CN209608737U - Camera module and electronic equipment - Google Patents

Abstract

Disclose a kind of camera module and electronic equipment, which includes: first shell and second shell, positioned at camera module both ends and the component of camera module is accommodated wherein；Third shell is fixedly connected between first shell and second shell, and with the first shell and second shell；First circuit board, between the first shell and third shell；First side of the first heat conduction member, first heat conduction member is contacted with the first circuit board, and second side opposite with first side of first heat conduction member is contacted with the third shell.The heat that electronic component generates in the disclosure is quickly transmitted to middle casing by heat conduction member, the middle casing with high thermal conductivity is recycled to be dispersed into ambient air, significantly reduce the temperature inside camera, improve the heat dissipation effect of camera in use, the structure of camera module is simple simultaneously, will not influence its packaging efficiency.

Description

Camera module and electronic equipment

Technical field

The utility model relates to camera technical fields, and in particular to a kind of camera module and the electronics with it are set It is standby.

Background technique

As clarity requirement of the market to camera is higher and higher, from 300,000,1,000,000,2,000,000 or even 8,000,000 pictures The power of element, corresponding imaging sensor constantly increases；And the overall dimensions of camera module are towards the side being increasingly miniaturized To development, this is extremely unfavorable for the heat dissipation of camera module entirety.In the case where no any radiator structure, high-power image The own temperature of sensor can rise quickly, or even the normal working temperature beyond imaging sensor, so as to cause image sensing Device failure or service life seriously reduce；And higher imaging sensor temperature can make the air themperature liter inside camera module Height works so that the electronic component in camera module is under higher temperature, leads to electronic component service life reduction, no Conducive to the quality of camera.Further, since the focal length of camera module is to carry out assembling determination, camera lens and image at room temperature The focal length of sensor can generate certain linear expansion because of material in the lifting process using temperature, and it is non-to cause focal length to generate Expected variation influences the clarity of imaging.

Bipartite metal shell heat dissipation is usually used in the radiating mode of vehicle-mounted camera at present, utilizes metal High thermal conductivity, a part of heat is transmitted to the shell of front by the mounting post that PCB (printed circuit board) is contacted with shell, remains Remaining partial heat distributes heat to ambient air by air transmitted to front shell and back shell, final two shells In.But since the thermal coefficient of air is extremely low, PCB and the shell mounting post contact surface air layer very thin there are thickness, thermal resistance It is larger, it is extremely limited by the heat that PCB is transmitted to shell；Similarly, the heat of remainder arrives shell by air transmitted Speed and heat are also extremely limited.

Therefore, the heat dissipation effect of vehicle-mounted camera in the prior art is barely satisfactory, especially for high-power figure As the vehicle-mounted camera of sensor.

Utility model content

In order to solve the above-mentioned technical problem, the application is proposed.Embodiments herein provides a kind of camera module, Include: first shell and second shell, positioned at camera module both ends and the component of camera module is accommodated wherein；Third Shell is fixedly connected between first shell and second shell, and with the first shell and second shell；First circuit Plate, between the first shell and third shell；First heat conduction member, the first side of first heat conduction member with it is described First circuit board contact, second side opposite with first side of first heat conduction member are contacted with the third shell.

The imaging sensor of the camera module is provided on the first circuit board.

The camera module further include: second circuit board, between the second shell and the third shell；The First side of two heat conduction members, second heat conduction member is contacted with the second circuit board, first heat conduction member with The opposite second side in first side is contacted with the third shell.

The third shell includes: outer wall and heat-conducting plate, and the heat-conducting plate is connected with the outer wall, and the outer wall is connected to Between the first shell and the second shell, first heat conduction member is contacted with the heat-conducting plate.

The first protrusion is provided on the heat-conducting plate, first protrusion is contacted with first heat conduction member.

First protrusion corresponds to the region where the electronic component on the first circuit board.

The material of the third shell includes metal.

The camera module further includes at least one containment member, is provided with one at least one described containment member At least one molding projection, the containment member contacted with the first circuit board or second circuit board with by it is described at least One projection clamps the first circuit board or second circuit board.

The inner peripheral surface of at least one containment member is arranged at least one described projection.

It is provided at least one fixed column corresponding at least one described projection in the second shell, described at least one A fixed column is against at least one described projection.

First heat conduction member is silica gel piece.

According to the one aspect of the application, a kind of electronic equipment is provided, which includes above-mentioned camera mould Group.

Technical solution based on the embodiment of the present application, the shell of camera module are divided into three parts, and electronic component produces Raw heat is quickly transmitted to middle casing by heat conduction member, and the middle casing with high thermal conductivity is recycled to be dispersed into periphery Air significantly reduces the temperature inside camera, improves the heat dissipation effect of camera in use, while camera The structure of mould group is simple, will not influence its packaging efficiency.

Detailed description of the invention

The embodiment of the present application is described in more detail in conjunction with the accompanying drawings, the above-mentioned and other purposes of the application, Feature and advantage will be apparent.Attached drawing is used to provide to further understand the embodiment of the present application, and constitutes explanation A part of book is used to explain the application together with the embodiment of the present application, does not constitute the limitation to the application.In the accompanying drawings, Identical reference label typically represents same parts or step.

Fig. 1 is the decomposition diagram according to the camera module of one exemplary embodiment of the application.

Fig. 2 is the decomposition diagram according to the camera module of the application another exemplary embodiment.

Fig. 3 is the exploded pictorial according to the part camera module including third shell of one exemplary embodiment of the application Figure.

Fig. 4 is the partial sectional view according to the third shell of the application another exemplary embodiment.

Fig. 5 is the schematic diagram according to the second shell of one exemplary embodiment of the application.

Fig. 6 is the decomposition diagram according to the camera module of one exemplary embodiment of the application.

Fig. 7 is the decomposition diagram according to the camera module of the application another exemplary embodiment.

Fig. 8 is the schematic diagram of the camera module after the assembly according to one exemplary embodiment of the application.

Specific embodiment

In the following, example embodiment according to the application will be described in detail by referring to the drawings.Obviously, described embodiment is only It is only a part of the embodiment of the application, rather than the whole embodiments of the application, it should be appreciated that the application is not by described herein The limitation of example embodiment.

Application is summarized

The shell of camera module is generally all made of two parts at present, that is, is made of two metal shells, camera mould The heat dissipation of group distributes heat in ambient air also with the two metal shells.But with the clarity to camera It is required that higher and higher, the power of imaging sensor is also increasing, and the temperature in camera module can rise quickly, or even exceed The normal working temperature of imaging sensor has seriously affected the work of the electronic component in camera module, especially image The work of sensor, so that the quality decline of camera module, influences the clarity of imaging.

The shell of camera module is different from bipartite shell in the prior art in the application, in the application The shell of camera module includes at least three parts, and the heat that electronic component generates quickly is transmitted to by heat conduction member to be located at Intermediate shell recycles the shell of the centre with high thermal conductivity to be dispersed into ambient air, significantly reduces in camera module The temperature in portion improves the heat dissipation effect of camera in use, while the structure of camera module is simple, will not influence Its packaging efficiency.

After describing the basic principle of the application, the various non-limiting of the application described below with reference to the accompanying drawings Embodiment.

Example devices

Fig. 1 is the decomposition diagram according to the camera module of one exemplary embodiment of the application.As shown in Figure 1, camera shooting Head mould group 1 includes: first shell 10 and second shell 20, positioned at camera module 1 both ends and by each portion of camera module 1 Part accommodates wherein；Third shell 30, between first shell 10 and second shell 20, and with first shell 10 and second shell 20 are fixedly connected；First circuit board 40, between first shell 10 and third shell 30；First heat conduction member 60, this first First side of heat conduction member 60 is contacted with first circuit board 40, second side opposite with the first side of the first heat conduction member 60 with The third shell 30 contacts.

In the present embodiment, the shell of camera module includes at least the first shell 10 positioned at side, is located in the middle Third shell 30 and second shell 20 positioned at the other side, for by each electronic-component container of camera module 1 in shell In.The material of first shell 10, second shell 20 and third shell 30 can be identical, can also be different two-by-two, or each other it Between it is different.The material that first shell 10, second shell 20 and third shell 30 can use heat transfer efficiency high.First shell Using being fixedly connected between 10 and third shell 30, for example, can be connected by screw thread between first shell 10 and third shell 30 It connects, pin connection, key connection, it either can be by welding or bonding.Similar, between second shell 20 and third shell 30 Connection type can also use threaded connection, pin connection, key connection, either pass through welding or bonding.On first circuit board 40 The electronic component 41 of camera module 1 is installed.The position of first circuit board 40 can be located at first shell 10 and third shell Between body 30, it can also be sealed by 10 semi-surrounding of first shell, the other side by third shell 30 or first circuit board 40 can With by 30 semi-surrounding of third shell, the other side is sealed by first shell 10.In other words, the side of first circuit board 40 directly facing Perhaps indirectly in face of 10 other side of first shell directly facing or indirectly face third shell 30.First heat conduction member 60 can To be heat transfer efficiency high material, such as heat-conducting silicone grease, heat-conducting silica gel sheet etc..The shape of first heat conduction member 60 can be piece Shape, strip or bulk etc. can be square, rectangle, polygon etc..First heat conduction member 60 can be located at first circuit board Between 40 and third shell 30, alternatively, the first heat conduction member 60 can be wrapped by third shell 30 half together with first circuit board 40 It encloses, the other side is sealed by first shell 10.In other words, the side of the first heat conduction member 60 and first circuit board 40 directly or Contact, the other side opposite with the side is directly or indirectly contacted with third shell 30.

By above-mentioned camera module 1, the heat that the electronic component on first circuit board 40 generates passes through the first thermally conductive structure Part 60 is quickly transmitted to third shell 30, and the third shell 30 with high thermal conductivity is recycled to be dispersed into ambient air, significant to drop Temperature inside low camera improves the heat dissipation effect of camera in use, while the structure letter of camera module It is single, it will not influence its packaging efficiency.

In the embodiment of the camera module of the application, camera module 1 is provided on first circuit board 40 Imaging sensor.Imaging sensor is the important devices of camera, influences the clarity of image, also determines camera module Quality.The application to the imaging sensor used without limitation.The focal length meeting of the camera lens 11 and imaging sensor of camera module Linear expansion, which occurs, since temperature raises and by material is influenced, and focal length is caused to generate unexpected variation, influences imaging Clarity.Thus it is guaranteed that the temperature around imaging sensor is constant most important for camera module.

Fig. 2 is the decomposition diagram according to the camera module of the application another exemplary embodiment.Camera in Fig. 2 Mould group is similar to camera module shown in Fig. 1, the difference is that the camera module further includes 50 He of second circuit board Second heat conduction member 70, as shown in Figure 2.The part electronic component of camera module, the second electricity are provided on second circuit board 50 Road plate 50 is between second shell 20 and third shell 30.Alternatively, second circuit board 50 can be surrounded by second shell 20, one Side is sealed by third shell 30, or can be surrounded by third shell 30, and side is sealed by second shell 20.In other words, second The side of circuit board 50 directly or indirectly faces second shell 20, and the other side directly or indirectly faces third shell 30.The Two heat conduction members 70 can be heat transfer efficiency high material, such as heat-conducting silicone grease, heat conductive silica gel etc..Second heat conduction member 70 is located at Between second circuit board 50 and third shell 30, alternatively, the second heat conduction member 70 can be with second circuit board 50 together by third Shell 30 surrounds, and side is sealed by second shell 20.In other words, the side of the second heat conduction member 70 connects with second circuit board 50 Touching, the another side opposite with above-mentioned side is contacted with third shell 30.

It, can also be by being located at centre even if there are two circuit boards for the setting of camera module 1 by the way that third shell 30 is arranged Third shell 30 heat is quickly transmitted to outside, without influence camera module inside temperature.

Fig. 3 is the exploded pictorial according to the part camera module including third shell of one exemplary embodiment of the application Figure.Fig. 4 is the partial sectional view according to the third shell of the application another exemplary embodiment.Fig. 5 is shown according to the application one The schematic diagram of the third shell of example property embodiment after mounting.

As shown in Figures 3 to 5, the third shell 30 in camera module 1 includes outer wall 31 and heat-conducting plate 32, heat-conducting plate 32 It is connected with outer wall 31, outer wall 31 is connected between first shell 10 and second shell 20, the first heat conduction member 60 and heat-conducting plate 32 Contact.

For the outer wall 31 of third shell 30 substantially in the annulus for being closed as a circle, one end of outer wall 31 is connected to first shell 10 end, the other end are connected to the end of second shell 20, and in other words, outer wall 31 connects first shell 10 and second shell 20 It is connected together.Outer wall 31 can also be in the arbitrary shape of matching first shell 10 and second shell 20, so that camera module With different appearances.

Heat-conducting plate 32 is located inside third shell 30, can be in tabular, heat-conducting plate 32 is arranged to have as far as possible larger Area, in favor of improving radiating effect.Outer wall 31 and heat-conducting plate 32 can be integrally formed, alternatively, outer wall 31 and heat-conducting plate 32 Two different components are fabricated to, then heat-conducting plate 32 is fixedly attached to outer wall 31, for example, heat-conducting plate 32 is threadedly coupled, welding Or it is adhered to outer wall 31, to be combined with outer wall 31.The material of heat-conducting plate 32 can be identical with the material of outer wall 31, can also be with Difference, for example, outer wall 31 and heat-conducting plate 32 can be metal material, alternatively, outer wall 31 can use metal material, heat-conducting plate 32 The nonmetallic materials that thermal coefficient can be used high.Heat-conducting plate 32 is directly contacted with the first heat conduction member 60, or can be passed through Other 60 mediate contact of component and the first heat conduction member.

In a further embodiment, the outside of the outer wall 31 of third shell 30 is provided with multiple fins, to help to radiate.

In a further embodiment, transverse slat (not shown) is set on the inside of the outer wall 31 of third shell 30, is set on transverse slat It is equipped with heat-conducting plate 32, in other words, transverse slat connects heat-conducting plate 32 and outer wall 31.Alternatively, heat-conducting plate 32 can be in the form of a column, from Outer wall 31 is towards prominent certain length inside third shell 30, to contact with electronic component.Alternatively, heat-conducting plate 32 can be positioned at outer The inside of wall 31, shape are generally corresponding to 31 shape of outer wall, are connect between outer wall 31 by Heat Conduction Material, by heat from leading Hot plate 32 is transmitted to outer wall 31.

By the outer wall 31 of third shell 30, the shell at 1 both ends of camera module is operatively connected, and can also be made Camera module 1 shows a variety of different shapes；By the heat-conducting plate 32 in third shell 30, will can more efficiently take the photograph As the heat inside head mould group 1 is transmitted to third shell 30, and then it is transmitted to outside camera module 1.In addition, heat-conducting plate 32 is not The transmitting that 1 internal heat of camera module can only be accelerated can also improve the intensity of third shell 30, and then improve camera The stability of mould group 1.

In the embodiment of the camera module of the application, the first protrusion 33 is provided on heat-conducting plate 32, first leads Hot component 60 is contacted with the first protrusion 33, alternatively, the first heat conduction member 60 can be by between other component and the first protrusion 33 Contact.The shape of first protrusion 33 can be rectangle, circle, polygon etc..First protrusion 33 can be with 32 one of heat-conducting plate Molding and slightly above 32 other parts of heat-conducting plate, alternatively, the first protrusion 33 can be set on heat-conducting plate 32, such as are bonded to Heat-conducting plate 32.The material of first protrusion 33 can be identical or different with heat-conducting plate 32.The setting of first protrusion 33, which can increase, to be led Hot material, to improve the heat conduction efficiency inside camera module.

In a further embodiment, the second protrusion can be set (not in the side opposite with the first protrusion 33 of heat-conducting plate 32 It shows).Second protrusion can be identical as the shape of the first protrusion 33 and material, the difference is that only the position of the second protrusion with Electronic component on second circuit board 50 is corresponding.

In the embodiment of the camera module of the application, the first protrusion 33 corresponds to the electricity on first circuit board 40 Region where sub- component 41, the heat so as to generate electronic component 41 are directly transferred to third shell 30, into And it is transmitted to the outside of camera module 1.The position of first protrusion 33 can correspond to the position of the first heat conduction member 60, thus Even if the position of electronic component 41 and the position of the first protrusion 33 be not corresponding, the heat that electronic component 41 generates can also be led to It crosses the first heat conduction member 60 and is transmitted to heat-conducting plate 32, and then be transmitted to third shell 30.The setting of first protrusion 33 can also be straight Indicate position or the main positions of heat transfer of heat-conducting plate 32 with seeing, convenient for the assembling of camera module 1.

In the embodiment of the camera module of the application, the material of third shell 30 can be the good gold of thermal conductivity Belong to or nonmetallic, such as aluminium, copper, silver or graphite etc..

In the embodiment of the camera module of the application, camera module 1 further includes containment member 80, seals structure Part 80 can be located in third shell 30 and/or first shell 10, and quantity can be one or more, be arranged in the first circuit The periphery of plate 40 and/or second circuit board 50 is positioned at first shell 10 in foregoing circuit plate to seal to foregoing circuit plate And/or cushioning effect is played to circuit board when in third shell 30.Containment member 80 may include sealing ring 81 and projection 82, dash forward The quantity of block 82 is one or more, and when projection 82 is multiple, projection 82 can be symmetrical arranged relative to each other, alternatively, Asymmetric setting relative to each other.Projection 82 can be integrally formed with sealing ring 81, can also be separately manufactured with sealing ring 81, then Fixed to sealing ring 81.Projection 82 can also form circuit board and clamp to the further damping of circuit board, sealing ring 81 Periphery matched with first shell 10 or third shell 30, to be carried out to circuit board preferably fixed.

Containment member 80 can also only include sealing ring 81, as shown in Figure 6 and Figure 7, be located at first shell 10 and third shell Containment member 80 between body only includes sealing ring 81.

In the embodiment of the camera module of the application, the inner peripheral surface 83 of containment member 80 is arranged in projection 82, Directly to grip to circuit board formation, in other words, the inner peripheral surface 83 of sealing ring 81 is arranged in projection 82.Alternatively, projection 82 It can be formed as strip, the inner peripheral surface 83 of containment member 80 is set.Alternatively, projection 82 can be formed in containment member 80 Four turnings, alternatively, projection 82 can be formed in the position convenient for clamping circuit board of the inner peripheral surface of containment member 80, thus right Circuit board forms more firm clamping.

In the embodiment of the camera module of the application, it is provided with position in second shell 20 and projection 82 is right The fixed column 21 answered.The quantity of fixed column 21 is corresponding with the quantity of projection 82, alternatively, the quantity of fixed column 21 is less than projection 82 Quantity, as long as containment member 80 can be made motionless relative to third shell 30.The shape of fixed column 21 can be column, item Shape or cone cell.The material of fixed column 21 can be identical as the material of second shell 20, may also be distinct from that second shell 20 Material.Fixed column 21 can be integrally formed with second shell 20, can also be separately manufactured with second shell 20, then for example, by weldering Connect or be adhesively secured second shell 20.

By making fixed column 21 seal against the projection 82 of component 80, the circuit board that containment member 80 clamps can be fixed To third shell 30, so that the fixation of circuit board is simplified, so that the assembly of camera module is more convenient.

Present invention also provides a kind of electronic equipment, which includes above-mentioned camera module 1, the electronic equipment It can be used for vehicle arrangement, which may include lilliput car, small vehicle, medium sized vehicle or oversize vehicle, can To be applied to passenger vehicle, perhaps car also can be applied to hand-propelled vehicle, automotive vehicle or automatic driving vehicle.

Exemplary means

Fig. 6 is the decomposition diagram according to the camera module of one exemplary embodiment of the application.Fig. 7 is according to the application The decomposition diagram of the camera module of another exemplary embodiment.Be not shown procapsid 11 and dust-proof cushion 13 in Fig. 7, Fig. 6 and The position that Fig. 7 difference essentially consists in the placement of the first heat conduction member 60 is different, and as shown in Fig. 6, the first heat conduction member 60 is placed Between first circuit board 40 and third shell 30, as shown in fig. 7, the first heat conduction member 60 is placed in second circuit board 50 and Between three shells 30.

It is described in detail referring to Fig. 6, as shown in fig. 6, in this embodiment, before camera module 1 can also include Shell 12 accommodates camera lens 11 wherein, and dust-proof cushion can also be arranged in the side in face of first shell 10 of first circuit board 40 13.First shell 10 and second shell 20 are open box-like in substantially side.The side of first shell 10 has columnar part, changes Yan Zhi, in the side opposite with open side, from side, shell extends columnar part to accommodate fixed lens 11.Similar, second Fluted or columnar part (referring to Fig. 7) is arranged in the side opposite with open side of shell 20, the signal for output image signal Line.The thickness at four turnings of first shell 10 and second shell 20 can be greater than the thickness on four sides, in order to open up threaded hole.

The position close to four turnings of first circuit board 40 and second circuit board 50 can open up threaded hole, in order to fill Match.First heat conduction member 60 can be located at the other side opposite with the side for being provided with electronic component of first circuit board 40, and Corresponding with the position of electronic component, in other words, electronic component is located at the first side of first circuit board 40, the first heat conduction member 60 be located at first circuit board 40 with the electronic component just opposite second side.

Second heat conduction member 70 (being not shown in Fig. 6, Fig. 7) can be located on second circuit board 50, as shown in Figure 1, that is, position Between heat-conducting plate 32 and second circuit board 50, the heat that second circuit board 50 generates is also passed into heat-conducting plate 32, in turn It is transmitted to third shell 30.

First heat conduction member 60 and the second heat conduction member 70 connect with two sides of the heat-conducting plate 32 of third shell 30 respectively Touching, thus by the heat transfer of first circuit board 40 and second circuit board 50 to heat-conducting plate 32, and then it is transmitted to third shell 30, It is transmitted to external environment again.

In another embodiment of the application, first circuit board 40 can also be contacted with first shell 10, to not only lead to The heat dissipation of third shell 30 is crossed, can also be radiated by first shell 10, that is, first shell 10 not only can be to the first circuit Plate 40 is fixed, and can also radiate to it.

Illustrative methods

As shown in Figure 6 and Figure 8, when assembling camera module, it is possible, firstly, to bond or be assembled to first for camera lens 11 Containment member 80 is sleeved on the periphery of first circuit board 40 by shell 10；Then, first circuit board 40 and first shell 10 is right Together, first circuit board 40 is fixed in first shell 10 using screw；Then, the first heat conduction member 60 is placed into third shell Protrusion on the heat-conducting plate 32 of body 30；Next, third shell 30 is aligned with first shell 10, recycle screw by third shell Body 30 is fastened to the first shell 10 after assembling；Then, containment member 80 is sleeved on to the periphery of second circuit board 50, then will Second heat conduction member 70 is placed on the second circuit board 50 for being set with containment member 80, then the second heat conduction member 70 is clamped Into second shell 20；Finally, second shell 20 is assembled on third shell 30 using screw.

The basic principle of the application is described in conjunction with specific embodiments above, however, it is desirable to, it is noted that in this application The advantages of referring to, advantage, effect etc. are only exemplary rather than limitation, must not believe that these advantages, advantage, effect etc. are the application Each embodiment is prerequisite.In addition, detail disclosed above is merely to exemplary effect and the work being easy to understand With, rather than limit, it is that must be realized using above-mentioned concrete details that above-mentioned details, which is not intended to limit the application,.

Device involved in the application, device, equipment, system block diagram only as illustrative example and be not intended to It is required that or hint must be attached in such a way that box illustrates, arrange, configure.As those skilled in the art will appreciate that , it can be connected by any way, arrange, configure these devices, device, equipment, system.Such as "include", "comprise", " tool " etc. word be open vocabulary, refer to " including but not limited to ", and can be used interchangeably with it.Vocabulary used herein above "or" and "and" refer to vocabulary "and/or", and can be used interchangeably with it, unless it is not such that context, which is explicitly indicated,.Here made Vocabulary " such as " refers to phrase " such as, but not limited to ", and can be used interchangeably with it.

It may also be noted that each component or each step are can to decompose in the device of the application, device and method And/or reconfigure.These decompose and/or reconfigure the equivalent scheme that should be regarded as the application.

The above description of disclosed aspect is provided so that any person skilled in the art can make or use this Application.Various modifications in terms of these are readily apparent to those skilled in the art, and are defined herein General Principle can be applied to other aspect without departing from scope of the present application.Therefore, the application is not intended to be limited to Aspect shown in this, but according to principle disclosed herein and the consistent widest range of novel feature.

In order to which purpose of illustration and description has been presented for above description.In addition, this description is not intended to the reality of the application It applies example and is restricted to form disclosed herein.Although already discussed above multiple exemplary aspects and embodiment, this field skill Its certain modifications, modification, change, addition and sub-portfolio will be recognized in art personnel.

Claims (12)

1. a kind of camera module characterized by comprising

First shell and second shell, positioned at camera module both ends and by the component of camera module accommodate wherein；

Third shell is fixedly connected between first shell and second shell, and with the first shell and second shell；

First circuit board, between the first shell and the third shell；

First side of the first heat conduction member, first heat conduction member is contacted with the first circuit board, the first thermally conductive structure Second side opposite with first side of part is contacted with the third shell.

2. camera module according to claim 1, wherein be provided with the camera module on the first circuit board Imaging sensor.

3. camera module according to claim 1, wherein further include:

Second circuit board, between the second shell and the third shell；

First side of the second heat conduction member, second heat conduction member is contacted with the second circuit board, the first thermally conductive structure Second side opposite with first side of part is contacted with the third shell.

4. camera module according to any one of claim 1 to 3, wherein the third shell includes: outer wall and leads Hot plate, the heat-conducting plate are connected with the outer wall, and the outer wall is connected between the first shell and the second shell, institute The first heat conduction member is stated to contact with the heat-conducting plate.

5. camera module according to claim 4, wherein it is provided with the first protrusion on the heat-conducting plate, described first Protrusion is contacted with first heat conduction member.

6. camera module according to claim 5, wherein first protrusion corresponds on the first circuit board Region where electronic component.

7. camera module according to any one of claim 1 to 3, wherein the material of the third shell includes gold Belong to.

8. camera module according to any one of claim 1 to 3, wherein further include at least one containment member, institute It states and is provided at least one integrally formed projection at least one containment member, the containment member and the first circuit board Or second circuit board contact is to clamp the first circuit board or second circuit board by least one described projection.

9. camera module according to claim 8, wherein at least one is close described for the setting of described at least one projection Seal the inner peripheral surface of component.

10. camera module according to claim 9, wherein be provided in the second shell with it is described at least one At least one corresponding fixed column of projection, at least one described fixed column is against at least one described projection.

11. camera module according to any one of claim 1 to 3, wherein first heat conduction member is silica gel Piece.

12. a kind of electronic equipment characterized by comprising camera mould according to any one of claim 1 to 11 Group.