WO2014122797A1 - Electronic apparatus and semiconductor electronic component - Google Patents

Electronic apparatus and semiconductor electronic component Download PDF

Info

Publication number
WO2014122797A1
WO2014122797A1 PCT/JP2013/058739 JP2013058739W WO2014122797A1 WO 2014122797 A1 WO2014122797 A1 WO 2014122797A1 JP 2013058739 W JP2013058739 W JP 2013058739W WO 2014122797 A1 WO2014122797 A1 WO 2014122797A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
modification
component
housing
electronic component
Prior art date
Application number
PCT/JP2013/058739
Other languages
French (fr)
Japanese (ja)
Inventor
青木　慎
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Publication of WO2014122797A1 publication Critical patent/WO2014122797A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Definitions

  • Embodiments described herein relate generally to an electronic device and a semiconductor electronic component.
  • an embodiment of the present invention has an object to obtain an electronic device and a semiconductor electronic component that can suppress an inconvenient event caused by warpage of the semiconductor electronic component.
  • An electronic apparatus includes, as an example, a housing, a circuit board, and a semiconductor electronic component.
  • the circuit board is accommodated in the housing and has a surface.
  • the semiconductor electronic component is mounted on a surface, has a peripheral portion as viewed from the thickness direction of the circuit board, and a concave portion or a convex portion is linearly provided on the peripheral portion.
  • FIG. 1 is a perspective view of an example of an electronic apparatus according to the embodiment.
  • FIG. 2 is a side view of a part of a circuit board housed in a housing of an example of the electronic apparatus according to the embodiment and components mounted on the surface of the circuit board.
  • FIG. 3 is a plan view of a semiconductor electronic component housed in a housing of an example of the electronic apparatus according to the embodiment. 4 is a cross-sectional view taken along the line IV-IV in FIG.
  • FIG. 5 is a plan view of a semiconductor electronic component according to a first modification.
  • FIG. 6 is a plan view of a semiconductor electronic component according to a second modification.
  • FIG. 7 is a cross-sectional view of a part of a semiconductor electronic component according to a third modification.
  • FIG. 8 is a plan view of a semiconductor electronic component according to a fourth modification.
  • FIG. 9 is a side view of a semiconductor electronic component according to a fourth modification.
  • 10 is a cross-sectional view taken along the line XX of FIG.
  • FIG. 11 is a partial cross-sectional view of a semiconductor electronic component according to a fifth modification.
  • FIG. 12 is a plan view of a semiconductor electronic component according to a sixth modification.
  • FIG. 13 is a side view of a semiconductor electronic component according to a seventh modification.
  • FIG. 14 is a side view of a semiconductor electronic component according to an eighth modification.
  • the electronic apparatus includes, for example, a tablet (slate) or desktop personal computer, a smartphone, an electronic book terminal, a smart book, a mobile phone, a PDA (personal digital assistant), a video display device, a television. It can be configured as an electronic device having a circuit board on which a semiconductor electronic component is surface-mounted, such as a receiver, a video phone, a video display control device, an information storage device, and the like.
  • the electronic device 1 includes a housing 2 (first housing, first portion) and a housing 3 (second housing, another housing). Body, second part).
  • the housing 2 supports the display device 4.
  • a circuit board 10 is accommodated in the housing 3.
  • the housing 3 includes a keyboard 6 (input operation unit, input reception unit, input unit), a touch pad 7 (input operation unit, input reception unit, input unit), and a click button 8 (input operation unit, input reception). Part, input part) and the like.
  • the housing 2 and the housing 3 are rotatably connected by a hinge portion 9 (connecting portion, connecting portion, turning support portion, hinge mechanism, connecting mechanism, connecting mechanism, turning support mechanism).
  • the hinge part 9 connects the housing 2 and the housing 3 so as to be rotatable about the rotation axis Ax.
  • the display screen 4 a of the display device 4 is visible from the opening 2 r provided on the surface 2 a of the housing 2. Further, the keyboard 6, the touch pad 7, the click button 8, and the like are exposed on the surface 3 a of the housing 3.
  • the surface 3 a of the housing 3 and the surface 2 a of the housing 2 overlap, and the display screen 4 a, the keyboard 6, the touch pad 7, the click button 8, etc. are hidden by the housing 3 and the housing 2.
  • the surface 3a of the housing 3 and the surface 2a of the housing 2 are exposed, and the display screen 4a, the keyboard 6, the touch pad 7, the click button 8, and the like can be used (viewed or operated).
  • the housing 2 has a quadrangular appearance in the front view and the rear view (in the present embodiment, a rectangular shape that is long horizontally as an example).
  • casing 2 is comprised by the flat rectangular parallelepiped shape thin in the front-back direction (thickness direction of the housing
  • the housing 2 includes a surface 2a (front surface, front surface, surface portion), a surface 2b on the opposite side (rear surface, rear surface, surface portion), and a surface 2p (side surface, surface portion) extending between the surface 2a and the surface 2b. Have. Both the surface 2a and the surface 2b intersect with the thickness direction.
  • the surface 2a and the surface 2b are substantially parallel. Further, the surfaces 2a, 2b and the surface 2p intersect (in the present embodiment, they are orthogonal as an example). Further, the housing 2 has four end portions 2c to 2f (side portions, edge portions, and peripheral edge portions) and four corner portions 2g to 2j (pointed portions, curved portions, end portions) in a front view. Have.
  • the ends 2c and 2e are examples of long sides.
  • the ends 2d and 2f are examples of short sides.
  • the housing 2 includes a wall 2k (part, plate, front wall, front wall, top wall, first wall) and a wall 2m (part, plate, rear wall, back wall). , Bottom wall portion, second wall portion) and wall portion 2n (part, plate, side wall portion, end wall portion, standing wall portion, span portion, third wall portion).
  • the wall 2k has a surface 2a.
  • the wall 2m has a surface 2b.
  • the wall 2n has a surface 2p.
  • the walls 2k, 2m, and 2n are all quadrangular (in the present embodiment, rectangular as an example).
  • the wall portions 2k, 2m, 2n are all plate-shaped.
  • the wall 2k is provided with a rectangular opening 2r.
  • the housing 2 can be made of, for example, a metal material or a synthetic resin material.
  • a metal material can be comprised by casting, a press, cutting, etc., for example.
  • the synthetic resin material can be constituted by, for example, injection molding.
  • the housing 3 can have a plurality of members (parts, divided bodies).
  • a display device 4 (display unit, display, panel, display component) is accommodated in the housing 2. Specifically, the user can visually recognize the display screen 4a of the display device 4 from the front side through the opening 2r.
  • the display device 4 has a quadrangular appearance (in the present embodiment, a rectangular shape as an example) when viewed from the front. Further, the display device 4 is configured in a flat rectangular parallelepiped shape that is thin in the front-rear direction.
  • the display device 4 is, for example, a liquid crystal display (LCD, liquid crystal display), an organic EL display (OELD, organic electro-luminescent display), or the like.
  • the display device 4 may be a flexible display.
  • a transparent and relatively thin rectangular input operation panel 5 (touch panel, touch sensor, operation surface, input operation unit) is provided on the front side (front side, wall 2k side) of the display device 4.
  • An input receiving unit is provided.
  • the input operation panel 5 covers the display screen 4a.
  • An operator (such as a user) executes input processing by performing operations such as touching, pushing, rubbing, or moving near the input operation panel 5 with the finger or stylus, for example. can do.
  • the light emitted from the display screen 4a of the display device 4 passes through the input operation panel 5 and exits from the opening 2r of the wall 2k to the front (outward) of the housing 2.
  • the input operation panel 5 is an example of an input unit.
  • the display device 4 and the input operation panel 5 are connected to the housing 2 by, for example, a coupler (a coupling component, a fixing component, for example, a screw, a fitting, a component, etc., not shown) It is fixed (supported) via an adhesive part (for example, an adhesive, a double-sided tape, etc., not shown).
  • a coupler a coupling component, a fixing component, for example, a screw, a fitting, a component, etc., not shown
  • an adhesive part for example, an adhesive, a double-sided tape, etc., not shown.
  • the input operation panel 5 may be configured as an in-cell touch panel included in the display device 4.
  • the housing 3 has a rectangular appearance in the front view and the rear view (in the present embodiment, a rectangular shape that is long horizontally as an example). Yes. Further, as shown in FIG. 1, the housing 3 is configured in a flat rectangular parallelepiped shape that is thin in the front-rear direction (the thickness direction of the housing 3).
  • the housing 3 includes a surface 3a (upper surface, top surface, surface portion), a surface 3b (lower surface, bottom surface, surface portion) on the opposite side, and a surface 3p (side surface, surface portion) extending between the surface 3a and the surface 3b. Have Both the surface 3a and the surface 3b intersect with the thickness direction.
  • the surface 3a and the surface 3b are substantially parallel. Further, the surfaces 3a, 3b and the surface 3p intersect (in the present embodiment, they are orthogonal as an example). Further, the housing 3 has four end portions 3c to 3f (side portions, edge portions, and peripheral edge portions) and four corner portions 3g to 3j (pointed portions, curved portions, end portions) in a front view. Have. The end portions 3c and 3e are examples of long side portions. The ends 3d and 3f are examples of short sides.
  • the housing 3 includes a wall portion 3k (part, plate, front wall portion, front wall portion, top wall portion, first wall portion) and wall portion 3m (part, plate, rear wall portion, back wall portion). , Bottom wall portion, second wall portion) and wall portion 3n (part, plate, side wall portion, end wall portion, standing wall portion, span portion, third wall portion).
  • the wall 3k has a surface 3a.
  • the wall 3m has a surface 3b.
  • the wall 3n has a surface 3p.
  • the wall portions 3k, 3m, and 3n are all quadrangular (in the present embodiment, rectangular as an example). Moreover, all the wall parts 3k, 3m, and 3n are plate shape.
  • the wall 3k is provided with a quadrangular opening 3r.
  • the housing 3 can be made of, for example, a metal material or a synthetic resin material.
  • a metal material can be comprised by casting, a press, cutting, etc., for example.
  • the synthetic resin material can be constituted by, for example, injection molding.
  • the housing 3 can have a plurality of members (parts, divided bodies).
  • circuit boards 10 are accommodated in the housing 3.
  • the circuit board 10 is provided in parallel with the keyboard 6.
  • the circuit board 10 is fixed to the housing 3 by a coupler (not shown).
  • the circuit board 10 includes, for example, a CPU (central processing unit), a graphic controller, a power circuit component, a PCH (platform controller hub), a memory slot connector, an LCD connector, and an I / O.
  • a plurality of components 20 electronic components, semiconductor electronic components, electrical components, packages, see FIG. 2) such as (input / output) connectors, power supply coils, elements, and connectors can be mounted.
  • a control circuit (not shown) configured on the circuit board 10 includes, for example, a video signal processing circuit, a tuner unit, an HDMI (high-definition multimedia interface) signal processing unit, an AV (audio video) input terminal, a remote controller Signal receiving unit, control unit, selector, on-screen display interface, storage unit (for example, ROM (read only memory), RAM (random access memory), HDD (hard disk drive), SSD (solid state drive), etc.), audio A signal processing circuit or the like can be included.
  • the control circuit outputs video (moving images, still images, etc.) on the display screen 4a of the display device 4, outputs sound from a speaker (not shown), and emits light from an LED (light emitting diode, not shown). Control etc.
  • the display device 4, the speaker, the LED, and the like are examples of the output unit.
  • the component 20 is surface-mounted on the surface 10 a of the circuit board 10.
  • the component 20 can also be mounted on the surface 10 b opposite to the surface 10 a of the circuit board 10.
  • the component 20 includes a circuit board 21 (second circuit board), an element 22, a cover part 23, and a connection part 24.
  • the component 20 is a BGA (ball grid array), a CSP (chip size package), or the like.
  • the circuit board 21 (interposer, substrate, package board, second circuit board) has a surface 21a (second surface) and a surface 21b on the opposite side.
  • the circuit board 21 may be made of a synthetic resin material having insulation properties, ceramic, or the like.
  • a conductor portion (conductor pattern, wiring layer, not shown) is included in the surfaces 21a, 21b or the inside of the circuit board 21.
  • the circuit board 21 can be a build-up board, a coreless board, or the like.
  • the circuit board 21 can be a rigid board, a flexible board, or the like. Further, the circuit board 21 can be provided with through holes, vias, through electrodes, and the like.
  • the element 22 (die) is mounted on the surface 21a as an example.
  • the element 22 (the conductor portion thereof, not shown) and the circuit board 21 (the conductor portion thereof, not shown) are connected via a conductor portion such as a wire (bonding wire), a bump, a conductive paste, or a plating layer. Connected mechanically and electrically.
  • the cover part 23 covers the circuit board 21 (the surface 21a) and the element 22 as an example.
  • the cover portion 23 can be made of a synthetic resin material having insulation properties. The cover 23 serves to protect and insulate the element 22.
  • connection part 24 solder balls, solder balls, bumps, joints.
  • the conductor part of the element 22 and the conductor part of the circuit board 10 are a conductor part (not shown) interposed between the element 22 and the circuit board 21, and a conductor part (not shown) in the circuit board 21.
  • the connecting portion 24 is cooled after being melted by a reflow process, thereby joining the conductor portions.
  • an area between the circuit board 10 and the component 20 (circuit board 21) except for the connection portion 24 is filled with an underfill 25.
  • the underfill 25 can be made of a synthetic resin material having insulating properties. There is a configuration in which the underfill 25 is not used.
  • the component 20 has a line of sight from the thickness direction of the circuit board 10 (line of sight from the normal direction of the surface 10 a, line of sight of FIG. 3, FIG. 2).
  • a plan view with respect to the surface 10a and the surface 20a a plan view with respect to the surface 10a and the surface 20a). That is, the component 20 is configured in a flat rectangular parallelepiped shape that is thin in the thickness direction of the circuit board 10.
  • the component 20 (cover 23) includes a surface 20a (plane) parallel to the surface 10a of the circuit board 10 on the side opposite to the circuit board 10, four sides 20b to 20e (ends), and four corners. 20f to 20i.
  • the side portions 20 b to 20 e and the corner portions 20 f to 20 i are the peripheral portion 20 j of the component 20.
  • the part 20 may be warped (deformed) due to, for example, heating during the reflow process. As an example, this warp is caused by a difference in linear expansion coefficient between different materials. Further, the component 20 may be warped in a state of being convex toward the circuit board 10 (posture), or may be warped in a state of being convex toward the side opposite to the circuit board 10. In any case, when the component 20 is warped, the reliability of the joint of the connection portion 24 is likely to be lowered locally or entirely. In this embodiment, as an example, as shown in FIGS.
  • the recess 26 is linear in the peripheral direction 20 j of the surface 20 a of the component 20 in the line of sight in the thickness direction of the circuit board 10 (in this embodiment, For example, a curved shape).
  • a concave portion 26 (concave groove, opening) extending linearly is provided on the surface 20 a of the cover portion 23. In such a configuration in which the concave portion 26 is provided, warpage may be smaller than in a configuration in which the concave portion 26 is not provided.
  • a displacement amount (deformation amount, for example, a distance from the surface 10a of the circuit board 10) accompanying the warp (deformation) occurs. ) Increases, for example, from the center C (geometric center of gravity) of the component 20 toward the peripheral portion 20j, and is maximum at the peripheral portion 20j.
  • the amount of displacement is relatively small on the center C side (inside) from the recess 26 because the recess 26 is provided. In some cases, it can be suppressed.
  • the present embodiment as an example, there is a case where warpage can be reduced as compared with the component 20 in which the recess 26 is not provided.
  • the warpage of the component 20 is larger as it is closer to the peripheral edge portion 20j.
  • the concave portion 26 is provided in the peripheral edge portion 20j of the component 20, as an example, warping (deformation) can be more effectively suppressed.
  • the recessed part 26 can be provided comparatively easily, for example using a dicing cutter (dicing saw) (by dicing).
  • the cover part 23 (component 20) can be shape
  • the recess 26 is provided in each of the four corners 20f to 20i.
  • the concave portion 26 includes two side portions 20b and 20c adjacent to the corner portion 20f, two side portions 20c and 20d adjacent to the corner portion 20g, and two side portions 20d adjacent to the corner portion 20h. 20e and between the two side portions 20e and 20b adjacent to the corner portion 20i.
  • warping deformation
  • the element 22 is not disposed in the corner portions 20f to 20i. Therefore, according to the present embodiment, as an example, the influence of the recess 26 on the element 22 may be made smaller.
  • a plurality of (in the present embodiment, two as an example) concave portions 26 are provided in parallel at substantially constant intervals corresponding to the respective corner portions 20f to 20i. ing.
  • the recesses 26 are provided in a plurality of concentric circles whose centers are the center C of the component 20 as viewed from the thickness direction of the circuit board 10.
  • the plurality of recesses 26 are provided in a circular arc shape (curved shape) and concentric circles at the corner portions 20f to 20i.
  • warpage deformation
  • the concave portions 26 are provided in a single layer.
  • the variation due to the position of the displacement amount may be easily suppressed because the concave portion 26 is provided in a curved shape (arc shape).
  • the concave portion 26 is provided in the peripheral portion 20j of the component 20 (semiconductor electronic component) as viewed from the thickness direction of the circuit board 10. Therefore, according to the present embodiment, as an example, there is a case where warpage can be further reduced as compared with the component 20 in which the recess 26 is not provided. In addition, since the peripheral portion 20j has a relatively large amount of displacement, as an example, warping (deformation) can be more effectively suppressed.
  • the recess 26 is provided on the cover 23 of the component 20 (semiconductor electronic component). Therefore, according to the present embodiment, as an example, the recess 26 can be provided in the component 20 relatively easily.
  • At least a part of the recess 26 is provided in the corners 20f to 20i of the component 20 (semiconductor electronic component). Since the corner portions 20f to 20i have a relatively large amount of displacement, according to the present embodiment, as an example, warping (deformation) can be more effectively suppressed.
  • the recess 26 is provided between two sides. Therefore, according to the present embodiment, as an example, compared with a configuration in which the concave portion 26 is provided along the entire circumference of the peripheral edge portion 20j, labor and cost for forming the concave portion 26 are easily reduced.
  • the recesses 26 are provided in multiples with a line of sight from the thickness direction of the circuit board 10. Therefore, according to the present embodiment, as an example, warpage (deformation) is more easily suppressed as compared to a configuration in which the concave portions 26 are provided in a single layer.
  • the shape of the recess 26 of the component 20 ⁇ / b> A is different from that of the above embodiment.
  • the recess 26 is provided over the entire circumference of the peripheral edge 20j.
  • Each recess 26 is along one of the four side portions 20b to 20e.
  • the concave portion 26 is provided in parallel with the side portions 20b to 20e.
  • a better result (effect) than the above embodiment can be obtained depending on the specifications (for example, shape, material, etc.) of the component 20A, environmental conditions (for example, reflow temperature, time, etc.), etc. There is also.
  • An electronic device 1B according to the modification shown in FIG. 6 has the same configuration as the electronic devices 1 and 1A. Therefore, the same effect based on the same configuration can be obtained also in this modification.
  • the part (configuration) shown in FIG. 6 can be replaced with the corresponding part (configuration) shown in the above-described embodiment or modification.
  • the shape of the recess 26 of the component 20 ⁇ / b> B is different from the above-described embodiment and modification.
  • the concave portions 26 provided in multiples (double as an example in the present modification) at each of the four corners 20f to 20i are line-of-sight from the thickness direction of the circuit board 10. And it extends linearly.
  • Each recess 26 intersects each side 20b to 20e at an angle of 45 °. Even with such a configuration, the same results (effects) as those of the above-described embodiment and modification can be obtained.
  • the electronic device 1C according to the modification shown in FIG. 7 has the same configuration as the electronic devices 1, 1A, 1B. Therefore, the same effect based on the same configuration can be obtained also in this modification.
  • the part (configuration) shown in FIG. 7 can be replaced with the corresponding part (configuration) shown in the above-described embodiment or modification.
  • the shape of the recess 26 of the component 20 ⁇ / b> C is different from the above-described embodiment and modification.
  • the concave portion 26 is a concave groove having a U-shaped cross section. Even with such a configuration, the same results (effects) as those of the above-described embodiment and modification can be obtained.
  • the specifications for example, shape, material, etc.
  • environmental conditions for example, reflow temperature, time, etc.
  • An electronic device 1D according to the modification shown in FIGS. 8 to 10 has the same configuration as the electronic devices 1 and 1A to 1C. Therefore, the same effect based on the same configuration can be obtained also in this modification.
  • the parts (configuration) shown in FIGS. 8 to 10 can be replaced with the corresponding parts (configuration) shown in the above-described embodiments and modifications.
  • the component 20D is a flip chip BGA that does not have the cover 23 and the circuit board 21 and the element 22 are exposed.
  • the convex part 27 is linear with the visual line of the thickness direction of the circuit board 10 on the peripheral part 20j of the surface 21a (second surface) of the circuit board 21 (second circuit board). (In this modification, it is provided in a curved line as an example).
  • the surface 21a of the circuit board 21 is provided with a protruding portion 27 (wall portion, protrusion, protruding line) extending linearly.
  • the convex portion 27 is positioned around the element 22 with a line of sight in the thickness direction of the circuit board 10.
  • warpage may be smaller than in a configuration in which the convex portion 27 is not provided.
  • the convex part 27 can be comprised with a synthetic resin material etc. as an example.
  • the convex portion 27 can be formed on the surface 21a of the circuit board 21, for example, or can be provided on the surface 21a by adhesion or the like. Even with such a configuration, the same results (effects) as those of the above-described embodiment and modification can be obtained.
  • An electronic device 1E according to the modification shown in FIG. 11 has the same configuration as the electronic devices 1, 1A to 1D. Therefore, the same effect based on the same configuration can be obtained also in this modification.
  • the part (configuration) shown in FIG. 11 can be replaced with the corresponding part (configuration) shown in the above-described embodiment or modification.
  • the component 20E is a flip chip BGA that does not have the cover 23 and the circuit board 21 and the element 22 are exposed, as in the fourth modification.
  • a concave portion 26 is provided instead of the convex portion 27 on the peripheral edge portion 20j of the surface 21a (second surface) of the circuit board 21 (second circuit board).
  • An electronic device 1F according to the modification shown in FIG. 12 has the same configuration as the electronic devices 1 and 1A to 1E. Therefore, the same effect based on the same configuration can be obtained also in this modification.
  • part (structure) shown by FIG. 12 can be substituted to the corresponding site
  • a concave portion 26 for example, a hemispherical concave portion 26.
  • a better result (effect) than the above-described embodiment and modification may be obtained depending on the specifications (for example, shape and material) of the component 20F and environmental conditions (for example, reflow temperature, time, etc.).
  • a plurality of convex portions 27 may be provided instead of the plurality of concave portions 26.
  • the invention according to the above-described embodiment and the modified examples includes the surface such as the QFN (quad flat no lead package, LLCC (lead less chip carrier)) shown in FIG. 13 and the QFP (quad flat package) shown in FIG.
  • the present invention can also be applied to other package components (semiconductor electronic components) to be mounted.
  • the concave portion 26 and the convex portion 27 can be provided on the circuit board 21 and the cover portion 23.
  • the same result (effect) can also be obtained by providing a linear cavity inside the circuit board 21 (second circuit board) or arranging a plurality of cavities in a linear shape.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

According to an embodiment of the present invention, an electronic apparatus is provided with, as one example, a case, a circuit board, and a semiconductor electronic component. The circuit board is housed in the case, and has a surface. The semiconductor electronic component is mounted on the surface, and has a peripheral portion when viewed from the thickness direction of the circuit board, and a recessed portion or a protruding portion is linearly provided in the peripheral portion.

Description

電子機器および半導体電子部品Electronic equipment and semiconductor electronic components
　本発明の実施形態は、電子機器および半導体電子部品に関する。 Embodiments described herein relate generally to an electronic device and a semiconductor electronic component.
　従来、回路基板の面に表面実装された半導体電子部品を有した電子機器が知られている。 Conventionally, an electronic device having a semiconductor electronic component mounted on the surface of a circuit board is known.
特開２００３－２４３８１８号公報JP 2003-243818 A
　この種の電子機器では、一例としては、半導体電子部品の反りに伴う不都合な事象を抑制できれば好ましい。 In this type of electronic equipment, as an example, it is preferable if an inconvenient event associated with warpage of the semiconductor electronic component can be suppressed.
　そこで、本発明の実施形態は、一例として、半導体電子部品の反りに伴う不都合な事象を抑制可能な電子機器および半導体電子部品を得ることを、目的の一つとする。 Therefore, as an example, an embodiment of the present invention has an object to obtain an electronic device and a semiconductor electronic component that can suppress an inconvenient event caused by warpage of the semiconductor electronic component.
　本発明の実施形態にかかる電子機器は、一例として、筐体と、回路基板と、半導体電子部品と、を備える。回路基板は、筐体内に収容され、面を有する。半導体電子部品は、面に実装され、回路基板の厚さ方向からの視線での周縁部を有し、当該周縁部に凹部または凸部が線状に設けられる。 An electronic apparatus according to an embodiment of the present invention includes, as an example, a housing, a circuit board, and a semiconductor electronic component. The circuit board is accommodated in the housing and has a surface. The semiconductor electronic component is mounted on a surface, has a peripheral portion as viewed from the thickness direction of the circuit board, and a concave portion or a convex portion is linearly provided on the peripheral portion.
図１は、実施形態にかかる電子機器の一例の斜視図である。FIG. 1 is a perspective view of an example of an electronic apparatus according to the embodiment. 図２は、実施形態にかかる電子機器の一例の筐体内に収容された回路基板の一部ならびに当該回路基板の面に実装された部品の側面図である。FIG. 2 is a side view of a part of a circuit board housed in a housing of an example of the electronic apparatus according to the embodiment and components mounted on the surface of the circuit board. 図３は、実施形態にかかる電子機器の一例の筐体内に収容された半導体電子部品の平面図である。FIG. 3 is a plan view of a semiconductor electronic component housed in a housing of an example of the electronic apparatus according to the embodiment. 図４は、図３のIV－IV断面図である。4 is a cross-sectional view taken along the line IV-IV in FIG. 図５は、第１変形例にかかる半導体電子部品の平面図である。FIG. 5 is a plan view of a semiconductor electronic component according to a first modification. 図６は、第２変形例にかかる半導体電子部品の平面図である。FIG. 6 is a plan view of a semiconductor electronic component according to a second modification. 図７は、第３変形例にかかる半導体電子部品の一部の断面図である。FIG. 7 is a cross-sectional view of a part of a semiconductor electronic component according to a third modification. 図８は、第４変形例にかかる半導体電子部品の平面図である。FIG. 8 is a plan view of a semiconductor electronic component according to a fourth modification. 図９は、第４変形例にかかる半導体電子部品の側面図である。FIG. 9 is a side view of a semiconductor electronic component according to a fourth modification. 図１０は、図８のX－X断面図である。10 is a cross-sectional view taken along the line XX of FIG. 図１１は、第５変形例にかかる半導体電子部品の一部の断面図である。FIG. 11 is a partial cross-sectional view of a semiconductor electronic component according to a fifth modification. 図１２は、第６変形例にかかる半導体電子部品の平面図である。FIG. 12 is a plan view of a semiconductor electronic component according to a sixth modification. 図１３は、第７変形例にかかる半導体電子部品の側面図である。FIG. 13 is a side view of a semiconductor electronic component according to a seventh modification. 図１４は、第８変形例にかかる半導体電子部品の側面図である。FIG. 14 is a side view of a semiconductor electronic component according to an eighth modification.
　以下の例示的な実施形態や変形例には、同様の構成要素が含まれている。よって、以下では、同様の構成要素には共通の符号が付されるとともに、重複する説明が省略される。また、各実施形態や変形例に含まれる部分は、他の実施形態や変形例の対応する部分と置き換えて構成されうる。 The following exemplary embodiments and modifications include similar components. Therefore, below, the same code | symbol is attached | subjected to the same component, and the overlapping description is abbreviate | omitted. In addition, the parts included in each embodiment or modification may be configured by replacing corresponding parts in other embodiments or modifications.
　また、以下の実施形態では、電子機器がクラムシェル型（ノート型、折り畳み型）のパーソナルコンピュータとして構成された場合が例示されるが、本実施形態にかかる電子機器は、これらには限定されない。本実施形態にかかる電子機器は、例えば、タブレット型（スレート型）やデスクトップ型のパーソナルコンピュータや、スマートフォン、電子書籍端末、スマートブック、携帯電話機、ＰＤＡ（personal　digital　assistant）、映像表示装置、テレビジョン受像機、テレビ電話機、映像表示制御装置、情報記憶装置等、半導体電子部品が表面実装された回路基板を有した電子機器として、構成されうる。 Further, in the following embodiment, a case where the electronic device is configured as a clamshell type (notebook type, folding type) personal computer is exemplified, but the electronic device according to the present embodiment is not limited to these. The electronic apparatus according to the present embodiment includes, for example, a tablet (slate) or desktop personal computer, a smartphone, an electronic book terminal, a smart book, a mobile phone, a PDA (personal digital assistant), a video display device, a television. It can be configured as an electronic device having a circuit board on which a semiconductor electronic component is surface-mounted, such as a receiver, a video phone, a video display control device, an information storage device, and the like.
＜実施形態＞
　本実施形態では、一例として、図１に示されるように、電子機器１は、筐体２（第一の筐体、第一の部分）と筐体３（第二の筐体、別の筐体、第二の部分）とを備える。筐体２は、表示装置４を支持している。筐体３には、回路基板１０が収容されている。また、筐体３には、キーボード６（入力操作部、入力受付部、入力部）や、タッチパッド７（入力操作部、入力受付部、入力部）、クリックボタン８（入力操作部、入力受付部、入力部）等が設けられている。 <Embodiment>
In this embodiment, as an example, as illustrated in FIG. 1, the electronic device 1 includes a housing 2 (first housing, first portion) and a housing 3 (second housing, another housing). Body, second part). The housing 2 supports the display device 4. A circuit board 10 is accommodated in the housing 3. The housing 3 includes a keyboard 6 (input operation unit, input reception unit, input unit), a touch pad 7 (input operation unit, input reception unit, input unit), and a click button 8 (input operation unit, input reception). Part, input part) and the like.
　筐体２と筐体３とは、ヒンジ部９（接続部、連結部、回動支持部、ヒンジ機構、接続機構、連結機構、回動支持機構）によって回動可能に接続されている。ヒンジ部９により、筐体２および筐体３は、少なくとも図１に示される展開状態と、図示されない折り畳み状態との間で回動可能に接続されている。本実施形態では、一例として、ヒンジ部９は、筐体２と筐体３とを、回動軸Ａｘ回りに回動可能に、接続している。表示装置４の表示画面４ａは、筐体２の面２ａに設けられた開口部２ｒから視認可能である。また、キーボード６や、タッチパッド７、クリックボタン８等は、筐体３の面３ａに露出している。折り畳み状態では、筐体３の面３ａと筐体２の面２ａとが重なり、表示画面４ａや、キーボード６、タッチパッド７、クリックボタン８等が、筐体３および筐体２に隠される。展開状態では、筐体３の面３ａおよび筐体２の面２ａが露出され、表示画面４ａや、キーボード６、タッチパッド７、クリックボタン８等が使用可能（視認可能あるいは操作可能）になる。 The housing 2 and the housing 3 are rotatably connected by a hinge portion 9 (connecting portion, connecting portion, turning support portion, hinge mechanism, connecting mechanism, connecting mechanism, turning support mechanism). By the hinge part 9, the housing | casing 2 and the housing | casing 3 are connected so that rotation is possible at least between the expansion | deployment state shown by FIG. 1, and the folding state which is not shown in figure. In the present embodiment, as an example, the hinge portion 9 connects the housing 2 and the housing 3 so as to be rotatable about the rotation axis Ax. The display screen 4 a of the display device 4 is visible from the opening 2 r provided on the surface 2 a of the housing 2. Further, the keyboard 6, the touch pad 7, the click button 8, and the like are exposed on the surface 3 a of the housing 3. In the folded state, the surface 3 a of the housing 3 and the surface 2 a of the housing 2 overlap, and the display screen 4 a, the keyboard 6, the touch pad 7, the click button 8, etc. are hidden by the housing 3 and the housing 2. In the unfolded state, the surface 3a of the housing 3 and the surface 2a of the housing 2 are exposed, and the display screen 4a, the keyboard 6, the touch pad 7, the click button 8, and the like can be used (viewed or operated).
　本実施形態では、一例として、図１に示されるように、筐体２は、正面視および背面視では四角形状（本実施形態では、一例として横に長い長方形状）の外観を呈している。また、筐体２は、本実施形態では、一例として、前後方向（筐体２の厚さ方向）に薄い扁平な直方体状に構成されている。筐体２は、面２ａ（正面、前面、面部）とその反対側の面２ｂ（背面、後面、面部）と、面２ａと面２ｂとの間に亘る面２ｐ（側面、面部）と、を有する。面２ａおよび面２ｂはいずれも、厚さ方向と交叉している。面２ａと面２ｂとは略平行である。また、面２ａ，２ｂと面２ｐとは、交叉している（本実施形態では、一例として直交している）。また、筐体２は、正面視では、四つの端部２ｃ～２ｆ（辺部、縁部、周縁部）と、四つの角部２ｇ～２ｊ（尖部、曲部、端部）と、を有する。端部２ｃ，２ｅは、長辺部の一例である。端部２ｄ，２ｆは、短辺部の一例である。 In the present embodiment, as an example, as shown in FIG. 1, the housing 2 has a quadrangular appearance in the front view and the rear view (in the present embodiment, a rectangular shape that is long horizontally as an example). Moreover, the housing | casing 2 is comprised by the flat rectangular parallelepiped shape thin in the front-back direction (thickness direction of the housing | casing 2) as an example in this embodiment. The housing 2 includes a surface 2a (front surface, front surface, surface portion), a surface 2b on the opposite side (rear surface, rear surface, surface portion), and a surface 2p (side surface, surface portion) extending between the surface 2a and the surface 2b. Have. Both the surface 2a and the surface 2b intersect with the thickness direction. The surface 2a and the surface 2b are substantially parallel. Further, the surfaces 2a, 2b and the surface 2p intersect (in the present embodiment, they are orthogonal as an example). Further, the housing 2 has four end portions 2c to 2f (side portions, edge portions, and peripheral edge portions) and four corner portions 2g to 2j (pointed portions, curved portions, end portions) in a front view. Have. The ends 2c and 2e are examples of long sides. The ends 2d and 2f are examples of short sides.
　また、筐体２は、壁部２ｋ（部分、プレート、前壁部、表壁部、天壁部、第一の壁部）と、壁部２ｍ（部分、プレート、後壁部、裏壁部、底壁部、第二の壁部）と、壁部２ｎ（部分、プレート、側壁部、端壁部、立壁部、亘部、第三の壁部）と、を有する。壁部２ｋは、面２ａを有する。壁部２ｍは、面２ｂを有する。壁部２ｎは、面２ｐを有する。壁部２ｋ，２ｍ，２ｎは、いずれも四角形状（本実施形態では、一例として長方形状）である。また、壁部２ｋ，２ｍ，２ｎは、いずれも板状である。壁部２ｋには、四角形状の開口部２ｒが設けられている。筐体２は、例えば、金属材料や合成樹脂材料等で構成されうる。金属材料は、例えば、鋳造や、プレス、切削等で構成することができる。合成樹脂材料は、例えば、射出成形等で構成することができる。なお、筐体３は、複数の部材（部品、分割体）を有することができる。 The housing 2 includes a wall 2k (part, plate, front wall, front wall, top wall, first wall) and a wall 2m (part, plate, rear wall, back wall). , Bottom wall portion, second wall portion) and wall portion 2n (part, plate, side wall portion, end wall portion, standing wall portion, span portion, third wall portion). The wall 2k has a surface 2a. The wall 2m has a surface 2b. The wall 2n has a surface 2p. The walls 2k, 2m, and 2n are all quadrangular (in the present embodiment, rectangular as an example). The wall portions 2k, 2m, 2n are all plate-shaped. The wall 2k is provided with a rectangular opening 2r. The housing 2 can be made of, for example, a metal material or a synthetic resin material. A metal material can be comprised by casting, a press, cutting, etc., for example. The synthetic resin material can be constituted by, for example, injection molding. The housing 3 can have a plurality of members (parts, divided bodies).
　また、本実施形態では、一例として、筐体２内には、表示装置４（表示部、ディスプレイ、パネル、表示部品）が収容されている。具体的には、使用者は、前方側から開口部２ｒを介して表示装置４の表示画面４ａを視認することができる。表示装置４は、正面視では四角形状（本実施形態では一例として長方形状）の外観を呈している。また、表示装置４は、前後方向に薄い偏平な直方体状に構成されている。表示装置４は、例えば、液晶ディスプレイ（ＬＣＤ，liquid　crystal　display）や、有機ＥＬディスプレイ（ＯＥＬＤ，organic　electro-luminescent　display）等である。また、表示装置４は、フレキシブルディスプレイであってもよい。 In this embodiment, as an example, a display device 4 (display unit, display, panel, display component) is accommodated in the housing 2. Specifically, the user can visually recognize the display screen 4a of the display device 4 from the front side through the opening 2r. The display device 4 has a quadrangular appearance (in the present embodiment, a rectangular shape as an example) when viewed from the front. Further, the display device 4 is configured in a flat rectangular parallelepiped shape that is thin in the front-rear direction. The display device 4 is, for example, a liquid crystal display (LCD, liquid crystal display), an organic EL display (OELD, organic electro-luminescent display), or the like. The display device 4 may be a flexible display.
　また、本実施形態では、一例として、表示装置４の前側（表側、壁部２ｋ側）には、透明な比較的薄い四角形状の入力操作パネル５（タッチパネル、タッチセンサ、操作面、入力操作部、入力受付部）が設けられている。入力操作パネル５は、表示画面４ａを覆っている。操作者（ユーザ等）は、例えば手指やスタイラス等によって、入力操作パネル５に対して、触れる、押す、擦る、あるいは入力操作パネル５の近傍で動かす等の操作を行うことで、入力処理を実行することができる。また、表示装置４の表示画面４ａから出た光は、入力操作パネル５を通過して壁部２ｋの開口部２ｒから筐体２の前方（外方）へ出る。入力操作パネル５は、入力部の一例である。また、本実施形態では、一例として、表示装置４および入力操作パネル５は、筐体２に、例えば、結合具（結合部品、固定部品、例えば、ねじ、金具、部品等、図示されず）や接着部（例えば接着剤や両面テープ等、図示されず）を介して固定される（支持される）。なお、入力操作パネル５は、表示装置４内に含まれたインセルタッチパネルとして構成されてもよい。 In the present embodiment, as an example, a transparent and relatively thin rectangular input operation panel 5 (touch panel, touch sensor, operation surface, input operation unit) is provided on the front side (front side, wall 2k side) of the display device 4. , An input receiving unit) is provided. The input operation panel 5 covers the display screen 4a. An operator (such as a user) executes input processing by performing operations such as touching, pushing, rubbing, or moving near the input operation panel 5 with the finger or stylus, for example. can do. The light emitted from the display screen 4a of the display device 4 passes through the input operation panel 5 and exits from the opening 2r of the wall 2k to the front (outward) of the housing 2. The input operation panel 5 is an example of an input unit. In the present embodiment, as an example, the display device 4 and the input operation panel 5 are connected to the housing 2 by, for example, a coupler (a coupling component, a fixing component, for example, a screw, a fitting, a component, etc., not shown) It is fixed (supported) via an adhesive part (for example, an adhesive, a double-sided tape, etc., not shown). Note that the input operation panel 5 may be configured as an in-cell touch panel included in the display device 4.
　一方、本実施形態では、一例として、図１に示されるように、筐体３は、正面視および背面視では四角形状（本実施形態では、一例として横に長い長方形状）の外観を呈している。また、図１に示されるように、筐体３は、前後方向（筐体３の厚さ方向）に薄い偏平な直方体状に構成されている。筐体３は、面３ａ（上面、天面、面部）とその反対側の面３ｂ（下面、底面、面部）と、面３ａと面３ｂとの間に亘る面３ｐ（側面、面部）と、を有する。面３ａおよび面３ｂはいずれも、厚さ方向と交叉している。面３ａと面３ｂとは略平行である。また、面３ａ，３ｂと面３ｐとは、交叉している（本実施形態では、一例として直交している）。また、筐体３は、正面視では、四つの端部３ｃ～３ｆ（辺部、縁部、周縁部）と、四つの角部３ｇ～３ｊと（尖部、曲部、端部）、を有する。端部３ｃ，３ｅは、長辺部の一例である。端部３ｄ，３ｆは、短辺部の一例である。 On the other hand, in the present embodiment, as an example, as shown in FIG. 1, the housing 3 has a rectangular appearance in the front view and the rear view (in the present embodiment, a rectangular shape that is long horizontally as an example). Yes. Further, as shown in FIG. 1, the housing 3 is configured in a flat rectangular parallelepiped shape that is thin in the front-rear direction (the thickness direction of the housing 3). The housing 3 includes a surface 3a (upper surface, top surface, surface portion), a surface 3b (lower surface, bottom surface, surface portion) on the opposite side, and a surface 3p (side surface, surface portion) extending between the surface 3a and the surface 3b. Have Both the surface 3a and the surface 3b intersect with the thickness direction. The surface 3a and the surface 3b are substantially parallel. Further, the surfaces 3a, 3b and the surface 3p intersect (in the present embodiment, they are orthogonal as an example). Further, the housing 3 has four end portions 3c to 3f (side portions, edge portions, and peripheral edge portions) and four corner portions 3g to 3j (pointed portions, curved portions, end portions) in a front view. Have. The end portions 3c and 3e are examples of long side portions. The ends 3d and 3f are examples of short sides.
　また、筐体３は、壁部３ｋ（部分、プレート、前壁部、表壁部、天壁部、第一の壁部）と、壁部３ｍ（部分、プレート、後壁部、裏壁部、底壁部、第二の壁部）と、壁部３ｎ（部分、プレート、側壁部、端壁部、立壁部、亘部、第三の壁部）と、を有する。壁部３ｋは、面３ａを有する。壁部３ｍは、面３ｂを有する。壁部３ｎは、面３ｐを有する。壁部３ｋ，３ｍ，３ｎは、いずれも四角形状（本実施形態では、一例として長方形状）である。また、壁部３ｋ，３ｍ，３ｎは、いずれも板状である。壁部３ｋには、四角形状の開口部３ｒが設けられている。筐体３は、例えば、金属材料や合成樹脂材料等で構成されうる。金属材料は、例えば、鋳造や、プレス、切削等で構成することができる。合成樹脂材料は、例えば、射出成形等で構成することができる。なお、筐体３は、複数の部材（部品、分割体）を有することができる。 The housing 3 includes a wall portion 3k (part, plate, front wall portion, front wall portion, top wall portion, first wall portion) and wall portion 3m (part, plate, rear wall portion, back wall portion). , Bottom wall portion, second wall portion) and wall portion 3n (part, plate, side wall portion, end wall portion, standing wall portion, span portion, third wall portion). The wall 3k has a surface 3a. The wall 3m has a surface 3b. The wall 3n has a surface 3p. The wall portions 3k, 3m, and 3n are all quadrangular (in the present embodiment, rectangular as an example). Moreover, all the wall parts 3k, 3m, and 3n are plate shape. The wall 3k is provided with a quadrangular opening 3r. The housing 3 can be made of, for example, a metal material or a synthetic resin material. A metal material can be comprised by casting, a press, cutting, etc., for example. The synthetic resin material can be constituted by, for example, injection molding. The housing 3 can have a plurality of members (parts, divided bodies).
　そして、本実施形態では、一例として、筐体３内には、一つ以上の回路基板１０（基板、部品、電気部品、基板アセンブリ）が収容されている。回路基板１０は、キーボード６と平行に設けられている。回路基板１０は、筐体３に、結合具（図示されず）によって固定されている。 In this embodiment, as an example, one or more circuit boards 10 (boards, components, electrical components, board assemblies) are accommodated in the housing 3. The circuit board 10 is provided in parallel with the keyboard 6. The circuit board 10 is fixed to the housing 3 by a coupler (not shown).
　また、本実施形態では、一例として、回路基板１０には、例えば、ＣＰＵ（central　processing　unit）や、グラフィックコントローラ、電源回路部品、ＰＣＨ（platform　controller　hub）、メモリスロットコネクタ、ＬＣＤコネクタ、Ｉ／Ｏ（input/output）コネクタ、電源コイル、素子、コネクタ等の複数の部品２０（電子部品、半導体電子部品、電気部品、パッケージ、図２参照）を実装することができる。また、回路基板１０に構成される制御回路（図示されず）は、例えば、映像信号処理回路や、チューナ部、ＨＤＭＩ（high-definition　multimedia　interface）信号処理部、ＡＶ（audio　video）入力端子、リモコン信号受信部、制御部、セレクタ、オンスクリーンディスプレイインタフェース、記憶部（例えば、ＲＯＭ（read　only　memory）、ＲＡＭ（random　access　memory）、ＨＤＤ（hard　disk　drive）、ＳＳＤ（solid　state　drive）等）、音声信号処理回路等を、含むことができる。制御回路は、表示装置４の表示画面４ａでの映像（動画や静止画等）の出力や、スピーカ（図示されず）での音声の出力、ＬＥＤ（light　emitting　diode、図示されず）での発光等を制御する。表示装置４や、スピーカ、ＬＥＤ等は、出力部の一例である。 In the present embodiment, as an example, the circuit board 10 includes, for example, a CPU (central processing unit), a graphic controller, a power circuit component, a PCH (platform controller hub), a memory slot connector, an LCD connector, and an I / O. A plurality of components 20 (electronic components, semiconductor electronic components, electrical components, packages, see FIG. 2) such as (input / output) connectors, power supply coils, elements, and connectors can be mounted. A control circuit (not shown) configured on the circuit board 10 includes, for example, a video signal processing circuit, a tuner unit, an HDMI (high-definition multimedia interface) signal processing unit, an AV (audio video) input terminal, a remote controller Signal receiving unit, control unit, selector, on-screen display interface, storage unit (for example, ROM (read only memory), RAM (random access memory), HDD (hard disk drive), SSD (solid state drive), etc.), audio A signal processing circuit or the like can be included. The control circuit outputs video (moving images, still images, etc.) on the display screen 4a of the display device 4, outputs sound from a speaker (not shown), and emits light from an LED (light emitting diode, not shown). Control etc. The display device 4, the speaker, the LED, and the like are examples of the output unit.
　本実施形態では、一例として、図２に示されるように、部品２０は、回路基板１０の面１０ａに表面実装されている。部品２０は、回路基板１０の面１０ａとは反対側の面１０ｂに実装されることもできる。部品２０は、回路基板２１（第二の回路基板）と、素子２２と、覆部２３と、接続部２４と、を有する。また、本実施形態では、一例として、部品２０は、ＢＧＡ（ball　grid　array）やＣＳＰ（chip　size　package）等である。 In this embodiment, as an example, as shown in FIG. 2, the component 20 is surface-mounted on the surface 10 a of the circuit board 10. The component 20 can also be mounted on the surface 10 b opposite to the surface 10 a of the circuit board 10. The component 20 includes a circuit board 21 (second circuit board), an element 22, a cover part 23, and a connection part 24. In the present embodiment, as an example, the component 20 is a BGA (ball grid array), a CSP (chip size package), or the like.
　回路基板２１（インターポーザ、サブストレート、パッケージ基板、第二の回路基板）は、面２１ａ（第二の面）とその反対側の面２１ｂとを有する。回路基板２１は、一例としては、絶縁性を有した合成樹脂材料や、セラミック等で構成されうる。回路基板２１の面２１ａ，２１ｂあるいは内部には、導体部（導体パターン、配線層、図示されず）が含まれている。回路基板２１は、ビルドアップ基板や、コアレス基板等であることができる。また、回路基板２１は、リジッド基板や、フレキシブル基板等であることができる。また、回路基板２１には、スルーホールや、ビア、貫通電極等が設けられうる。 The circuit board 21 (interposer, substrate, package board, second circuit board) has a surface 21a (second surface) and a surface 21b on the opposite side. For example, the circuit board 21 may be made of a synthetic resin material having insulation properties, ceramic, or the like. A conductor portion (conductor pattern, wiring layer, not shown) is included in the surfaces 21a, 21b or the inside of the circuit board 21. The circuit board 21 can be a build-up board, a coreless board, or the like. The circuit board 21 can be a rigid board, a flexible board, or the like. Further, the circuit board 21 can be provided with through holes, vias, through electrodes, and the like.
　素子２２（ダイ）は、本実施形態では、一例として、面２１ａに実装されている。素子２２（の導体部、図示されず）と、回路基板２１（の導体部、図示されず）とは、ワイヤ（ボンディングワイヤ）や、バンプ、導電性ペースト、メッキ層等の導体部を介して機械的かつ電気的に接続される。 In the present embodiment, the element 22 (die) is mounted on the surface 21a as an example. The element 22 (the conductor portion thereof, not shown) and the circuit board 21 (the conductor portion thereof, not shown) are connected via a conductor portion such as a wire (bonding wire), a bump, a conductive paste, or a plating layer. Connected mechanically and electrically.
　覆部２３（封止材）は、本実施形態では、一例として、回路基板２１（の面２１ａ）ならびに素子２２を覆っている。覆部２３は、一例としては、絶縁性を有した合成樹脂材料で構成されうる。覆部２３は、素子２２の保護や絶縁の役割を担う。 In this embodiment, the cover part 23 (sealing material) covers the circuit board 21 (the surface 21a) and the element 22 as an example. For example, the cover portion 23 can be made of a synthetic resin material having insulation properties. The cover 23 serves to protect and insulate the element 22.
　回路基板２１の導体部（図示されず）と、回路基板１０の導体部（図示されず）とは、接続部２４（ソルダボール、はんだボール、バンプ、接合部）を介して電気的かつ機械的に接続される。素子２２の導体部と、回路基板１０の導体部とは、素子２２と回路基板２１との間に介在する導体部（図示されず）と、回路基板２１内の導体部（図示されず）と、接続部２４とを介して、電気的に接続されている。接続部２４は、一例としては、リフロー処理によって溶融された後に冷却されることによって、導体部同士を接合する。 The conductor part (not shown) of the circuit board 21 and the conductor part (not shown) of the circuit board 10 are electrically and mechanically connected via a connection part 24 (solder balls, solder balls, bumps, joints). Connected to. The conductor part of the element 22 and the conductor part of the circuit board 10 are a conductor part (not shown) interposed between the element 22 and the circuit board 21, and a conductor part (not shown) in the circuit board 21. Are electrically connected to each other through the connecting portion 24. For example, the connecting portion 24 is cooled after being melted by a reflow process, thereby joining the conductor portions.
　また、回路基板１０と部品２０（回路基板２１）との間の、接続部２４を除く領域は、アンダーフィル２５で充填されている。アンダーフィル２５は、絶縁性を有した合成樹脂材料で構成されうる。なお、アンダーフィル２５を用いない構成もある。 Further, an area between the circuit board 10 and the component 20 (circuit board 21) except for the connection portion 24 is filled with an underfill 25. The underfill 25 can be made of a synthetic resin material having insulating properties. There is a configuration in which the underfill 25 is not used.
　また、本実施形態では、一例として、図３に示されるように、部品２０は、回路基板１０の厚さ方向からの視線（面１０ａの法線方向からの視線、図３の視線、図２の上方からの視線、面１０ａおよび面２０ａに対する平面視）で四角形状（本実施形態では、一例として正方形状）の外観を呈している。すなわち、部品２０は、回路基板１０の厚さ方向に薄い扁平な直方体状に構成されている。部品２０（覆部２３）は、回路基板１０とは反対側で回路基板１０の面１０ａと平行な面２０ａ（平面）と、四つの辺部２０ｂ～２０ｅ（端部）と、四つの角部２０ｆ～２０ｉと、を有している。本実施形態では、一例として、辺部２０ｂ～２０ｅならびに角部２０ｆ～２０ｉが、部品２０の周縁部２０ｊである。 In the present embodiment, as an example, as shown in FIG. 3, the component 20 has a line of sight from the thickness direction of the circuit board 10 (line of sight from the normal direction of the surface 10 a, line of sight of FIG. 3, FIG. 2). In the shape of a square (in this embodiment, a square shape as an example) with a line of sight from above, a plan view with respect to the surface 10a and the surface 20a). That is, the component 20 is configured in a flat rectangular parallelepiped shape that is thin in the thickness direction of the circuit board 10. The component 20 (cover 23) includes a surface 20a (plane) parallel to the surface 10a of the circuit board 10 on the side opposite to the circuit board 10, four sides 20b to 20e (ends), and four corners. 20f to 20i. In this embodiment, as an example, the side portions 20 b to 20 e and the corner portions 20 f to 20 i are the peripheral portion 20 j of the component 20.
　部品２０には、例えば、リフロー処理時の加熱等によって、反り（変形）が生じることがある。この反りは、一例としては、異なる材質の線膨張係数の差等によって生じる。また、部品２０は、回路基板１０側に凸となる状態（姿勢）に反る場合や、回路基板１０とは反対側に凸となる状態に反る場合がある。いずれの場合も、部品２０に反りが生じると、局所的あるいは全体的に、接続部２４の接合の信頼性が低下しやすい。本実施形態では、一例として、図３，４に示されるように、部品２０の面２０ａの周縁部２０ｊに、凹部２６が、回路基板１０の厚さ方向の視線で線状（本実施形態では、一例として曲線状）に設けられている。具体的には、覆部２３の面２０ａに、線状に延びた凹部２６（凹溝、開口部）が設けられている。このような凹部２６が設けられた構成では、凹部２６が設けられていない構成に比べて反りが小さくなる場合がある。仮に、凹部２６が設けられていない部品２０に回路基板１０側に凸となる反りが生じた場合、その反り（変形）に伴う変位量（変形量、例えば、回路基板１０の面１０ａからの距離）は、例えば、部品２０の中心Ｃ（幾何学上の重心）から周縁部２０ｊへ向かうほど大きくなり、周縁部２０ｊで最大となる。本実施形態の構成では、そのような反りが生じる状況下にあっても、凹部２６が設けられていることにより、一例としては、凹部２６より中心Ｃ側（内側）では変位量を比較的小さく抑制できる場合がある。すなわち、本実施形態によれば、一例としては、凹部２６が設けられない部品２０に比べて、反りを小さくできる場合がある。また、一般に、部品２０の反りは、周縁部２０ｊに近いほど大きい。この点、本実施形態によれば、凹部２６が部品２０の周縁部２０ｊに設けられているため、一例としては、より効果的に反り（変形）が抑制されやすい。なお、凹部２６は、一例としては、ダイシングカッター（ダイシングソー）を用いて（ダイシングによって）、比較的容易に設けることができる。また、別の一例としては、凹部２６が設けられた状態に覆部２３（部品２０）を成形することができる。また、図４に示されるように、本実施形態では、一例として、凹部２６は、Ｖ字状の断面形状を有している。 The part 20 may be warped (deformed) due to, for example, heating during the reflow process. As an example, this warp is caused by a difference in linear expansion coefficient between different materials. Further, the component 20 may be warped in a state of being convex toward the circuit board 10 (posture), or may be warped in a state of being convex toward the side opposite to the circuit board 10. In any case, when the component 20 is warped, the reliability of the joint of the connection portion 24 is likely to be lowered locally or entirely. In this embodiment, as an example, as shown in FIGS. 3 and 4, the recess 26 is linear in the peripheral direction 20 j of the surface 20 a of the component 20 in the line of sight in the thickness direction of the circuit board 10 (in this embodiment, For example, a curved shape). Specifically, a concave portion 26 (concave groove, opening) extending linearly is provided on the surface 20 a of the cover portion 23. In such a configuration in which the concave portion 26 is provided, warpage may be smaller than in a configuration in which the concave portion 26 is not provided. If a warp that protrudes toward the circuit board 10 occurs in the component 20 that is not provided with the recess 26, a displacement amount (deformation amount, for example, a distance from the surface 10a of the circuit board 10) accompanying the warp (deformation) occurs. ) Increases, for example, from the center C (geometric center of gravity) of the component 20 toward the peripheral portion 20j, and is maximum at the peripheral portion 20j. In the configuration of the present embodiment, even when the warp is generated, the amount of displacement is relatively small on the center C side (inside) from the recess 26 because the recess 26 is provided. In some cases, it can be suppressed. That is, according to the present embodiment, as an example, there is a case where warpage can be reduced as compared with the component 20 in which the recess 26 is not provided. In general, the warpage of the component 20 is larger as it is closer to the peripheral edge portion 20j. In this regard, according to the present embodiment, since the concave portion 26 is provided in the peripheral edge portion 20j of the component 20, as an example, warping (deformation) can be more effectively suppressed. In addition, the recessed part 26 can be provided comparatively easily, for example using a dicing cutter (dicing saw) (by dicing). Moreover, as another example, the cover part 23 (component 20) can be shape | molded in the state in which the recessed part 26 was provided. As shown in FIG. 4, in the present embodiment, as an example, the recess 26 has a V-shaped cross-sectional shape.
　また、本実施形態では、一例として、凹部２６は、四つの角部２０ｆ～２０ｉのそれぞれに設けられている。具体的に、凹部２６は、角部２０ｆに隣接した二つの辺部２０ｂ，２０ｃ間、角部２０ｇに隣接した二つの辺部２０ｃ，２０ｄ間、角部２０ｈに隣接した二つの辺部２０ｄ，２０ｅ間、ならびに角部２０ｉに隣接した二つの辺部２０ｅ，２０ｂ間のそれぞれに亘って、設けられている。このような構成により、一例としては、凹部２６が周縁部２０ｊの全周に沿って設けられた構成に比べて、凹部２６を形成する手間やコストが減りやすい。また、一般に、部品２０の反りは、角部２０ｆ～２０ｉに近いほど大きい。よって、本実施形態によれば、一例としては、より効果的に反り（変形）が抑制されやすい。また、角部２０ｆ～２０ｉには、素子２２は配置されない。よって、本実施形態によれば、一例としては、凹部２６による素子２２への影響をより小さくできる場合がある。 In the present embodiment, as an example, the recess 26 is provided in each of the four corners 20f to 20i. Specifically, the concave portion 26 includes two side portions 20b and 20c adjacent to the corner portion 20f, two side portions 20c and 20d adjacent to the corner portion 20g, and two side portions 20d adjacent to the corner portion 20h. 20e and between the two side portions 20e and 20b adjacent to the corner portion 20i. With such a configuration, as an example, compared with a configuration in which the concave portion 26 is provided along the entire circumference of the peripheral edge portion 20j, labor and cost for forming the concave portion 26 are easily reduced. In general, the warpage of the component 20 is larger as it is closer to the corners 20f to 20i. Therefore, according to the present embodiment, as an example, warping (deformation) can be more effectively suppressed. Further, the element 22 is not disposed in the corner portions 20f to 20i. Therefore, according to the present embodiment, as an example, the influence of the recess 26 on the element 22 may be made smaller.
　また、本実施形態では、一例として、それぞれの角部２０ｆ～２０ｉに対応して、複数（本実施形態では、一例として二つ）の凹部２６が、略一定の間隔をあけて並列に設けられている。具体的に、凹部２６は、回路基板１０の厚さ方向からの視線でその中心が部品２０の中心Ｃである同心円状に、多重に設けられている。すなわち、複数の凹部２６が、角部２０ｆ～２０ｉで、円弧状（曲線状）かつ同心円状に設けられている。本実施形態によれば、一例としては、凹部２６が一重に設けられた構成に比べて、より反り（変形）が抑制されやすい場合がある。また、凹部２６が曲線状（円弧状）に設けられている分、一例としては、変位量の位置によるばらつきが抑制されやすい場合がある。 In the present embodiment, as an example, a plurality of (in the present embodiment, two as an example) concave portions 26 are provided in parallel at substantially constant intervals corresponding to the respective corner portions 20f to 20i. ing. Specifically, the recesses 26 are provided in a plurality of concentric circles whose centers are the center C of the component 20 as viewed from the thickness direction of the circuit board 10. In other words, the plurality of recesses 26 are provided in a circular arc shape (curved shape) and concentric circles at the corner portions 20f to 20i. According to the present embodiment, as an example, there is a case where warpage (deformation) is more easily suppressed as compared with a configuration in which the concave portions 26 are provided in a single layer. Further, as an example, the variation due to the position of the displacement amount may be easily suppressed because the concave portion 26 is provided in a curved shape (arc shape).
　以上、説明したように、本実施形態では、一例として、部品２０（半導体電子部品）の、回路基板１０の厚さ方向からの視線での周縁部２０ｊに、凹部２６が設けられる。よって、本実施形態によれば、一例としては、凹部２６が設けられない部品２０に比べて、反りをより小さくできる場合がある。また、周縁部２０ｊは変位量が比較的大きいため、一例としては、より効果的に反り（変形）が抑制されやすい。 As described above, in the present embodiment, as an example, the concave portion 26 is provided in the peripheral portion 20j of the component 20 (semiconductor electronic component) as viewed from the thickness direction of the circuit board 10. Therefore, according to the present embodiment, as an example, there is a case where warpage can be further reduced as compared with the component 20 in which the recess 26 is not provided. In addition, since the peripheral portion 20j has a relatively large amount of displacement, as an example, warping (deformation) can be more effectively suppressed.
　また、本実施形態では、一例として、凹部２６の少なくとも一部は、部品２０（半導体電子部品）の覆部２３に設けられる。よって、本実施形態によれば、一例としては、凹部２６が部品２０に比較的容易に設けられうる。 In the present embodiment, as an example, at least a part of the recess 26 is provided on the cover 23 of the component 20 (semiconductor electronic component). Therefore, according to the present embodiment, as an example, the recess 26 can be provided in the component 20 relatively easily.
　また、本実施形態では、一例として、凹部２６の少なくとも一部は、部品２０（半導体電子部品）の角部２０ｆ～２０ｉに設けられる。角部２０ｆ～２０ｉは変位量が比較的大きいため、本実施形態によれば、一例としては、より一層効果的に反り（変形）が抑制されやすい。 In the present embodiment, as an example, at least a part of the recess 26 is provided in the corners 20f to 20i of the component 20 (semiconductor electronic component). Since the corner portions 20f to 20i have a relatively large amount of displacement, according to the present embodiment, as an example, warping (deformation) can be more effectively suppressed.
　また、本実施形態では、一例として、凹部２６は、二つの辺部間に亘って設けられる。よって、本実施形態によれば、一例としては、凹部２６が周縁部２０ｊの全周に沿って設けられた構成に比べて、凹部２６を形成する手間やコストが減りやすい。 Further, in the present embodiment, as an example, the recess 26 is provided between two sides. Therefore, according to the present embodiment, as an example, compared with a configuration in which the concave portion 26 is provided along the entire circumference of the peripheral edge portion 20j, labor and cost for forming the concave portion 26 are easily reduced.
　また、本実施形態では、一例として、凹部２６は、回路基板１０の厚さ方向からの視線で多重に設けられる。よって、本実施形態によれば、一例としては、凹部２６が一重に設けられた構成に比べて、より反り（変形）が抑制されやすい。 Further, in the present embodiment, as an example, the recesses 26 are provided in multiples with a line of sight from the thickness direction of the circuit board 10. Therefore, according to the present embodiment, as an example, warpage (deformation) is more easily suppressed as compared to a configuration in which the concave portions 26 are provided in a single layer.
＜第１変形例＞
　図５に示される変形例にかかる電子機器１Ａは、上記電子機器１と同様の構成を備えている。よって、本変形例によっても、同様の構成に基づく同様の効果が得られる。図５に示される部位（構成）は、上記実施形態に示される対応する部位（構成）に置き換えることができる。 <First Modification>
An electronic apparatus 1 </ b> A according to the modification shown in FIG. 5 has the same configuration as that of the electronic apparatus 1. Therefore, the same effect based on the same configuration can be obtained also in this modification. The part (configuration) shown in FIG. 5 can be replaced with the corresponding part (configuration) shown in the above embodiment.
　本変形例では、一例として、図５に示されるように、部品２０Ａの凹部２６の形状が上記実施形態とは相違している。具体的には、本変形例では、凹部２６は、周縁部２０ｊの全周に亘って設けられる。各凹部２６は、四つの辺部２０ｂ～２０ｅのいずれかに沿っている。凹部２６は、各辺部２０ｂ～２０ｅと平行に設けられている。このような構成によっても、上記実施形態と同様の結果（効果）が得られる。本変形例によれば、部品２０Ａのスペック（例えば、形状や材質等）や環境条件（例えば、リフロー温度や時間等）等によっては、上記実施形態よりも良好な結果（効果）が得られる場合もある。 In this modification, as an example, as shown in FIG. 5, the shape of the recess 26 of the component 20 </ b> A is different from that of the above embodiment. Specifically, in this modification, the recess 26 is provided over the entire circumference of the peripheral edge 20j. Each recess 26 is along one of the four side portions 20b to 20e. The concave portion 26 is provided in parallel with the side portions 20b to 20e. Even with such a configuration, the same result (effect) as in the above-described embodiment can be obtained. According to this modification, a better result (effect) than the above embodiment can be obtained depending on the specifications (for example, shape, material, etc.) of the component 20A, environmental conditions (for example, reflow temperature, time, etc.), etc. There is also.
＜第２変形例＞
　図６に示される変形例にかかる電子機器１Ｂは、上記電子機器１，１Ａと同様の構成を備えている。よって、本変形例によっても、同様の構成に基づく同様の効果が得られる。図６に示される部位（構成）は、上記実施形態や変形例に示される対応する部位（構成）に置き換えることができる。 <Second Modification>
An electronic device 1B according to the modification shown in FIG. 6 has the same configuration as the electronic devices 1 and 1A. Therefore, the same effect based on the same configuration can be obtained also in this modification. The part (configuration) shown in FIG. 6 can be replaced with the corresponding part (configuration) shown in the above-described embodiment or modification.
　本変形例では、一例として、図６に示されるように、部品２０Ｂの凹部２６の形状が上記実施形態や変形例とは相違している。具体的には、本変形例では、四つの角部２０ｆ～２０ｉのそれぞれに多重（本変形例では、一例として二重）に設けられた凹部２６が、回路基板１０の厚さ方向からの視線で、直線状に延びている。各凹部２６は、各辺部２０ｂ～２０ｅと、４５°の角度で交叉している。このような構成によっても、上記実施形態や変形例と同様の結果（効果）が得られる。本変形例によれば、部品２０Ｂのスペック（例えば、形状や材質等）や環境条件（例えば、リフロー温度や時間等）等によっては、上記実施形態や変形例よりも良好な結果（効果）が得られる場合もある。 In the present modification, as an example, as shown in FIG. 6, the shape of the recess 26 of the component 20 </ b> B is different from the above-described embodiment and modification. Specifically, in the present modification, the concave portions 26 provided in multiples (double as an example in the present modification) at each of the four corners 20f to 20i are line-of-sight from the thickness direction of the circuit board 10. And it extends linearly. Each recess 26 intersects each side 20b to 20e at an angle of 45 °. Even with such a configuration, the same results (effects) as those of the above-described embodiment and modification can be obtained. According to this modification, depending on the specifications (for example, shape, material, etc.) of the component 20B, environmental conditions (for example, reflow temperature, time, etc.), etc., better results (effects) than those in the above-described embodiments and modifications are obtained. In some cases.
＜第３変形例＞
　図７に示される変形例にかかる電子機器１Ｃは、上記電子機器１，１Ａ，１Ｂと同様の構成を備えている。よって、本変形例によっても、同様の構成に基づく同様の効果が得られる。図７に示される部位（構成）は、上記実施形態や変形例に示される対応する部位（構成）に置き換えることができる。 <Third Modification>
The electronic device 1C according to the modification shown in FIG. 7 has the same configuration as the electronic devices 1, 1A, 1B. Therefore, the same effect based on the same configuration can be obtained also in this modification. The part (configuration) shown in FIG. 7 can be replaced with the corresponding part (configuration) shown in the above-described embodiment or modification.
　本変形例では、一例として、図７に示されるように、部品２０Ｃの凹部２６の形状が上記実施形態や変形例とは相違している。具体的には、本変形例では、凹部２６はＵ字状の断面を有した凹溝である。このような構成によっても、上記実施形態や変形例と同様の結果（効果）が得られる。本変形例によれば、部品２０Ｃのスペック（例えば、形状や材質等）や環境条件（例えば、リフロー温度や時間等）等によっては、上記実施形態や変形例よりも良好な結果（効果）が得られる場合もある。 In the present modification, as an example, as shown in FIG. 7, the shape of the recess 26 of the component 20 </ b> C is different from the above-described embodiment and modification. Specifically, in this modification, the concave portion 26 is a concave groove having a U-shaped cross section. Even with such a configuration, the same results (effects) as those of the above-described embodiment and modification can be obtained. According to this modification, depending on the specifications (for example, shape, material, etc.) of the component 20C, environmental conditions (for example, reflow temperature, time, etc.), etc., better results (effects) than those in the above-described embodiments and modifications are obtained. In some cases.
＜第４変形例＞
　図８～１０に示される変形例にかかる電子機器１Ｄは、上記電子機器１，１Ａ～１Ｃと同様の構成を備えている。よって、本変形例によっても、同様の構成に基づく同様の効果が得られる。図８～１０に示される部位（構成）は、上記実施形態や変形例に示される対応する部位（構成）に置き換えることができる。 <Fourth Modification>
An electronic device 1D according to the modification shown in FIGS. 8 to 10 has the same configuration as the electronic devices 1 and 1A to 1C. Therefore, the same effect based on the same configuration can be obtained also in this modification. The parts (configuration) shown in FIGS. 8 to 10 can be replaced with the corresponding parts (configuration) shown in the above-described embodiments and modifications.
　本変形例では、一例として、部品２０Ｄは、覆部２３を有さず回路基板２１および素子２２が露出されたフリップチップＢＧＡである。そして、本変形例では、回路基板２１（第二の回路基板）の面２１ａ（第二の面）の周縁部２０ｊ上に、凸部２７が、回路基板１０の厚さ方向の視線で線状（本変形例では、一例として曲線状）に設けられている。具体的には、回路基板２１の面２１ａに、線状に延びた凸部２７（壁部、突起、凸条）が設けられている。凸部２７は、回路基板１０の厚さ方向の視線で、素子２２の周囲に位置されている。このような凸部２７が設けられた構成では、凸部２７が設けられていない構成に比べて反りが小さくなる場合がある。凸部２７は、一例としては、合成樹脂材料等で構成されることができる。凸部２７は、例えば、回路基板２１の面２１ａ上に成形することができるし、面２１ａ上に接着等によって設けることもできる。このような構成によっても、上記実施形態や変形例と同様の結果（効果）が得られる。本変形例によれば、部品２０Ｄのスペック（例えば、形状や材質等）や環境条件（例えば、リフロー温度や時間等）等によっては、上記実施形態や変形例よりも良好な結果（効果）が得られる場合もある。 In this modification, as an example, the component 20D is a flip chip BGA that does not have the cover 23 and the circuit board 21 and the element 22 are exposed. And in this modification, the convex part 27 is linear with the visual line of the thickness direction of the circuit board 10 on the peripheral part 20j of the surface 21a (second surface) of the circuit board 21 (second circuit board). (In this modification, it is provided in a curved line as an example). Specifically, the surface 21a of the circuit board 21 is provided with a protruding portion 27 (wall portion, protrusion, protruding line) extending linearly. The convex portion 27 is positioned around the element 22 with a line of sight in the thickness direction of the circuit board 10. In a configuration in which such a convex portion 27 is provided, warpage may be smaller than in a configuration in which the convex portion 27 is not provided. The convex part 27 can be comprised with a synthetic resin material etc. as an example. The convex portion 27 can be formed on the surface 21a of the circuit board 21, for example, or can be provided on the surface 21a by adhesion or the like. Even with such a configuration, the same results (effects) as those of the above-described embodiment and modification can be obtained. According to this modification, depending on the specifications (for example, shape, material, etc.) of the component 20D, environmental conditions (for example, reflow temperature, time, etc.), and the like, better results (effects) than those in the above-described embodiments and modifications are obtained. In some cases.
＜第５変形例＞
　図１１に示される変形例にかかる電子機器１Ｅは、上記電子機器１，１Ａ～１Ｄと同様の構成を備えている。よって、本変形例によっても、同様の構成に基づく同様の効果が得られる。図１１に示される部位（構成）は、上記実施形態や変形例に示される対応する部位（構成）に置き換えることができる。 <Fifth Modification>
An electronic device 1E according to the modification shown in FIG. 11 has the same configuration as the electronic devices 1, 1A to 1D. Therefore, the same effect based on the same configuration can be obtained also in this modification. The part (configuration) shown in FIG. 11 can be replaced with the corresponding part (configuration) shown in the above-described embodiment or modification.
　本変形例では、一例として、部品２０Ｅは、第４変形例と同様に、覆部２３を有さず回路基板２１および素子２２が露出されたフリップチップＢＧＡである。ただし、本変形例では、回路基板２１（第二の回路基板）の面２１ａ（第二の面）の周縁部２０ｊ上に、凸部２７に替えて凹部２６が設けられている。このような構成によっても、上記実施形態や変形例と同様の結果（効果）が得られる。本変形例によれば、部品２０Ｅのスペック（例えば、形状や材質等）や環境条件（例えば、リフロー温度や時間等）等によっては、上記実施形態や変形例よりも良好な結果（効果）が得られる場合もある。 In this modification, as an example, the component 20E is a flip chip BGA that does not have the cover 23 and the circuit board 21 and the element 22 are exposed, as in the fourth modification. However, in the present modification, a concave portion 26 is provided instead of the convex portion 27 on the peripheral edge portion 20j of the surface 21a (second surface) of the circuit board 21 (second circuit board). Even with such a configuration, the same results (effects) as those of the above-described embodiment and modification can be obtained. According to this modification, depending on the specifications (for example, shape and material) of the component 20E, environmental conditions (for example, reflow temperature, time, etc.), and the like, a better result (effect) than the above-described embodiment and modification can be obtained. In some cases.
＜第６変形例＞
　図１２に示される変形例にかかる電子機器１Ｆは、上記電子機器１，１Ａ～１Ｅと同様の構成を備えている。よって、本変形例によっても、同様の構成に基づく同様の効果が得られる。図１２に示される部位（構成）は、上記実施形態や変形例に示される対応する部位（構成）に置き換えることができる。 <Sixth Modification>
An electronic device 1F according to the modification shown in FIG. 12 has the same configuration as the electronic devices 1 and 1A to 1E. Therefore, the same effect based on the same configuration can be obtained also in this modification. The site | part (structure) shown by FIG. 12 can be substituted to the corresponding site | part (structure) shown by the said embodiment and modification.
　本変形例では、一例として、部品２０Ｆの回路基板２１（第二の回路基板）の面２１ａ（第二の面）の周縁部２０ｊ上に、線状（曲線状、円弧状）に並んだ複数の凹部２６（例えば、半球状の凹部２６）が設けられている。このような構成によっても、上記実施形態や変形例と同様の結果（効果）が得られる。本変形例によれば、部品２０Ｆのスペック（例えば、形状や材質等）や環境条件（例えば、リフロー温度や時間等）等によっては、上記実施形態や変形例よりも良好な結果（効果）が得られる場合もある。なお、複数の凹部２６に替えて複数の凸部２７が設けられてもよい。 In the present modification, as an example, a plurality of lines (curved, arc-shaped) arranged on the peripheral edge portion 20j of the surface 21a (second surface) of the circuit board 21 (second circuit board) of the component 20F. Is provided with a concave portion 26 (for example, a hemispherical concave portion 26). Even with such a configuration, the same results (effects) as those of the above-described embodiment and modification can be obtained. According to this modification, a better result (effect) than the above-described embodiment and modification may be obtained depending on the specifications (for example, shape and material) of the component 20F and environmental conditions (for example, reflow temperature, time, etc.). In some cases. A plurality of convex portions 27 may be provided instead of the plurality of concave portions 26.
　以上、本発明の実施形態および変形例を例示したが、上記実施形態および変形例はあくまで一例であって、発明の範囲を限定することは意図していない。これら実施形態および変形例は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、組み合わせ、変更を行うことができる。これら実施形態および変形例は、発明の範囲や要旨に含まれるとともに、請求の範囲に記載された発明とその均等の範囲に含まれる。また実施形態と変形例との間で、構成要素を部分的に置き換えることも可能である。また、各構成要素のスペック（構造や、種類、方向、形状、大きさ、長さ、幅、厚さ、高さ、数、配置、位置、材質等）は、適宜に変更して実施することができる。また、上記実施形態や変形例にかかる発明は、図１３に示されるＱＦＮ（quad　flat　no　lead　package，ＬＬＣＣ（lead　less　chip　carrier））や、図１４に示されるＱＦＰ（quad　flat　package）など、表面実装される他のパッケージ部品（半導体電子部品）にも適用することができる。この場合、凹部２６や凸部２７は、回路基板２１や覆部２３に設けられうる。また、回路基板２１（第二の回路基板）の内部に、線状の空洞を設ける、あるいは複数の空洞を線状に配置することで、同様の結果（効果）を得ることもできる。 As mentioned above, although embodiment and the modification of this invention were illustrated, the said embodiment and modification are an example to the last, Comprising: It is not intending limiting the range of invention. These embodiments and modifications can be implemented in various other forms, and various omissions, replacements, combinations, and changes can be made without departing from the spirit of the invention. These embodiments and modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof. It is also possible to partially replace the constituent elements between the embodiment and the modification. In addition, the specifications of each component (structure, type, direction, shape, size, length, width, thickness, height, number, arrangement, position, material, etc.) should be changed as appropriate. Can do. In addition, the invention according to the above-described embodiment and the modified examples includes the surface such as the QFN (quad flat no lead package, LLCC (lead less chip carrier)) shown in FIG. 13 and the QFP (quad flat package) shown in FIG. The present invention can also be applied to other package components (semiconductor electronic components) to be mounted. In this case, the concave portion 26 and the convex portion 27 can be provided on the circuit board 21 and the cover portion 23. Moreover, the same result (effect) can also be obtained by providing a linear cavity inside the circuit board 21 (second circuit board) or arranging a plurality of cavities in a linear shape.

Claims (9)

  1. 　筐体と、
    　前記筐体内に収容され、面を有した回路基板と、
    　前記面に実装され、前記回路基板の厚さ方向からの視線での周縁部を有し、当該周縁部に凹部または凸部が線状に設けられた、半導体電子部品と、
    　を備えた、電子機器。     A housing,
    A circuit board housed in the housing and having a surface;
    A semiconductor electronic component mounted on the surface and having a peripheral edge in a line of sight from the thickness direction of the circuit board, and a concave or convex portion provided linearly on the peripheral edge;
    With electronic equipment.
  2. 　前記半導体電子部品は、素子と、少なくとも当該素子を覆う覆部と、を有し、
    　前記凹部または前記凸部の少なくとも一部は、前記覆部に設けられた、請求項１に記載の電子機器。     The semiconductor electronic component has an element and a cover that covers at least the element,
    The electronic device according to claim 1, wherein at least a part of the concave portion or the convex portion is provided in the cover portion.
  3. 　前記半導体電子部品は、第二の面を有した第二の回路基板と、前記第二の面に実装された素子と、を有し、
    　前記凹部または前記凸部の少なくとも一部は、前記第二の回路基板に設けられた、請求項１に記載の電子機器。     The semiconductor electronic component has a second circuit board having a second surface, and an element mounted on the second surface,
    The electronic device according to claim 1, wherein at least a part of the concave portion or the convex portion is provided on the second circuit board.
  4. 　前記半導体電子部品は、前記回路基板の厚さ方向からの視線での角部を有し、
    　前記凹部または前記凸部の少なくとも一部は、前記角部に設けられた、請求項１～３のうちいずれか一つに記載の電子機器。     The semiconductor electronic component has a corner portion in a line of sight from the thickness direction of the circuit board,
    The electronic device according to any one of claims 1 to 3, wherein at least a part of the concave portion or the convex portion is provided at the corner portion.
  5. 　前記半導体電子部品は、前記回路基板の厚さ方向からの視線での前記角部に隣接した二つの辺部を有し、
    　前記凹部または前記凸部は、前記二つの辺部間に亘って設けられた、請求項４に記載の電子機器。     The semiconductor electronic component has two sides adjacent to the corner in a line of sight from the thickness direction of the circuit board,
    The electronic device according to claim 4, wherein the concave portion or the convex portion is provided between the two side portions.
  6. 　前記半導体電子部品は、前記回路基板の厚さ方向からの視線での辺部を有し、
    　前記凹部または前記凸部の少なくとも一部は、前記辺部に沿って設けられた、請求項１に記載の電子機器。     The semiconductor electronic component has a side line of sight from the thickness direction of the circuit board,
    The electronic device according to claim 1, wherein at least a part of the concave portion or the convex portion is provided along the side portion.
  7. 　複数の前記凹部または前記凸部が線状に並んで配置された、請求項１に記載の電子機器。 The electronic device according to claim 1, wherein a plurality of the concave portions or the convex portions are arranged in a line.
  8. 　前記凹部または前記凸部の少なくとも一部は、前記回路基板の厚さ方向からの視線で多重に設けられた、請求項１に記載の電子機器。 2. The electronic device according to claim 1, wherein at least a part of the concave portion or the convex portion is provided in a multiple manner with a line of sight from a thickness direction of the circuit board.
  9. 　回路基板の面に実装され、前記回路基板の厚さ方向からの視線での周縁部を有し、当該周縁部に凹部または凸部が線状に設けられた、半導体電子部品。 A semiconductor electronic component that is mounted on a surface of a circuit board, has a peripheral edge in a line of sight from the thickness direction of the circuit board, and a concave or convex portion is linearly provided on the peripheral edge.
PCT/JP2013/058739 2013-02-08 2013-03-26 Electronic apparatus and semiconductor electronic component WO2014122797A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013023744A JP2014154732A (en) 2013-02-08 2013-02-08 Electronic apparatus and semiconductor electronic component
JP2013-023744 2013-02-08

Publications (1)

Publication Number Publication Date
WO2014122797A1 true WO2014122797A1 (en) 2014-08-14

Family

ID=51299408

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/058739 WO2014122797A1 (en) 2013-02-08 2013-03-26 Electronic apparatus and semiconductor electronic component

Country Status (2)

Country Link
JP (1) JP2014154732A (en)
WO (1) WO2014122797A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9841645B2 (en) 2015-04-02 2017-12-12 Himax Display, Inc. Display device
KR101714557B1 (en) * 2015-05-06 2017-03-09 하이맥스 디스플레이, 인크. Display device
JP6588780B2 (en) * 2015-09-15 2019-10-09 株式会社インベント INJECTION NOZZLE AND INJECTION DEVICE HAVING THE INJECTION NOZZLE

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002026194A (en) * 2000-07-11 2002-01-25 Rohm Co Ltd Packaging structure of electronic component
JP2002313979A (en) * 2001-04-09 2002-10-25 Sony Corp Interposer and electronic circuit device
JP2003218279A (en) * 2002-01-23 2003-07-31 Shinko Electric Ind Co Ltd Circuit board and method for manufacturing the same
JP2005057004A (en) * 2003-08-01 2005-03-03 Sanyo Electric Co Ltd Method of manufacturing hybrid integrated circuit device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002026194A (en) * 2000-07-11 2002-01-25 Rohm Co Ltd Packaging structure of electronic component
JP2002313979A (en) * 2001-04-09 2002-10-25 Sony Corp Interposer and electronic circuit device
JP2003218279A (en) * 2002-01-23 2003-07-31 Shinko Electric Ind Co Ltd Circuit board and method for manufacturing the same
JP2005057004A (en) * 2003-08-01 2005-03-03 Sanyo Electric Co Ltd Method of manufacturing hybrid integrated circuit device

Also Published As

Publication number Publication date
JP2014154732A (en) 2014-08-25

Similar Documents

Publication Publication Date Title
US9398692B2 (en) Interconnecting conduction structure for electrically connecting conductive traces of flexible circuit boards
KR102041265B1 (en) Semiconductor Package Having a EMI shielding and heat dissipation function
US8476532B2 (en) Multilayer flexible printed circuit board and electronic device
US11930587B2 (en) Flexible printed circuit board and display device
US9685425B2 (en) Integrated circuit package
WO2014122797A1 (en) Electronic apparatus and semiconductor electronic component
JP2014086920A (en) Television receiver, electronic apparatus and substrate assembly
US20130141884A1 (en) Electronic Component Structure and Electronic Device
US11997794B2 (en) Display device
JP6192974B2 (en) Television receiver and electronic device
JP5739020B1 (en) Electronics
CN101888741A (en) Printed circuit board and notebook computer
US20130321708A1 (en) Television receiver and electronic device
US9591761B2 (en) Screen control module having greater anti-warp strength of a mobile electronic device and controller thereof
US20100132991A1 (en) Electronic device, printed circuit board, and electronic component
US20150279775A1 (en) Screen control module of a mobile electronic device and controller thereof
TWI429356B (en) Electrical connector and connecting unit thereof
JP6104602B2 (en) Electronics
US9451720B2 (en) Electronic device
US8513538B2 (en) Television apparatus, electronic device, and circuit board structure
CN104853563A (en) Electronic equipment
US20130278842A1 (en) Television reception apparatus, module, and electronic apparatus
JP2014027023A (en) Electronic apparatus and attachment method of circuit board
JP2014120451A (en) Electronic apparatus, connector, and connector assembly
JP2005136380A (en) Mounting structure and semiconductor device of semiconductor part

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13874408

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13874408

Country of ref document: EP

Kind code of ref document: A1