JP4722505B2 - Imaging device - Google Patents

Description

The present invention relates to an image pickup apparatus using an image pickup element such as a CCD or a CMOS.

  In general, in an image pickup apparatus using an image pickup element such as a CCD, it is known that an image to be picked up deteriorates due to an influence of a temperature rise of the CCD or a long exposure time. In particular, when used in applications such as a fluorescence microscope, the fluorescence emitted from the target fluorescent image is very weak light, so it must be exposed for a long time, and the heat generated by the CCD may be ignored. It is known that noise cannot be generated in the image.

  As a main measure against such a temperature rise of the CCD, a cooling element such as a Peltier element is used to cool the CCD. Here, if another member is interposed between the CCD and the cooling element, the cooling temperature of the CCD rises. Therefore, it is desirable to attach the CCD directly to the cooling surface of the cooling element. This is because, when another member is interposed, there is a decrease in cooling rate due to an increase in the total heat capacity of the member to be cooled, and a decrease in cooling efficiency due to the interposed member absorbing heat from the surroundings. However, normally, the CCD and the cooling element do not adopt a structure that can be directly fixed by screws or the like.

  For this reason, conventionally, various countermeasures have been proposed for how to directly contact the CCD and the cooling element. For example, according to Patent Document 1, a CCD that performs imaging, a cooling element (Peltier element) that uses a CCD side surface as a cooling surface, and a heat pipe that is arranged so that one end is in contact with the heat dissipation surface of the cooling element; And an elastic body such as rubber which is inserted between the substrate on which the CCD is soldered and fixed and the heat pipe and applies pressure to the heat pipe toward the CCD side, so that the CCD, the cooling element and the heat are heated. A configuration example has been proposed in which reliable thermal contact with the pipe is obtained.

  Further, according to Patent Document 2, a CCD that performs imaging, a cooling element that is disposed so that a cooling surface is in contact with the back side opposite to the imaging surface of the CCD, and a part of an exterior cover that includes a heat dissipation block And a leaf spring that presses the CCD toward the cooling element, and has been proposed.

  Further, according to Patent Document 3, a CCD that performs imaging, a cooling element having a cooling surface on the CCD side, a heat conductive pin and a heat radiating plate arranged so as to be in contact with the heat radiating surface of the cooling element, and attached to the heat radiating plate A configuration example has been proposed that includes a leaf spring that presses the heat conducting pin toward the CCD.

  Further, according to Patent Document 4, even if there are variations in the dimensions of the members, the CCD that performs imaging is brought into contact with the CCD via a heat transfer plate so that the optical axis of the CCD is constant. In a structure including a cooling element that cools a CCD, a substrate on which electronic components including the CCD are mounted, and a metal package having an airtight structure that accommodates these, the mounting of the CCD on the substrate is performed in the optical axis direction by a socket structure. A configuration example has been proposed in which it can be moved freely.

JP-A-8-31993 JP-A-6-45570 JP-A-9-83878 JP-A-10-210344

  By the way, according to Patent Document 1, since the CCD, the cooling element (Peltier element), and the heat pipe are in close contact with each other in a pressurized state by rubber, the heat generated by the CCD is radiated to the outside through the cooling element by the heat pipe. It can be said that the cooling efficiency is extremely good. However, in the case of the method of Patent Document 1, the thickness in the optical axis direction near the CCD is large, and the cooling structure is enlarged. Also, in the CCD structure, the cooling element, the heat pipe, and an elastic body such as rubber are laminated between the CCD and its mounting substrate, so that the length of the CCD lead terminal is not longer than the laminated thickness. In addition, a CCD having a general-purpose lead terminal cannot be used, and there is a disadvantage that the choices of the CCD are greatly limited.

  On the other hand, according to Patent Document 2, a general-purpose CCD can be used without increasing the cooling structure in the vicinity of the CCD, and the CCD is always kept in close contact with the cooling element in a pressurized state. Can do. However, since it is provided with a leaf spring that is attached to a part of the outer cover including the heat dissipation block and presses the CCD to the cooling element side, a part of the amount of heat that the cooling element radiates to the outer cover side is part of the outer cover. In some cases, the cooling efficiency is remarkably lowered by going around the CCD through the leaf spring attached to the CCD.

  In the case of Patent Document 3, the imaging surface side of the CCD is fixed by a cover member, and the heat radiated from the CCD to the outside air through the cooling element, the heat conduction pin, and the heat radiating plate is passed through the cover member. Since it goes around to the CCD side, the cooling efficiency may be remarkably lowered as in the case of Patent Document 2.

  Further, in the case of Patent Document 4, since the mounting of the CCD on the substrate is movable in the insertion direction by the socket structure, it is assumed that the contact state between the CCD and the cooling surface of the cooling element is obtained regardless of the dimensional variation. However, since it is a structure that is not subjected to pressure by the socket method, and more realistically, a structure in which floating occurs between the two, the thermal conductivity from the CCD to the cooling surface of the cooling element is low. There was a problem that cooling efficiency was lowered.

  The present invention has been made in view of the above, and an object of the present invention is to provide an image pickup apparatus that has a small cooling structure, little heat wraps around the image pickup element, and good cooling efficiency.

In order to solve the above-described problems and achieve the object, an imaging apparatus according to claim 1 includes an imaging element, a cooling element that is disposed on a cooling surface side to cool the imaging element, and the cooling A heat sink having a contact surface in contact with a heat radiating surface of the element, a substrate made of a heat insulating material to which the imaging element is electrically connected and mechanically fixed, and generating a pressing force at an end of the substrate, Pressing means for pressing the image sensor on the cooling element side.

An imaging apparatus according to a second aspect is the imaging apparatus according to the first aspect , wherein the pressing means attaches the substrate to the heat sink in a state in which a pressing force acts on the cooling element side, thereby cooling the imaging element. It is characterized by pressing toward the element side.

  An imaging apparatus according to a third aspect is the imaging apparatus according to the second aspect, wherein the pressing means applies a pressing force using a pressing member.

  An imaging apparatus according to a fourth aspect is the imaging apparatus according to the third aspect, wherein the height of the pressing member from the heat sink side to the top is the height from the surface of the imaging element opposite to the cooling element. It is characterized by being almost identical.

  An imaging apparatus according to a fifth aspect is the imaging apparatus according to the second aspect, wherein the pressing means applies a pressing force using an elastic deformation force of the substrate.

  The image pickup apparatus according to a sixth aspect is the image pickup apparatus according to the fifth aspect, wherein the pressing means is an attachment position set outside the image pickup element on a plane parallel to a plane including the image pickup surface of the image pickup element. A height position when the imaging element is in contact with the cooling element, the height of the position at which the board is attached by the fastener is fixed to the heat sink, the height of the pressing direction being adjustable; The position is lower than the heat sink side.

An imaging apparatus according to a seventh aspect is the imaging apparatus according to any one of the second to sixth aspects, wherein an attachment position of the substrate with respect to the heat sink is set in the vicinity of an end portion of the substrate far from the imaging element. It is characterized by.

An imaging apparatus according to an eighth aspect is the imaging apparatus according to any one of the first to seventh aspects, wherein the imaging element is electrically connected to the substrate by soldering a lead terminal and mechanically. Characterized by being fixed

The imaging device according to claim 9 is the imaging device according to any one of claims 1 to 7, wherein the imaging element is electrically connected to the substrate by a socket structure in which a lead terminal is detachable, It is mechanically detachably fixed by the second fastener.

  According to a tenth aspect of the present invention, in the imaging apparatus according to the first aspect, the heat sink includes an exterior cover that forms a space for sealing the imaging element and the cooling element.

  According to the present invention, since the image pickup device arranged on the cooling surface side of the cooling element is pressed to the cooling element side by the pressing means, there are few structural restrictions, and a small cooling structure can be realized. Since the image sensor is pressed to the cooling element side through the heat insulating material, the image sensor becomes thermally isolated by the cooling element and the heat insulating material, and only the image sensor can be cooled, and the sheet sink radiates heat. It is possible to provide an image pickup apparatus that has a low cooling efficiency and less heat or outside air heat entering the image pickup element.

  Exemplary embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

(Embodiment 1)
The first embodiment shows an application example to an image pickup apparatus using a two-dimensional CCD as an image pickup element in a fluorescent microscope having a long exposure time, for example. FIG. 1 is a longitudinal sectional front view showing a configuration example of the imaging apparatus according to the first embodiment. First, a CCD (Charge Coupled Device) 1 having a two-dimensional structure that realizes an imaging device for imaging a subject such as a fluorescent image is provided. The CCD 1 is electrically connected by soldering a lead terminal 4 around the opening 2 to a substrate 3 having an opening 2 slightly smaller than the CCD 1 on the back side opposite to the imaging surface 1a. It is connected and mechanically fixed. Further, on the back side of the CCD 1, a Peltier element is provided that realizes a cooling element 6 that is disposed at the position of the opening 2 and cools the CCD 1. The cooling element 6 is a rectangular parallelepiped element that is slightly smaller than the opening 2, and the surface in contact with the back surface of the CCD 1 is a cooling surface 6 a, and the opposite surface is a heat radiating surface 6 b. Although not particularly illustrated, electrical connection to the cooling element 6 is made between the substrate 3 and the cooling element 6.

  Further, an exterior cover 8 is provided that forms a space 7 that surrounds and seals the CCD 1, the cooling element 6, and the substrate 3. The exterior cover 8 forms a sealed space for the purpose of preventing condensation, but also functions as a heat sink and is made of a metal having good thermal conductivity, such as aluminum or copper. The exterior cover 8 has a divided structure of covers 8a and 8b that are divided into two in the imaging direction of the CCD 1 in consideration of the ease of assembly of the CCD 1, the substrate 3, the cooling element 6, and the like. The cover 8a has a disk shape, for example, and the cover 8b has a bottomed cylindrical shape having the same diameter as the cover 8a, for example, and is integrated by a fixing screw 9. Further, the joint of these covers 8a and 8b has a structure in which hermeticity is maintained by, for example, a sealing mechanism 10 continuous in the circumferential direction. Here, one cover 8 a has a contact surface 11 that contacts the cooling surface 6 b of the cooling element 6, and an opening 12 is formed in the other cover 8 b at a portion facing the imaging surface 1 a of the CCD 1. The cover glass 13 having light transmittance is fixed to the portion with an adhesive or the like, so that the CCD 1 can take an image in a sealed state.

  Furthermore, it has an attachment structure for attaching the above-described substrate 3 to the exterior cover 8, in the first embodiment, the cover 8a side. The attachment position may be any position on the substrate 3, but in the first embodiment, the substrate is located outside the CCD 1 and the cooling element 6 and is the most distant from the CCD 1 and the cooling element 6. 3 is set near the end. Further, this attachment position is set to the left and right equal positions when viewed from the center of the CCD 1. At such an attachment position, the round hole 3a of the substrate 3 (see FIG. 2 showing an enlarged detail of the stepped screw portion) just fits into the stud 15 attached to the screw hole 14 on the cover 8a side. A pressing member, for example, a coil spring, having a proper pressing force between the substrate 3 and the large diameter top portion 16b of the stepped screw 16 by screwing the screw portion 16a of the stepped screw 16 having a large diameter. By interposing 17, the substrate 3 is attached to the cover 8 a. Accordingly, the substrate 3 can be moved only in the axial direction of the stepped screw 16 by fitting the round hole 3 a and the stepped screw 16. The height of the stud 15 is adjusted so that at least the height of the substrate 3 in a state where the CCD 1 is in contact with the cooling surface 6a of the cooling element 6 is lower than the height of the cover 8a. However, the spring force of the coil spring 17 enables the movement in the direction approaching the cover 8 a according to the stepped screw 16.

  Accordingly, the CCD 1 is mounted on the cover 8a with the stepped screw 16 and the coil spring 17 being applied to the cover 8a by the stepped screw 16 and the coil spring 17, thereby pressing the CCD 1 toward the cooling element 6. It is structured. Further, the height of the stepped screw 16 from the inner surface of the cover 8a to the top portion 16b is set to be substantially the same as the height from the surface of the CCD 1 opposite to the cooling element 6 (imaging surface 1a). In this case, “substantially the same” means that it is not necessary to be exactly the same, and it is only necessary to have the same degree.

  In addition, a hole 19 through which a connection line 18 for connecting the circuit on the substrate 3 to an external circuit is inserted is formed in a part of the cover 8a, and is closed by an insulating seal member 20 such as silicon. . Reference numeral 21 denotes a connector for connecting the connection line 18 to the substrate 3.

  In such a configuration, the CCD 1 fixed on the substrate 3 is mounted in a state in which a pressing force is applied to the cooling element 6 side by the coil spring 17, so that the CCD 1 is always cooled by the pressing force. It will contact the cooling surface 6a of the element 6 in a pressed state. As a result, the CCD 1, the cooling element 6, and the cover 8a are kept in close contact. Thus, even if the CCD 1 generates heat due to long exposure or the like, the CCD 1 is directly cooled through the cooling surface 6a of the cooling element 6, and the cooling element 6 dissipates the absorbed heat toward the covers 8a and 8b. Furthermore, these covers 8a and 8b dissipate heat to the outside air by radiating heat to the outside air. In this case, as described above, the CCD 1 and the cooling element 6, and the cooling element 6 and the cover 8a are in contact with each other under an appropriate pressure under the pressing force of the coil spring 17, so that the CCD 1 and the cooling element 6, The thermal resistance between the cooling element 6 and the cover 8a becomes sufficiently small, and the CCD 1 can be efficiently cooled.

  In particular, in the first embodiment, since the substrate 3 is pressed against the cooling element 6 side by the coil spring 17 at the mounting position away from the CCD 1 or the like, the pressing force by the coil spring 17 is applied at a closer position. As a result, the pressing force acting on the cooling element 6 in the CCD 1 portion is not too strong, and it is easy to obtain an appropriate pressing force balanced so as not to be too weak. That is, it becomes easy to apply a pressing load that is not easily affected by variations in the mounting height of the CCD 1 and the cooling element 6 and does not damage the CCD 1 and the cooling element 6.

  As described above, according to the first embodiment, since the CCD 1 arranged on the cooling surface 6a side of the cooling element 6 is pressed to the cooling element 6 side by the coil spring 17 via the substrate 3, it is structurally structural. There are few restrictions, and the small cooling structure which can use a general purpose image sensor as CCD is realizable. This downsizing may be made more effective by suppressing the height by making the height from the inner surface of the cover 8a of the stepped screw 16 to the top portion 16b substantially the same as the height from the imaging surface 1a of the CCD 1. it can.

  In addition, since there is a substrate 3 that functions as a heat insulating material between the CCD 1 and the cover 8a, the metal pressing means such as the stud 15, the stepped screw 16, the coil spring 17, etc. The CCD 1 is pressed to the cooling element 6 side, and the CCD 1 is not in direct thermal contact with the covers 8a and 8b, but is thermally isolated by the cooling element 6 and the substrate 3 (heat insulating material). Only the CCD 1 can be cooled, and the heat radiated to the covers 8a and 8b and the heat of the outside air do not flow from the covers 8a and 8b to the CCD 1 side, and the cooling efficiency is improved.

  FIG. 3 shows a modification, and shows an example in which a leaf spring 22 is used as a pressing member instead of the coil spring 17. In addition, a pressing force acting as a pressing member between the inner surface side of the cover 8a and the substrate 3 may be locked so that a pressing force toward the cooling element 6 is applied to the substrate 3. Further, the stud 15 may be omitted by screwing a long stepped screw directly to the cover 8a.

(Embodiment 2)
FIG. 4 is a longitudinal front view showing a configuration example of the imaging apparatus according to the second embodiment. The second embodiment is different from the first embodiment in the structure for attaching the substrate 3 to which the CCD 1 is fixed to the cover 8a, and the other structures are the same as those in the first embodiment. Parts are indicated using the same reference numerals.

  In the second embodiment, a pressing force acts on the substrate 3 on the cooling element 6 side by using the elastic deformation force of the substrate 3 without separately using pressing members such as the coil spring 17 and the leaf spring 22. It is deformed and attached. Specifically, a stud (fastener) 31 is provided on the cover 8a so that the height from the inner surface of the cover 8a can be adjusted by rotating the cover 8a at an attachment position set near the end of the substrate 3, and by a nut 32. The substrate 3 can be fixed at a desired height position and fixed to a stud 31 adjusted and fixed to a desired height by a fixing screw (fastener) 33. In this case, the height at the mounting position of the substrate 3 (height from the inner surface of the cover 8a) is slightly lower on the cover 8a side than the height position P0 when the CCD 1 is just in contact with the cooling surface 6a of the cooling element 6. It is set to P1, and is fixed by the fixing screw 33 at this height position P1. FIG. 5 is a diagram schematically showing deformation of the substrate including the position P1 and the like.

  Next, assembling and fixing examples will be described. In assembling the imaging apparatus according to the second embodiment, after the CCD 1 is soldered and fixed on the substrate 3, the height of the stud 31 is set so that the CCD 1 and the cooling element 6, and the cooling element 6 and the cover 8a are in close contact with each other. From the adjusted state, as shown in FIG. 4, when the distance from the side surface of the CCD 1 to the center of the stud 31 is L, the stud 31 is further extended by a length corresponding to P0−P1 = L / 50 to L / 100. The board 3 is pushed down and adjusted to be fixed by the nut 32, and the substrate 3 is fixed to the stud 31 by the fixing screw 33 in this adjustment completed state. The extent to which the stud 31 is pushed in depends on the thickness, material, etc. of the substrate 3, but the extent of L / 50 to L / 100 in the second embodiment assumes a normal substrate having a thickness of about 1.2 mm. This is a numerical example.

  According to such a mounting structure of the substrate 3, the mounting and fixing position is lower on the cover 8a side than the position where the substrate 3 is flattened. Therefore, in the state shown in FIG. It is elastically deformed in the shape of a letter, and is in a state where a pressing force is always applied to the cooling element 6 side with respect to the CCD 1 which is fixed to the substrate 3 and located at the approximate center, and the cooling surface 6a of the cooling element 6 is in the pressed state. Close contact with. In particular, in the second embodiment, since the substrate 3 is elastically deformed by fixing the substrate 3 to the stud 31 at an attachment fixing position away from the CCD 1 or the like, the substrate 3 is fixed closer. An appropriate deformation pressing force balanced so that the pressing force acting on the cooling element 6 at the CCD 1 portion is not too strong and not too weak, without applying an excessive deformation load to the substrate 3 than when elastically deforming. It will be easy to do. That is, it becomes easy to apply a pressing load that is not easily affected by variations in the mounting height of the CCD 1 and the cooling element 6 and does not damage the CCD 1 and the cooling element 6.

  As described above, according to the second embodiment, the CCD 1 and the cooling element 6, and the cooling element 6 and the cover 8a are in contact with each other under an appropriate pressure under the pressing force caused by the elastic deformation of the substrate 3. The thermal resistance between the CCD 1 and the cooling element 6 and between the cooling element 6 and the cover 8a is sufficiently small, and the CCD 1 can be efficiently cooled. In particular, the second embodiment has a simple structure in which the CCD 1 arranged on the cooling surface 6a side of the cooling element 6 is pressed to the cooling element 6 side using the elastic deformation of the substrate 3, so that there are few structural restrictions. In addition, a small cooling structure that can use a general-purpose image sensor as a CCD can be realized. This miniaturization can be made more effective by not using an elastic member such as the coil spring 17 separately.

  Further, since there is a substrate 3 that functions as a heat insulating material between the CCD 1 and the cover 8a, the structure is fixed to the cover 8a by fasteners such as a metal stud 31 and a fixing screw 33. However, the CCD 1 is not in direct thermal contact with the covers 8a and 8b, but is in a thermally isolated state by the cooling element 6 and the substrate 3 (heat insulating material), and only the CCD 1 can be cooled, and the cover 8a , 8b and the heat of the outside air do not flow from the covers 8a, 8b to the CCD 1 side, so that the cooling efficiency is improved.

(Embodiment 3)
FIG. 6 is a longitudinal front view showing a configuration example of the imaging apparatus according to the third embodiment, and FIG. 7 is a longitudinal side view thereof. The third embodiment differs from the second embodiment in the mounting structure of the CCD 1 with respect to the substrate 3, and the mounting and fixing structure of the substrate 3 to the cover 8a is the same as the second embodiment.

  As shown in FIG. 6, the substrate 3 of the third embodiment has a socket type in which the insertion portion of the lead terminal 4 of the CCD 1 is a socket type, that is, a socket 41 having a through hole in the hole into which the lead terminal 4 of the CCD 1 is inserted. Is fixed. As a result, the lead terminal 4 of the CCD 1 is detachable from the socket 41, and the height position at the time of mounting can be adjusted. Therefore, the CCD 1 is electrically connected to the substrate 3 by the socket 41 in which the lead terminal 4 is detachable.

  On the other hand, as shown in FIG. 7, the CCD 1 is detachably fixed by screwing a screw 44 to a stud 43 fixed to the substrate 3 by a nut 42. That is, the nut 42, the stud 43, and the screw 44 are used as the second fastener.

  Next, assembling and fixing examples will be described. In assembling the imaging device of the third embodiment, after inserting the lead terminal 4 of the CCD 1 into the socket 41 of the substrate 3 to ensure electrical connection, the stud 43 is fixed to the substrate 3 by the nut 42. In this state, the CCD 1 is fixed to the stud 43 with a screw 44. The stud 43 may be fixed before the lead terminal 4 is inserted into the socket 41. Here, even if the length of the lead terminal 4 varies, the lead terminal 4 can move in the axial direction within the socket 41, and the CCD 1 is fixed to the substrate 3 without any trouble at a position regulated by the stud 43. Thereafter, from the state in which the height position of the stud 31 is adjusted so that the CCD 1 and the cooling element 6 and the cooling element 6 and the cover 8a are in close contact with each other, as in the case shown in FIG. When the distance to the center of L is L, the stud 31 is further pushed in by a length of about P0−P1 = L / 50 to L / 100, adjusted to a low level, and fixed by the nut 32. 3 is fixed to the stud 31 by a fixing screw 33.

  In the second embodiment, a heat conducting member 45 made of a material having high thermal conductivity such as aluminum is interposed between the heat radiating surface 6b of the cooling element 6 and the contact surface 11 of the cover 8a. It is fixed to the cover 8a. Here, the cover 8a and the heat conducting member 45 may be integrated.

  Also in the case of the third embodiment, since the CCD 1 is fixed to the substrate 3, the same operation and effect as in the second embodiment in which the CCD 1 is soldered and fixed to the substrate 3 are obtained. In addition, in the third embodiment, the CCD 1 can be attached to the substrate 3 electrically and mechanically. Therefore, for example, when the CCD 1 is defective, the substrate can be removed by removing the screw 44. Since only the CCD 1 can be removed from the 3 and replaced, the parts cost and man-hours required for the replacement can be reduced compared to the method of replacing the entire substrate 3 when the CCD 1 is defective as in the soldering method. Can do. On the contrary, the electrical connection is a socket type, but mechanically, the CCD 1 is fixed to the substrate 3 by the stud 43 and the screw 44. Therefore, there is a problem that the position of the CCD 1 is displaced due to vibration or the like. Absent.

  The socket method of the third embodiment has been described as an application example to the method of using the elastic deformation force of the substrate 3 as in the second embodiment. However, as in the first embodiment, the coil spring 17 or the like is used. The present invention can be similarly applied to a method using a pressing member.

(Embodiment 4)
FIG. 8 is a longitudinal sectional front view showing a configuration example of the imaging apparatus according to the fourth embodiment. In the fourth embodiment, a leaf spring 51 is provided on the cover 8b side to provide a pressing means that directly presses the CCD 1 toward the cooling element 6 at the end of the imaging surface 1a. Insulating material 52 is interposed between the CCD 1 and the CCD 1.

  In such a configuration, the CCD 1 fixed on the substrate 3 is in a state in which a pressing force is applied to the cooling element 6 side by the leaf spring 51, so that the pressing force always applies to the cooling surface 6 a of the cooling element 6. It will contact in a press state. As a result, the CCD 1, the cooling element 6, and the cover 8 a (accordingly, the exterior cover 8) maintain a close contact state. Thus, even if the CCD 1 generates heat due to long exposure or the like, the CCD 1 is directly cooled through the cooling surface 6a of the cooling element 6, and the cooling element 6 dissipates the absorbed heat toward the covers 8a and 8b. Furthermore, these covers 8a and 8b dissipate heat to the outside air by radiating heat to the outside air. In this case, as described above, the CCD 1 and the cooling element 6, and the cooling element 6 and the cover 8a are in contact with each other under an appropriate pressure under the pressing force of the leaf spring 51. The thermal resistance between the cooling element 6 and the cover 8a becomes sufficiently small, and the CCD 1 can be efficiently cooled. As described above, since the CCD 1 arranged on the cooling surface 6a side of the cooling element 6 is simply pressed against the cooling element 6 side by the leaf spring 51, there are few structural restrictions, and a general-purpose imaging element is used as the CCD. A small cooling structure that can be realized.

  Further, since there is a heat insulating material 52 between the CCD 1 and the leaf spring 51, the CCD 1 is in direct thermal contact with the covers 8a and 8b even if the structure is pressed by the metal leaf spring 51. However, only the CCD 1 can be cooled by the cooling element 6 and the heat insulating material 52, and the heat radiated to the covers 8a and 8b and the heat of the outside air are transmitted from these covers 8a and 8b. It does not go to the CCD 1 side, and the cooling efficiency is improved.

  In these embodiments, in consideration of dew condensation countermeasures and the like, the description has been given of the structure example including the exterior cover 7 having a sealed structure as a heat sink. The present invention can be similarly applied to an open structure of a type in which only there exists.

It is a vertical front view which shows the structural example of the imaging device of Embodiment 1 of this invention. It is a longitudinal front view which expands and shows the stepped screw vicinity. It is a vertical front view which shows the structural example of the imaging device of a modification. It is a vertical front view which shows the structural example of the imaging device of Embodiment 2 of this invention. It is a figure which shows typically a deformation | transformation etc. of a board | substrate. It is a vertical front view which shows the structural example of the imaging device of Embodiment 3 of this invention. It is the vertical side view. It is a vertical front view which shows the structural example of the imaging device of Embodiment 4 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 CCD, image pick-up element 3 Board | substrate, heat insulating material 4 Lead terminal 5 Solder 6 Cooling element 6a Cooling surface 6b Heat radiating surface 8 Exterior cover, heat sink 11 Contact surface 17 Press member 22 Press member 31, 33 Fastener 41 Socket 42-44 2nd Fastener 51 Pressing means 52 Heat insulating material

Claims (10)

An image sensor;
A cooling element that is disposed on the cooling surface side to cool the imaging element;
A heat sink having a contact surface in contact with the heat dissipation surface of the cooling element;
A substrate made of a heat insulating material to which the image sensor is electrically connected and mechanically fixed;
A pressing means for pressing the image sensor toward the cooling element by generating a pressing force at an end of the substrate ;
An imaging apparatus comprising: Before SL pressing means, image pickup of claim 1, characterized in that for pressing the image pickup element to the cooling device side by attaching the substrate in a state where the pressing force acts on the cooling device side to the heat sink apparatus.   The imaging apparatus according to claim 2, wherein the pressing unit applies a pressing force using a pressing member.   The imaging apparatus according to claim 3, wherein a height of the pressing member from the heat sink side to a top is substantially the same as a height of the imaging element to a surface opposite to the cooling element.   The imaging apparatus according to claim 2, wherein the pressing unit applies a pressing force using an elastic deformation force of the substrate.   The pressing means is a fastener for attaching the substrate to the heat sink so that the height in the pressing direction can be adjusted at an attachment position set outside the imaging element on a plane parallel to a plane including the imaging surface of the imaging element. The height at the mounting position of the substrate by the fastener is set to a position lower on the heat sink side than the height position when the imaging element is in contact with the cooling element. The imaging device described in 1. The imaging apparatus according to claim 2, wherein an attachment position of the substrate with respect to the heat sink is set in the vicinity of an end portion of the substrate that is separated from the imaging element. The imaging element, an imaging apparatus according to any one of claims 1-7, characterized in that is electrically connected to and mechanically fixed by soldering the lead terminals to the substrate. The imaging element is electrically connected lead terminal to the substrate by freely socket structure detachable, claim 1, characterized in that it is mechanically detachably fixed by a second fastener 8. The imaging device according to any one of 7.   The imaging apparatus according to claim 1, wherein the heat sink includes an exterior cover that forms a space for sealing the imaging element and the cooling element.

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