WO2021203640A1

WO2021203640A1 - Image sensing module, camera module, terminal device and mold

Info

Publication number: WO2021203640A1
Application number: PCT/CN2020/118105
Authority: WO
Inventors: 罗振东; 冉坤; 缪伟亮
Original assignee: 华为技术有限公司
Priority date: 2020-04-08
Filing date: 2020-09-27
Publication date: 2021-10-14
Also published as: CN212163453U

Abstract

The present application relates to the field of heat dissipation of electronic devices, and disclosed are an image sensing module (1000), a camera module (2000), terminal device, and a mold. The image sensing module comprises a printed circuit board (PCB) (1), an image sensor (2), a packaging layer (3) and heat conduction liquid (5). The PCB (1) is provided with a circuit that matches the image sensor (2), and the circuit is internally provided with necessary electronic components, such as resistors and capacitors. The image sensor (2) is arranged on the PCB (1) and is used for receiving image information. The heat conduction liquid (5) may absorb heat of the packaging layer at a part where heating is serious and transmit same to the packaging layer at the part where there is relatively little heating, so that the surfaces of all parts of the packaging layer may release the heat to the air, and the heat dissipation effect is further improved.

Description

Image sensor module, camera module, terminal equipment and mold

This application claims the priority of a Chinese patent application filed with the State Intellectual Property Office, the application number is 202020504217.7, and the application name is "image sensor module, camera module, terminal equipment and mold" on April 8, 2020, and its entire content Incorporated in this application by reference.

Technical field

This application relates to the field of heat dissipation of electronic devices, and in particular to an image sensor module, a camera module, a terminal device and a mold.

Background technique

The rapid development of camera technology for mobile phones and other terminal devices has made the improvement of camera performance a major development direction for terminal devices. As the pixels of terminal devices continue to increase, in order to match the needs of terminal devices for high frame rate photography and other application scenarios, the image sensor module is a part of the camera module, and its power consumption is significantly increased. As a result, the heat of the image sensor module is more serious, and the heat dissipation performance of the related image sensor module is average, and the heat cannot be discharged to the outside in time. After the temperature of the image sensor module increases, the thermal noise of the components is aggravated, and the camera module produces lens rear focus variation, which ultimately affects the sharpness of photographs.

Summary of the invention

An object of the present application is to provide an image sensor module, which aims to solve the problem of poor heat dissipation effect of the image sensor module.

To achieve this goal, the following technical solutions are adopted in the embodiments of this application:

Image sensor module, including:

Printed circuit board;

The image sensor is arranged on the printed circuit board;

An encapsulation layer is provided on the printed circuit board and covers the edge of the image sensor, and the encapsulation layer has a heat conduction channel; and

The heat-conducting liquid is arranged in the heat-conducting channel.

The encapsulation layer covers most of the electronic components on the printed circuit board and the edges of the image sensor, and most of the heat generated by the electronic components and the image sensor is radiated outward through the encapsulation layer. Due to the arrangement of the heat-conducting liquid in the heat-conducting channel, the heat-conducting liquid can form convection in the heat-conducting channel, so the heat-conducting liquid can transfer the heat of the severely heated part to the relatively low heat-generating part, as opposed to the inside-out through the encapsulation layer. The temperature gradient realizes the outward heat transfer, which can make full use of the surface area of the encapsulation layer to dissipate heat outward, thereby enhancing the heat dissipation effect.

At the same time, since the heat from the places with more serious heat generation (electronic components and image sensors) can be quickly transferred to other parts, the temperature of the parts with image sensors and electronic components can be prevented from being too high. Therefore, the packaging material and the printed circuit board of the packaging layer that are in contact with the electronic components and the image sensor that are severely heated are not easily deformed, and the image sensor itself is not easily deformed. When the image sensor module and the lens and other components form a camera module, the distance between the lens and the image sensor in the camera module is not prone to change, and the camera module is not prone to the problem of lens back focus variation.

Since the overall heat dissipation performance is better and local temperature is not easy to occur, it is not easy to reach the Tg point (glass transition temperature) of the glue used in the package in the image sensor module, and it is not easy to damage the overall structure of the image sensor module. The structure of the camera module is not easy to change, so that the camera module can work with high precision.

The heat-conducting liquid can be water, salt water, various oils and other objects.

In one embodiment, the heat conduction channel is bent to increase the length of the heat conduction channel, increase the capacity of the heat conduction liquid, and increase the contact area between the heat conduction liquid and the encapsulation layer. Furthermore, it is realized that the heat-conducting liquid can quickly transfer the heat from the place where the heat is severely generated to the area where the heat is lower, so as to make full use of the heat dissipation area of the surface of the encapsulation layer at the place where the heat is lower. Improve the overall heat dissipation performance of the image sensor module, and effectively avoid the problem of excessive local temperature of the image sensor module.

In one embodiment, the heat conduction channel is arranged around the image sensor. Therefore, the heat conduction liquid in the heat conduction channel can conduct thermal convection around the image sensor, that is, the temperature around the image sensor is relatively average, and it is not prone to local overheating, and it is not easy to cause the packaging layer, the printed circuit board and the image. The sensor is deformed.

In one embodiment, the image sensor module further includes an electronic component provided on the printed circuit board, and the heat conduction channel is located on the top of the electronic component or is arranged opposite to the side surface of the electronic component.

For example, the heat-conducting channel can be located on the top of the electronic component, and the heat-conducting liquid can quickly absorb the heat transferred from the top of the electronic component.

For example, the heat conduction channel may also have no overlap relationship with the electronic element, but the heat conduction channel is arranged opposite to the side surface of the electronic element and the image sensor, which can quickly absorb the heat transferred from the side surface of the electronic element. Moreover, since the heat-conducting channel and the electronic component do not overlap, the cross-sectional area of the heat-conducting channel can be large enough to increase the capacity of the heat-conducting liquid in the heat-conducting channel and increase the contact area between the heat-conducting liquid and the encapsulation layer.

Optionally, the number of heat-conducting channels can also be set to multiple, part of the heat-conducting channel is located on the top of the electronic component, and part of the heat-conducting channel avoids the electronic component and is opposite to the side surface of the electronic component.

Optionally, the structures of the various parts of the heat conduction channel can also be set to be different. The heat conduction channel is partially located on the top of some electronic components, and another part of the heat conduction channel avoids other electronic components and faces the side surfaces of other electronic components.

Optionally, when the heat conduction channel is bent, the heat conduction channel may be opposite to multiple side surfaces of a certain electronic component, so that the multiple side surfaces of the electronic component can quickly transfer heat to the heat conduction liquid in the heat channel.

Optionally, when the heat-conducting channel avoids the electronic component, the part of the heat-conducting channel may be in a "mouth shape", and the part of the mouth shape may be arranged around the electronic component.

Another object of the present application is to provide a camera module, which includes a lens and the image sensor module according to any one of the above embodiments; the lens and the image sensor are opposed and arranged at intervals. In the camera module with the image sensor module in the above-mentioned embodiment, since the heat from the places with more serious heat generation (electronic components and image sensors) can be quickly transferred to other parts, the temperature of the parts with the image sensor and electronic components can be avoided from being too high. Therefore, the packaging material and the printed circuit board of the packaging layer that are in contact with the electronic components and the image sensor that are severely heated are not easily deformed, and the image sensor itself is not easily deformed. Therefore, the distance between the lens and the image sensor in the camera module is not prone to change, and the camera module is not prone to the problem of lens rear focus variation. Because it is not prone to local overheating, it is not easy to reach the Tg point (glass transition temperature) of the glue used in the package in the camera module, and it is not easy to damage the overall structure of the image sensor module, and the structure of the camera module is not easy to change , So that the camera module can work with high precision.

In one embodiment, a voice coil motor is provided between the lens and the encapsulation layer, and the lens is installed at the output end of the voice coil motor. The voice coil motor can change the distance between the lens and the image sensor to realize the optical zoom of the camera module. It can be understood that the voice coil motor changes the distance between the lens and the image sensor to achieve optical zoom, which is an active control, and the distance is controllable. The change of the distance between the lens and the image sensor caused by the deformation of the internal structure of the camera module and other reasons is uncontrollable, which will affect the user's inability to accurately control the distance between the lens and the image sensor, which will affect the high precision of the camera module. work.

In one embodiment, the camera module further includes a bracket mounted on the packaging layer, the voice coil motor is mounted on the bracket, and the bracket is provided with a relief hole corresponding to the lens. The bracket is fixedly installed on the packaging layer, and the components of the camera module can be installed on the image sensor module through the bracket.

In one embodiment, the bracket is provided with blue glass at the relief hole to filter stray light and improve the image capture effect of the camera module.

In one embodiment, the encapsulation layer is provided with a heat-conducting groove, the bracket closes the heat-conducting groove, and a sealant is provided between the bracket and the notch of the heat-conducting groove. When processing and forming, firstly set up a heat conduction groove on the packaging layer, pour the heat conduction liquid into the heat conduction groove, and then use the bracket to close the heat conduction groove, and at the same time use the glue between the bracket and the packaging layer, and use the sealant and the bracket to The heat conduction groove is sealed.

For example, in other embodiments, the heat conduction channel in the encapsulation layer can also be made in other ways. For example, the heat conduction channel with an opening is formed first, and the opening is sealed after being filled with a heat conduction liquid.

Another object of the present application is to provide a terminal device including the camera module described in any of the above embodiments. In the terminal device with the above-mentioned camera module, the camera module is not prone to the problem of lens back focus variation when taking pictures or shooting. And it is not easy to cause local temperature to be too high, it is not easy to reach the Tg point (glass transition temperature) of the glue used in the camera module, and it is not easy to damage the overall structure of the image sensor module, and the structure of the camera module is not easy to change , So that the camera module can work with high precision, and ultimately ensure that the photos or recorded videos taken by the terminal equipment are sufficient to meet the preset requirements.

Another object of the present application is to provide a mold for manufacturing the image sensor module according to any one of the above embodiments, the mold has a convex structure corresponding to the heat conduction channel.

The beneficial effect of the image sensor module proposed in the embodiments of the application: the heat-conducting liquid can absorb the heat of the packaging layer in the part with severe heat generation and transfer it to the packaging layer in the part with relatively low heat generation. Therefore, all surfaces of the packaging layer can be directed to The heat is released in the air, thereby enhancing the heat dissipation effect.

With the camera module using the image sensor module described above, the heat from the place where the heat is more serious can be quickly transferred to other parts, and the temperature of the part with the image sensor and electronic components can be reduced. Therefore, the camera module is not prone to local deformation, so the distance between the lens and the image sensor in the camera module is not prone to change, and the camera module is not prone to the problem of lens back focus variation.

In the terminal equipment using the above-mentioned camera module, the camera module is not prone to the problem of lens rear focus variation when taking photos or videos, and the captured photos or recorded videos can meet the preset requirements.

Description of the drawings

Figure 1 is a top view of an image sensor module in one of the embodiments of the application;

2 is a top view of an image sensor module in another embodiment of the application;

FIG. 3 is a top view of an image sensor module in another embodiment of the application;

4 is a cross-sectional view of the image sensor module in the embodiment of the application;

FIG. 5 is a top view of an image sensor module in still another embodiment of the application;

Figure 6 is a cross-sectional view of the camera module in one of the embodiments of the application;

FIG. 7 is a cross-sectional view of a camera module in another embodiment of the application;

FIG. 8 is a schematic structural diagram of a terminal device in an embodiment of the application.

In the picture:

1000, image sensor module; 2000, camera module;

1. Printed circuit board; 2. Image sensor; 3. Encapsulation layer; 301. Heat conduction groove; 4. Heat conduction channel; 5. Heat conduction liquid; 6. Electronic components; 7. Lens; 8. Voice coil motor; 9. Support 901. Give way hole; 10. Blue glass.

Detailed ways

In order to make the purpose, technical solutions, and advantages of this application clearer and clearer, the following further describes the application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not used to limit the present application.

It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "Bottom", "Inner", "Outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the application and simplifying the description, and do not indicate or imply the device referred to. Or the element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present application.

In the description of the present application, "multiple" means two or more than two, unless otherwise specifically defined.

The camera module of the terminal equipment includes components such as an image sensor module and a lens; the image sensor of the image sensor module is used to receive the image information collected by the lens, and the printed circuit board of the image sensor module also has a function for communicating with the image sensor. Matching circuit, there are various necessary electronic components in the circuit. In order to enable the camera module to work with high accuracy under a certain parameter, the distance between the image sensor of the image sensor module and the lens needs to be specified, that is, to meet the setting of the parameter for the above-mentioned distance.

However, the inventor found that the photographing effect often deteriorates over time during the use of the camera module. After a lot of experiments and analysis, it is found that this is caused by the back focus variation of the image sensor module. The back focus variation is the difference between the image sensor and the image sensor. The distance between the end of the lens facing the image sensor changes, causing the imaging effect to deviate from the expected effect. The main reason for the variation of the rear focus of the lens is that the temperature of the image sensor module is too high, which in turn causes the deformation of the image sensor module. For example, when a certain type of image sensor on the image sensor module outputs at a frame rate of 12M, the temperature after 3 minutes exceeds 100°C, and the temperature can be as high as 110°C locally.

The related heat dissipation method of the image sensor module is to realize the heat transfer to the outside through the temperature gradient formed from the inside to the outside of the packaging material, and then to realize the outside heat dissipation. However, the heat dissipation effect of this heat dissipation method is limited, and the heat generated by the image sensor or other components cannot be quickly dissipated outward, causing the temperature at each component to increase sharply. The temperature of each component increases sharply, which causes the thermal noise of the components to increase; and the packaging material and the corresponding printed circuit board are easily deformed, which leads to the distance between the lens in the camera module and the image sensor. The change (although the change is small and difficult to recognize with the naked eye, the change has seriously affected the high-precision requirements of the camera module), and the problem of lens rear focus variation occurs. At the same time, the local temperature is too high, it is easy to exceed the Tg point (glass transition temperature) of the glue used in the package, and then destroy the overall structure of the image sensor module, and then destroy the structure of the camera module (for example, cause the rear focus of the lens to change), so that The camera module cannot work with high precision.

The image sensor module proposed in the embodiment of the present application can improve the heat dissipation effect of the image sensor module and effectively avoid excessive local temperature.

The implementation of this application will be described in detail below in conjunction with specific embodiments.

As shown in FIG. 4, an embodiment of the present application proposes an image sensor module 1000, which includes a printed circuit board 1, an image sensor 2, an encapsulation layer 3, and a thermally conductive liquid 5. The printed circuit board 1 has a circuit matched to the image sensor 2, and the circuit has necessary electronic components 6, such as resistors and capacitors. The image sensor 2 is arranged on the printed circuit board 1 and is used to receive image information. The encapsulation layer 3 is used to cover most of the area on the encapsulated printed circuit board 1, such as encapsulating the above-mentioned circuit and related electronic components 6, and at the same time covering the edge of the encapsulated image sensor 2. The encapsulation layer 3 has a heat-conducting channel 4 of a certain length, and the channel is used to contain the heat-conducting liquid 5. The heat-conducting liquid 5 can flow in the heat-conducting channel 4 and exchange heat with the encapsulation layer 3 at different positions of the heat-conducting channel 4.

The encapsulation layer 3 covers most of the electronic components 6 on the printed circuit board 1 and the edges of the image sensor 2, and most of the heat generated by the electronic components 6 and the image sensor 2 is radiated outward through the encapsulation layer 3. Due to the arrangement of the heat-conducting liquid 5 in the heat-conducting channel 4, the heat-conducting liquid 5 can form convection in the heat-conducting channel 4. Therefore, the heat-conducting liquid 5 can absorb the heat of the encapsulation layer 3 in the part with severe heat generation and transfer it to the package in the part with relatively low heat generation. The layer 3 realizes heat transfer to the outside by the temperature gradient formed from the inside to the outside of the encapsulation layer 3, and can make full use of the surface area of the encapsulation layer 3 to dissipate heat to the outside, thereby improving the heat dissipation effect.

At the same time, since the heat of the places with more serious heat generation (such as the electronic component 6 and the image sensor 2) can be quickly transferred to other parts, the temperature of the parts with the image sensor 2 and the electronic component 6 can be avoided from being too high. Therefore, the packaging material of the packaging layer 3 and the printed circuit board 1 that are in contact with the electronic component 6 and the image sensor 2 that are severely heated are not easily deformed, and the image sensor 2 itself is not easily deformed. Referring to FIG. 7, when the image sensor module 1000 and the lens 7 and other components form the camera module 2000, the distance between the lens 7 and the image sensor 2 in the camera module 2000 is not easy to change, and the camera module 2000 is not easy to appear The problem of lens 7 rear focus variation.

Since it is not prone to local overheating, it is not easy to reach the Tg point (glass transition temperature) of the glue used in the package in the image sensor module 1000, and it is not easy to damage the overall structure of the image sensor module 1000. The structure is not easy to change, so that the camera module 2000 can work with high precision.

In the embodiment of the present application, the heat-conducting liquid 5 can be water, salt water, various oils and other objects. For example, salt water with better fluidity and thermal conductivity can be selected. It can be understood that the inner wall of the heat conduction channel 4 may be provided with a waterproof layer, which can prevent liquid from penetrating into the packaging layer 3 when the material of the packaging layer 3 can seep water.

Since the heat-conducting liquid 5 itself has a certain heat storage capacity, the heat-conducting liquid 5 itself can absorb a certain amount of heat, and then quickly absorb the heat of components such as the electronic components 6 and the image sensor 2, so as to further improve the heat dissipation effect of the image sensor module 1000 , And alleviate the problem of excessive local temperature.

In the embodiment of the present application, as shown in FIGS. 1 to 3, the heat conduction channel 4 can be arranged in a bent shape to increase the length of the heat conduction channel 4, increase the capacity of the heat conduction liquid 5, and increase the heat conduction liquid 5 and the package Layer 3 contact area. Furthermore, it is realized that the heat-conducting liquid 5 can quickly absorb the heat of the encapsulation layer 3 where the heat is severely generated and transfer it to the area with lower heat generation, so as to make full use of the heat dissipation area of the surface of the encapsulation layer 3 where the heat generation is lower. The overall heat dissipation performance of the image sensor module 1000 is improved, and the problem of excessive local temperature of the image sensor module 1000 is effectively avoided.

In the embodiment of the present application, as shown in FIGS. 1 to 3, the heat conduction channel 4 can be arranged around the image sensor 2, so the heat conduction liquid 5 in the heat conduction channel 4 can conduct thermal convection around the image sensor 2, that is, The temperature around the image sensor 2 is relatively average, and it is not easy to cause local excessive temperature, and thus it is not easy to cause deformation of the packaging layer 3, the printed circuit board 1 and the image sensor 2. The surrounding method can be that one heat conduction channel 4 is arranged in a ring shape to realize the surrounding, as shown in FIG. 3; it can also be a structure that surrounds the image sensor 2 formed by a plurality of heat conduction channels 4 distributed end to end in sequence, as shown in FIGS. 1 to 2.

In the embodiment of the present application, as shown in FIGS. 3 to 4, the heat conduction channel 4 can be arranged on the top of the electronic component 6, and the heat transferred from the top of the electronic component 6 to the encapsulation layer 3 is transferred to the heat conduction liquid in the heat conduction channel 4. 5 absorbs, the heat transfer liquid 5 flows and transfers the heat to the encapsulation layer 3 at a lower temperature.

In another embodiment, as shown in Figure 1, Figure 2 and Figure 4, the heat conduction channel 4 may also have no overlap relationship with the electronic component 6 (that is, the projection of the heat conduction channel 4 on the printed circuit board 1 will not be The element 6 overlaps), but the heat conduction channel 4 is arranged opposite to the side surface of the electronic element 6 and the image sensor 2, and the heat conduction liquid 5 can absorb the heat transferred from the side surface of the electronic element 6. And because the heat conduction channel 4 and the electronic component 6 do not overlap, the cross-sectional area of the heat conduction channel 4 (the area perpendicular to the cross section of the printed circuit board 1) can be large enough (the bottom of the heat conduction channel 4 can be connected to the printed circuit board The distance between the surface of 1 is set to be small enough), thereby increasing the capacity of the heat conducting liquid 5 in the heat conducting channel 4 and increasing the contact area between the heat conducting liquid 5 and the encapsulation layer 3.

In another embodiment, the number of heat conduction channels 4 can also be set to multiple, part of the heat conduction channel 4 is located on the top of the electronic component 6; part of the heat conduction channel 4 does not overlap with the electronic component 6 and is on the side surface of the electronic component 6 relatively.

In another embodiment, as shown in FIG. 3, the structure of a continuous heat conduction channel 4 can also be set to be different. It does not overlap with other electronic components 6 and is arranged opposite to the side surfaces of other electronic components 6.

In another embodiment, as shown in FIGS. 1 to 2, when the heat conduction channel 4 is bent, the heat conduction channel 4 can be opposed to multiple side surfaces of a certain electronic component 6, so that the electronic component 6 has more Each side surface can quickly transfer heat to the heat conducting liquid 5 in the heat channel 4.

In another embodiment, as shown in FIG. 2, when the heat conduction channel 4 and the electronic component 6 do not overlap, the part of the heat conduction channel 4 may be in the shape of a "lip shape", and the part of the word shape may be arranged around the electronic component 6 .

As shown in FIGS. 6-7, an embodiment of the present application proposes a camera module 2000, which includes a lens 7 and the image sensor module 1000 in any one of the above embodiments; the lens 7 is opposite to the image sensor 2 and is arranged at intervals .

For the camera module 2000 with the image sensor module 1000 in the above-mentioned embodiment, the image sensor module 1000 has better performance in dissipating heat to the outside, and the overall temperature of the image sensor module 1000 is not too high, which alleviates the serious heat generation of the camera module 2000 This problem effectively reduces the occurrence of deformation of the image sensor module 1000 due to excessively high temperature.

In addition, since the heat from the place where the heat is more serious can be quickly transferred to other parts, the temperature of the part with the image sensor 2 and the electronic component 6 can be lowered. Therefore, the packaging material of the packaging layer 3 and the printed circuit board 1 that are in contact with the electronic component 6 and the image sensor 2 that are severely heated are not easily deformed, and the image sensor 2 itself is not easily deformed. Therefore, the distance between the lens 7 and the image sensor 2 in the camera module 2000 is not prone to change, and the camera module 2000 is not prone to the problem of rear focus variation of the lens 7.

Since the overall heat dissipation performance is good and local temperature is not easy to occur, it is not easy to reach the Tg point (glass transition temperature) of the glue used for packaging in the camera module 2000, and it is not easy to damage the overall structure of the camera module 2000 , So that the camera module 2000 can work with high precision.

As shown in FIGS. 6-7, in an embodiment of the camera module 2000, a driving motor (such as a voice coil motor 8) is provided between the lens 7 and the packaging layer 3, and the output end of the voice coil motor 8 can drive the lens 7 Move to actively change the distance between the lens 7 and the image sensor 2 to achieve optical zoom.

It can be understood that the voice coil motor 8 changes the distance between the lens 7 and the image sensor 2 to achieve optical zoom, which is an active control, and the distances are all controllable. The change in the distance between the lens 7 and the image sensor 2 caused by the deformation of the internal structure of the camera module 2000 and other reasons is uncontrollable, which will affect the user’s inability to accurately control the distance between the lens 7 and the image sensor 2 The camera module 2000 works with high precision.

As shown in FIG. 7, in an embodiment of the camera module 2000, the voice coil motor 8 is installed on the packaging layer 3 of the image sensor module 1000 through the bracket 9, so as to realize the stability of the installation of the voice coil motor 8, thereby ensuring the sound The accuracy of the loop motor 8 when adjusting the position of the lens 7. The bracket 9 can be fixed on the packaging layer 3 by dispensing glue, or can be embedded in the packaging layer 3. At the same time, a relief hole 901 is opened at a position where the bracket 9 faces the image sensor 2 so that the light passing through the lens 7 can reach the image sensor 2.

At the same time, a filter (for example, the blue glass 10) can also be installed in the relief hole 901 to filter stray light and improve the image capture effect of the image sensor 2.

On the basis of the above-mentioned embodiment, as shown in FIG. 5, during the manufacturing process, a heat-conducting groove 301 is provided on the packaging layer 3 (the heat-conducting groove 301 is the aforementioned heat-conducting channel 4), and the bracket 9 closes the heat-conducting groove 301, The above-mentioned heat conduction channel 4 is formed. When filling the heat-conducting liquid 5, first place the heat-conducting liquid 5 in the heat-conducting tank 301, then close the heat-conducting tank 301 with the bracket 9 and set a sealant between the bracket 9 and the notch of the heat-conducting tank 301 to realize the alignment of the heat-conducting tank 301 is hermetically closed.

Of course, the heat conduction groove 301 can also be provided on the basis of the heat conduction channel 4, that is, the heat conduction groove 301 is not equivalent to the heat conduction channel 4. However, the heat conduction groove 301 can achieve the same function as the heat conduction channel 4. The heat conduction groove 301 is filled with the heat conduction liquid 5 and is closed by the bracket 9 (that is, the heat conduction channel 4 includes: a closed heat conduction channel 4 formed in the encapsulation layer 3, And by subsequently using the bracket 9 to close the heat conduction channel 4) formed by the heat conduction groove 301.

As shown in FIG. 8, an embodiment of the present application proposes a terminal device, including the camera module 2000 of any one of the foregoing embodiments. For the terminal equipment with the above-mentioned camera module 2000, the camera module 2000 is not prone to local overheating when taking photos or videos, and it is not easy for the camera module 2000 to reach the Tg point (glass transition temperature) of the glue used for packaging. , It is not easy to damage the overall structure of the image sensor module 1000, the structure of the camera module 2000 is not easy to change, and the problem of rear focus variation of the lens 7 is not easy to occur, and the camera module 2000 can work with high precision and can reduce heat Noise, photos taken by the terminal device or videos recorded can meet the preset requirements.

The embodiment of the present application also proposes a mold for manufacturing the image sensor module 1000 in any one of the foregoing embodiments, and the mold has a convex structure corresponding to the heat conduction channel 4.

Obviously, the above-mentioned embodiments of the present application are only used to clearly illustrate the examples of the present application, and are not intended to limit the implementation manners of the present application. For those of ordinary skill in the art, other changes or modifications in different forms can be made on the basis of the above description. It is unnecessary and impossible to list all the implementation methods here. Any modification, equivalent replacement and improvement made within the spirit and principle of this application shall be included in the protection scope of the claims of this application.

Claims

The image sensing module is characterized in that it includes:

Printed circuit board;

The image sensor is arranged on the printed circuit board;

An encapsulation layer is arranged on the printed circuit board and covers the edge of the image sensor, and the encapsulation layer has a heat conduction channel; and

The heat-conducting liquid is arranged in the heat-conducting channel.
The image sensor module of claim 1, wherein the heat conduction channel is bent.
The image sensor module according to claim 1 or 2, wherein the heat conduction channel is arranged around the image sensor.
The image sensor module according to claim 1 or 2, wherein the image sensor module further comprises an electronic component provided on the printed circuit board, and the heat conduction channel is located on the top of the electronic component or It is arranged opposite to the side surface of the electronic component.
The image sensor module according to claim 4, wherein there are multiple heat conduction channels, some of the heat conduction channels are located on the top of the electronic component, and some of the heat conduction channels are opposite to the side of the electronic component. set up.
A camera module, characterized in that it comprises a lens, a bracket, and the image sensor module according to any one of claims 1-5; the lens is opposite to the image sensor and is arranged at intervals; the bracket is installed on the The encapsulation layer, the lens is mounted on the bracket, and the bracket is provided with a relief hole corresponding to the lens.
The camera module according to claim 6, wherein a driving motor is provided between the lens and the bracket, and the lens is installed at the output end of the driving motor.
8. The camera module of claim 7, wherein the driving motor is a voice coil motor.
The camera module according to any one of claims 6-8, wherein the bracket is provided with a filter at the relief hole.
The camera module according to any one of claims 6-8, wherein the encapsulation layer is provided with a heat-conducting groove, the bracket closes the heat-conducting groove, and the bracket and the notch of the heat-conducting groove are different from each other. A sealant is arranged in between, and the gap between the bracket and the inner surface of the heat conduction groove forms the heat conduction channel.
The terminal device is characterized by comprising the camera module according to any one of claims 6-10.
The mold is characterized in that it is used to manufacture the image sensor module according to any one of claims 1 to 5, and the mold has a convex structure corresponding to the heat conduction channel.