CN109698894A

CN109698894A - Photosensory assembly and camera module based on metallic support

Info

Publication number: CN109698894A
Application number: CN201710985806.4A
Authority: CN
Inventors: 赵波杰; 梅哲文
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2017-10-20
Filing date: 2017-10-20
Publication date: 2019-04-30
Anticipated expiration: 2037-10-20
Also published as: WO2019076352A1; CN111345021A; CN109698894B

Abstract

Photosensory assembly and camera module based on metallic support, the photosensory assembly include a wiring board, a photosensitive element, a molded base, wherein the photosensitive element is electrically connected to the wiring board, the mould group is shaped in the wiring board and the photosensitive element.The photosensory assembly further includes a filter element and a metallic support, wherein the metallic support is installed on the top surface of the molded base, for installing the filter element, wherein being formed as the photosensitive element between the filter element, the filter element bracket and the molded base provides an optical window of passage of light.

Description

Photosensory assembly and camera module based on metallic support

Technical field

The present invention relates to the senses that a camera module field more particularly to one utilize metallic support installation filter element based on one Optical assembly and camera module.

Background technique

Camera module is one of an indispensable part of intelligent electronic device, citing ground but be not limited to smart phone, phase The intelligent electronic devices such as mechanical, electrical brain equipment, wearable device.And set in lightening, integrated trend intelligently, for The requirement of camera module is also higher and higher.Particularly, with the universal and development of smart machine, increasingly tend to lightening, phase It answers ground camera module to adapt to develop, also increasingly requires multifunctional integrated, lightening, miniaturization, so that camera module It is assembled in the volume energy occupied needed for intelligent electronic device accordingly to reduce, and meets equipment for the imaging requirements of camera module. Therefore camera module production firm is persistently dedicated to design, manufactures the camera module for meeting these requirements.

Molded packages technique is emerging on the basis of traditional COB (Chip on Board) packaging technology grow up A kind of encapsulation technology.It as shown in Figure 1A, is the circuit board assemblies being prepared using existing molded packages technique.In this knot In structure, a molded section 1 is packaged in a circuit board 2 by way of molded packages, integrally to coat at least the one of the circuit board Part and the electronic component for being assembled in the circuit board, such as sensitive chip 3, passive electronic component etc., and one filters Piece 4 is mounted on the top side of the molded section 1, to the space that independently occupies of the electronic component for reducing camera module and assemble The cooperation safe space reserved in journey, and solve asking for the dust influence camera module image quality adhered on electronic component Topic.However, this technical solution also brings some new technical problems.

Those skilled in the art will be appreciated that optical filter 4 is extremely important element in camera module, can cross optical filtering The veiling glares such as the infrared light in line, so that final imaging effect is more preferably close to visual effect observed by human eye.Due to the optical filtering Piece 4 is fragile and high sensitive delicate electronic device, and shared specific gravity is larger in the cost of entire camera module.Cause This, in molded packages technology, which becomes the difficult point of an implementation.

More specifically, compared to traditional COB packaged type, pass through the molded section 1 prepared by molded packages technique The electronic component that one cladding is installed on the circuit board 2 is set, and utilizes the spatial position of the electronic component.Therefore, Relative to the microscope base in traditional COB encapsulation technology, the installation space which is supplied to the optical filter 4 correspondingly increases. At this point, if the optical filter 4 is directly mounted at the corresponding region of the molded section top surface, face needed for the optical filter 4 by selection Product is larger.Correspondingly, the cost of optical filter is directly proportional to the area needed for it, and with the increase of optical filter area, preparation Precision is more difficult to control and its hardness accordingly reduces.Therefore, when the area needed for the optical filter 4 increases, not only mean cost Promotion, more mean install enforcement difficulty aggravation.

Further, in general, the optical filter 4 by direct-assembling in the top side of the molded section 1, with will by the molded section 1 Optical filter 4 is held in the top of the photosensitive region of the sensitive chip 3.The optical filter 4 is made of friable material, causes when the optical filtering When piece 4 is assembled in the molded section 1, which easily occurs broken or damages.

It is high in order to solve 4 installation difficulty of the optical filter, it is easily broken and problem at high cost, one kind exists in the prior art Improvement project: a filter element microscope base 5 is additionally provided to improve the mounting condition of the optical filter 4.As shown in Figure 1B, specific In implementation process, which is installed on the top surface of the molded section 1, to be somebody's turn to do by the filter element microscope base 5 substitution Molded section 1 installs the optical filter 4.Correspondingly, the optical filtering can be reduced by adjusting the mounting groove size of the filter element microscope base 5 Size needed for piece 4, and the broken of the optical filter 4 is prevented by the filter element microscope base 5 offer support force.

However, the existing filter element microscope base 5 passes through integral forming process, such as moulding technology or Shooting Technique, system At and obtain, have biggish thickness.For example, in the circuit board assemblies of existing camera module, in general, for example having at one In body embodiment, the height of the molded section 1 is 0.3mm, and the height of the circuit board 2 is 0.2mm, and the filter element microscope base 5 Height be 0.3mm or so, more than the half of the wiring board and the molded section whole height.Therefore, which mentions The high whole height of circuit board assemblies, so that the optic back focal of the camera module is correspondingly improved, and reduces optic back focal It is pursuit in camera module optical design always.

Summary of the invention

It is an object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein described take the photograph Picture mould group includes a metallic support, and the metallic support is matched with a molded base of the camera module, to be described The other component of camera module provides support.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein described Metallic support is installed on the top surface corresponding position of the molded base, is the camera module to substitute the molded base Filter element provides suitable installation site.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein described Metallic support is made of metal material, and for relatively existing filter element microscope base, has relatively thin thickness, so that The overall height dimension of the camera module can be contracted by.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein described Metallic support is made of metal material, and for relatively existing filter element microscope base, has relatively thin thickness, so that The optic back focal of the camera module can be contracted by.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein one In a little embodiments, the metallic support outer edge is in the outer peripheral inside of the molded base top surface, to avoid described Metallic support by side external impacts and fragmentation and further may cause the damage of the filter element.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein one In a little embodiments, a part of outer edge of the metallic support is located at outer edge and the camera lens/drive of the molded base top surface Between the outer edge of dynamic device/fixed lens barrel, thus avoid the metallic support by side external impacts and fragmentation and into one Step may cause the damage of the filter element, and complies with when being installed on electronic equipment the arc at electronic equipment edge or incline Inclined-plane.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein described Metallic support outer surface is formed with a light-absorption layer, to prevent the veiling glare reflected by the metallic support to be incident to the camera shooting mould The photosensitive region of group, influences image quality.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein described A lightproof area is formed between the light-absorption layer of metallic support outer surface and the molded base inner surface, thus by the molding base The light that base inner surface reflection reaches the light-absorption layer is absorbed by the light-absorption layer, to prevent its described photosensitive element of arrival and shadow Ring image quality.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein one In a little embodiments, the characteristics of being higher than lead with circuit board electronic component, the step surface can be not higher than the wiring board The height of electronic component and be not less than the lead height, so that the position of the metallic support be made further to move down.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein passing through Setting to metallic support light passing region provides preferably light passing channel for the camera module, with from physical structure Angle prevents extraneous stray light into the photosensitive region of the camera module.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein described Metallic support is made of metal material, thus during the subsequent camera module baking-curing, the metallic support It is not susceptible to deformation, to effectively ensure that the relative position between the metallic support and the device for being installed on the metallic support Relationship keeps stablizing.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein described Metallic support is made of metal material, with good thermal conductivity, so that in the worked of the subsequent camera module Cheng Zhong, the heat for resulting from the wiring board can be conducted and be radiated by the metallic support.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein described Metallic support is formed with an escape hole, and the escape hole is suitable for providing outlet during the camera module toasts fixed logical Mouthful, the enclosure space gas in the camera module is prevented, because expanded by heating causes the filter element to be damaged or be crushed.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein one In a little embodiments, the metallic support has a support slot, and the filter element is adapted to be mounted to the described of the filter element Support slot, so that the opposite sinking in the position of the filter element.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein described The height of support slot is slightly larger than the thickness of the filter element, so that when the filter element is installed on the filter element When the support slot, the filter element will not protrude the top surface of the metallic support, to be effectively prevented the filter It is touched between optical element and last optical lens of the camera module.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein by gold Belonging to the metallic support made of material has relatively high flatness, thus optical lens or drive when the camera module When dynamic device or fixed lens barrel are supported at the metallic support rather than the molded base, to be easy to the optical lens or described The Installation And Calibration of driver.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein working as institute When stating filter element and being assembled in the molded base by the metallic support, the size of the required filter element can be corresponding It reduces, to reduce cost.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein described Metallic support is made of metal material, processing technology relative maturity and simple, and metal material advantage of lower cost.

It is another object of the present invention to provide one photosensory assembly and camera module based on metallic support, wherein passing through Metal working process, such as stamping process can prepare the metallic support of different size to adapt to different camera modules Requirement for different metal bracket.

By following description, other advantages of the invention and feature will be become apparent, and can pass through right The means and combination particularly pointed out in claim are accomplished.

To reach an at least goal of the invention of the invention, the present invention provides a photosensory assembly comprising:

One wiring board；

One photosensitive element, the photosensitive element are electrically connected to the wiring board；

One molded base, wherein the molded base is shaped in the wiring board and the photosensitive element；

One filter element；And

One metallic support, wherein the metallic support is installed on the top surface of the molded base, for installing the filter Optical element provides wherein being formed as the photosensitive element between the filter element, the metallic support and the molded base One optical window of passage of light.

By the understanding to subsequent description and attached drawing, further aim of the present invention and advantage will be fully demonstrated.

These and other objects of the invention, feature and advantage, by following detailed descriptions, drawings and claims are obtained To fully demonstrate.

Detailed description of the invention

Figure 1A is the schematic cross-sectional view according to an a kind of circuit board assemblies of a camera module of prior art.

Figure 1B is the schematic cross-sectional view according to a circuit board assemblies of a camera module of another prior art.

Fig. 2 is the schematic cross-sectional view according to a camera module of a preferred embodiment.

Fig. 3 is a camera module schematic cross-sectional view of a variant embodiment of above-mentioned preferred embodiment according to the present invention.

Fig. 4 is a paths schematic diagram of the camera module of above-mentioned preferred embodiment according to the present invention.

Fig. 5 is the schematic cross-sectional view of another variant embodiment of the camera module of above-mentioned preferred embodiment according to the present invention.

Fig. 6 is the schematic cross-sectional view of another variant embodiment of the camera module of above-mentioned preferred embodiment according to the present invention.

Fig. 7 is the schematic cross-sectional view of another variant embodiment of the camera module of above-mentioned preferred embodiment according to the present invention.

Fig. 8 is the schematic cross-sectional view of another variant embodiment of the camera module of above-mentioned preferred embodiment according to the present invention.

Fig. 9 is the schematic cross-sectional view of another variant embodiment of the camera module of above-mentioned preferred embodiment according to the present invention.

Figure 10 is the schematic cross-sectional view of a camera module of one second preferred embodiment according to the present invention.

Figure 10 A is the section view signal of a variant embodiment of the camera module of above-mentioned second preferred embodiment according to the present invention Figure.

Figure 10 B is that the section view of another variant embodiment of the camera module of above-mentioned second preferred embodiment according to the present invention is shown It is intended to.

Figure 10 C is that the section view of another variant embodiment of the camera module of above-mentioned second preferred embodiment according to the present invention is shown It is intended to.

Figure 10 D is that the section view of another variant embodiment of the camera module of above-mentioned second preferred embodiment according to the present invention is shown It is intended to.

Figure 11 is that the section view of another variant embodiment of the camera module of above-mentioned second preferred embodiment according to the present invention is shown It is intended to.

Figure 12 is that the section view of another variant embodiment of the camera module of above-mentioned second preferred embodiment according to the present invention is shown It is intended to.

Figure 13 is the schematic cross-sectional view of a camera module of a third preferred embodiment according to the present invention.

Figure 14 is the exploded perspective schematic diagram of a camera module of one the 4th preferred embodiment according to the present invention.

Figure 15 is the exploded perspective schematic diagram according to a variant embodiment of the camera module of above-mentioned 4th preferred embodiment.

Figure 16 A is the schematic diagram of one of manufacturing step of the camera module in above preferred embodiment.

Figure 16 B is two schematic diagram of the manufacturing step of the camera module in above preferred embodiment.

Figure 16 C is three schematic diagram of the manufacturing step of the camera module in above preferred embodiment.

Figure 17 A is four schematic diagram of the manufacturing step of the camera module in above preferred embodiment.

Figure 17 B is five schematic diagram of the manufacturing step of the camera module in above preferred embodiment.

Figure 18 is six schematic diagram of the manufacturing step of the camera module in above preferred embodiment.

Figure 19 is seven schematic diagram of the manufacturing step of the camera module in above preferred embodiment.

Figure 20 is eight schematic diagram of the manufacturing step of the camera module in above preferred embodiment.

Specific embodiment

It is described below for disclosing the present invention so that those skilled in the art can be realized the present invention.It is excellent in being described below Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It defines in the following description Basic principle of the invention can be applied to other embodiments, deformation scheme, improvement project, equivalent program and do not carry on the back Other technologies scheme from the spirit and scope of the present invention.

It will be understood by those skilled in the art that in exposure of the invention, term " longitudinal direction ", " transverse direction ", "upper", The orientation of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" or position are closed System is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, without referring to Show or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore above-mentioned art Language is not considered as limiting the invention.

It is understood that term " one " is interpreted as " at least one " or " one or more ", i.e., in one embodiment, unitary The quantity of part can be one, and in a further embodiment, the quantity of the element can be it is multiple, term " one " cannot understand For the limitation to quantity.

Referring to attached drawing 2, a camera module of a first preferred embodiment is elucidated with according to the present invention, wherein the camera shooting mould Group can be applied to various electronic equipments, illustrate but be not limited to smart phone, wearable device, computer equipment, television set, friendship Logical tool, camera, monitoring device, the camera module cooperate the electronic equipment to realize acquisition and reproduction etc. to target image Function.

As shown in Fig. 2, the camera module includes a photosensory assembly 10 and an optical lens 20, wherein the optical lens 20 are located at the photosensitive path of the photosensory assembly 10, to acquire the image information of measured target by the optical lens 20.It is special Not, in the preferred implementation of the invention, the camera module is fixed-focus camera module, that is, the optical lens 20 and institute The focal length stated between photosensory assembly 10 is unadjustable.Particularly, the optical lens 20 is carried by a lens barrel 20 as camera lens Element is assembled in the top of the photosensory assembly 10.It is understood that with the improvement of packaging technology, the body of camera module Molded dimension is constantly reduced, and in other variant embodiment, the optical lens 20 is assembled in institute in a manner of " naked camera lens " State the top of photosensory assembly 10, that is, at this point, being not necessarily to the lens barrel 20 or the camera lens load-carrying unit, 20 quilt of optical lens It is directly mounted at the top area of the photosensory assembly 10, as shown in Figure 10 D.

Those skilled in the art will be appreciated that, in other embodiment of the present invention, as shown in figure 3, the camera module Dynamic burnt camera module can be also implemented as, that is, in this embodiment, the camera module further includes a driving element 30, described Driving element 30 is installed on the top side of the photosensory assembly 10, and the optical lens 20 is assembled in the driving element 30, thus Phase when the driving element 30 is driven, between the optical lens 20 and a photosensitive element 12 of the photosensory assembly 10 It changes to positional relationship, in this way, to realize the function of optical focusing.It is noted that the driving Element 30 includes but is not limited to voice coil motor, stepper motor, MEMS etc..

More specifically, as shown in Fig. 2, the photosensory assembly 10 includes a wiring board 11, a photosensitive element 12, He Yimo Mould pedestal 13.The photosensitive element 12 can conductively be connected to the wiring board 11, wherein the light from measured target passes through The photosensory assembly 10 simultaneously reaches the photosensitive element 12, will be by be further advanced by the photoresponse of the photosensitive element 12 The optical signal for surveying target, which is converted into electronic equipment, can recognize and operable electric signal, realizes the acquisition of measured target figure and reproduces Etc. functions.The molded base 13 is shaped in the wiring board 11 and the photosensitive element 12, and coats the wiring board 11 and the photosensitive element 12 at least part so that the photosensory assembly 10 and the camera module have it is compact and small The structure of type.

In presently preferred embodiment of the invention, the photosensitive element 12 can be for example, by SMT (Surface Mounting Technology, surface mount process) it is installed on the corresponding region of the wiring board 11, and it is further advanced by one group of lead 14 Realize the electric connection between the wiring board 11 and the photosensitive element 12.That is, in the preferred implementation of the invention In example, the photosensory assembly 10 further includes one group of lead 14, and the lead 14 extends the photosensitive element 12 and the route Between plate 11, the wiring board 11 and the photosensitive element 12 is connected by the lead 14.Those skilled in the art answers Know, the mode of the conducting wiring board 11 and the photosensitive element 12 is referred to as " beating gold thread " technique.It is noted that in this hair In bright, the mode of forward direction " beating gold thread " may be selected, i.e., the described lead 14 extends to the photosensitive element 12 from the wiring board 11, Or selecting the mode of reversed " beating gold thread ", i.e., the described lead 14 extends to the wiring board 11 from the photosensitive element 12, is connected The photosensitive element 12 and the wiring board 11, this is not limited to by the present invention.Certainly, in other embodiment of the invention In, the mode that the photosensitive element 12 is installed on the wiring board 11 can by other means, such as embed, FC (Flip Chip, flip chip mounting process) etc..Those skilled in the art is, it will be appreciated that in the present invention, the photosensitive element 12 and institute The mode for stating installation and conducting between wiring board 11 is not limitation of the invention.

Further, when the photosensitive element 12 is installed on the wiring board 11 and is conducted it with the wiring board 11 Afterwards, molding process planning is executed to form the molded base 13 in the photosensitive element 12 and the wiring board 11.Such as Fig. 2 institute Show, the molded base 13 is shaped in the photosensitive element 12 and the wiring board 11, and coats the photosensitive element 12 At least part and be installed on a series of electronic components of the wiring board 11, to not only effectively reduce the sense The overall dimensions of optical assembly 10, and effectively prevent dust, sundries in similar traditional camera module and be adhered to the electronics The photosensitive element 12 is polluted on component and influences imaging effect.More specifically, the molded base 13 includes a molding Base body 131 and an optical window 132 is formed by by the molded base main body 131, wherein the optical window is enclosure space, and Corresponding at least photosensitive region of the photosensitive element 12, to allow to be incident to from optical window 132 described in extraneous light-transmissive The photosensitive element 12, to complete Image Acquisition.Particularly, in presently preferred embodiment of the invention, the molded base master There is body 131 closed ring structure to prevent extraneous veiling glare from side in order to provide closed interior environment for the photosensitive element 12 Face enters the photosensitive element 12.

It is noted that preferably, in the present invention, the molded base main body 131 has centrosymmetric structure, tool There is an inner surface 1311, is defined as the inner surface 1311 of the molded base.The molded base inner surface 1311 can be in one Fixed slope up extends from the wiring board 11 and the photosensitive element 12 or the molded base inner surface 1311 is not in There is slope to upwardly extend from the wiring board 11 and the photosensitive element 12, i.e., the described molded base inner surface 1311 is substantially vertical In the wiring board 11., it will be appreciated that the molded base inner surface 1311 has in other embodiment of the invention Multistage surface, wherein extending in non-in same plane formula between each section surface, so that the molded base 13 has multistage Formula structure, for example, can have inclination extended segment and vertical extension member.

In order to enable the imaging effect of the camera module is closer to human eye vision, the photosensory assembly 10 further includes one Filter element 40, the filter element 40 are set between the optical lens 20 and the photosensitive element 12, for filtering The optical signal of the optical lens 20 measured target collected.Particularly, the filter element 40 is held in the optical frames First 20 and the photosensitive element 12 be formed by photosensitive path, thus pass through the optical lens 20 light by the optical filtering Element 40 is filtered so that be incident in the light of the photosensitive element 12 without the veiling glares such as infrared light, thus it is final at As effect is closer to the visual effect of human eye.In the present invention, the filter element 40 citing ground but it is not limited to infrared cutoff Optical filter, smalt optical filter, wafer scale cutoff filter.In a further embodiment, it is also possible to which full impregnated piece can Light-exposed optical filter.

Correspondingly, as shown in Fig. 2, in presently preferred embodiment of the invention, the photosensory assembly 10 further includes a metal Bracket 50, the metallic support 50 are set between the filter element 40 and the molded base 13, to pass through the metal Bracket 50 improves the mounting condition and installation environment of the filter element 40.More specifically, the metallic support 50 is installed on The top surface of the molded base 13, for installing the filter element 40.Therefore, in presently preferred embodiment of the invention, The filter element 40 is installed on the top surface of the molded base 13 with being not directly contacted with, so that the molded base 13 pushes up table The Forming Quality and size in face not will cause direct influence to the installation of the filter element 40.That is, in the present invention The preferred embodiment in, the metallic support 50 substitute the molded base 13 be the filter element 40 installation is provided Position, therefore, the installation environment and mounting condition of the filter element 40 depend on the feature of the metallic support 50.In addition, institute 50 thickness of metallic support is stated in 0.03-0.2mm, can generally reduce height to 0.1mm hereinafter, for example can be the left side 0.08mm The right side, to be substantially reduced the height of the photosensory assembly.

Particularly, as shown in Fig. 2, in presently preferred embodiment of the invention, the metallic support 50 is by metal material system At with relatively high flatness.When the filter element 40 is installed on the metallic support 50, the filter element Uniform force between 40 and the contact surface of the metallic support 50 is being installed to significantly reduce the filter element 40 In the process, probability that is broken or damaging is caused due to unbalance stress.Meanwhile the filter element 40 and the metallic support 50 Overlappingly it is arranged, therefore, the flatness of the filter element 40 depends on the flatness of the metallic support 50.Therefore, at this In the preferred embodiment of invention, the filter element 40 has relatively high flatness, to pass through the optical lens 20 light can be actively filtered at the filter element 40.

Further, as shown in Fig. 2, the metallic support 50 has closed planar ring structure comprising an annular Main body 51 and the light admission port 52 formed by the annular body 51, wherein the metallic support 50 is installed on the molded base When 13, the annular body 51 partially overlapping fits in 13 top surface of molded base, meanwhile, the light admission port 52 is corresponding In the optical window 132 of the molded base main body 131, to form complete passage of light., it will be appreciated that the annular is main Body 51 partially overlapping fits in 13 top surface of molded base and extends to the inside of the molded base 13, therefore, Area needed for being installed on the filter element 40 of the annular body 51 of the metallic support 50 can be reduced accordingly, with drop Low cost and reduction installation difficulty.

In addition, the light admission port 52 of the metallic support 50 corresponds to the optical window 132 of the molded base 13, because This adjusts the feature of the light admission port 52 of the metallic support 50, and the photosensitive angle of the photosensitive element 12 and photosensitive can be changed Range.More specifically, in the preferred implementation of the invention, the metallic support 50 by partial suspended is supported in the mould The top surface of pedestal 13 is moulded, therefore, the light admission port 52 of the metallic support 50 is dimensioned slightly smaller than the molded base 13 The optical window 132, thus the light admission port 52 can photosensitive angle to the photosensitive element 12 and sensitive volume carry out into one The limitation of step ground.Preferably, as shown in Fig. 2, the inner surface of the light admission port 52 is inclined surface 511, and 511 court of the inclined surface To the photosensitive element 12, in this way, limits into angular and enter optical range corresponding to the photosensitive element 12 Photosensitive region.It is noted that in the present invention, the light admission port 52 can pass through metal etching process or metal erosion technique It is process, so that the inclined surface 511 of the light admission port 52 has relatively high flatness.Certainly, this field Technical staff will be appreciated that the light admission port 52 of the filter element 40 can be also prepared by metal stamping process, however, Due to that may generate bigger burr, the inside edge of the light admission port 52 and the inclined surface 511 need further Ground finishing.

It is noted that in presently preferred embodiment of the invention, when the metallic support 50 is installed on the molding When 13 top surface of pedestal, the outer ledge of the metallic support 50 is located at the inside of 13 outer peripheral edge of molded base, passes through this The mode of sample prevents the metallic support 50, during subsequent installation and use, because being squeezed or being impacted by its side And generating a folding force causes the filter element 40 by damaged or fragmentation.That is, in the preferred implementation of the invention In example, the outer ledge of the metallic support 50 does not protrude from 13 outer peripheral edge of molded base, thus, in subsequent installation and make During, 50 side of metallic support is in the state of not stressing always, to avoid due to the metallic support 50 deformation It makes and claims the filter element 40 that breakage occurs.

More specifically, as shown in Fig. 2, the outer ledge of the metallic support 50 is close to 13 periphery of molded base Edge, thus, on the one hand, it is (relatively large to connect that the metallic support 50 can be stably mounted at 13 top surface of molded base Contacting surface product), on the other hand, the molded base 13 can effectively obstruct extraneous installation object, such as the shell of smart phone, with The side of the metallic support 50 is touched, so that the side of the metallic support 50 is in the state of not stressing always, from And the filter element 40 can be effectively prevented and be crushed or damage due to the metallic support 50 is bent.It is noted that 50 edge of metallic support is close to 13 outer peripheral edge of molded base, that is to say, that the almost covering of metallic support 50 The all areas of 13 top surface of molded base, thus during subsequent assembling optical lens 20, the light 13 top surface of molded base can be assembled in by direct-assembling in the metallic support 50, rather than traditionally by learning camera lens 20.It answers Understanding, the metallic support 50 is made of metal material, with relatively high flatness, thus, it is more conducively described The calibration and adjustment of optical lens 20.It, can be more detailed in the description of the subsequent optical lens 20 about this partial content Carefully illustrate.

Certainly, those skilled in the art will be appreciated that, in other variant embodiment of the invention, the metallic support 50 may be disposed at the top surface of the molded base 13, and be located at the inside of the optical lens 20, at this point, the optical lens 20 are assembled in 13 top surface of molded base, and the metallic support 50 is effectively isolated in the optical lens 20 Inside.That is, the metallic support 50 does not provide in the variant embodiment of the invention for the optical lens 20 Seating surface is installed.

One variant embodiment of the metallic support 50 as shown in Fig. 8, wherein the metallic support 50 has Heavy mounting structure 53, so that the installation site of the filter element 40 gos deep into the optical window 132.That is, in the present invention The variant embodiment in, the metallic support 50 have stereochemical structure.More specifically, in this embodiment of the invention, The metallic support 50 includes an annular body 51, prolongs arm 531 and at least a sinking arm 532 at least one, wherein the sinking Arm 532 and the interior arm 531 that prolongs form the sink structures.As shown in figure 8, the sinking arm 532 is from the annular body 51 Ground, longitudinally one extension are turned to, to reduce the installation site height of the filter element 40, thus 40 phase of the filter element It is touched between separate last a piece of lens of the optical lens 20 to prevent terminating in the optical lens 20, and closer to In the photosensitive element 12, in favor of filtering veiling glare.Prolong the 531 son sinking arm 532 of arm in described and turns to ground, laterally one Extend, in order to provide the installation site of horizontal direction for the filter element 40, so that the filter element 40 and the sense The optical axis of optical element 12 is consistent.Specifically, in an embodiment of the present invention, the metallic support 50 includes the institute of four integrally connecteds Prolong the sinking arm 532 of arm 531 and four integrally connecteds in stating, it is each it is described in prolong arm 531 and each sinking arm 532 not Extend with position to form the sinking mounting structure 53.

It is noted that in the variant embodiment of the invention, since the filter element 40 is by metal material system At with relatively good ductility.Therefore, during actual processing forms metallic support 50, such as pass through Metal stamping process, the metallic support 50 can be stamped to form various differences in height, to meet the camera module of different size It is required that.To it is not necessary that similar in the prior art, the molding die for needing replacing 40 microscope base of filter element can prepare different size 40 microscope base of filter element so that cost can be further reduced.

In particular, in the present invention, the metallic support 50 is made of metal material, with relatively thin Thickness, so as to further reduce the height of the camera module on the whole.Particularly, pass through compared to existing Shooting Technique is formed by 40 microscope base of filter element, and the thickness of the metallic support 50 can be by substantially as made by metal material Reduction, to reduce the optic back focal and its whole height of the camera module.

Further, in the present invention, the metallic support 50 is made of metal material, for example, for example iron-based, aluminium base or Copper-based material etc..Such as in a specific example, it is implemented as a steel disc.It is well known that metal material light with higher Reflecting properties can generate more reflection veiling glare.In order to eliminate influence of this factor to image quality, further it is arranged one Corresponding region of the light-absorption layer 54 between the filter element 40, to prevent light from reflecting on 50 surface of metallic support And enter the photosensitive element 12, to influence final imaging effect.

More specifically, as shown in Fig. 2, in presently preferred embodiment of the invention, the light-absorption layer 54 is covered in described The outer surface of metallic support 50, so that the light portion for passing through the optical lens 20 passes through described in the light admission port 52 entrance Photosensitive element 12, and the light that part falls within 50 surface of metallic support is absorbed by the light-absorption layer 54, in this way Mode is effectively prevented and falls within the light on 50 surface of metallic support and enter the photosensitive element 12, shadow by multiple reflections Ring image quality.Preferably, as shown in figure 4, the light-absorption layer 54 be set to simultaneously the filter element 40 bottom surface and Top surface, thus fall within the veiling glare of 50 top surface of metallic support and be incident to the veiling glare of 50 bottom surface of metallic support, It can all be efficiently absorbed.It is incident to 13 inner surface of molded base and is reflected to up to the miscellaneous of 50 bottom surface of metallic support Light can also be absorbed by the light-absorption layer 54, so that 50 bottom surface of 13 inner surface of the molded base and the metallic support is described It is equivalent to form a lightproof area between light-absorption layer 54.It is highly preferred that the suction in order to further assure that the light-absorption layer 54 The entire outer surface for covering the metallic support 50 is set in light effect, the light-absorption layer 54.Certainly, those skilled in the art It will be appreciated that as shown in figure 9, the light-absorption layer 54 can only be arranged at the gold in other variant embodiment of the invention Belong to bracket 50 close to the region of the light admission port 52, to reduce the probability that the reflection veiling glare enters the photosensitive element 12.

It is noted that the light-absorption layer 54 can be formed in the phase of the metallic support 50 by platingization or film coating process Answer region.It should be understood by those skilled in the art that in the present invention, the generation type of the light-absorption layer 54 is not of the invention Limitation., it will be appreciated that the technique for forming the light-absorption layer 54 executes after 50 punch forming of metallic support, to prevent Described in punching press during metallic support 50, the light-absorption layer 54 is scratched and its globality is destroyed.Preferably, institute Stating light-absorption layer 54 is made of a black absorbing light-proof material.In addition, in other deformation implementation, it is also possible to by institute It states that metallic support 50 is surface roughening, is incident to the veiling glare being reflected after the metallic support 50 to reduce.

In order to further assure that the metallic support 50 can satisfy the requirement of certain stray light, as shown in Figure 10 A, institute Stating filter element 40 includes a filter element main body 41 and a light shield layer 42, that is, be may be selected in the respective area of the filter element 40 A light shield layer 42 is additionally arranged in domain, to limit the transparency range of the filter element 40 by the light shield layer 42.More specifically It says, in presently preferred embodiment of the invention, the light shield layer 42 is formed in 40 top surface of filter element, so that described The filter element main body 41 of filter element 40 has a peripheral part 411 and an optical filtering portion 412 positioned at periphery, wherein passing through The optical lens 20 light collected can enter the photosensitive element 12 through the optical filtering portion 412.Therefore, settable The relative positional relationship of the peripheral part 411 and the optical filtering portion 412 realizes the further limit to daylighting range and lighting angle It is fixed.

It is noted that in the present invention, the light shield layer 42 can be made of light absorbent or by that can reduce instead The material of light is made, and manufacturing process can be the techniques such as photoresist or silk-screen, and black absorbing light-proof material is formed in The surface of the filter element main body 41.

, it will be appreciated that in the actual implementation process, the position of the peripheral part 411 can carry out accordingly according to actual needs Adjustment.For example, in other embodiment of the present invention, the light shield layer 42 can be formed in the filter of the filter element 40 The bottom surface of optical element main body 41, as shown in Figure 10 B.That is, in this embodiment, the bottom surface of the filter element 40, which is equipped with, to be hidden Photosphere 42.Particularly, the inward flange of the light shield layer 42 is more than or is aligned 50 inside edge of metallic support, to limit State the size in camera module light passing region.The veiling glare for being incident to 13 inner surface of molded base is reflected onto the light shield layer 42 When be absorbed, to reduce the stray light for reaching the photosensitive element 12.

In other embodiment of the invention, as illustrated in figure 10 c, the light shield layer 42 can be set to the optical filtering simultaneously The front and back of element 40, and preferably, the light shield layer 42 for being formed in front and back is corresponding, to be protected by double Dangerous mechanism further assures that the filter element 40 can satisfy certain stray light requirement.

Further, those skilled in the art will be appreciated that, when the metallic support 50 passes through viscous glutinous medium, such as glue Water, the corresponding position and the filter element 40 for fitting in 13 top surface of molded base are installed on the metallic support After 50, the photosensory assembly 10 need to carry out baking-curing with the fixation metallic support 50 in the molded base 13.It needs It is noted that the filter element 40, the metallic support 50 and the molded base 13 form a confined space, that is, light Window, so that the gas in the confined space impacts the optical filtering because of expanded by heating during carrying out baking-curing Element 40, with may cause the filter element 40 occur it is damaged or broken.

Correspondingly, in order to solve this problem, referring to figures 16 to the manufacturing process of Figure 20, and it is specific such as Figure 18 or such as Figure 19 Shown, the filter element 40 is additionally provided with an escape hole 55, wherein the confined air that the escape hole 55 and the optical window 132 are formed Between be conducted, so that the gas of expanded by heating can be diffused by the escape hole 55 during carrying out baking-curing Outside is increased sharply with to be effectively prevented air pressure inside and causes unnecessary impact to the filter element 40.More specifically, exist In presently preferred embodiment of the invention, the escape hole 55 is positioned adjacent to the light admission port 52 of the metallic support 50, and And when the metallic support 50 is mounted on the corresponding position of the molded base 13, the escape hole 55 and the optical window 132 The confined space of formation is connected.Further, described to escape gas when the filter element 40 is installed on the metallic support 50 55 part of hole is covered by the filter element 40, is partially exposed to the external world, so that being located at the closed of the optical window 132 formation Gas in space can be diffused into the external world by being exposed to the extraneous naughty port region.

It should be understood by those skilled in the art that the escape hole 55 is most after 10 baking-curing of photosensory assembly It recloses well, to prevent extraneous dust from penetrating into inside the photosensory assembly 10 by the naughty mouth, influences image quality.Phase Ying Di, in presently preferred embodiment of the invention, the escape hole 55 has a connected region 551 and a finalization area.When the filter When optical element 40 is set to the metallic support 50,55 part of escape hole overlaps with the filter element 40, to be formed The connected region 551 and the finalization area, wherein the connected region 551 extend into the confined space that the optical window 132 is formed with For gas communication, the finalization area corresponds to 13 top surface of molded base, to seal for sealing.

Preferably, in presently preferred embodiment of the invention, the finalization area integrally extends the connected region 551, and The opening size of the finalization area be greater than the connected region 551 opening size, in favor of it is subsequent in finalization area apply glue into Row sealing is fixed.It is highly preferred that the opening depth of the finalization area is greater than the opening depth of the connected region 551, to avoid applying The glue overflow of the finalization area is added on to the sealing space, to prevent the photosensitive element 12 contaminated.

Those skilled in the art should be readily apparent that, in other embodiment of the invention, the gas channel of escaping can be set It is placed in the top of the molded base 13.More specifically, described be formed in the top of molded base 13 with escaping gas channel recess Portion, so that described one end for escaping gas channel is connected to the confined space that the optical window 132 is formed, it is described to escape the opposite of gas channel One end be connected to the external world, thus when carry out baking it is fixed during, in the confined space that the optical window 132 is formed Gas can edge it is described escape gas channel and circulate, prevent air pressure surge from damaging to the optical filtering original cost.Preferably, exist In the embodiment of the invention, the gas channel of escaping is set to a soft board side of the photosensory assembly 10, which is because, the side The molded base 13 it is narrow, be easy to the processing for escaping gas channel.

It is noted that the metallic support 50 is made of metal material, thus during baking-curing, it is described Metallic support 50 is not susceptible to deformation, to effectively ensure that the metallic support 50 and be installed on the device of the metallic support 50 Between relative positional relationship keep stablize.

Further, after 10 baking-curing of photosensory assembly, the optical lens 20 need to be assembled in the molding 13 top side of pedestal., it will be appreciated that the metallic support 50 can be assembled in the metal in presently preferred embodiment of the invention Bracket 50 rather than the molded base 13.Therefore, installation of the Forming Quality of the molded base 13 to the optical lens 20 It is not influenced directly with calibration.Particularly, it since the metallic support 50 is made of metal material, is put down with relatively high Whole degree, therefore, the optical lens 20 can be assembled in the metallic support 50 by way of being mechanically fixed, and have relatively High precision, so as to substantially reduce the Installation And Calibration cost of the optical lens 20.Certainly, those skilled in the art answers Know, the optical lens 20 equally can be assembled in the metal branch by way of active calibration (Active Alignment) Frame 50, to ensure the installation accuracy of the optical lens 20.

Correspondingly, when the optical lens 20 is assembled in the metallic support 50, the metallic support 50 is limited in Between the molded base 13 and the optical lens 20, to prevent, in the subsequent use process, the metallic support 50 because Camera module shakes and positional shift occurs.

It is noted that the optical lens 20 passes through 30 groups of a driving element in the other embodiment of invention Loaded on the metallic support 50.Similarly, the metallic support 50 with relatively high flatness similarly serves to favor the driving The Installation And Calibration of element 30.Further, those skilled in the art should be readily apparent that, the metallic support 50 can be solution The twin-lens installation calibrating of double camera modules is difficult, provides corresponding solution.

Referring to attached drawing 11, a camera module of one second preferred embodiment according to the present invention is elucidated with, wherein described the The structure of the camera module shown in two preferred embodiments is substantially consistent with structure shown in first preferred embodiment, in addition to institute State the installation site of metallic support 50A.

Particularly, as shown in figure 11, in presently preferred embodiment of the invention, the top surface of the molded base 13A has There is a step surface 133A of inside, the step surface 133A is formed on the inside of the molded base 13A, for supporting the metal Bracket 50.Correspondingly, the metallic support 50A includes an annular body 51A and the light passing that is formed by the annular body 51 Mouth 52A, wherein the annular body 51A is partially overlapping pasted when the metallic support 50A is installed on the molded base 13A Together in the step surface 133A of the molded base 13A, meanwhile, the light admission port 52A corresponds to the molded base main body The optical window 132A of 131A, to form complete passage of light., it will be appreciated that in presently preferred embodiment of the invention, The metallic support 50A is installed on step surface 133A, so that the relatively described optical lens 20A of the metallic support 50A is separate, It is touched to be effectively prevented between the filter element 40A and the last a piece of lens of the optical lens 20A.It is preferred that Ground, using circuit board electronic component be higher than lead the characteristics of, the step surface 133A can be not higher than the wiring board electricity The height of sub- component and be not less than the lead height, so that the position of the metallic support 50A be made further to move down.

The light admission port 52A of the metallic support 50A corresponds to the optical window 132A of the molded base 13A, because This adjusts the feature of the light admission port 52A of the metallic support 50A, can be changed the photosensitive element 12A photosensitive angle and Sensitive volume.More specifically, in the preferred implementation of the invention, the metallic support 50A is partially supported in the mould Step surface 133A described in pedestal 13A is moulded, therefore, the light admission port 52A's of the metallic support 50A is dimensioned slightly smaller than the mould The optical window 132A of pedestal 13A is moulded, so that the light admission port 52A can photosensitive angle to the photosensitive element 12A and photosensitive Range is further limited.Preferably, the inner surface of the light admission port 52A is inclined surface 511A, and the inclined surface 511A is towards the photosensitive element 12A, in this way, limits into angular and enters optical range corresponding to the photosensitive member The photosensitive region of part 12A.

It is noted that the metallic support 50A is installed on the molding base in presently preferred embodiment of the invention The step surface 133A of seat 13A so that the metallic support 50A can protecting field be located at the inside of the molded base 13A, In this way, prevent the metallic support 50A, in subsequent installation and during use, because by its side by crowded Pressure or impact and generating a folding force causes the filter element 40A by damaged or fragmentation.

Further, a variant embodiment of the metallic support 50A as shown in Fig. 12, wherein the metallic support 50A has a sinking mounting structure 53A, so that the installation site of the filter element 40A gos deep into the optical window 132A.Also It is to say, in the variant embodiment of the invention, the metallic support 50A has stereochemical structure.More specifically, in the present invention The embodiment in, the metallic support 50A includes an annular body 51A, prolongs arm 531A and at least a sinking arm at least one 532A, wherein the sinking arm 532A and the interior arm 531A that prolongs form the sinking mounting structure 53A.As shown in figure 12, institute It states sinking arm 532A and turns to ground, longitudinally one extension from the annular body 51A, to reduce the peace of the filter element 40A Holding position height, so that the filter element 40A is relatively distant from the optical lens 20A to prevent terminating in the optical lens 20A Last a piece of lens between touch, and the photosensitive element 12A is closer to, in favor of filtering veiling glare.Prolong in described Arm 531A turns to ground, laterally one extension from the sinking arm 532A, in order to provide level side for the filter element 40A To installation site so that the filter element 40A is consistent with the optical axis of the photosensitive element 12A.Specifically, of the invention In implementation, the metallic support 50A include four integrally connecteds it is described in prolong arm 531A and four integrally connecteds it is described under Heavy arm 532A, each interior arm 531A and each sinking arm 532A of prolonging extend in different location to form the sinking installation knot Structure 53A.

It is noted that in the variant embodiment of the invention, since the filter element 40A is by metal material system At with relatively good ductility.Therefore, during actual processing forms the metallic support 50A, such as pass through Metal stamping process, the metallic support 50A can be stamped to form various differences in height, to meet the camera module of different size It is required that.To it is not necessary that similar in the prior art, the molding die for needing replacing filter element 40A microscope base can prepare different rule The filter element 40A microscope base of lattice, so that cost can be further reduced.

Referring to attached drawing 13, a camera module of a third preferred embodiment according to the present invention is elucidated with, wherein described the The structure of the camera module shown in three preferred embodiments is substantially consistent with structure shown in first preferred embodiment, in addition to institute State the structure configuration of metallic support 50B.

Those skilled in the art will be appreciated that, with the development of molding process planning, the photosensory assembly 10 after molding Size it is smaller and smaller, or even have existed some optical lens 20B size it is bigger than the size of photosensory assembly 10B.At this point, such as The optical lens 20B is assembled in the top side the molded base 13B by fruit, and the part optical lens 20B is vacantly arranged, ties Structure is unstable.

Correspondingly, as shown in figure 13, in presently preferred embodiment of the invention, the metallic support 50B highlightedly extends In the peripheral part of the molded base 13B, for the optical lens 20B that support section is vacantly arranged, in order to reinforce State the support construction of optical lens 20B.That is, the metallic support 50B is institute in presently preferred embodiment of the invention It states optical lens 20B and one support platform is provided.

Particularly, in the preferred implementation of the invention, the outboard peripheries of the metallic support 50b are located at the optical frames The inside of head 20B peripheral part, so that when the camera module is assembled in an electronic equipment, such as smart phone, the gold The side for belonging to bracket 50B will not collide with the electronic equipment, deform to avoid the metallic support 50B and generate a folding force And destroy the filter element 40B.That is, in presently preferred embodiment of the invention, the prominent institute of the metallic support 50 The length for stating molded base 13B peripheral part is less than the length of the prominent molded base 13 of the optical lens 20B.

, it will be appreciated that the camera module provided by third preferred embodiment of the invention is non-suitable for complying with electronic equipment The installation of flat face.For example, as shown in figure 13, the camera module is installed in an electronic equipment, the wherein electronic equipment Shell 80B has an arc-shaped curved surface.At this point, the camera module of traditional box-shaped obviously can not adapt to mounting condition at this time. Specifically, in the assembling camera module during electronic equipment, the molded base 13B is set to shell 80B Side, the optical lens 20B dislocation of the camera module is protrusively provided and inconsistent with the other side of shell 80B, with Form stable fixed structure.

Referring to attached drawing 14, an array camera module of one the 4th preferred embodiment according to the present invention is elucidated with.The battle array Column camera module includes that a camera module includes multiple photosensory assembly 10C and multiple optical lens 20C, wherein the optics Camera lens 20C is located at the photosensitive path of the photosensory assembly 10C, to acquire the image of measured target by the optical lens 20C Information.Particularly, in the preferred implementation of the invention, the camera module is implemented as the even more mesh of binocular camera shooting mould group Camera module, that is, the camera module includes two or more optical lens 20C.Do not limited in this respect by the present invention.

It is noted that the binocular camera shooting mould group can be implemented as the double camera modules of fixed-focus, that is, the optical lens Focal length between 20C and the photosensory assembly 10C is unadjustable.Particularly, the optical lens 20C can by a lens barrel 20C, As camera lens load-carrying unit, it is assembled in the top of the photosensory assembly 10C.It is understood that with the improvement of packaging technology, The size of camera module is constantly reduced, and in other variant embodiment, the optical lens 20C is with " naked camera lens " Mode is assembled in the top of the photosensory assembly 10C, that is, at this point, being not necessarily to the lens barrel 20C or the camera lens load-carrying unit, institute State the top area that optical lens 20C is directly mounted to the photosensory assembly 10C.Or double camera modules are that dynamic coke is taken the photograph As mould group, the optical lens 20C is assembled in a corresponding driver.

More specifically, as shown in figure 14, the photosensory assembly 10C includes an at least wiring board 11C, two photosensitive elements 12C, and an at least molded base 13C.The photosensitive element 12C can conductively be connected to the wiring board 11C respectively, wherein coming The photosensory assembly 10C is passed through from the light of measured target and reaches each photosensitive element 12C, to be further advanced by each institute Stating the photoresponse of photosensitive element 12C and converting electronic equipment for the optical signal of measured target can recognize and operable telecommunications Number, realize the functions such as the acquisition of measured target figure and reproduction.The molded base 13C be shaped in the wiring board 11C and The photosensitive element 12C, and at least part of the wiring board 11C and the photosensitive element 12C are coated, so that the sense Optical assembly 10C and the camera module have compact and miniaturization structure.

It is noted that in the present invention, the wiring board 13C can be integral type wiring board or split type wiring board, Wherein when the wiring board 13C is integral type wiring board, the photosensitive element 12C is accordingly mounted on the wiring board 13C Corresponding region, to provide smooth mounting surface by the integral type wiring board 13C for the photosensitive element 12C.When described When wiring board 13C is split type wiring board, the wiring board 13C includes two seperated wiring boards, and the fission wiring board is fitted respectively In the attachment photosensitive element 13C.At this point, the assembly and working space between the two seperated wiring boards are more independent.

In presently preferred embodiment of the invention, the photosensitive element 12C can be for example, by SMT (Surface Mounting Technology, surface mount process) it is respectively arranged in the corresponding region of the wiring board 11C, and further The electric connection between the wiring board 11C and the photosensitive element 12C is realized by one group of lead 14C.The technology of this field Personnel will be appreciated that the mode of the conducting wiring board 11C and the photosensitive element 12C are referred to as " beating gold thread " technique.It need to point out It is that in the present invention, the mode of forward direction " beating gold thread " may be selected, i.e., the described lead 14C extends to described from the wiring board 11C Photosensitive element 12C, or select the mode of reversed " beating gold thread ", i.e., the described lead 14C extends to described from the photosensitive element 12C The photosensitive element 12C and the wiring board 11C is connected in wiring board 11C, this is not limited to by the present invention.

Further, when the photosensitive element 12C is installed on the wiring board 11C and is conducted with the wiring board 11C Later, molding process planning is executed to form the molded base 13C in the photosensitive element 12C and the wiring board 11C.Institute It states molded base 13C and is shaped in the photosensitive element 12 and the wiring board 11C, and coat the photosensitive element 12 extremely Lack a part and be installed on a series of electronic components of the wiring board 11C, to not only effectively reduce described photosensitive The overall dimensions of component 10C, and effectively prevent dust, sundries in similar traditional camera module and be adhered to the electronics member The photosensitive element 12C is polluted on device and influences imaging effect.Correspondingly, in the present invention, the molded base can be one Body formula molded base, i.e., the described molded base be shaped in the wiring board (integral type wiring board or split type wiring board) and The photosensitive element.It is also possible that the molded base is split type molded base, i.e., the described molded base includes two only Vertical molded base, the fission molded base are shaped in the wiring board and the photosensitive element respectively.

More specifically, the molded base 13C is including a molded base main body 131C and by the molded base main body 131C is formed by an at least optical window 132C, wherein the optical window 132C is enclosure space, and corresponds respectively to the photosensitive member At least photosensitive region of part 12C, to allow to be radiated to the photosensitive element from optical window 132C described in extraneous light-transmissive 12C, to complete Image Acquisition.Particularly, in presently preferred embodiment of the invention, the molded base main body 131C has envelope Closed-loop shaped structure prevents extraneous veiling glare from described in the entrance of side in order to provide closed interior environment for the photosensitive element 12C Photosensitive element 12C.

In order to enable the imaging effect of the camera module, closer to human eye vision, the photosensory assembly 10C further includes Two filter element 40C, the filter element 40C are respectively arranged between the optical lens 20C and the photosensitive element 12C, With the optical signal for filtering the optical lens 20C measured target collected.Particularly, the filter element 40C is kept It is formed by photosensitive path in the optical lens 20C and the photosensitive element 12C, to pass through the optical lens 20C Light filtered by the filter element 40C so that being radiated in the light of the photosensitive element 12C without infrared light etc. Veiling glare, thus visual effect of the final imaging effect closer to human eye.

Further, the photosensory assembly 10C further includes that an at least metallic support 50C, the metallic support 50C is set to Between the filter element 40C and the molded base 13C, to improve the filter element 40C by the metallic support 50C Mounting condition and installation environment.That is, at this point, the filter element is installed on the molded base with being not directly contacted with Top surface, therefore, the Forming Quality and size of the molded base top surface not will cause the installation of the filter element It is direct to influence.

Particularly, in presently preferred embodiment of the invention, the metallic support is made of metal material, and is had opposite Higher flatness, to be more advantageous to the installation calibrating of the filter element 40C and the optical lens 20C.More Say to body, when the filter element 40C is installed on the metallic support 50C, the filter element 40C and the metallic support Uniform force between the contact surface of 50C, so that the filter element 40C is significantly reduced, during the installation process, due to stress It is uneven and lead to probability that is broken or damaging.Meanwhile the filter element 40C and the metallic support 50C are overlappingly arranged, because This, the flatness of the filter element 40C depends on the flatness of the metallic support 50C.Therefore, of the invention this preferably In embodiment, the filter element 40C has relatively high flatness, so that the light across the optical lens 20C exists It can be actively filtered at the filter element 40C.

When the optical lens is assembled in the metallic support, due to metallic support flatness with higher, So as to be assembled in the metallic support 50C by way of being mechanically fixed, to substantially reduce the installation of the optical lens 20C With calibration cost.Certainly, those skilled in the art will be appreciated that, the optical lens 20C can equally pass through active calibration The mode of (Active Alignment) is assembled in the metallic support 50C, to ensure the installation essence of the optical lens 20C Degree.

It is noted that as shown in figure 14, in presently preferred embodiment of the invention, the metallic support 50C has Integral structure, i.e., the described metallic support includes an annular body 51C and has two light admission port 52C, wherein when the metal branch When frame 50C is assembled in the molded base 13C top surface, the annular body 51C fits in the top table of the molded base 13C Face, the light admission port 52C correspond respectively to the optical window 132C and the photosensitive element 12C.Certainly, those skilled in the art It is envisioned that as shown in figure 15, the metallic support 50C has split type structure in other variant embodiment of the invention, The i.e. described photosensory assembly 10C includes two independent metal bracket 50C, and the metallic support 50C is respectively adapted to be mounted on the molding The top surface of pedestal 13C, and the light admission port 52C of the metallic support 50C corresponds respectively to the optical window 132 and the sense Optical element 13C.In addition, the filter element 40 of multiple photosensory assemblies is also possible to integral structure or respectively independent.

Further, in the present invention, the metallic support 50C is made of metal material, such as iron-based, aluminium base or copper-based Material etc..Such as in a specific example, it is implemented as a steel disc.It is well known that metal material light reflection with higher Performance can generate more reflection veiling glare.In order to eliminate influence of this factor to image quality, an extinction is further set Corresponding region of the layer 54C between the filter element 40C, to prevent light from reflecting on the surface the metallic support 50C And enter the photosensitive element 12C, to influence final imaging effect.

More specifically, in presently preferred embodiment of the invention, the light-absorption layer 54C is covered in the metallic support The outer surface of 50C, so that being passed through described in light admission port 52C entrance by the optical lens 20C light portion collected Photosensitive element 12C, and the light that part falls within the surface the metallic support 50C is absorbed by the light-absorption layer 54C, in this way Mode, be effectively prevented and fall within the light on the surface the metallic support 50C and enter the photosensitive element by multiple reflections 12C influences image quality.Preferably, the light-absorption layer 54C is set to bottom surface and the top of the filter element 40C simultaneously Surface, thus fall within the veiling glare of the metallic support 50C top surface and be radiated to the veiling glare of the metallic support 50C bottom surface, It can all be efficiently absorbed.It is highly preferred that the extinction effect in order to further assure that the light-absorption layer 54C, the light-absorption layer 54C The entire outer surface for covering the metallic support 50C is set.Certainly, those skilled in the art will be appreciated that, of the invention In other variant embodiment, the light-absorption layer 54C can only be arranged at the metallic support 50C close to the light admission port 52C Region, with reduce it is described reflection veiling glare enter the photosensitive element 12C probability.

It is noted that the light-absorption layer 54C can be formed in the metallic support 50C's by platingization or film coating process Corresponding region.It should be understood by those skilled in the art that in the present invention, the generation type of the light-absorption layer 54C is not this hair Bright limitation., it will be appreciated that the technique for forming the light-absorption layer 54C executes after the metallic support 50C punch forming, During to prevent the metallic support 50C described in punching press, the light-absorption layer 54C is scratched and its globality is destroyed.

Further it will be understood that the structure of the camera module monomer in above-described embodiment can be applied to the present invention Array camera module in.

It can thus be seen that the object of the invention can be efficiently accomplished sufficiently.It is used to explain the present invention function and structure principle The embodiment is absolutely proved and is described, and the present invention is not by the limit based on the change on these embodiment basis System.Therefore, the present invention includes all modifications covered within appended claims claimed range and spirit.

Claims

1. a photosensory assembly characterized by comprising

One wiring board；

One photosensitive element；

One molded base, wherein the photosensitive element is electrically connected to the wiring board, the molded base is shaped in described Wiring board and the photosensitive element；

One filter element；And

One metallic support, wherein the metallic support is installed on the top surface of the molded base, for installing the optical filtering member Part, wherein being formed as the photosensitive element between the filter element, the metallic support and the molded base provides light One optical window of access.

2. photosensory assembly as described in claim 1, wherein the metallic support is main including an annular body and by the annular Body is formed by a light admission port, and the light admission port corresponds to the optical window, and the filter element is mounted on the metallic support top Side or bottom side.

3. photosensory assembly as described in claim 1, wherein the metallic support includes a light-absorption layer, the light-absorption layer is set to The surface of the metallic support.

4. photosensory assembly as described in claim 1, wherein the outer ledge of the metallic support is located at outside the molded base The inside of periphery.

5. photosensory assembly as claimed in claim 3, wherein the light-absorption layer metallic support black light-absorbing light-proof material, shape At in the bottom side surface of the metallic support or all surface of the metallic support.

6. photosensory assembly as described in claim 1, wherein the filter element includes a filter element main body and is set to institute The top surface and/or bottom surface for stating filter element base metal bracket are provided with the light shield layer of an annular, make the filter element Middle section forms an optical filtering portion of effectively filtering light.

7. the photosensory assembly as described in any in claim 1 to 6, wherein the metallic support further includes an escape hole, wherein The escape hole is formed by the optical window with the filter element, the metallic support and the molded base and is connected； Or the photosensory assembly has the escape hole for being formed in the molded base.

8. photosensory assembly as described in claim 1, wherein the top surface of the molded base has the step surface of an inside, institute It states metallic support and is at least partly installed on the step surface, it is preferable that the step surface is not higher than the electronics of the wiring board Height of the height of component not less than the lead between the wiring board and the photosensitive element.

9. a camera module, including a camera lens and just like the photosensory assembly any in claim 1 to 8.

10. an array camera module, which is characterized in that including at least two optical lens and at least two as appointed in claim 1 to 8 Photosensory assembly described in one, wherein at least wiring board described in two photosensory assemblies is connected or respective independence；The mould Modeling pedestal is connected or respective independence；The metallic support disjunctor one is respectively independent；The filter element disjunctor one Or it is respectively independent.