CN104902154B - Circuit board assemblies, the camera module with circuit board assemblies and picture pick-up device - Google Patents
Circuit board assemblies, the camera module with circuit board assemblies and picture pick-up device Download PDFInfo
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- CN104902154B CN104902154B CN201510277982.3A CN201510277982A CN104902154B CN 104902154 B CN104902154 B CN 104902154B CN 201510277982 A CN201510277982 A CN 201510277982A CN 104902154 B CN104902154 B CN 104902154B
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- Prior art keywords
- circuit board
- heat dissipating
- dissipating layer
- thermal trough
- thermal
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- 230000000712 assembly Effects 0.000 title claims abstract description 41
- 238000000429 assembly Methods 0.000 title claims abstract description 41
- 239000002184 metal Substances 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 104
- 238000010586 diagram Methods 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 4
- 230000009977 dual effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 2
- 239000002365 multiple layer Substances 0.000 description 2
- 239000005439 thermosphere Substances 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
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Abstract
The present invention provides a kind of circuit board assemblies, and the circuit board assemblies include first circuit board, the first heat dissipating layer, the second heat dissipating layer and second circuit board；The first circuit board, the first heat dissipating layer, the second heat dissipating layer and second circuit board are sequentially overlapped setting；First heat dissipating layer and/or second heat dissipating layer are equipped at least one thermal trough.The present invention also provides a kind of camera module and picture pick-up devices.
Description
Technical field
The present invention relates to a kind of circuit board assemblies, the camera module with circuit board assemblies and picture pick-up devices.
Background technique
In the prior art, automobile data recorder shot usually using a wide-angle camera as in front of operator seat i.e. outside vehicle before
The image of side, this camera lens generally use larger wide angular range to shoot bigger field range.However, this structure can not be same
When shooting is interior and vehicle rear scene, can not achieve pan-shot.And the electronic component on the circuit board of these cameras
A large amount of heat can be generated during the work time, influence electronic component performance and stability.
Summary of the invention
The technical problem to be solved by the embodiment of the invention is that providing a kind of circuit board assemblies for improving heat dissipation effect.
The present invention there is a need to provide a kind of picture pick-up device with the camera module.
To achieve the goals above, embodiment of the present invention provides the following technical solutions:
The present invention provides a kind of circuit board assemblies, and the circuit board assemblies include first circuit board, the first heat dissipating layer, second
Heat dissipating layer and second circuit board；The first circuit board, the first heat dissipating layer, the second heat dissipating layer and second circuit board are sequentially overlapped and set
It sets；First heat dissipating layer and/or second heat dissipating layer are equipped at least one thermal trough.
Wherein, first heat dissipating layer includes the first inner surface, and second heat dissipating layer includes the second inner surface；It is described to lead
Heat channel includes first thermal trough and second thermal trough；First thermal trough is set on first inner surface, institute
The second thermal trough is stated on the second surface；First inner surface is bonded with the second inner surface, first thermal trough
It is arranged in a crossed manner or overlap with second thermal trough.
Wherein, first heat dissipating layer includes the first inner surface, and second heat dissipating layer includes the second inner surface；It is described to lead
Heat channel includes multiple first thermal troughs and multiple second thermal troughs identical with the multiple first thermally conductive slot number；It is the multiple
The arrangement of first thermal trough is set on first inner surface, and first inner surface is bonded with the second inner surface, and the multiple the
The arrangement of two thermal troughs is set on second inner surface；The multiple first thermal trough and the multiple second thermal trough are one-to-one
It is arranged in a crossed manner or overlap.
Wherein, first heat dissipating layer includes the first inner surface and the first outer surface being oppositely arranged with the first inner surface；
Second heat dissipating layer includes the second inner surface and the second outer surface being oppositely arranged with the second inner surface；It is described at least one lead
Heat channel is set on first heat dissipating layer and runs through first inner surface and the first outer surface；Or described at least one is thermally conductive
Slot is set on second heat dissipating layer, and runs through second inner surface and the second outer surface.
Wherein, the first circuit board and the second circuit board are flexible circuit board；First heat dissipating layer with it is described
Second heat dissipating layer is made of metal materials such as steel.
Wherein, first heat dissipating layer is formed on a surface of the first circuit board and constitutes with first circuit board
First printed circuit board；Second heat dissipating layer is formed on one surface of the second circuit board and constitutes with second circuit board
Second printed circuit board；First heat dissipating layer and second heat dissipating layer are equipped at least one thermal trough；First print
Printed circuit board is overlapped with the second printed circuit board, and first heat dissipating layer is bonded with second heat dissipating layer, and described first
At least one thermal trough of heat dissipating layer intersects or again correspondingly at least one thermal trough on second heat dissipating layer
Folded setting.
Wherein, first heat dissipating layer and the second heat dissipating layer are ink layer or metal conducting layer.
The present invention provides a kind of camera module comprising the first camera lens, the second camera lens and the circuit board assemblies；
First camera lens is loaded on the first circuit board, and second camera lens is loaded on the second circuit board.
Wherein, first camera lens and the second camera lens are coaxially disposed, also, first camera lens is set to first circuit
The center of plate, second camera lens are set to the center of the second circuit board.
The present invention provides a kind of picture pick-up device, and the picture pick-up device includes circuit main board and the camera module, institute
It states circuit main board and the circuit board assemblies is electrically connected.
Circuit board assemblies of the invention increase heat dissipating layer on flexible circuit board, dredge what electronic element on circuit board distributed
Heat, heat dissipating layer is by thermal trough and itself radiates, and avoids the electronic component because of the excessively high damage circuit board of temperature, simultaneously
The heat dissipating layer can be used as stiffening plate use, the electronic component to increase the intensity of circuit board, and then in protection circuit plate.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the circuit board assemblies decomposition diagram of present pre-ferred embodiments；
Fig. 2 is the schematic cross-section after the assembling of circuit board assemblies described in Fig. 1；
Fig. 3 is the decomposition diagram of the second embodiment of the heat sink of circuit board assemblies described in Fig. 1；
Fig. 4 from Fig. 5 be Fig. 3 described in circuit board assemblies two kinds of different assembling modes schematic cross-section；
Fig. 6 is the decomposition diagram of the 3rd embodiment of the heat sink of the circuit board assemblies of present pre-ferred embodiments；
Fig. 7 is the schematic cross-section after the assembling of the circuit board assemblies of Fig. 6；
Fig. 8 is the circuit board assemblies decomposition diagram of fourth embodiment of the invention；
Fig. 9 is the schematic cross-section after the assembling of circuit board assemblies described in Fig. 8；
Figure 10 is the schematic diagram of camera module of the invention, including circuit board assemblies described in Fig. 8；
Figure 11 is the schematic cross-section for the circuit board assemblies for including described in the camera module of Figure 10.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, present pre-ferred embodiments provide a kind of circuit board assemblies comprising first circuit board 10, first
Heat dissipating layer 31, the second heat dissipating layer 33 and second circuit board 20.The first circuit board 10, the first heat dissipating layer 31, the second heat dissipating layer
33 and second circuit board 20 successively overlap；First heat dissipating layer 31 and/or second heat dissipating layer 33 are equipped at least
One thermal trough (figure is not marked).
In first embodiment of the invention, first heat dissipating layer 31 and second heat dissipating layer 33 are equipped at least one
Thermal trough.First heat dissipating layer 31 includes the first inner surface 311, and second heat dissipating layer 33 includes the second inner surface 331.Institute
Stating at least one thermal trough is two, including first thermal trough 41 and second thermal trough 42.First thermal trough
41 are opened on first inner surface 311, and second thermal trough 42 is opened on second inner surface 331.Described
One inner surface 311 is bonded with the second inner surface 331, first thermal trough 41 and second thermal trough 42 it is arranged in a crossed manner or
It overlaps.
In the present embodiment, the first circuit board 10 and second circuit board 20 are two rectangles, the identical rectangle of size
Plate body.The first circuit board 10 includes the first mounting surface 11 and the second mounting surface 12 being disposed opposite to each other with the first mounting surface.Institute
State the 4th mounting surface 22 that second circuit board 20 includes third mounting surface 21 and is disposed opposite to each other with third mounting surface 21.The present embodiment
In, first heat dissipating layer 31 and the second heat dissipating layer 33 are rectangular sheet, first heat dissipating layer 31 and the first circuit board
10 the second mounting surface 12 fitting；Second heat dissipating layer 33 is bonded with the 4th mounting surface 22 of the second circuit board 20, institute
It is opposite with second inner surface 331 and be bonded to state the first inner surface 311.Preferably, the first circuit board 10, second circuit
Fitting between plate 20, the first heat dissipating layer 31 and the second heat dissipating layer 33 is bonded using viscose glue.
First thermal trough 41 is strip groove with second thermal trough 42, and first thermal trough 41 is set to first
31 side of the first heat dissipating layer is run through on 311 medium position of the inner surface and both ends of the first thermal trough 41, so as to the first heat dissipating layer 31
On heat evacuation.Second thermal trough 42 be set to 331 medium position of the second inner surface on and the second thermal trough 42 two
33 side of the second heat dissipating layer is run through at end, so as to the evacuation of the heat on the second heat dissipating layer 33.First thermal trough 41 with it is described
Second thermal trough 42 is arranged in a crossed manner, and preferred first thermal trough 41 intersects with the second thermal trough 42 " ten " font.Please
Referring to Fig.2, first thermal trough 41 is overlapped with second thermal trough 42, i.e., described first thermal trough 41 and described the
Two thermal troughs, 42 pairing is formed through one-shaped slot.
Referring to Fig. 3, unlike the embodiments above, the thermal trough includes in second of embodiment of the invention
Multiple first thermal troughs 41 and multiple second thermal troughs 42 identical with the multiple first thermal trough, 41 quantity；The multiple
The arrangement of one thermal trough 41 is set on first inner surface 311, and the multiple arrangement of second thermal trough 42 is set in described second
On surface 331；First inner surface 311 is bonded with the second inner surface 331, the multiple first thermal trough 41 with it is the multiple
Second thermal trough 42 is one-to-one arranged in a crossed manner or overlaps.
Fig. 4 and Fig. 5 are please referred to, is dissipated specifically, the multiple first thermal trough 41 is divided into matrix arrangement in described first
On first inner surface 311 of thermosphere 31.The multiple second thermal trough 42 is divided into matrix arrangement in second heat dissipating layer 33
The second inner surface 331 on.In the present embodiment, the first thermal trough 41 is four, is divided into two column set on first inner surface 331
Two sides, and each first thermal trough 41 run through first heat dissipating layer 31 side.Second thermal trough 42 is
Four, it is divided into the two sides that two column are set to second inner surface 331, and each second thermal trough 42 runs through described second
The side of heat dissipating layer 33.First inner surface 311 is bonded with the second inner surface 332, wherein each described first thermal trough
41 is arranged in a crossed manner or overlap with corresponding second thermal trough 42 respectively, and first thermal trough 41 only with one
Second thermal trough 42 is arranged in a crossed manner or overlaps, such structure, can be with the timely heat by the heat dissipating layer of maximum area
Amount, which is dredged, to be distributed.
Referring to Fig. 6, being in third embodiment of the present invention with above-mentioned two embodiment difference: it is described at least
One thermal trough is opened on the first heat dissipating layer or second heat dissipating layer.In the present embodiment, first heat dissipating layer 34 includes
First inner surface 341 and the first outer surface 342 being oppositely arranged with the first inner surface 341；Second heat dissipating layer 35 includes the
Two inner surfaces 351 and the second outer surface 352 being oppositely arranged with the second inner surface 351.At least one described thermal trough 36 is set to
On first heat dissipating layer 34 and run through first inner surface 341 and the first outer surface 342；Or described at least one is thermally conductive
Slot is set on second heat dissipating layer 35, and runs through second inner surface 351 and the second outer surface 352.
Referring to Figure 7 together, in the present embodiment, it is preferred that the thermal trough 36 is set on first heat dissipating layer 34 simultaneously
Through first inner surface 341 and the first outer surface 342, and the thermal trough 36 is in first heat dissipating layer 34
The heart is arranged multiple.In other embodiments, the thermal trough 36 is set on second heat dissipating layer 35 and through described the
Two inner surfaces 351 and the second outer surface 352.
Further, in embodiment described above, the first circuit board 10 is flexibility with the second circuit board 20
Wiring board.First heat dissipating layer 31 is made with second heat dissipating layer 33 of metal materials such as steel.Preferably, described first
Heat dissipating layer 31 and second heat dissipating layer 33 are steel, can be dredged the first circuit board 10 and the second circuit board 20
While heat, increase the hardness of the first circuit board 10 and the second circuit board 20.
Circuit board assemblies of the invention increase heat dissipating layer on flexible circuit board, dredge what electronic element on circuit board distributed
Heat, heat dissipating layer is by thermal trough and itself radiates, and avoids because of the electronic component on the excessively high damage circuit board of temperature, together
Shi Suoshu heat dissipating layer can be used as stiffening plate use, the electronic component to increase the intensity of circuit board, and then in protection circuit plate.
Referring to Fig. 8, first heat dissipating layer 37 is formed in described in the fourth embodiment of circuit board assemblies of the present invention
The first printed circuit board 40 is constituted on one surface of one circuit board 10 and with first circuit board 10；Second heat dissipating layer, 38 shape
The second printed circuit board 50 is constituted on 20 1 surfaces of second circuit board described in Cheng Yu and with second circuit board 20；Described first dissipates
Thermosphere 37 and the second heat dissipating layer 38 are equipped at least one thermal trough；First printed circuit board 40 and the second printed circuit board
50 are superposed, and first heat dissipating layer 37 is bonded with second heat dissipating layer 38.Further, first heat dissipating layer 37 with
Second heat dissipating layer 38 is ink layer or metal conducting layer.
Specifically, first heat dissipating layer 37 be the first printed circuit board 40 outmost surface structure, can be for
Ink layer or metal conducting layer.First heat dissipating layer 37 can be formed in the first circuit board 10 by modes such as coatings
On.The first circuit board 10 is that a certain layer of the first printed circuit board 40 or multiple-layer stacked form.The thermal trough is set to
On first heat dissipating layer 37, the table that the first heat dissipating layer 37 extends to 40 the first heat dissipating layers 37 of direction on first circuit board can be passed through
Face, or only run through the first heat dissipating layer 37.
Second heat dissipating layer 38 is the outmost surface structure of the second printed circuit board 50, can be as ink layer or
Person's metal conducting layer.The second circuit board 20 is that a certain layer of the second printed circuit board 50 or multiple-layer stacked form.It is described
Thermal trough is set on the second heat dissipating layer 38, can be passed through the second heat dissipating layer 38 and be extended to second circuit board 20 towards the second heat dissipating layer
38 surface, or only run through the second heat dissipating layer 38.
Referring to Fig. 9, surface of first heat dissipating layer 37 far from first circuit board 10 is table in first in the present embodiment
Face 371.Surface of second heat dissipating layer 38 far from second circuit board 20 is the second inner surface 381.In the present embodiment, described
One inner surface 371 is equipped with multiple thermal troughs, and the thermal trough is arranged around 371 center of the first inner surface,
The thermal trough is the first thermal trough 372.Second inner surface 381 is equipped with multiple thermal troughs, and the thermal trough surrounds
Second inner surface, 381 center is arranged.The thermal trough is the second thermal trough 382.Thermally conductive groove shape in the present embodiment
It is identical as the shape in described first and 3rd embodiment.First printed circuit board 40 is superimposed with the second printed circuit board 50
Setting, first thermal trough 372 and the second thermal trough 382 are arranged in a crossed manner correspondingly or overlap, and one the
One thermal trough 372 is only arranged in a crossed manner or overlap with second thermal trough 382.Such structure, can be with maximum area
The heat of first printed circuit board 40 and the second printed circuit board 50 is dredged in time and is distributed.It should be understood that described
One heat dissipating layer 37 and the second heat dissipating layer 38 can be heat sink material and formed and first, second by the modes such as printing, in-molded
On circuit board or first heat dissipating layer 37 and the second heat dissipating layer 38 are also possible to cooling fin and fit in the first, second circuit
On plate.
Figure 10 and Figure 11 are please referred to, the present invention also provides a kind of camera module, the camera module includes the first mirror
Circuit board assemblies in first 110, second camera lens 120 and any of the above embodiment.With fourth embodiment in the present embodiment
For circuit board assemblies including the first printed circuit board 40 and the second printed circuit board 50.First camera lens 110 is loaded on institute
It states on the first printed circuit board 40, second camera lens 120 is loaded on second printed circuit board 50.In the present embodiment, institute
Stating camera module is dual camera mould group.First camera lens 110 is equipped with the first image sensor 1101, the first lens module
1102 and first microscope base 1103.First image sensor 1101, the first lens module 1102 are loaded in the first microscope base 1103.
First microscope base 1103 of first camera lens 110 is loaded on the first mounting surface 11, first image sensor 1101 and first
Mounting surface 11 is fixed by COB technique.Second camera lens 120 is equipped with the second image sensor 1201, the second lens module
1202 and second microscope base 1203.Second image sensor 1201, the second lens module 1202 is loaded on the second microscope base 1203.It is described
Second microscope base 1203 of the second camera lens 120 loaded on third mounting surface 21, install with third by second image sensor 1201
Face 21 is fixed by COB technique.Whereby, not only first, second heat dissipating layer the first, second image sensor is carried out it is scattered
Heat extends the service life of dual camera mould group, and guarantees that the first, second image sensor is wanted in assembling process intensity
It asks.The camera module can be mobile phone camera module group, camera of notebook computer mould group, security protection camera, vehicle-mounted camera
And optical navigation module etc..Above-mentioned dual camera mould group uses 180 degree bugeye lens, may be implemented to shoot simultaneously, and lead to
It crosses software process quality and realizes pan-shot.
Further, first camera lens 110 and the second camera lens 120 are coaxially disposed, also, first camera lens 110 is set
In the center of the first circuit board 10, second camera lens 120 is set to the center of the second circuit board 20.Specifically, institute
The first camera lens 110, first circuit board 10, second circuit board 20 and the second camera lens 120 are stated as coaxial arrangement, can be effectively reduced
The volume of dual camera mould group.
The present invention also provides a kind of picture pick-up device, the picture pick-up device includes circuit main board and the camera module,
The circuit main board and the circuit board assemblies are electrically connected.In the present embodiment, the circuit main board and the circuit board assemblies
It is electrically conducted by metal conductive terminal, conducting wire or connector.The picture pick-up device can be automobile data recorder, hand
Machine, security device etc..Such as on the automobile data recorder of vehicle-mounted product, picture pick-up device of the invention can be with synchronous recording panorama vehicle
Inside and outside image.
Embodiments described above does not constitute the restriction to the technical solution protection scope.It is any in above-mentioned implementation
Made modifications, equivalent substitutions and improvements etc., should be included in the protection model of the technical solution within the spirit and principle of mode
Within enclosing.
Claims (10)
1. a kind of circuit board assemblies, it is characterised in that: the circuit board assemblies include first circuit board, the first heat dissipating layer, second
Heat dissipating layer and second circuit board；The first circuit board, the first heat dissipating layer, the second heat dissipating layer and second circuit board are sequentially overlapped and set
It sets；The first circuit board include the second mounting surface, the second circuit board include the 4th mounting surface, first heat dissipating layer with
The second mounting surface fitting, second heat dissipating layer are bonded with the 4th mounting surface, and first heat dissipating layer includes first
Inner surface, second heat dissipating layer include the second inner surface, first inner surface and second inner surface fitting, and described the
One inner surface and second inner surface are equipped at least one thermal trough, thermal trough on first inner surface and described the
Thermal trough on two inner surfaces intersects or overlaps one to one.
2. circuit board assemblies as described in claim 1, which is characterized in that the thermal trough includes first thermal trough and one
A second thermal trough；First thermal trough is set on first inner surface, and second thermal trough is set in described second
On surface；First thermal trough and second thermal trough are arranged in a crossed manner or overlap.
3. circuit board assemblies as described in claim 1, which is characterized in that the thermal trough include multiple first thermal troughs and with
Identical multiple second thermal troughs of the multiple first thermally conductive slot number；The multiple first thermal trough arrangement is set to described first
On inner surface, the multiple second thermal trough arrangement is set on second inner surface；The multiple first thermal trough with it is described
Multiple second thermal troughs are one-to-one arranged in a crossed manner or overlap.
4. circuit board assemblies as described in claim 1, which is characterized in that first heat dissipating layer includes and the first inner surface phase
To the first outer surface of setting；The second outer surface that second heat dissipating layer and the second inner surface are oppositely arranged；Described at least one
A thermal trough is set on first heat dissipating layer and runs through first inner surface and the first outer surface；Or it is described at least one
Thermal trough is set on second heat dissipating layer, and runs through second inner surface and the second outer surface.
5. circuit board assemblies according to any one of claims 1-4, which is characterized in that the first circuit board and described second
Circuit board is flexible circuit board；First heat dissipating layer is made with second heat dissipating layer of metal materials such as steel.
6. circuit board assemblies as described in claim 1, which is characterized in that first heat dissipating layer is formed in first circuit
The first printed circuit board is constituted on one surface of plate and with first circuit board；Second heat dissipating layer is formed in second electricity
The second printed circuit board is constituted on one surface of road plate and with second circuit board；First heat dissipating layer and second heat dissipating layer
It is equipped at least one thermal trough；First printed circuit board is set with the second printed circuit board laminated add, first heat dissipation
Layer is bonded with second heat dissipating layer, at least one thermal trough of first heat dissipating layer and second heat dissipating layer at least
One thermal trough intersects or overlaps correspondingly.
7. circuit board assemblies as claimed in claim 6, which is characterized in that first heat dissipating layer and the second heat dissipating layer are ink
Layer or metal conducting layer.
8. a kind of camera module, which is characterized in that including any one of the first camera lens, the second camera lens and claim 1-7 institute
The circuit board assemblies stated；For first camera lens loaded on the first circuit board, second camera lens is loaded on the second circuit
On plate.
9. camera module as claimed in claim 8, which is characterized in that first camera lens and the second camera lens are coaxially disposed,
Also, first camera lens is set to the center of the first circuit board, and second camera lens is set in the second circuit board
The heart.
10. a kind of picture pick-up device, which is characterized in that the picture pick-up device includes any one of circuit main board and claim 8-9 institute
The camera module stated, the circuit main board and the circuit board assemblies are electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510277982.3A CN104902154B (en) | 2015-05-27 | 2015-05-27 | Circuit board assemblies, the camera module with circuit board assemblies and picture pick-up device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510277982.3A CN104902154B (en) | 2015-05-27 | 2015-05-27 | Circuit board assemblies, the camera module with circuit board assemblies and picture pick-up device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104902154A CN104902154A (en) | 2015-09-09 |
| CN104902154B true CN104902154B (en) | 2019-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510277982.3A Expired - Fee Related CN104902154B (en) | 2015-05-27 | 2015-05-27 | Circuit board assemblies, the camera module with circuit board assemblies and picture pick-up device |
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| Country | Link |
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| CN (1) | CN104902154B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109327570B (en) * | 2018-10-31 | 2020-07-03 | Oppo广东移动通信有限公司 | Touch screen assembly for display screen of electronic device, display screen and electronic device |
| CN111526265A (en) * | 2019-02-02 | 2020-08-11 | 厦门地平线征程智能科技有限公司 | Camera module and vehicle equipment |
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|---|---|---|---|---|
| CN1708212A (en) * | 2004-06-11 | 2005-12-14 | 周明庆 | Heat conductive substrate apparatus |
| CN101094560A (en) * | 2006-06-21 | 2007-12-26 | 三星电机株式会社 | PC board and its manufacturing method |
| CN201682690U (en) * | 2010-04-08 | 2010-12-22 | 梅州市志浩电子科技有限公司 | Heat dissipation device for printed circuit board |
| CN203352939U (en) * | 2013-07-31 | 2013-12-18 | 温州温博电子科技有限公司 | Multi-surface circuit board |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2499978Y (en) * | 2001-10-26 | 2002-07-10 | 财团法人工业技术研究院 | Three dimension stacking package radiator module |
| US8240036B2 (en) * | 2008-04-30 | 2012-08-14 | Panasonic Corporation | Method of producing a circuit board |
| CN203104938U (en) * | 2013-03-07 | 2013-07-31 | 广州市悦得电子有限公司 | Multilayer circuit board |
| CN104320908A (en) * | 2014-11-14 | 2015-01-28 | 镇江华印电路板有限公司 | Heat dissipating type multilayer soft and hardness combined printing plate |
| CN204810383U (en) * | 2015-05-27 | 2015-11-25 | 南昌欧菲光电技术有限公司 | Circuit board components , have circuit board components's camera module and camera equipment |
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2015
- 2015-05-27 CN CN201510277982.3A patent/CN104902154B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1708212A (en) * | 2004-06-11 | 2005-12-14 | 周明庆 | Heat conductive substrate apparatus |
| CN101094560A (en) * | 2006-06-21 | 2007-12-26 | 三星电机株式会社 | PC board and its manufacturing method |
| CN201682690U (en) * | 2010-04-08 | 2010-12-22 | 梅州市志浩电子科技有限公司 | Heat dissipation device for printed circuit board |
| CN203352939U (en) * | 2013-07-31 | 2013-12-18 | 温州温博电子科技有限公司 | Multi-surface circuit board |
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| Publication number | Publication date |
|---|---|
| CN104902154A (en) | 2015-09-09 |
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