CN212163453U - Image sensing module, camera module, terminal equipment and mold - Google Patents
Image sensing module, camera module, terminal equipment and mold Download PDFInfo
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- CN212163453U CN212163453U CN202020504217.7U CN202020504217U CN212163453U CN 212163453 U CN212163453 U CN 212163453U CN 202020504217 U CN202020504217 U CN 202020504217U CN 212163453 U CN212163453 U CN 212163453U
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
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Abstract
The application discloses image sensing module, module of making a video recording, terminal equipment and mould relates to electron device's heat dissipation field. The image sensing module comprises a printed circuit board, an image sensor, an encapsulation layer and heat-conducting liquid. The printed circuit board has circuitry thereon that matches the image sensor, with the requisite electronic components, such as resistors, capacitors, etc., within the circuitry. The image sensor is disposed on the printed circuit board and is for receiving image information. The heat transfer that the heat conduction liquid can absorb the encapsulation layer of the serious position that generates heat to the encapsulation layer of the lower position relatively that generates heat, therefore all surfaces of encapsulation layer all can realize releasing the heat to the air, and then promote the radiating effect.
Description
Technical Field
The application relates to the field of heat dissipation of electronic devices, in particular to an image sensing module, a camera module, a terminal device and a mold.
Background
The rapid development of the photographing technology of the terminal equipment such as the mobile phone and the like enables the improvement of the photographing performance to become the main development direction of the terminal equipment. Under the condition that terminal equipment pixel constantly improves, in order to match terminal equipment to application scene demands such as high frame rate photography, image sensing module is as the partly of the module of making a video recording, and its consumption is showing and is promoting. Further, the image sensor module generates heat seriously, and the related image sensor module has general heat dissipation performance, so that the heat cannot be discharged outside in time. After the temperature of the image sensing module rises, the thermal noise of components and parts is aggravated, the camera module is caused to generate focal variation behind the lens, and the shooting definition is finally influenced.
SUMMERY OF THE UTILITY MODEL
An object of the present application is to provide an image sensing module, which aims to solve the problem of poor heat dissipation effect of the image sensing module.
To achieve the purpose, the embodiment of the application adopts the following technical scheme:
an image sensing module comprising:
a printed circuit board;
the image sensor is arranged on the printed circuit board;
the packaging layer is arranged on the printed circuit board and covers the edge of the image sensor, and a heat conduction channel is arranged in the packaging layer; and
and the heat conduction liquid is arranged in the heat conduction channel.
The packaging layer covers most of the electronic components on the printed circuit board and the edge of the image sensor, and most of heat generated by the electronic components and the image sensor is dissipated outwards through the packaging layer. Because the setting of the heat conduction liquid in the heat conduction channel, the heat conduction liquid can form the convection current in the heat conduction channel, therefore the heat conduction liquid can be with the heat transfer of the serious position that generates heat to the position that generates heat lower relatively, for the temperature gradient that forms from inside to outside through the encapsulation layer realizes the outside transmission of heat, but the surface area of make full use of encapsulation layer dispels the heat outwards, and then promotes the radiating effect.
Meanwhile, the heat at the parts (the electronic element and the image sensor) with serious heat can be quickly transferred to other parts, so that the over-high temperature of the parts with the image sensor and the electronic element can be avoided. Therefore, the encapsulating material of the encapsulating layer and the printed circuit board in contact with the electronic component and the image sensor which generate heat seriously are not easily deformed, and the image sensor itself is not easily deformed. When the image sensing module and the components such as the lens form a camera module, the distance between the lens in the camera module and the image sensor is not easy to change, and the camera module is not easy to have the problem of back focal variation of the lens.
The integral heat dissipation performance is good, the local overhigh temperature is not easy to occur, the Tg point (glass transition temperature) of the glue used for packaging is not easy to reach in the image sensing module, the integral structure of the image sensing module is not easy to damage, and the structure of the camera module is not easy to change, so that the camera module can work with high precision.
The heat-conducting liquid can be water, saline water, various oils and the like.
In one embodiment, the heat conducting channel is bent to increase the length of the heat conducting channel, increase the capacity of the heat conducting liquid, and increase the contact area between the heat conducting liquid and the package layer. And then the heat conduction liquid can quickly transfer the heat at the position with serious heating to the area with lower heating value, so that the heat dissipation area of the surface of the packaging layer at the position with lower heating value is fully utilized. The heat dissipation performance of the whole image sensing module is improved, and the problem that the local temperature of the image sensing module is too high is effectively avoided.
In one embodiment, the thermally conductive channel is disposed around the image sensor. Therefore, heat conduction liquid in the heat conduction channel can carry out heat convection around the image sensor, namely the temperature around the image sensor is relatively average, local over-high temperature is not easy to occur, and deformation of the packaging layer, the printed circuit board and the image sensor is not easy to cause.
In one embodiment, the image sensing module further comprises an electronic component disposed on the printed circuit board, and the heat conduction channel is located on the top of the electronic component or opposite to a side surface of the electronic component.
For example, the heat conducting channel may be located on the top of the electronic component, and the heat conducting liquid may rapidly absorb heat transferred from the top of the electronic component.
For example, the heat conduction channel may not be overlapped with the electronic component, but the heat conduction channel is disposed opposite to the side surfaces of the electronic component and the image sensor, so as to quickly absorb heat transferred from the side surfaces of the electronic component. And because the heat conduction channel is not overlapped with the electronic element, the cross-sectional area of the heat conduction channel can be large enough, so that the capacity of the heat conduction liquid in the heat conduction channel is improved, and the contact area of the heat conduction liquid and the packaging layer is increased.
Alternatively, the number of the heat conduction channels may be set to be plural, a part of the heat conduction channels are located on the top of the electronic component, and a part of the heat conduction channels avoid the electronic component and are opposite to the side surface of the electronic component.
Alternatively, the heat conduction channel may have a different structure, where the heat conduction channel is partially located on the top of a part of the electronic components, and another part of the heat conduction channel is partially located away from other electronic components and is opposite to the side surfaces of other parts of the electronic components.
Optionally, when the heat conducting channel is bent, the heat conducting channel may be opposite to a plurality of side surfaces of an electronic component, so that the plurality of side surfaces of the electronic component may quickly transfer heat to the heat conducting liquid in the heat conducting channel.
Optionally, when the heat conducting channel avoids the electronic component, a part of the heat conducting channel may be in a shape of a Chinese character 'kou', and the part of the Chinese character 'kou' may be disposed around the electronic component.
Another objective of the present application is to provide a camera module, which includes a lens and the image sensing module according to any of the above embodiments; the lens is opposite to the image sensor and is arranged at intervals. The camera module with the image sensing module in the above embodiment can quickly transfer heat from the parts (the electronic component and the image sensor) with serious heat generation to other parts, so that the over-high temperature of the parts with the image sensor and the electronic component can be avoided. Therefore, the encapsulating material of the encapsulating layer and the printed circuit board in contact with the electronic component and the image sensor which generate heat seriously are not easily deformed, and the image sensor itself is not easily deformed. Therefore, the distance between the lens and the image sensor in the camera module is not easy to change, and the camera module is not easy to have the problem of back focal variation of the lens. Because the condition that local high temperature is difficult to take place, the Tg point (glass transition temperature) of the glue that the encapsulation was used is difficult for reaching in the module of making a video recording, is difficult for destroying the overall structure of image sensing module, and the structure of the module of making a video recording is difficult for changing for the work of the module of making a video recording high accuracy.
In one embodiment, a voice coil motor is arranged between the lens and the packaging layer, and the lens is mounted at the output end of the voice coil motor. The voice coil motor can change the distance between the lens and the image sensor so as to realize the optical zooming of the camera module. It can be understood that the voice coil motor changes the distance between the lens and the image sensor to realize the optical zooming, and the distance is controlled actively. And the change of the distance between camera lens and the image sensor that reasons such as the deformation of the module inner structure of making a video recording lead to is uncontrollable, can influence the unable accurate control camera lens of user and the distance between the image sensor, and then influence the work of the module high accuracy of making a video recording.
In one embodiment, the camera module further includes a bracket mounted on the encapsulation layer, the voice coil motor is mounted on the bracket, and the bracket is provided with a yielding hole corresponding to the lens. The support is fixedly arranged on the packaging layer, and the assembly of the camera module can be arranged on the image sensing module through the support.
In one embodiment, the bracket is provided with blue light glass at the yielding hole to filter stray light and improve the image acquisition effect of the camera module.
In one embodiment, the packaging layer is provided with a heat conduction groove, the support closes the heat conduction groove, and a sealant is arranged between the support and a notch of the heat conduction groove. When the packaging layer is machined and formed, the heat conduction groove is formed in the packaging layer, heat conduction liquid is filled into the heat conduction groove, the heat conduction groove is subsequently sealed by the aid of the support, glue is applied between the support and the packaging layer, and the heat conduction groove is sealed by the aid of the sealant and the support.
For example, in other embodiments, the heat conducting channel in the encapsulation layer may be formed in other manners, such as forming the heat conducting channel with an opening, and filling the heat conducting liquid and then sealing the opening.
It is a further object of this application to provide a terminal device including the camera module according to any one of the above embodiments. Terminal equipment with above-mentioned module of making a video recording, when shooing or making a video recording, the module of making a video recording all is difficult for appearing the burnt problem of variation behind the camera lens. And the condition that local temperature is too high is difficult to take place, the Tg point (glass transition temperature) of the glue used for packaging is difficult to reach in the module of making a video recording, the overall structure of the image sensing module is difficult to destroy, the structure of the module of making a video recording is difficult to change, so that the module of making a video recording can work with high precision, and finally, the photo shot by the terminal equipment or the recorded video can be ensured to sufficiently meet the preset requirement.
It is another object of the present application to provide a mold for manufacturing the image sensing module according to any of the above embodiments, wherein the mold has a protruding structure corresponding to the heat conducting channel.
The image sensing module provided by the embodiment of the application has the following beneficial effects: the heat transfer that the heat conduction liquid can absorb the encapsulation layer of the serious position that generates heat to the encapsulation layer of the lower position relatively that generates heat, therefore all surfaces of encapsulation layer all can realize releasing the heat to the air, and then promote the radiating effect.
By adopting the camera module of the image sensing module, the heat at the position with serious heat can be quickly transferred to other parts, and the temperature of the part with the image sensor and the electronic element can be reduced. Therefore, the camera module is not easy to generate local deformation, the distance between the lens in the camera module and the image sensor is not easy to change, and the camera module is not easy to have the problem of focal variation after the lens.
Adopt the terminal equipment of the above-mentioned module of making a video recording, when shooing or making a video recording, the module of making a video recording all is difficult for appearing the burnt problem of variation behind the camera lens, and the photo of shooing or the video of recording can satisfy and predetermine the requirement.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a top view of an image sensing module in one embodiment of the present application;
FIG. 2 is a top view of an image sensing module according to another embodiment of the present application;
FIG. 3 is a top view of an image sensing module according to yet another embodiment of the present application;
FIG. 4 is a cross-sectional view of an image sensing module in an embodiment of the present application;
FIG. 5 is a top view of an image sensing module according to yet another embodiment of the present application;
FIG. 6 is a cross-sectional view of a camera module in an embodiment of the present application;
FIG. 7 is a cross-sectional view of a camera module according to another embodiment of the present application;
fig. 8 is a schematic structural diagram of a terminal device in the embodiment of the present application.
In the figure:
1000. an image sensing module; 2000. a camera module;
1. a printed circuit board; 2. an image sensor; 3. a packaging layer; 301. a heat conducting groove; 4. a heat conducting channel; 5. a heat-conducting liquid; 6. an electronic component; 7. a lens; 8. a voice coil motor; 9. a support; 901. a hole of abdication; 10. blue light glass.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or positional relationship illustrated in the drawings for convenience in describing the present application and to simplify description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application.
In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
The camera module of the terminal equipment comprises an image sensing module, a lens and other components; the image sensor of the image sensing module is used for receiving image information collected by the lens, and the printed circuit board of the image sensing module is also provided with a circuit matched with the image sensor, and the circuit is provided with various necessary electronic elements. In order to enable the camera module to work with high precision under a certain parameter, the distance between the image sensor of the image sensing module and the lens needs to be specified, that is, the parameter is set for the distance.
However, the inventor finds that the photographing effect often deteriorates with time in the use process of the camera module, and through a large number of experiments and analyses, it is found that the photographing effect is caused by back focus variation of the image sensing module, and the back focus variation, that is, the distance between the image sensor and one end of the lens facing the image sensor, changes, so that the imaging effect deviates from the expected effect. The main reason for the occurrence of the back focus variation of the lens is the deformation of the image sensing module due to the over-high temperature of the image sensing module. For example, when an image sensor of a certain type on an image sensing module outputs at a frame rate of 12M, the temperature after 3 minutes exceeds 100 ℃, and the local temperature can be as high as 110 ℃.
The heat dissipation mode of the related image sensing module is that heat is transferred outwards through a temperature gradient formed by self packaging materials from inside to outside, and then the outward heat dissipation is realized. However, the heat dissipation effect of the heat dissipation method is limited, and heat generated by the image sensor or other components cannot be dissipated outwards quickly, so that the temperature of each component is increased sharply. The temperature of each component is increased sharply, which causes the thermal noise of the component to be intensified; and the packaging material and the corresponding printed circuit board at the position are easy to deform, so that the distance between the lens and the image sensor in the camera module is changed (although the change is small, the change is difficult to identify by naked eyes, the change seriously affects the requirement of the camera module on high precision), and the problem of the back focus variation of the lens is caused. Meanwhile, the local temperature is too high and easily exceeds the Tg point (glass transition temperature) of the glue used for packaging, so that the overall structure of the image sensing module is damaged, and the structure of the camera module is further damaged (for example, the back focal variation of a lens is caused), so that the camera module cannot work with high precision.
The image sensing module that this application embodiment provided can promote image sensing module radiating effect to and effectively avoid local high temperature.
The following detailed description of implementations of the present application is provided in conjunction with specific embodiments.
As shown in fig. 4, the present embodiment provides an image sensing module 1000, which includes a printed circuit board 1, an image sensor 2, an encapsulation layer 3, and a thermal conductive liquid 5. The printed circuit board 1 has circuitry thereon that is matched to the image sensor 2 and has the requisite electronic components 6, such as resistors, capacitors, etc., therein. The image sensor 2 is disposed on the printed circuit board 1 and receives image information. The encapsulation layer 3 serves to cover most of the area on the encapsulated printed circuit board 1, for example to encapsulate the above-mentioned circuitry and associated electronic components 6, as well as to cover the edges of the encapsulated image sensor 2. The encapsulation layer 3 has a length of thermally conductive channel 4 therein for receiving a thermally conductive liquid 5. The heat conducting liquid 5 may flow in the heat conducting channel 4 and exchange heat with the encapsulation layer 3 at different locations of the heat conducting channel 4.
The encapsulation layer 3 covers most of the electronic components 6 on the printed circuit board 1 and the edge of the image sensor 2, and most of the heat generated by the electronic components 6 and the image sensor 2 is dissipated outwards through the encapsulation layer 3. Because the setting of heat conduction liquid 5 in the heat conduction passageway 4, heat conduction liquid 5 can form the convection current in heat conduction passageway 4, consequently heat conduction liquid 5 can absorb the heat transfer of the encapsulated layer 3 of the serious position that generates heat to the encapsulated layer 3 of the position that generates heat lower relatively, for the temperature gradient that forms from inside to outside through encapsulated layer 3 realizes the heat outwards to transmit, but the outside heat dissipation of surface area of fully utilizing encapsulated layer 3, and then promote the radiating effect.
Meanwhile, since the heat generated by the parts with serious heat generation (such as the electronic component 6 and the image sensor 2) can be rapidly transferred to other parts, the temperature of the parts with the image sensor 2 and the electronic component 6 can be prevented from being too high. Therefore, the encapsulating material of the encapsulating layer 3 and the printed circuit board 1 which are in contact with the electronic component 6 and the image sensor 2 which generate heat seriously are not easily deformed, and the image sensor 2 itself is not easily deformed. Referring to fig. 7, when the image sensor module 1000 and the lens 7 form the camera module 2000, the distance between the lens 7 and the image sensor 2 in the camera module 2000 is not easy to change, and the camera module 2000 is not easy to have the problem of back focus variation of the lens 7.
Since the local temperature is not easily too high, the Tg point (glass transition temperature) of the glue used for encapsulation is not easily reached in the image sensing module 1000, the overall structure of the image sensing module 1000 is not easily damaged, and the structure of the camera module 2000 is not easily changed, so that the camera module 2000 can work with high precision.
In the embodiment of the present application, the heat conductive liquid 5 may be water, saline, various oils, and the like. For example, brine having good fluidity and thermal conductivity may be selected. It is understood that the inner wall of the heat conducting channel 4 may be provided with a waterproof layer, so as to prevent liquid from penetrating into the encapsulating layer 3 when the material of the encapsulating layer 3 is permeable to water.
Since the heat-conducting liquid 5 itself has a certain heat storage capacity, the heat-conducting liquid 5 itself can absorb a certain amount of heat, and further quickly absorb the heat of the electronic component 6, the image sensor 2 and other components, so as to further improve the heat dissipation effect of the image sensing module 1000 and alleviate the problem of local over-high temperature.
In the embodiments of the present application, as shown in fig. 1 to 3, the heat conducting channel 4 may be bent to increase the length of the heat conducting channel 4, increase the capacity of the heat conducting liquid 5, and increase the contact area between the heat conducting liquid 5 and the encapsulation layer 3. Further, the heat conducting liquid 5 can rapidly absorb the heat of the packaging layer 3 at the position with serious heating and transfer the heat to the region with lower heating value, so that the heat dissipation area of the surface of the packaging layer 3 at the position with lower heating value is fully utilized. The heat dissipation performance of the whole image sensing module 1000 is improved, and the problem of overhigh local temperature of the image sensing module 1000 is effectively avoided.
In the embodiment of the present application, as shown in fig. 1 to fig. 3, the heat conducting channel 4 may be disposed around the image sensor 2, so that the heat conducting liquid 5 in the heat conducting channel 4 can perform heat convection around the image sensor 2, that is, the temperature around the image sensor 2 is relatively average, and thus local temperature is not easily too high, and further, deformation of the package layer 3, the printed circuit board 1, and the image sensor 2 is not easily caused. The surrounding manner can be that one heat conduction channel 4 is arranged in a ring-shaped manner to realize the surrounding, as shown in fig. 3; the structure surrounding the image sensor 2 can also be formed by sequentially distributing a plurality of heat conducting channels 4 end to end, as shown in fig. 1-2.
In the embodiment of the present application, as shown in fig. 3-4, the heat conducting channel 4 may be disposed on the top of the electronic component 6, the heat transferred from the top of the electronic component 6 to the encapsulation layer 3 is absorbed by the heat conducting liquid 5 in the heat conducting channel 4, and the heat is transferred to the encapsulation layer 3 at a lower temperature after the heat conducting liquid 5 flows.
In another embodiment, as shown in fig. 1, fig. 2 and fig. 4, the heat conducting channel 4 may also be in a non-overlapping relationship with the electronic component 6 (i.e. the projection of the heat conducting channel 4 on the printed circuit board 1 may not overlap with the electronic component 6), and the heat conducting channel 4 is disposed opposite to the electronic component 6 and the side surface of the image sensor 2, and the heat conducting liquid 5 may absorb heat transferred from the side surface of the electronic component 6. And because the heat conduction channel 4 is not overlapped with the electronic component 6, the cross-sectional area (the area perpendicular to the cross-section of the printed circuit board 1) of the heat conduction channel 4 can be large enough (the distance between the bottom of the heat conduction channel 4 and the surface of the printed circuit board 1 can be set small enough), so as to improve the capacity of the heat conduction liquid 5 in the heat conduction channel 4 and increase the contact area between the heat conduction liquid 5 and the packaging layer 3.
In another embodiment, the number of the heat conducting channels 4 can also be set to be multiple, and part of the heat conducting channels 4 are positioned on the top of the electronic component 6; part of the heat conducting channel 4 is not coincident with the electronic component 6 and is opposite to the side surface of the electronic component 6.
In another embodiment, as shown in fig. 3, the structure of each part of one continuous through heat conduction channel 4 may be configured differently, the heat conduction channel 4 is partially located on the top of a part of the electronic component 6, and another part of the heat conduction channel 4 is not overlapped with other electronic components 6 and is disposed opposite to the side surface of the other part of the electronic component 6.
In another embodiment, as shown in fig. 1-2, when the heat conducting channel 4 is bent, the heat conducting channel 4 can be opposite to a plurality of side surfaces of an electronic component 6, so that the plurality of side surfaces of the electronic component 6 can rapidly transfer heat to the heat conducting liquid 5 in the heat conducting channel 4.
In another embodiment, as shown in fig. 2, when the heat conducting channel 4 is not overlapped with the electronic component 6, a part of the heat conducting channel 4 may be in a shape of a Chinese character 'kou', and the part of the Chinese character 'kou' may be disposed around the electronic component 6.
As shown in fig. 6 to 7, an embodiment of the present application provides a camera module 2000, which includes a lens 7 and an image sensing module 1000 in any one of the embodiments; the lens 7 is disposed opposite to and spaced apart from the image sensor 2.
With the camera module 2000 having the image sensing module 1000 in the above embodiment, the performance of outward heat dissipation of the image sensing module 1000 is better, the overall temperature of the image sensing module 1000 is not too high, the problem of serious heat generation of the camera module 2000 is alleviated, and the occurrence of deformation of the image sensing module 1000 due to too high temperature is effectively reduced.
And because the heat at the position with more serious heat generation can be quickly transferred to other parts, the temperature of the part with the image sensor 2 and the electronic element 6 can be reduced. Therefore, the encapsulating material of the encapsulating layer 3 and the printed circuit board 1 which are in contact with the electronic component 6 and the image sensor 2 which generate heat seriously are not easily deformed, and the image sensor 2 itself is not easily deformed. Therefore, the distance between the lens 7 and the image sensor 2 in the camera module 2000 is not easy to change, and the camera module 2000 is not easy to have the problem of back focus variation of the lens 7.
Because the whole heat dispersion is better, and the local high temperature is difficult to occur, the Tg point (glass transition temperature) of the glue used for packaging is difficult to reach in the camera module 2000, the whole structure of the camera module 2000 is difficult to damage, and the camera module 2000 can work with high precision.
As shown in fig. 6-7, in an embodiment of the camera module 2000, a driving motor (e.g., a voice coil motor 8) is disposed between the lens 7 and the encapsulation layer 3, and an output end of the voice coil motor 8 can drive the lens 7 to move, so as to actively change a distance between the lens 7 and the image sensor 2, thereby implementing optical zooming.
It can be understood that the voice coil motor 8 changes the distance between the lens 7 and the image sensor 2 to realize optical zooming, and is actively controlled, and the distance is controllable. The change of the distance between the lens 7 and the image sensor 2 caused by the deformation of the internal structure of the camera module 2000 is uncontrollable, which may affect the user to control the distance between the lens 7 and the image sensor 2, and further affect the high-precision operation of the camera module 2000.
As shown in fig. 7, in an embodiment of the camera module 2000, the voice coil motor 8 is installed on the package layer 3 of the image sensing module 1000 through the bracket 9, so as to realize the stability of the installation of the voice coil motor 8, and further ensure the accuracy of the voice coil motor 8 in adjusting the position of the lens 7. The support 9 may be fixed on the package layer 3 by dispensing, or may be embedded in the package layer 3. Meanwhile, a yielding hole 901 is formed at a position of the bracket 9, which is opposite to the image sensor 2, so that light passing through the lens 7 can reach the image sensor 2.
Meanwhile, an optical filter (for example, blue glass 10) may be installed in the yielding hole 901 for filtering stray light, so as to improve the image acquisition effect of the image sensor 2.
On the basis of the above embodiment, as shown in fig. 5, in the manufacturing process, a heat conduction groove 301 (the heat conduction groove 301 is the heat conduction channel 4) is formed on the encapsulation layer 3, and the bracket 9 closes the heat conduction groove 301 to form the heat conduction channel 4. When the heat conduction liquid 5 is filled, the heat conduction liquid 5 is firstly placed in the heat conduction groove 301, then the support 9 is used for sealing the heat conduction groove 301, and a sealant is arranged between the support 9 and the notch of the heat conduction groove 301, so that the heat conduction groove 301 is sealed and sealed.
Of course, the heat conducting groove 301 may also be provided on the basis of the heat conducting channel 4, i.e. the heat conducting groove 301 is not identical to the heat conducting channel 4. However, the heat conduction groove 301 can achieve the same function as the heat conduction channel 4, and the heat conduction groove 301 is filled with the heat conduction liquid 5 and is sealed by the bracket 9 (that is, the heat conduction channel 4 includes the sealed heat conduction channel 4 formed in the encapsulation layer 3 and the heat conduction channel 4 formed by subsequently sealing the heat conduction groove 301 by the bracket 9).
As shown in fig. 8, an embodiment of the present application provides a terminal device, which includes the camera module 2000 of any one of the above embodiments. Terminal equipment who has above-mentioned module 2000 of making a video recording, when shooing or making a video recording, the too high condition of local high temperature is difficult for taking place to module 2000 of making a video recording, be difficult for reaching the Tg point (glass transition temperature) of the glue that the encapsulation was used in the module 2000 of making a video recording, be difficult for destroying image sensing module 1000's overall structure, module 2000's of making a video recording structure is difficult for changing, and then the difficult problem that burnt variation appears behind the camera lens 7, and the work of the module 2000 of making a video recording, and can weaken thermal noise, the photo that terminal equipment shoots or the video of recording can satisfy and predetermine.
The embodiment of the present application further provides a mold for manufacturing the image sensing module 1000 in any of the above embodiments, wherein the mold has a protruding structure corresponding to the heat conducting channel 4.
It should be understood that the above examples are merely examples for clearly illustrating the present application, and are not intended to limit the embodiments of the present application. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present application shall be included in the protection scope of the claims of the present application.
Claims (12)
1. An image sensing module, comprising:
a printed circuit board;
the image sensor is arranged on the printed circuit board;
the packaging layer is arranged on the printed circuit board and covers the edge of the image sensor, and a heat conduction channel is arranged in the packaging layer; and
and the heat conduction liquid is arranged in the heat conduction channel.
2. The image sensing module of claim 1, wherein the heat conducting channel is bent.
3. The image sensing module of claim 1 or 2, wherein the thermally conductive channel is disposed around the image sensor.
4. The image sensing module of claim 1 or 2, further comprising electronic components disposed on the printed circuit board, wherein the heat conducting channel is located on a top portion of the electronic components or is disposed opposite to a side surface of the electronic components.
5. The image sensing module of claim 4, wherein the thermal conduction channel is multiple, a portion of the thermal conduction channel is located on a top of the electronic component, and a portion of the thermal conduction channel is located opposite a side of the electronic component.
6. The camera module, characterized by comprising a lens, a bracket and the image sensing module of any one of claims 1-5; the lens is opposite to the image sensor and is arranged at intervals; the support is arranged on the packaging layer, the lens is arranged on the support, and the support is provided with a yielding hole corresponding to the lens.
7. The camera module according to claim 6, wherein a driving motor is disposed between the lens and the bracket, and the lens is mounted at an output end of the driving motor.
8. The camera module of claim 7, wherein the drive motor is a voice coil motor.
9. A camera module according to any one of claims 6 to 8, wherein the frame is provided with a filter at the relief hole.
10. The camera module according to any one of claims 6-8, wherein the package layer defines a heat conduction groove, the support frame encloses the heat conduction groove, a sealant is disposed between the support frame and the groove opening of the heat conduction groove, and a gap between the support frame and an inner surface of the heat conduction groove forms the heat conduction channel.
11. Terminal device, characterized in that it comprises a camera module according to any one of claims 6 to 10.
12. A mold for manufacturing the image sensing module according to any one of claims 1 to 5, wherein the mold has a protrusion structure corresponding to the heat conducting channel.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020504217.7U CN212163453U (en) | 2020-04-08 | 2020-04-08 | Image sensing module, camera module, terminal equipment and mold |
| PCT/CN2020/118105 WO2021203640A1 (en) | 2020-04-08 | 2020-09-27 | Image sensing module, camera module, terminal device and mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020504217.7U CN212163453U (en) | 2020-04-08 | 2020-04-08 | Image sensing module, camera module, terminal equipment and mold |
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| Publication Number | Publication Date |
|---|---|
| CN212163453U true CN212163453U (en) | 2020-12-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020504217.7U Active CN212163453U (en) | 2020-04-08 | 2020-04-08 | Image sensing module, camera module, terminal equipment and mold |
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| Country | Link |
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| CN (1) | CN212163453U (en) |
| WO (1) | WO2021203640A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022193900A1 (en) * | 2021-03-19 | 2022-09-22 | 荣耀终端有限公司 | Camera module, assembly method therefor, and electronic device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101391176B1 (en) * | 2013-04-29 | 2014-05-07 | 주식회사 뷰웍스 | Image photography apparatus |
| CN206743368U (en) * | 2017-04-28 | 2017-12-12 | 南昌欧菲光电技术有限公司 | Camera module and its easy heat radiation photosensory assembly |
| CN208754401U (en) * | 2018-10-15 | 2019-04-16 | 深圳市聚力光电科技有限公司 | A kind of heat radiating type camera module |
| CN110767667B (en) * | 2019-11-26 | 2022-07-08 | 上海微阱电子科技有限公司 | Image sensor structure and forming method |
-
2020
- 2020-04-08 CN CN202020504217.7U patent/CN212163453U/en active Active
- 2020-09-27 WO PCT/CN2020/118105 patent/WO2021203640A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022193900A1 (en) * | 2021-03-19 | 2022-09-22 | 荣耀终端有限公司 | Camera module, assembly method therefor, and electronic device |
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| Publication number | Publication date |
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| WO2021203640A1 (en) | 2021-10-14 |
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