TWM506992U - Assembling structure of industrial camera - Google Patents

Assembling structure of industrial camera Download PDF

Info

Publication number
TWM506992U
TWM506992U TW104205312U TW104205312U TWM506992U TW M506992 U TWM506992 U TW M506992U TW 104205312 U TW104205312 U TW 104205312U TW 104205312 U TW104205312 U TW 104205312U TW M506992 U TWM506992 U TW M506992U
Authority
TW
Taiwan
Prior art keywords
lens
hole
assembly structure
industrial camera
lens holder
Prior art date
Application number
TW104205312U
Other languages
Chinese (zh)
Inventor
Chie-Ta Lee
Original Assignee
Adlink Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adlink Technology Inc filed Critical Adlink Technology Inc
Priority to TW104205312U priority Critical patent/TWM506992U/en
Publication of TWM506992U publication Critical patent/TWM506992U/en
Priority to CN201520981190.XU priority patent/CN205232317U/en

Links

Description

工業用相機之組裝結構Assembly structure of industrial camera

本創作係提供一種工業用相機之組裝結構,尤指鏡頭座與殼體分離組構設計,可使殼體不需針對攝像模組不同尺寸之感測元件開發出不同的模具,以更換不同鏡頭孔大小之鏡頭座配合感測元件進行組裝,進而達到結構穩定、便於量產且成本更為低廉之效果。The creation system provides an assembly structure of an industrial camera, especially a separate structure of the lens holder and the housing, so that the housing does not need to develop different molds for different sensing elements of the camera module to replace different lenses. The lens holder of the hole size is assembled with the sensing element, thereby achieving the effects of stable structure, mass production, and lower cost.

按,現今電子科技以日新月異的速度成長,並因應電腦設備在開放架構之下軟硬體標準化、功能不斷的擴充與升級,廠商便開發出適用於各專業領域中的工業電腦,主要應用在如工業控制、工業自動化、量測、網路與通訊設備、機器視覺與運動控制等,亦可適用於肩負重要任務的醫療、國防、交通運輸與航太領域等需要高可靠度與穩定性的應用,以滿足特定規格及嚴苛環境下執行各項高效能運作的要求。According to the current trend of electronic technology, with the rapid development of software and hardware under the open architecture, the manufacturers have developed industrial computers suitable for various professional fields, mainly in applications such as Industrial control, industrial automation, metrology, network and communication equipment, machine vision and motion control, etc., can also be applied to applications requiring high reliability and stability in medical, defense, transportation and aerospace fields with important tasks. To meet the requirements of performing high-performance operations in specific specifications and harsh environments.

再者,機器視覺的應用在各種產業的生產製造及品質檢測已是行之有年,並利用機器視覺提升檢測精度或加速生產效率,因此逐漸成為許多生產檢測設備中所必備的取像裝置,而隨著機器視覺的技術不斷推陳出新,亦可適用於數位監控、視訊或3D導引視覺機器人等高速機器視覺應用,以滿足高解析度、高畫面更新率與大量影像資料的傳輸、處理與判讀的需求,且可提高檢測產出的效率而降低生產成本。Furthermore, the application of machine vision in various industries has been in production for many years, and the use of machine vision to improve detection accuracy or accelerate production efficiency has gradually become an imaging device necessary for many production inspection equipment. With the continuous development of machine vision technology, it can also be applied to high-speed machine vision applications such as digital surveillance, video or 3D guided vision robots to meet the high resolution, high picture update rate and the transmission, processing and interpretation of large amounts of image data. Demand, and can increase the efficiency of testing output and reduce production costs.

而一般機器視覺檢測系統包括有照明光源、攝影機、影像處理裝置、顯示螢幕等,其中工業用之攝影機主要可分為面掃描式及線掃描式二種型式,並由攝影機將經過鏡頭投射在感測元件上所擷取到的影像傳輸至影像處理裝置作進一步的解讀後,再加以儲存、分析或是可以直接顯示於螢幕上,惟該一般攝影機皆為可拆裝式之鏡頭,並將鏡頭利用螺接的方式結合於殼體之鏡頭座上,此種雖然可針對實際的應用將鏡頭自鏡頭座之安裝孔內拆卸,再更換不同規格之鏡頭,以獲得更高解析度與最佳的成像品質,但因目前攝影機內部電路板所搭載之感測元件尺寸配合鏡頭座之鏡頭孔皆為固定而無法更換,並造成檢測系統硬體升級之困難或必須汰換整台攝影機,以致使設備更新與使用成本變得相對高昂,且因鏡頭座與殼體為一體成型所製成,若是鏡頭座之鏡頭孔欲配合不同的尺寸感測元件組裝使用,便需要針對殼體各別開發不同的模具才能進行生產,造成模具數量變多而成本仍然無法有效降低,故要如何有效解決因鏡頭座與殼體一體成型而無法配合組裝不同尺寸的感測元件所衍生之模具數量變多、成本高昂等問題已被業界視為所亟欲解決之課題,則有待從事此行業者重新設計來加以有效解決。The general machine vision inspection system includes an illumination source, a camera, an image processing device, a display screen, etc., wherein the industrial camera can be mainly divided into a face scan type and a line scan type, and the camera will project the lens through the lens. The image captured on the measuring component is transmitted to the image processing device for further interpretation, and then stored, analyzed or directly displayed on the screen, but the general camera is a detachable lens, and the lens is It is screwed into the lens mount of the housing. This can be used to remove the lens from the mounting hole of the lens mount for practical applications, and then replace the lens with different specifications to obtain higher resolution and best. Imaging quality, but because the size of the sensing component mounted on the internal circuit board of the camera is fixed with the lens hole of the lens holder, it cannot be replaced, and it is difficult to upgrade the hardware of the detection system or the entire camera must be replaced, so that the device The cost of updating and use becomes relatively high, and the lens mount and the housing are integrally formed, and if it is the lens hole of the lens mount In combination with different size sensing components, it is necessary to develop different molds for the housing to produce, resulting in a large number of molds and the cost can not be effectively reduced. Therefore, how to effectively solve the problem that the lens holder and the housing are integrally formed However, the problem that the number of molds derived from the assembly of sensing elements of different sizes is increased and the cost is high has been regarded as a problem to be solved by the industry, and it is yet to be redesigned to effectively solve the problem.

故,新型創作人有鑑於上述習用之問題與缺失,乃搜集相關資料經由多方的評估及考量,並利用從事於此行業之多年研發經驗不斷的試作與修改,始設計出此種工業用相機之組裝結構新型誕生。Therefore, in view of the above-mentioned problems and shortcomings, the new creators have collected and collected relevant materials through various evaluations and considerations, and have used the trial and modification of many years of R&D experience in this industry to design such industrial cameras. A new type of assembly structure was born.

本創作之主要目的乃在於攝像模組之電路板上為設有感測元件,並於電路板上所結合鏡頭座之基座表面上朝前方設有凸出之中空對 接部,且對接部內部之安裝孔底部設有可供感測元件嵌入而形成密合狀態之鏡頭孔,便可將攝像模組與鏡頭座進一步結合於殼體內部之容置空間,並由鏡頭座之對接部穿過殼體上之通孔而伸出至外部,此種鏡頭座組裝結構簡單而模具設計容易,並於組裝後可方便感測元件與鏡頭孔進行對準,且該鏡頭座與殼體分離組構設計,可使殼體不需針對攝像模組不同尺寸之感測元件開發出不同的模具,而僅只需更換不同鏡頭孔大小之鏡頭座配合感測元件進行組裝,以利於模組化大量生產,也可簡化製程與模具數量,進而達到結構穩定、便於量產且成本更為低廉之效果。The main purpose of the creation is that the circuit board of the camera module is provided with a sensing component, and a convex hollow pair is provided on the surface of the base of the lens mount combined with the circuit board. The connecting portion and the bottom of the mounting hole in the mating portion are provided with a lens hole for the sensing element to be embedded to form a close contact state, so that the camera module and the lens holder can be further combined into the housing space inside the housing, and The docking portion of the lens holder extends through the through hole in the housing to the outside. The lens holder has a simple assembly structure and an easy mold design, and the assembly of the sensing element and the lens hole is facilitated after assembly, and the lens is assembled. The housing and the housing are separated from each other, so that the housing does not need to develop different molds for different sensing elements of the camera module, and only the lens holders with different lens hole sizes are required to be assembled with the sensing elements. Conducive to modular mass production, it can also simplify the process and the number of molds, so as to achieve structural stability, mass production and lower cost.

本創作之次要目的乃在於攝像模組之感測元件周邊處為設有定位於電路板上之複數導熱塊,當攝像模組之感測元件於運作時,可透過導熱塊來吸收感測元件所產生之熱量,並將熱量經由鏡頭座傳導至殼體上形成一熱傳導路徑後,便可藉由導熱塊與感測元件相接觸形成抵貼提供直接的熱傳導功能,並利用鏡頭座與殼體進一步增加其整體的散熱面積,以提高感測元件之散熱效率,並保持整體系統正常的運作。The secondary purpose of the present invention is that a plurality of heat conducting blocks positioned on the circuit board are disposed around the sensing component of the camera module. When the sensing component of the camera module is in operation, the sensing block can absorb the sensing through the heat conducting block. The heat generated by the component and the heat is transmitted to the housing through the lens holder to form a heat conduction path, and the heat conduction block is brought into contact with the sensing element to form a direct heat transfer function, and the lens holder and the shell are utilized. The body further increases its overall heat dissipation area to improve the heat dissipation efficiency of the sensing element and maintain the normal operation of the overall system.

本創作之另一目的乃在於鏡頭座之鏡頭孔相鄰於安裝孔處之縱向表面為形成有阻擋面,並於阻擋面上形成有吸光層,當攝像模組之感測元件於運作時,可由感測元件感應鏡頭座之安裝孔內所結合之預設鏡頭聚焦投射之光線,並於感測元件感應的過程中亦可透過吸光層予以吸收部分入射至鏡頭孔內非影像資訊之光線,以有效抑制感測元件可能感應光線產生之雜訊,藉此可確保影像擷取的品質。Another object of the present invention is that a lens surface of the lens holder is formed with a blocking surface adjacent to the longitudinal surface of the mounting hole, and a light absorbing layer is formed on the blocking surface. When the sensing element of the camera module is in operation, The measuring component senses the predetermined lens combined in the mounting hole of the lens holder to focus the projected light, and in the process of sensing the sensing component, the light absorption layer can also absorb the non-image information light incident on the lens hole to effectively Suppressing the sensing element may sense the noise generated by the light, thereby ensuring the quality of the image capture.

1‧‧‧攝像模組1‧‧‧ camera module

11‧‧‧電路板11‧‧‧ boards

111‧‧‧第一穿孔111‧‧‧First perforation

112‧‧‧螺絲112‧‧‧ screws

113‧‧‧接合孔113‧‧‧Join hole

114‧‧‧第一連接器114‧‧‧First connector

12‧‧‧感測元件12‧‧‧Sensor components

121‧‧‧導熱塊121‧‧‧thermal block

122‧‧‧導熱介質122‧‧‧ Thermal medium

2‧‧‧鏡頭座2‧‧‧ lens mount

21‧‧‧基座21‧‧‧Base

211‧‧‧螺孔211‧‧‧ screw holes

2111‧‧‧凸柱2111‧‧‧Bump

212‧‧‧定位柱212‧‧‧Positioning column

22‧‧‧對接部22‧‧‧Docking Department

221‧‧‧安裝孔221‧‧‧ mounting holes

2211‧‧‧內螺紋2211‧‧‧ internal thread

222‧‧‧鏡頭孔222‧‧‧ lens hole

2221‧‧‧導斜面2221‧‧‧ guiding slope

2222‧‧‧阻擋面2222‧‧‧Block surface

223‧‧‧吸光層223‧‧‧Light absorbing layer

3‧‧‧殼體3‧‧‧Shell

30‧‧‧容置空間30‧‧‧ accommodating space

31‧‧‧外殼31‧‧‧ Shell

311‧‧‧通孔311‧‧‧through hole

312‧‧‧鏡頭外框312‧‧‧ lens frame

3121‧‧‧保護套環3121‧‧‧ protective collar

313‧‧‧第二穿孔313‧‧‧Second perforation

3131‧‧‧凹槽3131‧‧‧ Groove

314‧‧‧螺絲314‧‧‧ screws

315‧‧‧鎖孔315‧‧‧Keyhole

316‧‧‧導光柱316‧‧‧Light guide

32‧‧‧後蓋32‧‧‧ Back cover

321‧‧‧散熱片321‧‧‧ Heat sink

322‧‧‧第三穿孔322‧‧‧ third perforation

323‧‧‧螺絲323‧‧‧screw

324‧‧‧防水墊圈324‧‧‧Waterproof gasket

33‧‧‧電路模組33‧‧‧Circuit Module

331‧‧‧線路板331‧‧‧ circuit board

332‧‧‧晶片組332‧‧‧ chipsets

333‧‧‧第二連接器333‧‧‧Second connector

3331‧‧‧連接單元3331‧‧‧ Connection unit

334‧‧‧第三連接器334‧‧‧ third connector

3341‧‧‧連接單元3341‧‧‧ Connection unit

335‧‧‧指示燈335‧‧‧ indicator light

34‧‧‧傳輸介面34‧‧‧Transport interface

341‧‧‧電源接頭341‧‧‧Power connector

342‧‧‧訊號接頭342‧‧‧Signal connector

第一圖 係為本創作之立體外觀圖。The first picture is a three-dimensional appearance of the creation.

第二圖 係為本創作之立體分解圖。The second picture is a three-dimensional exploded view of the creation.

第三圖 係為本創作另一視角之立體分解圖。The third figure is a three-dimensional exploded view of another perspective of the creation.

第四圖 係為本創作之前視圖。The fourth picture is the front view of the creation.

第五圖 係為本創作之側視剖面圖。The fifth figure is a side cross-sectional view of the creation.

第六圖 係為本創作攝像模組與鏡頭座於組裝前之側視剖面圖。The sixth figure is a side cross-sectional view of the original camera module and the lens holder before assembly.

第七圖 係為本創作攝像模組與鏡頭座於組裝後之側視剖面圖。The seventh figure is a side cross-sectional view of the original camera module and the lens holder after assembly.

第八圖 係為本創作攝像模組與鏡頭座於組裝後之立體外觀圖。The eighth figure is a three-dimensional appearance of the original camera module and the lens holder.

為達成上述目的及功效,本創作所採用之技術手段及其構造,茲繪圖就本創作之較佳實施例詳加說明其構造與功能如下,俾利完全瞭解。In order to achieve the above objectives and effects, the technical means and its construction adopted in the present invention are described in detail in the preferred embodiment of the present invention, and the structure and function are as follows.

請參閱第一、二、三、四、五圖所示,係分別為本創作之立體外觀圖、立體分解圖、另一視角之立體分解圖、前視圖及側視剖面圖,由圖中可清楚看出,本創作工業用相機之組裝結構為包括有攝像模組1、鏡頭座2及殼體3,其中:Please refer to the first, second, third, fourth and fifth figures, which are respectively the three-dimensional appearance drawing, the three-dimensional exploded view, the three-dimensional exploded view, the front view and the side sectional view of the other perspective. It is clear that the assembled structure of the camera for the present invention includes a camera module 1, a lens holder 2 and a housing 3, wherein:

該攝像模組1為具有電路板11,並於電路板11一側表面上設有感測元件12,且該感測元件12可為互補式氧化金屬半導體(CMOS)或感光耦合元件(CCD),而感測元件12周邊處則設有定位於電路板11上之複數導熱塊121,以利於感測元件12運作時所產生之熱量可經由導熱塊121導出至外部來輔助進行散熱;另,電路板11上位於感測元件12之外側周圍表面處為設有可供螺絲112穿設之複 數第一穿孔111及接合孔113,且電路板11相對於感測元件12之另側表面上設有第一連接器114。The camera module 1 has a circuit board 11 , and a sensing component 12 is disposed on a surface of one side of the circuit board 11 , and the sensing component 12 can be a complementary metal oxide semiconductor (CMOS) or a photosensitive coupling component (CCD). And a plurality of heat conducting blocks 121 positioned on the circuit board 11 are disposed at the periphery of the sensing component 12 to facilitate heat generated by the sensing component 12 to be externally discharged through the heat conducting block 121 to assist in heat dissipation; The circuit board 11 is located at the outer surface of the outer side of the sensing element 12 and is provided with a screw 112. The first through hole 111 and the engaging hole 113 are counted, and the first connector 114 is disposed on the other side surface of the circuit board 11 with respect to the sensing element 12.

該鏡頭座2為具有基座21,並於基座21表面上朝前方設有凸出之中空對接部22,且對接部22內部所具之安裝孔221內壁面處形成有內螺紋2211,而對接部22之安裝孔221底部為設有貫通之鏡頭孔222,其鏡頭孔222後方周緣處形成有向外擴張之導斜面2221,並於鏡頭孔222相鄰於安裝孔221處之縱向表面形成有平整狀之阻擋面2222,且阻擋面2222上利用油墨或其他吸光材料以塗佈的方式形成有吸光層223;此外,鏡頭座2之基座21上位於對接部22之外側周圍表面處為設有複數螺孔211,並於螺孔211前後二側周緣處皆朝外形成有環狀之凸柱2111,且基座21後側表面上設有複數定位柱212。The lens holder 2 has a base 21, and a hollow abutting portion 22 is formed on the surface of the base 21 toward the front, and an internal thread 2211 is formed at an inner wall surface of the mounting hole 221 of the abutting portion 22, and The bottom of the mounting hole 221 of the abutting portion 22 is provided with a through-hole lens hole 222, and an outwardly expanding guiding slope 2221 is formed at a rear periphery of the lens hole 222, and is formed at a longitudinal surface of the lens hole 222 adjacent to the mounting hole 221. There is a flat blocking surface 2222, and the light absorbing layer 223 is formed on the blocking surface 2222 by coating with ink or other light absorbing material; further, the base 21 of the lens holder 2 is located at the outer peripheral surface of the abutting portion 22 A plurality of screw holes 211 are formed, and annular studs 2111 are formed outwardly on the front and rear sides of the screw holes 211, and a plurality of positioning posts 212 are disposed on the rear side surface of the base 21.

該殼體3為包括有中空之外殼31及結合於外殼31上之後蓋32,並於外殼31與後蓋32內部之間形成有可供電路模組33定位之容置空間30,且外殼31底部設有連接於電路模組33上並露出於殼體3外部之傳輸介面34,而外殼31前方處為設有連通至容置空間30內之通孔311,並於通孔311外側周圍處形成有凸出之環狀鏡頭外框312,且鏡頭外框312前側處套接有保護套環3121,再於通孔311相鄰於鏡頭外框312處之縱向表面上為設有可供螺絲314穿設之複數第二穿孔313,且各第二穿孔313後側周緣處分別朝外形成有凹槽3131;又,外殼31後方之開口內側處為設有複數鎖孔315,並於外殼31頂部設有外露之複數導光柱316,而後蓋32後側表面上 為設有矗立狀之複數散熱片321,並於散熱片321外側周圍處亦設有可供螺絲323穿設之複數第三穿孔322。The housing 3 includes a hollow outer casing 31 and a cover 32 coupled to the outer casing 31. An accommodation space 30 for positioning the circuit module 33 is formed between the outer casing 31 and the rear cover 32, and the outer casing 31 is formed. The bottom portion is provided with a transmission interface 34 connected to the circuit module 33 and exposed outside the casing 3. The front portion of the casing 31 is provided with a through hole 311 communicating with the inside of the accommodating space 30, and is located around the outside of the through hole 311. A protruding annular lens frame 312 is formed, and a protective collar 3121 is sleeved on the front side of the lens outer frame 312, and a screw is provided on the longitudinal surface of the through hole 311 adjacent to the lens outer frame 312. 314 is provided with a plurality of second through holes 313, and a groove 3131 is formed outwardly at a periphery of the rear side of each of the second through holes 313. Further, a plurality of keyholes 315 are provided at the inner side of the opening at the rear of the outer casing 31, and the outer casing 31 is provided. The top is provided with a plurality of exposed light guide columns 316, and the rear cover 32 is on the rear side surface A plurality of heat sinks 321 are provided, and a plurality of third through holes 322 are provided around the outer side of the heat sink 321 for the screws 323 to pass through.

再者,電路模組33為具有線路板331,其線路板331一側或二側表面上設有至少一個晶片組332,且該晶片組332可為現場可編輯邏輯閘陣列(FPGA)晶片、中央處理器(CPU)、圖形處理單元(GPU)、影像處理器(GMCH)、網路晶片或其他型式之處理晶片,而線路板331表面上亦可設有電源驅動電路、記憶體模組(圖中未標示)、固態硬碟(SSD)等電子零組件或電路,並於線路板331後側表面上設有第二連接器333及位於第二連接器333下方處之第三連接器334,且各第二連接器333與第三連接器334內分別插接有可為軟性扁平排線(FFC)或軟性電路板(FPC)之連接單元3331、3341,再於線路板331前側上方處設有可為發光二極體(LED)之複數指示燈335;另,傳輸介面34為包括有至少一個電源接頭341及訊號接頭342,並由電源接頭341與訊號接頭342之端子組分別連接於第三連接器334之連接單元3341上用以進行傳輸電源或訊號之使用。Furthermore, the circuit module 33 has a circuit board 331 having at least one wafer set 332 on one or both sides of the circuit board 331, and the chip set 332 can be a field editable logic gate array (FPGA) chip, A central processing unit (CPU), a graphics processing unit (GPU), a video processing unit (GMCH), a network chip or other types of processing chips, and a circuit board 331 may also be provided with a power driving circuit and a memory module ( An electronic component or circuit such as a solid state hard disk (SSD) is disposed on the rear surface of the circuit board 331 and a second connector 333 is disposed on the rear surface of the circuit board 331 and a third connector 334 located below the second connector 333. And each of the second connector 333 and the third connector 334 is respectively connected with a connection unit 3331, 3341 which can be a soft flat cable (FFC) or a flexible circuit board (FPC), and is further above the front side of the circuit board 331 A plurality of indicator lights 335 are provided for the light emitting diodes (LEDs). The transmission interface 34 includes at least one power connector 341 and a signal connector 342, and is connected to the terminal groups of the power connector 341 and the signal connector 342 respectively. The connection unit 3341 of the third connector 334 is used for transmission Use of the source or signal.

請搭配參閱第六、七、八圖所示,係分別為本創作攝像模組與鏡頭座於組裝前之側視剖面圖、組裝後之側視剖面圖及立體外觀圖,由圖中可清楚看出,當本創作於組裝時,係先將鏡頭座2之對接部22以鏡頭孔222為對正於攝像模組1之感測元件12處,便可推動於基座21使其定位柱212穿入於電路板11之接合孔113內,並由定位柱212之導引與限位作用,以利於感測元件12與對接部22之鏡頭孔22 2內進行對準,且待基座21底部抵貼於電路板11表面上後,便可將感測元件12完全嵌入於鏡頭孔222內形成密合狀態,並使導熱塊121抵靠於鏡頭孔222周緣處之導斜面2221上,而基座21之螺孔211則分別對應於電路板11之第一穿孔111處,並由螺絲112穿過第一穿孔111中後,再螺入於基座21之螺孔211內使鏡頭座2與攝像模組1之電路板11結合成為一體。Please refer to the sixth, seventh and eighth figures, which are the side cross-sectional view of the original camera module and the lens mount before assembly, the side view of the assembled side view and the stereoscopic appearance, which can be clearly seen from the figure. It can be seen that when the present invention is assembled, the abutting portion 22 of the lens holder 2 is first aligned with the lens hole 222 at the sensing element 12 of the camera module 1 to push the base 21 to its positioning column. The 212 is inserted into the engaging hole 113 of the circuit board 11 and guided and restrained by the positioning post 212 to facilitate the lens hole 22 of the sensing component 12 and the abutting portion 22 . Alignment is performed in 2, and after the bottom of the susceptor 21 abuts against the surface of the circuit board 11, the sensing element 12 can be completely embedded in the lens hole 222 to form a close state, and the heat conducting block 121 is pressed against the lens. The screw hole 211 of the base 21 corresponds to the first through hole 111 of the circuit board 11, and is passed through the first through hole 111 by the screw 112, and then screwed into the base. The lens holder 2 is integrated with the circuit board 11 of the camera module 1 in the screw hole 211 of the seat 21.

然而,上述感測元件12之導熱塊121與鏡頭座2之鏡頭孔222間為進一步設有導熱介質122,且該導熱介質122可為導熱塊121表面上貼附之導熱片或塗佈形成之導熱膏,並於感測元件12完全嵌入於鏡頭孔222內後,可將導熱塊121以導熱介質122抵持接觸於鏡頭孔222周緣處之導斜面2221上形成一熱傳導路徑,而有效降低其所產生之熱阻。However, the heat conducting block 121 of the sensing component 12 and the lens hole 222 of the lens holder 2 are further provided with a heat conductive medium 122, and the heat conductive medium 122 may be a heat conductive sheet attached to the surface of the heat conductive block 121 or coated. The heat conductive paste, after the sensing element 12 is completely embedded in the lens hole 222, can form a heat conduction path by the heat conducting block 121 with the heat conductive medium 122 abutting on the guiding slope 2221 at the periphery of the lens hole 222, thereby effectively reducing the heat conductive block 121. The resulting thermal resistance.

復請參閱如第二、四、五、八圖所示,當攝像模組1與鏡頭座2組裝完成後,便可將攝像模組1與鏡頭座2裝設於殼體3外殼31之容置空間30內,並使鏡頭座2之對接部22由內向外穿過外殼31之通孔311而伸出至鏡頭外框312內,且待鏡頭座2推入至定位,便可將基座21之螺孔211以凸柱2111嵌入於外殼31第二穿孔313之凹槽3131內,並由螺絲314穿過第二穿孔313中後,再螺入於基座21之螺孔211內,使攝像模組1可透過鏡頭座2與殼體3之外殼31結合成為一體。For example, as shown in the second, fourth, fifth, and eighth diagrams, when the camera module 1 and the lens holder 2 are assembled, the camera module 1 and the lens holder 2 can be mounted on the housing 31 of the housing 3. The space 30 is disposed, and the abutting portion 22 of the lens holder 2 is extended from the inner side to the outer side of the lens frame 312 through the through hole 311 of the outer casing 31, and the base is pushed into the positioning of the lens holder 2 The screw hole 211 of the 21 is inserted into the recess 3131 of the second through hole 313 of the outer casing 31 by the protrusion 2111, and is inserted into the second through hole 313 by the screw 314, and then screwed into the screw hole 211 of the base 21, so that The camera module 1 can be integrated with the outer casing 31 of the casing 3 through the lens mount 2.

續將電路模組33之線路板331為利用上述之利用螺絲鎖固的方式結合於後蓋32上,並使晶片組332以導熱介質(圖中未示 出)緊密抵貼於後蓋32內壁面處形成一熱傳導路徑,且待第二連接器333之連接單元3331另端插接於電路板11之第一連接器114內形成電性連接後,再將後蓋32罩覆於外殼31後側處,即可使電路模組33一併收容於殼體3之容置空間30內,同時將線路板331上之指示燈335對應於外殼31之導光柱316處,以供指示燈335可朝導光柱316投射產生對外顯示亮光,而後便可將後蓋32為蓋合於外殼31後方開口處,並由螺絲323穿過第三穿孔322中後,再螺入於外殼31之鎖孔315內結合成為一體,且該後蓋32與外殼31之相接面處為可設有一防水墊圈324,即可透過防水墊圈324使後蓋32結合於外殼31上後形成密封狀態,並具有良好的防水與防塵之功能。The circuit board 331 of the circuit module 33 is continuously bonded to the back cover 32 by using the above-mentioned screw locking method, and the wafer set 332 is made of a heat conductive medium (not shown). A heat-conducting path is formed in close contact with the inner wall surface of the rear cover 32, and after the other end of the connecting unit 3331 of the second connector 333 is electrically connected to the first connector 114 of the circuit board 11, The rear cover 32 is covered on the rear side of the outer casing 31, so that the circuit module 33 can be accommodated in the accommodating space 30 of the casing 3, and the indicator light 335 on the circuit board 331 is corresponding to the outer casing 31. At the light column 316, the indicator light 335 can be projected toward the light guide column 316 to generate external light, and then the rear cover 32 can be covered at the rear opening of the outer casing 31 and passed through the third through hole 322 by the screw 323. Then, it is screwed into the locking hole 315 of the outer casing 31 to be integrated, and a waterproof gasket 324 can be disposed at the interface between the rear cover 32 and the outer casing 31, that is, the rear cover 32 can be coupled to the outer casing 31 through the waterproof gasket 324. It forms a sealed state after the upper part and has a good waterproof and dustproof function.

本創作鏡頭座2對接部22之安裝孔221內為可利用內螺紋2211以螺接的方式結合有一鏡頭(圖中未示出),並將殼體3之傳輸介面34以電源接頭341與訊號接頭342透過線纜(圖中未示出)連接於工業電腦、網路控制自動化系統或其他電子裝置,當攝像模組1之感測元件12運作時,可由感測元件12感應鏡頭所聚焦投射之光線,並將擷取到的光線轉換成電子訊號後傳輸至電路模組33之晶片組332進行影像擷取與儲存等動作,並於感測元件12感應的過程中,亦可透過鏡頭孔222相鄰於安裝孔221處之吸光層223予以吸收部分入射至鏡頭孔222內非影像資訊之光線,以有效抑制感測元件12可能感應光線產生之雜訊,藉此可確保影像擷取的品質。In the mounting hole 221 of the mating portion 22 of the lens housing 2, a lens (not shown) can be coupled by means of the internal thread 2211, and the transmission interface 34 of the housing 3 is connected to the power connector 341 and the signal. The connector 342 is connected to an industrial computer, a network control automation system or other electronic device through a cable (not shown). When the sensing component 12 of the camera module 1 operates, the sensing component 12 can sense the focus of the lens. The light is converted into an electronic signal and transmitted to the chip set 332 of the circuit module 33 for image capture and storage, and in the process of sensing the sensing element 12, or through the lens hole. The light absorbing layer 223 adjacent to the mounting hole 221 absorbs light that is incident on the non-image information in the lens hole 222 to effectively suppress the noise generated by the sensing element 12, thereby ensuring image capturing. quality.

當本創作攝像模組1之感測元件12於運作時,可透過銅、鋁、鐵等材質製成之導熱塊121來吸收感測元件12所產生之熱量, 並將熱量經由導熱介質122傳導至鏡頭座2上,即可透過導熱介質122有效降低其熱阻,再由基座21抵貼於外殼31內壁面處而傳導至殼體3上形成一熱傳導路徑,便可藉由導熱塊121與感測元件12相接觸形成抵貼提供直接的熱傳導功能,使感測元件12運作時所產生之熱量不但可利用導熱塊121輔助進行散熱,並經由鏡頭座2與殼體3進一步增加其整體的散熱面積,且該導熱塊121配合鏡頭座2與殼體3所能導引出感測元件12的熱能多寡主要視材質的種類而定,以提高感測元件12之散熱效率,並保持整體系統正常的運作。When the sensing component 12 of the camera module 1 is in operation, the heat-dissipating block 121 made of copper, aluminum, iron or the like can absorb the heat generated by the sensing component 12, The heat is transmitted to the lens holder 2 via the heat transfer medium 122, so that the thermal resistance is effectively reduced by the heat transfer medium 122, and then the base 21 is abutted against the inner wall surface of the outer casing 31 to be conducted to the housing 3 to form a heat conduction path. The heat conduction block 121 and the sensing element 12 are brought into contact to form abutment to provide a direct heat conduction function, so that the heat generated when the sensing element 12 operates can be assisted not only by the heat conduction block 121 but also by the lens holder 2 Further increasing the heat dissipation area of the whole with the housing 3, and the thermal energy of the sensing block 12 that the thermal block 121 and the housing 3 can guide depends on the type of the material to improve the sensing component. 12 heat dissipation efficiency and maintain the normal operation of the overall system.

是以,本創作為針對鏡頭座2之基座21配合攝像模組1之電路板11組裝結構簡單而模具設計容易,並於組裝後可方便感測元件12與對接部22之鏡頭孔222進行對準,且該鏡頭座2與殼體3分離組構設計,可使殼體3不需針對攝像模組1不同尺寸之感測元件12開發出不同的模具,而僅只需更換不同鏡頭孔222大小之鏡頭座2配合感測元件12進行組裝,以利於模組化大量生產,也可簡化製程與模具數量,進而達到結構穩定、便於量產且成本更為低廉之效果。Therefore, the design of the circuit board 11 for the base 21 of the lens mount 2 with the camera module 1 is simple and the mold design is easy, and the lens hole 222 of the sensing component 12 and the mating portion 22 can be conveniently assembled after assembly. Alignment, and the lens mount 2 and the housing 3 are separated from each other, so that the housing 3 does not need to develop different molds for the sensing elements 12 of different sizes of the camera module 1, but only need to replace different lens holes 222. The lens holder 2 of the size is assembled with the sensing component 12 to facilitate mass production in a modular manner, and the number of processes and the number of molds can be simplified, thereby achieving the effects of stable structure, convenient mass production, and lower cost.

上述詳細說明為針對本創作一種較佳之可行實施例說明而已,惟該實施例並非用以限定本創作之申請專利範圍,凡其它未脫離本創作所揭示之技藝精神下所完成之均等變化與修飾變更,均應包含於本創作所涵蓋之專利範圍中。The above detailed description is intended to illustrate a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and other equivalents and modifications may be made without departing from the spirit of the invention. Changes are to be included in the scope of patents covered by this creation.

綜上所述,本創作上述之工業用相機之組裝結構為確實能達到其功效及目的,故本創作誠為一實用性優異之創作,實符合新型專利之申請要件,爰依法提出申請,盼 審委早日賜准本案,以保障新型創作 人之辛苦創作,倘若 鈞局有任何稽疑,請不吝來函指示,新型創作人定當竭力配合,實感德便。In summary, the assembly structure of the above-mentioned industrial camera is indeed able to achieve its efficacy and purpose, so this creation is a practical and excellent creation, which is in line with the application requirements of the new patent, and the application is made according to law. The trial committee will grant the case as soon as possible to protect the new creation. People's hard work, if there is any doubt in the bureau, please do not hesitate to give instructions, the new creators will try their best to cooperate, and feel really good.

1‧‧‧攝像模組1‧‧‧ camera module

11‧‧‧電路板11‧‧‧ boards

111‧‧‧第一穿孔111‧‧‧First perforation

112‧‧‧螺絲112‧‧‧ screws

113‧‧‧接合孔113‧‧‧Join hole

12‧‧‧感測元件12‧‧‧Sensor components

121‧‧‧導熱塊121‧‧‧thermal block

2‧‧‧鏡頭座2‧‧‧ lens mount

21‧‧‧基座21‧‧‧Base

211‧‧‧螺孔211‧‧‧ screw holes

2111‧‧‧凸柱2111‧‧‧Bump

22‧‧‧對接部22‧‧‧Docking Department

221‧‧‧安裝孔221‧‧‧ mounting holes

2211‧‧‧內螺紋2211‧‧‧ internal thread

222‧‧‧鏡頭孔222‧‧‧ lens hole

223‧‧‧吸光層223‧‧‧Light absorbing layer

3‧‧‧殼體3‧‧‧Shell

31‧‧‧外殼31‧‧‧ Shell

311‧‧‧通孔311‧‧‧through hole

312‧‧‧鏡頭外框312‧‧‧ lens frame

3121‧‧‧保護套環3121‧‧‧ protective collar

313‧‧‧第二穿孔313‧‧‧Second perforation

314‧‧‧螺絲314‧‧‧ screws

316‧‧‧導光柱316‧‧‧Light guide

32‧‧‧後蓋32‧‧‧ Back cover

321‧‧‧散熱片321‧‧‧ Heat sink

323‧‧‧螺絲323‧‧‧screw

324‧‧‧防水墊圈324‧‧‧Waterproof gasket

33‧‧‧電路模組33‧‧‧Circuit Module

331‧‧‧線路板331‧‧‧ circuit board

332‧‧‧晶片組332‧‧‧ chipsets

333‧‧‧第二連接器333‧‧‧Second connector

3331‧‧‧連接單元3331‧‧‧ Connection unit

3341‧‧‧連接單元3341‧‧‧ Connection unit

335‧‧‧指示燈335‧‧‧ indicator light

34‧‧‧傳輸介面34‧‧‧Transport interface

341‧‧‧電源接頭341‧‧‧Power connector

342‧‧‧訊號接頭342‧‧‧Signal connector

Claims (14)

一種工業用相機之組裝結構,係包括有攝像模組及鏡頭座,其中:該攝像模組為具有一電路板,並於電路板表面上設有感測元件;該鏡頭座為具有結合於電路板上之基座,並於基座表面上朝前方設有凸出之中空對接部,且對接部內部具有可供預設鏡頭結合之安裝孔,再於安裝孔底部設有可供感測元件對準嵌入之鏡頭孔。An assembly structure of an industrial camera includes a camera module and a lens holder, wherein: the camera module has a circuit board, and a sensing component is disposed on a surface of the circuit board; the lens mount has a circuit coupled to the circuit a base of the plate, and a convex hollow abutting portion is provided on the surface of the base toward the front, and the inside of the abutting portion has a mounting hole for the preset lens to be combined, and the sensing component is provided at the bottom of the mounting hole. Align the lens hole that is embedded. 如申請專利範圍第1項所述之工業用相機之組裝結構,其中該攝像模組之電路板上位於感測元件之外側周圍表面處為設有可供螺絲穿設之複數第一穿孔,並於鏡頭座之基座上設有可供螺絲螺入於其內結合成為一體之複數螺孔。The assembly structure of the industrial camera according to the first aspect of the invention, wherein the circuit board of the camera module is provided with a plurality of first perforations for the screw to be worn around the outer surface of the sensing element, and The base of the lens holder is provided with a plurality of screw holes into which the screws can be screwed into one body. 如申請專利範圍第2項所述之工業用相機之組裝結構,其中該電路板上位於感測元件之外側周圍表面處為設有複數接合孔,並於鏡頭座之基座上設有穿入接合孔內之複數定位柱。The assembly structure of the industrial camera according to the second aspect of the invention, wherein the circuit board is provided with a plurality of engaging holes at a peripheral surface of the outer side of the sensing element, and is provided with a penetration hole on the base of the lens holder. A plurality of positioning posts in the joint hole. 如申請專利範圍第1項所述之工業用相機之組裝結構,其中該攝像模組之感測元件周邊處為設有定位於電路板上之複數導熱塊。The assembly structure of the industrial camera according to the first aspect of the invention, wherein the sensing element of the camera module is provided with a plurality of heat conducting blocks positioned on the circuit board. 如申請專利範圍第4項所述之工業用相機之組裝結構,其中該鏡頭座之鏡頭孔後方周緣處為形成有向外擴張而可供感測元件周邊處的導熱塊抵靠於其上之導斜面。The assembly structure of the industrial camera according to the fourth aspect of the invention, wherein the rear periphery of the lens hole of the lens holder is formed to be outwardly expanded to abut the thermal conductive block at the periphery of the sensing element. Guided slope. 如申請專利範圍第5項所述之工業用相機之組裝結構,其中該感測元件之導熱塊與鏡頭座之鏡頭孔間為設有導熱介質。The assembly structure of the industrial camera according to the fifth aspect of the invention, wherein the heat conducting block of the sensing component and the lens hole of the lens holder are provided with a heat conducting medium. 如申請專利範圍第1項所述之工業用相機之組裝結構,其中該攝像模組之感測元件為一互補式氧化金屬半導體或感光耦合元件。The assembly structure of the industrial camera according to claim 1, wherein the sensing element of the camera module is a complementary oxidized metal semiconductor or a photosensitive coupling element. 如申請專利範圍第1項所述之工業用相機之組裝結構,其中該鏡頭座之鏡頭孔相鄰於安裝孔處之縱向表面為形成有阻擋面,並於阻擋面上形成有吸光層。The assembly structure of the industrial camera according to the first aspect of the invention, wherein the lens hole of the lens holder is formed with a blocking surface adjacent to the longitudinal surface of the mounting hole, and a light absorbing layer is formed on the blocking surface. 如申請專利範圍第1項所述之工業用相機之組裝結構,其中該攝像模組與鏡頭座外部為進一步結合有具外殼及後蓋之殼體,並於外殼與後蓋內部之間形成有可供攝像模組與鏡頭座定位之容置空間,且外殼前方處設有可供對接部穿過伸出至外部之通孔,再於殼體之容置空間內部定位有連接於攝像模組上之電路模組。The assembly structure of the industrial camera according to the first aspect of the invention, wherein the camera module and the exterior of the lens holder are further combined with a casing having a casing and a back cover, and formed between the casing and the inside of the back cover. The accommodating space for positioning the camera module and the lens holder, and the through hole at the front of the housing for extending through the outer portion of the housing, and being positioned inside the accommodating space of the housing and connected to the camera module The circuit module on it. 如申請專利範圍第9項所述之工業用相機之組裝結構,其中該攝像模組之電路板上為設有第一連接器,而殼體之電路模組所具之線路板表面上為設有至少一個晶片組及第二連接器,並於第二連接器內插接有另端連接於第一連接器之連接單元。The assembly structure of the industrial camera according to claim 9, wherein the circuit board of the camera module is provided with a first connector, and the circuit module of the housing has a circuit board surface. There is at least one chip set and a second connector, and a connecting unit connected to the first connector at the other end is inserted into the second connector. 如申請專利範圍第9項所述之工業用相機之組裝結構,其中該殼體外殼之通孔外側周圍處為形成有鏡頭外框,並於鏡頭外框前側處套接有保護套環。The assembly structure of the industrial camera according to claim 9, wherein a lens outer frame is formed around the outer side of the through hole of the outer casing, and a protective collar is sleeved at a front side of the outer frame of the lens. 如申請專利範圍第11項所述之工業用相機之組裝結構,其中該鏡頭座之基座上為設有複數螺孔,並於殼體外殼之通孔相鄰於鏡頭外框處之縱向表面上設有複數第二穿孔,且各第二穿孔中分別穿設有螺入於螺孔內使鏡頭座與殼體結合成為一體之螺絲。The assembly structure of the industrial camera according to claim 11, wherein the base of the lens holder is provided with a plurality of screw holes, and is disposed on a longitudinal surface of the housing shell adjacent to the lens frame. There are a plurality of second perforations, and each of the second perforations is respectively provided with a screw screwed into the screw hole to integrate the lens holder and the housing into a single body. 如申請專利範圍第9項所述之工業用相機之組裝結構,其中該殼體之外殼底部為設有露出於外部之傳輸介面,並於傳輸介面具有至少一個電源接頭及訊號接頭,而殼體之電路模組所具之線路板表面上 為設有至少一個晶片組及第三連接器,並於第三連接器內插接有電性連接於傳輸介面上之連接單元。The assembly structure of the industrial camera according to claim 9, wherein the bottom of the casing of the casing is provided with a transmission interface exposed to the outside, and has at least one power connector and a signal connector on the transmission interface, and the casing The circuit module has a circuit board surface The at least one chip set and the third connector are disposed, and the connecting unit electrically connected to the transmission interface is inserted into the third connector. 如申請專利範圍第9項所述之工業用相機之組裝結構,其中該殼體之外殼後方之開口內側處為設有複數鎖孔,並於後蓋後側表面上設有矗立狀之複數散熱片,且散熱片外側周圍處設有複數第三穿孔,再於第三穿孔中分別穿設有螺入於鎖孔內使後蓋與外殼結合成為一體之螺絲。The assembly structure of the industrial camera according to claim 9, wherein a plurality of keyholes are provided at the inner side of the opening at the rear of the casing, and a plurality of heat dissipation forms are provided on the rear side surface of the rear cover. And a plurality of third perforations are arranged around the outer side of the heat dissipating fins, and screws for screwing into the locking holes and integrating the rear cover and the outer casing are integrally formed in the third perforations.
TW104205312U 2015-04-09 2015-04-09 Assembling structure of industrial camera TWM506992U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW104205312U TWM506992U (en) 2015-04-09 2015-04-09 Assembling structure of industrial camera
CN201520981190.XU CN205232317U (en) 2015-04-09 2015-12-01 Assembling structure of industrial camera

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104205312U TWM506992U (en) 2015-04-09 2015-04-09 Assembling structure of industrial camera

Publications (1)

Publication Number Publication Date
TWM506992U true TWM506992U (en) 2015-08-11

Family

ID=54340218

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104205312U TWM506992U (en) 2015-04-09 2015-04-09 Assembling structure of industrial camera

Country Status (2)

Country Link
CN (1) CN205232317U (en)
TW (1) TWM506992U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109803070A (en) * 2017-11-16 2019-05-24 澔鸿科技股份有限公司 Detachable camera lens and preparation method thereof
TWI811876B (en) * 2021-11-30 2023-08-11 新煒科技有限公司 An electronic device for changing a camera module at any time

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107786784B (en) * 2016-08-29 2020-06-30 光宝电子(广州)有限公司 Lens assembly and manufacturing method thereof
CN108076256A (en) * 2016-11-18 2018-05-25 天津嘉深保科技发展有限公司 A kind of market survey service camera
CN107145025B (en) * 2017-06-23 2023-02-17 北京小米移动软件有限公司 Motion camera
JP2019028112A (en) * 2017-07-26 2019-02-21 日本電産サンキョー株式会社 Optical unit with tremor correction function
CN112689447A (en) * 2017-10-12 2021-04-20 深圳市大疆灵眸科技有限公司 Heat radiation structure, camera and moving platform
CN108227342A (en) * 2018-01-24 2018-06-29 合肥埃科光电科技有限公司 A kind of radiator for industrial camera
CN109737868A (en) * 2018-12-21 2019-05-10 华为技术有限公司 Flight time mould group and electronic equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109803070A (en) * 2017-11-16 2019-05-24 澔鸿科技股份有限公司 Detachable camera lens and preparation method thereof
TWI811876B (en) * 2021-11-30 2023-08-11 新煒科技有限公司 An electronic device for changing a camera module at any time

Also Published As

Publication number Publication date
CN205232317U (en) 2016-05-11

Similar Documents

Publication Publication Date Title
TWM506992U (en) Assembling structure of industrial camera
US9769361B2 (en) Assembly structure for industrial cameras
US10021283B2 (en) Light shielding members for solid state image capturing apparatus, camera module and electronic device
US20200296261A1 (en) Image capture assembly and aerial photographing aerial vehicle
TWI558200B (en) Image capturing module and image capturing device
TWM508886U (en) Circuit module chip heat dissipation structure
TWI516112B (en) Electronic apparatus and image building module
JP4872091B2 (en) Imaging device
JP6177244B2 (en) Cooling aerial camera
US20160242271A1 (en) Electronic apparatus capable of efficient and uniform heat dissipation
US10268018B1 (en) Lens module
US20170062303A1 (en) Circuit chip module heat dissipation structure
TWI574561B (en) Imaging device having efficient heat transfer, and associated systems
KR20180017375A (en) Camera module
TWI555395B (en) Image surveillance device
US8794775B2 (en) Camera light source mounting structures
WO2023273068A1 (en) Sensor module, facial recognition module, facial recognition apparatus and system
KR102645802B1 (en) Camera module
TWI736234B (en) Lens module and electronic device
TWM469509U (en) Camera module with heat dissipation member
CN215068290U (en) Face recognition module, face recognition equipment and face recognition system
CN210202299U (en) Electronic device
TW202113417A (en) Lens assembly module and electronic device
CN216565428U (en) Multi-view vision module and robot
CN112672002B (en) Image acquisition device

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees