CN104994259A - Camera module support molded based on metal powder, and manufacturing method and application thereof - Google Patents
Camera module support molded based on metal powder, and manufacturing method and application thereof Download PDFInfo
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- CN104994259A CN104994259A CN201510358084.0A CN201510358084A CN104994259A CN 104994259 A CN104994259 A CN 104994259A CN 201510358084 A CN201510358084 A CN 201510358084A CN 104994259 A CN104994259 A CN 104994259A
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Abstract
A camera module support molded based on metal powder and a manufacturing method and application thereof. The camera module support is obtained by metal powder or a mixture of metal powder and nonmetal powder, and has at least one first mounting part to be suitable for mounting at least one optical lens and/or at least one motor, and a second mounting part to be suitable for mounting at least one circuit board, thereby making a camera module. The camera module also includes at least one photosensitive chip, and the camera module support is used for conducting and radiating heat generated when photoelectric conversion of each light sensing chip is performed to external environment of the camera module support, and thus the camera module does not need arrangement of an extra heat dissipation device for the circuit board, so as to reduce the thickness of the camera module in an axial direction.
Description
Technical field
The present invention relates to a kind of optical imaging apparatus, particularly a kind of camera module support shaping based on metal dust and manufacture method thereof and application.
Background technology
At present, day by day pursue lightening with the portable electric appts that smart mobile phone, panel computer are representative, this requires that the size of all parts of portable electric appts (referring in particular to the gauge of all parts) is also more and more less, and such as, camera module as one of the standard configuration parts of portable electric appts also has lightening development trend.
Usually, the camera module of portable electric appts can be divided into single camera module and many camera modules.In one case, single camera module comprises the parts such as camera lens, support, chip and wiring board, in another case, single camera module can also comprise motor, and comprise motor for single camera module, its structure is, single camera module is installed in motor, chip is mounted on wiring board, and motor and wiring board are mounted on the both sides of support respectively, and camera lens is positioned at the photosensitive path of chip.Be understandable that, when the thickness of motor is determined, the thickness of camera module depends on the thickness of support.Therefore, in order to reduce the thickness of camera module, the thickness of support is also done thinner and thinner.The material of the support of prior art is selected from plastic material, due to the restriction of the mechanical property of plastic material, when the thickness of support is thinner, the mechanical property of support more can not meet the requirement of camera module, be in particular in, cause it in transported process, easily produce distortion because the thickness of support crosses thin, to such an extent as to cause the encapsulation yield of camera module greatly to reduce, and and then the series of problems such as cause the image quality of camera module not good.
In addition, single camera module is by the process that uses for a long time, and chip can produce a large amount of heats while carrying out photoelectric conversion, and thermal conductivity and the thermal diffusivity of the support be made up of plastic material are poor, cannot the radiation of supplemental heat effectively.In order to dispel the heat rapidly, traditional way is mounting a fin relative to the side of chip and derived by the heat of camera module inside at wiring board, the existence of fin further increases the thickness of camera module undoubtedly, therefore, how by the heat radiation of chip generation when carrying out photoelectric conversion out, it is also one of problem of needs research of the present invention.
Many camera modules are by the single camera module more than, carry out assemblying module system according to specific position relationship.The key issue related in the process that many camera modules assemble how to be carried out by two or more image-forming module spacing accurately, and it is spacing that indication here spacing includes but not limited in the spacing of encapsulation process and use procedure.In order to solve this requirement of many camera modules, usually need to use specific support, the support of many camera modules that prior art provides is made via processing metal finished product, and such as processing metal sheet material can obtain the support required for many camera modules.Although such support can meet the assembling needs of many camera modules, but it still also exists following problem, first, utilize the forming method difficulty of the support of prior art higher, especially, when relating to the support with complicated shape, the forming method of the support of prior art then cannot realize; Secondly, the size of the forming method of the support of prior art is utilized to be ensured accurately, to such an extent as to after multiple imaging modules is assemblied in support, can there is larger deviation between each imaging modules, this deviation then cannot be accepted and tolerate for the image quality of many camera modules; In addition, the difficulty when machining support of the formation method of the support of prior art and speed are difficult to by large-scale promotion and application.
Summary of the invention
One object of the present invention is to provide a kind of camera module support shaping based on metal dust and manufacture method thereof and application, wherein said camera module support is obtained by metal dust or metal dust and non-metal powder mixture, to enable the thickness of described camera module support reduce significantly, to meet the day by day lightening development trend of portable electric appts.
One object of the present invention is to provide a kind of camera module support shaping based on metal dust and manufacture method thereof and application, the mechanical property of the described camera module support be wherein made up of metal dust or metal dust and non-metal powder mixture is better than the mechanical property of the support be made up of plastic material, thus make described camera module support not easily produce distortion when being transported and use, and then be conducive to the image quality ensureing the camera module with described camera module support.
One object of the present invention is to provide a kind of camera module support shaping based on metal dust and manufacture method thereof and application, wherein said camera module support has good heat conductivility and heat dispersion, thus at the described camera module with described camera module support by the process that uses, the heat that the sensitive chip of described camera module produces in the process of work can be conducted by described camera module support and be radiated to the external environment condition of described camera module, thus described camera module does not need the extra cooling mechanism of configuration to carry out auxiliary heat dissipation, and then the integral thickness of described camera module is reduced significantly.
One object of the present invention is to provide a kind of camera module support shaping based on metal dust and manufacture method thereof and application, and wherein said camera module support prints technique forming metal powder by Shooting Technique or 3D or metal dust is obtained with non-metal powder mixture.
One object of the present invention is to provide a kind of camera module support shaping based on metal dust and manufacture method thereof and application, the manufacture method of wherein said camera module support can produce the described camera module support with labyrinth, and the precision of the described camera module support produced by described manufacture method can be ensured effectively, meet the development need of described camera module better to enable described camera module support and use needs.
One object of the present invention is to provide a kind of camera module support shaping based on metal dust and manufacture method thereof and application, wherein said manufacture method can improve the manufacture efficiency of described camera module support significantly, is suitable for being manufactured in large quantity to make described camera module support.
One object of the present invention is to provide a kind of camera module support shaping based on metal dust and manufacture method thereof and application, wherein said manufacture method can reduce the waste of the material in the process that described camera module support is manufactured, to reduce the manufacturing cost of described camera module support further.
In order to achieve the above object, the invention provides the camera module that a kind of thickness reduces, it comprises:
One wiring board;
At least one sensitive chip, every described sensitive chip is electrically connected on described wiring board respectively; And
One camera module support, it is obtained by metal dust or metal dust and non-metal powder mixture, described wiring board is mounted on described camera module support, wherein said camera module support is used for the heat conduction of every described sensitive chip generation when carrying out photoelectric conversion and is radiated to the external environment condition of described camera module support, thus described camera module does not need to configure extra heat abstractor at described wiring board, to reduce the thickness of described camera module in axis.
According to a further aspect in the invention, the present invention also provides a kind of camera module support, wherein said camera module support is obtained by metal dust or metal dust and non-metal powder mixture, and described camera module support has at least one first attachment portion to be suitable for mounting at least one optical lens and/or at least one motor and one second attachment portion to be suitable for mounting at least one wiring board.
According to a further aspect in the invention, the present invention also provides a kind of hot systems for camera module, and it comprises:
At least one sensitive chip;
One camera module support, described camera module support has an internal environment and an external environment condition, every described sensitive chip is housed inside the described internal environment of described camera module support, wherein the heat of every described sensitive chip generation when carrying out photoelectric conversion makes the gas of the described internal environment of described camera module support form hot gas, and described camera module support carries out heat exchange for the cold air of the described external environment condition by the hot gas of the described internal environment of described camera module support and described camera module support, thus reduce the temperature of the described internal environment of described camera module support.
According to a further aspect in the invention, the present invention also provides a kind of heat dissipating method of camera module, and wherein said heat dissipating method comprises the steps:
(A) along the heat of at least one sensitive chip of radial and axial radiation equably generation when carrying out photoelectric conversion of described camera module; With
(B) in the radial direction of described camera module, the cold air of the hot gas of the internal environment of camera module described in heat exchange and the external environment condition of described camera module, thus reduce the temperature of the internal environment of described camera module.
According to a further aspect in the invention, the present invention also provides a kind of method manufacturing camera module support, and wherein said manufacture method comprises the steps:
A () forms the stream based on metal dust;
B () pours into described stream in the mould of described camera module support; And
C () solidifies the described stream in the mould of described camera module support, with obtained described camera module support.
According to a further aspect in the invention, the present invention also provides a kind of method manufacturing described camera module support, and wherein said manufacture method comprises step:
I () forms the stream based on metal dust;
(ii) mathematical model relevant to described camera module support is set up; And
(iii) described stream is used to print based on described mathematical model, with obtained described camera module support.
Described camera module support provided by the invention, it prints technique by metal dust or metal dust and non-metal powder mixture by injection mo(u)lding or 3D and is formed integrally, with the support be made up of plastic material making the mechanical property of described camera module support be better than prior art.Especially when the size of described camera module support needs to be designed into ultra-thin, on the one hand in the process that described camera module support is transported, it not easily produces distortion, thus be conducive to the accurate encapsulation of follow-up described camera module, on the other hand at described camera module by the process that uses, the heat that described sensitive chip produces when carrying out long photoelectric conversion can not make the temperature distortion of described camera module support, thus is conducive to the stability of described camera module support and ensures the image quality of described camera module.
In addition, described camera module support provided by the invention, it prints technique by metal dust or metal dust and non-metal powder mixture by injection mo(u)lding or 3D and is formed integrally, there is good heat conductivility and heat dispersion, carry out heat exchange with the cold air of the external environment condition realizing heat and the described camera module operationally produced by described camera module in the radial direction of described camera module, thus reduce the temperature of the internal environment of described camera module.One of advantage of such heat dissipating method is, carry out the mode of heat exchange at axial direction relative to tradition, radial direction has larger area of dissipation, thus the radiating efficiency of described camera module can be improved, two of advantage is, the mode of heat exchange is carried out by described camera module support, the described camera module as prior art can not be needed to configure extra heat abstractor to realize heat radiation, thus the thickness of described camera module can be reduced significantly, with the development trend that the pursuit meeting described camera module is lightening.
Accompanying drawing explanation
Fig. 1 shows the vertical view of the camera module support of a preferred embodiment of the present invention.
Fig. 2 is the close-up schematic view of Fig. 1, shows the portion of giving vent to anger of camera module support.
Fig. 3 shows the cutaway view of the camera module support of above preferred embodiment of the present invention.
Fig. 4 shows the stereogram of the camera module support of another preferred embodiment of the present invention.
Fig. 5 shows the vertical view of the camera module support of a preferred embodiment more of the present invention.
Fig. 6 shows the cutaway view of the camera module support of above preferred embodiment of the present invention.
Fig. 7 shows the exploded view of the camera module of above preferred embodiment of the present invention.
Fig. 8 shows the cutaway view of the camera module of above preferred embodiment of the present invention.
Fig. 9 shows the heat dissipating method block diagram of the camera module of above preferred embodiment of the present invention.
Figure 10 shows the manufacturing process block diagram of the camera module support of above preferred embodiment of the present invention.
Figure 11 shows another manufacturing process block diagram of the camera module support of above preferred embodiment of the present invention.
Embodiment
Below describe and realize the present invention for disclosing the present invention to enable those skilled in the art.Preferred embodiment in below describing only as an example, it may occur to persons skilled in the art that other apparent modification.The general principle of the present invention defined in the following description can be applied to other embodiments, deformation program, improvement project, equivalent and not deviate from the other technologies scheme of the spirit and scope of the present invention.
Fig. 7 and Fig. 8 shows the schematic diagram of camera module according to a preferred embodiment of the present invention.What it will be appreciated by those skilled in the art that is, described camera module can be single camera module, also can be many camera modules, the many camera modules wherein provided in the present invention can be carry out assembling by multiple single camera module according to specific position relationship to obtain.Described camera module can comprise camera module support 10, wiring board 20, at least one sensitive chip 30, at least one optical lens 40 and at least one motor 50.
Every described sensitive chip 30 is electrically connected on described wiring board 20.Preferably, every described sensitive chip 30 can be mounted on described wiring board 20.Every described optical lens 40 is installed in every described motor 50 respectively, and every described optical lens 40 can be driven by every described motor 50 focal length that is suitable for adjusting described camera module respectively.Described wiring board 20 and every described motor 50 are arranged at the not homonymy of described camera module support 10 respectively, with the photosensitive path making every described optical lens 40 be positioned at every described sensitive chip 30, thus when described camera module is for gathering the image of object, the light be reflected by the object can be accepted to be suitable for carrying out photoelectric conversion by every described sensitive chip 30 further after the process by every described optical lens 40.That is, in the present invention, described camera module support 10 may be used for connecting described wiring board 20 and every described motor 50.
It is worth mentioning that, in an optional example of the present invention, the every described optical lens 40 of described camera module can also be arranged directly in described camera module support 10, thus makes described camera module support 10 directly can connect described wiring board 20 and every described optical lens 40.In another optional example of the present invention, as shown in Figure 4, described camera module support 10 can also be integrated bracket, and described camera module can not be configured described motor 50, thus every described optical lens 40 can be arranged directly in described camera module support 10, and then described camera module support 10 directly connects described wiring board 20 and every described optical lens 40, the present invention is unrestricted in this regard.
Fig. 1 to Fig. 3 shows described camera module support 10 according to a preferred embodiment of the present invention.Described camera module support 10 provided by the invention, print by injection mo(u)lding or 3D the mode that technique forms one by metal dust or metal dust and non-metal powder mixture to obtain, relative to the support made by plastic material of prior art, described camera module 10 of the present invention has better stability.As a concrete example, when described camera module support 10 need to be designed enough thin to be suitable for being configured at extra-thin described camera module time, the good mechanical property of described camera module support 10 can ensure that described camera module support is not yielding, thus in the encapsulation precision of the described camera module of follow-up guarantee.In addition, the described camera module support 10 obtained based on metal dust also has good bending resistance and good recovery capacity.
Specifically, when the support made by plastic material of described camera module support 10 of the present invention and prior art is subject to the External Force Acting in onesize and direction, more easily there is distortion such as such as bending in the support made by plastic material of prior art; Correspondingly, when producing the distortion of same degree after described camera module support 10 of the present invention is subject to External Force Acting with the support made by plastic material of prior art, after external force is cancelled, described camera module support 10 of the present invention more easily returns back to initial condition, thus the support that described camera module support 10 of the present invention is made than the plastics of prior art has more stability.What it will be appreciated by those skilled in the art that is, this external force very easily produces in the process that described camera module support 10 is transported, such as described camera module support 10 is subject to jolting etc. and all can produces this external force, thus the mechanical property improving described camera module support 10 has significant advantage for the quality of described camera module support 10.
That is, when described camera module support 10 is transported, even if the effect that described camera module support 10 is subject to external force also can not produce distortion, thus can ensure that described camera module is at follow-up encapsulation yield.Correspondingly, when described camera module is used, be also not easy when described camera module support 10 is heated to produce distortion, thus guarantee the image quality of described camera module.What it will be appreciated by those skilled in the art that is, the heat conductivility of the support that prior art is made by plastic material and heat dispersion poor, when described camera module is used for a long time, the heat of described sensitive chip 30 generation when carrying out photoelectric conversion is not easy to be radiated from the inside of described camera module support, thus cause support to produce distortion because of being too heated, and once inherently make described sensitive chip 30 and described optical lens 40 occur the situation of relative tilt after deformation of timbering, be adversely affected to cause the image quality of described camera module.Described camera module support 10 of the present invention, printing technique by metal dust or metal dust and non-metal powder mixture by injection mo(u)lding or 3D is formed integrally, there is good heat conductivility and heat dispersion, even if thus when described camera module support 10 is heated, described camera module support 10 also can not produce distortion.
It is worth mentioning that, in the present invention, metal dust can chosen from Fe, tungsten, molybdenum, copper, cobalt, nickel, titanium, tantalum, aluminium, tin, lead, tantalum, niobium, titanium, zirconium, beryllium, thorium, one or more in uranium.Correspondingly, non-metal powder can be selected from one or more in graphite, carbon black, pottery, plastics etc.Also it is worth mentioning that, metal dust in the present invention and non-metal powder can obtain technique by traditional powder and obtain, thus ensure that described camera module support 10 has material source widely, to reduce manufacture difficulty and the manufacturing cost of described camera module support 10 further.
The both sides of described camera module support 10 are respectively equipped with one first attachment portion 11 and one second attachment portion 12, described camera module support 10 also has at least one light channel 13 and is communicated in described first attachment portion 11 and described second attachment portion 12, thus every described light channel 13 allows light side radiation to described second place, attachment portion 12 from the side at described first place, attachment portion 11 of described camera module support 10.The described first attachment portion 11 of described camera module support 10 is suitable for being mounted every described optical lens 40 and/or every described motor 50, and every described optical lens 40 and/or every described motor 50 corresponding with the every described light channel 13 of described camera module support 10.Correspondingly, the described second attachment portion 12 of described camera module support 10 is suitable for being mounted described wiring board 30, and every described sensitive chip 30 is corresponding respectively at the every described light channel 13 of described camera module support 10, thus every described optical lens 40 is made to lay respectively at the photosensitive path of every described sensitive chip 30.
Further, as shown in Figure 2, described camera module support 10 has at least one portion 14 of giving vent to anger to be suitable for being communicated in internal environment and the external environment condition of described camera module support 10, thus when encapsulating described camera module, portion 14 of giving vent to anger described in every can make the air pressure of internal environment and the air pressure balance of external environment condition of described camera module support 10, to ensure the evenness between every described sensitive chip 30 and every described optical lens 40.It is worth mentioning that, in the present invention, the space defined within the inner surface of described camera module support 10 is the internal environment of described camera module support 10, and the space beyond the outer surface defining described camera module support 10 is the external environment condition of described camera module support 10.Also it is worth mentioning that, portion 14 of giving vent to anger described in every can have different shapes, portion 14 of such as, giving vent to anger described in every can be selected from the shape group of linear, sweep and other abnormity composition, and portion 14 of giving vent to anger described in every can be located at the diverse location of described camera module support 10, portion 14 of such as, giving vent to anger described in every can be positioned at the homonymy of described camera module support 10 with described second attachment portion 12.
As an exemplary explanation, described camera module support 10 is provided with at least one first outlet passageway 141 and at least one second outlet passageway 142, often described first outlet passageway 141 is communicated with respectively with every described second outlet passageway 142, with formed every described in give vent to anger portion 14.Preferably, often described first outlet passageway 141 is communicated with respectively deviously with every described second outlet passageway 142, thus can filter the pollutant carried from the gas that the external environment condition of described camera module support 10 enters into its internal environment via portion 14 of giving vent to anger described in every by portion 14 of giving vent to anger described in every.
In addition, described camera module support 10 can also be provided with at least one excessive glue groove 15, every described excessive glue groove 15 can with every described in compartment of terrain, portion 14 of giving vent to anger arrange, for holding unnecessary glue, thus prevent glue from the internal environment of described camera module support 10, polluting every described sensitive chip 30 or other parts.Such as, the both sides in portion 14 of giving vent to anger described in often can be respectively equipped with a described excessive glue groove 15, thus portion 14 of giving vent to anger described in preventing is blocked by unnecessary glue.
Specifically, in the process of the described camera module of encapsulation, need to arrange glue in the described second attachment portion 12 of described camera module support 10 and at least one parts of described wiring board 20, then described wiring board 20 is superimposedly arranged at the described second attachment portion 12 of described camera module support 10.Follow-up, Baking out is carried out to described camera module, now, the gas of the internal environment of described camera module support 10 makes air pressure raise because of being heated and forms hot gas, at this moment, the hot gas of the internal environment of described camera module support 10 can get rid of external environment condition to described camera module support 10 by portion 14 of giving vent to anger described in every.When terminating the baking of described camera module and making described camera module cool, the air pressure of the internal environment of described camera module support 10 can gradually lower than the air pressure of the external environment condition of described camera module support 10, at this moment, the gas of the external environment condition of described camera module support 10 can enter into the internal environment of described camera module support 10 by portion 14 of giving vent to anger described in every, in this process, the pollutant such as dust etc. that the gas entering into internal environment from the external environment condition of described camera module support 10 carries, to give vent to anger described in every described first outlet passageway 141 in portion 14 and the bending link position precipitation of described second outlet passageway 142, thus pollutant can not enter into the internal environment of described camera module support 10 and pollute every described sensitive chip 30 or other parts.In addition, also can expand in the process that glue is baked at described camera module, thus unnecessary glue will overflow into and remains in every described excessive glue groove 15, and because do not have described excessive glue groove 15 with every described in compartment of terrain, portion 14 of giving vent to anger arrange, thus unnecessary glue can not block on the one hand every described in give vent to anger portion 14, also can not pollute every described sensitive chip 30 or other the parts of the internal environment being in described camera module 10 on the other hand.
Described camera module support 10 according to another preferred embodiment of the invention as shown in Figure 4, with above-described embodiment unlike, described camera module support 10 is integral type camera module supports.Specifically, described camera module support 10 can have multiple described first attachment portion 11 and a described second attachment portion 12, and wherein often described first attachment portion 11 and described second attachment portion 12 are not located at the both sides of described camera module support 10 symmetrically.More particularly, often described first attachment portion 11 can be arranged along the depth direction of described camera module 10, thus every described optical lens 40 and/or every described motor 50 are installed in described photography module bracket 10 in Embedded mode, be mounted on the described second attachment portion 12 of described camera module support 10 by the described wiring board 20 being pasted with described sensitive chip 30, thus make every described optical lens 40 be positioned at the photosensitive path of every described sensitive chip 30.
It is worth mentioning that, in above-mentioned two preferred embodiments of the present invention, the quantity of described sensitive chip 30, described optical lens 40 and described motor 50 can be one respectively, and that is, described camera module can be single camera module.As shown in Figure 5 and Figure 6, in another preferred embodiment of the present invention, described camera module support 10 may be used for the described sensitive chip 30, described optical lens 40 and the described motor 50 that encapsulate two or more, thus makes described camera module form many camera modules.That is, described sensitive chip 30, described optical lens 40 and the described motor 50 more than can be encapsulated by a described camera module support 10.
Specifically, as an exemplary explanation, described camera module support 10 can have a described first attachment portion 11, a described second attachment portion 12 and two described light channels 13 are to be suitable for being communicated in the side at described first place, attachment portion 11 and the side at described second place, attachment portion 12, and every described optical lens 40 and/or every described motor 50 correspond to the described first attachment portion 11 that every described light channel 13 ground is mounted on described camera module support 10, when described wiring board 20 is mounted on the described second attachment portion 12 of described camera module support 10, every described sensitive chip 30 is corresponding respectively at every described light channel 13, thus make every described optical lens 40 lay respectively at the photosensitive path of every described sensitive chip 30.
In addition, the both sides of described camera module support 10 can also be respectively equipped with a setting element 16, every described setting element 16 is suitable for described camera module to be assembled on portable electronic equipment, thus prevent described camera module destroyed in assembling and follow-up use procedure, such as every described setting element 16 can be respectively equipped with a location hole, described camera module can be arranged on portable electronic equipment through described location hole by screw.By such mode, the distance between each photographing module (photographing module comprises optical lens, motor and sensitive chip) between described camera module can not offset, to guarantee the reliability of described camera module.
In addition, print by injection mo(u)lding or 3D the described camera module support 10 that technique obtains by metal dust or metal dust and non-metal powder mixture and also there is good heat conductivility and heat dispersion.As shown in Figure 8, the above-below direction defining described camera module is the axial direction of described camera module, and the peripheral direction defining described camera module is the radial direction of described camera module.
The function of the support made by plastic material of the described camera module support 10 obtained by injection mo(u)lding or 3D printing shaping by metal dust or metal dust and non-metal powder mixture of the present invention and prior art has the difference of essence.Specifically, the support made by plastic material of prior art is only for connecting motor and wiring board, therefore, in order to improve the heat-sinking capability of the camera module of prior art, need at the wiring board sidepiece additional configuration heat abstractor relative with sensitive chip, this heat abstractor is a sheet metal normally, with the external environment condition making the heat of sensitive chip generation when carrying out photoelectric conversion be radiated to described camera module by this heat abstractor.It will be appreciated by those skilled in the art that, heat abstractor is the axial direction being configured in described camera module, and that is, the camera module of prior art is provided in only axial direction and dispels the heat, and such mode also exists all many-sided defects.The first, the camera module of prior art is merely able to dispel the heat along the axial direction of camera module, and such radiating mode makes the contact area of this heat abstractor of camera module and external environment condition limited, thus causes the heat-sinking capability of the camera module of prior art not enough.Second, the camera module of prior art is dispelled the heat by this heat abstractor via wiring board, distortion can be produced when wiring board is heated for a long time, to such an extent as to make to be mounted between the sensitive chip of wiring board and optical lens and occur relative tilt, and have impact on the image quality of the camera module of prior art.3rd, this heat abstractor is additionally provided in the axial direction of camera module, and the thickness of the camera module of prior art is increased further, thus the camera module being conducive to prior art cannot be applied to pursuing on lightening portable electric appts.
Described camera module of the present invention is different from the heat dissipation direction of the camera module of prior art.Specifically, when described camera module support 10 and other parts packed and form described camera module time, described sensitive chip 30 is housed inside in the internal environment of described camera module support 10, thus described camera module support 10 is arranged around described sensitive chip 30.That is, described camera module support 10 is not in the axial direction of described camera module, but is arranged in the radial direction of described camera module.When described sensitive chip 30 produces heat in the process of carrying out photoelectric conversion, this heat can make the gas of the internal environment of described camera module support 10 form hot gas, and correspondingly, the gas of the external environment condition of described camera module support 10 is called as cold air.The heat that the hot gas of the inside of described camera module support 10 carries can conduct from internal environment by described camera module support 10 and be radiated to external environment condition, thus realized the heat exchange of hot gas and cold air by described camera module support 10, to reduce the temperature of the internal environment of described camera module support 10.By such mode, one of its advantage is, described camera module support 10 and the contact area of external environment condition are greater than the foundation area of described wiring board 20 and external environment condition, and described camera module support 10 directly realizes the heat exchange of hot gas and cold air, thus be conducive to the efficiency improving heat exchange; Two of its advantage is, the use of described camera module support 10 does not need to be described this heat abstractor of camera module additional configuration again, thus the integral thickness of described camera module can be reduced significantly, lightening development trend is pursued to meet portable electric appts, this is that the camera module of prior art is unexpected, and for the lifting of the overall performance of described camera module and the minimizing of thickness effective especially.
Thus as shown in Figure 9, the present invention also provides a kind of heat dissipating method 900 of camera module, and wherein said heat dissipating method 900 comprises the steps:
Step 910:(A) along the heat of at least one sensitive chip 30 of radial and axial radiation equably generation when carrying out photoelectric conversion of described camera module; With
Step 920:(B) in the radial direction of described camera module, the cold air of the hot gas of the internal environment of camera module described in heat exchange and the external environment condition of described camera module, thus reduce the temperature of the internal environment of described camera module.
What it will be appreciated by those skilled in the art that is, the axial direction of described camera module is wiring board and optical lens respectively, carry out in the process of photoelectric conversion at every described sensitive chip 30, the heat that every described sensitive chip 30 produces can be conducted by wiring board and be radiated to the external environment condition of described camera module, and in this process, the way of prior art is to improve thermal-radiating efficiency at the wiring board side additional configuration heat abstractor relative with every described sensitive chip 30, what it will be appreciated by those skilled in the art that is, this way of prior art adds described camera module undoubtedly at axial direction thickness.When described camera module is used, such as described camera module is installed in be pursued in lightening mobile phone, the axial direction of described camera module is the thickness direction of mobile phone, thus the thickness of described camera module determines the thickness of mobile phone, therefore, the size of described camera module is increased undoubtedly for increasing the thickness of mobile phone at axial direction.
In described step (B), the present invention is by carrying out heat exchange in the cold air of radial direction to the hot gas of described camera module internal environment and the external environment condition of described camera module, the radiating effect of described camera module is improved because of the increase of area of dissipation, and in this process, do not need additional configuration heat abstractor in the axial direction of described camera module, thus effectively reduce the thickness of described camera module, and then described camera module is made to meet the development need pursuing lightening electronic equipment.
Preferably, in described step (B), also comprise step: arrange a camera module support 10 in the radial direction of described camera module, for conduction and radiations heat energy.Relative to wiring board, the area of dissipation that described camera module support 10 is formed increases considerably, thus significantly increase the radiating effect of described camera module, and by such mode, described camera module support 10 itself forms a radiating component, thus the part that the heat that every described sensitive chip 30 produces is conducted to described wiring board 20 reduces significantly, to avoid described wiring board 20 because undue in heat energy generation distortion, to guarantee the image quality of described camera module.
Preferably, in described step (A), mount every described sensitive chip 30 in described wiring board 20, and in described step (B), mount described wiring board 20 in described camera module support 10, the heat conducting to described wiring board 20 when every described sensitive chip 30 carries out photoelectric conversion is conducted to described camera module support 10, further with the external environment condition of at least described camera module of radiation.That is, although the heat of every described sensitive chip 30 generation when carrying out photoelectric conversion can conduct on described wiring board 20, but this part heat can be dispelled the heat rapidly by described camera module support 10, and can not act on described wiring board 20 constantly, thus temperature raises the distortion caused because of continuing to be heated to avoid described wiring board 20.
According to another aspect of the present invention, it also offers a kind of hot systems for camera module, it comprises sensitive chip 30 described at least one and described camera module support 10, wherein said camera module support 10 has an internal environment and an external environment condition, every described sensitive chip 30 is housed inside the described internal environment of described camera module support 10, wherein the heat of every described sensitive chip 30 generation when carrying out photoelectric conversion makes the gas of the described internal environment of described camera module support 10 form hot gas, correspondingly, the gas of the described external environment condition of described camera module support 10 forms cold air, and described camera module support 10 carries out heat exchange for the cold air of the hot gas of the described internal environment by described camera module support 10 and the external environment condition of described camera module support 10, thus reduce the temperature of the described internal environment of described camera module support.
Further, described camera module support 10 is centered around the radial direction of every described sensitive chip 30, thus in the radial direction of every described sensitive chip 30, the cold air of the hot gas of the described internal environment of every described camera module support 10 and the described external environment condition of described camera module support is carried out heat exchange.
According to a further aspect in the invention, as shown in Figure 10, the present invention also provides a kind of method 1000 manufacturing described camera module support, and wherein said manufacture method 1000 comprises the steps.
Step 1010:(a) formed based on a stream of metal dust.Described stream is for the raw material at the described camera module support 10 of follow-up formation, and described stream can be metal dust, metal dust formed with non-metal powder mixture mixing sticker.Thus in a preferred embodiment of the present invention, described step (a) can also comprise step: mixed metal powder and sticker are to form described stream; In another preferred embodiment of the present invention, described step (a) can also comprise step: mixed metal powder, non-metal powder and sticker are to form described stream.What it will be appreciated by those skilled in the art that is, described stream involved in the present invention refers to can the raw material of automatic stream under gravity, thus in various embodiments, described stream can present different forms, as fluid or granular solid.
In addition, according to different use needs, raw-material ratio for obtained described camera module support 10 can be different, that is, and metal dust, non-metal powder and sticker that the described camera module support 10 of different size can need different proportion to configure.
Step 1020:(b) pour into described stream in the mould of described camera module support.Relative to the point-like charging aperture that prior art injection molding plastic material adopts, when the described stream of injection moulding based on metal material, the charging aperture of the mould institute material of described camera module support is style big water gap charging aperture.After described stream is poured into the mould of described camera module support, described stream coagulation forming can be made by the mode of sintering, thus in step 1030:(c) solidify described stream in the mould of described camera module support, with obtained described camera module support 10.It is worth mentioning that, in described step (c), the described stream coagulation forming that other mode makes in described camera module support can also be adopted.
Further, described manufacture method also comprises step 1040:(d) insulation processing of execution to the outer surface of described camera module support 10, thus when the described camera module with described camera module support 10 is configured in portable electronic equipment, can prevent other components of the internal structure of described camera module and portable electronic equipment from occurring the phenomenon of short circuit.
Further, described manufacture method also comprises step 1050:(e) the delustring process of execution to the outer surface of described camera module support 10, there is reflective situation to prevent the outer surface of described camera module support 10.What it will be appreciated by those skilled in the art that is, described step (d) and described step (e) can also synchronously be performed, that is, apply a reflective insulating material in the outer surface of described camera module support 10, thus described reflective insulating material forms a reflective insulating barrier in the outer surface of described camera module support 10.
According to another aspect of the present invention, as shown in figure 11, the present invention also provides a kind of method 1100 manufacturing described camera module support, and wherein said manufacture method 1100 comprises the steps.
Step 1110:(i) formed based on a stream of metal dust;
Step 1120:(ii) set up a mathematical model relevant to described camera module support 10; And
Step 1130:(iii) use described stream to print based on described mathematical model, with obtained described camera module support 10.Preferably, 3D is used in the described step (iii) to print camera module support 10 described in manufacture technics, to make described camera module support 10 can by shaping rapidly.
Preferably, in a preferred embodiment of the invention, described step (ii) can also comprise step, scans the sample of described camera module support 10, to set up the described mathematical model relevant to described camera module support 10.In another preferred embodiment of the present invention, described step (ii) can also comprise step, sets up the described mathematical model relevant to described camera module support 10 in a computer by modeling software.
Those skilled in the art are understandable that, by described manufacture method 1100, in the process manufacturing described camera module support 10, can carry out remote operation, to improve the manufacture efficiency of described camera module to it.
Those skilled in the art should understand shown in accompanying drawing to be only to example of the present invention instead of restriction with the embodiment of the present invention described above.
Can see that the object of the invention can fully effectively be completed thus.For explaining that this embodiment of function and structure principle of the present invention has been absolutely proved and described, and the present invention is not by the restriction based on the change on these embodiment basis.Therefore, the present invention includes all modifications be encompassed within appended claims book claimed range and spirit.
Claims (33)
1. a camera module for thickness reduction, is characterized in that, comprising:
One wiring board;
At least one sensitive chip, every described sensitive chip is electrically connected on described wiring board respectively; And
One camera module support, it is obtained by metal dust or metal dust and non-metal powder mixture, described wiring board is mounted on described camera module support, wherein said camera module support is used for the heat conduction of every described sensitive chip generation when carrying out photoelectric conversion and is radiated to the external environment condition of described camera module support, thus described camera module does not need to configure extra heat abstractor at described wiring board, to reduce the thickness of described camera module in axis.
2. camera module according to claim 1, wherein said camera module support is arranged in the radial direction of every described sensitive chip.
3. camera module according to claim 1 and 2, one or more in wherein said metal dust chosen from Fe, tungsten, molybdenum, copper, cobalt, nickel, titanium, tantalum, aluminium, tin, lead, tantalum, niobium, titanium, zirconium, beryllium, thorium, uranium.
4. camera module according to claim 1 and 2, one or more in wherein said metal dust chosen from Fe, tungsten, molybdenum, copper, cobalt, nickel, titanium, tantalum, aluminium, tin, lead, tantalum, niobium, titanium, zirconium, beryllium, thorium, uranium, correspondingly, described non-metal powder is selected from one or more in graphite, carbon black, plastics, pottery.
5. a camera module support, it is characterized in that, described camera module support is obtained by metal dust or metal dust and non-metal powder mixture, and described camera module support has at least one first attachment portion to be suitable for mounting at least one optical lens and/or at least one motor and one second attachment portion to be suitable for mounting at least one wiring board.
6. camera module support according to claim 5, wherein often described first attachment portion and described second attachment portion lay respectively at the both sides of described camera module support.
7. camera module support according to claim 5, wherein often described first attachment portion is arranged along the depth direction of described camera module support, and described second attachment portion is located at the side of described camera module support.
8. camera module support according to claim 5, is provided with at least one portion of giving vent to anger further to be communicated in internal environment and the external environment condition of described camera module support.
9. camera module support according to claim 8, described in wherein every, the portion of giving vent to anger extends the side at described second place, attachment portion of described camera module support deviously.
10. camera module support according to claim 8, is provided with at least one excessive glue groove further, every described excessive glue groove with every described in the portion of giving vent to anger be located at the homonymy of described camera module support spaced reciprocally.
11. camera module supports according to claim 10, one or more in wherein said metal dust chosen from Fe, tungsten, molybdenum, copper, cobalt, nickel, titanium, tantalum, aluminium, tin, lead, tantalum, niobium, titanium, zirconium, beryllium, thorium, uranium.
12. camera module supports according to claim 10, one or more in wherein said metal dust chosen from Fe, tungsten, molybdenum, copper, cobalt, nickel, titanium, tantalum, aluminium, tin, lead, tantalum, niobium, titanium, zirconium, beryllium, thorium, uranium, correspondingly, described non-metal powder is selected from one or more in graphite, carbon black, plastics, pottery.
13. camera module supports according to claim 11 or 12, wherein said camera module support forms one by injection molding process.
14. camera module supports according to claim 11 or 12, wherein said camera module support prints technique by 3D and is formed integrally.
15. camera module supports according to claim 11 or 12, wherein said camera module support is single camera module support or many camera modules support.
16. camera module supports according to claim 11 or 12, the outer surface of wherein said camera module support is provided with a luminous insulating barrier.
17. 1 kinds, for the hot systems of camera module, is characterized in that, described hot systems comprises:
At least one sensitive chip;
One camera module support, described camera module support has an internal environment and an external environment condition, every described sensitive chip is housed inside the described internal environment of described camera module support, wherein the heat of every described sensitive chip generation when carrying out photoelectric conversion makes the gas of the described internal environment of described camera module support form hot gas, and described camera module support carries out heat exchange for the cold air of the described external environment condition by the hot gas of the described internal environment of described camera module support and described camera module support, thus reduce the temperature of the described internal environment of described camera module support.
18. hot systems according to claim 17, wherein said camera module support is centered around the radial direction of every described sensitive chip, thus in the radial direction of every described sensitive chip, the cold air of the hot gas of the described internal environment of every described camera module support and the described external environment condition of described camera module support is carried out heat exchange.
19. hot systems according to claim 18, wherein said camera module support obtains based on metal dust.
The heat dissipating method of 20. 1 kinds of camera modules, is characterized in that, described heat dissipating method comprises the steps:
(A) along the heat of at least one sensitive chip of radial and axial radiation equably generation when carrying out photoelectric conversion of described camera module; With
(B) in the radial direction of described camera module, the cold air of the hot gas of the internal environment of camera module described in heat exchange and the external environment condition of described camera module, thus reduce the temperature of the internal environment of described camera module.
21. heat dissipating methods according to claim 20, wherein in described step (B), also comprise step: arrange a camera module support in the radial direction of described camera module, for conduction and radiations heat energy.
22. heat dissipating methods according to claim 21, wherein in described step (A), mount every described sensitive chip in a wiring board, and in described step (B), mount described wiring board in described camera module support, the heat conducting to described wiring board when every described sensitive chip carries out photoelectric conversion is conducted to described camera module support further.
23. 1 kinds of methods manufacturing camera module support, it is characterized in that, described manufacture method comprises the steps:
A () forms the stream based on metal dust;
B () pours into described stream in the mould of described camera module support; And
C () solidifies the described stream in the mould of described camera module support, with obtained described camera module support.
24. manufacture methods according to claim 23, wherein comprise step described step (a): mixed metal powder and sticker are to form described stream.
25. manufacture methods according to claim 23, wherein comprise step described step (a): mixed metal powder, non-metal powder and sticker are to form described stream.
26., according to described manufacture method arbitrary in claim 23 to 25, comprise step: the insulation processing performing the outer surface to described camera module support further.
27. manufacture methods according to claim 26, comprise step further: the delustring process performing the outer surface to described camera module support.
28., according to described manufacture method arbitrary in claim 23 to 25, comprise step further: coating one reflective insulating material is in the outer surface of described camera module support.
One or more 29. manufacture method according to claim 27, in wherein said metal dust chosen from Fe, tungsten, molybdenum, copper, cobalt, nickel, titanium, tantalum, aluminium, tin, lead, tantalum, niobium, titanium, zirconium, beryllium, thorium, uranium.
30. manufacture methods according to claim 27, one or more in wherein said metal dust chosen from Fe, tungsten, molybdenum, copper, cobalt, nickel, titanium, tantalum, aluminium, tin, lead, tantalum, niobium, titanium, zirconium, beryllium, thorium, uranium, correspondingly, described non-metal powder is selected from one or more in graphite, carbon black, plastics, pottery.
The method of 31. 1 kinds of described camera module supports of manufacture, it is characterized in that, described manufacture method comprises step:
I () forms the stream based on metal dust;
(ii) mathematical model relevant to described camera module support is set up; And
(iii) described stream is used to print based on described mathematical model, with obtained described camera module support.
32. manufacture methods according to claim 31, wherein in described step (ii), also comprise step: the sample scanning described camera module support, to set up the described mathematical model with described camera module support.
33. manufacture methods according to claim 31, wherein in described step (ii), also comprise step: set up the described mathematical model relevant to described camera module support in a computer by modeling software.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510358084.0A CN104994259A (en) | 2015-06-26 | 2015-06-26 | Camera module support molded based on metal powder, and manufacturing method and application thereof |
| PCT/CN2016/086852 WO2016206595A1 (en) | 2015-06-26 | 2016-06-23 | Camera module support frame based on metal powder injection molding and manufacturing method and application thereof |
| TW105119814A TWI650017B (en) | 2015-06-26 | 2016-06-24 | Camera module bracket based on metal powder molding, manufacturing method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510358084.0A CN104994259A (en) | 2015-06-26 | 2015-06-26 | Camera module support molded based on metal powder, and manufacturing method and application thereof |
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| CN104994259A true CN104994259A (en) | 2015-10-21 |
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| CN201510358084.0A Pending CN104994259A (en) | 2015-06-26 | 2015-06-26 | Camera module support molded based on metal powder, and manufacturing method and application thereof |
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| TW (1) | TWI650017B (en) |
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| TW201713109A (en) | 2017-04-01 |
| TWI650017B (en) | 2019-02-01 |
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