TWI650017B - Camera module bracket based on metal powder molding, manufacturing method and application thereof - Google Patents

Abstract

A camera module bracket based on metal powder molding, and a manufacturing method and application thereof, wherein the camera module bracket is made of metal powder or a mixture of metal powder and non-metal powder, and the camera module bracket has at least one first The mounting portion is adapted to mount at least one optical lens and/or at least one motor and a second mounting portion to be adapted to mount at least one circuit board to form a camera module. The camera module further includes at least one photosensitive wafer, and the camera module holder is configured to conduct and radiate heat generated by each of the photosensitive wafers during photoelectric conversion to an external environment of the camera module holder, thereby The camera module does not need to configure an additional heat sink on the circuit board to reduce the thickness of the camera module in the axial direction.

Description

Camera module bracket based on metal powder molding, manufacturing method and application thereof

The invention relates to an optical imaging device, in particular to a camera module bracket based on metal powder molding, a manufacturing method thereof and an application thereof.

At present, portable electronic devices represented by smart phones and tablet computers are increasingly seeking to be thin and light, which requires that the size of various components of portable electronic devices (especially the thickness dimensions of individual components) is also becoming smaller and smaller, for example, The camera module, which is one of the standard components of the portable electronic device, also has a trend of being thin and light.

Generally, the camera module of the portable electronic device can be divided into a single camera module and a multi camera module. In one case, the single camera module includes components such as a lens, a bracket, a chip, and a circuit board. In another case, the single camera module may further include a motor, and the single camera module includes a motor as an example. The single camera module is mounted on the motor, the wafer is mounted on the circuit board, the motor and the circuit board are respectively mounted on both sides of the bracket, and the lens is located in the photosensitive path of the wafer. It can be understood that, in the case where the thickness of the motor is determined, the thickness of the camera module depends on the thickness of the bracket. Therefore, in order to reduce the thickness of the camera module, the thickness of the bracket is also made thinner. The material of the prior art bracket is selected from a plastic material. Due to the limitation of the mechanical properties of the plastic material, the thinner the thickness of the stent, the less the mechanical properties of the stent can meet the requirements of the camera module, as shown in the bracket. The thickness is too thin, which causes it to be easily deformed in the process of being transported, so that the package yield of the camera module is greatly reduced, and the image quality of the camera module is poor.

In addition, in the process of being used for a long time, the single camera module generates a large amount of heat while performing photoelectric conversion, and the bracket made of plastic material has poor thermal conductivity and heat dissipation, and cannot effectively assist heat radiation. . In order to quickly dissipate heat, the conventional method is to mount a heat sink on the side of the circuit board relative to the wafer to remit the heat inside the camera module. The presence of the heat sink further increases the thickness of the camera module. Therefore, it is also one of the problems to be studied in the present invention how to radiate heat generated when the wafer is subjected to photoelectric conversion.

The multi-camera module is assembled by more than one single camera module and assembled according to a specific positional relationship. The key issue involved in the assembly of multi-camera modules is how to accurately or constrain two or more imaging modules. The limits referred to here include, but are not limited to, the limitations and use of the packaging process. Limits in the process. In order to solve this requirement of the multi-camera module, it is usually required to use a specific bracket. The bracket of the multi-camera module provided by the prior art is made by processing a finished metal product, for example, a metal sheet material can be used to manufacture a bracket required for the camera module. . Although such a bracket can meet the assembly requirements of the multi-camera module, it still has the following problems. First, the molding method using the prior art bracket is difficult, especially when it comes to a bracket having a complicated shape. The molding method of the technical bracket cannot be realized; secondly, the size of the molding method using the prior art bracket cannot be accurately ensured, so that when a plurality of imaging modules are assembled to the bracket, there will exist between the respective imaging modules. Large deviations, such deviations are unacceptable and tolerable for the imaging quality of multi-camera modules; in addition, the difficulty and speed of the imaging method of the prior art stents in processing the stents are difficult to be widely promoted and applied.

An object of the present invention is to provide a camera module bracket based on metal powder molding, and a manufacturing method and application thereof, wherein the camera module bracket is made of metal powder or metal powder and non-metal The metal powder mixture is produced so that the thickness of the camera module holder can be significantly reduced to meet the trend of increasingly thinner and lighter portable electronic devices.

An object of the present invention is to provide a camera module bracket based on metal powder molding, a manufacturing method thereof and an application thereof, wherein the mechanical performance of the camera module bracket made of metal powder or a mixture of metal powder and non-metal powder is superior to The mechanical properties of the bracket made of plastic material make the camera module bracket less likely to be deformed when being transported and used, thereby facilitating the image quality of the camera module having the camera module bracket.

An object of the present invention is to provide a camera module bracket based on metal powder molding, a manufacturing method thereof and an application thereof, wherein the camera module bracket has good thermal conductivity and heat dissipation performance, thereby having the camera module bracket During the use of the camera module, heat generated by the photosensitive chip of the camera module during operation can be conducted through the camera module bracket and radiated to the external environment of the camera module. The camera module does not need to be configured with an additional heat dissipation mechanism to assist in heat dissipation, thereby significantly reducing the overall thickness of the camera module.

An object of the present invention is to provide a camera module bracket based on metal powder molding, and a manufacturing method and application thereof, wherein the camera module bracket forms a metal powder or a mixture of a metal powder and a non-metal powder by an injection molding process or a 3D printing process. be made of.

An object of the present invention is to provide a camera module bracket based on metal powder molding, a manufacturing method thereof and an application thereof, wherein the manufacturing method of the camera module bracket can manufacture the camera module bracket having a complicated structure, and The accuracy of the camera module bracket manufactured by the manufacturing method can be effectively ensured, so that the camera module bracket can better meet the development needs and use requirements of the camera module.

An object of the present invention is to provide a camera module bracket based on metal powder molding, a manufacturing method thereof and an application thereof, wherein the manufacturing method can greatly improve the manufacturing efficiency of the camera module bracket, so that the camera module The set of brackets is adapted to be manufactured in large quantities.

An object of the present invention is to provide a camera module bracket based on metal powder molding, a manufacturing method thereof and an application thereof, wherein the manufacturing method can reduce waste of materials in a process in which the camera module bracket is manufactured, to further The manufacturing cost of the camera module bracket is reduced.

In order to achieve the above object, the present invention provides a camera module with reduced thickness, comprising: a circuit board; at least one photosensitive chip, each of the photosensitive wafers being electrically connected to the circuit board; and a camera module bracket, It is made of a metal powder or a mixture of a metal powder and a non-metal powder, and the circuit board is mounted on the camera module holder, wherein the camera module holder is used for photoelectric conversion of each of the photosensitive wafers. The generated heat is conducted and radiated to the external environment of the camera module bracket, so that the camera module does not need to be configured with an additional heat sink on the circuit board to reduce the thickness of the camera module in the axial direction.

According to another aspect of the present invention, the present invention further provides a camera module bracket, wherein the camera module bracket is made of metal powder or a mixture of metal powder and non-metal powder, and the camera module bracket has at least one A mounting portion is adapted to mount at least one optical lens and/or at least one motor, and a second mounting portion to be adapted to mount at least one circuit board.

According to another aspect of the present invention, the present invention further provides a thermal system for a camera module, comprising: at least one photosensitive wafer; a camera module bracket, the camera module bracket having an internal environment and an external environment Each of the photosensitive wafers is housed in the internal environment of the camera module holder, wherein heat generated by each of the photosensitive wafers during photoelectric conversion causes gas formation in the internal environment of the camera module holder Hot gas, and the camera module bracket is used to heat the internal environment of the camera module bracket Performing heat exchange with the cold gas of the external environment of the camera module bracket to reduce the temperature of the internal environment of the camera module bracket.

According to another aspect of the present invention, the present invention further provides a heat dissipation method for a camera module, wherein the heat dissipation method includes the following steps: (A) uniformly radiating at least one along a radial direction and an axial direction of the camera module The heat generated by the photosensitive wafer during photoelectric conversion; and (B) the hot gas in the radial direction of the camera module in the internal environment of the camera module and the cold environment of the external environment of the camera module Gas, thereby reducing the temperature of the internal environment of the camera module.

According to another aspect of the present invention, there is also provided a method of manufacturing a camera module holder, wherein the manufacturing method comprises the steps of: (a) forming a stream based on metal powder; (b) pouring the stream And the (c) solidifying the flow in the mold of the camera module bracket to obtain the camera module bracket.

According to another aspect of the present invention, there is also provided a method of manufacturing the camera module holder, wherein the manufacturing method comprises the steps of: (i) forming a stream based on metal powder; (ii) establishing and a digital model associated with the camera module bracket; and (iii) printing the stream using the stream based on the digital model to produce the camera module bracket.

The camera module bracket provided by the invention is formed by metal powder or a mixture of metal powder and non-metal powder by injection molding or 3D printing process, so that the mechanical performance of the camera module bracket is superior to the prior art. A bracket made of plastic material. Especially when the size of the camera module bracket needs to be designed to be ultra-thin, on the one hand, the camera module bracket is transported. In the process, the photosensitive chip is not easily deformed, thereby facilitating the precise packaging of the subsequent camera module, and on the other hand, during the use of the camera module, the photosensitive wafer is generated during long-term photoelectric conversion. The heat does not cause the camera module bracket to be thermally deformed, thereby facilitating the stability of the camera module bracket and ensuring the imaging quality of the camera module.

In addition, the camera module bracket provided by the present invention is formed by metal powder or a mixture of metal powder and non-metal powder by injection molding or 3D printing process, and has good thermal conductivity and heat dissipation performance to achieve The radial direction of the camera module exchanges heat generated by the camera module during operation with cold air of an external environment of the camera module, thereby reducing the temperature of the internal environment of the camera module. One of the advantages of such a heat dissipation method is that the radial direction has a larger heat dissipation area than the conventional heat exchange in the axial direction, thereby improving the heat dissipation efficiency of the camera module. The heat exchange of the camera module bracket can eliminate the need for the heat dissipation device to be disposed in the camera module of the prior art to achieve heat dissipation, thereby significantly reducing the thickness of the camera module. It conforms to the development trend of the pursuit of thinning and thinning of the camera module.

10‧‧‧ Camera Module Bracket

11‧‧‧First Placement Department

12‧‧‧Second Placement Department

13‧‧‧Light channel

14‧‧‧Exhaust department

15‧‧‧ overflow tank

16‧‧‧ Positioning components

20‧‧‧ circuit board

30‧‧‧Photosensitive wafer

40‧‧‧Optical lens

50‧‧‧Motor

141‧‧‧First outlet channel

142‧‧‧Second outlet channel

900‧‧‧Dissipation method

910, 920‧‧ steps

1000‧‧‧Method of manufacturing camera module bracket

1010, 1020, 1030, 1040, 1050‧‧ steps

1100‧‧‧Method of manufacturing camera module bracket

1110, 1120, 1130‧‧ steps

1 shows a top plan view of a camera module holder in accordance with a preferred embodiment of the present invention.

Figure 2 is a partial enlarged view of Figure 1 showing the air outlet of the camera module bracket.

Figure 3 is a cross-sectional view showing the camera module holder of the above preferred embodiment of the present invention.

4 is a perspective view of a camera module holder of another preferred embodiment of the present invention.

FIG. 5 is a top plan view of a camera module holder in accordance with still another preferred embodiment of the present invention.

Figure 6 is a cross-sectional view showing the camera module holder of the above preferred embodiment of the present invention.

Fig. 7 is an exploded view showing the image pickup module of the above preferred embodiment of the present invention.

Figure 8 is a cross-sectional view showing a camera module of the above preferred embodiment of the present invention.

FIG. 9 is a block diagram showing a heat dissipation method of the camera module of the above preferred embodiment of the present invention.

Fig. 10 is a block diagram showing the manufacturing process of the camera module holder of the above preferred embodiment of the present invention.

Fig. 11 is a block diagram showing another manufacturing process of the camera module holder of the above preferred embodiment of the present invention.

The following description is presented to disclose the invention to enable those skilled in the art to practice the invention. The preferred embodiments in the following description are by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention as defined in the following description may be applied to other embodiments, modifications, improvements, equivalents, and other embodiments without departing from the spirit and scope of the invention.

7 and 8 show schematic views of a camera module in accordance with a preferred embodiment of the present invention. It can be understood by those skilled in the art that the camera module can be a single camera module or a multiple camera module. The multi-camera module provided in the present invention can be composed of multiple single camera modules. It is assembled according to a specific positional relationship. The camera module can include a camera module holder 10, a circuit board 20, at least one photosensitive wafer 30, at least one optical lens 40, and at least one motor 50.

Each of the photosensitive wafers 30 is electrically connected to the wiring board 20. Preferably, each of the photosensitive wafers 30 may be mounted on the wiring board 20. Each of the optical lenses 40 is mounted to each of the motors 50, and each of the optical lenses 40 can be driven by each of the motors 50 to be adapted to adjust a focal length of the camera module. The circuit board 20 and each of the motors 50 are respectively disposed on different sides of the camera module holder 10 such that each of the optical lenses 40 is located in a photosensitive path of each of the photosensitive wafers 30, thereby When the module is used to capture an image of an object, the light reflected by the object can be used by each The processing of the optical lens 40 is further accepted by each of the photosensitive wafers 30 to be suitable for photoelectric conversion. That is, in the present invention, the camera module holder 10 can be used to connect the circuit board 20 and each of the motors 50.

It is to be noted that, in an optional example of the present invention, each of the optical lenses 40 of the camera module may be directly disposed on the camera module bracket 10, thereby making the camera module The bracket 10 is capable of directly connecting the wiring board 20 and each of the optical lenses 40. In another optional example of the present invention, as shown in FIG. 4, the camera module bracket 10 may also be an integrated bracket, and the camera module may not be configured with the motor 50, so that each The optical lens 40 can be directly disposed on the camera module holder 10, and the camera module holder 10 directly connects the circuit board 20 and each of the optical lenses 40. The present invention is not limited in this respect.

1 through 3 illustrate the camera module mount 10 in accordance with a preferred embodiment of the present invention. The camera module holder 10 provided by the invention is prepared by forming a metal powder or a mixture of a metal powder and a non-metal powder by injection molding or a 3D printing process, and is made of a plastic material compared with the prior art. The bracket, the camera module 10 of the present invention has better stability. As a specific example, when the camera module holder 10 needs to be designed to be thin enough to be configured in the ultra-thin type of the camera module, the good mechanical performance of the camera module holder 10 can be ensured. The camera module bracket is not easily deformed, thereby ensuring the package precision of the camera module in the subsequent manner. In addition, the camera module holder 10 made based on the metal powder also has good bending resistance and good recovery ability.

Specifically, when the camera module holder 10 of the present invention is subjected to an external force of the same size and direction from the prior art bracket made of a plastic material, the prior art bracket made of a plastic material is easier. Deformation such as bending occurs; correspondingly, when the camera module holder 10 of the present invention and the prior art bracket made of a plastic material are subjected to an external force to produce the same degree of deformation, after the external force is revoked, The camera module bracket 10 of the invention is easier to return to the initial The state in which the camera module holder 10 of the present invention is more stable than the bracket made of the prior art plastic. It can be understood by those skilled in the art that the external force is easily generated during the process of transporting the camera module bracket 10. For example, the camera module bracket 10 is subjected to bumps and the like, thereby generating the external force, thereby improving the camera. The mechanical properties of the module holder 10 have significant advantages over the quality of the camera module holder 10.

That is to say, when the camera module holder 10 is transported, even if the camera module holder 10 is subjected to an external force, no deformation occurs, and the subsequent package yield of the camera module can be ensured. Correspondingly, when the camera module is used, the camera module holder 10 is not easily deformed when heated, thereby ensuring the imaging quality of the camera module. It can be understood by those skilled in the art that the thermal conductivity and heat dissipation performance of the prior art stent made of plastic material are relatively poor, and the photosensitive wafer 30 is undergoing photoelectric conversion when the camera module is used for a long time. The heat generated at the time is not easily radiated from the inside of the camera module holder, thereby causing the bracket to be deformed due to excessive heat, and the photosensitive wafer 30 and the optical lens 40 must be relatively opposed once the bracket is deformed. The situation of tilting causes the imaging quality of the camera module to be adversely affected. The camera module holder 10 of the present invention is formed by metal powder or a mixture of metal powder and non-metal powder by injection molding or 3D printing process, and has good thermal conductivity and heat dissipation performance, so that even in the camera mode When the group holder 10 is heated, the camera module holder 10 is not deformed.

It is worth mentioning that in the present invention, the metal powder may be selected from the group consisting of iron, tungsten, molybdenum, copper, cobalt, nickel, titanium, niobium, aluminum, tin, lead, antimony, bismuth, titanium, zirconium, hafnium, tantalum, One or more of uranium. Accordingly, the non-metal powder may be selected from one or more of graphite, carbon black, ceramic, plastic, and the like. It is also worth mentioning that the metal powder and the non-metal powder in the present invention can be obtained by a conventional powder acquisition process, thereby ensuring that the camera module holder 10 has a wide range of material sources to further reduce the camera module. The manufacturing difficulty and manufacturing cost of the bracket 10.

A first mounting portion 11 and a second mounting portion 12 are respectively disposed on two sides of the camera module bracket 10, and the camera module bracket 10 further has at least one light channel 13 connected to the first mounting portion. a portion 11 and the second mounting portion 12 such that each of the light tunnels 13 allows light to pass from a side of the camera module holder 10 where the first mounting portion 11 is located to the second mounting portion Radiation on the side where 12 is located. The first mounting portion 11 of the camera module holder 10 is adapted to be attached to each of the optical lenses 40 and/or each of the motors 50, and each of the optical lenses 40 and/or each of the motors 50 corresponds to each of the light tunnels 13 of the camera module holder 10. Correspondingly, the second mounting portion 12 of the camera module holder 10 is adapted to be mounted on the circuit board 30, and each of the photosensitive wafers 30 is respectively in the camera module holder 10 The light tunnels 13 correspond so that each of the optical lenses 40 is located in a photosensitive path of each of the photosensitive wafers 30, respectively.

Further, as shown in FIG. 2, the camera module holder 10 has at least one air outlet portion 14 adapted to communicate with the internal environment and the external environment of the camera module holder 10, thereby encapsulating the camera module. Each of the air outlet portions 14 can balance the air pressure of the internal environment of the camera module holder 10 with the air pressure of the external environment to ensure the flatness between each of the photosensitive wafers 30 and each of the optical lenses 40. It is to be noted that, in the present invention, the space inside the inner surface of the camera module holder 10 is defined as the internal environment of the camera module holder 10, and the outer surface of the camera module holder 10 is defined. The space is the external environment of the camera module holder 10. It is also worth mentioning that each of the air outlet portions 14 may have a different shape, for example, each of the air outlet portions 14 may be selected from a shape group consisting of a straight line, a curved line, and other irregular shapes, and each of the air outlet portions 14 The air outlet portion 14 can be located on the same side of the camera module bracket 10 as the second mounting portion 12 .

As an exemplary illustration, the camera module bracket 10 is provided with at least one first air outlet passage 141 and at least one second air outlet passage 142, and each of the first air outlet passage 141 and each of the second air outlet passages 142 respectively Connected to form each of the air outlet portions 14. Preferably, each of the first gas outlets The passage 141 and each of the second air outlet passages 142 are respectively curvedly communicated, so that each of the air outlet portions 14 can be filtered to enter the internal environment from the external environment of the camera module bracket 10 via each of the air outlet portions 14 . The pollutants carried in the gas.

In addition, the camera module bracket 10 may further be provided with at least one glue overflow groove 15, and each of the glue overflow grooves 15 may be disposed at intervals from each of the air outlet portions 14 for accommodating excess glue to prevent glue. Each of the photosensitive wafers 30 or other components is contaminated in the internal environment of the camera module holder 10. For example, one of the overflow tanks 15 may be provided on each of the two sides of the air outlet portion 14, thereby preventing the air outlet portion 14 from being blocked by excess glue.

Specifically, in the process of encapsulating the camera module, it is required to provide glue on the second mounting portion 12 of the camera module holder 10 and at least one component of the circuit board 20, and then The circuit board 20 is disposed on the second mounting portion 12 of the camera module holder 10 in a superposed manner. Subsequently, the camera module is baked and heated. At this time, the gas in the internal environment of the camera module holder 10 is heated to increase the air pressure and form a hot gas. At this time, the camera module holder 10 is The hot gas of the internal environment is removed to the external environment of the camera module holder 10 through each of the air outlet portions 14. When the baking of the camera module is completed and the camera module is cooled, the air pressure of the internal environment of the camera module holder 10 is gradually lower than the air pressure of the external environment of the camera module holder 10 . At this time, the gas of the external environment of the camera module holder 10 enters the internal environment of the camera module holder 10 through each of the air outlet portions 14, in the process, from the outside of the camera module holder 10. Contaminants such as dust and the like carried in the gas entering the internal environment of the environment may be precipitated at the bent joint position of the first air outlet passage 141 and the second air outlet passage 142 of each of the air outlet portions 14, so that the pollutants are not Each of the photosensitive wafers 30 or other components may be contaminated by entering the internal environment of the camera module holder 10. In addition, the glue will also expand during the process of baking the camera module, so that excess glue will overflow and remain in each of the overflow tanks 15, and because the glue tank 15 and each of the glue tanks are not The gas portions 14 are disposed at intervals, so that the excess glue does not block each of the gas outlet portions 14 on the one hand, and on the other hand Each of the photosensitive wafers 30 or other components in the internal environment of the camera module 10 is not contaminated.

As shown in FIG. 4, the camera module holder 10 according to another preferred embodiment of the present invention is different from the above embodiment in that the camera module holder 10 is an integrated camera module holder. Specifically, the camera module holder 10 may have a plurality of the first mounting portions 11 and one of the second mounting portions 12, wherein each of the first mounting portions 11 and the second stickers The mounting portions 12 are not symmetrically disposed on both sides of the camera module holder 10. More specifically, each of the first mounting portions 11 may be disposed along a depth direction of the camera module 10 such that each of the optical lenses 40 and/or each of the motors 50 is embedded in an embedded manner. Mounted in the photographic module holder 10, the circuit board 20 to which the photosensitive wafer 30 is attached is attached to the second mounting portion 12 of the camera module holder 10, thereby The optical lens 40 is located on the photosensitive path of each of the photosensitive wafers 30.

It is to be noted that, in the above two preferred embodiments of the present invention, the number of the photosensitive wafer 30, the optical lens 40, and the motor 50 may be one, that is, the imaging mode. The group can be a single camera module. As shown in FIG. 5 and FIG. 6, in another preferred embodiment of the present invention, the camera module holder 10 can be used to package two or more of the photosensitive wafers 30 and the optical lens 40. And the motor 50, so that the camera module forms a multi-camera module. That is, more than one of the photosensitive wafer 30, the optical lens 40, and the motor 50 can be packaged by one of the camera module holders 10.

Specifically, as an exemplary illustration, the camera module holder 10 may have one of the first mounting portion 11, one of the second mounting portions 12, and two of the light tunnels 13 to be adapted. Connecting to a side where the first mounting portion 11 is located and a side where the second mounting portion 12 is located, and each of the optical lenses 40 and/or each of the motors 50 corresponds to each of the light channels 13 is attached to the first mounting portion 11 of the camera module holder 10, and when the circuit board 20 is attached to the camera Each of the photosensitive wafers 30 corresponds to each of the light tunnels 13 in the second mounting portion 12 of the module holder 10, so that each of the optical lenses 40 is located on each of the photosensitive wafers 30. path.

In addition, a positioning component 16 can be respectively disposed on each side of the camera module bracket 10, and each of the positioning components 16 is adapted to mount the camera module to a portable electronic device, thereby preventing the camera. The module is damaged during assembly and subsequent use. For example, each of the positioning elements 16 can be respectively provided with a positioning hole, and the camera module can be installed on the portable electronic device through the positioning hole through the screw. on. In this way, the distance between each camera module (the camera module including the optical lens, the motor, and the photosensitive wafer) between the camera modules is not offset to ensure the reliability of the camera module.

In addition, the camera module holder 10 prepared by metal powder or metal powder and non-metal powder mixture by injection molding or 3D printing process also has good thermal conductivity and heat dissipation performance. As shown in FIG. 8 , the vertical direction of the camera module is defined as the axial direction of the camera module, and the surrounding direction of the camera module is defined as the radial direction of the camera module.

The camera module holder 10 of the present invention obtained by injection molding or 3D printing from metal powder or metal powder and non-metal powder mixture is substantially different from the function of the prior art stent made of plastic material. . Specifically, the prior art bracket made of a plastic material is only used to connect the motor and the circuit board. Therefore, in order to improve the heat dissipation capability of the prior art camera module, it is necessary to additionally add a side of the circuit board opposite to the photosensitive wafer. The heat dissipating device is disposed, and the heat dissipating device is usually a metal piece to radiate heat generated by the photoreceptor wafer during photoelectric conversion to the external environment of the camera module through the heat dissipating device. It can be understood by those skilled in the art that the heat dissipation device is disposed in the axial direction of the camera module, that is, the prior art camera module only provides heat dissipation in the axial direction, and such a manner exists. Many defects. First, the prior art camera module can only dissipate heat along the axial direction of the camera module. Such a heat dissipation method makes the contact area of the heat sink of the camera module and the external environment limited, thereby causing the prior art camera module. Heat dissipation lack of ability. Secondly, the camera module of the prior art dissipates heat through the heat sink through the circuit board. When the circuit board is heated for a long time, the circuit board is deformed, so that the relative tilt between the photosensitive wafer and the optical lens mounted on the circuit board is caused. It affects the imaging quality of the prior art camera module. Thirdly, the heat dissipating device is additionally disposed in the axial direction of the camera module, so that the thickness of the camera module of the prior art is further increased, thereby facilitating the application of the prior art camera module to the pursuit of thin and light portability. On the electronic device.

The camera module of the present invention is different from the heat dissipation direction of the camera module of the prior art. Specifically, when the camera module holder 10 and other components are packaged to form the camera module, the photosensitive wafer 30 is housed in the internal environment of the camera module holder 10, thereby The camera module holder 10 is disposed around the photosensitive wafer 30. That is, the camera module holder 10 is not in the axial direction of the camera module, but is disposed in the radial direction of the camera module. When the photosensitive wafer 30 generates heat during photoelectric conversion, the heat causes the gas in the internal environment of the camera module holder 10 to form hot gas, and accordingly, the external environment of the camera module holder 10 The gas is called a cold gas. The heat carried by the hot gas inside the camera module holder 10 is conducted from the internal environment by the camera module holder 10 and radiated to the external environment, thereby realizing hot gas and cold gas through the camera module holder 10. The heat exchange is performed to lower the temperature of the internal environment of the camera module holder 10. In this way, one of the advantages is that the contact area of the camera module holder 10 with the external environment is larger than the base area of the circuit board 20 and the external environment, and the camera module bracket 10 directly realizes hot gas and The heat exchange of the cold gas is beneficial to improve the efficiency of the heat exchange; the second advantage is that the use of the camera module bracket 10 does not need to additionally configure the heat sink for the camera module, thereby making the camera The overall thickness of the module can be significantly reduced to meet the trend of the pursuit of thin and light portable electronic devices, which is unexpected in the prior art camera module, and the overall performance of the camera module is improved. The reduction in thickness is particularly effective.

Therefore, as shown in FIG. 9, the present invention further provides a heat dissipation method 900 for a camera module, wherein the heat dissipation method 900 includes the following steps: Step 910: (A) along a radial direction and an axial direction of the camera module Evenly radiating heat generated by at least one photosensitive wafer 30 during photoelectric conversion; and step 920: (B) thermally exchanging hot gases and contents of an internal environment of the camera module in a radial direction of the camera module The cold gas in the external environment of the camera module is used to reduce the temperature of the internal environment of the camera module.

It can be understood by those skilled in the art that the axial direction of the camera module is a circuit board and an optical lens, respectively, and heat generated by each of the photosensitive wafers 30 during photoelectric conversion of each of the photosensitive wafers 30. It is conducted through the circuit board and radiated to the external environment of the camera module, and in the process, the prior art is to additionally arrange a heat sink on the side of the circuit board opposite to each of the photosensitive wafers 30 to improve heat radiation. The efficiency of the person skilled in the art can understand that this method of the prior art undoubtedly increases the thickness of the camera module in the axial direction. When the camera module is used, for example, the camera module is installed in a mobile phone that is light and thin, and the axial direction of the camera module is the thickness direction of the mobile phone, so that the thickness of the camera module is determined. The thickness of the mobile phone, therefore, increasing the size of the camera module in the axial direction is undoubtedly increasing the thickness of the mobile phone.

In the step (B), the present invention heats the cold gas in the internal environment of the camera module in the radial direction and the cold gas in the external environment of the camera module, and the heat dissipation area is increased. The heat dissipation effect of the camera module, and in this process, there is no need to additionally configure a heat dissipation device in the axial direction of the camera module, thereby effectively reducing the thickness of the camera module, thereby enabling the The camera module meets the development needs of electronic devices that pursue thin and light.

Preferably, in the step (B), the method further includes the step of: arranging a camera module holder 10 in a radial direction of the camera module for conducting and radiating heat. Compared with the circuit board, the heat dissipation area formed by the camera module bracket 10 is greatly increased, thereby significantly increasing the camera. The heat dissipation effect of the module, and in this manner, the camera module holder 10 itself forms a heat dissipating member, so that the heat generated by each of the photosensitive wafers 30 is greatly reduced to the portion of the circuit board 20, The circuit board 20 is prevented from being deformed due to excessive heat energy to ensure the imaging quality of the camera module.

Preferably, in the step (A), each of the photosensitive wafers 30 is mounted on the circuit board 20, and in the step (B), the circuit board 20 is mounted on the camera module. The support 10 is further conducted to the camera module holder 10 to conduct heat to the circuit board holder 10 during photoelectric conversion of each of the photosensitive wafers 30 to radiate at least the external environment of the camera module. That is, although heat generated by each of the photosensitive wafers 30 during photoelectric conversion is conducted to the circuit board 20, part of the heat is quickly dissipated through the camera module holder 10 without continuing. Acting on the circuit board 20 to avoid deformation of the circuit board 20 due to an increase in temperature due to continuous heating.

According to another aspect of the present invention, a thermal system for a camera module includes at least one of the photosensitive wafer 30 and the camera module holder 10, wherein the camera module holder 10 has a An internal environment and an external environment, each of the photosensitive wafers 30 is housed in the internal environment of the camera module holder 10, wherein the heat generated by each of the photosensitive wafers 30 during photoelectric conversion causes the camera module The gas of the internal environment of the bracket 10 forms a hot gas, and correspondingly, the gas of the external environment of the camera module holder 10 forms a cold gas, and the camera module bracket 10 is used for the camera module. The hot gas of the internal environment of the bracket 10 exchanges heat with the cold gas of the external environment of the camera module holder 10, thereby reducing the temperature of the internal environment of the camera module bracket.

Further, the camera module holder 10 surrounds the radial direction of each of the photosensitive wafers 30, so that the internal environment of each of the camera module holders 10 is in the radial direction of each of the photosensitive wafers 30. The hot gas exchanges heat with the cold gas of the external environment of the camera module holder.

According to another aspect of the present invention, as shown in FIG. 10, the present invention also provides a method 1000 of manufacturing the camera module holder, wherein the manufacturing method 1000 includes the following steps.

Step 1010: (a) forming a stream based on the metal powder. The stream is a raw material for subsequently forming the camera module holder 10, and the stream may be formed by mixing a metal powder, a metal powder, and a non-metal powder mixture. Thus in a preferred embodiment of the invention, the step (a) may further comprise the step of mixing the metal powder with an adhesive to form the stream; in another preferred embodiment of the invention The step (a) may further comprise the step of mixing a metal powder, a non-metal powder and an adhesive to form the stream. It will be understood by those skilled in the art that the stream referred to in the present invention refers to a raw material that can be automatically flowed under the action of gravity, so that in different embodiments, the stream can take on different forms. , such as fluid or granular solids.

In addition, the ratio of the raw materials used to obtain the camera module bracket 10 may be different according to different usage requirements, that is, the camera module brackets 10 of different specifications may require metal powders of different proportions, Metal powder and adhesive.

Step 1020: (b) pouring the material into the mold of the camera module bracket. Compared with the point feed port used in the prior art injection molding plastic material, when the material flow based on the metal material is injected, the feed port of the material of the mold module bracket is a large nozzle feed port. After the stream is poured into the mold of the camera module holder, the stream may be solidified by sintering, so that in step 1030: (c) solidifying the mold of the camera module holder The stream is used to produce the camera module holder 10. It is worth mentioning that in the step (c), the flow in the camera module bracket can be solidified by other means.

Further, the manufacturing method further includes a step 1040 of: (d) performing an insulation process on an outer surface of the camera module holder 10, such that the camera with the camera module holder 10 is attached. When the module is disposed in the portable electronic device, the internal component of the camera module and other components of the portable electronic device can be prevented from being short-circuited.

Further, the manufacturing method further includes a step 1050 of: (e) performing a matting process on the outer surface of the camera module holder 10 to prevent the outer surface of the camera module holder 10 from being reflected. It can be understood by those skilled in the art that the step (d) and the step (e) can also be performed synchronously, that is, coating a reflective insulating material on the outer surface of the camera module holder 10. Therefore, the reflective insulating material forms a reflective insulating layer on the outer surface of the camera module holder 10.

In accordance with another aspect of the present invention, as shown in FIG. 11, the present invention also provides a method 1100 of fabricating the camera module mount, wherein the method of manufacture 1100 includes the following steps.

Step 1110: (i) forming a flow based on the metal powder; step 1120: (ii) establishing a digital model associated with the camera module holder 10; and step 1130: (iii) using the digital model based The flow stream is printed to produce the camera module holder 10. Preferably, the camera module holder 10 is manufactured using the 3D printing process in the step (iii) to enable the camera module holder 10 to be quickly formed.

It can be understood by those skilled in the art that, in the manufacturing method 1100, in the process of manufacturing the camera module holder 10, remote operation can be performed to improve the manufacturing efficiency of the camera module.

Those skilled in the art will appreciate that the embodiments of the invention, which are illustrated in the drawings and described above, are merely illustrative and not limiting.

It can thus be seen that the object of the invention can be fully and efficiently accomplished. This embodiment for explaining the functional and structural principles of the present invention has been fully illustrated and described, and the present invention is not based on these implementations. The limitations of the change based on the principle of the example. Accordingly, the present invention includes all modifications that come within the scope and spirit of the appended claims.

Claims (30)

A camera module, comprising: at least one optical lens; a circuit board; at least one photosensitive wafer, each of the photosensitive wafers being electrically connected to the circuit board, wherein each of the optical lenses is disposed in each of the optical lenses a photosensitive path of the photosensitive wafer; and a camera module holder, wherein the camera module holder is made of metal powder, and the circuit board is mounted on the camera module bracket, wherein the camera module bracket is used The heat generated by each of the photosensitive wafers during photoelectric conversion is conducted and radiated to an external environment of the camera module holder, so that the camera module does not need to be configured with an additional heat sink on the circuit board to reduce The thickness of the camera module in the axial direction; wherein the metal powder material is composed of iron, tungsten, molybdenum, copper, cobalt, nickel, titanium, bismuth, aluminum, tin, lead, bismuth, zirconium, hafnium, tantalum, uranium The group of materials that make up. The camera module of claim 1, wherein the camera module holder is disposed in a radial direction of each of the photosensitive wafers. A camera module, comprising: at least one optical lens; a circuit board; at least one photosensitive wafer, each of the photosensitive wafers being electrically connected to the circuit board, wherein each of the optical lenses is disposed in each of the optical lenses a photosensitive path of the photosensitive wafer; and a camera module holder, wherein the camera module holder is made of a mixture of a metal powder and a non-metal powder, and the circuit board is mounted on the camera module bracket, wherein the The camera module bracket is configured to conduct and radiate heat generated by each of the photosensitive wafers during photoelectric conversion to an external environment of the camera module bracket, so that the camera module does not need to be configured with an additional circuit board. Heat sink to reduce The thickness of the camera module in the axial direction; wherein the metal powder material is composed of iron, tungsten, molybdenum, copper, cobalt, nickel, titanium, bismuth, aluminum, tin, lead, bismuth, zirconium, hafnium, tantalum, uranium The set of materials, correspondingly, the non-metallic powder is composed of a material composed of graphite, carbon black, plastic, and ceramic. The camera module of claim 3, wherein the camera module holder is disposed in a radial direction of each of the photosensitive wafers. The camera module bracket is applicable to a camera module, wherein the camera module bracket is made of metal powder, and the camera module bracket has at least one first mounting portion to be suitable for the mounting device. At least one optical lens and/or at least one motor and a second mounting portion of the camera module are adapted to mount at least one circuit board of the camera module; wherein the metal powder material is made of iron, tungsten, A group of materials consisting of molybdenum, copper, cobalt, nickel, titanium, niobium, aluminum, tin, lead, antimony, zirconium, hafnium, tantalum, and uranium. The camera module bracket of claim 5, wherein each of the first mounting portion and the second mounting portion are respectively located at two sides of the camera module bracket, wherein the first sticker The mounting portion faces the optical lens or the motor to mount the optical lens or the motor, wherein the second mounting portion faces the circuit board for mounting the circuit board. The camera module bracket of claim 5, wherein each of the first mounting portions is disposed along a depth direction of the camera module bracket, and the second mounting portion is disposed in the camera. One side of the module holder; wherein the first mounting portion faces the optical lens or the motor for mounting the optical lens or the motor in an embedded manner, wherein the second mounting The portion faces the circuit board for mounting the circuit board. The camera module bracket of claim 5, further comprising at least one air outlet for communicating with an internal environment and an external environment of the camera module bracket; wherein an inner surface of the camera module bracket is inside The area is the internal environment, and an area other than an outer surface of the camera module holder is the outer area. The camera module bracket of claim 8, wherein each of the air outlets is curvedly extended on a side of the second mounting portion of the camera module bracket. The camera module bracket of claim 8 is further provided with at least one overflow tank, and each of the overflow tanks and each of the air outlets are spaced apart from each other on the same side of the camera module bracket. . The camera module bracket of claim 5, wherein the camera module bracket is integrally formed by an injection molding process. The camera module bracket of claim 5, wherein the camera module bracket is integrally formed by a 3D printing process. The camera module bracket of claim 5, wherein the camera module bracket is a single camera module bracket or a multi-camera module bracket. The camera module bracket of claim 5, wherein the outer surface of the camera module bracket is provided with a light emitting insulation layer. The camera module bracket is applicable to a camera module, wherein the camera module bracket is made of a mixture of metal powder and non-metal powder, and the camera module bracket has at least one first mounting portion. At least one optical lens and/or at least one motor and a second mounting portion adapted to mount the camera module to at least one circuit board suitable for mounting the camera module; wherein the metal powder material a group of materials consisting of iron, tungsten, molybdenum, copper, cobalt, nickel, titanium, niobium, aluminum, tin, lead, antimony, zirconium, hafnium, tantalum, and uranium, the non-metallic powder consisting of graphite, carbon black, plastic, A group of materials composed of ceramics. The camera module bracket of claim 15, wherein the camera module bracket is integrally formed by an injection molding process, or the camera module bracket is integrally formed by a 3D printing process. A camera module holder for a camera module, wherein the camera module includes at least one photosensitive wafer, wherein the camera module holder has an internal environment and an external environment, and each of the photosensitive wafers is accommodated The internal environment of the camera module holder, wherein heat generated by each of the photosensitive wafers during photoelectric conversion causes a gas of the internal environment of the camera module holder to form a hot gas, and the camera module The group bracket is configured to exchange heat between the hot gas of the internal environment of the camera module bracket and the cold gas of the external environment of the camera module bracket, thereby reducing the interior of the camera module bracket The temperature of the environment; wherein the area inside the inner surface of the camera module bracket is the internal environment, and the area outside the outer surface of the camera module bracket is the outer area, wherein the camera module bracket is made of metal A mixture of powder and non-metal powder is prepared. The camera module holder of claim 17, wherein the camera module holder surrounds a radial direction of each of the photosensitive wafers, so that each of the images is in a radial direction of each of the photosensitive wafers. The hot gas of the internal environment of the module holder exchanges heat with the cold gas of the external environment of the camera module holder. The camera module bracket of claim 18, wherein the metal powder material is made of iron, tungsten, molybdenum, copper, cobalt, nickel, titanium, lanthanum, aluminum, tin, lead, lanthanum, zirconium, hafnium, A material group composed of cerium and uranium, the non-metal powder being composed of a material composed of graphite, carbon black, plastic, and ceramic. A heat dissipation method for a camera module, characterized in that the heat dissipation method comprises the following steps: (A) uniformly radiating at least one photosensitive wafer along a radial direction and an axial direction of the camera module during photoelectric conversion And (B) arranging a camera module bracket in a radial direction of the camera module, wherein the camera module bracket surrounds the photosensitive wafer, and the heat is exchanged by the camera module bracket Camera module The hot gas of the internal environment and the cold gas of the external environment of the camera module, thereby reducing the temperature of the internal environment of the camera module, wherein the camera module bracket is made of metal powder. The heat dissipation method according to claim 20, wherein in the step (A), each of the photosensitive wafers is mounted on a circuit board, and in the step (B), the circuit board is mounted on the circuit board. The camera module holder is further conducted to the camera module holder during the photoelectric conversion of each of the photosensitive wafers. A method of manufacturing a camera module holder, characterized in that the manufacturing method comprises the steps of: (a) forming a stream based on metal powder; wherein the metal powder is made of iron, tungsten, molybdenum, copper, cobalt, nickel a material group consisting of titanium, tantalum, aluminum, tin, lead, antimony, zirconium, hafnium, tantalum, and uranium; (b) pouring the material into the mold of the camera module holder; and (c) solidifying The stream in the mold of the camera module holder is used to manufacture the camera module bracket. The manufacturing method according to claim 22, wherein the step (a) includes the step of mixing the metal powder with an adhesive to form the stream. The manufacturing method according to claim 22, wherein the step (a) includes the steps of: mixing a metal powder, a non-metal powder and an adhesive to form the stream; wherein the non-metal powder is made of graphite, A group of materials consisting of carbon black, plastic, and ceramics. The manufacturing method according to any one of claims 22 to 24, further comprising the step of performing an insulation treatment on an outer surface of the camera module holder. The manufacturing method of claim 25, further comprising the step of performing a matting process on an outer surface of the camera module holder. The manufacturing method according to any one of claims 22 to 24, further comprising the step of: coating a reflective insulating material on an outer surface of the camera module holder. A method of manufacturing a camera module holder, characterized in that the manufacturing method comprises the steps of: (i) forming a stream based on metal powder; wherein the metal powder is composed of iron, tungsten, molybdenum, copper, cobalt, nickel, a set of materials consisting of titanium, tantalum, aluminum, tin, lead, antimony, zirconium, hafnium, tantalum, uranium; (ii) establishing a digital model associated with the camera module support; and (iii) based on the digital model The stream is printed using the stream to produce the camera module holder. The manufacturing method of claim 28, wherein in the step (ii), the method further comprises the step of: scanning a sample of the camera module holder to establish the digital model with the camera module holder. The manufacturing method of claim 28, wherein in the step (ii), the method further comprises the step of: establishing, by the modeling software, the digital model associated with the camera module holder in a computer.