CN211352289U

CN211352289U - Camera and electronic equipment

Info

Publication number: CN211352289U
Application number: CN202020052963.7U
Authority: CN
Inventors: 贾玉虎
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-01-10
Filing date: 2020-01-10
Publication date: 2020-08-25
Anticipated expiration: 2030-01-10

Abstract

The embodiment of the application provides a camera and electronic equipment, wherein, the camera includes: the circuit board, the heat dissipation bracket with the mounting groove, the chip, the plastic sleeve with the mounting channel and the optical lens; the heat dissipation bracket is arranged on the circuit board; the chip is arranged on the circuit board and is positioned in the mounting groove; at least part of the plastic sleeve is arranged in the mounting groove and is positioned on one side of the mounting groove, which is far away from the chip; at least part of the optical lens is arranged in the mounting channel. The camera and the electronic equipment can distribute the heat generated inside the camera in time in the working process of the camera, and therefore the heat can be prevented from being gathered inside the camera, and a good heat dissipation effect can be achieved.

Description

Camera and electronic equipment

Technical Field

The utility model relates to an electronic equipment field, in particular to camera and electronic equipment.

Background

In the correlation technique, the camera of electronic equipment such as cell-phone is at the during operation, and its inside heat is concentrated, can't dispel the heat fast, from this, not only can influence optical components's operating condition in the camera, still can lead to the position temperature rise of installation camera among the electronic equipment, influences user experience.

SUMMERY OF THE UTILITY MODEL

In view of this, an object of the embodiments of the present application is to provide a camera and an electronic device with better heat dissipation effect.

In order to achieve the above purpose, the technical solution of the embodiment of the present application is implemented as follows:

a first aspect of an embodiment of the present application provides a camera, including:

a circuit board;

a heat dissipation bracket having a mounting groove, the heat dissipation bracket being disposed on the circuit board;

the chip is arranged on the circuit board and is positioned in the mounting groove;

the plastic sleeve is provided with an installation channel, at least part of the structure of the plastic sleeve is arranged in the installation groove, and the plastic sleeve is positioned on one side of the installation groove, which is far away from the chip;

an optical lens having at least a portion of its structure disposed in the mounting channel.

Furthermore, part of the inner wall of the mounting groove protrudes towards the direction close to the center of the mounting groove to form a supporting part for supporting the plastic sleeve.

Further, the support portion is annular.

Further, the outer surface of the plastic sleeve is attached to the inner wall of the mounting groove.

Further, the camera still includes graphite alkene layer, graphite alkene layer covers on the inner wall of mounting groove.

Further, the camera also comprises a heat dissipation piece, and the heat dissipation piece is arranged on the outer wall of the heat dissipation support.

Further, the heat dissipation member is located at one end of the heat dissipation bracket close to the circuit board.

Further, the heat dissipation member is a heat dissipation fin.

Further, the heat dissipation piece is the cooling tube, the camera still includes the coolant liquid, the coolant liquid sets up in the cooling tube.

A second aspect of the embodiments of the present application provides an electronic device, which includes the above-mentioned camera.

The embodiment of the application provides a camera and electronic equipment, through setting up the heat dissipation support, can distribute away the inside produced heat of camera in time in the camera working process, from this, can avoid the heat to gather in the inside of camera, and then can reach good radiating effect.

Drawings

Fig. 1 is a schematic structural diagram of a camera provided in an embodiment of the present application;

FIG. 2 is a cross-sectional view of the camera head shown in FIG. 1;

fig. 3 is a schematic view illustrating a matching relationship between the heat dissipation bracket and the plastic sleeve in fig. 2.

Reference numerals: a circuit board 10; a heat dissipation bracket 20; a mounting groove 20 a; a support portion 20 b; a chip 30; a plastic cover 40; the mounting channel 40 a; an optical lens 50; the heat sink 60.

Detailed Description

It should be noted that, in the present application, technical features in examples and embodiments may be combined with each other without conflict, and the detailed description in the specific embodiment should be understood as an explanation of the gist of the present application and should not be construed as an improper limitation to the present application.

An embodiment of the present application provides a camera, please refer to fig. 1 to 3, the camera includes: the circuit board 10, the heat dissipation bracket 20, the chip 30, the plastic cover 40 and the optical lens 50. The heat dissipation bracket 20 has a mounting groove 20a, and the heat dissipation bracket 20 is disposed on the circuit board 10. The chip 30 is disposed on the circuit board 10 in the mounting groove 20 a. The plastic sleeve 40 has a mounting channel 40a, and at least a portion of the plastic sleeve 40 is disposed in the mounting groove 20a and located on a side of the mounting groove 20a away from the chip 30. At least a portion of the optical lens 50 is disposed in the mounting channel 40 a.

Specifically, the camera of the present embodiment is a Fixed Focus camera (FF), and in other embodiments, the camera may also be an Auto Focus camera (AF).

The plastic sleeve 40 is used for fixing the optical lens 50, the plastic sleeve 40 of the present embodiment is connected with the optical lens 50 by a screw thread, in other embodiments, the optical lens 50 may also be bonded with the plastic sleeve 40, sleeved, etc., as long as the optical lens 50 can be fixed, which is not limited herein. To fix the plastic sleeve 40, referring to fig. 2 and 3, a portion of the inner wall of the mounting groove 20a of the embodiment protrudes toward the center of the mounting groove 20a to form a supporting portion 20b for supporting the plastic sleeve 40. The supporting portion 20b of the present embodiment is annular, and the plastic sleeve 40 is entirely located in the mounting groove 20a, in other embodiments, the supporting portion 20b may also be a boss that is disposed at an interval, as long as the supporting portion can support the plastic sleeve 40, and only a part of the plastic sleeve 40 may be disposed in the mounting groove 20a, and the other part is located outside the mounting groove 20 a. Further, the outer surface of the plastic sleeve 40 of the embodiment is attached to the inner wall of the mounting groove 20a, and further, the plastic sleeve 40 may be disposed on the inner wall of the mounting groove 20a and the supporting portion 20b by injection molding, so that the plastic sleeve 40 may be mounted more firmly.

The heat dissipating bracket 20 is mainly made of a heat dissipating material having a good heat conductive effect, such as metal. The chip is one of the main heat sources of the camera, in the related art, the chip is arranged in a lens bracket made of plastic materials, and due to the existence of the circuit board and the optical lens, the chip is equivalently sealed in a relatively closed space, and when the chip works, the heat generated by the chip is difficult to be dissipated from the relatively closed space, so that the heat dissipation effect of the camera is poor.

And the camera of this embodiment is owing to set up heat dissipation support 20, so, in camera working process, the produced heat of chip 30 can distribute away in time through heat dissipation support 20, from this, can avoid the heat at the inside gathering of camera, and then can reach good radiating effect.

Further, the camera may further include a graphene layer covering the inner wall of the mounting groove 20 a. Graphene layer mainly comprises graphite alkene, and graphite alkene has better heat conductivility and thermal radiation performance, can greatly improve radiating effect of heat dissipation support 20.

Referring to fig. 1 and 2, the camera of the present embodiment further includes a heat dissipation member 60, and the heat dissipation member 60 is disposed on an outer wall of the heat dissipation bracket 20.

Specifically, the heat source of the camera is mainly concentrated at one end of the camera close to the circuit board 10, and therefore, the heat dissipation member 60 of the present embodiment is also disposed at one end of the heat dissipation bracket 20 close to the circuit board 10, so that the heat dissipation speed can be further increased, and the heat concentration problem during the operation of the camera can be better improved. The heat dissipating member 60 of the present embodiment is a heat dissipating tube, and the camera further includes a cooling liquid, and the cooling liquid is disposed in the heat dissipating tube, in other embodiments, the heat dissipating member 60 may also be a heat dissipating fin.

Another embodiment of the present application further provides an electronic device, which includes the camera described above. The electronic equipment can be mobile phones, tablet computers, notebook computers and other electronic equipment with cameras.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A camera, comprising:

a circuit board;

2. The camera head as claimed in claim 1, wherein a portion of an inner wall of the mounting groove protrudes in a direction close to a center of the mounting groove to form a support portion for supporting the plastic sleeve.

3. The camera head of claim 2, wherein the support portion is annular.

4. The camera head according to any one of claims 1 to 3, wherein an outer surface of the plastic sleeve is attached to an inner wall of the mounting groove.

5. The camera according to any one of claims 1 to 3, further comprising a graphene layer covering an inner wall of the mounting groove.

6. The camera head according to any one of claims 1 to 3, further comprising a heat dissipation member disposed on an outer wall of the heat dissipation bracket.

7. The camera head as claimed in claim 6, wherein the heat dissipation member is located at an end of the heat dissipation bracket near the circuit board.

8. The camera of claim 6, wherein the heat sink is a heat sink.

9. The camera of claim 8, wherein said heat dissipating member is a heat dissipating tube, said camera further comprising a cooling liquid disposed in said heat dissipating tube.

10. An electronic device, characterized in that the electronic device comprises a camera according to any one of claims 1-9.