CN113840056B - Camera module and electronic equipment - Google Patents

Camera module and electronic equipment Download PDF

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Publication number
CN113840056B
CN113840056B CN202010581256.1A CN202010581256A CN113840056B CN 113840056 B CN113840056 B CN 113840056B CN 202010581256 A CN202010581256 A CN 202010581256A CN 113840056 B CN113840056 B CN 113840056B
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China
Prior art keywords
circuit board
camera module
adhesive layer
hole
reinforcing plate
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Active
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CN202010581256.1A
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Chinese (zh)
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CN113840056A (en
Inventor
李邓峰
季昂
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Priority to CN202010581256.1A priority Critical patent/CN113840056B/en
Priority to PCT/CN2021/101478 priority patent/WO2021259242A1/en
Publication of CN113840056A publication Critical patent/CN113840056A/en
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Publication of CN113840056B publication Critical patent/CN113840056B/en
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

The application provides a camera module, including circuit board, image sensor, support, light filter, camera lens base and camera lens, image sensor is fixed in the circuit board, and the support mounting has the logical unthreaded hole that corresponds to image sensor in the top side of circuit board, and the light filter is installed in the support and is covered logical unthreaded hole, and the light filter encloses with support and circuit board and closes formation first space. The circuit board is provided with an airflow channel, and the first space and the exterior of the camera module realize air flow through the airflow channel. The lens base is installed on the top side of the support, the lens is installed on the inner side of the lens base, the lens base, the support and the optical filter enclose to form a second space, and the second space is communicated with the outside of the camera module. The shown module of making a video recording of this application can avoid the light filter to have the atmospheric pressure difference because of both sides and take place cracked problem, improves the reliability of the module of making a video recording. The application also provides an electronic device comprising the camera module.

Description

Camera module and electronic equipment
Technical Field
The application relates to the technical field of imaging, in particular to a camera module and an electronic device.
Background
At present, a camera module is one of the indispensable core components of electronic devices such as mobile phones and computers. However, in the camera module, since the filter is fragile, the filter is easily broken due to the air pressure difference between the two sides, which affects the reliability of the camera module.
Disclosure of Invention
The application provides a module and electronic equipment make a video recording, avoids the light filter to have the atmospheric pressure difference because of both sides and takes place cracked problem, improves the reliability of the module of making a video recording.
In a first aspect, the present application provides a camera module, which can be used in an electronic device. The camera module comprises a circuit board, an image sensor, a bracket, an optical filter, a lens base and a lens. The image sensor is fixed on the circuit board, the support is arranged on the top side of the circuit board, the support is provided with a light through hole corresponding to the image sensor, the optical filter is arranged on the support and covers the light through hole, and the optical filter, the support and the circuit board enclose to form a first space;
the circuit board is provided with an airflow channel, and the first space and the exterior of the camera module realize air flow through the airflow channel;
the lens base is arranged on the top surface of the support, the lens is arranged on the inner side of the lens base, the lens base, the support and the optical filter enclose to form a second space, and the second space is communicated with the outside of the camera module.
Wherein the bracket is mounted to the top side of the circuit board means that at least a majority of the bracket is located on the top side of the circuit board. At this time, the bracket may be fixed to the top surface of the circuit board, or the bracket may be fixed to the peripheral surface of the circuit board, or the bracket may be fixed to the top surface and the peripheral surface of the circuit board.
Wherein, the opening of the light-passing hole is positioned on the top surface of the bracket. The light through hole corresponds to the image sensor and can indicate that the light through hole is opposite to the image sensor, so that the image sensor can receive light rays entering the first space from the light through hole.
The filter covers the light through hole, namely the filter covers the narrowest position of the light through hole, and external light can only enter the first space through the filter. Specifically, the optical filter may be accommodated in the light-passing hole, or a part of the optical filter may be accommodated in the light-passing hole, or the optical filter may cover the opening of the light-passing hole. At this time, the bottom of the filter faces the first space, and the top of the filter faces the second space.
In this application, because the circuit board has airflow channel, in the assembly process of the module of making a video recording, first space can realize through airflow channel that gas flows with the outside of the module of making a video recording. When the air pressure outside the camera module is reduced, the air in the first space can be exhausted to the outside of the camera module through the airflow channel; when the atmospheric pressure of the outside of the module of making a video recording rises, the outside air accessible air current passageway of the module of making a video recording gets into first space. Namely, the air flow channel can balance the air pressure outside the first space and the camera module. That is, airflow channel can remain the atmospheric pressure balance between the outside of first space and the module of making a video recording all the time, makes the atmospheric pressure of the top of light filter and bottom both sides keep balance, avoids the light filter because top and bottom both sides atmospheric pressure are unbalanced and cracked bad phenomenon appears crackle even, reduces and produces the bad probability of line and market trouble feedback proportion, guarantees the quality of the module of making a video recording.
In addition, since the second space is communicated with the outside of the camera module, the second space is communicated with the first space. In the use of making a video recording the module, when the atmospheric pressure of the outside of making a video recording the module changes, the atmospheric pressure in second space also changes thereupon, and airflow channel can balance the atmospheric pressure between first space and the outside of making a video recording the module this moment, makes the atmospheric pressure between the second space that is located the light filter top side and the first space that is located the light filter bottom side keep balanced, avoids taking place cracked problem because light filter both sides atmospheric pressure is uneven, guarantees the use reliability of making a video recording the module.
In one embodiment, the gas flow channel is a curved channel. That is, the air flow passage is a passage extending in a curved manner. In the manufacturing process of the camera module, the bent airflow channel can prevent materials such as water of a washing process from entering the first space through the airflow channel, and the imaging effect of the camera module is improved.
In addition, in the use of the camera module, the crooked airflow channel can also prevent pollutants such as external dust from getting into first space via airflow channel, not only can avoid image sensor and the circuit board that is located first space to be polluted, still can avoid the light filter to be polluted towards the surface in first space, solves the bad problems such as external pollutant entering first space causes shadow or shading, guarantees the shooting quality of camera module.
In one embodiment, the airflow channel includes an inner through hole, a conducting groove and an outer through hole which are sequentially communicated, an opening of the inner through hole is located on the top surface of the circuit board and communicated with the first space, an opening of the outer through hole is located on the peripheral surface of the circuit board or the bottom surface of the circuit board and communicated with the outside of the camera module, and the extending direction of the conducting groove is parallel to the top surface of the circuit board.
The conduction groove can extend along the direction parallel to the top surface of the circuit board. The conduction groove can be in a shape of a straight line, an L, a Z, an N or an S.
In one embodiment, the circuit board includes a stiffener, a circuit board, and an adhesive layer connected between the stiffener and the circuit board. The inner through hole is arranged on the circuit board, and an opening of the inner through hole is positioned on the top surface of the circuit board so as to be communicated with the first space. The adhesive layer is provided with a flow channel, the flow channel extends from the middle part of the adhesive layer to the edge of the adhesive layer and penetrates through the top surface and the bottom surface of the adhesive layer.
The runner still runs through the global of adhesive linkage, the stiffening plate covers the opening that the runner is located the bottom surface of adhesive linkage, the circuit board covers the opening that the runner is located the top surface of adhesive linkage, in order to form conduction groove and outer through-hole, perhaps, the stiffening plate covers the opening that the runner is located the bottom surface of adhesive linkage, the circuit board covers the opening that the runner is located the top surface of adhesive linkage, in order to form the conduction groove, the stiffening plate is located to outer through-hole, the opening of outer through-hole is located the global of stiffening plate or the bottom surface of stiffening plate, in order to communicate the outside of making a video recording the module.
The inner through hole can penetrate through the circuit board along the thickness direction of the circuit board so as to be communicated with the conduction groove.
In the embodiment, the inner through hole can be formed in the manufacturing process of the circuit board, and the flow channel is formed in the manufacturing process of the bonding layer, or the flow channel is formed in the manufacturing process of the bonding layer and the outer through hole is formed in the manufacturing process of the reinforcing plate, so that the air flow channel can be formed while the reinforcing plate, the bonding layer and the circuit board are assembled to form the circuit board, and the air flow channel does not need to be formed by additionally adopting a complex process, thereby being beneficial to simplifying the forming process of the air flow channel.
In one embodiment, the circuit board includes a stiffener, a circuit board, and an adhesive layer connected between the stiffener and the circuit board. The inner through hole is arranged on the circuit board, and the opening of the inner through hole is positioned on the top surface of the circuit board.
Part conduction groove is located the circuit board, and part conduction groove is located the adhesive linkage, and circuit board and adhesive linkage enclose to close promptly and form the conduction groove. Or, part of the conduction groove is arranged on the circuit board, part of the conduction groove is arranged on the bonding layer, and part of the conduction groove is arranged on the reinforcing plate, namely, the circuit board, the bonding layer and the reinforcing plate are encircled to form the conduction groove.
The adhesive layer is located to outer through-hole, and the opening of outer through-hole is located the global of adhesive layer, and perhaps, outer through-hole locates the stiffening plate, and the opening of outer through-hole is located the bottom surface of the global or stiffening plate of stiffening plate.
In the embodiment, the corresponding structures can be formed in the manufacturing process of the circuit board, the bonding layer and the reinforcing plate respectively, so that the airflow channel is formed while the reinforcing plate, the bonding layer and the circuit board are assembled to form the circuit board, and the airflow channel does not need to be formed by additionally adopting a complex process, thereby being beneficial to simplifying the forming process of the airflow channel.
In one embodiment, the inner diameter of the inner through hole is 0.1 mm-0.2 mm, so that the air flow circulation efficiency between the first space and the outside of the camera module is ensured.
Wherein, the inner through hole can be a round hole, and the inner diameter of the inner through hole is the diameter of the round hole. Or the inner through hole is a non-circular hole, and the inner diameter of the inner through hole is the size of the widest position in the inner through hole.
In one embodiment, the inner diameter of the outer through hole is 0.1 mm-0.2 mm, so that the air flow circulation efficiency between the outside of the camera module and the first space is ensured.
In one embodiment, the cross-sectional area of the conduction groove is 0.01mm 2 ～0.1mm 2 The circulation efficiency of air in the conduction groove can be ensured, and external foreign matters can be prevented from entering the conduction groove.
In one embodiment, the circuit board has a mounting groove, an opening of the mounting groove is located on a top surface of the circuit board and is communicated with the first space, the image sensor is mounted on the mounting groove, and the airflow channel is communicated with the mounting groove. At this moment, image sensor part embedding circuit board, at least some image sensor can make a video recording the high space of module with the circuit board sharing, is favorable to reducing the height of making a video recording the module.
In an embodiment, the groove depth of mounting groove is more than or equal to image sensor's height to make image sensor can with the circuit board high space of the module of making a video recording of sharing, be favorable to reducing the height of the module of making a video recording.
The volume of the mounting groove is larger than that of the image sensor, so that the airflow channel can be communicated with the first space through the mounting groove.
In one embodiment, the airflow channel comprises a conduction groove and an outer through hole communicated with the conduction groove, the extending direction of the conduction groove is parallel to the top surface of the circuit board, the conduction groove is communicated with the installation groove, and the opening of the outer through hole is located on the peripheral surface of the circuit board or the bottom surface of the circuit board and is communicated with the outside of the camera module.
In one embodiment, the circuit board includes a stiffener, a circuit board, and an adhesive layer connected between the stiffener and the circuit board. The opening of the mounting groove is positioned on the top surface of the circuit board. The adhesive layer is provided with a flow channel, the flow channel extends from the middle part of the adhesive layer to the edge of the adhesive layer and penetrates through the top surface and the bottom surface of the adhesive layer.
The runner still runs through the global of adhesive linkage, the stiffening plate covers the opening that the runner is located the bottom surface of adhesive linkage, the circuit board covers the opening that the runner is located the top surface of adhesive linkage, in order to form conduction groove and outer through-hole, perhaps, the stiffening plate covers the opening that the runner is located the bottom surface of adhesive linkage, the circuit board covers the opening that the runner is located the top surface of adhesive linkage, in order to form the conduction groove, the stiffening plate is located to outer through-hole, the opening of outer through-hole is located the global of stiffening plate or the bottom surface of stiffening plate, in order to communicate the outside of making a video recording the module.
The mounting groove can penetrate through the circuit board along the thickness direction of the circuit board so as to be communicated with the conduction groove.
In the embodiment, the corresponding structures can be formed in the manufacturing process of the circuit board, the bonding layer and the reinforcing plate respectively, so that the airflow channel is formed when the reinforcing plate, the bonding layer and the circuit board are assembled to form the circuit board, and the airflow channel does not need to be formed by additionally adopting a complex process, thereby being beneficial to simplifying the forming process of the airflow channel.
In one embodiment, the circuit board includes a stiffener, a circuit board, and an adhesive layer connected between the stiffener and the circuit board. The opening of mounting groove is located the top surface of circuit board to the first space of intercommunication. The circuit board is located to part conduction groove, and part conduction groove is located the adhesive linkage, and circuit board and adhesive linkage enclose to close promptly and form the conduction groove, and perhaps, part conduction groove is located the circuit board, and the adhesive linkage is located to part conduction groove, and the stiffening plate is located to part conduction groove, and circuit board, adhesive linkage and stiffening plate enclose promptly and form the conduction groove. The outer through hole is arranged on the bonding layer, the opening of the outer through hole is positioned on the circumferential surface of the bonding layer, or the outer through hole is arranged on the reinforcing plate, and the opening of the outer through hole is positioned on the circumferential surface of the reinforcing plate or the bottom surface of the reinforcing plate.
In the embodiment, the corresponding structures can be formed in the manufacturing process of the circuit board, the bonding layer and the reinforcing plate respectively, so that the airflow channel is formed when the reinforcing plate, the bonding layer and the circuit board are assembled to form the circuit board, and the airflow channel does not need to be formed by additionally adopting a complex process, thereby being beneficial to simplifying the forming process of the airflow channel.
In one embodiment, the cross-sectional area of the conduction groove is 0.01mm 2 ～0.1mm 2 The circulation efficiency of air in the conduction groove can be ensured, and external foreign matters can be prevented from entering the conduction groove.
In one embodiment, the top surface area of the optical filter is equal to or greater than 60mm 2 . Wherein, the optical filter is in a sheet shape. The bottom surface and the top surface of the optical filter have the same area and are arranged oppositely. The top surface area of the filter is equal to or more than 60mm 2 Make a video recording the module and have great image area, help making a video recording the module and obtain more clear and better quality effect of shooing.
In a second aspect, the application provides an electronic device, which comprises a shell and any one of the camera modules, wherein the camera module is installed in the shell, the first space and the shell are communicated with each other through an airflow channel to realize gas flow, and the second space is communicated with the shell.
When the electronic device is used, when the air pressure in the shell changes, the air flow channel can balance the air pressure between the first space and the shell, so that the air pressure on the two sides of the top and the bottom of the optical filter keeps balance, and the problem of fragmentation caused by unbalanced air pressure on the two sides of the optical filter is avoided.
In one embodiment, the shell comprises a first shell and a second shell, the first shell and the second shell are connected in a rotating mode, and the camera module is installed on the inner side of the first shell;
the electronic equipment further comprises a display module, the display module comprises a first part, a second part and a third part connected between the first part and the second part, the first part is installed on the first shell, the second part is installed on the second shell, the third part is located between the first shell and the second shell, and the third part can be bent.
The electronic device shown in this embodiment is a foldable electronic device, and the display module has a large display area. In electronic equipment's assembling process, for example when display module's apron and display panel laminating, need carry out the high pressure deaeration to display module, the module of making a video recording needs to bear great pressure this moment. Because the airflow channel of the camera module communicates the first space with the inside of the shell, the airflow channel can play a role in balancing the internal air pressure of the first space and the inside of the shell, and the phenomenon that the top and the bottom of the optical filter are cracked due to unbalanced pressure is avoided.
In addition, when carrying out the gas tightness test to electronic equipment, the module of making a video recording also can bear great pressure, and the airflow channel of the module of making a video recording also can play the effect of the atmospheric pressure of balanced light filter both sides, avoids the light filter to take place fragmentation.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present application, the drawings required to be used in the embodiments or the background art of the present application will be described below.
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a camera module in the electronic device shown in fig. 1;
FIG. 3 is an exploded view of the camera module shown in FIG. 2;
fig. 4 is a schematic cross-sectional view of the camera module shown in fig. 2 taken along the direction I-I;
FIG. 5 is a schematic structural diagram of a circuit board in the camera module shown in FIG. 3;
fig. 6 is a schematic view of an assembly structure of the image sensor and the circuit board in the camera module shown in fig. 3;
FIG. 7 is an exploded view of the circuit board of FIG. 5;
fig. 8 is a schematic structural diagram of a circuit board in a second electronic device according to an embodiment of the present application;
FIG. 9 is a schematic view of the circuit board of FIG. 8 taken along direction II-II;
fig. 10 is a schematic structural diagram of a circuit board in a third electronic device provided in an embodiment of the present application;
fig. 11 is a schematic view of an assembly structure of a circuit board and an image sensor in a third electronic device according to an embodiment of the present disclosure;
FIG. 12 is an exploded view of the circuit board of FIG. 10;
fig. 13 is a schematic structural diagram of a fourth electronic device provided in the embodiment of the present application;
fig. 14 is a schematic structural diagram of the electronic device shown in fig. 13 in another state.
Detailed Description
The embodiments of the present application are described below with reference to the drawings.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present disclosure.
The electronic device 100 may be an electronic product with a camera function, such as a mobile phone, a tablet computer, a notebook computer, a car machine, a point of sale terminal (POS for short), or a wearable device. Wherein, the wearable device can be an intelligent bracelet, an intelligent watch, augmented Reality (AR) glasses, virtual reality technology (VR) glasses, and the like. In the embodiment of the present application, the electronic device 100 is a mobile phone as an example.
For convenience of description, the width direction of the electronic device 100 is defined as an X-axis direction, the length direction of the electronic device 100 is defined as a Y-axis direction, the thickness direction of the electronic device 100 is defined as a Z-axis direction, and the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other.
In this embodiment, the electronic device 100 is a bar phone. The electronic device 100 includes a housing 10, a display module 20, a camera module 30, and an image processor 40. The case 10 includes a bezel 11 and a rear cover 12, and the rear cover 12 is fixed to one side of the bezel 11. The frame 11 and the rear cover 12 may be fixed to each other by assembling, or may be integrally formed structural members. It should be understood that in other embodiments, the electronic device 100 may also be a foldable handset.
The display module 20 is mounted on the housing 10, and encloses with the housing 10 to form an interior of the electronic device 100. Specifically, the display module 20 is fixed to a side of the frame 11 away from the rear cover 12. That is, the display module 20 and the rear cover 12 are fixed to opposite sides of the bezel 11, respectively. The display module 20 has a light-transmitting area 201, and light outside the electronic device 100 can enter the electronic device 100 through the light-transmitting area 201.
The camera module 30 and the image processor 40 are installed inside the housing 10. The inside of the casing 10 is the inside of the electronic device 100. The camera module 30 can collect light outside the electronic device 100 through the light-transmitting area 201 and form corresponding image data. The image processor 40 is electrically connected to the camera module 30, and the image processor 40 is configured to obtain image data from the camera module 30 and process the image data. The image data processed by the image processor 40 may be displayed on the display module 20, stored in the memory of the electronic device 100, or stored in the cloud via the electronic device 100.
In the electronic device 100 of the embodiment, the camera module 30 is located on a side of the electronic device 100 close to the display module 20 and is used as a front camera module of the electronic device 100. In other embodiments, the camera module 30 may also be located on a side of the electronic device 100 away from the display module 20, and used as a rear camera module of the electronic device 100. At this time, the rear cover 12 is provided with a camera hole, and the camera module 30 collects light outside the electronic device 100 through the camera hole of the rear cover 12. In other words, the camera module 30 can be used as a front camera module of the electronic device 100, and can also be used as a rear camera module of the electronic device 100. Alternatively, the electronic apparatus 100 may include a plurality of (two or more) camera modules 30, at least one camera module 30 serving as a front camera module of the electronic apparatus 100, and at least one camera module 30 serving as a rear camera module of the electronic apparatus 100.
Please refer to fig. 2 and fig. 3. Fig. 2 is a schematic structural diagram of the imaging module 30 in the electronic device 100 shown in fig. 1. Fig. 3 is an exploded view of the camera module 30 shown in fig. 2. The width direction of the camera module 30 is the X-axis direction, the length direction of the camera module 30 is the Y-axis direction, and the height direction of the camera module 30 is the Z-axis direction.
The camera module 30 includes a circuit board 31, an image sensor 32, a bracket 33, a filter 34, a lens base 35, and a lens 36. The circuit board 31 includes a top surface 311 and a bottom surface 312 that are oppositely disposed. Specifically, the top surface 311 and the bottom surface 312 of the circuit board 31 are both parallel to the X-Y plane. That is, the top surface 311 and the bottom surface 312 of the circuit board 31 are perpendicular to the Z-axis direction. The circuit board 31 may be electrically connected to the image processor 40 through a connection board (not shown), so that the camera module 30 is electrically connected to the image processor 40.
It should be noted that references to "top," "bottom," and other aspects of the present application are made with reference to the orientation of fig. 2, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, configuration, and operation, and therefore should not be considered limiting of the present application.
Referring to fig. 4, fig. 4 is a schematic cross-sectional view of the camera module 30 shown in fig. 2 taken along the direction I-I. The term "cut along the direction I-I" means a cut along the plane of the arrows at the two ends of the line I-I and the line I-I, and the description of the drawings will be understood in the following.
The image sensor 32 is fixed to the circuit board 31. In the present embodiment, the image sensor 32 is fixed to the top surface 311 of the circuit board 31. Specifically, the image sensor 32 is fixed to the middle region of the top surface 311, and is electrically connected to the circuit board 31. Illustratively, the image sensor 32 may be fixed to the top surface 311 of the circuit board 31 by means of bonding. For example, the camera module 30 may include a first adhesive layer 80, and the first adhesive layer 80 is adhered between the image sensor 32 and the top surface 311 of the circuit board 31. The image sensor 32 may be a chip.
The bracket 33 is mounted to the top side of the circuit board 31. In this embodiment, the bracket 33 is mounted on the top surface 311 of the circuit board 31. Specifically, the bracket 33 is fixed to the edge region of the top surface 311 and covers the top of the image sensor 32. Illustratively, the bracket 33 may be fixed to the top surface 311 of the circuit board 31 by means of bonding. For example, the camera module 30 may include a second adhesive layer 50, and the second adhesive layer 50 is adhered between the bracket 33 and the top surface 311 of the circuit board 31.
It should be noted that, the bracket 33 is mounted on the top side of the circuit board 31, which means that at least most of the bracket 33 is located on the top side of the circuit board 31. In this embodiment, the bracket 33 is fixed to the top surface 311 of the circuit board 31. In other embodiments, the bracket 33 may also be fixed to a peripheral surface (not shown) of the circuit board 31, or the bracket 33 may be fixed to the top surface 311 and the peripheral surface of the circuit board 31.
The bracket 33 includes a top surface 332 facing away from the circuit board 31. The support 33 has a light passing hole 333, and an opening of the light passing hole 333 is located on the top surface 332 of the support 33. Specifically, the light passing hole 333 is recessed from the top surface 332 of the bracket 33 toward the circuit board 31, and penetrates the bracket 33 in the Z-axis direction. Wherein the light passing hole 333 corresponds to the image sensor 32. It should be noted that, the light-passing hole 333 corresponds to the image sensor 32, which means that part or all of the projection of the light-passing hole 333 on the circuit board 31 overlaps with the image sensor 32 to ensure that the image sensor 32 can receive the light entering the inside of the bracket 33 from the light-passing hole 333. The same is understood in the following description about "corresponding to".
Further, the light passing hole 333 is a closed hole (i.e., the light passing hole 333 has a complete hole wall). The walls of the light hole 333 may be perpendicular to or inclined with respect to the top surface 332 of the rack 33. Specifically, the hole wall of the light transmitting hole 333 is partially protruded to form a supporting portion 3331. The support portion 3331 is a continuous closed loop. In other embodiments, the supporting portion 3331 may be in a discontinuous ring shape. It should be understood that the shape of the supporting portion 3331 is not limited to the square ring shape shown in fig. 3, but may be a circular ring shape, which is not particularly limited in the present application.
In addition, the bracket 33 has a positioning mark 334. Specifically, the positioning mark 334 is located on the top surface 332 of the support 33, so that in the assembling process of the camera module 30, the lens base 35 and the support 33 can be positioned quickly, and the assembling accuracy and the assembling efficiency between the lens base 35 and the support 33 are improved. The number of the positioning marks 334 is four, and the four positioning marks 334 are arranged at intervals around the light through hole 333. It should be noted that, in other embodiments, the bracket 33 may not have the positioning mark 334, and the lens base 35 may be positioned with the bracket 33 in other ways, which is not specifically limited in this application.
The filter 34 is mounted on the bracket 33 and covers the light transmitting hole 333, and the filter 34, the bracket 33 and the circuit board 31 enclose a first space 301. The optical filter 34 is accommodated in the light transmitting hole 333 and corresponds to the image sensor 32. The external light is filtered by the filter 34 and received by the image sensor 32, and the image sensor 32 converts the light to form an image.
Specifically, the optical filter 34 is mounted on a top surface (not shown) of the supporting portion 3331 in the light transmitting hole 333, and the optical filter 34 may be fixed to the top surface of the supporting portion 3331 by adhesion. For example, the camera module 30 may include a third adhesive layer 60, and the third adhesive layer 60 is adhered between the filter 34 and the support 33. The filter 34 includes, but is not limited to, an infrared cut filter or a full transmittance spectrum filter.
The filter 34 covering the light transmission hole 333 means that the filter 34 covers the narrowest position of the light transmission hole 333, and external light can enter the first space 301 only through the filter 34. In other embodiments, the filter 34 may be partially accommodated in the light-passing hole 333, or the filter 34 covers an opening of the light-passing hole 333.
In the present embodiment, the filter 34 is in the form of a sheet. The optical filter 34 includes a top surface 341 and a bottom surface 342 opposite to each other, and the top surface 341 and the bottom surface 342 of the optical filter 34 have the same area. Wherein the area of the filter 34 is equal to or larger than 60mm 2 . At this time, the camera module 30 has a larger imaging area, which is helpful for the camera module 30 to obtain a clearer and better photographing effect.
The lens base 35 is mounted on the top side of the holder 33. Specifically, the lens base 35 is fixed to the top surface 332 of the holder 33. Wherein the lens base 35 is fixed to the edge area of the top surface 332. Illustratively, the lens base 35 may be fixed to the holder 33 by bonding. For example, the camera module 30 may include a fourth adhesive layer 70, and the fourth adhesive layer 70 is adhered between the lens base 35 and the bracket 33. Of course, in other embodiments, the lens base 35 may be fixed to the bracket 33 by welding. For example, the camera module 30 may include a solder layer, and the solder layer is fixedly connected between the lens base 35 and the bracket 33.
The lens base 35 includes a top surface 351 facing away from the holder 33 and a bottom surface 352 disposed opposite the top surface 351. The lens base 35 includes a mounting groove 353, and an opening of the mounting groove 353 is located in a middle region of the top surface 351. The mounting groove 353 extends from the top surface 351 of the lens base 35 in the direction of the bottom surface 352, and penetrates the bottom surface 352 of the lens base 35. That is, the mounting groove 353 penetrates the lens base 35 from the height direction of the lens base 35. Specifically, the mounting groove 353 is right opposite to the light passing hole 333. That is, the mounting groove 353 is facing the image sensor 32. Light outside the camera module 30 can enter the first space 301 from the mounting groove 353 and the light-passing hole 333 and be received by the image sensor 32.
The lens 36 is mounted inside the lens base 35. Specifically, the lens 36 is mounted in the mounting groove 353 of the lens base 35 for converging light outside the camera module 30. That is, the lens 36 can condense external light and project the condensed external light from the filter 34 to the image sensor 32. The lens 36 may include a lens barrel and a lens group fixed inside the lens barrel. Illustratively, the number of lenses of the lens group may be multiple, such as 5, 6, 7, 8, etc.
In this embodiment, the lens 36, the lens base 35 and the filter 34 enclose a second space 302. In other words, the filter 34 divides the internal space of the camera module 30 into a first space 301 and a second space 302, the first space 301 being located at the bottom side of the filter 34, and the second space 302 being located at the top side of the filter 34. Wherein the second space 302 is communicated with the outside of the camera module 30. That is, the second space 302 can allow air to flow between the outside of the camera module 30. That is, gas between the second space 302 and the outside of the camera module 30 can be exchanged. In other words, there is no air pressure difference between the second space 302 and the outside of the camera module 30.
For example, the camera module 30 may be a camera module using a fixed focus lens. The lens base 35 is a supporting structure. The lens base 35 may be provided with a communication hole for communicating the second space 302 with the outside of the camera module 30. Alternatively, the camera module 30 may be a camera module using a focus-adjustable lens. The lens base 35 is a motor. The second space 302 can communicate with the outside of the camera module 30 through the gap of the reed in the motor.
Referring to fig. 4 and 5, fig. 5 is a schematic structural diagram of the circuit board 31 in the camera module 30 shown in fig. 3.
The circuit board 31 further includes a peripheral surface 313 connected between the top surface 311 and the bottom surface 312 of the circuit board 31. In this embodiment, the circuit board 31 has a square shape. The peripheral surface 313 of the circuit board 31 includes two first peripheral surfaces 314 disposed opposite to each other and a second peripheral surface 315 connected between the two first peripheral surfaces 314, and the two second peripheral surfaces 315 are disposed opposite to each other.
The circuit board 31 has an air flow passage 316, and the air flow passage 316 communicates the first space 301 with the outside of the camera module 30. That is, the first space 301 and the exterior of the camera module 30 can realize air flow through the air flow channel 316. That is, air between the first space 301 and the outside of the camera module 30 can be exchanged through the air flow passage 316.
It should be noted that, in the assembly process of the conventional camera module, the first space is usually in a closed state and completely isolated from the outside of the camera module, and when the air pressure outside the camera module is reduced or increased, there is an air pressure difference between the first air and the outside of the camera module due to the inability of air exchange, and at this time, the top side and the bottom side of the optical filter 34 are cracked due to the air pressure difference.
In the assembly process of the camera module 30 in this embodiment, when the air pressure outside the camera module 30 is reduced, the air in the first space 301 can be exhausted through the air flow passage 316; when the air pressure outside the camera module 30 increases, the air outside the camera module 30 may enter the first space 301 through the air flow passage 316. That is, the air flow channel 316 can balance the air pressure outside the first space 301 and the camera module 30. That is, the air flow channel 316 can always ensure that the air pressure in the first space 301 and the outside of the camera module 30 is balanced, so that the air pressure on the top and the bottom of the optical filter 34 is kept balanced, the undesirable phenomena of cracks or cracks caused by the unbalanced air pressure on the two sides of the optical filter 34 are avoided, the undesirable probability of a production line and the market Fault Feedback Ratio (FFR) can be reduced, and the quality of the camera module 30 is ensured.
In this embodiment, the airflow channel 316 connects the first space 301 and the inside of the electronic device 100. That is, the first space 301 and the inside of the electronic device 100 may realize gas flow through the gas flow channel 316. That is, gas between the first space 301 and the inside of the electronic apparatus 100 may be exchanged through the gas flow channel 316. Wherein, the outside of the camera module 30 is the space enclosed by the shell 10, the display module 20 and the camera module 30.
In the use process of the electronic device 100, when the air pressure inside the electronic device 100 changes, the air pressure in the second space 302 changes accordingly, and at this time, the air flow channel 316 can also balance the air pressure between the first space 301 and the inside of the electronic device 100, so that the air pressure between the second space 302 on the top side of the optical filter 34 and the first space 301 on the bottom side of the optical filter is kept balanced, the problem of fracture caused by unbalanced air pressure on both sides of the optical filter 34 is avoided, and the use reliability of the camera module 30 is ensured.
Further, the air flow passage 316 is a curved passage. That is, the air flow passage 316 extends in a curved manner. In this embodiment, the air flow channel 316 includes an inner through hole 317, a conduction groove 318 and an outer through hole 319 which are communicated in sequence. Specifically, the opening of the inner through hole 317 is located on the top surface 311 of the circuit board 31 and communicates with the first space 301. The inner diameter of the inner through hole 317 is 0.1mm to 0.2mm, so that the air flow circulation efficiency between the first space 301 and the outside of the camera module 30 is ensured.
It should be understood that the shape of the inner through-hole 317 may be a non-circular hole such as a square, instead of the figure hole shown in fig. 5. When the inner through-hole 317 is a circular hole, the inner diameter of the inner through-hole 317 is the diameter of the circular hole. When the inner through hole 317 may be a non-circular hole, the inner diameter of the inner through hole 317 is the size of the widest position in the inner through hole 317.
The opening of the outer through hole 319 is located on the peripheral surface 313 of the circuit board 31 and communicates with the outside of the camera module 30. Wherein, the inner diameter of the outer through hole 319 is between 0.1 mm-0.2 mm to ensure the air flow circulation efficiency between the first space 301 and the outside of the camera module 30. It should be noted that, in other embodiments, the outer through hole 319 may also be located on the bottom surface 312 of the circuit board 31 and communicate with the outside of the camera module 30, which is not specifically limited in this application.
The conduction groove 318 is located at the bottom side of the inner through hole 317The extending direction of the through groove 318 is parallel (may also be approximately parallel, i.e., there is a tolerance) to the top surface 311 of the circuit board 31. That is, the via groove 318 may extend in a direction parallel to the top surface 311 of the circuit board 31. Wherein the cross-sectional area of the conduction groove 318 is 0.01mm 2 ～0.1mm 2 Meanwhile, not only the circulation efficiency of air in the conduction groove 318 can be ensured, but also the foreign matters can be prevented from entering the conduction groove 318.
In this embodiment, the conduction groove 318 is bent and extended in a direction parallel to the top surface 311 of the circuit board 31, and has an "L" shape. It should be understood that, in other embodiments, the shape of the conduction groove 318 may also be a "one", "Z", "N", or "S", or the extending direction of the conduction groove 318 may also be not parallel to the top surface 311 of the circuit board 31, which is not particularly limited in this application.
In the manufacturing process of the camera module 30, the air flow passage 316 extending in a bending manner can prevent substances such as water in a water washing process from entering the first space 301 through the air flow passage 316, and the imaging effect of the camera module 30 is improved. In addition, in the using process of the electronic device 100, the curved and extended airflow channel 316 can also prevent external contaminants such as dust from entering the first space 301 through the airflow channel 316, which not only can prevent the image sensor 32 and the circuit board 31 located in the first space 301 from being contaminated, but also can prevent the surface of the optical filter 34 facing the first space 301 from being contaminated, thereby solving the problem that the external contaminants enter the first space 301 to cause poor problems such as shadows or black spots, and ensuring the shooting quality of the camera module 30.
In this embodiment, there are four airflow channels 316, and the four airflow channels 316 are disposed inside the circuit board 31 at intervals, so as to accelerate the gas exchange between the first space 301 and the outside of the camera module 30. Specifically, the openings of the four inner vias 317 are spaced apart from each other on the top surface 332 of the circuit board 31, and the four outer vias 319 are respectively located on the two first peripheral surfaces 314 and the two second peripheral surfaces 315. Wherein, the four air flow channels 316 are distributed along the geometric center line O-O of the circuit board 31 in a centrosymmetric manner.
Referring to fig. 6, fig. 6 is a schematic view of an assembly structure of the image sensor 32 and the circuit board 31 in the camera module 30 shown in fig. 3.
The openings of the four inner through holes 317 are arranged around the periphery of the image sensor 32. That is, the image sensor 32 does not cover the opening of the inner through hole 317, so that the airflow path 316 can always keep flowing through the first space 301, and the first space 301 and the air pressure outside the image pickup module 30 are balanced.
Referring to fig. 5 and 7, fig. 7 is an exploded view of the circuit board 31 shown in fig. 5.
The circuit board 31 includes a reinforcing plate 37, an adhesive layer 38, and a wiring board 39. The reinforcing plate 37 includes a top surface 371 and a bottom surface 372 arranged opposite to each other, and a peripheral surface 373 connected between the top surface 371 and the bottom surface 372. The adhesive layer 38 and the wiring board 39 are sequentially laminated on the top surface 371 of the reinforcing plate 37. The reinforcing plate 37 is used for supporting the circuit board 39, so that the strength of the circuit board 31 is improved, the circuit board 31 is favorable for bearing other devices, and the assembly of the circuit board 31 is facilitated. The reinforcing plate 37 may be made of a metal material such as stainless steel, copper, or steel.
The adhesive layer 38 is adhered between the reinforcing plate 37 and the wiring board 39. The adhesive layer 38 includes a top surface 381 and a bottom surface 382 disposed opposite to each other and a peripheral surface 383 connected between the top surface 381 and the bottom surface 382. The top surface 381 of the adhesive layer 38 is adhered to the wiring board 39, and the bottom surface 382 of the adhesive layer 38 is adhered to the reinforcing plate 37.
The adhesive layer 38 is provided with a flow passage 384. The flow passages 384 extend from the middle of the adhesive layer 38 towards the edges of the adhesive layer 38 and through the perimeter surface 383 of the adhesive layer 38. The flow channel 384 extends through the top surface 381 and the bottom surface 382 of the adhesive layer 38. That is, the flow passage 384 penetrates the adhesive layer 38 in the thickness direction of the adhesive layer 38.
The reinforcing plate 37 covers the opening of the flow passage 384 at the bottom surface 382 of the adhesive layer 38, and the wiring board 39 covers the opening of the flow passage 384 at the top surface 381 of the adhesive layer 38 to form the conduction groove 318 and the outer through hole 319 which are communicated in this order. The opening of the flow passage 384 in the circumferential surface 383 of the adhesive layer 38 is the opening of the outer through hole 319. It should be understood that in other embodiments, the reinforcing plate 37 can cover the opening of the flow channel 384 at the bottom surface 382 of the adhesive layer 38, the circuit board 39 can cover the opening of the flow channel 384 at the top surface 381 of the adhesive layer 38 to form the conduction groove 318, and the outer through hole 319 can also be provided on the reinforcing plate 37. At this time, the opening of the outer through hole 319 is located on the peripheral surface 373 of the reinforcing plate 37 or the bottom surface 372 of the reinforcing plate 37 to communicate with the outside of the image pickup module 30.
The wiring board 39 includes a top surface 391 facing away from the adhesive layer 38, a bottom surface 392 disposed opposite the top surface 391, and a peripheral surface 393 connected between the top surface 391 and the bottom surface 392. The circuit board 39 is a flexible circuit board or a rigid circuit board. In this embodiment, the top surface 391 of the wiring board 39 is the top surface 311 of the circuit board 31. The circumferential surface 393 of the circuit board 39, the circumferential surface 383 of the adhesive layer 38, and the circumferential surface 373 of the reinforcing plate 37 together form the circumferential surface 313 of the circuit board 31. The bottom surface 372 of the reinforcing plate 37 is the bottom surface 312 of the circuit board 31.
The inner through hole 317 is disposed on the circuit board 39, and an opening of the inner through hole 317 is located on a top surface 391 of the circuit board 39 to communicate with the first space 331. Specifically, the inner via 317 extends through the top surface 391 and the bottom surface 392 of the wiring board 39. That is, the inner through-hole 317 penetrates the wiring board 39 in the thickness direction of the wiring board 39 to communicate with the conduction groove 318.
In this embodiment, the inner through hole 317 is formed in the manufacturing process of the circuit board 39, and the flow channel 384 is formed in the manufacturing process of the adhesive layer 38, so that the airflow channel 316 can be formed at the same time when the reinforcing plate 37, the adhesive layer 38 and the circuit board 39 are assembled to form the circuit board 31, and a complicated process is not required to form the airflow channel 316, which helps to simplify the forming process of the airflow channel 316.
It should be understood that the conduction groove 318 of the air flow channel 316 is not limited to the embodiment, and in other embodiments, the conduction groove 318 may be formed by combining two or more of the three of the circuit board 39, the adhesive layer 38 and the reinforcing plate 37. For example, part of the conductive groove 318 is provided in the wiring board 39, and part of the conductive groove 318 is provided in the adhesive layer 38, that is, the wiring board 39 and the adhesive layer 38 surround each other to form the conductive groove 318. Alternatively, the partial conduction groove 318 is provided in the wiring board 39, the partial conduction groove 318 is provided in the adhesive layer 38, and the partial conduction groove 318 is provided in the reinforcing plate 37, that is, the wiring board 39, the adhesive layer 38, and the reinforcing plate 37 surround and form the conduction groove 318. Alternatively, the partial conduction groove 318 is provided in the adhesive layer 38, and the partial conduction groove 318 is provided in the reinforcing plate 37, that is, the conduction groove 318 is formed by surrounding the adhesive layer 38 and the reinforcing plate 37. At this time, the airflow channel 316 can be formed at the same time of assembling the circuit board 31 by forming corresponding structures in the manufacturing processes of the circuit board 39, the adhesive layer 38 and the reinforcing plate 37, and it is also unnecessary to use a complicated process to form the airflow channel 316, which is advantageous for simplifying the forming process of the airflow channel 316.
Please refer to fig. 8 and 9. Fig. 8 is a schematic structural diagram of a circuit board 31 in a second electronic device 100 according to an embodiment of the present application. Fig. 9 is a schematic structural view of the circuit board 31 shown in fig. 8 taken along the direction II-II.
The electronic apparatus 100 shown in the present embodiment is different from the electronic apparatus 100 shown in the above-described embodiments in that the circuit board 31 includes a circuit board 39. That is, the circuit board 31 is a circuit board without using a reinforcing plate. The wiring board 39 is a rigid wiring board. In this embodiment, the top surface 391 of the circuit board 39 is the top surface 311 of the circuit board 31, the bottom surface 392 of the circuit board 39 is the bottom surface 312 of the circuit board 31, and the peripheral surface 393 of the circuit board 39 is the peripheral surface 313 of the circuit board 31.
Specifically, the airflow passage 316 is formed in the wiring board 39. The openings of the inner vias 317 in the gas flow channels 316 are located on the top surface 391 of the circuit board 39. The inner vias 317 can be formed during the fabrication process of the circuit board 39. Outer via 319 and via 318 are located at the bottom side of inner via 317 and can be formed by cutting or etching the substrate in the lamination process of wiring board 39. Wherein the opening of the outer through hole 319 is located on the peripheral surface 393 of the circuit board 39.
Referring to fig. 10 and fig. 11, fig. 10 is a schematic structural diagram of a circuit board 31 in a third electronic device 100 according to an embodiment of the present application. Fig. 11 is an assembly structure diagram of the circuit board 31 and the image sensor 32 in the third electronic device 100 according to the embodiment of the present application.
The electronic device 100 of the present embodiment is different from the electronic device 100 of the two embodiments, in that the circuit board 31 has a mounting groove 310, and an opening of the mounting groove 310 is located on a top surface 311 of the circuit board 31 and communicates with the first space 301 (as shown in fig. 4). Specifically, the image sensor 32 is mounted in the mounting groove 310, and the mounting groove 310 communicates with the airflow passage 316. Wherein the area of the bottom wall of the mounting groove 310 is larger than the area of the bottom surface of the image sensor 32. The image sensor 32 is installed at a middle region of the bottom wall of the installation groove 310 and does not cover the opening of the air flow channel 316 toward the installation groove 310, so that the air flow channel 316 can be maintained in communication with the first space 301 through the installation groove 310.
In addition, the depth of the mounting groove 310 may be equal to or greater than the height of the image sensor 32, so that the image sensor 32 and the circuit board 31 may share the height space of the camera module 30, which is beneficial to reducing the height of the camera module 30 and realizing the miniaturization design of the camera module 30. In other embodiments, the depth of the mounting groove 310 may also be less than the height of the image sensor 32, and at this time, the image sensor 32 is partially embedded in the circuit board 31, and at least a part of the image sensor 32 may share the height space of the camera module 30 with the circuit board 31, which is beneficial to reducing the height of the camera module 30.
In the present embodiment, the airflow passage 316 includes a conduction groove 318 and an outer through hole 319 communicating with the conduction groove 318. The extending direction of the conduction groove 318 is parallel to the top surface 311 of the circuit board 31, and the conduction groove 318 is communicated with the mounting groove 310. Wherein, the end of the conduction groove 318 facing the mounting groove 310 is an opening of the airflow channel 316 facing the mounting groove 310.
Specifically, the conducting groove 318 is curved and extended along a direction parallel to the top surface 311 of the circuit board 31, and is shaped like a "u". Wherein the cross-sectional area of the conduction groove 318 is 0.01mm 2 ～0.1mm 2 Meanwhile, not only the circulation efficiency of air in the conduction groove 318 can be ensured, but also the foreign matters can be prevented from entering the conduction groove 318.
The opening of the outer through hole 319 is located on the peripheral surface 313 of the circuit board 31 and communicates with the outside of the camera module 30. Wherein, the inner diameter of the outer through hole 319 is between 0.1 mm-0.2 mm to ensure the air flow circulation efficiency between the first space 301 and the outside of the camera module 30. It should be noted that, in other embodiments, the outer through hole 319 may also be located on the bottom surface 312 of the circuit board 31 and communicate with the outside of the camera module 30, which is not specifically limited in this application.
Referring to fig. 12, fig. 12 is an exploded view of the circuit board 31 shown in fig. 10.
The circuit board 31 includes a reinforcing plate 37, an adhesive layer 38, and a wiring board 39, and the adhesive layer 38 is connected between the reinforcing plate 37 and the wiring board 39. The adhesive layer 38 also has mounting slots 385, the mounting slots 385 of the adhesive layer 38 extending through the top and bottom surfaces 381, 382 of the adhesive layer 38. That is, the mounting groove 385 of the adhesive layer 38 penetrates the adhesive layer 38 in the thickness direction of the adhesive layer 38. Wherein the mounting groove 385 of the adhesive layer 38 is located at the middle of the adhesive layer 38.
The adhesive layer 38 is provided with a flow passage 384. The flow passages 384 extend from the middle of the adhesive layer 38 toward the edges of the adhesive layer 38 and communicate with the mounting grooves 385 of the adhesive layer 38. The flow channel 384 extends through the top surface 381 and the bottom surface 382 of the adhesive layer 38. That is, the flow passage 384 penetrates the adhesive layer 38 in the thickness direction of the adhesive layer 38.
The reinforcing plate 37 covers the opening of the flow passage 384 at the bottom surface 382 of the adhesive layer 38, and the wiring board 39 covers the opening of the flow passage 384 at the top surface 381 of the adhesive layer 38 to form the conduction groove 318 and the outer through hole 319 which are communicated in this order. The opening of the flow passage 384 in the circumferential surface 383 of the adhesive layer 38 is the opening of the outer through hole 319. It should be understood that in other embodiments, the reinforcing plate 37 can cover the opening of the flow channel 384 at the bottom surface 382 of the adhesive layer 38, the circuit board 39 can cover the opening of the flow channel 384 at the top surface 381 of the adhesive layer 38 to form the conduction groove 318, and the outer through hole 319 can also be provided on the reinforcing plate 37. At this time, the opening of the outer through hole 319 is located on the peripheral surface 373 of the reinforcing plate 37 or the bottom surface 372 of the reinforcing plate 37 to communicate with the outside of the image pickup module 30.
The circuit board 39 has a mounting slot 395, and the mounting slot 395 of the circuit board 39 extends through the top surface 391 and the bottom surface 392 of the circuit board 39. That is, the mounting groove 395 of the wiring board 39 penetrates the wiring board 39 in the thickness direction of the wiring board 39. Wherein the mounting groove 310 of the circuit board 39 is located in the middle of the circuit board 39.
The wiring board 39 is fixed to the top surface 371 of the reinforcing plate 37 by the adhesive layer 38. Wherein the mounting groove 395 of the circuit board 39 communicates with the mounting groove 385 of the adhesive layer 38 to form the mounting groove 310 of the circuit board 31. That is, the mounting groove 310 of the circuit board 31 penetrates the wiring board 39 and the adhesive layer 38 in the thickness direction of the wiring board 39 and the adhesive layer 38 to communicate with the conduction groove 318. At this time, the groove bottom wall of the mounting groove 310 is a partial region of the top surface 371 of the reinforcing plate 37. That is, the image sensor 32 is mounted on the top surface 371 of the reinforcing plate 37.
In this embodiment, the mounting groove 395 is formed in the manufacturing process of the circuit board 39, and the flow channel 384 and the mounting groove 385 are formed in the manufacturing process of the adhesive layer 38, so that the airflow channel 316 can be formed at the same time when the reinforcing plate 37, the adhesive layer 38 and the circuit board 39 are assembled to form the circuit board 31, and a complicated process is not required to form the airflow channel 316, which helps to simplify the forming process of the airflow channel 316.
It should be understood that the conducting groove 318 of the air flow channel 316 is not limited to the embodiment, and in other embodiments, the conducting groove 318 may be formed by combining two or more of the circuit board 39, the adhesive layer 38 and the reinforcing plate 37. For example, part of the conductive groove 318 is provided in the wiring board 39, and part of the conductive groove 318 is provided in the adhesive layer 38, that is, the wiring board 39 and the adhesive layer 38 surround each other to form the conductive groove 318. Alternatively, the partial conduction groove 318 is provided in the wiring board 39, the partial conduction groove 318 is provided in the adhesive layer 38, and the partial conduction groove 318 is provided in the reinforcing plate 37, that is, the wiring board 39, the adhesive layer 38, and the reinforcing plate 37 surround and form the conduction groove 318. Alternatively, the partial conduction groove 318 is provided in the adhesive layer 38, and the partial conduction groove 318 is provided in the reinforcing plate 37, that is, the conduction groove 318 is formed by surrounding the adhesive layer 38 and the reinforcing plate 37.
At this time, the airflow channel 316 can be formed at the same time of assembling the circuit board 31 by forming corresponding structures in the manufacturing processes of the circuit board 39, the adhesive layer 38 and the reinforcing plate 37, and it is also unnecessary to use a complicated process to form the airflow channel 316, which is advantageous for simplifying the forming process of the airflow channel 316.
Please refer to fig. 13 and 14. Fig. 13 is a schematic structural diagram of a fourth electronic device 100 according to an embodiment of the present application. Fig. 14 is a schematic structural diagram of the electronic device 100 shown in fig. 13 in another state.
In this embodiment, the electronic device 100 is a foldable mobile phone. In other words, the electronic apparatus 100 is a cellular phone that can be switched between a folded state and an unfolded state. Here, the electronic apparatus 100 shown in fig. 13 is in an unfolded state, and the electronic apparatus 100 shown in fig. 14 is in a folded state. In the present application, the electronic device 100 is described as being foldable or unfoldable along the X-axis direction.
The electronic device 100 shown in the present embodiment is an electronic device 100 that can be folded once. In other embodiments, the electronic apparatus 100 may also be an electronic apparatus 100 that can be folded multiple times (two times or more). At this time, the electronic device 100 may have a plurality of portions, and each two adjacent portions may be relatively close to each other until the electronic device 100 is in the folded state, and each two adjacent portions may also be relatively far from each other until the electronic device 100 is in the unfolded state.
The electronic device 100 includes a housing 10, a display module 20, a camera module 30, and an image processor 40. The housing 10 includes a first housing 10a, a second housing 10b, and a connecting mechanism (not shown) connected between the first housing 10a and the second housing 10b. Wherein, the connecting mechanism is a rotating shaft mechanism extending along the X-axis direction. The first casing 10a and the second casing 10b are rotatably connected by a connection mechanism. That is, the first casing 10a and the second casing 10b are connected to each other by a connection mechanism and are relatively rotatable in the X-axis direction. Specifically, the first casing 10a and the second casing 10b can be rotated relatively to be close to each other, so that the casing 10 is in a folded state, as shown in fig. 14. The first housing 10a and the second housing 10b can also be rotated relatively away from each other to place the housings 10 in the unfolded state, as shown in fig. 13. In other words, the first casing 10a and the second casing 10b are relatively rotatable so that the casings 10 can be switched between the folded state and the unfolded state.
It should be understood that, in other embodiments, the connection mechanism may also be a sliding mechanism, a combination of rotating and sliding mechanisms, or a detachable fastening mechanism, which is not specifically limited in this application.
The display module 20 includes a first portion 20a, a second portion 20b, and a third portion 20c connected between the first portion 20a and the second portion 20 b. The first portion 20a, the second portion 20b, and the third portion 20c are located on the same side of the housing 10, and the first portion 20a, the third portion 20c, and the second portion 20b are arranged in order in the Y-axis direction. Specifically, the first portion 20a is mounted to the first housing 10a, and the second portion 20b is mounted to the second housing 10b. The third portion 20c is located between the first casing 10a and the second casing 10b, and the third portion 20c is bendable. Wherein the third portion 20c can be bent in the X-axis direction.
When the electronic device 100 is in the unfolded state, the display module 20 is in the unfolded state, and the first portion 20a, the second portion 20b and the third portion 20c are at 180 degrees (or at approximately 180 degrees, that is, a slight deviation is allowed). At this time, the electronic device 100 has a continuous large-area display area, so that large-screen display can be realized, and the use experience of the user is improved. When the electronic device 100 is in the folded state, the display module 20 is in the folded state, the first portion 20a overlaps the second portion 20b, and the third portion 20c is bent. At this time, the exposed area of the display module 20 is small, and the probability of damage to the display module 20 is reduced.
It should be noted that, when the electronic device 100 shown in the embodiment is in the folded state shown in fig. 14, the display module 20 is in the inward folded state, and at this time, the display module 20 is located between the first casing 10a and the second casing 10b. In other embodiments, when the electronic device 100 is in the folded state, the display module 20 may also be in an outward folded state, in which the first casing 10a and the second casing 10b are located between the first part 20a and the second part 20 b.
The camera module 30 and the image processor 40 are installed inside the case 10. Specifically, the camera module 30 is mounted inside the first housing 10 a. The first housing 10a is provided with a camera hole (not shown), and the camera module 30 collects light outside the electronic device 100 through the camera hole and forms corresponding image data. The image processor 40 is electrically connected to the camera module 30 for obtaining image data from the camera module 30 and processing the image data. The structure of the image capturing module 30 may be the same as that of the image capturing module 30 in the electronic device 100 according to the first embodiment. Of course, in other embodiments, the structure of the image capturing module 30 may be the same as that of the image capturing module 30 in the electronic device 100 according to the second or third embodiment.
In the electronic apparatus 100 shown in this embodiment, since the display area of the display module 20 is large, in an assembling process of the electronic apparatus 100, for example, when a cover plate of the display module 20 is attached to a display panel, the display module 20 needs to be defoamed under high pressure, and at this time, the camera module 30 needs to bear large pressure. Because the airflow channel 316 of the camera module 30 communicates with the first space 301 and the outside of the camera module 30, and the second space 302 communicates with the outside of the camera module 30, the airflow channel 316 can balance the air pressure in the first space 301 and the second space 302, and the occurrence of fracture due to unbalanced pressure on the top and the bottom of the optical filter 34 is avoided. In addition, when the electronic device 100 is tested for air tightness, the camera module 30 is also subjected to a large pressure, and the airflow channel 316 of the camera module 30 can also balance the air pressure on the two sides of the optical filter 34, so as to prevent the optical filter 34 from being broken.
The above description is only a part of the examples and embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and all the changes or substitutions should be covered within the scope of the present application; the embodiments and features of the embodiments of the present application may be combined with each other without conflict. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (23)

1. The camera module (30) is characterized by comprising a circuit board (31), an image sensor (32), a support (33), a light filter (34), a lens base (35) and a lens (36), wherein the image sensor (32) is fixed on the circuit board (31), the support (33) is installed on the top side of the circuit board (31), the support (33) is provided with a light through hole (333) corresponding to the image sensor (32), the light filter (34) is installed on the support (33) and covers the light through hole (333), and the light filter (34), the support (33) and the circuit board (31) enclose to form a first space (301);
the circuit board (31) is provided with an air flow channel (316), and the first space (301) and the exterior of the camera module (30) realize air flow through the air flow channel (316);
the camera lens comprises a lens base (35), a lens (36), a second space (302), a support (33) and a filter (34), wherein the lens base (35) is arranged on the top side of the support (33), the lens (36) is arranged on the inner side of the lens base (35), the lens (36), the lens base (35), the support (33) and the filter (34) are enclosed to form the second space (302), and the second space (302) is communicated with the outside of the camera module (30).
2. The camera module (30) of claim 1, wherein the airflow channel (316) is a curved channel.
3. The camera module (30) according to claim 1 or 2, wherein the air flow channel (316) comprises an inner through hole (317), a conducting groove (318) and an outer through hole (319) which are communicated in sequence, an opening of the inner through hole (317) is located on a top surface (311) of the circuit board (31) and communicated with the first space (301), an opening of the outer through hole (319) is located on a peripheral surface (313) of the circuit board (31) or a bottom surface (312) of the circuit board (31) and communicated with the outside of the camera module (30), and an extending direction of the conducting groove (318) is parallel to the top surface (311) of the circuit board (31).
4. The camera module (30) according to claim 3, wherein the circuit board (31) comprises a stiffener (37), a circuit board (39), and an adhesive layer (38) connected between the stiffener (37) and the circuit board (39), the inner via (317) is disposed on the circuit board (39), the adhesive layer (38) is provided with a flow channel (384), the flow channel (384) extends from a middle portion of the adhesive layer (38) to an edge of the adhesive layer (38), and penetrates through a top surface (381) and a bottom surface (382) of the adhesive layer (38);
the flow channel (384) penetrates through the peripheral surface (383) of the adhesive layer (38), the reinforcing plate (37) covers an opening, located on the bottom surface (382) of the adhesive layer (38), of the flow channel (384), the circuit board (39) covers an opening, located on the top surface (381) of the adhesive layer (38), of the flow channel (384), so that the conduction groove (318) and the outer through hole (319) are formed,
or, the reinforcing plate (37) covers the opening of the flow channel (384) on the bottom surface (382) of the adhesive layer (38), the circuit board (39) covers the opening of the flow channel (384) on the top surface (381) of the adhesive layer (38) to form the conduction groove (318), the outer through hole (319) is provided in the reinforcing plate (37), and the opening of the outer through hole (319) is located on the peripheral surface of the reinforcing plate (37) or the bottom surface of the reinforcing plate (37).
5. The camera module (30) according to claim 3, wherein the circuit board (31) comprises a reinforcing plate (37), a circuit board (39) and an adhesive layer (38) connected between the reinforcing plate (37) and the circuit board (39), and the inner through hole (317) is provided in the circuit board (39);
a part of the conduction groove (318) is provided in the wiring board (39), a part of the conduction groove (318) is provided in the adhesive layer (38), or a part of the conduction groove (318) is provided in the wiring board (39), a part of the conduction groove (318) is provided in the adhesive layer (38), and a part of the conduction groove (318) is provided in the reinforcing plate (37);
the outer through hole (319) is provided in the adhesive layer (38), and an opening of the outer through hole (319) is located in the circumferential surface of the adhesive layer (38), or the outer through hole (319) is provided in the reinforcing plate (37), and an opening of the outer through hole (319) is located in the circumferential surface of the reinforcing plate (37) or the bottom surface of the reinforcing plate (37).
6. The camera module (30) of claim 3, wherein the inner diameter of the inner through hole (317) is between 0.1mm and 0.2 mm.
7. The camera module (30) according to claim 4 or 5, wherein the inner diameter of the inner through hole (317) is between 0.1mm and 0.2 mm.
8. The camera module (30) of claim 3, wherein the cross-sectional area of the conduction channel (318) is 0.01mm 2 ～0.1mm 2 In the meantime.
9. The camera module (30) of any of claims 4-6, wherein the cross-sectional area of the conduction channel (318) is 0.01mm 2 ～0.1mm 2 In between.
10. The camera of claim 7The image module (30) is characterized in that the cross section area of the conduction groove (318) is 0.01mm 2 ～0.1mm 2 In between.
11. The camera module (30) according to claim 1 or 2, wherein the circuit board (31) has a mounting groove (310), an opening of the mounting groove (310) is located on a top surface (311) of the circuit board (31) and is communicated with the first space (301), the image sensor (32) is mounted on the mounting groove (310), and the air flow channel (316) is communicated with the mounting groove (310).
12. The camera module (30) according to claim 11, wherein the airflow channel (316) comprises a conduction groove (318) and an outer through hole (319) communicated with the conduction groove (318), the conduction groove (318) extends in a direction parallel to the top surface (311) of the circuit board (31), the conduction groove (318) is communicated with the mounting groove (310), and an opening of the outer through hole (319) is located on the peripheral surface (313) of the circuit board (31) or the bottom surface (312) of the circuit board (31) and is communicated with the outside of the camera module (30).
13. The camera module (30) according to claim 12, wherein the circuit board (31) comprises a reinforcing plate (37), a circuit board (39) and an adhesive layer (38) connected between the reinforcing plate (37) and the circuit board (39), the opening of the mounting groove (310) is located on the top surface of the circuit board (39), the adhesive layer (38) is provided with a flow channel (384), and the flow channel (384) extends from the middle of the adhesive layer (38) to the edge of the adhesive layer (38) and penetrates through the top surface (381) and the bottom surface (382) of the adhesive layer (38);
the flow channel (384) also penetrates through the circumferential surface (383) of the adhesive layer (38), the reinforcing plate (37) covers an opening, located on the bottom surface (382) of the adhesive layer (38), of the flow channel (384), the circuit board (39) covers an opening, located on the top surface (381) of the adhesive layer (38), of the flow channel (384), so that the conduction groove (318) and the outer through hole (319) are formed,
or, the reinforcing plate (37) covers the opening of the flow channel (384) on the bottom surface (382) of the adhesive layer (38), the circuit board (39) covers the opening of the flow channel (384) on the top surface (381) of the adhesive layer (38) to form the conduction groove (318), the outer through hole (319) is provided in the reinforcing plate (37), and the opening of the outer through hole (319) is located on the peripheral surface of the reinforcing plate (37) or the bottom surface of the reinforcing plate (37).
14. The camera module (30) according to claim 12, wherein the circuit board (31) includes a reinforcing plate (37), a circuit board (39), and an adhesive layer (38) connected between the reinforcing plate (37) and the circuit board (39), a part of the conductive groove (318) is provided in the adhesive layer (38), or a part of the conductive groove (318) is provided in the circuit board (39), a part of the conductive groove (318) is provided in the adhesive layer (38), and a part of the conductive groove (318) is provided in the reinforcing plate (37);
the outer through hole (319) is provided in the adhesive layer (38), and the opening of the outer through hole (319) is located in the circumferential surface of the adhesive layer (38), or the outer through hole (319) is provided in the reinforcing plate (37), and the opening of the outer through hole (319) is located in the circumferential surface of the reinforcing plate (37) or the bottom surface of the reinforcing plate (37).
15. The camera module (30) of claim 11, wherein the cross-sectional area of the conduction channel (318) is 0.01mm 2 ～0.1mm 2 In the meantime.
16. The camera module (30) of any of claims 12-14, wherein the cross-sectional area of the conduction channel (318) is 0.01mm 2 ～0.1mm 2 In the meantime.
17. Camera module (30) according to any one of claims 1, 2, 4-6, 8, 10 and 12-15, characterized in that the top surface area of the filter (34) is equal to or greater than 60mm 2 。
18. Camera module (3) according to claim 30) Characterized in that the area of the top surface of the filter (34) is equal to or greater than 60mm 2 。
19. Camera module (30) according to claim 7, characterized in that the area of the top surface of the filter (34) is equal to or greater than 60mm 2 。
20. The camera module (30) according to claim 9, wherein the top surface area of the filter (34) is equal to or greater than 60mm 2 。
21. The camera module (30) according to claim 11, wherein the top surface area of the filter (34) is equal to or greater than 60mm 2 。
22. An electronic device (100) comprising a housing (10) and the camera module (30) according to any one of claims 1-21, wherein the camera module (30) is mounted inside the housing (10), the first space (301) and the inside of the housing (10) realize a gas flow through the gas flow channel (316), and the second space (302) is communicated with the inside of the housing (10).
23. The electronic device (100) according to claim 22, wherein the housing (10) comprises a first housing (10 a) and a second housing (10 b), the first housing (10 a) and the second housing (10 b) are rotatably connected, and the camera module (30) is mounted inside the first housing (10 a);
the electronic device (100) further comprises a display module (20), the display module (20) comprises a first portion (20 a), a second portion (20 b) and a third portion (20 c) connected between the first portion (20 a) and the second portion (20 b), the first portion (20 a) is mounted on the first casing (10 a), the second portion (20 b) is mounted on the second casing (10 b), the third portion (20 c) is located between the first casing (10 a) and the second casing (10 b), and the third portion (20 c) is bendable.
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