit 30 includes at least one filter element 31, wherein the filter element 31 is held by the optical lens 10 and the photosensitive element Between 22.
  • the light reflected by the object can be filtered by the filter element 31 after entering the inside of the camera module 100 from the optical lens 10, and then passed through the light window 231 passing through the molded base 23. It is then imaged by the photosensitive element 22 and subjected to photoelectric conversion.
  • the type of the filter element 31 of the filter unit 30 is not limited in the camera module 100 of the present invention.
  • the filter element 31 may be, but not limited to, an infrared cutoff. Filter, full transparency filter.
  • the circuit board 21 of the molded photosensitive unit 20 can be connected to the apparatus body 200, for example, the circuit board 21 of the molded photosensitive unit 20 and the apparatus body 200 can be electrically connected so that The camera module 100 is mounted and connected to the device body 200.
  • the digital signal about the image of the object obtained by photoelectric conversion of the photosensitive element 22 can be subsequently sent to the device body 200, such as but not limited to being stored in the memory of the device body 200, or
  • the device body 200 is stored to the cloud or displayed on the display screen of the device body 200.
  • the digital signal about the image of the object obtained by the photoelectric conversion of the photosensitive element 22 is transmitted to the device body 200, it can be displayed while being stored in the memory or the cloud. On the display screen of the device body 200.
  • the circuit board 21 further includes at least one substrate 211 and at least one connecting plate 212, wherein the photosensitive element 22 is electrically connected to the substrate 211, wherein the connecting plate 212 has a module connecting end 2121 and a device connection end 2122 corresponding to the module connection end 2121, wherein the module connection end 2121 of the connection board 212 is electrically connected to the substrate 211, and the connection board 212
  • the device connection end 2122 is electrically connected to the device body 200.
  • the module connection end 2121 of the connection board 212 is mounted on the substrate 211 through a connection medium 2123.
  • the module connection end 2121 of the connection board 212 can pass through
  • the anisotropic conductive paste is not limited to being attached to the substrate 211 such that the module connection end 2121 of the connection plate 212 is electrically connected to the substrate 211.
  • the connection medium 2123 can be implemented as, but not limited to, an anisotropic conductive paste.
  • the module connecting end 2121 of the connecting board 212 integrally extends to the substrate 211, that is, the connecting board 212 and the substrate 211 are a unitary structure.
  • the connecting plate 212 includes a connector 2124, wherein the connector 2124 is disposed at the device connecting end 2122 of the connecting plate 212, or the connector 2124 is formed at the connecting plate 212.
  • the device connection end 2122 is configured such that the device connection end 2122 of the connection plate 212 can be conveniently electrically connected to the device body 200 through the connector 2124 of the connection plate 212.
  • the connecting plate 212 is soft and can be deformed, wherein the camera module 100 is connected to the device body 200 through the connecting plate 212.
  • the The connecting plate 212 can buffer assembly displacement and deformation caused by manufacturing tolerances of the camera module 100, and displacement of the camera module 100 due to vibration during use of the device body 200, thereby ensuring The reliability of the electronic device in the process of being used.
  • the substrate 211 has a substrate front surface 2111 and a substrate back surface 2112, wherein the substrate front surface 2111 and the substrate back surface 2112 correspond to each other.
  • the substrate 211 has a flat shape, so that the substrate front surface 2111 and the substrate back surface 2112 of the substrate 211 are both planar, such that the substrate front surface 2111 and the substrate back surface of the substrate 211 2112 can define a thickness dimension of the substrate 211. That is, the distance dimension between the substrate front surface 2111 and the substrate back surface 2112 of the substrate 211 is the thickness dimension of the substrate 211.
  • the substrate front surface 2111 or the substrate back surface 2112 of the substrate 211 may be provided with a recess.
  • the recess may be disposed on the substrate front surface 2111 of the substrate 211 or the An edge of the back surface 2112 of the substrate for accommodating the module connection end 2121 of the connection board 212, so that the module connection end 2121 of the connection board 212 and the front side of the substrate of the substrate 211 can be reduced.
  • the height difference of 2111 is reduced, or the height difference between the module connection end 2121. of the connection plate 212 and the substrate back surface 2112 of the substrate 211 is lowered.
  • the module connection end 2121 of the connection board 212 when the module connection end 2121 of the connection board 212 is connected to the substrate front surface 2111 of the substrate 211, the module connection end 2121 of the connection board 212 may be accommodated in the The recess of the substrate 211 prevents the module connection end 2121 of the connecting board 212 from protruding from the substrate front surface 2111 of the substrate 211.
  • the substrate 211 further has at least one flat mounting area 2113 and an edge area 2114 surrounding the mounting area 2113, wherein the A mounting region 2113 and the edge region 2114 are formed on the substrate front surface 2111 of the substrate 211, respectively.
  • the photosensitive element 22 has a photosensitive area 221 and a non-sensitive area 222 surrounding the photosensitive area 221, wherein the photosensitive element 22 is mounted on the mounting area 2113 of the substrate 211, wherein
  • the molding base 23 is integrally coupled to at least a portion of the edge region 2114 of the substrate 211, and the molding base 23 surrounds the photosensitive region 221 of the photosensitive member 22 so that The photosensitive region 221 of the photosensitive member 22 corresponds to the light window 231 of the molded base 23.
  • the molding base 23 extends upward from the substrate front surface 2111 of the substrate 211, and an annular light wall 26 can be formed, which surrounds the photosensitive region 221 of the photosensitive element 22.
  • the light window 231 is formed at a position corresponding to the photosensitive region 221 of the photosensitive member 22 to provide light to be passed by the photosensitive member 22 after passing through the light window 231.
  • the photosensitive region 221 receives and performs photoelectric conversion for imaging.
  • the molded base 23 has a top surface 232, a base inner surface 234, and a base outer surface 235, wherein the base inner surface 234 is used to form the light window 231, the base The outer surface 235 is exposed outside of the molded base 23, the top surface 232 extending inwardly and outwardly to be coupled to the base inner surface 234 and the base outer surface 235, respectively.
  • the molding base 23 may be formed by a molding process, such as, but not limited to, transfer molding or press molding, which may form the molding base 23, and the molding base 23 formed by a molding process
  • the flatness of the top surface 232 is higher to facilitate improving the optical performance of the camera module 100.
  • the base inner surface 234 of the molded base 23 extends obliquely so that the cross section of the light window 231 of the molded base 23 is inverted trapezoid, and in this way, can be effective Stray light is avoided to improve the optical performance of the camera module 100.
  • the light window 231 of the molding base 23 has an upper opening 2311 and a lower opening 2312 corresponding to the upper opening 2311, wherein the photosensitive region 221 of the photosensitive member 22 is held in the
  • the lower opening 2312 of the light window 231 is directed toward the optical lens 10, that is, an opening of a side of the light window 231 close to the substrate 211 is defined as the lower opening 2312
  • An opening of the light window 231 on a side close to the optical lens 10 is defined as the upper opening 2311, wherein the size of the upper opening 2311 is larger than the size of the lower opening 2312, and in this way, can be effective Stray light is avoided to improve the optical performance of the camera module 100.
  • the substrate 211 has good hardness to ensure the flatness of the substrate 211. In this manner, after the photosensitive member 22 is mounted on the mounting area 2113 of the substrate 211, The flatness of the photosensitive member 22 can be ensured.
  • the substrate 211 may be, but is not limited to, a hard board, a hard and soft bonding board, a ceramic substrate, or the like.
  • the molding base 23 can also reinforce the strength of the substrate 211 to make the substrate 211 flatter.
  • the molded base 23 also has good heat dissipation properties, and the molded base 23 can be quickly transferred to the heat after the heat generated by the photosensitive member 22 is transferred to the substrate 211.
  • the heat of the substrate 211 is radiated to the external environment of the camera module 100, so that the stability and reliability of the camera module 100 used for a long time can be ensured.
  • the molded photosensitive unit 20 further includes at least one connecting wire 24, wherein both ends of the connecting wire 24 are electrically connected to the photosensitive member 22 and the substrate 211, respectively, so as to be The photosensitive element 22 attached to the mounting region 2113 of the substrate 211 is electrically connected to the substrate 211 via the connection line 24.
  • the substrate 211 further has at least one substrate connector 2115, wherein each of the substrate connectors 2115 is disposed on the edge region 2114 of the substrate 211, respectively.
  • the substrate connectors 2115 may be arranged in, but not limited to, two groups, and each of the set of substrate connectors 2115 is symmetrically disposed on both sides of the mounting area 2113.
  • the photosensitive element 22 has at least one chip connector 223, wherein each of the chip connectors 223 is disposed in the non-photosensitive region 222 of the photosensitive member 22, respectively.
  • the chip connectors 223 may be arranged in, but not limited to, two groups, and each of the chip connectors 223 is symmetrically disposed on both sides of the photosensitive region 221.
  • each of the chip connectors 223 of the non-photosensitive region 222 of the photosensitive member 22 is disposed.
  • Each of the substrate connectors 2115 is disposed to the edge region 2114 of the substrate 211, respectively.
  • the two ends of the connecting wire 24 are respectively connected to the substrate connecting member 2115 of the substrate 211 and the chip connecting member 223 of the photosensitive member 22 to electrically connect the photosensitive member 22 and The substrate 211.
  • the connecting line 24 may be formed between the substrate connecting member 2115 of the substrate 211 and the chip connecting member 223 of the photosensitive member 22 by a wire bonding process, by way of The connecting wire 24 electrically connects the photosensitive member 22 and the substrate 211.
  • the wire bonding direction of the connecting wire 24 is not limited in the camera module 100 of the present invention.
  • the wire bonding direction of the connecting wire 24 may be from the substrate 211 to the
  • the light receiving element 22 may be from the light receiving element 22 to the substrate 211.
  • the type of the connecting line 24 is not limited in the camera module 100 of the present invention.
  • the connecting line 24 may be a gold wire, a lead wire, a copper wire or the like.
  • the substrate connector 2115 of the substrate 211 may be disposed on the mounting area 2113 of the substrate 211, and the photosensitive element 22
  • the chip connector 223 may be disposed on the chip back surface 224 of the photosensitive element 22, wherein the photosensitive element 22 is mounted when the photosensitive element 22 is mounted on the mounting area 2113 of the substrate 211
  • the chip connector 223 and the substrate connector 2115 of the substrate 211 can be electrically connected by direct contact, so that the photosensitive element 22 is electrically connected to the substrate 211.
  • the photosensitive member 22 can be directly electrically connected to the substrate 211 while the photosensitive member 22 is attached to the substrate 211.
  • the molded photosensitive unit 20 further includes at least one electronic component 25, wherein the electronic component 25 is electrically connected to the substrate 211.
  • the electronic component 25 may be mounted on the edge region 2114 of the substrate 211.
  • part or all of the electronic component 25 may be buried in the substrate 211.
  • a part of the electronic component 25 may also be mounted on the substrate back surface 2112 of the substrate 211 or a part of the electronic component 25 located on the substrate back surface 2112 of the substrate 211. Or all of the substrate 211 is buried.
  • the type of the electronic component 25 is not limited.
  • the electronic component 25 can be implemented as, but not limited to, a driver, a relay, a processor, a resistor, a capacitor, or the like.
  • the molding base 23 may be embedded in the edge region 2114 of the substrate 211 without embedding the electronic component 25, or may embed at least one of the electronic components. At least part of 25.
  • the molding base 23 embeds all of the electronic components 25 after being integrally bonded to the edge regions 2114 of the substrate 211.
  • the molding base 23 embedding the electronic component 25 after molding, the electronic component 25 can be prevented from contacting the external environment by the molding base 23, thereby A problem such as oxidation of the surface of the electronic component 25 is prevented.
  • the molded base 23 can also isolate adjacent electronic components 25 to prevent mutual interference between adjacent electronic components 25.
  • the molding base 23 can also make the spacing between adjacent electronic components 25 smaller by the manner in which the molded base 23 embeds the electronic component 25 after molding.
  • the electronic component 25 having a larger number and larger size can be mounted on the limited mounting area of the substrate 211.
  • the molding base 23 can also isolate the electronic component 25 and the photosensitive element 22 to prevent the surface of the electronic component 25 from escaping the photosensitive region 221 of the photosensitive element 22.
  • the molding base 23 can isolate the electronic component 25 and the photosensitive element 22 by embedding the electronic component 25, and the electronic component 25 and the photosensitive element 22 can also be made.
  • the electronic component 25 and the photosensitive element 22 are isolated in such a manner as to be located on both sides of the molded base 23.
  • the camera module 100 may not have the electronic component 25, and the camera module 100 is in this manner. Both the length and width dimensions and the height dimensions can be designed to be smaller, so that the camera module 100 can meet the configuration requirements of the thin and light electronic device. It can be understood that, after the camera module 100 is assembled to the device body 200, the camera module 100 can be electrically connected to the electronic components of the device body 200 by the The electronic component of the device body 200 processes an electrical signal obtained by the imaging module 100 by photoelectric conversion.
  • the filter unit 30 includes at least one frame type holder 32, wherein the holder 32 has at least one light passage 321 in which the filter element 31 is mounted.
  • the holder 32 and the filter element 31 close the light passage 321 of the holder 32.
  • the holder 32 is attached to the top surface 232 of the molding base 23 such that the light window 231 of the molding base 23 corresponds to being attached to the holder 32.
  • the filter element 31 is attached to the top surface 232 of the molding base 23 such that the light window 231 of the molding base 23 corresponds to being attached to the holder 32.
  • the molding base 23 is integrally bonded to the substrate front surface 2111 of the substrate 211 by a molding process, the top surface 232 of the molding base 23 has a higher degree of flatness, so that after the holder 32 is attached to the top surface 232 of the molded base 23, the central axis of the filter element 31 and the photosensitive element 22 can be secured.
  • the consistency of the central axis improves the optical performance of the camera module 100. That is, the optical axis of the photosensitive element 22 can be ensured to be perpendicular to the filter element 31.
  • the photosensitive device 1000 includes one of the molded photosensitive unit 20 and at least one of the filter units 30 attached to the molded photosensitive unit 20.
  • the camera module 100 includes at least one of the optical lens 10 and at least one of the photosensitive devices 1000, wherein the optical lens 10 is held by the photosensitive element 22 of the photosensitive device 1000. On the path.
  • the photosensitive device 1000 includes at least one mounting layer 1001 formed of a mounting medium 1002, wherein the mounting layer 1001 is held by the holder 32 of the filter unit 30 and the molding photosensitive Between the top surfaces 232 of the molded base 23 of the unit 20, the support 32 is attached to the top surface 232 of the molded base 23.
  • the type of the mounting medium 1002 is not limited in the camera module 100 of the present invention.
  • the mounting medium 1002 may be, but not limited to, glue, wherein the mounting medium 1002 The mounting layer 1001 held between the holder 32 and the top surface 232 of the molding base 23 is formed after curing.
  • the photosensitive device 1000 further has at least one sealed space 101 and at least one venting passage 102, wherein the filter is mounted after the support 32 is mounted on the top surface 232 of the molded base 23.
  • the sealed space 101 is formed between the unit 30 and the molded photosensitive unit 20, for example, in a specific example of the camera module 100 of the present invention, the filter element 31, the holder may be 32.
  • the sealed space 101 is formed between the molded base 23 and the substrate 211.
  • a gap may be formed between the filter element 31, the holder 32, the molding base 23, and the photosensitive element 22.
  • the sealed space 101 is described.
  • the photosensitive region 221 of the photosensitive member 22 is held in the sealed space 101.
  • the ventilation passage 102 is configured to communicate the sealed space 101 and the outside of the photosensitive device 1000 for balancing the internal air pressure of the sealed space 101 and the photosensitive device in the process of manufacturing the camera module 100 1000 external pressure. That is, the gas in the sealed space 101 and the gas outside the photosensitive device 1000 can be exchanged through the venting passage 102, so that during the manufacturing process of the camera module 100,
  • the venting passage 102 can ensure that the pressure of the air pressure of the sealed space 101 and the pressure of the external environment are balanced, so that it is possible to avoid the occurrence of pressure imbalance due to the occurrence of each component of the photosensitive device 1000 for forming the sealed space 101.
  • the damaged phenomenon in particular, can ensure that the pressures of the upper and lower portions of the filter element 31 are consistent, thereby avoiding the pressure imbalance caused by the upper and lower portions of the filter element 31.
  • the optical element 31 has a problem of cracking or chipping.
  • the venting passage 102 is curvedly extended to prevent contaminants such as dust from entering the sealed space 101 from the external environment via the venting passage 102 to contaminate the sensitized light held in the sealed space 101.
  • the camera module 100 includes at least one sealing member 103 formed by a sealing medium 104, wherein in the process of manufacturing the camera module 100, after performing the baking process on the photosensitive device 1000 Forming the sealing member 103 after the sealing medium 104 filled in the venting passage 102 is solidified, that is, the sealing member 103 is held in the venting passage 102 for blocking the venting passage 102 is in communication with the outside of the photosensitive device 1000.
  • the sealing member 103 held in the venting passage 102 can be formed, And the sealing member 103 can prevent contaminants such as dust from entering the sealed space 101 from the outside of the photosensitive device 1000 via the vent passage 102 to contaminate the photosensitive member 22 held in the sealed space 101.
  • the venting passage 102 extending in a bend can prevent the sealing medium 104 from flowing to the inner wall of the sealed space 101, and prevent the sealing medium 104 from entering the sealed space 101, thereby preventing the sealing medium 104 from contaminating the photographic light.
  • the venting passage 102 is formed in the abutment 32.
  • the abutment 32 has an inner portion 322 and an outer portion 323 surrounding the inner portion 322, wherein the inner portion 322 of the abutment 32 defines the abutment 32 Light passage 321.
  • the venting passage 102 extends from the outer side portion 323 of the holder 32 to the inner side portion 322, and the venting passage 102 communicates with the outer side portion 323 and the inner side portion 322 of the holder 32.
  • At least a portion of the inner portion 322 of the holder 32 is attached to the top surface 232 of the molding base 23 such that the vent passage 102 communicates with the sealed space of the photosensitive device 1000 101 and the exterior of the photosensitive device 1000.
  • the support 32 has a lower surface 324, an inner side 325, an upper surface 326 and an outer side 327, wherein the lower surface 324 and the upper surface 326 of the support 32 correspond to each other.
  • the inner side 325 and the outer side 327 of the holder 32 correspond to each other, wherein the inner side 325 of the holder 32 is used to define the light passage 321 .
  • the lower surface 324 and the inner side 325 of the support 32 are used to form the inner portion 322 of the abutment 32, and the upper surface 326 and the outer side 327 of the support 32 are
  • the outer portion 323 of the holder 32 is formed, wherein at least a portion of the lower surface 324 of the holder 32 is attached to the top surface 232 of the molding base 23.
  • the inner side surface 325 of the support 32 extends obliquely, in such a manner that light passes through the optical lens 10 of the camera module 100 into the interior of the camera module 100.
  • stray light can be avoided to improve the optical performance of the camera module 100.
  • the filter element 31 is attached to the upper surface 326 of the holder 32
  • FIG. 20B shows
  • the filter element 31 can also be attached to the lower surface 324 of the holder 32. It can be understood by those skilled in the art that the position where the filter element 31 is mounted on the holder 32 is not limited in the camera module 100 of the present invention, as long as the filter element 31 is provided. After being attached to the holder 32, the light passage 321 of the holder 32 can be made to correspond to the filter element 31. With further reference to FIG.
  • the lower surface 324 of the holder 32 has a lower surface inner side 3243 and a lower surface outer side 3244 surrounding the lower surface inner side 3243, wherein the filter element 31 is mounted on the The lower surface inner side 3243 of the lower surface 324 of the holder 32, at least a portion of the lower surface outer side 3244 of the lower surface 324 of the holder 32 is attached to the molded base 23
  • the top surface 232 is such that the filter element 31 is held on the photosensitive path of the photosensitive element 22.
  • the lower surface 324 of the support 32 has a non-painting area 3241 and a glue area 3242 surrounding the non-painting area 3241, wherein the two sides of the non-painting area 3241 are respectively inward And extending outwardly connected to the inner side surface 325 and the glue area 3242, wherein the two sides of the glue area 3242 extend inwardly and outwardly, respectively, to be connected to the non-paint area 3241 and Outer side 327.
  • the mounting medium 1002 can be formed to be held in the The placement layer 1001 between the glue area 3242 of the lower surface 324 of the holder 32 and the top surface 232 of the molded base 23.
  • the mounting medium 1002 can be formed to be held in the The placement layer 1001 between the glue area 3242 of the lower surface 324 of the holder 32 and the top surface 232 of the molded base 23.
  • the filter element 31 may be mounted on the glue area 3242 of the lower surface 324 of the holder 32,
  • the molding base 23 surrounds the filter element 31.
  • at least a portion of the lower surface outer side 3244 of the lower surface 324 of the support 32 forms the glue area 3242 of the support 32.
  • the support 32 has at least one venting hole 328 and at least one venting groove 329, wherein the venting hole 328 extends from the upper surface 326 of the pedestal 32 toward the lower surface 324, wherein a venting groove 329 formed in the lower surface 324 of the holder 32 and extending from the inner side surface 325 of the holder 32 toward the outer side surface 327, wherein the vent hole 328 and the venting The slots 329 communicate with each other to form the venting passage 102.
  • the opening of the vent 328 is formed in the upper surface 326 of the support 32, and the opening of the vent 328 in the upper surface 326 forms the venting passage 102 on the The opening of surface 326.
  • An opening of the venting groove 329 is formed in the lower surface 324 and the inner side 325 of the holder 32, wherein the lower surface 324 of the holder 32 is mounted through the mounting medium 1002
  • the top surface 232 of the molding base 32 closes the opening of the venting groove 329 formed in the lower surface 324, and only the The opening of the venting groove 329 at the inner side surface 325 is exposed, and the opening of the venting groove 329 exposed to the inner side surface 325 forms an opening of the venting passage 102 at the inner side surface 325.
  • the venting groove 329 of the support 32 has an open end 3291, a communicating end 3292, a first venting groove 3293 and a second venting groove 3294.
  • the open end 3291 of the venting groove 329 and the communicating end 3292 correspond to each other, and the venting groove 329 communicates with the sealed space 101 at the open end 3291, and communicates with the communicating end 3292 at the communicating end 3292 a vent 328, wherein the first venting groove 3293 is formed at the communicating end 3292, the second venting groove 3294 is formed at the open end 3291, and the first venting groove 3293 is respectively connected to the second end
  • the venting groove 3294 and the venting hole 328 are such that the second venting groove 3294, the first venting groove 3293, and the venting hole 328 form the venting passage 102 of the photosensitive device 1000.
  • the thickness dimension parameter of the support 32 is H, that is, the upper surface 326 and the lower surface 324 of the support 32.
  • the distance dimension parameter between the two is H.
  • the depth dimension parameter of the venting groove 329 of the support 32 is h1.
  • the thickness dimension parameter of the mounting medium 1002 applied to the glue area 3242 of the lower surface 324 of the holder 32 is h2.
  • the mounting medium 1002 can also be applied to the top surface 232 of the molding base 23.
  • the value of the depth dimension parameter h1 of the slot 329 is typically greater than the value of the thickness dimension parameter h2 of the mounting medium 1002.
  • the thickness dimension parameter h2 of the mounting medium 1002 ranges from h2 ⁇ 0.1 mm, and correspondingly, the depth dimension parameter h1 of the venting groove 329 of the holder 32.
  • the value ranges from h1 to 0.1 mm. Since the mounting medium 1002 expands when heated during the baking process, the number of depth dimension parameters h1 of the venting groove 329 of the holder 32 needs to be larger than the thickness of the mounting medium 1002.
  • the value of the parameter h2, for example, the range of the depth dimension parameter h1 of the venting groove 329 of the holder 32 is preferably h1 ⁇ 0.15 mm. More preferably, the depth dimension parameter h1 of the venting groove 329 of the support 32 ranges from h1 ⁇ 0.3 mm. In addition, in order to ensure the strength of the support 32, the depth of the venting groove 329 of the support 32 may not be too deep, for example, in a specific example, the depth of the venting groove 329 of the support 32
  • the ratio of the dimension parameter h1 to the thickness dimension parameter H of the support 32 ranges from 0.5% to 70% (including 0.5% and 70%).
  • the venting grooves 329 of the support 32 may have different depths at different positions. Specifically, a depth dimension of the venting groove 329 at the communicating end 3292 is greater than a depth dimension of the venting groove 329 at the open end 3291, for example, a depth dimension of the venting groove 329 at the open end 3291 may be It is about 0.03 mm, and the depth of the vent groove 329 at the communication end 3292 may be about 0.1 mm, preferably 0.15 mm. In other words, the depth dimension of the first venting groove 3293 of the venting groove 329 is larger than the depth dimension of the second venting groove 3294. For example, the depth dimension of the first venting groove 3293 of the venting groove 329 may be 0.1.
  • the second venting groove 3294 of the venting groove 329 may have a depth dimension of about 0.03 mm.
  • the venting groove 329 is stepped.
  • the depth of the venting groove 329 at the communicating end 3292 is designed to prevent the mounting medium 1002 from filling the venting groove 329, and the venting groove 329 is designed at the depth of the open end 3291.
  • the shallower is to reduce the size of the opening of the venting passage 102 at the sealed space 101 to prevent dust and the like from entering the sealed space 101 from the external environment via the venting passage 102.
  • the mounting medium 1002 is not provided at a position close to the open end 3291 of the venting groove 329, so that even if the venting groove 329 is shallow at the open end 3291, There is also no fear that the mounting medium 1002 will fill the venting groove 329.
  • the venting groove 329 has a depth dimension ranging from 5 ⁇ m to 200 ⁇ m (including 5 ⁇ m and 200 ⁇ m) at the open end 3291.
  • the mounting medium 1002 may be provided at a position close to the communication end 3292 of the venting groove 329 such that the venting groove 329 has a deeper depth at the communicating end 3292, for example, a depth dimension of 50 ⁇ m. ⁇ 200 ⁇ m (including 50 ⁇ m and 200 ⁇ m).
  • the support 32 further includes at least one overflow tank 3206 and at least one exhaust groove 3207, wherein the overflow tank 3206 and the exhaust groove 3207 are respectively formed under the support 32 Surface 324, and the overflow tank 3206 communicates with the venting groove 3207 and the venting opening 328 to form the venting passage 102 of the photosensitive device 1000.
  • the depth dimension of the overflow tank 3206 of the support 32 may be the same as or different from the depth dimension of the exhaust groove 3207.
  • the depth of the overflow tank 3206 of the support 32 is larger than the depth dimension of the exhaust groove 3207.
  • the depth of the overflow groove 3206 of the support 32 may be 0.1 mm.
  • the depth dimension of the venting groove 3207 may be about 0.03 mm, preferably 0.15 mm.
  • the excess of the mounting medium 1002 can overflow.
  • the overflow tank 3206 of the support 32 and there is no need to worry that the placement medium 1002 overflowing into the overflow tank 3206 will fill the overflow tank 3206 of the holder 32, through In this manner, it is possible to ensure that the venting passages 102 formed by the exhaust groove 3207, the overflow tank 3206, and the vent hole 328 are clear.
  • the width of the overflow tank 3206 of the support 32 may also be larger than the width dimension of the exhaust groove 3207. In this way, the overflow tank 3206 having a larger size on the one hand can avoid overflow.
  • the mounting medium 1002 entering the overflow tank 3206 is filled with the overflow tank 3206, and on the other hand, the smaller size of the exhaust groove 3207 can prevent dirt such as dust from passing through the exhaust groove 3207.
  • the sealed space 101 is entered from the outside of the photosensitive device 1000, thereby facilitating improvement of the optical performance of the camera module 100.
  • the width dimension of the vent groove 329 is greater than or equal to the diameter dimension of the bottom of the vent hole 328, and the distance between the peripheral wall of the vent hole 328 and the sidewall of the vent groove 329 is set.
  • the size is L1, where L1 ranges from 0mm to 0.2mm (including 0mm and 0.2mm).
  • the diameter dimension parameter of the bottom of the vent hole 328 is R
  • the width dimension parameter of the vent groove 329 at the communication end 3292 is W
  • the ratio of W to the diameter dimension parameter R of the bottom of the vent 328 ranges from 2:1 to 1:1 (including 2:1 and 1:1).
  • the maximum dimension of the width of the venting groove 329 at the communicating end 3292 is twice the diameter of the bottom of the venting opening 328
  • the minimum dimension of the width of the venting groove 329 at the communicating end 3292 is The diameter of the bottom of the vent 328 is equal in size.
  • the filter element 31 is mounted on the upper surface 326 of the holder 32 such that the light passage 321 of the holder 32 corresponds to the filter element 31, so that the filter The element 31 is capable of closing the light passage 321 of the holder 32. It can be understood that the opening of the venting passage 102 at the inner side surface 325 is held at the lower portion of the filter element 31, wherein the lower portion of the filter element 31 is used to form the sealed space 101.
  • the upper surface 326 of the support 32 has an upper surface inner side 3261 and an upper surface outer side 3262 surrounding the inner surface 3261 of the upper surface, wherein the filter element 31 is mounted on the The upper surface inner side 3261 of the holder 32.
  • the height dimension of the upper surface inner side 3261 is lower than the height dimension of the upper surface outer side 3262, that is, a height difference between the upper surface inner side 3261 and the upper surface outer side 3262, so that A mounting groove 3201 of the holder 32 is formed at a position corresponding to the inner side 3261 of the surface, wherein the mounting groove 3201 of the holder 32 communicates with the light passage 321 so as to be attached thereto.
  • the filter element 31 of the inner surface 3261 of the surface can be held in the mounting groove 3201, and the light passage 321 of the holder 32 can correspond to the filter element 31, so that the The height dimension of the camera module 100.
  • the upper surface inner side 3261 and the upper surface outer side 3262 may also be flush.
  • the inner side surface 325 of the support 32 has an inner surface upper side 3251 and an inner surface lower side 3252, wherein the inner surface upper side 3251 is connected upward and downward to the outer surface, respectively. 3262 and the upper surface inner side 3261, the inner surface lower side 3252 is connected upward and downward to the upper surface inner side 3261 and the lower surface 324, respectively.
  • the inner surface lower side 3252 of the inner side surface 325 extends obliquely to facilitate avoiding stray light, thereby improving the optical performance of the camera module 100.
  • a distance between an upper edge of the inner surface lower side 3252 and a central optical axis of the camera module 100 is greater than a lower edge of the inner surface lower side 3252 and the center of the camera module 100.
  • the distance between the optical axes is such that the inner surface lower side 3252 extends obliquely.
  • the distance between the connection position of the inner surface lower side 3252 and the upper surface inner side 3261 to the central optical axis of the camera module 100 is larger than the inner surface lower side 3252 and the lower surface 324.
  • the distance between the connection position to the central optical axis of the camera module 100 is such that the inner surface lower side 3252 extends obliquely.
  • the support 32 can be an injection molded part, i.e., the support 32 can be formed by an injection molding process.
  • the holder 32 forms the vent hole 328 and the venting groove 329 of the holder 32 while being injection molded, and in the present invention
  • the holder 32 may be formed first, and then the vent hole 328 and the venting groove 329 of the pedestal 32 may be formed by a process such as drilling or grooving. .
  • the camera module 100 of the present invention is not limited in this regard.
  • the camera module 100 can be an autofocus and zoom camera module.
  • the camera module 100 further includes at least one driver 40, wherein the optical lens 10 is drivably disposed on The driver 40, wherein the driver 40 is attached to the holder 32, so that the optical lens 10 is held in a photosensitive path of the photosensitive member 22.
  • the driver 40 may be attached to the outer surface 3262 of the upper surface of the holder 32.
  • the driver 40 may not be mounted to the holder 32 such that the driver 40 is attached to the top surface 232 of the molding base 23.
  • the driver 40 is capable of holding the optical lens 10 in a photosensitive path of the photosensitive element 22, and the driver 40 is capable of driving the optical lens 10 to move along a photosensitive path of the photosensitive element 22 to be adjusted Focusing and zooming of the camera module 100 are achieved by the relative positions of the optical lens 10 and the photosensitive element 22. It is worth mentioning that the driver 40 can be implemented as, but not limited to, a voice coil motor.
  • the upper surface 326 of the support 32 is provided with at least one positioning protrusion 3230 for attaching the driver 40 to the outer surface 3262 of the upper surface of the support 32.
  • the driver 40 is directed to the correct mounting position or to guide the driver 40 to the correct mounting position when the driver 40 is placed on the top surface 232 of the molding base 23.
  • the positioning protrusion 3230 protrudes from the outer surface outer side 3262 of the holder 32.
  • the number and shape of the positioning protrusions 3230 are not limited in the camera module 100 of the present invention.
  • the number of the positioning protrusions 3230 can be implemented as four, wherein each of the positioning The projections 3230 are respectively located at each corner of the holder 32.
  • the driver 40 has at least one motor pin 41, wherein the motor pin 41 of the driver 40 is connected to the substrate 211 to turn on the driver 40 and the substrate 211.
  • the molding base 23 has at least one lead groove 233, wherein the motor pin 41 of the driver 40 is received in the pin groove 233 of the molding base 23 to make the motor
  • the pin 41 may not protrude from the outer wall of the molded base 23, thereby not only ensuring the reliability of the camera module 100, but also making the camera module 100 more beautiful.
  • FIG. 4B shows a modified embodiment of the camera module 100.
  • the camera module 100 shown in FIG. 4 is different from the camera module 100 shown in FIG. 4B.
  • the camera module 100 is implemented as an array camera module.
  • the camera module 100 includes at least two of the optical lenses 10 and at least one of the molded photosensitive units 20, wherein The molded photosensitive unit 20 further includes at least one of the circuit board 21, at least two of the photosensitive elements 22, and at least one of the molded bases 23, the molded base 23 having at least two of the light windows 231, wherein each of the photosensitive elements 22 is electrically connected to the circuit board 21, the molding base 23 is integrally coupled to the circuit board 21, and the molding base 23 is surrounded by The photosensitive region 221 of each of the photosensitive elements 22 is so that the photosensitive regions 221 of each of the photosensitive members 22 respectively correspond to each of the light windows 231 of the molding base 23, Each of the optical lenses 10 is held in each of the photosensitive elements 22 Sensitive path.
  • the electronic component 25 is electrically connected to the substrate 211 on the substrate front surface 2111 of the substrate 211.
  • the electronic component 25 can be mounted on the substrate front surface 2111 of the substrate 211 by mounting, thereby making the electronic component
  • the substrate front surface 2111 of the substrate 211 is electrically connected to the substrate 211.
  • the electronic component 25 protrudes from the substrate front surface 2111 of the substrate 211.
  • the electronic component 25 may also be partially buried in the substrate 211 on the substrate front surface 2111 of the substrate 211, and the electronic component may be 25 and the substrate 211 are electrically connected to each other. At this time, the electronic component 25 also protrudes from the substrate front surface 2111 of the substrate 211.
  • the electronic component 25 may be electrically connected to the substrate back surface 2112 of the substrate 211.
  • the substrate 211 or the electronic component 25 is electrically connected to the substrate 211 such that the substrate back surface 2112 of the substrate 211 is half buried in the substrate 211.
  • the electronic component 25 may also be completely buried inside the substrate 211, that is, the electronic component 25 may not protrude from the The substrate front surface 2111 of the substrate 211 and the substrate back surface 2112 of the substrate 211 are not protruded.
  • the position of the electronic component 25 protruding from the front surface 2111 of the substrate 211 is not limited in the camera module 100 of the present invention, and is determined according to the specific application of the camera module 100. Adjustment, for example, in some examples of the camera module 100 of the present invention, a plurality of the electronic components 25 may be disposed on all areas of the substrate front surface 2111 of the substrate 211, and in the present invention In other examples of the camera module 100, a plurality of the electronic components 25 may also be disposed on a specific area of the substrate front surface 2111 of the substrate 211, such as a corner or a side or a certain side, etc.
  • the camera module 100 of the present invention is not limited in these respects.
  • the circuit board 21 of the camera module 100 may not provide the electronic component 25, that is, the camera module 100 may be a camera module 100 without electronic components. After the camera module 100 is mounted on the device body 200, the camera module 100 can be electrically connected to the electronic components of the device body 200.
  • one or more of the substrates 211 are arranged to form an imposition unit 3000.
  • the arrangement of the substrate 211 forming the imposition unit 3000 is not limited in the camera module 100 of the present invention, and is selected according to requirements, for example, the substrate 211 of the hard board is formed.
  • the arrangement of the imposition unit 3000 formed by the imposition unit 3000 and the hard and soft combination substrate 211 may be different. That is, the imposition unit 3000 includes at least one of the substrates 211.
  • the number of the substrates 211 of the imposition unit 3000 is implemented as two or more.
  • the imposition unit 3000 is placed in a molding die 300 to perform a molding process by the molding die 300.
  • the molding die 300 includes an upper die 301 and a lower die 302, wherein at least one of the upper die 301 and the lower die 302 can be operated to enable the molding die 300 to be executed Clamping and drafting operations.
  • the imposition unit 3000 is first placed in the lower mold 302, and then the upper mold 301 is placed on the lower mold 302 and/or the imposition unit 3000 to form the mold
  • the mold 300 performs a mold clamping operation, and at least one molding space 303 may be formed between the upper mold 301 and the substrate front surface 2111 of the substrate 211.
  • At least one communication channel 304 may be formed between the upper mold 301 and the substrate front surface 2111 of the substrate 21 for Adjacent to the molding space 303 is connected.
  • the fluid medium 400 can flow into and fill the adjacent molding spaces 303 through the communication passages 304.
  • a feed channel 306 is further formed between the upper mold 301 of the molding die 300 and the substrate front surface 2111 of the substrate 21, wherein the feed channel 306 is in communication with at least one of the communication passages 304 to allow the fluid medium 400 to flow from the feed passage 306 to the communication passage 304, and then allow the fluid medium 400 to pass through each of the communication passages 304 and each
  • the molding space 303 flows to fill all of the molding space 303, or the feed channel 306 communicates with at least one of the molding spaces 303 to allow the fluid medium 400 to flow from the feeding channel 306.
  • the molding space 303 then allows the fluid medium 400 to flow through each of the molding spaces 303 and each of the communication passages 304 to fill all of the molding spaces 303.
  • the molding die 300 includes a feeding mechanism 307, wherein the feeding mechanism 307 includes a hopper 3071 and a ejector 3072, wherein the hopper 3071 has a storage space 30711 and a a push channel 30712, the push channel 30712 communicating with the storage space 30711 and the feed channel 306, wherein the pusher 3072 is operatively disposed to the stock of the stocker 3071 Space 30711.
  • the feeding mechanism 307 includes a hopper 3071 and a ejector 3072, wherein the hopper 3071 has a storage space 30711 and a a push channel 30712, the push channel 30712 communicating with the storage space 30711 and the feed channel 306, wherein the pusher 3072 is operatively disposed to the stock of the stocker 3071 Space 30711.
  • the ejector 3072 When the ejector 3072 is operated, such as when the ejector 3072 is operated by, but not limited to, a hydraulic pump applying pressure to the ejector 3072, the ejector 3072 can be pushed to be stored in the The fluid medium 400 of the storage space 30711 is pushed into the molding space 303 from the push channel 30912 and the feed channel 306, respectively, and through each of the molding spaces 303 and each The communication passage 304 flows to fill all of the molding space 303.
  • the hopper 3071 includes a first stock element 30713 and a second stock element 30714, wherein the first stock The element 30713 and the upper mold 301 are implemented as a unitary structure, the second stock element 30714 and the lower mold 302 are implemented as a unitary structure, and the second stock element 30714 has a movable passage 30715 .
  • the storage space 30711 and the second can be formed between the first storage element 30713 and the second storage element 30714
  • the corresponding position of the movable channel 30715 of the stock element 30914 forms the push channel 30912.
  • the fluid medium 400 can also be stored in the push channel 30912.
  • the ejector 3072 may only provide pressure to apply pressure to the fluid medium 400 stored in the hopper space 30711 and drive the fluid medium 400 from the priming channel 30712 The supply mechanism 307 is discharged.
  • at least one of the ejector 3072 and the hopper 3071 may also provide heat to heat the fluid medium 400 stored in the hopper space 30711, such as in The fluid medium 400 is heated and melted, and then pressurized by the ejector 3072 to be discharged from the feed channel 30712 to the feeding mechanism 307.
  • the upper mold 301 further includes a molding guide 3011 and at least one light window molding portion 3012 and at least one molding guide groove 3013, wherein the light window molding portion 3012 integrally extends from The molding guide portion 3011 to form the molding guide groove 3013 between the light window molding portion 3012 and the molding guide portion 3011, or to form the molding between adjacent the light window molding portions 3012
  • the slot 3013 is guided.
  • the molding guide portion 3011 has a first pressing portion 30111
  • the light window forming portion 3012 has a second pressing portion 30121, wherein after the molding die 300 is subjected to a mold clamping process, The first pressing portion 30111 is pressed outside the edge region 2114 of the substrate 211, and the second pressing portion 30121 of the light window forming portion 3012 is pressed against the edge region of the substrate 211
  • the inner side of 2114 or the second pressing portion 30121 of the light window forming portion 3012 is pressed against at least a portion of the mounting area 2113 of the substrate 211, or the optical window forming portion 3012
  • the second pressing portion 30121 is simultaneously pressed against at least a portion of the mounting region 2113 of the substrate 211 and the inner side of the edge region 2114, thereby forming the molding space 303 at a position corresponding to the molding guiding groove 3013.
  • a portion of the edge region 2114 of the substrate 211 is held in the molding space 303, at which time the electronic component 25 protrud
  • the middle portion of the light window forming portion 3012 is formed in a concave manner to form a safety space 30122, wherein the second pressing portion 30121 of the light window forming portion 3012 is pressed against the substrate 211.
  • the substrate connector 2115 protruding from the substrate front surface 2111 of the substrate 211 and the mounting region 2113 of the substrate 211 can be held in the light window molding portion.
  • the safety space 30122 of 3012 prevents the substrate connection 2115 protruding from the substrate front surface 2111 of the substrate 211 and the mounting area 2113 of the substrate 211 from being pressed.
  • the molding die 300 further includes at least one film layer 305, wherein the film layer 305 is overlappedly disposed on an inner surface of the upper mold 301, for example, the film layer 305 may be attached thereto by The manner of the inner surface of the mold 301 is overlapped on the inner surface of the upper mold 301.
  • the film layer 305 is located between the first pressing portion 30111 of the upper mold 301 and the outer side of the edge region 2114 of the substrate 21 and is located at the Between the second pressing portion 30121 of the light window forming portion 3012 and the inner side of the edge portion 2114 of the substrate 21, in this manner, on the one hand, the film layer 305 can be absorbed by deformation.
  • the film layer 305 can isolate the first application of the upper mold 301.
  • a pressing portion 30111 and an outer side of the edge region 2114 of the substrate 211 and an inner side of the edge portion 2114 of the substrate 211 are separated from the second pressing portion 30121 to prevent the upper mold 301 from being scratched.
  • the substrate front surface 2111 of the substrate 211 is described to protect the substrate 211 from good electrical properties.
  • the film layer 305 can prevent a gap from being formed between the first pressing portion 30111 of the upper mold 301 and the outer side of the edge region 2114 of the substrate 211 by deformation, and preventing the A gap is formed between the second pressing portion 30121 and the inner side of the edge region 2114 of the substrate 211, so that the fluid medium 400 can be prevented from entering the mounting region 2111 of the substrate 211, and at the same time,
  • the fluid medium 400 can avoid the occurrence of "flash" defects after curing.
  • the film layer 305 can also facilitate the demolding of the upper mold 301 of the molding die 300, and the molding base 23 is avoided during the demolding of the upper mold 301. It is damaged, in particular, to prevent the light window 231 of the molded base 23 from being damaged, thereby ensuring the reliability of the camera module 100.
  • the fluid medium 400 is added to the hopper space 30711 of the supply mechanism 307, and then, by the ejector 3072, pressure is applied to the reservoir.
  • the push channel 30712 is discharged from the storage space 30711, and flows through the feed channel 306 to the molding space 303 communicating with the feed channel 306, and subsequently, when the fluid medium 400 continues
  • the fluid medium 400 can fill all of the molding space 303 through each of the molding spaces 303 and each of the communication passages 304.
  • the fluid medium 400 can be a liquid, a solid or a mixture of liquid and solid, etc., to enable the fluid medium 400 to flow. Additionally, the fluid medium 400 can be implemented as, but not limited to, a thermoset material. Of course, it will be understood by those skilled in the art that in other possible examples, it is also possible that the fluid medium 400 is implemented as a photo-curable material or a self-solid material.
  • the fluid medium 400 can cover an area of the edge region 2114 of the substrate 211 that is held within the molding space 303, and the cover is held In the electronic component 25 in the molding space 303, the fluid medium 400 filled in the molding space 303 can be cured by heating to form a continuous molding base 4200, wherein The joint molding base 4200 can be integrally coupled to a region of the substrate front surface 2111 of the substrate 211, and at least a portion of at least one of the electronic components 25 is embedded.
  • the continuous molded base 4200 can embed all of the electronic components 25. It is worth mentioning that the continuous molded base 4200 can be subsequently divided to form the molded base 23 of the molded photosensitive unit 20.
  • the fluid medium 400 filled in the molding space 303 can also be solidified by cooling, or the fluid medium 400 filled in the molding space 303 can be solidified at a normal temperature.
  • the camera module 100 of the present invention is not limited in this regard.
  • the molding base 23 can surround the mounting area 2113 of the substrate 211 to enable the The mounting area 2113 corresponds to the light window 231 of the molded base 23. It will be understood that the substrate connector 2115 of the substrate 211 is held within the light window 231 of the molded base 23. It is worth mentioning that the molded circuit board assembly semi-finished product 2100 is a semi-finished product of the molded photosensitive unit 20. That is, the molded circuit board assembly blank 2100 can be subsequently processed to form the molded photosensitive unit 20.
  • the base inner surface 234 of the molding base 23 is formed after the molding die 300 is demolded, and the base outer surface 235 of the molding base 23 It may be formed after the molding die 300 is demolded, or may be formed after the molded circuit board assembly blank 2100 is divided.
  • the molded circuit board assembly blank 2100 is divided to form a molded circuit board assembly 2000, and the molded circuit board assembly 2000 can be simultaneously formed, with reference to the stages illustrated in FIGS. 13A and 13B.
  • the outer surface 235 of the molded base 23 is formed after the outer surface of the molded base 23 is sanded.
  • the manner of dividing the molded circuit board assembly 2100 is not limited in the camera module 100 of the present invention.
  • the molded circuit board assembly semi-finished product 2100 may be divided by cutting to form the mold.
  • the plastic circuit board assembly 2000 can also be etched to divide the molded circuit board assembly blank 2100 to form the molded circuit board assembly 2000. It will be understood by those skilled in the art that the above-mentioned manner of dividing the molded circuit board assembly semi-finished product 2100 by cutting or etching is only an example, and does not constitute the content of the camera module 100 of the present invention. The limits of the scope.
  • the molded circuit board assembly semi-finished product 2100 can also be divided by other means to form the molded circuit board assembly 2000, so that the molded circuit board assembly semi-finished product 2100 can be divided.
  • the way can be. It is worth mentioning that the divided outer surface of the continuous molded base 4200 forms the base outer surface 235 of the molded base 23.
  • base outer surface 235 of the molded base 23 may be sloped or vertical, which may be selected as desired.
  • the direction in which the molded circuit board assembly semi-finished product 2100 is divided is not limited in the camera module 100 of the present invention.
  • the dividing direction may be from the substrate 211.
  • the direction in which the substrate front surface 2111 is located is in a direction in which the substrate back surface 2112 of the substrate 211 is located, and in the example illustrated in FIG. 13B, the dividing direction may be from the substrate back surface 2112 of the substrate 211.
  • the direction is toward the direction in which the substrate front surface 2111 of the substrate 211 is located.
  • the continuous molding base 4200 can form the molding base 23, and the light window 231 of the continuous molding base 4200 forms a The light window 231 of the molded base 23 is described.
  • the divided sides of the molded circuit board assembly blank 2100 form a split side 2001 of the molded circuit board assembly 2000. That is, the molded circuit board assembly 2000 has at least one of the divided sides 2001. Additionally, the side portion of the molded circuit board assembly blank 2100 that is demolded is a release side 2002 of the molded circuit board assembly 2000. That is, in some examples of the camera module 100 of the present invention, the molded circuit board assembly 2000 may have at least one of the divided side 2001 and at least one of the released sides 2002. In other examples of the camera module 100, the molded circuit board assembly 2000 may also have four of the divided sides 2001 or have four of the stripping sides 2002. It will be understood that both the split side 2001 and the release side 2002 may form the base outer surface 235 of the molded base 23.
  • the photosensitive member 22 is attached to the mounting region 2113 of the substrate 211, and the chip connector 223 of the photosensitive member 22 is passed through a wire bonding process.
  • the connecting line 24 is formed between the substrate connectors 2115 of the substrate 211 to electrically connect the photosensitive element 22 and the substrate 211 through the connecting line 24.
  • the holder 32 with the filter unit 30 is attached to the top surface 232 of the molding base 23 to form a photosensitive device semi-finished product. 1100, wherein the photosensitive device semi-finished product 1100 subsequently forms the photosensitive device 1000.
  • the mounting medium 1002 is applied on at least one of the top surface 232 of the molding base 23 and the lower surface 324 of the holder 32, for example,
  • the glue area 3242 of the lower surface 324 of the holder 32 applies the placement medium 1002, wherein the placement medium 1002 may be, but not limited to, glue.
  • the lower surface 324 of the holder 32 and the top surface 232 of the molded base 23 are then superposed on each other such that the mounting medium 1002 is held at the holder 32.
  • the excess of the mounting medium 1002 can overflow into the first venting groove 3293 of the venting groove 329, and due to the depth dimension of the first venting groove 3293 of the venting groove 329
  • the thickness of the mounting medium 1002 is larger than the thickness of the mounting medium 1002, so that the venting passage 102 is not blocked by the mounting medium 1002 overflowing into the first venting groove 3293 to ensure the venting of the venting passage 102. That is, excess of the mounting medium 1002 between the lower surface 324 of the holder 32 and the top surface 232 of the molded base 23 can overflow into the holder 32.
  • the placement medium 1002 within the overflow tank 3206 and overflowing into the overflow tank 3206 of the holder 32 does not block the ventilation passage 102, that is, overflowing into the overflow
  • the mounting medium 1002 in the glue tank 3206 does not fill the overflow tank 3206 to keep the ventilation passage 102 clear.
  • the overflow tank 3206 is formed at a connection position of the non-paint area 3241 of the lower surface 324 of the holder 32 and the glue area 3242 so as to be located at the support.
  • the excess of the mounting medium 1002 between the lower surface 324 of the 32 and the top surface 232 of the molded base 23 can overflow from the glue area 3242 of the lower surface 324. In this manner, in the overflow tank 3206 of the support 32, in this way, the flatness of the support 32 is ensured, thereby facilitating the improvement of the optical performance of the camera module 100.
  • the filter element 31 Forming the filter element 31, the holder 32, the molding base 23, and the substrate 211 after the holder 32 is attached to the molding base 23.
  • the holder 32 surrounds the photosensitive region 221 of the photosensitive member 22 to make the photosensitive member 22
  • the photosensitive region 221 corresponds to the filter element 31.
  • the light window 231 of the molding base 23 and the light passing passage 321 of the holder 32 correspond to each other so as to correspond to the light window 231 of the molding base 23
  • the photosensitive region 221 of the photosensitive member 22 can correspond to the filter element 31 that is attached to the holder 32 and closes the light passage 321 of the holder 32.
  • venting passage 102 is curvedly extended, such that after the holder 32 is attached to the molding base 23, the venting passage 102 can prevent dust and the like from passing through the The venting passage 102 enters the sealed space 101 from the external environment of the camera module 100 to contaminate the photosensitive region 221 of the photosensitive member 22 held in the sealed space 101 and contaminate the filter element 31
  • the portion for forming the sealed space 101 is used to prevent the occurrence of undesirable phenomena such as stain spots, thereby ensuring the product yield of the camera module 100.
  • the venting passage 102 is formed by the vent hole 328 and the venting groove 329 of the support 32 communicating with each other, wherein the vent hole 328 extends in a direction and the venting groove 329 extends. Inconsistent, thereby causing the venting passage 102 to extend in a curved manner.
  • the extending direction of the vent hole 328 and the extending direction of the venting groove 329 are perpendicular to each other, so that the middle portion of the venting passage 102 has a sharp turn, so that dust and the like can be effectively prevented from passing through the venting.
  • the passage 102 enters the sealed space 101 from the external environment.
  • the mounting layer 1001 is formed to enable the mounting medium 1002 to be further cured to form the mounting layer 1001 held between the lower surface 324 of the holder 32 and the top surface 232 of the molding base 23.
  • the holder 32 can be reliably mounted on the molded base 23, and the filter element 31 can be reliably held on the photosensitive path of the photosensitive member 22.
  • the gas outside the photosensitive device 1000 can be exchanged through the ventilation passage 102 to make the sealed space 101
  • the gas pressure and the gas pressure outside the photosensitive device 1000 can be always balanced, so that the components of the filter element 31, the photosensitive element 22, etc., which are used to form the sealed space 101, are not vulnerable because The phenomenon of cracking or chipping due to uneven pressure is particularly important for ensuring the image quality and yield of the camera module 100.
  • the gas in the sealed space 101 may expand due to thermal expansion and contraction, which causes the pressure of the air pressure in the sealed space 101 to become large and directly acts on the sealed space.
  • the photosensitive region 221 of the photosensitive member 22 of 101 and the filter element 31 are used to form a portion of the sealed space 101, for example, for the photosensitive region 221 of the photosensitive member 22, once said
  • the photosensitive region 221 of the photosensitive element 22 is subjected to a relatively large pressure, and the photosensitive region 221 of the photosensitive element 22 is deformed by a depression or the like to affect the imaging quality of the camera module 100;
  • the filter element 31 may be cracked or chipped. Liang phenomenon, the filter element 31 once cracks or chipping of undesirable phenomena, is inevitably lead to the camera module 100 of the image quality is affected, or even result in the scrapping of the camera module 100.
  • the sealed space 101 and the outside of the photosensitive device 1000 are communicated through the venting passage 102 formed in the holder 32, thus performing the baking process.
  • the gas of the sealed space 101 is thermally expanded, the expanded gas can be sequentially discharged to the outside of the photosensitive device 1000 through the venting groove 329 and the vent hole 328.
  • the sealed space The gas pressure in the 101 is balanced with the gas pressure outside the photosensitive device 1000, so that the photosensitive region 221 and the filter member 31 of the photosensitive member 22 held in the sealed space 101 are used to form a The portion of the sealed space 101 is not subjected to gas pressure.
  • the gas outside the photosensitive device 1000 can be sequentially supplied into the sealed space 101 through the vent hole 328 and the venting groove 329, at this time,
  • the gas pressure in the sealed space 101 is balanced with the gas pressure outside the photosensitive device 1000, thereby being held by the photosensitive region 221 and the filter element 31 of the photosensitive member 22 of the sealed space 101.
  • the portion where the sealed space 101 is formed is not subjected to gas pressure. That is, the venting passage 102 can always balance the gas pressure in the sealed space 101 and the gas pressure outside the photosensitive device 1000, which is to ensure the imaging quality and yield of the camera module 100. It is especially important to say.
  • the mounting medium 1002 also expands when heated, and since the depth dimension of the overflow tank 3206 is larger than the thickness dimension of the mounting medium 1002, the expanded mounting medium 1002 can overflow. It is into the overflow tank 3206 and does not block the ventilation passage 102. In other words, since the depth dimension of the first ventilation groove 3293 is larger than the thickness dimension of the mounting medium 1002, the expanded placement medium 1002 can overflow into the first ventilation groove 3293, and The venting passage 102 is not blocked.
  • vent passage 102 is curvedly extended, even when the gas is replenished from the outside of the photosensitive device 1000 to the sealed space 101 via the vent passage 102, even a gas such as dust is carried in the gas.
  • the contaminants such as dust can also be trapped at the turning position of the venting passage 102, that is, the extreme position where dust or the like enters the venting passage 102 is the vent hole 328 forming the venting passage 102. Therefore, it does not enter the venting groove 329 forming the venting passage 102, so that the camera module 100 can be prevented from having a problem such as a contamination point.
  • the sealing medium 104 is filled in the vent hole 328 forming the vent passage 102, and formed in the pass after the sealing medium 104 is cured.
  • the driver 40 incorporating the optical lens 10 is attached to the upper surface 326 of the holder 32, and the motor pin 41 of the driver 40 is mounted. Connected to the substrate 211 such that the optical lens 10 is held in a photosensitive path of the photosensitive element 22, and the filter element 31 is held between the optical lens 10 and the photosensitive element 22 .
  • the locating projections 3230 protruding from the upper surface 326 of the abutment 32 can guide the driver 40 to be placed in the correct position.
  • the module connection end 2121 of the connection board 212 is attached to the substrate front surface 2111 of the substrate 211 through the connection medium 2123 to electrically connect the The board 212 and the substrate 211 are connected to obtain the camera module 100 shown in FIG.
  • the module connection end 2121 of the connection board 212 may be mounted on the back surface of the substrate 211 through the connection medium 2123. 2112.
  • the stage shown in FIG. 19 can also be after the stage shown in FIG. 7 , so that the module connection end 2121 of the connecting board 212 is first mounted on the connecting medium 2123 through the connecting medium 2123.
  • the substrate front surface 2111 of the substrate 211 is then subjected to a molding process, by which the molded base 23 integrally bonded to the edge region 2114 of the substrate 211 can also be embedded.
  • the module connection end 2121 of the connection board 212 so that the molding base 23 enables the module connection end 2121 of the connection board 212 to be reliably mounted on the front surface of the substrate of the substrate 211 2111, to prevent the module connection end 2121 of the connecting board 212 from falling off the substrate 211.
  • FIG. 21 shows a modified embodiment of the camera module 100.
  • the driver 40 is mounted to the top surface 232 of the molded base 23.
  • the driver 40 is attached to the outside of the top surface 232 of the molding base 23, and the holder 32 is attached to the inner side of the top surface 232 of the molding base 23. In this way, the height dimension of the camera module 100 can be further reduced.
  • FIG. 22 shows another modified embodiment of the camera module 100.
  • the top surface 232 of the molded base 23 has a top surface inner side 2321, a top surface outer side 2322, and a pedestal mounting groove 2323, wherein the top surface outer side 2322 surrounds the top surface inner side 2321
  • the top surface outer side 2322 is higher than the top surface inner side 2321 so as to have a height difference between the top surface outer side 2322 and the top surface inner side 2321, thereby forming the pedestal mounting groove 2323.
  • the pedestal mounting groove 2323 is in communication with the light window 231.
  • the top surface inner side 2321, the top surface outer side 2322, and the pedestal mounting groove 2323 of the top surface 232 of the molded base 23 are formed by the same molding process.
  • the top surface outer side 2322 of the top surface 232 of the molded pedestal 23 may be first formed by a molding process, and then the mold base 23 is described by a process area such as grinding. An inner portion of the top surface 232 to form the top surface inner side 2321 of the top surface 232 of the molded base 23 and the pedestal mounting groove 2323.
  • the holder 32 is mounted on the top surface 2321 of the top surface 232 of the molding base 23 such that the holder 32 is held in the base mounting groove 2323. In this manner, the height difference between the upper surface 326 of the holder 32 and the top surface 2322 of the top surface 232 of the molding base 23 can be reduced, thereby facilitating further reduction of the The imaging quality of the camera module.
  • FIG. 23 shows another modified embodiment of the camera module 100, which is different from the camera module 100 shown in FIG. 20 in the camera module 100 shown in FIG.
  • the camera module 100 further includes at least one lens barrel 50, wherein the optical lens 10 is assembled to the lens barrel 50, and the lens barrel 50 is attached to the top of the molding base 23.
  • the surface 232 is such that the optical lens 10 is held in the photosensitive path of the photosensitive member 22, and the filter member 31 is held between the optical lens 10 and the photosensitive member 22.
  • the lens barrel 50 may also be integrally formed on the top surface 232 of the molding base 23, that is, the lens barrel 50 and the molding base 23 may be molded by the same molding. The process is formed integrally.
  • the lens barrel 50 may also be attached to the upper surface 326 of the holder 32, or the lens barrel 50 may be integrally formed on the holder 32.
  • the photosensitive element 22 is first mounted on the mounting of the substrate 211. a region 2113, and the photosensitive member 22 and the substrate 211 are electrically connected to each other, and then subjected to a molding process to integrally bond the molded base 23 of the edge region 2114 of the substrate 211.
  • the non-photosensitive region 222 of the photosensitive member 22 can be further coupled, thereby integrally bonding the molded base 23, the photosensitive member 22, and the substrate 211.
  • FIG. 25 shows another modified embodiment of the camera module 100.
  • the substrate 211 has at least one receiving space 2116, wherein the receiving space 2116 is from the substrate front surface 2111 of the substrate 211 to the
  • the substrate back surface 2112 extends in a direction in which the photosensitive member 22 is held in the housing space 2116 of the substrate 211, and the photosensitive member 22 and the substrate 211 are electrically connected to each other, and the molding base 23 is integrated.
  • the accommodating space 2116 may be a groove or a through hole.
  • the upper surface of the photosensitive element 22 and the substrate front surface 2111 of the substrate 211 can be reduced by the manner in which the photosensitive element 22 is held in the accommodating space 2116 of the substrate 211.
  • the height difference is even such that the upper surface of the photosensitive member 22 is flush with the substrate front surface 2111 of the substrate 211, or the upper surface of the photosensitive member 22 is lower than the substrate front surface 2111 of the substrate 211.
  • FIG. 26 shows another modified embodiment of the camera module 100.
  • the receiving space 2116 of the substrate 211 is implemented as a through hole, that is, the receiving space 2116 forms a substrate of the base 211.
  • a substrate the substrate connector 2115 of the substrate 211 is disposed on the substrate back surface 2112 of the substrate 211, wherein the non-photosensitive region 222 of the photosensitive element 22 is mounted on the substrate 211
  • the substrate back surface 2112, and the chip connector 223 disposed in the non-photosensitive region 222 of the photosensitive member 22 and the substrate connector 2115 disposed on the substrate back surface 2112 of the substrate 211 are mutually Turning on, wherein the substrate 211 surrounds the photosensitive region 221 of the photosensitive element 22 such that the photosensitive region 221 of the photosensitive element 22 corresponds to the receiving space 2116 of the substrate 211,
  • the molding base 23 is integrally coupled to the substrate 211 and the photosensitive element 22, and in this manner, the height dimension of the camera module 100 can be further reduced.
  • the molded photosensitive unit 20 further including at least one back molding portion 26, wherein the back molding portion 26 is integrally coupled to the The substrate back surface 2112 of the substrate 211 is used to reinforce the strength of the substrate 211.
  • the back molding portion 26 is further engageable with at least a portion of the back surface of the chip of the photosensitive member 22, such that the back molding portion 26 enables the photosensitive member 22 to be reliably attached to the The substrate back surface 2112 of the substrate 211 prevents the photosensitive element 22 from falling off from the substrate back surface 2112 of the substrate 211.
  • the back molding portion 26 and the molding base 23 may be formed by the same molding process. Alternatively, it is also possible to first form the molded base 23 by a molding process and then form the back molded portion 26 by a molding process.
  • Figures 28A and 28B show a variant embodiment of the support 32, which differs from the support 32 shown in Figures 6A and 6B in the arrangement shown in Figures 28A and 28B.
  • the holder 32 has a set of the venting holes 328 and one of the venting grooves 329, wherein each of the venting holes 328 is spaced apart from each other, and each of the venting holes 328 is respectively
  • the upper surface 326 of the abutment 32 extends toward the lower surface 324, wherein the venting groove 329 is formed in the lower surface 324 of the abutment 32 and from the inner side of the abutment 32 325 extends toward the outer side 327, wherein each of the vents 328 communicates with the venting groove 329, respectively, such that the venting groove 329 and each of the venting holes 328 form the venting passage 102.
  • each of the vent holes 328 of 32 may be smaller, and thus, it is possible to effectively prevent contaminants such as dust from entering the sealed space 101 from the external environment via each of the vent holes 328. And because the number of the vent holes 328 is relatively large, the venting passage 102 formed by the vent hole 328 having a smaller inner diameter is not in the sealed space 101 and during the baking process. Gas exchange in the external environment causes any adverse effects.
  • the sealing medium 104 may be automatically filled in each of the vent holes 328 by applying the sealing medium 104 to the upper surface 326 of the holder 32.
  • the sealing member 103 held in each of the vent holes 328 is formed after the sealing medium 104 is cured.
  • the sealing medium 104 is used to further form the sealing member 103 that encloses each of the venting holes 328. In this manner, no special process is required to close the venting passage 102.
  • the holder 32 has one of the venting holes 328 and a plurality of the venting grooves 329, wherein the venting holes 328
  • the upper surface 326 of the holder 32 extends toward the lower surface 324, and each of the venting grooves 329 is formed in the lower surface 324 of the holder 32, respectively, and from the holder 32.
  • the inner side 325 extends toward the outer side 327, wherein the vent 328 and each of the venting grooves 329 communicate with each other to form the venting passage 102.
  • the ventilation is further performed.
  • the slot 329 can also be kept open, so that the venting passage 102 is always kept in a clear state to improve the product yield of the camera module 100.
  • the shape of the venting groove 329 is "V" shaped as an example, it is not described in the present invention.
  • the content and range of the camera module 100 impose limitations.
  • the venting groove 329 may have any shape as long as it can communicate with the vent 328 and allow the venting groove 329 and the pass The vent 328 may form the venting passage 102.
  • FIG. 30 to FIG. 34C illustrate another modified embodiment of the camera module 100, which is different from the above embodiment in the specific embodiment of the camera module 100 shown in FIGS. 30 to 34C.
  • the venting passage 102 is formed between the holder 32 and the molded base 23.
  • the holder 32 has at least one venting groove 329, wherein the venting groove 329 is formed on the lower surface 324 of the holder 32, and the venting A slot 329 extends from the inner side 325 of the holder 32 to the outer side 327, wherein the lower portion of the holder 32 is disposed in the mounting layer 1001 formed by the mounting medium 1002
  • the venting groove 329 of the holder 32 is on the lower surface 324 of the holder 32 and the molding
  • the venting passage 102 is formed between the top surfaces 232 of the susceptor 23, and the venting passage 102 is for communicating the sealed space 101 and the outside of the photosensitive device 1000.
  • the venting groove 329 of the support 32 is curvedly extended.
  • the shape of the venting groove 329 may be in an "S" shape or a "V" shape, so that the pedestal 32 is mounted on the pedestal 32.
  • the said lower surface 324 of the holder 32 and the top surface 232 of the molding base 23 formed at a position corresponding to the venting groove 329 The vent passage 102 is curvedly extended, so that contaminants such as dust can be prevented from entering the sealed space 101 from the outside of the photosensitive device 1000 via the vent passage 102.
  • the support 32 has at least one first groove 3210 and at least one second groove 3220, wherein the first groove 3210 extends from the outer side 327 of the support 32 to the support
  • the inner side surface 325 of the 32 extends in a direction from the inner side surface 325 of the holder 32 toward the outer side surface 327 of the holder 32, and the first recess
  • the groove 3210 and the second groove 3220 communicate with each other to form the venting groove 329, thereby forming the venting passage 102 subsequently.
  • the extending direction of the first groove 3210 and the extending direction of the second groove 3220 are inconsistent, so that the ventilation groove 329 formed in the first groove 3210 and the second groove 3220 After the venting passage 102 is formed, the venting passage 102 extends in a curved manner.
  • at least one of the first groove 3210 and the second groove 3220 extends in a curved manner so that the first groove 3210 and the second groove 3220 are formed.
  • the venting passage 102 extends in a curved manner.
  • first groove 3210 and the second groove 3220 may have different depths, for example, the depth dimension of the first groove 3210 is larger than the depth dimension of the second groove 3220, in such a manner.
  • the mounting medium 1002 can overflow into the first groove 3210 and prevent the mounting medium 1002.
  • the first groove 3210 is filled to ensure the smoothness of the ventilation passage 102.
  • the first groove 3210 may be formed in the glue area 3242 of the holder 32, and the second groove 3220 may be formed in the non-paint area 3241 of the holder 32.
  • FIG. 35 shows another modified embodiment of the holder 32 of the camera module 100.
  • the holder 32 shown in FIGS. 34A to 34C is different from that shown in FIG.
  • two of the second grooves 3220 can communicate with the same one of the first grooves 3210, such as at the first groove 3210 and each of the second After the venting groove 329 formed by the recess 3220 forms the venting passage 102, the venting passage 102 may have a "Y" shape. That is, a plurality of the second grooves 3220 may communicate with the same one of the first grooves 3210. Optionally, a plurality of the first grooves 3210 may also communicate with the same one of the second grooves 3220.
  • FIG. 36 shows a modified embodiment of the molded circuit board assembly 2000, which may also be formed on the top surface 232 of the molded base 23, for example, in a molding process.
  • the venting groove 329 is formed in synchronization with the molding base 23, or after the molding base 23 is formed, by removing a portion of the top surface 232 of the molding base 23.
  • venting groove 329 Forming the venting groove 329, wherein the venting groove 329 extends from the pedestal inner surface 234 of the molded base 23 to the pedestal outer surface 235 such that the venting groove 329 communicates with the The light window 231 and the outside of the molding base 23, such that after the holder 32 is attached to the top surface 232 of the molding base 23, at a position corresponding to the ventilation groove 329
  • the vent passage 102 is formed for communicating the sealed space 101 and the outside of the photosensitive device 1000. It can be understood that the venting groove 329 formed on the top surface 232 of the molding base 23 can also be interconnected by at least one of the first groove 3210 and at least one of the second groove 3220. After formation.
  • the holder 32 has at least one of the vent holes 328, wherein the vent hole 328 is from the upper surface of the holder 32.
  • 326 extends to the lower surface 324 and the vent 328 communicates with the upper surface 326 and the lower surface 324 of the mount 32.
  • the top surface 232 of the molded base 23 has at least one of the venting grooves 329, wherein the venting grooves 329 are from the pedestal inner surface 234 of the molded base 23 to the outside of the pedestal
  • the surface 235 extends in a direction in which the lower surface 324 of the holder 32 is attached to the top surface 232 of the molding base 23 through the mounting layer 1001.
  • the vent 328 communicates with the venting groove 329 of the molding base 23 such that the vent hole 328 of the holder 32 and the venting groove 329 of the molding base 23 are formed
  • the venting passage 102 is described such that the venting passage 102 is for communicating the sealed space 101 and the outside of the photosensitive device 1000.
  • the top surface 232 of the molding base 23 further has a ventilation groove 3240 and an overflow groove 3250, wherein the ventilation groove 3240 and the overflow groove 3250 communicate with each other to form The venting groove 329.
  • the overflow groove 3250 communicates with the ventilation groove 3240 and the vent hole 328 of the support 32, wherein the overflow groove 3250 has a depth dimension larger than a depth dimension of the ventilation groove 3240, such that The mounting medium 1002 overflowing into the venting groove 329 can be retained in the overflow groove 3250 and prevent the mounting medium 1002 overflowing into the overflow groove 3250 from filling up.
  • the glue groove 3250 is configured to keep the ventilation passage 102 clear.
  • FIG. 38A is a cross-sectional view showing a modified embodiment of the holder 32
  • FIG. 38B is a cross-sectional view showing a modified embodiment of the photosensitive device 1000
  • FIG. 38C and FIG. 38D are respectively shown.
  • the non-painting area 3241 of the surface 324, and after the glue area 3242 of the lower surface 324 of the holder 32 is attached to the top surface 232 of the molding base 23,
  • the vent 328 of the holder 32 corresponds to the light window 231 of the molding base 23, in such a manner that the vent 328 of the holder 32 can be formed to communicate with the vent
  • the ventilation space 101 and the ventilation passage 102 outside the photosensitive device 1000 are sealed.
  • vent 328 is not limited in the camera module 100 of the present invention.
  • the vent 328 may be formed in the middle of the support 32 or may be formed in the The corner of the support 32, or any other possible location.
  • the photosensitive device 1000 further includes the sealing member 103, and after the baking process of the photosensitive device semi-finished product 1100 is performed to obtain the photosensitive device 1000, the sealing medium 104 is filled in The venting opening 328 of the abutment 32 and the sealing element 103 retained within the venting opening 328 after the sealing medium 104 has solidified in the venting opening 328, wherein the sealing element 103 is used to block the vent hole 328 to prevent the sealed space 101 from communicating with the outside of the photosensitive device 1000, so that dust such as dust on the outside of the photosensitive device 1000 can be prevented from entering the sealed space 101, In order to ensure the yield of the camera module 100.
  • Figure 39A shows a perspective schematic view of a variant embodiment of the support 32
  • Figure 39B shows a schematic cross-sectional view of a variant embodiment of the filter unit 30
  • Figure 39C shows the A schematic cross-sectional view of a modified embodiment of the photosensitive device 1000
  • FIGS. 39D and 39E are respectively a cross-sectional schematic view and a partially enlarged schematic view of a modified embodiment of the camera module 100, the ventilation of the holder 32.
  • a groove 329 is formed in the upper surface 326 of the holder 32, and the vent groove 329 extends from the inner side surface 325 of the holder 32 toward the outer side 327, and is disposed at the filter element 31.
  • the venting groove 329 forms the venting passage 102 between the holder 32 and the filter element 31. It can be understood that the ventilation passage 102 communicates with the light passage 321 of the support 32. Referring to FIGS. 39C to 39E, the venting passage 102 formed between the holder 32 and the filter member 31 is for communicating the sealed space 101 and the outside of the photosensitive device 1000.
  • the ventilation groove 329 of the support 32 is formed on the upper surface inner side 3261 of the upper surface 326 of the support 32, and is located in the mounting groove 3201 of the support 32.
  • the venting groove 329 extends from the inner surface lower side 3252 of the inner side surface 325 of the support 32 toward the outer side surface 327, for example, the venting groove 329 may be from the inner side surface 325
  • the inner surface lower side 3252 extends to the inner surface upper side 3251.
  • the filter element 31 is attached to the upper surface inner side 3261 of the upper surface 326 of the holder 32, and the filter element 31 is held at the mounting of the holder 32.
  • a gap 33 is formed between the outer wall of the filter element 31 and the inner surface upper surface 3251 of the holder 32, wherein the venting groove 329 communicates with the through hole of the holder 32.
  • the light passage 321 and the slit 33 are such that the vent groove 329 and the slit 33 form the vent passage 102.
  • the photosensitive device 1000 further includes the sealing member 103, and after the baking process of the photosensitive device semi-finished product 1100 is performed to obtain the photosensitive device 1000, the sealing medium 104 is filled in Formed in the slit 33 between the holder 32 and the filter element 31, and the sealing medium 104 is solidified in the slit 33 to form the seal held in the slit 33
  • the element 103 is configured to prevent the sealed space 101 from communicating with the outside of the photosensitive device 1000, so that dust such as dust on the outside of the photosensitive device 1000 can be prevented from entering the sealed space 101 to ensure the camera module. 100 yield.
  • FIG. 40A is a perspective view showing a modified embodiment of the holder 32
  • FIG. 40B is a schematic cross-sectional view showing a modified embodiment of the photosensitive device 1000
  • FIGS. 40C and 40D respectively show A schematic cross-sectional view and a partially enlarged schematic view of a modified embodiment of the camera module 100.
  • the outer side surface 327 of the holder 32 extends obliquely, and the angle of inclination of the outer side surface 327 of the holder 32 coincides with the inclination angle of the base inner surface 234 of the molded base 23.
  • the outer side surface 327 of the holder 32 is attached to the base inner surface 234 of the molding base 23 such that the filter element is attached to the holder 32 31 is held on the photosensitive path of the photosensitive member 22. That is, in this specific example of the camera module 100 of the present invention, the lower surface 324 of the holder 32 may not be attached to the top surface of the molding base 23. 232, but the outer side 327 of the holder 32 is attached to the base inner surface 234 of the molding base 23, in such a manner, at the molding base 23 The top surface 232 may not need to reserve a space for mounting the support 32, thereby facilitating the reduction of the length and width dimensions of the camera module 100.
  • the inclination angle of the outer side surface 327 of the holder 32 coincides with the inclination angle of the base inner surface 234 of the molded base 23, the outer side surface 327 of the holder 32 After the pedestal inner surface 234 of the molded base 23 is bonded together, the flatness of the filter element 31 can be ensured to ensure the optical performance of the camera module 100.
  • the venting groove 329 of the support 32 is disposed on the outer side 327 of the support 32, and the venting groove 329 extends from the upper surface 326 of the support 32 to the lower surface 324 So that the venting groove 329 communicates with the upper surface 326 and the lower surface 324 of the holder 32 so as to be on the outer side 327 of the holder 32 and the molded base 23
  • the venting groove 329 is formed between the outer side surface 327 of the holder 32 and the base inner surface 234 of the molded base 23.
  • the venting passage 102 is configured to communicate the sealed space 101 and the outside of the photosensitive device 1000.
  • the venting groove 329 of the support 32 is curvedly extended.
  • the venting groove 329 of the support 32 may be, but not limited to, an "S" shape, a "Y” shape, a "V” shape, or the like. And so that after the outer side surface 327 of the holder 32 and the base inner surface 234 of the molded base 23 are attached to each other, the outer side surface of the holder 32 is formed.
  • the venting passage 102 between the 327 and the base inner surface 234 of the molded base 23 is curvedly extended. In this manner, on the one hand, it is advantageous to prevent dust and the like on the outside of the photosensitive device 1000 from being contaminated.
  • the venting passage 102 does not flow into the sealed space 101 when the sealing medium 104 is filled in the venting passage 102, and thus the venting passage 102 does not flow into the sealed space 101, thereby The sealing medium 104 is held in the ventilation passage 102 and forms the sealing member 103 after curing, so that the sealing medium 104 can be prevented from contaminating the camera module due to entering the sealed space 101. 100 bad phenomenon.
  • the lower opening of the venting passage 102 is hidden outside the lower surface 324 of the pedestal 32 such that it does not enter the sealed space 101 from the filter element 31. Light has any effect.
  • the venting groove 329 may also be formed on the pedestal inner surface 234 of the molding base 23 and from the top surface 232 of the molding pedestal 23 toward the substrate 211. The direction extends to a position such that after the outer side 327 of the holder 32 and the base inner surface 234 of the molded base 23 are bonded to each other, the venting groove 329 is The ventilation passage 102 for communicating the sealed space 101 and the outside of the photosensitive device 1000 is formed between the outer side surface 327 of the holder 32 and the base inner surface 234 of the molded base 23. .
  • FIG. 41 is a cross-sectional view showing another modified embodiment of the photosensitive device 1000, which is different from the photosensitive device 1000 illustrated in FIG. 40B, and the photosensitive device 1000 illustrated in FIG.
  • the holder 32 of the photosensitive device 1000 has the vent 328, wherein the vent 328 extends from the upper surface 326 of the holder 32 to the lower surface 324 After the filter unit 30 is attached to the molded photosensitive unit 20, the vent hole 328 forms the vent passage 102 for communicating the sealed space 101 and the outside of the photosensitive device 1000. .
  • FIGS. 42A, 42B, and 42C are respectively a perspective view and a cross-sectional view showing different perspectives of another modified embodiment of the holder 32, and Fig. 42D shows a cross-sectional view of the filter unit 30.
  • FIG. 42E is a cross-sectional view showing the photosensitive device 1000
  • FIGS. 42F and 42G are respectively a cross-sectional view and a partially enlarged schematic view of the camera module 100.
  • the holder 32 includes a base mounting portion 34, a connecting portion 35, and a filter mounting portion 36, wherein the connecting portions 35 extend upward and downward, respectively, to be Connected to the susceptor mounting portion 34 and the filter mounting portion 36, for example, the pedestal mounting portion 34 of the holder 32, the connecting portion 35, and the filter sticker
  • the mounting portion 36 may be integrally formed by a process such as injection molding, so that the connecting portions 35 extend upward and downward, respectively, to be coupled to the pedestal mounting portion 34 and the filter mounting portion 36, and pass through In this manner, the filter mounting portion 36 of the holder 32 can form a sunken filter mounting portion, and the holder 32 can form a sunken holder.
  • the pedestal mounting portion 34 of the holder 32 is attached to the top surface 232 of the molding base 23, for example, the pedestal of the holder 32
  • the mounting portion 34 is attached to the top surface 2321 of the molding base 23 such that the holder 32 is held behind the susceptor mounting groove 2323 of the molding base 23.
  • the connecting portion 35 causes the filter mounting portion 36 to be held in the optical window 231 of the molding base 23 to further be attached to the filter mounting portion 36.
  • the filter element 31 is held in the light window 231 of the molding base 23, and the filter element 31 is held on the photosensitive path of the photosensitive element 22.
  • the filter mounting portion 36 has the light passing passage 321 , wherein the connecting portion 35 surrounds the periphery of the filter mounting portion 36 , and the lower end of the connecting portion 35 is connected to the The outer side of the filter mounting portion 36 or the lower end of the connecting portion 35 is integrally formed with the outer side of the filter mounting portion 36, wherein the pedestal mounting portion 34 surrounds the connection The periphery of the portion 35 and the high end of the connecting portion 35 are connected to the inner side of the susceptor mounting portion 34, or the high end of the connecting portion 35 is integrally molded with the inner side of the susceptor mounting portion 34.
  • the light passage 321 can be synchronously formed when the base mounting portion 34, the connecting portion 35 and the filter mounting portion 36 of the holder 32 are integrally formed. Or the manner in which the central portion of the filter mounting portion 36 is removed after the susceptor mounting portion 34 of the holder 32, the connecting portion 35, and the filter mounting portion 36 are molded.
  • the light passage 321 is formed.
  • the holder 32 is A connecting portion 35 extends from the top surface 232 of the molding base 23 toward the substrate 211 to cause the filter mounting portion 36 to sink to the light of the molding base 23
  • the window 231 is so as to surround the molded base 23 around the filter mounting portion 36 of the holder 32.
  • the length of the connecting portion 35 of the support 32 determines the specific position of the filter mounting portion 36 to sink, in other words, the connecting portion 35 of the holder 32.
  • the length determines the relative position of the filter element 31 and the photosensitive element 22, and the relative positions of the filter element 31 and the photosensitive element 22 determine the size of the filter element 31.
  • the length of the connecting portion 35 of the holder 32 determines the size of the filter element 31. Therefore, in the camera module 100 of the present invention, the position of the holder 32 can be adjusted.
  • the manner in which the length of the connecting portion 35 is described changes the size requirement of the camera module 100 for the filter element 31.
  • the extending distance of the connecting portion 35 of the support 32 affects the sinking depth of the filter element 31 in the light window 231 of the molded base 23, and
  • the extension distance of the filter mounting portion 36 affects the size of the filter element 31.
  • the extension distance of the connecting portion 35 of the holder 32 is larger, the position of the filter element 31 in the light window 231 of the molding base 23 is closer to the photosensitive member. 22.
  • the extending distance of the connecting portion 35 of the support 32 needs to be determined in conjunction with the imaging effect of the camera module 100, such as reducing the camera module.
  • the upper portion of the base of the back focus of the lens 100 causes a dark spot, such as an image of dust, and the extending distance of the filter mounting portion 36 of the holder 32 needs to consider the light path of the camera module 100 and the Factors such as the photosensitive region 221 of the photosensitive member 22 and the non-photosensitive region 222 and the remaining width of the substrate 211 are described.
  • the filter mounting portion 36 when the filter mounting portion 36 is extended inward, the filter mounting portion 36 does not block the photosensitive member 22 when the size of the filter element 31 is small.
  • the photosensitive region 221 does not block the incoming light excessively, and may extend more at a position where the substrate 211 is wider than the package, and has a smaller extension at a position where the package remaining width of the substrate 211 is smaller. Therefore, in the case of ensuring the imaging quality of the camera module 100, the area of the filter element 31 is reduced as much as possible, thereby ensuring the reliability of the camera module 100 and reducing the camera module 100. Manufacturing costs.
  • a receiving groove 37 is formed between the base mounting portion 34 of the holder 32 and the connecting portion 35, and the connecting portion 35 and the filter at the holder 32
  • the mounting groove 3201 is formed between the sheet mounting portions 36, wherein the filter element 31 of the filter mounting portion 36 attached to the holder 32 is held in the mounting groove
  • 3201 after the holder 32 is attached to the top surface 232 of the molding base 23, a portion of the molding base 23 is held in the housing of the holder 32.
  • the slot 37 it is possible to further reduce the length, width, and height dimensions of the camera module 100 to facilitate miniaturization of the camera module 100.
  • the vent hole 328 of the holder 32 is disposed on the filter of the holder 32. a portion 36, and the vent hole 328 extends from an upper surface to a lower surface of the filter mounting portion 36, and communicates the vent hole 328 with the mounting groove 3201, wherein the filter element 31
  • the slit 33 is formed between the outer wall of the filter element 31 and the connecting portion 35, wherein the vent hole 328 communicates with the slit 33,
  • the vent hole 328 and the slit 33 are formed to communicate the vent passage 102 for the sealed space 101 and the outside of the photosensitive device 1000.
  • the vent 328 is provided in the pedestal mounting portion 34 of the holder 32, and the vent 328 is from the pedestal mounting portion.
  • the upper surface of the upper surface 34 extends to the lower surface, and the vent hole 328 is communicated with the accommodating groove 37, wherein the susceptor mounting portion 34 of the holder 32 is attached to the molding base 23
  • the gap 33 is formed between the connecting portion 35 and the base inner surface 234 of the molding base 23, wherein the vent hole 328 communicates with the slit 33
  • the vent hole 328 and the slit 33 are formed to communicate the vent passage 102 for the sealed space 101 and the outside of the photosensitive device 1000.
  • the vent hole 328 of the holder 32 is disposed at the connecting portion 35 of the holder 32, and the vent hole 328 is from the connecting portion.
  • An inner surface of the 35 extends to the outer surface such that the vent 328 communicates with the mounting groove 3201 and the receiving groove 37, wherein the venting groove 329 of the holder 32 is disposed on the filter.
  • the mounting portion 36, and the venting groove 329 communicates with the mounting groove 3201 and the vent hole 328, wherein the filter element 31 is mounted on the filter of the holder 32
  • the filter unit 30 is formed by the portion 36, and the venting groove 329 and the vent hole 328 that communicate with each other after the top surface 232 of the molded base 23 of the holder 32 are formed.
  • the ventilation passage 102 communicates with the sealed space 101 and the outside of the photosensitive device 1000.
  • FIG. 44 is a cross-sectional view showing another modified embodiment of the camera module 100.
  • the camera module 100 further includes a light-transmitting protective member 60, wherein the protective member 60 has a light-transmitting region. 61.
  • An attachment area 62 and an escape space 63 wherein the attachment area 62 surrounds the light-transmissive area 61, and the escape space 63 is implemented as an escape slot, wherein the escape An air space 63 extends from the attachment area 62 to a suitable position of the light transmissive area 61, wherein the attachment area 62 of the protective element 60 is attached to the molded base 23 After the top surface 232, the escape space 63 is formed between the attachment region 62 of the shield member 60 and the top surface 232 of the molded base 23 for communicating the sealed space 101 and The ventilation passage 102 outside the photosensitive device 1000.
  • the escape space 63 may be implemented as an escape hole, wherein the escape space 63 extends from the upper surface to the lower surface of the protection element 60 in the light transmissive area 61, thereby The attachment region 62 of the member 60 is attached to the top surface 232 of the molding base 23, and the escape space 63 is formed to communicate the sealed space 101 and the photosensitive device 1000.
  • the venting channel 102 is external.
  • the escape space 63 may also be formed on the top surface 232 of the molding base 23 such that the attachment region 62 of the shield member 60 is attached to the mold.
  • the escape space 63 is formed between the top surface 232 of the molded base 23 and the attachment region 62 of the shield member 60 for The venting passage 102 that communicates the sealed space 101 and the outside of the photosensitive device 1000.
  • a camera module 100' according to another preferred embodiment of the present invention is illustrated in the following description, wherein the camera module 100' includes At least one optical lens 10' and at least one molded photosensitive unit 20', wherein the molded photosensitive unit 20' further comprises at least one circuit board 21', at least one photosensitive element 22', and at least one molded portion 27', wherein The photosensitive element 22' is electrically connected to the circuit board 21', and the molding portion 27' is integrally coupled to the circuit board 21', wherein the optical lens 10' is held at the photosensitive Photosensitive path of element 22'.
  • the circuit board 21' further includes at least one substrate 211' and at least one connecting plate 212', wherein the photosensitive element 22' is electrically connected to the substrate 211', wherein the connecting plate 212' has a mode a connection end 2121' and a device connection end 2122' corresponding to the module connection end 2121', wherein the module connection end 2121' of the connection plate 212' is electrically connected to the substrate 211
  • the device connection end 2122' of the connection board 212' is electrically connected to the device body 200.
  • the module connection end 2121' of the connection board 212' is mounted on the substrate 211' through a connection medium 2123', so that the module of the connection board 212'
  • the connection end 2121' is electrically connected to the substrate 211'.
  • the module connection end 2121' of the connecting plate 212' integrally extends to the substrate 211', that is, the connecting plate 212' and the substrate 211' are of a unitary structure.
  • the connecting plate 212' includes a connector 2124', wherein the connector 2124' is disposed at the device connecting end 2122' of the connecting plate 212', or the connector 2124' is formed in the The device connection end 2122' of the connection plate 212', wherein the device connection end 2122' of the connection plate 212' can be conveniently electrically connected to the connector 2124' of the connection plate 212' The device body 200.
  • the connecting plate 212 ′ is soft and can be deformed, wherein the camera module 100 ′ is connected to the device body 200 through the connecting plate 212 ′ in such a manner.
  • the connecting plate 212' can buffer assembly displacement and deformation caused by manufacturing tolerances of the camera module 100', and the camera module 100' is caused by vibration during use of the device body 200. The displacement, thereby ensuring the reliability of the electronic device in the process of being used.
  • the substrate 211' has a substrate front surface 2111' and a substrate back surface 2112', wherein the substrate front surface 2111' and the substrate back surface 2112' correspond to each other.
  • the substrate 211 ′ has a flat shape, so that the substrate front surface 2111 ′ and the substrate back surface 2 112 ′ of the substrate 211 ′ are both planar, such that the substrate front surface 2111 of the substrate 211 ′ 'and the substrate back surface 2112' can define the thickness dimension of the substrate 211'. That is, the distance dimension between the substrate front surface 2111' and the substrate back surface 2112' of the substrate 211' is the thickness dimension of the substrate 211'.
  • the substrate 211' further has at least one flat mounting area 2113' and an edge area 2114' surrounding the mounting area 2113', wherein the mounting area 2113' and the edge area 2114' respectively Formed on the substrate front surface 2111' of the substrate 211', wherein the photosensitive element 22' is mounted on the mounting area 2113' of the substrate 211', wherein the molding portion 27' is integrally Bonded to at least a portion of the edge region 2114' of the substrate 211'.
  • the substrate 211' has good hardness to ensure the flatness of the substrate 211', in such a manner that when the photosensitive element 22' is attached to the substrate 211' After the area 2113' is mounted, the flatness of the photosensitive element 22' can be ensured.
  • the substrate 211' may be, but not limited to, a hard board, a hard and soft bonding board, a ceramic substrate, or the like.
  • the molded photosensitive unit 20' further includes at least one connecting wire 24', wherein both ends of the connecting wire 24' are electrically connected to the photosensitive member 22' and the substrate 211, respectively. ', such that the photosensitive element 22' attached to the mounting region 2113' of the substrate 211' is electrically connected to the substrate 211' through the connecting line 24'.
  • the substrate 211' further has at least one substrate connector 2115', wherein each of the substrate connectors 2115' is disposed in the edge region 2114' of the substrate 211', respectively.
  • the substrate connectors 2115' may be arranged, but not limited to two, and each set of the substrate connectors 2115' are symmetrically disposed on opposite sides of the mounting area 2113'.
  • the photosensitive element 22' has a photosensitive area 221', a non-photosensitive area 222', and at least one chip connector 223', wherein the non-photosensitive area 222' surrounds the photosensitive area 221'.
  • Each of the chip connectors 223' is disposed in the non-photosensitive region 222' of the photosensitive element 22', respectively.
  • the chip connectors 223' may be arranged in, but not limited to, two groups, and each of the chip connectors 223' is symmetrically disposed on both sides of the photosensitive region 221'.
  • each of the non-photosensitive regions 222' of the photosensitive element 22' is disposed.
  • the chip connectors 223' respectively correspond to each of the substrate connectors 2115' disposed in the edge region 2114' of the substrate 211'.
  • the two ends of the connecting line 24' are respectively connected to the substrate connecting member 2115' of the substrate 211' and the chip connecting member 223' of the photosensitive element 22' to be electrically connected
  • the photosensitive element 22' and the substrate 211' are described.
  • the connecting line 24' may be formed between the substrate connecting member 2115' of the substrate 211' and the chip connecting member 223' of the photosensitive member 22' by a wire bonding process in such a manner
  • the photosensitive element 22' and the substrate 211' are electrically connected by the connecting line 24'.
  • the wire bonding direction of the connecting wire 24 ′ is not limited in the camera module 100 ′ of the present invention.
  • the wire bonding direction of the connecting wire 24 ′ may be from the substrate 211 .
  • 'to the photosensitive element 22' may be from the photosensitive element 22' to the substrate 211'.
  • the type of the connecting wire 24' is not limited in the camera module 100' of the present invention.
  • the connecting wire 24' may be a gold wire, a lead wire, a copper wire or the like.
  • the molded photosensitive unit 20' further includes at least one electronic component 25', wherein the electronic component 25' is electrically connected to the substrate 211'.
  • the electronic component 25' may be mounted on the edge region 2114' of the substrate 211'. Alternatively, part or all of the electronic component 25' may be buried in the substrate 211'. Optionally, a part of the electronic component 25 ′ may also be mounted on the back surface 2112 ′ of the substrate 211 ′, or the electrons located on the back surface 2112 ′ of the substrate 211 ′. A part or all of the component 25' is buried in the substrate 211'.
  • the type of the electronic component 25' is not limited, for example, the electronic component 25' may be implemented as, but not limited to, a driver, a relay, a processor, a resistor, a capacitor, or the like.
  • the molding portion 27 ′ may be integrally bonded to the edge region 2114 ′ of the substrate 211 ′ after the electronic component 25 ′ may not be embedded, or at least one of the electronic components 27 ′ may be embedded. At least part.
  • the molding portion 27' embeds all of the electronic components 25' after being integrally bonded to the edge region 2114' of the substrate 211'. It can be understood that, by the molding portion 27' embedding the electronic component 25' after molding, the electronic component 25' can be prevented from contacting the external environment by the molding portion 27'. Therefore, the surface of the electronic component 25' is prevented from being oxidized or the like.
  • the molded portion 27' is also capable of isolating adjacent electronic components 25' to prevent mutual interference between adjacent electronic components 25'.
  • the molded portion 27' can also make the interval between adjacent electronic components 25' smaller by the manner in which the molded portion 27' embeds the electronic component 25' after molding. Therefore, the electronic component 25' can be mounted in a larger number and larger size on the limited mounting area of the substrate 211'.
  • the molding portion 27' can also isolate the electronic component 25' and the photosensitive member 22' to prevent the surface of the electronic component 25' from escaping the photosensitive member 22'.
  • the photosensitive area 221' is described.
  • the molding portion 27' can isolate the electronic component 25' and the photosensitive element 22' by embedding the electronic component 25', and the electronic component 25' and the The photosensitive member 22' is spaced apart from the electronic component 25' and the photosensitive member 22' in such a manner as to be located on both sides of the molded portion 27'.
  • the molded portion 27' further includes at least one molded body 271', wherein the molded body 271' is integrally bonded to at least a portion of the edge region 2114' of the substrate 211' by a molding process.
  • the molded body 271' is embedded in at least a portion of at least one of the electronic components 25' protruding from the substrate front surface 2111' of the substrate 211'.
  • the molded body 271' can embed all of the electronic components 25'.
  • the molded body 271' can extend from the edge region 2114' of the substrate 211' to the non-photosensitive region 221' of the photosensitive member 22', that is, the molded body 271 'A portion of the non-photosensitive region 221' of the photosensitive element 22' can be embedded.
  • the molded body 271' can be integrally bonded to the edge region 2114' of the substrate 211' and the non-photosensitive region 222' of the photosensitive member 22'.
  • the number of the molded bodies 271' is two, and two of the molded bodies 271' can be symmetrically formed on both sides of the photosensitive region 221' of the photosensitive member 22', and A first light-passing space 272' of the molding portion 27' and two first mounting spaces 273' communicating with the first light-passing space 272' are formed between the two molded bodies 271'.
  • the camera module 100 ′ further includes at least one filter unit 30 ′, wherein the filter unit 30 ′ includes at least one filter element 31 ′, wherein the filter element 31 ′ is held on the optical lens 10 . Between and the photosensitive element 22'. After being reflected from the optical lens 10' into the interior of the camera module 100', the light reflected by the object can be filtered by the filter element 31', and then received and photoelectrically converted by the photosensitive element 22'. And imaging.
  • the type of the filter element 31 ′ of the filter unit 30 ′ is not limited in the camera module 100 ′ of the present invention.
  • the filter element 31 ′ may be It is not limited to an infrared cut filter or a full transmissive spectrum filter.
  • the filter unit 30' further includes at least one frame type holder 32', wherein the holder 32' has at least one light passage 321', wherein the filter element 31' is mounted on the holder 32', such that the filter element 31' closes the light passage 321' of the holder 32'.
  • the holder 32' has a second light-passing space 3202' and at least one second installation space 3203' communicating with the second light-passing space 3202', wherein the holder 32' is mounted on the a molded portion 27' such that at least a portion of each of the molded bodies 271' of the molded portion 27' is mounted to each of the second mounting spaces 3203' of the holder 32', and At least a portion of the holder 32' is mounted to each of the first mounting spaces 273' of the molding portion 27' such that the first light-passing space 272 of the molding portion 27'
  • the second light-passing space 3202' of the holder 32' can cooperate to form a light window 231', wherein the photosensitive area 221' of the photosensitive element 22' corresponds to the light window 231 '.
  • the support 32' includes a seat body 3204' and at least one extension arm 3205' that integrally extends from the seat body 3204'.
  • the number of the extension arms 3205' is implemented as two, wherein the two extension arms 3205' extend integrally and symmetrically with each other.
  • the holder body 3204' to form the second light-passing space 3202' and each of the second installation spaces 3203' between the two extension arms 3205', wherein the holder body 3204'
  • the light passing passage 321' is provided, and the light passing passage 321' communicates with the second light passing space 3202'.
  • each of the extension arms 3205' of the holder 32' is mounted and held at the molding portion 27', respectively.
  • Each of the first mounting spaces 273', each of the molding bodies 271' of the molding portion 27' is mounted to each of the second mounting spaces 3203' of the holder 32',
  • the first light-passing space 272' of the molding portion 27' and the second light-passing space 3202' of the holder 32' can be fitted to each other to form the light window 231'.
  • a sealed space 101' of the camera module 100' is formed, wherein the photosensitive region 221' of the photosensitive element 22' is held in the sealed space 101'. Further, a photosensitive device 1000' can be formed after the filter unit 30' and the molded photosensitive unit 20' are mounted together.
  • each of the extension arms 3205' of the support 32' matches the shape and mutual shape of the first installation space 273' of the molding portion 27'.
  • the shape and size of each of the molded bodies 271' of the molded portion 27' and the shape and size of each of the second mounting spaces 3203' of the holder 32' are matched with each other, in such a manner
  • the sealed space 101' of the camera module 100' is formed between the filter element 31', the holder 32', the molding portion 27', and the substrate 211'.
  • the photosensitive device 1000' includes at least one mounting layer 1001' formed with a mounting medium 1002', wherein the mounting layer 1001' is held at the holder 32' of the filter unit 30' and The molded portion 27' of the molded photosensitive unit 20' is placed between the molded portion 27' to be attached to the molded portion 27'.
  • the type of the mounting medium 1002' is not limited in the camera module 100' of the present invention.
  • the mounting medium 1002' may be, but not limited to, glue, wherein the sticker The mounting medium 1002' forms a mounting layer 1001' held between the holder 32' and the molded body 271' after curing.
  • the camera module 100' has at least one ventilation channel 102', wherein the sealed space 101' can be formed between the filter unit 30' and the molded photosensitive unit 20', for example,
  • the sealed space 101' is formed between the filter element 31', the holder 32', the molding portion 27' and the substrate 211', and the ventilation passage 102' is used to communicate the sealed space. 101' and the exterior of the photosensitive device 1000'.
  • the sealed space 101' may be formed between the filter element 31', the holder 32', the molded portion 27', and the photosensitive member 22'.
  • the gas in the sealed space 101' and the gas outside the photosensitive device 1000' can be exchanged through the venting passage 102', so that in the process in which the camera module 100' is manufactured
  • the venting passage 102 ′ can ensure that the air pressure of the sealed space 101 ′ and the pressure of the outside of the photosensitive device 1000 ′ are balanced, so that the formation of the camera module 100 ′ can be avoided.
  • each component of the sealed space 101' is damaged due to the pressure imbalance, in particular, can ensure that the upper and lower portions of the filter element 31' are subjected to the same air pressure, thereby avoiding the filter element
  • the upper and lower portions of 31' are subjected to an unbalanced air pressure, which causes a problem of cracking or chipping of the filter element 31'.
  • the venting passage 102' is formed in the abutment 32'. More preferably, the ventilation channel 102' is formed in the extension arm 3205' of the support 32', wherein the ventilation channel 102' communicates with the second light-passing space 3202' and the external environment, thereby The ventilation formed in the extension arm 3205' after the filter space 101' is formed between the filter element 31', the holder 32', the molding portion 27' and the substrate 211'.
  • the passage 102' is capable of communicating the sealed space 101' and the external environment.
  • the venting passage 102' may also be formed in the molded body 271'.
  • the venting passage 102' extends obliquely, that is, the extending direction of the venting passage 102' is inconsistent with the extending direction of the plane in which the photosensitive region 221' of the photosensitive member 22' is located, so that When the sealing member 103' held in the venting passage 102' is formed by filling a sealing medium 104' in the venting passage 102', the sealing medium 104' does not flow to the sealed space 101. In the end, it is advantageous to ensure the quality of the camera module 100' and improve the product yield of the camera module 100'.
  • the camera module 100' further includes at least one driver 40', wherein the optical lens 10' is drivably disposed on the driver 40', wherein the driver 40' is mounted on the holder 32' So that the optical lens 10' is held in the photosensitive path of the photosensitive element 22'.
  • the driver 40' is capable of driving the optical lens 10' to move along the photosensitive path of the photosensitive element 22' to achieve a manner of adjusting the relative positions of the optical lens 10' and the photosensitive element 22'. Focusing and zooming of the camera module 100'. It is worth mentioning that the driver 40' can be implemented as, but not limited to, a voice coil motor.
  • the driver 40' has at least one motor pin 41', wherein the motor pin 41' of the driver 40' is connected to the substrate 211' to turn on the driver 40' and the The substrate 211' is described.
  • FIG. 50 shows another modified embodiment of the camera module 100', which is different from the camera module 100' shown in FIG. 45 to FIG. 49C.
  • the number of the molded bodies 271' of the molding portion 27' may be two, and the two molded bodies 271' have an "L" shape.
  • the number of the extension arms 3205' of the holder 32' is two, and the two extension arms 3205' are in an "L" shape, so that the holder 32' is mounted on the holder
  • the sealed space 101' can be formed between the filter element 31', the holder 32', the molding portion 27', and the substrate 211', or The sealed space 101' is formed between the filter element 31', the holder 32', the molded portion 27', and the photosensitive member 22'.
  • Figure 51 shows a variant embodiment of the camera module 100', which differs from the camera module 100' shown in Figures 45 to 49C in the camera shown in Figure 51.
  • the number of the molded bodies 271' of the molding portion 27' may be one, and accordingly, the number of the extension arms 3205' of the holder 32' There are three, and the three extension arms 3205' are in a " ⁇ " shape, such that the shape of the holder 32' can cooperate with the shape of the molding portion 27', so that the holder 32 is 'After being mounted on the molding portion 27', the seal can be formed between the filter element 31', the holder 32', the molding portion 27' and the substrate 211'
  • the space 101', or the sealed space 101' is formed between the filter element 31', the holder 32', the molding portion 27', and the photosensitive member 22'.
  • Figure 52 shows a variant embodiment of the camera module 100', which differs from the camera module 100' shown in Figures 45 to 49C in the camera shown in Figure 52.
  • the number of the molded bodies 271' of the molded portion 27' may be three, and the three molded bodies 271' have a " ⁇ " shape, correspondingly
  • the number of the extension arms 3205' of the holder 32' is one, such that the shape of the holder 32' can cooperate with the shape of the molding portion 27' so that the holder After being mounted on the molding portion 27', the same can be formed between the filter element 31', the holder 32', the molding portion 27', and the substrate 211'.
  • the sealed space 101' or the sealed space 101' is formed between the filter element 31', the holder 32', the molded portion 27', and the photosensitive member 22'.
  • Figure 53 shows another variant embodiment of the camera module 100', which is different from the camera module 100' shown in Figures 45 to 49C, as shown in Figure 53
  • the number of the molded bodies 271' of the molding portion 27' is four, wherein two of the molded bodies 271' which are symmetrical to each other are defined as one The first molded body 271a', and the two mutually symmetrical two molded bodies 271' are defined as a second molded body 271b', wherein each of the first molded bodies 271a' and each The second molding bodies 271b' are respectively end to end, and each of the first molding bodies 271a' has a height dimension higher than a height dimension of each of the second molding bodies 271b', thereby The corresponding position of the second molded body 271b' forms the first mounting space 273' between the two first molded bodies 271a'.
  • each of the first molding bodies 271' can extend to the holder body 3204' of the holder 32', each of the first molding bodies 271a' being extendable to each of the extensions Arm 3205'.
  • the shape of the holder 32' can be matched with the shape of the molding portion 27' so that after the holder 32' is attached to the molding portion 27', the filter member can be 31', the support 32', the molding portion 27' and the substrate 211' form the sealed space 101', or in the filter element 31', the support 32', The sealed space 101' is formed between the molded portion 27' and the photosensitive member 22'.
  • FIG. 54 shows another modified embodiment of the camera module 100 ′.
  • the extension arm 3205 of the holder 32 ′ 'At least one notch 3208' is provided, wherein when the holder 32' is attached to the molded body 271', the notch 3208' is at the extension arm 3205 of the holder 32'
  • the venting passage 102' for communicating the sealed space 101' and the outside of the photosensitive device 1000' is formed between the second molded body 271b' of the molded body 271'.
  • the position of the notch 3208' of the support 32' is not limited in the camera module 100' of the present invention.
  • the notch 3208' may be formed on the branch.
  • the extension arm 3205' of the seat 32' may have a central portion or a corner.
  • the notch 3208' of the holder 32' may also be in the extension arm 3205' of the holder 32' and the The ventilation passage 102' for communicating the sealed space 101' and the outside of the photosensitive device 1000' is formed between the substrate front surface 2111' of the substrate 211'.
  • the present invention further provides a method of manufacturing the photosensitive device 1000, wherein the manufacturing method comprises the following steps:
  • venting passage 102 may be formed on the support 32, or the venting passage 102 may be formed on the molded base 23, or the venting passage 102 may be formed in the support Between 32 and the molded base 23, or a portion of the venting passage 102 is formed in the portion 32, and another portion is formed in the molded base 23.
  • the present invention further provides a method of manufacturing the camera module 100, wherein the manufacturing method includes the following steps:
  • the optical lens 10 is held on the photosensitive path of the photosensitive member 22 of the molded photosensitive unit 20.

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Abstract

Provided in the present invention are a camera module, support base thereof, photosensitive device, manufacturing method, and electronic apparatus. The support base has at least one light transmission channel. A light filtering unit is formed by attaching at least one light filtering element to the support base and blocking the light transmission channel by means of the light filtering element. The support base is attached to a molded photosensitive unit to form at least one sealed space between the light filtering unit and the molded photosensitive unit. The support base further has at least one ventilation channel in communication with the sealed space and external surroundings of the camera module, such that air exchange between the sealed space and the external surroundings of the camera module is enabled via the ventilation channel.

Description

摄像模组及其支座、感光装置和制造方法以及电子设备Camera module and its support, photosensitive device and manufacturing method, and electronic device 技术领域Technical field
本发明涉及光学成像领域,特别涉及一摄像模组及其支座、感光装置和制造方法以及电子设备。The present invention relates to the field of optical imaging, and in particular to a camera module and its support, a photosensitive device and a manufacturing method thereof, and an electronic device.
背景技术Background technique
近年来,智能电子设备变得日益流行,例如智能手机、平板电脑等电子设备的发展日益改变了人们的生活方式和娱乐方式。智能电子设备的很多功能得益于被配置于电子设备的摄像模组及其相关技术的发展,例如随着高像素、高品质的摄像模组的发展,智能电子设备越来越能够取代传统的卡片式数码相机。众所周知的是,高像素、高品质的摄像模组的硬件基础是感光元件具有更大尺寸的感光面积和数量更多、尺寸更大的被动元器件,由于智能电子设备对于更高像素、更高品质的追求,导致摄像模组的体积越来越大,这也使得摄像模组的发展趋势越来越不符合电子设备的轻薄化的发展趋势。例如,在控制智能电子设备的厚度尺寸,甚至需要进一步降低智能电子设备的基础上,一旦被配置于智能电子设备的摄像模组的体积被增加,则必然会导致摄像模组凸出于智能电子设备或者被配置于智能电子设备的其他智能部件(例如但不限于陀螺仪、传感器、处理器等)的数量减少、尺寸减小。可以理解的是,如果摄像模组凸出于智能电子设备,一方面会导致智能电子设备的外观设计受到影响,另一方面在使用者携带智能电子设备的过程中,凸出于智能电子设备的摄像模组容易被碰触而导致摄像模组被损坏。如果被配置于智能电子设备的数量减少、尺寸减小,则会对摄像模组的性能产生较大的不利影响,并进一步限制智能电子设备朝向智能化方向发展。In recent years, smart electronic devices have become increasingly popular, and the development of electronic devices such as smart phones and tablet computers has increasingly changed people's lifestyles and entertainment methods. Many functions of intelligent electronic devices benefit from the development of camera modules and related technologies that are configured in electronic devices. For example, with the development of high-pixel, high-quality camera modules, smart electronic devices are increasingly able to replace traditional ones. Card type digital camera. It is well known that the hardware foundation of high-pixel, high-quality camera modules is that the photosensitive element has a larger size of photosensitive area and a larger number of larger passive components, because the smart electronic device is higher pixel and higher. The pursuit of quality has led to the increasing size of camera modules, which makes the development trend of camera modules less and less in line with the development trend of thin and light electronic devices. For example, on the basis of controlling the thickness of the smart electronic device, and even further reducing the intelligent electronic device, once the volume of the camera module configured in the smart electronic device is increased, the camera module will inevitably protrude from the smart electronic device. The number of devices or other smart components (such as, but not limited to, gyroscopes, sensors, processors, etc.) that are configured to the smart electronic device is reduced in size and size. It can be understood that if the camera module protrudes from the smart electronic device, the design of the smart electronic device is affected on the one hand, and the smart electronic device is highlighted in the process of carrying the intelligent electronic device on the other hand. The camera module is easily touched and the camera module is damaged. If the number of smart electronic devices is reduced and the size is reduced, the performance of the camera module is greatly adversely affected, and the smart electronic device is further restricted toward the intelligent direction.
为了减小高像素、高品质的摄像模组的体积,发明人将应用于半导体封装领域的模塑封装工艺引入到摄像模组的封装过程中,具体为,首先将被动电子元器件通过表面贴附工艺贴装在电路板上,然后再利用模塑工艺使模塑材料一体地结合于电路板而形成一体式基座,其中一体式基座能够包埋被动电子元器件,由于在一体式基座和被动电子元器件之间不需要预留安全距离,从而使摄像模组的体积被减小,并且一体式基座能够通过隔离相邻被动电子元器件的方式阻止相邻被动电子元器件出现相互干扰的不良现象,从而在电路板的有限贴装面积上能够被贴装数量更多、尺寸更大的被动电子元器件,这有利于进一步提高摄像模组的品质。如果先将感光元件贴装在电路板上,然后再进行模塑工艺,则通过模塑工艺形成的一体地结合于电路板的一体式基座还能够进一步包埋感光元件的非感光区域,这样,在一体式基座和感光元件之间也不需要预留安全距离,从而有利于进一步减小摄像模组的体积。In order to reduce the volume of high-pixel, high-quality camera modules, the inventors introduced the molding and packaging process applied in the field of semiconductor packaging into the packaging process of the camera module. Specifically, the passive electronic components are first pasted through the surface. The process is mounted on the circuit board, and then the molding process is integrally integrated into the circuit board to form an integrated base, wherein the integrated base can embed the passive electronic components, because the integrated base There is no need to reserve a safe distance between the seat and the passive electronic components, so that the size of the camera module is reduced, and the integrated base can prevent adjacent passive electronic components from appearing by isolating adjacent passive electronic components. The mutual interference is a problem, so that a larger number of passive electronic components can be mounted on the limited mounting area of the circuit board, which is beneficial to further improve the quality of the camera module. If the photosensitive member is first mounted on a circuit board and then subjected to a molding process, the integrated pedestal integrally formed by the molding process and integrally bonded to the circuit board can further embed the non-photosensitive area of the photosensitive member. There is also no need to reserve a safe distance between the integrated base and the photosensitive element, which is advantageous for further reducing the volume of the camera module.
另外,滤光元件被保持在光学镜头和感光元件之间,以用于过滤自光学镜头 进入摄像模组的内部的光线中的杂散光。通常情况下,滤光元件是玻璃片,例如大不限于蓝玻璃,一方面,滤光元件比较脆弱,并且长宽尺寸越大的滤光元件越脆弱,另一方面,滤光元件的成本比较高,并且长宽尺寸越大的滤光元件的成本比较高。在将长宽尺寸比较大的滤光元件贴装在一体式基座上时,由于滤光元件很薄且比较脆弱,再在贴装过程中很容易造成滤光元件产生裂纹,或者造成滤光元件碎裂。另外,根据光学成像原理,滤光元件真正被有效利用的面积实际上很小,仅位于滤光元件的中部的区域是滤光区域。换言之,滤光元件的滤光区域的面积占滤光元件的整体面积比较小,这造成了滤光元件的浪费,并大幅度地增加了摄像模组的成本。In addition, the filter element is held between the optical lens and the photosensitive element for filtering stray light in the light entering the interior of the camera module from the optical lens. Usually, the filter element is a glass piece, for example, not limited to blue glass. On the one hand, the filter element is relatively fragile, and the filter element having a larger length and width is more fragile, and on the other hand, the cost of the filter element is compared. A filter element that is high and has a large length and width is relatively expensive. When the filter element having a relatively large length and a wide size is mounted on the integrated base, since the filter element is thin and fragile, the filter element is liable to be cracked or caused by the filter during the mounting process. The component is broken. In addition, according to the principle of optical imaging, the area in which the filter element is effectively utilized is actually small, and only the area located in the middle of the filter element is the filter area. In other words, the area of the filter region of the filter element occupies less overall area of the filter element, which causes waste of the filter element and greatly increases the cost of the camera module.
为了减小滤光元件的长宽尺寸和提高滤光元件的滤光区域占滤光元件的整体面积的比例,用于连接滤光元件和一体式基座的框形支座被发明人采用。具体地说,首先将滤光元件贴装在框形支座的内侧部,然后在将框形支座的外侧部通过胶水贴装在一体式基座上,此时,框形支座的内侧部能够从感光元件的非感光区域向感光区域方向延伸,并且使框形支座的通光孔对应于感光元件的感光区域,和使滤光元件被保持在感光元件的感光路径上。在现在的工艺中,利用胶水将框形支座贴装在一体式基座上,首先将胶水施涂于框形支座的下贴装面和/或一体式基座的上表面,然后再将框形支座的下贴装面和一体式基座的上表面贴装在一起之后进行烘烤工艺,此时,框形支座的下贴装面能够被可靠地贴装于一体式基座的上表面。然后,由于在将框形支座的下贴装面贴装于一体式基座的上表面之后,在滤光元件、框形支座、一体式基座和电路板之间会形成一个密封空间,此时,在进行烘烤工艺的过程中,密封空间的内部和外部环境的气压不再平衡,根据热胀冷缩的原理,密封空间内的气压会大于外部环境的气压,这样,会导致滤光元件、感光元件等较为脆弱的元器件受到气压的影响,气压会导致滤光元件、感光元件等较为脆弱的元器件产生变形或者裂纹等不良现象出现,而一旦这些不良现象出现,则必然会影响摄像模组的品质,甚至会导致摄像模组报废。因此,研究一种能在进行烘烤工艺的过程中使密封空间内的气压和外部环境的气压保持平衡的方法对于保证摄像模组的品质和良率来说特别的重要。In order to reduce the length and width dimensions of the filter element and to increase the ratio of the filter area of the filter element to the overall area of the filter element, a frame-shaped support for connecting the filter element and the unitary base is employed by the inventors. Specifically, first, the filter element is attached to the inner side of the frame-shaped support, and then the outer side of the frame-shaped support is attached to the integrated base by glue, and at this time, the inner side of the frame-shaped support The portion can extend from the non-photosensitive area of the photosensitive member toward the photosensitive region, and the light-passing hole of the frame-shaped holder corresponds to the photosensitive region of the photosensitive member, and the filter member is held on the photosensitive path of the photosensitive member. In the current process, the frame-shaped support is mounted on the integrated base by means of glue, and the glue is first applied to the lower mounting surface of the frame-shaped support and/or the upper surface of the integrated base, and then After the lower mounting surface of the frame-shaped support and the upper surface of the integrated base are attached together, the baking process is performed, and at this time, the lower mounting surface of the frame-shaped support can be reliably mounted on the integrated base. The upper surface of the seat. Then, after the lower mounting surface of the frame-shaped holder is attached to the upper surface of the integrated base, a sealed space is formed between the filter element, the frame-shaped support, the integrated base, and the circuit board. At this time, during the baking process, the air pressure inside and outside the sealed space is no longer balanced. According to the principle of thermal expansion and contraction, the air pressure in the sealed space will be greater than the pressure of the external environment, thus causing The fragile components such as filter elements and photosensitive elements are affected by the air pressure, and the air pressure may cause deformation or cracks in the fragile components such as the filter element and the photosensitive element, and if these undesirable phenomena occur, it is inevitable. Will affect the quality of the camera module, and even cause the camera module to be scrapped. Therefore, it is particularly important to study a method for balancing the air pressure in the sealed space with the pressure of the external environment during the baking process to ensure the quality and yield of the camera module.
发明内容Summary of the invention
本发明的一个目的在于提供一摄像模组及其支座、感光装置和制造方法以及电子设备,其中所述摄像模组具有至少一密封空间,在所述摄像模组被制造的过程中,所述密封空间的气压压力和所述摄像模组的感光装置的外部的气压压力能够始终被保持平衡,通过这样的方式,能够避免出现所述感光装置的用于形成所述密封空间的每个部件因受压不平衡而被损坏的不良现象。An object of the present invention is to provide a camera module and a support thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the camera module has at least one sealed space, in the process of manufacturing the camera module, The air pressure of the sealed space and the pressure of the outside of the photosensitive device of the camera module can be always balanced, in such a manner that each component of the photosensitive device for forming the sealed space can be avoided. Bad phenomenon caused by pressure imbalance.
本发明的一个目的在于提供一摄像模组及其支座、感光装置和制造方法以及电子设备,其中在所述摄像模组被制造的过程中,所述密封空间的气压压力和所述感光装置的外部的气压压力能够始终被保持平衡,通过这样的方式,能够保证所述感光装置的滤光元件的上部和下部受到的气压压力一致,从而避免因所述滤 光元件的上部和下部受到的压力不平衡而导致所述滤光元件出现裂纹或者碎裂的不良现象。An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein in the process of manufacturing the camera module, the pressure of the sealed space and the photosensitive device The external atmospheric pressure can be always balanced, in such a manner that the pressures of the upper and lower portions of the filter element of the photosensitive device are ensured to be uniform, thereby avoiding the upper and lower portions of the filter element being received. The pressure imbalance causes an undesirable phenomenon in which the filter element is cracked or chipped.
本发明的一个目的在于提供一摄像模组及其支座、感光装置和制造方法以及电子设备,其中所述感光装置具有至少一通气通道,以供连通所述密封空间和所述感光装置的外部,从而在进行烘烤工艺时,通过所述通气通道实现所述密封空间和所述感光装置的外部的气体交换的方式,平衡所述密封空间的气压压力和所述感光装置的外部的气压压力。An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the photosensitive device has at least one ventilation passage for communicating the sealed space and the exterior of the photosensitive device a method of achieving gas exchange between the sealed space and the exterior of the photosensitive device through the venting passage, balancing the pressure of the air in the sealed space and the pressure of the outside of the photosensitive device during the baking process .
本发明的一个目的在于提供一摄像模组及其支座、感光装置和制造方法以及电子设备,其中所述通气通道弯曲地延伸,以避免灰尘等污染物经由所述通气通道自外部环境进入所述密封空间,从而防止被保持在所述密封空间内的感光区域和所述滤光元件的用于形成所述密封空间的部分被污染。An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the ventilation passage is curvedly extended to prevent dust and the like from entering the external environment via the ventilation passage. The sealed space is prevented from being contaminated by the photosensitive region held in the sealed space and the portion of the filter element for forming the sealed space.
本发明的一个目的在于提供一摄像模组及其支座、感光装置和制造方法以及电子设备,其中所述通气通道能够被密封介质密封,以避免灰尘等污染物经由所述通气通道自所述感光装置的外部进入所述密封空间,从而防止被保持在所述密封空间内的感光区域和所述滤光元件形成所述密封空间的部分被污染。An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the ventilation passage can be sealed by a sealing medium to prevent dust and the like from being discharged through the ventilation passage. The outside of the photosensitive device enters the sealed space, thereby preventing the photosensitive region held in the sealed space and the portion where the filter element forms the sealed space from being contaminated.
本发明的一个目的在于提供一摄像模组及其支座、感光装置和制造方法以及电子设备,其中所述通气通道弯曲地延伸,通过这样的方式,在利用所述密封介质密封所述通气通道时,所述通气通道能够阻止所述密封介质流动到所述密封空间内,从而防止被保持在所述密封空间内的所述感光元件的感光区域被污染。An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the ventilation passage is curvedly extended, in such a manner that the ventilation passage is sealed with the sealing medium The venting passage can prevent the sealing medium from flowing into the sealed space, thereby preventing the photosensitive region of the photosensitive member held in the sealed space from being contaminated.
本发明的一个目的在于提供一摄像模组及其支座、感光装置和制造方法以及电子设备,其中所述通气通道弯曲地延伸,通过这样的方式,在利用所述密封介质密封所述通气通道时,所述密封介质不会流动到所述密封空间的内壁而导致所述密封空间的内部出现凹凸不平的不良现象,通过这样的方式,能够防止经由所述滤光元件进入所述密封空间的光线被影响,以保证所述摄像模组的成像品质。An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the ventilation passage is curvedly extended, in such a manner that the ventilation passage is sealed with the sealing medium At this time, the sealing medium does not flow to the inner wall of the sealed space, causing a defect in the inside of the sealed space, and in this way, entry into the sealed space through the filter element can be prevented. Light is affected to ensure the imaging quality of the camera module.
本发明的一个目的在于提供一摄像模组及其支座、感光装置和制造方法以及电子设备,其中所述支座具有至少一通气槽,在所述支座通过贴装介质被贴装于所述摄像模组的模塑基座时,所述通气槽在所述支座和所述模塑基座之间形成所述通气通道。An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the holder has at least one venting groove, and the holder is attached to the holder through a mounting medium. The venting groove forms the venting passage between the holder and the molding base when the pedestal of the camera module is molded.
本发明的一个目的在于提供一摄像模组及其支座、感光装置和制造方法以及电子设备,其中所述模塑基座具有至少一通气槽,在所述支座通过所述贴装介质被贴装于所述模塑基座时,所述通气槽在所述支座和所述模塑基座之间形成所述通气通道。An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the molding base has at least one venting groove through which the cradle is The venting groove forms the venting passage between the holder and the molded base when mounted on the molded base.
本发明的一个目的在于提供一摄像模组及其支座、感光装置和制造方法以及电子设备,其中所述支座具有至少一通气孔和至少一通气槽,所述通气孔和所述通气槽相互连通以形成所述通气通道,并且所述通气孔的延伸方向和所述通气槽的延伸方向不一致,这样,能够使所述通气通道弯曲地延伸。An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein the holder has at least one vent hole and at least one venting groove, and the vent hole and the venting groove are mutually Communicating to form the venting passage, and the extending direction of the vent hole does not coincide with the extending direction of the venting groove, such that the venting passage can be bently extended.
本发明的一个目的在于提供一摄像模组及其支座、感光装置和制造方法以及电子设备,其中所述通气槽的深度尺寸大于所述贴装介质的厚度尺寸,这样,在 进行烘烤工艺时,能够避免所述贴装介质受热膨胀时填满所述通气槽而堵塞所述通气通道的不良现象,从而通过保持所述通气孔和所述通气槽形成的所述通气通道畅通的方式保证所述密封空间内的气压压力和所述感光装置的外部的气压压力被保持平衡。An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein a depth dimension of the venting groove is larger than a thickness dimension of the mounting medium, so that a baking process is performed In this case, it is possible to avoid the problem that the venting channel is filled and the venting channel is blocked when the mounting medium is thermally expanded, thereby ensuring that the venting passage formed by the vent hole and the venting groove is unblocked. The pressure of the air pressure in the sealed space and the pressure of the outside of the photosensitive device are balanced.
本发明的一个目的在于提供一摄像模组及其支座、感光装置和制造方法以及电子设备,其中多个小尺寸的所述通气孔可以连通同一个所述通气槽而形成所述通气通道,通过这样的方式,小尺寸的所述通气孔能够阻止灰尘等污染物经由所述通气通道自外部环境进入所述密封空间而污染被保持在所述密封空间内的所述感光元件的感光区域和所述滤光元件的用于形成所述密封空间的部分的不良现象出现。An object of the present invention is to provide a camera module and a holder thereof, a photosensitive device and a manufacturing method thereof, and an electronic device, wherein a plurality of small-sized vent holes can communicate with the same one of the venting grooves to form the venting passage. In this manner, the small-sized vent hole can prevent contaminants such as dust from entering the sealed space from the external environment via the vent passage to contaminate the photosensitive region of the photosensitive member held in the sealed space and A problem of the portion of the filter element for forming the sealed space occurs.
依本发明的一个方面,本发明提供一摄像模组,其包括至少一光学镜头和至少一感光装置,其中所述感光装置包括:According to an aspect of the invention, the invention provides a camera module comprising at least one optical lens and at least one photosensitive device, wherein the photosensitive device comprises:
至少一滤光单元,其中所述滤光单元包括至少一支座和至少一滤光元件,所述支座具有至少一通光通道,所述滤光元件被贴装于所述支座,并且所述支座的所述通光通道对应于所述滤光元件;和At least one filter unit, wherein the filter unit comprises at least one seat and at least one filter element, the holder has at least one light passage, the filter element is mounted on the support, and The light passage of the holder corresponds to the filter element; and
至少一模塑感光单元,其中所述模塑感光单元进一步包括:At least one molded photosensitive unit, wherein the molded photosensitive unit further comprises:
至少一电路板,其中所述电路板包括至少一基板;At least one circuit board, wherein the circuit board includes at least one substrate;
至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域四周的一非感光区域,其中所述感光元件被导通地连接于所述基板;以及At least one photosensitive member, wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
至少一模塑基座,其中所述模塑基座具有至少一光窗,所述模塑基座一体地结合于所述基板,并且所述模塑基座环绕在所述感光元件的所述感光区域的四周,和所述感光元件的所述感光区域对应于所述模塑基座的所述光窗,其中所述支座被贴装于所述模塑基座的顶表面,并且在所述滤光单元和所述模塑感光单元之间形成至少一密封空间,所述感光元件的所述感光区域被保持在所述密封空间,其中所述光学镜头被保持在所述感光元件的感光路径,和所述滤光元件被保持在所述光学镜头和所述感光元件之间;At least one molded base, wherein the molded base has at least one light window, the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member a periphery of the photosensitive region, and the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein the holder is attached to a top surface of the molded base, and Forming at least one sealed space between the filter unit and the molded photosensitive unit, the photosensitive region of the photosensitive member being held in the sealed space, wherein the optical lens is held at the photosensitive element a photosensitive path, and the filter element is held between the optical lens and the photosensitive element;
其中所述感光装置具有至少一通气通道,所述通气通道用于连通所述密封空间和所述感光装置的外部,其中在所述感光装置被制造的过程中,所述通气通道用于使所述密封空间的内部的气体和所述感光装置的外部的气体交换,以平衡所述密封空间的内部的气压和所述感光装置的外部的气压。Wherein the photosensitive device has at least one venting passage for communicating the sealed space and the exterior of the photosensitive device, wherein the venting passage is used to make the venting passage during manufacture of the photosensitive device The gas inside the sealed space and the gas outside the photosensitive device are exchanged to balance the air pressure inside the sealed space and the air pressure outside the photosensitive device.
根据本发明的一个实施例,所述通气通道形成于所述支座;或者所述通气通道形成于所述模塑基座;或者所述通气通道形成于所述支座和所述模塑基座之间;或者所述通气通道的一部分形成于所述支座,另一部分形成于所述模塑基座和所述支座之间。According to an embodiment of the present invention, the venting passage is formed in the holder; or the venting passage is formed in the molding base; or the venting passage is formed in the holder and the molding base Between the seats; or a portion of the venting channel is formed in the pedestal and another portion is formed between the molded base and the pedestal.
根据本发明的一个实施例,所述通气通道弯曲地延伸;或者所述通气通道倾斜地延伸;或者所述通气通道的形状选择:“L”字形、“S”字形、“V”字形或者“Y”字形组成的形状组。According to an embodiment of the invention, the venting channel extends curvedly; or the venting channel extends obliquely; or the shape of the venting channel is selected: "L" shaped, "S" shaped, "V" shaped or " A group of shapes consisting of Y" shapes.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通气孔以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述通气孔自所述上表面向所述下表面方向延伸,所述通气槽形成于所述下表面,并且所述通气槽自所述内侧面向所述外侧面方向延伸,其中所述通气孔和所述通气槽相互连通以形成所述感光装置的所述通气通道。According to an embodiment of the present invention, the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one vent hole, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage a passage, wherein the vent hole extends from the upper surface toward the lower surface, the vent groove is formed on the lower surface, and the vent groove extends from the inner side toward the outer side direction, wherein The vent hole and the venting groove communicate with each other to form the venting passage of the photosensitive device.
根据本发明的一个实施例,所述通气孔的延伸方向和所述通气槽的延伸方向相互垂直。According to an embodiment of the invention, the extending direction of the vent hole and the extending direction of the vent groove are perpendicular to each other.
根据本发明的一个实施例,一个所述通气孔和一个所述通气槽相互连通以形成所述感光装置的所述通气通道;或者多个所述通气孔和一个所述通气槽相互连通以形成所述感光装置的所述通气通道;或者一个所述通气孔和多个所述通气槽相互连通以形成所述感光装置的所述通气通道。According to an embodiment of the present invention, one of the vent holes and one of the venting grooves communicate with each other to form the venting passage of the photosensitive device; or a plurality of the venting holes and one of the venting grooves communicate with each other to form The venting passage of the photosensitive device; or one of the venting holes and the plurality of venting grooves communicate with each other to form the venting passage of the photosensitive device.
根据本发明的一个实施例,所述通气槽呈阶梯状。According to an embodiment of the invention, the venting groove is stepped.
根据本发明的一个实施例,设所述支座的所述通气槽的深度尺寸的参数为h1,其中所述通气槽的深度尺寸的参数h1的取值范围是:h1≥0.1mm。According to an embodiment of the present invention, the parameter of the depth dimension of the venting groove of the pedestal is h1, wherein the parameter h1 of the depth dimension of the venting groove has a value range of: h1 ≥ 0.1 mm.
根据本发明的一个实施例,设所述支座的所述通气槽的深度尺寸的参数为h1,设所述支座的厚度尺寸的参数为H,其中所述通气槽的深度尺寸的参数h1和所述支座的厚度尺寸的参数H的比值的取值范围是:0.5%~70%。According to an embodiment of the present invention, the parameter of the depth dimension of the venting groove of the pedestal is h1, and the parameter of the thickness dimension of the pedestal is H, wherein the parameter h1 of the depth dimension of the venting groove The ratio of the ratio of the parameter H of the thickness dimension of the support is: 0.5% to 70%.
根据本发明的一个实施例,所述支座的所述通气槽具有一开口端和对应于所述开口端的一连通端,其中将所述通气槽的所述连通端的部分定义为一第一通气槽,将所述通气槽的所述开口端的部分定义为一第二通气槽,从而所述第一通气槽分别连通所述第二通气槽和所述通气孔,并且所述第二通气槽连通所述密封空间,其中所述第一通气槽的深度尺寸大于所述第二通气槽的深度尺寸。According to an embodiment of the present invention, the venting groove of the holder has an open end and a communicating end corresponding to the open end, wherein a portion of the communicating end of the venting groove is defined as a first venting a groove defining a portion of the open end of the venting groove as a second venting groove, such that the first venting groove communicates with the second venting groove and the venting hole, respectively, and the second venting groove is connected The sealed space, wherein a depth dimension of the first venting groove is greater than a depth dimension of the second venting groove.
根据本发明的一个实施例,所述支座的所述第一通气槽的深度尺寸为0.1mm,所述支座的所述第二通气槽的深度尺寸为0.03mm。According to an embodiment of the invention, the first venting groove of the holder has a depth dimension of 0.1 mm, and the second venting groove of the holder has a depth dimension of 0.03 mm.
根据本发明的一个实施例,设所述支座的所述第一通气槽的宽度尺寸的参数为W,设所述通气孔的低端的直径尺寸的参数为R,其中所述支座的所述第一通气槽的宽度尺寸与所述通气孔的低端的直径尺寸的比值的取值范围是:2:1~1:1。According to an embodiment of the present invention, the parameter of the width dimension of the first venting groove of the pedestal is W, and the parameter of the diameter dimension of the low end of the vent is R, wherein the pedestal The ratio of the width dimension of the first venting groove to the diameter dimension of the lower end of the vent hole ranges from 2:1 to 1:1.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述通气槽形成于所述下表面,并且所述通气槽自所述内侧面延伸至所述外侧面,其中在所述支座的所述下表面被贴装于所述模塑基座的所述顶表面后,所述通气槽在所述支座和所述模塑基座之间形成所述感光装置的所述通气通道。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein The venting groove is formed on the lower surface, and the venting groove extends from the inner side surface to the outer side surface, wherein the lower surface of the pedestal is attached to the molded base After the top surface is described, the venting groove forms the venting passage of the photosensitive device between the holder and the molded base.
根据本发明的一个实施例,所述通气槽弯曲地延伸。According to an embodiment of the invention, the venting groove extends in a curved manner.
根据本发明的一个实施例,所述通气槽的形状选自:“L”字形、“S”字 形、“V”字形以及“Y”字形组成的形状组。According to an embodiment of the invention, the shape of the venting groove is selected from the group consisting of: an "L" shape, an "S" shape, a "V" shape, and a "Y" shape.
根据本发明的一个实施例,所述支座具有至少一第一凹槽和至少一第二凹槽,所述第一凹槽自所述支座的所述内侧面向所述外侧面方向延伸,所述第二凹槽自所述支座的所述外侧面向所述内侧面方向延伸,并且所述第一凹槽和所述第二凹槽相互连通以形成所述支座的所述凹槽。According to an embodiment of the invention, the holder has at least one first groove and at least one second groove, the first groove extending from the inner side of the seat facing the outer side direction, The second groove extends from the outer side of the holder toward the inner side surface, and the first groove and the second groove communicate with each other to form the groove of the holder .
根据本发明的一个实施例,所述支座的所述第一凹槽的延伸方向和所述第二凹槽的延伸方向具有夹角。According to an embodiment of the invention, the extending direction of the first groove of the holder and the extending direction of the second groove have an included angle.
根据本发明的一个实施例,一个所述第一凹槽和一个所述第二凹槽相互连通以形成所述支座的所述凹槽;或者多个所述第一凹槽和一个所述第二凹槽相互连通以形成所述支座的所述凹槽;或者一个所述第一凹槽和多个所述第二凹槽相互连通以形成所述支座的所述凹槽。According to an embodiment of the present invention, one of the first groove and one of the second grooves communicate with each other to form the groove of the holder; or a plurality of the first groove and one of the The second grooves communicate with each other to form the grooves of the holder; or one of the first grooves and the plurality of the second grooves communicate with each other to form the grooves of the holder.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述下表面的靠近所述光窗的区域被界定为一非画胶区域,和所述下表面的远离所述光窗的区域被界定为环绕所述非画胶区域的一画胶区域,其中所述通气槽形成于所述下表面,并且所述通气槽自所述外侧面经由所述画胶区域延伸至所述非画胶区域的适当位置,其中在所述支座的所述下表面的所述画胶区域被贴装于所述模塑基座的所述顶表面后,所述通气槽在所述支座的所述下表面和所述模塑基座的所述顶表面之间形成所述感光装置的所述通气通道。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the lower surface adjacent to the light window is defined as a non-painting area, and an area of the lower surface remote from the light window is defined as a glue area surrounding the non-painting area, wherein The venting groove is formed on the lower surface, and the venting groove extends from the outer side surface via the glue area to a suitable position of the non-painting area, wherein the lower surface of the pedestal After the glue area is attached to the top surface of the molding base, the vent groove is on the lower surface of the holder and the top surface of the molding base Forming the venting passage of the photosensitive device
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述下表面的靠近所述光窗的区域被界定为一非画胶区域,和所述下表面的远离所述光窗的区域被界定为环绕所述非画胶区域的一画胶区域,其中所述通气孔自所述支座的所述上表面延伸至所述下表面的所述非画胶区域,其中所述支座的所述下表面的所述画胶区域被贴装于所述模塑基座的所述顶表面,所述支座的所述通气孔形成所述感光装置的所述通气通道。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer sides correspond to each other, and the inner side and the outer side extend upward and downward, respectively, to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein A region of the lower surface adjacent to the light window is defined as a non-painting region, and a region of the lower surface remote from the light window is defined as a glue region surrounding the non-painting region, wherein The venting hole extends from the upper surface of the holder to the non-painting area of the lower surface, wherein the glue area of the lower surface of the holder is attached to the mold The top surface of the plastic base, the venting opening of the holder forming the venting passage of the photosensitive device.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述通气槽形成于所述支座的所述上表面,并且所述通气槽自所述内侧面向所述外侧面方向延伸,其中所述滤光元件被贴装于所述支座的所述上表面,并且所述滤光元件使所述通气槽的一部分处于暴露状态,其中在所述支座的所述下表面被贴装于所述模塑基座的所述顶表面后,所述支座的所述通气槽在所述滤光元件和所述支座 之间形成所述感光装置的所述通气通道。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein a venting groove formed on the upper surface of the holder, and the venting groove extending from the inner side toward the outer side surface, wherein the filter element is mounted on the seat a surface, and the filter element exposes a portion of the venting groove, wherein after the lower surface of the pedestal is attached to the top surface of the molded base, the branch The venting groove of the seat forms the venting passage of the photosensitive device between the filter element and the holder.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述上表面的靠近所述光窗的区域被界定为一上表面内侧,和所述上表面的远离所述光窗的区域被界定为环绕在所述上表面内侧四周的一上表面外侧,其中所述内侧面具有一内侧面上侧和一内侧面下侧,所述内侧面上侧分别向上和向下延伸以连接于所述上表面外侧和所述上表面内侧,所述内侧面下侧分别向上和向下延伸以连接于所述上表面内侧和所述下表面,其中所述通气槽被设于所述上表面内侧,并且所述通气槽自所述内侧面下侧延伸至所述内侧面上侧,其中所述滤光元件被贴装于所述支座的所述上表面内侧,并且在所述滤光元件的侧壁和所述内侧面上侧之间形成一缝隙,所述支座的所述通气槽和所述缝隙相互连通以形成所述感光装置的所述通气通道,其中所述支座的所述下表面被贴装于所述模塑基座的所述顶表面。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the upper surface adjacent to the light window is defined as an inner side of the upper surface, and a region of the upper surface remote from the light window is defined to surround an outer surface of the upper surface of the upper surface, wherein The inner side surface has an inner side surface side and an inner side surface lower side, the inner side surface sides respectively extending upward and downward to be connected to the outer side of the upper surface and the inner side of the upper surface, the lower side of the inner side surface Extending upwardly and downwardly to connect to the inner side of the upper surface and the lower surface, wherein the venting groove is provided inside the upper surface, and the venting groove extends from the lower side of the inner side to the Inside An upper side, wherein the filter element is mounted inside the upper surface of the holder, and a gap is formed between a side wall of the filter element and the side of the inner side surface, the branch The venting groove of the seat and the slit communicate with each other to form the venting passage of the photosensitive device, wherein the lower surface of the holder is attached to the top surface of the molding base.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述上表面的靠近所述光窗的区域被界定为一上表面内侧,和所述上表面的远离所述光窗的区域被界定为环绕在所述上表面内侧四周的一上表面外侧,其中所述内侧面具有一内侧面上侧和一内侧面下侧,所述内侧面上侧分别向上和向下延伸以连接于所述上表面外侧和所述上表面内侧,所述内侧面下侧分别向上和向下延伸以连接于所述上表面内侧和所述下表面,其中所述通气孔自所述上表面内侧延伸至所述下表面,其中所述滤光元件被贴装于所述支座的所述上表面内侧,并且在所述滤光元件的侧壁和所述内侧面上侧之间形成一缝隙,所述支座的所述通气孔和所述缝隙相互连通以形成所述感光装置的所述通气通道,其中所述支座的所述下表面被贴装于所述模塑基座的所述顶表面。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer sides correspond to each other, and the inner side and the outer side extend upward and downward, respectively, to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the upper surface adjacent to the light window is defined as an inner side of the upper surface, and a region of the upper surface remote from the light window is defined to surround an outer surface of the upper surface of the upper surface, wherein The inner side surface has an inner side surface side and an inner side surface lower side, and the inner side surface side respectively extends upward and downward to be connected to the outer side of the upper surface and the inner side of the upper surface, respectively Extending upwardly and downwardly to connect to an inner side of the upper surface and the lower surface, wherein the vent extends from an inner side of the upper surface to the lower surface, wherein the filter element is attached to the branch seat Inside the upper surface, and forming a gap between the side wall of the filter element and the side of the inner side surface, the vent hole and the slit of the holder communicate with each other to form the photosensitive device The venting passage, wherein the lower surface of the pedestal is attached to the top surface of the molded base.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通气槽以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述上表面的靠近所述光窗的区域被界定为一上表面内侧,和所述上表面的远离所述光窗的区域被界定为环绕在所述上表面内侧四周的一上表面外侧,其中所述内侧面具有一内侧面上侧和一内侧面下侧,所述内侧面上侧分别向上和向下延伸以连接于所述上表面外侧和所述上表面内侧,所述内侧面下侧分别向上和向下延伸以连接于所述上表面内侧和所述下表面,其中所述通气槽自所述上表面外侧延伸至所述上表面内侧,所述通气孔自所述上表面内侧延伸至所述下表 面,并且所述通气孔和所述通气槽相互连通以形成所述感光装置的所述通气通道,其中所述滤光元件被贴装于所述支座的所述上表面内侧,所述支座的所述下表面被贴装于所述模塑基座的所述顶表面。According to an embodiment of the present invention, the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one venting groove, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage a channel, wherein a region of the upper surface adjacent to the light window is defined as an inner side of an upper surface, and a region of the upper surface remote from the light window is defined to surround an area around an inner side of the upper surface An outer side surface, wherein the inner side surface has an inner side surface side and an inner side surface lower side, the inner side surface sides respectively extending upward and downward to be coupled to the outer side of the upper surface and the inner side of the upper surface, The lower side of the inner side surface respectively extends upward and downward to be connected to the inner side of the upper surface and the lower surface, wherein the venting groove extends from the outer side of the upper surface to the inner side of the upper surface, the vent hole An inner side of the upper surface extends to the lower surface, and the vent hole and the venting groove communicate with each other to form the venting passage of the photosensitive device, wherein the filter element is attached to the holder On the inner side of the upper surface, the lower surface of the holder is attached to the top surface of the molded base.
根据本发明的一个实施例,所述支座包括一基座贴装部、一连接部以及一滤光片贴装部,所述连接部分别向上和向下延伸以连接于所述基座贴装部和所述滤光片贴装部,所述滤光片贴装部界定所述通光通道,所述滤光元件被贴装于所述支座的所述滤光片贴装部,并且在所述滤光元件的外壁和所述连接部之间形成一缝隙,其中所述支座的所述基座贴装部被贴装于所述模塑基座的所述顶表面,并且所述滤光片贴装部被保持在所述模塑基座的所述光窗,以使所述模塑基座环绕在所述支座的所述滤光片贴装部,其中所述支座具有至少一通光孔,其中所述通光孔自所述滤光片贴装部的上表面延伸至下表面,并且所述通光孔在所述滤光片贴装部的上表面连通所述缝隙,以形成所述感光装置的所述通气通道。According to an embodiment of the invention, the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder, And forming a slit between the outer wall of the filter element and the connecting portion, wherein the pedestal mounting portion of the holder is attached to the top surface of the molding base, and The filter mounting portion is held by the light window of the molding base such that the molding base surrounds the filter mounting portion of the holder, wherein The holder has at least one light passing hole, wherein the light passing hole extends from an upper surface to a lower surface of the filter mounting portion, and the light passing hole communicates with an upper surface of the filter mounting portion The slit to form the venting passage of the photosensitive device.
根据本发明的一个实施例,所述支座包括一基座贴装部、一连接部以及一滤光片贴装部,所述连接部分别向上和向下延伸以连接于所述基座贴装部和所述滤光片贴装部,所述滤光片贴装部界定所述通光通道,所述滤光元件被贴装于所述支座的所述滤光片贴装部,所述支座的所述基座贴装部被贴装于所述模塑基座的所述顶表面,并且所述滤光片贴装部被保持在所述模塑基座的所述光窗,以使所述模塑基座环绕在所述支座的所述滤光片贴装部,其中在所述模塑基座的基座内表面和所述支座的所述连接部之间形成一缝隙,其中所述支座具有至少一通光孔,其中所述通光孔自所述基座贴装部的上表面延伸至下表面,并且所述通光孔在所述基座贴装部的下表面连通所述缝隙,以形成所述感光装置的所述通气通道。According to an embodiment of the invention, the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder, The pedestal mounting portion of the holder is attached to the top surface of the molding base, and the filter mounting portion is held by the light of the molding base a window such that the molded base surrounds the filter mounting portion of the holder, wherein the base inner surface of the molded base and the connecting portion of the holder Forming a gap therebetween, wherein the holder has at least one light passing hole, wherein the light passing hole extends from an upper surface of the pedestal mounting portion to a lower surface, and the light passing hole is pasted on the pedestal A lower surface of the loading portion communicates with the slit to form the venting passage of the photosensitive device.
根据本发明的一个实施例,所述支座包括一基座贴装部、一连接部以及一滤光片贴装部,所述连接部分别向上和向下延伸以连接于所述基座贴装部和所述滤光片贴装部,所述滤光片贴装部界定所述通光通道,所述滤光元件被贴装于所述支座的所述滤光片贴装部,并且在所述滤光元件的外壁和所述连接部之间形成一缝隙,所述支座的所述基座贴装部被贴装于所述模塑基座的所述顶表面,并且所述滤光片贴装部被保持在所述模塑基座的所述光窗,以使所述模塑基座环绕在所述支座的所述滤光片贴装部,其中在所述模塑基座的基座内表面和所述支座的所述连接部之间形成另一缝隙,其中所述支座具有至少一通光孔,所述通光孔自所述连接部的一侧延伸至另一侧,以分别连通形成于所述滤光元件的外壁和所述连接部之间的所述缝隙和形成于所述模塑基座的基座内表面和所述滤光元件的外壁之间的所述缝隙,从而形成所述感光装置的所述通气通道。According to an embodiment of the invention, the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder, And forming a gap between the outer wall of the filter element and the connecting portion, the pedestal mounting portion of the holder being mounted on the top surface of the molding base, and The filter mounting portion is held in the light window of the molding base such that the molding base surrounds the filter mounting portion of the holder, wherein Forming another gap between the inner surface of the base of the molded base and the connecting portion of the holder, wherein the holder has at least one light passing hole, and the light passing hole is from one side of the connecting portion Extending to the other side to respectively communicate the gap formed between the outer wall of the filter element and the connecting portion and formed on the molded base The vent passage of the gap between the outer wall and the inner surface of said filter housing elements, thereby forming the photosensitive device.
根据本发明的一个实施例,所述模塑基座的所述顶表面具有至少一通气槽,所述通气槽自所述模塑基座的基座内表面延伸至基座外表面,以连通所述光窗和外部,其中在所述支座被贴装于所述模塑基座的所述顶表面后,所述通气槽在所述支座和所述模塑基座的所述顶表面之间形成所述感光装置的所述通气通道。According to an embodiment of the invention, the top surface of the molding base has at least one venting groove extending from the inner surface of the base of the molding base to the outer surface of the pedestal to communicate The light window and the exterior, wherein the venting groove is at the top of the holder and the molded base after the holder is attached to the top surface of the molding base The venting passage of the photosensitive device is formed between the surfaces.
根据本发明的一个实施例,所述模塑基座的所述通气槽弯曲地延伸。According to an embodiment of the invention, the venting groove of the molded base extends in a curved manner.
根据本发明的一个实施例,所述模塑基座的所述通气槽的形状选自:“L”字形、“S”字形、“V”字形以及“Y”字形组成的形状组。According to an embodiment of the invention, the shape of the venting groove of the molded base is selected from the group consisting of an "L" shape, an "S" shape, a "V" shape, and a "Y" shape.
根据本发明的一个实施例,所述模塑基座具有至少一第一凹槽和至少一第二凹槽,所述第一凹槽自所述模塑基座的所述基座内表面向所述基板外表面方向延伸,所述第二凹槽自所述模塑基座的所述基座外表面向所述基座内表面方向延伸,并且所述第一凹槽和所述第二凹槽相互连通以形成所述模塑基座的所述凹槽。According to an embodiment of the present invention, the molding base has at least one first groove and at least one second groove, the first groove is from the inner surface of the base of the molding base The outer surface of the substrate extends in a direction, the second groove extends from the outer surface of the base of the molding base toward the inner surface of the base, and the first groove and the second concave The slots communicate with each other to form the grooves of the molded base.
根据本发明的一个实施例,一个所述第一凹槽和一个所述第二凹槽相互连通以形成所述模塑基座的所述凹槽;或者一个所述第一凹槽和多个所述第二凹槽相互连通以形成所述模塑基座的所述凹槽;或者多个所述第一凹槽和一个所述第一凹槽相互连通以形成所述模塑基座的所述凹槽。According to an embodiment of the present invention, one of the first groove and one of the second grooves communicate with each other to form the groove of the molded base; or one of the first groove and a plurality of The second grooves communicate with each other to form the grooves of the molded base; or a plurality of the first grooves and one of the first grooves communicate with each other to form the molded base The groove.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述通气孔自所述支座的所述上表面延伸至所述下表面,其中所述模塑基座的所述顶表面具有至少一通气槽,所述通气槽自所述模塑基座的基座内表面向基座外表面方向延伸至适当位置,其中在所述支座的所述下表面被贴装于所述模塑基座的所述顶表面后,所述支座的所述通气孔和所述模塑基座的所述通气槽相互连通以形成所述感光装置的所述通气通道。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer side surfaces correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the vent hole being from the upper surface of the holder Extending to the lower surface, wherein the top surface of the molded base has at least one venting groove extending from the inner surface of the base of the molded base toward the outer surface of the base to a suitable a position wherein the venting opening of the holder and the ventilation of the molded base after the lower surface of the holder is attached to the top surface of the molding base The slots communicate with each other to form the venting passage of the photosensitive device.
根据本发明的一个实施例,所述模塑基座具有一第一凹槽和一第二凹槽,所述第一凹槽分别连通所述第二凹槽和所述通气孔,所述第二凹槽连通所述密封空间,其中所述第一凹槽的深度尺寸大于所述第二凹槽的深度尺寸。According to an embodiment of the invention, the molding base has a first groove and a second groove, the first groove respectively communicating the second groove and the vent, the first Two grooves communicate with the sealed space, wherein a depth dimension of the first groove is greater than a depth dimension of the second groove.
根据本发明的一个实施例,所述摄像模组进一步包括至少一密封元件,所述密封元件形成于和被保持在所述通气通道。According to an embodiment of the invention, the camera module further comprises at least one sealing element formed and held in the venting channel.
根据本发明的一个实施例,所述基板具有一基板正面、一基板背面以及至少一容纳空间,其中所述基板正面和所述基板背面相互对应,所述容纳空间自所述基板正面向所述基板背面方向延伸,其中所述感光装置被容纳于所述容纳空间。According to an embodiment of the present invention, the substrate has a substrate front surface, a substrate back surface, and at least one receiving space, wherein the substrate front surface and the substrate back surface correspond to each other, and the receiving space is from the front surface of the substrate toward the The substrate is extended in the back direction, wherein the photosensitive device is housed in the accommodation space.
根据本发明的一个实施例,所述基板具有一基板正面、一基板背面以及至少一容纳空间,其中所述基板正面和所述基板背面相互对应,所述容纳空间自所述基板正面延伸至所述基板背面,以连通所述基板正面和所述基板背面,其中所述感光元件的所述非感光区域被贴装于所述基板的所述基板背面,并且所述基板环绕在所述感光元件的所述感光区域的四周,以使所述感光元件的所述感光区域对应于所述基板的所述容纳空间。According to an embodiment of the present invention, the substrate has a substrate front surface, a substrate back surface, and at least one receiving space, wherein the substrate front surface and the substrate back surface correspond to each other, and the receiving space extends from the front surface of the substrate to the a back surface of the substrate to communicate the front surface of the substrate and the back surface of the substrate, wherein the non-photosensitive area of the photosensitive element is mounted on a back surface of the substrate of the substrate, and the substrate surrounds the photosensitive element The photosensitive region is circumferentially disposed such that the photosensitive region of the photosensitive member corresponds to the receiving space of the substrate.
根据本发明的一个实施例,所述模塑基座一体地结合于所述感光元件的所述非感光区域的至少一部分;或者所述模塑基座一体地结合于所述基板。According to an embodiment of the present invention, the molding base is integrally bonded to at least a portion of the non-photosensitive area of the photosensitive member; or the molding base is integrally bonded to the substrate.
根据本发明的一个实施例,所述电路板包括至少一电子元器件,所述电子元器件被导通地连接于所述基板,其中所述模塑基座包埋凸出于所述基板的所述基板正面的至少一个所述电子元器件的至少一部分。According to an embodiment of the invention, the circuit board comprises at least one electronic component, the electronic component being conductively connected to the substrate, wherein the molded base is embedded in the substrate At least a portion of at least one of the electronic components on the front side of the substrate.
依本发明的一个方面,本发明进一步提供一带有摄像模组的电子设备,其包括一设备本体和被设置于所述设备本体的至少一摄像模组,其中所述摄像模组包括至少一光学镜头和至少一感光装置,其中所述感光装置包括:According to an aspect of the present invention, the present invention further provides an electronic device with a camera module, comprising: a device body and at least one camera module disposed on the device body, wherein the camera module includes at least one optical a lens and at least one photosensitive device, wherein the photosensitive device comprises:
至少一滤光单元,其中所述滤光单元包括至少一支座和至少一滤光元件,所述支座具有至少一通光通道,所述滤光元件被贴装于所述支座,并且所述支座的所述通光通道对应于所述滤光元件;和At least one filter unit, wherein the filter unit comprises at least one seat and at least one filter element, the holder has at least one light passage, the filter element is mounted on the support, and The light passage of the holder corresponds to the filter element; and
至少一模塑感光单元,其中所述模塑感光单元进一步包括:At least one molded photosensitive unit, wherein the molded photosensitive unit further comprises:
至少一电路板,其中所述电路板包括至少一基板;At least one circuit board, wherein the circuit board includes at least one substrate;
至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域四周的一非感光区域,其中所述感光元件被导通地连接于所述基板;以及At least one photosensitive member, wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
至少一模塑基座,其中所述模塑基座具有至少一光窗,所述模塑基座一体地结合于所述基板,并且所述模塑基座环绕在所述感光元件的所述感光区域的四周,和所述感光元件的所述感光区域对应于所述模塑基座的所述光窗,其中所述支座被贴装于所述模塑基座的顶表面,并且在所述滤光单元和所述模塑感光单元之间形成至少一密封空间,所述感光元件的所述感光区域被保持在所述密封空间,其中所述光学镜头被保持在所述感光元件的感光路径,和所述滤光元件被保持在所述光学镜头和所述感光元件之间;At least one molded base, wherein the molded base has at least one light window, the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member a periphery of the photosensitive region, and the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein the holder is attached to a top surface of the molded base, and Forming at least one sealed space between the filter unit and the molded photosensitive unit, the photosensitive region of the photosensitive member being held in the sealed space, wherein the optical lens is held at the photosensitive element a photosensitive path, and the filter element is held between the optical lens and the photosensitive element;
其中所述感光装置具有至少一通气通道,所述通气通道用于连通所述密封空间和所述感光装置的外部,其中在所述感光装置被制造的过程中,所述通气通道用于使所述密封空间的内部的气体和所述感光装置的外部的气体交换,以平衡所述密封空间的内部的气压和所述感光装置的外部的气压。Wherein the photosensitive device has at least one venting passage for communicating the sealed space and the exterior of the photosensitive device, wherein the venting passage is used to make the venting passage during manufacture of the photosensitive device The gas inside the sealed space and the gas outside the photosensitive device are exchanged to balance the air pressure inside the sealed space and the air pressure outside the photosensitive device.
依本发明的另一个方面,本发明进一步提供一摄像模组,其包括至少一光学镜头和至少一感光装置,其中所述感光装置包括:According to another aspect of the present invention, the present invention further provides a camera module comprising at least one optical lens and at least one photosensitive device, wherein the photosensitive device comprises:
至少一滤光单元,其中所述滤光单元包括至少一支座和至少一滤光元件,其中所述支座具有至少一通光通道、至少一通气通道以及至少一第二通光空间,所述通光通道和所述通气通道分别连通所述第二通光空间,所述滤光元件被贴装于所述支座,并且所述支座的所述通光通道对应于所述滤光元件;和At least one filter unit, wherein the filter unit includes at least one seat and at least one filter element, wherein the support has at least one light passage, at least one ventilation passage, and at least one second light passage space, a light passing passage and the venting passage respectively communicate with the second light passing space, the filter element is attached to the pedestal, and the light passing passage of the pedestal corresponds to the filter element ;with
至少一模塑感光单元,其中所述模塑感光单元进一步包括:At least one molded photosensitive unit, wherein the molded photosensitive unit further comprises:
至少一电路板,其中所述电路板包括至少一基板;At least one circuit board, wherein the circuit board includes at least one substrate;
至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域四周的一非感光区域,其中所述感光元件被导通地连接于所述基板;以及At least one photosensitive member, wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
至少一模塑部,其中所述模塑部包括至少一模塑体和具有至少一第一通光空间,所述模塑体一体地结合于所述基板,并且所述模塑体形成至少所述第一通光空间,其中所述支座被贴装于所述模塑体,以使所述第一通光空间和所述第二通光空间相互连通而在所述滤光单元和所述模塑感光单元之间形成至少一密封空间,所述支座的所述通气通道用于连通所述密封空间和所 述感光装置的外部,其中所述感光元件的所述感光区域被保持在所述密封空间,其中所述光学镜头被保持在所述感光元件的感光路径,所述滤光元件被保持在所述光学镜头和所述感光元件之间。At least one molding portion, wherein the molding portion includes at least one molding body and has at least one first light passing space, the molding body is integrally bonded to the substrate, and the molding body forms at least a first light-passing space, wherein the holder is attached to the molded body such that the first light-passing space and the second light-passing space communicate with each other at the filter unit and the Forming at least one sealed space between the molded photosensitive units, the venting passage of the holder for communicating the sealed space and the outside of the photosensitive device, wherein the photosensitive region of the photosensitive member is held at The sealed space in which the optical lens is held in a photosensitive path of the photosensitive element, and the filter element is held between the optical lens and the photosensitive element.
根据本发明的一个实施例,所述支座包括一支座主体和一体地延伸于所述支座主体的至少一延伸臂,在所述支座主体和所述延伸臂之间形成所述第二通光空间,所述通光通道形成于所述支座主体,所述通气通道形成于所述延伸臂,其中所述支座的所述延伸臂被贴装于所述模塑部的所述模塑体。According to an embodiment of the present invention, the holder includes a seat body and at least one extension arm integrally extending from the holder body, and the first portion is formed between the holder body and the extension arm a light-passing passage formed in the holder body, the ventilation passage being formed in the extension arm, wherein the extension arm of the holder is attached to the molding portion The molded body is described.
根据本发明的一个实施例,所述支座包括至少一支座主体和一体地延伸于所述支座主体的至少一延伸臂,在所述支座主体和所述延伸臂之间形成所述第二通光空间和连通于所述第二通光空间的至少一第二安装空间,所述通光通道形成于所述支座主体,所述通气通道形成于所述延伸臂,其中在相邻所述模塑体之间形成至少一第一安装空间,其中在所述支座被贴装于所述模塑部时,所述支座的所述延伸臂的至少一部分被保持在所述模塑部的所述第一安装空间,所述模塑体的至少一部分被保持在所述支座的所述第二安装空间,以在所述滤光单元和所述模塑感光单元之间形成所述密封空间。According to an embodiment of the invention, the holder comprises at least a seat body and at least one extension arm integrally extending from the seat body, the formation being formed between the seat body and the extension arm a second light-passing space and at least one second installation space communicating with the second light-passing space, the light-passing passage is formed in the support body, and the ventilation passage is formed in the extension arm, wherein the phase is Forming at least one first installation space between adjacent molding bodies, wherein at least a portion of the extension arms of the holder are held in the holder when the holder is attached to the molding portion The first installation space of the molding portion, at least a portion of the molding body being held in the second installation space of the holder to be between the filter unit and the molded photosensitive unit The sealed space is formed.
根据本发明的一个实施例,所述模塑体呈“I”字形,所述延伸臂呈“匚”字形;或者所述模塑体呈“匚”字形,所述延伸臂呈“I”字形;或者所述模塑体呈“L”字形,所述延伸臂呈“L”字形;或者两个所述模塑体相互对称,两个所述延伸臂相互对称;或者所述模塑体和所述延伸臂均呈“口”字形。According to an embodiment of the invention, the molded body has an "I" shape, the extension arm has a U-shape; or the molded body has a U-shape, and the extension arm has an "I" shape. Or the molded body has an "L" shape, the extension arm has an "L" shape; or the two molded bodies are symmetrical to each other, and the two extension arms are symmetrical to each other; or the molded body and The extension arms are all in the shape of a "mouth".
根据本发明的一个实施例,所述通气通道倾斜地延伸。According to an embodiment of the invention, the ventilation channel extends obliquely.
依本发明的另一个方面,本发明进一步提供一带有摄像模组的电子设备,其包括一设备本体和至少一摄像模组,其中所述摄像模组至少一光学镜头和至少一感光装置,其中所述感光装置包括:According to another aspect of the present invention, the present invention further provides an electronic device with a camera module, comprising: a device body and at least one camera module, wherein the camera module has at least one optical lens and at least one photosensitive device, wherein The photosensitive device comprises:
至少一滤光单元,其中所述滤光单元包括至少一支座和至少一滤光元件,其中所述支座具有至少一通光通道、至少一通气通道以及至少一第二通光空间,所述通光通道和所述通气通道分别连通所述第二通光空间,所述滤光元件被贴装于所述支座,并且所述支座的所述通光通道对应于所述滤光元件;和At least one filter unit, wherein the filter unit includes at least one seat and at least one filter element, wherein the support has at least one light passage, at least one ventilation passage, and at least one second light passage space, a light passing passage and the venting passage respectively communicate with the second light passing space, the filter element is attached to the pedestal, and the light passing passage of the pedestal corresponds to the filter element ;with
至少一模塑感光单元,其中所述模塑感光单元进一步包括:At least one molded photosensitive unit, wherein the molded photosensitive unit further comprises:
至少一电路板,其中所述电路板包括至少一基板;At least one circuit board, wherein the circuit board includes at least one substrate;
至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域四周的一非感光区域,其中所述感光元件被导通地连接于所述基板;以及At least one photosensitive member, wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
至少一模塑部,其中所述模塑部包括至少一模塑体和具有至少一第一通光空间,所述模塑体一体地结合于所述基板,并且所述模塑体形成至少所述第一通光空间,其中所述支座被贴装于所述模塑体,以使所述第一通光空间和所述第二通光空间相互连通而在所述滤光单元和所述模塑感光单元之间形成至少一密封空间,所述支座的所述通气通道用于连通所述密封空间和所述感光装置的外部,其中所述感光元件的所述感光区域被保持在所述密封空 间,其中所述光学镜头被保持在所述感光元件的感光路径,所述滤光元件被保持在所述光学镜头和所述感光元件之间。At least one molding portion, wherein the molding portion includes at least one molding body and has at least one first light passing space, the molding body is integrally bonded to the substrate, and the molding body forms at least a first light-passing space, wherein the holder is attached to the molded body such that the first light-passing space and the second light-passing space communicate with each other at the filter unit and the Forming at least one sealed space between the molded photosensitive units, the venting passage of the holder for communicating the sealed space and the outside of the photosensitive device, wherein the photosensitive region of the photosensitive member is held at The sealed space in which the optical lens is held in a photosensitive path of the photosensitive element, and the filter element is held between the optical lens and the photosensitive element.
依本发明的另一个方面,本发明进一步提供一感光装置,其包括:According to another aspect of the present invention, the present invention further provides a photosensitive device comprising:
至少一滤光单元,其中所述滤光单元包括至少一支座和至少一滤光元件,所述支座具有至少一通光通道,所述滤光元件被贴装于所述支座,并且所述支座的所述通光通道对应于所述滤光元件;和At least one filter unit, wherein the filter unit comprises at least one seat and at least one filter element, the holder has at least one light passage, the filter element is mounted on the support, and The light passage of the holder corresponds to the filter element; and
至少一模塑感光单元,其中所述模塑感光单元进一步包括:At least one molded photosensitive unit, wherein the molded photosensitive unit further comprises:
至少一电路板,其中所述电路板包括至少一基板;At least one circuit board, wherein the circuit board includes at least one substrate;
至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域四周的一非感光区域,其中所述感光元件被导通地连接于所述基板;以及At least one photosensitive member, wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
至少一模塑基座,其中所述模塑基座具有至少一光窗,所述模塑基座一体地结合于所述基板,并且所述模塑基座环绕在所述感光元件的所述感光区域的四周,和所述感光元件的所述感光区域对应于所述模塑基座的所述光窗,其中所述支座被贴装于所述模塑基座的顶表面,并且在所述滤光单元和所述模塑感光单元之间形成至少一密封空间,所述感光元件的所述感光区域被保持在所述密封空间,所述滤光元件被保持在所述感光元件的感光路径;At least one molded base, wherein the molded base has at least one light window, the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member a periphery of the photosensitive region, and the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein the holder is attached to a top surface of the molded base, and Forming at least one sealed space between the filter unit and the molded photosensitive unit, the photosensitive region of the photosensitive member is held in the sealed space, and the filter element is held at the photosensitive member Photosensitive path
其中所述感光装置具有至少一通气通道,所述通气通道用于连通所述密封空间和所述感光装置的外部,其中在所述感光装置被制造的过程中,所述通气通道用于使所述密封空间的内部的气体和所述感光装置的外部的气体交换,以平衡所述密封空间的内部的气压和所述感光装置的外部的气压。Wherein the photosensitive device has at least one venting passage for communicating the sealed space and the exterior of the photosensitive device, wherein the venting passage is used to make the venting passage during manufacture of the photosensitive device The gas inside the sealed space and the gas outside the photosensitive device are exchanged to balance the air pressure inside the sealed space and the air pressure outside the photosensitive device.
根据本发明的一个实施例,所述通气通道形成于所述支座;或者所述通气通道形成于所述模塑基座;或者所述通气通道形成于所述支座和所述模塑基座之间;或者所述通气通道的一部分形成于所述支座,另一部分形成于所述模塑基座和所述支座之间。According to an embodiment of the present invention, the venting passage is formed in the holder; or the venting passage is formed in the molding base; or the venting passage is formed in the holder and the molding base Between the seats; or a portion of the venting channel is formed in the pedestal and another portion is formed between the molded base and the pedestal.
根据本发明的一个实施例,所述通气通道弯曲地延伸;或者所述通气通道倾斜地延伸;或者所述通气通道的形状选择:“L”字形、“S”字形、“V”字形或者“Y”字形组成的形状组。According to an embodiment of the invention, the venting channel extends curvedly; or the venting channel extends obliquely; or the shape of the venting channel is selected: "L" shaped, "S" shaped, "V" shaped or " A group of shapes consisting of Y" shapes.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通气孔以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述通气孔自所述上表面向所述下表面方向延伸,所述通气槽形成于所述下表面,并且所述通气槽自所述内侧面向所述外侧面方向延伸,其中所述通气孔和所述通气槽相互连通以形成所述感光装置的所述通气通道。According to an embodiment of the present invention, the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one vent hole, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage a passage, wherein the vent hole extends from the upper surface toward the lower surface, the vent groove is formed on the lower surface, and the vent groove extends from the inner side toward the outer side direction, wherein The vent hole and the venting groove communicate with each other to form the venting passage of the photosensitive device.
根据本发明的一个实施例,所述通气孔的延伸方向和所述通气槽的延伸方向相互垂直。According to an embodiment of the invention, the extending direction of the vent hole and the extending direction of the vent groove are perpendicular to each other.
根据本发明的一个实施例,一个所述通气孔和一个所述通气槽相互连通以形 成所述感光装置的所述通气通道;或者多个所述通气孔和一个所述通气槽相互连通以形成所述感光装置的所述通气通道;或者一个所述通气孔和多个所述通气槽相互连通以形成所述感光装置的所述通气通道。According to an embodiment of the present invention, one of the vent holes and one of the venting grooves communicate with each other to form the venting passage of the photosensitive device; or a plurality of the venting holes and one of the venting grooves communicate with each other to form The venting passage of the photosensitive device; or one of the venting holes and the plurality of venting grooves communicate with each other to form the venting passage of the photosensitive device.
根据本发明的一个实施例,所述通气槽呈阶梯状。According to an embodiment of the invention, the venting groove is stepped.
根据本发明的一个实施例,设所述支座的所述通气槽的深度尺寸的参数为h1,其中所述通气槽的深度尺寸的参数h1的取值范围是:h1≥0.1mm。According to an embodiment of the present invention, the parameter of the depth dimension of the venting groove of the pedestal is h1, wherein the parameter h1 of the depth dimension of the venting groove has a value range of: h1 ≥ 0.1 mm.
根据本发明的一个实施例,设所述支座的所述通气槽的深度尺寸的参数为h1,设所述支座的厚度尺寸的参数为H,其中所述通气槽的深度尺寸的参数h1和所述支座的厚度尺寸的参数H的比值的取值范围是:0.5%~70%。According to an embodiment of the present invention, the parameter of the depth dimension of the venting groove of the pedestal is h1, and the parameter of the thickness dimension of the pedestal is H, wherein the parameter h1 of the depth dimension of the venting groove The ratio of the ratio of the parameter H of the thickness dimension of the support is: 0.5% to 70%.
根据本发明的一个实施例,所述支座的所述通气槽具有一开口端和对应于所述开口端的一连通端,其中将所述通气槽的所述连通端的部分定义为一第一通气槽,将所述通气槽的所述开口端的部分定义为一第二通气槽,从而所述第一通气槽分别连通所述第二通气槽和所述通气孔,并且所述第二通气槽连通所述密封空间,其中所述第一通气槽的深度尺寸大于所述第二通气槽的深度尺寸。According to an embodiment of the present invention, the venting groove of the holder has an open end and a communicating end corresponding to the open end, wherein a portion of the communicating end of the venting groove is defined as a first venting a groove defining a portion of the open end of the venting groove as a second venting groove, such that the first venting groove communicates with the second venting groove and the venting hole, respectively, and the second venting groove is connected The sealed space, wherein a depth dimension of the first venting groove is greater than a depth dimension of the second venting groove.
根据本发明的一个实施例,所述支座的所述第一通气槽的深度尺寸为0.1mm,所述支座的所述第二通气槽的深度尺寸为0.03mm。According to an embodiment of the invention, the first venting groove of the holder has a depth dimension of 0.1 mm, and the second venting groove of the holder has a depth dimension of 0.03 mm.
根据本发明的一个实施例,设所述支座的所述第一通气槽的宽度尺寸的参数为W,设所述通气孔的低端的直径尺寸的参数为R,其中所述支座的所述第一通气槽的宽度尺寸与所述通气孔的低端的直径尺寸的比值的取值范围是:2:1~1:1。According to an embodiment of the present invention, the parameter of the width dimension of the first venting groove of the pedestal is W, and the parameter of the diameter dimension of the low end of the vent is R, wherein the pedestal The ratio of the width dimension of the first venting groove to the diameter dimension of the lower end of the vent hole ranges from 2:1 to 1:1.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述通气槽形成于所述下表面,并且所述通气槽自所述内侧面延伸至所述外侧面,其中在所述支座的所述下表面被贴装于所述模塑基座的所述顶表面后,所述通气槽在所述支座和所述模塑基座之间形成所述感光装置的所述通气通道。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein The venting groove is formed on the lower surface, and the venting groove extends from the inner side surface to the outer side surface, wherein the lower surface of the pedestal is attached to the molded base After the top surface is described, the venting groove forms the venting passage of the photosensitive device between the holder and the molded base.
根据本发明的一个实施例,所述通气槽弯曲地延伸。According to an embodiment of the invention, the venting groove extends in a curved manner.
根据本发明的一个实施例,所述通气槽的形状选自:“L”字形、“S”字形、“V”字形以及“Y”字形组成的形状组。According to an embodiment of the invention, the shape of the venting groove is selected from the group consisting of: an "L" shape, an "S" shape, a "V" shape, and a "Y" shape.
根据本发明的一个实施例,所述支座具有至少一第一凹槽和至少一第二凹槽,所述第一凹槽自所述支座的所述内侧面向所述外侧面方向延伸,所述第二凹槽自所述支座的所述外侧面像所述内侧面方向延伸,并且所述第一凹槽和所述第二凹槽相互连通以形成所述支座的所述凹槽。According to an embodiment of the invention, the holder has at least one first groove and at least one second groove, the first groove extending from the inner side of the seat facing the outer side direction, The second groove extends from the outer side surface of the holder like the inner side direction, and the first groove and the second groove communicate with each other to form the concave of the holder groove.
根据本发明的一个实施例,所述支座的所述第一凹槽的延伸方向和所述第二凹槽的延伸方向具有夹角。According to an embodiment of the invention, the extending direction of the first groove of the holder and the extending direction of the second groove have an included angle.
根据本发明的一个实施例,一个所述第一凹槽和一个所述第二凹槽相互连通以形成所述支座的所述凹槽;或者多个所述第一凹槽和一个所述第二凹槽相互连通以形成所述支座的所述凹槽;或者一个所述第一凹槽和多个所述第二凹槽相互 连通以形成所述支座的所述凹槽。According to an embodiment of the present invention, one of the first groove and one of the second grooves communicate with each other to form the groove of the holder; or a plurality of the first groove and one of the The second grooves communicate with each other to form the grooves of the holder; or one of the first grooves and the plurality of the second grooves communicate with each other to form the grooves of the holder.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述下表面的靠近所述光窗的区域被界定为一非画胶区域,和所述下表面的远离所述光窗的区域被界定为环绕所述非画胶区域的一画胶区域,其中所述通气槽形成于所述下表面,并且所述通气槽自所述外侧面经由所述画胶区域延伸至所述非画胶区域的适当位置,其中在所述支座的所述下表面的所述画胶区域被贴装于所述模塑基座的所述顶表面后,所述通气槽在所述支座的所述下表面和所述模塑基座的所述顶表面之间形成所述感光装置的所述通气通道。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the lower surface adjacent to the light window is defined as a non-painting area, and an area of the lower surface remote from the light window is defined as a glue area surrounding the non-painting area, wherein The venting groove is formed on the lower surface, and the venting groove extends from the outer side surface via the glue area to a suitable position of the non-painting area, wherein the lower surface of the pedestal After the glue area is attached to the top surface of the molding base, the vent groove is on the lower surface of the holder and the top surface of the molding base Forming the venting passage of the photosensitive device
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述下表面的靠近所述光窗的区域被界定为一非画胶区域,和所述下表面的远离所述光窗的区域被界定为环绕所述非画胶区域的一画胶区域,其中所述通气孔自所述支座的所述上表面延伸至所述下表面的所述非画胶区域,其中所述支座的所述下表面的所述画胶区域被贴装于所述模塑基座的所述顶表面,所述支座的所述通气孔形成所述感光装置的所述通气通道。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer sides correspond to each other, and the inner side and the outer side extend upward and downward, respectively, to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein A region of the lower surface adjacent to the light window is defined as a non-painting region, and a region of the lower surface remote from the light window is defined as a glue region surrounding the non-painting region, wherein The venting hole extends from the upper surface of the holder to the non-painting area of the lower surface, wherein the glue area of the lower surface of the holder is attached to the mold The top surface of the plastic base, the venting opening of the holder forming the venting passage of the photosensitive device.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述通气槽形成于所述支座的所述上表面,并且所述通气槽自所述内侧面向所述外侧面方向延伸,其中所述滤光元件被贴装于所述支座的所述上表面,并且所述滤光元件使所述通气槽的一部分处于暴露状态,其中在所述支座的所述下表面被贴装于所述模塑基座的所述顶表面后,所述支座的所述通气槽在所述滤光元件和所述支座之间形成所述感光装置的所述通气通道。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein a venting groove formed on the upper surface of the holder, and the venting groove extending from the inner side toward the outer side surface, wherein the filter element is mounted on the seat a surface, and the filter element exposes a portion of the venting groove, wherein after the lower surface of the pedestal is attached to the top surface of the molded base, the branch The venting groove of the seat forms the venting passage of the photosensitive device between the filter element and the holder.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述上表面的靠近所述光窗的区域被界定为一上表面内侧,和所述上表面的远离所述光窗的区域被界定为环绕在所述上表面内侧四周的一上表面外侧,其中所述内侧面具有一内侧面上侧和一内侧面下侧,所述内侧面上侧分别向上和向下延伸以连接于所述上表面外侧和所述上表面内侧,所述内侧面下侧分别向上和向下延伸以连接于所述上表面内侧和所述下表面,其中所述通气槽被设于所述上表面内侧,并且 所述通气槽自所述内侧面下侧延伸至所述内侧面上侧,其中所述滤光元件被贴装于所述支座的所述上表面内侧,并且在所述滤光元件的侧壁和所述内侧面上侧之间形成一缝隙,所述支座的所述通气槽和所述缝隙相互连通以形成所述感光装置的所述通气通道,其中所述支座的所述下表面被贴装于所述模塑基座的所述顶表面。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the upper surface adjacent to the light window is defined as an inner side of the upper surface, and a region of the upper surface remote from the light window is defined to surround an outer surface of the upper surface of the upper surface, wherein The inner side surface has an inner side surface side and an inner side surface lower side, the inner side surface sides respectively extending upward and downward to be connected to the outer side of the upper surface and the inner side of the upper surface, the lower side of the inner side surface Extending upwardly and downwardly to connect to the inner side of the upper surface and the lower surface, wherein the venting groove is provided inside the upper surface, and the venting groove extends from the lower side of the inner side to the Inside a face side, wherein the filter element is mounted inside the upper surface of the holder, and a gap is formed between a side wall of the filter element and the side of the inner side surface, The venting groove of the holder and the slit communicate with each other to form the venting passage of the photosensitive device, wherein the lower surface of the holder is attached to the top surface of the molding base .
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述上表面的靠近所述光窗的区域被界定为一上表面内侧,和所述上表面的远离所述光窗的区域被界定为环绕在所述上表面内侧四周的一上表面外侧,其中所述内侧面具有一内侧面上侧和一内侧面下侧,所述内侧面上侧分别向上和向下延伸以连接于所述上表面外侧和所述上表面内侧,所述内侧面下侧分别向上和向下延伸以连接于所述上表面内侧和所述下表面,其中所述通气孔自所述上表面内侧延伸至所述下表面,其中所述滤光元件被贴装于所述支座的所述上表面内侧,并且在所述滤光元件的侧壁和所述内侧面上侧之间形成一缝隙,所述支座的所述通气孔和所述缝隙相互连通以形成所述感光装置的所述通气通道,其中所述支座的所述下表面被贴装于所述模塑基座的所述顶表面。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer sides correspond to each other, and the inner side and the outer side extend upward and downward, respectively, to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the upper surface adjacent to the light window is defined as an inner side of the upper surface, and a region of the upper surface remote from the light window is defined to surround an outer surface of the upper surface of the upper surface, wherein The inner side surface has an inner side surface side and an inner side surface lower side, and the inner side surface side respectively extends upward and downward to be connected to the outer side of the upper surface and the inner side of the upper surface, respectively Extending upwardly and downwardly to connect to an inner side of the upper surface and the lower surface, wherein the vent extends from an inner side of the upper surface to the lower surface, wherein the filter element is attached to the branch seat Inside the upper surface, and forming a gap between the side wall of the filter element and the side of the inner side surface, the vent hole and the slit of the holder communicate with each other to form the photosensitive device The venting passage, wherein the lower surface of the pedestal is attached to the top surface of the molded base.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通气槽以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述上表面的靠近所述光窗的区域被界定为一上表面内侧,和所述上表面的远离所述光窗的区域被界定为环绕在所述上表面内侧四周的一上表面外侧,其中所述内侧面具有一内侧面上侧和一内侧面下侧,所述内侧面上侧分别向上和向下延伸以连接于所述上表面外侧和所述上表面内侧,所述内侧面下侧分别向上和向下延伸以连接于所述上表面内侧和所述下表面,其中所述通气槽自所述上表面外侧延伸至所述上表面内侧,所述通气孔自所述上表面内侧延伸至所述下表面,并且所述通气孔和所述通气槽相互连通以形成所述感光装置的所述通气通道,其中所述滤光元件被贴装于所述支座的所述上表面内侧,所述支座的所述下表面被贴装于所述模塑基座的所述顶表面。According to an embodiment of the present invention, the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one venting groove, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage a channel, wherein a region of the upper surface adjacent to the light window is defined as an inner side of an upper surface, and a region of the upper surface remote from the light window is defined to surround an area around an inner side of the upper surface An outer side surface, wherein the inner side surface has an inner side surface side and an inner side surface lower side, the inner side surface sides respectively extending upward and downward to be coupled to the outer side of the upper surface and the inner side of the upper surface, The lower side of the inner side surface respectively extends upward and downward to be connected to the inner side of the upper surface and the lower surface, wherein the venting groove extends from the outer side of the upper surface to the inner side of the upper surface, the vent hole An inner side of the upper surface extends to the lower surface, and the vent hole and the venting groove communicate with each other to form the venting passage of the photosensitive device, wherein the filter element is attached to the holder On the inner side of the upper surface, the lower surface of the holder is attached to the top surface of the molded base.
根据本发明的一个实施例,所述支座包括一基座贴装部、一连接部以及一滤光片贴装部,所述连接部分别向上和向下延伸以连接于所述基座贴装部和所述滤光片贴装部,所述滤光片贴装部界定所述通光通道,所述滤光元件被贴装于所述支座的所述滤光片贴装部,并且在所述滤光元件的外壁和所述连接部之间形成一缝隙,其中所述支座的所述基座贴装部被贴装于所述模塑基座的所述顶表面,并且所述滤光片贴装部被保持在所述模塑基座的所述光窗,以使所述模塑基座环绕在所述支座的所述滤光片贴装部,其中所述支座具有至少一通光孔,其中所述通 光孔自所述滤光片贴装部的上表面延伸至下表面,并且所述通光孔在所述滤光片贴装部的上表面连通所述缝隙,以形成所述感光装置的所述通气通道。According to an embodiment of the invention, the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder, And forming a slit between the outer wall of the filter element and the connecting portion, wherein the pedestal mounting portion of the holder is attached to the top surface of the molding base, and The filter mounting portion is held by the light window of the molding base such that the molding base surrounds the filter mounting portion of the holder, wherein The holder has at least one light passing hole, wherein the light passing hole extends from an upper surface to a lower surface of the filter mounting portion, and the light passing hole communicates with an upper surface of the filter mounting portion The slit to form the venting passage of the photosensitive device.
根据本发明的一个实施例,所述支座包括一基座贴装部、一连接部以及一滤光片贴装部,所述连接部分别向上和向下延伸以连接于所述基座贴装部和所述滤光片贴装部,所述滤光片贴装部界定所述通光通道,所述滤光元件被贴装于所述支座的所述滤光片贴装部,所述支座的所述基座贴装部被贴装于所述模塑基座的所述顶表面,并且所述滤光片贴装部被保持在所述模塑基座的所述光窗,以使所述模塑基座环绕在所述支座的所述滤光片贴装部,其中在所述模塑基座的基座内表面和所述支座的所述连接部之间形成一缝隙,其中所述支座具有至少一通光孔,其中所述通光孔自所述基座贴装部的上表面延伸至下表面,并且所述通光孔在所述基座贴装部的下表面连通所述缝隙,以形成所述感光装置的所述通气通道。According to an embodiment of the invention, the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder, The pedestal mounting portion of the holder is attached to the top surface of the molding base, and the filter mounting portion is held by the light of the molding base a window such that the molded base surrounds the filter mounting portion of the holder, wherein the base inner surface of the molded base and the connecting portion of the holder Forming a gap therebetween, wherein the holder has at least one light passing hole, wherein the light passing hole extends from an upper surface of the pedestal mounting portion to a lower surface, and the light passing hole is pasted on the pedestal A lower surface of the loading portion communicates with the slit to form the venting passage of the photosensitive device.
根据本发明的一个实施例,所述支座包括一基座贴装部、一连接部以及一滤光片贴装部,所述连接部分别向上和向下延伸以连接于所述基座贴装部和所述滤光片贴装部,所述滤光片贴装部界定所述通光通道,所述滤光元件被贴装于所述支座的所述滤光片贴装部,并且在所述滤光元件的外壁和所述连接部之间形成一缝隙,所述支座的所述基座贴装部被贴装于所述模塑基座的所述顶表面,并且所述滤光片贴装部被保持在所述模塑基座的所述光窗,以使所述模塑基座环绕在所述支座的所述滤光片贴装部,其中在所述模塑基座的基座内表面和所述支座的所述连接部之间形成另一缝隙,其中所述支座具有至少一通光孔,所述通光孔自所述连接部的一侧延伸至另一侧,以分别连通形成于所述滤光元件的外壁和所述连接部之间的所述缝隙和形成于所述模塑基座的基座内表面和所述滤光元件的外壁之间的所述缝隙,从而形成所述感光装置的所述通气通道。According to an embodiment of the invention, the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder, And forming a gap between the outer wall of the filter element and the connecting portion, the pedestal mounting portion of the holder being mounted on the top surface of the molding base, and The filter mounting portion is held in the light window of the molding base such that the molding base surrounds the filter mounting portion of the holder, wherein Forming another gap between the inner surface of the base of the molded base and the connecting portion of the holder, wherein the holder has at least one light passing hole, and the light passing hole is from one side of the connecting portion Extending to the other side to respectively communicate the gap formed between the outer wall of the filter element and the connecting portion and formed on the molded base The vent passage of the gap between the outer wall and the inner surface of said filter housing elements, thereby forming the photosensitive device.
根据本发明的一个实施例,所述模塑基座的所述顶表面具有至少一通气槽,所述通气槽自所述模塑基座的基座内表面延伸至基座外表面,以连通所述光窗和外部,其中在所述支座被贴装于所述模塑基座的所述顶表面后,所述通气槽在所述支座和所述模塑基座的所述顶表面之间形成所述感光装置的所述通气通道。According to an embodiment of the invention, the top surface of the molding base has at least one venting groove extending from the inner surface of the base of the molding base to the outer surface of the pedestal to communicate The light window and the exterior, wherein the venting groove is at the top of the holder and the molded base after the holder is attached to the top surface of the molding base The venting passage of the photosensitive device is formed between the surfaces.
根据本发明的一个实施例,所述模塑基座的所述通气槽弯曲地延伸。According to an embodiment of the invention, the venting groove of the molded base extends in a curved manner.
根据本发明的一个实施例,所述模塑基座的所述通气槽的形状选自:“L”字形、“S”字形、“V”字形以及“Y”字形组成的形状组。According to an embodiment of the invention, the shape of the venting groove of the molded base is selected from the group consisting of an "L" shape, an "S" shape, a "V" shape, and a "Y" shape.
根据本发明的一个实施例,所述模塑基座具有至少一第一凹槽和至少一第二凹槽,所述第一凹槽自所述模塑基座的所述基座内表面向所述基板外表面方向延伸,所述第二凹槽自所述模塑基座的所述基座外表面向所述基座内表面方向延伸,并且所述第一凹槽和所述第二凹槽相互连通以形成所述模塑基座的所述凹槽。According to an embodiment of the present invention, the molding base has at least one first groove and at least one second groove, the first groove is from the inner surface of the base of the molding base The outer surface of the substrate extends in a direction, the second groove extends from the outer surface of the base of the molding base toward the inner surface of the base, and the first groove and the second concave The slots communicate with each other to form the grooves of the molded base.
根据本发明的一个实施例,一个所述第一凹槽和一个所述第二凹槽相互连通以形成所述模塑基座的所述凹槽;或者一个所述第一凹槽和多个所述第二凹槽相互连通以形成所述模塑基座的所述凹槽;或者多个所述第一凹槽和一个所述第一 凹槽相互连通以形成所述模塑基座的所述凹槽。According to an embodiment of the present invention, one of the first groove and one of the second grooves communicate with each other to form the groove of the molded base; or one of the first groove and a plurality of The second grooves communicate with each other to form the grooves of the molded base; or a plurality of the first grooves and one of the first grooves communicate with each other to form the molded base The groove.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述通气孔自所述支座的所述上表面延伸至所述下表面,其中所述模塑基座的所述顶表面具有至少一通气槽,所述通气槽自所述模塑基座的基座内表面向基座外表面方向延伸至适当位置,其中在所述支座的所述下表面被贴装于所述模塑基座的所述顶表面后,所述支座的所述通气孔和所述模塑基座的所述通气槽相互连通以形成所述感光装置的所述通气通道。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer side surfaces correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the vent hole being from the upper surface of the holder Extending to the lower surface, wherein the top surface of the molded base has at least one venting groove extending from the inner surface of the base of the molded base toward the outer surface of the base to a suitable a position wherein the venting opening of the holder and the ventilation of the molded base after the lower surface of the holder is attached to the top surface of the molding base The slots communicate with each other to form the venting passage of the photosensitive device.
根据本发明的一个实施例,所述模塑基座具有一第一凹槽和一第二凹槽,所述第一凹槽分别连通所述第二凹槽和所述通气孔,所述第二凹槽连通所述密封空间,其中所述第一凹槽的深度尺寸大于所述第二凹槽的深度尺寸。According to an embodiment of the invention, the molding base has a first groove and a second groove, the first groove respectively communicating the second groove and the vent, the first Two grooves communicate with the sealed space, wherein a depth dimension of the first groove is greater than a depth dimension of the second groove.
根据本发明的一个实施例,所述摄像模组进一步包括至少一密封元件,所述密封元件形成于和被保持在所述通气通道。According to an embodiment of the invention, the camera module further comprises at least one sealing element formed and held in the venting channel.
根据本发明的一个实施例,所述基板具有一基板正面、一基板背面以及至少一容纳空间,其中所述基板正面和所述基板背面相互对应,所述容纳空间自所述基板正面向所述基板背面方向延伸,其中所述感光装置被容纳于所述容纳空间。According to an embodiment of the present invention, the substrate has a substrate front surface, a substrate back surface, and at least one receiving space, wherein the substrate front surface and the substrate back surface correspond to each other, and the receiving space is from the front surface of the substrate toward the The substrate is extended in the back direction, wherein the photosensitive device is housed in the accommodation space.
根据本发明的一个实施例,所述基板具有一基板正面、一基板背面以及至少一容纳空间,其中所述基板正面和所述基板背面相互对应,所述容纳空间自所述基板正面延伸至所述基板背面,以连通所述基板正面和所述基板背面,其中所述感光元件的所述非感光区域被贴装于所述基板的所述基板背面,并且所述基板环绕在所述感光元件的所述感光区域的四周,以使所述感光元件的所述感光区域对应于所述基板的所述容纳空间。According to an embodiment of the present invention, the substrate has a substrate front surface, a substrate back surface, and at least one receiving space, wherein the substrate front surface and the substrate back surface correspond to each other, and the receiving space extends from the front surface of the substrate to the a back surface of the substrate to communicate the front surface of the substrate and the back surface of the substrate, wherein the non-photosensitive area of the photosensitive element is mounted on a back surface of the substrate of the substrate, and the substrate surrounds the photosensitive element The photosensitive region is circumferentially disposed such that the photosensitive region of the photosensitive member corresponds to the receiving space of the substrate.
根据本发明的一个实施例,所述模塑基座一体地结合于所述感光元件的所述非感光区域的至少一部分;或者所述模塑基座一体地结合于所述基板。According to an embodiment of the present invention, the molding base is integrally bonded to at least a portion of the non-photosensitive area of the photosensitive member; or the molding base is integrally bonded to the substrate.
根据本发明的一个实施例,所述电路板包括至少一电子元器件,所述电子元器件被导通地连接于所述基板,其中所述模塑基座包埋凸出于所述基板的所述基板正面的至少一个所述电子元器件的至少一部分。According to an embodiment of the invention, the circuit board comprises at least one electronic component, the electronic component being conductively connected to the substrate, wherein the molded base is embedded in the substrate At least a portion of at least one of the electronic components on the front side of the substrate.
依本发明的另一个方面,本发明进一步提供一感光装置,其包括:According to another aspect of the present invention, the present invention further provides a photosensitive device comprising:
至少一滤光单元,其中所述滤光单元包括至少一支座和至少一滤光元件,其中所述支座具有至少一通光通道、至少一通气通道以及至少一第二通光空间,所述通光通道和所述通气通道分别连通所述第二通光空间,所述滤光元件被贴装于所述支座,并且所述支座的所述通光通道对应于所述滤光元件;和At least one filter unit, wherein the filter unit includes at least one seat and at least one filter element, wherein the support has at least one light passage, at least one ventilation passage, and at least one second light passage space, a light passing passage and the venting passage respectively communicate with the second light passing space, the filter element is attached to the pedestal, and the light passing passage of the pedestal corresponds to the filter element ;with
至少一模塑感光单元,其中所述模塑感光单元进一步包括:At least one molded photosensitive unit, wherein the molded photosensitive unit further comprises:
至少一电路板,其中所述电路板包括至少一基板;At least one circuit board, wherein the circuit board includes at least one substrate;
至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域四周的一非感光区域,其中所述感光元件被导通地连接于所述基板;以及At least one photosensitive member, wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
至少一模塑部,其中所述模塑部包括至少一模塑体和具有至少一第一通光空间,所述模塑体一体地结合于所述基板,并且所述模塑体形成至少所述第一通光空间,其中所述支座被贴装于所述模塑体,以使所述第一通光空间和所述第二通光空间相互连通而在所述滤光单元和所述模塑感光单元之间形成至少一密封空间,所述支座的所述通气通道用于连通所述密封空间和所述感光装置的外部,其中所述感光元件的所述感光区域被保持在所述密封空间,所述滤光元件被保持在所述感光元件的感光路径。At least one molding portion, wherein the molding portion includes at least one molding body and has at least one first light passing space, the molding body is integrally bonded to the substrate, and the molding body forms at least a first light-passing space, wherein the holder is attached to the molded body such that the first light-passing space and the second light-passing space communicate with each other at the filter unit and the Forming at least one sealed space between the molded photosensitive units, the venting passage of the holder for communicating the sealed space and the outside of the photosensitive device, wherein the photosensitive region of the photosensitive member is held at In the sealed space, the filter element is held in a photosensitive path of the photosensitive element.
根据本发明的一个实施例,所述支座包括一支座主体和一体地延伸于所述支座主体的至少一延伸臂,在所述支座主体和所述延伸臂之间形成所述第二通光空间,所述通光通道形成于所述支座主体,所述通气通道形成于所述延伸臂,其中所述支座的所述延伸臂被贴装于所述模塑部的所述模塑体。According to an embodiment of the present invention, the holder includes a seat body and at least one extension arm integrally extending from the holder body, and the first portion is formed between the holder body and the extension arm a light-passing passage formed in the holder body, the ventilation passage being formed in the extension arm, wherein the extension arm of the holder is attached to the molding portion The molded body is described.
根据本发明的一个实施例,所述支座包括至少一支座主体和一体地延伸于所述支座主体的至少一延伸臂,在所述支座主体和所述延伸臂之间形成所述第二通光空间和连通于所述第二通光空间的至少一第二安装空间,所述通光通道形成于所述支座主体,所述通气通道形成于所述延伸臂,其中在相邻所述模塑体之间形成至少一第一安装空间,其中在所述支座被贴装于所述模塑部时,所述支座的所述延伸臂的至少一部分被保持在所述模塑部的所述第一安装空间,所述模塑体的至少一部分被保持在所述支座的所述第二安装空间,以在所述滤光单元和所述模塑感光单元之间形成所述密封空间。According to an embodiment of the invention, the holder comprises at least a seat body and at least one extension arm integrally extending from the seat body, the formation being formed between the seat body and the extension arm a second light-passing space and at least one second installation space communicating with the second light-passing space, the light-passing passage is formed in the support body, and the ventilation passage is formed in the extension arm, wherein the phase is Forming at least one first installation space between adjacent molding bodies, wherein at least a portion of the extension arms of the holder are held in the holder when the holder is attached to the molding portion The first installation space of the molding portion, at least a portion of the molding body being held in the second installation space of the holder to be between the filter unit and the molded photosensitive unit The sealed space is formed.
根据本发明的一个实施例,所述模塑体呈“I”字形,所述延伸臂呈“匚”字形;或者所述模塑体呈“匚”字形,所述延伸臂呈“I”字形;或者所述模塑体呈“L”字形,所述延伸臂呈“L”字形;或者两个所述模塑体相互对称,两个所述延伸臂相互对称;或者所述模塑体和所述延伸臂均呈“口”字形。According to an embodiment of the invention, the molded body has an "I" shape, the extension arm has a U-shape; or the molded body has a U-shape, and the extension arm has an "I" shape. Or the molded body has an "L" shape, the extension arm has an "L" shape; or the two molded bodies are symmetrical to each other, and the two extension arms are symmetrical to each other; or the molded body and The extension arms are all in the shape of a "mouth".
依本发明的另一个方面,本发明进一步提供一支座,其中所述支座包括一内侧部和环绕在所述内侧部的四周的一外侧部,其中所述支座进一步具有至少一通光通道和至少一通气通道,所述内侧部界定所述通光通道,所述通气通道自所述外侧部延伸至所述内侧部,并且所述通气通道连通所述外侧部和所述内侧部。According to another aspect of the present invention, the present invention further provides a seat, wherein the holder includes an inner portion and an outer portion surrounding the inner portion, wherein the holder further has at least one light passage And at least one venting channel, the inner side portion defining the light passing passage, the venting passage extending from the outer side portion to the inner side portion, and the venting passage communicating the outer side portion and the inner side portion.
根据本发明的一个实施例,所述通气通道弯曲地延伸。According to an embodiment of the invention, the venting channel extends in a curved manner.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面以及一外侧面,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以被连接于所述上表面和所述下表面,其中所述上表面和所述外侧面形成所述外侧部的裸露面,所述下表面和所述内侧面形成所述内侧部的裸露面,其中所述通气通道自所述支座的所述上表面延伸至所述下表面。According to an embodiment of the invention, the support has an upper surface, a lower surface, an inner side and an outer side, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side Corresponding to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, wherein the upper surface and the outer side surface form a bareness of the outer side portion The lower surface and the inner side form an exposed surface of the inner portion, wherein the venting passage extends from the upper surface of the holder to the lower surface.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面以及一外侧面,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以被连接于所述上表面和所述下表面,其中所述上表面和所述外侧面形成所述外侧部的裸露面,所 述下表面和所述内侧面形成所述内侧部的裸露面,其中所述通气通道自所述支座的所述上表面延伸至所述支座的所述内侧面。According to an embodiment of the invention, the support has an upper surface, a lower surface, an inner side and an outer side, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side Corresponding to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, wherein the upper surface and the outer side surface form a bareness of the outer side portion The lower surface and the inner side form an exposed side of the inner side portion, wherein the venting passage extends from the upper surface of the seat to the inner side of the seat.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通气槽以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以被连接于所述上表面和所述下表面,其中所述上表面和所述外侧面形成所述外侧部的裸露面,所述下表面和所述内侧面形成所述内侧部的裸露面,其中所述通气孔自所述上表面向所述下表面方向延伸,所述通气槽形成于所述下表面,并且所述通气槽自所述内侧面向所述外侧面方向延伸,并且所述通气槽和所述通气孔相互连通以形成所述通气通道。According to an embodiment of the present invention, the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one venting groove, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, wherein the upper surface and the upper surface An outer side surface forms an exposed surface of the outer side portion, the lower surface and the inner side surface forming an exposed surface of the inner side portion, wherein the vent hole extends from the upper surface toward the lower surface direction, the ventilation A groove is formed in the lower surface, and the vent groove extends from the inner side toward the outer side direction, and the vent groove and the vent hole communicate with each other to form the vent passage.
根据本发明的一个实施例,所述通气槽具有一开口端和一连通端,所述通气槽在所述连通端的部分被定义为一第一通气槽,所述通气槽在所述开口端的部分被定义为一第二通气槽,从而所述第一通气槽连通所述通气孔和所述第二通气槽,并且所述第一通气槽的深度尺寸大于所述第二通气槽的深度尺寸。According to an embodiment of the present invention, the venting groove has an open end and a communicating end, a portion of the venting groove at the communicating end is defined as a first venting groove, and a portion of the venting groove at the open end It is defined as a second venting groove such that the first venting groove communicates with the venting hole and the second venting groove, and the first venting groove has a depth dimension greater than a depth dimension of the second venting groove.
根据本发明的一个实施例,设所述通气槽的深度尺寸的参数为h1,设所述支座的厚度尺寸的参数为H,其中所述通气槽的深度尺寸的参数h1和所述支座的厚度尺寸的参数H的比值的取值范围为:0.5%~70%。According to an embodiment of the present invention, the parameter of the depth dimension of the venting groove is h1, and the parameter of the thickness dimension of the pedestal is H, wherein the parameter h1 of the depth dimension of the venting groove and the pedestal The ratio of the parameter H of the thickness dimension is in the range of 0.5% to 70%.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面以及一外侧面,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以被连接于所述上表面和所述下表面,其中所述上表面和所述外侧面形成所述外侧部的裸露面,其中所述支座的所述上表面被用于贴装一滤光元件,或者所述支座的所述下表面被用于贴装所述滤光元件,并且在所述滤光元件被贴装于所述支座的所述上表面或者所述下表面后,所述支座的所述通光通道对应于所述滤光元件,从而所述滤光元件封闭所述支座的所述通光通道,其中所述支座的所述下表面被用于贴装一模塑感光单元,和所述支座的所述上表面被保持有组装有一光学镜头的一驱动器或者一镜筒,其中所述模塑感光单元包括:According to an embodiment of the invention, the support has an upper surface, a lower surface, an inner side and an outer side, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side Corresponding to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, wherein the upper surface and the outer side surface form a bareness of the outer side portion a surface, wherein the upper surface of the holder is used to mount a filter element, or the lower surface of the holder is used to mount the filter element, and the filter element After being attached to the upper surface or the lower surface of the holder, the light passage of the holder corresponds to the filter element, so that the filter element closes the holder The light passage, wherein the lower surface of the holder is used to mount a molded photosensitive unit, and the upper surface of the holder is held by a driver or a mirror in which an optical lens is assembled a cartridge, wherein the molded photosensitive unit comprises:
至少一电子元器件;At least one electronic component;
至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域的四周的一非感光区域;At least one photosensitive element, wherein the photosensitive element has a photosensitive area and a non-sensitive area surrounding the photosensitive area;
至少一电路板,其中所述电路板包括一基板和被连接于所述基板的基板正面或者基板背面的一连接板,其中所述连接板为柔性连接板,以供连接于一设备本体而形成一电子设备,其中所述感光元件通过一组连接线被导通地连接于所述基板,或者所述感光元件通过被贴装于所述基板的方式被导通地连接于所述基板,所述电子元器件被贴装于或者半埋入所述基板的所述基板正面和/或所述基板背面;以及At least one circuit board, wherein the circuit board includes a substrate and a connecting board connected to the front surface of the substrate or the back surface of the substrate, wherein the connecting board is a flexible connecting board for connecting to a device body to form An electronic device, wherein the photosensitive element is electrically connected to the substrate through a set of connecting lines, or the photosensitive element is electrically connected to the substrate by being attached to the substrate, The electronic component is mounted on or partially embedded in the front surface of the substrate and/or the back surface of the substrate;
一模塑基座,其中所述模塑基座具有至少一光窗,其中所述模塑基座一体地结合于所述基板的所述基板正面,或者所述模塑基座一体地结合于所述基板的所 述基板正面和所述感光元件的所述非感光区域的一部分,或者所述模塑基座一体地结合所述基板的所述基板正面和所述电子元器件,或者所述模塑基座一体地结合于所述基板的所述基板正面和所述电子元器件和所述感光元件的所述非感光区域的一部分,并且所述模塑基座环绕在所述感光元件的所述感光区域的四周,以使所述感光元件的所述感光区域对应于所述模塑基座的所述光窗,其中所述支座的所述下表面被贴装于所述模塑基座的顶表面,以使所述滤光元件被保持在所述感光元件的感光路径,其中所述驱动器或者所述镜筒被贴装于所述支座的所述上表面,或者所述驱动器或者所述镜筒被贴装于所述模塑基座的所述顶表面,以使所述光学镜头被保持在所述感光元件的感光路径,并且所述滤光元件被保持在所述光学镜头和所述感光元件之间。a molded base, wherein the molded base has at least one light window, wherein the molded base is integrally bonded to the front surface of the substrate of the substrate, or the molded base is integrally bonded to a front side of the substrate of the substrate and a portion of the non-photosensitive area of the photosensitive element, or the molded base integrally bonding the front surface of the substrate and the electronic component, or a molding base integrally bonded to a front surface of the substrate of the substrate and a portion of the non-photosensitive region of the electronic component and the photosensitive member, and the molded base surrounds the photosensitive member The photosensitive region is circumferentially disposed such that the photosensitive region of the photosensitive member corresponds to the light window of the molding base, wherein the lower surface of the holder is attached to the molding a top surface of the susceptor such that the filter element is held in a photosensitive path of the photosensitive element, wherein the driver or the lens barrel is attached to the upper surface of the holder, or The driver or the lens barrel is mounted on The top surface of the molding base is such that the optical lens is held in a photosensitive path of the photosensitive member, and the filter element is held between the optical lens and the photosensitive member.
依本发明的另一个方面,本发明进一步提供一感光装置,其包括:According to another aspect of the present invention, the present invention further provides a photosensitive device comprising:
至少一滤光元件;At least one filter element;
至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域的四周的一非感光区域;At least one photosensitive element, wherein the photosensitive element has a photosensitive area and a non-sensitive area surrounding the photosensitive area;
至少一支座,其中所述支座包括一内侧部和环绕在所述内侧部的四周的一外侧部,其中所述支座进一步具有至少一通光通道和至少一通气通道,所述内侧部界定所述通光通道,所述通气通道自所述外侧部延伸至所述内侧部,并且所述通气通道连通所述外侧部和所述内侧部,其中所述滤光元件被贴装于所述支座的所述外侧部或者所述内侧部,并且所述支座的所述通光通道对应于所述滤光元件;At least one seat, wherein the support includes an inner portion and an outer portion surrounding the inner portion, wherein the support further has at least one light passage and at least one air passage, the inner portion defining The light passage, the ventilation passage extending from the outer portion to the inner portion, and the ventilation passage communicating with the outer portion and the inner portion, wherein the filter element is attached to the The outer side portion or the inner side portion of the holder, and the light passing passage of the holder corresponds to the filter element;
至少一电路板,其中所述电路板具有至少一基板,其中所述感光元件被导通地连接于所述基板;以及At least one circuit board, wherein the circuit board has at least one substrate, wherein the photosensitive element is conductively connected to the substrate;
至少一模塑基座,其中所述模塑基座具有至少一光窗,其中所述模塑基座一体地结合于所述基板,并且所述模塑基座环绕在所述感光元件的所述感光区域的四周,以使所述感光元件的所述感光区域对应于所述模塑基座的所述光窗,其中所述支座的所述内侧部的至少一部分被贴装于所述模塑基座的顶表面,或者所述支座的所述外侧部的至少一部分被贴装于所述模塑基座的顶表面,以在所述滤光元件、所述支座、所述基板、所述模塑基座之间形成至少一密封空间,其中所述感光元件被保持在所述密封空间,其中所述支座的所述通气通道用于连通所述密封空间和所述感光装置的外部。At least one molded base, wherein the molded base has at least one light window, wherein the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member The periphery of the photosensitive region is such that the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein at least a portion of the inner portion of the holder is attached to the A top surface of the molded base, or at least a portion of the outer portion of the holder is attached to a top surface of the molded base to be in the filter element, the holder, the Forming at least one sealed space between the substrate and the molded base, wherein the photosensitive element is held in the sealed space, wherein the ventilation passage of the holder is for communicating the sealed space and the photosensitive The outside of the device.
依本发明的另一个方面,本发明进一步提供一摄像模组,其包括至少一光学镜头和至少一感光装置,其中所述感光装置进一步包括:According to another aspect of the present invention, the present invention further provides a camera module comprising at least one optical lens and at least one photosensitive device, wherein the photosensitive device further comprises:
至少一滤光元件;At least one filter element;
至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域的四周的一非感光区域;At least one photosensitive element, wherein the photosensitive element has a photosensitive area and a non-sensitive area surrounding the photosensitive area;
至少一支座,其中所述支座包括一内侧部和环绕在所述内侧部的四周的一外侧部,其中所述支座进一步具有至少一通光通道和至少一通气通道,所述内侧部界定所述通光通道,所述通气通道自所述外侧部延伸至所述内侧部,并且所述通气通道连通所述外侧部和所述内侧部,其中所述滤光元件被贴装于所述支座的所 述外侧部或者所述内侧部,并且所述支座的所述通光通道对应于所述滤光元件;At least one seat, wherein the support includes an inner portion and an outer portion surrounding the inner portion, wherein the support further has at least one light passage and at least one air passage, the inner portion defining The light passage, the ventilation passage extending from the outer portion to the inner portion, and the ventilation passage communicating with the outer portion and the inner portion, wherein the filter element is attached to the The outer side portion or the inner side portion of the holder, and the light passing passage of the holder corresponds to the filter element;
至少一电路板,其中所述电路板具有至少一基板,其中所述感光元件被导通地连接于所述基板;以及At least one circuit board, wherein the circuit board has at least one substrate, wherein the photosensitive element is conductively connected to the substrate;
至少一模塑基座,其中所述模塑基座具有至少一光窗,其中所述模塑基座一体地结合于所述基板,并且所述模塑基座环绕在所述感光元件的所述感光区域的四周,以使所述感光元件的所述感光区域对应于所述模塑基座的所述光窗,其中所述支座的所述内侧部的至少一部分被贴装于所述模塑基座的顶表面,或者所述支座的所述外侧部的至少一部分被贴装于所述模塑基座的顶表面,以在所述滤光元件、所述支座、所述基板、所述模塑基座之间形成至少一密封空间,其中所述感光元件被保持在所述密封空间,其中所述支座的所述通气通道用于连通所述密封空间和所述感光装置的外部,其中所述光学镜头被保持在所述感光装置的所述感光元件的感光路径,并且所述滤光元件被保持在所述光学镜头和所述感光元件之间。At least one molded base, wherein the molded base has at least one light window, wherein the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member The periphery of the photosensitive region is such that the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein at least a portion of the inner portion of the holder is attached to the A top surface of the molded base, or at least a portion of the outer portion of the holder is attached to a top surface of the molded base to be in the filter element, the holder, the Forming at least one sealed space between the substrate and the molded base, wherein the photosensitive element is held in the sealed space, wherein the ventilation passage of the holder is for communicating the sealed space and the photosensitive An exterior of the apparatus, wherein the optical lens is held in a photosensitive path of the photosensitive member of the photosensitive device, and the filter element is held between the optical lens and the photosensitive element.
依本发明的另一个方面,本发明进一步提供一支座,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通气槽以及至少一通光通道,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面用于界定所述通光通道,其中所述下表面的靠近所述光窗的区域被界定为一非画胶区域,所述下表面的远离所述光窗的区域被界定为环绕在所述非画胶区域四周的一画胶区域,并且所述非画胶区域向内延伸以连接所述内侧面,所述画胶区域向外延伸以连接所述外侧面,其中所述通气槽设于所述下表面,并且所述通气槽经由所述画胶区域自所述外侧面向所述内侧面方向延伸至所述非画胶区域的适当位置。According to another aspect of the present invention, the present invention further provides a stand, wherein the stand has an upper surface, a lower surface, an inner side, an outer side, at least one venting groove, and at least one light passage, wherein The upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface The inner side surface is for defining the light passing passage, wherein a region of the lower surface close to the light window is defined as a non-painting area, and an area of the lower surface away from the light window is defined a rubberized area surrounding the non-painting area, and the non-painting area extends inwardly to connect the inner side, the glue area extending outward to connect the outer side, wherein The venting groove is disposed on the lower surface, and the venting groove extends from the outer side surface toward the inner side surface to an appropriate position of the non-painting area via the glue area.
依本发明的另一个方面,本发明进一步提供一支座,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通气槽以及至少一通光通道,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面用于界定所述通光通道,其中所述下表面的靠近所述光窗的区域被界定为一非画胶区域,所述下表面的远离所述光窗的区域被界定为环绕在所述非画胶区域四周的一画胶区域,并且所述非画胶区域向内延伸以连接所述内侧面,所述画胶区域向外延伸以连接所述外侧面,其中所述通气槽设于所述下表面,并且所述通气槽依次经由所述画胶区域和所述非画胶区域自所述外侧面延伸至所述内侧面。According to another aspect of the present invention, the present invention further provides a stand, wherein the stand has an upper surface, a lower surface, an inner side, an outer side, at least one venting groove, and at least one light passage, wherein The upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface The inner side surface is for defining the light passing passage, wherein a region of the lower surface close to the light window is defined as a non-painting area, and an area of the lower surface away from the light window is defined a rubberized area surrounding the non-painting area, and the non-painting area extends inwardly to connect the inner side, the glue area extending outward to connect the outer side, wherein The venting groove is disposed on the lower surface, and the venting groove extends from the outer side surface to the inner side surface via the glue area and the non-painting area in sequence.
依本发明的另一个方面,本发明进一步提供一支座,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通气槽以及至少一通光通道,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面用于界定所述通光通道,其中所述通气槽被设于所述外侧面,并 且所述通气槽自所述上表面延伸至所述下表面。According to another aspect of the present invention, the present invention further provides a stand, wherein the stand has an upper surface, a lower surface, an inner side, an outer side, at least one venting groove, and at least one light passage, wherein The upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface The inner side surface is for defining the light passage passage, wherein the ventilation groove is provided on the outer side surface, and the ventilation groove extends from the upper surface to the lower surface.
根据本发明的一个实施例,在所述支座的所述外侧面被贴装于一模塑基座的基座内表面后,所述通气槽在所述支座的所述外侧面和所述模塑基座的所述基座内表面之间形成至少一通气通道。According to an embodiment of the present invention, after the outer side of the holder is attached to the inner surface of the base of a molded base, the venting groove is on the outer side of the holder and At least one venting channel is formed between the inner surfaces of the pedestals of the molded pedestal.
依本发明的另一个方面,本发明进一步提供一支座,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通气槽以及至少一通光通道,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面用于界定所述通光通道,其中所述通气槽设于所述上表面,并且所述通气槽自所述内侧面向所述外侧面方向延伸至适当位置。According to another aspect of the present invention, the present invention further provides a stand, wherein the stand has an upper surface, a lower surface, an inner side, an outer side, at least one venting groove, and at least one light passage, wherein The upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface The inner side surface is for defining the light passage passage, wherein the ventilation groove is disposed on the upper surface, and the ventilation groove extends from the inner side toward the outer side direction to an appropriate position.
依本发明的另一个方面,本发明进一步提供一支座,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通气槽以及至少一通光通道,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面用于界定所述通光通道,其中所述通气槽设于所述上表面,并且所述通气槽自所述内侧面延伸至所述外侧面。According to another aspect of the present invention, the present invention further provides a stand, wherein the stand has an upper surface, a lower surface, an inner side, an outer side, at least one venting groove, and at least one light passage, wherein The upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface The inner side is for defining the light passage, wherein the ventilation groove is disposed on the upper surface, and the ventilation groove extends from the inner side to the outer side.
依本发明的另一个方面,本发明进一步提供一支座,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通气槽以及至少一通光通道,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面用于界定所述通光通道,其中所述上表面的靠近所述光窗的部分被界定为一上表面内侧,所述上表面的远离所述光窗的部分被界定为环绕在所述上表面内侧四周的一上表面外侧,其中所述内侧面的靠近所述上表面的部分被界定为一内侧面上侧,所述内侧面的靠近所述下表面的部分被界定为一内侧面下侧,其中所述内侧面上侧向上和向下延伸以连接于所述上表面外侧和所述上表面内侧,所述内侧面下侧向上和向下延伸以连接于所述上表面内侧和所述下表面,所述上表面内侧向内和向外延伸以连接于所述内侧面下侧和所述内侧面上侧,所述上表面外侧向内和向外延伸以连接于所述内侧面上侧和所述外侧面,其中所述通气槽被设于所述上表面内侧,并且所述通气槽自所述内侧面下侧延伸至所述内侧面上侧。According to another aspect of the present invention, the present invention further provides a stand, wherein the stand has an upper surface, a lower surface, an inner side, an outer side, at least one venting groove, and at least one light passage, wherein The upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface The inner side surface is for defining the light passage, wherein a portion of the upper surface adjacent to the light window is defined as an inner side of an upper surface, and a portion of the upper surface remote from the light window is defined as Surrounding an outer surface of the upper surface of the upper surface, wherein a portion of the inner side near the upper surface is defined as an inner side surface, and a portion of the inner side near the lower surface is defined An inner side lower side, wherein the inner side surface extends upwardly and downwardly to be coupled to the outer side of the upper surface and the inner side of the upper surface, the lower side of the inner side extending upward and downward to be connected to the An inner side of the upper surface and an inner surface of the lower surface extending inwardly and outwardly to be coupled to the inner side lower side and the inner side upper side, the upper surface outer side extending inwardly and outwardly to connect The inner side surface and the outer side surface, wherein the vent groove is provided inside the upper surface, and the vent groove extends from the inner side lower side to the inner side surface side.
依本发明的另一个方面,本发明进一步提供一支座,其中所述通气槽弯曲地延伸。According to another aspect of the invention, the invention further provides a stand wherein the venting groove extends in a curved manner.
根据本发明的一个实施例,在所述支座的所述画胶区域被贴装于一模塑基座的顶表面后,所述通气槽在所述支座的所述下表面和所述模塑基座的顶表面之间形成至少一通气通道。According to an embodiment of the present invention, after the glue area of the holder is mounted on a top surface of a molded base, the vent groove is on the lower surface of the holder and the At least one venting passage is formed between the top surfaces of the molded base.
根据本发明的一个实施例,在一滤光元件被贴装于所述支座的所述上表面后,所述通气槽在所述滤光元件和所述支座的所述上表面之间形成至少一通气通道。According to an embodiment of the present invention, after a filter element is attached to the upper surface of the holder, the venting groove is between the filter element and the upper surface of the holder At least one venting channel is formed.
依本发明的另一个方面,本发明进一步提供一感光装置,其包括:According to another aspect of the present invention, the present invention further provides a photosensitive device comprising:
至少一密封元件;At least one sealing element;
至少一滤光单元,其中所述滤光单元包括至少一支座和至少一滤光元件,所述支座具有至少一通光通道,所述滤光元件被贴装于所述支座,并且所述支座的所述通光通道对应于所述滤光元件;以及At least one filter unit, wherein the filter unit comprises at least one seat and at least one filter element, the holder has at least one light passage, the filter element is mounted on the support, and The light passage of the holder corresponds to the filter element;
至少一模塑感光单元,其中所述模塑感光单元进一步包括:At least one molded photosensitive unit, wherein the molded photosensitive unit further comprises:
至少一电路板,其中所述电路板包括至少一基板;At least one circuit board, wherein the circuit board includes at least one substrate;
至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域四周的一非感光区域,其中所述感光元件被导通地连接于所述基板;以及At least one photosensitive member, wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
至少一模塑基座,其中所述模塑基座具有至少一光窗,所述模塑基座一体地结合于所述基板,并且所述模塑基座环绕在所述感光元件的所述感光区域的四周,和所述感光元件的所述感光区域对应于所述模塑基座的所述光窗,其中所述支座被贴装于所述模塑基座的顶表面,并且在所述滤光单元和所述模塑感光单元之间形成至少一密封空间,所述感光元件的所述感光区域被保持在所述密封空间;At least one molded base, wherein the molded base has at least one light window, the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member a periphery of the photosensitive region, and the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein the holder is attached to a top surface of the molded base, and Forming at least one sealed space between the filter unit and the molded photosensitive unit, the photosensitive region of the photosensitive element being held in the sealed space;
其中所述感光装置具有至少一通气通道,所述通气通道用于连通所述密封空间和所述感光装置的外部,其中在所述感光装置被制造的过程中,所述通气通道用于使所述密封空间的内部的气体和所述感光装置的外部的气体交换,以平衡所述密封空间的内部的气压和所述感光装置的外部的气压,其中所述密封元件被保持在所述通气通道。Wherein the photosensitive device has at least one venting passage for communicating the sealed space and the exterior of the photosensitive device, wherein the venting passage is used to make the venting passage during manufacture of the photosensitive device Gas exchange between the gas inside the sealed space and the outside of the photosensitive device to balance the air pressure inside the sealed space and the air pressure outside the photosensitive device, wherein the sealing member is held in the ventilation passage .
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通气孔以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述通气孔自所述上表面向所述下表面方向延伸,所述通气槽形成于所述下表面,并且所述通气槽自所述内侧面向所述外侧面方向延伸,其中所述通气孔和所述通气槽相互连通以形成所述感光装置的所述通气通道,其中所述密封元件被保持在所述通气孔。According to an embodiment of the present invention, the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one vent hole, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage a passage, wherein the vent hole extends from the upper surface toward the lower surface, the vent groove is formed on the lower surface, and the vent groove extends from the inner side toward the outer side direction, wherein The vent hole and the venting groove communicate with each other to form the venting passage of the photosensitive device, wherein the sealing member is held at the vent hole.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述通气槽形成于所述下表面,并且所述通气槽自所述内侧面延伸至所述外侧面,其中在所述支座的所述下表面被贴装于所述模塑基座的所述顶表面后,所述通气槽在所述支座和所述模塑基座之间形成所述感光装置的所述通气通道,其中所述密封元件被保持在所述通气槽。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein The venting groove is formed on the lower surface, and the venting groove extends from the inner side surface to the outer side surface, wherein the lower surface of the pedestal is attached to the molded base After the top surface is described, the venting groove forms the venting passage of the photosensitive device between the holder and the molded base, wherein the sealing member is held in the venting groove.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、 一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述下表面的靠近所述光窗的区域被界定为一非画胶区域,和所述下表面的远离所述光窗的区域被界定为环绕所述非画胶区域的一画胶区域,其中所述通气槽形成于所述下表面,并且所述通气槽自所述外侧面经由所述画胶区域延伸至所述非画胶区域的适当位置,其中在所述支座的所述下表面的所述画胶区域被贴装于所述模塑基座的所述顶表面后,所述通气槽在所述支座的所述下表面和所述模塑基座的所述顶表面之间形成所述感光装置的所述通气通道,其中所述密封元件被保持在所述通气槽。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the lower surface adjacent to the light window is defined as a non-painting area, and an area of the lower surface remote from the light window is defined as a glue area surrounding the non-painting area, wherein The venting groove is formed on the lower surface, and the venting groove extends from the outer side surface via the glue area to a suitable position of the non-painting area, wherein the lower surface of the pedestal After the glue area is attached to the top surface of the molding base, the vent groove is on the lower surface of the holder and the top surface of the molding base Forming the venting passage of the photosensitive device Where the sealing element is retained in the venting groove.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述下表面的靠近所述光窗的区域被界定为一非画胶区域,和所述下表面的远离所述光窗的区域被界定为环绕所述非画胶区域的一画胶区域,其中所述通气孔自所述支座的所述上表面延伸至所述下表面的所述非画胶区域,其中所述支座的所述下表面的所述画胶区域被贴装于所述模塑基座的所述顶表面,所述支座的所述通气孔形成所述感光装置的所述通气通道,其中所述密封元件被保持在所述通气孔。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer sides correspond to each other, and the inner side and the outer side extend upward and downward, respectively, to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein A region of the lower surface adjacent to the light window is defined as a non-painting region, and a region of the lower surface remote from the light window is defined as a glue region surrounding the non-painting region, wherein The venting hole extends from the upper surface of the holder to the non-painting area of the lower surface, wherein the glue area of the lower surface of the holder is attached to the mold The top surface of the plastic base, the venting opening of the holder forming the venting passage of the photosensitive device, wherein the sealing member is retained in the venting opening.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述通气槽形成于所述支座的所述上表面,并且所述通气槽自所述内侧面向所述外侧面方向延伸,其中所述滤光元件被贴装于所述支座的所述上表面,并且所述滤光元件使所述通气槽的一部分处于暴露状态,其中在所述支座的所述下表面被贴装于所述模塑基座的所述顶表面后,所述支座的所述通气槽在所述滤光元件和所述支座之间形成所述感光装置的所述通气通道,其中所述密封元件被保持在所述通气槽。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein a venting groove formed on the upper surface of the holder, and the venting groove extending from the inner side toward the outer side surface, wherein the filter element is mounted on the seat a surface, and the filter element exposes a portion of the venting groove, wherein after the lower surface of the pedestal is attached to the top surface of the molded base, the branch The venting groove of the seat forms the venting passage of the photosensitive device between the filter element and the holder, wherein the sealing member is held in the venting groove.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述上表面的靠近所述光窗的区域被界定为一上表面内侧,和所述上表面的远离所述光窗的区域被界定为环绕在所述上表面内侧四周的一上表面外侧,其中所述内侧面具有一内侧面上侧和一内侧面下侧,所述内侧面上侧分别向上和向下延伸以连接于所述上表面外侧和所述上表面内侧,所述内侧面下侧分别向上和向下延伸以连接于所述上表面内侧和所述下表面,其中所述通气槽被设于所述上表面内侧,并且 所述通气槽自所述内侧面下侧延伸至所述内侧面上侧,其中所述滤光元件被贴装于所述支座的所述上表面内侧,并且在所述滤光元件的侧壁和所述内侧面上侧之间形成一缝隙,所述支座的所述通气槽和所述缝隙相互连通以形成所述感光装置的所述通气通道,其中所述支座的所述下表面被贴装于所述模塑基座的所述顶表面,其中所述密封元件被保持在所述缝隙。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface Corresponding to the outer side, and the inner side and the outer side respectively extend upward and downward to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the upper surface adjacent to the light window is defined as an inner side of the upper surface, and a region of the upper surface remote from the light window is defined to surround an outer surface of the upper surface of the upper surface, wherein The inner side surface has an inner side surface side and an inner side surface lower side, the inner side surface sides respectively extending upward and downward to be connected to the outer side of the upper surface and the inner side of the upper surface, the lower side of the inner side surface Extending upwardly and downwardly to connect to the inner side of the upper surface and the lower surface, wherein the venting groove is provided inside the upper surface, and the venting groove extends from the lower side of the inner side to the Inside a face side, wherein the filter element is mounted inside the upper surface of the holder, and a gap is formed between a side wall of the filter element and the side of the inner side surface, The venting groove of the holder and the slit communicate with each other to form the venting passage of the photosensitive device, wherein the lower surface of the holder is attached to the top surface of the molding base Where the sealing element is retained in the gap.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述上表面的靠近所述光窗的区域被界定为一上表面内侧,和所述上表面的远离所述光窗的区域被界定为环绕在所述上表面内侧四周的一上表面外侧,其中所述内侧面具有一内侧面上侧和一内侧面下侧,所述内侧面上侧分别向上和向下延伸以连接于所述上表面外侧和所述上表面内侧,所述内侧面下侧分别向上和向下延伸以连接于所述上表面内侧和所述下表面,其中所述通气孔自所述上表面内侧延伸至所述下表面,其中所述滤光元件被贴装于所述支座的所述上表面内侧,并且在所述滤光元件的侧壁和所述内侧面上侧之间形成一缝隙,所述支座的所述通气孔和所述缝隙相互连通以形成所述感光装置的所述通气通道,其中所述支座的所述下表面被贴装于所述模塑基座的所述顶表面,其中所述密封元件被保持在所述缝隙。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer sides correspond to each other, and the inner side and the outer side extend upward and downward, respectively, to connect to the upper surface and the lower surface, the inner side defining the light passage, wherein An area of the upper surface adjacent to the light window is defined as an inner side of the upper surface, and a region of the upper surface remote from the light window is defined to surround an outer surface of the upper surface of the upper surface, wherein The inner side surface has an inner side surface side and an inner side surface lower side, and the inner side surface side respectively extends upward and downward to be connected to the outer side of the upper surface and the inner side of the upper surface, respectively Extending upwardly and downwardly to connect to an inner side of the upper surface and the lower surface, wherein the vent extends from an inner side of the upper surface to the lower surface, wherein the filter element is attached to the branch seat Inside the upper surface, and forming a gap between the side wall of the filter element and the side of the inner side surface, the vent hole and the slit of the holder communicate with each other to form the photosensitive device The venting passage, wherein the lower surface of the pedestal is attached to the top surface of the molded base, wherein the sealing member is retained in the slit.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通气槽以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述上表面的靠近所述光窗的区域被界定为一上表面内侧,和所述上表面的远离所述光窗的区域被界定为环绕在所述上表面内侧四周的一上表面外侧,其中所述内侧面具有一内侧面上侧和一内侧面下侧,所述内侧面上侧分别向上和向下延伸以连接于所述上表面外侧和所述上表面内侧,所述内侧面下侧分别向上和向下延伸以连接于所述上表面内侧和所述下表面,其中所述通气槽自所述上表面外侧延伸至所述上表面内侧,所述通气孔自所述上表面内侧延伸至所述下表面,并且所述通气孔和所述通气槽相互连通以形成所述感光装置的所述通气通道,其中所述滤光元件被贴装于所述支座的所述上表面内侧,所述支座的所述下表面被贴装于所述模塑基座的所述顶表面,其中所述密封元件被保持在所述通气槽。According to an embodiment of the present invention, the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one venting groove, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage a channel, wherein a region of the upper surface adjacent to the light window is defined as an inner side of an upper surface, and a region of the upper surface remote from the light window is defined to surround an area around an inner side of the upper surface An outer side surface, wherein the inner side surface has an inner side surface side and an inner side surface lower side, the inner side surface sides respectively extending upward and downward to be coupled to the outer side of the upper surface and the inner side of the upper surface, The lower side of the inner side surface respectively extends upward and downward to be connected to the inner side of the upper surface and the lower surface, wherein the venting groove extends from the outer side of the upper surface to the inner side of the upper surface, the vent hole An inner side of the upper surface extends to the lower surface, and the vent hole and the venting groove communicate with each other to form the venting passage of the photosensitive device, wherein the filter element is attached to the holder On the inside of the upper surface, the lower surface of the holder is attached to the top surface of the molded base, wherein the sealing member is held in the venting groove.
根据本发明的一个实施例,所述支座包括一基座贴装部、一连接部以及一滤光片贴装部,所述连接部分别向上和向下延伸以连接于所述基座贴装部和所述滤光片贴装部,所述滤光片贴装部界定所述通光通道,所述滤光元件被贴装于所述支座的所述滤光片贴装部,并且在所述滤光元件的外壁和所述连接部之间形成一缝隙,其中所述支座的所述基座贴装部被贴装于所述模塑基座的所述顶表面,并且所述滤光片贴装部被保持在所述模塑基座的所述光窗,以使所述模塑基座环绕 在所述支座的所述滤光片贴装部,其中所述支座具有至少一通光孔,其中所述通光孔自所述滤光片贴装部的上表面延伸至下表面,并且所述通光孔在所述滤光片贴装部的上表面连通所述缝隙,以形成所述感光装置的所述通气通道,其中所述密封元件被保持在所述缝隙。According to an embodiment of the invention, the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder, And forming a slit between the outer wall of the filter element and the connecting portion, wherein the pedestal mounting portion of the holder is attached to the top surface of the molding base, and The filter mounting portion is held by the light window of the molding base such that the molding base surrounds the filter mounting portion of the holder, wherein The holder has at least one light passing hole, wherein the light passing hole extends from an upper surface to a lower surface of the filter mounting portion, and the light passing hole communicates with an upper surface of the filter mounting portion The slit to form the venting passage of the photosensitive device, wherein the sealing member is held in the slit.
根据本发明的一个实施例,所述支座包括一基座贴装部、一连接部以及一滤光片贴装部,所述连接部分别向上和向下延伸以连接于所述基座贴装部和所述滤光片贴装部,所述滤光片贴装部界定所述通光通道,所述滤光元件被贴装于所述支座的所述滤光片贴装部,所述支座的所述基座贴装部被贴装于所述模塑基座的所述顶表面,并且所述滤光片贴装部被保持在所述模塑基座的所述光窗,以使所述模塑基座环绕在所述支座的所述滤光片贴装部,其中在所述模塑基座的基座内表面和所述支座的所述连接部之间形成一缝隙,其中所述支座具有至少一通光孔,其中所述通光孔自所述基座贴装部的上表面延伸至下表面,并且所述通光孔在所述基座贴装部的下表面连通所述缝隙,以形成所述感光装置的所述通气通道,其中所述密封元件被保持在所述通光孔。According to an embodiment of the invention, the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder, The pedestal mounting portion of the holder is attached to the top surface of the molding base, and the filter mounting portion is held by the light of the molding base a window such that the molded base surrounds the filter mounting portion of the holder, wherein the base inner surface of the molded base and the connecting portion of the holder Forming a gap therebetween, wherein the holder has at least one light passing hole, wherein the light passing hole extends from an upper surface of the pedestal mounting portion to a lower surface, and the light passing hole is pasted on the pedestal A lower surface of the loading portion communicates with the slit to form the venting passage of the photosensitive device, wherein the sealing member is retained in the light passing hole.
根据本发明的一个实施例,所述支座包括一基座贴装部、一连接部以及一滤光片贴装部,所述连接部分别向上和向下延伸以连接于所述基座贴装部和所述滤光片贴装部,所述滤光片贴装部界定所述通光通道,所述滤光元件被贴装于所述支座的所述滤光片贴装部,并且在所述滤光元件的外壁和所述连接部之间形成一缝隙,所述支座的所述基座贴装部被贴装于所述模塑基座的所述顶表面,并且所述滤光片贴装部被保持在所述模塑基座的所述光窗,以使所述模塑基座环绕在所述支座的所述滤光片贴装部,其中在所述模塑基座的基座内表面和所述支座的所述连接部之间形成另一缝隙,其中所述支座具有至少一通光孔,所述通光孔自所述连接部的一侧延伸至另一侧,以分别连通形成于所述滤光元件的外壁和所述连接部之间的所述缝隙和形成于所述模塑基座的基座内表面和所述滤光元件的外壁之间的所述缝隙,从而形成所述感光装置的所述通气通道,其中所述密封元件被保持在形成于所述滤光元件的外壁和所述连接部之间的所述缝隙。According to an embodiment of the invention, the support comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the base a mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter mounting portion of the holder, And forming a gap between the outer wall of the filter element and the connecting portion, the pedestal mounting portion of the holder being mounted on the top surface of the molding base, and The filter mounting portion is held in the light window of the molding base such that the molding base surrounds the filter mounting portion of the holder, wherein Forming another gap between the inner surface of the base of the molded base and the connecting portion of the holder, wherein the holder has at least one light passing hole, and the light passing hole is from one side of the connecting portion Extending to the other side to respectively communicate the gap formed between the outer wall of the filter element and the connecting portion and formed on the molded base The gap between the inner surface of the seat and the outer wall of the filter element, thereby forming the venting passage of the photosensitive device, wherein the sealing member is held on an outer wall formed on the filter element and The gap between the connections.
根据本发明的一个实施例,所述模塑基座的所述顶表面具有至少一通气槽,所述通气槽自所述模塑基座的基座内表面延伸至基座外表面,以连通所述光窗和外部,其中在所述支座被贴装于所述模塑基座的所述顶表面后,所述通气槽在所述支座和所述模塑基座的所述顶表面之间形成所述感光装置的所述通气通道,其中所述密封元件被保持在所述模塑基座的所述通气槽。According to an embodiment of the invention, the top surface of the molding base has at least one venting groove extending from the inner surface of the base of the molding base to the outer surface of the pedestal to communicate The light window and the exterior, wherein the venting groove is at the top of the holder and the molded base after the holder is attached to the top surface of the molding base The venting passage of the photosensitive device is formed between the surfaces, wherein the sealing member is held in the venting groove of the molding base.
根据本发明的一个实施例,所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述通气孔自所述支座的所述上表面延伸至所述下表面,其中所述模塑基座的所述顶表面具有至少一通气槽,所述通气槽自所述模塑基座的基座内表面向基座外表面方向延伸至适当位置,其中在所述支座的所述下表面被贴装于所述模塑基座的所述顶表面后,所述支座的所述通气孔和所 述模塑基座的所述通气槽相互连通以形成所述感光装置的所述通气通道,其中所述密封元件被保持在所述支座的所述通气孔。According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and The outer side surfaces correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the vent hole being from the upper surface of the holder Extending to the lower surface, wherein the top surface of the molded base has at least one venting groove extending from the inner surface of the base of the molded base toward the outer surface of the base to a suitable a position wherein the venting opening of the holder and the ventilation of the molded base after the lower surface of the holder is attached to the top surface of the molding base The slots communicate with each other to form the venting passage of the photosensitive device, wherein the sealing member is retained in the venting opening of the holder.
根据本发明的一个实施例,所述模塑基座一体地结合于所述感光元件的所述非感光区域的至少一部分;或者所述模塑基座一体地结合于所述基板。According to an embodiment of the present invention, the molding base is integrally bonded to at least a portion of the non-photosensitive area of the photosensitive member; or the molding base is integrally bonded to the substrate.
依本发明的另一个方面,本发明进一步提供一摄像模组,其包括:According to another aspect of the present invention, the present invention further provides a camera module, including:
至少一光学镜头;和At least one optical lens; and
至少一感光装置,其中所述感光装置进一步包括:At least one photosensitive device, wherein the photosensitive device further comprises:
至少一密封元件;At least one sealing element;
至少一滤光单元,其中所述滤光单元包括至少一支座和至少一滤光元件,所述支座具有至少一通光通道,所述滤光元件被贴装于所述支座,并且所述支座的所述通光通道对应于所述滤光元件;以及At least one filter unit, wherein the filter unit comprises at least one seat and at least one filter element, the holder has at least one light passage, the filter element is mounted on the support, and The light passage of the holder corresponds to the filter element;
至少一模塑感光单元,其中所述模塑感光单元进一步包括:At least one molded photosensitive unit, wherein the molded photosensitive unit further comprises:
至少一电路板,其中所述电路板包括至少一基板;At least one circuit board, wherein the circuit board includes at least one substrate;
至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域四周的一非感光区域,其中所述感光元件被导通地连接于所述基板;以及At least one photosensitive member, wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
至少一模塑基座,其中所述模塑基座具有至少一光窗,所述模塑基座一体地结合于所述基板,并且所述模塑基座环绕在所述感光元件的所述感光区域的四周,和所述感光元件的所述感光区域对应于所述模塑基座的所述光窗,其中所述支座被贴装于所述模塑基座的顶表面,并且在所述滤光单元和所述模塑感光单元之间形成至少一密封空间,所述感光元件的所述感光区域被保持在所述密封空间;At least one molded base, wherein the molded base has at least one light window, the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member a periphery of the photosensitive region, and the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein the holder is attached to a top surface of the molded base, and Forming at least one sealed space between the filter unit and the molded photosensitive unit, the photosensitive region of the photosensitive element being held in the sealed space;
其中所述感光装置具有至少一通气通道,所述通气通道用于连通所述密封空间和所述感光装置的外部,其中在所述感光装置被制造的过程中,所述通气通道用于使所述密封空间的内部的气体和所述感光装置的外部的气体交换,以平衡所述密封空间的内部的气压和所述感光装置的外部的气压,其中所述密封元件被保持在所述通气通道,其中所述光学镜头被保持在所述感光元件的感光路径,和所述滤光元件被保持在所述光学镜头和所述感光元件之间。Wherein the photosensitive device has at least one venting passage for communicating the sealed space and the exterior of the photosensitive device, wherein the venting passage is used to make the venting passage during manufacture of the photosensitive device Gas exchange between the gas inside the sealed space and the outside of the photosensitive device to balance the air pressure inside the sealed space and the air pressure outside the photosensitive device, wherein the sealing member is held in the ventilation passage Wherein the optical lens is held in a photosensitive path of the photosensitive element, and the filter element is held between the optical lens and the photosensitive element.
依本发明的另一个方面,本发明进一步提供一支座,其中所述支座一上表面、一下表面、一内侧面、一外侧面、至少一溢胶槽、至少一排气槽以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面用于界定所述通光通道,其中所述溢胶槽和所述排气槽分别设于所述下表面,并且所述排气槽连通所述通光通道和所述溢胶槽,其中所述通气孔自所述上表面向所述下表面方向延伸,并且所述通气孔连通所述溢胶槽。According to another aspect of the present invention, the present invention further provides a seat, wherein the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one glue overflow groove, at least one exhaust groove, and at least one passage. a gas hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be connected to the upper surface And the lower surface, the inner side surface is for defining the light passage, wherein the overflow tank and the exhaust groove are respectively disposed on the lower surface, and the exhaust groove communicates with the light passage a passage and the overflow tank, wherein the vent hole extends from the upper surface toward the lower surface, and the vent hole communicates with the overflow tank.
根据本发明的一个实施例,所述下表面的靠近所述光窗的区域被界定为一非画胶区域,所述下表面的远离所述光窗的区域被界定为环绕在所述非画胶区域四周的一画胶区域,并且所述非画胶区域向内延伸以连接所述内侧面,所述画胶区 域向外延伸以连接所述外侧面,其中所述排气槽自所述内侧面向所述画胶区域方向延伸,所述溢胶槽在所述非画胶区域连通所述排气槽和所述通气孔。According to an embodiment of the invention, the area of the lower surface adjacent to the light window is defined as a non-painting area, and the area of the lower surface remote from the light window is defined as surrounding the non-painting a glue area around the glue area, and the non-paint area extends inwardly to connect the inner side, the glue area extends outward to connect the outer side, wherein the exhaust slot is from the The inner side extends in the direction of the glue area, and the overflow tank communicates with the exhaust groove and the vent hole in the non-paint area.
根据本发明的一个实施例,所述下表面的靠近所述光窗的区域被界定为一非画胶区域,所述下表面的远离所述光窗的区域被界定为环绕在所述非画胶区域四周的一画胶区域,并且所述非画胶区域向内延伸以连接所述内侧面,所述画胶区域向外延伸以连接所述外侧面,其中所述排气槽自所述内侧面向所述画胶区域方向延伸,所述溢胶槽在所述非画胶区域连通所述排气槽,和在所述画胶区域连通所述通光孔。According to an embodiment of the invention, the area of the lower surface adjacent to the light window is defined as a non-painting area, and the area of the lower surface remote from the light window is defined as surrounding the non-painting a glue area around the glue area, and the non-paint area extends inwardly to connect the inner side, the glue area extends outward to connect the outer side, wherein the exhaust slot is from the The inner side extends in the direction of the glue area, the overflow tank communicates with the exhaust groove in the non-paint area, and the light passing hole is communicated in the glue area.
根据本发明的一个实施例,所述溢胶槽的深度尺寸大于所述排气槽的深度尺寸。According to an embodiment of the invention, the overflow tank has a depth dimension greater than a depth dimension of the exhaust slot.
根据本发明的一个实施例,所述溢胶槽的深度尺寸为0.1mm,所述排气槽的深度尺寸为0.03mm。According to an embodiment of the invention, the overflow tank has a depth dimension of 0.1 mm and the exhaust groove has a depth dimension of 0.03 mm.
根据本发明的一个实施例,设所述溢胶槽的宽度尺寸的参数为W,设所述通气孔的低端的直径尺寸的参数为R,其中所述溢胶槽的宽度尺寸与所述通气孔的低端的直径尺寸的比值的取值范围为:2:1~1:1。According to an embodiment of the present invention, the parameter of the width dimension of the overflow tank is W, and the parameter of the diameter dimension of the low end of the vent is R, wherein the width dimension of the overflow tank is The ratio of the diameter of the low end of the vent is in the range of 2:1 to 1:1.
根据本发明的一个实施例,所述支座的所述内侧面倾斜地延伸。According to an embodiment of the invention, the inner side of the seat extends obliquely.
依本发明的另一个方面,本发明进一步提供一感光装置,其包括:According to another aspect of the present invention, the present invention further provides a photosensitive device comprising:
至少一滤光元件;At least one filter element;
至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域的四周的一非感光区域;At least one photosensitive element, wherein the photosensitive element has a photosensitive area and a non-sensitive area surrounding the photosensitive area;
至少一支座,其中所述支座一上表面、一下表面、一内侧面、一外侧面、至少一溢胶槽、至少一排气槽以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面用于界定所述通光通道,其中所述溢胶槽和所述排气槽分别设于所述下表面,并且所述排气槽连通所述通光通道和所述溢胶槽,其中所述通气孔自所述上表面向所述下表面方向延伸,并且所述通气孔连通所述溢胶槽,其中所述滤光元件被贴装于所述支座的所述上表面或者所述下表面,并且所述支座的所述通光通道对应于所述滤光元件;At least one seat, wherein the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one glue overflow groove, at least one venting groove, and at least one vent hole, wherein the upper surface and the lower portion The surfaces correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface being Defining the light passage, wherein the overflow tank and the exhaust groove are respectively disposed on the lower surface, and the exhaust groove communicates with the light passage and the overflow tank, wherein a vent hole extending from the upper surface toward the lower surface, and the vent hole communicates with the overflow tank, wherein the filter element is attached to the upper surface or the lower surface of the holder a surface, and the light passage of the holder corresponds to the filter element;
至少一电路板,其中所述电路板具有至少一基板,其中所述感光元件被导通地连接于所述基板;以及At least one circuit board, wherein the circuit board has at least one substrate, wherein the photosensitive element is conductively connected to the substrate;
至少一模塑基座,其中所述模塑基座具有至少一光窗,其中所述模塑基座一体地结合于所述基板,并且所述模塑基座环绕在所述感光元件的所述感光区域的四周,以使所述感光元件的所述感光区域对应于所述模塑基座的所述光窗,其中所述支座的所述下表面的至少一部分被贴装于所述模塑基座的顶表面,以在所述滤光元件、所述支座、所述基板和所述模塑基座之间形成至少一密封空间,其中所述感光元件被保持在所述密封空间,其中所述支座的所述通气槽、所述溢胶槽和所述通气孔形成至少一通气通道,以用于连通所述密封空间和所述感光装置的 外部。At least one molded base, wherein the molded base has at least one light window, wherein the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member The periphery of the photosensitive region such that the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein at least a portion of the lower surface of the holder is attached to the Molding a top surface of the pedestal to form at least one sealed space between the filter element, the mount, the substrate, and the molded base, wherein the photosensitive element is held in the seal a space, wherein the venting groove, the overflow tank, and the vent hole of the holder form at least one venting passage for communicating the sealed space and an exterior of the photosensitive device.
根据本发明的一个实施例,所述模塑基座一体地结合于所述感光元件的所述非感光区域的至少一部分;或者所述模塑基座一体地结合于所述基板。According to an embodiment of the present invention, the molding base is integrally bonded to at least a portion of the non-photosensitive area of the photosensitive member; or the molding base is integrally bonded to the substrate.
依本发明的另一个方面,本发明进一步提供一摄像模组,其包括至少一光学镜头和至少一感光装置,其中所述感光装置进一步包括:According to another aspect of the present invention, the present invention further provides a camera module comprising at least one optical lens and at least one photosensitive device, wherein the photosensitive device further comprises:
至少一滤光元件;At least one filter element;
至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域的四周的一非感光区域;At least one photosensitive element, wherein the photosensitive element has a photosensitive area and a non-sensitive area surrounding the photosensitive area;
至少一支座,其中所述支座一上表面、一下表面、一内侧面、一外侧面、至少一溢胶槽、至少一排气槽以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面用于界定所述通光通道,其中所述溢胶槽和所述排气槽分别设于所述下表面,并且所述排气槽连通所述通光通道和所述溢胶槽,其中所述通气孔自所述上表面向所述下表面方向延伸,并且所述通气孔连通所述溢胶槽,其中所述滤光元件被贴装于所述支座的所述上表面或者所述下表面,并且所述支座的所述通光通道对应于所述滤光元件;At least one seat, wherein the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one glue overflow groove, at least one venting groove, and at least one vent hole, wherein the upper surface and the lower portion The surfaces correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface being Defining the light passage, wherein the overflow tank and the exhaust groove are respectively disposed on the lower surface, and the exhaust groove communicates with the light passage and the overflow tank, wherein a vent hole extending from the upper surface toward the lower surface, and the vent hole communicates with the overflow tank, wherein the filter element is attached to the upper surface or the lower surface of the holder a surface, and the light passage of the holder corresponds to the filter element;
至少一电路板,其中所述电路板具有至少一基板,其中所述感光元件被导通地连接于所述基板;以及At least one circuit board, wherein the circuit board has at least one substrate, wherein the photosensitive element is conductively connected to the substrate;
至少一模塑基座,其中所述模塑基座具有至少一光窗,其中所述模塑基座一体地结合于所述基板,并且所述模塑基座环绕在所述感光元件的所述感光区域的四周,以使所述感光元件的所述感光区域对应于所述模塑基座的所述光窗,其中所述支座的所述下表面的至少一部分被贴装于所述模塑基座的顶表面,以在所述滤光元件、所述支座、所述基板和所述模塑基座之间形成至少一密封空间,其中所述感光元件被保持在所述密封空间,其中所述支座的所述通气槽、所述溢胶槽和所述通气孔形成至少一通气通道,以用于连通所述密封空间和所述感光装置的外部,其中所述光学镜头被保持在所述感光元件的感光路径,和所述滤光元件被保持在所述光学镜头和所述感光元件之间。At least one molded base, wherein the molded base has at least one light window, wherein the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member The periphery of the photosensitive region such that the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein at least a portion of the lower surface of the holder is attached to the Molding a top surface of the pedestal to form at least one sealed space between the filter element, the mount, the substrate, and the molded base, wherein the photosensitive element is held in the seal a space, wherein the venting groove, the overflow tank, and the vent hole of the holder form at least one venting passage for communicating the sealed space and an exterior of the photosensitive device, wherein the optical lens A photosensitive path of the photosensitive member is held, and the filter element is held between the optical lens and the photosensitive element.
依本发明的另一个方面,本发明进一步提供一感光装置,其包括:According to another aspect of the present invention, the present invention further provides a photosensitive device comprising:
至少一滤光单元,其中所述滤光单元包括至少一滤光元件和至少一支座,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通光通道以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,所述通气孔自所述上表面延伸至所述下表面,其中所述滤光元件被贴装于所述支座,并且所述支座的所述通光通道对应于所述滤光元件;和At least one filter unit, wherein the filter unit includes at least one filter element and at least one seat, wherein the support has an upper surface, a lower surface, an inner side, an outer side, at least one light passage, and At least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be connected to the An upper surface and the lower surface, the inner side defining the light passage, the vent extending from the upper surface to the lower surface, wherein the filter element is mounted to the holder And the light passage of the holder corresponds to the filter element; and
至少一模塑感光单元,其中所述模塑感光单元进一步包括:At least one molded photosensitive unit, wherein the molded photosensitive unit further comprises:
至少一电路板,其中所述电路板包括至少一基板;At least one circuit board, wherein the circuit board includes at least one substrate;
至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域四周的一非感光区域,其中所述感光元件被导通地连接于所述基板;以及At least one photosensitive member, wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
至少一模塑基座,其中所述模塑基座具有至少一光窗、至少一通气槽、至少一基座内表面、一基座外表面以及一顶表面,其中所述基座内表面用于界定所述光窗,所述顶表面分别向内和向外延伸以连接于所述基座内表面和所述基座外表面,所述通气槽设于所述顶表面,并且所述通气槽自所述基座内表面向所述基座外表面方向延伸至适当位置,其中所述模塑基座一体地结合于所述基板,并且所述模塑基座环绕在所述感光元件的所述感光区域的四周,和所述感光元件的所述感光区域对应于所述模塑基座的所述光窗,其中所述支座的所述下表面的至少一部分被贴装于所述模塑基座的所述顶表面,并且在所述滤光单元和所述模塑感光单元之间形成至少一密封空间,所述感光元件的所述感光区域被保持在所述密封空间,其中所述支座的所述通光孔和所述模塑基座的所述通气槽相互连通以形成至少一通气通道,其中所述通气通道用于连通所述密封空间和所述感光装置的外部。At least one molded base, wherein the molded base has at least one light window, at least one venting groove, at least one pedestal inner surface, a pedestal outer surface, and a top surface, wherein the pedestal inner surface is Defining the light window, the top surface extending inwardly and outwardly to connect to the inner surface of the base and the outer surface of the base, the ventilation groove is disposed on the top surface, and the ventilation The groove extends from the inner surface of the base toward the outer surface of the base to a proper position, wherein the molded base is integrally coupled to the substrate, and the molded base surrounds the photosensitive element The periphery of the photosensitive region and the photosensitive region of the photosensitive member correspond to the light window of the molded base, wherein at least a portion of the lower surface of the holder is attached to the Forming the top surface of the susceptor and forming at least one sealed space between the filter unit and the molded photosensitive unit, the photosensitive region of the photosensitive member being held in the sealed space, wherein The light passing hole of the holder and the molding The base vent grooves communicate with each other to form at least one vent passage, wherein said vent passage for communicating the enclosed space and the outside of said photosensitive means.
根据本发明的一个实施例,所述模塑基座具有至少一第一凹槽和至少一第二凹槽,所述第一凹槽分别连通所述第二凹槽和所述支座的所述通气孔,所述第二凹槽连通所述密封空间,其中所述第一凹槽的深度尺寸大于所述第二凹槽的深度尺寸。According to an embodiment of the invention, the molding base has at least one first groove and at least one second groove, the first groove respectively communicating with the second groove and the seat a venting hole, the second groove communicating with the sealing space, wherein a depth dimension of the first groove is greater than a depth dimension of the second groove.
根据本发明的一个实施例,所述模塑基座一体地结合于所述感光元件的所述非感光区域的至少一部分;或者所述模塑基座一体地结合于所述基板。According to an embodiment of the present invention, the molding base is integrally bonded to at least a portion of the non-photosensitive area of the photosensitive member; or the molding base is integrally bonded to the substrate.
根据本发明的一个实施例,所述模塑感光单元包括至少一电子元器件,其中所述电子元器件被导通地连接于所述基板。According to an embodiment of the invention, the molded photosensitive unit comprises at least one electronic component, wherein the electronic component is electrically connected to the substrate.
根据本发明的一个实施例,所述模塑基座包埋凸出于所述基板的基板正面的至少一个所述电子元器件的至少一部分。According to an embodiment of the invention, the molded base encloses at least a portion of at least one of the electronic components protruding from the front side of the substrate of the substrate.
根据本发明的一个实施例,所述电路板包括至少一连接板,所述连接板具有一模组连接端和对应于所述模组连接端的一设备连接端,其中所述连接板的所述模组连接端被导通地连接于所述基板的基板正面或者基板背面,或者所述连接板的所述模组连接端一体地延伸于和被导通地连接于所述基板。According to an embodiment of the present invention, the circuit board includes at least one connection board having a module connection end and a device connection end corresponding to the module connection end, wherein the connection board The module connection end is electrically connected to the front surface of the substrate or the back surface of the substrate, or the module connection end of the connection board is integrally extended and electrically connected to the substrate.
根据本发明的一个实施例,所述基板具有至少一贴装区域和至少一连接线,所述感光元件被贴装于所述基板的所述贴装区域,所述连接线的两个端部分别被导通地连接于所述基板的基板连接件和所述感光元件的芯片连接件,以导通地连接所述感光元件和所述基板。According to an embodiment of the invention, the substrate has at least one mounting area and at least one connecting line, the photosensitive element is mounted on the mounting area of the substrate, and both ends of the connecting line A substrate connector connected to the substrate and a chip connector of the photosensitive member are electrically connected to electrically connect the photosensitive member and the substrate, respectively.
根据本发明的一个实施例,所述基板具有至少一容纳空间和至少一连接线,所述容纳空间自所述基板的基板正面向基板背面方向延伸,所述感光元件被保持在所述容纳空间,所述连接线的两个端部分别被导通地连接于所述基板的基板连接件和所述感光元件的芯片连接件,以导通地连接所述感光元件和所述基板。According to an embodiment of the present invention, the substrate has at least one receiving space and at least one connecting line extending from a front surface of the substrate toward a rear surface of the substrate, and the photosensitive member is held in the receiving space The two ends of the connecting wire are respectively electrically connected to the substrate connecting member of the substrate and the chip connecting member of the photosensitive member to electrically connect the photosensitive member and the substrate.
根据本发明的一个实施例,所述感光装置进一步包括一密封元件,其中所述 密封元件形成于所述支座的所述通气孔,并且所述密封元件被保持在所述支座的所述通气孔。According to an embodiment of the present invention, the photosensitive device further includes a sealing member, wherein the sealing member is formed in the vent hole of the holder, and the sealing member is held in the holder Vent holes.
依本发明的另一个方面,本发明进一步提供一摄像模组,其包括至少一光学镜头至少一感光装置,其中所述感光装置进一步包括:According to another aspect of the present invention, the present invention further provides a camera module comprising at least one optical lens, at least one photosensitive device, wherein the photosensitive device further comprises:
至少一滤光单元,其中所述滤光单元包括至少一滤光元件和至少一支座,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通光通道以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,所述通气孔自所述上表面延伸至所述下表面,其中所述滤光元件被贴装于所述支座,并且所述支座的所述通光通道对应于所述滤光元件;和At least one filter unit, wherein the filter unit includes at least one filter element and at least one seat, wherein the support has an upper surface, a lower surface, an inner side, an outer side, at least one light passage, and At least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be connected to the An upper surface and the lower surface, the inner side defining the light passage, the vent extending from the upper surface to the lower surface, wherein the filter element is mounted to the holder And the light passage of the holder corresponds to the filter element; and
至少一模塑感光单元,其中所述模塑感光单元进一步包括:At least one molded photosensitive unit, wherein the molded photosensitive unit further comprises:
至少一电路板,其中所述电路板包括至少一基板;At least one circuit board, wherein the circuit board includes at least one substrate;
至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域四周的一非感光区域,其中所述感光元件被导通地连接于所述基板;以及At least one photosensitive member, wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
至少一模塑基座,其中所述模塑基座具有至少一光窗、至少一通气槽、至少一基座内表面、一基座外表面以及一顶表面,其中所述基座内表面用于界定所述光窗,所述顶表面分别向内和向外延伸以连接于所述基座内表面和所述基座外表面,所述通气槽设于所述顶表面,并且所述通气槽自所述基座内表面向所述基座外表面方向延伸至适当位置,其中所述模塑基座一体地结合于所述基板,并且所述模塑基座环绕在所述感光元件的所述感光区域的四周,和所述感光元件的所述感光区域对应于所述模塑基座的所述光窗,其中所述支座的所述下表面的至少一部分被贴装于所述模塑基座的所述顶表面,并且在所述滤光单元和所述模塑感光单元之间形成至少一密封空间,所述感光元件的所述感光区域被保持在所述密封空间,其中所述支座的所述通光孔和所述模塑基座的所述通气槽相互连通以形成至少一通气通道,其中所述通气通道用于连通所述密封空间和所述感光装置的外部,其中所述光学镜头被保持在所述感光元件的感光路径,所述滤光元件被保持在所述光学镜头和所述感光元件之间。At least one molded base, wherein the molded base has at least one light window, at least one venting groove, at least one pedestal inner surface, a pedestal outer surface, and a top surface, wherein the pedestal inner surface is Defining the light window, the top surface extending inwardly and outwardly to connect to the inner surface of the base and the outer surface of the base, the ventilation groove is disposed on the top surface, and the ventilation The groove extends from the inner surface of the base toward the outer surface of the base to a proper position, wherein the molded base is integrally coupled to the substrate, and the molded base surrounds the photosensitive element The periphery of the photosensitive region and the photosensitive region of the photosensitive member correspond to the light window of the molded base, wherein at least a portion of the lower surface of the holder is attached to the Forming the top surface of the susceptor and forming at least one sealed space between the filter unit and the molded photosensitive unit, the photosensitive region of the photosensitive member being held in the sealed space, wherein The light passing hole of the holder and the molding The venting grooves of the seat communicate with each other to form at least one venting passage, wherein the venting passage is for communicating the sealed space and an exterior of the photosensitive device, wherein the optical lens is held at a photosensitive path of the photosensitive member The filter element is held between the optical lens and the photosensitive element.
附图说明DRAWINGS
图1是根据本发明的一较佳实施例的一摄像模组的应用状态示意图。FIG. 1 is a schematic diagram of an application state of a camera module according to a preferred embodiment of the present invention.
图2是根据本发明的上述较佳实施例的所述摄像模组的立体示意图。2 is a perspective view of the camera module according to the above preferred embodiment of the present invention.
图3是根据本发明的上述较佳实施例的所述摄像模组的分解示意图。3 is an exploded perspective view of the camera module in accordance with the above preferred embodiment of the present invention.
图4A是根据本发明的上述较佳实施例的所述摄像模组被沿着中间位置剖开后的内部结构示意图。4A is a schematic diagram showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along an intermediate position.
图4B是根据本发明的上述较佳实施例的所述摄像模组的一个变形实施方式被沿着中间位置剖开后的内部结构示意图。4B is a schematic view showing the internal structure of a modified embodiment of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图5是图4A的局部位置放大示意图。Fig. 5 is an enlarged schematic view showing a partial position of Fig. 4A.
图6A是依本发明的上述较佳实施例的所述摄像模组的一支座的一个视角的立体示意图。FIG. 6A is a perspective view showing a perspective view of a pedestal of the camera module according to the above preferred embodiment of the present invention.
图6B是依本发明的上述较佳实施例的所述摄像模组的所述支座的另一个视角的立体示意图。FIG. 6B is a perspective view of another perspective view of the holder of the camera module according to the above preferred embodiment of the present invention.
图7是依本发明的上述较佳实施例的所述摄像模组的一制造流程的制造步骤之一的剖视示意图。FIG. 7 is a cross-sectional view showing one of manufacturing steps of a manufacturing process of the camera module according to the above preferred embodiment of the present invention.
图8A和图8B是依本发明的上述较佳实施例的所述摄像模组的上述制造流程的制造步骤之二的剖视示意图。8A and FIG. 8B are schematic cross-sectional views showing the second manufacturing step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
图9是依本发明的上述较佳实施例的所述摄像模组的上述制造流程的制造步骤之三的剖视示意图。FIG. 9 is a cross-sectional view showing the third manufacturing step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
图10是依本发明的上述较佳实施例的所述摄像模组的上述制造流程的制造步骤之四的剖视示意图。FIG. 10 is a cross-sectional view showing the fourth manufacturing step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
图11是依本发明的上述较佳实施例的所述摄像模组的上述制造流程的制造步骤之五的剖视示意图。Figure 11 is a cross-sectional view showing the fifth manufacturing step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
图12是依本发明的上述较佳实施例的所述摄像模组的上述制造流程的制造步骤之六的剖视示意图。FIG. 12 is a cross-sectional view showing the sixth manufacturing step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
图13A和图13B是依本发明的上述较佳实施例的所述摄像模组的上述制造流程的制造步骤之七的剖视示意图。13A and FIG. 13B are schematic cross-sectional views showing the seventh manufacturing step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
图14是依本发明的上述较佳实施例的所述摄像模组的上述制造流程的制造步骤之八的剖视示意图。Figure 14 is a cross-sectional view showing the eighth manufacturing step of the manufacturing process of the image pickup module according to the above preferred embodiment of the present invention.
图15是依本发明的上述较佳实施例的所述摄像模组的上述制造流程的制造步骤之九的剖视示意图。Figure 15 is a cross-sectional view showing the manufacturing steps of the above-described manufacturing process of the camera module according to the above preferred embodiment of the present invention.
图16是依本发明的上述较佳实施例的所述摄像模组的上述制造流程的制造步骤之十的剖视示意图。Figure 16 is a cross-sectional view showing the manufacturing steps of the above-described manufacturing process of the camera module according to the above preferred embodiment of the present invention.
图17A至图17C是依本发明的上述较佳实施例的所述摄像模组的上述制造流程的制造步骤之十一的剖视示意图。17A to 17C are schematic cross-sectional views showing the eleventh manufacturing step of the above-described manufacturing flow of the image pickup module according to the above preferred embodiment of the present invention.
图18是依本发明的上述较佳实施例的所述摄像模组的上述制造流程的制造步骤之十二的剖视示意图。Figure 18 is a cross-sectional view showing the manufacturing steps of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
图19是依本发明的上述较佳实施例的所述摄像模组的上述制造流程的制造步骤之十三的剖视示意图。Figure 19 is a cross-sectional view showing the manufacturing steps of the above-described manufacturing process of the camera module according to the above preferred embodiment of the present invention.
图20A是依本发明的上述较佳实施例的所述摄像模组被沿着中间位置剖开后的内部结构示意图。FIG. 20A is a schematic diagram showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图20B是依本发明的上述较佳实施例的所述摄像模组的一个变形实施方式的被沿着中间位置剖开后的内部结构示意图。FIG. 20B is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position. FIG.
图21是依本发明的上述较佳实施例的所述摄像模组的另一个变形实施方式的被沿着中间位置剖开后的内部结构示意图。FIG. 21 is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图22是依本发明的上述较佳实施例的所述摄像模组的另一个变形实施方式 的被沿着中间位置剖开后的内部结构示意图。Figure 22 is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图23是依本发明的上述较佳实施例的所述摄像模组的另一个变形实施方式的被沿着中间位置剖开后的内部结构示意图。FIG. 23 is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图24是依本发明的上述较佳实施例的所述摄像模组的另一个变形实施方式的被沿着中间位置剖开后的内部结构示意图。FIG. 24 is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图25是依本发明的上述较佳实施例的所述摄像模组的另一个变形实施方式的被沿着中间位置剖开后的内部结构示意图。FIG. 25 is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图26是依本发明的上述较佳实施例的所述摄像模组的另一个变形实施方式的被沿着中间位置剖开后的内部结构示意图。FIG. 26 is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图27A是依本发明的上述较佳实施例的所述摄像模组的另一个变形实施方式的被沿着中间位置剖开后的内部结构示意图。FIG. 27A is a schematic diagram showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图27B是依本发明的上述较佳实施例的所述摄像模组的另一个变形实施方式的被沿着中间位置剖开后的内部结构示意图。FIG. 27B is a schematic diagram showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图28A和图28B是依本发明的上述较佳实施例的所述摄像模组的一支座的一个变形实施方式的示意图。28A and 28B are schematic views showing a modified embodiment of a pedestal of the camera module according to the above preferred embodiment of the present invention.
图29A和图29B是依本发明的上述较佳实施例的所述摄像模组的所述支座的另一个变形实施方式的示意图。29A and 29B are schematic views showing another modified embodiment of the holder of the camera module according to the above preferred embodiment of the present invention.
图30是依本发明的上述较佳实施例的所述摄像模组的另一个变形实施方式的立体示意图。FIG. 30 is a perspective view showing another modified embodiment of the camera module according to the above preferred embodiment of the present invention.
图31是依本发明的上述较佳实施例的所述摄像模组的分解示意图。Figure 31 is an exploded perspective view of the camera module in accordance with the above preferred embodiment of the present invention.
图32是依本发明的上述较佳实施例的所述摄像模组被沿着中间位置剖开后的内部结构示意图。32 is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图33是图32的局部位置放大示意图。Figure 33 is an enlarged schematic view of a partial position of Figure 32.
图34A是依本发明的上述较佳实施例的所述摄像模组的所述支座的一个视角的立体示意图。FIG. 34A is a perspective view showing a viewing angle of the holder of the camera module according to the above preferred embodiment of the present invention.
图34B是依本发明的上述较佳实施例的所述摄像模组的所述支座的另一个视角的立体示意图。Figure 34B is a perspective view showing another perspective of the holder of the camera module according to the above preferred embodiment of the present invention.
图34C是依本发明的上述较佳实施例的所述摄像模组的所述支座的俯视示意图。FIG. 34C is a top plan view of the holder of the camera module according to the above preferred embodiment of the present invention.
图35是依本发明的上述较佳实施例的所述摄像模组的所述支座的一个变形实施方式的示意图。Figure 35 is a schematic illustration of a modified embodiment of the holder of the camera module in accordance with the above-described preferred embodiment of the present invention.
图36是依本发明的上述较佳实施例的所述摄像模组的所述模塑电路板组件的一个变形实施方式的示意图。Figure 36 is a schematic illustration of a modified embodiment of the molded circuit board assembly of the camera module in accordance with the above-described preferred embodiment of the present invention.
图37是依本发明的上述较佳实施例的所述摄像模组的一个变形实施方式被沿着中间位置剖开后的内部结构的局部放大示意图。37 is a partially enlarged schematic view showing the internal structure of a modified embodiment of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图38A是依本发明的上述较佳实施例的所述摄像模组的所述支座的一个变形实施方式被沿着中间位置剖开后的内部结构示意图。FIG. 38A is a schematic diagram showing the internal structure of a modified embodiment of the holder of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图38B是依本发明的上述较佳实施例的所述摄像模组的所述感光装置的一 个变形实施方式的被沿着中间位置剖开后的内部结构示意图。Figure 38B is a schematic view showing the internal structure of a modified embodiment of the photosensitive device of the camera module according to the above preferred embodiment of the present invention, taken along the intermediate position.
图38C是依本发明的上述较佳实施例的所述摄像模组的一个变形实施方式的被沿着中间位置剖开后的内部结构示意图。38C is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图38D是图38C的局部位置放大示意图。Figure 38D is an enlarged schematic view of a partial position of Figure 38C.
图39A是依本发明的上述较佳实施例的所述摄像模组的所述支座的一个变形实施方式的立体示意图。FIG. 39A is a perspective view showing a modified embodiment of the holder of the camera module according to the above preferred embodiment of the present invention.
图39B是依本发明的上述较佳实施例的所述摄像模组的所述支座的上述变形实施方式被沿着中间位置剖开后的内部结构示意图。39B is a schematic view showing the internal structure of the above-described modified embodiment of the holder of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图39C是依本发明的上述较佳实施例的所述摄像模组的所述感光装置的一个变形实施方式的被沿着中间位置剖开后的内部结构示意图。39C is a schematic view showing the internal structure of a modified embodiment of the photosensitive device of the camera module according to the above preferred embodiment of the present invention, which is cut along an intermediate position.
图39D是依本发明的上述较佳实施例的所述摄像模组的一个变形实施方式的被沿着中间位置剖开后的内部结构示意图。39D is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图39E是图39D的局部位置放大示意图。Figure 39E is an enlarged schematic view of a partial position of Figure 39D.
图40A是依本发明的上述较佳实施例的所述摄像模组的所述支座的一个变形实施方式的立体示意图。FIG. 40A is a perspective view showing a modified embodiment of the holder of the camera module according to the above preferred embodiment of the present invention.
图40B是依本发明的上述较佳实施例的所述摄像模组的所述感光装置的一个变形实施方式的被沿着中间位置剖开后的内部结构示意图。FIG. 40B is a schematic view showing the internal structure of a modified embodiment of the photosensitive device of the camera module according to the above preferred embodiment of the present invention, which is cut along an intermediate position; FIG.
图40C是依本发明的上述较佳实施例的所述摄像模组的一个变形实施方式的被沿着中间位置剖开后的内部结构示意图。40C is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图40D是图39C的局部位置放大示意图。Fig. 40D is an enlarged schematic view of a partial position of Fig. 39C.
图41是依本发明的上述较佳实施例的所述摄像模组的所述感光装置的一个变形实施方式的被沿着中间位置剖开后的内部结构示意图。Figure 41 is a schematic view showing the internal structure of a modified embodiment of the photosensitive device of the camera module according to the above preferred embodiment of the present invention, taken along the intermediate position.
图42A是依本发明的上述较佳实施例的所述摄像模组的所述支座的一个变形实施方式的一个视角的立体示意图。Figure 42A is a perspective view showing a perspective view of a modified embodiment of the holder of the camera module according to the above preferred embodiment of the present invention.
图42B是依本发明的上述较佳实施例的所述摄像模组的所述支座的上述变形实施方式的另一个视角的立体示意图。42B is a perspective view showing another perspective of the above-described modified embodiment of the holder of the camera module according to the above preferred embodiment of the present invention.
图42C是依本发明的上述较佳实施例的所述摄像模组的所述支座被沿着中间位置剖开后的内部结构示意图。42C is a schematic view showing the internal structure of the holder of the camera module according to the above preferred embodiment of the present invention, which is cut along the intermediate position.
图42D是依本发明的上述较佳实施例的所述摄像模组的一滤光单元被沿着中间位置剖开后的内部结构示意图。42D is a schematic diagram showing the internal structure of a filter unit of the camera module according to the above preferred embodiment of the present invention, which is cut along an intermediate position.
图42E是依本发明的上述较佳实施例的所述摄像模组的所述感光装置的一个变形实施方式的被沿着中间位置剖开后的内部结构示意图。42E is a schematic view showing the internal structure of a modified embodiment of the photosensitive device of the camera module according to the above preferred embodiment of the present invention, which is cut along an intermediate position.
图42F是依本发明的上述较佳实施例的所述摄像模组的一个变形实施方式的被沿着中间位置剖开后的内部结构示意图。Figure 42F is a schematic view showing the internal structure of a modified embodiment of the camera module according to the above preferred embodiment of the present invention, taken along the intermediate position.
图42G是图42F的局部位置放大示意图。Figure 42G is an enlarged schematic view of a partial position of Figure 42F.
图43A和43B是依本发明的上述较佳实施例的所述摄像模组的所述感光装置的一个变形实施方式的被沿着中间位置剖开后的内部结构示意图。43A and 43B are schematic diagrams showing the internal structure of a modified embodiment of the photosensitive device of the camera module according to the above preferred embodiment of the present invention, taken along the intermediate position.
图44是依本发明的上述较佳实施例的所述摄像模组的所述感光装置的一个 变形实施方式的被沿着中间位置剖开后的内部结构示意图。Fig. 44 is a view showing the internal structure of a modified embodiment of the photosensitive device of the image pickup module according to the above preferred embodiment of the present invention, taken along the intermediate position.
图45是依本发明的上述较佳实施例的所述摄像模组的一个变形实施方式的立体示意图。Figure 45 is a perspective view showing a modified embodiment of the camera module according to the above preferred embodiment of the present invention.
图46是依本发明的上述较佳实施例的所述摄像模组的分解示意图。Figure 46 is an exploded perspective view of the camera module in accordance with the above preferred embodiment of the present invention.
图47是依本发明的上述较佳实施例的所述摄像模组被沿着中间位置剖开后的内部结构示意图。Figure 47 is a schematic view showing the internal structure of the camera module according to the above preferred embodiment of the present invention taken along the intermediate position.
图48是图47的局部位置放大示意图。Figure 48 is an enlarged schematic view showing a partial position of Figure 47.
图49A是依本发明的上述较佳实施例的所述摄像模组的所述支座的一个视角的立体示意图。FIG. 49A is a perspective view showing a viewing angle of the holder of the camera module according to the above preferred embodiment of the present invention.
图49B是依本发明的上述较佳实施例的所述摄像模组的所述支座的另一个视角的立体示意图。Figure 49B is a perspective view showing another perspective of the holder of the camera module according to the above preferred embodiment of the present invention.
图49C是依本发明的上述较佳实施例的所述摄像模组的所述支座的剖视示意图。Figure 49C is a cross-sectional view of the holder of the camera module in accordance with the above preferred embodiment of the present invention.
图50是依本发明的上述较佳实施例的的所述摄像模组的一个变形实施方式的分解示意图。Figure 50 is an exploded perspective view showing a modified embodiment of the camera module according to the above preferred embodiment of the present invention.
图51是依本发明的上述较佳实施例的的所述摄像模组的另一个变形实施方式的分解示意图。Figure 51 is an exploded perspective view showing another modified embodiment of the camera module according to the above preferred embodiment of the present invention.
图52是依本发明的上述较佳实施例的的所述摄像模组的另一个变形实施方式的分解示意图。Figure 52 is an exploded perspective view showing another modified embodiment of the camera module according to the above preferred embodiment of the present invention.
图53是依本发明的上述较佳实施例的的所述摄像模组的另一个变形实施方式的分解示意图。Figure 53 is an exploded perspective view showing another modified embodiment of the camera module according to the above preferred embodiment of the present invention.
图54是依本发明的上述较佳实施例的的所述摄像模组的另一个变形实施方式的分解示意图。Figure 54 is an exploded perspective view showing another modified embodiment of the camera module according to the above preferred embodiment of the present invention.
具体实施方式Detailed ways
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例,本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。The following description is presented to disclose the invention to enable those skilled in the art to practice the invention. The preferred embodiments in the following description are by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention as defined in the following description may be applied to other embodiments, modifications, improvements, equivalents, and other embodiments without departing from the spirit and scope of the invention.
本领域技术人员应理解的是,在本发明的揭露中,术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系,其仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此上述术语不能理解为对本发明的限制。It should be understood by those skilled in the art that in the disclosure of the present invention, the terms "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", " The orientation or positional relationship of the indications of "upright", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is merely for convenience of description of the present invention and The above description of the invention is not to be construed as a limitation of the invention.
可以理解的是,术语“一”应理解为“至少一”或“一个或多个”,即在一个实施例中,一个元件的数量可以为一个,而在另外的实施例中,该元件的数量可以为多个,术语“一”不能理解为对数量的限制。It will be understood that the term "a" is understood to mean "at least one" or "one or more", that is, in one embodiment, the number of one element may be one, and in other embodiments, the element The number can be multiple, and the term "a" cannot be construed as limiting the quantity.
参考本发明的说明书附图之图1,依本发明的一较佳实施例的一电子设备被 阐述,其中所述电子设备包括至少一摄像模组100和一设备本体200,其中所述摄像模组100被设置于所述设备本体200,以帮助所述设备本体200获取影像(例如视频或者图像)。Referring to FIG. 1 of the accompanying drawings of the present invention, an electronic device according to a preferred embodiment of the present invention is illustrated, wherein the electronic device includes at least one camera module 100 and a device body 200, wherein the camera module The group 100 is disposed on the device body 200 to assist the device body 200 in acquiring images (eg, video or images).
值得一提的是,尽管在附图1中示出的所述电子设备的示例中,所述摄像模组100被设置于所述设备本体200的背侧(背对着所述设备本体200的显示屏幕的一侧),可以理解的是,所述摄像模组100也可以被设置于所述设备本体200的正侧(所述设备本体200的显示屏幕所在的一侧),或者至少一个所述摄像模组100被设置于所述设备本体200的背侧和至少一个所述摄像模组100被设置于所述设备本体200的正侧,即在所述设备本体200的背侧和正侧均设有至少一个所述摄像模组100。尽管如此,本领域的技术人员可以理解的是,在所述电子设备的其他示例中,将一个或者多个所述摄像模组100设置在所述设备本体200的侧面也是有可能的。It is worth mentioning that, in the example of the electronic device shown in FIG. 1 , the camera module 100 is disposed on the back side of the device body 200 (facing away from the device body 200 It is understood that the camera module 100 can also be disposed on the positive side of the device body 200 (the side where the display screen of the device body 200 is located), or at least one The camera module 100 is disposed on the back side of the device body 200 and at least one of the camera modules 100 is disposed on the front side of the device body 200, that is, on the back side and the front side of the device body 200. At least one of the camera modules 100 is provided. Nonetheless, it will be understood by those skilled in the art that in other examples of the electronic device, it is also possible to have one or more of the camera modules 100 disposed on the side of the device body 200.
另外,所述摄像模组100的类型在本发明的所述电子设备中不受限制,尽管在附图1中示出的示例中以所述摄像模组100被实施为单镜头摄像模组为例,而在其他的示例中,所述摄像模组100也可以被实施为阵列摄像模组,例如但不限于双镜头摄像模组。In addition, the type of the camera module 100 is not limited in the electronic device of the present invention, although in the example shown in FIG. 1 , the camera module 100 is implemented as a single-lens camera module. For example, in other examples, the camera module 100 can also be implemented as an array camera module, such as but not limited to a dual lens camera module.
另外,尽管在附图1中示出的所述电子设备的所述设备本体200为智能手机,而在其他的示例中,所述设备本体200还可以被实施为但不限于平板电脑、电子书、MP3/4/5、个人数字助理、相机、电视机、洗衣机、冰箱等任何能够被配置所述摄像模组100的电子产品。In addition, although the device body 200 of the electronic device shown in FIG. 1 is a smart phone, in other examples, the device body 200 may be implemented as, but not limited to, a tablet computer, an e-book. Any of the electronic products that can be configured with the camera module 100, such as MP3/4/5, personal digital assistant, camera, television, washing machine, refrigerator, and the like.
参考本发明的说明书附图之附图2至图6B,依本发明的一较佳实施例的所述摄像模组在接下来的描述中被阐述,其中所述摄像模组100包括至少一光学镜头10和至少一模塑感光单元20,其中所述模塑感光单元20进一步包括至少一电路板21、至少一感光元件22以及至少一模塑基座23,其中所述感光元件22被导通地连接于所述电路板21,所述模塑基座23一体地结合于所述电路板21,其中所述光学镜头10被保持在所述感光元件22的感光路径。所述模塑基座23在一体地结合于所述电路板21的同时形成至少一光窗231,其中所述光窗231形成所述光学镜头10和所述感光元件22之间的光线通路。Referring to Figures 2 to 6B of the accompanying drawings of the present invention, the camera module according to a preferred embodiment of the present invention is illustrated in the following description, wherein the camera module 100 includes at least one optical The lens 10 and the at least one molded photosensitive unit 20, wherein the molded photosensitive unit 20 further comprises at least one circuit board 21, at least one photosensitive element 22, and at least one molded base 23, wherein the photosensitive element 22 is turned on Connected to the circuit board 21, the molding base 23 is integrally coupled to the circuit board 21, wherein the optical lens 10 is held in a photosensitive path of the photosensitive member 22. The molding base 23 forms at least one light window 231 while being integrally coupled to the circuit board 21, wherein the light window 231 forms a light path between the optical lens 10 and the photosensitive element 22.
所述摄像模组100进一步包括至少一滤光单元30,其中所述滤光单元30包括至少一滤光元件31,其中所述滤光元件31被保持在所述光学镜头10和所述感光元件22之间。被物体反射的光线在自所述光学镜头10进入所述摄像模组100的内部后,能够被所述滤光元件31过滤,然后在穿过所述模塑基座23的所述光窗231后再被所述感光元件22接收和进行光电转化而成像。The camera module 100 further includes at least one filter unit 30, wherein the filter unit 30 includes at least one filter element 31, wherein the filter element 31 is held by the optical lens 10 and the photosensitive element Between 22. The light reflected by the object can be filtered by the filter element 31 after entering the inside of the camera module 100 from the optical lens 10, and then passed through the light window 231 passing through the molded base 23. It is then imaged by the photosensitive element 22 and subjected to photoelectric conversion.
值得一提的是,所述滤光单元30的所述滤光元件31的类型在本发明的所述摄像模组100中不受限制,例如所述滤光元件31可以是但不限于红外截止滤光片、全透光谱滤光片。It is to be noted that the type of the filter element 31 of the filter unit 30 is not limited in the camera module 100 of the present invention. For example, the filter element 31 may be, but not limited to, an infrared cutoff. Filter, full transparency filter.
所述模塑感光单元20的所述电路板21能够和所述设备本体200相互连接,例如所述模塑感光单元20的所述电路板21和所述设备本体200能够被电连接, 以使所述摄像模组100被安装和被连接于所述设备本体200。被所述感光元件22进行光电转化后得到的关于物体的影像的数字信号能够在后续被发送至所述设备本体200,例如但不限于可以被存储在所述设备本体200的存储器中,也可以通过所述设备本体200被存储至云端,或者被显示在所述设备本体200的显示屏幕上。作为优选,当所述感光元件22进行光电转化后得到的关于物体的影像的数字信号被发送至所述设备本体200后,能够在被存储到所述存储器或者所述云端的同时被显示在所述设备本体200的显示屏幕上。The circuit board 21 of the molded photosensitive unit 20 can be connected to the apparatus body 200, for example, the circuit board 21 of the molded photosensitive unit 20 and the apparatus body 200 can be electrically connected so that The camera module 100 is mounted and connected to the device body 200. The digital signal about the image of the object obtained by photoelectric conversion of the photosensitive element 22 can be subsequently sent to the device body 200, such as but not limited to being stored in the memory of the device body 200, or The device body 200 is stored to the cloud or displayed on the display screen of the device body 200. Preferably, after the digital signal about the image of the object obtained by the photoelectric conversion of the photosensitive element 22 is transmitted to the device body 200, it can be displayed while being stored in the memory or the cloud. On the display screen of the device body 200.
进一步地,所述电路板21进一步包括至少一基板211和至少一连接板212,其中所述感光元件22被导通地连接于所述基板211,其中所述连接板212具有一模组连接端2121和对应于所述模组连接端2121的一设备连接端2122,其中所述连接板212的所述模组连接端2121被导通地连接于所述基板211,所述连接板212的所述设备连接端2122被电连接于所述设备本体200。Further, the circuit board 21 further includes at least one substrate 211 and at least one connecting plate 212, wherein the photosensitive element 22 is electrically connected to the substrate 211, wherein the connecting plate 212 has a module connecting end 2121 and a device connection end 2122 corresponding to the module connection end 2121, wherein the module connection end 2121 of the connection board 212 is electrically connected to the substrate 211, and the connection board 212 The device connection end 2122 is electrically connected to the device body 200.
在一个实施例中,所述连接板212的所述模组连接端2121通过一连接介质2123被贴装于所述基板211,例如所述连接板212的所述模组连接端2121能够通过但不限于各向异性导电胶被贴装于所述基板211,从而使所述连接板212的所述模组连接端2121被导通地连接于所述基板211。换言之,所述连接介质2123能够被实施为但不限于各向异性导电胶。可选地,所述连接板212的所述模组连接端2121一体地延伸于所述基板211,即,所述连接板212和所述基板211是一体式结构。In one embodiment, the module connection end 2121 of the connection board 212 is mounted on the substrate 211 through a connection medium 2123. For example, the module connection end 2121 of the connection board 212 can pass through The anisotropic conductive paste is not limited to being attached to the substrate 211 such that the module connection end 2121 of the connection plate 212 is electrically connected to the substrate 211. In other words, the connection medium 2123 can be implemented as, but not limited to, an anisotropic conductive paste. Optionally, the module connecting end 2121 of the connecting board 212 integrally extends to the substrate 211, that is, the connecting board 212 and the substrate 211 are a unitary structure.
另外,所述连接板212包括一连接器2124,其中所述连接器2124被设置于所述连接板212的所述设备连接端2122,或者所述连接器2124形成于所述连接板212的所述设备连接端2122,其中通过所述连接板212的所述连接器2124能够将所述连接板212的所述设备连接端2122方便地电连接于所述设备本体200。In addition, the connecting plate 212 includes a connector 2124, wherein the connector 2124 is disposed at the device connecting end 2122 of the connecting plate 212, or the connector 2124 is formed at the connecting plate 212. The device connection end 2122 is configured such that the device connection end 2122 of the connection plate 212 can be conveniently electrically connected to the device body 200 through the connector 2124 of the connection plate 212.
值得一提的是,所述连接板212是软质的,其能够产生变形,其中所述摄像模组100通过所述连接板212被连接于所述设备本体200,通过这样的方式,所述连接板212能够缓冲所述摄像模组100的制造公差造成的装配位移和变形,和在所述设备本体200被使用的过程中由于震动而造成的所述摄像模组100的位移,从而保证所述电子设备在被使用的过程中的可靠性。It is worth mentioning that the connecting plate 212 is soft and can be deformed, wherein the camera module 100 is connected to the device body 200 through the connecting plate 212. In this way, the The connecting plate 212 can buffer assembly displacement and deformation caused by manufacturing tolerances of the camera module 100, and displacement of the camera module 100 due to vibration during use of the device body 200, thereby ensuring The reliability of the electronic device in the process of being used.
所述基板211具有一基板正面2111和一基板背面2112,其中所述基板正面2111和所述基板背面2112相互对应。通常情况下,所述基板211呈平板状,从而所述基板211的所述基板正面2111和所述基板背面2112均是平面,这样,所述基板211的所述基板正面2111和所述基板背面2112能够界定所述基板211的厚度尺寸。也就是说,所述基板211的所述基板正面2111和所述基板背面2112之间的距离尺寸为所述基板211的厚度尺寸。可选地,所述基板211的所述基板正面2111或者所述基板背面2112可以设有一个凹槽,例如,所述凹槽可以被设于所述基板211的所述基板正面2111或者所述基板背面2112的边缘,以供容纳所述连接板212的所述模组连接端2121,这样,能够降低所述连接板212的所述模组连接端2121与所述基板211的所述基板正面2111的高度差,或者降低所 述连接板212的所述模组连接端2121与所述基板211的所述基板背面2112的高度差。例如,在所述连接板212的所述模组连接端2121被连接于所述基板211的所述基板正面2111时,所述连接板212的所述模组连接端2121可以被容纳于所述基板211的所述凹槽,以避免所述连接板212的所述模组连接端2121凸出于所述基板211的所述基板正面2111。The substrate 211 has a substrate front surface 2111 and a substrate back surface 2112, wherein the substrate front surface 2111 and the substrate back surface 2112 correspond to each other. Generally, the substrate 211 has a flat shape, so that the substrate front surface 2111 and the substrate back surface 2112 of the substrate 211 are both planar, such that the substrate front surface 2111 and the substrate back surface of the substrate 211 2112 can define a thickness dimension of the substrate 211. That is, the distance dimension between the substrate front surface 2111 and the substrate back surface 2112 of the substrate 211 is the thickness dimension of the substrate 211. Optionally, the substrate front surface 2111 or the substrate back surface 2112 of the substrate 211 may be provided with a recess. For example, the recess may be disposed on the substrate front surface 2111 of the substrate 211 or the An edge of the back surface 2112 of the substrate for accommodating the module connection end 2121 of the connection board 212, so that the module connection end 2121 of the connection board 212 and the front side of the substrate of the substrate 211 can be reduced. The height difference of 2111 is reduced, or the height difference between the module connection end 2121. of the connection plate 212 and the substrate back surface 2112 of the substrate 211 is lowered. For example, when the module connection end 2121 of the connection board 212 is connected to the substrate front surface 2111 of the substrate 211, the module connection end 2121 of the connection board 212 may be accommodated in the The recess of the substrate 211 prevents the module connection end 2121 of the connecting board 212 from protruding from the substrate front surface 2111 of the substrate 211.
参考附图4A示出的所述摄像模组100的一个示例,所述基板211进一步具有至少一平整的贴装区域2113和环绕在所述贴装区域2113四周的一边缘区域2114,其中所述贴装区域2113和所述边缘区域2114分别形成于所述基板211的所述基板正面2111。所述感光元件22具有一感光区域221和环绕在所述感光区域221四周的一非感光区域222,其中所述感光元件22被贴装于所述基板211的所述贴装区域2113,其中所述模塑基座23一体地结合于所述基板211的所述边缘区域2114的至少一部分,所述模塑基座23环绕在所述感光元件22的所述感光区域221的四周,以使所述感光元件22的所述感光区域221对应于所述模塑基座23的所述光窗231。可以理解的是,所述模塑基座23自所述基板211的所述基板正面2111向上延伸,可以形成一环形的光墙26,其环绕在所述感光元件22的所述感光区域221的四周,并且所述光墙26在所述感光元件22的所述感光区域221对应的位置形成所述光窗231,以供光线在穿过所述光窗231后被所述感光元件22的所述感光区域221接收和进行光电转化而成像。Referring to an example of the camera module 100 shown in FIG. 4A, the substrate 211 further has at least one flat mounting area 2113 and an edge area 2114 surrounding the mounting area 2113, wherein the A mounting region 2113 and the edge region 2114 are formed on the substrate front surface 2111 of the substrate 211, respectively. The photosensitive element 22 has a photosensitive area 221 and a non-sensitive area 222 surrounding the photosensitive area 221, wherein the photosensitive element 22 is mounted on the mounting area 2113 of the substrate 211, wherein The molding base 23 is integrally coupled to at least a portion of the edge region 2114 of the substrate 211, and the molding base 23 surrounds the photosensitive region 221 of the photosensitive member 22 so that The photosensitive region 221 of the photosensitive member 22 corresponds to the light window 231 of the molded base 23. It can be understood that the molding base 23 extends upward from the substrate front surface 2111 of the substrate 211, and an annular light wall 26 can be formed, which surrounds the photosensitive region 221 of the photosensitive element 22. The light window 231 is formed at a position corresponding to the photosensitive region 221 of the photosensitive member 22 to provide light to be passed by the photosensitive member 22 after passing through the light window 231. The photosensitive region 221 receives and performs photoelectric conversion for imaging.
另外,所述模塑基座23具有一顶表面232、一基座内表面234以及一基座外表面235,其中所述基座内表面234用于形成所述光窗231,所述基座外表面235裸露在所述模塑基座23的外部,所述顶表面232向内和向外延伸以分别连接于所述基座内表面234和所述基座外表面235。所述模塑基座23可以由模塑工艺形成,例如但不限于传递模塑或者模压模塑均可以形成所述模塑基座23,通过模塑工艺形成的所述模塑基座23的所述顶表面232的平整度更高,以有利于改善所述摄像模组100的光学性能。Additionally, the molded base 23 has a top surface 232, a base inner surface 234, and a base outer surface 235, wherein the base inner surface 234 is used to form the light window 231, the base The outer surface 235 is exposed outside of the molded base 23, the top surface 232 extending inwardly and outwardly to be coupled to the base inner surface 234 and the base outer surface 235, respectively. The molding base 23 may be formed by a molding process, such as, but not limited to, transfer molding or press molding, which may form the molding base 23, and the molding base 23 formed by a molding process The flatness of the top surface 232 is higher to facilitate improving the optical performance of the camera module 100.
进一步地,所述模塑基座23的所述基座内表面234倾斜地延伸,以使所述模塑基座23的所述光窗231的截面呈倒梯形,通过这样的方式,能够有效地避免杂散光,以改善所述摄像模组100的光学性能。换言之,所述模塑基座23的所述光窗231具有一上部开口2311和对应于所述上部开口2311的一下部开口2312,其中所述感光元件22的所述感光区域221被保持在所述光窗231的所述下部开口2312,所述上部开口2311朝向所述光学镜头10,即,将所述光窗231的靠近所述基板211的一侧的开口定义为所述下部开口2312,将所述光窗231的靠近所述光学镜头10的一侧的开口定义为所述上部开口2311,其中所述上部开口2311的尺寸大于所述下部开口2312的尺寸,通过这样的方式,能够有效地避免杂散光,以改善所述摄像模组100的光学性能。Further, the base inner surface 234 of the molded base 23 extends obliquely so that the cross section of the light window 231 of the molded base 23 is inverted trapezoid, and in this way, can be effective Stray light is avoided to improve the optical performance of the camera module 100. In other words, the light window 231 of the molding base 23 has an upper opening 2311 and a lower opening 2312 corresponding to the upper opening 2311, wherein the photosensitive region 221 of the photosensitive member 22 is held in the The lower opening 2312 of the light window 231, the upper opening 2311 is directed toward the optical lens 10, that is, an opening of a side of the light window 231 close to the substrate 211 is defined as the lower opening 2312, An opening of the light window 231 on a side close to the optical lens 10 is defined as the upper opening 2311, wherein the size of the upper opening 2311 is larger than the size of the lower opening 2312, and in this way, can be effective Stray light is avoided to improve the optical performance of the camera module 100.
通常情况下,所述基板211具有良好的硬度,以保证所述基板211的平整性,通过这样的方式,当所述感光元件22被贴装于所述基板211的所述贴装区域2113后,所述感光元件22的平整度能够被保证。例如,所述基板211可以是但不限 于硬板、硬软结合板、陶瓷基板等。在所述模塑基座23一体地结合于所述基板211之后,所述模塑基座23还能够补强所述基板211的强度,以使所述基板211更为平整。另外,所述模塑基座23还具有良好的散热性,当所述感光元件22产生的热量在被传递到所述基板211之后,所述模塑基座23能够快速地将被传递到所述基板211的热量辐射至所述摄像模组100的外部环境,这样,能够保证被长时间使用的所述摄像模组100的稳定性和可靠性。In general, the substrate 211 has good hardness to ensure the flatness of the substrate 211. In this manner, after the photosensitive member 22 is mounted on the mounting area 2113 of the substrate 211, The flatness of the photosensitive member 22 can be ensured. For example, the substrate 211 may be, but is not limited to, a hard board, a hard and soft bonding board, a ceramic substrate, or the like. After the molding base 23 is integrally bonded to the substrate 211, the molding base 23 can also reinforce the strength of the substrate 211 to make the substrate 211 flatter. In addition, the molded base 23 also has good heat dissipation properties, and the molded base 23 can be quickly transferred to the heat after the heat generated by the photosensitive member 22 is transferred to the substrate 211. The heat of the substrate 211 is radiated to the external environment of the camera module 100, so that the stability and reliability of the camera module 100 used for a long time can be ensured.
进一步地,所述模塑感光单元20进一步包括至少一连接线24,其中所述连接线24的两个端部分别被导通地连接于所述感光元件22和所述基板211,以使被贴装于所述基板211的所述贴装区域2113的所述感光元件22通过所述连接线24被导通地连接于所述基板211。Further, the molded photosensitive unit 20 further includes at least one connecting wire 24, wherein both ends of the connecting wire 24 are electrically connected to the photosensitive member 22 and the substrate 211, respectively, so as to be The photosensitive element 22 attached to the mounting region 2113 of the substrate 211 is electrically connected to the substrate 211 via the connection line 24.
具体地说,所述基板211进一步具有至少一基板连接件2115,其中每个所述基板连接件2115分别被设置于所述基板211的所述边缘区域2114。例如,所述基板连接件2115可以排列成但不限于两组,并且每组所述基板连接件2115分别被对称地设置于所述贴装区域2113的两侧。相应地,所述感光元件22具有至少一芯片连接件223,其中每个所述芯片连接件223分别被设置于所述感光元件22的所述非感光区域222。例如,所述芯片连接件223可以排列成但不限于两组,并且每组所述芯片连接件223分别被对称地设置于所述感光区域221的两侧。Specifically, the substrate 211 further has at least one substrate connector 2115, wherein each of the substrate connectors 2115 is disposed on the edge region 2114 of the substrate 211, respectively. For example, the substrate connectors 2115 may be arranged in, but not limited to, two groups, and each of the set of substrate connectors 2115 is symmetrically disposed on both sides of the mounting area 2113. Accordingly, the photosensitive element 22 has at least one chip connector 223, wherein each of the chip connectors 223 is disposed in the non-photosensitive region 222 of the photosensitive member 22, respectively. For example, the chip connectors 223 may be arranged in, but not limited to, two groups, and each of the chip connectors 223 is symmetrically disposed on both sides of the photosensitive region 221.
优选地,在将所述感光元件22贴装于所述基板211的所述贴装区域2113之后,被设置于所述感光元件22的所述非感光区域222的每个所述芯片连接件223分别对应于被设置于所述基板211的所述边缘区域2114的每个所述基板连接件2115。Preferably, after the photosensitive member 22 is attached to the mounting region 2113 of the substrate 211, each of the chip connectors 223 of the non-photosensitive region 222 of the photosensitive member 22 is disposed. Each of the substrate connectors 2115 is disposed to the edge region 2114 of the substrate 211, respectively.
所述连接线24的两个端部分别被连接于所述基板211的所述基板连接件2115和所述感光元件22的所述芯片连接件223,以导通地连接所述感光元件22和所述基板211。例如,可以通过打线工艺在所述基板211的所述基板连接件2115和所述感光元件22的所述芯片连接件223之间形成所述连接线24,通过这样的方式,藉由所述连接线24导通地连接所述感光元件22和所述基板211。The two ends of the connecting wire 24 are respectively connected to the substrate connecting member 2115 of the substrate 211 and the chip connecting member 223 of the photosensitive member 22 to electrically connect the photosensitive member 22 and The substrate 211. For example, the connecting line 24 may be formed between the substrate connecting member 2115 of the substrate 211 and the chip connecting member 223 of the photosensitive member 22 by a wire bonding process, by way of The connecting wire 24 electrically connects the photosensitive member 22 and the substrate 211.
值得一提的是,所述连接线24的打线方向在本发明的所述摄像模组100中不受限制,例如所述连接线24的打线方向可以是从所述基板211向所述感光元件22,也可以是从所述感光元件22向所述基板211。另外,所述连接线24的类型在本发明的所述摄像模组100中也可以不受限制,例如所述连接线24可以是金线、引线、铜线等。It is to be noted that the wire bonding direction of the connecting wire 24 is not limited in the camera module 100 of the present invention. For example, the wire bonding direction of the connecting wire 24 may be from the substrate 211 to the The light receiving element 22 may be from the light receiving element 22 to the substrate 211. In addition, the type of the connecting line 24 is not limited in the camera module 100 of the present invention. For example, the connecting line 24 may be a gold wire, a lead wire, a copper wire or the like.
可选地,在所述摄像模组100的其他的一些示例中,所述基板211的所述基板连接件2115可以被设置于所述基板211的所述贴装区域2113,所述感光元件22的所述芯片连接件223可以被设置于所述感光元件22的芯片背面224,其中在将所述感光元件22贴装于所述基板211的所述贴装区域2113时,所述感光元件22的所述芯片连接件223和所述基板211的所述基板连接件2115能够因直接接触而被导通,从而使所述感光元件22被可导通地连接于所述基板211。换言之,在将所述感光元件22贴装于所述基板211的同时,所述感光元件22可以被 直接导通地连接于所述基板211。Optionally, in other examples of the camera module 100, the substrate connector 2115 of the substrate 211 may be disposed on the mounting area 2113 of the substrate 211, and the photosensitive element 22 The chip connector 223 may be disposed on the chip back surface 224 of the photosensitive element 22, wherein the photosensitive element 22 is mounted when the photosensitive element 22 is mounted on the mounting area 2113 of the substrate 211 The chip connector 223 and the substrate connector 2115 of the substrate 211 can be electrically connected by direct contact, so that the photosensitive element 22 is electrically connected to the substrate 211. In other words, the photosensitive member 22 can be directly electrically connected to the substrate 211 while the photosensitive member 22 is attached to the substrate 211.
进一步地,所述模塑感光单元20进一步包括至少一电子元器件25,其中所述电子元器件25被导通地连接于所述基板211。Further, the molded photosensitive unit 20 further includes at least one electronic component 25, wherein the electronic component 25 is electrically connected to the substrate 211.
在本发明的所述摄像模组100的一个示例中,所述电子元器件25可以被贴装于所述基板211的所述边缘区域2114。可选地,所述电子元器件25的一部分或者全部可以被埋入所述基板211。还可选地,一部分所述电子元器件25也可以被贴装于所述基板211的所述基板背面2112,或者位于所述基板211的所述基板背面2112的所述电子元器件25的一部分或者全部被埋入所述基板211。In an example of the camera module 100 of the present invention, the electronic component 25 may be mounted on the edge region 2114 of the substrate 211. Alternatively, part or all of the electronic component 25 may be buried in the substrate 211. Optionally, a part of the electronic component 25 may also be mounted on the substrate back surface 2112 of the substrate 211 or a part of the electronic component 25 located on the substrate back surface 2112 of the substrate 211. Or all of the substrate 211 is buried.
值得一提的是,所述电子元器件25的类型不受限制,例如所述电子元器件25可以被实施为但不限于驱动器、继电器、处理器、电阻、电容等。参考附图4A,所述模塑基座23在一体地结合于所述基板211的所述边缘区域2114之后可以没有包埋所述电子元器件25,也可以包埋至少一个所述电子元器件25的至少一部分。优选地,所述模塑基座23在一体地结合于所述基板211的所述边缘区域2114之后包埋全部的所述电子元器件25。可以理解的是,通过所述模塑基座23在成型后包埋所述电子元器件25的方式,能够藉由所述模塑基座23阻止所述电子元器件25和外部环境接触,从而避免所述电子元器件25的表面出现氧化等不良现象。所述模塑基座23还可以隔离相邻所述电子元器件25,以阻止相邻所述电子元器件25之间出现相互干扰的不良现象。另外,通过所述模塑基座23在成型后包埋所述电子元器件25的方式,所述模塑基座23还能够使相邻所述电子元器件25之间的间距更小,从而使得所述基板211的有限贴装面积上能够被贴装数量更多、尺寸更大的所述电子元器件25。It is worth mentioning that the type of the electronic component 25 is not limited. For example, the electronic component 25 can be implemented as, but not limited to, a driver, a relay, a processor, a resistor, a capacitor, or the like. Referring to FIG. 4A, the molding base 23 may be embedded in the edge region 2114 of the substrate 211 without embedding the electronic component 25, or may embed at least one of the electronic components. At least part of 25. Preferably, the molding base 23 embeds all of the electronic components 25 after being integrally bonded to the edge regions 2114 of the substrate 211. It can be understood that, by the molding base 23 embedding the electronic component 25 after molding, the electronic component 25 can be prevented from contacting the external environment by the molding base 23, thereby A problem such as oxidation of the surface of the electronic component 25 is prevented. The molded base 23 can also isolate adjacent electronic components 25 to prevent mutual interference between adjacent electronic components 25. In addition, the molding base 23 can also make the spacing between adjacent electronic components 25 smaller by the manner in which the molded base 23 embeds the electronic component 25 after molding. The electronic component 25 having a larger number and larger size can be mounted on the limited mounting area of the substrate 211.
另外,所述模塑基座23也能够隔离所述电子元器件25和所述感光元件22,以避免所述电子元器件25的表面的脱落物污染所述感光元件22的所述感光区域221。例如,所述模塑基座23能够通过包埋所述电子元器件25的方式隔离所述电子元器件25和所述感光元件22,也可以使所述电子元器件25和所述感光元件22分别位于所述模塑基座23的两侧的方式隔离所述电子元器件25和所述感光元件22。In addition, the molding base 23 can also isolate the electronic component 25 and the photosensitive element 22 to prevent the surface of the electronic component 25 from escaping the photosensitive region 221 of the photosensitive element 22. . For example, the molding base 23 can isolate the electronic component 25 and the photosensitive element 22 by embedding the electronic component 25, and the electronic component 25 and the photosensitive element 22 can also be made. The electronic component 25 and the photosensitive element 22 are isolated in such a manner as to be located on both sides of the molded base 23.
值得一提的是,在所述摄像模组100的其他示例中,所述摄像模组100也可以没有所述电子元器件25,参考附图27B,通过这样的方式,所述摄像模组100的长宽尺寸和高度尺寸均可以被设计的更小,以使所述摄像模组100特别能够满足轻薄化电子设备的配置需要。可以理解的是,当所述摄像模组100被装配于所述设备本体200后,所述摄像模组100能够被导通地连接于所述设备本体200的电子元器件,以藉由所述设备本体200的电子元器件处理所述摄像模组100因进行光电转化而得到的电信号。It is to be noted that in other examples of the camera module 100, the camera module 100 may not have the electronic component 25, and the camera module 100 is in this manner. Both the length and width dimensions and the height dimensions can be designed to be smaller, so that the camera module 100 can meet the configuration requirements of the thin and light electronic device. It can be understood that, after the camera module 100 is assembled to the device body 200, the camera module 100 can be electrically connected to the electronic components of the device body 200 by the The electronic component of the device body 200 processes an electrical signal obtained by the imaging module 100 by photoelectric conversion.
参考附图2至图6B,所述滤光单元30包括至少一框型的支座32,其中所述支座32具有至少一通光通道321,其中所述滤光元件31被贴装于所述支座32,并且所述滤光元件31封闭所述支座32的所述通光通道321。所述支座32被贴装于所述模塑基座23的所述顶表面232,以使所述模塑基座23的所述光窗231 对应于被贴装于所述支座32的所述滤光元件31。2 to 6B, the filter unit 30 includes at least one frame type holder 32, wherein the holder 32 has at least one light passage 321 in which the filter element 31 is mounted. The holder 32 and the filter element 31 close the light passage 321 of the holder 32. The holder 32 is attached to the top surface 232 of the molding base 23 such that the light window 231 of the molding base 23 corresponds to being attached to the holder 32. The filter element 31.
值得一提的是,因所述模塑基座23是通过模塑工艺一体地结合于所述基板211的所述基板正面2111,因此,所述模塑基座23的所述顶表面232具有较高的平整度,从而在所述支座32被贴装于所述模塑基座23的所述顶表面232之后,能够保证所述滤光元件31的中轴和所述感光元件22的中轴的一致性,从而改善所述摄像模组100的光学性能。即,所述感光元件22的光轴可以被保证垂直于所述滤光元件31。It is worth mentioning that, since the molding base 23 is integrally bonded to the substrate front surface 2111 of the substrate 211 by a molding process, the top surface 232 of the molding base 23 has a higher degree of flatness, so that after the holder 32 is attached to the top surface 232 of the molded base 23, the central axis of the filter element 31 and the photosensitive element 22 can be secured. The consistency of the central axis improves the optical performance of the camera module 100. That is, the optical axis of the photosensitive element 22 can be ensured to be perpendicular to the filter element 31.
在所述滤光单元30的所述支座32被贴装于所述模塑基座23的所述顶表面232之后,所述滤光单元30和所述模塑感光单元20形成一感光装置1000。换言之,所述感光装置1000包括一个所述模塑感光单元20和被贴装于所述模塑感光单元20的至少一个所述滤光单元30。可以理解的是,所述摄像模组100包括至少一个所述光学镜头10和至少一个所述感光装置1000,其中所述光学镜头10被保持在所述感光装置1000的所述感光元件22的感光路径上。After the holder 32 of the filter unit 30 is attached to the top surface 232 of the molding base 23, the filter unit 30 and the molded photosensitive unit 20 form a photosensitive device 1000. In other words, the photosensitive device 1000 includes one of the molded photosensitive unit 20 and at least one of the filter units 30 attached to the molded photosensitive unit 20. It is to be understood that the camera module 100 includes at least one of the optical lens 10 and at least one of the photosensitive devices 1000, wherein the optical lens 10 is held by the photosensitive element 22 of the photosensitive device 1000. On the path.
所述感光装置1000包括至少一贴装层1001,其由一贴装介质1002形成,其中所述贴装层1001被保持在所述滤光单元30的所述支座32和所述模塑感光单元20的所述模塑基座23的所述顶表面232之间,以供将所述支座32贴装于所述模塑基座23的所述顶表面232。The photosensitive device 1000 includes at least one mounting layer 1001 formed of a mounting medium 1002, wherein the mounting layer 1001 is held by the holder 32 of the filter unit 30 and the molding photosensitive Between the top surfaces 232 of the molded base 23 of the unit 20, the support 32 is attached to the top surface 232 of the molded base 23.
值得一提的是,所述贴装介质1002的类型在本发明的所述摄像模组100中不受限制,例如所述贴装介质1002可以是但不限于胶水,其中所述贴装介质1002在固化后形成被保持在所述支座32和所述模塑基座23的所述顶表面232之间的所述贴装层1001。It is to be noted that the type of the mounting medium 1002 is not limited in the camera module 100 of the present invention. For example, the mounting medium 1002 may be, but not limited to, glue, wherein the mounting medium 1002 The mounting layer 1001 held between the holder 32 and the top surface 232 of the molding base 23 is formed after curing.
所述感光装置1000进一步具有至少一密封空间101和至少一通气通道102,其中在所述支座32被贴装于所述模塑基座23的所述顶表面232之后,在所述滤光单元30和所述模塑感光单元20之间形成所述密封空间101,例如在本发明的所述摄像模组100的一个具体的示例中,可以在所述滤光元件31、所述支座32、所述模塑基座23和所述基板211之间形成所述密封空间101。可选地,在所述摄像模组100的其他的示例中,也可以在所述滤光元件31、所述支座32、所述模塑基座23和所述感光元件22之间形成所述密封空间101。所述感光元件22的所述感光区域221被保持在所述密封空间101。所述通气通道102用于连通所述密封空间101和所述感光装置1000的外部,以在制造所述摄像模组100的过程中用于平衡所述密封空间101的内部气压和所述感光装置1000的外部气压。也就是说,所述密封空间101内的气体和所述感光装置1000的外部的气体能够通过所述通气通道102进行交换,这样,在所述摄像模组100被制造的过程中,通过所述通气通道102能够保证所述密封空间101的气压压力和外部环境的气压压力保持平衡,从而能够避免出现所述感光装置1000的用于形成所述密封空间101的每个部件因受压不平衡而被损坏的不良现象,尤其是能够保证所述滤光元件31的上部和下部受到的气压压力一致,从而避免因所述滤光元件31的上部和下部受到的气压压力不平衡而导致所述滤光元件31出现裂纹或者碎裂的不良现 象。The photosensitive device 1000 further has at least one sealed space 101 and at least one venting passage 102, wherein the filter is mounted after the support 32 is mounted on the top surface 232 of the molded base 23. The sealed space 101 is formed between the unit 30 and the molded photosensitive unit 20, for example, in a specific example of the camera module 100 of the present invention, the filter element 31, the holder may be 32. The sealed space 101 is formed between the molded base 23 and the substrate 211. Optionally, in other examples of the camera module 100, a gap may be formed between the filter element 31, the holder 32, the molding base 23, and the photosensitive element 22. The sealed space 101 is described. The photosensitive region 221 of the photosensitive member 22 is held in the sealed space 101. The ventilation passage 102 is configured to communicate the sealed space 101 and the outside of the photosensitive device 1000 for balancing the internal air pressure of the sealed space 101 and the photosensitive device in the process of manufacturing the camera module 100 1000 external pressure. That is, the gas in the sealed space 101 and the gas outside the photosensitive device 1000 can be exchanged through the venting passage 102, so that during the manufacturing process of the camera module 100, The venting passage 102 can ensure that the pressure of the air pressure of the sealed space 101 and the pressure of the external environment are balanced, so that it is possible to avoid the occurrence of pressure imbalance due to the occurrence of each component of the photosensitive device 1000 for forming the sealed space 101. The damaged phenomenon, in particular, can ensure that the pressures of the upper and lower portions of the filter element 31 are consistent, thereby avoiding the pressure imbalance caused by the upper and lower portions of the filter element 31. The optical element 31 has a problem of cracking or chipping.
优选地,所述通气通道102弯曲地延伸,以防止灰尘等污染物经由所述通气通道102自外部环境进入到所述密封空间101内而污染被保持在所述密封空间101内的所述感光元件22的所述感光区域221和污染所述滤光元件31的用于形成所述密封空间101的部分。Preferably, the venting passage 102 is curvedly extended to prevent contaminants such as dust from entering the sealed space 101 from the external environment via the venting passage 102 to contaminate the sensitized light held in the sealed space 101. The photosensitive region 221 of the element 22 and a portion of the filter element 31 that is used to form the sealed space 101.
进一步地,所述摄像模组100包括至少一密封元件103,其由一密封介质104形成,其中在制造所述摄像模组100的过程中,在对所述感光装置1000执行完烘烤工艺之后,使被填充在所述通气通道102的所述密封介质104固化后形成所述密封元件103,即,所述密封元件103被保持在所述通气通道102内,以用于阻止所述通气通道102和所述感光装置1000的外部连通。例如,在将所述密封介质104填充于所述通气通道102且在所述密封介质104在所述通气通道102内固化后能够形成被保持在所述通气通道102内的所述密封元件103,并且所述密封元件103能够阻止灰尘等污染物经由所述通气通道102自所述感光装置1000的外部进入所述密封空间101而污染被保持在所述密封空间101内的所述感光元件22的所述感光区域221和污染所述滤光元件31的用于形成所述密封空间101的部分。弯曲延伸的所述通气通道102能够阻止所述密封介质104流动到所述密封空间101的内壁,和阻止所述密封介质104进入所述密封空间101,从而避免所述密封介质104污染所述感光元件22的所述感光区域221和所述滤光元件31的用于形成所述密封空间101的部分。Further, the camera module 100 includes at least one sealing member 103 formed by a sealing medium 104, wherein in the process of manufacturing the camera module 100, after performing the baking process on the photosensitive device 1000 Forming the sealing member 103 after the sealing medium 104 filled in the venting passage 102 is solidified, that is, the sealing member 103 is held in the venting passage 102 for blocking the venting passage 102 is in communication with the outside of the photosensitive device 1000. For example, after the sealing medium 104 is filled in the venting passage 102 and the sealing medium 104 is solidified in the venting passage 102, the sealing member 103 held in the venting passage 102 can be formed, And the sealing member 103 can prevent contaminants such as dust from entering the sealed space 101 from the outside of the photosensitive device 1000 via the vent passage 102 to contaminate the photosensitive member 22 held in the sealed space 101. The photosensitive region 221 and a portion of the filter element 31 that is used to form the sealed space 101. The venting passage 102 extending in a bend can prevent the sealing medium 104 from flowing to the inner wall of the sealed space 101, and prevent the sealing medium 104 from entering the sealed space 101, thereby preventing the sealing medium 104 from contaminating the photographic light. The photosensitive region 221 of the element 22 and a portion of the filter element 31 for forming the sealed space 101.
参考附图6A和图6B,所述通气通道102形成于所述支座32。具体地说,所述支座32具有一内侧部322和环绕在所述内侧部322四周的一外侧部323,其中所述支座32的所述内侧部322界定所述支座32的所述通光通道321。所述通气通道102自所述支座32的所述外侧部323延伸至所述内侧部322,并且所述通气通道102连通所述支座32的所述外侧部323和所述内侧部322。所述支座32的所述内侧部322的至少一部分被贴装于所述模塑基座23的所述顶表面232,从而使所述通气通道102连通所述感光装置1000的所述密封空间101和所述感光装置1000的外部。Referring to Figures 6A and 6B, the venting passage 102 is formed in the abutment 32. Specifically, the abutment 32 has an inner portion 322 and an outer portion 323 surrounding the inner portion 322, wherein the inner portion 322 of the abutment 32 defines the abutment 32 Light passage 321. The venting passage 102 extends from the outer side portion 323 of the holder 32 to the inner side portion 322, and the venting passage 102 communicates with the outer side portion 323 and the inner side portion 322 of the holder 32. At least a portion of the inner portion 322 of the holder 32 is attached to the top surface 232 of the molding base 23 such that the vent passage 102 communicates with the sealed space of the photosensitive device 1000 101 and the exterior of the photosensitive device 1000.
进一步地,所述支座32具有一下表面324、一内侧面325、一上表面326以及一外侧面327,其中所述支座32的所述下表面324和所述上表面326相互对应,所述支座32的所述内侧面325和所述外侧面327相互对应,其中所述支座32的所述内侧面325用于界定所述通光通道321。所述支座32的所述下表面324和所述内侧面325用于形成所述支座32的所述内侧部322,所述支座32的所述上表面326和所述外侧面327用于形成所述支座32的所述外侧部323,其中所述支座32的所述下表面324的至少一部分被贴装于所述模塑基座23的所述顶表面232。优选地,所述支座32的所述内侧面325倾斜地延伸,通过这样的方式,在光线自所述摄像模组100的所述光学镜头10进入所述摄像模组100的内部而穿过所述支座32的所述通光通道321时,能够避免杂散光,以改善所述摄像模组100的光学性能。Further, the support 32 has a lower surface 324, an inner side 325, an upper surface 326 and an outer side 327, wherein the lower surface 324 and the upper surface 326 of the support 32 correspond to each other. The inner side 325 and the outer side 327 of the holder 32 correspond to each other, wherein the inner side 325 of the holder 32 is used to define the light passage 321 . The lower surface 324 and the inner side 325 of the support 32 are used to form the inner portion 322 of the abutment 32, and the upper surface 326 and the outer side 327 of the support 32 are The outer portion 323 of the holder 32 is formed, wherein at least a portion of the lower surface 324 of the holder 32 is attached to the top surface 232 of the molding base 23. Preferably, the inner side surface 325 of the support 32 extends obliquely, in such a manner that light passes through the optical lens 10 of the camera module 100 into the interior of the camera module 100. When the light passage 321 of the support 32 is used, stray light can be avoided to improve the optical performance of the camera module 100.
参考附图20A,在本发明的所述摄像模组100的这个具体的示例中,所述滤光元件31被贴装于所述支座32的所述上表面326,而在附图20B示出的所述摄像模组100的这个具体的示例中,所述滤光元件31也可以被贴装于所述支座32的所述下表面324。本领域的技术人员可以理解的是,所述滤光元件31被贴装于所述支座32的位置在本发明的所述摄像模组100中不受限制,其中只要所述滤光元件31在被贴装于所述支座32后,能够使所述支座32的所述通光通道321对应于所述滤光元件31即可。进一步参考附图20B,所述支座32的所述下表面324具有一下表面内侧3243和环绕在所述下表面内侧3243的一下表面外侧3244,其中所述滤光元件31被贴装于所述支座32的所述下表面324的所述下表面内侧3243,所述支座32的所述下表面324的所述下表面外侧3244的至少一部分被贴装于所述模塑基座23的所述顶表面232,以使所述滤光元件31被保持在所述感光元件22的感光路径上。所述支座32的所述下表面内侧3243和所述下表面外侧3244之间具有高度差,以形成一下部滤光元件贴装槽3245,其中被贴装于所述支座32的所述下表面内侧3243的所述滤光元件31可以被保持在所述支座32的所述下部滤光元件贴装槽3245。Referring to FIG. 20A, in this specific example of the camera module 100 of the present invention, the filter element 31 is attached to the upper surface 326 of the holder 32, and FIG. 20B shows In this specific example of the camera module 100, the filter element 31 can also be attached to the lower surface 324 of the holder 32. It can be understood by those skilled in the art that the position where the filter element 31 is mounted on the holder 32 is not limited in the camera module 100 of the present invention, as long as the filter element 31 is provided. After being attached to the holder 32, the light passage 321 of the holder 32 can be made to correspond to the filter element 31. With further reference to FIG. 20B, the lower surface 324 of the holder 32 has a lower surface inner side 3243 and a lower surface outer side 3244 surrounding the lower surface inner side 3243, wherein the filter element 31 is mounted on the The lower surface inner side 3243 of the lower surface 324 of the holder 32, at least a portion of the lower surface outer side 3244 of the lower surface 324 of the holder 32 is attached to the molded base 23 The top surface 232 is such that the filter element 31 is held on the photosensitive path of the photosensitive element 22. There is a height difference between the lower surface inner side 3243 of the support 32 and the lower surface outer side 3244 to form a lower filter element mounting groove 3245, wherein the above is mounted on the holder 32 The filter element 31 of the lower surface inner side 3243 may be held by the lower filter element mounting groove 3245 of the holder 32.
所述支座32的所述下表面324具有一非画胶区域3241和环绕在所述非画胶区域3241四周的一画胶区域3242,其中所述非画胶区域3241的两侧分别向内和向外延伸被连接于所述内侧面325和所述画胶区域3242,其中所述画胶区域3242的两侧分别向内和向外延伸被连接于所述非画胶区域3241和所述外侧面327。在贴装所述支座32于所述模塑基座23的所述顶表面232时,将所述贴装介质1002施涂于所述支座32的所述下表面324的所述画胶区域3242,然后在将所述支座32的所述下表面324和所述模塑基座23的所述顶表面232贴装在一起后,所述贴装介质1002能够形成被保持在所述支座32的所述下表面324的所述画胶区域3242和所述模塑基座23的所述顶表面232之间的所述贴装层1001。例如,在附图20B示出的所述摄像模组100的具体示例中,所述滤光元件31可以被贴装于所述支座32的所述下表面324的所述画胶区域3242,从而在所述支座32被贴装于所述模塑基座23的所述顶表面232时,所述模塑基座23环绕在所述滤光元件31的四周。值得一提的是,所述支座32的所述下表面324的所述下表面外侧3244的至少一部分形成所述支座32的所述画胶区域3242。The lower surface 324 of the support 32 has a non-painting area 3241 and a glue area 3242 surrounding the non-painting area 3241, wherein the two sides of the non-painting area 3241 are respectively inward And extending outwardly connected to the inner side surface 325 and the glue area 3242, wherein the two sides of the glue area 3242 extend inwardly and outwardly, respectively, to be connected to the non-paint area 3241 and Outer side 327. Applying the mounting medium 1002 to the lower surface 324 of the holder 32 when the holder 32 is placed on the top surface 232 of the molding base 23 a region 3242, and then after the lower surface 324 of the holder 32 and the top surface 232 of the molded base 23 are attached together, the mounting medium 1002 can be formed to be held in the The placement layer 1001 between the glue area 3242 of the lower surface 324 of the holder 32 and the top surface 232 of the molded base 23. For example, in the specific example of the camera module 100 illustrated in FIG. 20B, the filter element 31 may be mounted on the glue area 3242 of the lower surface 324 of the holder 32, Thus, when the holder 32 is attached to the top surface 232 of the molding base 23, the molding base 23 surrounds the filter element 31. It is worth mentioning that at least a portion of the lower surface outer side 3244 of the lower surface 324 of the support 32 forms the glue area 3242 of the support 32.
更进一步地,所述支座32具有至少一通气孔328和至少一通气槽329,其中所述通气孔328自所述支座32的所述上表面326向所述下表面324方向延伸,其中所述通气槽329形成于所述支座32的所述下表面324,并且自所述支座32的所述内侧面325向所述外侧面327方向延伸,其中所述通气孔328和所述通气槽329相互连通以形成所述通气通道102。可以理解的是,所述通气孔328的开口形成于所述支座32的所述上表面326,并且所述通气孔328在所述上表面326的开口形成所述通气通道102在所述上表面326的开口。所述通气槽329的开口形成于所述支座32的所述下表面324和所述内侧面325,其中在所述支座32的所述下表面324通过所述贴装介质1002被贴装于所述模塑基座23的所述顶表面 232之后,所述模塑基座32的所述顶表面232封闭所述通气槽329形成在所述下表面324的开口,而仅使所述通气槽329在所述内侧面325的开口被暴露,并且所述通气槽329被暴露在所述内侧面325的开口形成所述通气通道102在所述内侧面325的开口。Further, the support 32 has at least one venting hole 328 and at least one venting groove 329, wherein the venting hole 328 extends from the upper surface 326 of the pedestal 32 toward the lower surface 324, wherein a venting groove 329 formed in the lower surface 324 of the holder 32 and extending from the inner side surface 325 of the holder 32 toward the outer side surface 327, wherein the vent hole 328 and the venting The slots 329 communicate with each other to form the venting passage 102. It can be understood that the opening of the vent 328 is formed in the upper surface 326 of the support 32, and the opening of the vent 328 in the upper surface 326 forms the venting passage 102 on the The opening of surface 326. An opening of the venting groove 329 is formed in the lower surface 324 and the inner side 325 of the holder 32, wherein the lower surface 324 of the holder 32 is mounted through the mounting medium 1002 After the top surface 232 of the molding base 23, the top surface 232 of the molding base 32 closes the opening of the venting groove 329 formed in the lower surface 324, and only the The opening of the venting groove 329 at the inner side surface 325 is exposed, and the opening of the venting groove 329 exposed to the inner side surface 325 forms an opening of the venting passage 102 at the inner side surface 325.
优选地,如图5和图6B所示,所述支座32的所述通气槽329具有一开口端3291、一连通端3292、一第一通气槽3293以及一第二通气槽3294,其中所述通气槽329的所述开口端3291和所述连通端3292相互对应,并且所述通气槽329在所述开口端3291连通于所述密封空间101,和在所述连通端3292连通于所述通气孔328,其中所述第一通气槽3293形成于所述连通端3292,所述第二通气槽3294形成于所述开口端3291,并且所述第一通气槽3293分别连通于所述第二通气槽3294和所述通气孔328,以使所述第二通气槽3294、所述第一通气槽3293和所述通气孔328形成所述感光装置1000的所述通气通道102。Preferably, as shown in FIG. 5 and FIG. 6B, the venting groove 329 of the support 32 has an open end 3291, a communicating end 3292, a first venting groove 3293 and a second venting groove 3294. The open end 3291 of the venting groove 329 and the communicating end 3292 correspond to each other, and the venting groove 329 communicates with the sealed space 101 at the open end 3291, and communicates with the communicating end 3292 at the communicating end 3292 a vent 328, wherein the first venting groove 3293 is formed at the communicating end 3292, the second venting groove 3294 is formed at the open end 3291, and the first venting groove 3293 is respectively connected to the second end The venting groove 3294 and the venting hole 328 are such that the second venting groove 3294, the first venting groove 3293, and the venting hole 328 form the venting passage 102 of the photosensitive device 1000.
值得一提的是,参考附图4A、图5和图20,设所述支座32的厚度尺寸参数为H,即,所述支座32的所述上表面326和所述下表面324之间的距离尺寸参数为H。设所述支座32的所述通气槽329的深度尺寸参数为h1。设被施涂于所述支座32的所述下表面324的所述画胶区域3242的所述贴装介质1002的厚度尺寸参数为h2。值得一提的是,所述贴装介质1002也可以被施涂于所述模塑基座23的所述顶表面232。在贴装所述支座32于所述模塑基座23时,为了避免所述贴装介质1002填满所述支座32的所述通气槽329而堵塞所述通气通道102,所述通气槽329的深度尺寸参数h1的数值通常大于所述贴装介质1002的厚度尺寸参数h2的数值。例如,在一个具体的示例中,所述贴装介质1002的厚度尺寸参数h2的取值范围为:h2≤0.1mm,相应地,所述支座32的所述通气槽329的深度尺寸参数h1的取值范围为:h1>0.1mm。由于在进行烘烤工艺时,所述贴装介质1002受热时会膨胀,因此,所述支座32的所述通气槽329的深度尺寸参数h1的数量需要大于所述贴装介质1002的厚度尺寸参数h2的数值,例如所述支座32的所述通气槽329的深度尺寸参数h1的取值范围优选为:h1≥0.15mm。更优选地,所述支座32的所述通气槽329的深度尺寸参数h1的取值范围为:h1≥0.3mm。另外,为了保证所述支座32的强度,所述支座32的所述通气槽329的深度不能太深,例如在一个具体的示例中,所述支座32的所述通气槽329的深度尺寸参数h1与所述支座32的厚度尺寸参数H的比值的取值范围为:0.5%-70%(包括0.5%和70%)。It is worth mentioning that, referring to FIG. 4A, FIG. 5 and FIG. 20, the thickness dimension parameter of the support 32 is H, that is, the upper surface 326 and the lower surface 324 of the support 32. The distance dimension parameter between the two is H. The depth dimension parameter of the venting groove 329 of the support 32 is h1. The thickness dimension parameter of the mounting medium 1002 applied to the glue area 3242 of the lower surface 324 of the holder 32 is h2. It is worth mentioning that the mounting medium 1002 can also be applied to the top surface 232 of the molding base 23. When the holder 32 is placed on the molding base 23, the ventilation passage 102 is blocked in order to prevent the mounting medium 1002 from filling the ventilation groove 329 of the holder 32. The value of the depth dimension parameter h1 of the slot 329 is typically greater than the value of the thickness dimension parameter h2 of the mounting medium 1002. For example, in a specific example, the thickness dimension parameter h2 of the mounting medium 1002 ranges from h2 ≤ 0.1 mm, and correspondingly, the depth dimension parameter h1 of the venting groove 329 of the holder 32. The value ranges from h1 to 0.1 mm. Since the mounting medium 1002 expands when heated during the baking process, the number of depth dimension parameters h1 of the venting groove 329 of the holder 32 needs to be larger than the thickness of the mounting medium 1002. The value of the parameter h2, for example, the range of the depth dimension parameter h1 of the venting groove 329 of the holder 32 is preferably h1 ≥ 0.15 mm. More preferably, the depth dimension parameter h1 of the venting groove 329 of the support 32 ranges from h1 ≥ 0.3 mm. In addition, in order to ensure the strength of the support 32, the depth of the venting groove 329 of the support 32 may not be too deep, for example, in a specific example, the depth of the venting groove 329 of the support 32 The ratio of the dimension parameter h1 to the thickness dimension parameter H of the support 32 ranges from 0.5% to 70% (including 0.5% and 70%).
值得一提的是,所述支座32的所述通气槽329在不同的位置深度可以不同。具体地说,所述通气槽329在所述连通端3292的深度尺寸大于所述通气槽329在所述开口端3291的深度尺寸,例如所述通气槽329在所述开口端3291的深度尺寸可以是0.03mm左右,所述通气槽329在所述连通端3292的深度尺寸可以是0.1mm左右,优选为0.15mm。换言之,所述通气槽329的所述第一通气槽3293的深度尺寸大于所述第二通气槽3294的深度尺寸,例如所述通气槽329的所述第一通气槽3293的深度尺寸可以是0.1mm左右,优选为0.15mm。所述通气槽 329的所述第二通气槽3294的深度尺寸可以是0.03mm左右。优选地,所述通气槽329呈台阶状。所述通气槽329在所述连通端3292的深度被设计的较深是为了避免所述贴装介质1002填满所述通气槽329,所述通气槽329在所述开口端3291的深度被设计的较浅是为了减小所述通气通道102在所述密封空间101处的开口尺寸,以阻止灰尘等污染物经由所述通气通道102自外部环境进入所述密封空间101。值得一提的是,在靠近所述通气槽329的所述开口端3291的位置没有被提供所述贴装介质1002,从而即便是所述通气槽329在所述开口端3291的深度较浅,也不会担心所述贴装介质1002会填满所述通气槽329,例如所述通气槽329在所述开口端3291的深度尺寸范围为5μm~200μm(包括5μm和200μm)。在靠近所述通气槽329的所述连通端3292的位置可能会被提供所述贴装介质1002,从而所述通气槽329在所述连通端3292的深度较深,例如其深度尺寸范围为50μm~200μm(包括50μm和200μm)。It is worth mentioning that the venting grooves 329 of the support 32 may have different depths at different positions. Specifically, a depth dimension of the venting groove 329 at the communicating end 3292 is greater than a depth dimension of the venting groove 329 at the open end 3291, for example, a depth dimension of the venting groove 329 at the open end 3291 may be It is about 0.03 mm, and the depth of the vent groove 329 at the communication end 3292 may be about 0.1 mm, preferably 0.15 mm. In other words, the depth dimension of the first venting groove 3293 of the venting groove 329 is larger than the depth dimension of the second venting groove 3294. For example, the depth dimension of the first venting groove 3293 of the venting groove 329 may be 0.1. It is about mm, preferably 0.15 mm. The second venting groove 3294 of the venting groove 329 may have a depth dimension of about 0.03 mm. Preferably, the venting groove 329 is stepped. The depth of the venting groove 329 at the communicating end 3292 is designed to prevent the mounting medium 1002 from filling the venting groove 329, and the venting groove 329 is designed at the depth of the open end 3291. The shallower is to reduce the size of the opening of the venting passage 102 at the sealed space 101 to prevent dust and the like from entering the sealed space 101 from the external environment via the venting passage 102. It is worth mentioning that the mounting medium 1002 is not provided at a position close to the open end 3291 of the venting groove 329, so that even if the venting groove 329 is shallow at the open end 3291, There is also no fear that the mounting medium 1002 will fill the venting groove 329. For example, the venting groove 329 has a depth dimension ranging from 5 μm to 200 μm (including 5 μm and 200 μm) at the open end 3291. The mounting medium 1002 may be provided at a position close to the communication end 3292 of the venting groove 329 such that the venting groove 329 has a deeper depth at the communicating end 3292, for example, a depth dimension of 50 μm. ~200μm (including 50μm and 200μm).
进一步地,所述支座32进一步包括至少一溢胶槽3206和至少一排气槽3207,其中所述溢胶槽3206和所述排气槽3207分别形成于所述支座32的所述下表面324,并且所述溢胶槽3206连通所述排气槽3207和所述通气孔328,以形成所述感光装置1000的所述通气通道102。所述支座32的所述溢胶槽3206的深度尺寸与所述排气槽3207的深度尺寸可以相同,也可以不同。优选地,所述支座32的所述溢胶槽3206的深度尺寸大于所述排气槽3207的深度尺寸,例如,所述支座32的所述溢胶槽3206的深度尺寸可以是0.1mm左右,优选地0.15mm,而所述排气槽3207的深度尺寸可以是0.03mm左右,优选地0.15mm。在通过所述贴装介质1002将所述支座32的所述下表面324和所述模塑基座23的所述顶表面232贴合时,多余的所述贴装介质1002可以溢入所述支座32的所述溢胶槽3206内,并且不需要担心溢入所述溢胶槽3206内的所述贴装介质1002会填充满所述支座32的所述溢胶槽3206,通过这样的方式,能够保证所述排气槽3207、所述溢胶槽3206和所述通气孔328形成的所述通气通道102畅通。另外,所述支座32的所述溢胶槽3206的宽度尺寸也可以大于所述排气槽3207的宽度尺寸,通过这样的方式,一方面尺寸更大的所述溢胶槽3206能够避免溢入所述溢胶槽3206的所述贴装介质1002填充满所述溢胶槽3206,另一方面尺寸更小的所述排气槽3207能够避免灰尘等污染物会经由所述排气槽3207自所述感光装置1000的外部进入所述密封空间101,从而有利于改善所述摄像模组100的光学性能。Further, the support 32 further includes at least one overflow tank 3206 and at least one exhaust groove 3207, wherein the overflow tank 3206 and the exhaust groove 3207 are respectively formed under the support 32 Surface 324, and the overflow tank 3206 communicates with the venting groove 3207 and the venting opening 328 to form the venting passage 102 of the photosensitive device 1000. The depth dimension of the overflow tank 3206 of the support 32 may be the same as or different from the depth dimension of the exhaust groove 3207. Preferably, the depth of the overflow tank 3206 of the support 32 is larger than the depth dimension of the exhaust groove 3207. For example, the depth of the overflow groove 3206 of the support 32 may be 0.1 mm. Left and right, preferably 0.15 mm, and the depth dimension of the venting groove 3207 may be about 0.03 mm, preferably 0.15 mm. When the lower surface 324 of the holder 32 and the top surface 232 of the molded base 23 are attached by the mounting medium 1002, the excess of the mounting medium 1002 can overflow. In the overflow tank 3206 of the support 32, and there is no need to worry that the placement medium 1002 overflowing into the overflow tank 3206 will fill the overflow tank 3206 of the holder 32, through In this manner, it is possible to ensure that the venting passages 102 formed by the exhaust groove 3207, the overflow tank 3206, and the vent hole 328 are clear. In addition, the width of the overflow tank 3206 of the support 32 may also be larger than the width dimension of the exhaust groove 3207. In this way, the overflow tank 3206 having a larger size on the one hand can avoid overflow. The mounting medium 1002 entering the overflow tank 3206 is filled with the overflow tank 3206, and on the other hand, the smaller size of the exhaust groove 3207 can prevent dirt such as dust from passing through the exhaust groove 3207. The sealed space 101 is entered from the outside of the photosensitive device 1000, thereby facilitating improvement of the optical performance of the camera module 100.
另外,参考附图6B,所述通气槽329的宽度尺寸大于或者等于所述通气孔328的底部的直径尺寸,设所述通气孔328的周壁到所述通气槽329的侧壁之间的距离尺寸为L1,其中L1的取值范围为:0mm~0.2mm(包括0mm和0.2mm)。设所述通气孔328的底部的直径尺寸参数为R,设所述通气槽329在所述连通端3292的宽度尺寸参数为W,其中所述通气槽329在所述连通端3292的宽度尺寸参数W与所述通气孔328的底部的直径尺寸参数R的比值的取值范围为:2:1~1:1(包含2:1和1:1)。换言之,所述通气槽329在所述连通端3292的宽度的最大尺寸为所述通气孔328的底部的直径尺寸的两倍,所述通气槽329在所述连 通端3292的宽度的最小尺寸和所述通气孔328的底部的直径尺寸相等。In addition, referring to FIG. 6B, the width dimension of the vent groove 329 is greater than or equal to the diameter dimension of the bottom of the vent hole 328, and the distance between the peripheral wall of the vent hole 328 and the sidewall of the vent groove 329 is set. The size is L1, where L1 ranges from 0mm to 0.2mm (including 0mm and 0.2mm). The diameter dimension parameter of the bottom of the vent hole 328 is R, and the width dimension parameter of the vent groove 329 at the communication end 3292 is W, wherein the width dimension parameter of the vent groove 329 at the communication end 3292 The ratio of W to the diameter dimension parameter R of the bottom of the vent 328 ranges from 2:1 to 1:1 (including 2:1 and 1:1). In other words, the maximum dimension of the width of the venting groove 329 at the communicating end 3292 is twice the diameter of the bottom of the venting opening 328, and the minimum dimension of the width of the venting groove 329 at the communicating end 3292 is The diameter of the bottom of the vent 328 is equal in size.
所述滤光元件31被贴装于所述支座32的所述上表面326,以使所述支座32的所述通光通道321对应于所述滤光元件31,从而所述滤光元件31能够封闭所述支座32的所述通光通道321。可以理解的是,所述通气通道102在所述内侧面325的开口被保持在所述滤光元件31的下部,其中所述滤光元件31的下部用于形成所述密封空间101。The filter element 31 is mounted on the upper surface 326 of the holder 32 such that the light passage 321 of the holder 32 corresponds to the filter element 31, so that the filter The element 31 is capable of closing the light passage 321 of the holder 32. It can be understood that the opening of the venting passage 102 at the inner side surface 325 is held at the lower portion of the filter element 31, wherein the lower portion of the filter element 31 is used to form the sealed space 101.
进一步地,所述支座32的所述上表面326具有一上表面内侧3261和环绕在所述上表面内侧3261四周的一上表面外侧3262,其中所述滤光元件31被贴装于所述支座32的所述上表面内侧3261。优选地,所述上表面内侧3261的高度尺寸低于所述上表面外侧3262的高度尺寸,即,所述上表面内侧3261和所述上表面外侧3262之间具有高度差,从而在所述上表面内侧3261对应的位置形成所述支座32的一贴装槽3201,其中所述支座32的所述贴装槽3201连通于所述通光通道321,这样,被贴装于所述上表面内侧3261的所述滤光元件31能够被保持在所述贴装槽3201,和所述支座32的所述通光通道321能够对应于所述滤光元件31,这样,能够降低所述摄像模组100的高度尺寸。可选地,所述上表面内侧3261和所述上表面外侧3262也可以平齐。Further, the upper surface 326 of the support 32 has an upper surface inner side 3261 and an upper surface outer side 3262 surrounding the inner surface 3261 of the upper surface, wherein the filter element 31 is mounted on the The upper surface inner side 3261 of the holder 32. Preferably, the height dimension of the upper surface inner side 3261 is lower than the height dimension of the upper surface outer side 3262, that is, a height difference between the upper surface inner side 3261 and the upper surface outer side 3262, so that A mounting groove 3201 of the holder 32 is formed at a position corresponding to the inner side 3261 of the surface, wherein the mounting groove 3201 of the holder 32 communicates with the light passage 321 so as to be attached thereto. The filter element 31 of the inner surface 3261 of the surface can be held in the mounting groove 3201, and the light passage 321 of the holder 32 can correspond to the filter element 31, so that the The height dimension of the camera module 100. Alternatively, the upper surface inner side 3261 and the upper surface outer side 3262 may also be flush.
更进一步地,所述支座32的所述内侧面325具有一内表面上侧3251和一内表面下侧3252,其中所述内表面上侧3251向上和向下分别连接于所述上表面外侧3262和所述上表面内侧3261,所述内表面下侧3252向上和向下分别连接于所述上表面内侧3261和所述下表面324。优选地,所述内侧面325的所述内表面下侧3252倾斜地延伸,以有利于避免杂散光,从而改善所述摄像模组100的光学性能。例如,所述内表面下侧3252的上边缘与所述摄像模组100的中心光轴之间的距离尺寸大于所述内表面下侧3252的下边缘与所述摄像模组100的所述中心光轴之间的距离,以使所述内表面下侧3252倾斜地延伸。换言之,所述内表面下侧3252与所述上表面内侧3261的连接位置到所述摄像模组100的中心光轴之间的距离尺寸大于所述内表面下侧3252与所述下表面324的连接位置到所述摄像模组100的中心光轴之间的距离尺寸,以使所述内表面下侧3252倾斜地延伸。Further, the inner side surface 325 of the support 32 has an inner surface upper side 3251 and an inner surface lower side 3252, wherein the inner surface upper side 3251 is connected upward and downward to the outer surface, respectively. 3262 and the upper surface inner side 3261, the inner surface lower side 3252 is connected upward and downward to the upper surface inner side 3261 and the lower surface 324, respectively. Preferably, the inner surface lower side 3252 of the inner side surface 325 extends obliquely to facilitate avoiding stray light, thereby improving the optical performance of the camera module 100. For example, a distance between an upper edge of the inner surface lower side 3252 and a central optical axis of the camera module 100 is greater than a lower edge of the inner surface lower side 3252 and the center of the camera module 100. The distance between the optical axes is such that the inner surface lower side 3252 extends obliquely. In other words, the distance between the connection position of the inner surface lower side 3252 and the upper surface inner side 3261 to the central optical axis of the camera module 100 is larger than the inner surface lower side 3252 and the lower surface 324. The distance between the connection position to the central optical axis of the camera module 100 is such that the inner surface lower side 3252 extends obliquely.
优选地,参考附图6A和图6B,所述支座32可以是一个注塑件,即,可以通过注塑工艺形成所述支座32。在本发明的所述摄像模组100的一个示例中,所述支座32在被注塑成型的同时形成所述支座32的所述通气孔328和所述通气槽329,而在本发明的所述摄像模组100的另一个示例中,也可以先形成所述支座32,然后通过钻孔或者开槽等工艺形成相所述支座32的所述通气孔328和所述通气槽329。本发明的所述摄像模组100在这方面不受限制。Preferably, referring to Figures 6A and 6B, the support 32 can be an injection molded part, i.e., the support 32 can be formed by an injection molding process. In an example of the camera module 100 of the present invention, the holder 32 forms the vent hole 328 and the venting groove 329 of the holder 32 while being injection molded, and in the present invention In another example of the camera module 100, the holder 32 may be formed first, and then the vent hole 328 and the venting groove 329 of the pedestal 32 may be formed by a process such as drilling or grooving. . The camera module 100 of the present invention is not limited in this regard.
所述摄像模组100可以是一个自动对焦和变焦摄像模组,参考附图2至图4B,所述摄像模组100进一步包括至少一驱动器40,其中所述光学镜头10被可驱动地设置于所述驱动器40,其中所述驱动器40被贴装于所述支座32,以使所述光学镜头10被保持在所述感光元件22的感光路径。优选地,所述驱动器40 可以被贴装于所述支座32的所述上表面外侧3262。可选地,所述驱动器40也可以没有被贴装于所述支座32,而使将所述驱动器40贴装于所述模塑基座23的所述顶表面232。所述驱动器40能够使所述光学镜头10被保持在所述感光元件22的感光路径,和所述驱动器40能够驱动所述光学镜头10沿着所述感光元件22的感光路径移动,以通过调整所述光学镜头10和所述感光元件22的相对位置的方式,实现所述摄像模组100的对焦和变焦。值得一提的是,所述驱动器40可以被实施为但不限于音圈马达。The camera module 100 can be an autofocus and zoom camera module. Referring to FIG. 2 to FIG. 4B, the camera module 100 further includes at least one driver 40, wherein the optical lens 10 is drivably disposed on The driver 40, wherein the driver 40 is attached to the holder 32, so that the optical lens 10 is held in a photosensitive path of the photosensitive member 22. Preferably, the driver 40 may be attached to the outer surface 3262 of the upper surface of the holder 32. Alternatively, the driver 40 may not be mounted to the holder 32 such that the driver 40 is attached to the top surface 232 of the molding base 23. The driver 40 is capable of holding the optical lens 10 in a photosensitive path of the photosensitive element 22, and the driver 40 is capable of driving the optical lens 10 to move along a photosensitive path of the photosensitive element 22 to be adjusted Focusing and zooming of the camera module 100 are achieved by the relative positions of the optical lens 10 and the photosensitive element 22. It is worth mentioning that the driver 40 can be implemented as, but not limited to, a voice coil motor.
优选地,所述支座32的所述上表面326设有至少一定位凸起3230,以在贴装所述驱动器40于所述支座32的所述上表面外侧3262时,用于将所述驱动器40引导至正确的贴装位置,或者在贴装所述驱动器40于所述模塑基座23的所述顶表面232时,用于将所述驱动器40引导至正确的贴装位置。更优选地,所述定位凸起3230凸出于所述支座32的所述上表面外侧3262。另外,所述定位凸起3230的数量和形状在本发明的所述摄像模组100中不受限制,例如,所述定位凸起3230的数量可以被实施为4个,其中每个所述定位凸起3230分别位于所述支座32的每个转角处。Preferably, the upper surface 326 of the support 32 is provided with at least one positioning protrusion 3230 for attaching the driver 40 to the outer surface 3262 of the upper surface of the support 32. The driver 40 is directed to the correct mounting position or to guide the driver 40 to the correct mounting position when the driver 40 is placed on the top surface 232 of the molding base 23. More preferably, the positioning protrusion 3230 protrudes from the outer surface outer side 3262 of the holder 32. In addition, the number and shape of the positioning protrusions 3230 are not limited in the camera module 100 of the present invention. For example, the number of the positioning protrusions 3230 can be implemented as four, wherein each of the positioning The projections 3230 are respectively located at each corner of the holder 32.
进一步地,所述驱动器40具有至少一马达引脚41,其中所述驱动器40的所述马达引脚41被连接于所述基板211,以导通所述驱动器40和所述基板211。所述模塑基座23具有至少一引脚槽233,其中所述驱动器40的所述马达引脚41被容纳于所述模塑基座23的所述引脚槽233,以使所述马达引脚41可以不凸出于所述模塑基座23的外壁,从而不仅能够保证所述摄像模组100的可靠性,而且还能够使所述摄像模组100更美观。Further, the driver 40 has at least one motor pin 41, wherein the motor pin 41 of the driver 40 is connected to the substrate 211 to turn on the driver 40 and the substrate 211. The molding base 23 has at least one lead groove 233, wherein the motor pin 41 of the driver 40 is received in the pin groove 233 of the molding base 23 to make the motor The pin 41 may not protrude from the outer wall of the molded base 23, thereby not only ensuring the reliability of the camera module 100, but also making the camera module 100 more beautiful.
图4B示出了所述摄像模组100的一个变形实施方式,与附图4示出的所述摄像模组100不同的是,在附图4B示出的所述摄像模组100的这个具体的示例中,所述摄像模组100被实施为阵列摄像模组,具体地说,所述摄像模组100包括至少两个所述光学镜头10和至少一个所述模塑感光单元20,其中所述模塑感光单元20进一步包括至少一个所述电路板21、至少两个所述感光元件22以及至少一个所述模塑基座23,所述模塑基座23具有至少两个所述光窗231,其中每个所述感光元件22分别被导通地连接于所述电路板21,所述模塑基座23一体地结合于所述电路板21,并且所述模塑基座23环绕在每个所述感光元件22的所述感光区域221的四周,以使每个所述感光元件22的所述感光区域221分别对应于所述模塑基座23的每个所述光窗231,其中每个所述光学镜头10分别被保持在每个所述感光元件22的感光路径。FIG. 4B shows a modified embodiment of the camera module 100. The camera module 100 shown in FIG. 4 is different from the camera module 100 shown in FIG. 4B. In an example, the camera module 100 is implemented as an array camera module. Specifically, the camera module 100 includes at least two of the optical lenses 10 and at least one of the molded photosensitive units 20, wherein The molded photosensitive unit 20 further includes at least one of the circuit board 21, at least two of the photosensitive elements 22, and at least one of the molded bases 23, the molded base 23 having at least two of the light windows 231, wherein each of the photosensitive elements 22 is electrically connected to the circuit board 21, the molding base 23 is integrally coupled to the circuit board 21, and the molding base 23 is surrounded by The photosensitive region 221 of each of the photosensitive elements 22 is so that the photosensitive regions 221 of each of the photosensitive members 22 respectively correspond to each of the light windows 231 of the molding base 23, Each of the optical lenses 10 is held in each of the photosensitive elements 22 Sensitive path.
参考本发明的说明书附图之图7至图20,所述摄像模组100的制造流程在接下来的描述中被阐述。Referring to Figures 7 to 20 of the drawings of the present invention, the manufacturing process of the camera module 100 is illustrated in the following description.
参考附图7示出的阶段,将至少一个所述电子元器件25在所述基板211的所述基板正面2111导通地连接于所述基板211。例如,在所述摄像模组100的一个具体的示例中,所述电子元器件25可以通过贴装的方式被贴装于所述基板211的所述基板正面2111,从而使所述电子元器件25在所述基板211的所述基 板正面2111被导通地连接于所述基板211,此时,所述电子元器件25凸出于所述基板211的所述基板正面2111。在所述摄像模组100的另外一些具体的示例中,所述电子元器件25也可以在所述基板211的所述基板正面2111被半埋入所述基板211,并且使所述电子元器件25和所述基板211相互导通,此时,所述电子元器件25同样凸出于所述基板211的所述基板正面2111。Referring to the stage shown in FIG. 7, at least one of the electronic components 25 is electrically connected to the substrate 211 on the substrate front surface 2111 of the substrate 211. For example, in a specific example of the camera module 100, the electronic component 25 can be mounted on the substrate front surface 2111 of the substrate 211 by mounting, thereby making the electronic component The substrate front surface 2111 of the substrate 211 is electrically connected to the substrate 211. At this time, the electronic component 25 protrudes from the substrate front surface 2111 of the substrate 211. In another specific example of the camera module 100, the electronic component 25 may also be partially buried in the substrate 211 on the substrate front surface 2111 of the substrate 211, and the electronic component may be 25 and the substrate 211 are electrically connected to each other. At this time, the electronic component 25 also protrudes from the substrate front surface 2111 of the substrate 211.
可选地,在所述摄像模组100的其他的示例中,所述电子元器件25也可以以被贴装于所述基板211的所述基板背面2112的方式被导通地连接于所述基板211,或者所述电子元器件25以在所述基板211的所述基板背面2112被半埋入所述基板211的方式被导通地连接于所述基板211。另外,在所述摄像模组100的其他的示例中,所述电子元器件25也可以被全部埋入到所述基板211的内部,即,所述电子元器件25可以不凸出于所述基板211的所述基板正面2111和不凸出于所述基板211的所述基板背面2112。Optionally, in another example of the camera module 100, the electronic component 25 may be electrically connected to the substrate back surface 2112 of the substrate 211. The substrate 211 or the electronic component 25 is electrically connected to the substrate 211 such that the substrate back surface 2112 of the substrate 211 is half buried in the substrate 211. In addition, in other examples of the camera module 100, the electronic component 25 may also be completely buried inside the substrate 211, that is, the electronic component 25 may not protrude from the The substrate front surface 2111 of the substrate 211 and the substrate back surface 2112 of the substrate 211 are not protruded.
另外,所述电子元器件25凸出于所述基板211的所述基板正面2111的位置在本发明的所述摄像模组100中不受限制,其根据所述摄像模组100的具体应用被调整,例如在本发明的所述摄像模组100的一些示例中,多个所述电子元器件25可以被布置在所述基板211的所述基板正面2111的全部区域,而在本发明的所述摄像模组100的另一些示例中,多个所述电子元器件25也可以被布置在所述基板211的所述基板正面2111的特定区域,例如角落或者某一侧或者某两侧等,本发明的所述摄像模组100在这些方面不受限制。In addition, the position of the electronic component 25 protruding from the front surface 2111 of the substrate 211 is not limited in the camera module 100 of the present invention, and is determined according to the specific application of the camera module 100. Adjustment, for example, in some examples of the camera module 100 of the present invention, a plurality of the electronic components 25 may be disposed on all areas of the substrate front surface 2111 of the substrate 211, and in the present invention In other examples of the camera module 100, a plurality of the electronic components 25 may also be disposed on a specific area of the substrate front surface 2111 of the substrate 211, such as a corner or a side or a certain side, etc. The camera module 100 of the present invention is not limited in these respects.
值得一提的是,所述摄像模组100的所述电路板21也可以没有提供所述电子元器件25,即,所述摄像模组100可以是没有电子元器件的摄像模组100,其中在将所述摄像模组100装配于所述设备本体200之后,所述摄像模组100能够被导通所述设备本体200的电子元器件。It is to be noted that the circuit board 21 of the camera module 100 may not provide the electronic component 25, that is, the camera module 100 may be a camera module 100 without electronic components. After the camera module 100 is mounted on the device body 200, the camera module 100 can be electrically connected to the electronic components of the device body 200.
另外,一个以上的所述基板211被布置形成一拼版单元3000。值得一提的是,形成所述拼版单元3000的所述基板211的排列方式在本发明的所述摄像模组100中不受限制,其根据需要被选择,例如硬板的所述基板211形成的所述拼版单元3000和软硬结合版的基板211形成的所述拼版单元3000的排列方式可以不同。也就是说,所述拼版单元3000包括至少一个所述基板211。优选地,所述拼版单元3000的所述基板211的数量被实施为两个以上。In addition, one or more of the substrates 211 are arranged to form an imposition unit 3000. It is to be noted that the arrangement of the substrate 211 forming the imposition unit 3000 is not limited in the camera module 100 of the present invention, and is selected according to requirements, for example, the substrate 211 of the hard board is formed. The arrangement of the imposition unit 3000 formed by the imposition unit 3000 and the hard and soft combination substrate 211 may be different. That is, the imposition unit 3000 includes at least one of the substrates 211. Preferably, the number of the substrates 211 of the imposition unit 3000 is implemented as two or more.
在附图8A和图8B示出的阶段,将所述拼版单元3000放入到一成型模具300中,以藉由所述成型模具300执行模塑工艺。At the stage illustrated in FIGS. 8A and 8B, the imposition unit 3000 is placed in a molding die 300 to perform a molding process by the molding die 300.
具体地说,所述成型模具300包括一上模具301和一下模具302,其中所述上模具301和所述下模具302中的至少一个模具能够被操作,以使所述成型模具300能够被执行合模和拔模操作。例如,在一个示例中,首先将所述拼版单元3000放置于所述下模具302,然后将所述上模具301放置于所述下模具302和/或所述拼版单元3000,以对所述成型模具300执行合模操作,并且可以在所述上模具301和所述基板211的所述基板正面2111之间形成至少一成型空间303。Specifically, the molding die 300 includes an upper die 301 and a lower die 302, wherein at least one of the upper die 301 and the lower die 302 can be operated to enable the molding die 300 to be executed Clamping and drafting operations. For example, in one example, the imposition unit 3000 is first placed in the lower mold 302, and then the upper mold 301 is placed on the lower mold 302 and/or the imposition unit 3000 to form the mold The mold 300 performs a mold clamping operation, and at least one molding space 303 may be formed between the upper mold 301 and the substrate front surface 2111 of the substrate 211.
优选地,当所述成型空间303的数量是两个或者超过两个时,在所述上模具 301和所述基板21的所述基板正面2111之间还可以形成至少一连通通道304,以供连通相邻所述成型空间303。这样,当一个所述成型空间303内被填充有一流体介质400时,所述流体介质400能够通过所述连通通道304流进和填充在相邻所述成型空间303内。Preferably, when the number of the molding spaces 303 is two or more than two, at least one communication channel 304 may be formed between the upper mold 301 and the substrate front surface 2111 of the substrate 21 for Adjacent to the molding space 303 is connected. Thus, when one of the molding spaces 303 is filled with a fluid medium 400, the fluid medium 400 can flow into and fill the adjacent molding spaces 303 through the communication passages 304.
另外,进一步参考附图8A和图8B,在所述成型模具300的所述上模具301和所述基板21的所述基板正面2111之间还形成一进料通道306,其中所述进料通道306连通至少一个所述连通通道304,以允许所述流体介质400自所述进料通道306流入到所述连通通道304,然后再允许所述流体介质400通过每个所述连通通道304和每个所述成型空间303流动而填充满所有的所述成型空间303,或者所述进料通道306连通至少一个所述成型空间303,以允许所述流体介质400自所述进料通道306流入到所述成型空间303,然后再允许所述流体介质400通过每个所述成型空间303和每个所述连通通道304流动而填充满所有的所述成型空间303。In addition, referring further to FIGS. 8A and 8B, a feed channel 306 is further formed between the upper mold 301 of the molding die 300 and the substrate front surface 2111 of the substrate 21, wherein the feed channel 306 is in communication with at least one of the communication passages 304 to allow the fluid medium 400 to flow from the feed passage 306 to the communication passage 304, and then allow the fluid medium 400 to pass through each of the communication passages 304 and each The molding space 303 flows to fill all of the molding space 303, or the feed channel 306 communicates with at least one of the molding spaces 303 to allow the fluid medium 400 to flow from the feeding channel 306. The molding space 303 then allows the fluid medium 400 to flow through each of the molding spaces 303 and each of the communication passages 304 to fill all of the molding spaces 303.
进一步地,所述成型模具300包括一供料机构307,其中所述供料机构307包括一储料器3071和一推料器3072,其中所述储料器3071具有一储料空间30711和一推料通道30712,所述推料通道30712连通所述储料空间30711和所述进料通道306,其中所述推料器3072被可操作地设置于所述储料器3071的所述储料空间30711。当所述推料器3072被操作时,例如当通过但不限于液压泵施压于所述推料器3072而操作所述推料器3072时,所述推料器3072能够推动被存储在所述储料空间30711的所述流体介质400分别自所述推料通道30712和所述进料通道306而被推送进入到所述成型空间303,并且通过每个所述成型空间303和每个所述连通通道304流动而填充满所有的所述成型空间303。Further, the molding die 300 includes a feeding mechanism 307, wherein the feeding mechanism 307 includes a hopper 3071 and a ejector 3072, wherein the hopper 3071 has a storage space 30711 and a a push channel 30712, the push channel 30712 communicating with the storage space 30711 and the feed channel 306, wherein the pusher 3072 is operatively disposed to the stock of the stocker 3071 Space 30711. When the ejector 3072 is operated, such as when the ejector 3072 is operated by, but not limited to, a hydraulic pump applying pressure to the ejector 3072, the ejector 3072 can be pushed to be stored in the The fluid medium 400 of the storage space 30711 is pushed into the molding space 303 from the push channel 30912 and the feed channel 306, respectively, and through each of the molding spaces 303 and each The communication passage 304 flows to fill all of the molding space 303.
在附图8A和图8B示出的所述成型模具300的这个示例中,所述储料器3071包括一第一储料元件30713和一第二储料元件30714,其中所述第一储料元件30713和所述上模具301被实施为一体式结构,所述第二储料元件30714和所述下模具302被实施为一体式结构,并且所述第二储料元件30714具有一活动通道30715。当所述上模具301和所述下模具302合模时,能够在所述第一储料元件30713和所述第二储料元件30714之间形成所述储料空间30711和在所述第二储料元件30714的所述活动通道30715对应的位置形成所述推料通道30712。值得一提的是,所述推料通道30712内也可以被存储有所述流体介质400。In this example of the forming die 300 illustrated in Figures 8A and 8B, the hopper 3071 includes a first stock element 30713 and a second stock element 30714, wherein the first stock The element 30713 and the upper mold 301 are implemented as a unitary structure, the second stock element 30714 and the lower mold 302 are implemented as a unitary structure, and the second stock element 30714 has a movable passage 30715 . When the upper mold 301 and the lower mold 302 are clamped, the storage space 30711 and the second can be formed between the first storage element 30713 and the second storage element 30714 The corresponding position of the movable channel 30715 of the stock element 30914 forms the push channel 30912. It is worth mentioning that the fluid medium 400 can also be stored in the push channel 30912.
在一个实施例中,所述推料器3072可以仅提供压力以施压于被存储在所述储料空间30711的所述流体介质400,并驱动所述流体介质400自所述推料通道30712被排出所述供料机构307。在另一个实施例中,所述推料器3072和所述储料器3071中的至少一个还可以提供热量以加热被存储在所述储料空间30711内的所述流体介质400,例如在所述流体介质400被加热而融化后再被所述推料器3072施压压力而自所述推料通道30712被排出所述供料机构307。In one embodiment, the ejector 3072 may only provide pressure to apply pressure to the fluid medium 400 stored in the hopper space 30711 and drive the fluid medium 400 from the priming channel 30712 The supply mechanism 307 is discharged. In another embodiment, at least one of the ejector 3072 and the hopper 3071 may also provide heat to heat the fluid medium 400 stored in the hopper space 30711, such as in The fluid medium 400 is heated and melted, and then pressurized by the ejector 3072 to be discharged from the feed channel 30712 to the feeding mechanism 307.
继续参考附图8A和图8B,所述上模具301进一步包括一成型引导部3011和至少一光窗成型部3012以及具有至少一成型引导槽3013,其中所述光窗成型 部3012一体地延伸于所述成型引导部3011,以在所述光窗成型部3012和所述成型引导部3011之间形成所述成型引导槽3013,或者在相邻所述光窗成型部3012之间形成所述成型引导槽3013。With continued reference to FIGS. 8A and 8B, the upper mold 301 further includes a molding guide 3011 and at least one light window molding portion 3012 and at least one molding guide groove 3013, wherein the light window molding portion 3012 integrally extends from The molding guide portion 3011 to form the molding guide groove 3013 between the light window molding portion 3012 and the molding guide portion 3011, or to form the molding between adjacent the light window molding portions 3012 The slot 3013 is guided.
进一步地,所述成型引导部3011具有一第一施压部30111,所述光窗成型部3012具有一第二施压部30121,其中在所述成型模具300被执行合模工艺后,所述第一施压部30111施压于所述基板211的所述边缘区域2114的外侧,所述光窗成型部3012的所述第二施压部30121施压于所述基板211的所述边缘区域2114的内侧,或者所述光窗成型部3012的所述第二施压部30121施压于所述基板211的所述贴装区域2113的至少一部分,或者所述光窗成型部3012的所述第二施压部30121同时施压于所述基板211的所述贴装区域2113的至少一部分和所述边缘区域2114的内侧,从而在所述成型引导槽3013对应的位置形成所述成型空间303,并且所述基板211的所述边缘区域2114的一部分被保持在所述成型空间303,此时,凸出于所述基板211的所述基板正面2111的所述电子元器件25能够可以被保持在所述成型空间303。Further, the molding guide portion 3011 has a first pressing portion 30111, and the light window forming portion 3012 has a second pressing portion 30121, wherein after the molding die 300 is subjected to a mold clamping process, The first pressing portion 30111 is pressed outside the edge region 2114 of the substrate 211, and the second pressing portion 30121 of the light window forming portion 3012 is pressed against the edge region of the substrate 211 The inner side of 2114 or the second pressing portion 30121 of the light window forming portion 3012 is pressed against at least a portion of the mounting area 2113 of the substrate 211, or the optical window forming portion 3012 The second pressing portion 30121 is simultaneously pressed against at least a portion of the mounting region 2113 of the substrate 211 and the inner side of the edge region 2114, thereby forming the molding space 303 at a position corresponding to the molding guiding groove 3013. And a portion of the edge region 2114 of the substrate 211 is held in the molding space 303, at which time the electronic component 25 protruding from the substrate front surface 2111 of the substrate 211 can be held In the molding space 303.
优选地,所述光窗成型部3012的中部通过内凹的方式形成一安全空间30122,其中当所述光窗成型部3012的所述第二施压部30121施压于所述基板211的所述边缘区域2114的内侧时,凸出于所述基板211的所述基板正面2111的所述基板连接件2115和所述基板211的所述贴装区域2113能够被保持在所述光窗成型部3012的所述安全空间30122,以避免凸出于所述基板211的所述基板正面2111的所述基板连接件2115和所述基板211的所述贴装区域2113被施压。Preferably, the middle portion of the light window forming portion 3012 is formed in a concave manner to form a safety space 30122, wherein the second pressing portion 30121 of the light window forming portion 3012 is pressed against the substrate 211. When the inner side of the edge region 2114 is described, the substrate connector 2115 protruding from the substrate front surface 2111 of the substrate 211 and the mounting region 2113 of the substrate 211 can be held in the light window molding portion. The safety space 30122 of 3012 prevents the substrate connection 2115 protruding from the substrate front surface 2111 of the substrate 211 and the mounting area 2113 of the substrate 211 from being pressed.
优选地,所述成型模具300进一步包括至少一膜层305,其中所述膜层305被重叠地设置于所述上模具301的内表面,例如所述膜层305可以通过贴附于所述上模具301的内表面的方式被重叠地设置于所述上模具301的内表面。在所述成型模具300被合模后,所述膜层305位于所述上模具301的所述第一施压部30111和所述基板21的所述边缘区域2114的外侧之间和位于所述光窗成型部3012的所述第二施压部30121和所述基板21的所述边缘区域2114的内侧之间,通过这样的方式,一方面,所述膜层305能够通过产生变形的方式吸收所述成型模具300在被合模时产生的冲击力,以避免该冲击力直接作用于所述基板211,另一方面,所述膜层305能够隔离所述上模具301的所述第一施压部30111与所述基板211的所述边缘区域2114的外侧和隔离所述第二施压部30121与所述基板211的所述边缘区域2114的内侧,以防止所述上模具301刮伤所述基板211的所述基板正面2111,从而保护所述基板211的良好电性。Preferably, the molding die 300 further includes at least one film layer 305, wherein the film layer 305 is overlappedly disposed on an inner surface of the upper mold 301, for example, the film layer 305 may be attached thereto by The manner of the inner surface of the mold 301 is overlapped on the inner surface of the upper mold 301. After the molding die 300 is clamped, the film layer 305 is located between the first pressing portion 30111 of the upper mold 301 and the outer side of the edge region 2114 of the substrate 21 and is located at the Between the second pressing portion 30121 of the light window forming portion 3012 and the inner side of the edge portion 2114 of the substrate 21, in this manner, on the one hand, the film layer 305 can be absorbed by deformation. The impact force generated by the molding die 300 when being clamped to prevent the impact force from directly acting on the substrate 211. On the other hand, the film layer 305 can isolate the first application of the upper mold 301. a pressing portion 30111 and an outer side of the edge region 2114 of the substrate 211 and an inner side of the edge portion 2114 of the substrate 211 are separated from the second pressing portion 30121 to prevent the upper mold 301 from being scratched. The substrate front surface 2111 of the substrate 211 is described to protect the substrate 211 from good electrical properties.
另外,所述膜层305能够通过产生变形的方式阻止在所述上模具301的所述第一施压部30111与所述基板211的所述边缘区域2114的外侧之间产生缝隙和阻止所述第二施压部30121与所述基板211的所述边缘区域2114的内侧之间产生缝隙,这样,能够阻止所述流体介质400进入到所述基板211的所述贴装区域2111,同时,在所述流体介质400固化后能够避免出现“飞边”的不良现象。In addition, the film layer 305 can prevent a gap from being formed between the first pressing portion 30111 of the upper mold 301 and the outer side of the edge region 2114 of the substrate 211 by deformation, and preventing the A gap is formed between the second pressing portion 30121 and the inner side of the edge region 2114 of the substrate 211, so that the fluid medium 400 can be prevented from entering the mounting region 2111 of the substrate 211, and at the same time, The fluid medium 400 can avoid the occurrence of "flash" defects after curing.
另外,可以理解的是,所述膜层305也可以方便所述成型模具300的所述上模具301脱模,并且在所述上模具301脱模的过程中,避免所述模塑基座23被损坏,尤其是避免所述模塑基座23的所述光窗231被损坏,从而保证所述摄像模组100的可靠性。In addition, it can be understood that the film layer 305 can also facilitate the demolding of the upper mold 301 of the molding die 300, and the molding base 23 is avoided during the demolding of the upper mold 301. It is damaged, in particular, to prevent the light window 231 of the molded base 23 from being damaged, thereby ensuring the reliability of the camera module 100.
参考附图9和图10示出的阶段,将所述流体介质400加入到所述供料机构307的所述储料空间30711,然后,通过所述推料器3072施压于位于所述储料空间30711的所述流体介质400,同时,所述推料器3072和所述储料器3071中的至少一个还能够加热所述流体介质400,其中所述流体介质400在被施压时自所述推料通道30712被排出所述储料空间30711,和通过所述进料通道306流向连通于所述进料通道306的所述成型空间303,并且在后续,当所述流体介质400继续被施压时,所述流体介质400能够通过每个所述成型空间303和每个所述连通通道304填充满所有的所述成型空间303。Referring to the stages illustrated in Figures 9 and 10, the fluid medium 400 is added to the hopper space 30711 of the supply mechanism 307, and then, by the ejector 3072, pressure is applied to the reservoir. The fluid medium 400 of the material space 30711, at the same time, at least one of the ejector 3072 and the hopper 3071 can also heat the fluid medium 400, wherein the fluid medium 400 is self-pressurized The push channel 30712 is discharged from the storage space 30711, and flows through the feed channel 306 to the molding space 303 communicating with the feed channel 306, and subsequently, when the fluid medium 400 continues When pressurized, the fluid medium 400 can fill all of the molding space 303 through each of the molding spaces 303 and each of the communication passages 304.
值得一提的是,所述流体介质400可以是液体、固体或者液体和固体的混合物等,以使所述流体介质400能够流动。另外,所述流体介质400可以被实施为但不限于热固性材料。当然,本领域的技术人员可以理解的是,在其他可能的示例中,所述流体介质400被实施为光固性材料或者自固性材料也是有可能的。It is worth mentioning that the fluid medium 400 can be a liquid, a solid or a mixture of liquid and solid, etc., to enable the fluid medium 400 to flow. Additionally, the fluid medium 400 can be implemented as, but not limited to, a thermoset material. Of course, it will be understood by those skilled in the art that in other possible examples, it is also possible that the fluid medium 400 is implemented as a photo-curable material or a self-solid material.
当所述流体介质400被填充在所述成型空间303之后,所述流体介质400能够覆盖所述基板211的所述边缘区域2114的被保持在所述成型空间303内的区域,和覆盖被保持在所述成型空间303内的所述电子元器件25,在后续,可以通过加热的方式使填充在所述成型空间303的所述流体介质400固化而形成一连体模塑基座4200,其中所述连体模塑基座4200能够一体地结合于所述基板211的所述基板正面2111的区域,和包埋至少一个所述电子元器件25的至少一部分。优选地,所述连体模塑基座4200能够包埋全部的所述电子元器件25。值得一提的是,所述连体模塑基座4200能够在后续被分割以形成所述模塑感光单元20的所述模塑基座23。After the fluid medium 400 is filled in the molding space 303, the fluid medium 400 can cover an area of the edge region 2114 of the substrate 211 that is held within the molding space 303, and the cover is held In the electronic component 25 in the molding space 303, the fluid medium 400 filled in the molding space 303 can be cured by heating to form a continuous molding base 4200, wherein The joint molding base 4200 can be integrally coupled to a region of the substrate front surface 2111 of the substrate 211, and at least a portion of at least one of the electronic components 25 is embedded. Preferably, the continuous molded base 4200 can embed all of the electronic components 25. It is worth mentioning that the continuous molded base 4200 can be subsequently divided to form the molded base 23 of the molded photosensitive unit 20.
值得一提的是,也可以通过冷却的方式使被填充在所述成型空间303的所述流体介质400固化,或者在常温下使被填充在所述成型空间303的所述流体介质400固化,本发明的所述摄像模组100在这方面不受限制。It is worth mentioning that the fluid medium 400 filled in the molding space 303 can also be solidified by cooling, or the fluid medium 400 filled in the molding space 303 can be solidified at a normal temperature. The camera module 100 of the present invention is not limited in this regard.
参考附图11和图12示出的阶段,当所述流体介质400在所述成型模具300的所述成型空间303内固化而形成一体地结合于所述基板211的所述基板正面2111的所述连体模塑基座4200时,对所述成型模具300执行拔模操作,以得到一模塑电路板组件半成品2100,其中在所述成型模具300的所述上模具301的所述光窗成型部3012对应的位置能够形成所述连体模塑基座4200的所述光窗231,并且在所述连体模塑基座4200被分割以形成所述模塑基座23时,所述连体模塑基座4200的所述光窗231形成所述模塑基座23的所述光窗231。可以理解的是,在本发明的所述摄像模组100的这个具体的示例中,所述模塑基座23能够环绕在所述基板211的所述贴装区域2113的四周,以使所述贴装区域2113对应于所述模塑基座23的所述光窗231。可以理解的是,所述基板211的所述 基板连接件2115被保持在所述模塑基座23的所述光窗231内。值得一提的是,所述模塑电路板组件半成品2100是所述模塑感光单元20的半成品。也就是说,所述模塑电路板组件半成品2100在后续能够被加工以形成所述模塑感光单元20。Referring to the stages shown in FIGS. 11 and 12, when the fluid medium 400 is solidified in the molding space 303 of the molding die 300, a portion integrally bonded to the substrate front surface 2111 of the substrate 211 is formed. When the pedestal 4200 is integrally molded, a draft operation is performed on the molding die 300 to obtain a molded circuit board assembly semi-finished product 2100, wherein the light window of the upper mold 301 of the molding die 300 is formed. The position of the molding portion 3012 can form the light window 231 of the continuous molding base 4200, and when the continuous molding base 4200 is divided to form the molding base 23, The light window 231 of the continuous molded base 4200 forms the light window 231 of the molded base 23. It can be understood that, in this specific example of the camera module 100 of the present invention, the molding base 23 can surround the mounting area 2113 of the substrate 211 to enable the The mounting area 2113 corresponds to the light window 231 of the molded base 23. It will be understood that the substrate connector 2115 of the substrate 211 is held within the light window 231 of the molded base 23. It is worth mentioning that the molded circuit board assembly semi-finished product 2100 is a semi-finished product of the molded photosensitive unit 20. That is, the molded circuit board assembly blank 2100 can be subsequently processed to form the molded photosensitive unit 20.
值得一提的是,所述模塑基座23的所述基座内表面234是在所述成型模具300被脱模后形成的,所述模塑基座23的所述基座外表面235可以是在所述成型模具300被脱模后形成的,也可以是在所述模塑电路板组件半成品2100被分割后形成的。It is worth mentioning that the base inner surface 234 of the molding base 23 is formed after the molding die 300 is demolded, and the base outer surface 235 of the molding base 23 It may be formed after the molding die 300 is demolded, or may be formed after the molded circuit board assembly blank 2100 is divided.
具体地说,参考附图13A和图13B示出的阶段,分割所述模塑电路板组件半成品2100,以形成一模塑电路板组件2000,并且可以同时形成所述模塑电路板组件2000的所述模塑基座23的所述基座外表面235,而在另外的一些示例中,在分割所述模塑电路板组件半成品2100而形成所述模塑电路板组件2000后,也可以研磨或者打磨所述模塑基座23的外表面后形成所述模塑基座23的所述基座外表面235。Specifically, the molded circuit board assembly blank 2100 is divided to form a molded circuit board assembly 2000, and the molded circuit board assembly 2000 can be simultaneously formed, with reference to the stages illustrated in FIGS. 13A and 13B. The base outer surface 235 of the molded base 23, and in still other examples, after the molded circuit board assembly blank 2100 is divided to form the molded circuit board assembly 2000, it may also be ground. Alternatively, the outer surface 235 of the molded base 23 is formed after the outer surface of the molded base 23 is sanded.
另外,分割所述模塑电路板组件2100的方式在本发明的所述摄像模组100中不受限制,例如可以通过切割的方式分割所述模塑电路板组件半成品2100,以形成所述模塑电路板组件2000,也可以通过蚀刻的方式分割所述模塑电路板组件半成品2100,以形成所述模塑电路板组件2000。本领域的技术人员可以理解的是,上述列举的通过切割或者蚀刻来分割所述模塑电路板组件半成品2100的方式仅为示例,其并不构成对本发明的所述摄像模组100的内容和范围的限制。本领域的技术人员也可以通过其他的方式来分割所述模塑电路板组件半成品2100,以形成所述模塑电路板组件2000,因此,只要能够将所述模塑电路板组件半成品2100进行分割的方式均可。值得一提的是,所述连体模塑基座4200的被分割的外表面形成所述模塑基座23的所述基座外表面235。In addition, the manner of dividing the molded circuit board assembly 2100 is not limited in the camera module 100 of the present invention. For example, the molded circuit board assembly semi-finished product 2100 may be divided by cutting to form the mold. The plastic circuit board assembly 2000 can also be etched to divide the molded circuit board assembly blank 2100 to form the molded circuit board assembly 2000. It will be understood by those skilled in the art that the above-mentioned manner of dividing the molded circuit board assembly semi-finished product 2100 by cutting or etching is only an example, and does not constitute the content of the camera module 100 of the present invention. The limits of the scope. The molded circuit board assembly semi-finished product 2100 can also be divided by other means to form the molded circuit board assembly 2000, so that the molded circuit board assembly semi-finished product 2100 can be divided. The way can be. It is worth mentioning that the divided outer surface of the continuous molded base 4200 forms the base outer surface 235 of the molded base 23.
可以理解的是,所述模塑基座23的所述基座外表面235可以是倾斜的,也可以是竖直的,其根据需要被选择。It will be appreciated that the base outer surface 235 of the molded base 23 may be sloped or vertical, which may be selected as desired.
另外,分割所述模塑电路板组件半成品2100的方向在本发明的所述摄像模组100中不受限制,例如在附图13A示出的示例中,分割方向可以是从所述基板211的所述基板正面2111所在的方向向所述基板211的所述基板背面2112所在的方向,而在附图13B示出的示例中,分割方向可以从所述基板211的所述基板背面2112所在的方向向所述基板211的所述基板正面2111所在的方向。In addition, the direction in which the molded circuit board assembly semi-finished product 2100 is divided is not limited in the camera module 100 of the present invention. For example, in the example shown in FIG. 13A, the dividing direction may be from the substrate 211. The direction in which the substrate front surface 2111 is located is in a direction in which the substrate back surface 2112 of the substrate 211 is located, and in the example illustrated in FIG. 13B, the dividing direction may be from the substrate back surface 2112 of the substrate 211. The direction is toward the direction in which the substrate front surface 2111 of the substrate 211 is located.
在所述模塑电路板组件半成品2100被分割后,所述连体模塑基座4200能够形成所述模塑基座23,所述连体模塑基座4200的所述光窗231形成所述模塑基座23的所述光窗231。After the molded circuit board assembly blank 2100 is divided, the continuous molding base 4200 can form the molding base 23, and the light window 231 of the continuous molding base 4200 forms a The light window 231 of the molded base 23 is described.
值得一提的是,所述模塑电路板组件半成品2100的被分割的侧部形成所述模塑电路板组件2000的一分割侧2001。也就是说,所述模塑电路板组件2000具有至少一个所述分割侧2001。另外,所述模塑电路板组件半成品2100的脱模形成的侧部是所述模塑电路板组件2000的一脱模侧2002。也就是说,在本发明 的所述摄像模组100的一些示例中,所述模塑电路板组件2000可以具有至少一个所述分割侧2001和至少一个所述脱模侧2002。而在所述摄像模组100的其他的示例中,所述模塑电路板组件2000也可以具有四个所述分割侧2001,或者具有四个所述脱模侧2002。可以理解的是,所述分割侧2001和所述脱模侧2002均可以形成所述模塑基座23的所述基座外表面235。It is worth mentioning that the divided sides of the molded circuit board assembly blank 2100 form a split side 2001 of the molded circuit board assembly 2000. That is, the molded circuit board assembly 2000 has at least one of the divided sides 2001. Additionally, the side portion of the molded circuit board assembly blank 2100 that is demolded is a release side 2002 of the molded circuit board assembly 2000. That is, in some examples of the camera module 100 of the present invention, the molded circuit board assembly 2000 may have at least one of the divided side 2001 and at least one of the released sides 2002. In other examples of the camera module 100, the molded circuit board assembly 2000 may also have four of the divided sides 2001 or have four of the stripping sides 2002. It will be understood that both the split side 2001 and the release side 2002 may form the base outer surface 235 of the molded base 23.
参考附图14示出的阶段,将所述感光元件22贴装于所述基板211的所述贴装区域2113,和通过打线工艺在所述感光元件22的所述芯片连接件223与所述基板211的所述基板连接件2115之间形成所述连接线24,以通过所述连接线24导通地连接所述感光元件22和所述基板211。Referring to the stage shown in FIG. 14, the photosensitive member 22 is attached to the mounting region 2113 of the substrate 211, and the chip connector 223 of the photosensitive member 22 is passed through a wire bonding process. The connecting line 24 is formed between the substrate connectors 2115 of the substrate 211 to electrically connect the photosensitive element 22 and the substrate 211 through the connecting line 24.
参考附图15和图16示出的阶段,将带有所述滤光单元30的所述支座32贴装于所述模塑基座23的所述顶表面232,以形成一感光装置半成品1100,其中所述感光装置半成品1100在后续形成所述感光装置1000。Referring to the stages shown in Figs. 15 and 16, the holder 32 with the filter unit 30 is attached to the top surface 232 of the molding base 23 to form a photosensitive device semi-finished product. 1100, wherein the photosensitive device semi-finished product 1100 subsequently forms the photosensitive device 1000.
具体地说,首先,在所述模塑基座23的所述顶表面232和所述支座32的所述下表面324中的至少一个表面上施涂所述贴装介质1002,例如可以在所述支座32的所述下表面324的所述画胶区域3242施涂所述贴装介质1002,其中所述贴装介质1002可以是但不限于胶水。然后将所述支座32的所述下表面324和所述模塑基座23的所述顶表面232相互叠合在一起,以使所述贴装介质1002被保持在所述支座32的所述下表面324和所述模塑基座23的所述顶表面232之间,并且在所述贴装介质1002固化后形成被保持在所述支座32的所述下表面324和所述模塑基座23的所述顶表面232之间的所述贴装层1001,其中所述贴装层1001用于连接所述支座32的所述下表面324和所述模塑基座23的所述顶表面232。值得一提的是,多余的所述贴装介质1002能够溢入到所述通气槽329的所述第一通气槽3293,并且由于所述通气槽329的所述第一通气槽3293的深度尺寸大于所述贴装介质1002的厚度尺寸,从而不用担心溢入到所述第一通气槽3293的所述贴装介质1002堵塞所述通气通道102,以保证所述通气通道102的畅通。也就是说,位于所述支座32的所述下表面324和所述模塑基座23的所述顶表面232之间的多余的所述贴装介质1002能够溢入到所述支座32的所述溢胶槽3206内,并且溢入到所述支座32的所述溢胶槽3206内的所述贴装介质1002不会堵塞所述通气通道102,即,溢入到所述溢胶槽3206内的所述贴装介质1002不会填充满所述溢胶槽3206而使所述通气通道102保持畅通。值得一提的是,所述溢胶槽3206形成在所述支座32的所述下表面324的所述非画胶区域3241和所述画胶区域3242的连接位置,从而位于所述支座32的所述下表面324和所述模塑基座23的所述顶表面232之间的多余的所述贴装介质1002能够自所述下表面324的所述画胶区域3242溢入到所述支座32的所述溢胶槽3206内,通过这样的方式,有利于保证所述支座32的平整度,从而有利于改善所述摄像模组100的光学性能。Specifically, first, the mounting medium 1002 is applied on at least one of the top surface 232 of the molding base 23 and the lower surface 324 of the holder 32, for example, The glue area 3242 of the lower surface 324 of the holder 32 applies the placement medium 1002, wherein the placement medium 1002 may be, but not limited to, glue. The lower surface 324 of the holder 32 and the top surface 232 of the molded base 23 are then superposed on each other such that the mounting medium 1002 is held at the holder 32. Between the lower surface 324 and the top surface 232 of the molded base 23, and after the curing of the mounting medium 1002, the lower surface 324 held by the holder 32 and the The mounting layer 1001 between the top surfaces 232 of the molding base 23, wherein the mounting layer 1001 is used to connect the lower surface 324 of the holder 32 and the molding base 23 The top surface 232. It is worth mentioning that the excess of the mounting medium 1002 can overflow into the first venting groove 3293 of the venting groove 329, and due to the depth dimension of the first venting groove 3293 of the venting groove 329 The thickness of the mounting medium 1002 is larger than the thickness of the mounting medium 1002, so that the venting passage 102 is not blocked by the mounting medium 1002 overflowing into the first venting groove 3293 to ensure the venting of the venting passage 102. That is, excess of the mounting medium 1002 between the lower surface 324 of the holder 32 and the top surface 232 of the molded base 23 can overflow into the holder 32. The placement medium 1002 within the overflow tank 3206 and overflowing into the overflow tank 3206 of the holder 32 does not block the ventilation passage 102, that is, overflowing into the overflow The mounting medium 1002 in the glue tank 3206 does not fill the overflow tank 3206 to keep the ventilation passage 102 clear. It is worth mentioning that the overflow tank 3206 is formed at a connection position of the non-paint area 3241 of the lower surface 324 of the holder 32 and the glue area 3242 so as to be located at the support. The excess of the mounting medium 1002 between the lower surface 324 of the 32 and the top surface 232 of the molded base 23 can overflow from the glue area 3242 of the lower surface 324. In this manner, in the overflow tank 3206 of the support 32, in this way, the flatness of the support 32 is ensured, thereby facilitating the improvement of the optical performance of the camera module 100.
在所述支座32被贴装于所述模塑基座23之后,在所述滤光元件31、所述支座32、所述模塑基座23和所述基板211之间形成所述密封空间101,其中所 述感光元件22的所述感光区域221被保持在所述密封空间101,其中形成于所述支座32的所述通气通道102用于连通所述密封空间101和所述感光装置1000的外部。另外,在所述支座32被贴装于所述模塑基座23之后,所述支座32环绕在所述感光元件22的所述感光区域221的四周,以使所述感光元件22的所述感光区域221对应于所述滤光元件31。换言之,所述模塑基座23的所述光窗231和所述支座32的所述通光通道321相互对应,从而对应于所述模塑基座23的所述光窗231的所述感光元件22的所述感光区域221能够对应于被贴装在所述支座32且封闭所述支座32的所述通光通道321的所述滤光元件31。Forming the filter element 31, the holder 32, the molding base 23, and the substrate 211 after the holder 32 is attached to the molding base 23. a sealed space 101 in which the photosensitive region 221 of the photosensitive member 22 is held in the sealed space 101, wherein the venting passage 102 formed in the holder 32 is used to communicate the sealed space 101 and the The outside of the photosensitive device 1000. In addition, after the holder 32 is attached to the molding base 23, the holder 32 surrounds the photosensitive region 221 of the photosensitive member 22 to make the photosensitive member 22 The photosensitive region 221 corresponds to the filter element 31. In other words, the light window 231 of the molding base 23 and the light passing passage 321 of the holder 32 correspond to each other so as to correspond to the light window 231 of the molding base 23 The photosensitive region 221 of the photosensitive member 22 can correspond to the filter element 31 that is attached to the holder 32 and closes the light passage 321 of the holder 32.
值得一提的是,所述通气通道102弯曲地延伸,这样,在将所述支座32贴装于所述模塑基座23之后,所述通气通道102能够阻止灰尘等污染物经由所述通气通道102自所述摄像模组100的外部环境进入到所述密封空间101而污染被保持在所述密封空间101的所述感光元件22的所述感光区域221和污染所述滤光元件31的用于形成所述密封空间101的部分,以防止污坏点等不良现象的出现,从而保证所述摄像模组100的产品良率。It is worth mentioning that the venting passage 102 is curvedly extended, such that after the holder 32 is attached to the molding base 23, the venting passage 102 can prevent dust and the like from passing through the The venting passage 102 enters the sealed space 101 from the external environment of the camera module 100 to contaminate the photosensitive region 221 of the photosensitive member 22 held in the sealed space 101 and contaminate the filter element 31 The portion for forming the sealed space 101 is used to prevent the occurrence of undesirable phenomena such as stain spots, thereby ensuring the product yield of the camera module 100.
具体地说,所述通气通道102由所述支座32的相互连通的所述通气孔328和所述通气槽329形成,其中所述通气孔328的延伸方向和所述通气槽329的延伸方向不一致,从而使所述通气通道102弯曲地延伸。例如,所述通气孔328的延伸方向和所述通气槽329的延伸方向相互垂直,从而使所述通气通道102的中部具有一个急转弯,这样,能够有效地阻止灰尘等污染物经由所述通气通道102自外部环境进入所述密封空间101。Specifically, the venting passage 102 is formed by the vent hole 328 and the venting groove 329 of the support 32 communicating with each other, wherein the vent hole 328 extends in a direction and the venting groove 329 extends. Inconsistent, thereby causing the venting passage 102 to extend in a curved manner. For example, the extending direction of the vent hole 328 and the extending direction of the venting groove 329 are perpendicular to each other, so that the middle portion of the venting passage 102 has a sharp turn, so that dust and the like can be effectively prevented from passing through the venting. The passage 102 enters the sealed space 101 from the external environment.
参考附图17A和图17B示出的阶段,在将所述支座32通过所述贴装介质1002贴装于所述模塑基座23之后,需要对所述感光装置1000进行烘烤工艺,以使所述贴装介质1002能够进一步固化而形成被保持在所述支座32的所述下表面324和所述模塑基座23的所述顶表面232之间的所述贴装层1001,从而使所述支座32能够被可靠地贴装在所述模塑基座23上,和使所述滤光元件31能够被可靠地保持在所述感光元件22的感光路径上。Referring to the stages shown in FIGS. 17A and 17B, after the holder 32 is attached to the molding base 23 through the mounting medium 1002, it is necessary to perform a baking process on the photosensitive device 1000. The mounting layer 1001 is formed to enable the mounting medium 1002 to be further cured to form the mounting layer 1001 held between the lower surface 324 of the holder 32 and the top surface 232 of the molding base 23. Thereby, the holder 32 can be reliably mounted on the molded base 23, and the filter element 31 can be reliably held on the photosensitive path of the photosensitive member 22.
在进行烘烤工艺的过程中,所述密封空间101内的气体受热膨胀之后,能够通过所述通气通道102与所述感光装置1000的外部的气体进行交换,以使所述密封空间101内的气体气压和所述感光装置1000的外部的气体气压能够始终保持平衡,这样,用于形成所述密封空间101的所述滤光元件31、所述感光元件22等较为脆弱的元器件不会因为受压不均衡而出现裂纹或者碎裂的不良现象,这对于保证所述摄像模组100的成像品质和良率来说特别的重要。During the baking process, after the gas in the sealed space 101 is thermally expanded, the gas outside the photosensitive device 1000 can be exchanged through the ventilation passage 102 to make the sealed space 101 The gas pressure and the gas pressure outside the photosensitive device 1000 can be always balanced, so that the components of the filter element 31, the photosensitive element 22, etc., which are used to form the sealed space 101, are not vulnerable because The phenomenon of cracking or chipping due to uneven pressure is particularly important for ensuring the image quality and yield of the camera module 100.
例如,如果没有用于连通所述密封空间101和所述感光装置1000外部的所述通气通道102来实现所述密封空间101内的气体与所述感光装置1000的外部的气体的交换,在进行烘烤工艺的过程中,所述密封空间101内的气体会因为热胀冷缩而产生膨胀,这会导致所述密封空间101内的气压压力变大并直接作用于被保持在所述密封空间101的所述感光元件22的所述感光区域221和所述滤光元件31用于形成所述密封空间101的部分,例如对于所述感光元件22的所述感 光区域221来说,一旦所述感光元件22的所述感光区域221受到比较大的压力,则所述感光元件22的所述感光区域221会产生凹陷等变形,以至于影响所述摄像模组100的成像品质;对于所述滤光元件31来说,如果所述滤光元件31的下部受到的压力大于所述滤光元件31的上部受到的压力,则会导致滤光元件31出现裂纹或者碎裂的不良现象,而一旦所述滤光元件31出现裂纹或者碎裂的不良现象,则必然会导致所述摄像模组100的成像品质受到影响,甚至造成所述摄像模组100的报废。For example, if there is no ventilation passage 102 for communicating the sealed space 101 and the outside of the photosensitive device 1000 to exchange gas between the gas in the sealed space 101 and the outside of the photosensitive device 1000, During the baking process, the gas in the sealed space 101 may expand due to thermal expansion and contraction, which causes the pressure of the air pressure in the sealed space 101 to become large and directly acts on the sealed space. The photosensitive region 221 of the photosensitive member 22 of 101 and the filter element 31 are used to form a portion of the sealed space 101, for example, for the photosensitive region 221 of the photosensitive member 22, once said The photosensitive region 221 of the photosensitive element 22 is subjected to a relatively large pressure, and the photosensitive region 221 of the photosensitive element 22 is deformed by a depression or the like to affect the imaging quality of the camera module 100; In the case of the optical element 31, if the lower portion of the filter element 31 is subjected to a pressure greater than the pressure applied to the upper portion of the filter element 31, the filter element 31 may be cracked or chipped. Liang phenomenon, the filter element 31 once cracks or chipping of undesirable phenomena, is inevitably lead to the camera module 100 of the image quality is affected, or even result in the scrapping of the camera module 100.
在本发明的所述摄像模组100中,通过形成于所述支座32的所述通气通道102连通所述密封空间101和所述感光装置1000的外部,这样,在进行烘烤工艺的过程中,当所述密封空间101的气体受热膨胀时,膨胀后的气体能够依次通过所述通气槽329和所述通气孔328被排出到所述感光装置1000的外部,此时,所述密封空间101内的气体气压与所述感光装置1000的外部的气体气压平衡,从而被保持在所述密封空间101的所述感光元件22的所述感光区域221和所述滤光元件31用于形成所述密封空间101的部分不会受到气体压力。在进行烘烤工艺后且在所述感光装置1000降温时,所述感光装置1000的外部的气体能够依次通过所述通气孔328和通气槽329补充到所述密封空间101内,此时,所述密封空间101内的气体气压与所述感光装置1000的外部的气体气压平衡,从而被保持在所述密封空间101的所述感光元件22的所述感光区域221和所述滤光元件31用于形成所述密封空间101的部分不会受到气体压力。也就是说,所述通气通道102能够始终使所述密封空间101内的气体气压和所述感光装置1000的外部的气体气压保持平衡,这对于保证所述摄像模组100的成像品质和良率来说特别的重要。In the camera module 100 of the present invention, the sealed space 101 and the outside of the photosensitive device 1000 are communicated through the venting passage 102 formed in the holder 32, thus performing the baking process. When the gas of the sealed space 101 is thermally expanded, the expanded gas can be sequentially discharged to the outside of the photosensitive device 1000 through the venting groove 329 and the vent hole 328. At this time, the sealed space The gas pressure in the 101 is balanced with the gas pressure outside the photosensitive device 1000, so that the photosensitive region 221 and the filter member 31 of the photosensitive member 22 held in the sealed space 101 are used to form a The portion of the sealed space 101 is not subjected to gas pressure. After the baking process is performed and when the photosensitive device 1000 is cooled, the gas outside the photosensitive device 1000 can be sequentially supplied into the sealed space 101 through the vent hole 328 and the venting groove 329, at this time, The gas pressure in the sealed space 101 is balanced with the gas pressure outside the photosensitive device 1000, thereby being held by the photosensitive region 221 and the filter element 31 of the photosensitive member 22 of the sealed space 101. The portion where the sealed space 101 is formed is not subjected to gas pressure. That is, the venting passage 102 can always balance the gas pressure in the sealed space 101 and the gas pressure outside the photosensitive device 1000, which is to ensure the imaging quality and yield of the camera module 100. It is especially important to say.
同时,所述贴装介质1002在受热时也会发生膨胀,由于所述溢胶槽3206的深度尺寸大于所述贴装介质1002的厚度尺寸,从而膨胀后的所述贴装介质1002能够溢入到所述溢胶槽3206内,且不会堵塞所述通气通道102。换句话说,由于所述第一通气槽3293的深度尺寸大于所述贴装介质1002的厚度尺寸,从而膨胀后的所述贴装介质1002能够溢入到所述第一通气槽3293内,且不会堵塞所述通气通道102。At the same time, the mounting medium 1002 also expands when heated, and since the depth dimension of the overflow tank 3206 is larger than the thickness dimension of the mounting medium 1002, the expanded mounting medium 1002 can overflow. It is into the overflow tank 3206 and does not block the ventilation passage 102. In other words, since the depth dimension of the first ventilation groove 3293 is larger than the thickness dimension of the mounting medium 1002, the expanded placement medium 1002 can overflow into the first ventilation groove 3293, and The venting passage 102 is not blocked.
另外,由于所述通气通道102是弯曲地延伸的,从而在气体经由所述通气通道102自所述感光装置1000的外部补充到所述密封空间101时,气体中即便是携带了灰尘等污染物,这些灰尘等污染物也能够在所述通气通道102的转弯位置被截留,即,灰尘等污染物进入所述通气通道102的极限位置是形成所述通气通道102的所述通气孔328内,而不会进入到形成所述通气通道102的所述通气槽329内,这样,能够避免所述摄像模组100出现污染点等不良现象。In addition, since the vent passage 102 is curvedly extended, even when the gas is replenished from the outside of the photosensitive device 1000 to the sealed space 101 via the vent passage 102, even a gas such as dust is carried in the gas. The contaminants such as dust can also be trapped at the turning position of the venting passage 102, that is, the extreme position where dust or the like enters the venting passage 102 is the vent hole 328 forming the venting passage 102. Therefore, it does not enter the venting groove 329 forming the venting passage 102, so that the camera module 100 can be prevented from having a problem such as a contamination point.
参考附图17C,在完成烘烤工艺后,将所述密封介质104填充在形成所述通气通道102的所述通气孔328内,并且在所述密封介质104固化后形成被保持在所述通气孔328内的所述密封元件103,其中所述密封元件103阻止所述密封空间101和所述感光装置1000的外部相连通,这样,所述密封空间101能够形成 完整的封闭空间,从而在后续,灰尘等污染物被阻止进入所述密封空间101内。值得一提的是,由于所述通气孔328的延伸方向和所述通气槽329的延伸方向不同,从而在所述密封介质104被填充到所述通气孔328内时,由于所述密封介质104的流动性比较差,从而所述密封介质104被阻止进入所述通气槽329,通过这样的方式,能够防止所述密封介质104进入所述密封空间101,以保证所述摄像模组100的品质和产品良率。Referring to FIG. 17C, after the baking process is completed, the sealing medium 104 is filled in the vent hole 328 forming the vent passage 102, and formed in the pass after the sealing medium 104 is cured. The sealing member 103 in the air hole 328, wherein the sealing member 103 prevents the sealed space 101 from communicating with the outside of the photosensitive device 1000, so that the sealed space 101 can form a complete enclosed space, thereby Contaminants such as dust are prevented from entering the sealed space 101. It is worth mentioning that, since the extending direction of the vent hole 328 and the extending direction of the venting groove 329 are different, when the sealing medium 104 is filled into the vent hole 328, due to the sealing medium 104 The fluidity is relatively poor, so that the sealing medium 104 is prevented from entering the venting groove 329. In this manner, the sealing medium 104 can be prevented from entering the sealed space 101 to ensure the quality of the camera module 100. And product yield.
在附图18示出的阶段,将组装有所述光学镜头10的所述驱动器40贴装于所述支座32的所述上表面326,和将所述驱动器40的所述马达引脚41连接于所述基板211,以使所述光学镜头10被保持在所述感光元件22的感光路径,和使所述滤光元件31被保持在所述光学镜头10和所述感光元件22之间。在这个过程中,凸出于所述支座32的所述上表面326的所述定位凸起3230能够引导所述驱动器40被贴装至正确的位置。At the stage illustrated in FIG. 18, the driver 40 incorporating the optical lens 10 is attached to the upper surface 326 of the holder 32, and the motor pin 41 of the driver 40 is mounted. Connected to the substrate 211 such that the optical lens 10 is held in a photosensitive path of the photosensitive element 22, and the filter element 31 is held between the optical lens 10 and the photosensitive element 22 . During this process, the locating projections 3230 protruding from the upper surface 326 of the abutment 32 can guide the driver 40 to be placed in the correct position.
在附图19示出的阶段,通过所述连接介质2123将所述连接板212的所述模组连接端2121贴装于所述基板211的所述基板正面2111,以导通地连接所述连接板212和所述基板211,从而得到附图20示出的所述摄像模组100。可选地,在所述摄像模组100的其他示例中,也可以通过所述连接介质2123将所述连接板212的所述模组连接端2121贴装于所述基板211的所述基板背面2112。At the stage shown in FIG. 19, the module connection end 2121 of the connection board 212 is attached to the substrate front surface 2111 of the substrate 211 through the connection medium 2123 to electrically connect the The board 212 and the substrate 211 are connected to obtain the camera module 100 shown in FIG. Optionally, in another example of the camera module 100, the module connection end 2121 of the connection board 212 may be mounted on the back surface of the substrate 211 through the connection medium 2123. 2112.
值得一提的是,附图19示出的阶段也可以在图7示出的阶段之后,从而首先将所述连接板212的所述模组连接端2121通过所述连接介质2123贴装于所述基板211的所述基板正面2111,然后再进行模塑工艺,通过这样的方式,一体地结合于所述基板211的所述边缘区域2114的所述模塑基座23还能够包埋所述连接板212的所述模组连接端2121,从而所述模塑基座23能够使所述连接板212的所述模组连接端2121被可靠地贴装在所述基板211的所述基板正面2111,以避免所述连接板212的所述模组连接端2121从所述基板211上脱落。It should be noted that the stage shown in FIG. 19 can also be after the stage shown in FIG. 7 , so that the module connection end 2121 of the connecting board 212 is first mounted on the connecting medium 2123 through the connecting medium 2123. The substrate front surface 2111 of the substrate 211 is then subjected to a molding process, by which the molded base 23 integrally bonded to the edge region 2114 of the substrate 211 can also be embedded. The module connection end 2121 of the connection board 212, so that the molding base 23 enables the module connection end 2121 of the connection board 212 to be reliably mounted on the front surface of the substrate of the substrate 211 2111, to prevent the module connection end 2121 of the connecting board 212 from falling off the substrate 211.
附图21示出了所述摄像模组100的一个变形实施方式,与附图20示出的所述摄像模组100不同的是,在附图21示出的所述摄像模组100中,所述驱动器40被贴装于所述模塑基座23的所述顶表面232。换言之,所述驱动器40被贴装于所述模塑基座23的所述顶表面232的外侧,所述支座32被贴装于所述模塑基座23的所述顶表面232的内侧,通过这样的方式,能够进一步降低所述摄像模组100的高度尺寸。FIG. 21 shows a modified embodiment of the camera module 100. In contrast to the camera module 100 shown in FIG. 20, in the camera module 100 shown in FIG. The driver 40 is mounted to the top surface 232 of the molded base 23. In other words, the driver 40 is attached to the outside of the top surface 232 of the molding base 23, and the holder 32 is attached to the inner side of the top surface 232 of the molding base 23. In this way, the height dimension of the camera module 100 can be further reduced.
图22示出了所述摄像模组100的另一个变形实施方式,与附图21示出的所述摄像模组100不同的是,在附图22示出的所述摄像模组100中,所述模塑基座23的所述顶表面232具有一顶表面内侧2321、一顶表面外侧2322以及一基座贴装槽2323,其中所述顶表面外侧2322环绕在所述顶表面内侧2321的四周,并且所述顶表面外侧2322高于所述顶表面内侧2321,以使所述顶表面外侧2322和所述顶表面内侧2321之间具有高度差,从而形成所述基座贴装槽2323,并且所述基座贴装槽2323连通于所述光窗231。在一个示例中,所述模塑基座23的所述顶表面232的所述顶表面内侧2321、所述顶表面外侧2322和所述基座贴装 槽2323藉由同一个模塑工艺形成。在另一个示例中,可以通过模塑工艺首先形成所述模塑基座23的所述顶表面232的所述顶表面外侧2322,然后通过研磨等工艺区域所述模塑基座23的所述顶表面232的内侧部分,以形成所述模塑基座23的所述顶表面232的所述顶表面内侧2321和所述基座贴装槽2323。FIG. 22 shows another modified embodiment of the camera module 100. Unlike the camera module 100 shown in FIG. 21, in the camera module 100 shown in FIG. The top surface 232 of the molded base 23 has a top surface inner side 2321, a top surface outer side 2322, and a pedestal mounting groove 2323, wherein the top surface outer side 2322 surrounds the top surface inner side 2321 The top surface outer side 2322 is higher than the top surface inner side 2321 so as to have a height difference between the top surface outer side 2322 and the top surface inner side 2321, thereby forming the pedestal mounting groove 2323. And the pedestal mounting groove 2323 is in communication with the light window 231. In one example, the top surface inner side 2321, the top surface outer side 2322, and the pedestal mounting groove 2323 of the top surface 232 of the molded base 23 are formed by the same molding process. In another example, the top surface outer side 2322 of the top surface 232 of the molded pedestal 23 may be first formed by a molding process, and then the mold base 23 is described by a process area such as grinding. An inner portion of the top surface 232 to form the top surface inner side 2321 of the top surface 232 of the molded base 23 and the pedestal mounting groove 2323.
所述支座32被贴装于所述模塑基座23的所述顶表面232的所述顶表面内侧2321,以使所述支座32被保持在所述基座贴装槽2323内,通过这样的方式,能够降低所述支座32的所述上表面326和所述模塑基座23的所述顶表面232的所述顶表面外侧2322的高度差,从而有利于进一步降低所述摄像模组的成像品质。The holder 32 is mounted on the top surface 2321 of the top surface 232 of the molding base 23 such that the holder 32 is held in the base mounting groove 2323. In this manner, the height difference between the upper surface 326 of the holder 32 and the top surface 2322 of the top surface 232 of the molding base 23 can be reduced, thereby facilitating further reduction of the The imaging quality of the camera module.
附图23示出了所述摄像模组100的另一个变形实施方式,与附图20示出的所述摄像模组100不同的是,在附图23示出的所述摄像模组100中,所述摄像模组100进一步包括至少一镜筒50,其中所述光学镜头10被组装于所述镜筒50,所述镜筒50被贴装于所述模塑基座23的所述顶表面232,以使所述光学镜头10被保持在所述感光元件22的感光路径,和使所述滤光元件31被保持在所述光学镜头10和所述感光元件22之间。可选地,所述镜筒50也可以一体地形成于所述模塑基座23的所述顶表面232,即,所述镜筒50和所述模塑基座23可以由同一个模塑工艺一体地形成。可选地,所述镜筒50也可以被贴装于所述支座32的所述上表面326,或者所述镜筒50也可以一体地形成于所述支座32。FIG. 23 shows another modified embodiment of the camera module 100, which is different from the camera module 100 shown in FIG. 20 in the camera module 100 shown in FIG. The camera module 100 further includes at least one lens barrel 50, wherein the optical lens 10 is assembled to the lens barrel 50, and the lens barrel 50 is attached to the top of the molding base 23. The surface 232 is such that the optical lens 10 is held in the photosensitive path of the photosensitive member 22, and the filter member 31 is held between the optical lens 10 and the photosensitive member 22. Alternatively, the lens barrel 50 may also be integrally formed on the top surface 232 of the molding base 23, that is, the lens barrel 50 and the molding base 23 may be molded by the same molding. The process is formed integrally. Alternatively, the lens barrel 50 may also be attached to the upper surface 326 of the holder 32, or the lens barrel 50 may be integrally formed on the holder 32.
附图24示出的所述摄像模组100的另一个变形实施方式,在制造所述摄像模组100的过程中,首先将所述感光元件22贴装于所述基板211的所述贴装区域2113,和使所述感光元件22与所述基板211相互导通,然后再进行模塑工艺,以使一体地结合于所述基板211的所述边缘区域2114的所述模塑基座23能够进一步结合于所述感光元件22的所述非感光区域222,从而使所述模塑基座23、所述感光元件22和所述基板211一体地结合。这样,在所述模塑基座23和所述感光元件22之间不需要预留安全位置,以进一步减小所述摄像模组100的长宽尺寸。In another embodiment of the camera module 100 shown in FIG. 24, in the process of manufacturing the camera module 100, the photosensitive element 22 is first mounted on the mounting of the substrate 211. a region 2113, and the photosensitive member 22 and the substrate 211 are electrically connected to each other, and then subjected to a molding process to integrally bond the molded base 23 of the edge region 2114 of the substrate 211. The non-photosensitive region 222 of the photosensitive member 22 can be further coupled, thereby integrally bonding the molded base 23, the photosensitive member 22, and the substrate 211. Thus, there is no need to reserve a safe position between the molded base 23 and the photosensitive element 22 to further reduce the length and width dimensions of the camera module 100.
附图25示出了所述摄像模组100的另一个变形实施方式,所述基板211具有至少一容纳空间2116,其中所述容纳空间2116自所述基板211的所述基板正面2111向所述基板背面2112方向延伸,其中所述感光元件22被保持在所述基板211的所述容纳空间2116内,并且所述感光元件22和所述基板211相互导通,所述模塑基座23一体地结合于所述基板211和所述感光元件22,通过这样的方式,能够进一步降低所述摄像模组100的高度尺寸。值得一提的是,所述容纳空间2116可以是凹槽,也可以是通孔。可以理解的是,通过使所述感光元件22被保持在所述基板211的所述容纳空间2116的方式,能够降低所述感光元件22的上表面和所述基板211的所述基板正面2111的高度差,甚至使所述感光元件22的上表面和所述基板211的所述基板正面2111平齐,或者使所述感光元件22的上表面低于所述基板211的所述基板正面2111。FIG. 25 shows another modified embodiment of the camera module 100. The substrate 211 has at least one receiving space 2116, wherein the receiving space 2116 is from the substrate front surface 2111 of the substrate 211 to the The substrate back surface 2112 extends in a direction in which the photosensitive member 22 is held in the housing space 2116 of the substrate 211, and the photosensitive member 22 and the substrate 211 are electrically connected to each other, and the molding base 23 is integrated. In combination with the substrate 211 and the photosensitive element 22, the height dimension of the camera module 100 can be further reduced. It is worth mentioning that the accommodating space 2116 may be a groove or a through hole. It can be understood that the upper surface of the photosensitive element 22 and the substrate front surface 2111 of the substrate 211 can be reduced by the manner in which the photosensitive element 22 is held in the accommodating space 2116 of the substrate 211. The height difference is even such that the upper surface of the photosensitive member 22 is flush with the substrate front surface 2111 of the substrate 211, or the upper surface of the photosensitive member 22 is lower than the substrate front surface 2111 of the substrate 211.
附图26示出了所述摄像模组100的另一个变形实施方式,所述基板211的 所述容纳空间2116被实施为通孔,即,所述容纳空间2116形成所述基座211的基板通道,所述基板211的所述基板连接件2115被设置于所述基板211的所述基板背面2112,其中所述感光元件22的所述非感光区域222被贴装于所述基板211的所述基板背面2112,并且被设置于所述感光元件22的所述非感光区域222的所述芯片连接件223和被设置于所述基板211的所述基板背面2112的所述基板连接件2115相互导通,其中所述基板211环绕在所述感光元件22的所述感光区域221的四周,以使所述感光元件22的所述感光区域221对应于所述基板211的所述容纳空间2116,其中所述模塑基座23一体地结合于所述基板211和所述感光元件22,通过这样的方式,能够进一步降低所述摄像模组100的高度尺寸。FIG. 26 shows another modified embodiment of the camera module 100. The receiving space 2116 of the substrate 211 is implemented as a through hole, that is, the receiving space 2116 forms a substrate of the base 211. a substrate, the substrate connector 2115 of the substrate 211 is disposed on the substrate back surface 2112 of the substrate 211, wherein the non-photosensitive region 222 of the photosensitive element 22 is mounted on the substrate 211 The substrate back surface 2112, and the chip connector 223 disposed in the non-photosensitive region 222 of the photosensitive member 22 and the substrate connector 2115 disposed on the substrate back surface 2112 of the substrate 211 are mutually Turning on, wherein the substrate 211 surrounds the photosensitive region 221 of the photosensitive element 22 such that the photosensitive region 221 of the photosensitive element 22 corresponds to the receiving space 2116 of the substrate 211, The molding base 23 is integrally coupled to the substrate 211 and the photosensitive element 22, and in this manner, the height dimension of the camera module 100 can be further reduced.
附图27A示出了所述摄像模组100的另一个变形实施方式,所述模塑感光单元20进一步包括至少一背面模塑部26,其中所述背面模塑部26一体地结合于所述基板211的所述基板背面2112,以用于补强所述基板211的强度。优选地,所述背面模塑部26还能够结合于所述感光元件22的芯片背面的至少一部分,这样,所述背面模塑部26能够使所述感光元件22被可靠地贴装于所述基板211的所述基板背面2112,以防止所述感光元件22从所述基板211的所述基板背面2112脱落。优选地,所述背面模塑部26和所述模塑基座23可以由同一个模塑工艺形成。可选地,首先通过模塑工艺形成所述模塑基座23,然后再通过模塑工艺形成所述背面模塑部26也是有可能的。27A shows another modified embodiment of the camera module 100, the molded photosensitive unit 20 further including at least one back molding portion 26, wherein the back molding portion 26 is integrally coupled to the The substrate back surface 2112 of the substrate 211 is used to reinforce the strength of the substrate 211. Preferably, the back molding portion 26 is further engageable with at least a portion of the back surface of the chip of the photosensitive member 22, such that the back molding portion 26 enables the photosensitive member 22 to be reliably attached to the The substrate back surface 2112 of the substrate 211 prevents the photosensitive element 22 from falling off from the substrate back surface 2112 of the substrate 211. Preferably, the back molding portion 26 and the molding base 23 may be formed by the same molding process. Alternatively, it is also possible to first form the molded base 23 by a molding process and then form the back molded portion 26 by a molding process.
附图28A和图28B示出了所述支座32的一个变形实施方式,与附图6A和图6B示出的所述支座32不同的是,在附图28A和图28B示出的所述支座32中,所述支座32具有一组所述通气孔328和一个所述通气槽329,其中每个所述通气孔328相互间隔,并且每个所述通气孔328分别自所述支座32的所述上表面326向所述下表面324方向延伸,其中所述通气槽329形成于所述支座32的所述下表面324,并且自所述支座32的所述内侧面325向所述外侧面327延伸,其中每个所述通气孔328分别连通于所述通气槽329,以使所述通气槽329和每个所述通气孔328形成所述通气通道102。可以理解的是,相对于附图6A和图6B示出的所述支座32来说,在附图28A和图28B示出的所述支座32的这个具体的示例中,所述支座32的每个所述通气孔328的内径尺寸可以更小,这样,能够有效地阻止灰尘等污染物经由每个所述通气孔328自外部环境进入所述密封空间101。并且由于所述通气孔328的数量比较多,因此,在进行烘烤工艺的过程中,内径尺寸更小的所述通气孔328形成的所述通气通道102并不会对所述密封空间101和外部环境的气体交换造成任何的不利影响。在烘烤工艺完成后,可以通过在所述支座32的所述上表面326施涂所述密封介质104的方式,使所述密封介质104自动地填充在每个所述通气孔328内,以在所述密封介质104固化后形成被保持在每个所述通气孔328内的所述密封元件103。例如,在贴装所述驱动器40于所述支座32的所述上表面326时,需要在所述支座32的所述上表面326施胶,此时,被施涂的胶水可以形成所述密封介质104而用于进一步形成封闭每个所述通气孔328的所述密封元件103,通过这样的方式,不需 要专门的工序来封闭所述通气通道102。Figures 28A and 28B show a variant embodiment of the support 32, which differs from the support 32 shown in Figures 6A and 6B in the arrangement shown in Figures 28A and 28B. In the holder 32, the holder 32 has a set of the venting holes 328 and one of the venting grooves 329, wherein each of the venting holes 328 is spaced apart from each other, and each of the venting holes 328 is respectively The upper surface 326 of the abutment 32 extends toward the lower surface 324, wherein the venting groove 329 is formed in the lower surface 324 of the abutment 32 and from the inner side of the abutment 32 325 extends toward the outer side 327, wherein each of the vents 328 communicates with the venting groove 329, respectively, such that the venting groove 329 and each of the venting holes 328 form the venting passage 102. It will be appreciated that with respect to the abutment 32 illustrated in Figures 6A and 6B, in this particular example of the abutment 32 illustrated in Figures 28A and 28B, the abutment The inner diameter of each of the vent holes 328 of 32 may be smaller, and thus, it is possible to effectively prevent contaminants such as dust from entering the sealed space 101 from the external environment via each of the vent holes 328. And because the number of the vent holes 328 is relatively large, the venting passage 102 formed by the vent hole 328 having a smaller inner diameter is not in the sealed space 101 and during the baking process. Gas exchange in the external environment causes any adverse effects. After the baking process is completed, the sealing medium 104 may be automatically filled in each of the vent holes 328 by applying the sealing medium 104 to the upper surface 326 of the holder 32. The sealing member 103 held in each of the vent holes 328 is formed after the sealing medium 104 is cured. For example, when the driver 40 is placed on the upper surface 326 of the holder 32, the upper surface 326 of the holder 32 needs to be sized, and at this time, the applied glue can be formed. The sealing medium 104 is used to further form the sealing member 103 that encloses each of the venting holes 328. In this manner, no special process is required to close the venting passage 102.
在附图29A和图29B示出的所述支座32的另一个变形实施方式中,所述支座32具有一个所述通气孔328和多个所述通气槽329,其中所述通气孔328自所述支座32的所述上表面326向所述下表面324方向延伸,每个所述通气槽329分别形成于所述支座32的所述下表面324,并且自所述支座32的所述内侧面325向所述外侧面327延伸,其中所述通气孔328和每个所述通气槽329相互连通以形成所述通气通道102。这样,在通过所述贴装介质1002贴装所述支座32于所述模塑基座23时,即便是所述贴装介质1002封闭了其中一个所述通气槽329,另外的所述通气槽329也能够被保持畅通,从而使所述通气通道102始终保持在畅通状态,以提高所述摄像模组100的产品良率。In another modified embodiment of the holder 32 shown in FIGS. 29A and 29B, the holder 32 has one of the venting holes 328 and a plurality of the venting grooves 329, wherein the venting holes 328 The upper surface 326 of the holder 32 extends toward the lower surface 324, and each of the venting grooves 329 is formed in the lower surface 324 of the holder 32, respectively, and from the holder 32. The inner side 325 extends toward the outer side 327, wherein the vent 328 and each of the venting grooves 329 communicate with each other to form the venting passage 102. Thus, when the holder 32 is attached to the molding base 23 by the mounting medium 1002, even if the mounting medium 1002 closes one of the ventilation grooves 329, the ventilation is further performed. The slot 329 can also be kept open, so that the venting passage 102 is always kept in a clear state to improve the product yield of the camera module 100.
值得一提的是,尽管在附图29B示出的所述支座32的具体示例中,以所述通气槽329的形状为“V”字形为示例,但是其并不会对本发明的所述摄像模组100的内容和范围产生限制,在其他可能的示例中,所述通气槽329可以具有任何的形状,只要其能够连通所述通气孔328,并且使所述通气槽329和所述通气孔328形成所述通气通道102即可。It is worth mentioning that, although in the specific example of the holder 32 shown in FIG. 29B, the shape of the venting groove 329 is "V" shaped as an example, it is not described in the present invention. The content and range of the camera module 100 impose limitations. In other possible examples, the venting groove 329 may have any shape as long as it can communicate with the vent 328 and allow the venting groove 329 and the pass The vent 328 may form the venting passage 102.
附图30至图34C示出了所述摄像模组100的另一个变形实施方式,与上述实施例不同的是,在附图30至图34C示出的所述摄像模组100的这个具体的示例中,所述通气通道102形成于所述支座32和所述模塑基座23之间。FIG. 30 to FIG. 34C illustrate another modified embodiment of the camera module 100, which is different from the above embodiment in the specific embodiment of the camera module 100 shown in FIGS. 30 to 34C. In the example, the venting passage 102 is formed between the holder 32 and the molded base 23.
具体地说,参考附图34A至图34C所示,所述支座32具有至少一通气槽329,其中所述通气槽329形成于所述支座32的所述下表面324,并且所述通气槽329自所述支座32的所述内侧面325延伸至所述外侧面327,其中在通过所述贴装介质1002形成的所述贴装层1001而将所述支座32的所述下表面324和所述模塑基座23的所述顶表面232贴装在一起之后,所述支座32的所述通气槽329在所述支座32的所述下表面324和所述模塑基座23的所述顶表面232之间形成所述通气通道102,并且所述通气通道102用于连通所述密封空间101和所述感光装置1000的外部。Specifically, referring to FIGS. 34A to 34C, the holder 32 has at least one venting groove 329, wherein the venting groove 329 is formed on the lower surface 324 of the holder 32, and the venting A slot 329 extends from the inner side 325 of the holder 32 to the outer side 327, wherein the lower portion of the holder 32 is disposed in the mounting layer 1001 formed by the mounting medium 1002 After the surface 324 and the top surface 232 of the molded base 23 are attached together, the venting groove 329 of the holder 32 is on the lower surface 324 of the holder 32 and the molding The venting passage 102 is formed between the top surfaces 232 of the susceptor 23, and the venting passage 102 is for communicating the sealed space 101 and the outside of the photosensitive device 1000.
优选地,所述支座32的所述通气槽329弯曲地延伸,例如所述通气槽329的形状可以呈“S”字形或者“V”字形,从而在将所述支座32贴装于所述模塑基座23之后,在所述通气槽329对应的位置形成的位于所述支座32的所述下表面324和所述模塑基座23的所述顶表面232之间的所述通气通道102弯曲地延伸,这样,能够防止灰尘等污染物经由所述通气通道102自所述感光装置1000的外部进入所述密封空间101。Preferably, the venting groove 329 of the support 32 is curvedly extended. For example, the shape of the venting groove 329 may be in an "S" shape or a "V" shape, so that the pedestal 32 is mounted on the pedestal 32. After the molding of the susceptor 23, the said lower surface 324 of the holder 32 and the top surface 232 of the molding base 23 formed at a position corresponding to the venting groove 329 The vent passage 102 is curvedly extended, so that contaminants such as dust can be prevented from entering the sealed space 101 from the outside of the photosensitive device 1000 via the vent passage 102.
进一步地,所述支座32具有至少一第一凹槽3210和至少一第二凹槽3220,其中所述第一凹槽3210自所述支座32的所述外侧面327向所述支座32的所述内侧面325方向延伸,所述第二凹槽3220自所述支座32的所述内侧面325向所述支座32的所述外侧面327方向延伸,并且所述第一凹槽3210和所述第二凹槽3220相互连通,以形成所述通气槽329,进而在后续形成所述通气通道102。Further, the support 32 has at least one first groove 3210 and at least one second groove 3220, wherein the first groove 3210 extends from the outer side 327 of the support 32 to the support The inner side surface 325 of the 32 extends in a direction from the inner side surface 325 of the holder 32 toward the outer side surface 327 of the holder 32, and the first recess The groove 3210 and the second groove 3220 communicate with each other to form the venting groove 329, thereby forming the venting passage 102 subsequently.
优选地,所述第一凹槽3210的延伸方向和所述第二凹槽3220的延伸方向不 一致,从而在所述第一凹槽3210和所述第二凹槽3220形成的所述通气槽329形成所述通气通道102之后,所述通气通道102弯曲地延伸。可选地,所述第一凹槽3210和所述第二凹槽3220中的至少一个凹槽弯曲地延伸,从而在所述第一凹槽3210和所述第二凹槽3220形成的所述通气槽329形成所述通气通道102之后,所述通气通道102弯曲地延伸。另外,所述第一凹槽3210和所述第二凹槽3220可以具有不同的深度,例如所述第一凹槽3210的深度尺寸大于所述第二凹槽3220的深度尺寸,通过这样的方式,在贴装所述支座32于所述模塑基座23的所述顶表面232时,所述贴装介质1002能够溢入所述第一凹槽3210,并防止所述贴装介质1002填满所述第一凹槽3210,从而保证所述通气通道102的畅通。进一步地,所述第一凹槽3210可以形成于所述支座32的所述画胶区域3242,所述第二凹槽3220可以形成于所述支座32的所述非画胶区域3241。Preferably, the extending direction of the first groove 3210 and the extending direction of the second groove 3220 are inconsistent, so that the ventilation groove 329 formed in the first groove 3210 and the second groove 3220 After the venting passage 102 is formed, the venting passage 102 extends in a curved manner. Optionally, at least one of the first groove 3210 and the second groove 3220 extends in a curved manner so that the first groove 3210 and the second groove 3220 are formed. After the venting groove 329 forms the venting passage 102, the venting passage 102 extends in a curved manner. In addition, the first groove 3210 and the second groove 3220 may have different depths, for example, the depth dimension of the first groove 3210 is larger than the depth dimension of the second groove 3220, in such a manner. When the holder 32 is placed on the top surface 232 of the molding base 23, the mounting medium 1002 can overflow into the first groove 3210 and prevent the mounting medium 1002. The first groove 3210 is filled to ensure the smoothness of the ventilation passage 102. Further, the first groove 3210 may be formed in the glue area 3242 of the holder 32, and the second groove 3220 may be formed in the non-paint area 3241 of the holder 32.
附图35示出了所述摄像模组100的所述支座32的另一个变形实施方式,于附图34A至图34C示出的所述支座32不同的是,在附图35示出的所述支座32的这个具体的示例中,两个所述第二凹槽3220能够连通同一个所述第一凹槽3210,例如在所述第一凹槽3210和每个所述第二凹槽3220形成的所述通气槽329形成所述通气通道102之后,所述通气通道102可以呈“Y”形。也就是说,多个所述第二凹槽3220可以连通同一个所述第一凹槽3210。可选地,多个所述第一凹槽3210也可以连通同一个所述第二凹槽3220。FIG. 35 shows another modified embodiment of the holder 32 of the camera module 100. The holder 32 shown in FIGS. 34A to 34C is different from that shown in FIG. In this particular example of the holder 32, two of the second grooves 3220 can communicate with the same one of the first grooves 3210, such as at the first groove 3210 and each of the second After the venting groove 329 formed by the recess 3220 forms the venting passage 102, the venting passage 102 may have a "Y" shape. That is, a plurality of the second grooves 3220 may communicate with the same one of the first grooves 3210. Optionally, a plurality of the first grooves 3210 may also communicate with the same one of the second grooves 3220.
附图36示出了所述模塑电路板组件2000的一个变形实施方式,所述通气槽329也可以形成于所述模塑基座23的所述顶表面232,例如,在进行模塑工艺时,所述通气槽329与所述模塑基座23同步地形成,或者在所述模塑基座23形成之后,再通过去除所述模塑基座23的所述顶表面232的一部分的方式形成所述通气槽329,其中所述通气槽329自所述模塑基座23的所述基座内表面234延伸至所述基座外表面235,以使所述通气槽329连通所述光窗231和所述模塑基座23的外部,这样,在将所述支座32贴装于所述模塑基座23的所述顶表面232之后,在所述通气槽329对应的位置形成所述通气通道102,以用于连通所述密封空间101和所述感光装置1000的外部。可以理解的是,形成于所述模塑基座23的所述顶表面232的所述通气槽329也可以由至少一个所述第一凹槽3210和至少一个所述第二凹槽3220相互连通后形成。36 shows a modified embodiment of the molded circuit board assembly 2000, which may also be formed on the top surface 232 of the molded base 23, for example, in a molding process. The venting groove 329 is formed in synchronization with the molding base 23, or after the molding base 23 is formed, by removing a portion of the top surface 232 of the molding base 23. Forming the venting groove 329, wherein the venting groove 329 extends from the pedestal inner surface 234 of the molded base 23 to the pedestal outer surface 235 such that the venting groove 329 communicates with the The light window 231 and the outside of the molding base 23, such that after the holder 32 is attached to the top surface 232 of the molding base 23, at a position corresponding to the ventilation groove 329 The vent passage 102 is formed for communicating the sealed space 101 and the outside of the photosensitive device 1000. It can be understood that the venting groove 329 formed on the top surface 232 of the molding base 23 can also be interconnected by at least one of the first groove 3210 and at least one of the second groove 3220. After formation.
附图37示出了所述摄像模组100的另一个变形实施方式,所述支座32具有至少一个所述通气孔328,其中所述通气孔328自所述支座32的所述上表面326延伸至所述下表面324,并且所述通气孔328连通所述支座32的所述上表面326和所述下表面324。所述模塑基座23的所述顶表面232具有至少一个所述通气槽329,其中所述通气槽329自所述模塑基座23的所述基座内表面234向所述基座外表面235方向延伸,其中在将所述支座32的所述下表面324通过所述贴装层1001贴装于所述模塑基座23的所述顶表面232时,所述支座32的所述通气孔328连通于所述模塑基座23的所述通气槽329,以使所述支座32的所述通气孔328和所述模塑基座23的所述通气槽329形成所述通气通道102,从而所 述通气通道102用于连通所述密封空间101和所述感光装置1000的外部。37 shows another modified embodiment of the camera module 100. The holder 32 has at least one of the vent holes 328, wherein the vent hole 328 is from the upper surface of the holder 32. 326 extends to the lower surface 324 and the vent 328 communicates with the upper surface 326 and the lower surface 324 of the mount 32. The top surface 232 of the molded base 23 has at least one of the venting grooves 329, wherein the venting grooves 329 are from the pedestal inner surface 234 of the molded base 23 to the outside of the pedestal The surface 235 extends in a direction in which the lower surface 324 of the holder 32 is attached to the top surface 232 of the molding base 23 through the mounting layer 1001. The vent 328 communicates with the venting groove 329 of the molding base 23 such that the vent hole 328 of the holder 32 and the venting groove 329 of the molding base 23 are formed The venting passage 102 is described such that the venting passage 102 is for communicating the sealed space 101 and the outside of the photosensitive device 1000.
进一步地,所述模塑基座23的所述顶表面232进一步具有一通气凹槽3240和一溢胶凹槽3250,其中所述通气凹槽3240和所述溢胶凹槽3250相互连通以形成所述通气槽329。所述溢胶凹槽3250连通所述通气凹槽3240和所述支座32的所述通气孔328,其中所述溢胶凹槽3250的深度尺寸大于所述通气凹槽3240的深度尺寸,这样,溢入到所述通气槽329的所述贴装介质1002能够被保持在所述溢胶凹槽3250内,并防止溢入到所述溢胶凹槽3250的所述贴装介质1002填满所述溢胶凹槽3250,以保持所述通气通道102的畅通。Further, the top surface 232 of the molding base 23 further has a ventilation groove 3240 and an overflow groove 3250, wherein the ventilation groove 3240 and the overflow groove 3250 communicate with each other to form The venting groove 329. The overflow groove 3250 communicates with the ventilation groove 3240 and the vent hole 328 of the support 32, wherein the overflow groove 3250 has a depth dimension larger than a depth dimension of the ventilation groove 3240, such that The mounting medium 1002 overflowing into the venting groove 329 can be retained in the overflow groove 3250 and prevent the mounting medium 1002 overflowing into the overflow groove 3250 from filling up. The glue groove 3250 is configured to keep the ventilation passage 102 clear.
附图38A示出了所述支座32的一个变形实施方式的剖视示意图,附图38B示出了所述感光装置1000的一个变形实施方式的剖视示意图,附图38C和图38D分别示出了所述摄像模组100的一个变形实施方式的剖视示意图和局部放大示意图,所述支座32的所述通气孔328自所述支座32的所述上表面326延伸至所述下表面324的所述非画胶区域3241,并且在所述支座32的所述下表面324的所述画胶区域3242被贴装于所述模塑基座23的所述顶表面232之后,所述支座32的所述通气孔328对应于所述模塑基座23的所述光窗231,通过这样的方式,所述支座32的所述通气孔328能够形成用于连通所述密封空间101和所述感光装置1000的外部的所述通气通道102。38A is a cross-sectional view showing a modified embodiment of the holder 32, and FIG. 38B is a cross-sectional view showing a modified embodiment of the photosensitive device 1000, and FIG. 38C and FIG. 38D are respectively shown. A cross-sectional schematic view and a partially enlarged schematic view of a modified embodiment of the camera module 100, the vent 328 of the holder 32 extending from the upper surface 326 of the holder 32 to the lower portion The non-painting area 3241 of the surface 324, and after the glue area 3242 of the lower surface 324 of the holder 32 is attached to the top surface 232 of the molding base 23, The vent 328 of the holder 32 corresponds to the light window 231 of the molding base 23, in such a manner that the vent 328 of the holder 32 can be formed to communicate with the vent The ventilation space 101 and the ventilation passage 102 outside the photosensitive device 1000 are sealed.
值得一提的是,所述通气孔328的位置在本发明的所述摄像模组100中不受限制,例如所述通气孔328可以形成于所述支座32的中部,也可以形成于所述支座32的转角处,或者其他任何可能的位置。It is to be noted that the position of the vent 328 is not limited in the camera module 100 of the present invention. For example, the vent 328 may be formed in the middle of the support 32 or may be formed in the The corner of the support 32, or any other possible location.
参考附图38B至图38D,所述感光装置1000进一步包括所述密封元件103,在对所述感光装置半成品1100进行烘烤工艺而得到所述感光装置1000之后,将所述密封介质104填充在所述支座32的所述通气孔328内,并且在所述密封介质104在所述通气孔328固化后形成被保持在所述通气孔328内的所述密封元件103,其中所述密封元件103用于堵塞所述通气孔328,以阻止所述密封空间101和所述感光装置1000的外部连通,这样,能够阻止所述感光装置1000的外部的灰尘等污染物进入所述密封空间101,以保证所述摄像模组100的良率。Referring to FIGS. 38B to 38D, the photosensitive device 1000 further includes the sealing member 103, and after the baking process of the photosensitive device semi-finished product 1100 is performed to obtain the photosensitive device 1000, the sealing medium 104 is filled in The venting opening 328 of the abutment 32 and the sealing element 103 retained within the venting opening 328 after the sealing medium 104 has solidified in the venting opening 328, wherein the sealing element 103 is used to block the vent hole 328 to prevent the sealed space 101 from communicating with the outside of the photosensitive device 1000, so that dust such as dust on the outside of the photosensitive device 1000 can be prevented from entering the sealed space 101, In order to ensure the yield of the camera module 100.
附图39A示出了所述支座32的一个变形实施方式的立体示意图,附图39B示出了所述滤光单元30的一个变形实施方式的剖视示意图,附图39C示出了所述感光装置1000的一个变形实施方式的剖视示意图,附图39D和图39E分别是所述摄像模组100的一个变形实施方式的剖视示意图和局部放大示意图,所述支座32的所述通气槽329形成于所述支座32的所述上表面326,和所述通气槽329自所述支座32的所述内侧面325向外侧面327方向延伸,并且在所述滤光元件31被贴装于所述支座32的所述上表面326之后,所述通气槽329在所述支座32和所述滤光元件31之间形成所述通气通道102。可以理解的是,所述通气通道102连通所述支座32的所述通光通道321。参考附图39C至图39E所示,形成在所述支座32和所述滤光元件31之间的所述通气通道102用于连通所述密封空间101和所述感光装置1000的外部。Figure 39A shows a perspective schematic view of a variant embodiment of the support 32, Figure 39B shows a schematic cross-sectional view of a variant embodiment of the filter unit 30, Figure 39C shows the A schematic cross-sectional view of a modified embodiment of the photosensitive device 1000, and FIGS. 39D and 39E are respectively a cross-sectional schematic view and a partially enlarged schematic view of a modified embodiment of the camera module 100, the ventilation of the holder 32. A groove 329 is formed in the upper surface 326 of the holder 32, and the vent groove 329 extends from the inner side surface 325 of the holder 32 toward the outer side 327, and is disposed at the filter element 31. After being attached to the upper surface 326 of the holder 32, the venting groove 329 forms the venting passage 102 between the holder 32 and the filter element 31. It can be understood that the ventilation passage 102 communicates with the light passage 321 of the support 32. Referring to FIGS. 39C to 39E, the venting passage 102 formed between the holder 32 and the filter member 31 is for communicating the sealed space 101 and the outside of the photosensitive device 1000.
进一步地,所述支座32的所述通气槽329形成于所述支座32的所述上表面326的所述上表面内侧3261,并位于所述支座32的所述贴装槽3201内,并且所述通气槽329自所述支座32的所述内侧面325的所述内表面下侧3252向所述外侧面327方向延伸,例如所述通气槽329可以自所述内侧面325的所述内表面下侧3252延伸至所述内表面上侧3251。在所述滤光元件31被贴装于所述支座32的所述上表面326的所述上表面内侧3261,且所述滤光元件31被保持在所述支座32的所述贴装槽3201后,在所述滤光元件31的外壁和所述支座32的所述内表面上侧3251之间形成一缝隙33,其中所述通气槽329连通所述支座32的所述通光通道321和所述缝隙33,以使所述通气槽329和所述缝隙33形成所述通气通道102。Further, the ventilation groove 329 of the support 32 is formed on the upper surface inner side 3261 of the upper surface 326 of the support 32, and is located in the mounting groove 3201 of the support 32. And the venting groove 329 extends from the inner surface lower side 3252 of the inner side surface 325 of the support 32 toward the outer side surface 327, for example, the venting groove 329 may be from the inner side surface 325 The inner surface lower side 3252 extends to the inner surface upper side 3251. The filter element 31 is attached to the upper surface inner side 3261 of the upper surface 326 of the holder 32, and the filter element 31 is held at the mounting of the holder 32. After the slot 3201, a gap 33 is formed between the outer wall of the filter element 31 and the inner surface upper surface 3251 of the holder 32, wherein the venting groove 329 communicates with the through hole of the holder 32. The light passage 321 and the slit 33 are such that the vent groove 329 and the slit 33 form the vent passage 102.
参考附图39B至图39E,所述感光装置1000进一步包括所述密封元件103,在对所述感光装置半成品1100进行烘烤工艺而得到所述感光装置1000之后,将所述密封介质104填充在形成于所述支座32和所述滤光元件31之间的所述缝隙33内,并且所述密封介质104在所述缝隙33内固化后形成被保持在所述缝隙33内的所述密封元件103,以阻止所述密封空间101和所述感光装置1000的外部连通,这样,能够阻止所述感光装置1000的外部的灰尘等污染物进入所述密封空间101,以保证所述摄像模组100的良率。Referring to FIGS. 39B to 39E, the photosensitive device 1000 further includes the sealing member 103, and after the baking process of the photosensitive device semi-finished product 1100 is performed to obtain the photosensitive device 1000, the sealing medium 104 is filled in Formed in the slit 33 between the holder 32 and the filter element 31, and the sealing medium 104 is solidified in the slit 33 to form the seal held in the slit 33 The element 103 is configured to prevent the sealed space 101 from communicating with the outside of the photosensitive device 1000, so that dust such as dust on the outside of the photosensitive device 1000 can be prevented from entering the sealed space 101 to ensure the camera module. 100 yield.
附图40A示出了所述支座32的一个变形实施方式的立体示意图,附图40B示出了所述感光装置1000的一个变形实施方式的剖视示意图,附图40C和图40D分别示出了所述摄像模组100的一个变形实施方式的剖视示意图和局部放大示意图。所述支座32的所述外侧面327倾斜地延伸,并且所述支座32的所述外侧面327的倾斜角度和所述模塑基座23的所述基座内表面234的倾斜角度一致,其中所述支座32的所述外侧面327被贴装于所述模塑基座23的所述基座内表面234,以使被贴装于所述支座32的所述滤光元件31被保持在所述感光元件22的感光路径上。也就是说,在本发明的所述摄像模组100的这个具体的示例中,所述支座32的所述下表面324可以没有被贴装于所述模塑基座23的所述顶表面232,而是将所述支座32的所述外侧面327贴装于所述模塑基座23的所述基座内表面234,通过这样的方式,在所述模塑基座23的所述顶表面232可以不需要预留用于贴装所述支座32的空间,从而有利于减小所述摄像模组100的长宽尺寸。并且,由于所述支座32的所述外侧面327的倾斜角度和所述模塑基座23的所述基座内表面234的倾斜角度一致,从而所述支座32的所述外侧面327和所述模塑基座23的所述基座内表面234被贴合在一起后,能够保证所述滤光元件31的平整度,以保证所述摄像模组100的光学性能。40A is a perspective view showing a modified embodiment of the holder 32, and FIG. 40B is a schematic cross-sectional view showing a modified embodiment of the photosensitive device 1000, and FIGS. 40C and 40D respectively show A schematic cross-sectional view and a partially enlarged schematic view of a modified embodiment of the camera module 100. The outer side surface 327 of the holder 32 extends obliquely, and the angle of inclination of the outer side surface 327 of the holder 32 coincides with the inclination angle of the base inner surface 234 of the molded base 23. The outer side surface 327 of the holder 32 is attached to the base inner surface 234 of the molding base 23 such that the filter element is attached to the holder 32 31 is held on the photosensitive path of the photosensitive member 22. That is, in this specific example of the camera module 100 of the present invention, the lower surface 324 of the holder 32 may not be attached to the top surface of the molding base 23. 232, but the outer side 327 of the holder 32 is attached to the base inner surface 234 of the molding base 23, in such a manner, at the molding base 23 The top surface 232 may not need to reserve a space for mounting the support 32, thereby facilitating the reduction of the length and width dimensions of the camera module 100. And, since the inclination angle of the outer side surface 327 of the holder 32 coincides with the inclination angle of the base inner surface 234 of the molded base 23, the outer side surface 327 of the holder 32 After the pedestal inner surface 234 of the molded base 23 is bonded together, the flatness of the filter element 31 can be ensured to ensure the optical performance of the camera module 100.
所述支座32的所述通气槽329设于所述支座32的所述外侧面327,并且所述通气槽329自所述支座32的所述上表面326延伸至所述下表面324,以使所述通气槽329连通所述支座32的所述上表面326和所述下表面324,从而在所述支座32的所述外侧面327和所述模塑基座23的所述基座内表面234相互贴合在一起后,所述通气槽329在所述支座32的所述外侧面327和所述模塑基座23 的所述基座内表面234之间形成所述通气通道102,其中所述通气通道102用于连通所述密封空间101和所述感光装置1000的外部。优选地,所述支座32的所述通气槽329弯曲地延伸,例如所述支座32的所述通气槽329可以呈但不限于“S”字形、“Y”字形、“V”字形等等,从而在所述支座32的所述外侧面327和所述模塑基座23的所述基座内表面234相互贴合在一起后,形成在所述支座32的所述外侧面327和所述模塑基座23的所述基座内表面234之间的所述通气通道102弯曲地延伸,通过这样的方式,一方面有利于阻止所述感光装置1000的外部的灰尘等污染物经由所述通气通道102进入所述密封空间101,另一方面在将所述密封介质104填充在所述通气通道102时,所述通气通道102不会流动到所述密封空间101内,从而使所述密封介质104被保持在所述通气通道102内且在固化后形成所述密封元件103,这样,能够避免所述密封介质104因进入所述密封空间101而出现污染所述摄像模组100的不良现象。The venting groove 329 of the support 32 is disposed on the outer side 327 of the support 32, and the venting groove 329 extends from the upper surface 326 of the support 32 to the lower surface 324 So that the venting groove 329 communicates with the upper surface 326 and the lower surface 324 of the holder 32 so as to be on the outer side 327 of the holder 32 and the molded base 23 After the base inner surfaces 234 are attached to each other, the venting groove 329 is formed between the outer side surface 327 of the holder 32 and the base inner surface 234 of the molded base 23. The venting passage 102 is configured to communicate the sealed space 101 and the outside of the photosensitive device 1000. Preferably, the venting groove 329 of the support 32 is curvedly extended. For example, the venting groove 329 of the support 32 may be, but not limited to, an "S" shape, a "Y" shape, a "V" shape, or the like. And so that after the outer side surface 327 of the holder 32 and the base inner surface 234 of the molded base 23 are attached to each other, the outer side surface of the holder 32 is formed. The venting passage 102 between the 327 and the base inner surface 234 of the molded base 23 is curvedly extended. In this manner, on the one hand, it is advantageous to prevent dust and the like on the outside of the photosensitive device 1000 from being contaminated. The venting passage 102 does not flow into the sealed space 101 when the sealing medium 104 is filled in the venting passage 102, and thus the venting passage 102 does not flow into the sealed space 101, thereby The sealing medium 104 is held in the ventilation passage 102 and forms the sealing member 103 after curing, so that the sealing medium 104 can be prevented from contaminating the camera module due to entering the sealed space 101. 100 bad phenomenon.
值得一提的是,所述通气通道102的下部开口被隐藏在所述支座32的所述下表面324的外侧,这样,不会对自所述滤光元件31进入所述密封空间101的光线造成任何影响。It is worth mentioning that the lower opening of the venting passage 102 is hidden outside the lower surface 324 of the pedestal 32 such that it does not enter the sealed space 101 from the filter element 31. Light has any effect.
可选地,所述通气槽329也可以形成在所述模塑基座23的所述基座内表面234,并自所述模塑基座23的所述顶表面232向所述基板211的方向延伸至适当位置,从而在所述支座32的所述外侧面327和所述模塑基座23的所述基座内表面234相互贴合在一起之后,所述通气槽329在所述支座32的所述外侧面327和所述模塑基座23的所述基座内表面234之间形成用于连通所述密封空间101和所述感光装置1000的外部的所述通气通道102。Alternatively, the venting groove 329 may also be formed on the pedestal inner surface 234 of the molding base 23 and from the top surface 232 of the molding pedestal 23 toward the substrate 211. The direction extends to a position such that after the outer side 327 of the holder 32 and the base inner surface 234 of the molded base 23 are bonded to each other, the venting groove 329 is The ventilation passage 102 for communicating the sealed space 101 and the outside of the photosensitive device 1000 is formed between the outer side surface 327 of the holder 32 and the base inner surface 234 of the molded base 23. .
附图41示出了所述感光装置1000的另一个变形实施方式的剖视示意图,与附图40B示出的所述感光装置1000不同的是,在附图41示出的所述感光装置1000的这个具体的示例中,所述感光装置1000的所述支座32具有所述通气孔328,其中所述通气孔328自所述支座32的所述上表面326延伸至所述下表面324,以在所述滤光单元30被贴装于所述模塑感光单元20之后,所述通气孔328形成用于连通所述密封空间101和所述感光装置1000的外部的所述通气通道102。41 is a cross-sectional view showing another modified embodiment of the photosensitive device 1000, which is different from the photosensitive device 1000 illustrated in FIG. 40B, and the photosensitive device 1000 illustrated in FIG. In this particular example, the holder 32 of the photosensitive device 1000 has the vent 328, wherein the vent 328 extends from the upper surface 326 of the holder 32 to the lower surface 324 After the filter unit 30 is attached to the molded photosensitive unit 20, the vent hole 328 forms the vent passage 102 for communicating the sealed space 101 and the outside of the photosensitive device 1000. .
附图42A、图42B和图42C分别示出了所述支座32的另一个变形实施方式的不同视角的立体示意图和剖视示意图,附图42D示出了所述滤光单元30的剖视示意图,附图42E示出了所述感光装置1000的剖视示意图,附图42F和图42G分别示出了所述摄像模组100的剖视示意图和局部放大示意图。42A, 42B, and 42C are respectively a perspective view and a cross-sectional view showing different perspectives of another modified embodiment of the holder 32, and Fig. 42D shows a cross-sectional view of the filter unit 30. FIG. 42E is a cross-sectional view showing the photosensitive device 1000, and FIGS. 42F and 42G are respectively a cross-sectional view and a partially enlarged schematic view of the camera module 100.
参考附图42A至图42D,所述支座32包括一基座贴装部34、一连接部35以及一滤光片贴装部36,其中所述连接部35分别向上和向下地延伸以被连接于所述基座贴装部34和所述滤光片贴装部36,例如,所述支座32的所述基座贴装部34、所述连接部35和所述滤光片贴装部36可以通过注塑等工艺一体地形成,从而使所述连接部35分别向上和向下地延伸以被连接于所述基座贴装部34和所述滤光片贴装部36,并且通过这样的方式,所述支座32的所述滤光片贴装 部36能够形成下沉式滤光片贴装部,所述支座32能够形成下沉式支座。Referring to Figures 42A to 42D, the holder 32 includes a base mounting portion 34, a connecting portion 35, and a filter mounting portion 36, wherein the connecting portions 35 extend upward and downward, respectively, to be Connected to the susceptor mounting portion 34 and the filter mounting portion 36, for example, the pedestal mounting portion 34 of the holder 32, the connecting portion 35, and the filter sticker The mounting portion 36 may be integrally formed by a process such as injection molding, so that the connecting portions 35 extend upward and downward, respectively, to be coupled to the pedestal mounting portion 34 and the filter mounting portion 36, and pass through In this manner, the filter mounting portion 36 of the holder 32 can form a sunken filter mounting portion, and the holder 32 can form a sunken holder.
具体地说,在所述支座32的所述基座贴装部34被贴装于所述模塑基座23的所述顶表面232后,例如在所述支座32的所述基座贴装部34被贴装于所述模塑基座23的所述顶表面内侧2321,以使所述支座32被保持在所述模塑基座23的所述基座贴装槽2323之后,所述连接部35使所述滤光片贴装部36被保持在所述模塑基座23的所述光窗231内,从而进一步使被贴装于所述滤光片贴装部36的所述滤光元件31被保持在所述模塑基座23的所述光窗231内,和使所述滤光元件31被保持在所述感光元件22的感光路径上。所述滤光片贴装部36具有所述通光通道321,其中所述连接部35环绕在所述滤光片贴装部36的四周,并且所述连接部35的低端被连接于所述滤光片贴装部36的外侧,或者所述连接部35的低端与所述滤光片贴装部36的外侧一体地成型,其中所述基座贴装部34环绕在所述连接部35的四周,并且所述连接部35的高端被连接于所述基座贴装部34的内侧,或者所述连接部35的高端与所述基座贴装部34的内侧一体地成型。Specifically, after the pedestal mounting portion 34 of the holder 32 is attached to the top surface 232 of the molding base 23, for example, the pedestal of the holder 32 The mounting portion 34 is attached to the top surface 2321 of the molding base 23 such that the holder 32 is held behind the susceptor mounting groove 2323 of the molding base 23. The connecting portion 35 causes the filter mounting portion 36 to be held in the optical window 231 of the molding base 23 to further be attached to the filter mounting portion 36. The filter element 31 is held in the light window 231 of the molding base 23, and the filter element 31 is held on the photosensitive path of the photosensitive element 22. The filter mounting portion 36 has the light passing passage 321 , wherein the connecting portion 35 surrounds the periphery of the filter mounting portion 36 , and the lower end of the connecting portion 35 is connected to the The outer side of the filter mounting portion 36 or the lower end of the connecting portion 35 is integrally formed with the outer side of the filter mounting portion 36, wherein the pedestal mounting portion 34 surrounds the connection The periphery of the portion 35 and the high end of the connecting portion 35 are connected to the inner side of the susceptor mounting portion 34, or the high end of the connecting portion 35 is integrally molded with the inner side of the susceptor mounting portion 34.
值得一提的是,所述通光通道321可以在所述支座32的所述基座贴装部34、所述连接部35和所述滤光片贴装部36一体成型时同步地成型,或者在所述支座32的所述基座贴装部34、所述连接部35和所述滤光片贴装部36成型后通过去除所述滤光片贴装部36的中部的方式形成所述通光通道321。It is to be noted that the light passage 321 can be synchronously formed when the base mounting portion 34, the connecting portion 35 and the filter mounting portion 36 of the holder 32 are integrally formed. Or the manner in which the central portion of the filter mounting portion 36 is removed after the susceptor mounting portion 34 of the holder 32, the connecting portion 35, and the filter mounting portion 36 are molded. The light passage 321 is formed.
参考附图42A至图42G,在所述支座32的所述基座贴装部34被贴装于所述模塑基座23的所述顶表面232后,所述支座32的所述连接部35自所述模塑基座23的所述顶表面232向所述基板211方向延伸,以使所述滤光片贴装部36下沉到所述模塑基座23的所述光窗231内,从而使所述模塑基座23环绕在所述支座32的所述滤光片贴装部36的四周。Referring to FIGS. 42A to 42G, after the pedestal mounting portion 34 of the holder 32 is attached to the top surface 232 of the molding base 23, the holder 32 is A connecting portion 35 extends from the top surface 232 of the molding base 23 toward the substrate 211 to cause the filter mounting portion 36 to sink to the light of the molding base 23 The window 231 is so as to surround the molded base 23 around the filter mounting portion 36 of the holder 32.
值得一提的是,所述支座32的所述连接部35的长度决定了所述滤光片贴装部36下沉的具体位置,换言之,所述支座32的所述连接部35的长度决定了所述滤光元件31和所述感光元件22的相对位置,而所述滤光元件31和所述感光元件22的相对位置又决定了所述滤光元件31的尺寸。换言之,所述支座32的所述连接部35的长度决定了所述滤光元件31的尺寸,因此,在本发明的所述摄像模组100中,可以通过调整所述支座32的所述连接部35的长度的方式改变所述摄像模组100对所述滤光元件31的尺寸需求。It is worth mentioning that the length of the connecting portion 35 of the support 32 determines the specific position of the filter mounting portion 36 to sink, in other words, the connecting portion 35 of the holder 32. The length determines the relative position of the filter element 31 and the photosensitive element 22, and the relative positions of the filter element 31 and the photosensitive element 22 determine the size of the filter element 31. In other words, the length of the connecting portion 35 of the holder 32 determines the size of the filter element 31. Therefore, in the camera module 100 of the present invention, the position of the holder 32 can be adjusted. The manner in which the length of the connecting portion 35 is described changes the size requirement of the camera module 100 for the filter element 31.
还值得一提的是,所述支座32的所述连接部35的延伸距离影响所述滤光元件31在所述模塑基座23的所述光窗231内的下沉深度,而所述滤光片贴装部36的延伸距离影响所述滤光元件31的尺寸大小。例如,当所述支座32的所述连接部35的延伸距离越大时,所述滤光元件31在所述模塑基座23的所述光窗231内的位置越靠近所述感光元件22,对应的所述摄像模组100的后焦距离越小,当所述滤光片贴装部36的延伸距离越大时,所述支座32的所述通光通道321的尺寸越小,需要的所述滤光元件31的尺寸越小,从而能够降低所述滤光元件31的成本。尽管如此,本领域的技术人员可以理解的是,所述支座32的所述连接 部35的延伸距离需要结合所述摄像模组100的成像效果来确定,比如在减小所述摄像模组100的后焦的基础上部使其出现暗点,比如灰尘的影像,而所述支座32的所述滤光片贴装部36的延伸距离需要考虑所述摄像模组100的光线通路以及所述感光元件22的所述感光区域221和所述非感光区域222以及所述基板211的剩余宽度等因素。例如,在使所述滤光片贴装部36向内延伸时,在所述滤光元件31的尺寸较小的情况下,所述滤光片贴装部36不会遮挡所述感光元件22的所述感光区域221,不会过多遮挡进入的光线,且可以在所述基板211封装剩余较宽的位置延伸较多,而在所述基板211的封装剩余宽度较小的位置延伸较小,从而在保证所述摄像模组100的成像质量的情况下,尽可能地减小所述滤光元件31的面积,从而保证所述摄像模组100的可靠性和降低所述摄像模组100的制造成本。It is also worth mentioning that the extending distance of the connecting portion 35 of the support 32 affects the sinking depth of the filter element 31 in the light window 231 of the molded base 23, and The extension distance of the filter mounting portion 36 affects the size of the filter element 31. For example, when the extension distance of the connecting portion 35 of the holder 32 is larger, the position of the filter element 31 in the light window 231 of the molding base 23 is closer to the photosensitive member. 22. The smaller the back focus distance of the corresponding camera module 100 is, the smaller the extension distance of the filter mounting portion 36 is, the smaller the size of the light passage 321 of the holder 32 is. The smaller the size of the filter element 31 required, the lower the cost of the filter element 31 can be. However, it can be understood by those skilled in the art that the extending distance of the connecting portion 35 of the support 32 needs to be determined in conjunction with the imaging effect of the camera module 100, such as reducing the camera module. The upper portion of the base of the back focus of the lens 100 causes a dark spot, such as an image of dust, and the extending distance of the filter mounting portion 36 of the holder 32 needs to consider the light path of the camera module 100 and the Factors such as the photosensitive region 221 of the photosensitive member 22 and the non-photosensitive region 222 and the remaining width of the substrate 211 are described. For example, when the filter mounting portion 36 is extended inward, the filter mounting portion 36 does not block the photosensitive member 22 when the size of the filter element 31 is small. The photosensitive region 221 does not block the incoming light excessively, and may extend more at a position where the substrate 211 is wider than the package, and has a smaller extension at a position where the package remaining width of the substrate 211 is smaller. Therefore, in the case of ensuring the imaging quality of the camera module 100, the area of the filter element 31 is reduced as much as possible, thereby ensuring the reliability of the camera module 100 and reducing the camera module 100. Manufacturing costs.
进一步地,在所述支座32的所述基座贴装部34和所述连接部35之间形成一容纳槽37,和在所述支座32的所述连接部35和所述滤光片贴装部36之间形成所述贴装槽3201,其中被贴装于所述支座32的所述滤光片贴装部36的所述滤光元件31被保持在所述贴装槽3201内,其中在所述支座32被贴装于所述模塑基座23的所述顶表面232后,所述模塑基座23的一部分被保持在所述支座32的所述容纳槽37内,通过这样的方式,能够有利于进一步减小所述摄像模组100的长宽尺寸和高度尺寸,以有利于所述摄像模组100的小型化。Further, a receiving groove 37 is formed between the base mounting portion 34 of the holder 32 and the connecting portion 35, and the connecting portion 35 and the filter at the holder 32 The mounting groove 3201 is formed between the sheet mounting portions 36, wherein the filter element 31 of the filter mounting portion 36 attached to the holder 32 is held in the mounting groove In the case of 3201, after the holder 32 is attached to the top surface 232 of the molding base 23, a portion of the molding base 23 is held in the housing of the holder 32. In this manner, in the slot 37, it is possible to further reduce the length, width, and height dimensions of the camera module 100 to facilitate miniaturization of the camera module 100.
在附图42A至图42G示出的所述摄像模组100的这个具体的示例中,所述支座32的所述通气孔328被设于所述支座32的所述滤光片贴装部36,并且所述通气孔328自所述滤光片贴装部36的上表面延伸至下表面,和使所述通气孔328连通所述贴装槽3201,其中在所述滤光元件31被贴装于所述滤光片贴装部36后,在所述滤光元件31的外壁和所述连接部35之间形成所述缝隙33,其中所述通气孔328连通所述缝隙33,以使所述通气孔328和所述缝隙33形成用于连通所述密封空间101和所述感光装置1000的外部的所述通气通道102。In this specific example of the camera module 100 shown in FIGS. 42A to 42G, the vent hole 328 of the holder 32 is disposed on the filter of the holder 32. a portion 36, and the vent hole 328 extends from an upper surface to a lower surface of the filter mounting portion 36, and communicates the vent hole 328 with the mounting groove 3201, wherein the filter element 31 After being attached to the filter mounting portion 36, the slit 33 is formed between the outer wall of the filter element 31 and the connecting portion 35, wherein the vent hole 328 communicates with the slit 33, The vent hole 328 and the slit 33 are formed to communicate the vent passage 102 for the sealed space 101 and the outside of the photosensitive device 1000.
在另一个可能的示例中,参考附图43A,所述通气孔328被设于所述支座32的所述基座贴装部34,并且所述通气孔328自所述基座贴装部34的上表面延伸至下表面,和使所述通气孔328连通所述容纳槽37,其中在所述支座32的所述基座贴装部34被贴装于所述模塑基座23的所述顶表面232后,在所述连接部35和所述模塑基座23的所述基座内表面234之间形成所述缝隙33,其中所述通气孔328连通所述缝隙33,以使所述通气孔328和所述缝隙33形成用于连通所述密封空间101和所述感光装置1000的外部的所述通气通道102。In another possible example, referring to FIG. 43A, the vent 328 is provided in the pedestal mounting portion 34 of the holder 32, and the vent 328 is from the pedestal mounting portion. The upper surface of the upper surface 34 extends to the lower surface, and the vent hole 328 is communicated with the accommodating groove 37, wherein the susceptor mounting portion 34 of the holder 32 is attached to the molding base 23 After the top surface 232, the gap 33 is formed between the connecting portion 35 and the base inner surface 234 of the molding base 23, wherein the vent hole 328 communicates with the slit 33, The vent hole 328 and the slit 33 are formed to communicate the vent passage 102 for the sealed space 101 and the outside of the photosensitive device 1000.
在另一个可能的示例中,参考附图43B,所述支座32的所述通气孔328被设于所述支座32的所述连接部35,并且所述通气孔328自所述连接部35的内表面延伸至外表面,以使所述通气孔328连通所述贴装槽3201和所述容纳槽37,其中所述支座32的所述通气槽329被设于所述滤光片贴装部36,并且所述通气槽329连通所述贴装槽3201和所述通气孔328,其中在所述滤光元件31被贴装于所述支座32的所述滤光片贴装部36而形成所述滤光单元30,和使所述支座 32的所述模塑基座23的所述顶表面232之后,相互连通的所述通气槽329和所述通气孔328形成用于连通所述密封空间101和所述感光装置1000的外部的所述通气通道102。In another possible example, referring to FIG. 43B, the vent hole 328 of the holder 32 is disposed at the connecting portion 35 of the holder 32, and the vent hole 328 is from the connecting portion. An inner surface of the 35 extends to the outer surface such that the vent 328 communicates with the mounting groove 3201 and the receiving groove 37, wherein the venting groove 329 of the holder 32 is disposed on the filter The mounting portion 36, and the venting groove 329 communicates with the mounting groove 3201 and the vent hole 328, wherein the filter element 31 is mounted on the filter of the holder 32 The filter unit 30 is formed by the portion 36, and the venting groove 329 and the vent hole 328 that communicate with each other after the top surface 232 of the molded base 23 of the holder 32 are formed. The ventilation passage 102 communicates with the sealed space 101 and the outside of the photosensitive device 1000.
附图44示出了所述摄像模组100的另一个变形实施方式的剖视示意图,所述摄像模组100进一步包括一透光的防护元件60,其中所述防护元件60具有一透光区域61、一贴附区域62以及一逃气空间63,其中所述贴附区域62环绕在所述透光区域61的四周,所述逃气空间63被实施为一逃气槽,其中所述逃气空间63自所述贴附区域62延伸至所述透光区域61的适当位置,其中在所述防护元件60的所述贴附区域62被贴附于所述模塑基座23的所述顶表面232之后,所述逃气空间63在所述防护元件60的所述贴附区域62和所述模塑基座23的所述顶表面232之间形成用于连通所述密封空间101和所述感光装置1000的外部的所述通气通道102。可选地,所述逃气空间63可以被实施为逃气孔,其中所述逃气空间63在所述透光区域61自所述防护元件60的上表面延伸至下表面,从而在所述防护元件60的所述贴附区域62被贴附于所述模塑基座23的所述顶表面232之后,所述逃气空间63形成用于连通所述密封空间101和所述感光装置1000的外部的所述通气通道102。还可选地,所述逃气空间63也可以形成于所述模塑基座23的所述顶表面232,从而在所述防护元件60的所述贴附区域62被贴附于所述模塑基座23的所述顶表面232后,所述逃气空间63在所述模塑基座23的所述顶表面232和所述防护元件60的所述贴附区域62之间形成用于连通所述密封空间101和所述感光装置1000的外部的所述通气通道102。FIG. 44 is a cross-sectional view showing another modified embodiment of the camera module 100. The camera module 100 further includes a light-transmitting protective member 60, wherein the protective member 60 has a light-transmitting region. 61. An attachment area 62 and an escape space 63, wherein the attachment area 62 surrounds the light-transmissive area 61, and the escape space 63 is implemented as an escape slot, wherein the escape An air space 63 extends from the attachment area 62 to a suitable position of the light transmissive area 61, wherein the attachment area 62 of the protective element 60 is attached to the molded base 23 After the top surface 232, the escape space 63 is formed between the attachment region 62 of the shield member 60 and the top surface 232 of the molded base 23 for communicating the sealed space 101 and The ventilation passage 102 outside the photosensitive device 1000. Optionally, the escape space 63 may be implemented as an escape hole, wherein the escape space 63 extends from the upper surface to the lower surface of the protection element 60 in the light transmissive area 61, thereby The attachment region 62 of the member 60 is attached to the top surface 232 of the molding base 23, and the escape space 63 is formed to communicate the sealed space 101 and the photosensitive device 1000. The venting channel 102 is external. Still alternatively, the escape space 63 may also be formed on the top surface 232 of the molding base 23 such that the attachment region 62 of the shield member 60 is attached to the mold. After the top surface 232 of the plastic base 23, the escape space 63 is formed between the top surface 232 of the molded base 23 and the attachment region 62 of the shield member 60 for The venting passage 102 that communicates the sealed space 101 and the outside of the photosensitive device 1000.
参考本发明的说明书附图之附图45至图49C,依本发明的另一较佳实施例的一摄像模组100’在接下来的描述中被阐述,其中所述摄像模组100’包括至少一光学镜头10’和至少一模塑感光单元20’,其中所述模塑感光单元20’进一步包括至少一电路板21’、至少一感光元件22’以及至少一模塑部27’,其中所述感光元件22’被导通地连接于所述电路板21’,所述模塑部27’一体地结合于所述电路板21’,其中所述光学镜头10’被保持在所述感光元件22’的感光路径。Referring to Figures 45 to 49C of the accompanying drawings of the present invention, a camera module 100' according to another preferred embodiment of the present invention is illustrated in the following description, wherein the camera module 100' includes At least one optical lens 10' and at least one molded photosensitive unit 20', wherein the molded photosensitive unit 20' further comprises at least one circuit board 21', at least one photosensitive element 22', and at least one molded portion 27', wherein The photosensitive element 22' is electrically connected to the circuit board 21', and the molding portion 27' is integrally coupled to the circuit board 21', wherein the optical lens 10' is held at the photosensitive Photosensitive path of element 22'.
所述电路板21’进一步包括至少一基板211’和至少一连接板212’,其中所述感光元件22’被导通地连接于所述基板211’,其中所述连接板212’具有一模组连接端2121’和对应于所述模组连接端2121’的一设备连接端2122’,其中所述连接板212’的所述模组连接端2121’被导通地连接于所述基板211’,所述连接板212’的所述设备连接端2122’被电连接于所述设备本体200。The circuit board 21' further includes at least one substrate 211' and at least one connecting plate 212', wherein the photosensitive element 22' is electrically connected to the substrate 211', wherein the connecting plate 212' has a mode a connection end 2121' and a device connection end 2122' corresponding to the module connection end 2121', wherein the module connection end 2121' of the connection plate 212' is electrically connected to the substrate 211 The device connection end 2122' of the connection board 212' is electrically connected to the device body 200.
在一个实施例中,所述连接板212’的所述模组连接端2121’通过一连接介质2123’被贴装于所述基板211’,从而使所述连接板212’的所述模组连接端2121’被导通地连接于所述基板211’。可选地,所述连接板212’的所述模组连接端2121’一体地延伸于所述基板211’,即,所述连接板212’和所述基板211’是一体式结构。In one embodiment, the module connection end 2121' of the connection board 212' is mounted on the substrate 211' through a connection medium 2123', so that the module of the connection board 212' The connection end 2121' is electrically connected to the substrate 211'. Optionally, the module connection end 2121' of the connecting plate 212' integrally extends to the substrate 211', that is, the connecting plate 212' and the substrate 211' are of a unitary structure.
另外,所述连接板212’包括一连接器2124’,其中所述连接器2124’被 设置于所述连接板212’的所述设备连接端2122’,或者所述连接器2124’形成于所述连接板212’的所述设备连接端2122’,其中通过所述连接板212’的所述连接器2124’能够将所述连接板212’的所述设备连接端2122’方便地电连接于所述设备本体200。In addition, the connecting plate 212' includes a connector 2124', wherein the connector 2124' is disposed at the device connecting end 2122' of the connecting plate 212', or the connector 2124' is formed in the The device connection end 2122' of the connection plate 212', wherein the device connection end 2122' of the connection plate 212' can be conveniently electrically connected to the connector 2124' of the connection plate 212' The device body 200.
值得一提的是,所述连接板212’是软质的,其能够产生变形,其中所述摄像模组100’通过所述连接板212’被连接于所述设备本体200,通过这样的方式,所述连接板212’能够缓冲所述摄像模组100’的制造公差造成的装配位移和变形,和在所述设备本体200被使用的过程中由于震动而造成的所述摄像模组100’的位移,从而保证所述电子设备在被使用的过程中的可靠性。It is worth mentioning that the connecting plate 212 ′ is soft and can be deformed, wherein the camera module 100 ′ is connected to the device body 200 through the connecting plate 212 ′ in such a manner. The connecting plate 212' can buffer assembly displacement and deformation caused by manufacturing tolerances of the camera module 100', and the camera module 100' is caused by vibration during use of the device body 200. The displacement, thereby ensuring the reliability of the electronic device in the process of being used.
所述基板211’具有一基板正面2111’和一基板背面2112’,其中所述基板正面2111’和所述基板背面2112’相互对应。通常情况下,所述基板211’呈平板状,从而所述基板211’的所述基板正面2111’和所述基板背面2112’均是平面,这样,所述基板211’的所述基板正面2111’和所述基板背面2112’能够界定所述基板211’的厚度尺寸。也就是说,所述基板211’的所述基板正面2111’和所述基板背面2112’之间的距离尺寸为所述基板211’的厚度尺寸。The substrate 211' has a substrate front surface 2111' and a substrate back surface 2112', wherein the substrate front surface 2111' and the substrate back surface 2112' correspond to each other. Generally, the substrate 211 ′ has a flat shape, so that the substrate front surface 2111 ′ and the substrate back surface 2 112 ′ of the substrate 211 ′ are both planar, such that the substrate front surface 2111 of the substrate 211 ′ 'and the substrate back surface 2112' can define the thickness dimension of the substrate 211'. That is, the distance dimension between the substrate front surface 2111' and the substrate back surface 2112' of the substrate 211' is the thickness dimension of the substrate 211'.
所述基板211’进一步具有至少一平整的贴装区域2113’和环绕在所述贴装区域2113’四周的一边缘区域2114’,其中所述贴装区域2113’和所述边缘区域2114’分别形成于所述基板211’的所述基板正面2111’,其中所述感光元件22’被贴装于所述基板211’的所述贴装区域2113’,其中所述模塑部27’一体地结合于所述基板211’的所述边缘区域2114’的至少一部分。The substrate 211' further has at least one flat mounting area 2113' and an edge area 2114' surrounding the mounting area 2113', wherein the mounting area 2113' and the edge area 2114' respectively Formed on the substrate front surface 2111' of the substrate 211', wherein the photosensitive element 22' is mounted on the mounting area 2113' of the substrate 211', wherein the molding portion 27' is integrally Bonded to at least a portion of the edge region 2114' of the substrate 211'.
通常情况下,所述基板211’具有良好的硬度,以保证所述基板211’的平整性,通过这样的方式,当所述感光元件22’被贴装于所述基板211’的所述贴装区域2113’后,所述感光元件22’的平整度能够被保证。例如,所述基板211’可以是但不限于硬板、硬软结合板、陶瓷基板等。Generally, the substrate 211' has good hardness to ensure the flatness of the substrate 211', in such a manner that when the photosensitive element 22' is attached to the substrate 211' After the area 2113' is mounted, the flatness of the photosensitive element 22' can be ensured. For example, the substrate 211' may be, but not limited to, a hard board, a hard and soft bonding board, a ceramic substrate, or the like.
进一步地,所述模塑感光单元20’进一步包括至少一连接线24’,其中所述连接线24’的两个端部分别被导通地连接于所述感光元件22’和所述基板211’,以使被贴装于所述基板211’的所述贴装区域2113’的所述感光元件22’通过所述连接线24’被导通地连接于所述基板211’。Further, the molded photosensitive unit 20' further includes at least one connecting wire 24', wherein both ends of the connecting wire 24' are electrically connected to the photosensitive member 22' and the substrate 211, respectively. ', such that the photosensitive element 22' attached to the mounting region 2113' of the substrate 211' is electrically connected to the substrate 211' through the connecting line 24'.
具体地说,所述基板211’进一步具有至少一基板连接件2115’,其中每个所述基板连接件2115’分别被设置于所述基板211’的所述边缘区域2114’。例如,所述基板连接件2115’可以排列成但不限于两组,并且每组所述基板连接件2115’分别被对称地设置于所述贴装区域2113’的两侧。相应地,所述感光元件22’具有一感光区域221’、一非感光区域222’以及至少一芯片连接件223’,其中所述非感光区域222’环绕在所述感光区域221’的四周,每个所述芯片连接件223’分别被设置于所述感光元件22’的所述非感光区域222’。例如,所述芯片连接件223’可以排列成但不限于两组,并且每组所述芯片连接件223’分别被对称地设置于所述感光区域221’的两侧。Specifically, the substrate 211' further has at least one substrate connector 2115', wherein each of the substrate connectors 2115' is disposed in the edge region 2114' of the substrate 211', respectively. For example, the substrate connectors 2115' may be arranged, but not limited to two, and each set of the substrate connectors 2115' are symmetrically disposed on opposite sides of the mounting area 2113'. Correspondingly, the photosensitive element 22' has a photosensitive area 221', a non-photosensitive area 222', and at least one chip connector 223', wherein the non-photosensitive area 222' surrounds the photosensitive area 221'. Each of the chip connectors 223' is disposed in the non-photosensitive region 222' of the photosensitive element 22', respectively. For example, the chip connectors 223' may be arranged in, but not limited to, two groups, and each of the chip connectors 223' is symmetrically disposed on both sides of the photosensitive region 221'.
优选地,在将所述感光元件22’贴装于所述基板211’的所述贴装区域2113’ 之后,被设置于所述感光元件22’的所述非感光区域222’的每个所述芯片连接件223’分别对应于被设置于所述基板211’的所述边缘区域2114’的每个所述基板连接件2115’。Preferably, after the photosensitive element 22' is attached to the mounting area 2113' of the substrate 211', each of the non-photosensitive regions 222' of the photosensitive element 22' is disposed. The chip connectors 223' respectively correspond to each of the substrate connectors 2115' disposed in the edge region 2114' of the substrate 211'.
所述连接线24’的两个端部分别被连接于所述基板211’的所述基板连接件2115’和所述感光元件22’的所述芯片连接件223’,以导通地连接所述感光元件22’和所述基板211’。例如,可以通过打线工艺在所述基板211’的所述基板连接件2115’和所述感光元件22’的所述芯片连接件223’之间形成所述连接线24’,通过这样的方式,藉由所述连接线24’导通地连接所述感光元件22’和所述基板211’。The two ends of the connecting line 24' are respectively connected to the substrate connecting member 2115' of the substrate 211' and the chip connecting member 223' of the photosensitive element 22' to be electrically connected The photosensitive element 22' and the substrate 211' are described. For example, the connecting line 24' may be formed between the substrate connecting member 2115' of the substrate 211' and the chip connecting member 223' of the photosensitive member 22' by a wire bonding process in such a manner The photosensitive element 22' and the substrate 211' are electrically connected by the connecting line 24'.
值得一提的是,所述连接线24’的打线方向在本发明的所述摄像模组100’中不受限制,例如所述连接线24’的打线方向可以是从所述基板211’向所述感光元件22’,也可以是从所述感光元件22’向所述基板211’。另外,所述连接线24’的类型在本发明的所述摄像模组100’中也可以不受限制,例如所述连接线24’可以是金线、引线、铜线等。It is to be noted that the wire bonding direction of the connecting wire 24 ′ is not limited in the camera module 100 ′ of the present invention. For example, the wire bonding direction of the connecting wire 24 ′ may be from the substrate 211 . 'to the photosensitive element 22' may be from the photosensitive element 22' to the substrate 211'. Further, the type of the connecting wire 24' is not limited in the camera module 100' of the present invention. For example, the connecting wire 24' may be a gold wire, a lead wire, a copper wire or the like.
进一步地,所述模塑感光单元20’进一步包括至少一电子元器件25’,其中所述电子元器件25’被导通地连接于所述基板211’。Further, the molded photosensitive unit 20' further includes at least one electronic component 25', wherein the electronic component 25' is electrically connected to the substrate 211'.
在本发明的所述摄像模组100’的一个示例中,所述电子元器件25’可以被贴装于所述基板211’的所述边缘区域2114’。可选地,所述电子元器件25’的一部分或者全部可以被埋入所述基板211’。还可选地,一部分所述电子元器件25’也可以被贴装于所述基板211’的所述基板背面2112’,或者位于所述基板211’的所述基板背面2112’的所述电子元器件25’的一部分或者全部被埋入所述基板211’。In an example of the camera module 100' of the present invention, the electronic component 25' may be mounted on the edge region 2114' of the substrate 211'. Alternatively, part or all of the electronic component 25' may be buried in the substrate 211'. Optionally, a part of the electronic component 25 ′ may also be mounted on the back surface 2112 ′ of the substrate 211 ′, or the electrons located on the back surface 2112 ′ of the substrate 211 ′. A part or all of the component 25' is buried in the substrate 211'.
值得一提的是,所述电子元器件25’的类型不受限制,例如所述电子元器件25’可以被实施为但不限于驱动器、继电器、处理器、电阻、电容等。It is worth mentioning that the type of the electronic component 25' is not limited, for example, the electronic component 25' may be implemented as, but not limited to, a driver, a relay, a processor, a resistor, a capacitor, or the like.
所述模塑部27’一体地结合于所述基板211’的所述边缘区域2114’之后可以没有包埋所述电子元器件25’,也可以包埋至少一个所述电子元器件27’的至少一部分。优选地,所述模塑部27’在一体地结合于所述基板211’的所述边缘区域2114’之后包埋全部的所述电子元器件25’。可以理解的是,通过所述模塑部27’在成型后包埋所述电子元器件25’的方式,能够藉由所述模塑部27’阻止所述电子元器件25’和外部环境接触,从而避免所述电子元器件25’的表面出现氧化等不良现象。所述模塑部27’还能够隔离相邻所述电子元器件25’,以阻止相邻所述电子元器件25’之间出现相互干扰的不良现象。另外,通过所述模塑部27’在成型后包埋所述电子元器件25’的方式,所述模塑部27’还能够使相邻所述电子元器件25’之间的间隔更小,从而使得所述基板211’的有限贴装面积上能够被贴装数量更多、尺寸更大的所述电子元器件25’。The molding portion 27 ′ may be integrally bonded to the edge region 2114 ′ of the substrate 211 ′ after the electronic component 25 ′ may not be embedded, or at least one of the electronic components 27 ′ may be embedded. At least part. Preferably, the molding portion 27' embeds all of the electronic components 25' after being integrally bonded to the edge region 2114' of the substrate 211'. It can be understood that, by the molding portion 27' embedding the electronic component 25' after molding, the electronic component 25' can be prevented from contacting the external environment by the molding portion 27'. Therefore, the surface of the electronic component 25' is prevented from being oxidized or the like. The molded portion 27' is also capable of isolating adjacent electronic components 25' to prevent mutual interference between adjacent electronic components 25'. Further, the molded portion 27' can also make the interval between adjacent electronic components 25' smaller by the manner in which the molded portion 27' embeds the electronic component 25' after molding. Therefore, the electronic component 25' can be mounted in a larger number and larger size on the limited mounting area of the substrate 211'.
另外,所述模塑部27’也能够隔离所述电子元器件25’和所述感光元件22’,以避免所述电子元器件25’的表面的脱落物污染所述感光元件22’的所述感光区域221’。例如,所述模塑部27’能够通过包埋所述电子元器件25’的方式 隔离所述电子元器件25’和所述感光元件22’,也可以使所述电子元器件25’和所述感光元件22’分别位于所述模塑部27’的两侧的方式隔离所述电子元器件25’和所述感光元件22’。In addition, the molding portion 27' can also isolate the electronic component 25' and the photosensitive member 22' to prevent the surface of the electronic component 25' from escaping the photosensitive member 22'. The photosensitive area 221' is described. For example, the molding portion 27' can isolate the electronic component 25' and the photosensitive element 22' by embedding the electronic component 25', and the electronic component 25' and the The photosensitive member 22' is spaced apart from the electronic component 25' and the photosensitive member 22' in such a manner as to be located on both sides of the molded portion 27'.
所述模塑部27’进一步包括至少一模塑体271’,其中所述模塑体271’通过模塑工艺一体地结合于所述基板211’的所述边缘区域2114’的至少一部分。优选地,所述模塑体271’包埋凸出于所述基板211’的所述基板正面2111’的至少一个所述电子元器件25’的至少一部分。例如,所述模塑体271’能够包埋全部的所述电子元器件25’。更优选地,所述模塑体271’能够自所述基板211’的所述边缘区域2114’延伸至所述感光元件22’的所述非感光区域221’,即,所述模塑体271’能够包埋所述感光元件22’的所述非感光区域221’的一部分。换言之,所述模塑体271’能够一体地结合于所述基板211’的所述边缘区域2114’和所述感光元件22’的所述非感光区域222’。The molded portion 27' further includes at least one molded body 271', wherein the molded body 271' is integrally bonded to at least a portion of the edge region 2114' of the substrate 211' by a molding process. Preferably, the molded body 271' is embedded in at least a portion of at least one of the electronic components 25' protruding from the substrate front surface 2111' of the substrate 211'. For example, the molded body 271' can embed all of the electronic components 25'. More preferably, the molded body 271' can extend from the edge region 2114' of the substrate 211' to the non-photosensitive region 221' of the photosensitive member 22', that is, the molded body 271 'A portion of the non-photosensitive region 221' of the photosensitive element 22' can be embedded. In other words, the molded body 271' can be integrally bonded to the edge region 2114' of the substrate 211' and the non-photosensitive region 222' of the photosensitive member 22'.
优选地,所述模塑体271’的数量是两个,并且两个所述模塑体271’能够对称地形成在所述感光元件22’的所述感光区域221’的两侧,并且在两个所述模塑体271’之间形成所述模塑部27’的一第一通光空间272’和连通于所述第一通光空间272’的两第一安装空间273’。Preferably, the number of the molded bodies 271' is two, and two of the molded bodies 271' can be symmetrically formed on both sides of the photosensitive region 221' of the photosensitive member 22', and A first light-passing space 272' of the molding portion 27' and two first mounting spaces 273' communicating with the first light-passing space 272' are formed between the two molded bodies 271'.
所述摄像模组100’进一步包括至少一滤光单元30’,其中所述滤光单元30’包括至少一滤光元件31’,其中所述滤光元件31’被保持在所述光学镜头10’和所述感光元件22’之间。被物体反射的光线在自所述光学镜头10’进入所述摄像模组100’的内部后,能够被所述滤光元件31’过滤,然后再被所述感光元件22’接收和进行光电转化而成像。The camera module 100 ′ further includes at least one filter unit 30 ′, wherein the filter unit 30 ′ includes at least one filter element 31 ′, wherein the filter element 31 ′ is held on the optical lens 10 . Between and the photosensitive element 22'. After being reflected from the optical lens 10' into the interior of the camera module 100', the light reflected by the object can be filtered by the filter element 31', and then received and photoelectrically converted by the photosensitive element 22'. And imaging.
值得一提的是,所述滤光单元30’的所述滤光元件31’的类型在本发明的所述摄像模组100’中不受限制,例如所述滤光元件31’可以是但不限于红外截止滤光片、全透光谱滤光片。It is to be noted that the type of the filter element 31 ′ of the filter unit 30 ′ is not limited in the camera module 100 ′ of the present invention. For example, the filter element 31 ′ may be It is not limited to an infrared cut filter or a full transmissive spectrum filter.
所述滤光单元30’进一步包括至少一框型的支座32’,其中所述支座32’具有至少一通光通道321’,其中所述滤光元件31’被贴装于所述支座32’,以使所述滤光元件31’封闭所述支座32’的所述通光通道321’。所述支座32’具有一第二通光空间3202’和连通于所述第二通光空间3202’的至少一第二安装空间3203’,其中所述支座32’被贴装于所述模塑部27’,以使所述模塑部27’的每个所述模塑体271’的至少一部分被安装于所述支座32’的每个所述第二安装空间3203’,和使所述支座32’的至少一部分被安装于所述模塑部27’的每个所述第一安装空间273’,这样,所述模塑部27’的所述第一通光空间272’和所述支座32’的所述第二通光空间3202’能够相互配合而形成一光窗231’,其中所述感光元件22’的所述感光区域221’对应于所述光窗231’。The filter unit 30' further includes at least one frame type holder 32', wherein the holder 32' has at least one light passage 321', wherein the filter element 31' is mounted on the holder 32', such that the filter element 31' closes the light passage 321' of the holder 32'. The holder 32' has a second light-passing space 3202' and at least one second installation space 3203' communicating with the second light-passing space 3202', wherein the holder 32' is mounted on the a molded portion 27' such that at least a portion of each of the molded bodies 271' of the molded portion 27' is mounted to each of the second mounting spaces 3203' of the holder 32', and At least a portion of the holder 32' is mounted to each of the first mounting spaces 273' of the molding portion 27' such that the first light-passing space 272 of the molding portion 27' The second light-passing space 3202' of the holder 32' can cooperate to form a light window 231', wherein the photosensitive area 221' of the photosensitive element 22' corresponds to the light window 231 '.
进一步地,所述支座32’包括一支座主体3204’和一体地延伸于所述支座主体3204’的至少一延伸臂3205’。在本发明的所述摄像模组100’的这个具体的示例中,所述延伸臂3205’的数量被实施为两个,其中两个所述延伸臂3205’分别一体地且相互对称地延伸于所述支座主体3204’,以在两个所述延伸臂 3205’之间形成所述第二通光空间3202’和每个所述第二安装空间3203’,其中所述支座主体3204’具有所述通光通道321’,并且所述通光通道321’连通所述第二通光空间3202’。Further, the support 32' includes a seat body 3204' and at least one extension arm 3205' that integrally extends from the seat body 3204'. In this specific example of the camera module 100' of the present invention, the number of the extension arms 3205' is implemented as two, wherein the two extension arms 3205' extend integrally and symmetrically with each other. The holder body 3204' to form the second light-passing space 3202' and each of the second installation spaces 3203' between the two extension arms 3205', wherein the holder body 3204' The light passing passage 321' is provided, and the light passing passage 321' communicates with the second light passing space 3202'.
在所述支座32’被贴装于所述模塑部27’时,所述支座32’的每个所述延伸臂3205’分别被安装和被保持在所述模塑部27’的每个所述第一安装空间273’,所述模塑部27’的每个所述模塑体271’分别被安装于所述支座32’的每个所述第二安装空间3203’,这样,能够使所述模塑部27’的所述第一通光空间272’和所述支座32’的所述第二通光空间3202’相互配合而形成所述光窗231’。在将所述支座32’贴装于所述模塑部27’之后,在所述滤光元件31’、所述支座32’、所述模塑部27’和所述基板211’之间形成所述摄像模组100’的一密封空间101’,其中所述感光元件22’的所述感光区域221’被保持在所述密封空间101’。另外,在所述滤光单元30’和所述模塑感光单元20’被安装在一起之后能够形成一感光装置1000’。When the holder 32' is attached to the molding portion 27', each of the extension arms 3205' of the holder 32' is mounted and held at the molding portion 27', respectively. Each of the first mounting spaces 273', each of the molding bodies 271' of the molding portion 27' is mounted to each of the second mounting spaces 3203' of the holder 32', Thus, the first light-passing space 272' of the molding portion 27' and the second light-passing space 3202' of the holder 32' can be fitted to each other to form the light window 231'. After the holder 32' is attached to the molding portion 27', the filter member 31', the holder 32', the molding portion 27', and the substrate 211' are A sealed space 101' of the camera module 100' is formed, wherein the photosensitive region 221' of the photosensitive element 22' is held in the sealed space 101'. Further, a photosensitive device 1000' can be formed after the filter unit 30' and the molded photosensitive unit 20' are mounted together.
值得一提的是,所述支座32’的每个所述延伸臂3205’的形状和尺寸与所述模塑部27’的所述第一安装空间273’的形状和相互匹配,所述模塑部27’的每个所述模塑体271’的形状和尺寸与所述支座32’的每个所述第二安装空间3203’的形状和尺寸相互匹配,通过这样的方式,能够在所述滤光元件31’、所述支座32’、所述模塑部27’和所述基板211’之间形成所述摄像模组100’的所述密封空间101’。It is worth mentioning that the shape and size of each of the extension arms 3205' of the support 32' matches the shape and mutual shape of the first installation space 273' of the molding portion 27'. The shape and size of each of the molded bodies 271' of the molded portion 27' and the shape and size of each of the second mounting spaces 3203' of the holder 32' are matched with each other, in such a manner The sealed space 101' of the camera module 100' is formed between the filter element 31', the holder 32', the molding portion 27', and the substrate 211'.
所述感光装置1000’包括至少一贴装层1001’,其有一贴装介质1002’形成,其中所述贴装层1001’被保持在所述滤光单元30’的所述支座32’和所述模塑感光单元20’的所述模塑部27’之间,以供将所述支座32’贴装于所述模塑部27’。The photosensitive device 1000' includes at least one mounting layer 1001' formed with a mounting medium 1002', wherein the mounting layer 1001' is held at the holder 32' of the filter unit 30' and The molded portion 27' of the molded photosensitive unit 20' is placed between the molded portion 27' to be attached to the molded portion 27'.
值得一提的是,所述贴装介质1002’的类型在本发明的所述摄像模组100’中不受限制,例如所述贴装介质1002’可以是但不限于胶水,其中所述贴装介质1002’在固化后形成被保持在所述支座32’和所述模塑体271’之间的所述贴装层1001’。It is worth mentioning that the type of the mounting medium 1002' is not limited in the camera module 100' of the present invention. For example, the mounting medium 1002' may be, but not limited to, glue, wherein the sticker The mounting medium 1002' forms a mounting layer 1001' held between the holder 32' and the molded body 271' after curing.
进一步地,所述摄像模组100’具有至少一通气通道102’,其中在所述滤光单元30’和所述模塑感光单元20’之间能够形成所述密封空间101’,例如在所述滤光元件31’、所述支座32’、所述模塑部27’和所述基板211’之间形成所述密封空间101’,所述通气通道102’用于连通所述密封空间101’和所述感光装置1000’的外部。可选地,在所述滤光元件31’、所述支座32’、所述模塑部27’和所述感光元件22’之间也可以形成所述密封空间101’。也就是说,所述密封空间101’内的气体和所述感光装置1000’的外部的气体能够通过所述通气通道102’进行交换,这样,在所述摄像模组100’被制造的过程中,通过所述通气通道102’能够保证所述密封空间101’的气压压力和所述感光装置1000’的外部的气压压力保持平衡,从而能够避免出现所述摄像模组100’的用于形成所述密封空间101’的每个部件因受压不平衡而被损坏的不良现象, 尤其是能够保证所述滤光元件31’的上部和下部受到的气压压力一致,从而避免因所述滤光元件31’的上部和下部受到的气压压力不平衡而导致所述滤光元件31’出现裂纹或者碎裂的不良现象。Further, the camera module 100' has at least one ventilation channel 102', wherein the sealed space 101' can be formed between the filter unit 30' and the molded photosensitive unit 20', for example, The sealed space 101' is formed between the filter element 31', the holder 32', the molding portion 27' and the substrate 211', and the ventilation passage 102' is used to communicate the sealed space. 101' and the exterior of the photosensitive device 1000'. Alternatively, the sealed space 101' may be formed between the filter element 31', the holder 32', the molded portion 27', and the photosensitive member 22'. That is, the gas in the sealed space 101' and the gas outside the photosensitive device 1000' can be exchanged through the venting passage 102', so that in the process in which the camera module 100' is manufactured The venting passage 102 ′ can ensure that the air pressure of the sealed space 101 ′ and the pressure of the outside of the photosensitive device 1000 ′ are balanced, so that the formation of the camera module 100 ′ can be avoided. The problem that each component of the sealed space 101' is damaged due to the pressure imbalance, in particular, can ensure that the upper and lower portions of the filter element 31' are subjected to the same air pressure, thereby avoiding the filter element The upper and lower portions of 31' are subjected to an unbalanced air pressure, which causes a problem of cracking or chipping of the filter element 31'.
优选地,所述通气通道102’形成于所述支座32’。更优选地,所述通气通道102’形成于所述支座32’的所述延伸臂3205’,其中所述通气通道102’连通所述第二通光空间3202’和外部环境,从而在所述滤光元件31’、所述支座32’、所述模塑部27’和所述基板211’之间形成所述密封空间101’之后,形成于所述延伸臂3205’的所述通气通道102’能够连通所述密封空间101’和外部环境。可选地,所述通气通道102’也可以形成于所述模塑体271’。Preferably, the venting passage 102' is formed in the abutment 32'. More preferably, the ventilation channel 102' is formed in the extension arm 3205' of the support 32', wherein the ventilation channel 102' communicates with the second light-passing space 3202' and the external environment, thereby The ventilation formed in the extension arm 3205' after the filter space 101' is formed between the filter element 31', the holder 32', the molding portion 27' and the substrate 211'. The passage 102' is capable of communicating the sealed space 101' and the external environment. Alternatively, the venting passage 102' may also be formed in the molded body 271'.
优选地,所述通气通道102’倾斜地延伸,即,所述通气通道102’的延伸方向与所述感光元件22’的所述感光区域221’所在的平面的延伸方向不一致,这样,在后续通过将一密封介质104’填充在所述通气通道102’内而形成保持在所述通气通道102’的所述密封元件103’时,所述密封介质104’不会流动到所述密封空间101’内,从而有利于保证所述摄像模组100’的品质和提高所述摄像模组100’的产品良率。Preferably, the venting passage 102' extends obliquely, that is, the extending direction of the venting passage 102' is inconsistent with the extending direction of the plane in which the photosensitive region 221' of the photosensitive member 22' is located, so that When the sealing member 103' held in the venting passage 102' is formed by filling a sealing medium 104' in the venting passage 102', the sealing medium 104' does not flow to the sealed space 101. In the end, it is advantageous to ensure the quality of the camera module 100' and improve the product yield of the camera module 100'.
所述摄像模组100’进一步包括至少一驱动器40’,其中所述光学镜头10’被可驱动地设置于所述驱动器40’,其中所述驱动器40’被贴装于所述支座32’,以使所述光学镜头10’被保持在所述感光元件22’的感光路径。所述驱动器40’能够驱动所述光学镜头10’沿着所述感光元件22’的感光路径移动,以通过调整所述光学镜头10’和所述感光元件22’的相对位置的方式,实现所述摄像模组100’的对焦和变焦。值得一提的是,所述驱动器40’可以被实施为但不限于音圈马达。The camera module 100' further includes at least one driver 40', wherein the optical lens 10' is drivably disposed on the driver 40', wherein the driver 40' is mounted on the holder 32' So that the optical lens 10' is held in the photosensitive path of the photosensitive element 22'. The driver 40' is capable of driving the optical lens 10' to move along the photosensitive path of the photosensitive element 22' to achieve a manner of adjusting the relative positions of the optical lens 10' and the photosensitive element 22'. Focusing and zooming of the camera module 100'. It is worth mentioning that the driver 40' can be implemented as, but not limited to, a voice coil motor.
进一步地,所述驱动器40’具有至少一马达引脚41’,其中所述驱动器40’的所述马达引脚41’被连接于所述基板211’,以导通所述驱动器40’和所述基板211’。Further, the driver 40' has at least one motor pin 41', wherein the motor pin 41' of the driver 40' is connected to the substrate 211' to turn on the driver 40' and the The substrate 211' is described.
附图50示出了所述摄像模组100’的另一个变形实施方式,与附图45至图49C示出的所述摄像模组100’不同的是,在附图50示出的所述摄像模组100’的这个具体的示例中,所述模塑部27’的所述模塑体271’的数量可以是两个,且两个所述模塑体271’呈“L”形,相应地,所述支座32’的所述延伸臂3205’的数量是两个,并且两个所述延伸臂3205’呈“L”形,从而在所述支座32’被贴装于所述模塑部27’之后,能够在所述滤光元件31’、所述支座32’、所述模塑部27’和所述基板211’之间形成所述密封空间101’,或者在所述滤光元件31’、所述支座32’、所述模塑部27’和所述感光元件22’之间形成所述密封空间101’。FIG. 50 shows another modified embodiment of the camera module 100', which is different from the camera module 100' shown in FIG. 45 to FIG. 49C. In this specific example of the camera module 100', the number of the molded bodies 271' of the molding portion 27' may be two, and the two molded bodies 271' have an "L" shape. Correspondingly, the number of the extension arms 3205' of the holder 32' is two, and the two extension arms 3205' are in an "L" shape, so that the holder 32' is mounted on the holder After the molding portion 27', the sealed space 101' can be formed between the filter element 31', the holder 32', the molding portion 27', and the substrate 211', or The sealed space 101' is formed between the filter element 31', the holder 32', the molded portion 27', and the photosensitive member 22'.
附图51示出了所述摄像模组100’的一个变形实施方式,与附图45至图49C示出的所述摄像模组100’不同的是,在附图51示出的所述摄像模组100’的这个具体的示例中,所述模塑部27’的所述模塑体271’的数量可以是一个,相应地,所述支座32’的所述延伸臂3205’的数量是三个,并且三个所述延伸臂3205’ 呈“匚”形,这样,所述支座32’的形状能够与所述模塑部27’的形状相互配合,从而在所述支座32’被贴装于所述模塑部27’之后,能够在所述滤光元件31’、所述支座32’、所述模塑部27’和所述基板211’之间形成所述密封空间101’,或者在所述滤光元件31’、所述支座32’、所述模塑部27’和所述感光元件22’之间形成所述密封空间101’。Figure 51 shows a variant embodiment of the camera module 100', which differs from the camera module 100' shown in Figures 45 to 49C in the camera shown in Figure 51. In this specific example of the module 100', the number of the molded bodies 271' of the molding portion 27' may be one, and accordingly, the number of the extension arms 3205' of the holder 32' There are three, and the three extension arms 3205' are in a "匚" shape, such that the shape of the holder 32' can cooperate with the shape of the molding portion 27', so that the holder 32 is 'After being mounted on the molding portion 27', the seal can be formed between the filter element 31', the holder 32', the molding portion 27' and the substrate 211' The space 101', or the sealed space 101' is formed between the filter element 31', the holder 32', the molding portion 27', and the photosensitive member 22'.
附图52示出了所述摄像模组100’的一个变形实施方式,与附图45至图49C示出的所述摄像模组100’不同的是,在附图52示出的所述摄像模组100’的这个具体的示例中,所述模塑部27’的所述模塑体271’的数量可以是三个,并且三个所述模塑体271’呈“匚”形,相应地,所述支座32’的所述延伸臂3205’的数量是一个,这样,所述支座32’的形状能够与所述模塑部27’的形状相互配合,从而在所述支座32’被贴装于所述模塑部27’之后,能够在所述滤光元件31’、所述支座32’、所述模塑部27’和所述基板211’之间形成所述密封空间101’,或者在所述滤光元件31’、所述支座32’、所述模塑部27’和所述感光元件22’之间形成所述密封空间101’。Figure 52 shows a variant embodiment of the camera module 100', which differs from the camera module 100' shown in Figures 45 to 49C in the camera shown in Figure 52. In this specific example of the module 100', the number of the molded bodies 271' of the molded portion 27' may be three, and the three molded bodies 271' have a "匚" shape, correspondingly The number of the extension arms 3205' of the holder 32' is one, such that the shape of the holder 32' can cooperate with the shape of the molding portion 27' so that the holder After being mounted on the molding portion 27', the same can be formed between the filter element 31', the holder 32', the molding portion 27', and the substrate 211'. The sealed space 101' or the sealed space 101' is formed between the filter element 31', the holder 32', the molded portion 27', and the photosensitive member 22'.
附图53示出了所述摄像模组100’的另一个变形实施方式,与附图45至图49C示出的所述摄像模组100’不同的是,在附图53示出的所述摄像模组100’的这个具体的示例中,所述模塑部27’的所述模塑体271’的数量是四个,其中将相互对称的两个所述模塑体271’定义为一第一模塑体271a’,和将剩余的相互对称的两个所述模塑体271’定义为一第二模塑体271b’,其中每个所述第一模塑体271a’和每个所述第二模塑体271b’分别首尾相接,并且每个所述第一模塑体271a’的高度尺寸高于每个所述第二模塑体271b’的高度尺寸,从而在每个所述第二模塑体271b’对应的位置形成位于两个所述第一模塑体271a’之间的所述第一安装空间273’。在将所述支座32’贴装于所述模塑部27’时,所述支座32’的每个所述延伸臂3205’的底面被贴合于每个所述第二模塑体271b’的顶面,每个所述延伸臂3205’的侧面被贴合于每个所述第一模塑体271a’的侧面,从而使每个所述延伸臂3205’分别被安装于每个所述第一安装空间273’。换言之,每个所述第一模塑体271’能够延伸至所述支座32’的所述支座主体3204’,每个所述第一模塑体271a’能够延伸至每个所述延伸臂3205’。所述支座32’的形状能够与所述模塑部27’的形状相互配合,从而在所述支座32’被贴装于所述模塑部27’之后,能够在所述滤光元件31’、所述支座32’、所述模塑部27’和所述基板211’之间形成所述密封空间101’,或者在所述滤光元件31’、所述支座32’、所述模塑部27’和所述感光元件22’之间形成所述密封空间101’。Figure 53 shows another variant embodiment of the camera module 100', which is different from the camera module 100' shown in Figures 45 to 49C, as shown in Figure 53 In this specific example of the camera module 100', the number of the molded bodies 271' of the molding portion 27' is four, wherein two of the molded bodies 271' which are symmetrical to each other are defined as one The first molded body 271a', and the two mutually symmetrical two molded bodies 271' are defined as a second molded body 271b', wherein each of the first molded bodies 271a' and each The second molding bodies 271b' are respectively end to end, and each of the first molding bodies 271a' has a height dimension higher than a height dimension of each of the second molding bodies 271b', thereby The corresponding position of the second molded body 271b' forms the first mounting space 273' between the two first molded bodies 271a'. When the holder 32' is attached to the molding portion 27', the bottom surface of each of the extending arms 3205' of the holder 32' is attached to each of the second molding bodies. a top surface of 271b', a side of each of the extension arms 3205' is attached to a side of each of the first molding bodies 271a' such that each of the extension arms 3205' is mounted to each The first installation space 273'. In other words, each of the first molding bodies 271' can extend to the holder body 3204' of the holder 32', each of the first molding bodies 271a' being extendable to each of the extensions Arm 3205'. The shape of the holder 32' can be matched with the shape of the molding portion 27' so that after the holder 32' is attached to the molding portion 27', the filter member can be 31', the support 32', the molding portion 27' and the substrate 211' form the sealed space 101', or in the filter element 31', the support 32', The sealed space 101' is formed between the molded portion 27' and the photosensitive member 22'.
附图54示出了所述摄像模组100’的另一个变形实施方式,与附图53示出的所述摄像模组100’不同的是,所述支座32’的所述延伸臂3205’设有至少一缺槽3208’,其中在所述支座32’被贴装于所述模塑体271’时,所述缺槽3208’在所述支座32’的所述延伸臂3205’和所述模塑体271’的所述第二模塑体271b’之间形成用于连通所述密封空间101’和所述感光装置1000’的外 部的所述通气通道102’。FIG. 54 shows another modified embodiment of the camera module 100 ′. Unlike the camera module 100 ′ illustrated in FIG. 53 , the extension arm 3205 of the holder 32 ′ 'At least one notch 3208' is provided, wherein when the holder 32' is attached to the molded body 271', the notch 3208' is at the extension arm 3205 of the holder 32' The venting passage 102' for communicating the sealed space 101' and the outside of the photosensitive device 1000' is formed between the second molded body 271b' of the molded body 271'.
值得一提的是,所述支座32’的所述缺槽3208’的位置在本发明的所述摄像模组100’中不受限制,例如所述缺槽3208’可以形成于所述支座32’的所述延伸臂3205’的中部或者转角处均可。It is to be noted that the position of the notch 3208' of the support 32' is not limited in the camera module 100' of the present invention. For example, the notch 3208' may be formed on the branch. The extension arm 3205' of the seat 32' may have a central portion or a corner.
可选地,在所述摄像模组100’的其他的示例中,所述支座32’的所述缺槽3208’也可以在所述支座32’的所述延伸臂3205’和所述基板211’的所述基板正面2111’之间形成用于连通所述密封空间101’和所述感光装置1000’的外部的所述通气通道102’。Optionally, in other examples of the camera module 100', the notch 3208' of the holder 32' may also be in the extension arm 3205' of the holder 32' and the The ventilation passage 102' for communicating the sealed space 101' and the outside of the photosensitive device 1000' is formed between the substrate front surface 2111' of the substrate 211'.
依本发明的另一个方面,本发明进一步提供所述感光装置1000的制造方法,其中所述制造方法包括如下步骤:According to another aspect of the present invention, the present invention further provides a method of manufacturing the photosensitive device 1000, wherein the manufacturing method comprises the following steps:
(a)在将所述支座32贴装于所述模塑基座23时,在所述滤光单元30和所述模塑感光单元20之间形成至少一个所述密封空间101;(a) when the holder 32 is attached to the molding base 23, at least one of the sealed space 101 is formed between the filter unit 30 and the molded photosensitive unit 20;
(b)通过至少一个所述通气通道102连通所述密封空间101和所述感光装置1000的外部;以及(b) communicating the sealed space 101 and the exterior of the photosensitive device 1000 through at least one of the ventilation passages 102;
(c)使所述密封空间101的气体和外部环境的气体经由所述通气通道102相互交换,以平衡所述密封空间101的气压压力和所述感光装置1000的外部的气压压力。(c) The gas of the sealed space 101 and the atmosphere of the external environment are exchanged with each other via the vent passage 102 to balance the atmospheric pressure of the sealed space 101 and the atmospheric pressure of the outside of the photosensitive device 1000.
值得一提的是,所述通气通道102可以形成于所述支座32,或者所述通气通道102可以形成于所述模塑基座23,或者所述通气通道102可以形成于所述支座32和所述模塑基座23之间,或者所述通气通道102的一部分形成于所述会做32,另一部分形成于所述模塑基座23。It is worth mentioning that the venting passage 102 may be formed on the support 32, or the venting passage 102 may be formed on the molded base 23, or the venting passage 102 may be formed in the support Between 32 and the molded base 23, or a portion of the venting passage 102 is formed in the portion 32, and another portion is formed in the molded base 23.
依本发明的另一个方面,本发明进一步提供所述摄像模组100的制造方法,其中所述制造方法包括如下步骤:According to another aspect of the present invention, the present invention further provides a method of manufacturing the camera module 100, wherein the manufacturing method includes the following steps:
(A)在将所述支座32贴装于所述模塑基座23时,在所述滤光单元30和所述模塑感光单元20之间形成至少一个所述密封空间101;(A) when the holder 32 is attached to the molding base 23, at least one of the sealed spaces 101 is formed between the filter unit 30 and the molded photosensitive unit 20;
(B)通过至少一个所述通气通道102连通所述密封空间101和所述感光装置1000的外部;(B) communicating the sealed space 101 and the outside of the photosensitive device 1000 through at least one of the ventilation passages 102;
(C)使所述密封空间101的气体和外部环境的气体经由所述通气通道102相互交换,以平衡所述密封空间101的气压压力和所述感光装置1000的外部的气压压力;以及(C) exchanging the gas of the sealed space 101 and the atmosphere of the external environment via the vent passage 102 to balance the atmospheric pressure of the sealed space 101 and the pressure of the outside of the photosensitive device 1000;
(D)将所述光学镜头10保持在所述模塑感光单元20的所述感光元件22的感光路径上。(D) The optical lens 10 is held on the photosensitive path of the photosensitive member 22 of the molded photosensitive unit 20.
本领域的技术人员可以理解的是,以上实施例仅为举例,其中不同实施例的特征可以相互组合,以得到根据本发明揭露的内容很容易想到但是在附图中没有明确指出的实施方式。本领域的技术人员应理解,上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明,在没有背离所述原理下,本发明的实施方式可以有任何变形或修改。Those skilled in the art can understand that the above embodiments are merely examples, and the features of the different embodiments may be combined with each other to obtain an embodiment which is easily conceived according to the disclosure of the present invention but is not explicitly indicated in the drawings. Those skilled in the art should understand that the embodiments of the present invention described in the above description and the accompanying drawings are only by way of illustration and not limitation. The object of the invention has been achieved completely and efficiently. The present invention has been shown and described with respect to the embodiments of the present invention, and the embodiments of the present invention may be modified or modified without departing from the principles.

Claims (89)

  1. 一摄像模组,其特征在于,包括至少一光学镜头和至少一感光装置,其中所述感光装置包括:A camera module, comprising: at least one optical lens and at least one photosensitive device, wherein the photosensitive device comprises:
    至少一滤光单元,其中所述滤光单元包括至少一支座和至少一滤光元件,所述支座具有至少一通光通道,所述滤光元件被贴装于所述支座,并且所述支座的所述通光通道对应于所述滤光元件;和At least one filter unit, wherein the filter unit comprises at least one seat and at least one filter element, the holder has at least one light passage, the filter element is mounted on the support, and The light passage of the holder corresponds to the filter element; and
    至少一模塑感光单元,其中所述模塑感光单元进一步包括:At least one molded photosensitive unit, wherein the molded photosensitive unit further comprises:
    至少一电路板,其中所述电路板包括至少一基板;At least one circuit board, wherein the circuit board includes at least one substrate;
    至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域四周的一非感光区域,其中所述感光元件被导通地连接于所述基板;以及At least one photosensitive member, wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
    至少一模塑基座,其中所述模塑基座具有至少一光窗,所述模塑基座一体地结合于所述基板,并且所述模塑基座环绕在所述感光元件的所述感光区域的四周,和所述感光元件的所述感光区域对应于所述模塑基座的所述光窗,其中所述支座被贴装于所述模塑基座的顶表面,并且在所述滤光单元和所述模塑感光单元之间形成至少一密封空间,所述感光元件的所述感光区域被保持在所述密封空间,其中所述光学镜头被保持在所述感光元件的感光路径,和所述滤光元件被保持在所述光学镜头和所述感光元件之间;At least one molded base, wherein the molded base has at least one light window, the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member a periphery of the photosensitive region, and the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein the holder is attached to a top surface of the molded base, and Forming at least one sealed space between the filter unit and the molded photosensitive unit, the photosensitive region of the photosensitive member being held in the sealed space, wherein the optical lens is held at the photosensitive element a photosensitive path, and the filter element is held between the optical lens and the photosensitive element;
    其中所述感光装置具有至少一通气通道,所述通气通道用于连通所述密封空间和所述感光装置的外部,其中在所述感光装置被制造的过程中,所述通气通道用于使所述密封空间的内部的气体和所述感光装置的外部的气体交换,以平衡所述密封空间的内部的气压和所述感光装置的外部的气压。Wherein the photosensitive device has at least one venting passage for communicating the sealed space and the exterior of the photosensitive device, wherein the venting passage is used to make the venting passage during manufacture of the photosensitive device The gas inside the sealed space and the gas outside the photosensitive device are exchanged to balance the air pressure inside the sealed space and the air pressure outside the photosensitive device.
  2. 根据权利要求1所述的摄像模组,其中所述通气通道形成于所述支座;或者所述通气通道形成于所述模塑基座;或者所述通气通道形成于所述支座和所述模塑基座之间;或者所述通气通道的一部分形成于所述支座,另一部分形成于所述模塑基座和所述支座之间。The camera module according to claim 1, wherein the venting passage is formed in the holder; or the venting passage is formed in the molded base; or the venting passage is formed in the holder and the seat Between the molded pedestals; or a portion of the venting channel is formed in the pedestal and another portion is formed between the molded pedestal and the pedestal.
  3. 根据权利要求1所述的摄像模组,其中所述通气通道弯曲地延伸;或者所述通气通道倾斜地延伸;或者所述通气通道的形状选择:“L”字形、“S”字形、“V”字形或者“Y”字形组成的形状组。The camera module according to claim 1, wherein the ventilation passage is curvedly extended; or the ventilation passage is obliquely extended; or the shape of the ventilation passage is selected: "L" shape, "S" shape, "V" A group of shapes consisting of a glyph or a "Y" shape.
  4. 根据权利要求1所述的摄像模组,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通气孔以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述通气孔自所述上表面向所述下表面方向延伸,所述通气槽形成于所述下表面,并且所述通气槽自所述内侧面向所述外侧面方向延伸,其中所述通气孔和所述通气槽相互连通以形成所述感光装置的所述通气通道。The camera module according to claim 1, wherein the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one vent hole, and at least one venting groove, wherein the upper surface and the lower portion The surfaces correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side defining The light passage, wherein the vent hole extends from the upper surface toward the lower surface, the vent groove is formed on the lower surface, and the vent groove faces the outer side direction from the inner side Extending, wherein the venting opening and the venting groove communicate with each other to form the venting passage of the photosensitive device.
  5. 根据权利要求4所述的摄像模组,其中所述通气孔的延伸方向和所述通气槽的延伸方向相互垂直。The camera module according to claim 4, wherein an extending direction of the vent hole and an extending direction of the vent groove are perpendicular to each other.
  6. 根据权利要求4所述的摄像模组,其中一个所述通气孔和一个所述通气槽相互连通以形成所述感光装置的所述通气通道;或者多个所述通气孔和一个所述通气槽相互连通以形成所述感光装置的所述通气通道;或者一个所述通气孔和多个所述通气槽相互连通以形成所述感光装置的所述通气通道。The camera module according to claim 4, wherein one of said vent holes and one of said venting grooves communicate with each other to form said venting passage of said photosensitive device; or said plurality of vent holes and one of said venting grooves Interconnecting to form the venting passage of the photosensitive device; or one of the venting holes and the plurality of venting grooves communicating with each other to form the venting passage of the photosensitive device.
  7. 根据权利要求4所述的摄像模组,其中所述通气槽呈阶梯状。The camera module according to claim 4, wherein the venting groove is stepped.
  8. 根据权利要求4所述的摄像模组,其中设所述支座的所述通气槽的深度尺寸的参数为h1,其中所述通气槽的深度尺寸的参数h1的取值范围是:h1≥0.1mm。The camera module according to claim 4, wherein the parameter of the depth dimension of the venting groove of the pedestal is h1, wherein the parameter h1 of the depth dimension of the venting groove has a value range of: h1 ≥ 0.1 Mm.
  9. 根据权利要求4所述的摄像模组,其中设所述支座的所述通气槽的深度尺寸的参数为h1,设所述支座的厚度尺寸的参数为H,其中所述通气槽的深度尺寸的参数h1和所述支座的厚度尺寸的参数H的比值的取值范围是:0.5%~70%。The camera module according to claim 4, wherein a parameter of a depth dimension of the venting groove of the pedestal is h1, and a parameter of a thickness dimension of the pedestal is H, wherein a depth of the venting groove The ratio of the parameter h1 of the dimension to the parameter H of the thickness dimension of the support is in the range of 0.5% to 70%.
  10. 根据权利要求4所述的摄像模组,其中所述支座的所述通气槽具有一开口端和对应于所述开口端的一连通端,其中将所述通气槽的所述连通端的部分定义为一第一通气槽,将所述通气槽的所述开口端的部分定义为一第二通气槽,从而所述第一通气槽分别连通所述第二通气槽和所述通气孔,并且所述第二通气槽连通所述密封空间,其中所述第一通气槽的深度尺寸大于所述第二通气槽的深度尺寸。The camera module according to claim 4, wherein said venting groove of said holder has an open end and a communicating end corresponding to said open end, wherein a portion of said communicating end of said venting groove is defined as a first venting groove defining a portion of the open end of the venting groove as a second venting groove, such that the first venting groove communicates with the second venting groove and the venting hole, respectively, and the first venting groove The second venting groove communicates with the sealed space, wherein a depth dimension of the first venting groove is greater than a depth dimension of the second venting groove.
  11. 根据权利要求10所述的摄像模组,其中所述支座的所述第一通气槽的深度尺寸为0.1mm,所述支座的所述第二通气槽的深度尺寸为0.03mm。The camera module according to claim 10, wherein the first venting groove of the holder has a depth dimension of 0.1 mm, and the second venting groove of the holder has a depth dimension of 0.03 mm.
  12. 根据权利要求10所述的摄像模组,其中设所述支座的所述第一通气槽 的宽度尺寸的参数为W,设所述通气孔的低端的直径尺寸的参数为R,其中所述支座的所述第一通气槽的宽度尺寸与所述通气孔的低端的直径尺寸的比值的取值范围是:2:1~1:1。The camera module of claim 10, wherein the parameter of the width dimension of the first venting groove of the support is W, and the parameter of the diameter of the low end of the vent is R, wherein The ratio of the width dimension of the first venting groove of the support to the diameter dimension of the lower end of the vent hole ranges from 2:1 to 1:1.
  13. 根据权利要求1所述的摄像模组,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述通气槽形成于所述下表面,并且所述通气槽自所述内侧面延伸至所述外侧面,其中在所述支座的所述下表面被贴装于所述模塑基座的所述顶表面后,所述通气槽在所述支座和所述模塑基座之间形成所述感光装置的所述通气通道。The camera module of claim 1 , wherein the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage a passage, wherein the vent groove is formed on the lower surface, and the vent groove extends from the inner side to the outer side, wherein the lower surface of the pedestal is attached to the molding After the top surface of the pedestal, the venting groove forms the venting passage of the photosensitive device between the holder and the molded base.
  14. 根据权利要求13所述的摄像模组,其中所述通气槽弯曲地延伸。The camera module of claim 13 wherein said venting groove extends in a curved manner.
  15. 根据权利要求13所述的摄像模组,其中所述通气槽的形状选自:“L”字形、“S”字形、“V”字形以及“Y”字形组成的形状组。The camera module according to claim 13, wherein the shape of the vent groove is selected from the group consisting of an "L" shape, an "S" shape, a "V" shape, and a "Y" shape.
  16. 根据权利要求13所述的摄像模组,其中所述支座具有至少一第一凹槽和至少一第二凹槽,所述第一凹槽自所述支座的所述内侧面向所述外侧面方向延伸,所述第二凹槽自所述支座的所述外侧面向所述内侧面方向延伸,并且所述第一凹槽和所述第二凹槽相互连通以形成所述支座的所述凹槽。The camera module according to claim 13, wherein the holder has at least one first groove and at least one second groove, the first groove facing the outer side from the inner side of the holder Extending in a lateral direction, the second groove extends from the outer side of the seat toward the inner side direction, and the first groove and the second groove communicate with each other to form the seat The groove.
  17. 根据权利要求16所述的摄像模组,其中所述支座的所述第一凹槽的延伸方向和所述第二凹槽的延伸方向具有夹角。The camera module according to claim 16, wherein an extending direction of the first groove of the holder and an extending direction of the second groove have an angle.
  18. 根据权利要求16所述的摄像模组,其中一个所述第一凹槽和一个所述第二凹槽相互连通以形成所述支座的所述凹槽;或者多个所述第一凹槽和一个所述第二凹槽相互连通以形成所述支座的所述凹槽;或者一个所述第一凹槽和多个所述第二凹槽相互连通以形成所述支座的所述凹槽。The camera module according to claim 16, wherein one of said first groove and said second groove communicate with each other to form said groove of said holder; or said plurality of said first groove And the one of the second grooves communicating with each other to form the groove of the holder; or the one of the first groove and the plurality of the second grooves communicating with each other to form the holder Groove.
  19. 根据权利要求1所述的摄像模组,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述下表面的靠近所述光窗的区域被界定为一非画胶区域,和所述下表面的远离所述光窗的区域被界定为环绕所述非画胶区域的一画胶区域,其中所述 通气槽形成于所述下表面,并且所述通气槽自所述外侧面经由所述画胶区域延伸至所述非画胶区域的适当位置,其中在所述支座的所述下表面的所述画胶区域被贴装于所述模塑基座的所述顶表面后,所述通气槽在所述支座的所述下表面和所述模塑基座的所述顶表面之间形成所述感光装置的所述通气通道。The camera module of claim 1 , wherein the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage a channel, wherein a region of the lower surface adjacent to the light window is defined as a non-painting region, and a region of the lower surface remote from the light window is defined as a painting surrounding the non-painting region a glue region, wherein the venting groove is formed on the lower surface, and the venting groove extends from the outer side surface via the glue region to a suitable position of the non-painting region, wherein the pedestal The glue area of the lower surface is attached to the top surface of the molding base, the venting groove is at the lower surface of the holder and the molded base Forming the photosensitive device between the top surfaces Vent channel.
  20. 根据权利要求1所述的摄像模组,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述下表面的靠近所述光窗的区域被界定为一非画胶区域,和所述下表面的远离所述光窗的区域被界定为环绕所述非画胶区域的一画胶区域,其中所述通气孔自所述支座的所述上表面延伸至所述下表面的所述非画胶区域,其中所述支座的所述下表面的所述画胶区域被贴装于所述模塑基座的所述顶表面,所述支座的所述通气孔形成所述感光装置的所述通气通道。The camera module according to claim 1, wherein the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other. The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be connected to the upper surface and the lower surface, the inner side surface defining the light passage passage Wherein the area of the lower surface adjacent to the light window is defined as a non-painting area, and the area of the lower surface remote from the light window is defined as a glue surrounding the non-painting area a region, wherein the vent hole extends from the upper surface of the holder to the non-paint area of the lower surface, wherein the glue area of the lower surface of the holder is mounted The venting opening of the holder forms the venting passage of the photosensitive device on the top surface of the molded base.
  21. 根据权利要求1所述的摄像模组,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述通气槽形成于所述支座的所述上表面,并且所述通气槽自所述内侧面向所述外侧面方向延伸,其中所述滤光元件被贴装于所述支座的所述上表面,并且所述滤光元件使所述通气槽的一部分处于暴露状态,其中在所述支座的所述下表面被贴装于所述模塑基座的所述顶表面后,所述支座的所述通气槽在所述滤光元件和所述支座之间形成所述感光装置的所述通气通道。The camera module of claim 1 , wherein the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage a passage, wherein the vent groove is formed on the upper surface of the holder, and the vent groove extends from the inner side toward the outer side direction, wherein the filter element is attached to the holder The upper surface, and the filter element exposes a portion of the venting groove to an exposed state, wherein the lower surface of the pedestal is attached to the top surface of the molded pedestal The venting groove of the holder forms the venting passage of the photosensitive device between the filter element and the holder.
  22. 根据权利要求1所述的摄像模组,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述上表面的靠近所述光窗的区域被界定为一上表面内侧,和所述上表面的远离所述光窗的区域被界定为环绕在所述上表面内侧四周的一上表面外侧,其中所述内侧面具有一内侧面上侧和一内侧面下侧,所述内侧面上侧分别向上和向下延伸以连接于所述上表面外侧和所述上表面内侧,所述内侧面下侧分别向上 和向下延伸以连接于所述上表面内侧和所述下表面,其中所述通气槽被设于所述上表面内侧,并且所述通气槽自所述内侧面下侧延伸至所述内侧面上侧,其中所述滤光元件被贴装于所述支座的所述上表面内侧,并且在所述滤光元件的侧壁和所述内侧面上侧之间形成一缝隙,所述支座的所述通气槽和所述缝隙相互连通以形成所述感光装置的所述通气通道,其中所述支座的所述下表面被贴装于所述模塑基座的所述顶表面。The camera module of claim 1 , wherein the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein the upper surface and the lower surface correspond to each other, The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage a channel, wherein a region of the upper surface adjacent to the light window is defined as an inner side of an upper surface, and a region of the upper surface remote from the light window is defined to surround an area around an inner side of the upper surface An outer side surface, wherein the inner side surface has an inner side surface side and an inner side surface lower side, the inner side surface sides respectively extending upward and downward to be coupled to the outer side of the upper surface and the inner side of the upper surface, The lower side of the inner side surface respectively extends upward and downward to be connected to the inner side of the upper surface and the lower surface, wherein the venting groove is provided inside the upper surface, and the venting groove is from the lower side of the inner side extend The inner side surface, wherein the filter element is attached to the inner side of the upper surface of the holder, and a gap is formed between the side wall of the filter element and the side of the inner side surface The venting groove of the holder and the slit communicate with each other to form the venting passage of the photosensitive device, wherein the lower surface of the holder is attached to the molded base The top surface.
  23. 根据权利要求1所述的摄像模组,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述上表面的靠近所述光窗的区域被界定为一上表面内侧,和所述上表面的远离所述光窗的区域被界定为环绕在所述上表面内侧四周的一上表面外侧,其中所述内侧面具有一内侧面上侧和一内侧面下侧,所述内侧面上侧分别向上和向下延伸以连接于所述上表面外侧和所述上表面内侧,所述内侧面下侧分别向上和向下延伸以连接于所述上表面内侧和所述下表面,其中所述通气孔自所述上表面内侧延伸至所述下表面,其中所述滤光元件被贴装于所述支座的所述上表面内侧,并且在所述滤光元件的侧壁和所述内侧面上侧之间形成一缝隙,所述支座的所述通气孔和所述缝隙相互连通以形成所述感光装置的所述通气通道,其中所述支座的所述下表面被贴装于所述模塑基座的所述顶表面。The camera module according to claim 1, wherein the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other. The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be connected to the upper surface and the lower surface, the inner side surface defining the light passage passage Wherein the area of the upper surface adjacent to the light window is defined as an inner side of the upper surface, and the area of the upper surface remote from the light window is defined as an upper surface surrounding the inner side of the upper surface The outer side, wherein the inner side has an inner side face and an inner side lower side, the inner side faces respectively extending upward and downward to be coupled to the outer side of the upper surface and the inner side of the upper surface, the inner side Side undersides extend upwardly and downwardly to connect to an inner side of the upper surface and the lower surface, wherein the vent extends from an inner side of the upper surface to the lower surface, wherein the filter element is mounted to a slit is formed inside the upper surface of the holder, and a gap is formed between the side wall of the filter element and the side of the inner side surface, and the vent hole and the slit of the holder communicate with each other to The venting passage of the photosensitive device is formed, wherein the lower surface of the holder is attached to the top surface of the molding base.
  24. 根据权利要求1所述的摄像模组,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通气槽以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述上表面的靠近所述光窗的区域被界定为一上表面内侧,和所述上表面的远离所述光窗的区域被界定为环绕在所述上表面内侧四周的一上表面外侧,其中所述内侧面具有一内侧面上侧和一内侧面下侧,所述内侧面上侧分别向上和向下延伸以连接于所述上表面外侧和所述上表面内侧,所述内侧面下侧分别向上和向下延伸以连接于所述上表面内侧和所述下表面,其中所述通气槽自所述上表面外侧延伸至所述上表面内侧,所述通气孔自所述上表面内侧延伸至所述下表面,并且所述通气孔和所述通气槽相互连通以形成所述感光装置的 所述通气通道,其中所述滤光元件被贴装于所述支座的所述上表面内侧,所述支座的所述下表面被贴装于所述模塑基座的所述顶表面。The camera module of claim 1 , wherein the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one venting groove, and at least one venting hole, wherein the upper surface and the lower surface The surfaces correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side defining The light passage, wherein a region of the upper surface adjacent to the light window is defined as an inner side of the upper surface, and a region of the upper surface remote from the light window is defined to surround the inner surface of the upper surface An outer side of an upper surface, wherein the inner side has an inner side and an inner side lower side, the inner side sides extending upward and downward, respectively, to be coupled to the outer surface and the upper surface An inner side, the lower side of the inner side surface respectively extending upward and downward to be connected to the inner side of the upper surface and the lower surface, wherein the venting groove extends from an outer side of the upper surface to an inner side of the upper surface, the through a vent extending from an inner side of the upper surface to the lower surface, and the vent hole and the venting groove communicate with each other to form the venting passage of the photosensitive device, wherein the filter element is attached to the Inside the upper surface of the holder, the lower surface of the holder is attached to the top surface of the molded base.
  25. 根据权利要求1所述的摄像模组,其中所述支座包括一基座贴装部、一连接部以及一滤光片贴装部,所述连接部分别向上和向下延伸以连接于所述基座贴装部和所述滤光片贴装部,所述滤光片贴装部界定所述通光通道,所述滤光元件被贴装于所述支座的所述滤光片贴装部,并且在所述滤光元件的外壁和所述连接部之间形成一缝隙,其中所述支座的所述基座贴装部被贴装于所述模塑基座的所述顶表面,并且所述滤光片贴装部被保持在所述模塑基座的所述光窗,以使所述模塑基座环绕在所述支座的所述滤光片贴装部,其中所述支座具有至少一通光孔,其中所述通光孔自所述滤光片贴装部的上表面延伸至下表面,并且所述通光孔在所述滤光片贴装部的上表面连通所述缝隙,以形成所述感光装置的所述通气通道。The camera module of claim 1 , wherein the holder comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the camera a susceptor mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter of the holder a mounting portion, and forming a slit between the outer wall of the filter element and the connecting portion, wherein the pedestal mounting portion of the holder is attached to the molded base a top surface, and the filter mounting portion is held by the light window of the molding base such that the molding base surrounds the filter mounting portion of the holder Wherein the holder has at least one light passing hole, wherein the light passing hole extends from an upper surface to a lower surface of the filter mounting portion, and the light passing hole is in the filter mounting portion The upper surface communicates with the slit to form the venting passage of the photosensitive device.
  26. 根据权利要求1所述的摄像模组,其中所述支座包括一基座贴装部、一连接部以及一滤光片贴装部,所述连接部分别向上和向下延伸以连接于所述基座贴装部和所述滤光片贴装部,所述滤光片贴装部界定所述通光通道,所述滤光元件被贴装于所述支座的所述滤光片贴装部,所述支座的所述基座贴装部被贴装于所述模塑基座的所述顶表面,并且所述滤光片贴装部被保持在所述模塑基座的所述光窗,以使所述模塑基座环绕在所述支座的所述滤光片贴装部,其中在所述模塑基座的基座内表面和所述支座的所述连接部之间形成一缝隙,其中所述支座具有至少一通光孔,其中所述通光孔自所述基座贴装部的上表面延伸至下表面,并且所述通光孔在所述基座贴装部的下表面连通所述缝隙,以形成所述感光装置的所述通气通道。The camera module of claim 1 , wherein the holder comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the camera a susceptor mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter of the holder a mounting portion, the pedestal mounting portion of the holder is attached to the top surface of the molding base, and the filter mounting portion is held on the molding base The light window is such that the molded base surrounds the filter mounting portion of the holder, wherein the inner surface of the base of the molded base and the holder are Forming a gap between the connecting portions, wherein the holder has at least one light passing hole, wherein the light passing hole extends from an upper surface to a lower surface of the base mounting portion, and the light passing hole is in the A lower surface of the susceptor mounting portion communicates with the slit to form the venting passage of the photosensitive device.
  27. 根据权利要求1所述的摄像模组,其中所述支座包括一基座贴装部、一连接部以及一滤光片贴装部,所述连接部分别向上和向下延伸以连接于所述基座贴装部和所述滤光片贴装部,所述滤光片贴装部界定所述通光通道,所述滤光元件被贴装于所述支座的所述滤光片贴装部,并且在所述滤光元件的外壁和所述连接部之间形成一缝隙,所述支座的所述基座贴装部被贴装于所述模塑基座的所述顶表面,并且所述滤光片贴装部被保持在所述模塑基座的所述光窗,以使所述模塑基座环绕在所述支座的所述滤光片贴装部,其中在所述模塑基座的基座内表面和所述支座的所述连接部之间形成另一缝隙,其中所述支座具有至少一通光孔, 所述通光孔自所述连接部的一侧延伸至另一侧,以分别连通形成于所述滤光元件的外壁和所述连接部之间的所述缝隙和形成于所述模塑基座的基座内表面和所述滤光元件的外壁之间的所述缝隙,从而形成所述感光装置的所述通气通道。The camera module of claim 1 , wherein the holder comprises a base mounting portion, a connecting portion and a filter mounting portion, the connecting portions respectively extending upward and downward to be connected to the camera a susceptor mounting portion and the filter mounting portion, the filter mounting portion defining the light passing passage, the filter element being attached to the filter of the holder a mounting portion, and forming a slit between the outer wall of the filter element and the connecting portion, the pedestal mounting portion of the holder being attached to the top of the molded base a surface, and the filter mounting portion is held by the light window of the molding base such that the molding base surrounds the filter mounting portion of the holder, Wherein another gap is formed between the inner surface of the base of the molded base and the connecting portion of the holder, wherein the holder has at least one light passing hole, and the light passing hole is connected to the light One side of the portion extends to the other side to respectively communicate the gap formed between the outer wall of the filter element and the connecting portion and formed in the The vent passage gap between the outer wall of the inner surface of the plastic base of the filter element and the base, thereby forming the photosensitive device.
  28. 根据权利要求1所述的摄像模组,其中所述模塑基座的所述顶表面具有至少一通气槽,所述通气槽自所述模塑基座的基座内表面延伸至基座外表面,以连通所述光窗和外部,其中在所述支座被贴装于所述模塑基座的所述顶表面后,所述通气槽在所述支座和所述模塑基座的所述顶表面之间形成所述感光装置的所述通气通道。The camera module according to claim 1, wherein said top surface of said molded base has at least one venting groove extending from said inner surface of said base of said molded base to outside said base a surface to communicate the light window and the exterior, wherein the venting groove is at the holder and the molded base after the holder is attached to the top surface of the molding base The venting passage of the photosensitive device is formed between the top surfaces.
  29. 根据权利要求28所述的摄像模组,其中所述模塑基座的所述通气槽弯曲地延伸。The camera module of claim 28, wherein the venting groove of the molded base extends in a curved manner.
  30. 根据权利要求28所述的摄像模组,其中所述模塑基座的所述通气槽的形状选自:“L”字形、“S”字形、“V”字形以及“Y”字形组成的形状组。The camera module according to claim 28, wherein said vent groove of said molded base has a shape selected from the group consisting of: an "L" shape, an "S" shape, a "V" shape, and a shape of "Y" shape. group.
  31. 根据权利要求28所述的摄像模组,其中所述模塑基座具有至少一第一凹槽和至少一第二凹槽,所述第一凹槽自所述模塑基座的所述基座内表面向所述基板外表面方向延伸,所述第二凹槽自所述模塑基座的所述基座外表面向所述基座内表面方向延伸,并且所述第一凹槽和所述第二凹槽相互连通以形成所述模塑基座的所述凹槽。The camera module according to claim 28, wherein said molding base has at least one first groove and at least one second groove, said first groove being from said base of said molded base The inner surface of the seat extends toward the outer surface of the substrate, the second groove extends from the outer surface of the base of the molded base toward the inner surface of the base, and the first groove and the The second grooves communicate with each other to form the grooves of the molded base.
  32. 根据权利要求31所述的摄像模组,其中一个所述第一凹槽和一个所述第二凹槽相互连通以形成所述模塑基座的所述凹槽;或者一个所述第一凹槽和多个所述第二凹槽相互连通以形成所述模塑基座的所述凹槽;或者多个所述第一凹槽和一个所述第一凹槽相互连通以形成所述模塑基座的所述凹槽。The camera module according to claim 31, wherein one of said first recess and said second recess communicate with each other to form said recess of said molded base; or one of said first recess a groove and a plurality of the second grooves communicate with each other to form the groove of the molded base; or a plurality of the first grooves and one of the first grooves communicate with each other to form the mold The groove of the plastic base.
  33. 根据权利要求1所述的摄像模组,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述通气孔自所述支座的所述上表面延伸至所述下表面,其中所述模塑基座的所述顶表面具有至少一通气槽,所述通气槽自所述模塑基座的基座内表面向基座外表面方向延伸至适当位置,其中在所述支座的所述下表面被贴装于所述模塑基座的所述顶表面后,所述支座的所述通气孔和所述模塑基座的所述通气槽相互连通以形成所述感光装置的所述通气通道。The camera module according to claim 1, wherein the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other. The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be connected to the upper surface and the lower surface, and the vent hole is from the support The upper surface extends to the lower surface, wherein the top surface of the molded base has at least one venting groove from the inner surface of the base of the molded base to the outer surface of the base The direction extends to a position where the venting opening of the holder and the molded base are after the lower surface of the holder is attached to the top surface of the molding base The venting grooves communicate with each other to form the venting passage of the photosensitive device.
  34. 根据权利要求33所述的摄像模组,其中所述模塑基座具有一第一凹槽和一第二凹槽,所述第一凹槽分别连通所述第二凹槽和所述通气孔,所述第二凹槽连通所述密封空间,其中所述第一凹槽的深度尺寸大于所述第二凹槽的深度尺寸。The camera module of claim 33, wherein the molding base has a first groove and a second groove, the first groove respectively communicating the second groove and the vent The second groove communicates with the sealed space, wherein a depth dimension of the first groove is greater than a depth dimension of the second groove.
  35. 根据权利要求1至34中任一所述的摄像模组,进一步包括至少一密封元件,所述密封元件形成于和被保持在所述通气通道。The camera module according to any one of claims 1 to 34, further comprising at least one sealing member formed and held in the ventilation passage.
  36. 根据权利要求1至35中任一所述的摄像模组,其中所述基板具有一基板正面、一基板背面以及至少一容纳空间,其中所述基板正面和所述基板背面相互对应,所述容纳空间自所述基板正面向所述基板背面方向延伸,其中所述感光装置被容纳于所述容纳空间。The camera module according to any one of claims 1 to 35, wherein the substrate has a substrate front surface, a substrate back surface, and at least one receiving space, wherein the substrate front surface and the substrate back surface correspond to each other, and the housing A space extends from a front surface of the substrate toward a back surface of the substrate, wherein the photosensitive device is housed in the receiving space.
  37. 根据权利要求1至35中任一所述的摄像模组,其中所述基板具有一基板正面、一基板背面以及至少一容纳空间,其中所述基板正面和所述基板背面相互对应,所述容纳空间自所述基板正面延伸至所述基板背面,以连通所述基板正面和所述基板背面,其中所述感光元件的所述非感光区域被贴装于所述基板的所述基板背面,并且所述基板环绕在所述感光元件的所述感光区域的四周,以使所述感光元件的所述感光区域对应于所述基板的所述容纳空间。The camera module according to any one of claims 1 to 35, wherein the substrate has a substrate front surface, a substrate back surface, and at least one receiving space, wherein the substrate front surface and the substrate back surface correspond to each other, and the housing a space extending from a front surface of the substrate to a back surface of the substrate to communicate the front surface of the substrate and the back surface of the substrate, wherein the non-photosensitive area of the photosensitive member is mounted on a back surface of the substrate of the substrate, and The substrate surrounds the photosensitive region of the photosensitive member such that the photosensitive region of the photosensitive member corresponds to the receiving space of the substrate.
  38. 根据权利要求1至37中任一所述的摄像模组,其中所述模塑基座包埋所述感光元件的所述非感光区域的至少一部分。The camera module according to any one of claims 1 to 37, wherein the molding base embeds at least a portion of the non-photosensitive area of the photosensitive member.
  39. 根据权利要求1至38中任一所述的摄像模组,其中所述电路板包括至少一电子元器件,所述电子元器件被导通地连接于所述基板,其中所述模塑基座包埋凸出于所述基板的所述基板正面的至少一个所述电子元器件的至少一部分。The camera module according to any one of claims 1 to 38, wherein said circuit board comprises at least one electronic component, said electronic component being conductively connected to said substrate, wherein said molded base Embedding at least a portion of at least one of the electronic components protruding from a front surface of the substrate of the substrate.
  40. 一带有摄像模组的电子设备,其特征在于,包括:An electronic device with a camera module, comprising:
    一设备本体;和a device body; and
    根据权利要求1至39中任一所述的至少一个所述摄像模组,其中所述摄像模组被设置于所述设备本体。The at least one camera module according to any one of claims 1 to 39, wherein the camera module is disposed on the device body.
  41. 一摄像模组,其特征在于,包括至少一光学镜头和至少一感光装置,其中所述感光装置包括:A camera module, comprising: at least one optical lens and at least one photosensitive device, wherein the photosensitive device comprises:
    至少一滤光单元,其中所述滤光单元包括至少一支座和至少一滤光元件,其中所述支座具有至少一通光通道、至少一通气通道以及至少一第二通光空间,所述通光通道和所述通气通道分别连通所述第二通光空间,所述滤光元件被贴装于 所述支座,并且所述支座的所述通光通道对应于所述滤光元件;和At least one filter unit, wherein the filter unit includes at least one seat and at least one filter element, wherein the support has at least one light passage, at least one ventilation passage, and at least one second light passage space, a light passing passage and the venting passage respectively communicate with the second light passing space, the filter element is attached to the pedestal, and the light passing passage of the pedestal corresponds to the filter element ;with
    至少一模塑感光单元,其中所述模塑感光单元进一步包括:At least one molded photosensitive unit, wherein the molded photosensitive unit further comprises:
    至少一电路板,其中所述电路板包括至少一基板;At least one circuit board, wherein the circuit board includes at least one substrate;
    至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域四周的一非感光区域,其中所述感光元件被导通地连接于所述基板;以及At least one photosensitive member, wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
    至少一模塑部,其中所述模塑部包括至少一模塑体和具有至少一第一通光空间,所述模塑体一体地结合于所述基板,并且所述模塑体形成至少所述第一通光空间,其中所述支座被贴装于所述模塑体,以使所述第一通光空间和所述第二通光空间相互连通而在所述滤光单元和所述模塑感光单元之间形成至少一密封空间,所述支座的所述通气通道用于连通所述密封空间和所述感光装置的外部,其中所述感光元件的所述感光区域被保持在所述密封空间,其中所述光学镜头被保持在所述感光元件的感光路径,所述滤光元件被保持在所述光学镜头和所述感光元件之间。At least one molding portion, wherein the molding portion includes at least one molding body and has at least one first light passing space, the molding body is integrally bonded to the substrate, and the molding body forms at least a first light-passing space, wherein the holder is attached to the molded body such that the first light-passing space and the second light-passing space communicate with each other at the filter unit and the Forming at least one sealed space between the molded photosensitive units, the venting passage of the holder for communicating the sealed space and the outside of the photosensitive device, wherein the photosensitive region of the photosensitive member is held at The sealed space in which the optical lens is held in a photosensitive path of the photosensitive element, and the filter element is held between the optical lens and the photosensitive element.
  42. 根据权利要求41所述的摄像模组,其中所述支座包括一支座主体和一体地延伸于所述支座主体的至少一延伸臂,在所述支座主体和所述延伸臂之间形成所述第二通光空间,所述通光通道形成于所述支座主体,所述通气通道形成于所述延伸臂,其中所述支座的所述延伸臂被贴装于所述模塑部的所述模塑体。The camera module according to claim 41, wherein said holder comprises a seat body and at least one extension arm integrally extending from said holder body, between said holder body and said extension arm Forming the second light passing space, the light passing passage is formed in the holder body, the ventilation passage is formed in the extension arm, wherein the extension arm of the holder is attached to the mold The molded body of the plastic part.
  43. 根据权利要求41所述的摄像模组,其中所述支座包括至少一支座主体和一体地延伸于所述支座主体的至少一延伸臂,在所述支座主体和所述延伸臂之间形成所述第二通光空间和连通于所述第二通光空间的至少一第二安装空间,所述通光通道形成于所述支座主体,所述通气通道形成于所述延伸臂,其中在相邻所述模塑体之间形成至少一第一安装空间,其中在所述支座被贴装于所述模塑部时,所述支座的所述延伸臂的至少一部分被保持在所述模塑部的所述第一安装空间,所述模塑体的至少一部分被保持在所述支座的所述第二安装空间,以在所述滤光单元和所述模塑感光单元之间形成所述密封空间。The camera module according to claim 41, wherein said holder comprises at least one seat body and at least one extension arm integrally extending from said holder body, at said holder body and said extension arm Forming the second light-passing space and at least one second installation space communicating with the second light-passing space, the light-passing passage is formed in the support body, and the ventilation passage is formed on the extension arm Forming at least one first installation space between adjacent molding bodies, wherein at least a portion of the extension arm of the holder is when the holder is attached to the molding portion Holding in the first installation space of the molding portion, at least a portion of the molding body is held in the second mounting space of the holder to be in the filter unit and the molding The sealed space is formed between the photosensitive cells.
  44. 根据权利要求43所述的摄像模组,其中所述模塑体呈“I”字形,所述延伸臂呈“匚”字形;或者所述模塑体呈“匚”字形,所述延伸臂呈“I”字形;或者所述模塑体呈“L”字形,所述延伸臂呈“L”字形;或者两个所述模塑体相互对称,两个所述延伸臂相互对称;或者所述模塑体和所述延伸臂均呈“口” 字形。The camera module according to claim 43, wherein the molded body has an "I" shape, the extension arm has a U shape; or the molded body has a U shape, and the extension arm is "I" shape; or the molded body has an "L" shape, the extension arm has an "L" shape; or the two molded bodies are symmetrical to each other, and the two extension arms are symmetrical to each other; or Both the molded body and the extension arm have a "mouth" shape.
  45. 根据权利要求41至44中任一所述的摄像模组,其中所述通气通道倾斜地延伸。The camera module according to any one of claims 41 to 44, wherein the ventilation passage extends obliquely.
  46. 一带有摄像模组的电子设备,其特征在于,包括:An electronic device with a camera module, comprising:
    一设备本体;和a device body; and
    根据权利要求41至45中任一所述的至少一个所述摄像模组,其中所述摄像模组被设置于所述设备本体。The at least one camera module according to any one of claims 41 to 45, wherein the camera module is disposed on the device body.
  47. 一感光装置,其特征在于,包括:A photosensitive device, comprising:
    至少一滤光单元,其中所述滤光单元包括至少一支座和至少一滤光元件,所述支座具有至少一通光通道,所述滤光元件被贴装于所述支座,并且所述支座的所述通光通道对应于所述滤光元件;和At least one filter unit, wherein the filter unit comprises at least one seat and at least one filter element, the holder has at least one light passage, the filter element is mounted on the support, and The light passage of the holder corresponds to the filter element; and
    至少一模塑感光单元,其中所述模塑感光单元进一步包括:At least one molded photosensitive unit, wherein the molded photosensitive unit further comprises:
    至少一电路板,其中所述电路板包括至少一基板;At least one circuit board, wherein the circuit board includes at least one substrate;
    至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域四周的一非感光区域,其中所述感光元件被导通地连接于所述基板;以及At least one photosensitive member, wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
    至少一模塑基座,其中所述模塑基座具有至少一光窗,所述模塑基座一体地结合于所述基板,并且所述模塑基座环绕在所述感光元件的所述感光区域的四周,和所述感光元件的所述感光区域对应于所述模塑基座的所述光窗,其中所述支座被贴装于所述模塑基座的顶表面,并且在所述滤光单元和所述模塑感光单元之间形成至少一密封空间,所述感光元件的所述感光区域被保持在所述密封空间,所述滤光元件被保持在所述感光元件的感光路径;At least one molded base, wherein the molded base has at least one light window, the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive member a periphery of the photosensitive region, and the photosensitive region of the photosensitive member corresponds to the light window of the molded base, wherein the holder is attached to a top surface of the molded base, and Forming at least one sealed space between the filter unit and the molded photosensitive unit, the photosensitive region of the photosensitive member is held in the sealed space, and the filter element is held at the photosensitive member Photosensitive path
    其中所述感光装置具有至少一通气通道,所述通气通道用于连通所述密封空间和所述感光装置的外部,其中在所述感光装置被制造的过程中,所述通气通道用于使所述密封空间的内部的气体和所述感光装置的外部的气体交换,以平衡所述密封空间的内部的气压和所述感光装置的外部的气压。Wherein the photosensitive device has at least one venting passage for communicating the sealed space and the exterior of the photosensitive device, wherein the venting passage is used to make the venting passage during manufacture of the photosensitive device The gas inside the sealed space and the gas outside the photosensitive device are exchanged to balance the air pressure inside the sealed space and the air pressure outside the photosensitive device.
  48. 根据权利要求47所述的感光装置,其中所述通气通道形成于所述支座;或者所述通气通道形成于所述模塑基座;或者所述通气通道形成于所述支座和所述模塑基座之间;或者所述通气通道的一部分形成于所述支座,另一部分形成于所述模塑基座和所述支座之间。The photosensitive device according to claim 47, wherein said vent passage is formed in said holder; or said vent passage is formed in said molded base; or said vent passage is formed in said holder and said Between the molded pedestals; or a portion of the venting channel is formed in the pedestal and another portion is formed between the molded pedestal and the pedestal.
  49. 根据权利要求47所述的感光装置,其中所述通气通道弯曲地延伸;或者所述通气通道倾斜地延伸;或者所述通气通道的形状选择:“L”字形、“S”字形、“V”字形或者“Y”字形组成的形状组。The photosensitive device according to claim 47, wherein said ventilation passage is curvedly extended; or said ventilation passage is obliquely extended; or the shape of said ventilation passage is selected: "L" shape, "S" shape, "V" A group of shapes consisting of glyphs or "Y" shapes.
  50. 根据权利要求47所述的感光装置,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通气孔以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述通气孔自所述上表面向所述下表面方向延伸,所述通气槽形成于所述下表面,并且所述通气槽自所述内侧面向所述外侧面方向延伸,其中所述通气孔和所述通气槽相互连通以形成所述感光装置的所述通气通道。The photosensitive device according to claim 47, wherein said holder has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one vent hole, and at least one venting groove, wherein said upper surface and said lower surface Corresponding to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be connected to the upper surface and the lower surface, the inner side defining The light passage, wherein the vent hole extends from the upper surface toward the lower surface, the vent groove is formed on the lower surface, and the vent groove extends from the inner side toward the outer side surface Wherein the vent hole and the venting groove communicate with each other to form the venting passage of the photosensitive device.
  51. 根据权利要求50所述的感光装置,其中所述通气孔的延伸方向和所述通气槽的延伸方向相互垂直。The photosensitive device according to claim 50, wherein a direction in which said vent hole extends and a direction in which said vent groove extends are perpendicular to each other.
  52. 根据权利要求50所述的感光装置,其中一个所述通气孔和一个所述通气槽相互连通以形成所述感光装置的所述通气通道;或者多个所述通气孔和一个所述通气槽相互连通以形成所述感光装置的所述通气通道;或者一个所述通气孔和多个所述通气槽相互连通以形成所述感光装置的所述通气通道。The photosensitive device according to claim 50, wherein one of said vent holes and one of said venting grooves communicate with each other to form said venting passage of said photosensitive device; or a plurality of said vent holes and said venting groove are mutually Communicating to form the venting passage of the photosensitive device; or one of the venting holes and the plurality of venting grooves communicate with each other to form the venting passage of the photosensitive device.
  53. 根据权利要求50所述的感光装置,其中所述通气槽呈阶梯状。The photosensitive device according to claim 50, wherein said vent groove is stepped.
  54. 根据权利要求50所述的感光装置,其中设所述支座的所述通气槽的深度尺寸的参数为h1,其中所述通气槽的深度尺寸的参数h1的取值范围是:h1≥0.1mm。The photosensitive device according to claim 50, wherein the parameter of the depth dimension of the venting groove of the holder is h1, wherein the parameter h1 of the depth dimension of the venting groove has a value range of: h1 ≥ 0.1 mm .
  55. 根据权利要求50所述的感光装置,其中设所述支座的所述通气槽的深度尺寸的参数为h1,设所述支座的厚度尺寸的参数为H,其中所述通气槽的深度尺寸的参数h1和所述支座的厚度尺寸的参数H的比值的取值范围是:0.5%~70%。The photosensitive device according to claim 50, wherein a parameter of a depth dimension of said venting groove of said holder is h1, and a parameter of a thickness dimension of said holder is H, wherein a depth dimension of said venting groove The ratio of the parameter h1 to the parameter H of the thickness dimension of the support is in the range of 0.5% to 70%.
  56. 根据权利要求50所述的感光装置,其中所述支座的所述通气槽具有一开口端和对应于所述开口端的一连通端,其中将所述通气槽的所述连通端的部分定义为一第一通气槽,将所述通气槽的所述开口端的部分定义为一第二通气槽,从而所述第一通气槽分别连通所述第二通气槽和所述通气孔,并且所述第二通气槽连通所述密封空间,其中所述第一通气槽的深度尺寸大于所述第二通气槽的深 度尺寸。The photosensitive device according to claim 50, wherein said vent groove of said holder has an open end and a communication end corresponding to said open end, wherein a portion of said communication end of said vent groove is defined as a a first venting groove defining a portion of the open end of the venting groove as a second venting groove, such that the first venting groove communicates with the second venting groove and the venting hole, respectively, and the second venting groove The venting groove communicates with the sealed space, wherein a depth dimension of the first venting groove is greater than a depth dimension of the second venting groove.
  57. 根据权利要求56所述的感光装置,其中所述支座的所述第一通气槽的深度尺寸为0.1mm,所述支座的所述第二通气槽的深度尺寸为0.03mm。The photosensitive device according to claim 56, wherein said first vent groove of said holder has a depth dimension of 0.1 mm, and said second vent groove of said holder has a depth dimension of 0.03 mm.
  58. 根据权利要求56所述的感光装置,其中设所述支座的所述第一通气槽的宽度尺寸的参数为W,设所述通气孔的低端的直径尺寸的参数为R,其中所述支座的所述第一通气槽的宽度尺寸与所述通气孔的低端的直径尺寸的比值的取值范围是:2:1~1:1。The photosensitive device according to claim 56, wherein a parameter of a width dimension of said first venting groove of said holder is W, and a parameter of a diameter dimension of a lower end of said vent hole is R, wherein said The ratio of the width dimension of the first venting groove of the support to the diameter dimension of the lower end of the vent hole ranges from 2:1 to 1:1.
  59. 根据权利要求47所述的感光装置,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述通气槽形成于所述下表面,并且所述通气槽自所述内侧面延伸至所述外侧面,其中在所述支座的所述下表面被贴装于所述模塑基座的所述顶表面后,所述通气槽在所述支座和所述模塑基座之间形成所述感光装置的所述通气通道。The photosensitive device according to claim 47, wherein said holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein said upper surface and said lower surface correspond to each other The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be connected to the upper surface and the lower surface, the inner side surface defining the light passage passage Wherein the venting groove is formed on the lower surface, and the venting groove extends from the inner side surface to the outer side surface, wherein the lower surface of the pedestal is attached to the molding base After the top surface of the seat, the venting groove forms the venting passage of the photosensitive device between the holder and the molded base.
  60. 根据权利要求59所述的感光装置,其中所述通气槽弯曲地延伸。The photosensitive device according to claim 59, wherein said vent groove extends in a curved manner.
  61. 根据权利要求59所述的感光装置,其中所述通气槽的形状选自:“L”字形、“S”字形、“V”字形以及“Y”字形组成的形状组。The photosensitive device according to claim 59, wherein said vent groove has a shape selected from the group consisting of: an "L" shape, an "S" shape, a "V" shape, and a "Y" shape.
  62. 根据权利要求59所述的感光装置,其中所述支座具有至少一第一凹槽和至少一第二凹槽,所述第一凹槽自所述支座的所述内侧面向所述外侧面方向延伸,所述第二凹槽自所述支座的所述外侧面像所述内侧面方向延伸,并且所述第一凹槽和所述第二凹槽相互连通以形成所述支座的所述凹槽。The photosensitive device according to claim 59, wherein said holder has at least one first groove and at least one second groove, said first groove facing said outer side from said inner side of said holder Extending in a direction, the second groove extends from the outer side surface of the holder like the inner side direction, and the first groove and the second groove communicate with each other to form the seat The groove.
  63. 根据权利要求62所述的感光装置,其中所述支座的所述第一凹槽的延伸方向和所述第二凹槽的延伸方向具有夹角。The photosensitive device according to claim 62, wherein an extending direction of said first groove of said holder and an extending direction of said second groove have an included angle.
  64. 根据权利要求62所述的感光装置,其中一个所述第一凹槽和一个所述第二凹槽相互连通以形成所述支座的所述凹槽;或者多个所述第一凹槽和一个所述第二凹槽相互连通以形成所述支座的所述凹槽;或者一个所述第一凹槽和多个所述第二凹槽相互连通以形成所述支座的所述凹槽。The photosensitive device according to claim 62, wherein one of said first groove and said second groove communicate with each other to form said groove of said holder; or a plurality of said first groove and One of the second grooves communicates with each other to form the groove of the holder; or one of the first groove and the plurality of the second grooves communicate with each other to form the concave of the holder groove.
  65. 根据权利要求47所述的感光装置,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相 互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述下表面的靠近所述光窗的区域被界定为一非画胶区域,和所述下表面的远离所述光窗的区域被界定为环绕所述非画胶区域的一画胶区域,其中所述通气槽形成于所述下表面,并且所述通气槽自所述外侧面经由所述画胶区域延伸至所述非画胶区域的适当位置,其中在所述支座的所述下表面的所述画胶区域被贴装于所述模塑基座的所述顶表面后,所述通气槽在所述支座的所述下表面和所述模塑基座的所述顶表面之间形成所述感光装置的所述通气通道。The photosensitive device according to claim 47, wherein said holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein said upper surface and said lower surface correspond to each other The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be connected to the upper surface and the lower surface, the inner side surface defining the light passage passage Wherein the area of the lower surface adjacent to the light window is defined as a non-painting area, and the area of the lower surface remote from the light window is defined as a glue surrounding the non-painting area a region, wherein the venting groove is formed in the lower surface, and the venting groove extends from the outer side surface via the gelatinized region to an appropriate position of the non-painting region, wherein the pedestal is at the seat After the painted area of the lower surface is attached to the top surface of the molded base, the venting groove is on the lower surface of the holder and the molded base Forming the photosensitive device between the top surfaces Vent channel.
  66. 根据权利要求47所述的感光装置,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述下表面的靠近所述光窗的区域被界定为一非画胶区域,和所述下表面的远离所述光窗的区域被界定为环绕所述非画胶区域的一画胶区域,其中所述通气孔自所述支座的所述上表面延伸至所述下表面的所述非画胶区域,其中所述支座的所述下表面的所述画胶区域被贴装于所述模塑基座的所述顶表面,所述支座的所述通气孔形成所述感光装置的所述通气通道。The photosensitive device according to claim 47, wherein said holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein said upper surface and said lower surface correspond to each other, said The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage passage, Wherein the area of the lower surface adjacent to the light window is defined as a non-paint area, and the area of the lower surface remote from the light window is defined as a glue area surrounding the non-paint area Wherein the venting hole extends from the upper surface of the holder to the non-painting area of the lower surface, wherein the glue area of the lower surface of the holder is attached to The top surface of the molded base, the vent of the holder forms the venting passage of the photosensitive device.
  67. 根据权利要求47所述的感光装置,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述通气槽形成于所述支座的所述上表面,并且所述通气槽自所述内侧面向所述外侧面方向延伸,其中所述滤光元件被贴装于所述支座的所述上表面,并且所述滤光元件使所述通气槽的一部分处于暴露状态,其中在所述支座的所述下表面被贴装于所述模塑基座的所述顶表面后,所述支座的所述通气槽在所述滤光元件和所述支座之间形成所述感光装置的所述通气通道。The photosensitive device according to claim 47, wherein said holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein said upper surface and said lower surface correspond to each other The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be connected to the upper surface and the lower surface, the inner side surface defining the light passage passage Wherein the venting groove is formed on the upper surface of the holder, and the venting groove extends from the inner side toward the outer side direction, wherein the filter element is attached to the holder The upper surface, and the filter element exposes a portion of the venting groove, wherein after the lower surface of the pedestal is attached to the top surface of the molded pedestal, The venting groove of the holder forms the venting passage of the photosensitive device between the filter element and the holder.
  68. 根据权利要求47所述的感光装置,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气槽,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通 道,其中所述上表面的靠近所述光窗的区域被界定为一上表面内侧,和所述上表面的远离所述光窗的区域被界定为环绕在所述上表面内侧四周的一上表面外侧,其中所述内侧面具有一内侧面上侧和一内侧面下侧,所述内侧面上侧分别向上和向下延伸以连接于所述上表面外侧和所述上表面内侧,所述内侧面下侧分别向上和向下延伸以连接于所述上表面内侧和所述下表面,其中所述通气槽被设于所述上表面内侧,并且所述通气槽自所述内侧面下侧延伸至所述内侧面上侧,其中所述滤光元件被贴装于所述支座的所述上表面内侧,并且在所述滤光元件的侧壁和所述内侧面上侧之间形成一缝隙,所述支座的所述通气槽和所述缝隙相互连通以形成所述感光装置的所述通气通道,其中所述支座的所述下表面被贴装于所述模塑基座的所述顶表面。The photosensitive device according to claim 47, wherein said holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one venting groove, wherein said upper surface and said lower surface correspond to each other The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be connected to the upper surface and the lower surface, the inner side surface defining the light passage passage Wherein the area of the upper surface adjacent to the light window is defined as an inner side of the upper surface, and the area of the upper surface remote from the light window is defined as an upper surface surrounding the inner side of the upper surface The outer side, wherein the inner side has an inner side face and an inner side lower side, the inner side faces respectively extending upward and downward to be coupled to the outer side of the upper surface and the inner side of the upper surface, the inner side The side lower sides respectively extend upward and downward to be connected to the inner side of the upper surface and the lower surface, wherein the venting groove is provided inside the upper surface, and the venting groove extends from the lower side of the inner side surface The inner side surface, wherein the filter element is attached to the inner side of the upper surface of the holder, and a gap is formed between the side wall of the filter element and the side of the inner side surface The venting groove of the holder and the slit communicate with each other to form the venting passage of the photosensitive device, wherein the lower surface of the holder is attached to the molded base The top surface.
  69. 根据权利要求47所述的感光装置,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述上表面的靠近所述光窗的区域被界定为一上表面内侧,和所述上表面的远离所述光窗的区域被界定为环绕在所述上表面内侧四周的一上表面外侧,其中所述内侧面具有一内侧面上侧和一内侧面下侧,所述内侧面上侧分别向上和向下延伸以连接于所述上表面外侧和所述上表面内侧,所述内侧面下侧分别向上和向下延伸以连接于所述上表面内侧和所述下表面,其中所述通气孔自所述上表面内侧延伸至所述下表面,其中所述滤光元件被贴装于所述支座的所述上表面内侧,并且在所述滤光元件的侧壁和所述内侧面上侧之间形成一缝隙,所述支座的所述通气孔和所述缝隙相互连通以形成所述感光装置的所述通气通道,其中所述支座的所述下表面被贴装于所述模塑基座的所述顶表面。The photosensitive device according to claim 47, wherein said holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein said upper surface and said lower surface correspond to each other, said The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the inner side surface defining the light passage passage, Wherein the area of the upper surface adjacent to the light window is defined as an inner side of the upper surface, and the area of the upper surface remote from the light window is defined to surround an outer surface of the inner side of the upper surface The inner side surface has an inner side surface side and an inner side surface lower side, the inner side surface sides respectively extending upward and downward to be coupled to the outer side of the upper surface and the inner side of the upper surface, the inner side a lower side extending upwardly and downwardly to connect to an inner side of the upper surface and the lower surface, wherein the vent hole extends from an inner side of the upper surface to the lower surface, wherein the filter element is mounted a slit is formed inside the upper surface of the holder, and a gap is formed between the side wall of the filter element and the side of the inner side surface, and the vent hole and the slit of the holder communicate with each other to The venting passage of the photosensitive device is formed, wherein the lower surface of the holder is attached to the top surface of the molding base.
  70. 根据权利要求47所述的感光装置,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面、至少一通气槽以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述内侧面界定所述通光通道,其中所述上表面的靠近所述光窗的区域被界定为一上表面内侧,和所述上表面的远离所述光窗的区域被界定为环绕在所述上表面内侧四周的一上表面外侧,其中所述内侧面具有一内侧面上侧和一内侧面下侧,所述内侧面 上侧分别向上和向下延伸以连接于所述上表面外侧和所述上表面内侧,所述内侧面下侧分别向上和向下延伸以连接于所述上表面内侧和所述下表面,其中所述通气槽自所述上表面外侧延伸至所述上表面内侧,所述通气孔自所述上表面内侧延伸至所述下表面,并且所述通气孔和所述通气槽相互连通以形成所述感光装置的所述通气通道,其中所述滤光元件被贴装于所述支座的所述上表面内侧,所述支座的所述下表面被贴装于所述模塑基座的所述顶表面。The photosensitive device according to claim 47, wherein said holder has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one venting groove, and at least one vent hole, wherein said upper surface and said lower surface Corresponding to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be connected to the upper surface and the lower surface, the inner side defining a light passageway, wherein a region of the upper surface adjacent to the light window is defined as an inner side of an upper surface, and a region of the upper surface remote from the light window is defined to surround an inner side of the upper surface An outer surface of the upper surface, wherein the inner side surface has an inner side surface side and an inner side surface lower side, the inner side surface sides respectively extending upward and downward to be connected to the outer side of the upper surface and the inner side of the upper surface The lower side of the inner side surface respectively extends upward and downward to be connected to the inner side of the upper surface and the lower surface, wherein the venting groove extends from the outer side of the upper surface to the inner side of the upper surface, a vent extending from an inner side of the upper surface to the lower surface, and the vent hole and the venting groove communicate with each other to form the venting passage of the photosensitive device, wherein the filter element is attached to the Inside the upper surface of the holder, the lower surface of the holder is attached to the top surface of the molded base.
  71. 根据权利要求47所述的感光装置,其中所述支座包括一基座贴装部、一连接部以及一滤光片贴装部,所述连接部分别向上和向下延伸以连接于所述基座贴装部和所述滤光片贴装部,所述滤光片贴装部界定所述通光通道,所述滤光元件被贴装于所述支座的所述滤光片贴装部,并且在所述滤光元件的外壁和所述连接部之间形成一缝隙,其中所述支座的所述基座贴装部被贴装于所述模塑基座的所述顶表面,并且所述滤光片贴装部被保持在所述模塑基座的所述光窗,以使所述模塑基座环绕在所述支座的所述滤光片贴装部,其中所述支座具有至少一通光孔,其中所述通光孔自所述滤光片贴装部的上表面延伸至下表面,并且所述通光孔在所述滤光片贴装部的上表面连通所述缝隙,以形成所述感光装置的所述通气通道。The photosensitive device according to claim 47, wherein said holder comprises a base mounting portion, a connecting portion and a filter mounting portion, said connecting portions extending upward and downward respectively to be connected to said a susceptor mounting portion and the filter mounting portion, the filter mounting portion defining the light passage, the filter element being attached to the filter of the holder a portion, and a gap is formed between the outer wall of the filter element and the connecting portion, wherein the pedestal mounting portion of the holder is attached to the top of the molded base a surface, and the filter mounting portion is held by the light window of the molding base such that the molding base surrounds the filter mounting portion of the holder, Wherein the holder has at least one light passing hole, wherein the light passing hole extends from an upper surface of the filter mounting portion to a lower surface, and the light passing hole is at the filter mounting portion The upper surface communicates with the slit to form the venting passage of the photosensitive device.
  72. 根据权利要求47所述的感光装置,其中所述支座包括一基座贴装部、一连接部以及一滤光片贴装部,所述连接部分别向上和向下延伸以连接于所述基座贴装部和所述滤光片贴装部,所述滤光片贴装部界定所述通光通道,所述滤光元件被贴装于所述支座的所述滤光片贴装部,所述支座的所述基座贴装部被贴装于所述模塑基座的所述顶表面,并且所述滤光片贴装部被保持在所述模塑基座的所述光窗,以使所述模塑基座环绕在所述支座的所述滤光片贴装部,其中在所述模塑基座的基座内表面和所述支座的所述连接部之间形成一缝隙,其中所述支座具有至少一通光孔,其中所述通光孔自所述基座贴装部的上表面延伸至下表面,并且所述通光孔在所述基座贴装部的下表面连通所述缝隙,以形成所述感光装置的所述通气通道。The photosensitive device according to claim 47, wherein said holder comprises a base mounting portion, a connecting portion and a filter mounting portion, said connecting portions extending upward and downward respectively to be connected to said a susceptor mounting portion and the filter mounting portion, the filter mounting portion defining the light passage, the filter element being attached to the filter of the holder a mounting portion, the pedestal mounting portion of the holder is attached to the top surface of the molding base, and the filter mounting portion is held at the molded base The light window such that the molded base surrounds the filter mounting portion of the holder, wherein the inner surface of the base of the molded base and the holder are Forming a gap between the connecting portions, wherein the holder has at least one light passing hole, wherein the light passing hole extends from an upper surface of the pedestal mounting portion to a lower surface, and the light passing hole is in the A lower surface of the susceptor mounting portion communicates with the slit to form the venting passage of the photosensitive device.
  73. 根据权利要求47所述的感光装置,其中所述支座包括一基座贴装部、一连接部以及一滤光片贴装部,所述连接部分别向上和向下延伸以连接于所述基座贴装部和所述滤光片贴装部,所述滤光片贴装部界定所述通光通道,所述滤光元件被贴装于所述支座的所述滤光片贴装部,并且在所述滤光元件的外壁和所述 连接部之间形成一缝隙,所述支座的所述基座贴装部被贴装于所述模塑基座的所述顶表面,并且所述滤光片贴装部被保持在所述模塑基座的所述光窗,以使所述模塑基座环绕在所述支座的所述滤光片贴装部,其中在所述模塑基座的基座内表面和所述支座的所述连接部之间形成另一缝隙,其中所述支座具有至少一通光孔,所述通光孔自所述连接部的一侧延伸至另一侧,以分别连通形成于所述滤光元件的外壁和所述连接部之间的所述缝隙和形成于所述模塑基座的基座内表面和所述滤光元件的外壁之间的所述缝隙,从而形成所述感光装置的所述通气通道。The photosensitive device according to claim 47, wherein said holder comprises a base mounting portion, a connecting portion and a filter mounting portion, said connecting portions extending upward and downward respectively to be connected to said a susceptor mounting portion and the filter mounting portion, the filter mounting portion defining the light passage, the filter element being attached to the filter of the holder a mounting portion, and forming a slit between the outer wall of the filter element and the connecting portion, the pedestal mounting portion of the holder being attached to the top surface of the molding base And the filter mounting portion is held by the light window of the molding base such that the molding base surrounds the filter mounting portion of the holder, wherein Forming another gap between the inner surface of the base of the molded base and the connecting portion of the holder, wherein the holder has at least one light passing hole, and the light passing hole is from the connecting portion One side extends to the other side to respectively communicate the gap formed between the outer wall of the filter element and the connecting portion and formed in the The vent passage gap between the outer wall of the inner surface of the plastic base of the filter element and the base, thereby forming the photosensitive device.
  74. 根据权利要求47所述的感光装置,其中所述模塑基座的所述顶表面具有至少一通气槽,所述通气槽自所述模塑基座的基座内表面延伸至基座外表面,以连通所述光窗和外部,其中在所述支座被贴装于所述模塑基座的所述顶表面后,所述通气槽在所述支座和所述模塑基座的所述顶表面之间形成所述感光装置的所述通气通道。A photosensitive device according to claim 47, wherein said top surface of said molded base has at least one venting groove extending from an inner surface of said base of said molded base to an outer surface of said base Connecting the light window and the exterior, wherein the venting groove is in the holder and the molded base after the holder is attached to the top surface of the molding base The venting passage of the photosensitive device is formed between the top surfaces.
  75. 根据权利要求74所述的感光装置,其中所述模塑基座的所述通气槽弯曲地延伸。The photosensitive device according to claim 74, wherein said vent groove of said molded base extends in a curved manner.
  76. 根据权利要求74所述的感光装置,其中所述模塑基座的所述通气槽的形状选自:“L”字形、“S”字形、“V”字形以及“Y”字形组成的形状组。The photosensitive device according to claim 74, wherein said vent groove of said molded base has a shape selected from the group consisting of: an "L" shape, an "S" shape, a "V" shape, and a "Y" shape. .
  77. 根据权利要求74所述的感光装置,其中所述模塑基座具有至少一第一凹槽和至少一第二凹槽,所述第一凹槽自所述模塑基座的所述基座内表面向所述基板外表面方向延伸,所述第二凹槽自所述模塑基座的所述基座外表面向所述基座内表面方向延伸,并且所述第一凹槽和所述第二凹槽相互连通以形成所述模塑基座的所述凹槽。The photosensitive device according to claim 74, wherein said molding base has at least one first groove and at least one second groove, said first groove being from said base of said molded base An inner surface extending toward an outer surface of the substrate, the second groove extending from the outer surface of the base of the molded base toward the inner surface of the base, and the first groove and the first groove The second grooves communicate with each other to form the grooves of the molded base.
  78. 根据权利要求77所述的感光装置,其中一个所述第一凹槽和一个所述第二凹槽相互连通以形成所述模塑基座的所述凹槽;或者一个所述第一凹槽和多个所述第二凹槽相互连通以形成所述模塑基座的所述凹槽;或者多个所述第一凹槽和一个所述第一凹槽相互连通以形成所述模塑基座的所述凹槽。The photosensitive device according to claim 77, wherein one of said first grooves and one of said second grooves communicate with each other to form said groove of said molded base; or one of said first grooves And a plurality of the second grooves communicate with each other to form the groove of the molded base; or a plurality of the first grooves and one of the first grooves communicate with each other to form the molding The groove of the base.
  79. 根据权利要求47所述的感光装置,其中所述支座具有一上表面、一下表面、一内侧面、一外侧面以及至少一通气孔,其中所述上表面和所述下表面相互对应,所述内侧面和所述外侧面相互对应,并且所述内侧面和所述外侧面分别向上和向下延伸以连接于所述上表面和所述下表面,所述通气孔自所述支座的所 述上表面延伸至所述下表面,其中所述模塑基座的所述顶表面具有至少一通气槽,所述通气槽自所述模塑基座的基座内表面向基座外表面方向延伸至适当位置,其中在所述支座的所述下表面被贴装于所述模塑基座的所述顶表面后,所述支座的所述通气孔和所述模塑基座的所述通气槽相互连通以形成所述感光装置的所述通气通道。The photosensitive device according to claim 47, wherein said holder has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one vent hole, wherein said upper surface and said lower surface correspond to each other, said The inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface respectively extend upward and downward to be coupled to the upper surface and the lower surface, the vent hole being from the support Said upper surface extends to said lower surface, wherein said top surface of said molded base has at least one venting groove, said venting groove being oriented from the inner surface of said base of said molded base toward the outer surface of said base Extending into a position wherein the venting opening of the holder and the molded base are after the lower surface of the holder is attached to the top surface of the molded base The venting grooves communicate with each other to form the venting passage of the photosensitive device.
  80. 根据权利要求79所述的感光装置,其中所述模塑基座具有一第一凹槽和一第二凹槽,所述第一凹槽分别连通所述第二凹槽和所述通气孔,所述第二凹槽连通所述密封空间,其中所述第一凹槽的深度尺寸大于所述第二凹槽的深度尺寸。The photosensitive device according to claim 79, wherein said molding base has a first groove and a second groove, said first groove communicating with said second groove and said vent hole, respectively The second groove communicates with the sealed space, wherein a depth dimension of the first groove is greater than a depth dimension of the second groove.
  81. 根据权利要求47至80中任一所述的感光装置,进一步包括至少一密封元件,所述密封元件形成于和被保持在所述通气通道。A photosensitive device according to any one of claims 47 to 80, further comprising at least one sealing member formed and held in said ventilation passage.
  82. 根据权利要求47至81中任一所述的感光装置,其中所述基板具有一基板正面、一基板背面以及至少一容纳空间,其中所述基板正面和所述基板背面相互对应,所述容纳空间自所述基板正面向所述基板背面方向延伸,其中所述感光装置被容纳于所述容纳空间。The photosensitive device according to any one of claims 47 to 81, wherein the substrate has a substrate front surface, a substrate back surface, and at least one accommodating space, wherein the substrate front surface and the substrate back surface correspond to each other, and the accommodating space The front surface of the substrate extends toward the back surface of the substrate, wherein the photosensitive device is housed in the receiving space.
  83. 根据权利要求47至81中任一所述的感光装置,其中所述基板具有一基板正面、一基板背面以及至少一容纳空间,其中所述基板正面和所述基板背面相互对应,所述容纳空间自所述基板正面延伸至所述基板背面,以连通所述基板正面和所述基板背面,其中所述感光元件的所述非感光区域被贴装于所述基板的所述基板背面,并且所述基板环绕在所述感光元件的所述感光区域的四周,以使所述感光元件的所述感光区域对应于所述基板的所述容纳空间。The photosensitive device according to any one of claims 47 to 81, wherein the substrate has a substrate front surface, a substrate back surface, and at least one accommodating space, wherein the substrate front surface and the substrate back surface correspond to each other, and the accommodating space Extending from a front surface of the substrate to a back surface of the substrate to communicate the front surface of the substrate and the back surface of the substrate, wherein the non-photosensitive area of the photosensitive element is mounted on a back surface of the substrate of the substrate, and The substrate surrounds the photosensitive region of the photosensitive member such that the photosensitive region of the photosensitive member corresponds to the receiving space of the substrate.
  84. 根据权利要求47至83中任一所述的感光装置,其中所述模塑基座包埋所述感光元件的所述非感光区域的至少一部分。A photosensitive device according to any one of claims 47 to 83, wherein said molded base embeds at least a portion of said non-photosensitive area of said photosensitive member.
  85. 根据权利要求47至84中任一所述的感光装置,其中所述电路板包括至少一电子元器件,所述电子元器件被导通地连接于所述基板,其中所述模塑基座包埋凸出于所述基板的所述基板正面的至少一个所述电子元器件的至少一部分。The photosensitive device according to any one of claims 47 to 84, wherein said circuit board comprises at least one electronic component, said electronic component being conductively connected to said substrate, wherein said molded base package Embedding at least a portion of at least one of the electronic components on the front side of the substrate of the substrate.
  86. 一感光装置,其特征在于,包括:A photosensitive device, comprising:
    至少一滤光单元,其中所述滤光单元包括至少一支座和至少一滤光元件,其中所述支座具有至少一通光通道、至少一通气通道以及至少一第二通光空间,所述通光通道和所述通气通道分别连通所述第二通光空间,所述滤光元件被贴装于 所述支座,并且所述支座的所述通光通道对应于所述滤光元件;和At least one filter unit, wherein the filter unit includes at least one seat and at least one filter element, wherein the support has at least one light passage, at least one ventilation passage, and at least one second light passage space, a light passing passage and the venting passage respectively communicate with the second light passing space, the filter element is attached to the pedestal, and the light passing passage of the pedestal corresponds to the filter element ;with
    至少一模塑感光单元,其中所述模塑感光单元进一步包括:At least one molded photosensitive unit, wherein the molded photosensitive unit further comprises:
    至少一电路板,其中所述电路板包括至少一基板;At least one circuit board, wherein the circuit board includes at least one substrate;
    至少一感光元件,其中所述感光元件具有一感光区域和环绕在所述感光区域四周的一非感光区域,其中所述感光元件被导通地连接于所述基板;以及At least one photosensitive member, wherein the photosensitive member has a photosensitive region and a non-photosensitive region surrounding the photosensitive region, wherein the photosensitive member is electrically connected to the substrate;
    至少一模塑部,其中所述模塑部包括至少一模塑体和具有至少一第一通光空间,所述模塑体一体地结合于所述基板,并且所述模塑体形成至少所述第一通光空间,其中所述支座被贴装于所述模塑体,以使所述第一通光空间和所述第二通光空间相互连通而在所述滤光单元和所述模塑感光单元之间形成至少一密封空间,所述支座的所述通气通道用于连通所述密封空间和所述感光装置的外部,其中所述感光元件的所述感光区域被保持在所述密封空间,所述滤光元件被保持在所述感光元件的感光路径。At least one molding portion, wherein the molding portion includes at least one molding body and has at least one first light passing space, the molding body is integrally bonded to the substrate, and the molding body forms at least a first light-passing space, wherein the holder is attached to the molded body such that the first light-passing space and the second light-passing space communicate with each other at the filter unit and the Forming at least one sealed space between the molded photosensitive units, the venting passage of the holder for communicating the sealed space and the outside of the photosensitive device, wherein the photosensitive region of the photosensitive member is held at In the sealed space, the filter element is held in a photosensitive path of the photosensitive element.
  87. 根据权利要求86所述的感光装置,其中所述支座包括一支座主体和一体地延伸于所述支座主体的至少一延伸臂,在所述支座主体和所述延伸臂之间形成所述第二通光空间,所述通光通道形成于所述支座主体,所述通气通道形成于所述延伸臂,其中所述支座的所述延伸臂被贴装于所述模塑部的所述模塑体。The photosensitive device according to claim 86, wherein said holder comprises a holder body and at least one extension arm integrally extending from said holder body, formed between said holder body and said extension arm The second light passing space, the light passing passage is formed in the holder body, the ventilation passage is formed in the extension arm, wherein the extension arm of the holder is attached to the molding The molded body of the part.
  88. 根据权利要求86所述的感光装置,其中所述支座包括至少一支座主体和一体地延伸于所述支座主体的至少一延伸臂,在所述支座主体和所述延伸臂之间形成所述第二通光空间和连通于所述第二通光空间的至少一第二安装空间,所述通光通道形成于所述支座主体,所述通气通道形成于所述延伸臂,其中在相邻所述模塑体之间形成至少一第一安装空间,其中在所述支座被贴装于所述模塑部时,所述支座的所述延伸臂的至少一部分被保持在所述模塑部的所述第一安装空间,所述模塑体的至少一部分被保持在所述支座的所述第二安装空间,以在所述滤光单元和所述模塑感光单元之间形成所述密封空间。A photosensitive device according to claim 86, wherein said holder comprises at least a holder body and at least one extension arm integrally extending from said holder body, between said holder body and said extension arm Forming the second light-passing space and at least one second installation space communicating with the second light-passing space, the light-passing passage is formed in the support body, and the ventilation passage is formed on the extension arm, Wherein at least one first installation space is formed between adjacent molding bodies, wherein at least a portion of the extension arms of the holder are held while the holder is attached to the molding portion In the first installation space of the molding portion, at least a portion of the molding body is held in the second mounting space of the holder to be in the filter unit and the molding photosensitive The sealed space is formed between the units.
  89. 根据权利要求89所述的感光装置,其中所述模塑体呈“I”字形,所述延伸臂呈“匚”字形;或者所述模塑体呈“匚”字形,所述延伸臂呈“I”字形;或者所述模塑体呈“L”字形,所述延伸臂呈“L”字形;或者两个所述模塑体相互对称,两个所述延伸臂相互对称;或者所述模塑体和所述延伸臂均呈“口”字形。The photosensitive device according to claim 89, wherein said molded body has an "I" shape, said extension arm has a U-shape; or said molded body has a U-shape, and said extension arm is " I"-shaped; or the molded body has an "L" shape, the extension arm has an "L" shape; or two of the molding bodies are symmetrical to each other, and the two extension arms are symmetrical to each other; or the mold Both the molded body and the extension arm have a "mouth" shape.
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CN109286736B (en) 2022-04-29
CN110892702B (en) 2021-08-27
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CN112600998A (en) 2021-04-02
CN109286736A (en) 2019-01-29

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