JP4412542B2 - Sealed electronic components, circuit boards, and electronic equipment - Google Patents

Description

  The present invention relates to a sealed electronic component having a chip body such as an IC chip or a CCD housed in a sealed state in a packaging, a circuit board having the sealed electronic component, and a mobile phone having the circuit substrate. It is related with electronic equipment.

In recent years, various electronic devices (for example, digital cameras, mobile phones, etc.) have been miniaturized due to technological progress and market demands. Accordingly, various electronic components incorporated in the electronic devices have been reduced. Miniaturization is required. For this reason, heat dissipation of electronic components is one of the problems, and various countermeasures against heat dissipation are considered.
In particular, as shown in FIG. 10, for an electronic component 40 in which a chip main body 41 such as an IC chip or a CCD is packaged in a sealed state by a package 42, heat generated from the chip main body 41 easily flows into the package 42. Since there is a possibility of adversely affecting the chip body 41, heat radiation countermeasures are regarded as important. For example, in the case of the chip body 41 that performs imaging such as a CCD or CMOS, as the temperature of the chip body 41 increases, noise occurs and the image quality is degraded. Therefore, heat dissipation is particularly needed.

For example, as shown in FIG. 11, a heat radiating plate 43 made of a metal material such as copper having excellent thermal conductivity is provided on the bottom plate of the package 42 on which the chip body 41 is placed. A device that releases heat generated from the chip body 41 to the atmosphere is known. However, even if the heat radiating plate 43 made of copper having excellent thermal conductivity is used, the heat of the chip body 41 cannot be efficiently released, and the heat radiating effect is low.
As another method, for example, a method by air cooling using a fan, a method of improving a heat dissipation effect by using a heat sink, and the like are known. However, in these methods, not only the number of parts increases but also installation space or the like needs to be secured, so that the electronic parts cannot be downsized as described above.

Therefore, a method using a Peltier element is known as a method capable of reducing the size and simultaneously taking measures against heat dissipation (see, for example, Patent Document 1).
The electric component described in Patent Document 1 cools a component main body by using a Peltier element as a material constituting a printed circuit board to which the component main body (chip main body) is attached. According to this method, the component main body can be directly cooled, and since the Peltier element is used, it is possible to cope with downsizing.
Further, unlike the electric component described in Patent Document 1 described above, a method of attaching a Peltier element directly to the chip body and cooling the chip body is also known.
Japanese Unexamined Patent Publication No. 7-153997

However, the following problems remain in the conventional method.
That is, the method of using a Peltier element as a material constituting the printed circuit board as described in Patent Document 1 is difficult to manufacture because it is necessary to create the Peltier element on the printed circuit board from the manufacturing stage. It was time-consuming and time-consuming.

Further, when the Peltier element is directly attached to the chip body, an excessive load may be applied to the Peltier element, which may have an adverse effect. That is, when a load such as bending or compression acts on the chip body or the substrate when the chip body is attached to the substrate, the load is transmitted to the Peltier element. Here, the Peltier element has a configuration in which a p-type thermoelectric material and an n-type thermoelectric material are arranged between two substrates (electrically insulating substrates such as alumina and aluminum nitride) serving as a cooling surface and a heat dissipation surface. It is. At this time, the p-type thermoelectric material and the n-type thermoelectric material generally use Bi-Te-based materials, Fe-Si-based materials, etc., which are thermoelectric materials with good performance, but these materials have mechanical strength. There is a disadvantage that it is low.
Therefore, when a load is transmitted to the Peltier element, the Peltier element may be deformed or cracked, for example, which may reduce reliability. Further, when the Peltier element is directly attached to the chip body, the condensation generated on the cooling surface has an adverse effect on the chip body, and there is a risk that the reliability is also lowered.
In particular, in the case where the Peltier element is directly attached to the chip body 41 housed in the package 42 shown in FIG. 10, since a process for attaching the Peltier element is required at the time of packaging, manufacturing is difficult. (Complication), and it took a lot of time and manufacturing.

  The present invention has been made in view of such circumstances, and an object of the present invention is to efficiently cool the packaged chip body using the Peltier element and to reinforce the Peltier element. An object of the present invention is to provide a sealed electronic component and a circuit board that prevent the chip body from dew condensation and improve reliability, and that are easy to manufacture.

The present invention provides the following means in order to solve the above problems.
The sealed electronic component according to the present invention includes a box-shaped package with a sealed interior, a chip body placed on the bottom plate of the package and housed in the package, and electrically connected to the chip body. A sealing-type electronic component having a connection terminal exposed to the outside of the package, and a plate-like heat sink disposed opposite to the bottom plate of the package, and between the heat sink and the bottom plate of the package A Peltier element having a cooling surface bonded to the bottom plate and a heat radiating surface bonded to one surface of the heat sink, and at least the Peltier element sandwiched between the bottom plate of the package and the heat sink And a fixing portion for fixing.

  In the sealed electronic component according to the present invention, since the cooling surface of the Peltier element is bonded to the bottom plate of the package on which the chip body is placed, the chip body can be cooled via the bottom plate. In particular, since a Peltier element is used, instantaneous cooling can be performed without noise and the temperature of the chip body can be reliably lowered. Therefore, even if, for example, a CCD, CMOS, or the like is adopted as the chip body, it is possible to suppress the occurrence of noise or the like as much as possible. On the other hand, the heat absorbed from the chip body is reliably radiated to the atmosphere after being transmitted from the heat radiating surface to the heat radiating plate.

In addition, since the Peltier element is arranged between the bottom plate of the package fixed by the fixing part and the heat radiating plate, for example, when it is mounted on a substrate or the like via a connection terminal, the package is temporarily compressed. Even if an external force such as bending or bending is applied, it is difficult to transmit the external force directly to the Peltier element. That is, the bottom plate, the heat radiating plate, and the fixing portion of the package are responsible for reinforcing the Peltier element. Therefore, it is possible to prevent the Peltier element from being bent or cracked as much as possible. Also from this fact, the cooling of the chip body can be ensured, and the reliability can be improved.
In particular, since the Peltier element and the heat sink can be attached to the bottom plate of the package by the fixing portion after the package containing the chip body, the manufacture is easy. Therefore, the manufacturing time can be shortened and the manufacturing cost can be reduced.

  The sealed electronic component of the present invention is the sealed electronic component of the present invention, wherein the bottom plate of the package is formed of a metal material.

  In the sealed electronic component according to the present invention, since the bottom plate of the package is formed of, for example, a metal material such as copper having excellent conductivity, the chip body can be cooled more efficiently by the Peltier element. It is possible to prevent inflow of heat from outside. Therefore, the reliability can be further improved.

  Further, the sealed electronic component of the present invention is the sealed electronic component of the present invention, wherein the fixed portion is provided so as to surround the periphery of the Peltier element, the fixed portion, the bottom plate of the package, and the The Peltier element is sealed by one surface of the heat sink.

In the sealed electronic component according to the present invention, since the fixing portion is provided so as to surround the Peltier element, the bottom plate and the heat radiating plate of the package are more integrally fixed and become stronger. Therefore, the strength reliability of the Peltier element can be further ensured.
Furthermore, since the Peltier element is sealed by one surface of the fixing portion, the bottom plate of the package, and the heat radiating plate, the Peltier element does not come into contact with the surrounding atmosphere. Therefore, condensation on the cooling surface and the bottom plate can be prevented. Therefore, the reliability can be further improved.

  Further, the sealed electronic component of the present invention is the sealed electronic component according to any one of the present inventions, wherein the connection terminal is electrically connected to the chip body at the base end side, and at least the package It is a lead frame that protrudes outward from the opposite side surface and has a leading end bent toward the bottom plate, and the leading end is bent so as to be substantially the same height as the other surface of the heat sink. It is characterized by being.

   In the sealed electronic component according to the present invention, the sealed electronic component can be placed on a substrate, for example, by a lead frame. At this time, the Peltier element can be placed between the substrate and the package. In particular, since the tip of the lead frame is set at substantially the same height as the other surface of the heat sink, the other surface of the heat sink is in contact with the substrate. Accordingly, the installation area is increased, and mounting can be performed in a stable mounting state.

  The circuit board according to the present invention includes the sealed electronic component according to any of the present inventions, and the sealed electronic component placed on the surface and electrically connected to the chip body via the connection terminal. And a substrate body having a circuit that can be connected electrically.

The circuit board according to the present invention includes the sealed electronic component in which the chip body is reliably cooled and the reliability of the Peltier element is improved. Therefore, the reliability of the entire circuit board can be improved. In addition, since the sealed electronic component can be manufactured at a low cost, even if a plurality of sealed electronic components are placed on the substrate body, the cost can be reduced.
In particular, since the Peltier element is used, the sealed electronic component can be reduced in size, and as a result, the entire circuit board can be easily reduced in size and can be used in various electric devices.

  Further, the circuit board of the present invention includes a box-shaped package sealed inside, a chip main body placed on the bottom plate of the package and housed in the package, and a base end side electrically connected to the chip main body. A sealed electronic component having a lead frame which is connected and protrudes outward from at least the opposing side surface of the package and whose front end is bent toward the bottom plate; and the surface of the sealed electronic component And a circuit board comprising a circuit board body having a circuit electrically connectable to the chip body via the lead frame, the circuit board being disposed between the circuit board body and the bottom plate of the package. A Peltier element having a cooling surface bonded to the bottom plate and a heat radiating surface bonded to the surface of the substrate body, and at least the Peltier element sandwiched between the bottom plate of the package and the surface of the substrate body And a fixing portion for fixing between the heat radiating surface, and is characterized in that the heat radiation through the substrate main body.

  In the circuit board according to the present invention, since the cooling surface of the Peltier element is adhered to the bottom plate of the package on which the chip body is placed, the chip body can be cooled via the bottom plate. In particular, since a Peltier element is used, instantaneous cooling can be performed without noise and the temperature of the chip body can be reliably lowered. Therefore, even if, for example, a CCD, CMOS, or the like is adopted as the chip body, it is possible to suppress the occurrence of noise or the like as much as possible. On the other hand, the heat absorbed from the chip body is reliably radiated to the atmosphere after being transmitted from the heat dissipation surface to the substrate body.

In addition, since the Peltier element is arranged between the bottom plate of the package fixed by the fixing portion and the surface of the substrate body, the Peltier element is temporarily compressed or placed on the package placed (mounted) on the surface of the substrate body. Even if an external force such as bending is applied, it is difficult to transmit the external force directly to the Peltier element. That is, the bottom plate, the substrate body, and the fixing portion of the package are responsible for reinforcing the Peltier element. Therefore, it is possible to prevent the Peltier element from being bent or cracked as much as possible. Also from this fact, the cooling of the chip body can be ensured, and the reliability can be improved.
In particular, since the Peltier element can be attached to the bottom plate of the package and attached to the surface of the substrate body after the package containing the chip body, manufacturing is easy. Therefore, the manufacturing time can be shortened and the manufacturing cost can be reduced.

  The circuit board of the present invention is characterized in that, in the circuit board of the present invention, the bottom plate of the package is formed of a metal material.

  In the circuit board according to the present invention, since the bottom plate of the package is formed of a metal material such as copper having excellent conductivity, for example, the chip body can be cooled more efficiently by the Peltier element, Prevent inflow of heat from outside. Therefore, the reliability can be further improved.

  The circuit board of the present invention is the circuit board of the present invention, wherein the fixing portion is provided so as to surround the periphery of the Peltier element, and the Peltier is formed by the fixing portion, the bottom plate of the package, and the surface of the substrate body. The element is sealed.

In the circuit board according to the present invention, since the fixing portion is provided so as to surround the Peltier element, the bottom plate of the package and the board main body are fixed more integrally and become stronger. Therefore, the strength reliability of the Peltier element can be further ensured.
Furthermore, since the Peltier element is sealed by the fixing portion, the bottom plate of the package, and the surface of the substrate body, the Peltier element does not come into contact with the surrounding atmosphere. Therefore, condensation on the cooling surface and the bottom plate can be prevented. Therefore, the reliability can be further improved.

  The circuit board according to the present invention is the circuit board according to any one of the above-described inventions, wherein the fixing portion fixes the side surfaces of the lead frame and the package at the same time.

  In the circuit board according to the present invention, the fixing portion fixes the bottom plate of the package, the side surface of the package, the lead frame, and the surface of the substrate body all together, so that the package can be more stably placed on the surface of the substrate body. Fix it. Therefore, it becomes difficult for the external force to be transmitted by the Peltier element, and the reliability can be further improved.

  The circuit board according to the present invention is the circuit board according to any one of the above-described inventions, wherein the substrate body has a heat radiating plate on a surface thereof, and the heat radiating surface is bonded to the heat radiating plate. It is characterized by radiating heat through a plate

  In the circuit board according to the present invention, the heat radiating surface of the Peltier element radiates heat from the board body via the heat radiating plate, so that heat can be radiated more efficiently.

   Further, the circuit board of the present invention is the circuit board according to any one of the above-mentioned inventions, wherein the circuit of the board body is electrically connectable to the Peltier element and supplies power to the Peltier element. It is a feature.

  In the circuit board according to the present invention, power can be supplied to the Peltier element using the circuit of the board body, so that the number of wirings can be reduced as much as possible and the wirings can be prevented from becoming cluttered.

  Moreover, an electronic apparatus according to the present invention includes the circuit board according to any one of the present inventions.

   In the electronic device according to the present invention, the cost can be reduced and the size can be reduced, and the chip body is provided with a circuit board with improved reliability by reliably cooling the chip body. Even if it does, the influence by the temperature rise of a chip body can be minimized and reliability can be improved and downsizing can be achieved.

According to the sealed electronic component according to the present invention, since the Peltier element is used, instantaneous cooling without noise or the like can be performed to reliably lower the temperature of the chip body. Even when a CCD, CMOS, or the like is employed, the occurrence of noise or the like as in the conventional case can be suppressed as much as possible.
In addition, since the bottom plate, the heat radiating plate, and the fixing portion of the package carry out reinforcement of the Peltier element, even if an external force such as compression is applied to the package, the Peltier element is prevented from being bent or cracked as much as possible. be able to. Therefore, the cooling of the chip body can be ensured, and the reliability can be improved.
Furthermore, since it is possible to attach the Peltier element and the heat sink to the bottom plate of the package later by the fixing portion with respect to the package housing the chip body, the manufacturing is easy. Therefore, the manufacturing time can be shortened and the manufacturing cost can be reduced.

  In addition, according to the circuit board according to the present invention, since the chip body is reliably cooled and the sealed electronic component in which the reliability of the Peltier element is improved, the reliability of the entire circuit board can be improved. In addition, the cost and size can be reduced.

In addition, according to the electronic device of the present invention, it is possible to improve the reliability while minimizing the influence of the temperature increase of the chip body, and to reduce the size.
In particular, when a cellular phone or the like having a CCD or the like as a chip body and having a camera mechanism is adopted in an electronic device, the rise in temperature of the CCD can be effectively suppressed, so that noise caused by the rise in temperature is generated. Can be suppressed as much as possible, and deterioration in image quality can be eliminated. Even if an external force is applied, since the Peltier element is reinforced, it is difficult for the external force to be transmitted to the Peltier element, and the operation of the Peltier element is ensured and cooling is not hindered. Therefore, as described above, the reliability can be improved.

Hereinafter, a first embodiment of a sealed electronic component, a circuit board, and an electronic device according to the present invention will be described with reference to FIGS. 1 and 2.
A cellular phone (electronic device) of the present embodiment includes a circuit board 1 shown in FIGS. 1 and 2, a housing (not shown) that houses the circuit board, and a package 10 that is provided in the housing and will be described later. A lens unit (not shown) arranged so as to be adjacent to the upper plate 10c, a power supply unit (not shown) arranged inside the housing and supplying power to the circuit board 1, and each of these components arranged inside the housing And a control unit (not shown) for comprehensive control.

  As shown in FIGS. 1 and 2, the circuit board 1 has a sealed electronic component 2 and the sealed electronic component 2 placed on the surface, and a CCD (chip) via a lead frame 12 described later. And a substrate body 4 having substrate wiring (circuit) 3 that can be electrically connected to the body.

  The sealed electronic component 2 includes a box-shaped package 10 whose inside is sealed, a CCD 11 placed on the bottom plate 10 a of the package 10 and housed in the package 10, and electrically connected to the CCD 11. And exposed to the outside of the package 10, that is, the base end side is electrically connected, protrudes outward from at least the opposite side surface 10b of the package 10, and the front end side is bent 90 degrees toward the bottom plate 10a side. A lead frame (connecting terminal) 12, a plate-like heat sink 13 disposed opposite to the bottom plate 10 a of the package 10, and the heat sink 13 and the bottom plate 10 a of the package 10. 14 and a Peltier element 16 having a heat radiating surface 15 bonded to one surface 13a of the heat radiating plate 13, and at least the Peltier element 16 sandwiched between the And a fixing portion 17 for fixing between the bottom plate 10a of the di-10 and the heat sink 13.

The package 10 is formed in a rectangular shape when viewed from above, and the upper plate 10c is made of a transparent material such as glass, and the portions excluding the side surface 10b and a part of the bottom plate 10a are made of plastic or the like. In the present embodiment, a part of the bottom plate 10a, specifically, the region W on which the CCD 11 is placed is formed of copper (metal material) which is a high thermal conductivity material.
The CCD 11 performs imaging through the upper plate 10c made of a transparent material and the lens unit. The CCD 11 is electrically connected to the lead frame 12 via a wire 20. The operation of the CCD 11 is controlled by the control unit.
The region W is preferably formed entirely of metal on which the CCD 11 is placed, but may be a part on which the CCD 11 is placed, or a plastic and metal It may be a laminated structure or the entire surface may be plastic.

  The lead frame 12 is disposed in the package 10 on the base end side, and protrudes out of the package 10 while the front end side maintains the inside of the package 10 and is bent 90 degrees in the middle. At this time, the tip 12 a is adjusted so as to be substantially the same height as the other surface (contact surface with the substrate body 4) 13 b of the heat radiating plate 13. Thereby, both the heat sink 13 and the leading end 12 a of the lead frame 12 come into contact with the surface of the substrate body 4. The leading end 12 a of the lead frame 12 is electrically connected to the board wiring 3 by “solder” 21 and fixed.

The Peltier element 16 includes a pair of electrically insulating substrates 25 and 26 such as alumina and aluminum nitride, and a p-type thermoelectric material 27 and an n-type thermoelectric material 28 disposed between the pair of substrates 25 and 26. Have. The p-type thermoelectric material 27 and the n-type thermoelectric material 28 are PN-bonded by an electrode (not shown) and are electrically connected in series.
Further, of the pair of substrates 25 and 26, the surface of one substrate 25 is the cooling surface 14, and the surface of the other substrate 26 is the heat dissipation surface 15. The Peltier element 16 is connected to the power supply unit and the control unit via the wiring 29, and the control unit supplies the p-type thermoelectric material 27 and the n-type thermoelectric material 28 so that the one substrate 25 side is cooled. The direction of flowing electrons is controlled.
Further, the Peltier element 16 has a cooling surface 14 and a heat radiating surface 15 made of heat conductive grease such as silicon gel, silver paste, adhesive, or the like, and a bottom plate 10a of the package 10 and one surface 13a of the heat radiating plate 13, respectively. It is glued to. As a result, the cooling surface 14 and the heat radiating surface 15 are surely in surface contact with the bottom plate 10 a and the heat radiating plate 13.

The heat radiating plate 13 is formed so as to have a larger surface area than the surface area of the heat radiating surface 15 of the Peltier element 16. For example, as shown in FIG. It is formed into a shape. The other surface 13b of the heat sink 13 is bonded and fixed to the surface of the substrate body 4 with an adhesive.
The fixing portion 17 is made of epoxy or silicon-based resin. In the present embodiment, as shown in FIG. 2, the heat sink 13 and the bottom plate of the package 10 are arranged at the four corners of the heat sink 13. 10a is fixed.

Next, the case where the circuit board 1 configured as described above is manufactured will be described.
First, in the clean room, the CCD 11 is housed in a sealed state in the package 10, and the base end side of the lead frame 12 is electrically connected to the CCD 11. Next, the cooling surface 14 of the Peltier element 16 is bonded to the bottom plate 10 a of the package 10 that houses the CCD 11, and one surface 13 a of the heat dissipation plate 13 is bonded to the heat dissipation surface 15 of the Peltier element 16. After bonding the package 10, the Peltier element 16 and the heat sink 13, the heat sink 13 and the bottom plate 10 a of the package 10 are fixed with resin at the four corners of the heat sink 13 to form a fixing portion 17. Thus, the sealed electronic component 2 in which the Peltier element 16 is bonded to the bottom plate 10a of the package 10 can be manufactured.

Next, after applying an adhesive to the other surface 13 b of the heat radiating plate 13, the sealing electronic component 2 is placed at a predetermined position on the surface of the substrate body 4. At this time, since the tip 12a of the lead frame 12 is formed at substantially the same height as the other surface 13b of the heat radiating plate 13, the tip 12a of the lead frame 12 is in contact with the surface of the substrate body 4. Become. Then, the tip 12a of the lead frame 12 and the substrate wiring 3 of the substrate body 4 are electrically connected and fixed by “solder” 21.
In this way, the circuit board 1 can be manufactured.

  As described above, in the sealed electronic component 2 of the present embodiment, the cooling surface 14 of the Peltier element 16 is bonded to the bottom plate 10a of the package 10 on which the CCD 11 is placed. The CCD 11 can be cooled. In particular, since the Peltier element 16 is used, the temperature of the CCD 11 can be reliably lowered by performing instantaneous cooling without noise. Therefore, it is possible to reduce the noise of the CCD 11 that is generated due to a temperature rise as much as possible. On the other hand, the heat absorbed from the CCD 11 is transmitted to the heat radiating plate 13 from the heat radiating surface 15 and then reliably radiated to the atmosphere. In particular, the heat radiating plate 13 has a larger surface area than the heat radiating surface 15 of the Peltier element 16, and therefore has a high heat radiating effect. Further, since the cooling surface 14 and the heat radiating surface 15 are reliably in surface contact with the bottom plate 10a and the heat radiating plate 13 of the package 10 by an adhesive or the like, cooling and heat dissipation can be performed efficiently.

In addition, since the Peltier element 16 is disposed between the bottom plate 10a of the package 10 fixed by the fixing portion 17 and the heat radiating plate 13, even if an external force such as compression or bending is applied to the package 10, the external force However, it is difficult to transmit directly to the Peltier element 16. That is, the bottom plate 10 a, the heat radiating plate 13, and the fixing portion 17 of the package 10 are responsible for reinforcing the Peltier element 16. Therefore, it is possible to prevent the Peltier element 16 from being bent or cracked as much as possible. Also from this, the cooling of the CCD 11 can be made more reliable, and the reliability can be improved.
In addition, since the CCD 11 is stored in the package 10 in the clean room, the Peltier element 16 and the heat radiating plate 13 can be attached later by the fixing portion 17, so that the manufacturing is easy. Therefore, the manufacturing time can be shortened and the manufacturing cost can be reduced.

In addition, since the bottom plate 10a (partial region W) of the package 10 is formed of copper, which is a highly thermally conductive material, the cooling efficiency of the CCD 11 can be improved and heat inflow from the outside can be prevented. Therefore, the reliability can be further improved.
Further, since the tip 12a of the lead frame 12 is formed at substantially the same height as the other surface 13b of the heat radiating plate 13, the other surface 13b of the heat radiating plate 13 is in contact with the surface of the substrate body 4. Become. Therefore, an installation area increases and a stable mounting state can be ensured.

  Moreover, according to the circuit board 1 of this embodiment, since the CCD 11 is reliably cooled and the sealed electronic component 2 in which the reliability of the Peltier element 16 is improved is provided, the reliability of the entire circuit board 1 is also improved. can do. In addition, since the sealed electronic component 2 can be manufactured at a low cost, even if a plurality of sealed electronic components 2 are placed on the substrate body 4, the cost can be reduced. In particular, since the Peltier element 16 is used, the sealed electronic component 2 can be reduced in size, and as a result, the entire circuit board 1 can be easily reduced in size.

  Furthermore, according to the cellular phone of the present invention, the temperature rise of the CCD 11 can be effectively suppressed by the Peltier element 16, so that the generation of noise due to the temperature increase can be suppressed as much as possible and the deterioration of the image quality can be eliminated. it can. Even if an external force is applied, since the Peltier element 16 is reinforced, it is difficult for the external force to be transmitted to the Peltier element 16, and the operation of the Peltier element 16 is ensured and cooling is not hindered. Therefore, as described above, the reliability can be improved simultaneously with the miniaturization.

  In the first embodiment, the lead frame 12 is formed so that the tip 12a thereof is substantially the same height as the other surface 13b of the heat sink 13, and the heat sink 13 is brought into contact with the substrate body 4. However, the present invention is not limited to this. For example, as shown in FIG. 3, the tip 12 a of the lead frame 12 is formed to be longer than the other surface 13 b of the heat radiating plate 13, and placed on the substrate body 4. In this case, the heat radiating plate 13 and the substrate body 4 may be separated from each other.

  Moreover, in the said 1st Embodiment, although the heat sink 13 was formed in the substantially same magnitude | size as the package 10, not only this but a magnitude | size may be set freely. For example, as shown in FIG. 4, it may be formed in a size surrounding the package 10. By carrying out like this, since a surface area increases further and the heat dissipation effect can be improved, it is more preferable. At this time, the heat radiating plate 13 may be deformed so as to be slightly separated from the surface of the substrate body 4 in order to prevent interference with the substrate wiring 3. At this time, the surface area can be further increased by forming a plurality of fins around the heat radiating plate 13.

Moreover, in the said 1st Embodiment, although it was set as the structure which provided the fixing | fixed part 17 in four places of the four corners of the heat sink 13, it is not restricted to four places, What is necessary is just to be provided on both sides of the Peltier device 16 at least. . For example, there may be three or six places. As shown in FIG. 5, the fixing portion 17 is provided so as to surround the periphery of the Peltier element 16, and one of the fixing portion 17, the bottom plate 10 a of the package 10 and the heat radiating plate 13 is provided. The Peltier element 16 may be sealed by the surface 13a.
In this case, the bottom plate 10a and the heat radiating plate 13 of the package 10 are more integrally fixed and become a stronger state. Therefore, the strength reliability of the Peltier element 16 can be further ensured.
Furthermore, since the Peltier element 16 is sealed, the Peltier element 16 does not come into contact with the surrounding atmosphere. Therefore, condensation on the cooling surface 14 and the bottom plate 10a of the package 10 can be prevented. Therefore, the reliability can be further improved.

Next, a second embodiment of the circuit board and the electronic device according to the present invention will be described with reference to FIG. Note that the same reference numerals in the second embodiment denote the same components as those in the first embodiment, and a description thereof will be omitted.
The difference between the second embodiment and the first embodiment is that, in the first embodiment, the fixing portion 17 fixes between the bottom plate 10a of the package 10 and the one surface 13a of the heat radiating plate 13. On the other hand, the circuit board 30 of the second embodiment is that the fixing portion 32 fixes between the bottom plate 10 a of the package 10 and the surface of the substrate body 4.
In the present embodiment, the sealed electronic component 31 is configured by the package 10, the CCD 11, and the lead frame 12.

That is, the cellular phone (electronic device) of the present embodiment includes the circuit board 30 having the sealing electronic component 31, the substrate body 4, the Peltier element 16, and the fixing portion 32, as shown in FIG. It has.
The Peltier element 16 is disposed between the substrate body 4 and the bottom plate 10a of the package 10, and a heat radiating surface 15 is adhered to the surface of the substrate body 4. 4 is used for heat dissipation.
Further, as described above, the fixing portion 32 fixes the space between the bottom plate 10 a of the package 10 and the surface of the substrate body 4 at four locations at the four corners of the package 10.

In the circuit board 30 configured as described above, the heat absorbed from the CCD 11 is transferred from the heat radiation surface 15 to the board body 4 and then radiated to the atmosphere. In the present embodiment, the bottom plate 10 a, the substrate body 4, and the fixing portion 32 of the package 10 are responsible for reinforcing the Peltier element 16. Therefore, as in the first embodiment, even if an external force such as compression or bending is applied to the package 10, it is difficult for the external force to be transmitted to the Peltier element 16, and the Peltier element 16 is prevented from being bent or cracked as much as possible. be able to. Therefore, the CCD 11 can be reliably cooled, and the reliability can be improved.
Further, when the circuit board 30 of the present embodiment is manufactured, the CCD 11 is stored in a sealed state in the package 10 in the clean room, and then the Peltier element 16 is attached by the fixing portion 32 later, as in the first embodiment. Manufacturing is easy. Therefore, it is possible to shorten the manufacturing time and the manufacturing cost.

In the second embodiment, the heat radiating surface 15 of the Peltier element 16 is directly bonded to the surface of the substrate body 4. For example, as shown in FIG. 7, the substrate body 4 has a heat radiating plate 33 on the surface. The heat radiating surface 15 may be bonded to the heat radiating plate 33 so that heat is radiated through the heat radiating plate 33.
The heat radiating plate 33 is provided to have a surface area larger than the surface area of the heat radiating surface 15. By doing so, since the surface area increases, the heat dissipation effect can be enhanced and the reliability is improved.

  Further, in the second embodiment, the fixing portion 32 is formed so as to surround the periphery of the Peltier element 16 as in the case shown in FIG. 5, and the fixing portion 32, the bottom plate 10 a of the package 10, and the substrate body 4. The Peltier element 16 may be sealed with the surface. The effect in this case is the same as that shown in FIG.

Furthermore, in the circuit board 30 shown in FIG. 7, the fixing portion 32 fixes the surface of the substrate body 4 and the bottom plate 10a of the package 10, but for example, as shown in FIG. The side surface 10b of the package 10 and the lead frame 12 may be fixed simultaneously.
By doing so, the fixing portion 32 fixes the bottom plate 10 a of the package 10, the side surface 10 b of the package 10, the lead frame 12, and the surface of the substrate body 4 together, so that the package 10 can be fixed more stably. . Therefore, it becomes difficult for the external force to be transmitted by the Peltier element 16, and further improvement in reliability can be achieved.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

For example, in each of the above embodiments, a mobile phone is adopted as an example of an electronic device, but the present invention is not limited to a mobile phone. For example, an electronic device such as a digital camera may be used. In particular, any electronic device having a chip body disposed in a sealed state in a sealed package may be used.
In each of the above embodiments, a CCD is used as an example of a chip body, but the present invention is not limited to a CCD. For example, a CMOS, IC chip or the like may be used.
Further, the case where one chip body (CCD) is accommodated in the package has been described as an example, but the number is not limited to one, and a plurality may be accommodated. In this case, all the chip bodies may be cooled at once by the Peltier element, or each chip body may be cooled by providing Peltier elements according to the number of chip bodies.
A plurality of sealed electronic components may be placed on the substrate body.

In the first embodiment, the sealed electronic component is placed on the substrate body using the lead frame. However, the connection type terminal is not limited to the lead frame and may be a connection terminal that can be electrically connected to the circuit of the substrate body. It doesn't matter. For example, a spherical connection terminal may be used.
In addition, the sealed electronic component is placed on the board body so that the Peltier element is positioned between the package and the board body. However, the present invention is not limited to this, and the sealing is performed so that the board body, the package, and the Peltier element are arranged in this order. The stationary electronic component may be placed on the substrate body.

Further, in each of the above embodiments, the Peltier element is electrically connected directly to the power supply unit or the control unit of the mobile phone by wiring. For example, as shown in FIG. It may be configured to be electrically connectable to the Peltier element 16 and to be electrically connected to the Peltier element 16 via the wiring 29 to supply power. That is, the Peltier element 16 may be configured to be electrically connected to the power supply unit and the control unit of the mobile phone via the wiring 29 and the substrate wiring 3. The wiring 29 may not be used, and the Peltier element 16 may be electrically connected to the substrate wiring 3.
By doing so, the number of wirings can be reduced as much as possible, the cluttered feeling can be eliminated, and a simple configuration can be achieved.

It is sectional drawing which shows 1st Embodiment of the circuit board and sealing type electronic component which concern on this invention. It is a cross-sectional arrow AA figure shown in FIG. FIG. 4 is a cross-sectional view of a circuit board that is a modification of the circuit board shown in FIG. 1 and in which a heat sink and a substrate body are separated from each other. FIG. 6 is a top view of a circuit board that is a modification of the circuit board shown in FIG. 1 and is formed so that a heat sink surrounds the package and has a large surface area. FIG. 7 is a top view of a circuit board that is a modification of the circuit board shown in FIG. 1 and that has a fixed portion that surrounds the periphery of the Peltier element. It is sectional drawing which shows 2nd Embodiment of the circuit board based on this invention. FIG. 7 is a modification of the circuit board shown in FIG. 6, and is a cross-sectional view of the circuit board in which the heat dissipation surface of the Peltier element is bonded to the surface of the substrate body via the heat dissipation plate. FIG. 8 is a modified example of the circuit board shown in FIG. 7, in which the fixing portion integrally fixes the bottom plate of the package, the side surface of the package, the lead frame, and the surface of the board main body. It is a figure which shows an example which electrically connected the Peltier device to the board | substrate wiring of a board | substrate body via wiring. It is sectional drawing which shows an example of the conventional electronic component by which the chip | tip main body was accommodated in the sealed state in the package. It is sectional drawing of the electronic component which provided the heat sink in the bottom plate of the package of the electronic component shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,30 Circuit board 2,31 Sealing type electronic component 4 Substrate body 10 Package 10a Package bottom plate 11 CCD (chip body)
12 Lead frame (connection terminal)
13, 33 Heat radiation plate 14 Cooling surface 15 Heat radiation surface 16 Peltier element 17, 32 Fixed part

Claims (10)

A box-shaped package sealed inside, a chip body placed on the bottom plate of the package and housed in the package, and a connection terminal electrically connected to the chip body and exposed to the outside of the package A sealed electronic component having
A plate-like heat sink disposed opposite to the bottom plate of the package;
A Peltier element disposed between the heat radiating plate and the bottom plate of the package, the cooling surface being bonded to the bottom plate and the heat radiating surface bonded to one surface of the heat radiating plate;
A fixing portion for fixing between the bottom plate of the package and the heat radiating plate, at least sandwiching the Peltier element ;
The connection terminal is a lead frame that is electrically connected to the chip body at the base end side, protrudes outward from at least the opposite side surface of the package, and is bent at the tip end side toward the bottom plate side. A sealed electronic component, wherein the tip is bent so as to be substantially the same height as the other surface of the heat radiating plate. The sealed electronic component according to claim 1,
A sealed electronic component, wherein a bottom plate of the package is formed of a metal material. In the sealed electronic component according to claim 1 or 2,
The fixing part is provided so as to surround the periphery of the Peltier element, and the Peltier element is sealed by one surface of the fixing part, the bottom plate of the package, and the heat radiating plate. . The sealed electronic component according to any one of claims 1 to 3,
A circuit board comprising: a substrate main body having a substrate wiring on which the sealed electronic component is placed on the surface, and a tip end of the lead frame is fixed and electrically connected. A box-shaped package sealed inside, a chip main body placed on the bottom plate of the package and housed in the package, and a base end side electrically connected to the chip main body, and at least opposite side surfaces of the package A sealed electronic component having a lead frame protruding outward and having a leading end bent toward the bottom plate,
A circuit board comprising a substrate body having a substrate wiring on which the sealed electronic component is mounted on the surface and having a lead wire to which the leading end of the lead frame is fixed and electrically connected;
A Peltier element disposed between the substrate body and the bottom plate of the package, a cooling surface bonded to the bottom plate and a heat dissipation surface bonded to the surface of the substrate body;
A fixing part for fixing between the bottom plate of the package and the surface of the substrate body, at least sandwiching the Peltier element;
The heat dissipation surface dissipates heat through the substrate body,
The fixing part is provided so as to surround the periphery of the Peltier element, and the Peltier element is sealed by the fixing part, the bottom plate of the package, and the surface of the substrate body . The circuit board according to claim 5, wherein
A circuit board , wherein a bottom plate of the package is made of a metal material . In the circuit board according to claim 5 or 6,
The circuit board according to claim 1 , wherein the fixing unit fixes the side surfaces of the lead frame and the package simultaneously . The circuit board according to any one of claims 5 to 7 ,
The substrate body has a heat sink on its surface,
The circuit board , wherein the heat dissipation surface is bonded to the heat dissipation plate and dissipates heat through the heat dissipation plate . The circuit board according to any one of claims 4 to 8 ,
The circuit board according to claim 1, wherein the circuit of the substrate body is electrically connectable to the Peltier element and supplies power to the Peltier element . An electronic apparatus comprising the circuit board according to claim 4.

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