WO2022021736A1

WO2022021736A1 - Heat dissipation structure and electronic terminal

Info

Publication number: WO2022021736A1
Application number: PCT/CN2020/135387
Authority: WO
Inventors: 宋闯
Original assignee: 深圳市大疆创新科技有限公司
Priority date: 2020-07-29
Filing date: 2020-12-10
Publication date: 2022-02-03
Also published as: CN212413687U; CN114467369A

Abstract

A heat dissipation structure (100) and an electronic terminal (1000). The heat dissipation structure (100) comprises a function component (10), a first heat-conducting layer (20), and a heat dissipation plate (30). The function component (10) comprises an electronic device (11) and a circuit board (12), the circuit board (12) comprises a first surface (121) and a second surface (122) that are opposite to one another, the electronic device (11) is disposed on at least one surface among the first surface (121) and the second surface (122), and the electronic device (11) comprises a heating device. The first heat-conducting layer (20) is disposed on the second surface (122), and the first heat-conducting layer (20) is basically attached to the second surface (122). The first heat-conducting layer (20) is connected to the heat dissipation plate (30) and the circuit board (12), and the heat dissipation plate (30) is used to enable the heat of the function component (10) that is conducted by passing through the first heat-conducting layer (20) to dissipate.

Description

Thermal Structure and Electronic Termination

priority information

This application claims the priority and rights of patent application No. 202021557993.X filed with the State Intellectual Property Office of China on July 29, 2020, and is hereby incorporated by reference in its entirety.

technical field

The present application relates to the technical field of electronic equipment, and in particular, to a heat dissipation structure and an electronic terminal.

Background technique

Currently, electronic devices are widely used to implement corresponding functions, for example, electronic devices may include image sensors for imaging, memory for storage, processors for signal processing, and the like. When the electronic device is working, it usually generates heat. If the heat is not dissipated in time, it will have an adverse effect on the normal operation of the electronic device. For example, high temperature will affect the imaging quality of the image sensor, and will also cause the problem that the solder joints between the image sensor and the printed circuit board fall off, affecting the normal use of electronic devices.

SUMMARY OF THE INVENTION

Embodiments of the present application disclose a heat dissipation structure and an electronic terminal.

The heat dissipation structure of the embodiment of the present application includes a functional component, a first thermal conductive layer, and a heat dissipation plate; the functional component includes an electronic device and a circuit board, and the circuit board includes a first surface and a second surface opposite to each other, and the electronic device provided on at least one of the first surface and the second surface, the electronic device includes a heating device; the first thermal conductive layer is provided on the second surface, and the first thermal conductive layer and the second thermal conductive layer are arranged on the second surface. The surfaces are substantially attached; the first heat conducting layer connects the heat dissipation plate and the circuit board, and the heat dissipation plate is used to dissipate the heat of the functional components conducted through the first heat conducting layer.

In the above heat dissipation structure, the heat of the functional components can be transferred to the heat dissipation plate through the first heat conduction layer, and the heat dissipation plate dissipates the heat to the outside of the heat dissipation structure, so that the heat of the functional components can be effectively dissipated, and the normal use of the functional components is ensured.

The electronic terminal of the embodiments of the present application includes a body and the heat dissipation structure described in the above embodiments, and the heat dissipation structure is installed on the body.

In the electronic terminal with the above-mentioned heat dissipation structure, the heat of the functional components can be radiated to the heat dissipation plate through the first heat conduction layer, and the heat dissipation plate can then dissipate the heat to the outside of the heat dissipation structure, so that the heat of the functional components can be effectively dissipated to ensure that normal use of functional components.

Additional aspects and advantages of the present application will be set forth, in part, from the following description, and in part will become apparent from the following description, or may be learned by practice of the present application.

Description of drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, wherein:

1 is an exploded schematic view of a heat dissipation structure according to an embodiment of the present application;

2 is a schematic structural diagram of a circuit board and an image sensor according to an embodiment of the present application;

3 is a side view of a heat dissipation structure according to an embodiment of the present application;

FIG. 4 is a schematic perspective view of an electronic terminal according to an embodiment of the present application.

Description of main component symbols:

Heat dissipation structure 100 , functional component 10 , electronic device 11 , image sensor 111 , circuit board 12 , first surface 121 , second surface 122 , positioning hole 123 , first thermal conductive layer 20 , heat dissipation plate 30 , surface 32 , bracket assembly 40 , the first end cap 41, the end cap opening 411, the electrical connection seat 412, the end cap contact point 413, the second end cap 42, the mounting post 43, the fastener 44, the elastic piece 45, the first connection line 46, the second connecting wire 47, positioning member 49, filter 50, first sealing member 60, second sealing member 70, receiving groove 701;

Electronic terminal 1000 , body 300 .

detailed description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, only used to explain the present application, and should not be construed as a limitation on the present application.

In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relation. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

In this application, unless otherwise expressly specified and defined, a first feature "on" or "under" a second feature may include direct contact between the first and second features, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the application. Furthermore, this application may repeat reference numerals and/or reference letters in different instances for the purpose of simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, this application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

Embodiments of the present application provide a heat dissipation structure, which is applied to the heat dissipation of an image sensor, such as the heat dissipation of an image sensor of a camera, a photographing device, or the like. The heat dissipation structure of the embodiment of the present application can also be applied to the heat dissipation of components such as memories and processors, for example, it is applied to double-rate synchronous dynamic random access memory (Double Data Rate SDRAM, DDR SDRAM), Digital Signal Processing (Digital Signal Processing, DSP) ) and other components to dissipate heat.

Referring to FIGS. 1-3 , an embodiment of the present application provides a heat dissipation structure 100 . The heat dissipation structure 100 includes a functional component 10 , a first thermal conductive layer 20 and a heat dissipation plate 30 . The functional assembly 10 includes an electronic device 11 and a circuit board 12, the circuit board 12 includes a first surface 121 and a second surface 122 opposite to each other, the electronic device 11 is arranged on at least one side of the first surface 121 and the second surface 122, and the electronic device 11 Including heat generating devices. The first heat-conducting layer 20 is disposed on the second surface 122 , and the first heat-conducting layer 20 is substantially adhered to the second surface 122 . The first heat-conducting layer 20 connects the heat-dissipating plate 30 and the circuit board 12 , and the heat-dissipating plate 30 is used to dissipate the heat of the functional components 10 conducted through the first heat-conducting layer 20 .

In the above heat dissipation structure 100, the heat of the functional components 10 can be transferred to the heat dissipation plate 30 through the first heat conduction layer 20, and the heat dissipation plate 30 dissipates the heat to the outside of the heat dissipation structure 100, so that the heat of the functional components 10 can be effectively dissipated, ensuring that Normal use of functional assembly 10.

The heat dissipation structure 100 of the embodiment of the present application can be applied to the heat dissipation of the image sensor 111 , for example, the heat dissipation of the image sensor 111 of a camera, a photographing device, or the like. The heat dissipation structure 100 of the embodiment of the present application can also be applied to the heat dissipation of components such as memories and processors, such as being applied to double-rate synchronous dynamic random access memory (Double Data Rate SDRAM, DDR SDRAM), digital signal processors (Digital Signal Processing, DSP) and other components. In the embodiments of the present application, the heat dissipation structure 100 is applied to the heat dissipation of the image sensor 111 of the camera as an example for description.

The image sensor 111 is an important component of the camera, a component that converts optical signals into electronic signals, and is widely used in digital cameras and other photographing devices. Since the image sensor 111 has more pixels, the size of the image sensor 111 is larger. , during the use of the camera, the heat generation of the image sensor 111 is greater, and the image sensor 111 is arranged on the circuit board 12. The thermal expansion and contraction coefficients of the circuit board 12 and the image sensor 111 are different. During the process, the solder joints between the connection circuit board 12 and the image sensor 111 will fall off, reducing the service life of the image sensor 111, thereby reducing the service life of the camera.

It should be pointed out that there are three main ways of heat transfer, namely heat conduction, heat radiation and convection. Heat conduction is the way of heat transfer between objects in contact with each other, such as heat conduction between metals. Thermal radiation plays a role in heat transfer between objects by emitting and absorbing each other's infrared rays, such as an object's temperature rise after receiving solar radiation. Convection is a method of conducting heat through the circulation of fluids, such as radiators to heat the air in a room.

The heat dissipation structure 100 of the embodiment of the present application mainly utilizes heat conduction and heat radiation to dissipate heat. That is, after the heating element on the functional component 10 generates heat during operation, it transfers the heat to the circuit board 12 through thermal conduction and thermal radiation. Part of the heat is also transferred to the heat dissipation plate 30 through thermal radiation. The first thermal conductive layer 20 also transfers heat to the heat dissipation plate 30 through thermal conduction and thermal radiation. Finally, the heat dissipation plate 30 transfers its own heat to the outside through thermal conduction and thermal radiation. A space or external object forms a heat transfer channel on the heat dissipation structure 100 from the functional component 10 to the heat dissipation plate 30 and then to the outside of the heat dissipation structure 100 , thereby cooling the functional component 10 .

Specifically, the first thermally conductive layer 20 may include at least one of thermally conductive silicone grease, thermally conductive gel and thermally conductive gasket. Thermal grease has good thermal conductivity, good electrical insulation, and a wide operating temperature (-50 ℃ ~ 230 ℃). Thermally conductive gel has a long service life and can be kept for a long time without drying up and pulverizing. Thermal pads have a lower lifespan, but are easy to replace. In the embodiment of the present application, the first thermally conductive layer 20 is thermally conductive silicone grease, which can be coated on the second surface 122 of the circuit board 12 to conduct heat on the circuit board 12 to the heat dissipation plate 30 . Moreover, the first thermal conductive layer 20 is formed by using thermal conductive silicone grease, and the first thermal conductive layer 20 can be well attached to the second surface 122 of the circuit board 12 and the electronic device 11 on the second surface 122, so that the first thermal conductive layer 20 The contact with the second surface 122 and the electronic device 11 on the second surface 122 can be realized substantially without air gap, which improves the heat dissipation efficiency. Similarly, the heat dissipation plate and the first heat conducting layer 20 can also be in contact with substantially no air gap, which further improves the heat dissipation efficiency.

In some embodiments, the heat sink 30 includes a metal heat sink. In this way, the heat-dissipating plate 30 made of metal has good thermal conductivity, and the heat on the functional component 10 can be quickly conducted to the heat-dissipating plate 30 through the first heat-conducting layer 20.

Specifically, the metal heat sink can be made of metals such as silver (Ag), copper (Cu), gold (Au), aluminum (Al), sodium (Na), iron (Fe), lead (Pb), or alloys. The heat dissipation plate 30 of the embodiment of the present application adopts a metal heat dissipation plate made of aluminum. The heat dissipation plate 30 made of metal aluminum can quickly conduct the heat on the functional component 10 to the heat dissipation plate 30 through the first heat conducting layer 20 , and the cost is low, and the molding is easier.

Of course, in other embodiments, the heat dissipation plate 30 may also be made of other alternative materials, and the other alternative materials may include other metal or non-metal materials, which will not be repeated here.

In some embodiments, the surface of the heat dissipation plate 30 is black. In this way, the black surface of the heat dissipation plate can absorb heat faster.

Specifically, according to Kirchhoff's law, under the premise of the same object, black objects absorb and radiate heat faster than other colors through thermal radiation. It can be understood that absorbing heat means absorbing the thermal radiation emitted by other objects, and radiating heat is the thermal radiation emitted by itself. Therefore, when the surface of the heat dissipation plate 30 is black, the heat dissipation plate 30 receives heat radiation from the circuit board 12 and the first thermal conductive layer 20 at a faster rate, which can improve the heat dissipation plate 30 to absorb the functional components 10 by heat radiation. the rate of heat. In addition, when the surface of the heat dissipation plate 30 is black, the amount of heat radiation emitted is large, which can improve the ability of the heat dissipation plate 30 to dissipate the absorbed heat to the outside of the heat dissipation structure 100 , thereby improving the heat dissipation capability of the heat dissipation structure 100 .

In some embodiments, the surface of the heat dissipation plate 30 is provided with a heat radiation layer. In this way, the heat radiation layer can improve the ability of the heat dissipation plate 30 to emit heat radiation, thereby improving the ability of the heat dissipation plate 30 to dissipate the absorbed heat to the outside of the heat dissipation structure 100 , thereby improving the heat dissipation capability of the heat dissipation structure 100 .

Specifically, the heat radiation layer may be a heat radiation paint coated on the surface of the heat dissipation plate 30 , and the heat radiation paint can improve the heat dissipation effect of the heat dissipation plate 30 . The heat radiation paint can be applied to the side of the heat dissipation plate 30 opposite to the first heat conducting layer 20 , or can be applied to the entire surface of the heat dissipation plate 30 . In the embodiment of the present application, the heat radiation layer is provided on the side of the heat dissipation plate 30 opposite to the first heat conducting layer 20 .

When the heat dissipation plate 30 is made of metal aluminum, the heat radiation layer can also be obtained by anodization. After the metal aluminum is anodized, an aluminum oxide film will be formed on the surface. This aluminum oxide film can enhance the heat dissipation of the heat dissipation plate 30. The ability of radiation, the aluminum oxide film also has good insulation and wear resistance, plays a protective role on the heat dissipation plate 30, and can improve the life of the heat dissipation plate 30 and the heat radiation layer.

It can be understood that in some embodiments, the surface of the heat dissipation plate 30 is black and a heat radiation layer is provided on the surface of the heat dissipation plate 30 .

Referring to FIG. 1 , in some embodiments, a surface 32 of the heat dissipation plate 30 opposite to the first thermal conductive layer 20 is convex and concave. In this way, the surface area of the surface 32 of the heat dissipation plate 30 opposite to the first heat conducting layer 20 can be increased, the total amount of thermal radiation emitted by the heat dissipation plate 30 can be increased, the contact area between the heat dissipation plate 30 and the air can be increased, and heat dissipation can be increased. The plate 30 transmits the heat to the air through thermal conduction, so as to improve the effect of the heat dissipation plate 30 to dissipate heat as a whole.

As shown in FIG. 1 , the convex and concave shape of the surface 32 of the heat dissipation plate 30 according to the embodiment of the present application is a wavy shape. In other embodiments, the surface of the heat dissipation plate 30 may also be formed with multiple grooves, multiple holes and other structures to increase the surface area of the heat dissipation plate 30 and enhance the ability of the heat dissipation plate 30 to emit heat radiation.

In some embodiments, the circuit board 12 includes a ceramic board. Specifically, the ceramic plate and the electronic device 11 have more matched thermal expansion coefficients. Under the same temperature difference, the volume changes of the ceramic plate and the electronic device 11 due to thermal expansion and contraction are basically the same, which can effectively reduce the thermal expansion caused by different coefficients. The solder joints between the electronic device 11 and the circuit board 12 come off. At the same time, the ceramic plate also has good thermal conductivity, that is, the ceramic plate has better thermal conductivity, and can effectively transfer the heat generated by the electronic device 11 to the first thermal conductive layer 20, thereby transferring the heat to the heat dissipation plate 30, and finally heat. radiate to the outside of the heat dissipation structure 100 .

Referring to FIG. 1 , in some embodiments, the electronic device 11 is provided on the first side 121 and the second side 122 , and the electronic device 11 provided on the first side 121 includes at least one of the following: an image sensor 111 , a processor, memory. The electronic device 11 provided on the second side 122 includes at least one of the following: capacitors, resistors and inductors.

In this way, the heat of the electronic device 11 disposed on the first surface 121 and the second surface 122 can be transferred to the heat dissipation plate 30 via the circuit board 12 and the first thermal conductive layer 20, and then the heat dissipation plate 30 can dissipate the heat to the heat dissipation plate 30. Structure 100 exterior.

Specifically, the electronic device 11 disposed on the second surface 122 can also be attached to the first thermal conductive layer 20 , and the first thermal conductive layer 20 can directly transfer the heat of the electronic device 11 to the heat dissipation plate 30 .

Capacitors, resistors, inductors, etc. may be provided on the circuit board 12 by surface mount technology (SMT) to improve the bonding degree of the capacitors, resistors, inductors, etc. with the circuit board 12 .

Of course, in other embodiments, the image sensor 111 , the processor, the memory, the capacitor, the resistor, and the inductor may also be disposed on either side of the first surface 121 and the second surface 122 , and the electronic device 11 may also include the aforementioned electronic device Other devices other than 11.

Referring to FIGS. 1 and 3 , in some embodiments, the heat dissipation structure 100 includes a bracket assembly 40 . The functional assembly 10 is mounted on the bracket assembly 40 . In this way, the functional assembly 10 can be fixed to the bracket assembly 40 , which can prevent the functional assembly 10 from loosening and ensure the normal operation of the functional assembly 10 .

Specifically, the functional assembly 10 may be disposed inside the bracket assembly 40 , or partially disposed inside the bracket assembly 40 , and the bracket assembly 40 can support and protect the functional assembly 10 .

Referring to FIGS. 1 and 3 , in some embodiments, the bracket assembly 40 includes a first end cover 41 and a mounting post 43 , the mounting post 43 is provided on the first end cover 41 , and the circuit board 12 is elastically connected to the mounting post 43 .

In this way, less vibration of the bracket assembly 40 can be transmitted to the circuit board 12, so as to ensure the normal operation of the electronic device 11 on the circuit board 12.

Specifically, when the heat dissipation structure 100 is applied to an electronic terminal, due to factors such as the use environment, the electronic terminal is usually accompanied by vibration during use, and the vibration will cause adverse effects on the electronic device 11 on the circuit board 12. For example, For a long time, the connection between the electronic device 11 and the circuit board 12 will become loose. For another example, for the electronic device 11 that is particularly sensitive to vibration, such as the image sensor 111, a little vibration may cause the image of the image sensor 111 to be blurred. . Therefore, the circuit board 12 is elastically connected to the mounting posts, and the vibration of the bracket assembly 40 is reduced to be transmitted to the circuit board 12 in an elastic manner, so as to ensure the normal operation of the electronic devices on the circuit board 12 .

In addition, referring to FIG. 4 , the bracket assembly 40 may further include a second end cover 42 . The second end cover 42 and the first end cover 41 are connected to form an accommodation space, and the heat dissipation structure 100 is accommodated in the accommodation space.

Referring to FIGS. 1 and 3 , in some embodiments, the bracket assembly 40 includes a fastener 44 and an elastic member 45 . The elastic member 45 is at least partially located in the mounting post 43 , and the fastener 44 penetrates the circuit board 12 and the elastic member 45 and is connected with the mounting post 43 so that the elastic member 45 provides elastic connection for the circuit board 12 .

In this way, when the fastener 44 connects the circuit board 12 to the mounting post 43 , the elastic member 45 can provide elastic force between the mounting post 43 and the circuit board 12 .

Specifically, the fasteners 44 may be screws, pins, snaps, etc., and the fasteners 44 in the embodiments of the present application are screws. A threaded hole may be formed in the mounting post 43 , so that the fastener 44 can cooperate with the mounting post 43 to perform a fastening function. The elastic member 45 may be located in the threaded hole, and the elastic member 45 may be a spring, an elastic sheet, an elastic ring, etc. The elastic member 45 in the embodiment of the present application is a spring. The column part of the screw passes through the spring and the circuit board 12 , one end of the spring is pressed against the first surface 121 of the circuit board 12 , the head of the screw is pressed against the second surface 12 of the circuit board 12 , and the other end of the elastic member 45 is pressed against the first surface 121 of the circuit board 12 . Hold on the bottom of the threaded hole.

In some embodiments, the bracket assembly 40 may further include a positioning member 49 provided on the first end cover 41 , and a positioning hole 123 is formed on the circuit board 12 corresponding to the positioning member 49 . Positioning the relative positions of the circuit board 12 and the first end cover 41 is convenient for the fasteners 44 to fasten the circuit board 12 .

Referring to FIG. 1 , in some embodiments, the electronic device 11 includes an image sensor 111 disposed on the first surface 121 . The heat dissipation structure 100 includes an optical filter 50 , and the optical filter 50 is disposed on the photosensitive side of the image sensor 111 .

In this way, the filter 50 can filter out the light unnecessary for imaging by the image sensor 111 , thereby improving the imaging quality of the image sensor 111 .

In the embodiment of the present application, the filter 50 may be an ultraviolet filter, which is used in a camera and is disposed on the photosensitive side of the image sensor 111 , which can reduce the influence of ultraviolet rays on the imaging of the image sensor 111 , thereby improving the quality of pictures taken by the camera. , so that the camera has better shooting effect in outdoor or strong light environment. In other embodiments, the filter 50 may also be other types of filters, such as infrared filters.

Referring to FIGS. 1 and 3 , in some embodiments, the heat dissipation structure 100 includes a first sealing member 60 and a second sealing member 70 . The first sealing member 60 is sealingly connected to the bracket assembly 40 and the filter 50 , and the second sealing member 70 is sealingly connected to the filter 50 and the image sensor 111 .

In this way, the first sealing member 60 and the second sealing member 70 can prevent dust and moisture from entering between the bracket assembly 40 , the filter 50 and the image sensor 111 , and can also reduce other light from entering from the side, so as to ensure the imaging of the image sensor 111 quality.

Specifically, the first sealing member 60 and the second sealing member 70 may be made into a frame shape. The first sealing member 60 and the second sealing member 70 may be made of sponge, rubber, or a material having a sealing and dustproof effect. The first sealing member 60 and the second sealing member 70 in the embodiment of the present application are both made of sponge, and further, they are made of dust-proof sponge, which has a good dust-proof effect.

Further, a surface of the second sealing member 70 facing the image sensor 111 is provided with a receiving groove 701 , and the outer periphery of the image sensor can be received in the receiving groove 701 . When the optical filter 50 is connected to the second sealing member 70, the optical filter 50 seals the opening of one end of the receiving groove 701, and the circuit board 12 seals the opening of the other end of the receiving groove 701. In this way, the optical filter 50 and the second sealing member 70 and the circuit board 12 form a relatively sealed accommodating space, and the image sensor 111 is located in the accommodating space, which further ensures the airtightness of the image sensor 111 .

Referring to FIG. 4 , in some embodiments, the bracket assembly 40 is used for installing the lens module, and the bracket assembly 40 is provided with a first connecting wire 46 for electrically connecting the motor of the lens module.

In this way, the motor of the lens module can be connected through the first connecting line 46, so as to control the start and stop of the motor of the lens module, and play the role of controlling the adjustment of the lens module to adjust the focus of the lens.

Specifically, the camera according to the embodiment of the present application may include a processor, and the processor is configured to acquire an image captured by the image sensor 111, and issue an instruction to the motor of the lens module according to the image, so that the motor of the lens module controls the lens module to adjust the position of the lens. focal length.

Referring to FIG. 1 , in some embodiments, the bracket assembly 40 is provided with a second connecting wire 47 for electrically connecting the microphone of the electronic terminal. In this way, the microphone of the electronic terminal can be connected through the second connection line 47, so that the camera has the function of collecting sound.

Specifically, the microphone is arranged in the lens module, so as to collect the sound in front of the camera. Referring to FIG. 4, the first end cap 41 is provided with an end cap opening 411, and the end cap opening 411 is provided with an electrical connection seat 412. The electrical connection seat 412 includes a plurality of end cap contact points 413, and a part of the end cap contact points 413 are connected to the first end cap contact point 413. A connecting wire 46 and another part of the end cap contact points 413 are connected to the second connecting wire 47 . The lens module can be provided with multiple lens contact points. When the lens module is installed on the front side of the first end cap 41, the end cap contact points 413 are connected to the lens contact points in a one-to-one correspondence, so that the motor of the lens module is electrically connected to the first connection wire 46, and the microphone is connected to the first connection wire 46. The two connecting wires 47 form an electrical connection, which is convenient for the camera to control the motor and the microphone of the lens module.

In some embodiments, the bracket assembly 40 is provided with a third connection wire for electrically connecting the image sensor 111 . The image sensor 111 and the processor or display of the camera may be connected through a third connection line, and the processor or the display screen can acquire the image captured by the image sensor 111 . In one example, the first connection line 60 , the second connection line 70 and the third connection line may be flexible circuit boards.

In certain embodiments, the heat dissipation structure 100 includes a second thermally conductive layer. The second heat-conducting layer is disposed on a surface 32 of the heat dissipation plate 30 opposite to the first heat-conducting layer 20 .

In this way, the second heat-conducting layer can be connected to other heat-dissipating components, so as to be able to dissipate the heat of the heat-dissipating plate 30 and improve the heat-dissipating effect of the heat-dissipating plate 30 .

Specifically, the second thermally conductive layer may be a thermally conductive graphite sheet, and the thermally conductive graphite sheet has excellent thermal conductivity, is light and thin, and is easy to process. In the embodiment of the present application, one side of the second heat conducting layer is connected to the heat dissipation plate 30, and the other side is connected to the rear case of the camera body, so that the heat of the heat dissipation plate 30 is exported to the camera body, and the heat dissipation effect of the heat dissipation plate 30 is improved. Therefore, the heat dissipation effect of the heat dissipation structure 100 is improved as a whole.

Referring to FIG. 4 , an electronic terminal 1000 according to an embodiment of the present application includes a body 300 and a heat dissipation structure 100 according to any of the above embodiments, and the heat dissipation structure 100 is installed on the body 300 .

In the electronic terminal 1000 described above, in the electronic terminal 1000 having the above-mentioned heat dissipation structure 100, the heat of the functional component 10 can be radiated to the heat dissipation plate 30 through the first heat conduction layer 20, and the heat dissipation plate 30 will dissipate the heat to the outside of the heat dissipation structure 100, so that the functional component The heat of 10 can be effectively dissipated, which ensures the normal use of functional component 10 .

In some embodiments, the electronic terminal 1000 includes a camera, an unmanned aerial vehicle, a mobile vehicle, and a robot. The heat dissipation structure 100 can dissipate heat for the image sensor 111, memory and processor of the electronic terminal 1000 such as cameras, unmanned aerial vehicles, mobile vehicles and robots, reduce the operating temperature of the image sensor 111, the memory and the processor, improve the camera, unmanned The service life of aircraft, mobile vehicles and robots. In the embodiment shown in FIG. 4 , the electronic terminal is a camera.

In the description of this specification, reference to the terms "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples", etc. A particular feature, structure, material, or characteristic described in this embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present application have been shown and described, those of ordinary skill in the art will appreciate that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, The scope of the application is defined by the claims and their equivalents.

Claims

A heat dissipation structure, characterized in that it includes:

A functional assembly, the functional assembly includes an electronic device and a circuit board, the circuit board includes a first surface and a second surface opposite to each other, and the electronic device is provided on at least one side of the first surface and the second surface , the electronic device includes a heating device;

a first thermally conductive layer, the first thermally conductive layer is provided on the second surface, the first thermally conductive layer is substantially adhered to the second surface; and

a heat dissipation plate, the first heat conduction layer connects the heat dissipation plate and the circuit board, and the heat dissipation plate is used for dissipating the heat of the functional components conducted through the first heat conduction layer.
The heat dissipation structure according to claim 1, wherein the heat dissipation plate comprises a metal heat dissipation plate.
The heat dissipation structure according to claim 1, wherein the surface of the heat dissipation plate is black, and/or the surface of the heat dissipation plate is provided with a heat radiation layer.
The heat dissipation structure according to claim 1, wherein a surface of the heat dissipation plate opposite to the first heat conducting layer is convex and concave.
The heat dissipation structure of claim 1, wherein the circuit board comprises a ceramic board.
The heat dissipation structure according to claim 1, wherein the electronic device is arranged on the first surface and the second surface,

The electronic device provided on the first surface includes at least one of the following: an image sensor, a processor, and a memory,

The electronic device provided on the second side includes at least one of the following: a capacitor, a resistor and an inductor.
The heat dissipation structure according to claim 1, wherein the heat dissipation structure comprises a bracket assembly, and the functional component is mounted on the bracket assembly.
The heat dissipation structure according to claim 7, wherein the bracket assembly comprises a first end cover and an installation post, the installation post is provided on the first end cap, and the circuit board is elastically connected to the installation post .
The heat dissipation structure according to claim 8, wherein the bracket assembly comprises a fastener and an elastic member, the elastic member is at least partially located in the mounting post, and the fastener passes through the circuit The board and the elastic member are connected with the mounting post so that the elastic member provides elastic connection for the circuit board.
The heat dissipation structure according to claim 7, wherein the electronic device comprises an image sensor provided on the first surface, the heat dissipation structure comprises a filter, and the filter is provided on the image sensor the photosensitive side.
The heat dissipation structure according to claim 10, wherein the heat dissipation structure comprises a first sealing member and a second sealing member, the first sealing member sealingly connects the bracket assembly and the optical filter, the A second seal sealingly connects the filter and the image sensor.
The heat dissipation structure according to claim 7, wherein the bracket assembly is used for installing a lens module, the bracket assembly is provided with a first connecting wire for electrically connecting the motor of the lens module, and/or

The bracket assembly is provided with a second connecting wire for electrically connecting the microphone of the electronic terminal.
The heat dissipation structure according to claim 1, wherein the heat dissipation structure comprises a second heat conduction layer, and the second heat conduction layer is provided on a surface of the heat dissipation plate opposite to the first heat conduction layer.
An electronic terminal, comprising a body and the heat dissipation structure according to any one of claims 1-13, wherein the heat dissipation structure is mounted on the body.
The electronic terminal according to claim 14, wherein the electronic terminal comprises a camera, an unmanned aerial vehicle, a mobile vehicle and a robot.