JP2004309623A - Imaging apparatus, mobile terminal and imaging apparatus manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an imaging apparatus capable of coping with the difference of a position where the imaging apparatus is arranged in a mobile terminal, restraining loss due to defects and being manufactured at low cost, and to obtain an imaging apparatus manufacturing method. <P>SOLUTION: The imaging apparatus has: an optical module part obtained by integrating an imaging device and an image pickup optical system; and a circuit board part on which circuit components are mounted. The circuit board part is constituted of: a non-flexible board; and a flexible board arranged at the aperture part or the notched part of the non-flexible board, or a non-flexible board connected through the flexible board. The imaging apparatus is constituted by electrically connecting the imaging device of the optical module part to a board arranged at the aperture part or the notched part of the non-flexible board. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an imaging device, and more particularly to an imaging device suitable for mounting on a mobile terminal such as a mobile phone or a mobile computer.
[0002]
[Prior art]
2. Description of the Related Art In recent years, small and thin imaging devices have been developed and mounted on small and thin electronic devices such as mobile phones and personal computers.
[0003]
Further, as an image pickup device used in the image pickup apparatus, a charge coupled device (CCD) image sensor, a complementary metal-oxide semiconductor (CMOS) image sensor, or the like is used.
[0004]
As these image pickup devices, those in which an image pickup device is mounted on a printed circuit board and an image pickup optical system is mounted above the image pickup device are known.
[0005]
In order to reduce the thickness of the optical module, the flexible printed circuit board is sandwiched between the imaging device and the imaging optical system by flip-chip mounting, and this flexible printed circuit board is connected to the connector of the board on which the electronic components are mounted. There is a system (for example, see Patent Document 1).
[0006]
[Patent Document 1]
JP-A-2001-128072 (page 3, FIG. 1)
[0007]
[Problems to be solved by the invention]
2. Description of the Related Art In recent years, mobile phones with a built-in imaging device have become very popular. These mobile phones are very different varieties, and the cycle of their generation change is very short.
[0008]
In these mobile phones, the positions where the imaging devices are arranged are various, and the shapes of the housings are also various. To deal with the shapes of the built-in imaging devices individually, it is necessary to prepare various types of imaging devices, which leads to an increase in tooling costs and a decrease in production efficiency, which in turn leads to an increase in cost. Absent.
[0009]
Further, the camera system described in Patent Document 1 has an advantage that the thickness including the image sensor and the lens unit can be configured to be thin by flip-chip mounting, but since the connecting electrode portion is on the same surface as the image sensor light receiving surface. The resin for sealing and the adhesive for securing the strength of the connection part wrap around the light receiving surface, causing a problem that adversely affects the imaging performance. There is a problem that it must be discarded and the cost increases.
[0010]
The present invention has been made in view of the above problems, and is capable of responding to subtle differences in the shape of a portable terminal, quickly responding to a difference in the position of an imaging device in the portable terminal, and having a low defect loss and a low defect loss. It is an object of the present invention to obtain an imaging device and an imaging device manufacturing method that can be manufactured at low cost.
[0011]
[Means for Solving the Problems]
An object of the present invention is to provide an image pickup device that photoelectrically converts a subject light, an optical module unit in which an imaging optical system for guiding the subject light to the image pickup device is integrated, and a circuit on which a circuit component for driving the image pickup device is mounted. A substrate portion, wherein the circuit board portion includes a non-flexible substrate and a non-flexible substrate connected by a flexible substrate or a flexible substrate disposed in an opening or a cutout portion of the non-flexible substrate. The optical module section and the circuit board section were integrated by electrically connecting the image pickup device to a board arranged in an opening or a cutout section of the non-flexible board. This is achieved by an imaging device characterized by the above.
[0012]
Thereby, since the optical module unit is connected to the circuit board by a flexible substrate, the optical module unit can be delicately changed in position and direction, and the same imaging device can be used for portable terminals having minute shapes different from each other. Will be able to respond. In addition, by mounting the circuit components on the non-flexible substrate, not only easiness of mounting but also reduction of the substrate cost can be achieved.
[0013]
Further, by providing a mobile terminal having the imaging device, a mobile terminal equipped with the imaging device having the above-described effects can be obtained.
[0014]
A step of forming an optical module unit in which an imaging element that photoelectrically converts the subject light and an imaging optical system that guides the subject light to the imaging element are integrated; a non-flexible substrate; and an opening of the non-flexible substrate. Forming a circuit board portion on which circuit components are mounted on a flexible substrate disposed in a portion or a notch portion, or a substrate formed of a non-flexible substrate connected by the flexible substrate; Electrically connecting the imaging element of the module unit to the substrate disposed in the cutout portion of the non-flexible substrate.
[0015]
Thus, by assembling the optical module section and the circuit board section separately, it is possible to minimize the damage due to disposal in the case of a defect, and to reduce the cost.
[0016]
Furthermore, by preparing several kinds of optical modules and several kinds of circuit boards, and changing the combination at the time of coupling, it is possible to easily obtain various types and shapes of imaging devices, and It can respond to requests and supply at low cost.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail with reference to embodiments, but the present invention is not limited thereto.
[0018]
FIG. 1 is a diagram illustrating an appearance of a mobile phone T which is an example of a mobile terminal according to an embodiment of the present invention.
[0019]
In a mobile phone T shown in FIG. 1, an upper housing 71 as a case having a display screen D and a lower housing 72 having operation buttons P are connected via a hinge 73. The optical module unit 4 of the imaging device is built in above the panel D of the screen display unit in the upper housing 71 so that the optical members of the optical module unit 4 can take in light from the outer surface side of the upper housing 71. Are located.
[0020]
The position of the optical module unit 4 may be arranged below the panel D of the screen display unit in the upper housing 71, or may be arranged right and left from the center line. Further, the mobile phone need not be foldable.
[0021]
FIG. 2 is an external perspective view illustrating an example of the imaging device 100 according to the present embodiment.
[0022]
As shown in FIG. 2, the imaging device 100 includes a circuit board section 20 including a flexible printed circuit board FPC, which is a flexible board, and a non-flexible board 21, and the optical module section 4. The optical module unit 4 includes a light-shielding plate 5 having an opening for light incidence, and an outer frame member 6 including an optical member, an image sensor, and the like.
[0023]
The board 21 of the circuit board unit 20 is a board made of paper phenol, glass epoxy, or the like, on which a connector 22, various electronic components 23 and 24, a system IC 25, and the like are mounted. The system IC 25 constitutes a drive circuit for driving an image pickup device in the optical module unit 4, an image processing circuit for performing various image processing on an image signal obtained by the optical module unit 4, and the like. The connector 22 is for connecting the imaging device 100 to another substrate in the mobile terminal.
[0024]
The flexible printed circuit board FPC is obtained by forming a wiring pattern (not shown) on a base film made of, for example, polyester or polyimide using a conductive material such as copper.
[0025]
FIG. 3 is a partially omitted cross-sectional view of the optical module unit 4 taken along line FF shown in FIG.
[0026]
As shown in FIG. 1, the optical module unit 4 includes an optical element 1, an aperture plate 3, an elastic member 7, and an infrared cut filter 8, in addition to the image sensor 2, the outer frame member 6, and the light shielding plate 5.
[0027]
In FIG. 3, the imaging device 2 is composed of, for example, a CMOS image sensor, a CCD image sensor, or the like, and is first attached and attached to the outer frame member 6 as shown in the figure. Thereafter, the optical member 1 serving as the image pickup optical system is dropped from above the outer frame member 6 and incorporated. An aperture plate 3 having an opening 3a is attached to the optical member 1. Further, the optical member 1 has a flange portion 1e, an elastic member 7 is incorporated so as to press the flange portion 1e, and the light shielding plate 5 with the infrared cut filter 8 attached is bonded to the outer frame member 6. . The optical member 1 pressed by the elastic member 7 comes into contact with the image pickup device 2 by leg portions 1d provided at at least three places. As a result, the distance between the light receiving portion 2a of the imaging element 2 and the optically effective surface 1a of the optical member 1 is guaranteed. The optical module unit 4 is created as a unit as described above.
[0028]
The dashed-dotted line shown in the figure indicates a substrate connected to an image sensor 2 of an optical module unit 4 described later, and a connection portion 2b of the image sensor 2 and a connection formed on the substrate corresponding to the connection portion 2b. It is configured to be connected to a terminal unit.
[0029]
FIG. 4 is a diagram showing various examples of the shape of the circuit board unit 20 applied to the present invention.
[0030]
In the figure, A and C denote non-flexible substrates, for example, paper phenol or glass epoxy substrates, and B denotes a flexible substrate, for example, a flexible printed circuit board.
[0031]
FIG. 4A shows a substrate in which a corner of a non-flexible substrate A is cut out, and a flexible substrate B is arranged and connected to the cut-out portion. FIG. 4B shows a substrate in which the non-flexible substrate A is cut out in a U-shape, and the flexible substrate B is arranged and connected to the cutout. FIG. 4C shows a substrate in which the center of the non-flexible substrate A is an opening, and the flexible substrate B is arranged and connected to the opening. FIG. 4D shows a substrate in which the non-flexible substrate A is cut out in a U-shape, and the flexible substrate B is arranged and connected to the notch in two directions. FIG. 4E shows a substrate including a non-flexible substrate A and a non-flexible substrate C connected by a flexible substrate B. In addition, these may use the board | substrate with which the non-flexible board | substrate part and the flexible board | substrate part were integrally formed called rigid flexible.
[0032]
4A to 4D, a connection terminal BP corresponding to the connection portion 2b of the image sensor 2 is formed on the flexible substrate B. In FIG. 4E, the non-flexible substrate is used. A connection terminal BP corresponding to the connection portion 2b of the image sensor 2 is formed in C.
[0033]
A connector, various electronic components, a system IC, and the like are mounted on a non-flexible substrate A (corresponding to the non-flexible substrate 21 shown in FIG. 2) shown in FIG. The unit 20 is created as a unit.
[0034]
After the optical module unit 4 and the circuit board unit 20 are individually formed as a unit in this way, both are combined to complete the imaging device 100.
[0035]
In the case of FIGS. 4A to 4D, this coupling is performed by electrically connecting the connection portion 2b of the imaging element 2 of the optical module unit 4 shown in FIG. 3 to the connection terminal BP formed on the flexible substrate B. In the case of FIG. 4E, the connection portion 2b of the image sensor 2 of the optical module portion 4 is electrically connected to the connection terminal BP formed on the non-flexible substrate C. You. In this connection, it is preferable that the outer frame member 4 and the flexible substrate B or the non-flexible substrate C are fixed with an adhesive at the time of this connection.
[0036]
In this way, by creating the optical module unit 4 and the circuit board unit 20 as separate units, damage due to disposal when a defect occurs can be minimized, and the cost can be reduced.
[0037]
Furthermore, by preparing several kinds of optical modules and several kinds of circuit boards, and changing the combination at the time of coupling, it is possible to easily obtain imaging devices of various forms and shapes, Can be promptly responded to, and low-cost supply is possible.
[0038]
In addition, by mounting the electronic circuit components on the non-flexible substrate, it is possible to reduce not only the ease of handling and the mounting but also the cost of the substrate.
[0039]
An example in which the imaging device assembled as described above corresponds to a subtle difference in the shape inside the portable terminal will be described below.
[0040]
FIG. 5 is a partially omitted cross-sectional view showing the imaging device of the present invention, that is, the periphery of the imaging device of a mobile phone incorporating the optical module unit 4 and the circuit board unit 20.
[0041]
5A to 5C, reference numeral 31 denotes an outer surface side cover, and 32 denotes an inner surface side cover, and constitutes an upper housing 71 (see FIG. 1). D is a panel of the screen display unit, and 34 is a display device, which displays a color image, characters, characters, and the like. Reference numeral 4 denotes an optical module unit, and reference numeral 20 denotes a circuit board unit, which is integrated via the above-described flexible board B. Reference numeral 33 denotes a dustproof panel, and the outer surface side cover 31 has an opening E and is arranged on the front surface of the optical module unit 4.
[0042]
FIG. 5A shows an example in which the outer surface of the outer surface side cover 31 and the optical axis of the optical module unit 4 are arranged orthogonally. FIG. 5B is an example in which the optical axis of the optical module unit 4 is arranged at an end of the outer surface cover 31 at an angle to the longitudinal surface of the outer surface cover 31, and FIG. Shows an example in which the optical axis of the optical module unit 4 is oriented in a direction substantially parallel to the longitudinal surface of the upper housing 71.
[0043]
As described above, since the optical module unit 4 and the circuit board unit 20 are connected via the flexible board B, even if the optical module unit 4 is arranged in various directions in the portable terminal as described above, the same applies. It is possible to cope with the imaging device.
[0044]
Further, in the case of the arrangement as shown in FIGS. 5B and 5C, the holding member can be formed by utilizing the elastic force of the flexible substrate B without holding the back surface of the optical module section 4. It can be unnecessary. That is, the front surface of the optical module portion 4 abuts on a flat portion around the opening E of the outer surface side cover 31 and is pressed by the elastic force of the flexible substrate B to maintain the illustrated state.
[0045]
When the elastic force is used as described above, when the flexible substrate is a flexible printed circuit board made of polyimide, the length of the flexible substrate B at a portion connecting the optical module unit 4 and the circuit board unit 20 is used. Is preferably about 1 to 5 mm when a pattern is formed only on one side of the substrate B, and about 2 to 10 mm when a pattern is formed on both sides. This is because the elastic force of the substrate works moderately.
[0046]
Although the cross-sectional view shown in FIG. 5 has been described using the circuit board shown in FIG. 4A as the circuit board section, the circuit board shown in FIGS. By appropriately selecting the sections, it is possible to easily obtain imaging devices of various forms and shapes. As a result, it is possible to quickly respond to various requests of customers and supply can be performed at low cost.
[0047]
【The invention's effect】
As described above, it is possible to cope with a subtle difference in the shape of the mobile terminal, to cope with a difference in the arrangement position of the imaging device in the mobile terminal, and to manufacture the device at low cost with low defect loss. An imaging device and an imaging device manufacturing method can be obtained.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating an appearance of a mobile phone as an example of a mobile terminal according to an embodiment of the present invention.
FIG. 2 is an external perspective view illustrating an example of an imaging device according to the present embodiment.
FIG. 3 is a partially omitted cross-sectional view of the optical module section taken along the line FF shown in FIG. 2;
FIG. 4 is a diagram showing various examples of shapes of a circuit board unit applied to the present invention.
FIG. 5 is a partially omitted cross-sectional view showing the periphery of an imaging device of a mobile phone incorporating the imaging device of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Optical member 2 Image sensor 3 Aperture plate 4 Optical module part 5 Light shielding plate 6 Outer frame member 7 Elastic member 8 Infrared cut filter 20 Circuit board part 100 Imaging device

Claims (3)

An imaging element that photoelectrically converts the subject light, and an optical module unit in which an imaging optical system that guides the subject light to the imaging element is integrated;
And a circuit board unit on which circuit components for driving the image sensor are mounted,
The circuit board unit includes a non-flexible substrate, a flexible substrate disposed in an opening or a cutout of the non-flexible substrate, or a non-flexible substrate connected by a flexible substrate. An imaging device, wherein the optical module unit and the circuit board unit are integrated by electrically connecting an element to a substrate disposed in an opening or a cutout of the non-flexible substrate. A mobile terminal comprising the imaging device according to claim 1. An imaging device that photoelectrically converts the subject light, and a step of creating an optical module unit in which an imaging optical system that guides the subject light to the imaging device is integrated;
A circuit component was mounted on a non-flexible substrate, and a flexible substrate disposed in an opening or a cutout of the non-flexible substrate or a substrate formed of a non-flexible substrate connected by the flexible substrate. A step of creating a circuit board part;
Electrically connecting an image sensor of the optical module unit to a substrate disposed in a cutout portion of the non-flexible substrate.

Images