JP2011086737A - Thermoelectric conversion module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermoelectric conversion module capable of assuring a heat radiative performance and an endothermic performance, such as to maintain a trouble-free size for an electric wiring work (a wiring work), at mounting of electrodes. <P>SOLUTION: A thermoelectric conversion module 1 includes a thermoelectric semiconductor element 2; an endothermic part insulation property substrate 3b constituting an endothermic part disposed facing each other so as to sandwich the thermoelectric semiconductor element 2; and a heat radiation insulation property substrate 3a constituting the endothermic part; and uses the peltier effect caused by current drawn in the thermoelectric semiconductor element 2 via the endothermic part insulating property substrate 3b and an electric wiring pattern 4 formed on the endothermic part insulating property substrate 3a; and electrical pads 5 for electrically connecting the thermoelectric conversion module 1 and the outside of the thermoelectric conversion module 1 with a surface other than the surface contacting the thermoelectric semiconductor element 2 of either or both of the endothermic part insulating property substrate 3b or the heat radiation part insulating property substrate 3a. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a configuration of a thermoelectric conversion module using the Peltier effect of a thermoelectric semiconductor element.

  A thermoelectric conversion module equipped with a thermoelectric semiconductor element is a module for thermal control using the Peltier effect that when current flows through a junction of two types of conductive semiconductors, heat is transported together with the current. It is easy to miniaturize and is suitable for parts applications that require local thermal control, and because there is no moving part, a quiet thermal control device that does not generate vibration can be configured, and it is relatively simple by controlling electrical signals It has many advantages such as precise temperature control by operation, and is applied in various fields.

  FIG. 4 is a schematic view of a thermoelectric exchange module of a type having an electrode cable on which a conventional thermoelectric semiconductor element is mounted.

  As shown in FIG. 4, a thermoelectric exchange module 100 of the type having an electrode cable on which a conventional thermoelectric semiconductor element is mounted has a configuration in which thermoelectric semiconductor elements 101 having first or second conductivity are alternately arranged. Between the thermoelectric semiconductor elements 101 and the electric wiring pattern 103 for connecting the alternately arranged thermoelectric semiconductor elements 101 and the electric current for energizing the thermoelectric semiconductor elements. And a wiring cable 104.

FIG. 5 is a schematic view of a thermoelectric exchange module having an electrode pad on which a conventional thermoelectric semiconductor element is mounted.
As shown in FIG. 5, a thermoelectric exchange module 100 having an electrode pad on which a conventional thermoelectric semiconductor element is mounted has a configuration in which thermoelectric semiconductor elements 101 having first or second conductivity are alternately arranged. It has a configuration sandwiched between insulating substrates 102 constituting a heat radiating portion or a heat absorbing portion, and is composed of an electric wiring pattern 103 for connecting alternately arranged thermoelectric semiconductor elements 101 and electrode pads 105.

  As described above, in the thermoelectric conversion module 100 equipped with the conventional thermoelectric semiconductor element, the thermoelectric semiconductor element 101 is disposed and used for electrical wiring so that the two types of conductive thermoelectric semiconductor elements 101 are alternately connected. A pair of electrodes that are electrically wired by the cable 104 and flow current are configured.

  The conventional thermoelectric conversion module 100 shown in FIG. 4 has a general shape of a thermoelectric conversion module used for relatively large devices and parts, and is connected to an external electric signal controller or an external electric signal controller. The electrode extraction portion of the thermoelectric exchange module 100 so that the electrical connection can be easily made by connecting or soldering the wiring coming out of the thermoelectric conversion module 100 using the electrodes via the terminals and the substrate that are formed. An electrical wiring cable 104 is connected to the cable. Further, the conventional thermoelectric conversion module 100 shown in FIG. 5 has a shape that is often used for a relatively small electric module, optical module, and the like, and includes an electrode pad 105.

FIG. 6 is a schematic diagram showing a configuration example of a thermoelectric exchange module in a conventional general optical module and components mounted thereon.
As shown in FIG. 6, a conventional general optical module includes an optical semiconductor chip 106 such as a DFB laser chip, a thermistor chip 107, a photodiode (PD) 108, a carrier 109, and a thermoelectric exchange module 100. A heat sink 110 for an optical semiconductor chip such as a DFB laser chip and a wiring board 111 with electronic components such as a wiring board or a matching resistor are mounted. The optical module includes an optical lens 112, an isolator 113, and an optical module housing 114.

  For example, in an optical module equipped with a direct modulation DFB laser, an optical semiconductor chip 106 such as a DFB laser chip that is an optical device, a thermistor chip 107 for temperature monitoring, a PD 108 for laser output monitoring, an optical lens 112, an isolator 113, and the like. A plurality of components are housed in a small optical module housing 114 at a high density.

  And in an optical module, since position adjustment of parts for optical connection and electrical wiring are needed, the thermoelectric conversion module 100 used for this is small and electrical wiring is performed in a narrow space. In general, a device having an electrode pad 105 corresponding to electrical wiring using a wire bonder or the like is used.

  Here, when attention is paid to the attachment position of an electrode or electrode cable for electrical connection with an external device for controlling the operation of the thermoelectric conversion module 100, the conventional thermoelectric conversion module 100 has an insulation sandwiching the thermoelectric semiconductor element 101 therebetween. In general, an electrode is formed in the same surface as the surface of the heat-dissipating surface or the heat-absorbing surface that is disposed opposite to the thermoelectric semiconductor element 101, and most of the insulating substrate is a heat-dissipating surface. 102 was configured.

  In order to increase the heat dissipation efficiency of the heat dissipation surface, the surface facing the thermoelectric semiconductor element 101 on the heat dissipation surface can be secured with a large area in contact with external components, and the heat absorption efficiency of the heat absorption surface is also increased. This is because the purpose is to arrange the electrodes so that the surface of the heat absorbing surface opposite to the surface in contact with the thermoelectric semiconductor element 101 can secure a large area in contact with the heat absorbing component.

“Transistor Technology”, November 2003, p. 203-204 “Furukawa Electric Time Report”, No. 115, January 2005, p. 21-25

  In an optical module or the like used in an optical communication system, a resistance component or the like added to efficiently guide a laser chip or a high-frequency electric signal to an optical device is mounted. These components generate heat during operation. For example, in a laser module, temperature control may be necessary because the chip temperature affects chip characteristics. Therefore, in many optical modules, a thermoelectric exchange module for controlling the chip temperature has been mounted.

  However, as shown in FIG. 6, in the optical module, compared to the size of the thermoelectric conversion module 100 for ensuring heat absorption performance, an optical semiconductor chip 106 such as a DFB laser chip, which is an optical device that is a main heating element, Resistive components were mostly small enough. Therefore, generally, an optical semiconductor chip 106 such as a DFB laser chip mounted on the surface of the insulating substrate 102 constituting the heat absorption surface of the thermoelectric exchange module 100 or on the heat absorption surface of the thermoelectric exchange module 100 is mounted. There is a case where there is a heat distribution in the part, and it is not necessary to use the entire heat absorption surface of the thermoelectric exchange module 100 for heat absorption.

  In addition, in the small TO-CAN package and the like that are actively developed for cost reduction of the optical module, it is an essential condition that the Peltier element is also small, and it is necessary to ensure the necessary heat absorption performance. For this reason, it is essential to arrange as many thermoelectric semiconductor elements 101 as possible on the insulating substrate 102, and it is necessary for mounting wiring work such as miniaturization of the electrode portion for connection with an external device or an external device and wire bonding. Therefore, it has been necessary to design a new electrode part that satisfies the conflicting requirements of ensuring an appropriate electrode size (that is, ensuring a large electrode part size).

  In view of the above, the present invention provides a thermoelectric exchange module capable of ensuring heat radiation performance and heat absorption performance while maintaining a size that does not hinder electrical wiring work (wiring work) when mounting electrodes. With the goal.

The thermoelectric conversion module according to the first invention for solving the above-mentioned problems is
A heat-absorbing-part insulating substrate constituting a heat-absorbing part and a heat-dissipating part-insulating substrate constituting a heat-dissipating part; And in the thermoelectric conversion module using the Peltier effect generated by flowing a current to the thermoelectric semiconductor element through the electrical wiring formed on the heat dissipation part insulating substrate,
The thermoelectric exchange module and the outside of the thermoelectric exchange module are electrically connected to a surface other than the surface in contact with the thermoelectric semiconductor element in one or both of the heat absorbing portion insulating substrate and the heat dissipation portion insulating substrate. An electrode to be formed is formed.

A thermoelectric conversion module according to a second invention that solves the above problem is the thermoelectric conversion module according to the first invention.
A through-hole electrical wiring that penetrates through the heat-absorbing part insulating substrate or the heat-radiating part insulating substrate and electrically connects the electrical wiring and the electrode is provided.

The thermoelectric conversion module according to a third invention for solving the above-mentioned problems is the thermoelectric conversion module according to the first invention or the second invention.
The heat-absorbing part insulating substrate and the heat-dissipating part insulating substrate have the same area.

The thermoelectric conversion module according to a fourth invention for solving the above-mentioned problems is the thermoelectric conversion module according to the first invention or the second invention.
The fitting structure of the shape according to the shape of the pin for electrical wiring comprised in the stem in TO-CAN is formed in the side surface of the said heat absorption part insulating board | substrate or the said heat sinking part insulation board | substrate.

  ADVANTAGE OF THE INVENTION According to this invention, the thermoelectric exchange module which can ensure heat dissipation performance and heat absorption performance can be provided, maintaining the size which does not have trouble in electrical wiring work (wiring work) at the time of mounting of an electrode.

It is a schematic diagram of the thermoelectric exchange module which concerns on the 1st Example of this invention. It is a schematic diagram of the thermoelectric exchange module which concerns on the 2nd Example of this invention. It is a schematic diagram of the thermoelectric exchange module which concerns on the 3rd Example of this invention. It is a schematic diagram of the type of thermoelectric exchange module which has the electrode cable carrying the conventional thermoelectric semiconductor element. It is a schematic diagram of the type of thermoelectric exchange module which has an electrode pad carrying the conventional thermoelectric semiconductor element. It is the schematic diagram which showed the structural example of the thermoelectric exchange module in the conventional general optical module, and the components mounted on it.

  Hereinafter, the form for implementing the thermoelectric conversion module which concerns on this invention is demonstrated, referring drawings.

Hereinafter, a first embodiment of a thermoelectric exchange module according to the present invention will be described.
FIG. 1 is a schematic diagram of a thermoelectric exchange module according to a first embodiment of the present invention. 1A is a perspective view of the thermoelectric exchange module according to the first embodiment of the present invention as viewed from above, and FIG. 1B is a lower view of the thermoelectric exchange module according to the first embodiment of the present invention. The perspective view seen from is shown.

  As shown in FIG. 1, the thermoelectric exchange module 1 according to the present embodiment has a heat dissipating part insulating property that constitutes a heat dissipating part by alternately arranging the thermoelectric semiconductor elements 2 having the first or second conductivity. An electric wiring pattern 4 for connecting the thermoelectric semiconductor elements 2 arranged alternately with the substrate 3a and the heat-absorbing-part insulating substrate 3b constituting the heat-absorbing part, and the heat-absorbing-part insulating substrate 3b The electrode pad 5 is formed. In the present embodiment, the heat radiating portion insulating substrate 3a is described as a heat radiating surface, and the heat absorbing portion insulating substrate 3b is described as a heat absorbing surface.

  The thermoelectric exchange module 1 according to the present embodiment is configured such that the thermoelectric semiconductor element 2 is sandwiched between the heat dissipating part insulating substrate 3a and the heat absorbing part insulating substrate 3b. Electrode wiring is provided on each of the heat-dissipating part insulating substrate 3a and the heat-absorbing part insulating substrate 3b with which the thermoelectric semiconductor elements 2 are in contact so that the two types of thermoelectric semiconductor elements 2 having electrical conductivity are alternately connected to each other. A pattern 4 is formed, and the electrode wiring pattern 4 and the thermoelectric semiconductor element 2 are connected via solder.

  In this embodiment, the heat absorption part insulating substrate 3b is patterned so that both ends of the electric wiring pattern 4 are formed. Both ends of the electric wiring pattern 4 are connected to electrode pads 5 formed on the surface of the heat absorbing part insulating substrate 3b facing the thermoelectric semiconductor element 2 through a metal pattern formed on the side surface of the heat absorbing part insulating substrate 3b. Has been.

  On the surface on which the electrode pad 5 is formed, in addition to the electrode pad 5, an optical semiconductor chip 10 such as a DFB laser chip, a heat sink 13 for an optical semiconductor chip such as a thermistor chip 11 and a DFB laser chip, and a component such as a wiring board 14 There are pads (not shown) for fixing the carrier 12 carrying the solder with solder, and the pads are arranged at intervals so as not to be short-circuited by bleeding of solder or the like.

  In this embodiment, the heat-radiating part insulating substrate 3a and the heat-absorbing-part insulating substrate 3b have the same size. However, the heat-dissipating-part insulating substrate 3a and the heat-absorbing-part insulating substrate 3b having different sizes are used. May be. In this embodiment, the electrode pad 5 is formed on the heat-absorbing part insulating substrate 3b. However, even if the electrode pad 5 is formed on the heat-dissipating part insulating substrate 3a, the heat-absorbing-part insulating substrate 3b and the heat-dissipating part are insulative. Electrode pads 5 may be formed on both of the substrates 3a.

  Therefore, according to the thermoelectric exchange module according to the present embodiment, heat dissipation performance and heat absorption performance can be ensured while maintaining a size that does not hinder electric wiring work (wiring work) when the electrodes are mounted.

Hereinafter, a second embodiment of the thermoelectric exchange module according to the present invention will be described.
FIG. 2 is a schematic diagram of a thermoelectric exchange module according to a second embodiment of the present invention. 2A is a perspective view seen from above the thermoelectric exchange module according to the second embodiment of the present invention, and FIG. 2B is a lower view of the thermoelectric exchange module according to the second embodiment of the present invention. FIG. 2C is a schematic diagram of through-hole electrical wiring in the thermoelectric exchange module according to the second embodiment of the present invention.

  As shown in FIG. 2, the basic configuration of the thermoelectric exchange module 1 according to the present embodiment is substantially the same as the configuration of the thermoelectric exchange module 1 according to the first embodiment. A through-hole electrical wiring 6 is formed in the partial insulating substrate 3 b, and the electrical pad 5 and the thermoelectric semiconductor element 2 are electrically connected through the through-hole electrical wiring 6.

  For example, in the case where the heat-absorbing part insulating substrate 3b is made of ceramic, a conductive material to be the through-hole electrical wiring 6 is disposed in advance before the ceramic firing step, so that the through-hole electrical wiring 6 in the ceramic firing step. May be embedded in the ceramic. Further, for example, the through-hole electrical wiring 6 may be formed by forming a through-hole in a part of the ceramic substrate by laser irradiation or the like and applying electroless plating or the like to the inner wall of the through-hole.

  According to the thermoelectric exchange module 1 according to the present embodiment, by using the through-hole electrical wiring 6, other parts and foreign matters adhere to the side surfaces of the heat-dissipating part insulating substrate 3 a or the heat-absorbing part insulating substrate 3 b. A risk that a short circuit occurs between the pads 5 can be avoided.

Hereinafter, a third embodiment of the thermoelectric exchange module according to the present invention will be described.
FIG. 3 is a schematic diagram of a thermoelectric exchange module according to a third embodiment of the present invention. 3A is a perspective view of the thermoelectric exchange module according to the third embodiment of the present invention, and FIG. 1B is a fitting structure electrode portion in the thermoelectric exchange module according to the third embodiment of the present invention. FIG.

  The thermoelectric exchange module 1 which concerns on a present Example becomes a structure which can be mounted in a TO-CAN type | mold module. Generally, a stem 7 for fixing a chip or the like used in a TO-CAN type module has a pin 8 for electric wiring made of glass feedthrough. Since the size of the stem 7 itself is as small as φ5.6 mm, for example, it is an absolute condition that the components mounted on the stem 7 are also small.

  In addition, when a temperature adjustment component is mounted on a TO-CAN type module, the main path for heat exchange with the outside is the small and thin stem 7, so that the temperature adjustment component has high heat absorption or heat generation performance. Is required. For this reason, the thermoelectric exchange module 1 according to the present embodiment can secure the size of the thermoelectric exchange module 1 as large as possible in the TO-CAN stem 7 and can perform efficient wiring work in a narrow space. It was supposed to realize a possible configuration.

  As shown in FIG. 3, the basic configuration of the thermoelectric exchange module 1 according to the present embodiment is substantially the same as the configuration of the thermoelectric exchange module 1 according to the first and second embodiments, but according to the present embodiment. The thermoelectric exchange module 1 is patterned so that both ends of the electric wiring pattern 4 are formed on the heat dissipating part insulating substrate 3a. Both ends of the electric wiring pattern 4 are connected to electrode pads 9 formed on a surface orthogonal to the thermoelectric semiconductor element 2 in the heat dissipation part insulating substrate 3a through a metal pattern formed on the side surface of the heat dissipation part insulating substrate 3a. Has been. The heat dissipating portion insulating substrate 3 a is processed so that the portion where the electrode pad 9 is configured is fitted with the pin 8 for electric wiring formed on the stem 7.

  Further, in this embodiment, the heat dissipating part insulating substrate 3a is made larger than the heat absorbing part insulating substrate 3b so that the electric wiring work by fitting is not difficult due to the bending of the pin 8 configured on the stem 7, etc. Only the side surface on which the electrode pad 9 is formed on the fitting structure protrudes from the heat absorbing portion insulating substrate 3b.

  In this embodiment, the heat sink insulating substrate 3a is fitted to the side surface and the electrode pad 9 is configured. However, the heat absorbing portion insulating substrate 3b or the heat absorbing portion insulating substrate 3b and the heat sink insulating substrate 3a The fitting structure and the electrode pad 9 may be formed on both. In this embodiment, the two fitting structures and the electrode pads 9 are configured on one side surface of the heat-dissipating part insulating substrate 3a. However, the fitting structure and the electrode pad 9 may be configured on different side surfaces.

  As described above, according to the thermoelectric conversion module according to the present invention, the heat-radiating part insulating substrate 3a or the heat-absorbing part insulating property that had to be enlarged only for forming the electrode pads 5 and 9 in the thermoelectric exchange module 1 is used. Since the space of the substrate 3b can be omitted, the thermoelectric exchange module 1 can be made small.

  Further, according to the thermoelectric conversion module according to the present invention, the position of the electrode pad 5 in the thermoelectric exchange module 1 is configured on the surface facing the component surface on which the thermoelectric exchange module 1 is mounted. Electric wiring can be done.

  Moreover, according to the thermoelectric conversion module according to the present invention, it is possible to configure the position of the electrode pad 9 in the thermoelectric exchange module 1 in the direction in which the pin 8 to the thermoelectric exchange module 1 is attached, for example, a TO-CAN module. Thus, it can be easily mounted on a small module having a small mounting space.

  The present invention can be used, for example, in the configuration of a thermoelectric conversion module that uses the Peltier effect of a thermoelectric semiconductor element.

DESCRIPTION OF SYMBOLS 1 Thermoelectric conversion module 2 Thermoelectric semiconductor element 3a Heat radiation part insulating substrate 3b Heat absorption part insulating substrate 4 Electrical wiring pattern 5, 9 Electrode pad 6 Through-hole electrical wiring 7 Stem 8 Pin 10 Optical semiconductor chip 11 Thermistor chip 12 Carrier 13 Heat sink 14 Wiring board 100 Conventional thermoelectric conversion module 101 Thermoelectric semiconductor element 102 Insulating substrate 103 Electric wiring pattern 104 Electric wiring cable 105 Electrode pad 106 Optical semiconductor chip 107 Thermistor chip 108 Photodiode (PD)
109 Carrier 110 Heat sink 111 Wiring board 112 Optical lens 113 Isolator 114 Optical module housing

Claims (4)

A heat-absorbing-part insulating substrate constituting a heat-absorbing part and a heat-dissipating part-insulating substrate constituting a heat-dissipating part; And in the thermoelectric conversion module using the Peltier effect generated by flowing a current to the thermoelectric semiconductor element through the electrical wiring formed on the heat dissipation part insulating substrate,
The thermoelectric exchange module and the outside of the thermoelectric exchange module are electrically connected to a surface other than the surface in contact with the thermoelectric semiconductor element in one or both of the heat absorbing portion insulating substrate and the heat dissipation portion insulating substrate. The thermoelectric conversion module characterized by forming the electrode to perform. 2. The thermoelectric conversion module according to claim 1, further comprising a through-hole electrical wiring that penetrates through the heat absorbing portion insulating substrate or the heat radiating portion insulating substrate and electrically connects the electrical wiring and the electrode. . 3. The thermoelectric conversion module according to claim 1, wherein areas of the heat-absorbing part insulating substrate and the heat-dissipating part insulating substrate are the same. The fitting structure of the shape according to the shape of the pin for electric wiring comprised in the stem in TO-CAN is formed in the side surface of the said heat absorption part insulation board | substrate or the said heat radiation part insulation board | substrate. The thermoelectric conversion module of any one of Claim 1 or Claim 2.

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