CN104853563A - Electronic equipment - Google Patents
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- CN104853563A CN104853563A CN201410056834.4A CN201410056834A CN104853563A CN 104853563 A CN104853563 A CN 104853563A CN 201410056834 A CN201410056834 A CN 201410056834A CN 104853563 A CN104853563 A CN 104853563A
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- Prior art keywords
- circuit board
- electronic equipment
- electronic device
- support
- housing
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Abstract
The invention discloses electronic equipment which comprises a housing, a first circuit board, a second circuit board and a support. The first circuit board is arranged in the housing. A first surface of the first circuit board is provided with at least one electronic device. The second circuit board is provided with a through hole. The at least one electronic device is arranged in the through hole. The support is arranged in the housing. The support and the first circuit board are respectively arranged on two opposite sides of the second circuit board. A first surface of the support is in contact with the at least one electronic device. The support is made of a metal material.
Description
Technical field
The present invention relates to electronic technology field, particularly relate to a kind of electronic equipment.
Background technology
Along with the development of science and technology and the progress of society, electronic equipment such as computer, mobile phone, TV have become an indispensable part in people's live and work.
In order to ensure that the electronic device in electronic equipment can normally work, in electronic equipment, be usually provided with heating panel.Particularly, described electronic equipment comprises: housing, support, circuit board and heating panel, and described support, circuit board and heating panel are arranged in described housing, and described circuit board is arranged between described support and described heating panel.Described circuit board is provided with the electronic device of at least one heating, described heating panel contacts with described electronic device, for absorbing the heat of described electronic device generation and distributing, thus avoid the accumulation of heat that described electronic device produces, ensure the normal work of electronic device.
But present inventor in the process realizing technical scheme, at least find that above-mentioned prior art exists following technical problem:
Because existing electronic equipment needs to arrange heating panel, thus cause the thickness of described electronic equipment to increase, be unfavorable for the development trend of electronics miniaturization.
Summary of the invention
The application provides a kind of electronic equipment, solve in prior art because existing electronic equipment needs to arrange heating panel, the thickness of described electronic equipment is caused to increase, be unfavorable for the development trend of electronics miniaturization, reach the thickness reducing described electronic equipment, be beneficial to the development of electronics miniaturization.
The application provides a kind of electronic equipment, comprises housing, first circuit board, second circuit board and support.Described first circuit board is arranged in described housing, the first surface of described first circuit board is provided with at least one electronic device; Described second circuit board offers through hole, and at least one electronic device described is positioned at described through hole; Described Bracket setting is in described housing, and described support and described first circuit board are arranged at the relative both sides of described second circuit board respectively, and the first surface of described support contacts with at least one electronic device described, and described support is made up of metal material.
Preferably, described first circuit board and the electrical connection of described second circuit board.
Preferably, described electronic equipment also comprises second circuit board, and described second circuit board offers through hole, and described electronic device is positioned at described through hole.
Preferably, described housing comprises fore shell and the back cover relative with fore shell, described first circuit board and described second circuit board are arranged between described support and described back cover, and the distance in the middle part of described back cover and between described support is greater than the distance between described back cover edge and described support.
Preferably, the thickness of described second circuit board is greater than the thickness of described first circuit board.
Preferably, described first circuit board is fixed on described second circuit board.
Preferably, the size that the size of described first circuit board is greater than described through hole is less than the size of described second circuit board.
Preferably, the first surface of described first circuit board is only provided with described electronic device, second surface opposing with described first surface on described first circuit board is provided with electronic component, described second circuit board is only provided with electronic component on the surface opposing with described support.
Preferably, described electronic equipment also comprises heat conductive pad, and described heat conductive pad is arranged between described support and described electronic device, is delivered to conductivity on described support for improving described heat.
Preferably, described heat conductive pad is specially heat conductive silica gel.
Preferably, described support is metal reinforcing.
The application's beneficial effect is as follows:
Above-mentioned electronic equipment by by described Bracket setting for be made up of metal material, thus make described support can not only realize the function supported, the heat of described electronic device generation can also be absorbed and distribute, the heat avoiding described electronic device to produce preserves around electronic device, and affect work and the useful life of electronic device, thus avoid increasing heating panel in addition, solve in prior art because existing electronic equipment needs to arrange heating panel, the thickness of described electronic equipment is caused to increase, be unfavorable for the development trend of electronics miniaturization, reach the thickness reducing described electronic equipment, be beneficial to the development of electronics miniaturization.
By arranging described heat conductive pad, the gap between described support and described electronic device can not only be filled, to improve the efficiency of described heat trnasfer, the effect such as damping, insulation can also be played simultaneously.
By arranging described second circuit board, the space in described housing can be utilized more fully, improving the utilance in space, when being especially only provided with described electronic device on the first surface of described first circuit board.
Be greater than by described first circuit board being set to size the size that described through hole is less than described second circuit board, thus be convenient to described first circuit board to be fixed on described second circuit board, and the space in electronic equipment described in Appropriate application.
By only opposing with described support on described second circuit board surface is provided with electronic component, to reduce the thickness of described electronic equipment further, be beneficial to the lightening development trend of electronic equipment.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described by the accompanying drawing used required in describing embodiment below, apparently, the accompanying drawing in the following describes is only some embodiments of the present invention.
Fig. 1 is the front view of the application first better embodiment electronic equipment;
Fig. 2 is the generalized section of electronic equipment in Fig. 1.
Embodiment
The embodiment of the present application is by providing a kind of electronic equipment, solve in prior art because existing electronic equipment needs to arrange heating panel, the thickness of described electronic equipment is caused to increase, be unfavorable for the development trend of electronics miniaturization, reach the thickness reducing described electronic equipment, be beneficial to the development of electronics miniaturization.
Technical scheme in the embodiment of the present application is for solving the problems of the technologies described above, and general thought is as follows:
A kind of electronic equipment, comprises housing, first circuit board, second circuit board and support.Described first circuit board is arranged in described housing, the first surface of described first circuit board is provided with at least one electronic device; Described second circuit board offers through hole, and at least one electronic device described is positioned at described through hole; Described Bracket setting is in described housing, and described support and described first circuit board are arranged at the relative both sides of described second circuit board respectively, and the first surface of described support contacts with at least one electronic device described, and described support is made up of metal material.
Above-mentioned electronic equipment by by described Bracket setting for be made up of metal material, thus make described support can not only realize the function supported, the heat of described electronic device generation can also be absorbed and distribute, the heat avoiding described electronic device to produce preserves around electronic device, and affect work and the useful life of electronic device, thus avoid increasing heating panel in addition, solve in prior art because existing electronic equipment needs to arrange heating panel, the thickness of described electronic equipment is caused to increase, be unfavorable for the development trend of electronics miniaturization, reach the thickness reducing described electronic equipment, be beneficial to the development of electronics miniaturization.
In order to better understand technique scheme, below in conjunction with Figure of description and concrete execution mode, technique scheme is described in detail.
As shown in Figure 1, be the front view of the application first better embodiment electronic equipment 100.Described electronic equipment can be the electronic equipments such as mobile phone, PAD, notebook computer.In the present embodiment, with electronic equipment 100 for mobile phone is described, in other embodiments, described electronic equipment 100 is not limited to mobile phone.
Consult Fig. 2 simultaneously, described electronic equipment 100 comprise housing 10, first circuit board 20, second circuit board 50 and the support 30 be arranged in described housing 10.
A receiving space is formed with, to hold the parts such as described first circuit board 20, described support 30 in described housing 10.Described housing 10 can have plastic material to make, and also can be made up of metal material, or part has plastic material to make, and part from metal material is made.Described housing 10 can comprise fore shell 11 and the back cover 12 relative with fore shell, described back cover 12 can directly and fore shell 11 be fixed to surround described receiving space, also by by described fore shell 11 and described back cover 12 fixing with a framework on to surround described receiving space.In the present embodiment, described back cover 12 is directly fixed to surround described receiving space with described fore shell 11.
In the present embodiment, because described electronic equipment 100 is mobile phone, therefore, described fore shell 11 offers opening 111, so that fix a display screen 13.In other embodiments, described fore shell 11 can not offer opening 111, also need not fix a display screen.
Described first circuit board 20 is arranged in described receiving space.The first surface 21 of described first circuit board 20 is provided with at least one electronic device 22.Described electronic device 22 is specifically as follows the high electronic device of the caloric values such as chip, processor, memory.When receiving space in described housing 10 is enough, on the first surface 21 of described first circuit board 20 except described electronic device 22 is set, other electronic devices can also be set, also can not arrange, with on the second surface 23 that first surface 21 is opposing, can electronic device be set, also can not arranges.In the present embodiment, in order to reduce the thickness of described electronic equipment 100, the first surface 21 of described first circuit board 20 is only provided with described electronic device 22, second surface 23 opposing with described first surface 21 on described first circuit board 20 is provided with the electronic component identical or not identical with described electronic device 22.
Described second circuit board 50 offers through hole 51, and described electronic device 22 is positioned at described through hole 51.Described electronic device 22 can contact with described second circuit board 50, also can not contact with described second circuit board 50.Because, the height of described electronic device 22 is usually higher, therefore, by arranging described second circuit board 50, the space in described housing 10 can be utilized more fully, improve the utilance in space, when being especially only provided with described electronic device 22 on the first surface 21 of described first circuit board 20.Particularly, described through hole 51 is opened in the middle part of described second circuit board 50.
Described first circuit board 20 and described second circuit board 50 are arranged between described support 30 and described back cover 12, distance between the middle part of described back cover 12 and described support 30 is greater than the distance between the edge of described back cover 12 and described support 30, that is, the cross section of described back cover is arc, be beneficial to the attractive in appearance of electronic equipment 100, therefore, described first circuit board 20 and described second circuit board 50 can be arranged on the position in the middle part of by described first circuit board 20 and described second circuit board 50 relative to described first circuit board 20 and the highly higher electronic component of described second circuit board 50, improve the space availability ratio in electronic equipment 100.
Particularly, described first circuit board 20 and described second circuit board 50 can directly be electrically connected, also can not be electrically connected, in the present embodiment, described first circuit board 20 and described second circuit board 50 can be electrically connected mutually, specifically can directly be connected by wire, or solder joint corresponding on first circuit board 20 described in ball bond and described second circuit board 50, to realize mutual electrical connection.
Described support 30 is arranged in described receiving space, and described support 30 is arranged at the relative both sides of described second circuit board 50 respectively with described first circuit board 20, and the first surface 31 of described support 30 contacts with at least one electronic device 22 described.Described support 30 is made up of metal material, described support 30 can be entity, and also can be hollow out, can also be metal reinforcing.Because described support 30 is by metallic material, therefore, described support 30 has good heat conductivity, described support 30 can absorb the heat that the described electronic device 22 that contacts with described support 30 produces, thus the heat avoiding described electronic device 22 to produce preserves around electronic device 22, and affect work and the useful life of electronic device 22.
Above-mentioned electronic equipment 100 is by being set to be made up of metal material by described support 30, thus make described support 30 can not only realize the function supported, the heat of described electronic device 22 generation can also be absorbed and distribute, the heat avoiding described electronic device 22 to produce preserves around electronic device 22, and affect work and the useful life of electronic device 22, thus avoid arranging heating panel in addition, solve in prior art because existing electronic equipment needs to arrange heating panel, the thickness of described electronic equipment is caused to increase, be unfavorable for the development trend of electronics miniaturization, reach the thickness reducing described electronic equipment, be beneficial to the development of electronics miniaturization.
In order to improve the pyroconductivity between described electronic device 22 and described first circuit board 20, described electronic equipment 100 also comprises heat conductive pad 40, described heat conductive pad 40 is arranged between described support 30 and described electronic device 22, is delivered to conductivity on described support 30 to improve described heat.Described heat conductive pad 40 can be made up of materials such as Graphene, heat conductive silica gel, heat-conducting creams.By arranging described heat conductive pad 40, the gap between described support 30 and described electronic device 22 can not only be filled, to improve the efficiency of described heat trnasfer, the effect such as damping, insulation can also be played simultaneously.
Further, in order to reduce the thickness of described electronic equipment 100, utilize the development that electronics is frivolous, the thickness of described second circuit board 50 is set to the thickness being greater than described first circuit board 20, as as described in first circuit board 20 be set to 0.3mm, described second circuit board 50 is set to 0.7mm.In addition, described first circuit board 20 is fixed on described second circuit board 50, specifically can by welding or screw is fixing etc. that mode is fixed.
Particularly, the size that the size of described first circuit board 20 is greater than described through hole 51 is less than the size of described second circuit board 50.Be greater than by described first circuit board 20 being set to size the size that described through hole 51 is less than described second circuit board 50, thus be convenient to described first circuit board 20 to be fixed on described second circuit board 50, and the space in electronic equipment 100 described in Appropriate application.
In order to reduce the thickness of described electronic equipment 100 further, only on the surface opposing with described support 30, be provided with electronic component 52 by described second circuit board 50, that is, described second circuit board 50 is single-sided circuit board.By only opposing with described support 30 on described second circuit board 50 surface is provided with electronic component 52, to reduce the thickness of described electronic equipment 100 further, be beneficial to the lightening development trend of electronic equipment 100.
Above-mentioned electronic equipment 100 is by being set to be made up of metal material by described support 30, thus make described support 30 can not only realize the function supported, the heat of described electronic device 22 generation can also be absorbed and distribute, the heat avoiding described electronic device 22 to produce preserves around electronic device 22, and affect work and the useful life of electronic device 22, thus avoid increasing heating panel in addition, solve in prior art because existing electronic equipment needs to arrange heating panel, the thickness of described electronic equipment is caused to increase, be unfavorable for the development trend of electronics miniaturization, reach the thickness reducing described electronic equipment, be beneficial to the development of electronics miniaturization.
By arranging described heat conductive pad 40, the gap between described support 30 and described electronic device 22 can not only be filled, to improve the efficiency of described heat trnasfer, the effect such as damping, insulation can also be played simultaneously.
By arranging described second circuit board 50, the space in described housing 10 can be utilized more fully, improving the utilance in space, when being especially only provided with described electronic device 22 on the first surface 21 of described first circuit board 20.
Be greater than by described first circuit board 20 being set to size the size that described through hole 51 is less than described second circuit board 50, thus be convenient to described first circuit board 20 to be fixed on described second circuit board 50, and the space in electronic equipment 100 described in Appropriate application.
By only opposing with described support 30 on described second circuit board 50 surface is provided with electronic component 52, to reduce the thickness of described electronic equipment 100 further, be beneficial to the lightening development trend of electronic equipment 100.
Although describe the preferred embodiments of the present invention, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the scope of the invention.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (10)
1. an electronic equipment, comprising:
Housing;
First circuit board, is arranged in described housing, the first surface of described first circuit board is provided with at least one electronic device;
Second circuit board, described second circuit board offers through hole, and at least one electronic device described is positioned at described through hole;
Support, is arranged in described housing, and described support and described first circuit board are arranged at the relative both sides of described second circuit board respectively, and the first surface of described support contacts with at least one electronic device described, and described support is made up of metal material.
2. electronic equipment as claimed in claim 1, is characterized in that, described first circuit board and the electrical connection of described second circuit board.
3. electronic equipment as claimed in claim 2, it is characterized in that, described housing comprises fore shell and the back cover relative with fore shell, described first circuit board and described second circuit board are arranged between described support and described back cover, and the distance in the middle part of described back cover and between described support is greater than the distance between described back cover edge and described support.
4. electronic equipment as claimed in claim 2 or claim 3, it is characterized in that, the thickness of described second circuit board is greater than the thickness of described first circuit board.
5. electronic equipment as claimed in claim 4, it is characterized in that, described first circuit board is fixed on described second circuit board.
6. electronic equipment as claimed in claim 2, is characterized in that, the size that the size of described first circuit board is greater than described through hole is less than the size of described second circuit board.
7. electronic equipment as claimed in claim 2, it is characterized in that, the first surface of described first circuit board is only provided with described electronic device, second surface opposing with described first surface on described first circuit board is provided with electronic component, described second circuit board is only provided with electronic component on the surface opposing with described support.
8. electronic equipment as claimed in claim 1, it is characterized in that, described electronic equipment also comprises heat conductive pad, and described heat conductive pad is arranged between described support and described electronic device, is delivered to conductivity on described support for improving described heat.
9. electronic equipment as claimed in claim 8, it is characterized in that, described heat conductive pad is specially heat conductive silica gel.
10. electronic equipment as claimed in claim 8, it is characterized in that, described support is metal reinforcing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410056834.4A CN104853563A (en) | 2014-02-19 | 2014-02-19 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410056834.4A CN104853563A (en) | 2014-02-19 | 2014-02-19 | Electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104853563A true CN104853563A (en) | 2015-08-19 |
Family
ID=53852808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410056834.4A Pending CN104853563A (en) | 2014-02-19 | 2014-02-19 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104853563A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020063195A1 (en) * | 2018-09-29 | 2020-04-02 | 维沃移动通信有限公司 | Circuit board structure and electronic device |
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| CN201303004Y (en) * | 2008-12-10 | 2009-09-02 | 重庆新束光电子科技有限公司 | Novel LED encapsulating bracket |
| CN102014600A (en) * | 2010-12-21 | 2011-04-13 | 摩比天线技术（深圳）有限公司 | Radiating structure and manufacturing method thereof as well as electronic device with radiating structure |
| CN102024797A (en) * | 2009-09-23 | 2011-04-20 | 虹堡科技股份有限公司 | Protective structure for electronic element |
| CN202276549U (en) * | 2011-09-26 | 2012-06-13 | 番禺得意精密电子工业有限公司 | Electric connection component |
| CN102811591A (en) * | 2012-08-08 | 2012-12-05 | 慈溪市顺达实业有限公司 | Variable frequency motor controller of washing machine |
| CN103021971A (en) * | 2011-09-22 | 2013-04-03 | 华晶科技股份有限公司 | Electronic device and heat dissipation structure for image sensors |
| CN203327459U (en) * | 2013-05-23 | 2013-12-04 | 青岛海信移动通信技术股份有限公司 | Portable mobile terminal |
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2014
- 2014-02-19 CN CN201410056834.4A patent/CN104853563A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080151487A1 (en) * | 2004-09-29 | 2008-06-26 | Super Talent Electronics, Inc. | Memory Module Assembly Including Heat-Sink Plates With Heat-Exchange Fins Attached To Integrated Circuits By Adhesive |
| CN201303004Y (en) * | 2008-12-10 | 2009-09-02 | 重庆新束光电子科技有限公司 | Novel LED encapsulating bracket |
| CN102024797A (en) * | 2009-09-23 | 2011-04-20 | 虹堡科技股份有限公司 | Protective structure for electronic element |
| CN102014600A (en) * | 2010-12-21 | 2011-04-13 | 摩比天线技术（深圳）有限公司 | Radiating structure and manufacturing method thereof as well as electronic device with radiating structure |
| CN103021971A (en) * | 2011-09-22 | 2013-04-03 | 华晶科技股份有限公司 | Electronic device and heat dissipation structure for image sensors |
| CN202276549U (en) * | 2011-09-26 | 2012-06-13 | 番禺得意精密电子工业有限公司 | Electric connection component |
| CN102811591A (en) * | 2012-08-08 | 2012-12-05 | 慈溪市顺达实业有限公司 | Variable frequency motor controller of washing machine |
| CN203327459U (en) * | 2013-05-23 | 2013-12-04 | 青岛海信移动通信技术股份有限公司 | Portable mobile terminal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020063195A1 (en) * | 2018-09-29 | 2020-04-02 | 维沃移动通信有限公司 | Circuit board structure and electronic device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150819 |
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| RJ01 | Rejection of invention patent application after publication |