KR102130628B1 - Camera devices with heat dissipation structure - Google Patents

Abstract

An imaging device is disclosed. The imaging device according to the present invention includes an imaging element module mounted with an imaging element that senses an image from a lens barrel and light passing through a lens group in the lens barrel, and an external housing in which the imaging element module is embedded. In the present invention, a built-in outer housing and a circular or polygonal hole formed in the center include a heat sink having a raised portion formed to a size corresponding to the hole of the image pickup device substrate, and the raised portion passing through the hole in front of the imaging element substrate. It is a point that it is configured to be in direct contact with the back side of the imaging element, and the edge portion of the heat sink in direct contact with the outer housing, so that the heat generated by the imaging element absorbs and radiates heat to the outside through the outer housing.

Description

{Camera devices with heat dissipation structure}

The present invention relates to an imaging device, and particularly to a imaging device having a simple structure and a heat dissipation structure capable of exhibiting high heat dissipation performance.

Semiconductor imaging devices, such as CCD (Charge Coupled Devices) mounted on electronic cameras, tend to increase dark noise due to dark current as the temperature of the device increases and the time for exposure to light increases. This is the main factor that degrades the imaging sensitivity of the camera.

Accordingly, in a high-sensitivity camera device such as an astrophotography camera, a scientific research microscope camera, and an industrial camera that shoots a small amount of light for a long time, the rear surface of the imaging device is forced using a Peltier element, air cooling, water cooling, liquid nitrogen, or the like. Cooling is used to reduce the dark current significantly.

For example, Japanese Patent Publication No. 1997-162379'Cooled CCD Camera Device' is a technology that uses a Peltier element, and installs a window on the heat conduction bracket in contact with the Peltier element, and first installs the CCD package or heat conduction bracket as a Peltier element. A technique for preventing condensation on the CCD surface by condensation is disclosed.

In addition, U.S. Patent No. 6,466,443'Heat sink fastener with pivotable securing means' is a typical example of an air cooling method using a cooling fan, which attaches a heat sink to the CPU surface, which is a heat source, absorbs heat from the heat source, and absorbs heat from the heat sink. It is configured to cool the heat sink with air by installing a cooling fan on the top.

However, the CCD (Charge Coupled Devices) cooling method using a Peltier device has a problem of increasing the complexity of the device due to the addition of a power line that supplies power to the Peltier device, and the problem that the total power consumption is increased due to the use of the Peltier device. There is.

In addition, the air cooling method using a heat sink and a cooling fan also has a large total power consumption due to the use of a cooling fan, and the noise generated when the fan rotates becomes a problem. In particular, it is structurally complicated and requires a lot of assembly processes. And there is a problem that there is a limit to downsizing the device due to the volume of the cooling fan.

On the other hand, Korean Patent Registration No. 10-0444559'semiconductor device' is a technology that employs a heat conduction cooling method to suppress the temperature rise of the CCD chip by using a plate-shaped heat sink attached to the bottom of the CCD chip. It has a feature that can eliminate the use of parts that require power, such as cooling fans.

Therefore, there is an advantage in terms of manufacturing cost or device miniaturization compared to a conventional method using a Peltier element or a cooling fan. However, since the heat sink structure is simple, the effect of suppressing the high temperature heat generated by the CCD chip is not sufficiently exhibited, thereby deteriorating the overall heat dissipation performance.

Japanese Patent Publication No. 1997-162379 (Publication date 1997. 06. 20) Korean Registered Patent No. 10-0444559 (Registration Date 2004. 08.05)

The technical problem to be solved by the present invention is to provide an image photographing device having a simple structure and an effective cooling effect on an imaging device.

Another technical problem to be solved by the present invention is to provide an image photographing apparatus capable of excluding the use of current-consuming parts such as a Peltier element or a cooling fan and achieving device miniaturization.

According to an embodiment of the present invention as a solution to the problem,

In the imaging device including a lens barrel and an imaging element module mounted with an imaging element for sensing an image from light passing through a lens group in the lens barrel, and an external housing in which the imaging element module is built,

An imaging element substrate embedded in the outer housing and having a circular or polygonal hole formed in the center; And

It includes; a heat sink having a raised portion formed in a size corresponding to the hole of the imaging element substrate;

The ridge portion passes through the hole and is in direct contact with the back of the imaging element in front of the imaging element substrate, and the edge portion of the heat sink is directly in contact with the outer housing, so that the heat generated by the imaging element absorbs the heat and absorbs the outer housing. It provides an image taking device, characterized in that configured to radiate heat to the outside.

The image photographing apparatus according to an embodiment of the present invention may further include a support block interposed between the imaging element substrate and the imaging element, and supporting the imaging element apart from the imaging element substrate.

At this time, a plurality of sockets are mounted around the hole of the imaging element substrate, and a plurality of pins are formed to correspond to each of the sockets on the surface of the imaging element facing the imaging element substrate. The imaging element may be electrically connected to the imaging element substrate while being spaced apart from the imaging element substrate.

In addition, a holder for arranging and fixing the plurality of sockets at equal or equal intervals may be interposed between the central opening of the support block through which the raised portion passes and the raised portion, and more preferably, the holder may be an electrical insulator. .

In addition, a thermally conductive elastic pad may be interposed between the imaging element and the surface of the raised portion.

The raised portion applied to the present invention is preferably provided to connect two parallel heat-conducting pieces and one end of the heat-conducting piece, and a heat input piece having an even heat-transfer surface formed on a side facing the imaging element; Can.

In addition, the heat sink applied to the present invention preferably includes a first heat exchanger and a second heat exchanger, which are connected to the ridges at both sides of the ridge, and the first heat exchanger and the second heat exchanger. At least one gap holder is formed in each of the portions, and the first and second heat transfer portions are spaced apart from the imaging device substrate by a predetermined distance.

At this time, a first air-cooled channel is formed between the imaging element substrate and the imaging element by the raised portion, and between the imaging element substrate and the heat sink by the first heat transfer portion and the second heat transfer portion disposed at a predetermined distance from the imaging element substrate. A second air cooling channel and a third air cooling channel may be formed.

In addition, according to an embodiment of the present invention, a plate-shaped heat dissipation piece is formed at the edge of the heatsink contacting the outer housing, and the heatsink is configured to be in surface contact with the outer housing through the heat dissipation, thereby enabling effective heat transfer. have.

In addition, the outermost surface of the support block is configured to be spaced apart from the housing by a predetermined distance for positioning of the imaging device and assembly of the block, and the support block is made of aluminum (Al) or an aluminum alloy material, and the imaging device substrate The support block may be plated to prepare for electromagnetic interference (EMI) and electrostatic discharge (ESD), and at the same time, improve heat transfer performance from the imaging device substrate to the support block.

According to the image photographing device according to an embodiment of the present invention, the heat of the imaging element can be radiated to the outside through the metal heat sink and the outer housing by directly contacting the metal heat sink connected to the outer housing on the back of the imaging element, which is a heat source (heating element). As a structure having a very simple structure, high cooling performance can be exhibited without using a separate current-consuming component.

In addition, since the use of current-consuming parts such as a Peltier element or a cooling fan is excluded, the power consumption of the entire equipment is greatly reduced, which has an advantage in terms of energy efficiency, and is a simple mechanical structure that does not use current-consuming parts. In addition to the increase in mass productivity due to shrinking, the equipment can be made more compact and compact to meet the market demand in the trend.

In addition, structurally, since the imaging element is a structure that is electrically connected to the substrate in a state spaced from the substrate (imaging element substrate) through a support block, it is possible to minimize the effect of heat generated by the imaging element directly on the substrate. have. For example, it is possible to prevent or minimize substrate deformation due to high temperature heat, component damage, or device malfunction.

In addition, since a separate socket is mounted on the imaging element substrate, the imaging element is electrically connected to the imaging element substrate in a state spaced apart from the imaging element substrate through a support block, and thus can be applied to an expensive imaging element during functional inspection of the substrate. The electrical damage can be prevented, and the distance between the imaging device and the substrate can be more freely adjusted according to the specification change through a change in the thickness of the support block.

1 is a partial cutaway cross-sectional view of an image photographing device according to an embodiment of the present invention.
Figure 2 is an exploded perspective view showing the separation of the imaging device module, which is a main part of the present invention.
Figure 3 is an enlarged view of a main portion of the present invention showing an enlarged portion'A' of Figure 1;
Figure 4 is a cross-sectional view of the heat sink shown in Figure 2 as viewed from the AA line direction.
FIG. 5 is a cross-sectional view of the heat sink shown in FIG. 2 when viewed from the direction BB.
6 is a view showing the flow of heat generated in the imaging device in the image pickup device according to an embodiment of the present invention.

Hereinafter, a preferred embodiment of the present invention will be described in detail.

Terms used in the specification are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, the terms “include” or “have” are intended to indicate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, or that one or more other features or It should be understood that the presence or addition possibilities of numbers, steps, actions, components, parts or combinations thereof are not excluded in advance.

Further, terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from other components.

In addition, terms such as “…unit”, “…unit”, and “…module” described in the specification mean a unit that processes at least one function or operation, which may be implemented by hardware or software or a combination of hardware and software. Can.

In the description with reference to the accompanying drawings, the same reference numerals will be assigned to the same components, and redundant description thereof will be omitted. In the following description, when it is determined that a detailed description of known technologies related to the present invention may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted.

1 is a partially cut-away cross-sectional view of an image photographing apparatus according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view showing an imaging device module that is a main part of the present invention. And Figure 3 is an enlarged view of a main portion of the present invention showing the enlarged portion'A' in FIG.

1 to 3, the image photographing device 1 according to an embodiment of the present invention includes a lens mount 10, an imaging device module 20, and an outer housing 40. A lens barrel (not shown) is mounted on the front end of the lens mount 10, and the imaging element module 20 includes an imaging element 21 that senses an image from light passing through a lens group in the lens barrel.

The lens mount 10 serves to connect the lens barrel and the camera body. Depending on the lens manufacturer, the mount flange back distance, that is, the distance from the imaging surface of the imaging element to the front end of the lens mount 10 and the lens mounting method may be different, so there is a special limitation in the length or structure of the lens mount 10. no.

The imaging element module 20 includes an imaging element 21 and an imaging element substrate 23 on which the imaging element 21 is mounted. In addition, the imaging element 21 is provided with a heat sink 24 which is a heat dissipation element that prevents dark current and dark noise from being generated by the driving heat. The imaging element 21 senses an image from light passing through the lens group in the lens barrel and provides image data to the imaging element substrate 23 in the form of an electrical signal.

The image data provided from the imaging device 21 undergoes a data processing process through a processing element mounted on the imaging device substrate 23 (a series of data processing processes to reconstruct image data into an image form), and a display unit integrally configured with the equipment By passing it to (not shown), the user can express it recognizablely, or it can be transmitted to an external device such as a computer connected through a dedicated cable.

A circular or polygonal hole 230 is formed in the center of the imaging element substrate 23 embedded in the outer housing 40. Further, a raised portion 240 is formed in a size corresponding to the hole 230 in a position corresponding to the hole 230 of the imaging element substrate 23 on the heat sink 24, and the raised portion 240 is the It passes through the hole 230 and directly contacts the back side of the imaging element 21 positioned in front of the imaging element substrate 23 based on the input direction of light.

The outermost edge portion of the heat sink 24 in which the raised portion 240 contacts the imaging element 21 is configured to contact the outer housing 40 constituting the outer shape of the equipment. Accordingly, when heat is generated from the imaging element 21, the heat is absorbed by the heat sink 24, and the absorbed heat is transferred to the outer housing 40 on the relatively low temperature side along the heat sink 24 and the outer housing ( 40).

That is, in the imaging element module 20 applied to the embodiment of the present invention, the heat generated by the imaging element 21 is absorbed by the heat sink 24 through the raised portion 240 contacting the imaging element 21, and the heat sink As a structure for dissipating the heat absorbed by (24) to the outside through the outer housing 40, it is possible to effectively dissipate heat from the imaging element 21 to the outside without using a separate current-consuming component as in the prior art.

The heat sink 24 may be, for example, a metal having light and high thermal conductivity, such as copper (Cu) or aluminum (Al), but is not limited to a metal such as copper or aluminum. This is because, in some cases, a metal having a high thermal conductivity such as silver (Ag) or beryllium (Be) or a thermally conductive plastic having a thermal conductivity almost similar to that of a metal can also be used.

A support block 26 may be interposed between the imaging element 21 and the imaging element substrate 23. The support block 26 is for maintaining a constant distance between two components 21 and 23 between the imaging element substrate 23 and the imaging element 21, and maintaining the heat sink 24 and a plurality of gaps It is connected to the dragon leg 265 and can be stably disposed at a predetermined position in the outer housing 40.

The outermost surface of the support block 26 is configured to be spaced apart from the outer housing 40 by a predetermined distance for adjusting the position of the imaging element 21 and the assembly of the support block 26, but the support block 26 is made of aluminum ( Al) or aluminum alloy material, plated on the contact area of the support block of the imaging device substrate to prepare for EMI (Electromagnetic interference), ESD (Electrostatic discharge), and at the same time heat conduction from the imaging device substrate to the support block side It can also be configured to improve performance.

A plurality of sockets 232 are mounted around the hole 230 of the imaging element substrate 23. In addition, a plurality of pins 212 are formed on the surface of the imaging element 21 facing the imaging element substrate 23 corresponding to each of the sockets 232. Accordingly, when assembling equipment, the imaging elements 21 are spaced apart from each other through the support block 26 through the combination of the socket 232 on the imaging element substrate 23 and the corresponding pins 212. The substrate 23 is electrically connected.

The central opening of the support block 26 through which the ridge 240 passes, so that the assembly of the imaging element 21 in the assembly process and the resistance of the socket 232 and the pin 212 to the external impact are increased. Between the 260 and the raised portion 240, as shown in FIGS. 1 and 3, the holder 50 may be interposed as an insulator that aligns and secures the plurality of sockets 232 at equal or equal intervals. have.

On the other hand, the heat transfer efficiency of the imaging element 21 with respect to the heat sink 24 is greatly influenced by the state of contact between the imaging element 21 and the heat sink 24, specifically, the raised portion 240. Therefore, in order to increase the heat transfer efficiency, stable adhesion between the imaging device 21 and the raised portion 240 is required, and for this purpose, a thermally conductive elastic pad 22 is interposed.

Thermally conductive elastic pads (Thermal pads) 22 are interposed between the surfaces of the imaging element 21 and the ridges 240, so that these (imaging elements and ridges) are stably in close contact with each other to make surface contact. It is guided so that it functions as a stable and rapid heat transfer from the imaging element 21 toward the heat sink 24.

That is, the thermally conductive elastic pad (Thermal pad, 22) is to increase the heat transfer efficiency by increasing the contact area through the stable contact of the imaging element 21 to the raised portion 240, for example, thermally conductive silicone rubber or A metal film may be coated with a thermally conductive elastic adhesive on the surface of an elastic body such as a thermally conductive synthetic rubber, but is not limited thereto.

4 and 5 are cut-away cross-sectional views of the heat sink shown in FIG. 2 in AA and BB directions, respectively, and the structure of the heat sink applied to the embodiment of the present invention will be described in more detail. .

1 and 4 and 5, the main function of the heat sink 24 is the heat dissipation function for the imaging element 21, but the imaging element module 20 including the imaging element substrate 23 is provided in the outer housing 40. ) It also serves as a support for fixing in a fixed position. The heat sink 24 includes the above-described raised portion 240 which directly or indirectly contacts the imaging element 21 or the thermally conductive elastic pad 22.

The heat sink 24 also includes a plate-shaped heat sink piece 246 in contact with the outer housing 40. The heat dissipation piece 246 may be configured to be bent at a substantially right angle from the outermost edge end of the heat sink 24 to extend any length in the longitudinal direction of the outer housing 40, and the heat dissipation piece 246 and the outer housing ( 40) may be configured to make surface contact with a portion of the inner surface of the outer housing 40 so that rapid heat transfer can be achieved therebetween.

In some cases, a heat transfer fluid, such as thermal grease, between the outer housing 40 and the heat dissipation piece 246, more specifically, on the surface of the heat dissipation piece 246 contacting the outer housing 40. By applying a material, it is possible to ensure stable and rapid heat transfer from the heat dissipation piece 246 toward the outer housing 40.

Further, the heat dissipation piece 246 may be configured to be inclined at an arbitrary angle outside the heat dissipation plate 24. When the heat dissipation piece 246 is configured to be inclined at an arbitrary angle to the outside of the heat dissipation plate 24, the heat dissipation piece 246 forms a strong surface contact in an elastic contact with the corresponding surface of the outer housing 40, so that The imaging element module 20 may be fixed at a designated position in the outer housing 40 without fixing means.

In addition, when the heat dissipation piece 246 is configured to be inclined at an arbitrary angle to the outside of the heat dissipation plate 24, the heat dissipation piece 246 is configured to form a strong surface contact in an elastic contact with the corresponding surface of the outer housing 40, so that the outside The heat transfer area from the heat sink 24 to the outer housing 40 can be smoothly performed by increasing the area of heat transfer through stable contact between the housing 40 and the heat sink 24.

Here, since the number or formation position of the heat dissipation piece 246 may vary depending on the shape or size of the outer housing 40, it is revealed that the number or formation position is not limited to the form illustrated in the drawings.

On the other hand, the raised portion 240 is preferably, in the drawing, the two thermal conductive pieces (240b, see FIG. 5) parallel to each other extending in the horizontal direction toward the imaging element 21 from the imaging element substrate 23 side, and the thermal conductivity It is provided to interconnect one end of the piece 240b, and may be configured of a heat input piece 240a having a heat-transferring surface with an even surface on the side facing the imaging element 21.

The first heat transfer part 242 and the second heat transfer part 244 are provided on both side portions of the raised part 240 to be connected to the raised part 240. In addition, one or more gap holders 248 are formed in each of the first heat transfer portion 242 and the second heat transfer portion 244, passing through the gap maintenance hole 248 and the imaging element substrate 23 and supporting blocks ( 26) coupled to each other through a fastening member 249 coupled to constitute one imaging device module 20.

The fastening member 249 serves to couple the gap holder 248 to the imaging element substrate 23 and the support block 26 as one, and the imaging element substrate 23 with the heat sink 24 interposed therebetween. It serves to increase stability by maintaining the contact height of connectors that electrically connect the two substrates between other substrates (not shown) disposed opposite to each other.

In addition, the gap holder 248 extends an arbitrary length toward the imaging element substrate 23 side of each of the surfaces of the first heat transfer portion 242 and the second heat transfer portion 244 facing the imaging element substrate 23, and assembling parts. Thereafter, the first heat transfer part 242 and the second heat transfer part 244 are spaced apart from the imaging element substrate 23 to reduce the influence of heat of the heat sink 24 on the substrate.

In addition, a first air cooling channel 250 through which air can flow is formed between the imaging element substrate 23 and the imaging element 21 by the raised portion 240, and the first heat transfer portion 242 and the 2 The second air-cooling channel 252 and the third air-cooling channel 254 are formed between the imaging element substrate 23 by the heat transfer unit 244, thereby cooling the air flow in each air-cooling channel by convection. Can be exerted and more rapid heat dissipation can be implemented.

Hereinafter, the process of discharging the heat of the imaging element from the image photographing device configured as described above to the outside of the device will be briefly described in connection with the schematic operation of the image photographing device.

6 is a view for explaining the flow of heat generated in the imaging device in the image pickup device according to an embodiment of the present invention.

Referring to FIG. 6, light reflected from a subject when photographing an image is incident on a lens group in the lens barrel through an incident portion (not shown) of the lens barrel, and the imaging element 21 is a lens group in the lens barrel (not shown) ) Senses an image from light passing through and provides image data to the imaging element substrate 23 in the form of an electrical signal.

The image data provided from the imaging device 21 is integrated (or separately) into the equipment through a data processing process (a series of data processing process to reconstruct image data into an image form) through a processing element mounted on the imaging device substrate 23. By being transmitted to the display unit configured as, the user is recognized or displayed, or transmitted to an external device such as a computer connected through a dedicated cable.

The imaging element 21 senses an image from external light and converts image data into an electrical signal. Therefore, a lot of heat is generated in the process. In particular, the longer the exposure time of the imaging element 21 to the light, the more heat is generated. The generated heat is a factor that increases the dark noise caused by the dark current, and consequently decreases the imaging sensitivity of the camera.

According to an embodiment of the present invention, the heat of the imaging element 21 can be quickly and efficiently dissipated outside the equipment without using a current-consuming component such as a Peltier element or a cooling fan. The heat sink (24) connected to the outer housing (40) is directly contacted to the back of the imaging element (21), which is a heat source (heating element), so that the heat of the imaging element (21) is external through the metal heat sink (24) and the outer housing (40). This is because a structure for dissipating heat is provided.

More specifically, when heat is generated in the imaging element 21, the heat is absorbed by the heat sink 24 through the thermally conductive elastic pad 22. And the absorbed heat is transferred to the outer housing 40 on the relatively low temperature side along the heat sink 24 and is discharged into the air through the outer housing 40. In addition, a part of the heat is transmitted to the outer housing 40 through the support block 26 supporting the imaging element 21 and is discharged into the air.

That is, most of the heat generated from the imaging element 21 is discharged to the outside of the equipment through one heat transfer path leading to the thermally conductive elastic pad 22 -> heat sink 24 -> outer housing 40, and some heat is supported Block 26 -> is discharged outside the equipment through another heat transfer path leading to the outer housing 40. Therefore, smooth heat dissipation can be realized without a current-consuming component such as a Peltier element or a cooling fan.

In addition, while the heat of the imaging element 21 is moved to the outer housing 40 through the heat sink 24, the first air cooling channel 250 by the raised portion 240 of the heat sink 24 and the first Due to the cooling action of the relatively low temperature air flowing through the second air cooling channel 252 and the third air cooling channel 254 by the heat transfer unit 242 and the second heat transfer unit 244, part of the outer housing 40 Effective heat dissipation is realized by diffuse heat dissipation inside.

According to the image pickup device according to the embodiment of the present invention as described above, the metal heat sink connected to the external housing is directly brought into contact with the rear surface of the imaging element, which is a heat source (heating element), and the heat of the imaging element is transferred to the outside through the metal heat sink and the external housing. As a structure capable of dissipating heat, the structure is very simple and high cooling performance can be exhibited without using a separate current-consuming component.

In addition, since the use of current-consuming parts such as a Peltier element or a cooling fan is excluded, the power consumption of the entire equipment is greatly reduced, which has an advantage in terms of energy efficiency, and is a simple mechanical structure that does not use current-consuming parts. In addition to the increase in mass productivity due to shrinking, the equipment can be made more compact and compact to meet the market demand in the trend.

In addition, structurally, since the imaging element is a structure that is electrically connected to the substrate in a state spaced from the substrate (imaging element substrate) through a support block, it is possible to minimize the effect of heat generated by the imaging element directly on the substrate. have. For example, it is possible to prevent or minimize substrate deformation due to high temperature heat, component damage, or device malfunction.

In addition, since a separate socket is mounted on the imaging element substrate, the imaging element is electrically connected to the imaging element substrate in a state spaced apart from the imaging element substrate through a support block, and thus can be applied to an expensive imaging element during functional inspection of the substrate. The electrical damage can be prevented, and the distance between the imaging device and the substrate can be more freely adjusted according to the specification change through a change in the thickness of the support block.

In the above detailed description of the present invention, only specific embodiments thereof have been described. However, it should be understood that the present invention is not limited to the specific forms mentioned in the detailed description, but rather includes all modifications, equivalents, and substitutes within the spirit and scope of the present invention as defined by the appended claims. Should be.

DESCRIPTION OF SYMBOLS 1 Imaging device 10 Lens mount
20: imaging element module 21: imaging element
22: thermally conductive elastic pad 23: imaging element substrate
24: heat sink 26: support block
40: outer housing 50: holder
212: pin 230: hole
232: socket 240: ridge
240a: Heat input piece 240b: Heat conduction piece
242: 1st heat transfer part 244: 2nd heat transfer part
246: heat dissipation piece 248: spacing maintenance
249: fastening member 250: first air cooling channel
252: 2nd air cooling channel 254: 3rd air cooling channel

Claims (10)

An imaging element module 20 mounted with an imaging element 21 that senses an image from a lens barrel and light passing through a lens group in the lens barrel, and an outer housing 40 in which the imaging element module 20 is embedded. In the imaging device (1),
An imaging element substrate 23 embedded in the outer housing 40 and having a circular or polygonal hole 230 formed in the center; And
It includes; a heat sink 24 having a raised portion 240 formed to a size corresponding to the hole 230 of the imaging element substrate 23; includes,
The raised portion 240 passes through the hole 230 and directly contacts the back side of the imaging element 21 in front of the imaging element substrate 23, and the outer housing 40 has an edge portion of the heat sink 24. It is configured to directly contact, the heat generated by the imaging element 21 is absorbed by the heat sink 24 and radiated to the outside through the outer housing 40,
A plate-shaped heat dissipation piece 246 is formed at an edge portion of the heat sink 24 that is in contact with the outer housing 40, and the heat dissipation plate 24 contacts the outer housing 40 through the heat dissipation piece 246. Video shooting device, characterized in that.
According to claim 1,
And a support block (26) interposed between the imaging element substrate (23) and the imaging element (21) and supporting the imaging element (21) spaced apart from the imaging element substrate (23).
According to claim 2,
A plurality of sockets 232 are mounted around the hole 230 of the imaging element substrate 23 and correspond to each of the sockets 232 on the surface of the imaging element 21 facing the imaging element substrate 23. A plurality of pins 212 is formed so that,
An image characterized in that the imaging element 21 is electrically connected to the imaging element substrate 23 in a state spaced apart from the imaging element substrate 23 through the combination of the socket 232 and the corresponding pin 212. Photography equipment.
The method of claim 3,
Holder for an insulator that aligns and secures the plurality of sockets 232 at equal or equal intervals between the central opening 260 of the support block 26 through which the ridge 240 passes and the ridge 240 at equal or equal intervals ( 50) is interposed, characterized in that the video recording device.
The method according to claim 1 or 2,
An imaging device characterized in that a thermally conductive elastic pad (22) is interposed between the imaging element 21 and the surface of the raised portion 240.
The method according to claim 1 or 2,
The raised portion 240,
A pair of opposing heat conduction pieces 240b;
It is provided to interconnect one end of the heat-conducting piece (240b), the imaging device characterized in that it consists of a heat-input piece (240a) having a heat-transfer surface evenly formed on the side facing the imaging element (21).
The method according to claim 1 or 2,
The heat sink 24,
A raised portion 240;
It includes; a first heat transfer portion 242 and a second heat transfer portion 244 connected to the raised portion 240 at both sides of the raised portion 240;
Each of the first heat exchanger 242 and the second heat exchanger 244 is provided with one or more spacing holders 248, and the first and second heat exchangers 242 and 2 are formed by the spacing holder 248. The imaging device, characterized in that the heat transfer portion 244 is spaced a predetermined distance from the imaging element substrate 23
The method of claim 7,
A first air cooling channel 250 is formed between the imaging element substrate 23 and the imaging element 21 by the raised portion 240,
The second air cooling channel 252 between the imaging element substrate 23 and the heat sink 24 by the first heat exchanger 242 and the second heat exchanger 244 are spaced apart a predetermined distance from the imaging device substrate 23 And a third air cooling channel 254 is formed.
delete According to claim 2,
The outermost surface of the support block 26 is configured to be spaced apart from the outer housing 40 by a predetermined distance, the support block 26 is made of aluminum (Al) or an aluminum alloy material, the support of the imaging device substrate 23 The imaging device, characterized in that the part in contact with the block 26 is plated.

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