201229605 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種攝像模組，尤其涉及一種具有基板組件 之攝像模組。 【先前技術】 [0002] —般之攝像模組包括基板組件及鏡頭組件。基板組件包 括電路板及感光晶片。感光晶片與鏡頭組件依次安裝於 電路板上。然，該種攝像模組一般厚度較高，導致體積 偏大，難以適應當前電子裝置輕薄化之需求。 【發明内容】 [0003] 鑒於上述内容，有必要提供一種體積較小之攝像模組。 [0004] 一種攝像模組，其包括鏡頭組件及基板組件。鏡頭組件 鏡片及用於安裝鏡片之鏡座。板組件包括電路板及設置 於電路板上用於接收來自鏡片光線之感光晶片。鏡座開 設有至少部分容納該電路板及感光晶片之容納腔。 [0005] 所述攝像模組開設有容納腔，使電路板及感光晶片至少 部分地容納於其中，減少了攝像模組之厚度，有利於攝 像模組之小型化。 【實施方式】 [0006] 下面結合附圖及實施方式對本發明之攝像模組作進一步 之詳細說明。 [0007] 請參見圖1，本發明之攝像模組200包括鏡頭組件21與基 板組件23。 [0008] 鏡頭組件21包括鏡片211、容納鏡片211之鏡筒213、鏡 100100118 表單編號A0101 第4頁/共12頁 1002000204-0 201229605 座2 15及濾光片217。鏡筒21 3上開設有透光孔2131，鏡 片211可經透光孔21 31接收外部光線。鏡筒213外部形成 有外螺紋（未標示）’鏡座215内壁形成有内螺紋（未標示） ’使鏡筒213藉由螺紋配合安裝於鏡座215内。鏡座215 一端於兩側邊緣位置處分別形成有相對之第一擋牆2151 與第二擋牆2153，其中，第一擋牆2151略長於第二擋牆 2153。第一擋牆2151與第二擋牆2153之間形成有容納腔 2155 ’濾光片217安裝於容納腔2155内，並與鏡片211對 準’以濾去來自於透光孔2131之紅外光，提高成像品質 〇 。 [0009]請同時參見圖2，基板組件23包括電路板231、感光晶片 233、電子組件235、加強片237及導線239。本實施方式 中，電路板231為柔性電路板。電路板231包括第一表面 2311及與第一表面2311相對之第二表面2313，其中，第 一表面2311為正面’即可供導線239連接之焊接面，第二 表面2313為背面。電路板231於第一表面2311上設置有 ^ 連接點（圖未標）’電路板231中部開設有通孔2315。感 光晶片233具有感光區2331。感光晶片233安裝於電路板 231之第二表面2313上，並藉由導線239連接至電路板 231上之金手指（圖未標）上實現電連接，且感光區2331 正對電路板231之通孔2315。電子組件235安裝於電路板 231之第一表面2311上。加強片237安裝於感光晶片233 遠離電路板231之表面上，並部分突出於感光晶片233之 外，以安裝於鏡座215第一擋牆2151之末端，並保護感光 晶片233。第二擋牆2153與感光晶片233之間形成有通道 100100118 表單編號A0101 第5頁/共12頁 1002000204-0 201229605 2157 ’電路板231從通道2157穿出至鏡座215外部，連接 至蝻示幕（圖未示）上。本實施方式中，電路板231位於鏡 片211與感光晶片233之間，且電路板231之寬度略小於 感光晶片233之寬度，當電路板231設置於感光晶片233 上時’感光晶片233部分暴露於電路板231外。電路板 231鄰近邊緣之位置與感光晶片233暴露於電路板231外 之部分成對設置有連接點，可利用引線機或焊接機（圖未 示）採用内引腳連接技術（ILB，即inner iead bonding) 將導線239 二端分別先後打入感 光晶片 233之焊墊 2333及電路板231之金手指上’以將感光晶片233及電路 板231連接。讓種結構有利於減少電路板231之寬度，進 而減少攝像模組2〇〇之體積。 [0010] [0011] 使用時’外部光線從鏡筒213之透光孔2131依次經過鏡片 211、濾光片217、電路板231之通孔2315到達感光晶片 233之感光區2331，感光晶片233將該光線之光資訊轉化 為電資訊並藉由導線239送至電路板231，由電路板231 將電資訊輸送到外部，並於顯示;幕上顯示成像。 本發明之攝像模組200之鏡座215上開設有容納腔2155， 電路板231、感光晶片233均部分容納於容納腔2155内， 減少了攝像模組2〇〇之高度，進而減少攝像模組2〇〇之體 積，有利於攝像模組2〇〇之輕薄化設計。 [0012]综上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 100100118 1002000204-0 表單編號A0101 第6頁/共12頁 201229605 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0013] 圖1係本發明實施方式之攝像模組之剖視圖。 [0014] 圖2係圖1所示攝像模組之基板組件之俯視圖。201229605 VI. Description of the Invention: [Technical Field] The present invention relates to a camera module, and more particularly to a camera module having a substrate assembly. [Prior Art] [0002] A general camera module includes a substrate assembly and a lens assembly. The substrate assembly includes a circuit board and a photosensitive wafer. The photosensitive wafer and lens assembly are sequentially mounted on the circuit board. However, such a camera module generally has a relatively high thickness, resulting in a large volume, which is difficult to adapt to the current demand for thin and light electronic devices. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide a smaller camera module. [0004] A camera module includes a lens assembly and a substrate assembly. Lens assembly Lens and mirror mount for mounting the lens. The board assembly includes a circuit board and a photosensitive wafer disposed on the circuit board for receiving light from the lens. The lens holder is provided with a receiving cavity at least partially accommodating the circuit board and the photosensitive wafer. [0005] The camera module is provided with a receiving cavity, so that the circuit board and the photosensitive chip are at least partially accommodated therein, which reduces the thickness of the camera module and facilitates miniaturization of the camera module. [Embodiment] The camera module of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Referring to FIG. 1, a camera module 200 of the present invention includes a lens assembly 21 and a substrate assembly 23. [0008] The lens assembly 21 includes a lens 211, a lens barrel 213 accommodating the lens 211, a mirror 100100118, a form number A0101, a fourth page, a total of 12 pages, a 1002000204-0201229605, a seat 2 15 and a filter 217. The lens barrel 21 3 is provided with a light transmission hole 2131, and the lens sheet 211 can receive external light through the light transmission hole 21 31. The outer portion of the lens barrel 213 is externally threaded (not shown). The inner wall of the lens holder 215 is internally threaded (not shown). The lens barrel 213 is mounted in the lens holder 215 by a threaded fit. One end of the mirror base 215 is formed with an opposite first retaining wall 2151 and a second retaining wall 2153 at two side edge positions, wherein the first retaining wall 2151 is slightly longer than the second retaining wall 2153. A receiving cavity 2155 is formed between the first retaining wall 2151 and the second retaining wall 2153. The filter 217 is mounted in the receiving cavity 2155 and aligned with the lens 211 to filter out infrared light from the light transmitting hole 2131. Improve image quality. Referring to FIG. 2 at the same time, the substrate assembly 23 includes a circuit board 231, a photosensitive wafer 233, an electronic component 235, a reinforcing sheet 237, and a wire 239. In the present embodiment, the circuit board 231 is a flexible circuit board. The circuit board 231 includes a first surface 2311 and a second surface 2313 opposite the first surface 2311, wherein the first surface 2311 is a front surface, i.e., a soldering surface to which the wires 239 are connected, and the second surface 2313 is a back surface. The circuit board 231 is provided with a connection point (not shown) on the first surface 2311. The through hole 2315 is formed in the middle of the circuit board 231. The photosensitive wafer 233 has a photosensitive region 2331. The photosensitive wafer 233 is mounted on the second surface 2313 of the circuit board 231, and is electrically connected to the gold finger (not shown) connected to the circuit board 231 by the wire 239, and the photosensitive area 2331 is connected to the circuit board 231. Hole 2315. The electronic component 235 is mounted on the first surface 2311 of the circuit board 231. The reinforcing sheet 237 is mounted on the surface of the photosensitive wafer 233 away from the circuit board 231 and partially protrudes from the photosensitive wafer 233 to be mounted at the end of the first retaining wall 2151 of the lens holder 215, and protects the photosensitive wafer 233. A passage 100100118 is formed between the second retaining wall 2153 and the photosensitive wafer 233. Form No. A0101 Page 5 of 12 1002000204-0 201229605 2157 'The circuit board 231 passes out from the passage 2157 to the outside of the mirror mount 215, and is connected to the screen (not shown). In this embodiment, the circuit board 231 is located between the lens 211 and the photosensitive wafer 233, and the width of the circuit board 231 is slightly smaller than the width of the photosensitive wafer 233. When the circuit board 231 is disposed on the photosensitive wafer 233, the photosensitive wafer 233 is partially exposed. Outside the circuit board 231. The position of the adjacent edge of the circuit board 231 is opposite to the portion of the photosensitive wafer 233 exposed to the outside of the circuit board 231, and a connection point can be provided by using a lead machine or a soldering machine (not shown) (ILB, ie inner iead) Bonding The two ends of the wire 239 are respectively driven into the pad 2333 of the photosensitive wafer 233 and the gold finger of the circuit board 231 to connect the photosensitive wafer 233 and the circuit board 231. The seed structure is advantageous for reducing the width of the circuit board 231, thereby reducing the volume of the camera module 2 . [0011] [0011] When used, external light passes through the transparent hole 2131 of the lens barrel 213 through the lens 211, the filter 217, and the through hole 2315 of the circuit board 231 to reach the photosensitive region 2331 of the photosensitive wafer 233, and the photosensitive wafer 233 will The light information of the light is converted into electrical information and sent to the circuit board 231 via the wire 239, and the electrical information is transmitted to the outside by the circuit board 231 for display; the image is displayed on the screen. The lens holder 215 of the camera module 200 of the present invention is provided with a receiving cavity 2155. The circuit board 231 and the photosensitive wafer 233 are partially accommodated in the receiving cavity 2155, thereby reducing the height of the camera module 2 and reducing the camera module. The volume of 2〇〇 is beneficial to the slim and light design of the camera module. [0012] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by those skilled in the art in light of the spirit of the invention. 100100118 1002000204-0 Form No. A0101 Page 6 of 12 201229605, all of which are covered by the following patents. BRIEF DESCRIPTION OF THE DRAWINGS [0013] FIG. 1 is a cross-sectional view of a camera module according to an embodiment of the present invention. 2 is a top plan view of a substrate assembly of the camera module shown in FIG. 1.
【主要元件符號說明】 [0015] 攝像模組200 [0016] 鏡頭組件21 [0017] 鏡片211 [0018] 鏡筒213 [0019] 透光孔2131 [0020] 鏡座215 [0021] 第一擋牆2151 [0022] 第二擋牆2153 [0023] 容納腔215 5 [0024] 通道157 [0025] 滤光片217 [0026] 基板組件23 [0027] 電路板231 [0028] 第一表面2311 [0029] 第二表面2313 表單編號Α0101 100100118 第7頁/共12頁 1002000204-0 201229605 [0030] 通孔 2315 [0031] 感光晶片233 [0032] 感光區 2 3 3 1 [0033] 焊墊 2333 [0034] 電子組件2 3 5 [0035] 加強片237 [0036] 導線 2 3 9 1002000204-0 100100118 表單編號A0101 第8頁/共12頁[Main Component Symbol Description] [0015] Camera Module 200 [0016] Lens Assembly 21 [0017] Lens 211 [0018] Lens Tube 213 [0019] Light Transmission Hole 2131 [0020] Mirror Seat 215 [0021] First Retaining Wall 2151 [0022] Second Retaining Wall 2153 [0023] Accommodating Cavity 215 5 [0024] Channel 157 [0025] Substrate 217 [0026] Substrate Assembly 23 [0027] Circuit Board 231 [0028] First Surface 2311 [0029] Second surface 2313 Form number Α 0101 100100118 Page 7 / Total 12 pages 1002000204-0 201229605 [0030] Through hole 2315 [0031] Photosensitive wafer 233 [0032] Photosensitive area 2 3 3 1 [0033] Solder pad 2333 [0034] Electronics Assembly 2 3 5 [0035] Reinforcement Sheet 237 [0036] Conductor 2 3 9 1002000204-0 100100118 Form Number A0101 Page 8 of 12