CN112672002B

CN112672002B - Image acquisition device

Info

Publication number: CN112672002B
Application number: CN201910978965.0A
Authority: CN
Inventors: 陈威铮; 王琮右
Original assignee: Chicony Electronics Co Ltd
Current assignee: Chicony Electronics Co Ltd
Priority date: 2019-10-15
Filing date: 2019-10-15
Publication date: 2022-09-02
Anticipated expiration: 2039-10-15
Also published as: CN112672002A

Abstract

The invention discloses an image capturing device which comprises a circuit board, an image sensor, a light filter switcher, a lens and a heat conducting structure. The circuit board has a surface. The image sensor is disposed on the surface. The filter switcher is located above the surface. The lens is positioned on a photosensitive path of the image sensor. The heat conducting structure is in contact with the circuit board and the optical filter switcher and is provided with a channel. The image sensor is located in the channel.

Description

Image acquisition device

Technical Field

The invention relates to an image acquisition device.

Background

An image capturing device is a device for converting an optical image into an electronic signal, and is widely applied to digital cameras and other electronic optical devices. Early image capturing devices used analog signals, such as a video camera tube (tube), for the photosensitive element. Nowadays, the photosensitive elements are mainly classified into two types, namely, charge-coupled devices (CCD) and complementary metal oxide semiconductor Active pixel sensors (CMOS Active pixel sensors).

Generally, heat conduction through surface contact is most direct when heat is to be dissipated from electronic components. However, for the conventional image capturing device, the image sensor can only conduct heat away through the heat dissipation element on the back of the circuit board. However, since the heat of the image sensor is blocked by the circuit board, the heat conduction efficiency is poor. Even if a through-wiring is further provided in the circuit board in order to increase the heat transfer efficiency, the through-wiring is often limited by the crowded surface space of the circuit board, and the effect thereof cannot be effectively exerted.

Therefore, how to provide an image capturing device capable of solving the above problems is one of the problems that the industry needs to invest in research and development resources to solve.

Disclosure of Invention

An objective of the present invention is to provide an image capturing device that can solve the above-mentioned problems.

In order to achieve the above objectives, according to an embodiment of the present invention, an image capturing device includes a circuit board, an image sensor, a filter switcher, a lens, and a heat conducting structure. The circuit board has a surface. The image sensor is disposed on the surface. The filter switcher is located above the surface. The lens is positioned on a photosensitive path of the image sensor. The heat conducting structure is in contact with the circuit board and the optical filter switcher and is provided with a channel. The image sensor is located in the channel.

In one or more embodiments of the invention, the thermally conductive structure is at least partially compressible.

In one or more embodiments of the present invention, the heat conducting structure has two contact surfaces respectively contacting the circuit board and the filter switch. Both contact surfaces are compressible.

In one or more embodiments of the present invention, the heat conducting structure includes at least one heat conducting pad.

In one or more embodiments of the present invention, the number of the at least one thermal pad is two. The two heat-conducting gaskets are respectively contacted with the circuit board and the optical filter switcher.

In one or more embodiments of the present invention, the heat conductive structure further includes a metal block. The metal block is contacted between the two heat-conducting gaskets. The channel penetrates through the two heat-conducting gaskets and the metal block.

In one or more embodiments of the present invention, the heat conductive structure includes a metal block and a light absorbing layer. The metal block is thermally connected between the circuit board and the filter switcher and has at least one part of which the inner wall surface forms a channel. The light absorbing layer is coated on the inner wall surface completely.

In one or more embodiments of the present invention, the filter switch includes a metal plate. The filter switcher contacts the heat conducting structure with the metal plate.

In one or more embodiments of the present invention, the circuit board further has a metal wiring layer. The metal wiring layer is partially exposed from the surface and contacts the thermal conductive structure.

In one or more embodiments of the present invention, the portion of the metal circuit layer exposed from the surface is annular.

In summary, in the image capturing apparatus of the present invention, the heat generated by the image sensor is conducted to the filter switch through the heat conducting structure disposed on the same side of the circuit board as the image sensor, so as to achieve the purpose of dissipating heat. Because the heat transfer path does not need to reach the other side of the circuit board, the heat conduction efficiency can be effectively improved.

The foregoing is illustrative only of the problems, solutions to problems, and other problems that are addressed by the present invention, and the specific details of which are set forth in the following description and the related drawings.

Drawings

In order to make the aforementioned and other objects, features, advantages and embodiments of the invention more comprehensible, the following description is given:

FIG. 1 is a perspective view illustrating an image capturing apparatus according to an embodiment of the present invention;

FIG. 2A is a perspective view of the components inside the image capturing device according to one embodiment of the present invention;

FIG. 2B is an exploded view showing the components shown in FIG. 2A;

FIG. 3 is a schematic cross-sectional view of the component shown in FIG. 2A along line 3-3;

fig. 4 is a schematic cross-sectional view illustrating components inside the image capturing apparatus according to another embodiment.

100: image acquisition device

110: box body

111: perforation

120: circuit board

120 a: surface of

121: metal circuit layer

130: image sensor

140: optical filter switcher

141: shell body

141 a: metal plate

150. 250: heat conduction structure

160: mirror base

170: lens barrel

251a, 251 b: heat conducting gasket

252: metal block

253: light absorbing layer

C: channel

Detailed Description

In the following description, numerous implementation details are set forth in order to provide a thorough understanding of the present invention. It should be understood, however, that these implementation details are not to be interpreted as limiting the invention. That is, in some embodiments of the invention, such implementation details are not necessary. In addition, for the sake of simplicity, some conventional structures and elements are shown in the drawings in a simple schematic manner.

Please refer to fig. 1 to 3. Fig. 1 is a perspective view illustrating an image capturing apparatus 100 according to an embodiment of the present invention. Fig. 2A is a perspective view illustrating components inside the image capturing apparatus 100 according to an embodiment of the invention. Fig. 2B is an exploded view showing the components shown in fig. 2A. FIG. 3 is a schematic cross-sectional view of the component shown in FIG. 2A along line 3-3. The structure and function of each element and the connection relationship between each element included in the image capturing apparatus 100 according to the present embodiment will be described in detail below.

As shown in fig. 1 to 3, in the present embodiment, the image capturing apparatus 100 includes a box 110, and a circuit board 120, an image sensor 130, a filter switch 140, a heat conducting structure 150, a lens holder 160 and a lens 170, which are located in the box 110. The circuit board 120 has a surface 120 a. The image sensor 130 is disposed on the surface 120a of the circuit board 120. The filter switch 140 is located above the surface 120a of the circuit board 120. The filter switch 140 is operable to selectively filter certain types of light, thereby allowing only other types of light to pass through. For example, the filter switch 140 is an infrared filter switch capable of selectively filtering infrared light to allow only other types of light except infrared light to pass through, but the invention is not limited thereto. The heat conducting structure 150 is in contact with the circuit board 120 and the filter switch 140, and has a channel C. That is, the heat conducting structure 150 is substantially annular, as shown in fig. 2B. The image sensor 130 is located in the channel C. The lens base 160 is disposed on the surface 120a of the circuit board 120 and fixes the filter switcher 140. In some embodiments, the lens base 160 is attached to the circuit board 120 by screws, but the invention is not limited thereto. In some embodiments, the filter switch 140 is fixed to the lens holder 160 by adhesion, but the invention is not limited thereto. In addition, the case 110 has a perforation 111. The lens 170 is fixed to the lens holder 160, and is engaged with the through hole 111 of the case 110 to be exposed outside the case 110. The lens 170 is located on the light sensing path of the image sensor 130, and the image sensor 130 captures the scene outside the box 110 through the lens 170 to generate a corresponding image. In addition, the filter switch 140 is also located on the light sensing path of the image sensor 130, and the filter switch 140 can selectively allow only specific types of light to reach the image sensor 130. That is, the external light enters the channel C of the heat conducting structure 150 through the lens 170 and the filter switch 140 to reach the image sensor 130. In the present embodiment, the filter switch 140 is located between the lens 170 and the image sensor 130, and the external light enters through the lens 170, can be filtered by the filter switch 140, enters into the channel C of the heat conducting structure 150, and reaches the image sensor 130.

With the above structure configuration, the heat generated by the image sensor 130 can be conducted to the filter switch 140 through the heat conducting structure 150 disposed on the same side of the circuit board 120 as the image sensor 130, so as to achieve the purpose of heat dissipation. Since the heat transfer path does not need to reach the other side of the circuit board 120, the heat conduction efficiency can be effectively improved.

In some embodiments, the thermally conductive structure 150 is a thermally conductive gasket. The heat conducting structure 150 is compressible, so that two contact surfaces of the heat conducting structure 150 contacting the circuit board 120 and the filter switch 140 respectively are also compressible, and thus the heat conducting structure can be tightly attached to the circuit board 120 and the filter switch 140. In other words, the compressible heat conducting structure 150 can ensure that it contacts the circuit board 120 and the filter switch 140 in a surface contact manner, thereby effectively reducing the thermal resistance.

In some embodiments, the heat conducting structure 150 is made of opaque material, so as to provide a light shielding effect, and further prevent surrounding stray light from reaching the image sensor 130 through the gap between the circuit board 120 and the filter switch 140 to affect the imaging quality.

In some embodiments, as shown in fig. 3, the filter switcher 140 includes a housing 141. The case 141 is partially formed of a metal plate 141 a. The other parts of the housing 141 are made of plastic, for example. The filter switch 140 contacts the heat conducting structure 150 through the metal plate 141a, so that the heat generated by the image sensor 130 can be quickly conducted to the metal plate 141a without being accumulated in the heat conducting structure 150. In addition, the metal plate 141a provides a large area for dissipating heat to the air. In some embodiments, the metal plate 141a may be made of a metal substrate by a stamping process, but the invention is not limited thereto. In other embodiments, the housing 141 of the filter switch 140 may be made of metal.

In some embodiments, as shown in fig. 2B and fig. 3, the circuit board 120 further has a metal circuit layer 121. The metal circuit layer 121 is partially exposed from the surface 120a of the circuit board 120 and contacts the heat conducting structure 150. Therefore, the metal circuit layer 121 can rapidly conduct the heat generated by the image sensor 130 to the heat conducting structure 150, and further, the heat conducting efficiency can be further improved. In some embodiments, the exposed portion of the metal circuit layer 121 from the surface 120a of the circuit board 120 is annular, and the shape thereof substantially matches the shape of the contact surface of the heat conducting structure 150 contacting the circuit board 120, so as to further improve the heat conducting efficiency.

Referring to fig. 4, a cross-sectional view of the components inside the image capturing apparatus 100 according to another embodiment is shown. In the present embodiment, the heat conducting structure 150 in the embodiment shown in fig. 3 is modified, so that the components of the circuit board 120, the image sensor 130, the filter switch 140, the lens holder 160, the lens 170, and the like can refer to the related descriptions above, and are not repeated herein.

Specifically, in the present embodiment, the heat conducting structure 250 includes two

heat conducting pads

251a, 251b and a metal block 252. The two heat

conductive pads

251a, 251b contact the circuit board 120 and the filter switch 140, respectively. The metal bump 252 is in contact with the two heat

conductive pads

251a, 251b, and is further thermally connected between the circuit board 120 and the filter switch 140. By "thermally connected," it is meant that thermal energy can be transferred after connection. The channel C penetrates the two

thermal pads

251a, 251b and the metal block 252. That is, the two

thermal pads

251a, 251b and the metal block 252 are substantially annular. The two heat

conductive pads

251a, 251b are compressible, so that the two heat

conductive pads

251a, 251b respectively contact two contact surfaces of the circuit board 120 and the filter switch 140 and two contact surfaces of the metal block 252 are also compressible, and can be tightly attached to the circuit board 120, the filter switch 140 and the metal block 252. In other words, the two compressible

thermal pads

251a, 251b can ensure that they contact the circuit board 120, the filter switch 140 and the metal block 252 in a surface contact manner, thereby effectively reducing the thermal resistance.

In some embodiments, the material of the two heat

conductive pads

251a, 251b of the present embodiment is the same as the heat conductive structure 150 shown in fig. 3. The thickness of the heat conductive structure 250 of the present embodiment is substantially the same as the heat conductive structure 150 shown in fig. 3. The thickness of the metal block 252 of this embodiment is greater than the thicknesses of the two heat

conductive pads

251a, 251b, and the thermal conductivity of the metal block 252 is greater than the thermal conductivities of the two heat

conductive pads

251a, 251 b. Thereby, the overall thermal conductivity of the heat conducting structure 250 of the present embodiment may be greater than the thermal conductivity with the heat conducting structure 150 shown in fig. 3.

In some embodiments, the metal block 252 has an inner wall surface forming at least a portion of the channel C. The thermally conductive structure 250 also includes a light absorbing layer 253. The light absorbing layer 253 is entirely coated on the inner wall surface of the metal block 252. Therefore, in the process that the external light reaches the image sensor 130 through the lens 170, the filter switch 140 and the heat conducting structure 250, the light is prevented from being reflected by the inner wall surface of the metal block 252 to influence the imaging quality of the image sensor 130.

As can be clearly seen from the above detailed description of the embodiments of the present invention, in the image capturing apparatus of the present invention, the heat generated by the image sensor is conducted to the optical filter switch through the heat conducting structure disposed on the same side of the circuit board as the image sensor, so as to achieve the purpose of heat dissipation. Because the heat transfer path does not need to reach the other side of the circuit board, the heat conduction efficiency can be effectively improved.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.

Claims

1. An image capturing device, comprising:

a circuit board having a surface;

an image sensor disposed on the surface;

a filter switcher located over the surface;

the lens base is arranged on the surface of the circuit board and is used for fixing the optical filter switcher;

the lens is positioned on a photosensitive path of the image sensor; and

the heat conducting structure is contacted between the circuit board and the optical filter switcher and is provided with a channel, wherein the image sensor is positioned in the channel;

the heat conducting structure is a heat conducting gasket, the heat conducting structure is provided with two contact surfaces which are respectively contacted with the circuit board and the optical filter switcher, and the two contact surfaces are compressible; the heat conducting structure is positioned in the inner space of the mirror base, and the periphery of the heat conducting structure is spaced from the mirror base; the filter switcher comprises a shell, a part of the shell is formed by a metal plate, the metal plate of the filter switcher is in contact with the heat conducting structure, and heat generated by the image sensor is conducted to the filter switcher through the heat conducting structure.

2. The image capturing apparatus of claim 1, wherein the filter switch is operable to selectively allow only certain types of light to reach the image sensor.

3. The image capturing device as claimed in claim 1, wherein the heat conducting structure is annular.

4. The image capturing device of claim 1, wherein the lens mount is attached to the circuit board by a screw lock.

5. The image capturing device of claim 1, wherein the housing is entirely made of metal.

6. The image capturing device as claimed in claim 1, wherein the circuit board further has a metal circuit layer, the metal circuit layer being partially exposed from the surface and contacting the heat conducting structure.

7. The image capturing device as claimed in claim 6, wherein the portion of the metal circuit layer exposed from the surface is annular.