CN103021971A - Electronic device and heat dissipation structure for image sensors - Google Patents
Electronic device and heat dissipation structure for image sensors Download PDFInfo
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- CN103021971A CN103021971A CN2011102834964A CN201110283496A CN103021971A CN 103021971 A CN103021971 A CN 103021971A CN 2011102834964 A CN2011102834964 A CN 2011102834964A CN 201110283496 A CN201110283496 A CN 201110283496A CN 103021971 A CN103021971 A CN 103021971A
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Abstract
The invention discloses an electronic device and a heat dissipation structure for image sensors. The electronic device comprises a motherboard, a heat dissipation structure for image sensors, and a lens module, wherein the heat dissipation structure for image sensors comprises a heat dissipation plate, a heat conduction medium, an image sensor packaging body and a glass cover; the heat dissipation plate is fixed on the motherboard; the heat conduction medium is configured on the heat dissipation plate; the image sensor packaging body is fixed on the heat conduction medium, and comprises a circuit board, a plurality of bonding pads, an image sensor and a sealing body; the circuit board is provided with an opening; and the image sensor is electrically connected with the circuit board through the bonding pads, a light receiving surface of the image sensor faces to the opening, and the back surface of the image sensor faces to the heat conduction medium.
Description
Technical field
The present invention relates to a kind of electronic installation, relate in particular to a kind of electronic installation with image sensor radiator structure.
Background technology
Indispensable computer, mobile phone, digital camera and liquid crystal display etc. in now people's life, none is not the Related product of semi-conductor industry, its relevant peripheral product is various especially, the rich potentiality and the importance that demonstrate electronics industry.In recent years, under the demand of people for the rapidly lifting of electronic product function and diversification, portability and light and handyization, its encapsulation procedure dealer has broken away from traditional technology and towards high precision processing procedure development such as high power, high density, light, thin and microminiaturizations, except above-mentioned trend, Electronic Packaging still need possess high-reliability, thermal diffusivity is good and the necessary characteristic such as low manufacturing cost, with the challenge in the face of launch time-histories and life cycle.
In numerous electronic products, the most in vogue with audio-visual multimedia again, and the release of the products such as digital camera, digital photography and image scanner, so that the image numberization has become inevitable trend.Wherein important key part and component is exactly image sensor (Image Sensor).This image sensor is a kind of semiconductor chip, it can be converted to electronic signal with light signal, and this semiconductor chip and comprise a photo-sensitive cell, photo-sensitive cell is a complementary matal-oxide semiconductor (Complementary Metal-Oxide Semiconductor mostly, CMOS) or a charge coupled cell (Charge-Coupled Device, CCD).
Generally speaking, the signal receiving end of image sensor (pad) designs in the side with respect to light receiving surface (light receiving surface), i.e. the back side of image sensor package body (image sensor package).Then, the mode with piece (wire bonding) is fixed on the image sensor package body on wiring board (Printed Circuit Board, PCB) or the soft board (Flexible Printed Circuit Board, FPCB).Yet, such configuration, the back side with respect to light receiving surface of image sensor is covered by wiring board or soft board, so that image sensor can't be by conduction or convection type heat radiation.Therefore, in order to cooperate image sensor in the development in portable product market, how image sensor is improved the image sensor that causes temperature overheating because of heating with simple structure, the emphasis that still develops for WeiLai Technology.
Summary of the invention
The invention provides a kind of electronic installation, by image sensor radiator structure simple in structure, so that electronic installation reaches good radiating effect.
The invention provides a kind of image sensor radiator structure, be applicable to electronic installation, have simple structure, can improve the heat dissipation problem of image sensor, and then promote the efficient of electronic installation.
The present invention proposes a kind of electronic installation, comprises a mainboard, an image sensor radiator structure and a camera lens module.The image sensor radiator structure is disposed at mainboard, comprises a heating panel, a heat-conducting medium, an image sensor package body and a glass cover.Heating panel is fixed in mainboard.Heat-conducting medium is disposed at heating panel, and heating panel is between mainboard and heat-conducting medium.The image sensor package body is fixed in heat-conducting medium, comprises a wiring board, a plurality of connection pad, an image sensor and a seal.Wiring board has a first surface, with respect to one second and an opening of first surface.A plurality of connection pads be disposed at first surface and be positioned at opening around.Image sensor has a light receiving surface and with respect to the back side of light receiving surface, and is electrically connected the first surface of wiring board by the connection pad image sensor.Wherein light receiving surface towards opening and the back side towards heat-conducting medium.Seal is used for encapsulation image sensor and connection pad, and between the first surface and heat-conducting medium of wiring board.Glass cover is disposed at opening and covers image sensor.Camera lens module cover glass covers and is disposed at the image sensor radiator structure.The image sensor radiator structure is between camera lens module and mainboard.
The present invention also proposes a kind of image sensor radiator structure, is disposed in the electronic installation.Electronic installation comprises a mainboard and a camera lens module.The image sensor radiator structure is disposed at mainboard.The camera lens module is disposed at the image sensor radiator structure, and the image sensor radiator structure is between camera lens module and mainboard.The image sensor radiator structure comprises a heating panel, a heat-conducting medium, an image sensor package body and a glass cover.Heating panel is fixed in mainboard.Heat-conducting medium is disposed at heating panel, and heating panel is between mainboard and heat-conducting medium.The image sensor package body is fixed in heat-conducting medium, comprises a wiring board, a plurality of connection pad, an image sensor and a seal.Wiring board has a first surface, with respect to one second and an opening of first surface.A plurality of connection pads be disposed at first surface and be positioned at opening around.Image sensor has a light receiving surface and with respect to the back side of light receiving surface, and is electrically connected the first surface of wiring board by the connection pad image sensor.Wherein light receiving surface towards opening and the back side towards heat-conducting medium.Seal is used for encapsulation image sensor and connection pad, and between the first surface and heat-conducting medium of wiring board.Glass cover is disposed at opening and covers image sensor.
In one embodiment of this invention, above-mentioned heat-conducting medium is a thermal grease, a thermal paste or a cooling pad.
In one embodiment of this invention, above-mentioned heating panel is a metallic plate.
In one embodiment of this invention, above-mentioned heating panel is the part of a screen support structure of this electronic installation.
In one embodiment of this invention, above-mentioned heating panel comprises a fins group, is disposed at the one side of this heating panel, and between this heating panel and this mainboard.
In one embodiment of this invention, above-mentioned wiring board is a printed circuit board (PCB) or a flexible printed wiring board.
Based on above-mentioned, the present invention is disposed at the back side of image sensor by heating panel and heat-conducting medium, so that image sensor can reach radiating effect by the mode of conduction or convection current.Therefore, electronic installation of the present invention by the configuration of image sensor radiator structure, can improve the heat dissipation problem of image sensor, so that image sensor can use higher operating frequency, the operating efficiency of electronic installation is promoted.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate accompanying drawing to be described in detail below.
Description of drawings
Fig. 1 is the schematic diagram according to a kind of electronic installation of one embodiment of the invention.
Fig. 2 is the schematic diagram of image sensor radiator structure of the electronic installation of Fig. 1.
Fig. 3 shows that the image sensor heat abstractor of Fig. 2 is along the cross-sectional schematic of line A-A.
Reference numeral:
50: mainboard
60: the camera lens module
100: electronic installation
200: the image sensor radiator structure
210: heating panel
212: the position, hole
220: heat-conducting medium
230: the image sensor package body
232: wiring board
232a: first surface
232b: second
232c: opening
234: connection pad
236: image sensor
236a: light receiving surface
236b: the back side
238: seal
240: glass cover
Embodiment
Fig. 1 is the schematic diagram according to a kind of electronic installation of one embodiment of the invention.Please refer to Fig. 1, the electronic installation 100 of present embodiment is camera for example, comprises mainboard 50, an image sensor radiator structure 200 and a camera lens module 60.Image sensor radiator structure 200 is disposed at mainboard 50.Camera lens module 60 is disposed at image sensor radiator structure 200, and image sensor radiator structure 200 is between camera lens module 60 and mainboard 50.
Fig. 2 is the schematic diagram of image sensor radiator structure of the electronic installation of Fig. 1.Fig. 3 shows that the image sensor heat abstractor of Fig. 2 is along the cross-sectional schematic of line A-A.Please also refer to Fig. 2 and Fig. 3, image sensor radiator structure 200 comprises heating panel 210, heat-conducting medium 220, image sensor package body 230 and glass cover 240.
In the present embodiment, image sensor package body 230 is fixed in heat-conducting medium 220, and heat-conducting medium 220 is disposed at heating panel 210.Heat-conducting medium 220 mainly is in heat conducting mode, and the torrid zone that image sensor package body 230 is come out is to heating panel 210, heating panel 210 is distributed to heat again in the mode of convection current around.Therefore, heating panel 210 metallic plate preferably.And in order to simplify the structure, heating panel 210 can be the sheet metal component that electronic installation 100 namely has, for example the sheet metal of the screen support structure (not shown) of electronic installation 100.Accordingly, the electronic installation 100 of present embodiment needn't additionally increase under the condition of element, can directly utilize the part of the internal structure that namely has to be used as heating panel 210, heat-conducting medium 220 is disposed at heating panel 210, so that image sensor package body 230 reaches the effect of heat radiation.Moreover the area that the sheet metal component that electronic installation 100 inside namely have and the area of contact with air are compared image sensor and contact with air will be greater, so utilize heating panel 210 can promote the radiating effect of electronic installation 100 inside.In addition, the heating panel 210 of present embodiment can comprise that also a fins group (not shown) is configured in the one side that does not dispose heat-conducting medium 220 of heating panel 210, to promote the radiating effect of electronic installation 100.In addition, the heat-conducting medium 220 of present embodiment can be thermal grease, thermal paste, cooling pad or any other Heat Conduction Material that is fit to, and this present invention is not limited.
Please refer to Fig. 3, in the present embodiment, image sensor package body 230 comprises wiring board 232, a plurality of connection pad 234, image sensor 236 and seal 238.In the present embodiment, image sensor 236 can be a kind of charge coupled cell image sensor (charge coupled device image sensor, CCD image sensor) or imageing sensor (complementary metal oxide semiconductor image sensor, CMOS image sensor).In order to make the image sensor 236 can be with higher operating frequency, for the efficient that promotes image sensor 236 or overheated for fear of image sensor 236, hot quick and a large amount of being pulled away that must allow image sensor 236 come out.Therefore, in the present embodiment, the structure of image sensor 236 dress mode is different with structure dress mode in the past.
More specifically, as shown in Figure 3, wiring board 232 has first surface 232a, with respect to second 232b and the opening 232c of first surface 232a.In the present embodiment, wiring board 232 can be printed circuit board (PCB) (Printed Circuit Board, PCB) or flexible printed wiring board (Flexible Printed Circuit Board, FPCB), and the present invention is not limited to this.Image sensor 236 has light receiving surface 236a and with respect to the back side 236b of light receiving surface 236a.In the present embodiment, image sensor 236 is electrically connected to the first surface 232a of wiring board 232 by connection pad 234, wherein light receiving surface 236a towards opening 232c and back side 236b towards heat-conducting medium 220.Connection pad 234 be disposed at the first surface 232a of wiring board 232 and be positioned at opening 232c around.
Generally speaking, existing image sensor all is to encapsulate by connection pad and in the structure dress mode of the back side near wiring board.Yet as shown in Figure 3, in the present embodiment, for the back side 236b with image sensor 236 can stick heat-conducting medium 220, image sensor 236 disposes near the structure dress mode of wiring board 232 with light receiving surface 236a.And, in order to receive entering of light, disposed an opening 232c on the wiring board 232, again image sensor 236 is disposed at opening 232c.So, the image sensor 236 of present embodiment can reach good radiating effect.
Please continue with reference to figure 3, image sensor package body 230 also comprises a seal 238.Seal 238 is to encapsulate image sensor 236 and connection pad 234.The seal 238 of present embodiment is between the first surface 232a and heat-conducting medium 220 of wiring board 232.Material that it should be noted that seal 238 can be to consist of with resin or ceramic material.But in order to make better heat-radiation effect, the seal 238 of present embodiment is to consist of with ceramic material.In addition, in order to allow image sensor 236 better be protected, disposed a glass cover 240 on second 232b of wiring board 232, and glass cover 240 is disposed at the opening 232c of wiring board 232, and covers image sensor 236.
Please refer to Fig. 2, for camera lens module 60 is disposed at image sensor radiator structure 200, disposed position, a plurality of hole 212 on the heating panel 210 of present embodiment, so that camera lens module 60 can be to lock to heating panel 210.Yet the present invention does not limit the fixed form of camera lens module 60 and image sensor radiator structure 200.
In sum, the present invention is disposed at the back side of image sensor by heating panel and heat-conducting medium, so that image sensor can reach radiating effect by the mode of conduction or convection current.Therefore, electronic installation of the present invention by the configuration of image sensor radiator structure, can improve the heat dissipation problem of image sensor, so that image sensor can use higher operating frequency, the operating efficiency of electronic installation is promoted.In addition, can directly utilize the inner existing sheet metal component of electronic installation: for example the part sheet metal component of the supporting construction of display screen is used as heating panel, so that electronic installation is not only simple in structure, also can reach better radiating effect.
Although the present invention discloses as above with embodiment, so it is not to limit the present invention, and any person of an ordinary skill in the technical field when can doing a little change and retouching, and does not break away from the spirit and scope of the present invention.
Claims (12)
1. electronic installation comprises:
One mainboard;
One image sensor radiator structure is disposed at this mainboard, comprising:
One heating panel is fixed in this mainboard;
One heat-conducting medium is disposed at this heating panel, and this heating panel is between this mainboard and this heat-conducting medium;
One image sensor package body is fixed in this heat-conducting medium, comprising:
One wiring board has a first surface, with respect to one second and an opening of this first surface;
A plurality of connection pads, be disposed at this first surface and be positioned at this opening around;
One image sensor has a light receiving surface and with respect to the back side of this light receiving surface, and is electrically connected this first surface of this wiring board by those connection pads, wherein this light receiving surface towards this opening and this back side towards this heat-conducting medium;
One seal is used for this image sensor of encapsulation and those connection pads, and between this first surface and this heat-conducting medium of this wiring board; And
One glass cover is disposed at this opening and covers this image sensor; And
One camera lens module covers this glass cover and is disposed at this image sensor radiator structure, and this image sensor radiator structure is between this camera lens module and this mainboard.
2. electronic installation according to claim 1, wherein this heat-conducting medium is a thermal grease, a thermal paste or a cooling pad.
3. electronic installation according to claim 1, wherein this heating panel is a metallic plate.
4. electronic installation according to claim 3, wherein this heating panel is the part of a screen support structure of this electronic installation.
5. electronic installation according to claim 3, wherein this heating panel comprises a fins group, is disposed at the one side of this heating panel, and between this heating panel and this mainboard.
6. electronic installation according to claim 1, wherein this wiring board is a printed circuit board (PCB) or a flexible printed wiring board.
7. image sensor radiator structure, be disposed in the electronic installation, this electronic installation comprises a mainboard and a camera lens module, this image sensor radiator structure is disposed at this mainboard, this camera lens module is disposed at this image sensor radiator structure, this image sensor radiator structure and comprises between this camera lens module and this mainboard:
One heating panel is fixed in this mainboard;
One heat-conducting medium is disposed at this heating panel, and this heating panel is between this mainboard and this heat-conducting medium;
One image sensor package body is fixed in this heat-conducting medium, comprising:
One wiring board has a first surface, with respect to one second and an opening of this first surface;
A plurality of connection pads, be disposed at this first surface and be positioned at this opening around;
One image sensor has a light receiving surface and with respect to the back side of this light receiving surface, and is electrically connected this first surface of this wiring board by those connection pads, wherein this light receiving surface towards this opening and this back side towards this heat-conducting medium; And
One seal is used for this image sensor of encapsulation and those connection pads, and is positioned at this circuit
Between this first surface and this heat-conducting medium of plate; And
One glass cover is disposed at this opening and covers this image sensor.
8. image sensor radiator structure according to claim 7, wherein this heat-conducting medium is a thermal grease, a thermal paste or a cooling pad.
9. image sensor radiator structure according to claim 7, wherein this heating panel is a metallic plate.
10. image sensor radiator structure according to claim 9, wherein this heating panel is the part of a screen support structure of this electronic installation.
11. image sensor radiator structure according to claim 9, wherein this heating panel comprises a fins group, is disposed at the one side of this heating panel, and between this heating panel and this mainboard.
12. image sensor radiator structure according to claim 7, wherein this wiring board is a printed circuit board (PCB) or a flexible printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102834964A CN103021971A (en) | 2011-09-22 | 2011-09-22 | Electronic device and heat dissipation structure for image sensors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102834964A CN103021971A (en) | 2011-09-22 | 2011-09-22 | Electronic device and heat dissipation structure for image sensors |
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| Publication Number | Publication Date |
|---|---|
| CN103021971A true CN103021971A (en) | 2013-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102834964A Pending CN103021971A (en) | 2011-09-22 | 2011-09-22 | Electronic device and heat dissipation structure for image sensors |
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| CN (1) | CN103021971A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104853563A (en) * | 2014-02-19 | 2015-08-19 | 联想(北京)有限公司 | Electronic equipment |
| CN109756659A (en) * | 2018-12-26 | 2019-05-14 | 维沃移动通信有限公司 | A kind of photographic device and electronic equipment |
| CN110248053A (en) * | 2018-03-08 | 2019-09-17 | 光宝电子(广州)有限公司 | Photographic device |
| CN113099820A (en) * | 2020-01-09 | 2021-07-13 | 苏州宝时得电动工具有限公司 | Intelligent mower |
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| US20080246845A1 (en) * | 2007-04-04 | 2008-10-09 | Hon Hai Precision Industry Co., Ltd. | Camera module with compact packaging of image sensor chip |
| US20090153706A1 (en) * | 2007-12-18 | 2009-06-18 | Hon Hai Precision Industry Co., Ltd. | Imaging module package |
| US20100243872A1 (en) * | 2009-03-24 | 2010-09-30 | Ryosuke Amano | Semiconductor device |
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| CN1705111A (en) * | 2004-05-31 | 2005-12-07 | 株式会社东芝 | Cooling system and projection-type image display apparatus using the same |
| US20060278810A1 (en) * | 2005-05-24 | 2006-12-14 | Yuji Kobayashi | Image pickup unit and image pickup apparatus |
| US20080246845A1 (en) * | 2007-04-04 | 2008-10-09 | Hon Hai Precision Industry Co., Ltd. | Camera module with compact packaging of image sensor chip |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104853563A (en) * | 2014-02-19 | 2015-08-19 | 联想(北京)有限公司 | Electronic equipment |
| CN110248053A (en) * | 2018-03-08 | 2019-09-17 | 光宝电子(广州)有限公司 | Photographic device |
| CN110248053B (en) * | 2018-03-08 | 2021-05-25 | 光宝电子(广州)有限公司 | Image pickup apparatus |
| CN109756659A (en) * | 2018-12-26 | 2019-05-14 | 维沃移动通信有限公司 | A kind of photographic device and electronic equipment |
| CN109756659B (en) * | 2018-12-26 | 2020-07-31 | 维沃移动通信有限公司 | Camera device and electronic equipment |
| CN113099820A (en) * | 2020-01-09 | 2021-07-13 | 苏州宝时得电动工具有限公司 | Intelligent mower |
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Application publication date: 20130403 |