JP2004309623A - Imaging apparatus, mobile terminal and imaging apparatus manufacturing method - Google Patents

Imaging apparatus, mobile terminal and imaging apparatus manufacturing method Download PDF

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Publication number
JP2004309623A
JP2004309623A JP2003100205A JP2003100205A JP2004309623A JP 2004309623 A JP2004309623 A JP 2004309623A JP 2003100205 A JP2003100205 A JP 2003100205A JP 2003100205 A JP2003100205 A JP 2003100205A JP 2004309623 A JP2004309623 A JP 2004309623A
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Japan
Prior art keywords
flexible substrate
non
imaging
optical module
imaging apparatus
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JP2003100205A
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Japanese (ja)
Inventor
Sadahito Katagiri
Kazuo Nibu
和男 丹生
禎人 片桐
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Konica Minolta Opto Inc
コニカミノルタオプト株式会社
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Priority to JP2003100205A priority Critical patent/JP2004309623A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To obtain an imaging apparatus capable of coping with the difference of a position where the imaging apparatus is arranged in a mobile terminal, restraining loss due to defects and being manufactured at low cost, and to obtain an imaging apparatus manufacturing method. <P>SOLUTION: The imaging apparatus has: an optical module part obtained by integrating an imaging device and an image pickup optical system; and a circuit board part on which circuit components are mounted. The circuit board part is constituted of: a non-flexible board; and a flexible board arranged at the aperture part or the notched part of the non-flexible board, or a non-flexible board connected through the flexible board. The imaging apparatus is constituted by electrically connecting the imaging device of the optical module part to a board arranged at the aperture part or the notched part of the non-flexible board. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【0001】 [0001]
【発明の属する技術分野】 BACKGROUND OF THE INVENTION
本発明は撮像装置、特に携帯電話機やモバイルコンピュータ等の携帯端末への搭載に好適な撮像装置に関するものである。 The present invention is an imaging apparatus, and more particularly to a suitable imaging device mounted on the mobile terminal such as a mobile phone or mobile computer.
【0002】 [0002]
【従来の技術】 BACKGROUND OF THE INVENTION
近年、小型で薄型の撮像装置が開発され携帯電話機やパーソナルコンピュータ等の小型、薄型の電子機器に搭載されるようになった。 Recently, small such as a small thin imaging apparatus have been developed in mobile phones and personal computers, has come to be mounted on a thin electronic device.
【0003】 [0003]
また撮像装置に使用される撮像素子としては、CCD(Charge Coupled Device)型イメージセンサやCMOS(Complementary Metal−Oxide Semiconductor)型イメージセンサ等が使用されている。 As image pickup elements used for the imaging device, CCD (Charge Coupled Device) type image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) type image sensor or the like is used.
【0004】 [0004]
これらの撮像装置は、撮像素子をプリント基板に実装すると共に、撮像素子の上部に撮像光学系を搭載したものが公知である。 These imaging devices, as well as mounting an imaging element on the printed circuit board, it is known that incorporating an imaging optical system on top of the image sensor.
【0005】 [0005]
また、光学モジュール部の薄型化のため、フリップチップ実装により撮像素子と撮像光学系でフレキシブルプリント基板を挟むように構成し、このフレキシブルプリント基板を電子部品の搭載された基板のコネクタに接続しカメラシステムとしたものがある(例えば、特許文献1参照)。 Further, since the thickness of the optical module unit, configured to sandwich the flexible printed circuit board by the imaging device and the imaging optical system by flip chip mounting, connect the flexible printed circuit board to the connector mounted on the board of the electronic component camera there are those with the system (e.g., see Patent Document 1).
【0006】 [0006]
【特許文献1】 [Patent Document 1]
特開2001−128072号公報(第3頁、図1) JP 2001-128072 JP (page 3, FIG. 1)
【0007】 [0007]
【発明が解決しようとする課題】 [Problems that the Invention is to Solve
近年、撮像装置を内蔵した携帯電話機の普及が著しい。 Recently, the spread of portable telephone incorporating the imaging device is remarkable. これらの携帯電話は、非常に他品種であり、またその世代交代の周期も非常に短いのが実状である。 These mobile phone is a very other varieties, also the period of the generational change is also very short of the actual situation.
【0008】 [0008]
これらの携帯電話は、撮像装置の配置される位置も種々であり、更にその筐体の形状も同様に多種にわたっている。 These phones are placed the position of the imaging device is also variously, spans a wide similarly further the shape of the housing. これらに対し内蔵される撮像装置の形状を個々に対応しようとすると、多種の撮像装置を準備しなくてはならず、治工具費の増大と生産効率の低下を招き、ひいてはコストアップが避けられない。 When the shape of the image pickup device built to these attempts to correspond to individual, not have to prepare a variety of imaging devices, cause a decrease in increasing the production efficiency of the tools costs, be avoided and thus cost Absent.
【0009】 [0009]
また、特許文献1に記載のカメラシステムは、フリップチップ実装により撮像素子とレンズユニット部を含めた厚みを薄く構成できる利点を有するが、接続する電極部が撮像素子受光面と同面にあるため封止用の樹脂や接続部の強度確保のための接着剤が受光面にまわり込み、撮像性能に悪影響を与える問題が発生し不良率の増大及び不良時には撮像素子に接続されたフレキシブルプリント基板も廃棄せねばならずコストアップしてしまう問題がある。 The camera system described in Patent Document 1 has the advantage of thin structure and thickness including the image pickup device and the lens unit portion by flip-chip mounting, since the electrode portions to be connected in the same plane and the imaging element receiving surface adhesive for securing the strength of the resin and the connecting portion for sealing is narrowing around the light-receiving surface, also a flexible printed board connected to the imaging device to increase and when failure problem occurs defect rate adversely affect imaging performance there is a problem that the cost does not must be discarded.
【0010】 [0010]
本発明は、上記問題に鑑み、携帯端末の微妙な形状の違いに対応可能で、携帯端末内の撮像装置の配置される位置の相違に対し迅速に対応可能で、且つ不良損失が低く、低コストで製作可能な撮像装置及び撮像装置製造方法を得ることを目的とする。 In view of the above problems, it can correspond to subtle difference in the shape of the portable terminal, and rapidly adaptable to different arrangements are the position of the imaging device in a portable terminal, and poor loss low, low for its object to obtain a possible imaging apparatus and an imaging device manufacturing method manufacturing cost.
【0011】 [0011]
【課題を解決するための手段】 In order to solve the problems]
上記の目的は、被写体光を光電変換する撮像素子と、該撮像素子に被写体光を導く撮像光学系とが一体化された光学モジュール部と、前記撮像素子を駆動する回路部品が実装された回路基板部と、を有し、前記回路基板部は、非撓性基板と、該非撓性基板の開口部又は切り欠き部に配置される可撓性基板もしくは可撓性基板により接続された非撓性基板で構成され、前記撮像素子を前記非撓性基板の開口部又は切り欠き部に配置される基板と電気的に接続することにより、前記光学モジュール部と前記回路基板部とを一体化したことを特徴とする撮像装置、とすることで達成される。 The above objects, an image sensor for photoelectrically converting a subject light, and an optical module unit which the imaging optical system and is integrated for guiding subject light to the image sensor, the circuit in which the circuit components are mounted for driving the imaging element It includes a substrate portion, the circuit board unit includes a non fLEXIBLE substrate, non-connected by a flexible substrate or a flexible substrate is disposed in an opening or cut-out of the non fLEXIBLE substrate Deflection It consists of sexual substrate by connecting the substrate and electrically arranged the imaging element in the opening or the cut-out of the non FLEXIBLE substrate was integrated with the circuit board portion and the optical module unit It is achieved by an imaging apparatus, characterized in that.
【0012】 [0012]
これにより、光学モジュール部が可撓性の基板で回路基板と接続されるため光学モジュール部は微妙な位置や方向の変更が可能となり、微少な形状の異なる携帯端末に対しても同一の撮像装置で対応できるようになる。 Thus, the optical module unit for the optical module unit is connected to the circuit board by a flexible substrate enables delicate position and direction of the change, the same imaging device with respect to different portable terminal having fine shapes in will be able to support. また、回路部品の実装を非撓性の基板に行うことで、実装の容易さのみならず基板コストの削減が可能となる。 Furthermore, an implementation of the circuit component to the non FLEXIBLE substrate, it is possible to reduce only the ease become not board cost implementation.
【0013】 [0013]
更に、この撮像装置を備えたことを特徴とする携帯端末とすることで、上述の効果を有した撮像装置を搭載した携帯端末を得ることができる。 Furthermore, by a portable terminal comprising the image pickup apparatus, it is possible to obtain a portable terminal equipped with an imaging device having the above-described effects.
【0014】 [0014]
また、被写体光を光電変換する撮像素子と、該撮像素子に被写体光を導く撮像光学系とが一体化された光学モジュール部を作成する工程と、非撓性基板と、該非撓性基板の開口部又は切り欠き部に配置される可撓性基板、もしくは可撓性基板により接続された非撓性基板で構成される基板に、回路部品を実装した回路基板部を作成する工程と、前記光学モジュール部の撮像素子を前記前記非撓性基板の切り欠き部に配置された基板と電気的に接続する工程と、を有する撮像装置製造方法、とすることで達成される。 Also, an image sensor for photoelectrically converting an object light, a step of producing optical module unit which the imaging optical system and is integrated for guiding subject light to the image sensor, and a non FLEXIBLE substrate, non FLEXIBLE substrate opening the flexible substrate is disposed in parts or notches, or the substrate consists of a non fLEXIBLE board connected by a flexible substrate, a step of creating a circuit board portion mounting the circuit component, said optical imaging device manufacturing method having the steps of the substrate and electrically connected to the imaging element arranged in the notch portion of said non FLEXIBLE substrate of the module unit, is achieved by a.
【0015】 [0015]
これにより、光学モジュール部と回路基板部を別個に組み立てることにより不良時の廃棄による損害を最少に押さえることができ、低コスト化が可能なる。 Thus, it is possible to suppress to a minimum the damage caused by disposal at failure by assembling the circuit board portion the optical module unit separately, cost reduction becomes possible.
【0016】 [0016]
更に、数種の光学モジュールと数種の回路基板部を作成しておき、結合時の組み合わせを変更することで、多種の形態、形状の撮像装置を容易に得ることができ、顧客の種々の要望に対し対応可能で、かつ低コストで供給可能となる。 Furthermore, advance to create a circuit board portion of several optical modules and several, by changing the combination of time binding, various forms, the imaging device in the form can be easily obtained, various customer It can correspond to demand, and can be supplied at low cost.
【0017】 [0017]
【発明の実施の形態】 DETAILED DESCRIPTION OF THE INVENTION
以下、実施の形態により本発明を詳しく説明するが、本発明はこれに限定されるものではない。 Hereinafter, the present invention will be described in detail using embodiments, the present invention is not limited thereto.
【0018】 [0018]
図1は、本発明の実施形態に係る携帯端末の一例である携帯電話機Tの外観を示す図である。 Figure 1 is a diagram showing an outer appearance of a portable telephone T as an example of a portable terminal according to an exemplary embodiment of the present invention.
【0019】 [0019]
図1に示す携帯電話機Tは、表示画面Dを備えたケースとしての上筐体71と、操作ボタンPを備えた下筐体72とがヒンジ73を介して連結されている。 Mobile phone T shown in FIG. 1, the upper casing 71 as a case having a display screen D, a lower casing 72 provided with an operation button P is connected through a hinge 73. 撮像装置の光学モジュール部4は、上筐体71内の画面表示部のパネルDの上方に内蔵されており、光学モジュール部4の光学部材が上筐体71の外表面側から光を取り込めるよう配置されている。 The optical module of the imaging device 4 is incorporated in the upper panel D of the screen display unit of the upper housing 71, so that the optical member of the optical module unit 4 take in light from the outer surface side of the upper housing 71 It is located.
【0020】 [0020]
なお、この光学モジュール部4の位置は上筐体71内の画面表示部のパネルDの下方に配置してもよい、また中心線から左右にずれて配置されていてもよい。 The position of the optical module unit 4 may be arranged to be shifted may be disposed below the panel D of the screen display unit in the upper housing 71, also from the center line to the left and right. 更に、携帯電話機は折りたたみ式でなくともよい。 Furthermore, the cellular phone may not be collapsible.
【0021】 [0021]
図2は、本実施の形態における撮像装置100の一例を示す外観斜視図である。 Figure 2 is an external perspective view showing an example of an imaging apparatus 100 in the present embodiment.
【0022】 [0022]
図2に示すように、撮像装置100は可撓性の基板であるフレキシブルプリント基板FPCと非撓性の基板21で構成された回路基板部20と、光学モジュール部4で構成されている。 2, the imaging apparatus 100 includes a circuit board 20 made of a flexible printed circuit board FPC and non FLEXIBLE substrate 21 is a flexible substrate is comprised of an optically module section 4. 光学モジュール部4は、光入射のための開口部を有する遮光板5と光学部材及び撮像素子等を内包する外枠部材6で構成される。 Optical module unit 4 is composed of an outer frame member 6 which encloses the light shielding plate 5 and the optical member and the image pickup device or the like having an opening for light incidence.
【0023】 [0023]
回路基板部20の基板21は紙フェノールやガラスエポキシ系等の基板であって、コネクタ22、各種電子部品23、24及びシステムIC25等が実装される。 Substrate 21 of the circuit board 20 is a substrate such as paper phenol or glass epoxy, connector 22, various electronic components 23, 24 and system IC25 like are mounted. システムIC25は、光学モジュール部4内の撮像素子を駆動するための駆動回路や光学モジュール部4によって得られる画像信号に種々の画像処理を施す画像処理回路などを構成するものである。 System IC25 is for forming a an image processing circuit which performs various image processing on image signals obtained by the drive circuit and the optical module section 4 for driving the image pickup device in the optical module section 4. コネクタ22は、この撮像装置100を携帯端末内の他の基板と接続するためのものである。 Connector 22 is for connecting the image pickup device 100 and the other boards in the portable terminal.
【0024】 [0024]
フレキシブルプリント基板FPCは、例えばポリエステルやポリイミドからなるベースフィルムに銅等の導体材料によって配線パターン(不図示)を形成したものである。 The flexible printed circuit board FPC is obtained by forming a wiring pattern (not shown) by a conductor material such as copper to a base film made of, for example, polyester or polyimide.
【0025】 [0025]
図3は、図2に示すF−F線で切断した光学モジュール部4の一部省略断面図である。 Figure 3 is a fragmentary sectional view of an optical module section 4 taken along the line F-F shown in FIG.
【0026】 [0026]
同図に示すように、光学モジュール部4は撮像素子2、外枠部材6、遮光板5に加え、光学部材1、絞り板3、弾性部材7、赤外カットフィルタ8で構成されている。 As shown in the figure, the optical module unit 4 the imaging device 2, the outer frame member 6, in addition to the light-shielding plate 5, the optical member 1, the diaphragm plate 3, the elastic member 7 is constituted by an infrared cut filter 8.
【0027】 [0027]
図3において、撮像素子2は例えばCMOS型イメージセンサ、CCD型イメージセンサ等からなり、まず図示のように外枠部材6に接着し取り付けられる。 3, the image pickup element 2 is for example a CMOS image sensor, a CCD image sensor or the like, is first attached adhesively to the outer frame member 6 as shown. この後、撮像光学系である光学部材1を外枠部材6の上方から落とし込み、組み込まれる。 Thereafter, darken the optical member 1 which is an imaging optical system from the top of the outer frame member 6, are incorporated. この光学部材1には、開口部3aを有する絞り板3が取り付けられている。 This optical member 1, the diaphragm plate 3 having an opening 3a is attached. また、光学部材1はフランジ部1eを有し、このフランジ部1eを押圧するように弾性部材7が組み込まれ、赤外カットフィルタ8の組み付けられた遮光板5が外枠部材6に接着される。 The optical element 1 has a flange portion 1e, the elastic member 7 so as to press the flange portion 1e is incorporated, the light shielding plate 5 assembled with an infrared cut filter 8 is bonded to the outer frame member 6 . 弾性部材7により押圧された光学部材1は、少なくとも3箇所に設けられた脚部1dで撮像素子2に当接するようになっている。 The optical member 1 is pressed by the elastic member 7 is adapted to abut the image pickup element 2 in the leg portion 1d provided on at least three places. これにより撮像素子2の受光部2aと光学部材1の光学有効面1aの間隔が保証される。 Accordingly spacing of the optical effective surface 1a of the light receiving portion 2a and the optical member 1 of the imaging device 2 is ensured. 光学モジュール部4は以上のようにしてユニットとして作成される。 Optical module unit 4 is created as a unit as described above.
【0028】 [0028]
同図に示す一点鎖線は、後述の光学モジュール部4の撮像素子2と接続される基板を示し、撮像素子2の接続部2bと、この接続部2bに対応して基板上に形成された接続端子部との間で接続するよう構成されている。 One-dot chain line shown in the figure, shows a substrate connected to the imaging device 2 of the optical module section 4 described later, the connection portion 2b of image sensor 2, connection formed on the substrate in correspondence with the connection portion 2b It is configured to connect with the terminal portion.
【0029】 [0029]
図4は、本発明に適用される回路基板部20の種々の形状例を示した図である。 Figure 4 is a diagram showing various shapes of the circuit board portion 20 which is applied to the present invention.
【0030】 [0030]
同図において、A及びCは非撓性基板、例えば紙フェノールやガラスエポキシ系の基板を示し、Bは可撓性基板、例えばフレキシブルプリント基板を示している。 In the figure, A and C are non FLEXIBLE substrate, for example, shows the substrate of paper phenol or glass epoxy, B is a flexible substrate, for example, shows a flexible printed circuit board.
【0031】 [0031]
図4(a)は、非撓性基板Aの角部を切り欠いて、この切り欠き部に可撓性基板Bを配置し接続した基板を示している。 FIG. 4 (a), by cutting the corner portion of the non FLEXIBLE substrate A, shows a substrate with the flexible substrate B placed connected to the cutout portion. 図4(b)は、非撓性基板Aをコの字状に切り欠いて、この切り欠き部に可撓性基板Bを配置し接続した基板を示している。 FIG. 4 (b), the non FLEXIBLE substrate A by cutting the U-shape, the flexible substrate B placed shows a board connected to the cutout portion. 図4(c)は、非撓性基板Aの中央を開口部にし、この開口部に可撓性基板Bを配置し接続した基板を示している。 FIG. 4 (c), a central non FLEXIBLE substrate A and the opening, the flexible substrate B placed shows a board connected to the opening. 図4(d)は、非撓性基板Aをコの字状に切り欠いて、この切り欠き部に2方向から可撓性基板Bを配置し接続した基板を示している。 FIG. 4 (d), the non FLEXIBLE substrate A by cutting the U-shape, shows a substrate with the flexible substrate B placed connections from two directions in this notch portion. 図4(e)は、非撓性基板Aと、可撓性基板Bにより接続された非撓性基板Cで構成された基板を示している。 FIG. 4 (e) illustrates a non FLEXIBLE substrate A, a substrate made of connected non FLEXIBLE substrate C by a flexible substrate B. なおこれらは、リジットフレキと呼ばれる、非撓性基板部と可撓性基板部が一体で構成された基板を使用してもよい。 Note these are referred to as rigid flexible, flexible substrate portion and the non FLEXIBLE substrate portion may use a substrate composed integrally.
【0032】 [0032]
図4(a)〜(d)に示す可撓性基板Bには、前述の撮像素子2の接続部2bに対応した接続端子BPが形成され、図4(e)においては、非撓性基板Cに撮像素子2の接続部2bに対応した接続端子BPが形成されている。 Figure 4 a flexible substrate B shown in (a) ~ (d) are formed connection terminals BP corresponding to the connection portion 2b of image sensor 2 described above, in FIG. 4 (e), non FLEXIBLE substrate connection terminals BP are formed corresponding to the connecting portion 2b of image sensor 2 to C.
【0033】 [0033]
このような構成の基板のうち、図4に示す非撓性基板A(図2に示す非撓性基板21に相当)上に、コネクタ、各種電子部品、及びシステムIC等が実装され、回路基板部20がユニットとして作成される。 Of the substrate having such a configuration, on the non-FLEXIBLE substrate A shown in FIG. 4 (corresponding to the non FLEXIBLE substrate 21 shown in FIG. 2), connectors, various electronic components and systems IC or the like is mounted, the circuit board part 20 is created as a unit.
【0034】 [0034]
このようにして光学モジュール部4と回路基板部20がユニットとして個々に作成された後、この双方が結合され撮像装置100が完成する。 After such an optical module unit 4 and the circuit board unit 20 in the is created individually as a unit, the image pickup apparatus 100 the both are combined to complete.
【0035】 [0035]
この結合は、図4(a)〜(d)の場合は、可撓性基板Bに形成された接続端子BPに、図3に示す光学モジュール部4の撮像素子2の接続部2bが電気的に接続されることでおこなわれ、図4(e)の場合は、非撓性基板Cに形成された接続端子BPに、光学モジュール部4の撮像素子2の接続部2bが電気的に接続される。 This binding, in the case of FIG. 4 (a) ~ (d), the formed connection terminals BP to the flexible substrate B, the electrical connection portion 2b imaging element 2 of the optical module section 4 is shown in FIG. 3 performed in connected thereto that in the case in FIG. 4 (e), the connection terminals BP formed on the non-FLEXIBLE substrate C, the connection portion 2b imaging element 2 of the optical module section 4 are electrically connected that. なお、この接続時に外枠部材4と可撓性基板B若しくは非撓性基板Cを接着剤で固着することが好ましい。 It is preferable to fix the outer frame member 4, a flexible substrate B or non FLEXIBLE substrate C with an adhesive at the connection.
【0036】 [0036]
このように、光学モジュール部4と回路基板部20を別ユニットとしてそれぞれを作成することにより不良発生時の廃棄による損害を最少に止めることができ、低コスト化できる。 Thus, it is possible to stop minimizing damage from disposal at failure by creating a respective optical module section 4 and the circuit board unit 20 as separate units, it can be low cost.
【0037】 [0037]
更に、数種の光学モジュールと数種の回路基板部を作成しておいて、結合時の組み合わせを変更することで、多種の形態、形状の撮像装置を容易に得ることができ、顧客の種々の要望に対し迅速に対応可能で、かつ低コストの供給を可能とできる。 Furthermore, should make a circuit board portion of several optical modules and several, by changing the combination upon binding, it can be obtained various forms, the imaging device in the form easily, customers various to demands and rapidly adaptable, and can enable the supply of low cost.
【0038】 [0038]
加えて、電子回路部品の実装を非撓性基板におこなうことで、取り扱いの容易性、実装の容易性のみならず基板コストの削減も可能となる。 In addition, by performing an implementation of the electronic circuit component to a non FLEXIBLE substrate, ease of handling, it is possible to reduce the substrate cost as well ease only implementation.
【0039】 [0039]
以上のようにして組み立てられた撮像装置が携帯端末内部の微妙な形状の違いに対応する例を以下に説明する。 It describes an example in which above the imaging device assembled corresponds to subtle difference in shape of the inner mobile terminal below.
【0040】 [0040]
図5は、本発明の撮像装置、即ち光学モジュール部4と回路基板部20を内蔵した携帯電話の撮像装置周辺を示す一部省略断面図である。 Figure 5 is an imaging device, i.e. fragmentary sectional view showing an imaging apparatus around the mobile phone with a built-in optical module section 4 and the circuit board 20 of the present invention.
【0041】 [0041]
図5(a)〜(c)において、31は外表面側カバー、32は内表面側カバーであり、上筐体71(図1参照)を構成する。 In FIG. 5 (a) ~ (c), 31 is the outer surface side cover, 32 is an inner surface side of the cover, constituting the upper housing 71 (see FIG. 1). Dは画面表示部のパネル、34は表示装置であり、この表示装置34はカラーの画像及び文字、キャラクター等を表示するものである。 D panel screen display unit, 34 denotes a display device, the display device 34 is for displaying color images and characters, characters and the like. 4は光学モジュール部、20は回路基板部であり、前述の可撓性の基板Bを介し一体となっている。 4 the optical module unit 20 is a circuit board unit, are integrated via a flexible substrate B described above. 33は防塵パネルであり、外表面側カバー31は開口部Eを有し、光学モジュール部4の前面に配置される。 33 is a dustproof panel, the outer surface side cover 31 has an opening E, is disposed in front of the optical module section 4.
【0042】 [0042]
図5(a)は外表面側カバー31の外表面と光学モジュール部4の光軸が直交するよう配置された例である。 5 (a) is a arranged examples so that the optical axis of the outer surface and the optical module section 4 of the outer surface side cover 31 are orthogonal. 図5(b)は、外表面カバー31の端部で、外表面カバー31の長手方向表面に対し光学モジュール部4の光軸を斜めに傾けて配置された例であり、図5(c)は上筐体71の長手方向表面に略平行な方向に光学モジュール部4の光軸を向けて配置した例を示している。 FIG. 5 (b), the end portion of the outer surface covering 31 is an example which is arranged to be inclined to the optical axis of the optical module unit 4 obliquely to the longitudinal surface of the outer front cover 31, and FIG. 5 (c) shows an example in which toward the optical axis of the optical module unit 4 in a direction substantially parallel to the longitudinal surfaces of the upper casing 71.
【0043】 [0043]
このように、光学モジュール部4と回路基板部20が可撓性の基板Bを介して接続されているため上記のように携帯端末内で種々の方向に光学モジュール部4が配置されても同じ撮像装置での対応が可能となる。 Thus, the same be the optical module unit 4 disposed in various directions in a mobile device as described above for the optical module unit 4 and the circuit board unit 20 is connected via a flexible substrate B compatible with the imaging device can be realized.
【0044】 [0044]
また、図5(b)、図5(c)のような配置の場合、光学モジュール部4の背面を保持しなくとも、可撓性の基板Bの持つ弾性力を利用することで保持部材を不要とすることができる。 Further, FIG. 5 (b), when the arrangement shown in FIG. 5 (c), the even without holding the back of the optical module unit 4, a holding member by utilizing elastic force of a flexible substrate B it can be eliminated. 即ち、光学モジュール部4の前面が外表面側カバー31の開口部E周辺の平面部に当接し、可撓性の基板Bの持つ弾性力により押しつけられて図示の状態を保持することができる。 That is, the front of the optical module section 4 comes into contact with the flat portion of the periphery of an opening E of the outer surface side cover 31, is pressed against the elastic force of a flexible substrate B to maintain the state shown.
【0045】 [0045]
なおこのように弾性力を利用する場合は、可撓性基板がポリイミド製のフレキシブルプリント基板の場合は、光学モジュール部4と回路基板部20を繋ぎの部分の可撓性の基板Bの長さは、基板Bの片面にのみパターンが形成されている場合1〜5mm程度、また両面にパターンが形成されている場合は2〜10mm程度が望ましい。 In the case of using such elastic force, when a flexible substrate is a polyimide flexible printed circuit board, the length of the flexible substrate B portion of the connecting optical module section 4 and the circuit board unit 20 It is about if 1~5mm are single-sided pattern only the formation of the substrate B, also if the pattern is formed on both sides about 2~10mm is desirable. これは、基板の持つ弾性力が適度に働くためである。 This is because the elastic force of a substrate acts moderately.
【0046】 [0046]
図5に示した断面図は、回路基板部として図4(a)に示すものを用いて説明したが、携帯電話機Tの撮像装置レイアウトに応じ図4(b)〜(e)に示す回路基板部を適宜選択することにより多種の形態、形状の撮像装置を容易に得ることができる。 Sectional view shown in FIG. 5 has been described with reference to those shown in FIGS. 4 (a) as a circuit board unit, the circuit board shown in Figure according to an imaging device layout of the mobile phone T 4 (b) ~ (e) part can be obtained various forms, the imaging device in the form easily by appropriately selecting the. これにより顧客の種々の要望に対し迅速に対応可能となり、かつ低コストで供給可能となる。 Thus quickly it becomes possible corresponding to various customer requirements, and can be supplied at low cost.
【0047】 [0047]
【発明の効果】 【Effect of the invention】
以上説明したように、携帯端末の微妙な形状の違いに対応可能で、携帯端末内の撮像装置の配置される位置の相違に対し対応可能で、且つ不良損失が低く、低コストで製作可能な撮像装置及び撮像装置製造方法を得ることができた。 As described above, it can correspond to subtle difference in the shape of the portable terminal, can correspond to differences deployed the position of the imaging device in a portable terminal, and poor loss low, which can be manufactured at low cost It could be obtained imaging apparatus and an imaging device manufacturing method.
【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS
【図1】本発明の実施形態に係る携帯端末の一例である携帯電話機の外観を示す図である。 1 is a diagram showing an appearance of a cellular phone as an example of a mobile terminal according to an embodiment of the present invention.
【図2】本実施の形態における撮像装置の一例を示す外観斜視図である。 It is an external perspective view showing an example of an image pickup apparatus in FIG. 2 embodiment.
【図3】図2に示すF−F線で切断した光学モジュール部の一部省略断面図である。 3 is a fragmentary sectional view of an optical module section taken along the line F-F shown in FIG.
【図4】本発明に適用される回路基板部の種々の形状例を示した図である。 4 is a diagram showing the various shapes of the circuit board portion to be applied to the present invention.
【図5】本発明の撮像装置を内蔵した携帯電話の撮像装置周辺を示す一部省略断面図である。 5 is a fragmentary sectional view showing an imaging apparatus around the mobile phone with a built-in image pickup device of the present invention.
【符号の説明】 DESCRIPTION OF SYMBOLS
1 光学部材2 撮像素子3 絞り板4 光学モジュール部5 遮光板6 外枠部材7 弾性部材8 赤外カットフィルタ20 回路基板部100 撮像装置 First optical member 2 imaging element 3 stop plate 4 optical module unit 5 light shielding plate 6 outer frame member 7 elastic member 8 infrared cut-off filter 20 circuit board unit 100 imaging device

Claims (3)

  1. 被写体光を光電変換する撮像素子と、該撮像素子に被写体光を導く撮像光学系とが一体化された光学モジュール部と、 An image sensor for photoelectrically converting an object light, and an optical module unit which the imaging optical system and is integrated for guiding subject light to the image sensor,
    前記撮像素子を駆動する回路部品が実装された回路基板部と、を有し、 Anda circuit board portion which circuit components are mounted for driving the imaging element,
    前記回路基板部は、非撓性基板と、該非撓性基板の開口部又は切り欠き部に配置される可撓性基板もしくは可撓性基板により接続された非撓性基板で構成され、前記撮像素子を前記非撓性基板の開口部又は切り欠き部に配置される基板と電気的に接続することにより、前記光学モジュール部と前記回路基板部とを一体化したことを特徴とする撮像装置。 The circuit board unit comprises: a non FLEXIBLE substrate, formed of a non FLEXIBLE board connected by a flexible substrate or a flexible substrate is disposed in an opening or cut-out of the non FLEXIBLE substrate, the imaging by connecting the substrate and electrically arranged an element in the opening or cut-out of the non FLEXIBLE substrate, the imaging device being characterized in that integrated with the circuit board portion and the optical module unit.
  2. 請求項1に記載の撮像装置を備えたことを特徴とする携帯端末。 Mobile terminal comprising the image pickup apparatus according to claim 1.
  3. 被写体光を光電変換する撮像素子と、該撮像素子に被写体光を導く撮像光学系とが一体化された光学モジュール部を作成する工程と、 A step of creating an image sensor for photoelectrically converting the object light, an optical module unit which the imaging optical system and is integrated for guiding subject light to the image sensor,
    非撓性基板と、該非撓性基板の開口部又は切り欠き部に配置される可撓性基板もしくは可撓性基板により接続された非撓性基板で構成される基板に、回路部品を実装した回路基板部を作成する工程と、 A non FLEXIBLE substrate, the substrate composed of a non FLEXIBLE board connected by a flexible substrate or a flexible substrate is disposed in an opening or cut-out of the non FLEXIBLE substrate, mounting the circuit component a step of creating a circuit board portion,
    前記光学モジュール部の撮像素子を前記前記非撓性基板の切り欠き部に配置された基板と電気的に接続する工程と、を有する撮像装置製造方法。 It said imaging device manufacturing method having the steps of the imaging device to connect the said non FLEXIBLE substrate cutout electrical and substrate disposed part in the optical module unit.
JP2003100205A 2003-04-03 2003-04-03 Imaging apparatus, mobile terminal and imaging apparatus manufacturing method Pending JP2004309623A (en)

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US8723705B2 (en) 2004-11-24 2014-05-13 Qualcomm Incorporated Low output skew double data rate serial encoder
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US8539119B2 (en) 2004-11-24 2013-09-17 Qualcomm Incorporated Methods and apparatus for exchanging messages having a digital data interface device message format
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