JP4777636B2 - Thermoelectric element, circuit board and electronic device - Google Patents

Description

  The present invention relates to a thermoelectric element capable of heating or cooling a temperature-controlled object such as a CCD according to electric power supplied thereto, a circuit board having the thermoelectric element, and an electronic apparatus having the circuit board.

In recent years, various kinds of electronic devices (for example, digital cameras, mobile phones, etc.) have been miniaturized due to technological progress and market demands. Accordingly, various electronic components incorporated in the electronic devices have been reduced. Miniaturization is required. As one of the problems associated with this, there is a problem of heat dissipation of electronic parts, and various countermeasures against this heat dissipation are considered.
As one of the heat dissipation measures, one using a Peltier element is known (for example, see Patent Document 1). In particular, the Peltier element is effectively used in electronic devices and the like because it can instantaneously cool an electronic component or the like that is an object to be controlled and can be downsized.

The Peltier device described in Patent Document 1 is generally attached as shown in FIG. In other words, the Peltier element 30 is a target to be temperature-controlled by a heat conductive adhesive (for example, a heat conductive silicon gel) 32 on a first substrate 31 serving as a cooling surface among substrates arranged to face each other. The second substrate 34 that is bonded to the object 33 and serves as a heat radiating surface is attached to the heat radiating member 35 such as a heat sink with the heat conductive adhesive 32.
Further, a p-type thermoelectric element 37 and an n-type thermoelectric element 38 that are electrically connected in series via an electrode 36 are provided between the first substrate 31 and the second substrate 34. The electrode 36 is electrically connected to a power supply unit (not shown) or the like via a lead 40 connected by “solder” 39, and the p-type thermoelectric element 37 is cooled so that the first substrate 31 side is cooled. The direction of electrons flowing through the n-type thermoelectric element 38 is controlled.
Japanese Patent Laid-Open No. 3-201579

However, the following problems remain in the conventional method.
That is, when the conventional Peltier element 30 as described in Patent Document 1 is attached, the thermal connection (mechanical connection) to the temperature controlled object 33 and the heat sink 35 and the lead wire 40 are performed. It is necessary to make the electrical connection separately, and there are inconveniences that are troublesome, and the presence of the lead wire 40 is troublesome and affects the mounting operation.
This is because the power supply to the Peltier element 30 is due to the lead wire 40 attached to the second substrate 34 on the heat sink (side where temperature control is not performed) 35 of the two substrates. is there. That is, since a metal heat sink 35 is generally attached to the heat radiating side, power supply to the Peltier element 30 has to rely on wiring such as the lead wire 40.

  The present invention has been made in consideration of such circumstances, and the object thereof is that no lead wire is required, thermal connection and electrical connection can be easily performed without trouble, and workability is improved. To provide an improved thermoelectric element, a circuit board having the thermoelectric element, and an electronic apparatus having the circuit board.

The present invention provides the following means in order to solve the above problems.
The thermoelectric element of the present invention is a thermoelectric element that can arbitrarily heat or cool a temperature-controlled object electrically connected to the substrate wiring based on the supplied power, and in a state where a predetermined interval is provided. A plurality of p-type thermoelectric elements provided in parallel between a first substrate and a second substrate formed of an insulating material and sandwiched between the first substrate and the second substrate. An element and an n-type thermoelectric element; and a bonding electrode formed on the back surface of each of the first substrate and the second substrate and electrically connecting the p-type thermoelectric element and the n-type thermoelectric element in series; An electrode layer made of a metal material provided at least on the front surface of the first substrate and electrically connected to the bonding electrode formed on the back surface and electrically connectable to the substrate wiring; And the p-type thermoelectric element and the junction electrode Said supplying power to n-type thermoelectric element, is characterized in that to cool or heat the object to be temperature controlled object via said first substrate or said second substrate.

In the thermoelectric element according to the present invention, power is supplied to the p-type thermoelectric element and the n-type thermoelectric element through the electrode layer and the bonding electrode so that a current flows in a predetermined direction. Heat can be transferred between the first substrate and the second substrate to heat or cool the first substrate or the second substrate. Thereby, a to-be-temperature-controlled object can be heated or cooled arbitrarily.
In particular, since the electrode layer electrically connected to the bonding electrode on the back surface is provided on the front surface of the first substrate, the electrode layer and the substrate wiring can be easily electrically connected by soldering or the like. be able to. In addition, since the lead wire that has been used conventionally is unnecessary, there is no need to bother that the lead wire interferes with the work when making the electrical connection, and the work is easy and simple.
Also, by performing soldering or the like, the first substrate can be thermally connected (mechanically connected) to the substrate body or the like having the substrate wiring through the electrode layer simultaneously with the electrical connection. As in the prior art, it is not necessary to make the thermal connection and the electrical connection separately. Therefore, work efficiency is improved without taking time and effort.

  Moreover, the thermoelectric element of the present invention is the thermoelectric element of the present invention, wherein the electrode layer is formed so as to wrap around the side surface of the first substrate and is electrically connected to the bonding electrode. It is what.

  In the thermoelectric element according to the present invention, since the electrode layer wraps around the side surface of the first substrate so as to go from the front surface to the back surface and is electrically connected to the bonding electrode, a reliable electrical connection is ensured. can do. In particular, since it is not necessary to process the first substrate, the strength is not affected.

  The thermoelectric element of the present invention is the thermoelectric element of the present invention, wherein the thermoelectric element of the present invention includes a through hole formed in the first substrate and having an opening on each of the front surface and the back surface, and the electrode layer includes at least It is formed so as to cover the inner peripheral surface, and is electrically connected to the bonding electrode through the inner peripheral surface.

  In the thermoelectric element according to the present invention, the electrode layer passes through at least the inner peripheral surface of the through hole and reaches the back surface side, and is electrically connected to the bonding electrode. In particular, since the through hole is used, an electrical path from the front surface to the back surface can be hidden inside the first substrate without being exposed to the outside. Therefore, the possibility of external contact is eliminated as much as possible, and the reliability can be improved. Further, the electrode layer may be formed not only to cover the inner peripheral surface of the through hole but also to fill the inside of the through hole. By doing so, the electrical connection with the bonding electrode is further improved.

  The thermoelectric element of the present invention is the thermoelectric element according to any one of the above-described present invention, wherein the electrode layer is provided on the entire surface of the first substrate.

  In the thermoelectric element according to the present invention, since the electrode layer is provided on the entire surface, the entire first substrate is electrically connected to the first substrate via the electrode layer by soldering or the like, and simultaneously and easily thermally connected. Can be made.

  The thermoelectric element of the present invention is the thermoelectric element according to any one of the above-described aspects of the present invention, wherein the electrode layer is provided on a part of the surface of the first substrate, and a metal film is formed on the surface of the other region. Is formed.

  In the thermoelectric element according to the present invention, the electrode layer can be electrically connected to the substrate wiring by soldering or the like, and at the same time, the first substrate is connected via the metal film by soldering or the like, for example, the substrate body having the substrate wiring or the like It can be thermally bonded to the external member.

  The thermoelectric element according to the present invention is the thermoelectric element according to any one of the present inventions described above, wherein a second metal film is formed on the surface of the second substrate. .

  In the thermoelectric element according to the present invention, since the second metal film is also provided on the surface of the second substrate, the second substrate is adhered to an external member such as a heat sink by soldering or the like. , Can ensure thermal connection.

  Moreover, the thermoelectric element of the present invention is the thermoelectric element according to any one of the present inventions, wherein at least one of the first substrate and the second substrate is formed of a material mainly composed of a resin. It is characterized by being.

  In the thermoelectric element according to the present invention, since the substrate can be formed of a material mainly composed of a resin such as polyimide resin, it can be manufactured at low cost. In addition, since the workability is good, it is easy to produce a desired shape with high accuracy, leading to an improvement in reliability. Furthermore, since it has strength and flexibility, it can be made as thin as possible, and is efficient when heating or cooling.

  The circuit board of the present invention has the thermoelectric element according to any one of the present invention and the substrate wiring on which the temperature controlled object is mounted and electrically connected to the electrode layer on the surface. A substrate body attached to the surface of the first substrate across the substrate wiring, and attached to the surface of the second substrate to dissipate heat from the object to be controlled or to control the object And a heat sink for storing heat applied to the heat sink.

The circuit board according to the present invention does not require a conventional lead wire, and has a thermoelectric element having an electrode layer on the surface of the first substrate. Simultaneously with the electrical connection, the substrate body can be thermally attached to the surface of the first substrate via the substrate wiring. As described above, the thermal connection and the electrical connection can be performed at the same time, and the workability can be greatly improved as compared with the conventional case. Further, the temperature controlled object can be instantaneously heated or cooled via the substrate body due to the relationship with the heat sink attached to the second substrate side.
In particular, it is possible to simultaneously supply power to the thermoelectric element and power to the object to be temperature controlled via the substrate wiring, so that the power supply method becomes simpler.

  The circuit board of the present invention includes a thermoelectric element according to any one of the present inventions, a substrate body on which the object to be temperature controlled is mounted and attached to the surface of the second substrate, and the electrodes The substrate wiring electrically connected to the layer is provided on the surface and attached to the surface of the first substrate across the substrate wiring, and heat from the temperature controlled object is radiated or transferred to the temperature controlled object. It is characterized by including a heat sink for storing heat to be applied.

The circuit board according to the present invention does not require a conventional lead wire, and has a thermoelectric element having an electrode layer on the surface of the first substrate. Simultaneously with the electrical connection, a heat sink can be thermally attached to the surface of the first substrate via the substrate wiring. As described above, the thermal connection and the electrical connection can be performed at the same time, and the workability can be greatly improved as compared with the conventional case. In addition, the object to be controlled can be instantaneously heated or cooled via the substrate body depending on the relationship with the heat sink attached to the first substrate side.
In particular, since the electrode layer is located on the opposite side of the object to be temperature controlled with the p-type thermoelectric element and the n-type thermoelectric element sandwiched therebetween, the influence of heat generated during power supply is applied to the object to be temperature controlled. Hard to give. Therefore, particularly when the object to be controlled is cooled, the cooling efficiency is further improved.

  The circuit board of the present invention is the circuit board of the present invention, wherein at least one of the first substrate and the second substrate has a thermal expansion coefficient substantially the same as the material forming the substrate body. It is formed by the material which has this.

  In the circuit boards according to the present invention, the thermal expansion coefficients of the mutual boards can be made substantially the same, so that when the temperature rises, deformation due to the difference in the thermal expansion coefficient can be prevented, and the reliability against heat can be improved. it can.

  Moreover, an electronic apparatus according to the present invention includes the circuit board according to any one of the present inventions.

  The electronic device according to the present invention does not require a conventional lead wire, and can be electrically and thermally connected at the same time, and has a circuit board with improved workability. Easy and efficient production.

  According to the thermoelectric element of the present invention, since the electrode layer is provided on the surface of the first substrate, the electrode layer and the substrate wiring can be easily electrically connected by soldering or the like. In addition, since the lead wire that has been used conventionally is unnecessary, there is no need to bother that the lead wire interferes with the work when making the electrical connection, and the work is easy and simple. Furthermore, simultaneously with the electrical connection, the first substrate can be thermally connected (mechanically connected) to the substrate body or the like having the substrate wiring via the electrode layer. There is no need to make separate connections and electrical connections. Therefore, workability can be improved without taking time and effort.

Moreover, according to the circuit board according to the present invention, since the thermoelectric element having the electrode layer is provided, the thermal connection and the electrical connection can be performed at the same time. Improvements can be made.
In addition, according to the electronic apparatus according to the present invention, the conventional lead wire is unnecessary, and the electrical connection and the thermal connection can be performed at the same time, and the circuit board has improved workability. Manufacturing is easy and efficient.

Hereinafter, a first embodiment of a thermoelectric element, a circuit board, and an electronic device according to the present invention will be described with reference to FIGS. 1 to 3.
As shown in FIG. 1, a cellular phone (electronic device) 1 according to the present embodiment includes a circuit board 2, a casing (not shown) that houses the circuit board 2, and a CCD that is provided in the casing and will be described later. (Temperature controlled object) a lens unit (not shown) arranged adjacent to the object 4, a power source unit (not shown) that is arranged inside the housing and supplies power to the circuit board 2, and is arranged inside the housing A control unit (not shown) for comprehensively controlling these components is provided.

The circuit board 2 includes a Peltier element (thermoelectric element) 3 and a substrate wiring 5 on which a CCD 4 is mounted and electrically connected to an electrode layer to be described later. A mounting substrate (substrate body) 6 attached to the surface 10a of the first substrate 10 and a metal heat sink 7 attached to the surface 11a of the second substrate 11 of the Peltier element 3 and dissipating heat from the CCD 4. I have.
In the present embodiment, a case where the Peltier element 3 cools the CCD 4 will be described as an example.

  In the present embodiment, the mounting substrate 6 is made of ceramics, and the CCD 4 is mounted on the surface 6a. Further, the substrate wiring 5 is provided on the back surface 6b of the mounting substrate 6, and the substrate wiring 5 is electrically connected to the CCD 4 and the control unit. Thus, the control unit can operate the power supply unit to supply power to the CCD 4 and control the operation.

The Peltier element 3 can be arbitrarily cooled based on the electric power supplied to the CCD 4 electrically connected to the substrate wiring 5, and has a predetermined interval as shown in FIGS. The first substrate 10 and the second substrate 11 that are arranged in parallel and formed of an insulating material, and are sandwiched between the first substrate 10 and the second substrate 11. A plurality of p-type thermoelectric elements 12 and n-type thermoelectric elements 13, and back surfaces 10b and 11b of the first substrate 10 and the second substrate 11, respectively. A bonding electrode 14 that is PN-bonded and electrically connected in series, and is provided at least on the front surface 10a of the first substrate 10 and is electrically connected to the bonding electrode 14 formed on the back surface 10b and is connected to the substrate wiring. 5 is a metal material that can be electrically connected And an electrode layer 15 made.
The Peltier element 3 supplies power to the p-type thermoelectric element 12 and the n-type thermoelectric element 13 via the electrode layer 15 and the bonding electrode 14, and cools the CCD 4 via the first substrate 10. It has become. This will be described in detail later.

The first substrate 10 and the second substrate 11 are made of alumina, for example. In addition, as shown in FIGS. 2 and 3, the first substrate 10 has two through holes (through holes) 16 having openings on the front surface 10 a and the back surface 10 b, respectively.
The electrode layer 15 is, for example, a metal film laminated in the order of copper, nickel, and gold from the first substrate 10 side, and is provided on the entire surface 10a of the first substrate 10 as shown in FIG. It has a positive electrode side electrode layer 15a and a negative electrode side electrode layer 15b that are electrically connected to the positive electrode side (+ side) and the negative electrode side (− side) of the bonding electrode 14, respectively.
The positive electrode side electrode layer 15a and the negative electrode side electrode layer 15b are provided so as to have the same area while being electrically independent from each other.
The positive electrode side electrode layer 15a and the negative electrode side electrode layer 15b are formed so as to cover at least the inner peripheral surface of the through hole 16, and are electrically connected to the bonding electrode 14 through the inner peripheral surface. It has become. That is, in the present embodiment, as shown in FIG. 2, the interior of the through hole 16 is formed.

The Peltier element 3 is connected to the control unit via the bonding electrode 14, the electrode layer 15, and the substrate wiring 5, and the control unit performs p-type thermoelectric so that the surface 10 a of the first substrate 10 is cooled. The direction of electrons flowing through the element 12 and the n-type thermoelectric element 13 is controlled.
Further, as shown in FIG. 1, the first substrate 10 is bonded to the mounting substrate 6 by “solder” 17 and the electrode layer 15, and the second substrate 11 is made of thermally conductive grease such as silicon gel, silver It is bonded to the heat sink 7 by a paste or an adhesive 18. Thereby, the first substrate 10 and the second substrate 11 are in a state of being in surface contact with the mounting substrate 6 and the heat sink 7 reliably.

Next, the case where the circuit board 2 configured as described above is manufactured will be described below.
First, the first substrate 10 of the Peltier element 3 is attached to the mounting substrate 6. That is, since the electrode layer 15 composed of the positive electrode layer 15a and the negative electrode layer 15b is formed on the entire surface 10a of the first substrate 10, the electrode layer 15 and the substrate can be formed by soldering. The wiring 5 can be easily electrically connected. In particular, since the electrode layer 15 is a metal film laminated with copper, nickel, and gold, the “solder” 17 can be easily attached and a reliable electrical connection can be performed.
In addition, since the lead wire that has been used conventionally is unnecessary, there is no need to bother that the lead wire interferes with the work when making the electrical connection, and the work is easy and simple.

Simultaneously with this electrical connection, the first substrate 10 can be thermally connected (mechanically connected) to the mounting substrate 6 by the “solder” 17 through the electrode layer 15. In other words, the thermal connection and the electrical connection are not performed separately as in the prior art, but the thermal connection and the electrical connection can be performed simultaneously by a single operation by soldering. Therefore, work efficiency can be improved without taking time and effort.
Then, after the first substrate 10 and the mounting substrate 6 are bonded by the electrode layer 15 and the “solder” 17, the heat sink 7 is bonded to the surface 11 a of the second substrate 11 through the adhesive 18 described above.
In this way, the circuit board 2 can be manufactured.

Then, heat is transferred between the p-type thermoelectric element 12 and the n-type thermoelectric element 13 by supplying electric power from the control unit to the Peltier element 3 via the substrate wiring 5, the electrode layer 15, and the bonding electrode 14. Thus, the first substrate 10 can be cooled, and the CCD 4 can be cooled via the mounting substrate 6. The heat generated by the CCD 4 is radiated from the heat sink 7 to the atmosphere via the second substrate 11.
In particular, the first substrate 10 and the second substrate 11 are reliably in surface contact with the mounting substrate 6 and the heat sink 7 by the electrode layer 15, the “solder” 17 and the adhesive 18, respectively. Smooth and efficient cooling and heat dissipation.

As described above, according to the Peltier element 3 of the present embodiment, since the electrode layer 15 is provided on the surface 10a of the first substrate 10, electrical connection and thermal connection can be performed simultaneously. In addition, since the lead wire that has been conventionally used is unnecessary, the work can be performed without feeling troublesome such as the lead wire interfering with the work. Therefore, it is easy to work and work efficiency can be improved.
In addition, since the electrode layer 15 is electrically connected to the bonding electrode 14 using the through hole 16, an electrical path from the front surface 10a of the first substrate 10 to the back surface 10b is exposed to the outside. Without being hidden inside the first substrate 10. Therefore, the possibility of contact from the outside is eliminated as much as possible, and the reliability can be improved.
In the present embodiment, since the electrode layer 15 is formed so as to fill the inside of the through hole 16, the contact area is increased and the electrical connection with the bonding electrode 14 is ensured. This also improves the reliability.
Furthermore, since the electrode layer 15 is provided on the entire surface of the first substrate 10, the entire first substrate 10 can be easily and reliably thermally connected to the mounting substrate 6 by soldering.

  In addition, according to the circuit board 2 of the present embodiment, since the Peltier element 3 having the electrode layer 15 is provided, thermal connection and electrical connection can be performed simultaneously, which is far more than conventional. Workability is improved. Further, due to the relationship with the heat sink 7 attached to the second substrate 11 side, the CCD 4 can be instantaneously cooled via the mounting substrate 6 and the heat of the CCD 4 can be radiated to the atmosphere. In particular, since the power supply to the Peltier element 3 and the power supply to the CCD 4 can be performed simultaneously via the substrate wiring 5, the power supply method is simplified.

  Further, according to the mobile phone 1 of the present embodiment, the temperature increase of the CCD 4 can be effectively suppressed by the Peltier element 3, so that the generation of noise due to the temperature increase is suppressed as much as possible and the deterioration of the image quality is eliminated. Can do. In addition, since the conventional circuit board 2 which does not require a conventional lead wire, can perform electrical connection and thermal connection at the same time, and has improved workability, can be manufactured easily and efficiently. It can be performed.

Next, a second embodiment of the circuit board according to the present invention will be described with reference to FIG. Note that the same reference numerals in the second embodiment denote the same components as those in the first embodiment, and a description thereof will be omitted.
The difference between the second embodiment and the first embodiment is that the mounting substrate 6 of the first embodiment is provided with the substrate wiring 5 on the side to be bonded to the first substrate 10, that is, on the back surface 6b side. On the other hand, the mounting substrate 6 of the second embodiment is that the substrate wiring 5 is led through the through hole 20 from the opposite surface to which the first substrate 10 is attached, that is, the surface 6a side.
The substrate wiring 5 is electrically connected to the flexible substrate 21 on the surface 6 a side of the mounting substrate 6, and is electrically connected to the control unit via the flexible substrate 21. Further, the CCD 4 of this embodiment is mounted on the surface 6 a of the mounting substrate 6 by solder bumps.

  As described above, the mounting substrate 6 is generally configured to consolidate mounted products such as the substrate wiring 5 and the CCD 4 on one side, but even in such a case, the substrate wiring is provided via the through hole 16 or the like. The Peltier element 3 can be easily electrically and thermally connected simply by taking 5 out to the back surface 6b side.

In each of the above embodiments, the electrode layer 15 is electrically connected to the bonding electrode 14 using the through-holes 16. However, the present invention is not limited to this. For example, as shown in FIG. 10 may be electrically connected to the bonding electrode 14 so as to go around the side surface 10c.
In this case, since it is not necessary to form the through hole 16 or the like in the first substrate 10, the step of forming the through hole 16 can be eliminated and the strength of the first substrate 10 is affected. Absent. Further, since the electrode layer 15 and the bonding electrode 14 can be electrically connected by simply turning around the side surface 10c of the first substrate 10, the workability can be further improved.

In each of the above embodiments, both the first substrate 10 and the second substrate 11 are made of alumina. However, the present invention is not limited to alumina. For example, as shown in FIG. 6, the first substrate 10 may be formed of a resin-based material such as a polyimide resin.
By doing so, the first substrate 10 can be manufactured at a lower cost, and the cost can be reduced. Further, since the workability is good, it is easy to manufacture in a desired shape, and the through hole 16 can be formed with high accuracy, so that the reliability can be improved.
Furthermore, since it has intensity | strength and a softness | flexibility, as shown in FIG. 6, it can be made as thin as possible (for example, 1 micrometer-100 micrometers), and it can cool more efficiently.
In addition, it is not limited to a polyimide resin, What is necessary is just a resin as a main component. Further, glass fiber or the like may be added to make the strength stronger.

  In particular, when the mounting substrate 6 is similarly formed of a resin-based material, such as a polyimide resin, the thermal expansion coefficients of the mounting substrate 6 and the first substrate 10 can be made the same. By doing so, when the temperature rises, deformation of the Peltier element 3 due to a difference in thermal expansion coefficient can be prevented, and reliability with respect to heat can be improved.

  Further, as shown in FIG. 7, the second substrate 11 may be formed of a polyimide resin in the same manner as the first substrate 10. The effect in this case is the same as described above. In this case, in particular, the overall thickness can be further reduced, so that further downsizing can be achieved.

Further, in the case of the Peltier element 3 in FIGS. 6 and 7 described above, as shown in FIGS. 8 and 9, a metallized layer formed of a metal film similar to the electrode layer 15 on the surface 11 a of the second substrate 11. (Second metal film) 25 may be provided.
By doing so, when the heat sink 7 is bonded to the second substrate 11, thermal connection can be surely performed by soldering. In particular, when the first substrate 10 is soldered, the heat sink 7 can be attached at the same time, so that workability can be further improved.
Note that the metallized layer 25 may be provided on the second substrate 11 of the Peltier element 3 of the first and second embodiments.

In each of the above embodiments, the positive electrode side electrode layer 15a and the negative electrode side electrode layer 15b of the electrode layer 15 are formed so as to have the same area (so that the surface area of the first substrate 10 is divided into two). However, this ratio may be set arbitrarily. For example, as shown in FIG. 10, the positive electrode side electrode layer 15a may be formed so as to have a larger area than the negative electrode side electrode layer 15b. Even in this case, the effect is the same.
Thus, the ratio and position of the positive electrode layer 15a and the negative electrode layer 15b may be set freely.

  Furthermore, as shown in FIGS. 11 and 12, the electrode layer 15 may be provided in a partial region of the surface 10a of the first substrate 10 and a metallized layer (metal film) 26 may be formed in another region. . In this case, since the first substrate 10 can be thermally connected to the mounting substrate 6 through the metallized layer 26, it is necessary to provide the substrate wiring 5 so as to cover the entire surface 10a of the mounting substrate 6. Absent. As described above, even if the space for forming the substrate wiring 5 is small, the Peltier element 3 can be reliably electrically and thermally connected to the mounting substrate 6.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

For example, in each of the above embodiments, a mobile phone is adopted as an example of an electronic device, but the present invention is not limited to a mobile phone. For example, an electronic device such as a digital camera may be used.
In each of the above embodiments, the CCD is adopted as an example of the object to be temperature controlled, but is not limited to the CCD. For example, a CMOS, IC chip or the like may be used. Furthermore, although the case where the CCD is cooled is taken as an example, the present invention is not limited to cooling, and can be applied to the case where the object to be controlled is heated.
The CCD is not limited to the front surface side of the mounting substrate, and may be mounted on the back surface side.

Further, in each of the above embodiments, the first substrate is attached to the mounting substrate, but a heat sink may be attached to the first substrate. In this case, the substrate wiring of the mounting substrate may be branched and provided on the surface of the heat sink. And while connecting this board | substrate wiring and an electrode layer electrically, a 1st board | substrate and a heat sink are thermally connected by this electrode layer or a metallization layer as shown in FIG.
The operational effects of the circuit board configured as described above are the same as those of the above-described embodiments. In particular, since the electrode layer is positioned on the opposite side of the CCD with the p-type thermoelectric element and the n-type thermoelectric element interposed therebetween, it is difficult to affect the CCD due to the heat generated during power supply. Therefore, the cooling efficiency can be further improved.

It is sectional drawing which shows 1st Embodiment of the mobile telephone (electronic device) which concerns on this invention, a circuit board, and a Peltier device (thermoelectric device). It is sectional drawing of the Peltier device shown in FIG. It is the figure which looked at the Peltier device shown in FIG. 2 from the upper surface of the 1st board | substrate. It is sectional drawing which shows 2nd Embodiment of the mobile telephone (electronic device) which concerns on this invention, a circuit board, and a Peltier device (thermoelectric device). FIG. 3 is a view showing another example of the Peltier element shown in FIG. 2, in which the electrode layer goes around the side surface of the first substrate and is electrically connected to the bonding electrode formed on the back surface. FIG. It is a figure which shows the other example of the Peltier device shown in FIG. 2, Comprising: It is sectional drawing of the Peltier device in which the 1st board | substrate is formed with the material which has resin as a main component. It is a figure which shows the other example of the Peltier device shown in FIG. 2, Comprising: It is sectional drawing of the Peltier device in which the 1st board | substrate and the 2nd board | substrate are formed with the material which has resin as a main component. FIG. 3 is a diagram showing another example of the Peltier element shown in FIG. 2, wherein the first substrate is formed of a material mainly composed of a resin, and a metallized layer is formed on the surface of the second substrate. It is sectional drawing of a Peltier device. FIG. 3 is a diagram showing another example of the Peltier element shown in FIG. 2, in which the first substrate and the second substrate are formed of a resin-based material, and a metallized layer is formed on the surface of the second substrate. It is sectional drawing of the Peltier device in which is formed. It is a figure which shows the other example of the Peltier device shown in FIG. 2, Comprising: The positive electrode side electrode layer is a figure which shows the Peltier device with much area which occupies the surface of a 1st board | substrate compared with the negative electrode side electrode layer. FIG. 3 is a diagram showing another example of the Peltier element shown in FIG. 2, in which an electrode layer including a positive electrode layer and a negative electrode layer is provided on a part of the surface of the first substrate, and a metallized layer is formed in another region. It is a figure which shows the Peltier device in which is formed. It is a figure which shows the modification of the Peltier device shown in FIG. 11, Comprising: It is a figure which shows the Peltier device in which the positive electrode side electrode layer and the negative electrode side electrode layer are formed on both sides of a metallization layer. It is sectional drawing which shows the attachment state of the conventional Peltier device.

Explanation of symbols

1 Mobile phone (electronic equipment)
2 Circuit board 3 Peltier element (thermoelectric element)
4 CCD (temperature controlled object)
5 Board wiring 6 Mounting board (board body)
7 heat sink 10 first substrate 11 second substrate 12 p-type thermoelectric element 13 n-type thermoelectric element 14 bonding electrode 15 electrode layer 16 through hole (through hole)
25 Second metal film (metallized layer)
26 Metal film (metallized layer)

Claims (5)

A thermoelectric element that can arbitrarily heat or cool a temperature-controlled object electrically connected to a substrate wiring formed on a substrate body formed of an insulating material containing resin as a main component based on supplied power. There,
A first substrate and a second substrate, which are arranged in parallel at a predetermined interval, have substantially the same coefficient of thermal expansion as the material forming the substrate body, and are formed of an insulating material mainly composed of a resin. A substrate of
A second metal film formed on the surface of the second substrate;
A plurality of p-type thermoelectric elements and n-type thermoelectric elements provided in a state of being sandwiched between the first substrate and the second substrate;
A bonding electrode formed on the back surface of each of the first substrate and the second substrate and electrically connecting the p-type thermoelectric element and the n-type thermoelectric element in series;
A through hole formed in the first substrate and having an opening on each of the front surface and the back surface;
It is formed so as to cover at least the inner peripheral surface of the through hole, and is electrically connected to the bonding electrode formed on the back surface of the first substrate through the inner peripheral surface and electrically connected to the substrate wiring. An electrode layer made of a connectable metal material,
The substrate main body has the substrate wiring on the surface on which the temperature controlled object is mounted and is electrically connected to the electrode layer, and is attached to the surface of the first substrate across the substrate wiring. ,
Power is supplied to the p-type thermoelectric element and the n-type thermoelectric element via the electrode layer and the bonding electrode, and the temperature controlled object is cooled via the first substrate or the second substrate. Alternatively, a thermoelectric element that is heated. The thermoelectric device according to claim 1, wherein
The thermoelectric element, wherein the electrode layer is provided on the entire surface of the first substrate. The thermoelectric device according to claim 1 , wherein
The electrode layer is provided on a part of the surface of the first substrate, and a metal film is formed on the surface of another region. The thermoelectric element according to any one of claims 1 to 3,
A circuit board, comprising: a heat sink attached to the surface of the second substrate and configured to dissipate heat from the object to be controlled or store heat to be given to the object to be controlled.   An electronic apparatus comprising the circuit board according to claim 4.

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