CN216748400U

CN216748400U - Heat radiation structure and camera

Info

Publication number: CN216748400U
Application number: CN202122676353.1U
Authority: CN
Inventors: 谢东杰; 殷贵超; 冯杰
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-11-03
Filing date: 2021-11-03
Publication date: 2022-06-14
Anticipated expiration: 2031-11-03

Abstract

The application provides a heat radiation structure and a camera. The heat dissipation structure comprises a shell, the shell comprises a shell body and a heat dissipation plate, the shell body is fixedly connected with the heat dissipation plate, the heat dissipation plate is provided with a containing cavity, the heat dissipation plate is arranged in the containing cavity, the containing cavity is used for containing PCBA including chips, a gap used for filling heat dissipation media is formed between the chips and the heat dissipation plate, and the heat dissipation structure further comprises a guide piece, a positioning piece and a fixing portion. A guide member connects the housing and the PCBA for guiding the PCBA relatively closer to or farther from the heat sink plate. One end of the positioning piece is fixedly connected with the PCBA, and the other end of the positioning piece is in contact with the heat dissipation plate and used for limiting the size of the gap. The fixed part includes first mounting and second mounting, second mounting and PCBA fixed connection, and first mounting one end is used for restricting the heating panel and keeps away from PCBA relatively, and the other end is used for dismantling the cooperation with the second mounting. The heat dissipation structure can reduce the thermal resistance and improve the heat transfer efficiency by controlling the thickness of the heat dissipation medium through the positioning piece.

Description

Heat radiation structure and camera

Technical Field

The application relates to the field of electronic devices, in particular to a heat dissipation structure and a camera.

Background

With the development of the camera technology, the computational power requirement of the video monitoring image processing on the chip is higher and higher, the power consumption of the chip is continuously improved, and higher requirements are provided for the heat dissipation effect of the camera.

In order to avoid the extrusion between the chip and the heat dissipation structure, a gap needs to be reserved between the chip and the heat dissipation structure, and the heat conduction between the chip and the heat dissipation structure is realized by adopting a form of filling the gap with the heat dissipation structure. The larger the thickness of the heat dissipation medium means the higher the thermal resistance thereof, the lower the heat dissipation capability. In camera assembly, the gap between the chip and the heat dissipation structure is determined by assembly tolerances, which result in non-uniform thickness of the heat dissipation medium filling the gap. When the thickness of the heat dissipation medium is larger due to assembly tolerance, the heat dissipation medium has larger thermal resistance, so that the heat transfer efficiency between the chip and the heat dissipation structure is low.

SUMMERY OF THE UTILITY MODEL

The application provides a heat radiation structure and camera, the thickness of the control heat dissipation medium of being convenient for.

A first aspect of embodiments of the present application provides a heat dissipation structure. This kind of heat radiation structure includes the casing, the casing includes shell and heating panel, the shell with heating panel fixed connection, the shell has the holding chamber, the heating panel set up in the holding intracavity, the holding chamber still is used for holding PCBA (Printed Circuit Board Assembly), PCBA includes the chip with form the clearance that is used for filling heat-dissipating medium between the heating panel, heat radiation structure still includes guide, setting element and fixed part. One end of the guide piece is fixedly connected with the shell, and the other end of the guide piece is in sliding fit with the PCBA so as to guide the PCBA to be relatively close to or far away from the heat dissipation plate along the guide piece. The setting element one end be used for with PCBA fixed connection, the other end contact the heating panel to the restriction the heating panel with between the PCBA the size in clearance. The fixed part includes first mounting and second mounting, the second mounting with PCBA fixed connection, first mounting one end is used for restricting the heating panel is kept away from relatively PCBA, the other end be used for with the cooperation can be dismantled to the second mounting.

The heat dissipation structure can dissipate the heat of the PCBA out of the accommodating cavity through a heat dissipation path from the heat dissipation plate to the shell. The electronic equipment can also be installed except that installation PCBA in the holding chamber, but PCBA and casing accessible guide realize relative movement's cooperation for can adjust the relative position of PCBA and heating panel during installation PCBA, let the relative distance between PCBA and the heating panel be closer to, the relative distance between PCBA and the heating panel is controlled through the setting element. Among the prior art, through the form of casing and PCBA direct fixed connection, the manufacturing tolerance of casing seriously influences the relative position of PCBA and heating panel, and the heat radiation structure that this application provided can effectively reduce the thickness of radiating medium between PCBA and the heating panel, improves the heat exchange efficiency between PCBA and the heating panel.

Based on the first aspect, in a possible implementation manner, the heat dissipation structure further includes an elastic member, one end of the elastic member acts on the PCBA, and the other end of the elastic member acts on the guide member or the housing. The spring member causes the PCBA to have a tendency to approach a first position close to the heat sink plate or to approach a second position away from the heat sink plate.

In this possible implementation, the heat dissipation structure enables the PCBA to be in a relatively stable position when the electronic device and the PCBA are mounted by the resilient member. If the elastic piece exerts the elastic force that is close to the heating panel to PCBA, then PCBA is stable in the first position as far as possible, and electronic equipment and PCBA relative position are comparatively stable, make things convenient for the equipment of electronic equipment and PCBA. If the elastic piece exerts the elastic force who keeps away from the heating panel to PCBA, then PCBA stabilizes in the second position as far as possible, and electronic equipment and PCBA relative position are comparatively stable, make things convenient for the equipment of electronic equipment and PCBA.

Based on the first aspect, in a possible implementation manner, the housing includes a first housing member and a second housing member, and the first housing member is detachably engaged with the second housing member. The first housing member is adapted to engage the guide member. The second shell is fixedly connected with the heat dissipation plate.

In this possible implementation, cooperation can be dismantled to first casing and second casing in this heat radiation structure, and on the one hand, electronic equipment can be fixed with first casing, and the dismouting of electronic equipment of being convenient for can be assembled first casing and second casing after with electronic equipment and first casing fixed coordination again, and on the other hand, the later maintenance of can being convenient for makes first casing and second casing dismantle once more after the equipment through the detachable form.

Based on the first aspect, in a possible implementation manner, the first fixing piece includes a limit bolt, and the second fixing piece includes a nut. The heat dissipation plate has a connection hole. The limiting bolt comprises a screw and a screw head, the screw can penetrate through the connecting hole and is matched with the nut, and the screw head can contact the heat dissipation plate to be far away from one surface of the PCBA so as to limit the heat dissipation plate to be relatively far away from the PCBA.

In this possible implementation, the screw-thread fit of the limit bolt and the nut can realize a relatively stable fixed fit in the axial position of the screw, and the screw head of the limit bolt can be just used for the relative movement of the limit heat dissipation plate.

Based on the first aspect, in a possible implementation manner, in a first direction, a size of the positioning element is larger than a size of the nut, and the first direction is a direction in which the PCBA faces the heat dissipation plate.

In this possible implementation, the dimension of the positioning member in the first direction is larger than the dimension of the nut, i.e. the relative distance of the PCBA and the heat sink plate is limited by the positioning member.

Based on the first aspect, in a possible implementation manner, the number of the positioning elements is at least two, two positioning elements are arranged at an interval in a second direction, and the second direction is a direction parallel to the heat dissipation plate.

In this possible implementation, a plurality of positioning elements are arranged on the surface of the PCBA and/or the heat spreader plate, distributing the force points between the PCBA and the heat spreader plate over a larger area, which may reduce the chance of the heat spreader plate deflecting relative to the PCBA.

In a possible implementation manner based on the first aspect, the heat dissipation plate includes a heat dissipation boss facing the chip. The heat dissipation boss is used for contacting one surface of the heat dissipation medium far away from the chip

In this possible implementation manner, the heat dissipation boss can further reduce the distance between the heat dissipation plate and the chip, so that the used heat dissipation medium is thinner, and the heat dissipation efficiency of the heat dissipation structure is higher.

A second aspect of the embodiment of the application provides a heat radiation structure, and this kind of heat radiation structure includes the casing, the casing includes shell and heating panel, the shell with heating panel fixed connection, the shell has the holding chamber, the heating panel set up in the holding intracavity, the holding chamber still is used for holding PCBA, PCBA includes the chip with form the clearance that is used for filling the radiating medium between the heating panel, heat radiation structure still includes guide, setting element and fixed part. One end of the guide piece is fixedly connected with the shell, and the other end of the guide piece is in sliding fit with the PCBA so as to guide the PCBA to be relatively close to or far away from the heat dissipation plate along the guide piece. The setting element one end be used for with PCBA fixed connection, the other end contact the heating panel to the restriction the heating panel with between the PCBA the size in clearance. The fixed part comprises a first fixing part, one end of the first fixing part is used for limiting the heating panel to be relatively far away from the PCBA, and the other end of the first fixing part is used for being detachably matched with the positioning part. Compared with the heat dissipation structure provided by the first aspect, the positioning piece can limit the relative distance between the PCBA and the heat dissipation plate and is used for fixing the PCBA and the heat dissipation plate relatively. The size of the positioning piece in the first direction is large, and the positioning piece is connected with the first fixing piece, so that the detachable connection stability can be improved. The heat dissipation structure of the second aspect may be combined with various implementations of the heat dissipation structure of the first aspect, so as to have an effect similar to that of the heat dissipation structure of the first aspect.

A third aspect of embodiments of the present application provides a camera including an image pickup unit and the heat dissipation structure provided in the first aspect. The camera shooting unit is arranged in the accommodating cavity and electrically connected with the PCBA. PCBA sets up the holding intracavity, with guide piece sliding fit. One end of the heat dissipation medium is in contact with the PCBA, and the other end of the heat dissipation medium is in contact with the heat dissipation plate. The camera can radiate the heat of the PCBA out of the accommodating cavity through a heat radiation path from the heat radiation plate to the shell. The image pickup unit forms the aforementioned electronic apparatus. The heat radiation structure enables the camera shooting unit to be difficult to generate accumulated heat, effectively improves the heat radiation effect of the camera, and enables the camera to stably run for a long time.

Based on the third aspect, in a possible implementation manner, the housing further has a light hole, and the camera unit includes a camera facing the light hole.

In this possible implementation, the camera accepts optical information through the light-transmitting hole, can set up whole camera unit in the holding intracavity entirely, and need not stretch out the camera holding chamber.

Based on the third aspect, in a possible implementation manner, the casing includes a panel and a fixing bracket, the fixing bracket is fixedly connected to the panel, the fixing bracket is located in the accommodating cavity, and the fixing bracket has a fixing cavity, and the fixing cavity is used for fixing the image pickup unit. The fixing bracket is matched with the guide piece.

In this possible implementation manner, the fixing bracket in the heat dissipation structure may further enhance the fixing strength of the camera unit.

Based on the third aspect, in a possible implementation manner, the camera includes a flexible wire, one end of the flexible wire is electrically connected to the PCBA, and the other end of the flexible wire is electrically connected to the camera unit.

In this possible implementation, the flexible wire realizes electrical connection of the PCBA and the camera unit. The flexible wire can the flexible deformation for PCBA when moving relative to the casing under the direction of guide, also can maintain PCBA and camera unit's electric connection.

Drawings

Fig. 1 is a sectional view of a camera of the prior art.

Fig. 2 is a cross-sectional view of a camera provided in an embodiment of the present application.

Fig. 3 is a flowchart illustrating an assembly process of a camera according to an embodiment of the present application.

Fig. 4 is a cross-sectional view of a camera provided in an embodiment of the present application.

Fig. 5 is a cross-sectional view of a camera provided in an embodiment of the present application.

Fig. 6 is a cross-sectional view of a camera provided in an embodiment of the present application.

Description of the main elements

Video camera 001

Heat radiation structure 010

Image pickup unit 030

Case 100

Outer shell 110

First case member 111

Panel 1111

Fixing support 1113

Second housing member 113

Third casing part 115

Heat dissipation plate 130

Heat dissipation boss 131

PCBA 200

Chip 210

PCB 230

Heat-dissipating medium 300

Guide 400

Elastic member 410

Positioning member 500

Fixing part 600

First fixing member 610

Screw 611

Screw head 613

Second fixing member 630

Fastening bolt 700

First direction X

Second direction Y

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

The following description of the embodiments of the present application is provided by way of specific examples, and other advantages and effects of the present application will be readily apparent to those skilled in the art from the disclosure herein. While the description of the present application will be described in conjunction with the preferred embodiments, it is not intended that the features of the present application be limited to this embodiment. On the contrary, the application of the present disclosure with reference to the embodiments is intended to cover alternatives or modifications as may be extended based on the claims of the present disclosure. In the following description, numerous specific details are included to provide a thorough understanding of the present application. The present application may be practiced without these particulars. Moreover, some of the specific details have been omitted from the description in order to avoid obscuring or obscuring the focus of the present application. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

Hereinafter, the terms "first", "second", etc., if used, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified. "Upper," "lower," "left," "right," and like directional terms are defined relative to the schematically-disposed orientations of elements in the figures, and it is to be understood that the directional terms are relative terms, which are used for descriptive and clarity purposes and are intended to correspond to changes in the orientation in which the elements in the figures are disposed.

In the present application, the term "connected", if used, is to be understood broadly, unless otherwise explicitly stated or limited, for example "connected" may be a fixed connection, a detachable connection, or an integral part; may be directly connected or indirectly connected through an intermediate. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In the following detailed description of the embodiments, which is to be read in connection with the accompanying drawings, the drawings showing the partial structure of the device are not necessarily to scale, and are merely exemplary, which should not limit the scope of the invention.

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

Fig. 1 shows a cross-sectional view of a prior art camera 001.

As shown in fig. 1, the video camera 001 includes an image pickup unit 030, a PCBA200, and a heat dissipation structure 010. The heat dissipation structure 010 includes a case 100. The housing 100 includes a housing 110 and a heat dissipation plate 130, the housing 110 includes a first housing member 111 and a second housing member 113, which are detachable, and the heat dissipation plate 130 is fixedly connected to the second housing member 113. The first casing member 111 includes a fixing bracket 1113, a fixing cavity is formed in the fixing bracket 1113, the image pickup unit 030 is mounted in the fixing cavity, and the PCBA200 and the fixing bracket 1113 are fixedly connected by fastening bolts 700. PCBA200 still with camera unit 030 electric connection for can realize data transmission between PCBA200 and the camera unit 030.

The PCBA200 includes a chip 210, and the heat spreader plate 130 includes heat spreader bosses 131 facing the chip 210. The camera 001 further includes a heat dissipation medium 300, and the heat dissipation medium 300 is filled between the chip 210 and the heat dissipation boss 131.

Such a camera 001 may be assembled by:

s101, the image pickup unit 030 is mounted in the fixing bracket 1113.

S102, fixedly connecting the PCBA200 with the fixing support 1113, and smearing the heat dissipation medium 300 on the surface of the chip 210 of the PCBA 200.

S103, the first casing member 111 and the second casing member 113 are butted so that the heat dissipation plate 130 fixed to the second casing member 113 is relatively close to the PCBA200 fixed to the first casing member 111. The chip 210 and the heat dissipation lands 131 press the heat dissipation medium 300 such that the heat dissipation medium 300 is filled between the chip 210 and the heat dissipation lands 131.

The thickness of the heat medium 300 in such a camera 001 has a long tolerance chain in an actual production process depending on the size of the first housing member 111, the size of the second housing member 113, the mounting position of the PCBA200 to the first housing member 111, and the like. In order to ensure that the chip 210 and the heat dissipation bump 131 are not pressed against each other, a larger gap needs to be reserved between the chip 210 and the heat dissipation bump 131, resulting in a larger thickness of the heat dissipation medium 300, thereby increasing the thermal resistance.

Fig. 2 shows a cross-sectional view of a camera 001 in one embodiment of the present application.

As shown in fig. 2, the video camera 001 includes an image pickup unit 030, a PCBA200, and a heat dissipation structure 010. The heat dissipation structure 010 includes a housing 100, the housing 100 has a receiving cavity, the camera unit 030 is installed in the receiving cavity, and the camera unit 030 is protected by the housing 100. PCBA200 sets up in the holding intracavity, PCBA200 and the unit 030 electric connection that makes a video recording to realize PCBA200 and the data transmission of the unit 030 that makes a video recording. The case 100 further includes a case 110 and a heat sink 130, and the case 110 is fixedly connected to the heat sink 130, so that heat can be rapidly conducted between the case 110 and the heat sink 130. Heat spreader 130 is positioned within the receiving cavity, and heat spreader 130 is configured to absorb heat from PCBA200 and conduct the heat to housing 110.

The camera 001 also includes a heat-dissipating medium 300, and the PCBA200 includes a chip 210 and a PCB 230. The chip 210 is fixed on the PCB230 and is fixedly connected to the PCB 230. During operation of PCBA200, chip 210 generates a large amount of heat, and heat dissipation medium 300 fills the space between chip 210 and heat dissipation plate 130, transfers the heat generated by chip 210 to heat dissipation plate 130, and dissipates the heat through housing 110.

A gap is formed between the chip 210 and the heat dissipation plate 130, and the heat dissipation medium 300 is filled between the chip 210 and the heat dissipation plate 130 in a flexibly deformable state, so that the gap between the chip 210 and the heat dissipation plate 130 can be reduced as much as possible, and the thermal resistance generated by the gap can be reduced. The heat medium 300 may be cured after being filled between the chip 210 and the heat sink 130, and the cured heat medium 300 may have a good thermal conductivity without relative displacement between the PCBA200 and the heat sink 130.

Optionally, the heat dissipation medium 300 may be heat dissipation silicone grease, which has a high thermal conductivity and a poor electrical conductivity, and can reduce the probability of electrical connection between the chip 210 and the heat dissipation plate 130. In addition, the heat dissipation silicone grease has the property of flexible deformation, and when the heat dissipation silicone grease is filled between the chip 210 and the heat dissipation plate 130, air between the chip 210 and the heat dissipation plate 130 can be extruded through deformation, so that the gap between the chip 210 and the heat dissipation plate 130 is reduced, and the thermal resistance is reduced.

The housing 100 includes a first housing member 111 and a second housing member 113.

The first casing 111 includes a panel 1111 and a fixing bracket 1113, and the panel 1111 is fixedly connected to the fixing bracket 1113. A fixed cavity is formed in the fixed support 1113, and the camera unit 030 is arranged in the fixed cavity and fixed through the fixed support 1113. The fixed cavity is matched with the shape of the camera unit 030, so that the camera unit 030 can be in a relatively stable position when being fixed in the fixed cavity. In addition, the contact area between the camera unit 030 and the inner wall of the fixed cavity is increased, the camera unit 030 can be effectively protected, and the local stress of the camera unit 030 is reduced when the camera 001 shakes.

The panel 1111 is provided with a light hole, and the camera of the camera unit 030 faces the light hole. Light rays outside the housing 100 enter the camera through the light-transmitting hole and are captured by the camera unit 030.

The second housing member 113 is detachably connected to the first housing member 111. The second housing member 113 is a portion of the case 110 fixedly connected to the heat dissipation plate 130. The second housing 113 and the heat dissipation plate 130 can rapidly transfer heat therebetween. The second housing 113, the heat radiating plate 130, and the panel 1111 collectively surround the fixing bracket 1113. The heat sink 130 is located at one end of the fixing bracket 1113 away from the panel 1111, and a portion of the second housing 113 extends from the outer periphery of the heat sink 130 toward the panel 1111.

The first housing member 111 and the second housing member 113 may be detachably connected by bonding or screwing. For example, an adhesive is disposed on an end surface of the first casing 111, and when the second casing 113 is close to the first casing 111, the adhesive contacts the second casing 113, and further presses the first casing 111 and the second casing 113, so that the first casing 111 and the second casing 113 are relatively close to each other, and the adhesive can stably bond the first casing 111 and the second casing 113. When the first casing 111 and the second casing 113 need to be detached, the viscosity of the adhesive can be reduced by high temperature, and then the first casing 111 and the second casing 113 are separated. A tongue and groove may be provided at a position where the first casing 111 and the second casing 113 are connected, and a bolt may be installed at the tongue and groove position to detachably connect the first casing 111 and the second casing 113.

The first casing member 111 and the second casing member 113 are detachably connected, so that, on one hand, the second casing member 113 and the first casing member 111 have enough space for mounting the camera unit 030 and the PCBA200 before assembly, and on the other hand, subsequent maintenance can be facilitated.

The heat dissipating structure 010 further includes a guide 400, a positioning member 500, and a fixing portion 600. The guide 400 is fixedly coupled to the fixing bracket 1113, and the guide 400 extends from one surface of the fixing bracket 1113 near the heat radiating plate 130 in the first direction X. The first direction X is a direction in which the PCBA200 faces the heat radiating plate 130, that is, a direction perpendicular to the plate-shaped PCBA 200. Guide holes are provided in the PCB230 of the PCBA200, and the guide members 400 are inserted into the guide holes so that the PCBA200 can extend in the extending direction of the guide holes.

The guide 400 may be a bolt, and when the PCBA200 is assembled, the guide hole in the PCBA200 may be aligned with the threaded hole in the fixing bracket 1113, and the bolt may then be passed through the guide hole and threadedly engaged with the threaded hole. The bolt extends in a first direction X, along which PCBA200 can move. The PCBA200 can move relatively closer to or further away from the heat spreader plate 130 as it moves along the bolts.

It is understood that the guide member 400 may also be fixedly coupled to the PCB230 of the PCBA200, with guide holes provided in the mounting bracket 1113, and the guide member 400 inserted into the guide holes in the mounting bracket 1113 such that the PCBA200 is movable relative to the mounting bracket 1113 in the direction of extension of the guide member 400.

It can be understood that the guide 400 may also be configured as a pin, and an elastic hook claw extending radially is disposed at an end of the pin, when the elastic hook claw is inserted into the through hole, the elastic hook claw is folded and continues to slide along the through hole, and after the elastic hook claw penetrates through the through hole, the elastic hook claw is elastically opened to prevent the pin from moving reversely. A radially extending projection may be provided on the portion of the pin that is not inserted into the through-hole, which projection in turn prevents further insertion of the pin into the through-hole, thereby axially spacing the pin from the mounting bracket 1113 and allowing relative movement of the PCBA200 in the axial direction of the pin.

The heat dissipation structure 010 further includes an elastic member 410, and the elastic member 410 is a compression spring. Spring 410 fits around the outside of guide 400, with one end of spring 410 acting on the end of guide 400 and the other end acting on PCBA 200. When PCBA200 is moved along guide 400 to an end that is positioned away from fixed bracket 1113, PCBA200 is in the first position. When PCBA200 is moved along guide 400 to be located near one end of stationary bracket 1113, PCBA200 is in the second position. The elastic force of the elastic member 410 makes the PCBA200 have a tendency to approach the second position, and when the PCBA200 and the camera unit 030 are assembled, the PCBA200 can be relatively stably located at the second position, and the relative position of the PCBA200 and the camera unit 030 is relatively stable, so that the position of the PCBA200 can be easily controlled, and the PCBA200 and the camera unit 030 can be electrically connected through a flexible wire. The PCBA200 itself integrates a flexible wire (not shown in the figures), and after the PCBA200 is stabilized in position, the flexible wire of the PCBA200 is pulled to the position of the camera unit 030, and the end of the flexible wire is inserted into the port of the camera unit 030.

It will be appreciated that flexible wires may also be routed from the camera unit 030, inserting the flexible wires into ports of the PCBA 200. Or separate flexible wires can be inserted at both ends into the ports of the camera unit 030 and the PCBA200, respectively.

The positioning member 500 is fixedly connected to the PCB230 of the PCBA200, and the positioning member 500 extends from one end of the PCBA200 facing the heat dissipation plate 130 in a direction toward the heat dissipation plate 130. When the PCBA200 is relatively close to the heat sink plate 130, the spacer 500 may contact the heat sink plate 130, preventing the PCBA200 from further approaching the heat sink plate 130, such that there is a closest relative distance between the PCBA200 and the heat sink plate 130. The heat dissipation plate 130 includes a heat dissipation protrusion 131 facing the chip 210, the heat dissipation medium 300 is filled between the heat dissipation protrusion 131 and the chip 210, and the size of the positioning member 500 in the first direction X is larger than the sum of the sizes of the chip 210 and the heat dissipation protrusion 131, and is as close as possible to the sum of the sizes of the chip 210 and the heat dissipation protrusion 131. In this way, on the one hand, when the PCBA200 and the heat dissipation plate 130 are at the closest relative distance, the chip 210 and the heat dissipation boss 131 are as close as possible, and the size of the heat dissipation medium 300 in the first direction X is as small as possible, so that the thermal resistance of the heat dissipation medium 300 can be reduced. On the other hand, the acting force between the chip 210 and the heat dissipation boss 131 can be reduced, and the extrusion of the heat dissipation boss 131 to the chip 210 can be reduced.

The positioning member 500 is a nut post having a threaded hole at an end facing the heat dissipation plate 130. The fixing portion 600 includes a first fixing member 610, and the first fixing member 610 is a limit bolt. The limit bolt includes a screw head 613 and a screw rod 611, a connection hole is provided on the heat dissipation plate 130, and the screw rod 611 passes through the connection hole and is screw-connected with the nut post. As the depth of the screw 611 screwing into the nut column increases, the PCBA200 gradually approaches the heat dissipation plate 130, when the nut column contacts the heat dissipation plate 130, the PCBA200 and the heat dissipation plate 130 are at the closest relative distance, and the cooperation of the first fixing member 610 and the positioning member 500 also makes the PCBA200 and the heat dissipation plate 130 relatively fixed, at this time, the relative distance between the chip 210 and the heat dissipation boss 131 is limited by the size of the nut column, that is, the thickness of the heat dissipation medium 300 is limited by the size of the nut column.

The number of the positioning members 500 is two, and the two positioning members 500 are spaced in the second direction Y, which is a direction parallel to the heat dissipation plate 130. By having two positioning members 500, the heat spreader 130 and the PCBA200 are subject to more force points when the positioning members 500 contact the heat spreader 130, thereby reducing the chance of the PCBA200 deflecting about the positioning members 500 relative to the positioning plate.

It is understood that the number of spacers 500 may be three, four, or more, and that distributing the spacers 500 over a greater area of the PCBA200 may allow the PCBA200 and the heat sink plate 130 to more stably maintain relative positions when the PCBA200 and the heat sink plate 130 are at a closest relative distance.

The outer shell 110 further comprises a third casing element 115, the third casing element 115 being arranged at an end of the second casing element 113 remote from the first casing element 111. A portion of the second case member 113 extends from the outer periphery of the heat radiating plate 130 in a direction away from the panel 1111, and the third case member 115 is detachably attached to the portion. The third case member 115 may effectively protect the heat dissipation plate 130.

Fig. 3 shows a flow chart of the camera of fig. 2 when assembled.

Referring to fig. 3, the assembly of the heat dissipation structure 010 can be performed by the following steps:

s201, mounting the camera unit 030 in a fixing cavity, so that the camera unit 030 is fixed relative to the first casing member 111;

s202, aligning the PCBA200 to the fixing support 1113, sleeving the elastic piece 410 outside the guide piece 400, and enabling the guide piece 400 to penetrate through a guide hole in the PCBA200 to be in threaded fit with the fixing support 1113. At this time, the resilient force of resilient member 410 causes PCBA200 to approach fixing bracket 1113.

S203, the image pickup unit 030 and the PCBA200 are electrically connected by a flexible wire.

S204, the heat dissipation medium 300 is applied to the chip 210 of the PCBA 200.

S205, assembling the second casing 113 and the first casing 111, so that the second casing 113 and the first casing 111 are relatively fixed. The heat dissipation bosses 131 of the heat dissipation plate 130 face the chips 210 on the PCBA 200.

S206, the first fixing element 610 is inserted through the connection hole of the heat dissipation plate 130, and the first fixing element 610 is rotated, such that the first fixing element 610 is screwed with the positioning element 500. The torsion force for rotating the first fixing member 610 is controlled, and when the torsion force for rotating the first fixing member 610 reaches a predetermined value, it is determined that the positioning member 500 has contacted the heat dissipation plate 130. In this process, the heat dissipation medium 300 is adapted to the relative distance between the chip 210 and the heat dissipation boss 131, and is deformed, and the heat dissipation medium 300 is filled between the chip 210 and the heat dissipation boss 131.

S207, the third housing part 115 and the second housing part 113 are assembled.

In this assembly form, the PCBA200 is movably fitted with the housing 100 when assembled, and when the PCBA200 is relatively fixed to the heat dissipation plate 130, the relative distance between the heat dissipation boss 131 and the chip 210 is controlled by the positioning member 500, so that the distance between the chip 210 and the heat dissipation boss 131 can be reduced, thereby making the heat dissipation medium 300 have a smaller thickness and reducing the thermal resistance between the chip 210 and the heat dissipation boss 131. So that the heat of the chip 210 can be rapidly transferred to the heat dissipation plate 130 and dissipated out of the receiving cavity through the housing 110.

The PCBA200 and the heat spreader plate 130 have a defined relative distance therebetween after assembly, thereby reducing the gap caused by relative movement between the PCBA200 and the heat spreader plate 130. The PCBA200 and the heat sink 130 can simultaneously contact both sides of the heat sink 300 even in a state where the camera 001 is moving, thereby obtaining a good heat conduction.

The heat sink 130 is directly and fixedly connected to the housing 110, and the heat sink 130 and the housing 110 may be integrally formed, so that the heat sink 130 can rapidly conduct heat to the housing 110. The thickness of the heat dissipating medium 300 is controlled in such a manner that the PCBA200 approaches the heat dissipating plate 130 during assembly, and the flexibility of the electrical connection between the PCBA200 and the image pickup unit 030 by flexible wires is fully utilized. After the heat dissipation structure 010 is assembled, the heat dissipation effect is guaranteed, and meanwhile, the heat dissipation structure has smaller internal stress.

It is understood that the heat dissipation structure 010 can be used in other electronic devices. For example, the projection unit is installed in the accommodating cavity as an electronic device, so that a projector with a good heat dissipation effect is formed.

Fig. 4 shows a cross-sectional view of a camera 001 in an embodiment of the present application.

As shown in fig. 4, this camera 001 is different from the camera 001 in fig. 2 in that an elastic member 410 is provided between the PCBA200 and the fixing bracket 1113, and the elastic force of the elastic member 410 causes the PCBA200 to have a tendency to approach the first position, and when the PCBA200 and the camera unit 030 are assembled, the PCBA200 can be relatively stably located at the first position, and the PCBA200 and the camera unit 030 are relatively stably located, so that it is easy to control the position of the PCBA200, and it is convenient to electrically connect the PCBA200 and the camera unit 030 via a flexible wire. Moreover, since the PCBA200 is relatively close to the heat dissipating plate 130 when the PCBA200 is in the first position, it is easier to find the connecting holes on the heat dissipating plate through the connecting holes to be opposite to the positioning members 500 on the PCBA200 when the first casing member 111 and the second casing member 113 are butted.

When the heat dissipation structure 010 is assembled, the following steps may be performed:

s202, the guide piece 400 penetrates through a guide hole in the PCBA200, the elastic piece 410 is sleeved outside the guide piece 400, the guide piece 400 is aligned with a threaded hole in the fixing support 1113, and the guide piece 400 is rotated to enable the guide piece 400 to be in threaded fit with the fixing support 1113. At this time, the resilient force of resilient member 410 urges PCBA200 away from fixed bracket 1113.

S205, assembling the second casing 113 and the first casing 111, so that the second casing 113 and the first casing 111 are relatively fixed. The heat dissipating bosses 131 of the heat dissipating plate 130 face the chips 210 on the PCBA 200.

S206, the first fixing member 610 passes through the connection hole of the heat dissipation plate 130, and the first fixing member 610 is rotated, so that the first fixing member 610 is screw-engaged with the positioning member 500. The torsion for rotating the first fixing member 610 is controlled, and when the torsion for rotating the first fixing member 610 reaches a predetermined value, it can be determined that the positioning member 500 has contacted the heat dissipation plate 130. In this process, the heat dissipation medium 300 is adapted to the relative distance between the chip 210 and the heat dissipation boss 131, and is deformed, and the heat dissipation medium 300 is filled between the chip 210 and the heat dissipation boss 131.

S207, the third casing 115 and the second casing 113 are assembled.

Fig. 5 shows a cross-sectional view of a camera 001 in an embodiment of the present application.

As shown in fig. 5, the video camera 001 includes an image pickup unit 030 and a heat dissipation structure 010. The heat dissipation structure 010 includes a casing 100, the casing 100 has a housing cavity, and the camera unit 030 is installed in the housing cavity, and the camera unit 030 is protected by the casing 100. The heat dissipation structure 010 further includes a PCBA200, the PCBA200 is also disposed in the accommodating cavity, and the PCBA200 is electrically connected to the camera unit 030 as the electronic device, so as to achieve data transmission between the PCBA200 and the camera unit 030. The case 100 further includes a case 110 and a heat sink 130, and the case 110 is fixedly connected to the heat sink 130, so that heat can be rapidly conducted between the case 110 and the heat sink 130. Heat sink 130 is positioned within the receiving cavity, and heat sink 130 is configured to absorb heat from PCBA200 and conduct the heat to housing 110.

The camera 001 also includes a heat-dissipating medium 300, and the PCBA200 includes a chip 210. During operation of PCBA200, chip 210 generates a large amount of heat, and heat dissipation medium 300 fills the space between chip 210 and heat dissipation plate 130, transfers the heat generated by chip 210 to heat dissipation plate 130, and dissipates the heat through housing 110.

The heat dissipating structure 010 further includes a guide 400, a positioning member 500, and a fixing portion 600. The guide 400 is fixedly connected to the fixing bracket 1113, and the guide 400 extends in the first direction X from a surface of the fixing bracket 1113 close to the heat radiating plate 130. The first direction X is a direction in which the PCBA200 faces the heat radiating plate 130, that is, a direction perpendicular to the plate-shaped PCBA 200. The PCBA200 is provided with a guide hole into which the guide 400 is inserted so that the PCBA200 can extend in the extending direction of the guide hole.

The heat dissipation structure 010 further includes an elastic member 410, and the elastic member 410 is a compression spring. Spring 410 fits over the outside of guide 400, with one end of spring 410 acting on the end of guide 400 and the other end acting on PCBA 200. When PCBA200 is moved along guide 400 to an end that is located away from fixed bracket 1113, PCBA200 is in the first position. When PCBA200 moves along guide 400 to be located near one end of fixed bracket 1113, PCBA200 is in the second position. The elastic force of the elastic member 410 makes the PCBA200 have a tendency to approach the second position, and when the PCBA200 and the camera unit 030 are assembled, the PCBA200 can be relatively stably located at the second position, and the relative position of the PCBA200 and the camera unit 030 is relatively stable, so that the position of the PCBA200 can be easily controlled, and the PCBA200 and the camera unit 030 can be electrically connected through a flexible wire.

The positioning member 500 is fixedly connected to the heat sink plate 130, and the positioning member 500 extends from one end of the heat sink plate 130 toward the PCBA200 in the direction of the PCBA 200. The positioning member 500 is integrally formed with the heat dissipation plate 130, and the positioning member 500 is a protrusion on the surface of the heat dissipation plate 130. When the PCBA200 is relatively close to the heat sink plate 130, the spacer 500 may contact the PCBA200, preventing the PCBA200 from further approaching the heat sink plate 130, such that there is a closest relative distance between the PCBA200 and the heat sink plate 130. The heat dissipation plate 130 includes a heat dissipation protrusion 131 facing the chip 210, the heat dissipation medium 300 is filled between the heat dissipation protrusion 131 and the chip 210, and the size of the positioning member 500 in the first direction X is larger than the sum of the sizes of the chip 210 and the heat dissipation protrusion 131, and is as close as possible to the sum of the sizes of the chip 210 and the heat dissipation protrusion 131. In this way, on the one hand, when the PCBA200 and the heat dissipation plate 130 are at the closest relative distance, the chip 210 and the heat dissipation boss 131 are as close as possible, and the size of the heat dissipation medium 300 in the first direction X is as small as possible, so that the thermal resistance of the heat dissipation medium 300 can be reduced. On the other hand, the acting force between the chip 210 and the heat dissipation boss 131 can be reduced, and the extrusion of the heat dissipation boss 131 to the chip 210 can be reduced.

The fixing portion 600 includes a first fixing member 610 and a second fixing member 630, the first fixing member 610 is a limit bolt, and the second fixing member 630 is a nut. Second fixing member 630 is fixedly provided on a surface of PCBA200 facing heat sink 130. The limit bolt includes a screw head 613 and a screw rod 611, a connection hole is provided on the heat dissipation plate 130, and the screw rod 611 passes through the connection hole and is screw-connected with the nut. As the depth of the screw 611 screwing into the nut increases, the PCBA200 gradually approaches the heat dissipation plate 130, when the positioning member 500 contacts the PCBA200, the PCBA200 and the heat dissipation plate 130 are at the closest relative distance, and the cooperation of the first fixing member 610 and the second fixing member 630 also makes the PCBA200 and the heat dissipation plate 130 relatively fixed, at this time, the relative distance between the chip 210 and the heat dissipation boss 131 is limited by the size of the positioning member 500, that is, the thickness of the heat dissipation medium 300 is limited by the size of the positioning member 500.

The number of the positioning members 500 is two, and the two positioning members 500 are spaced in the second direction Y, which is a direction parallel to the heat dissipation plate 130. By having two spacers 500, the heat spreader plate 130 will have more points of force on the PCBA200 when the spacers 500 contact the PCBA200, thereby reducing the chance of the PCBA200 deflecting about the spacers 500 relative to the positioning plate.

It is understood that the number of the positioning members 500 may be three, four or more, and that the positioning members 500 are distributed over a larger area of the heat dissipation plate 130, so that the PCBA200 and the heat dissipation plate 130 maintain their relative positions more stably when the PCBA200 and the heat dissipation plate 130 are at the closest relative distance.

It will be appreciated that the spacer 500 may also be provided on the PCBA200, with the spacer 500 contacting the heat sink plate 130 when the PCBA200 is relatively close to the heat sink plate 130, thereby limiting the relative distance of the PCBA200 and the heat sink plate 130.

The outer shell 110 further comprises a third casing element 115, the third casing element 115 being arranged at an end of the second casing element 113 remote from the first casing element 111. A portion of the second casing 113 extends from the outer periphery of the heat dissipation plate 130 in a direction away from the panel 1111, and the third casing 115 is detachably connected to the portion. The third case member 115 may effectively protect the heat dissipation plate 130.

S206, the first fixing member 610 passes through the connection hole of the heat dissipation plate 130, and the first fixing member 610 is rotated such that the first fixing member 610 is screw-engaged with the second fixing member 630. The torque force for rotating the first fixing member 610 is controlled, and when the torque force for rotating the first fixing member 610 reaches a predetermined value, the positioning member 500 is considered to have contacted the PCBA 200. In this process, the heat dissipation medium 300 is adapted to the relative distance between the chip 210 and the heat dissipation boss 131, and is deformed, and the heat dissipation medium 300 is filled between the chip 210 and the heat dissipation boss 131.

S207, the third casing 115 and the second casing 113 are assembled.

Fig. 6 shows a cross-sectional view of a camera 001 in an embodiment of the present application.

As shown in fig. 6, this camera 001 is different from the camera 001 in fig. 5 in that an elastic member 410 is provided between the PCBA200 and the fixing bracket 1113, and the elastic force of the elastic member 410 causes the PCBA200 to have a tendency to approach the first position, and when the PCBA200 and the camera unit 030 are assembled, the PCBA200 can be relatively stably located at the first position, and the PCBA200 and the camera unit 030 are relatively stably located, so that it is easy to control the position of the PCBA200, and it is convenient to electrically connect the PCBA200 and the camera unit 030 via a flexible wire. Moreover, since the PCBA200 is relatively close to the heat dissipating plate 130 when the PCBA200 is in the first position, it is easier to find the connecting holes on the heat dissipating plate through the connecting holes to be opposite to the positioning members 500 on the PCBA200 when the first casing member 111 and the second casing member 113 are butted.

S207, the third casing 115 and the second casing 113 are assembled.

The above description is only an embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure should be covered by the disclosure of the present application.

Claims

1. The utility model provides a heat radiation structure, includes the casing, the casing includes shell and heating panel, the shell with heating panel fixed connection, the shell has the holding chamber, the heating panel set up in the holding intracavity, the holding chamber still is used for holding PCBA, PCBA includes the chip with form the clearance that is used for filling the radiating medium between the heating panel, its characterized in that, heat radiation structure still includes:

one end of the guide piece is fixedly connected with the shell, and the other end of the guide piece is in sliding fit with the PCBA so as to guide the PCBA to relatively approach or depart from the heat dissipation plate along the guide piece;

one end of the positioning piece is fixedly connected with the PCBA, and the other end of the positioning piece is in contact with the heat dissipation plate so as to limit the size of the gap between the heat dissipation plate and the PCBA;

the fixed part comprises a first fixed part and a second fixed part, the second fixed part is fixedly connected with the PCBA, one end of the first fixed part is used for limiting the heating panel to be relatively far away from the PCBA, and the other end of the first fixed part is used for being detachably matched with the second fixed part.

2. The heat dissipating structure of claim 1,

the heat dissipation structure further comprises an elastic piece, one end of the elastic piece acts on the PCBA, and the other end of the elastic piece acts on the guide piece or the shell;

the spring causes the PCBA to have a tendency to move closer to or further away from the heat sink plate.

3. The heat dissipating structure of claim 1, wherein said housing comprises a first casing member and a second casing member, said first casing member being detachably engaged with said second casing member;

the first shell is connected with the guide piece;

the second shell is fixedly connected with the heat dissipation plate.

4. The heat dissipating structure of claim 1, wherein said first fixing member comprises a retaining bolt and said second fixing member comprises a nut;

the heat dissipation plate is provided with a connecting hole;

the limiting bolt comprises a screw and a screw head, the screw can penetrate through the connecting hole and is matched with the nut, and the screw head can contact the heat dissipation plate to be far away from one surface of the PCBA so as to limit the heat dissipation plate to be relatively far away from the PCBA.

5. The heat dissipating structure of claim 4, wherein the dimension of the positioning member is greater than the dimension of the nut in a first direction, the first direction being a direction of the PCBA toward the heat dissipating plate.

6. The heat dissipating structure of claim 1, wherein the number of the positioning members is at least two, and two positioning members are spaced apart in a second direction, which is a direction parallel to the heat dissipating plate.

7. The heat dissipating structure of claim 1, wherein the heat dissipating plate comprises heat dissipating bosses facing the chip;

the heat dissipation boss is used for contacting one surface of the heat dissipation medium far away from the chip.

8. The heat dissipating structure of claim 1, wherein the heat dissipating plate comprises heat dissipating bosses facing the chip;

the heat dissipation boss is used for contacting the heat dissipation medium.

9. The utility model provides a heat radiation structure, includes the casing, the casing includes shell and heating panel, the shell with heating panel fixed connection, the shell has the holding chamber, the heating panel set up in the holding intracavity, the holding chamber still is used for holding PCBA, PCBA includes the chip with form the clearance that is used for filling the radiating medium between the heating panel, its characterized in that, heat radiation structure still includes:

the fixing part comprises a first fixing part, one end of the first fixing part is used for limiting the heating panel to be relatively far away from the PCBA, and the other end of the first fixing part is used for detachably matching with the positioning part.

10. A camera comprising a camera unit, a PCBA, a heat-dissipating medium, and a heat-dissipating structure according to any one of claims 1 to 9;

the camera shooting unit is arranged in the accommodating cavity and is electrically connected with the PCBA;

the PCBA is arranged in the accommodating cavity and is in sliding fit with the guide piece;

one end of the heat dissipation medium is in contact with the PCBA, and the other end of the heat dissipation medium is in contact with the heat dissipation plate.

11. The camera of claim 10, wherein the housing further has a light-transmissive aperture, and the camera unit includes a camera head, the camera head facing the light-transmissive aperture.

12. The camera of claim 10, wherein the housing comprises a panel and a fixing bracket, the fixing bracket is fixedly connected with the panel, the fixing bracket is located in the accommodating cavity, the fixing bracket has a fixing cavity, and the fixing cavity is used for fixing the camera shooting unit;

the fixing bracket is matched with the guide piece.

13. The camera of claim 10, further comprising a flexible wire having one end electrically connected to the PCBA and another end electrically connected to the camera element.